Substrate assembly

Abstract

The present invention may provide a substrate assembly comprising: a substrate including a wireless communication unit; and a shield portion coupled to the substrate so as to cover the wireless communication unit, wherein the shield portion includes a hole and a clip portion extending from the hole and fastened to an object to be fixed, and the hole is positioned so as to be offset from the wireless communication unit.

Description

PCB assembly

[0001] The present invention relates to a substrate assembly.

[0002] An electronic device (e.g., a display device) may be equipped with a separate communication module. A circuit board on which the communication module is mounted may be joined to a fixed object of the electronic device via screws. However, repeated use of the screws can damage the screw insertion holes on the fixed object side, requiring the entire fixed object to be replaced.

[0003] To prevent this, the use of screws can be excluded, and the communication module can be mounted to the electronic device using a clip. However, if a clip is to be used, there is a problem in that the structure becomes complex because a separate clip must be provided on the board on which the communication module is mounted.

[0004] The technical problem to be solved by the present invention is to provide a substrate assembly with a simplified structure that combines a substrate on which a communication module is mounted with a display device without using screws.

[0005] An embodiment may provide a substrate assembly comprising a substrate including a wireless communication unit and a shield portion coupled to the substrate to cover the wireless communication unit, wherein the shield portion includes a hole and a clip portion extending from the hole and fastened to a fixed object, and the hole is positioned offset from the wireless communication unit.

[0006] The shield portion includes an upper portion where the clip portion is formed and a side portion located along the perimeter of the upper portion, wherein the upper portion contacts the fixed object and the side portion can contact the substrate.

[0007] The above hole may be positioned to overlap with the fastening part of the above-mentioned fixed object.

[0008] When the clip portion is fastened to the fixed object, the hole can be covered by the fixed object.

[0009] The above side may include a first side arranged along the width direction of the clip portion and a second side arranged along the length direction of the clip portion.

[0010] The length of the first side may be greater than the length of the second side.

[0011] The contact area between the upper part and the fastening part of the fixed object may be positioned offset from the wireless communication part.

[0012] The above shield portion may include a projection extending from the lower end of the above side portion.

[0013] The clip portion may include a body portion bent upward from the side wall of the hole, a contact portion bent toward the hole from the end of the body portion, and an end portion bent away from the hole from the contact portion.

[0014] The above substrate includes a component electrically connected to the wireless communication unit, and the substrate includes a first surface and a second surface disposed opposite to the first surface, and the shield unit and the wireless communication unit may be located on the first surface, and the component may be located on the second surface.

[0015] According to an embodiment of the present invention, by providing a clip portion on a shield portion covering a wireless communication portion, a substrate on which a communication module is mounted is coupled to a display device without using screws, while having the advantage of a simplified structure.

[0016] According to the embodiment, the upper part of the shield portion has a sufficient contact surface to contact the fastening portion of the fixed object, and since it is formed as a flat plate, the fastening portion of the fixed object entering in a sliding manner can enter along the upper part, thereby providing the advantage of very easy coupling between the clip portion and the fastening portion of the fixed object.

[0017] FIG. 1 is a drawing illustrating a substrate assembly and a fixed object according to an embodiment.

[0018] FIG. 2 is a drawing illustrating a shield portion,

[0019] Figure 3 is a plan view of the shield portion,

[0020] FIG. 4 is a drawing illustrating the shape of the clip portion,

[0021] FIG. 5 is a drawing showing a shield portion disposed on a substrate,

[0022] FIG. 6 is a drawing illustrating a shield portion coupled to a substrate.

[0023] FIG. 7 is a diagram illustrating the bonding state of the soldering and the substrate.

[0024] FIG. 8 is a drawing illustrating a substrate assembly viewed from the side.

[0025] FIG. 9 is a drawing showing a state in which a substrate assembly is fixed to a fixed object.

[0026] FIG. 10 is a drawing illustrating the process of a clip portion being fixed to a fixed object.

[0027] FIG. 11 is a side view illustrating the state in which the clip portion is in contact with the object to be fixed.

[0028] FIG. 12 is a drawing showing the state of the hole when the clip part is fixed to the object to be fixed.

[0029] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0030] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0031] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0032] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0033] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0034] In addition, terms such as first, second, A, B, (a), (b), etc. may be used when describing the components of the embodiments of the present invention.

[0035] These terms are intended merely to distinguish a component from other components and are not limited by the nature, order, sequence, etc., of the said component.

[0036] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0037] Furthermore, when described as being formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0038] Hereinafter, the fixed object may be various chassis structures, such as plates or brackets, provided for coupling to an electronic device. A clip portion installed on a substrate is intended to fix the substrate to the fixed object in a sliding manner. Since this clip portion is intended to connect the substrate and the fixed object and must be provided as a separate component, the structure of the substrate assembly becomes complex. The substrate assembly according to the embodiment is a device that simplifies the structure while configuring the substrate and the fixed object to be assembled in a sliding manner in order to fundamentally solve this problem.

[0039] FIG. 1 is a drawing illustrating a substrate assembly (20) and a fixed object (10) according to an embodiment.

[0040] Referring to FIG. 1, the substrate assembly (20) may include a substrate (100) and a shield portion (200). The substrate (100) may include a wireless communication portion (110 in FIG. 5). The wireless communication portion (110) may include a wireless communication chipset composed of a Wi-Fi chipset or a Bluetooth chipset. The wireless communication portion (110) is highly likely to experience electromagnetic interference problems. Accordingly, the wireless communication portion (110) must have a shielding structure applied to protect the communication chipsets from external interference and prevent electromagnetic waves generated from the communication chipsets from being emitted to the outside.

[0041] The shield portion (200) is installed on the substrate (100) to cover the wireless communication portion (110), thereby preventing the wireless communication portion (110) from being affected by external electromagnetic waves and also preventing electromagnetic waves generated from the wireless communication portion (110) from affecting other electronic components mounted on the substrate (100). This shield portion (200) is a metal member that covers the entire wireless communication portion (110) and may be made of a highly conductive metal such as stainless steel, aluminum, copper, or a nickel alloy.

[0042] This substrate assembly (20) can be fixed to the fastening portion (11) of the fixed object (10). The substrate assembly (20) can be fixed to the fixed object (10) in a sliding manner. The substrate assembly (20) includes a shield portion (200) for electromagnetic shielding of the wireless communication portion (110), and has the characteristic of reducing the number of parts by forming a clip portion (210) for coupling with the fixed object (10) on the shield portion (200). When the substrate assembly (20) and the electronic device are facing each other, the clip portion (210) and the fixed object (10) are aligned, and the clip portion (210) and the fixed object (10) can be fixed such that a part of the clip portion (210) slides into the fastening portion (11) of the fixed object (10). Through this clip portion (210), the substrate assembly (20) can be fixed to the electronic device.

[0043] FIG. 2 is a drawing illustrating a shield part (200).

[0044] Referring to FIG. 2, the shield portion (200) includes a clip portion (210). This is intended to form a clip portion (210) on the shield portion (200) so that a part of the shield portion (200) can be used as a fixing device to combine with a fixed object (10) without a separate fixing device. The specific configuration of the shield portion (200) implementing this is as follows.

[0045] The shield portion (200) may include an upper portion (230) and a side portion (240) located along the perimeter of the upper portion (230). For example, the shield portion (200) may have a rectangular cover shape with an empty interior. The shape of the shield portion (200) may be varied in correspondence with the shape of the wireless communication portion (110) and the shape of the area of ​​the substrate (100) occupied by the wireless communication portion (110). The upper portion (230) is composed of a flat plate and contacts the fastening portion (11) of the fixed object (10) when the substrate assembly (20) is fixed to the fixed object (10). The side portion (240) contacts the substrate (100) and may be fastened to the substrate (100). The upper portion (230) covers the wireless communication portion (110) located inside the side portion (240) and spaced apart from the substrate (100).

[0046] The upper part (230) includes a hole (220). A clip portion (210) is located in the hole (220). The clip portion (210) may extend from the inner wall of the hole (220). This clip portion (210) may be formed as part of the upper part (230). The clip portion (210) can be realized by cutting a part of the upper part (230) and bending the cut portion. During the process of cutting a part of the upper part (230), a hole (220) is formed, and the clip portion (210) is aligned with the hole (220). The positions of the hole (220) and the clip portion (210) may be located closer to the edge rather than the center of the upper part (230). Since a part of the upper part (230) is molded into the clip portion (210), the upper part (230) and the clip portion (210) are the same member and are naturally made of the same material.

[0047] Figure 3 is a plan view of the shield part (200).

[0048] Referring to FIGS. 2 and 3, the side (240) may be divided into a first side (241) and a second side (242). The first side (241) may be formed along the width direction of the clip portion (210). The second side (242) is formed along the length direction of the clip portion (210). The first side (241) and the second side (242) are connected perpendicularly to each other. For example, two first side (241)s are positioned facing each other, and two second side (242)s are positioned facing each other. A wireless communication unit (110) is located in the inner space formed by the first side (241) and the second side (242).

[0049] Meanwhile, the length (L1) of the first side (241) is greater than the length (L2) of the second side (242). The length (L1) of the first side (241) can be determined by considering the size of the wireless communication unit (110) and the size of the clip unit (210) located away from the wireless communication unit (110). These first side (241) and second side (242) also serve to withstand the load generated when the substrate (100) is fixed to the fixed object (10). Generally, when the substrate (100) is fixed to the fixed object (10), a load may be applied in a direction perpendicular to the width direction of the clip unit (210). Therefore, by making the length (L1) of the first side (241) formed along the width direction of the clip unit (210) relatively large, the structural rigidity of the shield unit (200) can be increased.

[0050] FIG. 4 is a drawing illustrating the shape of the clip portion (210).

[0051] Referring to FIGS. 2 and 4, the clip portion (210) can be formed by cutting a portion of the upper part (230) and bending the cut portion. This clip portion (210) may include a body portion (211), a contact portion (212), and an end portion (213). The body portion (211) may be formed to be bent upward from the side wall of the hole (220) formed on the upper surface. The contact portion (212) may be formed to be bent toward the hole (220) from the end of the body portion (211). At least a portion of the contact portion (212) contacts the object to be fixed (10). The end portion (213) is bent away from the hole (220) at the contact portion (212). The end portion (213) has a shape that is spread out based on the direction in which the fixed object (10) enters in a sliding manner, so it can induce smooth entry of the fixed object (10).

[0052] When a fixed object (10) enters below the clip portion (210), the clip portion (210) is deformed to have a restoring force as it opens due to the entering fixed object (10). By applying pressure to the fixed object (10) through the restoring force of the clip portion (210), the bonding force between the substrate (100) and the fixed object (10) can be secured. Although the clip portion (210) has been described in this manner, the present invention is not limited thereto, and it can be deformed into various shapes capable of elastic deformation when the fixed object (10) enters in a sliding manner.

[0053] In this way, since the clip portion (210) is formed as part of the shield portion (200), there is no need to provide a separate fixing device to fix the substrate (100) to the object to be fixed (10). In particular, the upper portion (230) of the shield portion (200) has a sufficient contact surface to contact the object to be fixed (10) and is formed as a flat plate, so the fastening portion (11) of the object to be fixed (10) that enters in a sliding manner can enter along the upper portion (230), making it very easy to combine the clip portion (210) and the fastening portion (11).

[0054] FIG. 5 is a drawing showing a shield portion (200) placed on a substrate (100).

[0055] Referring to FIG. 5, the shield portion (200) is a member that shields electromagnetic waves. Therefore, it must surround the wireless communication portion (110) to seal it. However, in the case of the clip portion (210), since it is aligned with the hole (220) that exposes the interior of the shield portion (200), the clip portion (210) must be positioned out of alignment with the wireless communication portion (110). This is because electromagnetic shielding may be obstructed through the hole (220). Therefore, the positions of the hole (220) and the clip portion (210) are determined by considering the position of the wireless communication portion (110) together with the position of the fixed object (10).

[0056] FIG. 6 is a drawing showing a shield portion (200) coupled to a substrate (100), and FIG. 7 is a drawing showing the coupling state of the soldering and the substrate (100).

[0057] Referring to FIGS. 2, 6, and 7, the side portion (240) of the shield portion (200) includes a protrusion portion (250). The protrusion portion (250) may be formed by extending downward from the bottom of the side portion (240). This protrusion portion (250) is intended for coupling the shield portion (200) with the substrate (100). When the protrusion portion (250) is coupled with the substrate (100) and the clip portion (210) is coupled to the fastening portion (11) of the fixed object (10), the shield portion (200) may be prevented from shaking. This protrusion portion (250) may include a first protrusion (251) and a second protrusion (252). The first protrusion (251) may be located on the second side portion (242). The first projection (251) may be located at the center of the second side (242). The first projection (251) may be inserted into the through hole (130) of the substrate (100).

[0058] The substrate (100) may include a plurality of through holes (130). The plurality of through holes (130) may be positioned away from the wireless communication unit (110). A first projection (251) may be inserted into the through hole (130) of the substrate (100) to align the shield unit (200) to a coupling position relative to the substrate (100). Alternatively, the first projection (251) may be soldered after penetrating the substrate (100). A second projection (252) may be positioned near the corner of the first side (241) and the second side (242). The second projection (252) may be inserted into the through hole (130) of the substrate (100) and soldered after penetrating the substrate (100).

[0059] FIG. 8 is a drawing showing a substrate assembly (20) viewed from the side.

[0060] Referring to FIG. 8, the substrate (100) includes a first surface (S1) and a second surface (S2) located opposite to the first surface (S1). A wireless communication unit (110) may be located on the first surface (S1), and a component (120) electrically connected to the wireless communication unit (110) may be located on the second surface (S2). A shield unit (200) may be coupled to the first surface (S1) to cover the wireless communication unit (110).

[0061] FIG. 9 is a drawing showing the state in which a substrate assembly (20) is fixed to a fixed object (10).

[0062] Referring to FIG. 9, when the substrate assembly (20) is fixed to the fixed object (10), the substrate (100) and the fixed object (10) are positioned facing each other, and the shield portion (200) is positioned facing the fastening portion (11). The fixed object (10) and the substrate (100) are positioned spaced apart by the size of the shield portion (200) and the fastening portion (11). The fastening portion (11) is in contact with the shield portion (200). The position of the fastening portion (11) is positioned offset from the wireless communication portion (110).

[0063] FIG. 10 is a drawing illustrating the process of the clip portion (210) being fixed to the fixed object (10), and FIG. 11 is a side view illustrating the state in which the clip portion (210) is in contact with the fixed object (10).

[0064] Referring to FIGS. 10 and 11, the substrate assembly (20) is slidably coupled to the fastening portion (11). The clip portion (210) slides toward the fastening portion (11) while the fastening portion (11) is in contact with the upper portion (230) of the shield portion (200). As the hole (220) aligns with the fastening portion (11), the fastening portion (11) enters the lower side of the clip portion (210). As the fastening portion (11) enters the lower side of the clip portion (210), the clip portion (210) is lifted, and the clip portion (210) is elastically deformed by the fastening portion (11).

[0065] When the clip portion (210) is fully coupled to the fastening portion (11), the clip portion (210) can be located inside the fastening portion (11).

[0066] FIG. 12 is a drawing illustrating the state of the hole (220) when the clip portion (210) is fixed to the fastening portion (11) of the fixed object (10). Referring to FIG. 11 and FIG. 12, when the clip portion (210) is fully coupled to the fastening portion (11), the hole (220) is blocked by the fastening portion (11). Because the hole (220) is blocked by the fastening portion (11), the interior of the shield portion (200) is not exposed by the hole (220) and is closed. External electromagnetic waves may affect the wireless communication unit (110) through the hole (220), or electromagnetic waves from the wireless communication unit (110) may leak out of the shield unit (200) through the hole (220). However, since the hole (220) is naturally blocked during the process of the substrate (100) being coupled to the fixed object (10), it is possible to prevent shielding from not being achieved through the hole (220).

[0067] Although the invention has been described above with reference to embodiments, this is merely illustrative and does not limit the invention. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments may be modified and implemented. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims.

Claims

1. A substrate including a wireless communication unit; and It includes a shield portion coupled to the substrate to cover the wireless communication portion, and The above shield portion includes a hole and a clip portion extending from the hole and fastened to a fixed object, and the hole is a substrate assembly positioned offset from the wireless communication portion.

2. In Paragraph 1, The shield portion includes an upper portion where the clip portion is formed and a side portion located along the perimeter of the upper portion. The upper part above is in contact with the fixed object, and The above side is a substrate assembly in contact with the substrate.

3. In Paragraph 2, The above hole is a substrate assembly positioned to overlap with the fastening portion of the above-mentioned fixed object.

4. In Paragraph 3, A substrate assembly in which the hole is covered by the fixed object when the clip portion is fastened to the fixed object.

5. In Paragraph 2, A substrate assembly comprising a first side portion arranged along the width direction of the clip portion and a second side portion arranged along the length direction of the clip portion.

6. In Paragraph 5, A substrate assembly in which the length of the first side is greater than the length of the second side.

7. In Paragraph 2, The contact area between the upper part and the fastening part of the fixed object is a substrate assembly positioned offset from the wireless communication part.

8. In Paragraph 2, The above shield portion is a substrate assembly including a projection extending from the lower end of the above side.

9. In Paragraph 1, The above clip portion comprises a body portion bent upward from the side wall of the hole, a contact portion bent toward the hole from the end of the body portion, and an end portion bent away from the hole from the contact portion, forming a substrate assembly.

10. In Paragraph 1, The above substrate includes a component electrically connected to the wireless communication unit, and The above substrate includes a first surface and a second surface disposed on the side opposite to the first surface, and A substrate assembly in which the shield portion and the wireless communication portion are located on the first surface, and the element is located on the second surface.

Images