Antenna module and communication device comprising same

Abstract

According to one embodiment, a communication device may comprise an antenna module. The antenna module can include: a printed circuit board; a plurality of antenna elements disposed on a first surface of the printed circuit board; a plurality of filters disposed on the first surface; a conductive portion disposed on the first surface; and a radio frequency (RF) processing circuit disposed on a second surface opposite to the first surface of the printed circuit board. Each of the antenna elements can be spaced apart from the first surface by a support portion. Each of the filters can be disposed between at least two antenna elements from among the plurality of antenna elements. The conductive portion can cover at least a portion of a third region of the first surface, which excludes a first region corresponding to the plurality of antenna elements and a second region corresponding to the plurality of filters.

Description

Antenna module and communication device including the same

[0001] The present disclosure relates to an antenna module and a communication device including the same.

[0002] Products equipped with multiple antennas are being developed to enhance communication performance. It is expected that equipment featuring an even greater number of antennas will be used. As the number of antennas in communication devices increases, the number of RF components (e.g., filters) inevitably increases as well.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to one embodiment, a communication device may include an antenna module. The antenna module may include a printed circuit board, a plurality of antenna elements disposed on a first surface of the printed circuit board, a plurality of filters disposed on the first surface of the printed circuit board, a conductive portion disposed on the first surface of the printed circuit board, and an RF (radio frequency) processing circuit disposed on a second surface opposite to the first surface of the printed circuit board. Each of the plurality of antenna elements may be disposed spaced apart from the first surface by a support portion. Each of the plurality of filters may be disposed between at least two of the plurality of antenna elements. The conductive portion may be formed to cover at least a portion of a third region of the first surface, excluding a first region corresponding to the plurality of antenna elements and a second region corresponding to the plurality of filters.

[0005] According to one embodiment, an antenna module may include a printed circuit board, a plurality of antenna elements disposed on a first surface of the printed circuit board, a plurality of filters disposed on the first surface of the printed circuit board, a conductive portion disposed on the first surface of the printed circuit board, and a radio frequency (RF) processing circuit disposed on a second surface opposite to the first surface of the printed circuit board. Each of the plurality of antenna elements may be disposed spaced apart from the first surface by a support portion. Each of the plurality of filters may be disposed between at least two of the plurality of antenna elements. The conductive portion may be formed to cover at least a portion of a third region of the first surface, excluding a first region corresponding to the plurality of antenna elements and a second region corresponding to the plurality of filters.

[0006] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0007] Figure 1 shows a wireless communication system.

[0008] Figure 2 shows examples of components of a communication device.

[0009] Figure 3a shows an example of a communication device.

[0010] Figure 3b shows an example of the components of a communication device.

[0011] Figure 4a shows an example of a communication device.

[0012] Figure 4b shows an example of components of a communication device.

[0013] FIG. 5a is a perspective view of an antenna module.

[0014] FIG. 5b is a plan view of the antenna module viewed from the first direction.

[0015] FIG. 5c is a conceptual diagram of an antenna module viewed from the second direction.

[0016] FIG. 5d is a plan view of the antenna module viewed from a third direction.

[0017] FIG. 6a is a perspective view of an antenna module including a conductive portion.

[0018] FIG. 6b is a plan view of an antenna module including a conductive portion viewed from a first direction.

[0019] Figure 6c is a schematic view of an antenna module cut along A-A'.

[0020] FIG. 6d is a plan view of the edge portion of the antenna module viewed from the second direction.

[0021] FIG. 7a is a perspective view of an antenna module including a conductive portion.

[0022] Figure 7b is a schematic view of an antenna module cut along B-B'.

[0023] FIG. 8a is a perspective view of an antenna module including a conductive portion.

[0024] Figure 8b is a schematic view of an antenna module cut along C-C'.

[0025] FIG. 9a is a conceptual diagram of an antenna module including a conductive part.

[0026] FIG. 9b is a conceptual diagram of an antenna module including a conductive part.

[0027] Figure 10a shows graphs of an antenna module that does not include a conductive part.

[0028] FIG. 10b is a graph of an antenna module including a conductive part.

[0029] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0030] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0031] Terms used in the following description to refer to components of an electronic device (e.g., insulating plate, substrate, PCB (print circuit board), FPCB (flexible PCB), module, antenna, antenna element, antenna element, circuit, amplifier circuit, processor, chip, component, device), terms referring to the shape of a component (e.g., opening, structure, structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), and terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, amplifier circuit, RF path, RF module, RF circuit, splitter, divider, coupler, combiner) are examples provided for the convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Additionally, terms such as '...part', '...device', '...object', '...body' used below may refer to at least one shape structure or a unit that processes a function.

[0032] Additionally, in this disclosure, expressions of "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions of "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of elements from A (including A) to B (including B). Below, "C" and / or "D" refers to including at least one of "C" or "D," i.e., {'C', 'D', 'C' and 'D'}.

[0033] FIG. 1 illustrates a wireless communication system. The wireless communication environment of FIG. 1 exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), a third terminal (120-3)) as a part of the nodes using a wireless channel.

[0034] Referring to FIG. 1, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance over which it can transmit signals. In addition to being a base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5G node (5th generation node)', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', MMU (Massive MIMO (multiple input multiple output) Unit)', 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU)', 'remote radio head (RRH)', or other terms having an equivalent technical meaning. The base station (110) can transmit downlink signals or receive uplink signals.

[0035] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without user involvement. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as 'user equipment (UE)', 'mobile station', 'subscriber station', 'customer premises equipment (CPE)', 'remote terminal', 'wireless terminal', 'electronic device', or 'vehicle terminal', 'user device', or other terms having an equivalent technical meaning.

[0036] Beamforming technology is utilized as one of the techniques to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally uses multiple antennas to concentrate the reach area of ​​radio waves or to increase the directivity of reception sensitivity in a specific direction. Therefore, to form beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, a base station (110) may be equipped with multiple antennas. A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or an antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0037] A key technology for enhancing the data capacity of 5G communication is beamforming technology using an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased, or the power per RF path must be increased. However, increasing the number of RF paths leads to larger product sizes, and due to spatial constraints in installing actual base station equipment, it is currently impossible to increase them further. To increase antenna gain through high output without increasing the number of RF paths, antenna gain can be increased by connecting multiple antenna elements using dividers (or splitters) in the RF paths. Here, the antenna elements corresponding to the RF paths may be referred to as sub-arrays. As a non-limiting example, sub-array technology may be utilized to increase the signal radiation gain. An antenna array may include multiple sub-arrays. The antennas of the antenna array may be divided into the multiple sub-arrays. The signal may be radiated through each of the antennas of the sub-arrays.

[0038] In FIG. 1, the base station (110) of FIG. 1 is described as an example to explain an electronic device including an antenna, but the embodiments of the present disclosure are not limited thereto. As an electronic device according to the embodiments of the present disclosure, in addition to the base station (110), any wireless equipment performing a function equivalent to that of the base station, wireless equipment connected to the base station (e.g., TRP), the terminal (120) of FIG. 1, or other communication equipment used for 5G communication is possible. Hereinafter, as a structure of multiple antennas for communication in a MIMO (Multiple Input Multiple Output) environment, the present disclosure describes an antenna array composed of sub-arrays as an example, but is not limited to examples where easy modifications for beamforming are possible.

[0039] FIG. 2 illustrates examples of components of a communication device. The communication device may be a base station (110) of FIG. 1 or a component of the base station (110). Meanwhile, unlike what is illustrated, the present disclosure does not exclude the possibility that the communication device may be implemented in a terminal (120).

[0040] Referring to FIG. 2, an exemplary functional configuration of a communication device (210) is illustrated. The communication device (210) may include an antenna section (211), a filter section (212), an RF (radio frequency) processing section (213), and a processor (214).

[0041] The antenna section (211) may include a plurality of antennas. The antennas may perform functions for transmitting and receiving signals through a wireless channel. The antennas may include a radiator made of a conductor (e.g., a metal structure) or a conductive pattern formed on a substrate (e.g., a PCB). The antennas may radiate upconverted signals over a wireless channel or acquire signals radiated by another device. Each antenna may be referred to by an antenna element, antenna component, antenna radiator, radiating part, radiator, and / or equivalent technical terms. The antenna section (211) may include an antenna array in which a plurality of antenna elements form an array. The antenna section (211) may be electrically connected to the filter section (212) via RF signal lines. For example, a plurality of antenna elements of the antenna section (211) may be coupled to a board (e.g., a PCB). The antenna elements may be placed on one side of the board, or a module on which the antenna elements are placed may be placed. The above board may include RF signal lines connecting each antenna element and the RF filters of the filter section (212). The RF signal lines may be referred to as a feeding network. The board may be referred to as a wireless unit board, a wireless unit board, an antenna board, an antenna board, a radiation board, a radiation board, an RF board, an RF board, and / or an equivalent technical term.

[0042] The filter unit (212) can perform filtering to transmit a signal of a desired frequency. The filter unit (212) may include a plurality of RF filters. The RF filters can perform the function of selectively passing a frequency by forming resonance. The filter unit (212) may include at least one of a band-pass filter, a low-pass filter, a high-pass filter, or a band-reject filter. The filter unit (212) may include RF circuits for obtaining a signal in a frequency band for transmission or a frequency band for reception. Each RF filter of the filter unit (212) may be electrically connected to the antennas of the antenna unit (211) and the RF processing circuit of the RF processing unit (213).

[0043] The RF processing unit (213) may include a plurality of RF processing circuits. An RF processing circuit may be a unit for processing a signal received through an antenna or a signal radiated through an antenna. An RF processing circuit may include a plurality of paths corresponding to the antennas. At least one RF processing circuit may be referred to as an RF chain. An RF chain may include a plurality of RF elements. The RF elements may include an amplifier, a mixer, an oscillator, a DAC, an ADC, etc. For example, the RF processing unit (213) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal into an analog RF transmission signal. The up converter and the DAC form part of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Additionally, for example, the RF processing unit (213) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts the digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of the reception path. The reception path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (213) may be implemented on a PCB. The communication device (210) may include a stacked structure in the order of an antenna unit (211) - a filter unit (212) - an RF processing unit (213). The antennas and the RF components of the RF processing unit (213) may be implemented on a PCB, and filters may be repeatedly connected between the PCBs to form multiple layers.For example, the RF processing unit (213) may include a communication chip (e.g., RFIC).

[0044] The processor (214) can control the overall operations of the communication device (210). The processor (214) may be referred to as a control unit, a controller, or a control unit. The processor (214) may include various modules for performing communication. The processor (214) may include at least one processor, such as a modem. The processor (214) may include modules for digital signal processing. For example, the processor (214) may include a modem. When transmitting data, the processor (214) generates complex symbols by encoding and modulating the transmitted bit sequence. Also, for example, when receiving data, the processor (214) restores the received bit sequence by demodulating and decoding the baseband signal. The processor (214) may perform the functions of a protocol stack required by the communication standard.

[0045] In FIG. 2, functional components of a communication device (210) are described as a communication device including a plurality of antennas. However, the example shown in FIG. 2 is merely an exemplary configuration for RF calibration described later, and the embodiments of the present disclosure are not limited to the components of the communication device shown in FIG. 2. For example, even if some of the components of the communication device are omitted or the connection relationships of the components are different, any device including a plurality of antennas (e.g., a communication device, a communication module) can be understood as an embodiment of the present disclosure.

[0046] Figure 3a shows an example of a communication device.

[0047] Referring to FIG. 3a, the communication device (300) may include a front cover (301), an antenna plate (302), a shield can (303), a main PCB (304), and a rear housing (305). For example, the communication device (300) may be referred to as a massive MIMO unit (MMU) or a radio unit (RU).

[0048] According to one embodiment, the front cover (301) may be configured to surround the antenna plate (302). The front cover (301) may protect a plurality of antennas placed on the antenna plate (302). For example, the front cover (301) may be referred to as a radome. For example, the front cover (301) may be configured to reduce transmission loss of the frequency band used in the communication device (300). For example, the front cover (301) may be composed of a material having excellent radio wave transmittance and excellent environmental resistance.

[0049] According to one embodiment, the antenna plate (302) may include a plurality of antennas. For example, the antenna plate (302) may include a plurality of antennas and an antenna substrate for arranging the plurality of antennas (e.g., antenna element, antenna array, antenna sub-array). For example, each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. For the plurality of antennas, the description of the antenna portion (211) of FIG. 2 may be referenced. For example, the plurality of antennas may be arranged on the antenna substrate. The antenna substrate on which the plurality of antennas are arranged may be referred to as an insulating plate, an insulating plate, a radiating substrate, a radiating plate, and / or an equivalent technical term.

[0050] According to one embodiment, an antenna plate (302) may be placed on a shield can (303). The antenna plate (302) may be placed on the shield can (303) so as not to affect the signal emitted through the plurality of antennas included in the antenna plate (302). The shield can (303) can reduce the effect on the signal emitted through the plurality of antennas generated by the components placed on the main PCB (304). According to one embodiment, a plurality of filters may be placed between the shield can (303) and the antenna plate (302). For the plurality of filters, the description of the filter section (212) of FIG. 2 may be referenced.

[0051] According to one embodiment, the main PCB (304) may provide connections between components for transmitting signals through a plurality of antennas. For example, an RF processing circuit may be placed on a first surface of the main PCB (304). A processor may be placed on a second surface opposite to the first surface of the main PCB (304).

[0052] According to one embodiment, the rear housing (305) may include a heat sink to provide protection and heat dissipation for the communication device (300). The heat sink may be configured to dissipate heat generated by the components of the main PCB (304) to the outside.

[0053] Figure 3b shows an example of the components of a communication device.

[0054] Referring to FIG. 3b, Example (380) represents a part of the communication device (300) of FIG. 3a viewed from one direction (e.g., the x-axis or y-axis of FIG. 3a). In Example (380), the communication device (300) (or part of the communication device (300)) may include a PCB (310), a shield can (320), an antenna substrate (330), a filter (340), and a heat sink (350).

[0055] The PCB (310) may include a coin (362). The coin (362) may be placed within the PCB (310) to dissipate heat generated from components of the communication device (300) (e.g., RF processing circuit (363)). The coin (362) may be inserted inside the PCB (310). The coin (362) may be formed to penetrate a first side (e.g., front) and a second side (e.g., rear) of the PCB (310). The coin (362) may be positioned to contact a heat sink (350). Heat generated from components of the communication device (300) (e.g., RF processing circuit (363)) may be transferred to the heat sink (350) through the coin (362). The heat transferred to the heat sink (350) may be discharged to the outside through the rear housing (305) of FIG. 3A.

[0056] An RF processing circuit (363) may be placed on the first side (e.g., front) of the PCB (310). The RF processing circuit (363) may be placed on the coin (362) of the PCB (310). For the RF processing circuit (363), the description of the RF processing unit (213) of FIG. 2 may be referenced.

[0057] A processor (361) may be placed on a second side (e.g., the rear side) of the PCB (310). For the processor (361), the description of the processor (214) in FIG. 2 may be referenced. For example, the processor (361) may include modules for digital signal processing. The processor (361) may include a module for processing a digital signal received from an external device (e.g., a digital unit (DU)).

[0058] The RF processing circuit (363) can be connected to the filter (340) through the connector (368). A transmission signal can be provided to the filter (340) through the connector (368). A reception signal can be provided from the filter (340) through the connector (368). The connector (368) can be connected to the filter (340) by passing through the shield can (320).

[0059] The filter (340) may correspond to at least one of the plurality of filters described in FIG. 3a. The filter (340) may be configured to filter a signal received through the connector (368). For the filter (340), the description of the filter section (212) in FIG. 2 may be referenced.

[0060] An antenna substrate (330) may be placed on a filter (340). The antenna substrate (330) may be part of the antenna plate (302) of FIG. 3a. A plurality of antennas (e.g., antenna element (331), antenna element (332)) may be placed (or implemented) on the antenna substrate (330). The antenna substrate (330) may be connected to the filter (340) through connectors (369) (e.g., RF signal lines, feed networks). The antenna substrate (330) may receive a transmission signal from the filter (340) through the connectors (369). The antenna substrate (330) may provide a reception signal to the filter (340) through the connectors (369).

[0061] Figure 4a shows an example of a communication device.

[0062] Referring to FIG. 4a, the communication device (400) may include a front cover (401), a PCB (402), and a rear housing (403). For example, the communication device (400) may be referred to as a massive MIMO unit (MMU) or a radio unit (RU).

[0063] According to one embodiment, the front cover (401) may be configured to enclose the PCB (402). The front cover (401) may protect the PCB (402) and / or components placed on the PCB (402). For example, the front cover (401) may be referred to as a radome. For example, the front cover (401) may be configured to reduce transmission loss of the frequency band used in the communication device (400). For example, the front cover (401) may be composed of a material with excellent radio wave transmittance and excellent environmental resistance. For example, the front cover (401) may correspond to the front cover (301) of FIG. 3A.

[0064] According to one embodiment, components including a plurality of antennas, a plurality of filters, a processor, and a power amplifier may be disposed on the PCB (402). Components included in the antenna plate (302) and the main PCB (304) of FIG. 3a may be disposed on the PCB (402).

[0065] For example, the PCB (402) may include a plurality of antennas. A plurality of antennas may be disposed on a first surface (e.g., front) of the PCB (402). For example, the plurality of antennas may include antenna elements and support portions. For example, each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. For the plurality of antennas, the description of the antenna portion (211) of FIG. 2 may be referenced. For example, the antenna substrate on which the plurality of antennas are disposed may be referred to as an insulating plate, an insulating plate, a radiating substrate, a radiating plate, and / or an equivalent technical term.

[0066] According to an embodiment, an antenna substrate for a plurality of antennas may be disposed on a first surface (e.g., front) of the PCB (402). A plurality of antennas may be disposed on the antenna substrate. For example, the plurality of antennas and the substrate on which the plurality of antennas are disposed may correspond to the antenna plate (302) of FIG. 3a.

[0067] For example, the PCB (402) may provide connections between components for transmitting signals through a plurality of antennas. A plurality of antennas may be placed on a first surface (e.g., front) of the PCB (402). A power amplifier circuit, an RF processing circuit, a circulator, and a plurality of filters may be placed on a second surface (e.g., rear) of the PCB (402). However, it is not limited thereto. In addition to the components described above, the PCB (402) may further include various components for transmitting signals from the communication device (400).

[0068] According to one embodiment, the rear housing (403) may include a heat sink to provide protection and heat dissipation for the communication device (400). The heat sink may be configured to dissipate heat generated by the components of the PCB (402) to the outside. According to an embodiment, the heat sink may provide the function of a shield can. According to an embodiment, the rear housing (403) may include a heat sink and a shield can.

[0069] In FIG. 4b below, specific examples of the components of the communication device (400) will be described later.

[0070] Figure 4b shows an example of components of a communication device.

[0071] Referring to FIG. 4b, example (480) represents a part of the communication device (400) of FIG. 4a viewed from one direction (e.g., the x-axis or y-axis of FIG. 3a). In example (480), the communication device (400) (or part of the communication device (400)) may include a PCB (410), a plurality of antennas (420), and a heat sink (430).

[0072] The PCB (410) shown in example (480) may be part of the PCB (402) of FIG. 4a. The plurality of antennas (420) shown in example (480) may be part of the plurality of antennas described in FIG. 4a. The heat sink (430) shown in example (480) may be part of the heat sink described in FIG. 4a.

[0073] According to one embodiment, a plurality of antennas (420) may be placed on a PCB (402). According to an embodiment, a plurality of antennas (420) may be placed on an antenna substrate. The antenna substrate may be placed on the PCB (402).

[0074] The PCB (402) (or antenna board) may include RF signal lines connecting a plurality of antennas (420) and a filter (413). The RF signal lines may be referred to as a feeding network.

[0075] According to one embodiment, the PCB (402) may include a processor (411), an RF processing circuit (412), and a filter (413). This is exemplary, and the PCB (402) may further include various components for transmitting and / or receiving signals.

[0076] For example, the processor (411), RF processing circuit (412), and filter (413) may be placed on a second side (e.g., the rear side) of the PCB (402). For example, the processor (411) may include modules for digital signal processing. For the processor (411), the description of the processor (214) in FIG. 2 may be referenced. For the RF processing circuit (412), the description of the RF processing unit (213) in FIG. 2 may be referenced. For the filter (413), the description of the filter unit (212) in FIG. 2 may be referenced.

[0077] According to one embodiment, at least some of the components placed on the second side (e.g., rear) of the PCB (402) (e.g., processor (411), RF processing circuit (412)) may be placed to be in contact with the heat sink (430). Heat generated from at least some of the components placed on the second side (e.g., rear) of the PCB (402) (e.g., processor (411) or RF processing circuit (412))) may be transferred to the heat sink (430). The heat transferred to the heat sink (430) may be discharged to the outside through the rear housing (403) of FIG. 4a.

[0078] According to one embodiment, a PCB (402) and various components placed on the PCB (402) may be referred to as an antenna module. For example, the antenna module may include a PCB (402), a processor (411), an RF processing circuit (412), a filter (413), and a plurality of antennas (420).

[0079] Unlike the communication device (300) described in FIGS. 3a and 3b, a plurality of antennas may be disposed on a first surface (e.g., front) of the PCB (402) of the communication device (400), and components for transmitting and / or receiving signals may be disposed on a second surface (e.g., rear) of the PCB (402). Due to the large area occupied by the filter (or plurality of filters) on the second surface of the PCB (402), an unnecessary area (481) may be formed on the first surface. If the filter (413) is disposed on the PCB (402) within the space (or remaining space) formed by the plurality of antennas (420), the unnecessary area (481) may be reduced. Accordingly, the specification below will describe a specific example of an antenna module in which a plurality of antennas and a plurality of filters are disposed on the first surface of the PCB.

[0080] FIG. 5a is a perspective view of an antenna module.

[0081] Referring to FIG. 5a, the antenna module (500) may include a plurality of antenna elements (510), a plurality of filters (520), and a PCB (530). FIG. 5a may show a first surface (e.g., front) of the antenna module (500). Although not shown, the remaining components (e.g., processor, RF processing circuit) excluding the plurality of antenna elements (510) and the plurality of filters (520) may be placed on a second surface (e.g., rear) of the antenna module (500).

[0082] According to one embodiment, each of the plurality of antenna elements (510) may be positioned so as to be spaced apart from the first surface (e.g., front) of the PCB (530) by a first length by a support portion. For example, among the plurality of antenna elements (510), an antenna element (511) may be positioned so as to be spaced apart from the first surface (e.g., front) of the PCB (530) by a first length by a support portion (541). Among the plurality of antenna elements (510), an antenna element (512) may be positioned so as to be spaced apart from the first surface (e.g., front) of the PCB (530) by a first length by a support portion (542). Among the plurality of antenna elements (510), an antenna element (513) may be positioned so as to be spaced apart from the first surface (e.g., front) of the PCB (530) by a first length by a support portion (543). Among the plurality of antenna elements (510), the antenna element (514) may be positioned so as to be spaced apart from the first surface (e.g., front) of the PCB (530) by a first length by a support portion (544). Among the plurality of antenna elements (510), the antenna element (515) may be positioned so as to be spaced apart from the first surface (e.g., front) of the PCB (530) by a first length by a support portion (545). Among the plurality of antenna elements (510), the antenna element (516) may be positioned so as to be spaced apart from the first surface (e.g., front) of the PCB (530) by a first length by a support portion (546).

[0083] For example, the first length may correspond to the height of the support portion (e.g., support portion (541) to support portion (546)). Depending on the height of the support portion, the distance from the first surface to which the antenna element connected to the support portion is separated may change.

[0084] According to one embodiment, the number of multiple antenna elements (510) can be set in various ways. For example, the number of multiple antenna elements (510) can be configured as one of 64, 128, or 192.

[0085] According to one embodiment, each of the plurality of filters (520) may be positioned between at least two of the plurality of antenna elements (510). For example, filters (521) and (522) may be positioned between antenna element (511) (or support part (541)) and antenna element (513) (or support part (543)). Filters (523) and (524) may be positioned between antenna element (512) (or support part (542)) and antenna element (514) (or support part (544)).

[0086] According to one embodiment, the number of multiple antenna elements (510) may be greater than the number of multiple filters (520). For example, two filters may be placed on the PCB (530) for every three antenna elements. For example, filters (521) and filters (522) may be used for antenna elements (511), antenna elements (513), and antenna elements (515) (or a sub-array including antenna elements (511), antenna elements (513), and antenna elements (515). Filters (521) and filters (522) may be connected to antenna elements (511), antenna elements (513), and antenna elements (515). For example, filters (523) and filters (524) may be used for antenna elements (512), antenna elements (514), and antenna elements (516) (or a sub-array including antenna elements (512), antenna elements (514), and antenna elements (516). Filters (523) and filters (524) may be connected to antenna elements (512), antenna elements (514), and antenna elements (516). However, they are not limited thereto. For example, depending on the structure (or performance) of the filters, one filter per three antenna elements (e.g., sub-array) may be placed on the PCB (530).

[0087] For example, each of the plurality of filters (520) may have a height of a second length that is smaller than the first length. Each of the plurality of filters (520) may be placed within a space formed by two adjacent antenna elements among the plurality of antenna elements (510). For example, two adjacent antenna elements may be spaced apart by a length (d1). The length (d2) of the filter placed between two adjacent antenna elements may be greater than the length (d1). For example, the filter may be placed within a space formed by two adjacent antenna elements and two support parts. For example, the filter (541) may be placed within a space formed based on an antenna element (511), an antenna element (513), a support part (541), and a support part (543).

[0088] For example, multiple filters (520) may be arranged in a row. For example, filters (521), (522), (523), and (524) may be arranged in a row. However, this is not limited thereto.

[0089] According to an embodiment, each of the plurality of antenna elements (510) may be placed in the remaining area (or remaining space) after the antenna elements (510) are placed on the PCB (530). For example, unlike as shown in FIG. 5a, filters (521) and filters (522) may be placed between antenna element (511) (or support part (541)) and antenna element (513) (or support part (543)), and filters (523) and filters (524) may be placed between antenna element (514) (or support part (544)) and antenna element (516) (or support part (546)). For example, unlike as shown in FIG. 5a, the plurality of filters (520) may be placed along the edges of the PCB (530) after the plurality of antenna elements (510) are placed on the PCB (530).

[0090] FIG. 5b is a plan view of the antenna module viewed from the first direction.

[0091] FIG. 5c is a conceptual diagram of an antenna module viewed from the second direction.

[0092] FIG. 5d is a plan view of the antenna module viewed from a third direction.

[0093] FIG. 5b is a plan view of the antenna module (500) of FIG. 5a viewed in a first direction (e.g., -z axis direction). FIG. 5c is a plan view of the antenna module (500) of FIG. 5a viewed in a second direction (e.g., -y axis direction). FIG. 5d is a plan view of the antenna module (500) of FIG. 5a viewed in a third direction (e.g., x axis direction).

[0094] Referring to FIG. 5b, a first surface (e.g., front) of a PCB (530) may be shown in FIG. 5b. Within the first surface, a plurality of antenna elements (510) may occupy a first area. Within the first surface, a plurality of filters (520) may occupy a second area.

[0095] For example, at least a portion of the first area may overlap with at least a portion of the second area. For example, the area occupied by the antenna element (511) within the first surface may overlap with the area occupied by the filter (521) and / or the filter (522). When looking at the first surface of the antenna module (500), the antenna element (511) may appear to overlap with the filter (521) and / or the filter (522). The area occupied by the antenna element (513) within the first surface may overlap with the area occupied by the filter (521) and / or the filter (522). When looking at the first surface of the antenna module (500), the antenna element (513) may appear to overlap with the filter (521) and / or the filter (522).

[0096] Referring to FIG. 5c, a plurality of antenna elements (510) and a plurality of filters (520) may be disposed on a first surface (e.g., front) of the PCB (530). Each of the plurality of filters (520) may be disposed between two adjacent antenna elements. A processor (411) and / or an RF processing circuit (412) may be disposed on a second surface (e.g., rear) of the PCB (530) of the antenna module (500).

[0097] For example, as a plurality of filters (520) are placed on the second surface of the PCB (530), the unnecessary area (481) shown in FIG. 4b may not occur. Therefore, since the unnecessary area of ​​the PCB (530) is not created, the overall size of the antenna module (500) may be reduced.

[0098] Referring to FIG. 5d, when the antenna module (500) of FIG. 5a is viewed in a third direction (e.g., x-axis direction), antenna elements (511), antenna elements (513), and antenna elements (515) may be arranged in a line. For example, a plurality of antenna elements (510) may be spaced apart from each other by a length (d1). The distance between antenna elements (511) and antenna elements (513) may be a length (d1). Antenna elements (511) and antenna elements (513) may be spaced apart from each other by a length (d1). The horizontal length of each of the plurality of filters (520) may be a length (d2). The length (d2) may be greater than the length (d1). For example, each of the plurality of antenna elements (510) may be spaced apart from the first surface of the PCB (530) by a length (h1). For example, the height of each of the support parts for a plurality of antenna elements (510) may be length (h1). In order for each of the plurality of filters (520) to be placed between at least two antenna elements, the height of each of the plurality of filters (520) may be length (h2). Length (h1) may be greater than length (h2).

[0099] According to one embodiment, the filter (521) may be placed within the space formed by the antenna element (511), the antenna element (513), the support portion (541), and the support portion (543). Depending on the placement of the filter (521), distortion of the beam emitted by the antenna elements adjacent to the filter (521) may occur. For example, a signal may be radiated in direction (591) and direction (592) by the antenna element (513). Since the filter (521) is located in the direction (591) where the signal is radiated, mutual coupling may occur between the antenna element (513) and the filter (521). Additionally, since the filter (521) is located only in direction (591) among direction (591) and direction (592), the signal may be radiated asymmetrically. Therefore, the side-lobe and CPR (cross-polarization ratio) characteristics of the antenna module (500) may deteriorate, and beam distortion may occur.

[0100] According to one embodiment, in order to minimize beam distortion, the antenna module (500) may further include a conductive portion. For example, a conductive portion may further include a first surface of the PCB (530) of the antenna module (500). In the specification below, a specific example of an antenna module (500) including a conductive portion disposed on the first surface of the PCB (530) will be described.

[0101] FIG. 6a is a perspective view of an antenna module including a conductive portion.

[0102] FIG. 6b is a plan view of an antenna module including a conductive portion viewed from a first direction.

[0103] Figure 6c is a schematic view of an antenna module cut along A-A'.

[0104] FIG. 6d is a plan view of the edge portion of the antenna module viewed from the second direction.

[0105] FIG. 6b is a plan view of the antenna module (500) of FIG. 6a viewed in a first direction (e.g., -z axis direction). FIG. 6c is a conceptual diagram of the antenna module (500) of FIG. 6a cut along A-A'. FIG. 6d is a plan view of the antenna module (500) of FIG. 6a viewed in a third direction (e.g., x axis direction) of the edge portion of the antenna module (500) of FIG. 6a.

[0106] Referring to FIG. 6a, the antenna module (500) of FIG. 6a may include the components of the antenna module (500) of FIG. 5a through 5d. For the antenna module (500) of FIG. 6a (or the components included in the antenna module (500) of FIG. 6a), the description of the antenna module (500) of FIG. 5a through 5d (or the components included in the antenna module (500) of FIG. 5a through 5d) may be referenced. According to an embodiment, the antenna module (500) of FIG. 6a may be repeatedly arranged in a plane.

[0107] According to one embodiment, the antenna module (500) may include a conductive portion (560). For example, the conductive portion (560) may be composed of a metal plate. The conductive portion (560) may be composed of a PCB, FPCB, or plastic plated with a conductive material.

[0108] For example, the conductive portion (560) may be formed to cover at least a portion of a third area, excluding a first area corresponding to a plurality of antenna elements (510) and a second area corresponding to a plurality of filters (520) on the first surface of the PCB (530). For example, the conductive portion (560) may be formed to cover at least a portion of a third area, excluding a first area occupied by a plurality of antenna elements (510) and a second area occupied by a plurality of filters (520) on the first surface of the PCB (530).

[0109] According to one embodiment, the conductive portion (560) may include openings corresponding to a first region and a second region. For example, the conductive portion (560) may include openings corresponding to each of a plurality of antenna elements (510). For example, the conductive portion (560) may include an opening (551) corresponding to an antenna element (511). The conductive portion (560) may include an opening (552) corresponding to an antenna element (512). The conductive portion (560) may include an opening (553) corresponding to an antenna element (513). The conductive portion (560) may include an opening (554) corresponding to an antenna element (514). The conductive portion (560) may include an opening (555) corresponding to an antenna element (515). The conductive portion (560) may include an opening (556) corresponding to the antenna element (516). For example, the size of the opening corresponding to the antenna element may be equal to the size of the antenna element or smaller than the size of the antenna element. However, it is not limited thereto.

[0110] For example, the conductive portion (560) may include an opening corresponding to each of the plurality of filters (520). For example, since the plurality of filters (520) are arranged continuously on the first surface of the PCB (530), the conductive portion (560) may include one opening (550) for the plurality of filters (520).

[0111] According to one embodiment, the opening (551), opening (552), opening (553), and opening (554) may overlap with the opening (550). Thus, the opening (550), and the openings (551), opening (552), opening (553), and opening (554) may form a single opening. However, this is not limited thereto.

[0112] According to one embodiment, the conductive portion (560) may include a top plate (e.g., the top plate (561) of FIG. 6b) and at least one side plate (e.g., the side plate (562) of FIG. 6d). At least one side plate may support the top plate.

[0113] Referring to FIG. 6b, a first surface of a PCB (530) may be illustrated. Within the first surface, a plurality of antenna elements (510) may occupy a first region. Within the first surface, a plurality of filters (520) may occupy a second region. A conductive portion (560) may be formed to cover at least some or all of a third region within the first surface, excluding the first region occupied by the plurality of antenna elements (510) and the second region occupied by the plurality of filters (520). For example, within the first surface of the PCB (530), at least some or all of the third region may be covered by a top plate (561) of the conductive portion (560).

[0114] According to one embodiment, the conductive portion (560) may include a plurality of openings for a plurality of antenna elements (510) and a plurality of filters (520) to be exposed to the outside. For example, the antenna module (500) may include an opening (559) for the antenna elements of the upper two rows of the plurality of antenna elements (510) shown in FIG. 6b and for the plurality of filters (520). The antenna module (500) may include openings (e.g., opening (515), opening (516)) for the antenna elements of the remaining one row of the plurality of antenna elements (510). However, it is not limited thereto. The antenna module (500) shown in FIG. 6b is exemplary, and when the positions where the plurality of filters (520) are placed on the first surface of the PCB (530) are changed, the positions of the openings of the conductive portion (560) may also be changed.

[0115] According to one embodiment, the antenna module (500) may include fasteners (580) for joining a conductive portion (560) and a PCB (530). The conductive portion (560) and the PCB (530) may be joined by the fasteners (580). For example, at least one of a screw, a rivet, and / or a bolt may be used for each of the fasteners (580). The fasteners (580) may be arranged along the edges of the PCB (530). For example, fasteners (580-1), (580-2), (580-3), and (580-4) may be arranged along the edges of the PCB (530).

[0116] Referring to FIG. 6c, the conductive portion (560) may be connected to a region (600) for providing ground. To reduce the impact on signals (or beams) emitted from a plurality of antenna elements (510), the conductive portion (560) may be connected to a region (600) for providing ground. For example, the conductive portion (560) may be connected to a region (600) for providing ground via path (601) and / or path (602). For example, the conductive portion (560) may be connected to the ground of the PCB (530) via path (601) and / or path (602). However, it is not limited thereto. Depending on the embodiment, the conductive portion (560) may not be connected to ground.

[0117] According to one embodiment, the path (701) and / or path (602) may be provided by a side plate of the conductive portion (560). As the side plate of the conductive portion (560) is connected to a region (600) for providing ground of the PCB (530), the path (601) and / or path (602) may be formed.

[0118] According to one embodiment, the path (601) and / or path (602) may be provided by at least one of the fasteners (580). As at least one of the fasteners for joining the conductive portion (560) and the PCB (530) is connected to the area (600) for providing ground of the PCB (530), the path (601) and / or path (602) may be formed.

[0119] Although not illustrated, the PCB (530) may include at least one conductive pattern used as at least one feed line for a plurality of antenna elements (510). At least one conductive pattern may be placed on a first surface of the PCB (530). At least one conductive pattern may be connected to a support portion of the plurality of antenna elements (510). Each of the plurality of antenna elements (510) may receive or transmit a signal through the support portion connected to the antenna element.

[0120] Referring to FIG. 6d, an edge portion of an antenna module (500) including a fastening portion (580-1) and an antenna element (511) is shown. For example, a conductive portion (560) can be coupled to a PCB (530) through the fastening portion (580-1).

[0121] According to one embodiment, each of the plurality of antenna elements (510) may be spaced apart from the first surface of the PCB (530) by a length (h1). The height of each of the plurality of filters (520) may be a length (h2). The length (h1) may be greater than the length (h2). The top plate of the conductive portion (560) (e.g., the top plate (561) of FIG. 6b) may be spaced apart from the first surface of the PCB (530) by a length (h3).

[0122] For example, the antenna element (511) may be spaced apart from the first surface of the PCB (530) by a length (h1). The height of the filter (521) may be a length (h2). The top plate of the conductive part (560) (e.g., the top plate (561) in FIG. 6b) may be spaced apart from the first surface of the PCB (530) by a length (h3). The conductive part (560) may have a height of a length (h3). For example, if the conductive part (560) has a side plate (562), the side plate (562) of the conductive part (560) may have a height of a length (h3).

[0123] According to one embodiment, in order to provide a substantially flat surface through a plurality of filters (520) and a conductive portion (560), the length (h3) may correspond to the length (h2). For example, the conductive portion (560) may have a height of length (h3) corresponding to length (h2) to reduce distortion of the signal emitted from the plurality of antenna elements (510). Unlike FIG. 6d, according to an embodiment, the conductive portion (560) may be formed such that the height of the fastening portions (580) also has length (h3).

[0124] FIG. 7a is a perspective view of an antenna module including a conductive portion.

[0125] Figure 7b is a schematic view of an antenna module cut along B-B'.

[0126] Referring to FIGS. 7a and 7b, the antenna module (500) of FIGS. 7a and 7b may include components of the antenna module (500) of FIGS. 6a through 6d. For the antenna module (500) of FIG. 7a (or components included in the antenna module (500) of FIG. 7a), the description of the antenna module (500) of FIGS. 6a through 6d (or components included in the antenna module (500) of FIG. 6a through 6d) may be referenced. FIG. 7b is a conceptual diagram of the antenna module (500) of FIG. 7a cut along B-B'.

[0127] Referring to FIGS. 7a and 7b, a plurality of slits (700) may be formed on the top plate (561) of the conductive portion (560). The conductive portion (560) may include a plurality of slits (700). For example, the plurality of slits (700) may be distinguished from a plurality of openings included in the conductive portion (560). The plurality of openings may be formed for a plurality of antenna elements (510) and a plurality of filters (520). The plurality of slits (700) may be formed to reduce beam distortion of the plurality of antenna elements (510).

[0128] For example, a plurality of slits (700) may be formed along the edge of the conductive portion (560). For example, a slit (700-1) may be formed at the edge of the conductive portion (560) adjacent to the antenna element (511). A slit (700-2) may be formed at the edge of the conductive portion (560) adjacent to the antenna element (512). A slit (700-3) may be formed at the edge of the conductive portion (560) adjacent to the antenna element (515). A slit (700-4) may be formed at the edge of the conductive portion (560) adjacent to the antenna element (516).

[0129] Although not illustrated, at least some or all of the plurality of slits (700) may be formed between at least two of the plurality of antenna elements (510). For example, at least one slit may be formed between antenna element (513) and antenna element (515). For example, at least one slit may be formed between antenna element (514) and antenna element (516). For example, at least one slit may be formed between element (511) and antenna element (512). At least one slit may be formed between element (513) and antenna element (514). At least one slit may be formed between element (515) and antenna element (516). As described above, the location where at least one slit is formed in the conductive portion (560) may not be limited. At least one slit may be formed in various ways in the conductive portion (560). According to an embodiment, if the conductive portion (560) includes a side plate, at least one slit may be formed in the side plate of the conductive portion (560).

[0130] FIG. 8a is a perspective view of an antenna module including a conductive portion.

[0131] Figure 8b is a schematic view of an antenna module cut along C-C'.

[0132] The antenna module (500) of FIGS. 8a and 8b may include the components of the antenna module (500) of FIGS. 6a through 6d. For the antenna module (500) of FIG. 8a (or the components included in the antenna module (500) of FIG. 8a), the description of the antenna module (500) of FIG. 6a through 6d (or the components included in the antenna module (500) of FIG. 6a through 6d) may be referenced. FIG. 8b is a conceptual diagram of the antenna module (500) of FIG. 8a cut along C-C'.

[0133] Referring to FIGS. 8A and 8B, a plurality of conductive patterns (800) may be disposed on the top plate (561) of the conductive portion (560). The conductive portion (560) may include a plurality of conductive patterns (800). The plurality of conductive patterns (800) may be disposed to reduce beam distortion of the plurality of antenna elements (510). In FIGS. 8A and 8B, an example is shown in which the shape of each of the plurality of conductive patterns (800) is configured in a U-shape, but the shape of each of the plurality of conductive patterns (800) may be formed in various ways.

[0134] For example, a conductive pattern (800-1) may be placed at the edge of a conductive portion (560) adjacent to an antenna element (511). A conductive pattern (800-2) may be placed at the edge of a conductive portion (560) adjacent to an antenna element (513). A filter (521) may be placed between the conductive pattern (800-1) and the conductive pattern (800-2). For example, a conductive pattern (800-3) may be placed between the antenna element (511) and the antenna element (512). A conductive pattern (800-4) may be placed between the antenna element (513) and the antenna element (514). A filter (522) and / or a filter (523) may be placed between the conductive pattern (800-3) and the conductive pattern (800-4).

[0135] According to one embodiment, the location where at least one conductive pattern is formed on the conductive portion (560) may not be limited. For example, at least one conductive pattern may be placed between the element (515) and the antenna element (516). For example, at least one conductive pattern may be placed between the element (513) and the antenna element (515). For example, at least one conductive pattern may be placed between the element (514) and the antenna element (516). According to an embodiment, at least some or all of the plurality of conductive patterns (800) may be placed along the edges of the conductive portion (560). According to an embodiment, if the conductive portion (560) includes a side plate, at least one conductive pattern may be placed on the side plate of the conductive portion (560).

[0136] FIG. 9a is a conceptual diagram of an antenna module including a conductive part.

[0137] FIG. 9b is a conceptual diagram of an antenna module including a conductive part.

[0138] The antenna module (500) of FIGS. 9a and 9b may include the components of the antenna module (500) of FIGS. 6a to 6d. For the antenna module (500) of FIGS. 9a and 9b (or the components included in the antenna module (500) of FIGS. 9a and 9b), the description of the antenna module (500) of FIGS. 6a to 6d (or the components included in the antenna module (500) of FIGS. 6a to 6d) may be referenced.

[0139] Referring to FIG. 9a, the example (910) may be another example of the antenna module (500) illustrated in FIG. 6c. The conductive portion (560) may include a top plate (561). The conductive portion (560) may include an extension portion (911) and / or an extension portion (912) extending from the edge of the top plate (561).

[0140] For example, the angle between the extension part (911) and the top plate (561) may be greater than the reference angle (e.g., 90 degrees). The angle between the extension part (912) and the top plate (561) may be greater than the reference angle (e.g., 90 degrees). For example, the direction in which the extension part (911) and / or the extension part (912) are facing may be distinguishable from the direction in which the top plate (561) is facing.

[0141] Referring to FIG. 9b, the example (920) may be another example of the antenna module (500) illustrated in FIG. 6c. The conductive portion (560) may include a top plate (561). The conductive portion (560) may include an extension portion (921) and / or an extension portion (922) extending from the edge of the top plate (561).

[0142] For example, the angle between the extension part (921) and the top plate (561) may be less than or equal to a reference angle (e.g., 90 degrees). The angle between the extension part (922) and the top plate (561) may be less than or equal to a reference angle (e.g., 90 degrees). For example, the direction in which the extension part (921) and / or the extension part (922) are facing may be distinguishable from the direction in which the top plate (561) is facing.

[0143] In FIGS. 7a and 7b, an example is illustrated in which a plurality of slits (700) are included in the conductive portion (560). In FIGS. 8a and 8b, an example is illustrated in which a plurality of conductive patterns (800) are included in the conductive portion (560). FIGS. 9a and 9b illustrate an example in which extension portions (911, 912, 921, 922) of the edge of the conductive portion (560) are included. The examples described above are described independently, but are exemplary and are not limited thereto. According to one embodiment, the conductive portion (560) may include at least one or all of the slits, conductive patterns, and / or extension portions.

[0144] Figure 10a shows graphs of an antenna module that does not include a conductive part.

[0145] FIG. 10b is a graph of an antenna module including a conductive part.

[0146] Referring to FIG. 10a, graph (1011) may represent the gain for co-polarization of an antenna module that does not include a conductive part (e.g., antenna module (500) of FIG. 5a). Graph (1012) may represent the gain for cross-polarization of an antenna module that does not include a conductive part (e.g., antenna module (500) of FIG. 6a). The horizontal axis of graph (1011) and graph (1012) may be an angle with respect to the z-axis on the xy-plane (or an angle in the azimuth plane) (unit: degrees, °), and the vertical axis may be referenced as relative gain (unit: decibel, dB).

[0147] Referring to FIG. 10b, graph (1021) may represent the gain for co-polarization of an antenna module containing a conductive part (e.g., antenna module (500) of FIG. 6a). Graph (1022) may represent the gain for cross-polarization of an antenna module not containing a conductive part (e.g., antenna module (500) of FIG. 6a). The horizontal axis of graph (1021) and graph (1022) may be an angle with respect to the z-axis on the xy-plane (or an angle in the azimuth plane) (unit: degrees, °), and the vertical axis may be referenced as relative gain (unit: decibel, dB).

[0148] Referring to graphs (1011) and (1021), when the antenna module includes a conductive part, the first side-lobe is improved. Referring to graphs (1012) and (1022), when the antenna module includes a conductive part, the gain is reduced at the angle of 0 degrees, so the cross-polarization ratio (CPR) is improved.

[0149] According to one embodiment, a communication device may include an antenna module. The antenna module may include a printed circuit board, a plurality of antenna elements disposed on a first surface of the printed circuit board, a plurality of filters disposed on the first surface of the printed circuit board, a conductive portion disposed on the first surface of the printed circuit board, and an RF (radio frequency) processing circuit disposed on a second surface opposite to the first surface of the printed circuit board. Each of the plurality of antenna elements may be disposed spaced apart from the first surface by a support portion. Each of the plurality of filters may be disposed between at least two of the plurality of antenna elements. The conductive portion may be formed to cover at least a portion of a third region of the first surface, excluding a first region corresponding to the plurality of antenna elements and a second region corresponding to the plurality of filters.

[0150] For example, each of the plurality of antenna elements may be arranged to be spaced apart from the first surface by a first length by the support portion. Each of the plurality of filters may have a height of a second length that is smaller than the first length.

[0151] For example, the conductive portion may have a height of a third length corresponding to the second length to reduce distortion of the signal emitted from the plurality of antenna elements.

[0152] For example, the conductive portion may be connected to ground provided on the printed circuit board.

[0153] For example, the conductive portion may include a plurality of openings for the plurality of antenna elements and the plurality of filters to be exposed to the outside.

[0154] For example, the conductive portion may include at least one slit distinct from the plurality of openings.

[0155] For example, at least a portion of the first region may overlap with at least a portion of the second region.

[0156] For example, the conductive portion may include a top plate and at least one fastening portion.

[0157] For example, the conductive portion and the printed circuit board may be joined by the at least one fastening portion.

[0158] For example, the top plate may include at least one conductive pattern. Each of the at least one conductive pattern may be disposed on the top plate between at least two antenna elements among the plurality of antenna elements.

[0159] For example, the number of the plurality of antenna elements may be greater than the number of the plurality of filters.

[0160] According to one embodiment, an antenna module may include a printed circuit board, a plurality of antenna elements disposed on a first surface of the printed circuit board, a plurality of filters disposed on the first surface of the printed circuit board, a conductive portion disposed on the first surface of the printed circuit board, and a radio frequency (RF) processing circuit disposed on a second surface opposite to the first surface of the printed circuit board. Each of the plurality of antenna elements may be disposed spaced apart from the first surface by a support portion. Each of the plurality of filters may be disposed between at least two of the plurality of antenna elements. The conductive portion may be formed to cover at least a portion of a third region of the first surface, excluding a first region corresponding to the plurality of antenna elements and a second region corresponding to the plurality of filters.

[0161] For example, each of the plurality of antenna elements may be arranged to be spaced apart from the first surface by a first length by the support portion. Each of the plurality of filters may have a height of a second length that is smaller than the first length.

[0162] For example, the conductive portion may have a height of a third length corresponding to the second length to reduce distortion of the signal emitted from the plurality of antenna elements.

[0163] For example, the conductive portion may be connected to ground provided on the printed circuit board.

[0164] For example, the conductive portion may include a plurality of openings for the plurality of antenna elements and the plurality of filters to be exposed to the outside.

[0165] For example, the conductive portion may include at least one slit distinct from the plurality of openings.

[0166] For example, the conductive portion may include a top plate and at least one fastening portion.

[0167] For example, the conductive portion and the printed circuit board may be joined by the at least one fastening portion.

[0168] For example, the top plate may include at least one conductive pattern. Each of the at least one conductive pattern may be disposed on the top plate between at least two antenna elements among the plurality of antenna elements.

[0169] Methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0170] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the embodiments described in the claims or specification of this disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0171] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0172] Additionally, the program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WAN (wide area network), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0173] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0174] According to embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Generally or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components in the same or similar manner as those performed by the corresponding component among the plurality of components prior to integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0175] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure.

Claims

1. In a communication device, It includes an antenna module, and the antenna module is, Printed circuit board; A plurality of antenna elements disposed on a first surface of the above printed circuit board; A plurality of filters disposed on the first surface of the printed circuit board; A conductive portion disposed on the first surface of the printed circuit board; and It includes an RF (radio frequency) processing circuit disposed on a second surface opposite to the first surface of the printed circuit board, and Each of the above plurality of antenna elements is, It is positioned to be spaced apart from the first surface by means of a support part, and Each of the above plurality of filters is, It is disposed between at least two of the plurality of antenna elements, and The above conductive part is, Among the first surfaces, formed to cover at least a portion of a third region excluding a first region corresponding to the plurality of antenna elements and a second region corresponding to the plurality of filters. Communication device.

2. In claim 1, each of the plurality of antenna elements is, It is positioned so as to be spaced apart from the first surface by a first length by the above support portion, Each of the above plurality of filters is, having a height of a second length smaller than the first length, Communication device.

3. In claim 2, the conductive portion is, To reduce distortion of the signal emitted from the plurality of antenna elements, having a height of a third length corresponding to the second length, Communication device.

4. In claim 1, the conductive portion is, Connected to the ground provided on the above printed circuit board, Communication device.

5. In claim 1, the conductive portion is, A plurality of openings for the plurality of antenna elements and the plurality of filters to be exposed to the outside, Communication device.

6. In claim 5, the conductive portion is, further comprising at least one slit distinct from the plurality of openings mentioned above, Communication device.

7. In claim 1, at least a portion of the first region is, Overlapping with at least a portion of the second area above, Communication device.

8. In claim 1, the conductive portion is, Top plate; and including at least one fastening part, Communication device.

9. In claim 8, the conductive portion and the printed circuit board are, coupled by the above-mentioned at least one fastening part, Communication device.

10. In claim 9, the top plate is, It includes at least one conductive pattern, Each of the above-mentioned at least one conductive pattern is, Among at least two antenna elements of the plurality of antenna elements, disposed on the top plate, Communication device.

11. In claim 1, the number of the plurality of antenna elements is, More than the number of the aforementioned multiple filters, Communication device.

12. In an antenna module, Printed circuit board; A plurality of antenna elements disposed on a first surface of the above printed circuit board; A plurality of filters disposed on the first surface of the printed circuit board; A conductive portion disposed on the first surface of the printed circuit board; and It includes an RF (radio frequency) processing circuit disposed on a second surface opposite to the first surface of the printed circuit board, and Each of the above plurality of antenna elements is, It is positioned to be spaced apart from the first surface by means of a support part, and Each of the above plurality of filters is, It is positioned between at least two of the plurality of antenna elements, and The above conductive part is, Among the first surfaces, formed to cover at least a portion of a third region excluding a first region corresponding to the plurality of antenna elements and a second region corresponding to the plurality of filters. Antenna module.

13. In claim 12, each of the plurality of antenna elements is, It is positioned so as to be spaced apart from the first surface by a first length by the above support portion, Each of the above plurality of filters is, having a height of a second length smaller than the first length, Antenna module.

14. In claim 13, the conductive portion is, To reduce distortion of the signal emitted from the plurality of antenna elements, having a height of a third length corresponding to the second length, Antenna module.

15. In claim 12, the conductive portion is, Connected to the ground provided on the above printed circuit board, Antenna module.

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