Camera device and electronic device comprising same

Abstract

An electronic device according to various embodiments may comprise: a printed circuit board; an image sensor connected to the printed circuit board; an IR filter bracket including an opening formed at a position corresponding to the image sensor; and a filter disposed on the IR filter bracket. The IR filter bracket may at least partially cover the image sensor. The filter may cover the opening. The IR filter bracket may include a first portion at least partially covering at least one of the image sensor and the printed circuit board, and a second portion extending from the first portion. The filter may be disposed in the second portion. The second portion may be located at a position closer to the image sensor than the first portion in a direction from the filter toward the image sensor, so as to form a step with the first portion. The IR filter bracket may include a metal layer and an insulating layer forming at least a portion of the inner side of the IR filter bracket.

Description

Camera device and electronic device including the same

[0001] The present disclosure relates to a camera device and an electronic device including the same.

[0002] With the advancement of digital camera manufacturing technology, electronic devices equipped with compact and lightweight camera units have become commercially available. As camera units are integrated into electronic devices that are commonly carried at all times (e.g., mobile communication terminals), users have been able to conveniently utilize various functions, such as video calls and augmented reality, in addition to taking photos and videos.

[0003] The camera device may include an infrared filter to prevent color distortion caused by the infrared wavelength of light incident on the image sensor. The infrared filter may be positioned to block infrared light incident on the image sensor. The camera device may include a support structure that supports the infrared filter.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] An electronic device according to one embodiment may include a printed circuit board. The electronic device may include an image sensor connected to the printed circuit board. The electronic device may include an IR filter bracket including an opening formed at a position corresponding to the image sensor. The IR filter bracket may cover at least partially the image sensor. The electronic device may include a filter disposed on the IR filter bracket. The filter may cover the opening. The IR filter bracket may include a first portion that at least partially covers at least one of the image sensor or the printed circuit board, and a second portion extending from the first portion. The filter may be disposed on the second portion. The second portion may be located at a position closer to the image sensor than the first portion in a direction from the filter toward the image sensor so as to form a step with the first portion. The IR filter bracket may include a metal layer and an insulating layer forming at least a portion of the inner side of the IR filter bracket.

[0006] A camera device according to one embodiment may include a printed circuit board. The camera device may include an image sensor connected to the printed circuit board. The image sensor may include a light receiving portion. The camera device may include an infrared filter disposed at a predetermined distance from the image sensor at a position corresponding to the light receiving portion of the image sensor. The camera device may include a metal member that at least partially covers the image sensor. The metal member may support the infrared filter. The metal member may include a first portion that at least partially covers at least one of the printed circuit board or the image sensor, and a second portion extending from the first portion. The infrared filter may be disposed in the second portion. The second portion may be located at a position closer to the image sensor than the first portion in a direction from the infrared filter toward the image sensor so as to form a step with the first portion. The metal member may include a metal layer and an insulating layer forming at least a portion of the inner side of the metal member.

[0007] FIG. 1 is an exploded perspective view of a camera device according to one embodiment.

[0008] FIG. 2 is a plan view of a printed circuit board having an IR filter bracket arranged thereon, according to one embodiment.

[0009] FIG. 3 is a cross-sectional view taken along line A-A' of FIG. 2 according to one embodiment.

[0010] FIG. 4 is a drawing for explaining the process of forming an IR filter bracket according to one embodiment.

[0011] FIG. 5 is a cross-sectional perspective view illustrating the end of a second part of an IR filter bracket according to one embodiment.

[0012] FIG. 6 is a cross-sectional view illustrating the end of a second part of an IR filter bracket according to one embodiment.

[0013] FIG. 7 is a plan view of a printed circuit board having electrical elements arranged thereon, according to one embodiment.

[0014] FIG. 8 is a cross-sectional perspective view illustrating an IR filter bracket covering an electrical element according to one embodiment.

[0015] FIG. 9 is a cross-sectional view of a camera device according to one embodiment.

[0016] FIG. 10 is a plan view illustrating a process of placing a portion of an IR filter bracket on a plate according to one embodiment.

[0017] FIG. 11 is a perspective view of an IR filter bracket including a fourth part according to one embodiment.

[0018] FIG. 12 is a side view of an IR filter bracket including a fourth part according to one embodiment.

[0019] FIG. 13 is a cross-sectional view in which an IR filter bracket including a fourth part is placed on a plate according to one embodiment.

[0020] FIG. 14 is a cross-sectional view illustrating a first bonding material according to one embodiment.

[0021] FIG. 15 is a plan view of an IR filter bracket including at least one hole according to one embodiment.

[0022] FIG. 16 is a cross-sectional perspective view illustrating a second bonding material disposed within an IR filter bracket including at least one hole, according to one embodiment.

[0023] FIG. 17 is a cross-sectional view illustrating a second bonding material disposed within an IR filter bracket including at least one hole, according to one embodiment.

[0024] FIG. 18 is a cross-sectional view of a printed circuit board having an IR filter bracket including at least one hole arranged thereon, according to one embodiment.

[0025] FIG. 19 is a front perspective view of an electronic device according to one embodiment.

[0026] FIG. 20 is a rear perspective view of an electronic device according to one embodiment.

[0027] Embodiments of the present disclosure are described below in detail with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present disclosure in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals.

[0028] The terms used in this disclosure are described in their current, general form considering the functions mentioned herein; however, they may refer to various other terms depending on the intent of those skilled in the art, case law, the emergence of new technologies, etc. Accordingly, the terms used in this disclosure should not be interpreted solely by their names, but should be interpreted based on the meaning of the terms and the overall content of this disclosure.

[0029] An electronic device according to various embodiments of this document may include, for example, at least one of a smartphone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, a desktop personal computer, a laptop personal computer, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a mobile medical device, a camera, or a wearable device. According to various embodiments, the wearable device may include at least one of an accessory type (e.g., a watch, a ring, a bracelet, an anklet, a necklace, glasses, a contact lens, or a head-mounted device (HMD)), a fabric or clothing integrated type (e.g., electronic clothing), a body-attached type (e.g., a skin pad or a tattoo), or a bio-implantable type (e.g., an implantable circuit).

[0030] In one embodiment, the electronic device may be a home appliance. The home appliance may include, for example, at least one of a television, a DVD (digital video disk) player, audio, a refrigerator, an air conditioner, a vacuum cleaner, an oven, a microwave oven, a washing machine, an air purifier, a set-top box, a home automation control panel, a security control panel, a TV box, a game console, an electronic dictionary, an electronic key, a camcorder, or a digital photo frame.

[0031] In one embodiment, the electronic device comprises various medical devices (e.g., various portable medical measuring devices (blood glucose meters, heart rate monitors, blood pressure monitors, or body temperature monitors), MRA (magnetic resonance angiography), MRI (magnetic resonance imaging), CT (computer tomography), imaging devices, or ultrasound devices), navigation devices, global navigation satellite systems (GNSS (global navigation satellite system)), event data recorders (EDR), flight data recorders (FDR), automotive infotainment devices, marine electronic equipment (e.g., marine navigation devices, or gyrocompasses), avionics, security devices, vehicle head units, industrial or domestic robots, ATMs (automatic teller's machines) of financial institutions, POS (point of sales) of stores, or Internet of Things devices (e.g., light bulbs, various sensors, electric or gas meters, sprinkler systems, fire alarms, thermostats, streetlights, It may include at least one of a toaster, exercise equipment, hot water tank, heater, or boiler.

[0032] According to one embodiment, the electronic device may include at least one of furniture or part of a building / structure, an electronic board, an electronic signature receiving device, a projector, or various measuring instruments (e.g., water, electricity, gas, or radio wave measuring instruments). In various embodiments, the electronic device may be a combination of one or more of the various devices described above. The electronic device according to one embodiment may be a flexible electronic device. Furthermore, the electronic device according to the embodiments of this document is not limited to the devices described above and may include new electronic devices resulting from technological advancements.

[0033] Additionally, terms such as "first," "second," etc., may be used to describe various components, but the components should not be limited by these terms. These terms are used for the purpose of distinguishing one component from another.

[0034] Throughout the specification, when a configuration is described as being "connected" to another configuration, this includes not only cases where they are "directly connected," but also cases where they are connected with another configuration in between. Furthermore, when a part is described as "including" a component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0035] Phrases such as "according to one embodiment" and "in one embodiment" appearing in various places in this disclosure do not necessarily refer to the same embodiment. Furthermore, phrases such as "according to one embodiment" and "in one embodiment" appearing in various places in this disclosure do not necessarily refer to different embodiments. For example, each embodiment may be combined with one another.

[0036] FIG. 1 is an exploded perspective view of a camera device according to one embodiment.

[0037] The configuration of FIG. 1 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0038] A camera device (100) according to one embodiment (e.g., the second optical sensor (1300) of FIG. 20)) may include a housing (110), a lens assembly (120), a printed circuit board (140), an image sensor (150), a filter (160), and an IR filter bracket (200). However, the components of the camera device (100) are not limited thereto. For example, the camera device (100) may omit at least one of the aforementioned components or include at least one additional component. For example, the camera device (100) may include at least one of a plate (e.g., a base) on which the printed circuit board (140) is placed, or a driving unit (130) for driving the camera device (100). In one example, the driving unit (130) may include at least one of a first driving unit (not shown) for driving auto focus (AF) of the camera device (100) or a second driving unit (not shown) for driving optical image stabilization (OIS) of the camera device (100).

[0039] According to one embodiment, the housing (110) may form the exterior of the camera device (100). For example, the housing (110) may provide a frame for supporting other components. The shape of the housing (110) may be modified according to the shape of the components included in the camera device (100). For example, the housing (110) may have a box shape. However, it is not limited thereto.

[0040] According to one embodiment, a space may be formed inside the housing (110). At least some of the components included in the camera device (100) may be disposed in the formed space. For example, at least one of at least a part of the lens assembly (120), a first driving unit for AF driving of the camera device (100), or a second driving unit for OIS driving of the camera device (100) may be disposed in the space. However, it is not limited thereto.

[0041] According to one embodiment, the housing (110) may be positioned on top of the printed circuit board (140) (e.g., above the +z axis direction). For example, the housing (110) may be positioned on at least one of the printed circuit board (140) or the IR filter bracket (200). In the present disclosure, the housing (110) may be named a cover (110). However, it is not limited thereto.

[0042] According to one embodiment, the lens assembly (120) may include at least one lens positioned so that an image of a subject is formed on an image sensor (150). The camera device (100) may receive light through the lens assembly (120). For example, light may be introduced into the interior of the camera device (100) through at least some of the at least one lens. In one example, light may be introduced into the interior of the camera device (100) in the direction of the optical axis (e.g., the -z axis direction).

[0043] According to one embodiment, at least a portion of the lens assembly (120) may be exposed to the outside of the camera device (100). For example, at least a portion of the lens assembly (120) may be positioned to protrude from the upper surface of the housing (110) (e.g., the surface facing the +z direction). According to one embodiment, the lens assembly (120) may be positioned on the upper surface of the printed circuit board (140) (e.g., above the +z axis direction).

[0044] According to one embodiment, the remaining portion of the lens assembly (120) may be placed inside the housing (110). In one example, the lens assembly (120) may be movably positioned relative to the housing (110). For example, the lens assembly (120) may be moved by a driving unit (130) for driving the camera device (100). For example, the lens assembly (120) may be moved relative to the housing (110) in a first direction (e.g., +z-axis direction or -z-axis direction) by a first driving unit (not shown) for AF driving of the camera device (100). For example, the lens assembly (120) may be moved relative to the housing (110) in at least one of a second direction (e.g., +x-axis direction or -x-axis direction) or a third direction (e.g., +y-axis direction or -y-axis direction) by a second driving unit (not shown) for OIS driving of the camera device (100). However, it is not limited thereto. In the present disclosure, a lens assembly may be named a lens part. However, it is not limited thereto.

[0045] According to one embodiment, the driving unit (130) may be positioned on the upper part of the printed circuit board (140) (e.g., above the +z axis direction). For example, the driving unit (130) may be positioned on at least one of the printed circuit board (140) or the IR filter bracket (200).

[0046] According to one embodiment, the printed circuit board (140) may include a plate shape. For example, the printed circuit board (140) may have at least a rectangular shape. However, it is not limited thereto. In one example, the printed circuit board (140) may be placed on a plate (e.g., the plate (180) of FIG. 3). For example, the printed circuit board (140) may be fixed to the plate.

[0047] According to one embodiment, the image sensor (150) can convert light passing through the lens assembly (120) into an electrical signal. For example, the image sensor (150) can convert light received passing through at least one lens into an electrical signal.

[0048] According to one embodiment, the image sensor (150) may be connected to a printed circuit board (140). For example, the image sensor (150) may be electrically connected to the printed circuit board (140). For example, the image sensor (150) may be connected to the printed circuit board (140) through a connecting member (e.g., the connecting member (151) of FIG. 3).

[0049] According to one embodiment, the image sensor (150) may be placed on a printed circuit board (140). For example, the image sensor (150) may be placed on the printed circuit board (140). The image sensor (150) may be coupled with the printed circuit board (140). For example, the image sensor (150) may be in contact with the printed circuit board (140). However, it is not limited thereto. For example, the image sensor (150) may be placed on a plate. For example, the image sensor (150) may be in contact with the plate. In one example, the image sensor (150) may be surrounded by at least a portion of the printed circuit board (140). For example, the image sensor (150) may be at least partially surrounded by the printed circuit board (140) while in contact with the plate.

[0050] According to one embodiment, the filter (160) may be positioned between the lens assembly (120) and the image sensor (150). According to one embodiment, the filter (160) may be positioned at a location spaced apart from the lens assembly (120). The filter (160) may be positioned at a location spaced apart from the image sensor (150). In one example, the filter (160) may include an infrared filter. However, it is not limited thereto.

[0051] According to one embodiment, light passing through the lens assembly (120) may pass through the filter (160) and be incident on the image sensor (150). In one example, the filter (160) may be configured to block infrared rays from the light (or light signal) passing through the lens assembly (120). However, it is not limited thereto. In the present disclosure, the filter may be named a filtering member, an infrared filter, or an IR filter. However, it is not limited thereto.

[0052] According to one embodiment, the IR filter bracket (200) may be positioned to support the filter (160). For example, the filter (160) may be placed on the IR filter bracket (200). The IR filter bracket (200) may cover at least one of the printed circuit board (140) or the image sensor (150). For example, the IR filter bracket (200) may be positioned to at least partially surround the image sensor (150). For example, the IR filter bracket (200) may be positioned so that the image sensor is located inside the IR filter bracket (200).

[0053] According to one embodiment, the IR filter bracket (200) may include an opening. The opening may be formed at a position corresponding to the image sensor (150). For example, the opening may be positioned at a position overlapping the image sensor (150). A filter (160) may cover the opening. The image sensor (150) may be placed within the space formed by the IR filter bracket (200) and the filter (160).

[0054] According to one embodiment, the IR filter bracket (200) may include metal. For example, the IR filter bracket (200) may be formed of a metal material. In one example, the IR filter bracket (200) may be formed of stainless steel (SUS). However, it is not limited thereto. In one example, the IR filter bracket (200) may be formed of a non-magnetic metal material.

[0055] In the present disclosure, the IR filter bracket may be named a metal member, a support member, a shielding member, a shield can, a filter bracket, or a bracket. However, it is not limited thereto.

[0056] The present disclosure may provide a camera device (100) comprising an IR filter bracket (200) formed of metal and having a thin thickness. In the present disclosure, the camera device may be named an electronic device.

[0057] FIG. 2 is a plan view of a printed circuit board having an IR filter bracket arranged thereon, according to one embodiment.

[0058] The configuration of FIG. 2 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0059] According to one embodiment, the IR filter bracket (200) may correspond at least partially to the printed circuit board (140) or the image sensor (e.g., the image sensor (150) of FIG. 1). For example, the IR filter bracket (200) may overlap at least partially with the printed circuit board (140) or the image sensor (150). For example, the IR filter bracket (200) may cover at least one of the printed circuit board (140) or the image sensor (150) at least partially.

[0060] According to one embodiment, the IR filter bracket (200) may be placed on a printed circuit board (140). However, it is not limited thereto. For example, the IR filter bracket (200) may be placed on at least one of the printed circuit board (140) or a plate (e.g., the plate (180) of FIG. 3).

[0061] According to one embodiment, the IR filter bracket (200) may include a first part (210) that at least partially covers at least one of a printed circuit board (140) or an image sensor (e.g., the image sensor (150) of FIG. 1). For example, the first part (210) may at least partially cover the printed circuit board (140). For example, the first part (210) may at least partially cover the image sensor (150). For example, the first part (210) may at least partially cover the printed circuit board (140) and the image sensor (150).

[0062] According to one embodiment, the IR filter bracket (200) may include a second portion (220) extending from a first portion (210). A filter (160) may be placed on the IR filter bracket (200). For example, the filter (160) may be placed on the second portion (220) of the IR filter bracket (200). For example, the filter (160) may be placed to cover the opening on the second portion (220) of the IR filter bracket (200). The second portion (220) of the IR filter bracket (200) may include a portion on which the filter (160) is placed.

[0063] According to one embodiment, the first part (210) may at least partially surround the second part (220). For example, the first part (210) may at least partially surround the edge of the second part (220). For example, the first part (210) may be located on the outer edge of the second part (220).

[0064] According to one embodiment, the filter (160) may be positioned at a location corresponding to an image sensor (e.g., the image sensor (150) of FIG. 1). For example, the filter (160) may be positioned at a location corresponding to the light receiving part of the image sensor (150) in the direction in which light is incident (e.g., the direction of the optical axis). The filter (160) may be positioned at a location that overlaps with the image sensor (150). For example, the filter (160) may be positioned at a location that overlaps with the light receiving part of the image sensor (150) in the direction in which light is incident.

[0065] According to one embodiment, the filter (160) may be positioned at a location corresponding to the opening (201) of the IR filter bracket (200). For example, the filter (160) may cover the opening (201) of the IR filter bracket (200). The image sensor may be at least partially surrounded by the IR filter bracket (200) and the filter (160). For example, the image sensor may be placed within the space formed by the IR filter bracket (200) and the filter (160). For example, the image sensor may be placed below the IR filter bracket (200). For example, the image sensor may be placed below the filter (160).

[0066] According to one embodiment, the filter (160) may be at least partially surrounded by an IR filter bracket (200). For example, the filter (160) may be at least partially surrounded by a first portion (210) of the IR filter bracket (200). For example, the first portion (210) may be positioned to surround the edge of the filter (160).

[0067] According to one embodiment, a blocking member (170) may be disposed on the filter (160). The blocking member (170) may be configured to block light incident on a part of the filter (160).

[0068] According to one embodiment, the blocking member (170) may be positioned to block light from being incident on a part of the filter (160). For example, the blocking member (170) may be positioned to overlap with a second part that overlaps with the filter (160). For example, the blocking member (170) may be positioned at the edge of the filter (160) or at a position adjacent to the edge of the filter (160). For example, the blocking member (170) may be positioned on the upper surface of the filter (160) along the edge of the upper surface of the filter (160). For example, the blocking member (170) may be positioned on the upper surface of the filter (160) to at least partially surround the edge of the upper surface of the filter (160).

[0069] According to one embodiment, the blocking member (170) may include at least one of a tape or a film. The blocking member (170) may have a color for blocking light. For example, the blocking member (170) may have a color for absorbing light. For example, the blocking member (170) may have a black color. However, it is not limited thereto. In the present disclosure, the blocking member (170) may be named a film member, a masking member, a masking tape, a masking film, a blocking tape, or a blocking film. However, it is not limited thereto.

[0070] In the present disclosure, the first portion of the IR filter bracket may be described as a portion in which at least one of the housing (e.g., the housing (110) of FIG. 1) or the driving unit (e.g., the driving unit (130) of FIG. 1) of a camera device (e.g., the camera device (100) of FIG. 1) is disposed. However, it is not limited thereto.

[0071] According to one embodiment, the IR filter bracket may include at least one first portion. In one example, the IR filter bracket may include a plurality of first portions.

[0072] In the present disclosure, a second portion of the IR filter bracket may be described as a portion where the filter (160) is placed. According to one embodiment, the IR filter bracket may include at least one second portion. In one example, the IR filter bracket may include a plurality of second portions.

[0073] FIG. 3 is a cross-sectional view taken along line A-A' of FIG. 2 according to one embodiment.

[0074] The configuration of FIG. 3 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0075] According to one embodiment, with reference to FIG. 3, a second portion (220) of the IR filter bracket (200) may form an opening (201). For example, at least a portion of the end of the second portion (220) of the IR filter bracket (200) may form an opening (201). The opening (201) may be located between the filter (160) and the image sensor (150). The second portion (220) may be positioned between the filter (160) and the image sensor (150).

[0076] According to one embodiment, the IR filter bracket (200) may include a third portion (230) extending from a first portion (210). The third portion (230) may form a side of the IR filter bracket (200). The third portion (230) may be placed on a printed circuit board (140).

[0077] According to one embodiment, the IR filter bracket (200) may include a connecting portion (240) connected to a third portion (230). The connecting portion (240) may be placed on a printed circuit board (140). The IR filter bracket (200) may be coupled to the printed circuit board (140) through a coupling portion (241). For example, the IR filter bracket (200) may be coupled to the printed circuit board (140) through soldering at the coupling portion (241). However, it is not limited thereto. For example, the third portion (230) may be coupled to the printed circuit board (140) through soldering. For example, at the portion of the third portion (230) that contacts the printed circuit board (140), the third portion (230) may be coupled to the printed circuit board (140) through soldering. In one example, at least one of the connecting part (240) or the coupling part (241) in the IR filter bracket (200) may be omitted.

[0078] In the present disclosure, a third portion of the IR filter bracket may be described as a portion that supports the IR filter bracket (200) by contacting a printed circuit board (140). In one example, the third portion (230) of the IR filter bracket (200) may be omitted. For example, the third portion (230) of the IR filter bracket (200) may be omitted, and the IR filter bracket (200) may include a fourth portion (e.g., the fourth portion (541, 542) of FIG. 10). However, it is not limited thereto. For example, the IR filter bracket (200) may include at least one of the third portion (230) or the fourth portion.

[0079] According to one embodiment, the IR filter bracket (200) may include at least one third part. In one example, the IR filter bracket (200) may include a plurality of third parts.

[0080] According to one embodiment, the third part (230) may face in a different direction from the first part (210). For example, the third part (230) may be substantially perpendicular to the first part (210). However, it is not limited thereto. According to one embodiment, the third part (230) may be formed by bending at least once relative to the first part (210).

[0081] According to one embodiment, the third part (230) may face in a different direction from the second part (220). For example, the third part (230) may be substantially perpendicular to the second part (220). However, it is not limited thereto.

[0082] According to one embodiment, the first part (210) and the second part (220) may be positioned apart from the printed circuit board (140) and the image sensor (150) by the third part (230). For example, the third part (230) may form the height of the IR filter bracket (200).

[0083] According to one embodiment, the third part (230) may include a structure that reinforces the rigidity of the IR filter bracket (200). For example, the third part (230) may include a beading structure. In this invention, the beading structure may be described as a structure having a protrusion shape that protrudes in the direction in which the side of the third part (230) faces (e.g., the x-axis direction). For example, the inner side of the third part (230) may include at least one protrusion protruding in a direction toward the interior of the IR filter bracket (200). The outer side of the third part (230) may include at least one protrusion protruding in a direction toward the exterior of the IR filter bracket (200). However, it is not limited thereto.

[0084] According to one embodiment, the filter (160) may be positioned at a location spaced apart from the image sensor (150) by the IR filter bracket (200). For example, a second part (220) of the IR filter bracket (200) may be positioned at a location spaced apart from the image sensor (150). The filter (160) may be supported by the second part (220) of the IR filter bracket (200) and spaced apart from the image sensor (150).

[0085] According to one embodiment, the first part (210) may be located at least partially between the second part (220) and the third part (230).

[0086] According to one embodiment, the second part (220) may face in the same direction as the first part (210). For example, the second part (220) may be substantially parallel to the first part (210). However, it is not limited thereto. For example, the first part (210) may be positioned to form an angle of inclination with the second part (220). According to one embodiment, the second part (220) may be formed by bending at least once relative to the first part (210).

[0087] According to one embodiment, the second part (220) may form a step with the first part (210). For example, the space between the second part (220) and the first part (210) may be bent at least once.

[0088] According to one embodiment, the second part (220) may be located at a lower position than the first part (210). For example, the second part (220) may include a stepped surface that is lower than one side of the first part (210). For example, the second part (220) may be located at a position closer to the image sensor (150) than the first part (210). For example, the second part (220) may be closer to the image sensor (150) than the first part (210) in a direction from the filter (160) toward the image sensor (150) (e.g., the optical axis direction or the -z axis direction). For example, the second part (220) may be formed to be located closer to the image sensor (150) than the first part (210) so as to form a step with the first part (210). For example, the distance between the second part (220) and the image sensor (150) may be smaller than the distance between the first part (210) and the image sensor (150). For example, the distance between the inner side of the second part (220) and the image sensor (150) may be smaller than the distance between the inner side of the first part (210) and the image sensor (150).

[0089] According to one embodiment, the second part (220) may be positioned lower than the first part (210) and higher than the printed circuit board (140). For example, the second part (220) may be positioned lower than the first part (210) and higher than the upper surface of the printed circuit board (140) (e.g., the surface facing the +z direction). The second part (220) may be positioned lower than the first part (210) and higher than the image sensor (150). For example, the second part (220) may be positioned lower than the first part (210) and higher than the upper surface of the image sensor (150) (e.g., the surface facing the +z direction). The second part (220) may be positioned lower than the first part (210) and higher than the light receiving part of the image sensor (150) (e.g., the light receiving part (152) of FIG. 5).

[0090] According to one embodiment, a camera device (e.g., the camera device (100) of FIG. 1) may include a plate (180) that supports a printed circuit board (140). For example, the plate (180) may be placed under the printed circuit board (140).

[0091] According to one embodiment, the second part (220) may be located closer to the plate (180) than the first part (210). For example, referring to FIG. 3, the first part (210) may be spaced apart from the plate (180) by a first length (D1) in the direction from the filter (160) toward the image sensor (150) (e.g., the -z direction). The second part (220) may be spaced apart from the plate (180) by a second length (D2) in the direction from the filter (160) toward the image sensor (150). In one example, the first length (D1) may be greater than the second length (D2). However, it is not limited thereto.

[0092] According to one embodiment, the filter (160) may be placed in the second part (220). The second part (220) forms a step with the first part (210), so that the height of the IR filter bracket (200) on which the filter (160) is placed may be reduced. Accordingly, the height of the camera device (e.g., the camera device (100) of FIG. 1) may be reduced. Accordingly, the height of the electronic device (e.g., the electronic device (1000) of FIG. 19) may be reduced.

[0093] According to one embodiment, a printed circuit board (140) and an image sensor (150) may be placed on a plate (180). The printed circuit board (140) and the image sensor (150) may be in contact with the plate (180). For example, the printed circuit board (140) and the image sensor (150) may be attached to the plate (180).

[0094] According to one embodiment, the plate (180) may include a plate shape. For example, the plate (180) may be a rectangular plate. However, it is not limited thereto. For example, the plate (180) may have a shape corresponding to at least a part of the printed circuit board (140).

[0095] According to one embodiment, the plate (180) may comprise a metal. For example, the plate (180) may comprise at least one of a copper alloy or stainless steel (SUS, steel use stainless). However, it is not limited thereto. In the present disclosure, the plate may be named a base. However, it is not limited thereto.

[0096] According to one embodiment, a camera device (e.g., the camera device (100) of FIG. 1) may include at least one connecting member (151) connecting an image sensor (150) and a printed circuit board (140). The at least one connecting member (151) may extend from the image sensor (150) to the printed circuit board (140). For example, the at least one connecting member (151) may extend from the upper surface of the image sensor (150) (e.g., the surface facing the +z direction) to the upper surface of the printed circuit board (140) (e.g., the surface facing the +z direction). However, it is not limited thereto.

[0097] According to one embodiment, the image sensor (150) may be connected to the printed circuit board (140) through a connecting member (151). For example, the image sensor (150) may be connected to the printed circuit board (140) through wire bonding. In the present disclosure, the connecting member (151) may be named a wire member, but is not limited thereto.

[0098] According to one embodiment, the connecting member (151) may be disposed within the IR filter bracket (200). For example, the connecting member (151) may be disposed within the space formed by the IR filter bracket (200), the printed circuit board (140), and the image sensor (150).

[0099] According to one embodiment, the IR filter bracket (200) may cover the connecting member (151). For example, the upper part of the IR filter bracket (200) (e.g., the first part (210)) may cover the upper part of the connecting member (151). For example, the upper part of the IR filter bracket (200) may be positioned over the connecting member (151). The IR filter bracket (200) may surround the connecting member (151) at least partially. For example, the third part (230) of the IR filter bracket (200) may surround the side of the connecting member (151). The IR filter bracket (200) may enclose the connecting member (151).

[0100] According to one embodiment, the connecting member (151) may be positioned adjacent to the inner side of the IR filter bracket (200). For example, the connecting member (151) may be positioned adjacent to the inner side of the upper part (e.g., the first part (210)) of the IR filter bracket (200). For example, the connecting member (151) may be positioned adjacent to the inner side of the third part (230). The inner side of the IR filter bracket (200) may include an insulating layer. For example, the insulating layer may form at least a portion of the inner side of the IR filter bracket (200). Since the inner side of the IR filter bracket (200) includes an insulating layer, damage to the connecting member (151) by the IR filter bracket (200) formed of a metal material may be prevented.

[0101] According to one embodiment, at least a portion of the blocking member (170) may overlap with at least a portion of the second portion (220) of the IR filter bracket (200). For example, at least a portion of the blocking member (170) may overlap with at least a portion of the second portion (220) in a direction (e.g., -z direction) toward the image sensor (150) from the filter (160). For example, at least a portion of the blocking member (170) may be positioned on the filter (160) in a location that overlaps with at least a portion of the second portion (220). For example, the filter (160) may be positioned between the blocking member (170) and the second portion (220). For example, the edge of the filter (160) may be positioned between the blocking member (170) and the second portion (220).

[0102] According to one embodiment, the blocking member (170) may cover the end of the second part (220). For example, the blocking member (170) may completely cover the end of the second part (220). For example, the blocking member (170) may be positioned so as to protrude further toward the interior of the opening (201) than the end of the second part (220) (for example, the part of the second part (220) that forms the opening (201). For example, the width (W1) of the part of the second part (220) that overlaps with the blocking member (170) may be smaller than the width (W2) of the blocking member (170). Thus, light incident on the second part (220) of the IR filter bracket (200) formed of a metal material may be blocked by the blocking member (170). Therefore, the phenomenon of light being reflected by the IR filter bracket (200) (e.g., flare) can be prevented or reduced.

[0103] FIG. 4 is a drawing for explaining the process of forming an IR filter bracket according to one embodiment.

[0104] The configuration of FIG. 4 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0105] According to one embodiment, the IR filter bracket (200) may be formed from a base material (200a). For example, the IR filter bracket (200) may be formed by processing the base material (200a). For example, the IR filter bracket (200) may be formed by cutting at least a portion of the base material (200a). The IR filter bracket (200) may be formed by bending the base material (200a) at least once.

[0106] According to one embodiment, with reference to FIG. 4(a), the base material (200a) of the IR filter bracket (200) may include a metal layer (2001) and an insulating layer (2002) disposed on the metal layer (2001). The insulating layer (2002) may be attached to the metal layer (2001). For example, the insulating layer (2002) may be attached to the metal layer (2001) through a press process.

[0107] According to one embodiment, the base material (200a) may include an anti-reflection layer (2003). The anti-reflection layer (2003) may be disposed opposite to the insulating layer (2002). For example, the insulating layer (2002) may be disposed on one side of the metal layer (2001), and the anti-reflection layer (2003) may be disposed on the other side of the metal layer (2001). The anti-reflection layer (2003) may be attached to the metal layer (2001). The anti-reflection layer (2003) may have a color to block light or reduce light reflection. For example, the anti-reflection layer (2003) may have a color to absorb light. For example, the anti-reflection layer (2003) may have a black color. However, it is not limited thereto. In one example, the anti-reflection layer (2003) may be omitted from the base material (200a). In the present disclosure, the anti-reflective layer may be named a coating layer or an anti-reflective coating layer. However, it is not limited thereto.

[0108] According to one embodiment, the IR filter bracket (200) may be formed from a base material (200a) comprising a metal layer (2001) and an insulating layer (2002) attached to the metal layer (2001) (or a base material (200a) comprising a metal layer (2001), an insulating layer (2002) attached to the metal layer (2001), and an anti-reflection layer (2003) attached to the metal layer (2001). For example, the shape of the IR filter bracket (200) may be formed with the insulating layer (2002) attached to the metal layer (2001). However, it is not limited thereto. For example, the shape of the IR filter bracket (200) may be formed with the insulating layer (2002) and the anti-reflection layer (2003) attached to the metal layer (2001).

[0109] According to one embodiment, at least one of the first part (210), the second part (220), or the third part (230) of the IR filter bracket (200) may be formed with an insulating layer (2002) attached to a metal layer (2001). When an insulating member is attached after forming the IR filter bracket, the process of forming at least one insulating layer on the third part (230) may be difficult, and the quality of the IR filter bracket may be degraded. Therefore, when forming the IR filter bracket from a base material including an insulating layer, the quality of the IR filter bracket may be improved compared to when an insulating member is attached after forming the IR filter bracket.

[0110] According to one embodiment, with reference to FIG. 4(b), the IR filter bracket (200) may include a metal layer (2001) and an insulating layer (2002). At least a portion of the inner side of the metal layer (2001) may include the insulating layer (2002). For example, the insulating layer (2002) may form at least a portion of the inner side of the IR filter bracket (200). However, it is not limited thereto. For example, the IR filter bracket (200) may include a metal layer (2001), an insulating layer (2002), and an anti-reflection layer (2003). At least a portion of the outer side of the metal layer (2001) may include the anti-reflection layer (2003). For example, the anti-reflection layer (2003) may form at least a portion of the outer side of the IR filter bracket (200).

[0111] In FIG. 4, the inner side of the IR filter bracket (200) is shown as including an insulating layer (2002) and the outer side of the IR filter bracket (200) is shown as including an anti-reflection layer (2003), but is not limited thereto. For example, the inner side of the IR filter bracket (200) may include at least one of an insulating layer or an anti-reflection layer, and the outer side of the IR filter bracket (200) may include at least one of an insulating layer or an anti-reflection layer.

[0112] According to one embodiment, the IR filter bracket (200) is formed from a base material (200a) comprising a metal layer (2001) and an insulating layer (2002) attached to the metal layer (2001), so that one side of the IR filter bracket (200) where the insulating layer (2002) is not disposed may be exposed to the outside. For example, at least a portion of the end of the second part (220) may not include an insulating layer. For example, one side (221) of the end of the second part (220) may not include an insulating layer. According to one embodiment, at least one of an insulating member or an anti-reflection member may be disposed on one side of the IR filter bracket (200) where the insulating layer (2002) is not disposed. Accordingly, the phenomenon of light being reflected by one side of the IR filter bracket (200) where the insulating layer (2002) is not disposed (e.g., flare phenomenon) may be prevented or reduced.

[0113] According to one embodiment, when the IR filter bracket (200) is formed of a metal material (e.g., when the IR filter bracket (200) includes a metal layer), the thickness of the IR filter bracket (200) may be thinner than when the IR filter bracket is formed of an injection molded material. In one example, the thickness of the IR filter bracket (200) may be about 0.2 mm or less. For example, the thickness of the IR filter bracket (200) may be about 0.1 mm. The thickness of the metal layer (2001) may be about 0.05 mm. The thickness of the insulating layer (2002) may be about 0.025 mm. The thickness of the anti-reflection layer (2003) may be about 0.025 mm. However, it is not limited thereto.

[0114] FIG. 5 is a cross-sectional perspective view illustrating the end of a second part of an IR filter bracket according to one embodiment.

[0115] The configuration of FIG. 5 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0116] When referring to FIG. 4, one side (321) of the end of the second part (320) according to one embodiment may not include at least one of an insulating layer or an anti-reflective layer. In this case, at least a portion of the second part (320) may be formed by bending toward a different direction. For example, the second part (320) may be formed by bending one side (321) of the end of the second part (320) toward the image sensor (150). For example, the end of the second part (320) may be formed by bending toward the direction from the filter (160) toward the image sensor (150) (e.g., the optical axis direction). One side (321) of the end of the second part (320) may face the image sensor (150). For example, one side (321) of the end of the second part (320) may face the light receiving portion (152) of the image sensor (150). For example, one side (321) of the end of the second part (320) may face in the opposite direction to the blocking member (170). Thus, the phenomenon of light reflection (e.g., flare) by one side (e.g., one side (321)) of the second part (320) that does not include an insulating layer may be prevented or reduced.

[0117] FIG. 6 is a cross-sectional view illustrating the end of a second part of an IR filter bracket according to one embodiment.

[0118] The configuration of FIG. 6 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0119] Referring to FIG. 6, the second part (320) may include an end that overlaps with the blocking member (170). The second part (320) may be bent at least once so that the end of the second part (320) faces the image sensor (150). For example, the second part (320) may be bent at least once so that one side (321) of the end of the second part (320) faces the image sensor (150).

[0120] According to one embodiment, the blocking member (170) may be positioned so as to protrude further toward the interior of the opening than the end of the second part (320). For example, one side (321) of the end of the second part (320) may completely overlap with the blocking member (170). However, it is not limited thereto.

[0121] According to one embodiment, the end of the second part (320) may be substantially parallel to the third part (330). The end of the second part (320) may be oriented in a different direction from the first part (310). For example, the end of the second part (320) may be substantially perpendicular to the first part (310). However, it is not limited thereto. For example, the end of the second part (320) may form an angle of inclination with at least one of the first part (310) or the third part (330).

[0122] According to one embodiment, the end of the second part (320) may be spaced apart from the image sensor (150) by a predetermined distance. For example, one side (321) of the end of the second part (320) may be spaced apart from the image sensor (150) by a predetermined distance.

[0123] According to one embodiment, the printed circuit board (140) may include an opening. An image sensor (150) may be placed within the opening. For example, the image sensor (150) may be placed on a plate (180) within the opening.

[0124] FIG. 7 is a plan view of a printed circuit board having electrical elements arranged thereon, according to one embodiment.

[0125] The configuration of FIG. 7 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0126] According to one embodiment, a camera device (e.g., the camera device (100) of FIG. 1) may include at least one electrical element (1401). According to one embodiment, at least one electrical element (1401) may be disposed on a printed circuit board (140). At least one electrical element (1401) may be disposed at a location adjacent to an image sensor (150). For example, at least one electrical element (1401) may be disposed at a location adjacent to the edge of the image sensor (150). In one example, referring to FIG. 7, a plurality of electrical elements (1401) may be disposed on the printed circuit board (140). The plurality of electrical elements (1401) may be disposed to at least partially surround the edge of the image sensor (150).

[0127] According to one embodiment, the electrical element (1401) may include at least one of an IC, a capacitor, or a resistor chip. However, it is not limited thereto.

[0128] FIG. 8 is a cross-sectional perspective view illustrating an IR filter bracket covering an electrical element according to one embodiment.

[0129] The configuration of FIG. 8 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0130] According to one embodiment, the IR filter bracket (300) may be configured to protect at least one of at least one electrical component (1401), at least one connecting member (151), or image sensor (150) from electromagnetic waves generated from electronic components. For example, the IR filter bracket (300) may be positioned to shield at least one of at least one electrical component (1401), at least one connecting member (151), or image sensor (150) from electromagnetic waves generated from electronic components. The IR filter bracket (300) may prevent or reduce the ingress of dust and / or foreign matter into at least one of at least one electrical component (1401), at least one connecting member (151), or image sensor (150).

[0131] According to one embodiment, the IR filter bracket (300) may cover at least one electrical element (1401). For example, the upper part of the IR filter bracket (300) (e.g., the first part (310)) may cover at least one electrical element (1401). The IR filter bracket (300) may at least partially surround at least one electrical element (1401). For example, the third part (330) of the IR filter bracket (300) may surround at least one electrical element (1401) along the area where the at least one electrical element (1401) is placed.

[0132] According to one embodiment, the IR filter bracket (300) may cover at least one electrical element (1401) and at least one connecting member (151). For example, the upper part of the IR filter bracket (300) (e.g., a first part (310)) may cover at least one electrical element (1401) and at least one connecting member (151). The IR filter bracket (300) may at least partially surround at least one electrical element (1401) and at least one connecting member (151). For example, a third part (330) of the IR filter bracket (300) may surround at least one electrical element (1401) and at least one connecting member (151) along an area where at least one electrical element (1401) and at least one connecting member (151) are placed.

[0133] According to one embodiment, at least one of at least one electrical element (1401) or at least one connecting member (151) may be disposed inside the IR filter bracket (300). For example, at least one of at least one electrical element (1401) or at least one connecting member (151) may be disposed within the space formed by the IR filter bracket (300), the printed circuit board (140), and the image sensor (150).

[0134] According to one embodiment, the printed circuit board (140) may be divided into a first region and a second region by an IR filter bracket (300). For example, the printed circuit board (140) may be divided into a first region and a second region by a third part (330) of the IR filter bracket (300). For example, the first region may be placed inside the IR filter bracket (300). The second region may be placed outside the IR filter bracket (300). At least one of at least one electrical element (1401) or at least one connecting member (151) may be placed in the first region. In the present disclosure, the third part may be named a partition, a partition part, or a partition member. However, it is not limited thereto.

[0135] FIG. 9 is a cross-sectional view of a camera device according to one embodiment.

[0136] The configuration of FIG. 9 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0137] According to one embodiment, the housing (110) may be placed on at least one of a printed circuit board (140) or an IR filter bracket (300). The driving unit (130) may be placed on at least one of the printed circuit board (140) or the IR filter bracket (300). For example, the driving unit (130) may be placed on the printed circuit board (140). For example, the driving unit (130) may be placed on the IR filter bracket (300). For example, the driving unit (130) may be placed on both the printed circuit board (140) and the IR filter bracket (300). For example, a part of the driving unit (130) may be placed on the printed circuit board (140), and another part of the driving unit (130) may be placed on the IR filter bracket (300).

[0138] According to one embodiment, the housing (110) may be placed on at least one of a printed circuit board (140) or an IR filter bracket (300). For example, the housing (110) may be seated on at least one of the printed circuit board (140) or the IR filter bracket (300). The driving unit (130) may be placed on at least one of the printed circuit board (140) or the IR filter bracket (300). For example, the driving unit (130) may be seated on at least one of the printed circuit board (140) or the IR filter bracket (300).

[0139] According to one embodiment, in a process of aligning the lens assembly (120) and the image sensor (e.g., an active alignment process), the driving unit (130) may be positioned at a predetermined distance from at least one of the printed circuit board (140) or the IR filter bracket (300). For example, the driving unit (130) may be positioned at a predetermined distance from at least one of the printed circuit board (140) or the IR filter bracket (300). For example, the driving unit (130) may not come into contact with at least one of the printed circuit board (140) or the IR filter bracket (300).

[0140] According to one embodiment, when the lens assembly (120) and the image sensor are aligned in the alignment process, the driving unit (130) may be coupled to at least one of the printed circuit board (140) or the IR filter bracket (300). For example, the driving unit (130) may be bonded to at least one of the printed circuit board (140) or the IR filter bracket (300). For example, an adhesive member may be placed between the driving unit (130) and at least one of the printed circuit board (140) or the IR filter bracket (300). For example, the driving unit (130) may be bonded to at least one of the printed circuit board (140) or the IR filter bracket (300) through the adhesive member. For example, the driving unit (130) may be fixed to at least one of the printed circuit board (140) or the IR filter bracket (300) through the adhesive member. In one example, the adhesive member may be placed in a space formed with the driving unit (130) spaced apart from at least one of the printed circuit board (140) or the IR filter bracket (300). For example, the adhesive member may be placed in a space formed with the driving unit (130) spaced apart from at least one of the printed circuit board (140) or the IR filter bracket (300) while the lens assembly (120) and the image sensor are aligned.

[0141] According to one embodiment, the housing (110) and / or the driving unit (130) may be placed on a printed circuit board (140) so that the height of the camera device (e.g., the camera device (100) of FIG. 1) (e.g., the height in the direction of the optical axis) may be lowered. However, this is not limited thereto. For example, at least a portion of the housing (110) and / or at least a portion of the driving unit (130) may be placed on an IR filter bracket (300). For example, at least a portion of the housing (110) and / or at least a portion of the driving unit (130) may be placed on a first portion of the IR filter bracket (300) (e.g., the first portion (210) of FIG. 3).

[0142] According to one embodiment, the IR filter bracket (300) may be configured to protect at least one electrical element (1401) from a magnetic field generated from electronic components (e.g., a coil of a driving unit (130)). For example, the IR filter bracket (300) may be positioned to shield at least one electrical element (1401) from a magnetic field generated from electronic components. For example, the IR filter bracket (300) may be positioned to cover at least one electrical element (1401). For example, the IR filter bracket (300) may be positioned to surround at least one electrical element (1401). For example, the IR filter bracket (300) may be positioned to enclose at least one electrical element (1401).

[0143] FIG. 10 is a plan view illustrating a process of placing a portion of an IR filter bracket on a plate according to one embodiment.

[0144] The configuration of FIG. 10 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0145] Referring to FIG. 10(a), a printed circuit board (440) and an image sensor (150) may be placed on a plate (180). The printed circuit board (440) may form a first space (441) in which the image sensor (150) is placed. The first space (441) may be formed by being surrounded by the printed circuit board (140). The image sensor (150) may be placed within the first space (441).

[0146] According to one embodiment, the connecting member (151) can be connected to the printed circuit board (140) in an area adjacent to the first side of the image sensor (150) and in an area adjacent to the second side opposite the first side.

[0147] Referring to FIG. 10(b), at least a portion of the printed circuit board (440) may be removed. For example, at least a portion of the printed circuit board (440) may be removed to form at least one of a second space (442) or a third space (443). The printed circuit board (440) may form at least one of a first space (441), a second space (442), or a third space (443). The second space (442) and the third space (443) may be formed between the image sensor (150) and the printed circuit board (140). The second space (442) may be connected to the first space (441). The third space (443) may be connected to the first space (441).

[0148] According to one embodiment, the second space (442) and the third space (443) may be formed in an area where the connecting member (151) is not placed. For example, the second space (442) may be formed in an area adjacent to the third side that is substantially perpendicular to the first side and the second side of the image sensor (150). The third space (443) may be formed in an area adjacent to the fourth side that is substantially perpendicular to the first side and the second side of the image sensor (150). The fourth side may be opposite to the third side.

[0149] According to one embodiment, at least one of the second space (442) or the third space (443) is formed, so that the area of ​​the plate (180) visible between the image sensor (150) and the printed circuit board (140) can be increased.

[0150] Referring to FIG. 10(c), the IR filter bracket (500) may include at least one fourth part (541, 542). According to one embodiment, at least a portion of the IR filter bracket (500) may be positioned between the image sensor (145) and the printed circuit board (140). For example, at least one fourth part (541, 542) may be positioned within the space formed between the image sensor (145) and the printed circuit board (140). For example, the fourth part (541) may be positioned in the second space (442). For example, the fourth part (542) may be positioned in the third space (443).

[0151] According to one embodiment, at least a portion of the IR filter bracket (500) may be disposed on the plate (180). For example, at least one fourth portion (541, 542) may be disposed on the plate (180). For example, at least one fourth portion (541, 542) may be in contact with the plate (180). In the present disclosure, the fourth portion may be described as a portion that is in contact with the plate (180) and supports the IR filter bracket (500). In one example, the IR filter bracket (500) may include a plurality of fourth portions.

[0152] According to one embodiment, at least one fourth part (541, 542) may be placed in a portion where the connecting member (151) is not placed. For example, at least one connecting member (151) may be placed in an area adjacent to the first side of the image sensor (150), or in at least one of an area adjacent to the second side opposite the first side of the image sensor (150). At least one fourth part (541, 542) may be placed in an area adjacent to the third side of the image sensor (150), or in at least one of an area adjacent to the fourth side opposite the third side of the image sensor (150).

[0153] According to one embodiment, at least one fourth part (541, 542) may include a structure that reinforces the rigidity of the IR filter bracket (500). For example, at least one fourth part (541, 542) may include a beading structure. In this invention, the beading structure may be described as a structure having a protrusion shape that protrudes in the direction in which the side of at least one fourth part (541, 542) faces (e.g., the x-axis direction). For example, the inner side of at least one fourth part (541, 542) may include at least one protrusion protruding in a direction toward the interior of the IR filter bracket (500). The outer side of at least one fourth part (541, 542) may include at least one protrusion protruding in a direction toward the exterior of the IR filter bracket (500). However, it is not limited thereto.

[0154] The shape of the IR filter bracket (500) shown in (c) of FIG. 10 is a schematic representation of the IR filter bracket (500) and is not limited thereto.

[0155] In the present disclosure, the first space may be named the first cavity. The second space may be named the second cavity. The third space may be named the third cavity. However, it is not limited thereto.

[0156] FIG. 11 is a perspective view of an IR filter bracket including a fourth part according to one embodiment.

[0157] FIG. 12 is a side view of an IR filter bracket including a fourth part according to one embodiment.

[0158] The configurations of FIGS. 11 and FIGS. 12 may be referenced by configurations of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0159] Referring to FIGS. 11 and 12, an IR filter bracket (600) according to one embodiment may include a plurality of first parts (610). The plurality of first parts (610) may be arranged with a second part (620) in between. For example, a first part (610) may be formed on one side of the second part (620) and on the other side of the second part (620). For example, the plurality of first parts (610) may be arranged with an opening of the IR filter bracket (600) in between.

[0160] According to one embodiment, the third part (630) may form at least a portion of the side of the first part (610). However, it is not limited thereto. For example, the third part (630) may form at least a portion of the side of the second part (620).

[0161] According to one embodiment, the height of the third part (630) forming the side of the first part (610) may differ from the height of the third part (630) forming the side of the second part (620). For example, the height of the third part (630) forming the side of the first part (610) may be greater than the height of the third part (630) forming the side of the second part (620).

[0162] According to one embodiment, at least one fourth part (641) may be formed by protruding in the direction toward the back surface of the IR filter bracket (600) (e.g., the side facing the -z direction). For example, at least one fourth part (641) may be formed by protruding from the third part (630). For example, at least one fourth part (641) may protrude from the third part (630) in the direction toward the back surface of the IR filter bracket (600). In one example, at least one fourth part (641) may protrude from the third part (630) forming the side of the second part (620). However, it is not limited thereto.

[0163] According to one embodiment, at least one fourth part (641) may be positioned between a plurality of first parts (610). However, it is not limited thereto.

[0164] According to one embodiment, at least one fourth part (641) may be extended from the third part (630). However, it is not limited thereto.

[0165] Although not shown in FIGS. 11 and 12, the IR filter bracket (600) may include a plurality of fourth parts (641). The plurality of fourth parts (641) may be arranged with an opening of the IR filter bracket (600) in between.

[0166] When referring to FIG. 8, at least one of at least one connecting member (e.g., at least one connecting member (151) of FIG. 8) or at least one electrical element (e.g., at least one electrical element (1401) of FIG. 8) may be disposed within the IR filter bracket (600) according to one embodiment. For example, the first part (610) may cover at least one of the at least one connecting member (151) or at least one electrical element (1401). For example, at least one of the at least one connecting member (151) or at least one electrical element (1401) may be at least partially surrounded by a third part (630) forming a side of the first part (610).

[0167] FIG. 13 is a cross-sectional view in which an IR filter bracket including a fourth part is placed on a plate according to one embodiment.

[0168] The configuration of FIG. 13 may be referenced by configurations of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0169] According to one embodiment, the image sensor (150) may be placed within a first space that is at least partially enclosed by a printed circuit board (440). A fourth part (741) may be placed within a second space (442) between the printed circuit board (440) and the image sensor (150). For example, the fourth part (741) may be placed between the printed circuit board (440) and the image sensor (150). The fourth part (742) may be placed within a third space (443) between the printed circuit board (440) and the image sensor (150). For example, the fourth part (742) may be placed between the printed circuit board (440) and the image sensor (150).

[0170] According to one embodiment, at least one fourth part (741, 742) may be oriented in the same direction as the third part (730). For example, at least one fourth part (741, 742) may be substantially parallel to the third part (730). However, it is not limited thereto.

[0171] According to one embodiment, at least one fourth part (741, 742) may be oriented in a different direction from the first part (710). For example, at least one fourth part (741, 742) may be substantially perpendicular to the first part (710). However, it is not limited thereto.

[0172] According to one embodiment, at least one fourth part (741, 742) may be oriented in a different direction from the second part (720). For example, at least one fourth part (741, 742) may be substantially perpendicular to the second part (720). However, it is not limited thereto.

[0173] Referring to FIG. 13, at least one fourth part (741, 742) according to one embodiment may extend from the first part (710). For example, at least one fourth part (741, 742) may protrude from the first part (710). For example, at least one fourth part (741, 742) may protrude from the first part (710) in a direction toward the plate (180) (e.g., the -z direction). However, it is not limited thereto.

[0174] According to one embodiment, at least one fourth part (741, 742) may be formed by being drawn out so as to be located closer to the plate (180) than the third part (730). For example, the end of at least one fourth part (741, 742) may be in contact with the plate (180), and the end of the third part (730) may be spaced apart from the plate (180) by a predetermined distance. For example, the end of the third part (730) may be spaced apart from the plate (180) by the height of the printed circuit board (440).

[0175] According to one embodiment, the third part (730) may be placed on the printed circuit board (440). For example, the third part (730) may be in contact with the printed circuit board (440). At least one fourth part (741, 742) may be placed on the plate (180). For example, at least one fourth part (741, 742) may be in contact with the plate (180). At least one fourth part (641) may be in contact with the plate (180) to support the IR filter bracket (600), and the third part (630) may be in contact with the printed circuit board (440) to support the IR filter bracket (600). Thus, the IR filter bracket (600) can prevent or reduce damage to the image sensor (150) caused by external impact.

[0176] FIG. 14 is a cross-sectional view illustrating a first bonding material according to one embodiment.

[0177] The configuration of FIG. 14 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0178] According to one embodiment, a camera device (e.g., the camera device (100) of FIG. 1) may include at least one bonding material configured to reinforce the rigidity of the camera device. For example, the camera device may include a first bonding material (190). In the present disclosure, the first bonding material (190) may be described as a configuration that bonds at least one fourth portion of an IR filter bracket to another configuration. However, it is not limited thereto.

[0179] According to one embodiment, a first bonding material (190) may be disposed between a printed circuit board (440) and an image sensor (150). For example, the first bonding material (190) may be disposed in at least a part of at least one of a first space (e.g., the first space (441) of FIG. 10), a second space (e.g., the second space (442) of FIG. 10), or a third space (e.g., the third space (443) of FIG. 10). For example, the first bonding material (190) may be disposed within a space enclosed by the printed circuit board (440), the image sensor (150), the plate (180), and at least one fourth part (741, 742).

[0180] According to one embodiment, the first bonding material (190) may be in contact with at least one of a printed circuit board (440), an image sensor (150), a plate (180), or at least one fourth part (741, 742). The first bonding material (190) may bond at least one fourth part (741, 742) and the plate (180). However, it is not limited thereto. For example, the first bonding material (190) may bond at least two of the printed circuit board (440), the image sensor (150), the plate (180), or at least one fourth part (741, 742).

[0181] According to one embodiment, the first bonding material (190) may include a thermosetting material. For example, the first bonding material (190) may include epoxy. However, it is not limited thereto.

[0182] FIG. 15 is a plan view of an IR filter bracket including at least one hole according to one embodiment.

[0183] The configuration of FIG. 15 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0184] According to one embodiment, the IR filter bracket (800) may include a portion forming the upper (or upper surface) of the IR filter bracket (800). For example, the IR filter bracket (800) may include a first portion (810) and a second portion (820). However, it is not limited thereto. For example, referring to FIG. 15, the IR filter bracket (800) may further include at least one fifth portion (850) forming the upper (or upper surface) of the IR filter bracket (800). The fifth portion (850) may be located at least partially between the first portion (810) and the second portion (820). In one example, the fifth portion (850) may at least partially surround the second portion (820). For example, the fifth portion (850) may at least partially surround the edge of the second portion (820).

[0185] According to one embodiment, the IR filter bracket (800) may include at least one hole. For example, the upper portion of the IR filter bracket (800) may include at least one hole. For example, referring to FIG. 15, the IR filter bracket (800) may include at least one first hole (802) and at least one second hole (803). However, it is not limited thereto. For example, the IR filter bracket (800) may omit at least one first hole (802) or at least one second hole (803), or may include at least one additional hole.

[0186] According to one embodiment, at least one first hole (802) may be formed in the first part (810). At least one second hole (803) may be formed in the fifth part (850).

[0187] According to one embodiment, the shape of the first hole (802) may correspond to the shape of the first part (810). For example, the first hole (802) may be formed along the length direction (e.g., the y-axis direction) of the first part (810). However, it is not limited thereto.

[0188] According to one embodiment, the longitudinal direction of the first hole (802) may be substantially parallel to the longitudinal direction of the second hole (803). However, it is not limited thereto.

[0189] The number of first holes (802) and the shape of the first holes (802) according to one embodiment are not limited to those shown in FIG. 15. The number of second holes (803) and the shape of the second holes (803) according to one embodiment are not limited to those shown in FIG. 15.

[0190] FIG. 16 is a cross-sectional perspective view illustrating a second bonding material disposed within an IR filter bracket including at least one hole, according to one embodiment.

[0191] FIG. 17 is a cross-sectional view illustrating a second bonding material disposed within an IR filter bracket including at least one hole, according to one embodiment.

[0192] The configurations of FIGS. 16 and FIGS. 17 may be referenced by configurations of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to configurations of other drawings.

[0193] Referring to FIGS. 16 and 17, according to one embodiment, at least one first hole (802) may be formed at a position corresponding to at least one electrical element (1401). For example, at least one electrical element (1401) may overlap with at least one first hole (802). For example, when viewed from the optical axis direction (e.g., the -z direction), at least one electrical element (1401) may be visible through at least one first hole (802).

[0194] According to one embodiment, at least one second hole (803) may be formed at a position corresponding to at least one connecting member (151). For example, at least one connecting member (151) may overlap with at least one second hole (803). For example, when viewed from the optical axis direction (e.g., the -z direction), at least one connecting member (151) may be visible through at least one second hole (803).

[0195] According to one embodiment, a camera device (e.g., the camera device (100) of FIG. 1) may include at least one bonding material configured to reinforce the rigidity of the camera device. For example, the camera device may include a second bonding material (890).

[0196] According to one embodiment, a second bonding material (890) may be disposed within a space formed by an IR filter bracket (800), a printed circuit board (140), and an image sensor (150). For example, the second bonding material (890) may be disposed within a space enclosed by an IR filter bracket (800), a printed circuit board (140), and an image sensor (150). For example, the second bonding material (890) may be disposed within a space formed by a first part (810), a third part (830), a fifth part (850), a printed circuit board (140), and an image sensor (150). However, it is not limited thereto. For example, the second bonding material (890) may be disposed within a space formed by an IR filter bracket (800), a printed circuit board (140), an image sensor (150), and a plate (180). For example, the second bonding material (890) can be placed between the printed circuit board (140) and the image sensor (150).

[0197] According to one embodiment, the IR filter bracket (800) may be used as a mold. For example, the IR filter bracket (800) may provide a space into which the second bonding material (890) is filled. Referring to FIG. 17, according to one embodiment, the second bonding material (890) may be filled within the space formed by the IR filter bracket (800), the printed circuit board (140), and the image sensor (150). For example, the second bonding material (890) may be filled within the space enclosed by the IR filter bracket (800), the printed circuit board (140), and the image sensor (150). For example, the second bonding material (890) may be filled within the space formed by the first part (810), the third part (830), the fifth part (850), the printed circuit board (140), and the image sensor (150). However, it is not limited thereto. For example, the second bonding material (890) can be filled within the space formed by the IR filter bracket (800), the printed circuit board (140), the image sensor (150), and the plate (180).

[0198] According to one embodiment, the second bonding material (890) may be configured to be injected into the IR filter bracket (800) through at least one hole formed in the IR filter bracket (800). For example, referring to FIG. 16, the second bonding material (890) may be injected into the IR filter bracket (800) through at least one of at least one first hole (802) or at least one second hole (803).

[0199] According to one embodiment, a second bonding material (890) injected into the IR filter bracket (800) through at least one hole may be applied within the space formed by the IR filter bracket (800), the printed circuit board (140), and the image sensor (150). For example, the second bonding material (890) may be applied within the space enclosed by the IR filter bracket (800), the printed circuit board (140), and the image sensor (150). For example, the second bonding material (890) may be applied within the space formed by the first part (810), the third part (830), the fifth part (850), the printed circuit board (140), and the image sensor (150). However, it is not limited thereto. For example, the second bonding material (890) may be applied within the space formed by the IR filter bracket (800), the printed circuit board (140), the image sensor (150), and the plate (180).

[0200] According to one embodiment, the second bonding material (890) may be in contact with at least one of an IR filter bracket (800), a printed circuit board (140), an image sensor (150), or a plate (180). However, it is not limited thereto. According to one embodiment, the second bonding material (890) may be in contact with at least one connecting member (151). For example, the second bonding material (890) may cover at least one connecting member (151). For example, the second bonding material (890) may be positioned to at least partially wrap around at least one connecting member (151). According to one embodiment, the second bonding material (890) may be in contact with at least one electrical element (1401). For example, the second bonding material (890) may cover at least one electrical element (1401). For example, the second bonding material (890) may be positioned to at least partially wrap at least one electrical element (1401).

[0201] According to one embodiment, the second bonding material (890) can bond at least two of an IR filter bracket (800), a printed circuit board (140), an image sensor (150), a plate (180), at least one connecting member (151), or at least one electrical element (1401).

[0202] According to one embodiment, the second bonding material (890) may include a thermosetting material. For example, the second bonding material (890) may include epoxy. However, it is not limited thereto.

[0203] According to one embodiment, the IR filter bracket (800) can be used as a mold for at least one bonding material (e.g., a second bonding material (890)) to improve the rigidity of the camera device and / or parts of the camera device. By using the IR filter bracket (800) as a mold for at least one bonding material (e.g., a second bonding material (890)), a camera device with improved rigidity can be easily manufactured. By using the IR filter bracket (800) as a mold for at least one bonding material (e.g., a second bonding material (890)), a camera device with improved rigidity can be manufactured at a low cost, and economic efficiency can be improved.

[0204] According to one embodiment, the fifth part (850) may form a step with respect to the first part (810). For example, the length at which the fifth part (850) is spaced from the printed circuit board (140) (or plate (180)) may differ from the length at which the first part (810) is spaced from the printed circuit board (140) (or plate (180)). For example, the length at which the fifth part (850) is spaced from the printed circuit board (140) (or plate (180)) may be less than or equal to the length at which the first part (810) is spaced from the printed circuit board (140) (or plate (180)). However, it is not limited thereto.

[0205] According to one embodiment, the fifth part (850) may form a step with the second part (820). For example, the length at which the fifth part (850) is spaced from the image sensor (150) (or plate (180)) may differ from the length at which the second part (820) is spaced from the image sensor (150) (or plate (180)). For example, the length at which the fifth part (850) is spaced from the image sensor (150) (or plate (180)) may be greater than or equal to the length at which the second part (820) is spaced from the image sensor (150) (or plate (180)). However, it is not limited thereto.

[0206] According to one embodiment, the fifth part (850) may be located at a position lower than the first part (810) and higher than the second part (820). However, it is not limited thereto.

[0207] FIG. 18 is a cross-sectional view of a printed circuit board having an IR filter bracket including at least one hole arranged thereon, according to one embodiment.

[0208] The configuration of FIG. 18 may be referenced by the configuration of other drawings to the extent that they are not disposed of from each other. The same terms and / or the same reference numerals have been used for configurations that are identical or substantially identical to the configuration of other drawings.

[0209] According to one embodiment, the IR filter bracket (900) may include a first part (910), a second part (920), a third part (930), and a fifth part (950). However, it is not limited thereto. For example, referring to FIG. 18, the IR filter bracket (900) may further include at least one sixth part (960) located between the first part (910) and the fifth part (950). The sixth part (960) may form at least a portion of the upper part (or upper surface) of the IR filter bracket (900).

[0210] According to one embodiment, the sixth part (960) may form a step with the first part (910). The sixth part (960) may form a step with the fifth part (950). In one example, the sixth part (960) may be located at a position higher than the second part (920) and lower than the first part (910). The sixth part (960) may be located at a position higher than the second part (920) and lower than the fifth part (950). However, it is not limited thereto.

[0211] According to one embodiment, the sixth portion (960) may include at least one third hole (904). The at least one third hole (904) may be formed at a position corresponding to a hole formed in the printed circuit board (140). For example, the at least one third hole (904) may be formed at a position that at least partially overlaps with a hole formed in the printed circuit board (140).

[0212] According to one embodiment, the third hole (904) may be formed between the first hole (902) and the second hole (903). However, it is not limited thereto.

[0213] According to one embodiment, the second bonding material (990) may be disposed within a space formed by the IR filter bracket (900), the printed circuit board (140), the image sensor (150), and the plate (180). For example, the second bonding material (990) may be disposed within a hole formed in the printed circuit board. For example, the second bonding material (990) may be disposed within a space formed by the first part (910), the third part (930), the fifth part (950), the sixth part (960), the printed circuit board (140), the image sensor (150), and the plate (180). In one example, the second bonding material (990) may be disposed within a groove formed in the printed circuit board (140).

[0214] According to one embodiment, the IR filter bracket (900) may be used as a mold. For example, the IR filter bracket (900) may provide a space into which a second bonding material (990) is filled. Referring to FIG. 18, according to one embodiment, the second bonding material (990) may be filled within a space formed by the IR filter bracket (900), the printed circuit board (140), and the image sensor (150). For example, the second bonding material (990) may be filled within a space enclosed by the IR filter bracket (900), the printed circuit board (140), and the image sensor (150). For example, the second bonding material (990) may be filled within a space formed by the first part (910), the third part (930), the fifth part (950), the sixth part (960), the printed circuit board (140), and the image sensor (150). However, it is not limited thereto. For example, the second bonding material (990) can be filled within the space formed by the IR filter bracket (900), the printed circuit board (140), the image sensor (150), and the plate (180). In one example, the second bonding material (990) can be filled within a groove formed in the printed circuit board (140).

[0215] According to one embodiment, the second bonding material (990) may be configured to be injected into the IR filter bracket (900) through at least one hole formed in the IR filter bracket (900). For example, referring to FIG. 18, the second bonding material (990) may be injected into the IR filter bracket (800) through at least one of at least one first hole (902), at least one second hole (903), or at least one third hole (904).

[0216] According to one embodiment, a second bonding material (990) injected into the IR filter bracket (900) through at least one hole may be applied within the space formed by the IR filter bracket (900), the printed circuit board (140), and the image sensor (150). For example, the second bonding material (990) may be applied within the space enclosed by the IR filter bracket (900), the printed circuit board (140), and the image sensor (150). For example, the second bonding material (990) may be applied within the space formed by the first part (910), the third part (930), the fifth part (950), the sixth part (960), the printed circuit board (140), and the image sensor (150). However, it is not limited thereto. For example, the second bonding material (990) may be applied within the space formed by the IR filter bracket (900), the printed circuit board (140), the image sensor (150), and the plate (180). In one example, the second bonding material (990) may be applied within a groove formed in the printed circuit board (140).

[0217] According to one embodiment, the second bonding material (990) may be in contact with at least one of an IR filter bracket (900), a printed circuit board (140), an image sensor (150), or a plate (180). However, it is not limited thereto.

[0218] According to one embodiment, the second bonding material (990) may be in contact with at least one connecting member (151). For example, the second bonding material (990) may cover at least one connecting member (151). For example, the second bonding material (990) may be positioned to at least partially wrap around at least one connecting member (151).

[0219] According to one embodiment, the second bonding material (990) may be in contact with at least one electrical element (1401). For example, the second bonding material (990) may cover at least one electrical element (1401). For example, the second bonding material (990) may be positioned to at least partially wrap the at least one electrical element (1401).

[0220] According to one embodiment, the second bonding material (990) can bond at least two of an IR filter bracket (900), a printed circuit board (140), an image sensor (150), a plate (180), at least one connecting member (151), or at least one electrical element (1401).

[0221] According to one embodiment, the IR filter bracket (900) can be connected to the ground of the printed circuit board (140).

[0222] Hereinafter, the electronic device of the present disclosure is extended or embodied with reference to FIGS. 19 and 20. For example, the aforementioned camera device (e.g., the camera device (100) of FIG. 1) may be referenced by the first optical sensor (1030) and the second optical sensor (1300) of FIGS. 19 and 20.

[0223] FIG. 19 is a front perspective view of an electronic device according to one embodiment. FIG. 20 is a rear perspective view of an electronic device according to one embodiment.

[0224] Referring to FIGS. 19 and 20, an electronic device (1000) according to one embodiment may include a housing (110) comprising a first surface (or front) (1100A), a second surface (or rear) (1100B), and a side (or side wall) (1100C) surrounding the space between the first surface (1100A) and the second surface (1100B). In one embodiment, the housing (1100) may refer to a structure forming part of the first surface (1100A), the second surface (1100B), and the side (1100C).

[0225] According to one embodiment, the first surface (1100A) may be formed by a front plate (1210) in which at least one portion is substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). In one example, the front plate (1210) may include a curved portion that extends seamlessly from the first surface (1100A) toward the rear plate (1110) at at least one side edge portion.

[0226] In one embodiment, the second surface (1100B) may be formed by a substantially opaque back plate (1110). In one example, the back plate (1110) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. In one example, the back plate (1110) may include a curved portion that extends seamlessly from the second surface (1100B) toward the front plate (1210) at at least one end. In this disclosure, the back plate may be referred to as a back cover.

[0227] In one embodiment, the side (1100C) may be formed by a side member (or side bezel structure or side wall) comprising metal and / or polymer in combination with the front plate (1210) and the rear plate (1110). In one example, the side (1100C) is located to the right of the electronic device (1000) (e.g., the +x direction in FIG. 19) and comprises a first side (1111) extending along a first direction (e.g., the +y direction in FIG. 19), a second side (1112) parallel to the first side (1111) and extending along the first direction, a third side (1113) extending along a second direction perpendicular to the first direction (e.g., the +x direction in FIG. 19) and connecting one end of the first side (1111) (e.g., one end in the +y direction in FIG. 19) and one end of the second side (1112) (e.g., one end in the +y direction in FIG. 19), and / or parallel to the third side (1113) and connecting the other end of the first side (1111) (e.g., one end in the -y direction in FIG. 19) and the other end of the second side (1112) (e.g., FIG. 19 It may include a fourth side (1114) connecting one end (in the -y direction).

[0228] According to one embodiment, the electronic device (1000) may include at least one of a display (1200), a first optical sensor (e.g., a sensor module and / or a camera module) (1030), a connector hole (1040), or an audio module (1050). In one example, the electronic device (1000) may omit at least one or additionally include other components. For example, the electronic device (1000) may further include a sensor module not illustrated. The electronic device (1000) may omit a key input device (1070).

[0229] In one embodiment, a sensor such as a proximity sensor, an ambient light sensor, an image sensor, or an iris sensor may be integrated into the display (1200) or positioned adjacent to the display (1200) within the area provided by the front plate (1210).

[0230] In one embodiment, the display (1200) may be visually exposed through a significant portion of the front plate (1210). In one example, the display (1200) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one example, the corners of the display (1200) may be formed to be largely identical to the adjacent outer shape (e.g., a curved surface) of the front plate (1210).

[0231] In one embodiment, the connector hole (1040) may accommodate an external electronic device (e.g., a connector for transmitting and receiving power and / or data with the electronic device, and / or a connector for transmitting and receiving audio signals with the external electronic device). For example, the connector hole (1040) may include a USB connector or an earphone jack (not shown) (or, "earphone interface"). In one embodiment, the USB connector and the earphone jack may be implemented as a single hole, and in one embodiment, the electronic device (1000) may transmit and receive power and / or data or transmit and receive audio signals with the external device without a separate connector hole.

[0232] In one embodiment, the audio module (1050) may include a microphone hole and a speaker hole. A microphone for acquiring external sound may be placed inside the microphone hole, and a plurality of microphones may be placed inside to detect the direction of sound. In one example, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker (e.g., a piezo speaker) may be included without a speaker hole. The speaker hole may include an external speaker hole and a receiver hole for calls.

[0233] In one embodiment, the key input device (1070) may be positioned on the side (1100C) of the housing (1100). In one embodiment, the electronic device (1000) may not include some or all of the aforementioned key input devices (1070), and the key input devices (1070) that are not included may be implemented in other forms, such as soft keys, on the display (1200). In one example, the key input device (1070) may include at least a portion of a fingerprint sensor positioned on the second side (1100B) of the housing (1100).

[0234] In one embodiment, the second optical sensor (1300) and the third optical sensor (1060) may be placed on the second side (1100B) of the electronic device (1000). The second optical sensor (1300) may include a plurality of cameras. In one example, the third optical sensor (1060) may include a flash. In one example, the first optical sensor (1030), the second optical sensor (1300), and the third optical sensor (1060) may include one or more lenses, an image sensor, and / or an image processor. The third optical sensor (1060) may include a light-emitting diode or a xenon lamp. In one example, two or more lenses (e.g., an infrared camera, a wide-angle and / or telephoto lens) and image sensors may be placed on one side of the electronic device (1000).

[0235] In one embodiment, the electronic device (1000) may generate an electronic signal or data value corresponding to an internal operating state or an external environmental state by including a sensor module not illustrated. The electronic device (1000) may further include at least one of a sensor module not illustrated, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a temperature sensor, or a humidity sensor.

[0236] As described above, an electronic device according to one embodiment (e.g., the camera device (100) of FIG. 1 or the electronic device (1000) of FIG. 19) may include a printed circuit board (e.g., the printed circuit board (140) of FIG. 1). The electronic device may include an image sensor (e.g., the image sensor (150) of FIG. 1) connected to the printed circuit board. The electronic device may include an IR filter bracket (e.g., the IR filter bracket (200) of FIG. 1) including an opening (e.g., the opening (201) of FIG. 3) formed at a position corresponding to the image sensor. The IR filter bracket may cover the image sensor at least partially. The electronic device may include a filter (e.g., the filter (160) of FIG. 1) placed on the IR filter bracket. The filter may cover the opening. The IR filter bracket may include a first portion (e.g., the first portion (210) in FIG. 3) that at least partially covers at least one of the image sensor or the printed circuit board, and a second portion (e.g., the second portion (220) in FIG. 3) that extends from the first portion. The filter may be placed in the second portion. The second portion may be located closer to the image sensor in the direction from the filter toward the image sensor than the first portion so as to form a step with the first portion. The IR filter bracket may include a metal layer (e.g., the metal layer (2001) in FIG. 4), and an insulating layer (e.g., the insulating layer (2002) in FIG. 4) that forms at least a portion of the inner side of the IR filter bracket.

[0237] According to one embodiment, the first part and the second part may be formed with the insulating layer attached to the metal layer.

[0238] According to one embodiment, the outer side of the IR filter bracket may include an anti-reflection layer (e.g., the anti-reflection layer (2003) of FIG. 4). The metal layer may be disposed between the anti-reflection layer and the insulating layer.

[0239] According to one embodiment, the IR filter bracket may include a third portion (e.g., the third portion (230) of FIG. 3) forming a side of the IR filter bracket. The third portion may be disposed on the printed circuit board. The third portion may extend from the first portion. The third portion may be substantially perpendicular to the first portion. The first portion may be substantially parallel to the second portion. The first portion may be located at least partially between the first portion and the third portion.

[0240] According to one embodiment, the electronic device may include a plate (e.g., the plate (180) of FIG. 3) that supports the printed circuit board. The image sensor may be placed on the plate. The printed circuit board may be placed to at least partially surround the image sensor.

[0241] According to one embodiment, the first portion may be spaced apart from the plate by a first length (e.g., the first length (D1) in FIG. 3) in the direction from the filter toward the image sensor. The second portion may be spaced apart from the plate by a second length (e.g., the second length (D2) in FIG. 3) in the direction from the filter toward the image sensor. The first length may be greater than the second length.

[0242] According to one embodiment, the IR filter bracket may include at least one fourth portion (e.g., the fourth portion (741, 742) of FIG. 13) disposed between the printed circuit board and the image sensor. The at least one fourth portion may be disposed on the plate. The at least one fourth portion may be substantially perpendicular to the second portion.

[0243] According to one embodiment, the electronic device may include a first bonding material (e.g., the first bonding material (190) of FIG. 14) disposed between the printed circuit board and the image sensor. The first bonding material may bond the at least one four parts and the plate.

[0244] According to one embodiment, the IR filter bracket may include a third portion forming a side of the IR filter bracket. The third portion may be disposed on the printed circuit board. The fourth portion may be formed to protrude so as to be located at a position closer to the plate than the third portion.

[0245] According to one embodiment, the electronic device may include a blocking member (e.g., a blocking member (170) of FIG. 3) disposed on the filter. At least a portion of the blocking member may be disposed at a position overlapping with the second portion in the direction from the filter toward the image sensor.

[0246] According to one embodiment, the width of the portion of the second part that overlaps with the blocking member (e.g., width (W1) in FIG. 3) may be smaller than or equal to the width of the blocking member (e.g., width (W2) in FIG. 3).

[0247] According to one embodiment, the second portion may include an end portion that overlaps with the blocking member. The second portion may be bent at least once so that the end portion of the second portion faces the image sensor.

[0248] According to one embodiment, the electronic device may include at least one connecting member (e.g., connecting member (151) of FIG. 3) connecting the image sensor and the printed circuit board. The electronic device may include at least one electrical element (e.g., electrical element (1401) of FIG. 8) disposed on the printed circuit board at a location adjacent to the image sensor. The IR filter bracket may cover at least one of the at least one connecting member or the at least one electrical element. At least one of the at least one connecting member or the at least one electrical element may be disposed within the space formed by the IR filter bracket, the printed circuit board, and the image sensor.

[0249] According to one embodiment, the electronic device may include a second bonding material (e.g., the second bonding material (890) of FIG. 16) disposed within a space formed by the IR filter bracket, the printed circuit board, and the image sensor. The IR filter bracket may include at least one hole (e.g., at least one first hole (802) of FIG. 15). The second bonding material may be configured to be injected into the space through the at least one hole.

[0250] According to one embodiment, the electronic device may include a plate supporting the printed circuit board. The second bonding material may be positioned to contact at least one of the printed circuit board, the image sensor, the plate, or the IR filter bracket within the space.

[0251] As described above, a camera device according to one embodiment (e.g., the camera device (100) of FIG. 1) may include a printed circuit board (e.g., the printed circuit board (140) of FIG. 1). The camera device may include an image sensor (e.g., the image sensor (150) of FIG. 1) connected to the printed circuit board. The image sensor may include a light receiving part (e.g., the light receiving part (152) of FIG. 5). The camera device may include an infrared filter (e.g., the filter (160) of FIG. 2) disposed at a predetermined distance from the image sensor at a position corresponding to the light receiving part of the image sensor. The camera device may include a metal member (e.g., the IR filter bracket (200) of FIG. 1) that covers the image sensor at least partially. The metal member may support the infrared filter. The metal member may include a first portion (e.g., the first portion (210) in FIG. 3) that at least partially covers at least one of the printed circuit board or the image sensor, and a second portion (e.g., the second portion (220) in FIG. 3) that extends from the first portion. The infrared filter may be disposed in the second portion. The second portion may be located closer to the image sensor than the first portion in the direction from the infrared filter toward the image sensor so as to form a step with the first portion. The metal member may include a metal layer (e.g., the metal layer (2001) in FIG. 4), and an insulating layer (e.g., the insulating layer (2002) in FIG. 4) that forms at least a portion of the inner side of the metal member.

[0252] According to one embodiment, the first part and the second part may be formed with the insulating layer attached to the metal layer.

[0253] According to one embodiment, the camera device may include a plate (e.g., the plate (180) of FIG. 3) that supports the printed circuit board. The image sensor may be placed on the plate. The printed circuit board may be placed to at least partially surround the image sensor.

[0254] According to one embodiment, the first portion may be spaced apart from the plate by a first length (e.g., the first length (D1) in FIG. 3) in the direction from the infrared filter toward the image sensor. The second portion may be spaced apart from the plate by a second length (e.g., the second length (D2) in FIG. 3) in the direction from the infrared filter toward the image sensor. The first length may be greater than the second length.

[0255] According to one embodiment, the camera device may include a blocking member (e.g., the blocking member (170) of FIG. 2) disposed on the infrared filter. At least a portion of the blocking member may be disposed at a position overlapping with the second portion in the direction from the infrared filter toward the image sensor.

[0256] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0257] Additionally, in the present disclosure, "comprising at least one of a, b, or c" may mean "comprising only a, comprising only b, comprising only c, or comprising a combination of two or more (comprising a and b, comprising b and c, comprising a and c, or comprising all of a, b, and c)."

[0258] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

Claims

1. In an electronic device, Printed circuit board; An image sensor connected to the above printed circuit board; An IR (infrared) filter bracket including an opening formed at a position corresponding to the image sensor and covering the image sensor at least partially; and A filter disposed on the IR filter bracket and covering the opening; comprising The IR filter bracket comprises a first portion that at least partially covers at least one of the image sensor or the printed circuit board, and a second portion extending from the first portion and on which the filter is disposed. The second portion is positioned closer to the image sensor in the direction from the filter toward the image sensor than the first portion so as to form a step difference with the first portion, and The above IR filter bracket comprises a metal layer and an insulating layer forming at least a portion of the inner side of the IR filter bracket. Electronic device.

2. In Claim 1, The first and second parts above are formed with the insulating layer attached to the metal layer, Electronic device.

3. In Claim 1, The outer side of the above IR filter bracket includes an anti-reflection layer, and The metal layer is disposed between the anti-reflection layer and the insulating layer, Electronic device.

4. In Claim 1, The above IR filter bracket further includes a third part forming a side of the above IR filter bracket, and The third portion is disposed on the printed circuit board and extends from the first portion, and is substantially perpendicular to the first portion, and The first part is substantially parallel to the second part and is located at least partially between the first part and the third part. Electronic device.

5. In Claim 1, It further includes a plate supporting the above printed circuit board, The image sensor is placed on the plate, and The above printed circuit board is positioned to at least partially surround the image sensor, Electronic device.

6. In Claim 5, The first portion is spaced apart from the plate by a first length in the direction from the filter toward the image sensor, and The second portion is spaced apart from the plate by a second length in the direction from the filter toward the image sensor, and The first length above is greater than the second length, Electronic device.

7. In Claim 6, The above IR filter bracket further includes at least one fourth part disposed between the printed circuit board and the image sensor, and The above at least one fourth part is disposed on the plate and substantially perpendicular to the second part, Electronic device.

8. In Claim 7, A first bonding material disposed between the printed circuit board and the image sensor, and further comprising bonding the at least one fourth part and the plate, electronic device, 9. In Claim 7, The above IR filter bracket further includes a third part forming a side of the above IR filter bracket, and The above third part is disposed on the printed circuit board, and The above fourth part is formed to protrude so as to be located at a position closer to the plate than the above third part, Electronic device.

10. In Claim 1, It further includes a blocking member disposed on the above filter, and At least a portion of the blocking member is positioned at a location overlapping with the second portion in the direction from the filter toward the image sensor, Electronic device.

11. In Claim 10, The width of the portion of the second part that overlaps with the blocking member is smaller than the width of the blocking member. Electronic device.

12. In Claim 10, The second portion includes an end portion that overlaps with the blocking member, and the end portion of the second portion is bent at least once so as to face the image sensor. Electronic device.

13. In Claim 1, At least one connecting member (151) connecting the image sensor and the printed circuit board; and It further includes at least one electrical element disposed on the printed circuit board at a location adjacent to the image sensor, and The above IR filter bracket covers at least one of the at least one connecting member or the at least one electrical element, and At least one of the above-mentioned at least one connecting member or the above-mentioned at least one electrical element is disposed within the space formed by the IR filter bracket, the printed circuit board, and the image sensor, Electronic device.

14. In Claim 1, It further includes a second bonding material disposed within the space formed by the IR filter bracket, the printed circuit board, and the image sensor, and The above IR filter bracket includes at least one hole, and The second bonding material is configured to be injected into the space through the at least one hole. Electronic device.

15. In Claim 14, It further includes a plate supporting the above printed circuit board, The second bonding material is positioned to be in contact with at least one of the printed circuit board, the image sensor, the plate, or the IR filter bracket within the space, Electronic device.

Images