Battery and electronic device including same

Abstract

Disclosed is a battery. The battery may comprise: an electrode assembly including a positive electrode tab and a negative electrode tab; and a printed circuit board on which a protection circuit module is disposed and a plurality of layers including a conductive layer are stacked. The conductive layer may comprise: a first conductive portion disposed between two layers among the plurality of layers; and a second conductive portion protruding from the first conductive portion. The second conductive portion of the conductive layer may be coupled to one of the positive electrode tab and the negative electrode tab.

Description

Battery and electronic device including the same

[0001] The following descriptions relate to batteries and electronic devices containing them.

[0002] An electronic device may include various electronic components. The electronic device may include a battery for providing power to the electronic components. The battery may include a positive electrode, a negative electrode, and a separator disposed between them. An electrode tab extending from the electrode may be coupled to a lead tab. Power provided from the battery may be provided to the outside of the battery through the lead tab.

[0003] A battery is disclosed. The battery may include an electrode assembly comprising a positive tab and a negative tab, and a printed circuit board having a plurality of layers stacked thereon, each layer comprising a conductive layer and a protection circuit module. The conductive layer may include a first conductive portion disposed between two of the plurality of layers, and a second conductive portion protruding from the first conductive portion. The second conductive portion of the conductive layer may be coupled to one of the positive tab or the negative tab.

[0004] An electronic device is disclosed. The electronic device may include a battery and one or more electronic components that receive power from the battery. The battery may include an electrode assembly comprising a positive tab and a negative tab, and a printed circuit board having a plurality of layers stacked thereon, each layer comprising a conductive layer and a protection circuit module. The conductive layer may include a first conductive portion disposed between two of the plurality of layers, and a second conductive portion protruding from the first conductive portion. The second conductive portion of the conductive layer may be coupled to one of the positive tab or the negative tab.

[0005] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0006] FIG. 2 is a block diagram of a power management module and a battery according to one embodiment.

[0007] FIG. 3a is a perspective view of a battery according to one embodiment.

[0008] FIG. 3b is a cross-sectional view of the battery of FIG. 3a cut along A-A'.

[0009] FIG. 3c is an exploded perspective view of the battery of FIG. 3b.

[0010] Figure 4a is a drawing illustrating a printed circuit board.

[0011] Figure 4b is a diagram illustrating an example in which the lead tabs of a printed circuit board and a battery are connected.

[0012] FIG. 5a is a drawing illustrating a printed circuit board including a protruding conductive portion according to one embodiment.

[0013] Figure 5b is a cross-sectional view taken along B-B' of Figure 5a.

[0014] FIG. 6 is an exploded perspective view of a printed circuit board according to one embodiment.

[0015] FIG. 7a is a drawing illustrating an example in which a printed circuit board and a battery lead tab are connected according to one embodiment.

[0016] FIG. 7b is a drawing illustrating an example in which a printed circuit board is mounted on a battery according to one embodiment.

[0017] FIG. 7c is a perspective view illustrating an example in which a printed circuit board is mounted on a battery according to one embodiment.

[0018] FIG. 8a is a drawing illustrating a battery protection circuit including a protruding conductive portion according to one embodiment.

[0019] Figure 8b is a cross-sectional view taken along C-C' of Figure 8a.

[0020] FIG. 9 is an exploded perspective view of a battery protection circuit according to one embodiment.

[0021] FIG. 10a is a drawing illustrating an example in which a battery protection circuit and a lead tab of a battery are connected according to one embodiment.

[0022] FIG. 10b is a drawing illustrating an example in which a printed circuit board is seated on a battery according to one embodiment.

[0023] FIG. 10c is a perspective view illustrating an example in which a printed circuit board is mounted on a battery according to one embodiment.

[0024] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0025] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0026] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0027] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0028] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0032] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0033] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0034] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0038] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0040] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 664 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 6 ms or less) for realizing URLLC.

[0043] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0044] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0045] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] FIG. 2 is a block diagram (200) of a power management module and a battery according to one embodiment.

[0048] Referring to FIG. 2, the power management module (188) may include a charging circuit (210), a power regulator (220), or a power gauge (230). The charging circuit (210) can charge the battery (189) using power supplied from an external power source to the electronic device (101). According to one embodiment, the charging circuit (210) can select a charging method (e.g., normal charging or fast charging) based on at least some of the types of external power sources (e.g., power adapter, USB, or wireless charging), the magnitude of power available from the external power source, or the attributes of the battery (189), and charge the battery (189) using the selected charging method. The external power source may be wired to the electronic device (101), for example, through a connection terminal (178), or wirelessly connected through an antenna module (197).

[0049] The power regulator (220) can generate multiple powers having different voltage or different current levels by adjusting the voltage level or current level of the power supplied from, for example, an external power source or a battery (189). The power regulator (220) can adjust the power of the external power source or battery (189) to a voltage or current level suitable for each of the components included in the electronic device (101). According to one embodiment, the power regulator (220) may be implemented in the form of a low drop-out (LDO) regulator or a switching regulator. The power gauge (230) can measure usage status information for the battery (189) (e.g., capacity of the battery (189), number of charge / discharge cycles, voltage, or temperature).

[0050] The power management module (188) can determine charge state information related to the charging of the battery (189) (e.g., lifespan, overvoltage, undervoltage, overcurrent, overcharge, overdischarge, overheating, short circuit, or swelling) based at least part of the measured usage state information, using, for example, a charging circuit (210), a power regulator (220), or a power gauge (230). The power management module (188) can determine whether the battery (189) is normal or abnormal based at least part of the determined charge state information. If the state of the battery (189) is determined to be abnormal, the power management module (188) can adjust the charging of the battery (189) (e.g., reducing the charging current or voltage, or stopping the charging). According to one embodiment, at least some of the functions of the power management module (188) may be performed by an external control device (e.g., a processor (120)).

[0051] According to one embodiment, the battery (189) may include a battery protection circuit module (PCM) (240). The battery protection circuit (240) may perform one or more of various functions (e.g., a pre-shutdown function) to prevent performance degradation or burnout of the battery (189). The battery protection circuit (240) may additionally or substantially be configured as at least part of a battery management system (BMS) capable of performing various functions including cell balancing, measuring battery capacity, measuring charge / discharge cycles, measuring temperature, or measuring voltage.

[0052] According to one embodiment, at least a portion of the usage status information or charge status information of the battery (189) may be measured using a corresponding sensor (e.g., temperature sensor) among the sensor modules (176), a power gauge (230), or a power management module (188). According to one embodiment, the corresponding sensor (e.g., temperature sensor) among the sensor modules (176) may be included as part of the battery protection circuit (240) or may be placed near the battery (189) as a separate device.

[0053] FIG. 3a is a perspective view of a battery according to one embodiment. FIG. 3b is a cross-sectional view of the battery of FIG. 3a taken along A-A'. FIG. 3c is an exploded perspective view of the battery of FIG. 3a.

[0054] The battery (300) of FIG. 3a may be referred to as the aforementioned battery (189). For example, the battery (300) may be a rechargeable secondary battery. For example, the battery (300) may be a lithium ion battery.

[0055] A battery (300) according to one embodiment may include a case (340). The case (340) may form the exterior of the battery (300). Components of the battery (300) (e.g., negative electrode (311), positive electrode (312), separator (350), and electrolyte of FIG. 3c) may be accommodated within the case (340). The case (340) may protect the components accommodated inside. In one embodiment, the components (e.g., negative electrode (311), positive electrode (312), separator (350), and electrolyte of FIG. 3c) may be referred to as a battery assembly. The case (340) may include a pouch-type case or a prismatic (or cylindrical) case. The case (340) illustrated in FIG. 3a is illustrated as a pouch-type case, but is not limited thereto. For example, the case (340) may be a rectangular (or cylindrical) case.

[0056] In one embodiment, an electronic device (e.g., the electronic device (101) of FIG. 1) may include electronic components for implementing various functions (e.g., a processor (e.g., the processor (120) of FIG. 1), an audio module (e.g., the audio module (170) of FIG. 1), a camera module (e.g., the camera module (180) of FIG. 1), and / or an antenna module (e.g., the antenna module (197) of FIG. 1). A battery (300) of the electronic device (101) may be configured to provide power for the operation of the electronic components.

[0057] In one embodiment, the battery (300) may include a lead tab (330). For example, the lead tab (330) may be electrically connected to an electrical circuit, such as a battery protection module. For example, the lead tab (330) may provide an electrical connection between an electrode (e.g., electrode (310) in FIG. 3b) placed within the case (340) and an electronic component outside the battery (300). The battery protection module (PCM) may be placed in the terrace seal (341) area.

[0058] In one embodiment, power from the battery (300) can be provided to each of the electronic components through the lead tab (330). For example, power stored in the battery (300) can be provided to the outside through the lead tab (330) (discharge), and power provided to charge the battery (300) from the outside can be provided to the battery (300) through the lead tab (330) (charge). The lead tab (330) can be coupled to an electrode tab (e.g., electrode tab (320) of FIG. 3b) of an electrode (310) disposed inside the case (340). The lead tab (330) may include a first lead tab (331) in contact with a first electrode tab (e.g., first electrode tab (321) of FIG. 3A) and a second lead tab (332) in contact with a second electrode tab (e.g., second electrode tab (322) of FIG. 3A). A portion of the lead tab (330) may be exposed to the outside of the case (340). A portion of the lead tab (330) extending from the inside of the case (340) to the outside of the case (340) may be exposed to the side of the case (340). To seal the case (340) where the lead tab (330) is exposed, a terrace seal (341) containing an insulating material may be formed on the side of the case (340).

[0059] Referring to FIG. 3b, in one embodiment, the battery (300) may include a lead tab (330) connected to an electrode (310). The lead tab (330) may be exposed outside the case (340) by extending through the terrace seal (341) of the case (340). The lead tab (330) may be electrically connected to an external circuit or electrically connected to another battery to form a battery module or battery pack.

[0060] In one embodiment, the lead tab (330) may comprise a conductive material. For example, the lead tab (330) may comprise a metal. A portion of the lead tab (330) may be exposed to the outside of the case (340), and an electrode tab (320) extending from the electrode (310) may extend toward another portion of the lead tab (330) located within the case (340). The electrode tab (320) may be at least partially bent so as to be coupled with the lead tab (330).

[0061] In one embodiment, the electrode (310) may include an electrode tab (320). The electrode tab (320) may be joined to the lead tab (330) in a welding area (360) that extends from the electrode (310) and contacts the lead tab (330). In one embodiment, the methods of joining the lead tab (330) and the electrode tab (320) may vary. For example, a method of welding the lead tab (330) to the electrode tab (320) using ultrasound may be used. Alternatively, a method of welding the lead tab (330) to the electrode tab (320) using a laser may be used. Alternatively, a method of welding the lead tab (330) to the electrode tab (320) in advance by adding a separate substrate may be used in the electrode process for manufacturing the electrode (310).

[0062] In one embodiment, the lead tab (330) may be the conductive portion (511) in FIG. 5a, the conductive portion (811) in FIG. 8a, or the conductive portion (812) in FIG. 8a.

[0063] In one embodiment, referring to FIG. 3c, components of a battery (300) may be arranged inside a case (340). For example, a negative electrode (311), a positive electrode (312), a separator (350), and an electrolyte may be arranged inside the case (340). The battery (300) illustrated in FIG. 3c may be a stack-type battery in which the negative electrode (311) and the positive electrode (312) are alternately stacked. The negative electrode (311) and the positive electrode (312), respectively, may be referred to as a cathode and an anode based on the discharge of the battery (300). However, the embodiment is not limited thereto. For example, the battery (300) may comprise a jelly roll formed by rolling (or winding) (or rotating) the negative electrode (311), the positive electrode (312), and the separator (350) in a designated rotational direction (e.g., clockwise or counterclockwise).

[0064] In one embodiment, the electrode (310) may include a negative electrode (311) and a positive electrode (312) having electrically opposite characteristics. The electrode (310) may include an electrode current collector and an electrode active material layer coated on the electrode current collector. In one embodiment, the negative electrode (311) may include a negative electrode substrate and a negative electrode active material layer coated on the negative electrode substrate. In one embodiment, the positive electrode (312) may include a positive electrode substrate and a positive electrode active material layer coated on the positive electrode substrate.

[0065] For example, the cathode substrate and / or the anode substrate may comprise a non-conductive material (e.g., a polymer). For example, the polymer may comprise polyethylene (PE) or polyethylene terephthalate (PET).

[0066] In one embodiment, the negative active material layer may include a negative active material involved in the electrochemical reaction of the negative electrode (311), a conductive material to improve electrical conductivity within the negative electrode (311), and a binder to enable the negative active material layer to be easily attached to the negative substrate. In one embodiment, the negative active material may include graphite, LTO (lithium titanate), silicon (Si), germanium (Ge), tin (Sn), or lithium oxide (Li2O). In one embodiment, the binder of the negative active material layer may use a polymer material such as PVDF (polyvinylidene fluoride), PAA (polyacrylic acid), SBR (styrene-butadiene rubber), and CMC (carboxymethylcellulose).

[0067] In one embodiment, the positive active material layer may include a positive active material involved in the electrochemical reaction of the positive electrode (312), a conductive material for improving electrical conductivity within the positive electrode (312), and a binder so that the positive active material layer can be easily attached to the positive substrate. In one embodiment, the positive active material may include LiCoO2, LiNiCoMnO2, LiNiCoAlO2, LiTiS2, LiCoO2, LiNiO2, LiMnO2, LiMn2O4, LiCo2O4, LiFePO4, LiMnPO4, LiCoPO4, LiFeSO4F, or LiVPO4F, but is not limited thereto. In one embodiment, a polymer material such as PVDF may be used as the binder of the positive active material layer.

[0068] In one embodiment, a separator (350) may be interposed between the positive electrode (312) and the negative electrode (311). The separator (350) may provide a passage through which lithium ions can pass and may prevent physical contact (or direct electrical short circuit) between the negative electrode (311) and the positive electrode (312).

[0069] In one embodiment, the electrolyte may provide a path for lithium ions to move between the positive electrode (312) and the negative electrode (311). For example, the electrolyte may include a liquid electrolyte or a gel electrolyte.

[0070] In one embodiment, the electrode (310) may include an electrode tab (320). For example, the electrode tab (320) may include a first electrode tab (321) extending from a negative electrode (311) and a second electrode tab (322) extending from a positive electrode (312). The first electrode tab (321) may be referred to as the negative electrode tab, and the second electrode tab (322) may be referred to as the positive electrode tab.

[0071] FIG. 4a is a drawing illustrating a printed circuit board. FIG. 4b is a drawing illustrating an example in which the lead tabs of a printed circuit board and a battery are connected.

[0072] Referring to FIG. 4a, the printed circuit board (400) may include plates (411, 412) that are physically coupled to a lead tab (e.g., lead tab (330) in FIG. 3a) (or electrode tab (e.g., electrode tab (320) in FIG. 3c)). The plates (411, 412) may be placed on the top layer (or bottom layer) where components of the printed circuit board (400) are placed. The components may perform one or more functions related to the battery (300) (e.g., cell balancing, battery capacity measurement, charge / discharge cycle measurement, temperature measurement, or voltage measurement). In terms of performing one or more functions related to the battery (300) (e.g., cell balancing, battery capacity measurement, charge / discharge cycle measurement, temperature measurement, or voltage measurement), the components may be referred to as protection circuit modules.

[0073] Referring to FIG. 4b, the lead tabs (331, 332) of the battery (300) are coupled to each of the plates (411, 412), so that the printed circuit board (400) can be electrically connected to the battery (300).

[0074] However, referring to FIG. 4a and FIG. 4b, the plates (411, 412) are placed on the same layer (e.g., top layer, or bottom layer) as the layer on which the components of the printed circuit board (400) are placed, so that the length (421, 422, 423, 424, 425) of the printed circuit board (400) can be increased by the length (422, 424) of the plates (411, 412). Accordingly, the increase in the length (421, 422, 423, 424, 425) of the printed circuit board (400) may be a constraint on the miniaturization of the battery (300) and the consequent miniaturization of the electronic device (101). Below, the length (421, 422, 423, 424, 425) of the printed circuit board (400) can be reduced to reduce the battery (300) and thereby reduce the electronic device (101) of the present invention.

[0075] FIG. 5a is a drawing illustrating a printed circuit board including a protruding conductive portion according to one embodiment. FIG. 5b is a cross-sectional view taken along B-B' of FIG. 5a. FIG. 6 is an exploded perspective view of a printed circuit board according to one embodiment. FIG. 7a is a drawing illustrating an example in which a lead tab of a printed circuit board and a battery are connected according to one embodiment. FIG. 7b is a drawing illustrating an example in which a printed circuit board is mounted on a battery according to one embodiment. FIG. 7c is a perspective view illustrating an example in which a printed circuit board is mounted on a battery according to one embodiment.

[0076] Referring to FIG. 5a, the printed circuit board (500) may include a conductive portion (511) physically coupled to a negative tab (e.g., the first lead tab (331) in FIG. 3a) (or, the first electrode tab (321) in FIG. 3c)) and a plate (512) physically coupled to a positive tab (e.g., the second lead tab (332) in FIG. 3a) (or, the second electrode tab (322) in FIG. 3c)). The negative tab (e.g., the first lead tab (331) in FIG. 3a)) (or, the first electrode tab (e.g., the first electrode tab (321) in FIG. 3c)) and the positive tab (e.g., the second lead tab (332) in FIG. 3a)) (or, the second electrode tab (e.g., the second electrode tab (322) in FIG. 3c)) may comprise a conductive material (e.g., a metal). However, embodiments Examples are not limited thereto. For example, the conductive portion (511) of the printed circuit board (500) may be physically coupled to the positive tab (e.g., the second lead tab (332) in FIG. 3a) (or, the second electrode tab (322) in FIG. 3c), and the plate (512) of the printed circuit board (500) may be physically coupled to the negative tab (e.g., the first lead tab (331) in FIG. 3a) (or, the first electrode tab (321) in FIG. 3c).

[0077] In one embodiment, the conductive portion (511) may include a conductive material corresponding to the negative tab. For example, the conductive portion (511) may include copper. In one embodiment, the plate (512) may include a conductive material for electrical connection with the positive tab. For example, the plate (512) may include nickel. However, the embodiments are not limited thereto. For example, the conductive portion (511) may include a conductive material (e.g., aluminum) corresponding to the positive tab.

[0078] In one embodiment, the plate (512) may be placed on the top layer (or bottom layer) where components of the printed circuit board (500) are placed.

[0079] In one embodiment, the conductive portion (511) may be electrically connected to a layer other than the top layer (or bottom layer) where components of the printed circuit board (500) are placed. In one embodiment, the plate physically coupled to the cathode tab in the top layer (or bottom layer) where components are placed is omitted, and by including the conductive portion (511) physically coupled to the cathode tab, the length of the printed circuit board (500) may be reduced by the length of the plate. For example, compared to the printed circuit board (400) of FIG. 4a and FIG. 4b, the length (521, 522, 523, 525) of the printed circuit board (500) may be reduced by the length (424) of the plate (411). In addition, compared to the printed circuit board (400) of FIG. 4a and FIG. 4b, the length (521, 523, 525) in which components are placed on the top layer (or bottom layer) of the printed circuit board (500) may correspond to the length (421, 423, 425) of the printed circuit board (400).

[0080] In one embodiment, the conductive portion (511) may protrude from a layer other than the top layer (or bottom layer) on which components of the printed circuit board (500) are placed. For example, the printed circuit board (500) may include a printed circuit board (e.g., a double-sided PCB or a multilayer PCB) comprising two or more conductive layers. In one embodiment, the conductive portion (511) may protrude from at least one of the two or more conductive layers.

[0081] For example, referring to FIG. 5b, the printed circuit board (500) may include a plurality of layers (531 to 537, 540, 551 to 557, 561, 565, 571, and 575).

[0082] In one embodiment, the layers (531, 551) may be coverlay layers. In one embodiment, the layers (531, 551) may be photoimageable solder resist (PSR) layers. For example, the layers (531, 551) may have a thickness of 30 micrometers. However, the embodiments are not limited thereto. For example, the layers (531, 551) may include a PSR layer (e.g., 30 micrometers), an adhesive layer (e.g., 15 micrometers), and a polyimide (PI) film layer (e.g., 7.5 micrometers).

[0083] In one embodiment, the layers (532, 533, 552, 553) may be conductive layers. For example, the layers (532, 552) may be copper-plated layers. For example, the layers (533, 553) may be copper layers. For example, the layers (532, 552) may have a thickness of 30 micrometers. For example, the layers (533, 553) may have a thickness of 35 micrometers. For example, the layers (532, 533) may be referred to as conductive layers (or, first conductive layers, first layer conductive layers). For example, the layers (552, 553) may be referred to as conductive layers (or, fourth conductive layers, fourth layer conductive layers). In one embodiment, the first layer conductive layer and the fourth layer conductive layer may be electrically connected via holes.

[0084] In one embodiment, the layers (534, 535, 554, 555) may be prepreg layers. For example, the layers (534, 535, 554, 555) may have a thickness of 110 micrometers.

[0085] In one embodiment, the layer (536, 556) may be a PI film layer (e.g., 12.5 micrometers). In one embodiment, the layer (537, 557) may be an adhesive layer (e.g., 40 micrometers).

[0086] In the following, a plurality of layers (531 to 537) may be collectively referred to as layer (530). A plurality of layers (551 to 557) may be collectively referred to as layer (550).

[0087] In one embodiment, the layer (540) may be a core layer or a substrate layer. For example, the layer (540) may have a thickness of 20 micrometers.

[0088] In one embodiment, one or more components (581, 585) may be disposed on the top layer (e.g., layer (531), or layer (530)) among a plurality of layers (530, 540, 550, 561, 565, 571, and 575). In one embodiment, one or more components (581, 585) may be electrically connected (or coupled) to a positive tab and / or a negative tab. In one embodiment, one or more components (581, 585) may perform one or more functions related to the battery (300) (e.g., cell balancing, battery capacity measurement, charge / discharge cycle measurement, temperature measurement, or voltage measurement). In one embodiment, one or more components (581, 585) may be electrically connected to a 1-layer conductive layer and / or a 4-layer conductive layer via hole. The components (581, 585) may be referred to as protection circuit modules in terms of performing one or more functions related to the battery (300) (e.g., cell balancing, battery capacity measurement, charge / discharge cycle measurement, temperature measurement, or voltage measurement).

[0089] In one embodiment, the layers (561, 565, 571, 575) may be conductive layers. For example, the layers (565, 575) may be copper-plated layers. For example, the layers (561, 571) may be copper layers. For example, the layers (565, 575) may have a thickness of 30 micrometers. For example, the layers (561, 571) may have a thickness of 35 micrometers. For example, the layers (561, 565) may be referred to as conductive layers (or, second conductive layers, two-layer conductive layers). For example, the layers (571, 575) may be referred to as conductive layers (or, third conductive layers, three-layer conductive layers). Hereinafter, the layers (561, 565) may be referred to as conductive layers (560). Layers (571, 575) may be referred to as a conductive layer (570). In one embodiment, the conductive layer (560, 570) may be electrically connected to one or more components (581, 585), a single-layer conductive layer, and / or a four-layer conductive layer via hole.

[0090] In one embodiment, at least one of the conductive layers (532, 533, 552, 553, 561, 565, 571, and 575) may include a conductive portion (511) protruding from a portion where a plurality of layers (530, 540, 550, 560, and 570) overlap. For example, the conductive layers (560, 570) may include a conductive portion (511) protruding from a portion where a plurality of layers (530, 540, 550, 560, and 570) overlap. In one embodiment, the portion where a plurality of layers (530, 540, 550, 560, and 570) overlap may be a portion that overlaps with a layer on which one or more components (581, 585) are disposed.

[0091] For example, with reference to the exploded perspective view (600) of the layers (530, 540, 550, 560, and 570) of FIG. 6, the conductive layer (560) may include a first conductive portion (611) disposed between two layers (530, 540) among the plurality of layers (530, 540, 550, 560, and 570), and a second conductive portion (615) protruding from the first conductive portion (611). For example, the conductive layer (570) may include a first conductive portion (621) disposed between two layers (550, 540) among the plurality of layers (530, 540, 550, 560, and 570), and a second conductive portion (625) protruding from the first conductive portion (621). For example, the first conductive portions (611, 621) of the conductive layers (560, 570) may include portions (613, 617, 623, 627) for electrical connection with the outside of the printed circuit board (500). The portions (613, 623) among the portions for electrical connection (613, 617, 623, 627) may be portions electrically connected to the negative tab (or, first lead tab (331)) (or, first electrode tab (321)). The portions (617, 627) among the portions for electrical connection (613, 617, 623, 627) may be portions electrically connected to the positive tab (or, second lead tab (332)) (or, second electrode tab (322)). For example, the first conductive portions (611, 621) of the conductive layers (560, 570) may include conductive portions (619, 629) that include test points. In one embodiment, electrical connection between the plurality of layers (530, 540, 550, 560, and 570) may be made through via holes disposed in each of the plurality of layers (530, 540, 550, 560, and 570).

[0092] In one embodiment, the conductive layer (560) may be laminated on a first surface of the layer (540) (or core layer, substrate layer). In one embodiment, the conductive layer (570) may be laminated on a second surface opposite to the first surface of the layer (540) (or core layer, substrate layer).

[0093] In one embodiment, the first conductive portions (611, 621) may overlap with other layers (530, 540, and 550). In one embodiment, the second conductive portions (615, 625) may not overlap with other layers (530, 540, and 550). In one embodiment, the second conductive portions (615, 625) may overlap with each other. For example, the second conductive portion (615) may overlap with the second conductive portion (625). For example, the second conductive portion (615) and the second conductive portion (625) that overlap with each other may be referred to as the conductive portion (511).

[0094] In one embodiment, the conductive portion (511) (or, second conductive portions (615, 625)) may be physically coupled to the cathode tab (or, first lead tab (331)) (or, first electrode tab (321)). For example, referring to FIG. 7a, the conductive portion (511) (or, second conductive portions (615, 625)) may be physically coupled to the cathode tab by welding to the first electrode tab (321) in a welding area (e.g., 360 in FIG. 3b) within the case (e.g., 340 in FIG. 3b).

[0095] For example, the second conductive parts (615, 625) and the cathode tab (or, first lead tab (331)) (or, first electrode tab (321)) may be melted and fused in the welding area (e.g., 360 in FIG. 3b) within the case (e.g., 340 in FIG. 3b) by frictional heat generated by ultrasonic vibrations, and then the second conductive parts (615, 625) may be welded onto the cathode tab (or, first lead tab (331)) (or, first electrode tab (321)) in the welding area (e.g., 360 in FIG. 3b) within the case (e.g., 340 in FIG. 3b) through a cooling process. Alternatively, the second conductive parts (615, 625) and the cathode tab (or the first lead tab (331)) (or the first electrode tab (321)) may be melted and fused in a welding area (e.g., 360 in FIG. 3b) within a case (e.g., 340 in FIG. 3b), and subsequently, through a cooling process, the second conductive parts (615, 625) may be welded onto the cathode tab (or the first lead tab (331)) (or the first electrode tab (321)). In one embodiment, the second conductive portions (615, 625) may be welded to the cathode tab (or, first lead tab (331)) (or, first electrode tab (321)), thereby allowing the cathode tab (or, first lead tab (331)) (or, first electrode tab (321)) to bend toward the second conductive portions (615, 625). For example, the second conductive portions (615, 625) may have a width (e.g., 5 millimeters) corresponding to the cathode tab (or, first lead tab (331)) (or, first electrode tab (321)). However, the embodiment is not limited thereto. For example, the second conductive parts (615, 625) can be physically joined to the anode tab (or, the second lead tab (332)) (or, the second electrode tab (322)) by welding them to the anode tab.

[0096] In one embodiment, the plate (512) can be physically coupled with the positive tab (or, the second lead tab (332)) (or, the second electrode tab (322)).

[0097] In one embodiment, referring to FIGS. 7a through 7c, a printed circuit board (500) may have a second lead tab (332) coupled with a conductive portion (511) (or second conductive portions (615, 625)) and a plate (512) connected to a battery (300). For example, a printed circuit board (500) rotated so that the top layer on which the plate (512) is located faces downward may be seated on the battery (300).

[0098] According to one embodiment, the conductive portion (511) may include a non-conductive portion. For example, the non-conductive portion of the conductive portion (511) may be configured to prevent the conductive portion (511) from being exposed to the outside and causing an electrical short circuit with another object.

[0099] In FIG. 5b and FIG. 6, two conductive layers (560, 570) are illustrated as including second conductive portions (615, 625) for being physically coupled to a cathode tab (or, first lead tab (331)) (or, first electrode tab (321)). However, embodiments are not limited thereto. For example, one of four conductive layers (e.g., 1st to 4th conductive layers) may include a second conductive portion for being physically coupled to a cathode tab. For example, one conductive layer may be one of a 1st conductive layer (e.g., layers (532, 533)), a 2nd conductive layer (560), a 3rd conductive layer (570), or a 4th conductive layer (layers (552, 553)). For example, two of the four conductive layers (e.g., layers 1 through 4 conductive layers) may include a second conductive portion for being physically bonded to the cathode tab. For example, the two conductive layers may be two conductive layers among a layer 1 conductive layer (e.g., layers (532, 533)), a layer 2 conductive layer (560), a layer 3 conductive layer (570), or a layer 4 conductive layer (layers (552, 553)). For example, the two conductive layers may be consecutive conductive layers (e.g., layers 1 and 2 conductive layers, layers 2 and 3 conductive layers, or layers 3 and 4 conductive layers). For example, three or more of the four conductive layers (e.g., layers 1 through 4 conductive layers) may include a second conductive portion for being physically bonded to the cathode tab. For example, three or more conductive layers may be three or more conductive layers among a 1-layer conductive layer (e.g., layers (532, 533)), a 2-layer conductive layer (560), a 3-layer conductive layer (570), or a 4-layer conductive layer (layers (552, 553)).For example, three or more conductive layers may be continuous conductive layers (e.g., 1 to 3 conductive layers, 2 to 4 conductive layers, or 1 to 4 conductive layers).

[0100] As described above, the printed circuit board (500) may have its length (521, 522, 523, 525) of the printed circuit board (500) reduced by the length (424) (or width) of the plate (411) compared to the printed circuit board (400) of FIG. 4a by removing the plate (411) for physical connection with the negative tab (or, first lead tab (331)) (or, first electrode tab (321)) of the battery (300). For example, the printed circuit board (500) may have its length (424) (or width) (e.g., 6 millimeters) of the plate (411) for inserting a width (e.g., 5 millimeters) corresponding to the negative tab (or, first lead tab (331)) (or, first electrode tab (321)). Accordingly, when the printed circuit board (400) is 40 millimeters long, the length of the plate (411) is reduced by 6 millimeters, so that the printed circuit board (500) can be reduced by 15% compared to the printed circuit board (400).

[0101] Additionally, the second conductive portions (615, 625) of the printed circuit board (500) can serve as lead tabs that are physically coupled to the electrode tab (320) (or the first electrode tab (321)) of the battery (300). For example, the printed circuit board (500) can utilize the second conductive portions (615, 625) protruding from at least one conductive layer that meets the thickness required for the lead tab as lead tabs that are physically coupled to the electrode tab (320) (or the first electrode tab (321)) of the battery (300).

[0102] FIG. 8a is a drawing illustrating a battery protection circuit including a protruding conductive portion according to one embodiment. FIG. 8b is a cross-sectional view taken along C-C' of FIG. 8a. FIG. 9 is an exploded perspective view of a battery protection circuit according to one embodiment. FIG. 10a is a drawing illustrating an example in which the electrode tabs of a battery are connected to a battery protection circuit according to one embodiment. FIG. 10b is a drawing illustrating an example in which a printed circuit board is mounted on a battery according to one embodiment. FIG. 10c is a perspective view illustrating an example in which a printed circuit board is mounted on a battery according to one embodiment.

[0103] The printed circuit board (800) of FIG. 8a may have a shape in which the plate (512) is replaced by a conductive portion (812) compared to the printed circuit board (500) of FIG. 5a. Accordingly, the length (or width) of the printed circuit board (800) of FIG. 8a may be reduced by the amount of the plate (512) by which the plate (512) for physical connection with the positive tab (or second lead tab (332)) (or second electrode tab (322)) of the battery (300) is removed compared to the printed circuit board (500) of FIG. 5a. For example, the length (or width) (e.g., 6 millimeters) of the plate (512) for inserting a width (e.g., 5 millimeters) corresponding to the negative tab may be reduced in the printed circuit board (500).

[0104] Referring to FIG. 8a, the printed circuit board (800) may include a conductive portion (811) physically coupled to a negative tab (e.g., the first lead tab (331) in FIG. 3a) (or, the first electrode tab (321) in FIG. 3c)) and a conductive portion (812) physically coupled to a positive tab (e.g., the second lead tab (332) in FIG. 3a) (or, the second electrode tab (322) in FIG. 3c)).

[0105] In one embodiment, the conductive portion (811) may include a conductive material corresponding to the negative tab. For example, the conductive portion (811) may include copper. In one embodiment, the conductive portion (812) may include a conductive material for electrical connection with the positive tab. For example, the conductive portion (812) may include aluminum.

[0106] In one embodiment, the conductive portions (811, 812) may be electrically connected to a layer other than the top layer (or bottom layer) where the components of the printed circuit board (800) are placed. In one embodiment, the plates in the top layer (or bottom layer) where the components are placed are omitted, and by including the conductive portions (811, 812) that are physically coupled to the cathode tab or the anode tab, the length of the printed circuit board (800) may be reduced by the length of the plates. For example, compared to the printed circuit board (400) of FIG. 4a and FIG. 4b, the length (821, 823, 825) of the printed circuit board (800) may be reduced by the length (422, 424) of the plates (411, 412). Additionally, compared to the printed circuit board (400) of FIG. 4a and FIG. 4b, the length (821, 823, 825) in which components are placed on the top layer (or bottom layer) of the printed circuit board (800) may correspond to the length (421, 423, 425) of the printed circuit board (400).

[0107] In one embodiment, the conductive portions (811, 812) may protrude from a layer other than the top layer (or bottom layer) where the components of the printed circuit board (800) are placed. In one embodiment, the conductive portions (811, 812) may protrude from at least one conductive layer among two or more conductive layers of the printed circuit board (800).

[0108] For example, referring to FIG. 8b, the printed circuit board (800) may include a plurality of layers (831 to 837, 840, 851 to 857, 861, 865, 871, and 875).

[0109] In one embodiment, the layers (831, 851) may be coverlay layers. In one embodiment, the layers (831, 851) may be PSR layers. For example, the layers (831, 851) may have a thickness of 30 micrometers. However, the embodiments are not limited thereto. For example, the layers (831, 851) may include a PSR layer (e.g., 30 micrometers), an adhesive layer (e.g., 15 micrometers), and a PI film layer (e.g., 7.5 micrometers).

[0110] In one embodiment, the layers (832, 833, 852, 853) may be conductive layers. For example, the layers (832, 852) may be copper-plated layers. For example, the layers (833, 853) may be copper layers. For example, the layers (832, 852) may have a thickness of 30 micrometers. For example, the layers (833, 853) may have a thickness of 35 micrometers. For example, the layers (832, 833) may be referred to as conductive layers (or, first conductive layers, first layer conductive layers). For example, the layers (852, 853) may be referred to as conductive layers (or, fourth conductive layers, fourth layer conductive layers). In one embodiment, the first layer conductive layer and the fourth layer conductive layer may be electrically connected via holes.

[0111] In one embodiment, the layers (834, 835, 854, 855) may be prepreg layers. For example, the layers (834, 835, 854, 855) may have a thickness of 110 micrometers.

[0112] In one embodiment, the layer (836, 856) may be a PI film layer (e.g., 12.5 micrometers). In one embodiment, the layer (837, 857) may be an adhesive layer (e.g., 40 micrometers).

[0113] In the following, a plurality of layers (831 to 837) may be collectively referred to as layer (830). A plurality of layers (851 to 857) may be collectively referred to as layer (850).

[0114] In one embodiment, the layer (840) may be a core layer or a substrate layer. For example, the layer (840) may have a thickness of 20 micrometers.

[0115] In one embodiment, one or more components (881) may be placed on the top layer (e.g., layer (831), or layer (830)) of a plurality of layers (830, 840, 850, 861, 865, 871, and 875). In one embodiment, one or more components (881) may be electrically connected (or coupled) to a positive tab and / or a negative tab. In one embodiment, one or more components (881) may perform one or more functions related to the battery (300) (e.g., cell balancing, battery capacity measurement, charge / discharge cycle measurement, temperature measurement, or voltage measurement). In one embodiment, one or more components (881) may be electrically connected to a 1-layer conductive layer and / or a 4-layer conductive layer via hole.

[0116] In one embodiment, the layers (861, 865, 871, 875) may be conductive layers. For example, the layers (865, 875) may be copper-plated layers. For example, the layers (861, 871) may be copper layers. For example, the layers (865, 875) may have a thickness of 30 micrometers. For example, the layers (861, 871) may have a thickness of 35 micrometers. For example, the layers (861, 865) may be referred to as conductive layers (or, second conductive layers, two-layer conductive layers). For example, the layers (871, 875) may be referred to as conductive layers (or, third conductive layers, three-layer conductive layers). Hereinafter, the layers (861, 865) may be referred to as conductive layers (860). Layers (871, 875) may be referred to as a conductive layer (870). In one embodiment, the conductive layer (860, 870) may be electrically connected to one or more components (881), a single-layer conductive layer, and / or a four-layer conductive layer via hole.

[0117] In one embodiment, at least one of the conductive layers (832, 833, 852, 853, 861, 865, 871, and 875) may include a conductive portion (811) and a conductive portion (812) protruding from a portion where a plurality of layers (830, 840, 850, 860, and 870) overlap. For example, the conductive layers (860, 870) may include a conductive portion (811) and a conductive portion (812) protruding from a portion where a plurality of layers (830, 840, 850, 860, and 870) overlap. In one embodiment, the conductive portion (811) and the conductive portion (812) may be physically separated from each other. In one embodiment, the portion where a plurality of layers (830, 840, 850, 860, and 870) overlap may be a portion that overlaps with a layer on which one or more parts (881) are placed.

[0118] For example, with reference to the exploded perspective view (900) of the layers (830, 840, 850, 860, and 870) of FIG. 9, the conductive layer (860) may include a first conductive portion (911) disposed between two layers (830, 840) among the plurality of layers (830, 840, 850, 860, and 870), a second conductive portion (915) protruding from the first conductive portion (911), and a third conductive portion (919) protruding from the first conductive portion (911) and physically separated from the second conductive portion (915).

[0119] For example, the first conductive portions (911, 921) of the conductive layers (860, 870) may include portions (913, 917, 923, 927) for electrical connection with the outside of the printed circuit board (800). The portions (913, 923) among the portions for electrical connection (913, 917, 923, 927) may be portions electrically connected to the negative tab (or, first lead tab (331)) (or, first electrode tab (321)). The portions (917, 927) among the portions for electrical connection (913, 917, 923, 927) may be portions electrically connected to the positive tab (or, second lead tab (332)) (or, second electrode tab (322)). For example, the first conductive portions (911, 921) of the conductive layers (860, 870) may include conductive portions (918, 928) that include test points. In one embodiment, electrical connection between the plurality of layers (830, 840, 850, 860, and 870) may be made through via holes disposed in each of the plurality of layers (830, 840, 850, 860, and 870).

[0120] In one embodiment, the conductive layer (860) may include a conductive material (e.g., copper) and another conductive material (e.g., aluminum). In one embodiment, the second conductive portion (915) may include a conductive material (e.g., copper) corresponding to the negative tab. In one embodiment, the third conductive portion (919) may include another conductive material (e.g., aluminum) corresponding to the positive tab.

[0121] In one embodiment, the second conductive portion (915) may be electrically connected to a portion (931) of the conductive layer (860) containing a conductive material (e.g., copper), and the third conductive portion (919) may be electrically connected to another portion (932) of the conductive layer (860) containing a conductive material (e.g., aluminum). For example, the second conductive portion (915) may protrude from the portion (931) of the conductive layer (860) containing a conductive material (e.g., copper), and the third conductive portion (919) may protrude from the other portion (932) of the conductive layer (860) containing a conductive material (e.g., aluminum). Within the conductive layer (860), the portion (931) and the other portion (932) may be electrically separated.

[0122] For example, the conductive layer (870) may include a first conductive portion (921) disposed between two layers (840, 850) among a plurality of layers (830, 840, 850, 860, and 870), a second conductive portion (925) protruding from the first conductive portion (921), and a third conductive portion (929) protruding from the first conductive portion (921) and physically separated from the second conductive portion (925).

[0123] Likewise, the conductive layer (870) may include a conductive material (e.g., copper) and another conductive material (e.g., aluminum). In one embodiment, the second conductive portion (925) may include a conductive material (e.g., copper) corresponding to the negative tab. In one embodiment, the third conductive portion (929) may include another conductive material (e.g., aluminum) corresponding to the positive tab.

[0124] In one embodiment, the second conductive portion (925) may be electrically connected to a portion of the conductive layer (870) containing a conductive material (e.g., copper), and the third conductive portion (929) may be electrically connected to another portion of the conductive layer (870) containing a conductive material (e.g., aluminum). For example, by applying a structure similar to the enlarged view of the conductive layer (860) to the conductive layer (870), the second conductive portion (925) may protrude from a portion of the conductive layer (870) containing a conductive material (e.g., copper), and the third conductive portion (929) may protrude from another portion of the conductive layer (870) containing a conductive material (e.g., aluminum). Within the conductive layer (870), some portions and other portions may be electrically separated.

[0125] In one embodiment, the conductive layer (860) may be laminated on a first surface of the layer (840) (or core layer, substrate layer). In one embodiment, the conductive layer (870) may be laminated on a second surface opposite to the first surface of the layer (840) (or core layer, substrate layer).

[0126] In one embodiment, the first conductive portions (911, 921) may overlap with other layers (830, 840, and 850). In one embodiment, the second conductive portions (915, 925) may not overlap with other layers (830, 840, and 850). In one embodiment, the second conductive portions (915, 925) may overlap with each other. For example, the second conductive portion (915) may overlap with the second conductive portion (925). For example, the second conductive portion (915) and the second conductive portion (925) that overlap with each other may be referred to as the conductive portion (811). In one embodiment, the third conductive portions (919, 929) may overlap with each other. For example, the third conductive portion (919) may overlap with the third conductive portion (929). For example, the third conductive portion (919) and the third conductive portion (929) that overlap each other may be referred to as the conductive portion (812).

[0127] In one embodiment, the conductive portion (811) (or, second conductive portions (915, 925)) may be physically joined to the cathode tab (or, first lead tab (331)) (or first electrode tab (321)) in a welding area (e.g., 360 in FIG. 3b) within the case (e.g., 340 in FIG. 3b). For example, the conductive portion (811) (or, second conductive portions (915, 925)) may be physically joined to the cathode tab by welding to the first lead tab (331) in a welding area (e.g., 360 in FIG. 3b) within the case (e.g., 340 in FIG. 3b). For example, the second conductive parts (915, 925) may have a width (e.g., 8 millimeters) corresponding to the cathode tab (or, first lead tab (331)) (or, first electrode tab (321)).

[0128] In one embodiment, the conductive portion (812) (or, third conductive portions (919, 929)) may be physically joined to the anode tab (or, second lead tab (332)) (or, second electrode tab (322)). For example, the conductive portion (812) (or, third conductive portions (919, 929)) may be physically joined to the anode tab by welding to the second lead tab (332) in a welding area (e.g., 360 in FIG. 3b) within the case (e.g., 340 in FIG. 3b). For example, the third conductive portions (919, 929) may have a width (e.g., 8 millimeters) corresponding to the anode tab (or, second lead tab (332)) (or, second electrode tab (322)).

[0129] In one embodiment, referring to FIG. 10b and FIG. 10c, a printed circuit board (800) in which a conductive portion (811) (or, second conductive portions (915, 925)) is coupled to a first lead tab (331) and a conductive portion (812) (or, third conductive portions (919, 929)) is coupled to a second lead tab (332) can be mounted on a battery (300). For example, a printed circuit board (800) rotated so that the top layer on which components are located faces downward can be mounted on a battery (300).

[0130] In FIGS. 8b and FIG. 9, conductive layers (860, 870) are illustrated as each comprising a second conductive portion (915, 925) for being physically coupled to the negative tab of the battery (300) and a third conductive portion (919, 929) for being physically coupled to the positive tab. However, embodiments are not limited thereto. For example, one of the four conductive layers (e.g., 1st to 4th conductive layers) may include a second conductive portion for being physically coupled to the negative tab, and another conductive layer may include a third conductive portion for being physically coupled to the positive tab. For example, the conductive layer (860) may include a second conductive portion (915), and the conductive layer (870) may include a third conductive portion (929). In this case, the conductive layer (860) may be a copper layer, and the conductive layer (870) may be an aluminum layer.

[0131] As another example, two consecutive conductive layers (e.g., 1st and 2nd conductive layers, 2nd and 3rd conductive layers, or 3rd and 4th conductive layers) among four conductive layers (e.g., 1st and 2nd conductive layers, 2nd and 3rd conductive layers, or 3rd and 4th conductive layers) may include a second conductive portion for being physically coupled to a cathode tab, and two other consecutive conductive layers (e.g., 1st and 2nd conductive layers, 2nd and 3rd conductive layers, or 3rd and 4th conductive layers) may include a third conductive portion for being physically coupled to an anode tab.

[0132] In FIG. 8b and FIG. 9, two conductive layers (860, 870) are illustrated as including second conductive portions (915, 925) for being physically coupled to a negative tab and third conductive portions (919, 929) for being physically coupled to a positive tab. However, embodiments are not limited thereto. For example, one of four conductive layers (e.g., 1st to 4th conductive layers) may include a second conductive portion and a third conductive portion. For example, one conductive layer may be one of a 1st conductive layer (e.g., layers (832, 833)), a 2nd conductive layer (860), a 3rd conductive layer (870), or a 4th conductive layer (layers (852, 853)). For example, two of the four conductive layers (e.g., 1st to 4th conductive layers) may include a second conductive portion and a third conductive portion for being physically bonded to a negative tab or an anode tab. For example, the two conductive layers may be two conductive layers among a 1st conductive layer (e.g., layers (832, 833)), a 2nd conductive layer (860), a 3rd conductive layer (870), or a 4th conductive layer (layers (852, 853)). For example, the two conductive layers may be consecutive conductive layers (e.g., 1st and 2nd conductive layers, 2nd and 3rd conductive layers, or 3rd and 4th conductive layers). For example, three or more of the four conductive layers (e.g., 1st to 4th conductive layers) may include a second conductive portion for being physically bonded to a negative tab. For example, three or more conductive layers may be three or more conductive layers among a 1-layer conductive layer (e.g., layers (832, 833)), a 2-layer conductive layer (860), a 3-layer conductive layer (870), or a 4-layer conductive layer (layers (852, 853)).For example, three or more conductive layers may be continuous conductive layers (e.g., 1 to 3 conductive layers, 2 to 4 conductive layers, or 1 to 4 conductive layers).

[0133] As described above, the printed circuit board (800) may have its length (or width) reduced by the plates (411, 412) for physical connection with the battery (300) compared to the printed circuit board (400) of FIG. 4a by the removal of the plates (411, 412). For example, the length (or width) of the plates (411, 412) (e.g., 12 millimeters) may be reduced. Accordingly, if the printed circuit board (400) is 40 millimeters, the printed circuit board (800) may have its length reduced by 30% compared to the printed circuit board (400) by reducing the length of the plates (411, 412) by 12 millimeters.

[0134] Additionally, the second conductive portions (915, 925) and the third conductive portions (919, 929) of the printed circuit board (800) can serve as lead tabs that are physically coupled to the electrode tab (320) of the battery (300). For example, the printed circuit board (800) can utilize the second conductive portions (915, 925) and the third conductive portions (919, 929) protruding from at least one conductive layer that meets the thickness required for the lead tab as lead tabs that are physically coupled to the electrode tab (320) of the battery (300).

[0135] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs.

[0136] As described above, the battery (189) may include an electrode assembly comprising a positive tab (332) and a negative tab (331), and a printed circuit board (500) having a plurality of layers (530, 540, 550, 560, 570) stacked thereon, each layer comprising a conductive layer (560). The conductive layer (560) may include a first conductive portion (611) disposed between two of the plurality of layers (530, 540, 550, 560, 570), and a second conductive portion (615) protruding from the first conductive portion (611). The second conductive portion (615) of the conductive layer (560) may be coupled to one of the positive tab (332) or the negative tab (331).

[0137] A plate (512) may be placed on the uppermost layer among the plurality of layers (530, 540, 550, 560, 570). The plate (512) may be combined with the other tab among the positive tab (332) or the negative tab (331).

[0138] One of the above tabs may be the negative tab (331). The other tab may be the positive tab (332).

[0139] The printed circuit board (500) may include another conductive layer (570) among the plurality of layers (530, 540, 550, 560, 570). The other conductive layer (570) may include a third conductive portion (621) disposed between two other layers among the plurality of layers (530, 540, 550, 560, 570), and a fourth conductive portion (625) protruding from the third conductive portion (621). The fourth conductive portion (625) of the other conductive layer (560, 570) may be coupled to the one tab.

[0140] The conductive layer (560) may be laminated on a first surface of the substrate layer (540). The other conductive layer (570) may be laminated on a second surface of the substrate layer (540) opposite to the first surface. The second conductive portion (615) may overlap with the fourth conductive portion (625).

[0141] According to one embodiment, the battery (189) may include a printed circuit board (800) that includes another conductive layer (870) among the plurality of layers (830, 840, 850, 860, 870). The other conductive layer (870) may include a third conductive portion (921) disposed between two other layers among the plurality of layers (830, 840, 850, 860, 870), and a fourth conductive portion (929) protruding from the third conductive portion (921). The fourth conductive portion (929) of the other conductive layer (870) may be coupled to the other tab among the positive tab (332) or the negative tab (331).

[0142] The conductive layer (860) may be a copper layer. The other conductive layer (870) may be an aluminum layer.

[0143] The conductive layer (860) may include a third conductive portion (919) that protrudes from the first conductive portion (811) and is spaced apart from the second conductive portion (915). The third conductive portion (919) of the conductive layer (860) may be coupled to the other tab among the positive tab (332) or the negative tab (331).

[0144] The second conductive portion (915) may include copper. The third conductive portion (919) may include aluminum.

[0145] As described above, the electronic device (101) may include a battery (189) and one or more electronic components that receive power from the battery (189). The battery (189) may include an electrode assembly including a positive tab (332) and a negative tab (331), and a protective circuit module disposed thereon, and a printed circuit board (500) having a plurality of layers (530, 540, 550, 560, 570) stacked thereon, including a conductive layer (560). The conductive layer (560) may include a first conductive portion (611) disposed between two of the plurality of layers (530, 540, 550, 560, 570), and a second conductive portion (615) protruding from the first conductive portion (611). The second conductive portion (615) of the conductive layer (560) can be combined with one of the positive tabs (332) or the negative tabs (331).

[0146] A plate (512) may be placed on the uppermost layer among the plurality of layers (530, 540, 550, 560, 570). The plate (512) may be combined with the other tab among the positive tab (332) or the negative tab (331).

[0147] One of the above tabs may be the negative tab (331). The other tab may be the positive tab (332).

[0148] The printed circuit board (500) may include another conductive layer (570) among the plurality of layers (530, 540, 550, 560, 570). The other conductive layer (570) may include a third conductive portion (621) disposed between two other layers among the plurality of layers (530, 540, 550, 560, 570), and a fourth conductive portion (625) protruding from the third conductive portion (621). The fourth conductive portion (625) of the other conductive layer (570) may be coupled to the one tab.

[0149] The conductive layer (560) may be laminated on a first surface of the substrate layer (540). The other conductive layer (570) may be laminated on a second surface of the substrate layer (540) opposite to the first surface. The second conductive portion (615) may overlap with the fourth conductive portion (625).

[0150] According to one embodiment, the battery (189) may include a printed circuit board (800) that includes another conductive layer (870) among the plurality of layers (830, 840, 850, 860, 870). The other conductive layer (870) may include a third conductive portion (921) disposed between two other layers among the plurality of layers (830, 840, 850, 860, 870), and a fourth conductive portion (929) protruding from the third conductive portion (921). The fourth conductive portion (929) of the other conductive layer (870) may be coupled to the other tab among the positive tab (332) or the negative tab (331).

[0151] The conductive layer (860) may be a copper layer. The other conductive layer (870) may be an aluminum layer.

[0152] The conductive layer (860) may include a third conductive portion (919) that protrudes from the first conductive portion (911) and is spaced apart from the second conductive portion (915). The third conductive portion (919) of the conductive layer (860) may be coupled to the other tab among the positive tab (332) or the negative tab (331).

[0153] The second conductive portion (915) may include copper. The third conductive portion (929) may include aluminum.

[0154] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0155] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0156] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0157] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0158] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0159] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0160] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. Regarding batteries, An electrode assembly including a positive electrode tab and a negative electrode tab, and It includes a printed circuit board having a plurality of layers including a conductive layer stacked thereon, on which a protection circuit module is disposed, and The above conductive layer is, A first conductive portion disposed between two of the plurality of layers, and It includes a second conductive portion protruding from the first conductive portion, and The second conductive portion of the conductive layer is coupled to one of the tabs of the positive tab or the negative tab, battery.

2. In Claim 1, A plate is placed on the top layer among the above plurality of layers, and The above plate is coupled to the other tab among the anode tab or the cathode tab, battery.

3. In Claim 2, The above-mentioned tab is the cathode tab, and The other tab mentioned above is the positive tab, battery.

4. In any one of claims 1 to 3, The above printed circuit board includes another conductive layer among the plurality of layers, and The other conductive layer mentioned above is, A third conductive portion disposed between the other two layers among the plurality of layers above, and It includes a fourth conductive portion protruding from the third conductive portion, and The fourth conductive portion of the other conductive layer is combined with the one tab, battery.

5. In Claim 4, The above conductive layer is laminated on a first surface of a substrate layer. The other conductive layer is laminated on a second surface opposite to the first surface of the substrate layer. battery.

6. In Claim 4, The second conductive portion overlaps with the fourth conductive portion, battery.

7. In any one of claims 1 to 6, The above printed circuit board includes another conductive layer among the plurality of layers, and The other conductive layer mentioned above is, A third conductive portion disposed between the other two layers among the plurality of layers above, and It includes a fourth conductive portion protruding from the third conductive portion, and The fourth conductive portion of the other conductive layer is coupled with the other tab among the positive tab or the negative tab, battery.

8. In Claim 7, The above conductive layer is a copper layer, and The other conductive layer mentioned above is an aluminum layer, battery.

9. In any one of claims 1 to 8, The above conductive layer is, It includes a third conductive portion that protrudes from the first conductive portion and is spaced apart from the second conductive portion, The third conductive portion of the above conductive layer is coupled to the other tab among the anode tab or the cathode tab, battery.

10. In Claim 9, The above second conductive portion includes copper, and The above third conductive portion comprises aluminum, battery.

11. In an electronic device, Battery, and It includes one or more electronic components that receive power from the above battery, and The above battery is, An electrode assembly including a positive electrode tab and a negative electrode tab, and A printed circuit board having a protection circuit module disposed thereon and a plurality of layers including a conductive layer stacked thereon, and The above conductive layer is, A first conductive portion disposed between two of the plurality of layers, and It includes a second conductive portion protruding from the first conductive portion, and The second conductive portion of the conductive layer is coupled to one of the tabs of the positive tab or the negative tab, Electronic device.

12. In Claim 11, A plate is placed on the top layer among the above plurality of layers, and The above plate is coupled to the other tab among the anode tab or the cathode tab, Electronic device.

13. In Claim 12, The above-mentioned tab is the cathode tab, and The other tab mentioned above is the positive tab, Electronic device.

14. In any one of claims 11 to 13, The above printed circuit board includes another conductive layer among the plurality of layers, and The other conductive layer mentioned above is, A third conductive portion disposed between the other two layers among the plurality of layers above, and It includes a fourth conductive portion protruding from the third conductive portion, and The fourth conductive portion of the other conductive layer is combined with the one tab, Electronic device.

15. In Claim 14, The above conductive layer is laminated on a first surface of a substrate layer. The other conductive layer is laminated on a second surface opposite to the first surface of the substrate layer. Electronic device.

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