Camera device and optical instrument

Abstract

An embodiment comprises: a fixed part including a housing and a circuit board disposed in the housing; a moving part including a first substrate part and an image sensor disposed on the first substrate part; a support substrate supporting the moving part with respect to the fixed part and electrically connected to the first substrate part; and a shape memory alloy member coupled to the fixed part and the moving part and moving the moving part in a direction perpendicular to an optical axis with respect to the fixed part or rolling the moving part with respect to the optical axis, wherein the shape memory alloy member is electrically connected to the support substrate through the circuit board, and a driving signal is applied to the shape memory alloy member through the support substrate and the circuit board.

Description

Camera devices and optical instruments

[0001] The embodiment relates to a camera device and an optical device including the same.

[0002] Since it is difficult to apply the voice coil motor (VCM) technology used in conventional camera devices to ultra-compact, low-power camera devices, research in this regard has been actively conducted.

[0003] The demand for and production of electronic products, such as smartphones and mobile phones equipped with cameras, are increasing. Mobile phone cameras are trending toward higher pixel counts and miniaturization, and accordingly, actuators are also becoming smaller, larger in diameter, and multi-functional. To implement high-pixel mobile phone cameras, improvements in camera performance and additional features such as autofocus, shutter shake reduction, and zoom capabilities are required.

[0004] The embodiment provides a camera device and an optical device including the same, which can reduce the size and eliminate constraints on the arrangement of the OIS moving part according to the arrangement of the shape memory alloy wire assembly that supplies a driving signal to the shape memory alloy member.

[0005] A camera device according to an embodiment comprises: a fixed part including a housing and a circuit board disposed in the housing; a moving part including a first substrate part and an image sensor disposed in the first substrate part; a support substrate that supports the moving part with respect to the fixed part and is electrically connected to the first substrate part; and a shape memory alloy member coupled to the fixed part and the moving part and which moves the moving part with respect to the fixed part in a direction perpendicular to the optical axis or rolls the moving part with respect to the optical axis, wherein the shape memory alloy member is electrically connected to the support substrate through the circuit board, and a driving signal is applied to the shape memory alloy member through the support substrate and the circuit board.

[0006] A camera device according to another embodiment includes: a fixed part comprising a housing and a first substrate part disposed below the housing and coupled with the housing; a moving part comprising a holder disposed below the first substrate part, a second substrate part coupled with the holder, and an image sensor electrically connected to the second substrate part; a plate disposed between the first substrate part and the holder and electrically connected to the first substrate part; and a shape memory alloy member connecting the first substrate part and the plate, and moving the moving part in a direction perpendicular to the optical axis with respect to the fixed part or rolling the moving part with respect to the optical axis.

[0007] In the embodiment, the substrate is positioned between the housing of the AF moving part and the OIS moving part, and is electrically connected to the circuit board and support board of the AF moving part, so the size of the camera device can be reduced.

[0008] In the embodiment, since the substrate is positioned between the housing of the OIS moving part and the AF moving part, the assembly of the OIS moving part can be eliminated due to the positioning of the substrate.

[0009] FIG. 1 is a perspective view of a camera device according to an embodiment.

[0010] FIG. 2 is a perspective view of a camera device with the cover member and lens module removed.

[0011] Figure 3 is an exploded perspective view of the camera device of Figure 1.

[0012] Figure 4a is a cross-sectional view of the camera device in the AB direction of Figure 1.

[0013] Figure 4b is a cross-sectional view of the camera device in the CD direction of Figure 1.

[0014] FIG. 4c is a cross-sectional view of the camera device in the EF direction of FIG. 1.

[0015] Fig. 5 is an exploded perspective view of the AF drive unit of Fig. 3.

[0016] FIG. 6 is a perspective view of a bobbin, a sensing magnet, a balancing magnet, a coil, a circuit board, a first position sensor, and a capacitor.

[0017] FIG. 7 is a perspective view of a bobbin, housing, circuit board, upper elastic member, sensing magnet, and balancing magnet.

[0018] FIG. 8 is a bottom perspective view of a housing, a bobbin, a lower elastic member, a magnet, and a circuit board.

[0019] Figure 9 is a perspective view of the image sensor section.

[0020] FIG. 10a is a first exploded perspective view of the image sensor unit of FIG. 9.

[0021] FIG. 10b is a second separated perspective view of the image sensor unit of FIG. 9.

[0022] FIG. 11a is a bottom perspective view of the housing, substrate part, and circuit board.

[0023] FIG. 11b is a plan view of a part of the image sensor unit showing the arrangement of the second position sensor.

[0024] FIG. 12a is a first exploded perspective view of a substrate portion, a shape memory alloy member, a plate, and a holder.

[0025] FIG. 12b is a second separated perspective view of a substrate portion, a shape memory alloy member, a plate, and a holder.

[0026] FIG. 13 is a plan view of the plate and holder.

[0027] FIG. 14a is a perspective view of a substrate, a plate, and a shape memory alloy member.

[0028] FIG. 14b is a plan view of a substrate, a plate, and a shape memory alloy member.

[0029] FIG. 15a is a first perspective view of a first substrate portion, a support substrate, and a first heat dissipation member.

[0030] FIG. 15b is a second perspective view of the first substrate portion, the support substrate, and the first heat dissipation member.

[0031] FIG. 16a is a partial perspective view of the housing, the second substrate, the holder, and the substrate portion.

[0032] FIG. 16b is a partial perspective view of the second substrate, holder, and substrate portion of FIG. 16a.

[0033] FIG. 16c is a perspective view in a different direction of the second substrate, holder, and substrate part of FIG. 16b.

[0034] FIG. 17a is a partial perspective view of a housing, a holder, a first substrate, a first position sensor, a sensing magnet, a substrate portion, and a support substrate.

[0035] FIG. 17b is a perspective view of the holder, the first substrate, and the support substrate of FIG. 17a.

[0036] FIG. 18 shows a simplified cross-sectional view of the lens module, first substrate portion, image sensor, first heat dissipation member, second substrate portion, and second heat dissipation member of FIG. 10a.

[0037] Figure 19 is a diagram illustrating the relationship between temperature, resistance, and length of a shape memory alloy member.

[0038] FIG. 20 shows the electrical connection between the substrate and the second substrate according to another embodiment.

[0039] FIG. 21a is a first perspective view of the substrate portion, plate, shape memory alloy member, and holder of FIG. 20.

[0040] FIG. 21b is a second perspective view of the substrate portion, plate, shape memory alloy member, and holder of FIG. 20.

[0041] FIG. 22a shows a perspective view of an optical device according to an embodiment.

[0042] FIG. 22b shows a perspective view of an optical device according to another embodiment.

[0043] FIG. 23 shows a configuration diagram of the optical device illustrated in FIG. 22a and FIG. 22b.

[0044] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0045] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0046] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0047] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0048] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0049] Furthermore, where it is stated that a component is 'connected,' 'combined,' or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected,' 'combined,' or 'joined' due to another component located between the component and the other component. Additionally, where it is stated that a component is formed or placed "above or below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Moreover, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0050] The AF drive unit below may be referred to as a lens drive device, lens drive unit, VCM (Voice Coil Motor), actuator, or lens moving device, and the term "coil" below may be replaced with "coil unit," and the term "elastic member" may be replaced with "elastic unit" or "spring." Additionally, in the following description, "terminal" may be replaced with "pad," "electrode," "conductive layer," or "bonding part."

[0051] In the following description, "substrate part," "printed circuit board," "circuit board," or "substrate" may be used interchangeably or as substitutes for each other.

[0052] For convenience of explanation, the camera device according to the embodiment is described using a Cartesian coordinate system (x, y, z), but may be described using other coordinate systems, and the embodiment is not limited thereto. In each drawing, the x-axis and y-axis represent directions perpendicular to the z-axis, which is the direction of the optical axis. The z-axis direction, which is the direction of the optical axis (OA), can be defined as any one of the 'first direction', 'second direction', and 'third direction', the x-axis direction can be defined as another of the 'first direction', 'second direction', and 'third direction', and the y-axis direction can be defined as the remaining other of the 'first direction', 'second direction', and 'third direction'.

[0053] In addition, for example, the x-axis direction can be defined as 'either the first horizontal direction and the second horizontal direction', and the y-axis direction can be defined as 'the other one among the first horizontal direction and the second horizontal direction'.

[0054] In addition, for example, the optical axis may be the optical axis of the lens or the optical axis of the lens mounted on the lens barrel. For example, the optical axis may be an axis perpendicular to the imaging area (or sensor surface) of the image sensor and passing through the center of the imaging area (sensor surface). For example, the optical axis direction may be a direction perpendicular to the imaging area of ​​the image sensor. In addition, for example, the optical axis direction may be a direction parallel to the optical axis.

[0055] A camera device according to an embodiment can perform an 'auto-focusing function'. Here, the auto-focusing function refers to automatically focusing an image of a subject onto the image sensor surface. In addition, a camera device according to an embodiment can perform a 'shake correction function'. Here, the shake correction function refers to preventing the outline of a captured image from being formed clearly due to vibrations caused by the user's hand shake when capturing a still image.

[0056] Hereinafter, the camera device may be referred to as a "camera module," "camera assembly," "camera unit," "camera," "imaging device," or "image sensor shift device," etc.

[0057] FIG. 1 is a perspective view of a camera device (10) according to an embodiment, FIG. 2 is a perspective view of a camera device (10) with the cover member (300) and lens module (400) removed, FIG. 3 is an exploded perspective view of the camera device (10) of FIG. 1, FIG. 4a is a cross-sectional view of the camera device (10) in the AB direction of FIG. 1, FIG. 4b is a cross-sectional view of the camera device (10) in the CD direction of FIG. 1, FIG. 4c is a cross-sectional view of the camera device (10) in the EF direction of FIG. 1, FIG. 5 is an exploded perspective view of the AF drive unit (100) of FIG. 3, FIG. 6 is a perspective view of a bobbin (110), a sensing magnet (180), a balancing magnet (185), a coil (120), a circuit board (190), a first position sensor (170), and a capacitor (195), FIG. 7 FIG. 8 is a perspective view of a bobbin (110), a housing (140), a circuit board (190), an upper elastic member (150), a sensing magnet (180), and a balancing magnet (185), and FIG. 8 is a bottom perspective view of a housing (140), a bobbin (110), a lower elastic member (160), a magnet (130), and a circuit board (190).

[0058] Referring to FIGS. 1 through 8, the camera device (10) may include an AF drive unit (100) and an image sensor unit (350). The AF drive unit (100) may include an "AF moving unit." The image sensor unit (350) may include an OIS drive unit. The OIS drive unit may include an "OIS moving unit." Either one of the AF moving unit and the OIS moving unit may be a first moving unit, and the other one of the AF moving unit and the OIS moving unit may be a second moving unit.

[0059] The camera device (10) may further include at least one of a cover member (300) and a lens module (400). The cover member (300) and the base (210) described later may form a case.

[0060] The AF drive unit (100) can be combined with the lens module (400) and moves the lens module in the direction of the optical axis (OA) or in a direction parallel to the optical axis, and the auto-focusing function of the camera device (10) can be performed by the AF drive unit (100).

[0061] The image sensor unit (350) may include an image sensor (810). For example, the image sensor unit (350) (or OIS driving unit) may include an OIS moving unit that includes the image sensor (810). For example, the image sensor unit (350) may move the OIS moving unit (e.g., image sensor (810)) in a direction perpendicular to the optical axis. Additionally, the image sensor unit (350) may tilt or rotate (or roll) the OIS moving unit (e.g., image sensor (810)) based on the optical axis or with the optical axis as a rotation axis. To this end, the image sensor unit (350) may include a shape memory alloy member (45) connecting the OIS moving unit and the fixed unit. The image sensor unit (350) may perform a hand shake correction function of the camera device (10).

[0062] For example, the image sensor (810) may include an imaging area for detecting light that has passed through the lens module (400). Here, the imaging area may be expressed as an effective area, a light receiving area, an active area, or a pixel area. For example, the imaging area of ​​the image sensor (810) is a region where light that has passed through the filter (610) is incident and an image containing the light is formed, and may include at least one unit pixel. For example, the imaging area may include a plurality of unit pixels.

[0063] The AF drive unit (100) may be replaced with "lens moving unit" or "lens driving device". Alternatively, the AF drive unit (100) may be replaced with "first moving unit (or second moving unit)", "first actuator (or second actuator)", or "AF moving unit".

[0064] Additionally, the image sensor unit (350) may be replaced with "image sensor moving unit," "image sensor shift unit," "sensor moving unit," or "sensor shift unit." Alternatively, the image sensor unit (350) may be replaced with a second moving unit (or first moving unit) or a "second actuator (or first actuator)."

[0065] Referring to FIGS. 5 through 8, the AF driving unit (100) can move the lens module (400) in the direction of the optical axis. For example, the AF driving unit (100) can move the bobbin (110) in the direction of the optical axis. For example, the AF driving unit (100) may include a bobbin (110), a coil (120), a magnet (130), and a housing (140). The AF driving unit (100) may include an elastic member, and the elastic member may further include at least one of an upper elastic member (150) and a lower elastic member (160).

[0066] Additionally, the AF driving unit (100) may include a first position sensor (170) for AF feedback driving. Additionally, the AF driving unit (100) may further include at least one of a circuit board (190) and a sensing magnet (180). Additionally, the AF driving unit (100) may further include at least one of a balancing magnet (185) and a capacitor (195).

[0067] The bobbin (110) can be placed inside the housing (140) and can be moved in the direction of the optical axis (OA) or a first direction (e.g., the Z-axis direction) by electromagnetic interaction between the coil (120) and the magnet (130).

[0068]

[0069] * The bobbin (110) may have an opening (101) for combining with or mounting the lens module (400). For example, the opening (101) of the bobbin (110) may be a through hole that penetrates the bobbin (110) in the direction of the optical axis, and the shape of the opening (101) of the bobbin (110) may be circular, elliptical, or polygonal.

[0070] The lens module (400) may include at least one lens or / and a lens barrel. For example, the lens module (400) may include one or more lenses and a lens barrel that accommodates one or more lenses. However, one configuration of the lens module is not limited to a lens barrel, and any holder structure capable of supporting one or more lenses is possible.

[0071] For example, the lens module (400) may be screw-coupled to the bobbin (110) as an example. Or, for example, the lens module (400) may be coupled to the bobbin (110) by an adhesive (not shown) as an example. Meanwhile, light passing through the lens module (400) may pass through the filter (610) and be irradiated onto the image sensor (810).

[0072] The bobbin (110) may include at least one protrusion (111A, 111B) provided on the outer surface. For example, at least one protrusion (111A, 111B) may protrude in a direction parallel to a straight line perpendicular to the optical axis (OA). For example, the bobbin (110) may include two protrusions (111A, 111B) located opposite each other with respect to the optical axis (OA). For example, the protrusions (111A, 111B) of the bobbin (110) may be positioned on the outer surface of the bobbin (110) corresponding to or opposite to the side of the housing (140).

[0073] The protrusions (111A, 111B) of the bobbin (110) correspond to or face the grooves (25A, 25B) of the housing (140) and can be inserted or placed within the grooves (25A, 25B) of the housing (140), thereby suppressing or preventing the bobbin (110) from rotating beyond a certain range around the optical axis. Additionally, the protrusions (111A, 111B) can act as stoppers to cause the bobbin (110) to move within a defined range in the direction of the optical axis (e.g., from the upper elastic member (150) to the lower elastic member (160)) due to external impact, etc.

[0074] Additionally, for example, a protrusion (46A) may be formed at the corner of the bobbin (110) in a direction parallel to a straight line perpendicular to the optical axis (OA), and the protrusion (46A) of the bobbin (110) may correspond to or face the groove (46B) of the housing (140) and may be inserted or placed within the groove (46B) of the housing (140), thereby suppressing or preventing the bobbin (110) from rotating beyond a certain range around the optical axis.

[0075] A first escape groove (112a) may be provided on the upper surface of the bobbin (110) to avoid spatial interference with the first frame connecting portion (153) of the upper elastic member (150). Additionally, a second escape groove (112b) may be provided on the lower surface of the bobbin (110) to avoid spatial interference with the second frame connecting portion (163) of the lower elastic member (160).

[0076] The bobbin (110) may include a first coupling portion (116a) for being coupled and fixed to an upper elastic member (150). For example, the first coupling portion (116a) of the bobbin (110) may be in the form of a protrusion, but in other embodiments, it may be flat or groove-shaped. Additionally, the bobbin (110) may include a second coupling portion (116b) for being coupled and fixed to a lower elastic member (160). For example, the second coupling portion (116b) may be in the form of a protrusion, but in other embodiments, it may be flat or groove-shaped.

[0077] Referring to FIG. 5, a groove (105) in which a coil (120) is seated, inserted, or placed may be provided on the outer surface of the bobbin (110). For example, the groove (105) of the bobbin (110) may have a shape that matches the shape of the coil (120), a closed curve shape (e.g., a ring shape).

[0078] Additionally, the bobbin (110) may be provided with a first mounting groove (26a) in which a sensing magnet (180) is seated, inserted, fixed, or placed. Additionally, the outer surface of the bobbin (110) may be provided with a second mounting groove (26b) in which a balancing magnet (185) is seated, inserted, fixed, or placed.

[0079] For example, the first and second seating grooves (26a, 26b) of the bobbin (110) may be formed on the outer surfaces of the bobbin (110) located opposite each other with respect to the optical axis. For example, the first seating groove (26a) may be formed on the first protrusion (111A) of the bobbin (110), and the second seating groove (26b) may be formed on the second protrusion (111B) of the bobbin (110).

[0080] For example, a damper (not shown) may be placed between the bobbin (110) and the upper elastic member (150). Also, a damper (not shown) may be placed between the upper elastic member (150) and the housing (140). For example, the damper may be placed between the housing (140) and the first frame connecting part (153) of the upper elastic member (150), and may be in contact with, coupled with, or attached to both.

[0081] The coil (120) may be placed on the bobbin (110). The coil (120) may be combined with the bobbin (110). For example, the coil (120) may be placed on or combined with the outer surface of the bobbin (110). For example, the coil (120) may be wound on the outer surface of the bobbin (110) in a direction rotating around the optical axis (OA). For example, the coil (120) may be wound directly on the outer surface of the bobbin (110). According to another embodiment, the coil (120) may be wound on the bobbin (110) using a coil ring or provided as an angled ring-shaped coil block.

[0082] Power or a driving signal may be applied to the coil (120). The power or driving signal supplied to the coil (120) may be a direct current signal or an alternating current signal, or may include both a direct current signal and an alternating current signal, and may be in the form of voltage or current.

[0083] When a driving signal (e.g., driving current) is supplied, the coil (120) can form an electromagnetic force through electromagnetic interaction with the magnet (130), and the bobbin (110) can be moved in the direction of the optical axis (OA) by the formed electromagnetic force.

[0084] From the initial position of the AF moving part, the bobbin (110) can be moved in an upward or downward direction, and this is referred to as bidirectional driving of the AF moving part. Alternatively, from the initial position of the AF moving part, the bobbin (110) can be moved in an upward direction, and this is referred to as unidirectional driving of the AF moving part.

[0085] In the initial position of the AF moving part, the coil (120) can be positioned in a direction perpendicular to the optical axis (OA) and parallel to a straight line passing through the optical axis so as to correspond to, face, or overlap with the magnet (130) placed in the housing (140).

[0086] For example, the AF moving unit may include a bobbin (110) and components coupled to the bobbin (110) (e.g., a coil (120), a sensing magnet (180), and a balancing magnet (180, 185). Additionally, the AF moving unit may further include a lens module (400).

[0087] And the initial position of the AF moving part may be the initial position of the AF moving part when power is not applied to the coil (120). In addition, the initial position of the bobbin (110) may be the position where the AF moving part is placed when gravity acts from the bobbin (110) toward the base (210), or conversely when gravity acts from the base (210) toward the bobbin (110).

[0088] A sensing magnet (180) can provide a magnetic field for the first position sensor (170) to detect, and a balancing magnet (185) can counteract the magnetic field effect of the sensing magnet (180) and serve to balance the weight with the sensing magnet (180). The balancing magnet (195) may also be referred to as a "weight member," a "weight balance member," or a "balancing member."

[0089] The sensing magnet (180) may be referred to as a "sensor magnet" or a "second magnet." The sensing magnet (180) may be placed on the bobbin (110) or coupled to the bobbin (110). The sensing magnet (180) may be placed to correspond to or opposite the first position sensor (170). The balancing magnet (185) may be placed on the bobbin (110). The balancing magnet (185) may be coupled to the bobbin (110). For example, the balancing magnet (185) may be placed on the opposite side of the sensing magnet (180) with respect to the optical axis.

[0090] For example, each of the sensing magnet and balancing magnet (180, 185) may be a unipolar magnetized magnet having one N pole and one S pole, but in other embodiments, each of the sensing magnet and balancing magnet (180, 185) may be a bipolar magnetized magnet or a quadruple magnet including two N poles and two S poles.

[0091] The sensing magnet (180) can move along the optical axis direction together with the bobbin (110), and the first position sensor (170) can detect the strength of the magnetic field or magnetic force of the sensing magnet (180) moving along the optical axis direction and can output an output signal according to the detected result.

[0092] For example, the strength of the magnetic field or the magnetic force detected by the first position sensor (170) may change according to the displacement of the bobbin (110) in the direction of the optical axis, and the first position sensor (170) may output an output signal proportional to the strength of the detected magnetic field, and the displacement of the bobbin (110) in the direction of the optical axis may be detected using the output signal of the first position sensor (170).

[0093] In another embodiment, the positions of the sensing magnet and the position sensor may be arranged opposite to each other. For example, the sensing magnet may be placed in a fixed part, e.g., a housing, and the position sensor may be placed in a movable part, e.g., a bobbin. In another embodiment, the balancing magnet (185) may be omitted.

[0094] The housing (140) is disposed inside the cover member (300). For example, the housing (140) may be disposed on the image sensor part (350). The housing (140) may be disposed on the substrate part (410). The housing (140) may accommodate a bobbin (110) inside and may support a magnet (130), a first position sensor (170), and a circuit board (190).

[0095] Referring to FIGS. 5, 7, and 8, the housing (140) may have a hollow column shape overall. For example, the housing (140) may have a polygonal (e.g., square or octagonal) or circular opening, and the opening of the housing (140) may be in the form of a through hole penetrating the housing (140) in the direction of the optical axis. For example, it may be placed within the opening of the housing (140) of the bobbin (110).

[0096] The housing (140) may include a plurality of sides. The sides of the housing (140) may correspond to or opposite the side plates (302) of the cover member (300). The housing (140) may include a corner portion (or corner) positioned between two adjacent sides. The corner of the housing (140) may correspond to or opposite the corner of the cover member (300).

[0097] In order to prevent the upper or upper surface of the housing (140) from directly colliding with the inner surface of the top plate (301) of the cover member (300), the housing (140) may include a stopper (145) provided on the upper, upper surface, or top.

[0098] Referring to FIG. 5, the housing (140) may include a mounting groove (14A, 14B) (or groove) for receiving a circuit board (190). The mounting groove (14A) may have a shape that matches the shape of the circuit board (190).

[0099] The housing (140) may include protrusions (44A, 44B) that surround at least one of the circuit board (190) and the support board (310). For example, the protrusions (44A, 44B) may be placed or formed on the outer surface of the housing (140). For example, the protrusions (44A, 44B) may be placed or formed on the outer surface of the side of the housing (140). The protrusions (44A, 44B) may serve to protect or support the circuit board (190) and the support board (310). The protrusions (44A, 44B) may be referred to as "protective part," "supporting part," "extension part," or guide part.

[0100] The protrusions (44A, 44B) of the housing (140) may cover at least a portion of the circuit board (190). The protrusions (44A, 44B) may cover at least a portion of the support board (310). For example, the housing (140) may include a first protrusion (44A) disposed on a first side of the housing and a second protrusion (44B) disposed on a second side of the housing (140). The second side of the housing (140) may be located opposite the first side of the housing (140) with respect to the optical axis (OA) or bobbin (110). The first protrusion (44A) and the second protrusion (44B) may be located opposite each other with respect to the optical axis (OA) or bobbin (110).

[0101] For example, the first substrate (190A) may be placed on the first protrusion (44A), and the second substrate (190B) may be placed on the second protrusion (44B). For example, the first substrate (190A) may be placed within the first mounting groove (14A) formed on the first protrusion (44A). The second substrate (190B) may be placed within the second mounting groove (14B) formed on the second protrusion (44B).

[0102] For example, each of the first protrusion (44A) and the second protrusion (44B) may include a first part (47A) connected to the upper surface of the housing (140), and a second part (47B) connected to the first part (47A) and spaced apart from the side of the housing (140).

[0103] For example, the first part (47A) of the first protrusion (44A) may be connected to the upper surface of the first side of the housing (140), and the first part (47A) of the second protrusion (44B) may be connected to the upper surface of the second side of the housing (140). For example, the first part (47A) may protrude from the upper surface of the housing (140) in the direction of the optical axis or in the direction of the inner surface of the top plate (301) of the cover member (300).

[0104] At least a portion of the first substrate (190A) may be located between the first portion (47A) and the second portion (47B) of the first protrusion (44A). Also, at least a portion of the support substrate (310) may be located between the first portion (47A) and the second portion (47B) of the first protrusion (44A). Also, at least a portion of the second substrate (190B) may be located between the first portion (47A) and the second portion (47B) of the second protrusion (44B). Additionally, for example, at least another portion of the support substrate (310) may be located between the first portion (47A) and the second portion (47B) of the second protrusion (44B).

[0105] An adhesive or sealing member may be placed between the protrusions (44A, 44B) of the housing (140) and the cover member (300). For example, the adhesive (or sealing member) may be placed between the protrusions (44A, 44B) of the housing (140) and the side plate (302) of the cover member (300), and the two may be joined. The protrusions (44A, 44B) may increase the joining area with the side plate (302) of the cover member (300) and may stably join the housing (140) and the cover member (300) without interference from the support substrate (310).

[0106] Referring to FIGS. 7 and 8, the housing (140) may include a first opening (47D1) for exposing terminals (B1 to B4) of the terminal portion (95) of the first substrate (190A), and, for example, the first opening (47D1) may be formed on a first side of the housing (140). For example, the first opening (47D1) may be formed on a first protrusion (44A) of the housing (140). For example, the first opening (47D1) may be formed on a second portion (47B) of the first protrusion (44A).

[0107] Additionally, the housing (140) may include a second opening (47D2) for exposing terminals (R1 to R5) of the second terminal portion (97) of the second substrate (190B). For example, the second opening (47D2) may be formed on a second side of the housing (140). For example, the second opening (47D2) may be formed on a second protrusion (44B) of the housing (140). For example, the second opening (47D2) may be formed on a second portion (47B) of the second protrusion (44B).

[0108] Each of the first protrusion (44A) and the second protrusion (44B) of the housing (140) may include a third part (47C) extending from the second part (47B). For example, the third part (47C) may extend or protrude from the lower or bottom of the second part (47B) in a direction parallel to the outer surface of the first side (or second side) of the housing (140) (e.g., a second horizontal direction).

[0109] For example, the third part (47C) may include a third-1 part extending from one end of the second part (47B) and a third-2 part extending from the other end of the second part (47B), and the third-1 part and the third-2 part may extend or protrude in opposite directions.

[0110] At least one first coupling part (143) that is coupled to the first outer frame (152) of the upper elastic member (150) may be provided on the upper, top, or upper surface of the housing (140). A second coupling part (147) that is coupled to and fixed to the second outer frame (162) of the lower elastic member (160) may be provided on the lower, bottom, or lower surface of the housing (140). For example, each of the first and second coupling parts (143, 147) of the housing (140) may be flat, protruding, or groove-shaped.

[0111] The magnet (130) may be placed, coupled, or fixed to the housing (140). For example, the magnet (130) may be placed, coupled, or fixed to the side of the housing (140). In another embodiment, the magnet (130) may be placed, coupled, or fixed to the corner of the housing.

[0112] For example, the magnet (130) may include a plurality of magnet units. For example, the magnet (130) may include a plurality of magnet units (130-1 to 130-4) disposed in the housing (140). In another embodiment, the number of magnet units included in the magnet (130) may be two or more.

[0113] The magnet (130) may be placed on at least one of the side or corner of the housing (140). For example, at least a portion of the magnet (130) may be placed on the side or corner of the housing (140). Or, for example, at least a portion of the magnet (130) may be placed on the side of the housing (140), and the remaining portion may be placed on the corner of the housing (140).

[0114] For example, magnet units (130-1 to 130-4) may be placed on any one of the corresponding four sides of the housing (140). For example, the first magnet unit (130-1) and the second magnet unit (130-2) may be located opposite each other on the housing (140) in a first horizontal direction (e.g., X-axis direction). For example, the third magnet unit (130-3) and the fourth magnet unit (130-4) may be located opposite each other on the housing (140) in a second horizontal direction (e.g., Y-axis direction). For example, the first magnet unit (130-1) and the second magnet unit (130-3) can be arranged side by side in a second horizontal direction (e.g., the Y-axis direction), and the third magnet unit (130-3) and the fourth magnet unit (130-4) can be arranged side by side in a first horizontal direction (e.g., the X-axis direction).

[0115] For example, at least one of the first magnet unit (130-1) and the second magnet unit (130-2) may include two spaced-apart magnet units (31A, 31B). This may be to avoid spatial interference with the circuit board (190A, 190B). For example, at least one of the first position sensor (170) and the circuit board (190A, 190B) may be placed between the two magnet units (31A, 31B). Additionally, by separating each of the first magnet unit (130-1) and the second magnet unit (130-2) into two, the electromagnetic force resulting from interaction with the coil (120) can be increased. That is, in the embodiment, by including a total of six magnet units, the electromagnetic force resulting from interaction with the coil (120) can be increased.

[0116] In the initial position of the AF moving part, the magnet (130) can be placed in the housing (140) such that it is perpendicular to the optical axis (OA) and overlaps at least a portion with the coil (120) in a direction parallel to the straight line passing through the optical axis (OA).

[0117] The magnet (130) may include a unipolar magnetized magnet or a 2-pole magnet comprising one N-pole region and one S-pole region. In another embodiment, the magnet (130) may include a positive magnetized magnet or a 4-pole magnet comprising two N-pole regions and two S-pole regions. In yet another embodiment, the magnet (130) may include a unipolar magnetized magnet and a positive magnetized magnet.

[0118] A circuit board (190) may be placed in a housing (140). A circuit board (190) may be coupled to the housing (140). The circuit board (190) may include a first board (190A, or first circuit board) and a second board (190B, second circuit board). The second board (190B) may be replaced with "first board (or first circuit board)", and the first board (190A) may be replaced with "second board (or second circuit board)". For example, the circuit board (190) may be a printed circuit board or an FPCB.

[0119] The first substrate (190A) and the second substrate (190B) may be placed on the side of the housing (140). For example, the first substrate (190A) and the second substrate (190B) may be placed on opposite sides of the housing (140) with respect to the optical axis (OA) or bobbin (110). For example, the first position sensor (170) may be placed or mounted on the first substrate (190A) and may be electrically connected to the first substrate (190A).

[0120] Referring to FIGS. 5 and 7, for example, a first substrate (190A) may be placed on the first side of the housing (140), and a second substrate (190B) may be placed on the second side of the housing (140). For example, the first substrate (190A) may be placed in the first mounting groove (14A) of the housing (140), and the second substrate (190B) may be placed in the second mounting groove (14B) of the housing (140).

[0121] The first substrate (190A) may include a terminal portion (95) (or terminal unit) comprising a plurality of terminals (B1 to B4). The terminal portion (95) of the first substrate (190A) may be exposed to the outside of the first side of the housing (140) through an opening (47D1) of the housing (140). The plurality of terminals (B1 to B4) of the first substrate (190A) may be electrically connected to the first position sensor (170).

[0122] Referring to FIG. 6, the first substrate (190A) may include a first part (191A), a second part (191B), and a third part (191C) connecting the first part (191A) and the second part (191B). The first part (191A) may be positioned closer to the bobbin (110) than the second part (191B). A first position sensor (170) may be positioned in the first part (191A) of the first substrate (190A), and a plurality of terminals (B1 to B4) may be positioned in the second part (191B) of the first substrate (190A). For example, the first part (191A) and the second part (191B) may be positioned side by side or parallel to each other.

[0123] Since the first to third portions (191A to 191C) of the first substrate (190A) are combined with the housing (140), the bonding strength between the housing (140) and the first substrate (190A) can be improved, which can facilitate bonding and improve solderability when the terminals (B1 to B4) of the first substrate (190A) and the terminals (P1 to P4) of the support substrate (310) are combined by means of a conductive adhesive or solder.

[0124] For example, the first position sensor (170) may be placed on the first surface of the first part (191A), and the first surface of the first part (191A) may be a surface facing or opposite the sensing magnet (180) (or the outer surface of the bobbin (110). For example, a plurality of terminals (B1 to B4) may be placed on the first surface of the second part (191B). For example, the first surface of the second part (191B) may be a surface exposed by the opening (47D1) of the housing (140). For example, the first surface of the second part (191B) may be the opposite surface of the second surface of the second part (191B), the second surface of the second part (191B) may be the surface facing the second surface of the first part (191A), and the second surface of the first part (191A) may be the opposite surface of the first surface of the first part (191A).

[0125] One end of the third part (191C) may be connected to one end of the first part (191A), and the third part (191C) may be bent from one end of the first part (191A) toward the second part (191B), and the second part (191B) may be connected to the other end of the third part (191C) and bent from the other end of the third part (191C). For example, the first part (191A) and the second part (191B) may be arranged side by side in a second horizontal direction (Y-axis direction).

[0126] Also, referring to FIGS. 2 and FIGS. 5, the first substrate (190A) may include a first pad (5A) electrically connected to a first upper elastic unit (150-1) and a second pad (5B) electrically connected to a second upper elastic unit (150-2). The first and second pads (5A, 5B) may be electrically connected to a first position sensor (170). For example, the first and second pads (5A, 5B) may be placed on the first surface of a first portion (191A) of the first substrate (190A).

[0127] Referring to FIGS. 7 and 8, the second substrate (190B) may include a first terminal portion (96) and a second terminal portion (97). For example, the first terminal portion (96) may be electrically connected to the substrate portion (410). The second terminal portion (97) may be electrically connected to the support substrate (310).

[0128] The second substrate (190B) may include a first part (192A), a second part (192B), and a third part (192C) connecting the first part (192A) and the second part (192B). The first part (192A) may be positioned closer to the bobbin (110) than the second part (192B). The second part (192B) may be positioned further outward than the first part (192A). For example, the first part (191A) and the second part (191B) of the second substrate (190B) may be positioned side by side or parallel to each other.

[0129] Since the first to third portions (192A to 192C) of the second substrate (190B) are joined to the housing (140), the bonding strength between the housing (140) and the second substrate (190B) can be improved, which can facilitate bonding and improve solderability when joining the terminals (R1 to R5) of the second substrate (190B) and the terminals (M1 to M5) of the support substrate (310) by means of a conductive adhesive or solder.

[0130] The first terminal portion (96) may be disposed on the first portion (192A) of the second substrate (190B). The second terminal portion (97) may be disposed on the second portion (192B) of the second substrate (190B). For example, the first terminal portion (96) may be disposed on the first surface of the first portion (192A), and the first surface of the first portion (192A) may be a surface facing or opposite to the outer surface (or balancing magnet (185)) of the bobbin (110). The first terminal portion (96) may include a plurality of terminals. For example, the first terminal portion (96) may include terminals (Q1 to Q5) disposed on the first surface of the first portion (192A) spaced apart in the second horizontal direction.

[0131] For example, the second terminal portion (97) may be disposed on the first surface of the second portion (192B). The second terminal portion (97) may include a plurality of terminals. For example, the second terminal portion (97) may include terminals (R1 to R5) disposed on the first surface of the second portion (192B) spaced apart in a second horizontal direction. The first surface of the second portion (192B) may be a surface exposed by the opening (47D2) of the housing (140). For example, the first surface of the second part (192B) may be the opposite surface of the second surface of the second part (192B), the second surface of the second part (192B) may be the surface facing the second surface of the first part (192A) of the second substrate (190B), and the second surface of the first part (192A) may be the opposite surface of the first surface of the first part (192A) of the second substrate (190B).

[0132] One end of the third part (192C) may be connected to one end of the first part (192A), and the third part (192C) may be bent toward the second part (192B) from one end of the first part (192A). The second part (192B) may be connected to the other end of the third part (192C) and may be bent toward the other end of the third part (192C). For example, the first part (192A) and the second part (192B) of the second substrate (190B) may be arranged parallel to each other in the second horizontal direction (Y-axis direction).

[0133] The first position sensor (170) may be placed in the housing (140). The first position sensor (170) may be placed on a circuit board (190) (e.g., the first board (190A)). The first position sensor (170) may be electrically connected to the circuit board (190). For example, the first position sensor (170) may be electrically connected to the first to fourth terminals (B1 to B4) of the first board (190A). For example, the first board (190A) may include a circuit pattern or wiring (not shown) for electrically connecting the first to fourth terminals (B1 to B4) and the first position sensor (170).

[0134] For example, at the initial position of the AF moving part, the first position sensor (170) may be perpendicular to the optical axis (OA) and may be at least partially facing or overlapping with the sensing magnet (180) in a direction parallel to a straight line passing through the optical axis (OA). In another embodiment, at the initial position of the AF moving part, the first position sensor may not be facing or overlapping with the sensing magnet.

[0135] The first position sensor (170) can detect the movement, displacement, or position of the bobbin (110) in the direction of the optical axis. That is, the first position sensor (170) can detect the magnetic field or the strength of the magnetic field of the sensing magnet (180) mounted on the bobbin (110) according to the movement of the bobbin (110), and can output an output signal according to the detected result, and the movement, displacement, or position of the bobbin (110) in the direction of the optical axis can be detected using the output of the first position sensor (170).

[0136] The first position sensor (170) may be a driver IC including a Hall sensor and a driver. The first position sensor (170) may include first to fourth terminals for transmitting and receiving data with the outside using data communication using a protocol, e.g., I2C communication, and fifth and sixth terminals for directly supplying a driving signal to the coil (120).

[0137] The first to fourth terminals of the first position sensor (170) may be electrically connected to the first substrate (190) by solder or conductive adhesive. Each of the first to fourth terminals of the first position sensor (170) may be electrically connected to any one of the first to fourth terminals (B1 to B4) of the first substrate (190A). Additionally, the fifth and sixth terminals of the first position sensor (170) may be electrically connected to the coil (120).

[0138] The first position sensor (170) can be electrically connected to the coil (120) through at least one of the upper elastic member (150) and the lower elastic member (160) and can provide a driving signal to the coil (120). For example, a part of the first upper elastic unit (150-1) can be electrically connected to one end of the coil (120), and another part (4A) of the first upper elastic unit (150-1) can be electrically connected to the first substrate (190A) (e.g., the first pad (5A)). For example, a part of the second upper elastic unit (150-2) can be electrically connected to the other end of the coil (120), and another part (4B) of the second upper elastic unit (150-2) can be electrically connected to the first substrate (190A) (e.g., the second pad (5B)). For example, each of the fifth and sixth terminals of the first position sensor (170) may be electrically connected to either of the first and second pads (5A, 5B) of the first substrate (190A). In another embodiment, the coil (120) may be electrically connected to the fifth and sixth terminals of the first substrate (190A) and the first position sensor (170) by two lower elastic members.

[0139] For example, in an embodiment where the first position sensor (170) is a driver IC, the first and second terminals (B1, B2) of the first substrate (190A) may be power terminals for supplying power to the first position sensor (170), the third terminal (B3) may be a terminal for a clock signal, and the fourth terminal (B4) may be a terminal for a data signal.

[0140] In another embodiment, the first position sensor (170) may be a Hall sensor. In this case, the first position sensor (170) may include two input terminals to which a driving signal or power is supplied and two output terminals for outputting a sensing voltage (or output voltage). For example, a driving signal may be supplied to the first position sensor (170) through the first and second terminals (B1, B2) of the first substrate (190A), and the output of the first position sensor (170) may be output externally through the third and fourth terminals (B3, B4). Additionally, the coil (120) may be electrically connected to the first substrate (190A). Furthermore, the first substrate (190A) may include two additional terminals separate from the first to fourth terminals (B1 to B4), and a driving signal may be supplied to the coil (120) from the outside through the two separate terminals. For example, the ground terminal among the power terminals of the first position sensor (170) can be electrically connected to the cover member (300).

[0141] The capacitor (195) may be placed on the first substrate (190A). For example, the capacitor (195) may be placed or mounted on the second surface of the first substrate (190A). In another embodiment, the capacitor (195) may be placed or mounted on the first surface of the first substrate (190A).

[0142] The capacitor (195) may be in the form of a chip, wherein the chip may include a first terminal corresponding to one end of the capacitor (195) and a second terminal corresponding to the other end of the capacitor (195). The capacitor (195) may be referred to as a "capacitive element" or a condenser. The capacitor (195) may be electrically connected to the first and second terminals (B1, B2) of the first substrate (190A) for supplying power (or a driving signal) to the first position sensor (170) from the outside. For example, the capacitor (195) may be connected in parallel to the first and second terminals (B1, B2). Alternatively, the capacitor (195) may be electrically connected to two terminals of the first position sensor (170) that are electrically connected to the first and second terminals (B1, B2) of the first substrate (190A). For example, a capacitor (195) can be connected in parallel to two terminals of a first position sensor (170) that are electrically connected to the first and second terminals (B1, B2).

[0143] The capacitor (195) is electrically connected to the first and second terminals (B1, B2) of the circuit board (190) and can function as a smoothing circuit to remove ripple components included in the power signal (GND, VDD) supplied from the outside to the first position sensor (170), thereby providing a stable and constant power signal to the first position sensor (170).

[0144] The upper elastic member (150) and the lower elastic member (160) may be coupled to at least one of the bobbin (110) and the housing (140). For example, the upper elastic member (150) may be coupled to the upper, top, or upper surface of the bobbin (110) and the upper, top, or upper surface of the housing (140). The lower elastic member (160) may be coupled to the lower, bottom, or lower surface of the bobbin (110) and the lower, bottom, or lower surface of the housing (140). The upper elastic member (150) and the lower elastic member (160) may elastically support the bobbin (110) with respect to the housing (140).

[0145] The upper elastic member (150) may include a plurality of upper elastic units (e.g., 150-1 to 150-4) that are electrically separated from each other or spaced apart from each other. The lower elastic member (160) is implemented as a single elastic unit, but in other embodiments, it may include a plurality of lower elastic units that are electrically separated from each other or spaced apart from each other. In other embodiments, at least one of the upper elastic member and the lower elastic member may be implemented as a single unit or a single configuration.

[0146] The upper elastic member (150) may further include a first inner frame (151) coupled or fixed to the upper, upper surface, or top of the bobbin (110), a second inner frame (152) coupled or fixed to the upper, upper surface, or top of the housing (140), and a first frame connecting part (153) connecting the first inner frame (151) and the first outer frame (152).

[0147] The lower elastic member (160) may include a second inner frame (161) coupled or fixed to the lower, lower, or bottom of the bobbin (110), a second outer frame (162) coupled or fixed to the lower, lower, or bottom of the housing (140), and a second frame connecting part (163) connecting the second inner frame (161) and the second outer frame (162) to each other. The inner frame may be replaced with an inner part, the outer frame may be replaced with an outer part, and the frame connecting part may be replaced with a connecting part.

[0148] For example, the first inner frame (151) may include a through hole (151a) that is coupled to the first coupling part (116a) of the bobbin (110), and the first outer frame (152) may include a through hole (152a) that is coupled to the first coupling part (143) of the housing (140). For example, the second inner frame (161) may include a through hole (161a) that is coupled to the second coupling part (116b) of the bobbin (110), and the second outer frame (162) may include a through hole (not shown) that is coupled to the second coupling part (147) of the housing (140). Each of the first and second frame connecting parts (153, 163) may be formed to be bent or curved (or curved) at least once to form a pattern of a certain shape.

[0149] Each of the upper elastic member (150) and the lower elastic member (160) may be made of a conductive material, for example, a metal material. Additionally, each of the upper elastic member (150) and the lower elastic member (160) may be formed of an elastic member, for example, a plate spring.

[0150] Referring to FIGS. 5 and 7, for example, the second outer frame (152) of the first upper elastic unit (150-1) may include a first bonding portion (4A) that is joined to or electrically connected to the first pad (5A) of the first substrate (190A) by solder or conductive adhesive. The second outer frame (152) of the second upper elastic unit (150-2) may include a second bonding portion (4B) that is electrically connected to the second pad (5B) of the first substrate (190A) by solder or conductive adhesive.

[0151] In another embodiment, at least one of the upper elastic member (150) or the lower elastic member (160) may include two elastic members. For example, each of the two elastic members of either the upper elastic member (150) or the lower elastic member (160) may be coupled to or electrically connected to a corresponding one of the first and second pads of the circuit board (190), and the coil (120) may be electrically connected to the two elastic members.

[0152] FIG. 9 is a perspective view of an image sensor unit (350), FIG. 10a is a first exploded perspective view of the image sensor unit (350) of FIG. 9, FIG. 10b is a second exploded perspective view of the image sensor unit (350) of FIG. 9, FIG. 11a is a bottom perspective view of a housing (140), a substrate unit (410), and a circuit board (190), FIG. 11b shows the arrangement of a second position sensor (240), FIG. 12a is a first exploded perspective view of a substrate unit (410), a shape memory alloy member (45), a plate (420), and a holder (270), FIG. 12b is a second exploded perspective view of a substrate unit (410), a shape memory alloy member (45), a plate (420), and a holder (270), FIG. 13 is a top view of a plate (420) and a holder (270), and FIG. 14a is FIG. 14 is a perspective view of a substrate portion (410), a plate (420), and a shape memory alloy member (45); FIG. 14 is a plan view of the substrate portion (410), a plate (420), and a shape memory alloy member (45); FIG. 15a is a first perspective view of a substrate portion (255), a support substrate (310), and a first heat dissipation member (280); FIG. 15b is a second perspective view of a substrate portion (255), a support substrate (310), and a first heat dissipation member (280); FIG. 16a is a partial perspective view of a housing (140), a second substrate (190B), a holder (270), and a substrate portion (410); FIG. 16b is a partial perspective view of the second substrate (190B), a holder (270), and a substrate portion (410) of FIG. 16a; FIG. 16c is a second substrate (190B) of FIG. 16b, FIG. 17 is a perspective view of the holder (270) and the substrate portion (410) in a different direction, FIG. 17 is a partial perspective view of the housing (140), the holder (270), the first substrate (190A), the first position sensor (170), the sensing magnet (180), the substrate portion (410), and the support substrate (310), FIG. 17 is a perspective view of the holder (270), the first substrate (190A), and the support substrate (310) of FIG. 17.

[0153] Referring to FIGS. 9 to 17b, the image sensor unit (350) may include a fixed unit and an OIS moving unit spaced apart from the fixed unit. The image sensor unit (350) may include a support substrate (310) connecting the fixed unit and the OIS moving unit.

[0154] The fixed part may be a fixed part of the camera device (10) that does not move during OIS operation. The fixed part may be a fixed element that does not move in a direction perpendicular to the optical axis by means of the shape memory alloy member (45) during OIS operation.

[0155] The fixed part may include a substrate part (800). For example, the fixed part may include a base (210) coupled to the substrate part (800). For example, the fixed part may include a housing (140) of the AF driving part and a configuration disposed in the housing (140), such as a magnet (130), a first position sensor (170), and a circuit board (190). Additionally, the fixed part may include a substrate part (410) which is a configuration coupled to the housing (140). Additionally, the fixed part may include a cover member (300) coupled to the base (210).

[0156] The OIS moving part may be disposed inside the cover member (300). The OIS moving part may include an image sensor (810). The OIS moving part may include a substrate part (255) that is spaced apart from the substrate part (800) and electrically connected to the substrate part (800). Additionally, for example, the OIS moving part may include at least one of a configuration disposed on the substrate part (255), such as a first heat dissipation member (280), a holder (270), and a second position sensor (240). The holder (270) may be replaced with a "spaced member." In other embodiments, the holder (270) may be omitted.

[0157] The support substrate (310) can be combined with the fixed part and the OIS moving part. The support substrate (310) can support the OIS moving part with respect to the fixed part so that the OIS moving part moves in a direction perpendicular to the optical axis, or tilts or rotates within a preset range with respect to the optical axis. Additionally, the support substrate (310) can electrically connect the fixed part and the OIS moving part.

[0158] The holder (270) may be positioned below the AF drive unit (100). For example, the holder (270) may be made of a non-conductive material. For example, the holder (270) may be made of an injection molding material that is easy to shape by an injection molding process. Additionally, the holder (270) may be formed of an insulating material. Also, for example, the holder (270) may be made of a resin or plastic material.

[0159] Referring to FIG. 12a and FIG. 12b, the holder (270) may include an upper surface (270A), a lower surface (270B) opposite to the upper surface (270A), and a side surface (e.g., an outer surface) connecting the upper surface (270A) and the lower surface (270B). For example, the lower surface (270B) of the holder (270) may face or be opposite to the substrate portion (800).

[0160] The holder (270) can support the substrate portion (255) and can be coupled with the substrate portion (255). For example, the substrate portion (255) can be placed below the holder (270). For example, the lower part, the bottom surface (270B), or the bottom of the holder (270) can be coupled with the upper part, the top surface (270A), or the top of the substrate portion (255). For example, the holder (270) can be coupled with the substrate portion (255) by means of an adhesive.

[0161] The holder (270) can be combined with the plate (420). The plate (420) can be placed on the holder (270). The plate (420) can be combined with the upper, top, or upper surface (270A) of the holder (270). For example, with respect to the holder (270), the plate (420) and the substrate portion (410) can be placed on the upper side of the holder (270), and the substrate portion (255) can be placed on the lower side of the holder (270).

[0162] The holder (270) may include an opening (70) corresponding to a region of the substrate portion (255). For example, the opening (70) of the holder (270) may be a through hole penetrating the holder (270) in the direction of the optical axis. For example, the opening (70) of the holder (270) may correspond to, oppose, or overlap with the image sensor (810) in the direction of the optical axis. Additionally, the opening (70) of the holder (270) in the direction of the optical axis may correspond to, oppose, or overlap with the lens module (400). The shape of the opening (70) of the holder (270) as viewed from above may be a polygon, for example, a square, a circle, or an ellipse, but is not limited thereto and may be implemented in various shapes.

[0163] For example, the opening (70) of the holder (270) may have a shape or size that exposes a part of the image sensor (810) and the substrate portion (255). For example, the opening (70) may have a shape or size that exposes a part of the upper surface of the first circuit board (250), a part of the upper surface of the second circuit board (260), and the elements. For example, the area of ​​the opening (70) of the holder (270) may be larger than the area of ​​the image sensor (810) and may be larger than the area of ​​the opening (250A) of the first circuit board (250).

[0164] The holder (270) may include holes (70A, 70B, 70C) corresponding to the second position sensor (240). For example, the holder (270) may include holes (70A, 70B, 70C) formed at positions corresponding to each of the first to third sensors (240A, 240B, 240C) of the second position sensor (240). For example, the holes (70A, 70B, 70C) may be through holes penetrating the holder (270) in the direction of the optical axis. In other embodiments, the holes (70A, 70B, 70C) of the holder (270) may be omitted.

[0165] The holder (270) may include at least one protrusion (27A, 27B). The protrusion (27A, 27B) may protrude from the upper surface (270A) of the holder (270). For example, the protrusion (27A, 27B) may protrude from the outer surface of the holder (270) in the direction of the optical axis or upward. For example, the holder (270) may include two protrusions (27A, 27B) that are opposite or overlap in a second horizontal direction (e.g., the Y-axis direction). For example, the two protrusions (27A, 217B) of the holder (270) may be located on opposite sides of the optical axis.

[0166] The holder (270) may include four sides (or side plates), and protrusions (27A, 27B) may be formed on two of the four sides. For example, the protrusions (27A, 27B) may be positioned or located in the center of the sides (or side plates) of the holder (270).

[0167] The holder (270) may include a groove (341a). The groove (341a) may be an adhesive receiving groove. For example, the groove (341a) may be formed on the outer surface of the protrusions (27A, 27B) of the holder (270). The groove (341a) may be formed on the upper surface of the protrusions (27A, 27B) of the holder (270). An adhesive for bonding the support substrate (310) to the holder (270) may be disposed in the groove (341a). The groove (341a) may include a plurality of grooves. For example, the groove (341a) may extend in the direction of the optical axis. In another embodiment, the groove of the holder (270) may extend in a direction perpendicular to the optical axis.

[0168] The substrate portion (255) can be placed on the holder (260). The substrate portion (255) can be coupled with the holder (260). The substrate portion (255) can be placed below the holder (260). The substrate portion (255) can be placed on the lower surface (270B) of the holder (260). The substrate portion (255) can be coupled to the lower surface (270B) of the holder (260).

[0169] The substrate portion (255) may include a first circuit board (250) and a second circuit board (260) that are electrically connected to each other. For example, the first circuit board (250) may be placed on or coupled to the lower surface (270B) of the holder (270). For example, a groove (270C) for seating or placing the first circuit board (250) may be formed on the lower surface (270B) of the holder (270). For example, the first surface of the first circuit board (250) may be coupled or attached to the lower surface of the holder (270) or the groove (270C) formed on the lower surface of the holder (270) by means of an adhesive member. At this time, the first surface of the first circuit board (250) may face or opposite the AF driving unit and may be the surface on which the second position sensor (240) is placed. In addition, the second side of the first circuit board (250) may be the opposite side of the first side of the first circuit board (250).

[0170] Any one of the substrate parts (255, 410, 800) can be defined as a "first substrate part" or a first circuit board (or a first substrate), any other of the substrate parts (255, 410, 800) can be defined as a "second substrate part" or a second circuit board (or a second substrate), and the remaining one of the substrate parts (255, 410, 800) can be defined as a "third substrate part" or a third circuit board (or a third substrate).

[0171] The first circuit board (250) may be replaced with a main board, a main circuit board, a sensor circuit board, or a mobile circuit board. The second circuit board (260) may be replaced with a "sensor board." In other embodiments, the first circuit board (250) may be replaced with a "second board" or "second circuit board," and the second circuit board (260) may be replaced with a "first board" or "first circuit board."

[0172] A second position sensor (240: 240A, 240B, 240C) for detecting movement of the OIS moving part in a direction perpendicular to the optical axis direction or / and rotation, tilting, or rolling of the OIS moving part relative to the optical axis may be disposed on the first circuit board (250). Additionally, a circuit element (e.g., a capacitor) may be disposed on the first circuit board (250). For example, the first circuit board (250) may be a printed circuit board or a flexible printed circuit board (FPCB).

[0173] The first circuit board (250) may include an opening (250A) that corresponds to or opposes the opening of the lens module (400) or the bobbin (110). For example, the opening (250A) of the first circuit board (250) may be a through hole or a hollow that penetrates the first circuit board (250) in the direction of the optical axis, and may be formed in the center of the first circuit board (250). When viewed from above, the shape of the first circuit board (250), for example, the outer circumference shape, may be a shape that matches or corresponds to the holder (270), for example, a rectangular shape. Also, when viewed from above, the shape of the opening (250A) of the first circuit board (250) may be a polygon, for example, a square, or a circular or elliptical shape. For example, the opening (250A) of the first circuit board (250) can open or expose the image sensor (810) or / and the opening (260A) of the second circuit board (260).

[0174] Additionally, the first circuit board (250) may include at least one terminal (251) for electrically connecting to the second circuit board (260). Here, the terminal (251) of the first circuit board (250) may be replaced with a "pad" or "bonding part." The terminal (251) of the first circuit board (250) may be placed or arranged on the lower surface of the first circuit board (250). For example, there may be multiple terminals (251), and multiple terminals (251) may be placed or arranged in a direction parallel to one side in the area between the opening (250A) of the first circuit board (250) and one side. For example, multiple terminals (251) may be arranged to surround the opening (250A).

[0175] The second circuit board (260) may be placed below the first circuit board (250). The second circuit board (260) may be placed on the lower surface of the first circuit board (250). When viewed from above, the second circuit board (260) may be polygonal (e.g., square, square, or rectangular), but in other embodiments, it may be circular or elliptical.

[0176] For example, the outer periphery area of ​​the rectangular second circuit board (260) may be larger than the area of ​​the opening (250A) of the first circuit board (250). For example, the lower side of the opening (250A) of the first circuit board (250) may be shielded or blocked by the second circuit board (260). For example, when viewed from the upper or lower side, the outer surface (or side) of the second circuit board (260) may be located between the outer surface (or side) of the first circuit board (250) and the opening (250A) of the first circuit board (250).

[0177] For example, the second circuit board (260) may include an opening (250A) of the first circuit board (250) and / or an opening (260A) corresponding to the image sensor (810). The opening (260A) of the second circuit board (260) may be a hole or a hollow penetrating the second circuit board (260) in the direction of the optical axis, and may be formed in the center of the second circuit board (260). For example, the opening (260A) of the second circuit board (260) may open or expose the image sensor (810). For example, the image sensor (810) may be placed within the opening (260A) of the second circuit board (260). In another embodiment, the opening (260A) may not be formed in the second circuit board (260), and the image sensor (810) may be placed on the upper surface of the second circuit board (260).

[0178] The second circuit board (260) may include at least one terminal (261) that is electrically connected to at least one terminal (251) of the first circuit board (250). For example, the number of terminals (261) of the second circuit board (260) may be multiple. For example, at least one terminal (261) of the second circuit board (260) may be formed on a side or outer surface of the second circuit board (260) connecting the upper surface and the lower surface of the second circuit board (260). The upper surface of the second circuit board (260) may be a surface facing the first circuit board (250), and the lower surface of the second circuit board (260) may be a surface opposite to the upper surface of the second circuit board (260). For example, the terminal (261) may be in the form of a groove that is recessed from the side of the second circuit board (260). Alternatively, for example, the terminal (261) may be in the form of a semicircular or semi-elliptical via formed on the side of the second circuit board (260). In another embodiment, at least one terminal of the second circuit board (260) electrically connected to the second terminal (251) of the first circuit board (250) may be formed on the upper surface of the second circuit board (260). For example, the terminal (261) of the second circuit board (260) may be joined to the terminal (251) of the first circuit board (250) by means of solder or a conductive adhesive.

[0179] For example, the first and second circuit boards (250, 260) may be printed circuit boards or FPCBs. Also, at least one of the first and second circuit boards (250, 260) may be an organic substrate or a ceramic substrate.

[0180] The first heat dissipation member (280) may be placed on or coupled to the substrate portion (255). For example, the first heat dissipation member (280) may be placed on or coupled to the second circuit board (260). For example, the first heat dissipation member (280) may be placed below the second circuit board (260). For example, the first heat dissipation member (280) may be coupled to or fixed to the lower surface of the second circuit board (260).

[0181] The opening (260A) of the second circuit board (260) may open or expose at least a portion of the first heat dissipation member (280). An image sensor (810) may be placed, attached, or bonded on at least a portion of the first heat dissipation member (280) exposed by the opening (260A) of the second circuit board (260). For example, the image sensor (810) may be fixed, attached, or bonded to the first heat dissipation member (280) by means of an adhesive. For example, at least one area of ​​the upper surface of the first heat dissipation member (280) may be exposed by the opening (260A) of the second circuit board (260), and the image sensor (810) may be placed, attached, or bonded on at least one area of ​​the upper surface of the first heat dissipation member (280) exposed by the opening (260A) of the second circuit board (260).

[0182] In another embodiment, the second circuit board (260) may include a groove formed on its lower surface to accommodate or place the first heat dissipation member (280). In another embodiment, the opening (260A) may not be formed in the second circuit board (260), and the first heat dissipation member (280) may be fixed, attached, or coupled to the lower surface of the second circuit board (260). In yet another embodiment, the first heat dissipation member (280) may be omitted.

[0183] For example, the first heat dissipation member (280) may be a plate-shaped member having a predetermined thickness and hardness. Additionally, the first heat dissipation member (280) may enhance the heat dissipation effect of releasing heat generated from a heat source of the substrate portion (255) to the outside. At this time, the heat source of the substrate portion (255) may be an electronic element (or circuit element) disposed on the substrate portion (255), such as an image sensor (810), a second position sensor (240), or / and a capacitor.

[0184] For example, the first heat dissipation member (280) may include at least one of a metal material having high thermal conductivity and high heat dissipation efficiency, such as SUS, aluminum, nickel, phosphorus, bronze, or copper. In another embodiment, the first heat dissipation member (280) may be formed of a heat dissipation member having high thermal conductivity, such as heat dissipation epoxy, heat dissipation plastic (e.g., polyimide), or heat dissipation synthetic resin. In the first heat dissipation member (280), the "heat dissipation member" may be replaced with a plate, a metal plate, a reinforcing material, or a stiffener.

[0185] In addition, the first heat dissipation member (280) can stably support the image sensor (810) and can serve as a reinforcing material to prevent the image sensor (810) from being damaged by external impact or contact.

[0186] To enhance the heat dissipation effect, the first heat dissipation member (280) may include a preset pattern comprising at least one groove or at least one protrusion. For example, a groove or protrusion having a preset pattern may be formed on the lower surface of the first heat dissipation member (280).

[0187] For example, the preset pattern may include a plurality of grooves formed at preset intervals. For example, the preset pattern may have a stripe shape. In another embodiment, the preset pattern may have a net shape or a mesh shape. In yet another embodiment, the preset pattern may have a shape including dots spaced apart from each other. For example, the shape of the dots may be circular, elliptical, or polygonal (e.g., square). In another embodiment, the preset pattern may be formed on at least one of the upper surface, lower surface, or outer surface of the first heat dissipation member (280). In yet another embodiment, the heat dissipation member may include holes or through holes instead of grooves or protrusions. Since the first heat dissipation member (280) moves together with the OIS moving part, it may be spaced apart from the fixed part, e.g., the substrate part (800). The first heat dissipation member (280) may include at least one escape groove (281, see FIG. 15a) to avoid spatial interference with the solder connecting the terminals (251, 261).

[0188] The second position sensor (240) may be placed on the substrate (255). The second position sensor (240) may be electrically connected to the substrate (255). For example, the second position sensor (240) may be placed, coupled, or mounted on the first surface (e.g., the top surface) of the first circuit board (250). The second position sensor (240) may detect movement or displacement of the OIS moving part in a direction perpendicular to the optical axis direction, for example, shift or movement of the OIS moving part in a direction perpendicular to the optical axis direction. Additionally, the second position sensor (240) may detect rotation, rolling, or tilting of the OIS moving part within a preset range relative to or around the optical axis. The first position sensor (170) may be replaced with "AF position sensor," and the second position sensor (240) may be replaced with "OIS position sensor."

[0189] The second position sensor (240) may be opposed to or overlapped with at least a portion of the magnet (130) in the optical axis direction. For example, the second position sensor (240) may include two or more sensors. To detect the movement of the OIS moving part, two or more sensors may correspond to or overlap with two or more of the magnet units (130-1 to 130-4) in the optical axis direction. For example, the second position sensor (240) may include three sensors (240A to 240C). For example, in the optical axis direction, the second position sensor (240) may overlap with the holes (70A to 70C) of the holder (270) and may be placed within the holes (70A to 70C).

[0190] For example, the second position sensor (240) may include a first sensor (240A), a second sensor (240B), and a third sensor (240C) spaced apart from each other. Each of the first sensor (240), the second sensor (240B), and the third sensor (240C) may be electrically connected to the first circuit board (250).

[0191] For example, each of the first to third sensors (240A, 240B, 240C) may be a Hall sensor. In another embodiment, each of the first to third sensors (240A, 240B, 240C) may be a driver IC including a Hall sensor and a driver. The description of the first position sensor (170) may be applied or applied by analogy to the first to third sensors (240A, 240B, 240C). For example, each of the first to third sensors (240A2, 240B, 240C) may be a displacement sensing sensor in which the output voltage changes according to the position (or) relationship with the corresponding magnet unit.

[0192] In the direction of the optical axis, the second position sensor (240) may be opposite, corresponding to, or overlap with the magnet (130). For example, at the initial position of the OIS moving part, at least a portion of the first sensor (240A) may overlap in the direction of the optical axis with either of two magnet units (130-1, 130-2) that are positioned opposite each other in the first horizontal direction (X-axis direction). For example, the first sensor (240A) may output a first output signal (e.g., a first output voltage) based on the result of detecting the magnetic field of either of the magnet units (e.g., 130-1) (or 130-2).

[0193] For example, at the initial position of the OIS moving part, at least a portion of the second sensor (240B) may overlap in the optical axis direction with either one of two magnet units (130-3, 130-40) located opposite each other in the second horizontal direction (Y-axis direction) (e.g., 130-3) (or 130-4). The second sensor (240B) may output a second output signal (e.g., a second output voltage) based on the result of detecting the magnetic field of either one of the magnet units (e.g., 130-3) (or 130-4)).

[0194] Additionally, for example, at the initial position of the OIS moving part, at least a portion of the third sensor (240C) may overlap in the optical axis direction with either the other one of the two magnet units (130-1, 130-2) (e.g., 130-2) (or 130-1)) positioned opposite each other in the first horizontal direction (X-axis direction) or the other one of the two magnet units (130-3, 130-4) positioned opposite each other in the second horizontal direction (Y-axis direction) (e.g., 130-4) (or 130-3)). For example, the third sensor (240C) may output a third output signal (e.g., a third output voltage) based on the result of detecting the magnetic field of the other one of the magnet units. At this time, the magnet unit that overlaps the third sensor (240C) in the optical axis direction may not overlap with the first sensor (240A) and the second sensor (240B) in the optical axis direction.

[0195] The initial position of the OIS moving part may be the initial position of the OIS moving part when no power or driving signal is applied to the shape memory alloy member (45) from the control part (830, 780). In addition, the initial position of the OIS moving part may be the position where the OIS moving part is placed when gravity acts from the substrate part (255) toward the substrate part (800), or when gravity acts in the opposite direction.

[0196] In order to improve the linearity of the relationship between the output of the second position sensor (240) and the displacement of the OIS moving part, each sensor (240A, 240B, 240C) can be overlapped with the corresponding magnet unit in the optical axis direction within the stroke range of the OIS moving part.

[0197] The control unit (830) may include an analog-to-digital converter that receives output voltages from the first to third sensors (240A to 240C) and outputs a data value (digital value or code value) based on the result of analog-to-digital conversion of the received output voltages. The control unit (830) can detect the displacement (or position) in the X-axis direction, the displacement (or position) in the Y-axis direction, and the rotation angle (rolling angle) of the OIS moving unit using the data values.

[0198] In another embodiment, the third sensor (240C) may be omitted, and the control unit (830) may receive output voltages from the first and second sensors (240A, 240B) and use the received output voltages to detect the displacement (or position) in the X-axis direction and the displacement (or position) in the Y-axis direction of the OIS moving unit. For example, in another embodiment, the control unit (830) may generate a data value (digital value or code value) based on the result of analog-to-digital conversion of the first and second output voltages, and use the generated data value to detect the displacement (or position) in the X-axis direction and the displacement (or position) in the Y-axis direction of the OIS moving unit.

[0199] The base (210) may be positioned below the substrate portion (255). The base (210) may be spaced apart from the OIS moving portion. For example, the base (210) may be spaced apart from the substrate portion (255) and the holder (270). The base (210) may be a polygon, for example, a square shape, that matches or corresponds to the cover member (300) or the substrate portion (255).

[0200] For example, the base (210) may include an opening (210A) corresponding to or opposite to the substrate portion (255). The opening (210A) of the base (210) may be a through hole penetrating the base (210) in the direction of the optical axis. In other embodiments, the base may not have an opening.

[0201] For example, the base (210) may be combined with at least one of the cover member (300) and the housing (140). For example, the base (120) may be combined with the side plate (302) of the cover member (300) and / or the housing (140). The side or outer surface of the base (210) may include a step (211, see FIG. 14) on which an adhesive may be applied when bonded to the side plate (302) of the cover member (300). At this time, the step (211) may guide the side plate (302) of the cover member (300) to be bonded to the upper side. The step (211) of the base (210) and the lower end of the side plate (302) of the cover member (300) may be bonded and fixed by an adhesive or the like.

[0202] The base (210) may include at least one protrusion (216A, 216B) protruding from the upper surface. For example, the protrusion (216A, 216B) may protrude upward from the outer surface of the base (210). For example, the base (210) may include two protrusions (216A, 216B) that face each other or overlap in a first horizontal direction (e.g., X-axis direction).

[0203] For example, the base (210) may include four sides (or side plates), and protrusions (216A, 216B) may be formed on two of the four sides. For example, the protrusions (216A, 216B) may be positioned or located in the center of the sides (or side plates) of the base (210). The direction of placement of the protrusions (216A, 216B) of the base (210) may intersect with the direction of placement of the protrusions (27A, 27B) of the holder (270). For example, the direction of placement of the protrusions (216A, 216B) of the base (210) and the direction of placement of the protrusions (27A, 27B) of the holder (270) may be perpendicular to each other.

[0204] The base (210) may include a groove (341b). The groove (341b) may be an adhesive receiving groove. The groove (341b) may be formed on the outer surface of the protrusions (216A, 216B) of the base (210). The groove (341b) may be formed on the upper surface of the protrusions (216A, 216B) of the base (210). The groove (341b) may be formed from the upper surface to the lower surface of the protrusions (216A, 216B) of the base (210). An adhesive for bonding the support substrate (310) to the base (210) may be disposed in the groove (341b). The groove (341b) may include a plurality of grooves. For example, the groove (341b) may extend in the direction of the optical axis. In another embodiment, the groove formed in the protrusion (216A, 216B) of the base (210) may extend in a direction perpendicular to the optical axis.

[0205] The substrate portion (800) may be positioned below the base (210). For example, the substrate portion (800) may be positioned spaced apart from the OIS moving portion, such as the substrate portion (255) and the first heat dissipation member (280), in the direction of the optical axis. For example, the substrate portion (800) may be positioned below the lower surface of the base (210). The substrate portion (800) may be coupled to the base (210). For example, the substrate portion (800) may be coupled to the lower surface of the base (210). The substrate portion (800) may serve to provide a signal from the outside to the image sensor portion (350) or to output a signal transmitted from the image sensor portion (350) to the outside. The substrate portion (800) may be represented as a "connector substrate."

[0206] The substrate portion (800) may include a first area (801) (or first substrate) corresponding to, opposite to, or overlapping with the AF drive unit (100) or image sensor (810) in the direction of the optical axis, a second area (802) (or second substrate) where a connector (804) is disposed, and a third area (803) (or third substrate) connecting the first area (801) and the second area (802). The connector (804) is electrically connected to the second area (802) of the substrate portion (800) and may have a port for electrically connecting to an external device (e.g., an optical device (200A)). The opening (210A) of the base (210) may be closed or closed by the first area (801) of the substrate portion (800).

[0207] A first region (801) of the substrate portion (800) may correspond to, oppose, or overlap with at least one of the cover member (300) and the base (210) in the optical axis direction. For example, the first region (801) may overlap with the top plate (301) and side plate (302) of the cover member (300) in the optical axis direction. Each of the first region (801) and the second region (802) of the substrate portion (800) may include a rigid substrate. A third region (803) may include a flexible substrate. Additionally, each of the first region (801) and the third region (802) may further include a flexible substrate. In another embodiment, at least one of the first to third regions (801 to 803) of the circuit board (800) may include at least one of a rigid substrate and a flexible substrate. The substrate portion (800) may be positioned behind the substrate portion (255). For example, the substrate portion (255) may be positioned between the AF drive portion (100) and the substrate portion (800). When viewed from above, the first region (801) of the substrate portion (800) may be polygonal (e.g., square, square, or rectangular), but in other embodiments, it may be circular or similar.

[0208] The second area (802) may be positioned adjacent to the first side of the first area (801), and the third area (803) may be connected to the first side of the first area (801). For example, the third area (803) may be connected to one side of the second area (802) that extends from the first area (801) and faces the first side. For example, the third area (803) may be spaced apart from the extension area (808).

[0209] The substrate portion (800) may include a plurality of terminals (800B) corresponding to the terminals (311) of the support substrate (310). The plurality of terminals (800B) may be formed in a first region (801) of the substrate portion (800). For example, the plurality of terminals (800B) may be formed on a first surface (e.g., an upper surface) of the substrate portion (800) (e.g., a first region (801)) facing the substrate portion (255).

[0210] The substrate portion (800) may include an extended portion (808) that is connected to the first portion (801) and extends from the first portion (801). The extended portion (808) may extend from any side of the first portion (801).

[0211] The camera device (10) may include a control unit (830) disposed on a substrate (800). For example, the control unit (830) may be disposed on an extended area (808) of the substrate (800). A coupling hole (not shown) may be formed in the first area (801), and a coupling projection (not shown) for coupling with the coupling hole of the first area (801) may be formed on the base (210).

[0212] The camera device (10) may further include a second heat dissipation member (380) that is disposed, coupled, or fixed to the substrate portion (800). The second heat dissipation member (380) may be disposed in a first area of ​​the substrate portion (800). For example, the second heat dissipation member (380) may be disposed, coupled, or fixed to the upper surface of the first area (801) of the substrate portion (800). In other embodiments, the second heat dissipation member (380) may be omitted. For example, the second heat dissipation member (380) may be a plate-shaped member having a predetermined thickness and hardness. Additionally, the second heat dissipation member (380) may face or overlap with the first heat dissipation member (280) in the direction of the optical axis. The second heat dissipation member (380) may be exposed from the opening (210A) of the base (210), thereby improving the heat transfer efficiency from the first heat dissipation member (280) to the second heat dissipation member (380) and improving the heat dissipation efficiency of the camera device (200). The camera device (10) may further include a third heat dissipation member (not shown) that is disposed, coupled, or fixed to the second surface (e.g., bottom surface) of the substrate portion (800).

[0213] The control unit (830) is placed or coupled to the upper surface of the extension area (808), but in another embodiment, the control unit (830) may be placed or coupled to the lower surface of the extension area (808). The control unit (830) is placed in the extension area (808) of the substrate part (800) located outside the cover member (300), but in another embodiment, the control unit may be placed in the first area of ​​the substrate part (800) located outside the base (210). In yet another embodiment, the control unit (830) may be placed or mounted on the first circuit board (250) or the second circuit board (260). For example, in another embodiment, the control unit (830) may be placed or mounted on the upper surface of the second circuit board (260). Since a heat dissipation member (280) is disposed or combined on the lower surface of the second circuit board (260), when a control unit is disposed on the second circuit board (260), heat generated by the control unit can be easily released by the heat dissipation member (280), thereby improving heat dissipation efficiency.

[0214] The camera device (10) may include a cover can (405) that is positioned in an extended area (808) to protect the control unit (830) from external impact and accommodates the control unit (830) inside. The cover can (405) may include a top plate and a side plate connected to the top plate and extending from the top plate toward the extended area (808). The cover can (405) may be positioned, coupled, or fixed to the upper surface of the extended area (808). For example, the lower, bottom, or lower surface of the side plate of the cover can (405) may be coupled, attached, or fixed to the upper surface of the extended area (808). Since the cover can (405) accommodates the control unit (830) inside, it can suppress heat generated from the control unit (830) from being released outside the cover can (405) and transferred to the image sensor. The description of the material of the first heat dissipation member (280) or the material of the cover member (300) can be applied to or inferred from the cover can (405).

[0215] In another embodiment, the substrate portion (800) may not include an extension area (808), and the control portion (830) may be placed in the second area (802) of the substrate portion (800). Additionally, the cover can (405) may be placed, coupled, or fixed in the second area (802) of the second substrate portion (800A). For example, the lower, bottom, or bottom surface of the side plate of the cover can (405) may be coupled, attached, or fixed to the upper surface of the second area (802). In yet another embodiment, the control portion (830) may be placed, coupled, or mounted on the bottom surface of the second area (802) of the substrate portion (800). Additionally, the cover can (405) may be placed, coupled, or fixed on the bottom surface of the second area (802) of the substrate portion (800). For example, the lower, bottom, or bottom surface of the side plate of the cover can (405) may be coupled, attached, or fixed to the bottom surface of the second area (802). In FIG. 4a, the connector (804) is placed on the bottom surface of the second area (802) of the substrate part (800), but in other embodiments, the connector may be placed on the top surface of the second area of ​​the substrate part (800).

[0216] FIG. 18 shows a simplified cross-sectional view of the lens module (400), substrate part (255), image sensor (810), first heat dissipation member (280), substrate part (800), and second heat dissipation member (380) of FIG. 10a.

[0217] Referring to FIG. 18, the image sensor (810) may be placed within an opening (260A) (or hole) of the second circuit board (260) and may be combined with a first heat dissipation member (280). For example, the first heat dissipation member (280) may include a body (37A) placed below the second circuit board (260) and a protrusion (37B) (or protruding region) protruding from the body (37A) and placed within the opening (260A) of the second circuit board (260).

[0218] The image sensor (810) may be placed, coupled, or fixed on the protrusion (37B) of the first heat dissipation member (280). For example, the image sensor (810) may be placed, coupled, or attached to the upper surface of the protrusion (37B). For example, the upper surface of the protrusion (37B) may be positioned lower than the upper surface of the second circuit board (260). In another embodiment, the upper surface of the protrusion (37B) may be positioned at the same height as the upper surface of the second circuit board (260).

[0219] The second heat dissipation member (380) may be disposed on the first surface (801A) (or upper surface) of the first region (801) of the second substrate portion (800) facing the first heat dissipation member (280) in the optical axis direction. The separation distance (G1) (or gap) in the optical axis direction between the substrate portion (255) and the substrate portion (800) may be 0.05 [mm] to 0.7 [mm]. For example, the separation distance (G1) may be the distance between the lower surface of the first heat dissipation member (280) and the upper surface of the second heat dissipation member (380). In another embodiment, G1 may be 0.15 [mm] to 0.5 [mm]. In yet another embodiment, G1 may be 0.15 [mm] to 0.3 [mm]. In yet another embodiment, G1 may be 0.2 [mm] to 0.3 [mm]. It could be.

[0220] The substrate portion (800) may include a first conductive layer (93) that is exposed to the first surface (801A) and contacts the second heat dissipation member (380), for example, the lower surface of the second heat dissipation member (380). For example, the first conductive layer (93) may be heat-fused to the lower surface of the second heat dissipation member (380) or bonded by a conductive adhesive, for example, solder. In addition, for example, the first conductive layer (93) may be electrically connected to the second heat dissipation member (380).

[0221] The substrate portion (800) may include a second conductive layer (92A) that is connected to the first conductive layer (93) and exposed from the second surface (801B) (or lower surface) of the substrate portion (800), which is opposite to the first surface (801A) of the substrate portion (800). For example, the second conductive layer (92A) may be electrically connected to the ground of the substrate portion (800).

[0222] The first conductive layer (93) may be in the form of a via that passes through at least a portion of the substrate portion (800). For example, the first conductive layer (93) may include a first via (93A) that penetrates the substrate portion (800) and is open or exposed to the second surface (801B) of the substrate portion (800). Additionally, the first conductive layer (93) may include a second via (93B) that is in contact with the lower surface of the second heat dissipation member (380) at one end and is in contact, coupled with, or connected to the second conductive layer (92A) at the other end.

[0223] In FIG. 18, the second conductive layer (92A) may be placed in a groove formed on the second surface (801B) of the second substrate portion (800-1), coupled to the groove, or attached to the groove. In another embodiment, the second conductive layer may be placed, coupled, or attached to the second surface (801B) of the substrate portion (800), which is a flat surface where no groove is formed.

[0224] The first conductive layer (93) and the second conductive layer (92A) can serve as a heat dissipation pattern or heat dissipation pad for heat dissipation of the substrate (800). That is, since the first conductive layer (93) and the second conductive layer (92A) are solely for the purpose of heat dissipation, they may not be electrically connected to other wiring of the substrate (800), excluding the ground of the substrate (800). At this time, the other wiring may be wiring electrically connected to electronic components (or circuit components) such as the control unit (830, 780) and the image sensor (810), or to the support substrate (310).

[0225] The second conductive layer (92A) can be electrically connected to the cover member (300) (e.g., side plate (302)) through solder, conductive adhesive, or conductive tape. By electrically connecting the ground of the substrate part (800) and the second heat dissipation member (380) to the cover member (300), the camera device (10) can be protected from static electricity and the heat dissipation efficiency can be improved.

[0226] Since the second heat dissipation member (380) is positioned on the first surface of the substrate portion (800), the distance from the first heat dissipation member (280) can be reduced, thereby improving heat dissipation efficiency. Heat emitted from the first heat dissipation member (280) can be transferred to the second heat dissipation member (380) through convection or radiation, and the transferred heat can be released to the outside through the second heat dissipation member (380), thereby improving the heat dissipation effect. Since the upper surface of the second heat dissipation member (380) and the lower surface of the first heat dissipation member (370) are positioned to face each other or overlap in the direction of the optical axis, heat can be effectively transferred from the first heat dissipation member (280) to the second heat dissipation member (380). For example, the first heat dissipation member (370) and the second heat dissipation member (380) can be formed of the same material. In another embodiment, the first heat dissipation member (370) and the second heat dissipation member (380) may be formed of different materials. For example, the thermal conductivity of the first heat dissipation member (370) may be applied to or analogously applied to the second heat dissipation member (380).

[0227] Additionally, the second heat dissipation member (380) can stably support the substrate portion (800) and can serve as a reinforcing material to prevent the substrate portion (800) from being damaged by external impact or contact. In another embodiment, the second heat dissipation member (380) may be formed of a heat dissipation member with high thermal conductivity, such as heat dissipation epoxy, heat dissipation plastic, or heat dissipation synthetic resin.

[0228] The second heat dissipation member (380) may include at least one groove or at least one protrusion to enhance the heat dissipation effect. For example, a groove or protrusion having a preset pattern may be formed on at least one of the upper or lower surfaces of the second heat dissipation member (380). In another embodiment, the second heat dissipation member may include a hole or a through hole instead of a groove. For example, the second heat dissipation member according to another embodiment may include a plurality of through holes. The description of the preset pattern of the first heat dissipation member (280) may be applied to or analogously applied to the second heat dissipation member (380).

[0229] The support substrate (310) can support the moving part so that the OIS moving part moves in a direction perpendicular to the optical axis direction relative to the fixed part. The support substrate (310) can electrically connect the substrate part (255) and the substrate part (800). The support substrate (310) can be expressed as a "support member," "connecting substrate," or "connecting part." Alternatively, the support substrate (310) can be expressed as an "interposer" or "interposer substrate."

[0230] The support substrate (310) may include a flexible substrate or be a flexible substrate. For example, the support substrate (310) may include a Flexible Printed Circuit Board (FPCB). The support substrate (310) may have flexibility in at least a part. The first circuit board (250) and the support substrate (310) may be connected to each other.

[0231] Referring to FIGS. 15a and 15b, for example, the support substrate (310) may include a connecting portion (320) connected to the first circuit board (250). For example, the first circuit board (250) and the support substrate (310) may be formed integrally. In another embodiment, the first circuit board (250) and the support substrate (310) may be configured separately rather than integrally, and may be connected to each other by the connecting portion (320) and electrically connected. Or in another embodiment, the connecting portion (320) may be formed integrally with at least one of the support substrate (310) or the first circuit board (250). Additionally, the support substrate (310) may be electrically connected to the first circuit board (250). The support substrate (310) may be electrically connected to the substrate portion (800).

[0232] The support substrate (310) can support the OIS moving part with respect to the fixed part. Additionally, the support substrate (310) can guide the movement of the OIS moving part. The support substrate (310) can guide the OIS moving part to move in a direction perpendicular to the optical axis direction. The support substrate (310) can guide the OIS moving part to rotate, tilt, or roll with the optical axis as the axis. The support substrate (310) can restrict the movement of the OIS moving part in the direction of the optical axis.

[0233] A portion of the support substrate (310) may be coupled, attached, or fixed to a base (210) which is a fixed portion, and another portion of the support substrate (310) may be coupled, attached, or fixed to a holder (270) which is an OIS moving portion. For example, a portion of the body (86, 87) of the support substrate (310) may be coupled to a protrusion (27A, 27B) of the holder (270). Another portion of the body (86, 87) of the support substrate (310) may be coupled to a protrusion (216A, 216B) of the base (210). Additionally, the terminal portions (7A to 7D) of the support substrate (310) may be coupled to terminals (800B) of the substrate portion (800).

[0234] The support substrate (310) may include a circuit member (310A). The circuit member (310A) is intended to electrically connect the first circuit board (250) and the substrate portion (800), and may be a flexible substrate or include at least one of a flexible substrate and a rigid substrate. For example, the circuit member (310A) may be an FPCB. Additionally, the support substrate (310) may further include an elastic portion (310B) coupled to the circuit member (310A). The elastic portion (310B) is intended to elastically support the OIS moving portion and may be implemented as an elastic body, such as a spring. The elastic portion (310B) may include metal or be made of an elastic material. In other embodiments, the elastic portion (310B) may be omitted.

[0235] The support substrate (310) may be connected to the substrate portion (255) (e.g., the first circuit board (250)) and may include at least one connection portion (320A, 320B) that is electrically connected to the substrate portion (255) (e.g., the first circuit board (250)). Additionally, the support substrate (310) may be connected to the substrate portion (800) and may include at least one terminal portion (7A to 7D) that is electrically connected to the substrate portion (800), and at least one terminal portion (7A to 7D) may include a plurality of terminals (311).

[0236] For example, the support substrate (310) may include a first support substrate (310-1) and a second support substrate (310-2) spaced apart from each other. The first and second support substrates (310-1, 310-2) may be formed symmetrically. In another embodiment, the first support substrate (310-1) and the second support substrate (310-2) may be a single substrate formed integrally. In yet another embodiment, the support substrate (310) may include three or more support substrates.

[0237] The first and second support substrates (310-1, 310-2) may be disposed on both sides of the first circuit board (250). For example, the first support substrate (310-1) may include a first body (86) and at least one terminal portion (7A, 7B) extending from the first body (86). The at least one terminal portion (7A, 7B) of the first support substrate (310-1) may include a plurality of terminals (311). The second support substrate (310-2) may include a second body (87) and at least one terminal portion (7C, 7D) extending from the second body (87). The at least one terminal portion (7C, 7D) of the second support substrate (310-2) may include a plurality of terminals (311).

[0238] The first circuit board (250) may include a first side (33A) and a second side (33B) located opposite each other, and a third side (33C) and a fourth side (33D) located between the first side (33A) and the second side (33B) and opposite each other.

[0239] For example, the first connecting part (320A) can connect the first body (86) and the first side (33A) of the first circuit board (250), and the second connecting part (320B) can connect the second body (87) and the second side (33B) of the first circuit board (250).

[0240] The first body (86) may include a first part (6A) corresponding to or opposite to the first side (33A) of the first circuit board (250), a second part (6B) corresponding to a part (or one side) of the third side (33C) of the first circuit board (250), and a third part (6C) corresponding to a part (or one side) of the fourth side (33D) of the first circuit board (250). Additionally, the first body (86) may include a first bending part (6D) that connects one end of the first part (6A) and the second part (6B) and is bent from one end of the first part (6A), and a second bending part (6E) that connects the other end of the first part (6A) and the third part (6C) and is bent from the other end of the first part (6A).

[0241] For example, the first support substrate (310-1) may include a first terminal portion (7A) and a second terminal portion (7B). For example, the first terminal portion (7A) may extend or protrude from the second portion (6B) of the first body (86) toward the substrate portion (800), and the second terminal portion (7B) may extend or protrude from the third portion (6C) of the first body (86) toward the substrate portion (800). The first terminal portion (7B) may be located on the opposite side of the first terminal portion (7A) with the substrate portion (255) (e.g., the first circuit board (250)) in between. For example, the first connecting portion (320A) may connect the first portion (6A) of the first body (86) and the first side portion (33A) of the first circuit board (250). The first connecting part (320A) may include a bent portion.

[0242] The second body (87) may include a first part (9A) corresponding to or opposite to the second side (33B) of the first circuit board (250), a second part (9B) corresponding to or opposite to another part (or other side) of the third side (33C) of the first circuit board (250), and a third part (9C) corresponding to or opposite to another part (or other side) of the fourth side (33D) of the first circuit board (250). Additionally, the second body (87) may include a first bending part (9D) that connects one end of the first part (9A) and the second part (9B) and is bent from one end of the first part (9A), and a second bending part (9E) that connects the other end of the first part (9A) and the third part (9C) and is bent from the other end of the first part (9A).

[0243] For example, the second support substrate (310-2) may include a third terminal portion (7C) and a fourth terminal portion (7D). The third terminal portion (7C) may extend or protrude from the second part (9B) of the second body (87) toward the substrate portion (800), and the fourth terminal portion (7D) may extend or protrude from the third part (9C) of the second body (87) toward the substrate portion (800). The fourth terminal portion (7D) may be located on the opposite side of the third terminal portion (7C) with the substrate portion (255) (e.g., the first circuit board (250)) in between. For example, the second connecting portion (320B) may connect the first part (9A) of the second body (87) and the second side (33B) of the first circuit board (250). The second connecting portion (320B) may include a bent portion.

[0244] Referring to FIG. 15a and FIG. 17b, for example, terminals (P1 to P4) for electrically connecting to terminals (B1 to B4) of terminal portion (95) of the first substrate (190A) of the AF driving unit (100) may be formed in the terminal portion (e.g., 7A, 7C) of the support substrate (310). Each of the terminals (B1 to B4) of the terminal portion (95) of the first substrate (190A) may be electrically connected to any one of the corresponding terminals (P1 to P4) of the terminal portion (7A, 7C) of the support substrate (310) by means of solder or conductive adhesive. In addition, since the terminal (311) of the support substrate (310) is electrically connected to the terminal (800B) of the substrate portion (800), the terminal portion (95) of the first substrate (190A) of the AF driving unit (100) can be electrically connected to the terminal (800B) of the substrate portion (800) through the support substrate (310).

[0245] Referring to FIG. 15b and FIG. 16c, terminal portions (e.g., 7B, 7D) of the support substrate (310) may have terminals (M1 to M5) formed therein to be electrically connected to terminal portions (R1 to R5) of terminal portions (97) of the second substrate (190B) of the AF driving unit (100).

[0246] Each of the terminals (R1 to R5) of the terminal portion (97) of the second substrate (190B) can be electrically connected to any one of the corresponding terminals (M1 to M5) of the terminal portion (7B, 7D) of the support substrate (310) by means of solder or conductive adhesive. Additionally, since the terminal (311) of the support substrate (310) is electrically connected to the terminal (800B) of the substrate portion (800), the terminal portion (97) of the second substrate (190B) of the AF driving unit (100) can be electrically connected to the terminal (800B) of the substrate portion (800) through the support substrate (310).

[0247] Referring to FIG. 15a, the circuit member (310A) of the support substrate (310) may include a first insulating layer (29A), a second insulating layer (29B), and a conductive layer (29C) formed between the first insulating layer (29A) and the second insulating layer (29B). The conductive layer (29C) may be a wiring layer for transmitting electrical signals. For example, the second layer (29B) may be located outside the first layer (29A). Each of the first and second insulating layers (29A, 29B) may be formed of an insulating material, such as polyimide or solder resist, and the conductive layer (29C) may be formed of a conductive material, such as copper, gold, or aluminum, or an alloy containing copper, gold, or aluminum.

[0248] The elastic portion (310B) of the support substrate (310) may be disposed on the second layer (29B). The elastic portion (310B) may be formed of an alloy comprising at least one of copper, titanium, or nickel, or an alloy comprising at least one of copper, titanium, or nickel, to serve as a spring. For example, the elastic portion (310B) may be formed of an alloy of copper and titanium or an alloy of copper and nickel. For example, the elastic portion (310B) may be electrically connected to the ground of the substrate portion (255) or the substrate portion (800), and the elastic portion (310B) may be used for impedance matching of the transmission line (or wiring) of the substrate portion (255, 310, 800), and through impedance matching, the loss of the transmission signal may be reduced, thereby reducing the influence of noise. For example, the matching impedance may be 40 ohms to 600 ohms. For example, the matching impedance may be 50 ohms. For example, an EMI member (e.g., EMI tape) or a conductive member (e.g., conductive tape) may be used for impedance matching.

[0249] The support substrate (310) may include a metal member or a conductive member on its outer surface. For example, the metal member may be an EMI member (e.g., EMI tape) or a conductive member (e.g., conductive tape). For example, the EMI member or the conductive member may be placed or attached to at least one of the elastic member (310B) or the circuit member (310A). The support substrate (310) may further include a protective material or an insulating material that wraps around or covers the elastic member (310B).

[0250] Referring to FIG. 9, the holder (270) may include first to fourth sides corresponding to or opposite to the first to fourth sides (33A to 33D) of the first circuit board (250).

[0251] The first and second sides of the holder (270) may be positioned opposite each other in a second horizontal direction (e.g., Y-axis direction) or on opposite sides. Additionally, the third and fourth sides of the holder (270) may be positioned opposite each other in a first horizontal direction (e.g., X-axis direction) or on opposite sides.

[0252] At least a portion of the support substrate (310) may be attached to or coupled to the holder (270). For example, at least one connecting portion (320A, 320B) of the support substrate (310) may be coupled to at least one of the first to fourth sides of the holder (270) by means of an adhesive.

[0253] The first connecting part (320A) can be coupled, attached, or fixed to the first side of the holder (270) by means of an adhesive, and the second connecting part (320B) can be coupled, attached, or fixed to the second side of the holder (270).

[0254] A first protrusion (27A) may be formed on the first side of the holder (270), and a second protrusion (27B) may be formed on the second side of the holder (270). A support substrate (310) may be coupled, attached, or fixed to the protrusions (27A, 27B) of the holder (270). A support substrate (310) may be coupled, attached, or fixed to the outer surface (or inner surface) of the protrusions (27A, 27B) of the holder (270).

[0255] A portion of the support substrate (310) may be coupled, attached, or fixed to the first protrusion (27A) and the second protrusion (27B) of the holder (270). The body (86, 87) of the support substrate (310) may be coupled, attached, or fixed to the first and second protrusions (27A, 27B) of the holder (270). For example, at least a portion of the first connecting portion (320A) may be coupled to the first protrusion (27A) of the holder (270). At least a portion of the second connecting portion (320B) may be coupled to the second protrusion (27B) of the holder (270).

[0256] For example, the first support substrate (310-1) may be coupled, attached, or fixed to the first protrusion (27A), and the second support substrate (310-2) may be coupled, attached, or fixed to the second protrusion (27B). For example, the first part (6A) of the first body (86) may be coupled, attached, or fixed to the outer surface (or inner surface) of the first protrusion (27A), and the first part (9A) of the second body (87) may be coupled, attached, or fixed to the outer surface (or inner surface) of the second protrusion (27B).

[0257] The base (210) may include first to fourth sides that correspond to or oppose the first to fourth sides (33A to 33D) of the first circuit board (250). Additionally, the first to fourth sides of the base (210) may correspond to or oppose the first to fourth sides of the holder (270). The first and second sides of the base (210) may be positioned opposite each other in a second horizontal direction (e.g., Y-axis direction) or on opposite sides. Additionally, the third and fourth sides of the base (210) may be positioned opposite each other in a first horizontal direction (e.g., X-axis direction).

[0258] At least a portion of the support substrate (310) may be coupled, attached, or fixed to the base (210). For example, the body (86, 87) of the support substrate (310) may be coupled to the base (210) by an adhesive. For example, a portion of the body (86, 87) of the support substrate (310) connected to the terminal portions (7A to 7D) may be coupled to the base (210).

[0259] For example, at least a portion of the support substrate (310) may be coupled, attached, or fixed to the protrusions (216A, 216B) formed on the base (210). For example, the support substrate (310) may be coupled, attached, or fixed to the outer surface (or inner surface) of the protrusions (216A, 216B) of the base (210). A first protrusion (216A) may be formed on the third side of the base (210), and a second protrusion (216B) may be formed on the fourth side of the base (210).

[0260] For example, the body (86, 87) of the support substrate (310) may be coupled, attached, or fixed to the first and second protrusions (216A, 216B) of the base (210). For example, one end of the first support substrate (310-1) (e.g., the second part (6B)) may be coupled, attached, or fixed to one area of ​​the first protrusion (216A) of the base (210), and the other end of the first support substrate (310-1) (e.g., the third part (6C)) may be coupled, attached, or fixed to one area of ​​the second protrusion (216B) of the base (210). For example, one end of the second support substrate (310-2) (e.g., the second part (9B)) may be coupled, attached, or fixed to another part of the first protrusion (216A) of the base (210), and the other end of the second support substrate (310-2) (e.g., the third part (9C)) may be coupled, attached, or fixed to another part of the second protrusion (216B) of the base (210).

[0261] A first coupling area (69A) may be formed between the first body (86) of the first support substrate (310-1) and the first protrusion (27A) of the holder (270), and a second coupling area (69B) may be formed between the second body (87) of the second support substrate (310-2) and the second protrusion (27B) of the holder (270).

[0262] Additionally, a third coupling region (59A) may be formed between one end of each of the first and second support substrates (310-1, 310-2) and the first protrusion (216A) of the base (210). A fourth coupling region (59B) may be formed between the other end of each of the first and second support substrates (310-1, 310-2) and the second protrusion (216B) of the base (210), and

[0263] By means of the support substrate (310) and the first to fourth bonding regions (69A, 69B, 59A, 59B), the OIS moving part can be elastically supported with respect to the fixed part. The terminals (311) of the support substrate (310) can be bonded to the terminals (800B) of the substrate part (800) by solder or conductive adhesive and can be electrically connected.

[0264] A camera device according to another embodiment may include a support member that replaces the support substrate (310). For example, the support member may be a spring, a wire, a shape memory alloy, or a ball member. For example, the support member may include one or more wires. The support member may connect the substrate portion (255) (e.g., the second circuit board (260)) and the substrate portion (800) (or base (210)) to each other. For example, one end of each of the plurality of wires may be connected to the substrate portion (255) (e.g., the second circuit board (260)), and the other end of each of the plurality of wires may be connected to the substrate portion (800) (or base (210)).

[0265] A camera device according to another embodiment may include a support member separately from the support substrate (310). In this case, the support member may be, for example, a spring, a wire, a shape memory alloy, or a ball member. For example, the support member may be formed from one wire or two or more wires. For example, the support member may include a plurality of wires disposed on at least one of the corners and sides of the base (210) or the substrate portion (800). For example, one end of the support member (e.g., wire) may be coupled to an upper elastic member (150). For example, one end of the support member (e.g., wire) may be coupled to an outer frame (152) of the upper elastic member (150). For example, the other end of the support member (e.g., wire) may be coupled to a holder (270). Or, for example, the other end of the support member may be coupled to a terminal portion that is coupled to the holder (270).

[0266] The substrate portion (410) may be positioned between the AF driving portion and the OIS moving portion. The substrate portion (410) may be positioned between the housing (140) and the holder (270). For example, the substrate portion (410) may be positioned between the housing (140) and the plate (420). The substrate portion (410) may be coupled to the housing (140).

[0267] Referring to FIGS. 11a through 12b, the substrate portion (410) may be electrically connected to a shape memory alloy member (45) and may supply a driving signal to the shape memory alloy member (45). The substrate portion (410) may be expressed as "substrate," "circuit board," "board," "driving portion," or "driving board." The substrate portion (410) may include a body (411), an extension portion (412) connected to the body (411), and a terminal portion (98) disposed on the extension portion (412).

[0268] The body (411) may have a polygonal shape or a plate shape. The body (411) may include an opening (410A) corresponding to or opposite to the opening of the bobbin (110) or the lens module (400). For example, the opening (410A) may be a through hole penetrating the body (411) in the direction of the optical axis.

[0269] The extension portion (412) may extend from the body (411) in the direction of the optical axis. For example, the extension portion (412) may extend from the outer surface of the body (411) in an upward direction or toward the housing (140). For example, a bent portion may be included between the extension portion (412) and the body (411). For example, the extension portion (412) may be bent upward from the outer surface of the body (411).

[0270] For example, at least a portion of the extension (412) may pass through the side of the housing (140) on which the second substrate (190B) is placed. The terminals (3A to 3E) of the extension (412) may be exposed from the upper surface of the housing (140) for electrical connection (e.g., soldering) with the terminals (Q1 to Q5) of the substrate (190B). The extension (412) may be placed inside the first portion (192A) of the second substrate (190B).

[0271] Since the extension portion (412) extends in an upward direction or toward the terminal portion (96) of the second substrate (190B), electrical coupling or connection between the extension portion (412) and the terminal portion (98) by solder or conductive adhesive can be facilitated. The extension portion (412) may be referred to as a "terminal surface" or a "terminal plate." For example, the extension portion (412) may be located in the middle or central area of ​​any one outer surface of the body (411). The terminal portion (98) of the substrate portion (410) may include a plurality of terminals (3A to 3E) corresponding to the terminals (Q1 to Q5) of the second substrate (190B). Each of the plurality of terminals (3A to 3E) of the substrate portion (410) can be joined to any one of the corresponding terminals (Q1 to Q5) of the second substrate (190B) by solder or conductive adhesive and can be electrically connected.

[0272] In the embodiment, the terminal portion (96) formed on the extension portion (412) of the substrate portion (410) which is electrically connected to the shape memory alloy member (450) can be electrically connected to the terminal portion (96) of the circuit board (190B) by soldering. At this time, the materials of the substrate portion (410), the terminal portion (96), and the terminal portion (98) of the extension portion (412) can be unified, and the pitch or width of the terminals of each terminal portion (96, 98) can be made identical. As a result, soldering between the substrate portion (410), the terminal portion (96), and the terminal portion (98) of the extension portion (412) can be facilitated, solderability can be improved, and electrical connection characteristics can be improved. Furthermore, by improving solderability and electrical connection characteristics, the manufacturing process quality and productivity of the camera device can be improved.

[0273] The substrate portion (410) may include at least one coupling portion (413) for coupling with the housing (140). The coupling portion (413) may be coupled to the housing (140) by an adhesive. The coupling portion (413) may be connected to the outer surface of the body (411) of the substrate portion (410) and may be bent and extended in a direction toward the housing (410) from the outer surface of the body (411). For example, the coupling portion (413) may include a plurality of coupling portions (413A to 413D) that are connected to the outer surface of the body (411) and spaced apart from each other. For example, the coupling portion (413) and the body (411) may be perpendicular to each other, but in other embodiments, the angle formed by the two may be an acute angle or an obtuse angle.

[0274] Additionally, for example, at least a portion of the body (411) may be joined to the housing (140). For example, at least a portion of the upper surface of the body (411) may be joined to the lower surface of the housing (140) by means of an adhesive. For example, the joining portion (413) may be expressed as an "extension portion" or a "protrusion portion." The joining portion (413) can improve the bonding force between the substrate portion (410) and the housing (140), and the substrate portion (410), to which one end of the shape memory alloy member (45) is joined, can be stably joined to the housing (140), which is the fixed portion, thereby enabling stable OIS driving or hand tremor correction.

[0275] One end of the shape memory alloy member (45) can be coupled to the substrate portion (410). For example, the substrate portion (410) may include a coupling portion (415A, 415B) coupled to one end of the shape memory alloy member (45). Referring to FIG. 11a, the substrate portion (410) may include a first coupling portion (415A) and a second coupling portion (415B) disposed on the lower surface of the body (411). The first and second coupling portions (415A, 415B) of the substrate portion (410) may correspond to a fixed portion.

[0276] For example, each of the first coupling part (415A) and the second coupling part (415B) may protrude downward from the lower surface of the body (411) of the substrate part (410) or in a direction toward the holder (270). For example, the lower surface of each of the first and second coupling parts (415A, 415B) may have a step difference with the lower surface of the body (411) in the direction of the optical axis. For example, the lower surface of each of the first and second coupling parts (415A, 415B) may be located below the lower surface of the body (411). Each of the first and second coupling parts may be electrically connected to the body (411) and may be electrically connected to the terminal part (98) of the extension part (412).

[0277] For example, the first coupling part (415A) may be positioned at the first corner (81A) of the substrate part (410) (or body (411)), and the second coupling part (415B) may be positioned at the second corner (81B) of the substrate part (410) (or body (411)). The first corner (81A) and the second corner (81B) of the substrate part (410) may be located opposite each other in the first diagonal direction of the substrate part (410) with respect to the optical axis.

[0278] The first and second coupling parts (415A, 415B) of the substrate part (410) can serve to maintain an air gap between the substrate part (410) (e.g., body 411) and the holder (270) (or plate (420)), thereby allowing the OIS moving part to move smoothly and easily by the shape memory alloy member (45). Additionally, the first and second coupling parts (415A, 415B) of the substrate part (410) can serve as a stopper to prevent the lower surface of the substrate part (410) (e.g., body (411)) from directly colliding with the holder (270).

[0279] The plate (420) can support the OIS moving part with respect to the fixed part. For example, at least a portion of the plate (420) may be coupled to the OIS moving part (e.g., holder (270)), and at least another portion of the plate (420) may be coupled to the fixed part (e.g., housing (140) or substrate part (410)). The plate (420) may be expressed as a "support part," "moving plate," "support plate," "conducting part," "elastic member," or "conducting plate."

[0280] Referring to FIG. 13, FIG. 14a, and FIG. 14b, the plate (420) may include an inner portion (421, or "first portion") coupled to a holder (270), an outer portion (422, or "second portion") coupled to a fixing portion, and a connecting portion (423, or "third portion") connecting the inner portion (421) and the outer portion (422).

[0281] The inner portion (421) may include an opening (420A) corresponding to or opposite to the lens module (400) or bobbin (110). The opening (420A) of the inner portion (421) may correspond to or opposite to the opening (70) of the holder (270). For example, the opening (240A) of the inner portion (421) may be a through hole penetrating the inner portion (421) in the direction of the optical axis. In another embodiment, the inner portion (421) may be coupled to the substrate portion (255).

[0282] Referring to FIG. 12a, for example, the lower surface of the inner portion (421) may be coupled with the upper surface (270A) of the holder (270). The upper surface (270A) of the holder (270) may include a first surface (55A) and a second surface (55B) having a step difference from the first surface (55A). The second surface (55B) may be positioned higher than the first surface (55A). The second surface may protrude in the direction of the optical axis, the upward direction, or the direction toward the substrate portion (410) relative to the first surface. For example, the lower surface of the inner portion (421) may be coupled with the second surface (55B) of the upper surface (270A) of the holder (270).

[0283] For example, a groove (271) may be formed on the upper surface (270A) of the holder (270) to which an adhesive is applied or placed to join the inner portion (421) and the holder (270). For example, the groove (271) may be formed on the second surface (55B) of the upper surface (270A) of the holder (270).

[0284] The outer part (422) can be coupled with the substrate part (410). The outer part (422) can be electrically connected to the substrate part (410). The outer part (422) may include at least one hole (422A, 422B) for coupling with the substrate part (410). For example, the hole (422A, 422B) of the outer part (422) can be coupled to the lower surface of the body (411) of the substrate part (410) by means of an adhesive. In another embodiment, the outer part (422) may be coupled with the housing (140). The connecting part (423) may be formed to be bent or curved (or curved) at least once to form a pattern of a certain shape.

[0285] Referring to FIG. 14a, the plate (420) may include a connecting portion (423A, 423B) that is connected to the other end of the shape memory alloy member (45). For example, the inner portion (421) of the plate (420) may include the connecting portion (423A, 423B). The connecting portion (423A, 423B) of the plate (420) may be connected to a holder (270). For example, the connecting portion (423A, 423B) may include a clamp for connecting to the end of the shape memory alloy member (45).

[0286] For example, the first coupling portion (423A) and the second coupling portion (423B) of the plate (420) may each protrude downward from the lower surface of the elastic member (e.g., the inner portion (421)) or in a direction toward the holder (270). For example, the lower surface of each of the first and second coupling portions (423A, 423B) may have a step difference with respect to the lower surface of the inner portion (421) in the direction of the optical axis. For example, the lower surface of each of the first and second coupling portions (423A, 423B) may be located below the lower surface of the inner portion (421). Each of the first and second coupling portions (423A, 423B) may be electrically connected to the terminal portion (98) of the extension portion (412) through the shape memory alloy member (45).

[0287] The plate (420) may include a first coupling part (423A) corresponding to or opposite the third corner (81C) of the substrate part (410) (or body (411)) and a second coupling part (423B) corresponding to or opposite the fourth corner (81D) of the substrate part (410) (or body (411)). The third corner (81C) and the fourth corner (81D) of the substrate part (410) may be located opposite each other in the second diagonal direction of the substrate part (410) with respect to the optical axis. The second diagonal direction may be a different direction from the first diagonal direction. The second diagonal direction and the first diagonal direction may intersect each other. For example, the first diagonal direction and the second diagonal direction may be perpendicular to each other.

[0288] For example, the first connecting portion (423A) and the second connecting portion (423B) of the plate (420) may be connected to the first surface (55A) of the upper surface (270A) of the holder (270). For example, the lower surfaces of each of the first connecting portion (423A) and the second connecting portion (423B) may be connected to the first surface (55A) of the upper surface (270A) of the holder (270) by means of an adhesive.

[0289] The plate (420) may include a relief portion that is spatially separated from the coupling portion (415A, 415B) of the substrate portion (410). For example, the outer portion (422) of the plate (420) may include a relief portion that is spatially separated from the coupling portion (415A, 415B) of the substrate portion (410) in the direction of the optical axis. For example, the coupling portion (415A, 415B) of the substrate portion (410) in the direction of the optical axis may correspond to, oppose, or overlap with the first surface (55A) of the upper surface (270A) of the holder (270).

[0290] The plate (420) may be electrically connected to the substrate portion (410). For example, the outer portion (422) of the plate (420) may be electrically connected to the substrate portion (410) by solder or conductive adhesive. For example, the substrate portion (410) may include a pad or terminal (not shown) that is electrically connected to the plate (420) (e.g., the outer portion (422)). For example, the substrate portion (410) may include a pad or terminal that is electrically connected to the outer portion (422) of the plate (420) and disposed on the lower surface of the body (411), and the plate (420) may be electrically connected to any one of the terminals of the substrate portion (410) (e.g., 3E).

[0291] The plate (420) may be made of a conductive material, for example, a metal material. For example, the plate (420) may be formed of a plate spring, etc. Also, for example, the plate (420) may be a non-magnetic material to prevent the plate (420) from blocking the magnetic field of the magnet (130) from reaching the second position sensor (240). For example, the plate (420) may be formed of a non-magnetic material.

[0292] Additionally, in order to prevent the second position sensor (240) from being obstructed from detecting the magnetic field or magnetic flux of the magnet (130) by the plate (420), the plate (420) may be structured to be separated from at least one of the second position sensor (240) and the magnet (130) in the optical axis direction. For example, at least a portion of the second position sensor (240) and at least a portion of the magnet (130) may not overlap with the plate (420) in the optical axis direction.

[0293] For example, at least a portion of the second position sensor (240) and at least a portion of the magnet (130) that do not overlap with the plate (420) in the optical axis direction may overlap with each other in the optical axis direction. In another embodiment, the plate (420) may be a magnetic material.

[0294] The shape memory alloy member (45) can move the OIS moving part (or OIS movable part) in a direction perpendicular to the optical axis, such as a first horizontal direction (e.g., X-axis direction) and a second horizontal direction (e.g., Y-axis direction) due to expansion and contraction. Additionally, the shape memory alloy member (45) can rotate or tilt the OIS moving part (or OIS movable part) clockwise or counterclockwise by a preset angle relative to the optical axis due to expansion and contraction.

[0295] The shape memory alloy member (45) may include a shape memory alloy (SMA). A shape memory alloy is an alloy that returns to its original shape, which is stored at a specific temperature, even if it is deformed into a different shape. For example, the shape memory alloy member (45) may be a conductive member formed from a conductive material. For example, the shape memory alloy member (45) may be an alloy comprising at least one of Ti, Ni, Cu, Fe, Au, Zn, Mn, Ag, or Cd. The shape memory alloy member (45) may be a wire, but in other embodiments, the shape memory alloy member (45) may be in the form of a plate.

[0296] The shape memory alloy member (45) can be connected to a fixed part and an OIS moving part. For example, one end of the shape memory alloy member (45) can be connected to the fixed part, and the other end of the shape memory alloy member (45) can be connected to the OIS moving part. For example, one end of the shape memory alloy member (45) can be connected to the connecting part (415A, 415B) of the substrate part (410) which is the fixed part, and the other end of the shape memory alloy member (45) can be connected to the connecting part (423A, 423B) of the inner part (421) of the plate (420) which is connected to the holder (270) which is the moving part.

[0297] The shape memory alloy member (45) may include a first member (45A), a second member (45B), a third member (45C), and a fourth member (45D). In FIG. 12a, the shape memory alloy member (45) includes four independent shape memory alloy wires, but in other embodiments, the shape memory alloy member may include five or more independent shape memory alloy wires.

[0298] Referring to FIG. 14a, one end of the first member (45A) can be coupled to the first corner (81A) of the substrate portion (410), and the other end of the first member (45A) can be coupled to the first part of the plate (420) (e.g., the first part of the inner portion (421)) corresponding to, opposite to, or overlapping the third corner (81C) of the substrate portion (410). One end of the second member (45B) can be coupled to the second corner (81B) of the substrate portion (410), and the other end of the second member (45B) can be coupled to the second part of the plate (420) (e.g., the second part of the inner portion (421)) corresponding to, opposite to, or overlapping the fourth corner (81D) of the substrate portion (410). One end of the third member (45C) can be coupled to the second corner (81B) of the substrate portion (410), and the other end of the third member (45C) can be coupled to the first part of the plate (420) (e.g., the first part of the inner portion (421)). One end of the fourth member (45D) can be coupled to the first corner (81A) of the substrate portion (410), and the other end of the fourth member (45D) can be coupled to the second part of the plate (420) (e.g., the second part of the inner portion (421)).

[0299] For example, one end of the first member (45A) may be coupled to the first coupling portion (415A) of the substrate portion (410). For example, one end of the first member (45A) may be electrically connected to the first coupling portion (415A) of the substrate portion (410). Also, for example, the other end of the first member (45A) may be coupled to the first coupling portion (423A) of the plate (420). For example, the other end of the first member (45A) may be electrically connected to the first coupling portion (423A) of the plate (420). For example, one end of the first member (45A) may be electrically connected to the first terminal (3A) among the terminals (3A to 3E) of the substrate portion (410).

[0300] For example, one end of the second member (45B) may be coupled to the second coupling portion (415B) of the substrate portion (410). One end of the second member (45B) may be electrically connected to the second coupling portion (415B) of the substrate portion (410). Also, for example, the other end of the second member (45B) may be coupled to the second coupling portion (423B) of the plate (420). The other end of the second member (45B) may be electrically connected to the second coupling portion (423B) of the plate (420). For example, one end of the second member (45B) may be electrically connected to the second terminal (3B) among the terminals (3A to 3E) of the substrate portion (410).

[0301] For example, one end of the third member (45C) may be coupled to the second coupling portion (415B) of the substrate portion (410). The other end of the third member (45C) may be electrically connected to the second coupling portion (415B) of the substrate portion (410). Also, for example, the other end of the third member (45C) may be coupled to the first coupling portion (423A) of the plate (420). The other end of the third member (45C) may be electrically connected to the first coupling portion (423A) of the plate (420). For example, one end of the third member (45C) may be electrically connected to the third terminal (3C) among the terminals (3A to 3E) of the substrate portion (410).

[0302] For example, one end of the fourth member (45D) may be coupled to the first coupling portion (415A) of the substrate portion (410). One end of the fourth member (45D) may be electrically connected to the first coupling portion (415A) of the substrate portion (410). Also, for example, the other end of the fourth member (45D) may be coupled to the second coupling portion (423B) of the plate (420). For example, one end of the fourth member (45D) may be electrically connected to the fourth terminal (3D) among the terminals (3A to 3E) of the substrate portion (410).

[0303] The other end of each of the first to fourth members (45A to 45D) can be electrically connected to the plate (420) and can be electrically connected to the fifth terminal (3E) among the terminals (3A to 3E) of the substrate part (410).

[0304] In another embodiment, the plate (420) may be omitted, and the other end of the shape memory alloy member (45) may be coupled to the holder (270). Instead of the coupling portions (423A, 423B) of the plate (420), a terminal or conductive pattern may be disposed on the holder (270) to be electrically connected to the other end of the shape memory alloy member (45). For example, the holder (270) may include a terminal coupled to the holder (270) or inserted into the holder (270) to be electrically connected to the other end of the shape memory alloy member (45). For example, the holder (270) may be provided with a common connection terminal or conductive pattern for the terminals of the first to fourth members (45A to 45D) to be commonly connected.

[0305] The shape memory alloy member (45) can have its resistance and length changed by a driving signal. For example, the shape memory alloy member (45) can have its resistance and length changed by energizing or de-energizing.

[0306] FIG. 19 is a diagram illustrating the relationship between temperature, resistance, and length of a shape memory alloy member (45). Referring to FIG. 19 (a), at a low temperature (e.g., room temperature), the resistance of the shape memory alloy member (45) may have a high resistance value. At this time, the shape memory alloy member (45) may have a first length (L1). Referring to FIG. 19 (b), when a driving signal (e.g., driving current or driving voltage) is applied to the shape memory alloy member (45), the temperature of the shape memory alloy member (45) rises, and at the driving temperature (e.g., 100°C to 110°C), the length of the shape memory alloy member (24) may decrease, and at this time, the shape memory alloy member (45) may have a second length (L2) that is smaller than the first length (L1).

[0307] In this way, the shape memory alloy member (45) can be expanded or contracted by a driving signal, and the OIS moving part coupled to the shape memory alloy member (45) can be moved in a direction perpendicular to the optical axis or tilted by a predetermined angle with respect to the optical axis.

[0308] By controlling the driving signal applied to each of the first to fourth members (45A to 45D) of the shape memory alloy member (45), the degree of expansion or contraction of the shape memory alloy member (45) can be controlled, and thereby, by moving the OIS moving part, a hand tremor correction function can be performed.

[0309] Compared to a comparative example equipped with a magnet and an OIS coil for OIS driving, the embodiment utilizes a shape memory alloy member with low weight and volume instead of a magnet and an OIS coil, so the structure is simple, manufacturing costs are reduced, product size and height can be easily reduced, and the design and engineering freedom of optical devices such as mobile phones can be improved.

[0310] Since a separate OIS magnet different from the AF magnet (130) is not used, magnetic field interference with surrounding components and surrounding products can be minimized, and the manufacturing of dual or triple camera devices can be made easier.

[0311] In addition, the driving force resulting from the expansion or contraction of the shape memory alloy member is about eight times greater than the electromagnetic force between the magnet and the coil, so the current consumption can be reduced, and as a result, the battery life of the optical device can be increased.

[0312] For example, since the shape memory alloy member (45) exhibits strong hysteresis characteristics, the driving signal supplied to the shape memory alloy member (45) may be a Pulse Width Modulation (PWM) signal to minimize this. This allows for a reduction in current consumption and an increase in response speed. For example, the driving frequency of the PWM signal may be 20 [KHz] or higher, which is outside the audible frequency range. In another embodiment, the control unit (830) may generate a DC current as a driving signal and supply it to each of the first to fourth members (45A to 45D). Since the driving temperature of the shape memory alloy member (45) is, for example, 100°C to 110°C, heat may be generated from the shape memory alloy member (45), and since the plate (420) is connected to the shape memory alloy member (45), the heat of the shape memory alloy member (45) can be easily released by the plate (420).

[0313] The control unit (830) can generate four driving signals to drive the first to fourth members (45A, 45D). Referring to FIG. 16c, the four driving signals generated by the control unit (830) can be supplied to a support substrate (310) that is electrically connected to the substrate unit (800). The four driving signals supplied to the support substrate (310) can be supplied to the second substrate (190B) through the terminals (M1 to M5) of the terminal unit (7B, 7D) of the support substrate (310) and the terminals (R1 to R5) of the second substrate (190B).

[0314] Referring to FIGS. 16b and 16c, a driving signal can be supplied from terminals (M1 to M5) of a support substrate (310) to a second substrate (190B), and the driving signals supplied to the second substrate (190B) can be supplied to terminals (3A to 3E) of a substrate portion (410) through terminals (Q1 to Q5) of the second substrate (190B).

[0315] A first driving signal can be supplied to a first member (45A) through a first terminal (3A) of the substrate (410), a second driving signal can be supplied to a second member (45B) through a second terminal (3B) of the substrate (410), a third driving signal can be supplied to a third member (45C) through a third terminal (3C) of the substrate (410), and a fourth driving signal can be supplied to a fourth member (45D) through a fourth terminal (3D) of the substrate (410). For example, a fifth terminal (3E) of the substrate (410) may be a common ground terminal for the first to fourth members (45A to 45D).

[0316] Each of the first to fourth driving signals may be an individual or independent signal. Additionally, for example, each of the first to fourth driving signals may be a PWM signal to increase response speed and reduce power consumption. In another embodiment, each of the first to fourth driving signals may include at least one of a direct current or alternating current signal.

[0317] In addition, in another embodiment, when performing OIS driving, e.g., X-axis movement, Y-axis movement, and rotation, at least two of the first to fourth driving signals may be supplied simultaneously to at least two of the first to fourth members (45A to 45D) to eliminate crosstalk between signals. And by controlling the strength of the first to fourth driving signals, X-axis movement, Y-axis movement, or rotation operation can be performed. In the driving range (or driving temperature range (e.g., 100°C to 110°C) of the shape memory alloy member (45), if the strength of the current of the driving signal increases, the shape memory alloy member (45) may contract and its length may decrease. On the other hand, if the strength of the current of the driving signal decreases, the shape memory alloy member (45) may expand and its length may increase.

[0318] Referring to FIG. 14b, the case in which the OIS moving part is moved in a first horizontal direction (e.g., X-axis direction) is described. In FIG. 14b, the first and second connecting parts (415A and 415B) of the substrate part (410) are fixed parts, and the first and second connecting parts (423A, 423B) of the plate (420) may correspond to moving parts.

[0319] Referring to FIG. 14b, in order to move the OIS moving part in the -X axis direction, the third driving signal can be controlled so that the third member (45C) contracts, and the fourth driving signal can be controlled so that the fourth member (45D) expands. On the other hand, in order to move the OIS moving part in the +X axis direction, the fourth driving signal can be controlled so that the fourth member (45D) contracts, and the third driving signal can be controlled so that the third member (45C) expands. For example, the range of shift (or stroke) of the OIS moving part in the +X axis direction (or -X axis direction) from the origin (or initial position) may be 80 μm to 400 μm. Or, for example, the range of shift (or stroke) of the OIS moving part in the +X axis direction (or -X axis direction) may be 100 μm to 200 μm.

[0320] Next, the case in which the OIS moving part is moved in the +Y axis direction is described. To move the OIS moving part in the +Y axis direction, the second driving signal can be controlled so that the second member (45B) contracts, and the first driving signal can be controlled so that the first member (45A) expands. On the other hand, to move the OIS moving part in the -Y axis direction, the first driving signal can be controlled so that the first member (45A) contracts, and the second driving signal can be controlled so that the second member (45B) expands. For example, the range of shift (or stroke) of the OIS moving part in the +Y axis direction (or -Y axis direction) from the origin (or initial position) may be 80 μm to 400 μm. Or, for example, the range of shift (or stroke) of the OIS moving part in the +Y axis direction (or -Y axis direction) may be 100 μm to 200 μm.

[0321] Next, the case in which the OIS moving part is rotated with respect to the optical axis is described. To rotate the OIS moving part counterclockwise, the third and fourth driving signals can be controlled so that both the third and fourth members (45C, 45D) are retracted. Alternatively, to rotate the OIS moving part clockwise, the first and second driving signals can be controlled so that both the first and second members (45A, 45B) are expanded. Furthermore, to rotate the OIS moving part clockwise, the first and second control signals can be controlled so that both the first and second members (45A, 45B) are retracted. Alternatively, to rotate the OIS moving part clockwise, the third and fourth control signals can be controlled so that both the third and fourth members (45C, 45D) are expanded. For example, the range of the rotation angle of the OIS moving part clockwise or counterclockwise may be 0.3 to 3 degrees. Or, for example, the range of the rotation angle of the OIS moving part may be 0.5 to 1.5 degrees.

[0322] The image sensor unit (350) may include at least one of a controller (830), a memory (512), and a capacitor (514). The controller (830) may be spaced apart from the substrate unit (255). For example, the controller (830) may be placed on the substrate unit (800). The memory (512) may be placed on at least one of the substrate unit (255) and the substrate unit (800). For example, the memory (512) may be placed or mounted in the first region (801) of the substrate unit (800). For example, the memory (512) may be spatially avoided or spaced apart from the second heat dissipation member (380). For example, the second heat dissipation member (380) may include an escape groove or opening to avoid spatial interference with the memory (512), and the memory (512) may be placed within the escape groove or opening of the second heat dissipation member (380). The capacitor (514) may be placed in at least one of the substrate portion (255) and the substrate portion (800).

[0323] The memory (512) can store a first data value (or code value) corresponding to the output of the second position sensor (240) according to the displacement (or stroke) of the OIS moving part in a direction perpendicular to the optical axis (e.g., X-axis direction or Y-axis direction) for OIS feedback driving. Additionally, the memory (512) can store a second data value (or code value) corresponding to the output of the first position sensor (170) according to the displacement (or stroke) of the bobbin (110) in a first direction (e.g., optical axis direction or Z-axis direction) for AF feedback driving.

[0324] For example, each of the first and second data values ​​may be stored in memory (512) in the form of a lookup table. Alternatively, each of the first and second data values ​​may be stored in memory (512) in the form of a mathematical formula or an algorithm. Additionally, memory (512) may store a mathematical formula, an algorithm, or a program for the operation of the control unit (830). For example, memory (512) may be a non-volatile memory, such as an EEPROM (Electrically Erasable Programmable Read-Only Memory).

[0325] The control unit (830) may be located on the outside of the cover member (300) or in a region of the substrate unit (800) located outside the cover member (300). For example, the control unit (830) may be located in an extended region (808) of the substrate unit (800). The extended region (808) may be located on the outside of the cover member (300) or outside the cover member (300). The extended region (808) may be referred to as a "fourth region," "protruding region," "extended part," or "protruding part." In the direction of the optical axis, the extended region (808) may not overlap with the AF moving part and the OIS moving part. For example, the extension area (808) may extend from the first side of the first area (801) in the same direction as the third area (803) (e.g., the second horizontal direction), thereby reducing the area occupied by the camera device (10) in a direction perpendicular to the optical axis, and the embodiment may minimize the increase in the size of the camera device (10) caused by the extension area (808). In another embodiment, the extension area may be connected to the first side of the first area (801) of the substrate portion (800) and any one of the other sides, or may protrude from any one of the other sides of the first area (801).

[0326] The control unit (830) may be located outside the cover member (300) or outside the cover member (300). For example, the control unit (830) may be located outside the space formed by the cover member (300), the base (210), and the first region (801) of the substrate member (800). For example, the control unit (830) does not overlap with the lens module (400), the AF moving unit, the OIS moving unit, and the first region (801) of the second substrate member (255) in the direction of the optical axis. At least one capacitor (514) may be disposed or mounted on the upper surface of the extended region (808).

[0327] In a sensor-shift camera device in which the image sensor moves for image stabilization, the substrate of the OIS moving part and the substrate of the fixed part are spaced apart from each other; therefore, it may be vulnerable to dissipating heat generated in the OIS moving part to the outside through the fixed part. The image sensor, shape memory alloy, and control unit may be heat sources. Here, the "control unit" may be a driver IC that controls AF driving or / and OIS driving.

[0328] In the embodiment, the image sensor (810) and the shape memory alloy member (45) are placed in the OIS moving part located inside the cover member (300), and the control unit (830) is placed in the extension part (808) of the substrate part (255) that does not overlap with the image sensor (810) in the direction of the optical axis. As a result, the heat source control unit (830) can be separated or isolated from the image sensor (810) with the cover member (300) and / or the base (210) in between, and can be placed far away from the image sensor (810). Since the heat source control unit (830) is placed outside the cover member (300) and the base (210), heat dissipation can be facilitated. In addition, since the heat source between the control unit (830) and the image sensor (810) is isolated or separated from each other by the cover member (300) and the base (210), the effect of heat generated in the control unit (830) on the image sensor (810) can be significantly reduced.

[0329] The camera device (10) may include a third heat dissipation member (not shown) that is placed, coupled, or attached to an extension area (808) to enhance the heat dissipation effect. The third heat dissipation member may be in contact with the extension area (808). For example, the third heat dissipation member may be placed below the extension area (808). For example, the third heat dissipation member may be placed, coupled, or fixed to the lower surface of the extension area (808). The third heat dissipation member may be a plate-shaped member, and the description of the material of the first heat dissipation member (280) may be applied or inferred to the third heat dissipation member. At least a portion of the third heat dissipation member may overlap with the control unit (830) in the direction of the optical axis.

[0330] The control unit (830) may be electrically connected to the second position sensor (240). The control unit (830) may adjust or control the driving signal provided to the shape memory alloy member (45) using the output signal received from the sensors (240A, 240B, 240C) of the second position sensor (240) and the first data value stored in the memory (512), and may perform a feedback OIS operation. Additionally, the control unit (830) may be electrically connected to the first position sensor (170). For example, when the first position sensor (170) is implemented as a Hall sensor alone, the first position sensor (170) may be electrically connected to the control unit (830). At this time, the control unit (830) may control the driving signal provided to the coil (120) using the output signal of the first position sensor (170) and the second data value stored in the memory (512), and thereby perform a feedback auto-focusing operation.

[0331] The control unit (830) may be implemented in the form of a driver IC, but is not limited thereto. For example, the control unit (830) may be electrically connected to the terminals (800B) of the substrate unit (800). The control unit (830) may control a first position sensor implemented as a Hall sensor alone and / or a second position sensor implemented as a Hall sensor alone. For example, the control unit (830) may supply a driving signal to the first position sensor implemented as a Hall sensor alone and / or the second position sensor implemented as a Hall sensor alone, and may receive an output signal of the first position sensor and / or an output signal of the second position sensor. In another embodiment, the first position sensor may be implemented as a Hall sensor alone, and the second position sensor may be in the form of a driver IC including a Hall sensor, in which case the control unit (830) may be electrically connected to the first position sensor, supply a driving signal to the first position sensor, and receive an output signal from the first position sensor. The control unit (830) may include a driving driver for driving at least one of the first position sensor and the second position sensor.

[0332] The image sensor unit (350) may further include a motion sensor (not shown) disposed on either the substrate unit (255) or the substrate unit (800). The motion sensor may be electrically connected to the control unit (830). The motion sensor may output rotational angular velocity information resulting from the movement of the camera device (10). For example, the motion sensor may be implemented as a 2-axis or 3-axis gyro sensor or an angular velocity sensor. For example, the motion sensor may output information regarding the amount of movement in the X-axis direction, the amount of movement in the y-axis direction, and the amount of rotation resulting from the movement of the camera device (10). In another embodiment, the motion sensor may be omitted from the camera device (10), and if the motion sensor is omitted from the camera device, the camera device (10) may receive position information resulting from the movement of the camera device (10) from the motion sensor provided in the optical device (200A).

[0333] The image sensor unit (350) may further include a filter (610) positioned between the lens module (400) and the image sensor (810). Additionally, the image sensor unit (350) may further include a filter holder (600) for positioning, mounting, or receiving the filter (610). The filter holder (600) may be referred to as a "sensor base." The filter (610) may serve to block or allow light of a specific frequency band from passing through the lens barrel (400) to enter the image sensor (810). For example, the filter (610) may be an infrared blocking filter. For example, the filter (610) may be positioned parallel to the xy plane perpendicular to the optical axis (OA). The filter (610) may be positioned below the lens module (400). The filter holder (600) may be positioned below the AF drive unit (100). For example, the filter holder (600) may be placed on the substrate portion (255). For example, the filter holder (600) may be placed on the upper surface of the second circuit board (260) of the substrate portion (255). The filter holder (600) may be bonded to a region of the second circuit board (260) around the image sensor (810) by an adhesive and may be exposed by an opening (250A) of the first circuit board (250). For example, the opening (250A) of the first circuit board (250) may expose the filter holder (600) placed on the second circuit board (260) and the filter (610) placed on the filter holder (600). The filter holder (600) may have an opening (61A) formed in the portion where the filter (610) is mounted or placed so that light passing through the filter (610) can be incident on the image sensor (810). The opening (61A) of the filter holder (600) may be in the form of a through hole that penetrates the filter holder (600) in the direction of the optical axis. For example, the opening (61A) of the filter holder (600) may penetrate the center of the filter holder (600) and may be positioned to correspond to or opposite the image sensor (810).The filter holder (600) may have a seating portion (500) that is recessed from the upper surface and on which the filter (610) is seated, and the filter (610) may be placed, seated, or mounted on the seating portion (500). The seating portion (500) may be formed to surround the opening (61A). In another embodiment, the seating portion of the filter holder may be in the form of a protrusion that protrudes from the upper surface of the filter.

[0334] The image sensor unit (350) may further include an adhesive disposed between the filter (610) and the mounting unit (500), and the filter (610) may be coupled or attached to the filter holder (600) by the adhesive. In another embodiment, the filter holder may be coupled to the holder (270) or to the AF driving unit (100).

[0335] Referring to FIG. 3, the cover member (300) may be in the form of a box with an open bottom and including a top plate (301) and a side plate (302), and the bottom of the side plate (302) of the cover member (300) may be coupled to the base (210). The shape of the top plate (301) of the cover member (300) may be polygonal, for example, square or octagon. The cover member (300) may have an opening (303) on the top plate (301) that exposes the lens of the lens module (400) coupled to the bobbin (110) to external light. Referring to FIGS. 1 and 3, a groove (304) may be formed in the side plate (302) of the cover member (300) to expose terminal portions (95, 97) of the circuit board (190), terminals (P1 to P4, M1 to M5) of terminal portions (7A, 7C) of the support board (310), terminal (311) of the support board (310), and terminal (800B) of the second circuit board (800).

[0336] For example, the cover member (300) may be formed from a metal material. For example, the cover member (300) may be formed from SUS (Steel Use Stainless) (e.g., SUS 4 series). Also, the cover member (300) may be formed from a cold-rolled steel plate (Steel Plate Cold Commercial, SPC). For example, the cover member (300) may be formed from a SUS material containing 50 percent ([%]) or more of Fe. Also, for example, the surface of the cover member (300) may be plated with an anti-oxidation metal, such as nickel, to prevent oxidation. Also, for example, in another embodiment, the cover member (300) may be formed from a magnetic material or a metal material having magnetism.

[0337] In another embodiment, the cover member (300) may be formed from an injection molded material, such as plastic or resin. Additionally, the cover member (300) may be made of an insulating material or a material that blocks electromagnetic waves.

[0338] The cover member (300) and the base (210) can accommodate the AF drive unit (100) and the OIS mover, protect the AF drive unit (100) and the OIS mover from external impact, and prevent foreign substances from entering from the outside. For example, at the initial position of the OIS mover, the outer surface of the OIS mover, such as the holder (270), can be spaced apart from the inner surface of the base (210) by a predetermined distance. Also, for example, at the initial position of the OIS mover, the lower surface of the holder (270) and the substrate (255) can be spaced apart from the base (210) by a predetermined distance.

[0339] The control unit (830) can supply at least one driving signal to at least one of the members (45A to 45D) of the shape memory alloy member (45), and by controlling at least one driving signal, the OIS moving unit can be moved in the X-axis direction or / and the Y-axis direction, or the OIS moving unit can be rotated, tilted, or rolled within a preset angle range centered on the optical axis.

[0340] The camera device (10) may further include a fourth sensor that overlaps in the optical axis direction with the remaining magnet unit that does not overlap in the optical axis direction with the first to third sensors (240A, 240B, 240C) among the first to fourth magnet units (130-1 to 130-4). The fourth sensor may be placed on a substrate portion (255) (e.g., a first circuit board (250)). For example, the fourth sensor may be placed adjacent to any corner of the first circuit board (250) where the first to third sensors (240A to 240C) are not placed.

[0341] The control unit (830) can be electrically connected to the second position sensor (240) through the substrate unit (800), the support substrate (310), and the substrate unit (255). The shape memory alloy member (45) can be electrically connected to the control unit (830) through the substrate unit (800), the support substrate (310), the second substrate (190B), and the substrate unit (410). That is, the control unit (830) can apply a driving signal (e.g., driving current) to the shape memory alloy member (45) through the substrate unit (800), the support substrate (310), the second substrate (190B), and the substrate unit (410).

[0342] The embodiment is compared with the comparative example, and the advantages of the embodiment based on the results of the comparison are explained. In the comparative example, the configuration corresponding to the substrate part (410) according to the embodiment is referred to as an "SMA (shape memory alloy) assembly." At this time, the SMA assembly serves to provide a driving signal to the shape memory alloy member. In the comparative example, the "SMA assembly" is positioned below the OIS moving part (e.g., the first substrate part), and in the comparative example, the terminal part of the SMA assembly can be folded into a second substrate part located below the base (210), and can be directly coupled to the second substrate part by soldering to be electrically connected. At this time, the first substrate part can move together with the image sensor when driving the OIS, and the second substrate part can be fixed without moving together with the image sensor when driving the OIS. In addition, in the comparative example, the AF moving part and the OIS sensor part are assembled separately, and then the AF moving part and the OIS sensor part are finally assembled together.

[0343] In the embodiment, after attaching the substrate part (410) to the AF moving part, the shape memory alloy member (45), plate (420), and OIS moving part belonging to the OIS sensor part (350) are combined. In the embodiment, the substrate part (410) may be placed between the housing (140), which is the fixed part, and the holder (270), which is the OIS moving part (or the plate (420) coupled to the holder (270)). The substrate part (410) may be electrically connected to the substrate part (800) using the circuit board (190B) of the AF driving part (100) and the support board (310). Compared to the structure of the camera device according to the comparative example, the above-described structure of the embodiment can reduce the size of the camera device.

[0344] In the comparative example, there may be restrictions on assembling the image sensor coupled to the heat dissipation member onto the substrate (255). On the other hand, in the embodiment, the OIS moving part can be stably assembled onto the substrate (410) after the substrate (410) is coupled or assembled to the AF driving part (100) (e.g., housing (140)).

[0345] In the comparative example, foreign matter may be generated during the process of assembling the AF drive unit (100) and the already assembled OIS sensor unit, and the generated foreign matter may affect the image sensor of the OIS sensor unit, thereby deteriorating the performance of the image sensor. On the other hand, in the embodiment, since the assembly of the OIS move unit can be performed stably after combining the AF move unit and the substrate unit (410), the generation of foreign matter can be suppressed, which is advantageous for foreign matter management.

[0346] FIG. 20 shows an electrical connection between a substrate portion (410-1) and a second substrate (190B) according to another embodiment, FIG. 21a is a first perspective view of the substrate portion (410-1), plate (420-1), shape memory alloy member (45), and holder (270) of FIG. 20, and FIG. 21b is a second perspective view of the substrate portion (410-1), plate (420-1), shape memory alloy member (45), and holder (270) of FIG. 20.

[0347] The substrate portion (410-1) may include a body (411) and a terminal portion (4) extending from the body (411). The terminal portion (98) of FIG. 9 is in the form where a part of the substrate (e.g., PCB or FPCB) is bent and extended from the body (411), whereas the terminal portion (4) of FIG. 20 may be in the form where conductive terminals (4A to 4E) are bent and extended from the body (411). For example, the terminals (3A to 3E) of FIG. 9 may have a structure where the part bent and extended from the body (411) is covered with an insulator and only one end of the terminals is exposed from the insulator, and the terminals (4A to 4E) of FIG. 20 may have a structure where the part bent and extended from the body (411) is not covered with an insulator. The description of the terminals (3A to 3E) of FIG. 9 may be applied to or by analogy to the terminals (4A to 4E) of FIG. 20. The connecting portions (423A, 423B) of the plate (420-1) of FIG. 20 may include a clamp that is connected to the other end of the shape memory alloy member (45).

[0348] The coupling portion (413) of the substrate portion (410-1) of FIG. 20 may include a groove (29) to increase the coupling area with the housing (140) and improve the coupling force. Also, referring to FIG. 21b, the substrate portion (410-1) may include at least one protrusion (39) protruding from the bottom surface. For example, the number of protrusions (39) may be two or more. For example, the substrate portion (410-1) may include a plurality of protrusions (39A to 39D) protruding toward the plate (420).

[0349] When the OIS moving part moves, the protrusion (39) can reduce the contact area between the OIS moving part (e.g., the inner part (421) of the plate (420) and the fixed part (e.g., the substrate part (410-1)) and reduce the frictional force between the two. As a result, the power consumption and heat generation required during OIS operation can be reduced.

[0350] In addition, the camera device according to the embodiment may be included in an optical instrument that forms an image of an object in space using light characteristics such as reflection, refraction, absorption, interference, and diffraction, and aims to increase the visual acuity of the eye, or aims to record and reproduce an image by a lens, or aims for optical measurement, propagation or transmission of an image, etc. For example, the optical instrument according to the embodiment may be a mobile phone, mobile phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcasting terminal, PDA (Personal Digital Assistants), PMP (Portable Multimedia Player), navigation, etc., but is not limited thereto, and any device for capturing images or photographs is possible.

[0351] FIG. 22a shows a perspective view of an optical device (200A) according to an embodiment, FIG. 22b shows a perspective view of an optical device (200X) according to another embodiment, and FIG. 23 shows a configuration diagram of the optical device (200A) shown in FIG. 22a and FIG. 22b.

[0352] For example, the embodiment of FIG. 22a may be a front camera of an optical device (200A) in which the lens module (400) of the camera module (200) is positioned to face the front of the body (850). The embodiment of FIG. 20b may be a rear camera in which the lens module (400) of the camera module (200) is positioned to face the rear of the body (850) of the optical device (200A). FIG. 20b illustrates an example in which two rear cameras are positioned, but in other embodiments, one or more rear cameras may be positioned. In other embodiments, the optical device (200A) according to the embodiment may correspond to the front camera and the rear camera of the optical device (200A).

[0353] The optical device (200A) may include a body (850), a wireless communication unit (710), an A / V input unit (720), a sensing unit (740), an input / output unit (750), a memory unit (760), an interface unit (770), a control unit (780), and a power supply unit (790). The body (850) may include a case (casing, housing, cover, etc.) forming the exterior. For example, the body (850) may be divided into a front case (851) and a rear case (852).

[0354] The wireless communication unit (710) may be configured to include one or more modules that enable wireless communication between the optical device (200A) and the wireless communication system or between the optical device (200A) and the network where the optical device (200A) is located. For example, the wireless communication unit (710) may be configured to include a broadcast reception module (711), a mobile communication module (712), a wireless internet module (713), a short-range communication module (714), and a location information module (715).

[0355] The A / V (Audio / Video) input unit (720) is for inputting audio or video signals and may include a camera (721) and a microphone (722), etc. The camera (721) may include a camera device according to the embodiment. The sensing unit (740) may generate a sensing signal to control the operation of the optical device (200A) by detecting the current state of the optical device (200A), such as the open / closed state of the optical device (200A), the position of the optical device (200A), the presence or absence of user contact, the orientation of the optical device (200A), and the acceleration / deceleration of the optical device (200A).

[0356] The input / output unit (750) is intended to generate input or output related to sight, hearing, or touch. The input / output unit (750) may include a keypad unit (730), a display module (751), an audio output module (752), and a touch screen panel (753). The memory unit (760) may store a program for processing and controlling the control unit (780). The interface unit (770) serves as a passage connecting to an external device connected to the optical device (200A). The control unit (780) can control the overall operation of the optical device (200A). The power supply unit (790) can receive external power or internal power under the control of the control unit (780) and supply power necessary for the operation of each component.

[0357] The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. exemplified in each embodiment may be combined or modified and implemented in other embodiments by a person skilled in the art to which the embodiments belong. Therefore, details regarding such combinations and modifications should be interpreted as being included within the scope of the present invention.

[0358] The embodiment can be used in camera devices and optical devices that can reduce the size and eliminate constraints on the arrangement of the OIS moving part according to the arrangement of the shape memory alloy wire assembly that supplies a driving signal to the shape memory alloy member.

Claims

1. A fixing part comprising a housing and a circuit board disposed in the housing; A moving part including a first substrate and an image sensor disposed on the first substrate; A support substrate that supports the movable part with respect to the fixed part and is electrically connected to the first substrate part; and It includes a shape memory alloy member coupled to the fixed part and the moving part, which moves the moving part in a direction perpendicular to the optical axis relative to the fixed part or rolls the moving part relative to the optical axis. A camera device in which the shape memory alloy member is electrically connected to the support substrate through the circuit board, and a driving signal is applied to the shape memory alloy member through the support substrate and the circuit board.

2. In Paragraph 1, A camera device comprising a fixed part disposed between the housing and the moving part, and a second substrate part electrically connecting the shape memory alloy member and the circuit board.

3. In Paragraph 2, A plate comprising a first portion coupled to the moving portion and a second portion coupled to the second substrate portion, disposed between the second substrate portion and the moving portion, and the second portion coupled to the second substrate portion. The above plate is a camera device electrically connected to the shape memory alloy member and the second substrate part.

4. In Paragraph 3, The second substrate above is, A body disposed below the housing and coupled with the housing; and A camera device comprising an extension extending from the body in the direction of the housing and electrically connected to the circuit board.

5. In Paragraph 4, The second substrate portion includes a first terminal portion disposed in the extension portion, and A camera device comprising a circuit board including a second terminal portion coupled to the first terminal portion of the second board portion and a second terminal portion electrically connected to the support board.

6. In Paragraph 5, The above circuit board is disposed on one side of the housing, and A camera device in which at least a portion of the extension passes through one side of the housing and the first terminal portion is exposed from the upper surface of the housing.

7. In Paragraph 4, A camera device comprising a second substrate portion that extends from the outer surface of the body and a coupling portion that is coupled to the outer surface of the side of the housing.

8. In Paragraph 1, A camera device comprising a third substrate portion that is positioned below the moving portion and spaced apart from the moving portion, and is electrically connected to the support substrate.

9. In Paragraph 2, A camera device in which a driving signal is supplied to the shape memory alloy member through the circuit board, the support board, and the first and second board portions.

10. A fixing part comprising a housing and a first substrate portion disposed below the housing and coupled with the housing; A moving part comprising a holder disposed below the first substrate part, a second substrate part coupled to the holder, and an image sensor electrically connected to the second substrate part; A plate disposed between the first substrate and the holder and electrically connected to the first substrate; and A camera device comprising a shape memory alloy member that connects the first substrate part and the plate, and moves the moving part in a direction perpendicular to the optical axis with respect to the fixed part, or rolls the moving part with respect to the optical axis.

Images