Foldable electronic device including heat dissipation sheet

Abstract

This foldable electronic device includes a first housing part, a second housing part, a hinge assembly, a hinge cover, a sliding mechanism, and a heat dissipation sheet. The sliding mechanism may include a plurality of bars including at least one bar configured to move. The heat dissipation sheet may include a first portion at least partially wound around the plurality of bars, a second portion partially attached to the first housing part, and a third portion partially attached to the second housing part. The sliding mechanism is configured to adjust the first length of the first portion, the second length of the second portion, and the third length of the third portion, via at least one bar configured to move in response to tensile stress applied to the heat dissipation sheet.

Description

Foldable electronic device including a heat dissipation sheet

[0001] The present disclosure relates to a foldable electronic device comprising a heat dissipation sheet.

[0002] An electronic device may include a plurality of housing parts that are rotatably coupled. For example, the electronic device may include a first housing part and a second housing part that are rotatably coupled to each other. The electronic device may include a heat dissipation sheet for dissipating heat generated from electronic components. Heat generated from electronic components may be dissipated through the heat dissipation sheet. In an electronic device comprising a plurality of housing parts, the heat dissipation sheet may be positioned to dissipate heat to the plurality of housing parts. For example, the heat dissipation sheet may be positioned across the first housing part and the second housing part. When the heat dissipation sheet is positioned across the first housing part and the second housing part, a tensile force may be applied to the heat dissipation sheet.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] A foldable electronic device is disclosed. The foldable electronic device may include a first housing part and a second housing part. The foldable electronic device may include a hinge assembly configured to rotatably connect the first housing part and the second housing part. The foldable electronic device may include a hinge cover covering the hinge assembly. The foldable electronic device may include a sliding mechanism received within the hinge cover and comprising a plurality of bars. At least one of the plurality of bars may be configured to move based on the rotation of the first housing part and the rotation of the second housing part. The foldable electronic device may include a heat dissipation sheet. The heat dissipation sheet may include a first part configured to be at least partially wound around the plurality of bars and to maintain tension by the plurality of bars, a second part extending from one end of the first part of the heat dissipation sheet within the hinge cover to the first housing part and partially attached to the first housing part, and a third part extending from the other end of the first part of the heat dissipation sheet within the hinge cover to the second housing part and partially attached to the second housing part. The sliding mechanism may be configured to adjust the first length of the first part, the second length of the second part, and the third length of the third part through the at least one bar configured to move in response to tensile stress applied to the heat dissipation sheet based on the rotation of the first housing part and the rotation of the second housing part.

[0005] A foldable electronic device is disclosed. The foldable electronic device may include a first housing part and a second housing part. The foldable electronic device may include a hinge assembly configured to rotatably connect the first housing part and the second housing part. The foldable electronic device may include a hinge cover covering the hinge assembly. The foldable electronic device may include a sliding mechanism accommodated within the hinge cover. The sliding mechanism may include a first bar that maintains a position and a second bar configured to move based on the state of the foldable electronic device. The foldable electronic device may include a heat dissipation sheet. The heat dissipation sheet may include a first portion configured to be at least partially wound in an S shape around the first bar and the second bar and to maintain tension by the plurality of bars. The heat dissipation sheet may include a second portion that extends from one end of the first portion of the heat dissipation sheet within the hinge cover to the first housing part and is partially attached to the first housing part. The heat dissipation sheet may include a third portion that extends from the other end of the first portion of the heat dissipation sheet within the hinge cover to the second housing part and is partially attached to the second housing part. The sliding mechanism may be configured to adjust the first length of the first portion, the second length of the second portion, and the third length of the third portion through the second bar, which is configured to move in response to tensile stress applied to the heat dissipation sheet based on the rotation of the first housing part and the rotation of the second housing part. The total length of the heat dissipation sheet may be substantially constant, independently of the movement of the second bar.

[0006] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0007] FIG. 2a illustrates an example of an unfolded state of an electronic device according to one embodiment.

[0008] FIG. 2b illustrates an example of a folded state of an electronic device according to one embodiment.

[0009] FIG. 2c is an exploded view of an electronic device according to one embodiment.

[0010] FIG. 3 is a rear view of a foldable electronic device according to one embodiment.

[0011] FIG. 4 is a cross-sectional view of the foldable electronic device of FIG. 3 cut along the line A-A' in the unfolded state of the foldable electronic device.

[0012] Figure 5 is a cross-sectional view of a foldable electronic device in a folded state.

[0013] FIG. 6 illustrates a sliding mechanism within the unfolded state of a foldable electronic device.

[0014] FIG. 7 illustrates a sliding mechanism of a foldable electronic device in a folded state.

[0015] FIG. 8 is a perspective view of the first plate of the sliding mechanism.

[0016] FIG. 9 is a plan view of the first plate of the sliding mechanism.

[0017] FIG. 10 is a perspective view of a first plate in which an elastic member is disposed.

[0018] FIG. 11 is a plan view of a first plate in which an elastic member is placed.

[0019] FIG. 12 is a perspective view of a first plate in which a plurality of bars are combined.

[0020] FIG. 13 is a plan view of a first plate in which a plurality of bars are combined.

[0021] FIG. 14 is a perspective view of a sliding mechanism in which a heat dissipation sheet is wound around a plurality of bars.

[0022] FIG. 15 is a plan view of a sliding mechanism in which a heat dissipation sheet is wound around a plurality of bars.

[0023] FIG. 16 is a perspective view of a sliding mechanism in which a second plate is coupled to a first plate.

[0024] FIG. 17 is a plan view of a sliding mechanism in which a second plate is coupled to a first plate.

[0025] FIG. 18 illustrates the process of assembling a sliding mechanism into a foldable housing.

[0026] FIG. 19 is a perspective view of a sliding mechanism including a ring spring.

[0027] FIG. 20 is a side view of a sliding mechanism including a ring spring.

[0028] FIG. 21 is a perspective view of a sliding mechanism including a plurality of moving bars.

[0029] FIG. 22 is a side view of a sliding mechanism including a plurality of moving bars.

[0030] FIG. 23 illustrates a foldable electronic device according to one embodiment.

[0031] FIG. 24 illustrates the interior of the foldable electronic device of FIG. 23.

[0032] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment.

[0033] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0034] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0035] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0036] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0040] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0041] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0042] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0046] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0048] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0051] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0052] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0053] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIG. 2a illustrates an example of an unfolded state of an electronic device according to one embodiment. FIG. 2b illustrates an example of a folded state of an electronic device according to one embodiment. FIG. 2c is an exploded view of an electronic device according to one embodiment.

[0056] The electronic device (101) of FIG. 1 may include an electronic device (200) having a foldable structure. Referring to FIG. 2a, FIG. 2b, and FIG. 2c, an electronic device (200) according to one embodiment may include a foldable housing (201), a display (230) (e.g., the display module (160) of FIG. 1), one or more cameras (240), and a hinge assembly (250).

[0057] According to one embodiment, the foldable housing (201) may define the exterior surface of the electronic device (200). For example, the foldable housing (201) may accommodate components disposed inside the electronic device (200) as the physical exterior of the electronic device (200) exposed to the outside. At least some of the components for implementing the functions of the electronic device (200) may be disposed within the foldable housing (201). According to one embodiment, the foldable housing (201) may include a first housing part (210) and a second housing part (220).

[0058] According to one embodiment, the first housing part (210) may include a first surface (211), a second surface (212) opposite to the first surface (211), and a first side (213) (side exterior surface) that at least partially covers the edge of the first surface (211) and the edge of the second surface (212). For example, the first surface (211) may be referred to as the front exterior surface of the first housing part (210), and the second surface (212) may be referred to as the rear exterior surface of the first housing part (210). The first side (213) may be connected to the periphery of the first surface (211) and the edge of the second surface (212). The first surface (211), the second surface (212), and the first side (213) may form an internal space of the first housing part (210). For example, at least one component may be placed within the space enclosed by the first surface (211), the second surface (212), and the first side (213).

[0059] According to one embodiment, the second housing part (220) may include a third surface (221), a fourth surface (222) opposite to the third surface (221), and a second side (223) that at least partially covers the edge of the third surface (221) and the edge of the fourth surface (222). For example, the third surface (221) may be referred to as the front of the second housing part (220), and the fourth surface (222) may be referred to as the rear of the second housing part (220). The second side (223) may be connected to the edge of the third surface (221) and the edge of the fourth surface (222). The third surface (221), the fourth surface (222), and the second side (223) may form an internal space of the second housing part (220). For example, at least one component may be placed within the space enclosed by the third side (221), the fourth side (222), and the second side (223).

[0060] According to one embodiment, the display (230) may correspond to a flexible display. The display (230) may include a display panel configured to display visual information. The display panel may include a front portion comprising pixels including a plurality of subpixels. The front portion of the display panel may be referred to as a display area or an active area in terms of displaying visual information. The front portion of the display panel may be referred to as a front panel. The front portion may be covered by substantially transparent windows and / or protective layers.

[0061] According to one embodiment, the display (230) may include a first part (231), a second part (232), and a third part (233) disposed between the first part (231) and the second part (232). The electronic device (200) may further include a cover display (235) distinct from the display (230). The cover display (235) may be referred to as a sub-display.

[0062] According to one embodiment, a first part (231) of the display (230) may correspond to a first housing part (210). A second part (232) of the display (230) may be supported by a second housing part (220). At least a portion of the first part (231) corresponding to the first housing part (210) may be supported by the first housing part (210). At least a portion of the second part (232) corresponding to the second housing part (220) may be supported by the second housing part (220). The first part (231) and the second part (232) may be substantially flat independently of the state of the electronic device (200).

[0063] According to one embodiment, a third part (233) of the display (230) may be configured to be at least partially bent based on the rotation of the first housing part (210) and / or the rotation of the second housing part (220). For example, in an unfolded state where the first housing part (210) and the second housing part (220) are unfolded, the third part (233) may be substantially flat. In a folded state where the first housing part (210) and the second housing part (220) are folded, or in a partially folded state or partially unfolded state between the folded state and the unfolded state, the third part (233) may be at least partially bent. The display (230) may be a flexible display including the bendable third part (233).

[0064] According to one embodiment, one or more cameras (240) may be configured to acquire an image or video based on receiving light from a subject outside the electronic device (200). For example, one or more cameras (240) may include first cameras (241), a second camera (242), and / or a third camera (243). For example, the first cameras (241) may be placed within a first housing part (210). For example, the first housing part (210) may include at least one opening (241a) that overlaps the first cameras (241) when the electronic device (200) is viewed from above. The first cameras (241) may acquire an image based on receiving light from outside the electronic device (200) through at least one opening (241a). The first cameras (241) can be directed toward the rear side of the electronic device (200).

[0065] According to one embodiment, the second camera (242) may be disposed within the second housing part (220). The second housing part (220) may include at least one opening (242a) that overlaps the second camera (242) when the electronic device (200) is viewed from above. The second camera (242) may acquire an image based on receiving light from outside the electronic device (200) through the at least one opening (242a).

[0066] According to one embodiment, the third camera (243) may be disposed within the first housing part (210). For example, the first part (231) of the display (230) may include at least one opening that overlaps the third camera (243) when the display (230) is viewed from above. The third camera (243) may acquire an image based on receiving light from outside the display (230) through the at least one opening.

[0067] According to one embodiment, the second camera (242) and the third camera (243) may be positioned below the display (230) or the cover display (235) (e.g., in the -z direction). For example, the second camera (242) and / or the third camera (243) may include an under display camera (UDC) and / or a punch hole camera.

[0068] According to one embodiment, the first housing part (210) and the second housing part (220) can be rotatably coupled. For example, the second housing part (220) can be rotatably coupled to the first housing part (210) through a hinge assembly (250).

[0069] According to one embodiment, the hinge assembly (250) can rotatably connect the first housing part (210) and the second housing part (220). The hinge assembly (250) can be positioned between the first housing part (210) and the second housing part (220) of the electronic device (200) so that the electronic device (200) can be folded. The hinge assembly (250) can enable the electronic device (200) to be changed from an unfolded state to a folded state. The hinge assembly (250) can enable the electronic device (200) to be changed from a folded state to an unfolded state. For example, the hinge assembly (250) can maintain the electronic device (200) in a partially folded (or partially unfolded) state between the unfolded state and the folded state.

[0070] According to one embodiment, the unfolded state may be referred to as a state in which the first direction in which the first part (231) faces and the second direction in which the second part (232) faces are substantially the same. The folded state may be referred to as a state in which the first direction is substantially opposite to the second direction. When the electronic device (200) is in the folded state, the first housing part (210) and the second housing part (220) may be stacked or overlapped.

[0071] According to one embodiment, when the electronic device (200) is in a folded state and a partially folded state, the first direction and the second direction may be different from each other. For example, when the electronic device (200) is in a folded state, the first direction and the second direction may be opposite to each other. For example, when the electronic device (200) is in a partially folded state, the first direction may form an angle with respect to the second direction.

[0072] For example, the electronic device (200) may include at least one conductive portion (214a, 224a) and at least one non-conductive portion (214b, 224b) contained within the first side (213) and / or the third side (223). For example, the at least one conductive portion (214a, 224a) may be separated from other conductive portions within the first side (213) and / or the third side (223) by contacting the at least one non-conductive portion (214b, 224b). In one embodiment, the at least one conductive portion (214a, 224a) may operate as an antenna radiator to be used for communication with an external electronic device.

[0073] Referring to FIG. 2c, the hinge assembly (250) may be at least partially covered by a hinge cover (251). The hinge assembly (250) may include a first hinge plate (252), a second hinge plate (253), and a plurality of hinge modules (1800) (254). The hinge cover (251) may at least partially cover the components of the hinge assembly (250) and protect the components of the hinge assembly (250). The hinge cover (251) may be at least partially exposed to the outside of the electronic device (200) through the space between the first housing part (210) and the second housing part (220) when the electronic device (200) is in a folded state. When the electronic device (200) is in an unfolded state, the hinge cover (251) may be covered by the first housing part (210) and the second housing part (220). The hinge cover (251) may be referred to as a hinge housing.

[0074] According to one embodiment, the first hinge plate (252) and the second hinge plate (253) are each operatively coupled to the first housing part (210) and the second housing part (220), respectively, thereby allowing the first housing part (210) and the second housing part (220) to be rotatably connected. For example, the first hinge plate (252) may be coupled to the first bracket (215) of the first housing part (210), and the second hinge plate (253) may be coupled to the second bracket (227) of the second housing part (220). As the first hinge plate (252) and the second hinge plate (253) are operatively coupled to the first bracket (215) and the second bracket (227), respectively, the first housing part (210) and the second housing part (220) may be rotatable according to the rotation of the first hinge plate (252) and the second hinge plate (253).

[0075] According to one embodiment, a plurality of hinge modules (1800) (254) can rotate a first hinge plate (252) and a second hinge plate (253). For example, the plurality of hinge modules (1800) (254) may include gears that are rotatably engaged with each other. The first hinge plate (252) and the second hinge plate (253) can be rotated based on the rotational movement of the gears of the plurality of hinge modules (1800) (254).

[0076] According to one embodiment, the first housing part (210) may include a first bracket (215) and a rear cover (216). The first bracket (215) is disposed inside the first housing part (210) and may support at least one component disposed inside the first housing part (210). The rear cover (216) may at least partially form a second surface (212) of the first housing part (210). For example, the second housing part (220) may include a second bracket (227). The second bracket (227) is disposed inside the second housing part (220) and may support at least one component disposed inside the second housing part (220). For example, a cover display (235) may be disposed below (e.g., in the -z direction) the second bracket (227).

[0077] An electronic device (200) according to one embodiment may include a plurality of electronic components for implementing various functions in addition to the one or more cameras (240) described above. For example, the electronic device (200) may include a first printed circuit board (261), a second printed circuit board (262), a flexible printed circuit board (263), and / or a battery (189). The electronic components described above are exemplary and are not limited thereto.

[0078] For example, the first printed circuit board (261) and the second printed circuit board (262) can each provide electrical connections between components within the electronic device (200). For example, the first printed circuit board (261) can be placed within the first housing part (210), and the second printed circuit board (262) can be placed within the second housing part (220). The first printed circuit board (261) can provide electrical connections between electronic components placed within the first housing part (210). The second printed circuit board (262) can provide electrical connections between electronic components placed within the second housing part (220). A flexible printed circuit board (263) can electrically connect the first printed circuit board (261) and the second printed circuit board (262). For example, the flexible printed circuit board (263) may extend from the first printed circuit board (261) across the hinge assembly (250) to the second printed circuit board (262). For example, the flexible printed circuit board (263) may overlap at least partially with the hinge assembly (250).

[0079] According to one embodiment, the battery (189) is a device for supplying power to at least one component of an electronic device (200), and may include, for example, a non-rechargeable primary battery and / or a rechargeable secondary battery.

[0080] According to one embodiment, the electronic device (200) may include a plurality of antennas (ANT1, ANT2, ANT3, or ANT4) to be used for communication with an external electronic device. For example, the electronic device (200) may include a main antenna (ANT1), a sub-antenna (ANT2), an ultra-wide band (UWB) antenna (ANT3), and / or an antenna (ANT4) for short-range wireless communication. However, it is not limited thereto. For example, the main antenna (ANT1) may include one or more conductive portions forming at least a portion of the first housing part (210) or the second housing part (220). For example, the main antenna (ANT1) may include a plurality of conductive portions forming an edge portion of the first housing part (210). For example, the main antenna (ANT1) may further include conductive portions forming an upper edge or a side edge of the first housing part (210). The main antenna (ANT1) may be configured to transmit and / or receive signals of various frequency bands through each of the plurality of conductive parts or a combination of the plurality of conductive parts.

[0081] FIG. 3 is a rear view of a foldable electronic device according to one embodiment.

[0082] Referring to FIG. 3, the foldable electronic device (200) may include various electronic components (301) that emit heat. For example, the foldable electronic device (200) may include an application processor (e.g., the main processor (121) of FIG. 1). The application processor may be placed within the first housing part (210). The application processor may include a CPU (central processing unit) and / or a GPU (graphic processing unit). Transistors integrated within the CPU and / or GPU may perform various operations. While performing these operations, the application processor may generate heat. The heat generated from the application processor may cause a rise in the temperature of the electronic device. This rise in temperature may cause malfunction of the electronic device or damage to the electronic device. If the heat does not spread within the foldable electronic device (200) but is concentrated in a specific area, it may cause discomfort to the user of the foldable electronic device (200).

[0083] A foldable electronic device (200) according to one embodiment may include a heat dissipation sheet (300) configured to diffuse and / or dissipate heat generated from electronic components (301). The heat dissipation sheet (300) may include materials having high thermal conductivity. For example, the heat dissipation sheet (300) may include graphite, silicon, metal, ceramic, or a combination thereof. The heat dissipation sheet (300) may diffuse the heat so that the heat generated from the electronic components (301) does not concentrate on a specific area of ​​the foldable electronic device (200). The heat may be dissipated by diffusing through the heat dissipation sheet (300). The heat dissipation sheet (300) may be configured to reduce the temperature rise of the foldable electronic device (200) and reduce damage and / or malfunction of the electronic components (301) by diffusing and dissipating the heat.

[0084] As described above, the foldable electronic device (200) may include a first housing part (210) and a second housing part (220) rotatably connected to each other. In the folded state of the foldable electronic device (200), since the first housing part (210) and the second housing part (220) are stacked on top of each other, each of the first housing part (210) and the second housing part (220) may have a relatively small size. For example, the size of the first housing part (210) and the size of the second housing part (220) may each be smaller than the size of the electronic device including a bar-shaped housing. Since the first housing part (210) and the second housing part (220) each have a relatively small size, heat generated within the first housing part (210) may be difficult to effectively dissipate within the first housing part (210), and heat generated within the second housing part (220) may be difficult to effectively dissipate within the second housing part (220). When heat generated in either the first housing part (210) or the second housing part (220) (e.g., the first housing part (210)) is transferred to the other (e.g., the second housing part (220)), the temperature rise of the foldable electronic device (200) can be effectively reduced.

[0085] According to one embodiment, a heat dissipation sheet (300) may be positioned across a first housing part (210) and a second housing part (220) to effectively reduce the temperature rise of a foldable electronic device (200). For example, one side of the heat dissipation sheet (300) may be attached to the first housing part (210), and the other side of the heat dissipation sheet (300), opposite to the one side, may be attached to the second housing part (220). Since the heat dissipation sheet (300) is positioned across the first housing part (210) and the second housing part (220), heat generated in either the first housing part (210) or the second housing part (220) can be diffused to the other through the heat dissipation sheet (300). Since the heat dissipation sheet (300) can diffuse heat over a relatively wide area, it may be configured to effectively reduce the temperature rise of the foldable electronic device (200).

[0086] According to one embodiment, as the heat dissipation sheet (300) is positioned across the first housing part (210) and the second housing part (220), a portion of the heat dissipation sheet (300) may be positioned to overlap with the hinge assembly (250). For example, one side of the heat dissipation sheet (300) is attached to the first housing part (210), and the other side of the heat dissipation sheet (300) is attached to the second housing part (220), and a portion of the heat dissipation sheet (300) between the one side and the other side may be accommodated within a hinge cover (e.g., the hinge cover (251) of FIG. 4).

[0087] When the state of the foldable electronic device (200) changes due to the rotation of the first housing part (210) and the rotation of the second housing part (220), tensile stress may be applied to the heat dissipation sheet (300). In the present disclosure, tensile stress may be referred to as stress pulling the heat dissipation sheet (300) from both sides. To compensate (or offset) the tensile stress applied to the heat dissipation sheet (300), a portion of the heat dissipation sheet (300) contained within the hinge cover (251) may have a margin. For example, the margin may be provided as a portion of the heat dissipation sheet (300) attached to the first housing part (210) and a portion of the heat dissipation sheet (300) attached to the second housing part (220) so as to compensate for or offset the tensile force when a tensile force is applied to the heat dissipation sheet (300).

[0088] For example, when the above-mentioned clearance portion is provided as the above-mentioned portions of the heat dissipation sheet (300), the clearance portion may interfere with the components of the hinge assembly (250). For example, if the behavior of the clearance portion of the heat dissipation sheet (300) is not controlled while the foldable electronic device (200) changes from a folded state to an unfolded state, the clearance portion may interfere with the components of the hinge assembly (250) (e.g., gears or hinge plates (e.g., hinge plates (252, 253) of FIG. 2c). The interference may cause damage to the components of the hinge assembly (250).

[0089] For example, in order to reduce damage to the heat dissipation sheet (300) caused by tensile stress applied to the heat dissipation sheet (300), the heat dissipation sheet (300) may include a flexible material. In order to reduce damage to the heat dissipation sheet (300), a material capable of allowing elongation of the heat dissipation sheet (300) when the tensile stress is applied to the heat dissipation sheet (300) may be required. The requirement for the material may cause an increase in the manufacturing cost of the heat dissipation sheet (300). If the heat dissipation sheet (300) is repeatedly elongated, damage to the heat dissipation sheet (300) may occur.

[0090] A foldable electronic device (200) according to one embodiment may include a sliding mechanism (e.g., a sliding mechanism (400) of FIG. 4) for controlling the behavior of a spare portion of a heat dissipation sheet (300) to compensate for tensile stress applied to the heat dissipation sheet (300). A portion of the heat dissipation sheet (300) may be configured to change or adjust the length of a portion of the heat dissipation sheet (300) attached to a first housing and a portion of the heat dissipation sheet (300) attached to a second housing by winding or unwinding on the sliding mechanism (400).

[0091] The structure and operation of the sliding mechanism (400) are described below.

[0092] FIG. 4 is a cross-sectional view of the foldable electronic device of FIG. 3 cut along the line A-A' in the unfolded state of the foldable electronic device. FIG. 5 is a cross-sectional view of the foldable electronic device in the folded state of the foldable electronic device.

[0093] Referring to FIG. 4, a foldable electronic device (200) according to one embodiment may include a sliding mechanism (400). The sliding mechanism (400) may be accommodated within a hinge cover (251). The sliding mechanism (400) may be configured to adjust (change) the second length of a second part (320) of the heat dissipation sheet (300) partially attached to a first housing part (210) and the third length of a third part (330) of the heat dissipation sheet (300) partially attached to a second housing part (220) by adjusting the length (e.g., first length) of a part of the heat dissipation sheet (300) (e.g., first length). The adjustment of the lengths may be referred to as the heat dissipation sheet (300) expanding or contracting in response to tensile stress applied from the sliding mechanism (400) to the heat dissipation sheet (300).

[0094] According to one embodiment, the sliding mechanism (400) may include a plurality of bars (410). At least one of the plurality of bars (410) (e.g., a second bar (412)) may be configured to move (or slide) based on the rotation of the first housing part (210) and / or the rotation of the second housing part (220). The operation of the sliding mechanism (400) is described later. The sliding mechanism (400) may apply tensile stress to the heat dissipation sheet (300) by the rotation of the foldable housing, and the length of the heat dissipation sheet (300) may be adjusted (or changed) according to the application of the tensile stress.

[0095] A foldable electronic device (200) according to one embodiment may include a heat dissipation sheet (300). The heat dissipation sheet (300) may extend from a first housing part (210) across a hinge cover (251) to a second housing part (220). As described above, the heat dissipation sheet (300) may be configured to diffuse heat generated within the first housing part (210) to the second housing part (220) and to diffuse heat generated within the second housing part (220) to the first housing part (210).

[0096] According to one embodiment, the heat dissipation sheet (300) may include a first part (310), a second part (320), and a third part (330).

[0097] In the present disclosure, the first part (310), the second part (320), and the third part (330) are not defined by dividing the entire heat dissipation sheet (300) on an absolute basis. According to one embodiment, the first part (310), the second part (320), and the third part (330) may be defined relatively based on the state of the foldable electronic device (200). For example, depending on the angle between the first housing part (210) and the second housing part (220), the distinction between the first part (310), the second part (320), and the third part (330) may differ.

[0098] According to one embodiment, a first portion (310) of the heat dissipation sheet (300) may be referred to as a spare portion of the heat dissipation sheet (300) for compensating for tensile stress applied to the heat dissipation sheet (300). The first portion (310) of the heat dissipation sheet (300) may be at least partially wound around a plurality of bars (410) and configured to maintain tension by the plurality of bars (410).

[0099] For example, if a plurality of bars (410) include a first bar (411) and a second bar (412), at least a portion of the first part (310) of the heat dissipation sheet (300) may be wrapped around the first bar (411) and the second bar (412). The tension of the first part (310) of the heat dissipation sheet (300) may be maintained by the first bar (411) and the second bar (412). Maintaining the tension of the first part (310) of the heat dissipation sheet (300) may be referred to as the first part (310) between the first bar (411) and the second bar (412) remaining in a substantially flat state without being irregularly bent or folded.

[0100] As described below, when at least one of the plurality of bars (410) (e.g., second bar (412)) is moved (or slid) according to the rotation of the first housing part (210) and / or the second housing part (220), the first length of the first part (310), the second length of the second part (320), and the third length of the third part (330) may be adjusted. For example, when the first length of the first part (310) of the heat dissipation sheet (300) is changed according to the movement of the at least one bar (e.g., second bar (412)), the second length of the second part (320) of the heat dissipation sheet (300) and the third length of the third part (330) of the heat dissipation sheet (300) may be changed. For example, if the first length of the first part (310) is shortened according to the movement of at least one bar, the second length of the second part (320) and the third length of the third part (330) may be lengthened. The total length of the heat dissipation sheet (300) may be substantially constant. For example, even if the first length of the first part (310), the second length of the second part (320), and the third length of the third part (330) are each changed according to the movement of the at least one bar, the total length of the heat dissipation sheet (300) may be substantially constant. The sum of the first length, the second length, and the third length may be referred to as the total length of the heat dissipation sheet (300).

[0101] According to one embodiment, while at least one of the plurality of bars (410) moves, the tension of the first portion (310) of the heat dissipation sheet (300) can be maintained. Since the tension of the first portion (310) of the heat dissipation sheet (300) is maintained, the behavior of the spare portion can be controlled. The first portion (310) of the heat dissipation sheet (300) can extend from the second portion (320) of the heat dissipation sheet (300) to the third portion (330) of the heat dissipation sheet (300).

[0102] According to one embodiment, a second portion (320) of the heat dissipation sheet (300) may extend from one end (311) of the first portion (310) of the heat dissipation sheet (300) within the hinge cover (251) to the first housing part (210). The second portion (320) of the heat dissipation sheet (300) may be partially attached to the first housing part (210). For example, the second portion (320) of the heat dissipation sheet (300) may include a first sub-part (321) and a second sub-part (322). The first sub-part (321) may be attached to the first housing part (210) (e.g., the first bracket (215)). The second sub-part (322) can extend from the first sub-part (321) into the hinge cover (251) and can be connected to one end (311) of the first part (310) within the hinge cover (251). For example, the one end (311) of the first part (310) to which the second part (320) is connected may correspond to the one end (311) of the first part (310) that is wound around the bar (e.g., the first bar (411)) located furthest from the first housing part (210) among the plurality of bars (410). For example, if a plurality of bars (410) include a first bar (411) and a second bar (412), and the first bar (411) is positioned close to the first housing part (210) and the second bar (412) is positioned close to the second housing part (220), then one end (311) of the first part (310) to which the second part (320) is connected may be referred to as one end of a portion of the first part (310) wound around the first bar (411).

[0103] According to one embodiment, a third portion (330) of the heat dissipation sheet (300) may extend from the other end (312) of the first portion (310) of the heat dissipation sheet (300) within the hinge cover (251) to a second housing part (220). The third portion (330) of the heat dissipation sheet (300) may be partially attached to the second housing part (220). For example, the third portion (330) of the heat dissipation sheet (300) may include a third sub-part (331) and a fourth sub-part (332). The third sub-part (331) may be attached to the second housing part (220) (e.g., a second bracket (227)). The fourth sub-part (332) can extend from the third sub-part (331) into the hinge cover (251) and can be connected to the other end (312) of the first part (310) within the hinge cover (251). For example, the other end (312) of the first part (310) to which the third part (330) is connected may correspond to the other end (312) of the first part (310) that is wound around the bar (e.g., the second bar (412)) located furthest from the second housing part (220) among the plurality of bars (410). For example, if a plurality of bars (410) include a first bar (411) and a second bar (412), and the first bar (411) is positioned close to the first housing part (210) and the second bar (412) is positioned close to the second housing part (220), the other end (312) of the first part (310) to which the third part (330) is connected may be referred to as one end of the part of the first part (310) wound around the second bar (412).

[0104] Referring to FIG. 5, when the foldable electronic device (200) changes from an unfolded state to a folded state, tensile stress may be applied to the heat dissipation sheet (300). The tensile stress applied to the heat dissipation sheet (300) may be based on the angle between the first housing part (210) and the second housing part (220). For example, in the unfolded state of the foldable electronic device (200) shown in FIG. 4, the angle may be approximately 180 degrees, and in the folded state of the foldable electronic device (200) shown in FIG. 5, the angle may be approximately 0 degrees. When the angle is reduced, tensile stress may be applied to the heat dissipation sheet (300). As the angle is reduced, the tensile stress may increase. Conversely, when the angle is increased, the tensile stress applied to the heat dissipation sheet (300) may decrease.

[0105] For example, when the foldable electronic device (200) changes from an unfolded state to a folded state, the first housing part (210) may rotate about 90 degrees in a first rotation direction (e.g., clockwise), and the second housing part (220) may rotate about 90 degrees in a second rotation direction opposite to the first rotation direction (e.g., counterclockwise). In the folded state of the foldable electronic device (200), the first housing part (210) and the second housing part (220) may be positioned to face each other. In the folded state of the foldable electronic device (200), the angle between the first housing part (210) and the second housing part (220) may be about 0 degrees. As the first housing part (210) and the second housing part (220) are positioned to face each other, tensile stress can be applied to the second part (320) of the heat dissipation sheet (300) attached to the first housing part (210) (e.g., the first bracket (215)) and the third part (330) of the heat dissipation sheet (300) attached to the second housing part (220) (e.g., the second bracket (227)).

[0106] For example, when the foldable electronic device (200) changes from a folded state to an unfolded state, the first housing part (210) may rotate about 90 degrees in a second rotation direction (e.g., counterclockwise), and the second housing part (220) may rotate about 90 degrees in a first rotation direction (e.g., clockwise). In the unfolded state of the foldable electronic device (200), the first housing part (210) and the second housing part (220) may be positioned substantially parallel to each other. In the unfolded state of the foldable electronic device (200), the angle between the first housing part (210) and the second housing part (220) may be about 180 degrees. As the first housing part (210) and the second housing part (220) are positioned parallel to each other, the tensile stress applied to the second part (320) of the heat dissipation sheet (300) attached to the first housing part (210) (e.g., the first bracket (215)) and the third part (330) of the heat dissipation sheet (300) attached to the second housing part (220) (e.g., the second bracket (227)) can be reduced (or released).

[0107] According to one embodiment, the tensile stress applied to the heat dissipation sheet (300) may be configured to cause movement of at least one of the plurality of bars (410) of the sliding mechanism (400). For example, the tensile stress may act as a driving force that causes movement of the at least one bar.

[0108] According to one embodiment, a plurality of bars (410) of the sliding mechanism (400) may include a first bar (411) and a second bar (412). For example, the first bar (411) may maintain its position. Even if tensile stress is applied to the heat dissipation sheet (300), the first bar (411) may maintain its position without moving. In terms of maintaining the position of the first bar (411), the first bar (411) may be referred to as a fixed bar. For example, the second bar (412) may be configured to move (or slide) in response to tensile stress applied to the heat dissipation sheet (300). The second bar (412) may be configured to move closer to the first bar (411) or to move (or slide) away from the second bar (412). The second bar (412) may be referred to as a moving bar in terms of moving in response to tensile stress.

[0109] As illustrated in FIG. 4, when the foldable electronic device (200) is in an unfolded state, the second bar (412) may be located at a first position furthest from the first bar (411). When the foldable electronic device (200) is in an unfolded state, the distance between the first bar (411) and the second bar (412) may correspond to a first distance.

[0110] As illustrated in FIG. 5, when the foldable electronic device (200) is in a folded state, the second bar (412) may be located at a second position closest to the first bar (411). When the foldable electronic device (200) is in a folded state, the distance between the first bar (411) and the second bar (412) may correspond to a second distance shorter than the first distance. According to one embodiment, the second bar (412) may be configured to move between the first position and the second position in response to tensile stress applied to the heat dissipation sheet (300) based on the angle between the first housing part (210) and the second housing part (220).

[0111] According to one embodiment, the first length of the first portion (310) of the heat dissipation sheet (300), which is at least partially wound around a plurality of bars (410) and maintains tension, may be configured to change based on the distance between the first bar (411) and the second bar (412). For example, the first length of the first portion (310) of the heat dissipation sheet (300) may correspond to the maximum length in the unfolded state of the foldable electronic device (200), where the distance between the first bar (411) and the second bar (412) corresponds to the first distance. For example, the first length of the first portion (310) of the heat dissipation sheet (300) may correspond to the minimum length in the folded state of the foldable electronic device (200), where the distance between the first bar (411) and the second bar (412) corresponds to the second distance.

[0112] According to one embodiment, a change in the first length of the first part (310) may cause a change in the second length of the second part (320) connected to one end (311) of the first part (310) and a change in the third length of the third part (330) connected to the other end (312) of the first part (310).

[0113] For example, when the foldable electronic device (200) changes from an unfolded state to a folded state, the second bar (412) may be moved (or slid) to approach the first bar (411). While the second bar (412) is moved to approach the first bar (411), a portion of the first portion (310) of the heat dissipation sheet (300) that is at least partially wrapped around the first bar (411) and the second bar (412) may be provided as a second portion (320) of the heat dissipation sheet (300) and a third portion (330) of the heat dissipation sheet (300). For example, a portion of the first portion (310) may be provided as a second portion (320) (e.g., a first sub-part (322)) along the outer surface of the first bar (411) by the movement of the second bar (412). Another part of the first part (310) may be provided as a third part (330) (e.g., a fourth sub-part (332)) along the outer surface of the second bar (412) by the movement of the second bar (412). As the second bar (412) moves toward the first bar (411), the first length of the first part (310) may be reduced as a part of the first part (310) is provided as a second part (320) and a third part (330), and the second length of the second part (320) and the third length of the third part (330) may be increased.

[0114] According to one embodiment, tensile stress applied to the heat dissipation sheet (300) based on rotation of the first housing part (210) and / or rotation of the second housing part (220) can be compensated (or offset) by a change in the second length of the second part (320) of the heat dissipation sheet (300) and a change in the third length of the third part (330) of the heat dissipation sheet (300). For example, the tensile stress applied to the heat dissipation sheet (300) can be compensated by providing the first part (310) corresponding to the spare part as the second part (320) and the third part (330).

[0115] As described above, when the foldable electronic device (200) is in a folded state, tensile stress may be applied to the heat dissipation sheet (300). In response to the tensile stress, the second bar (412) moves to approach the first bar (411), and the first length of the first part (310) may be reduced by the movement of the second bar (412). By the amount by which the first length of the first part (310) is reduced, the second length of the second part (320) and the third length of the third part (330) may be increased. The tensile stress applied to the second part (320) may be compensated (or offset) by the increased second length. The tensile stress applied to the third part (330) may be compensated (or offset) by the increased third length. Since the tensile stress applied to the heat dissipation sheet (300) is compensated, the total length of the heat dissipation sheet (300) can remain substantially constant even when the foldable electronic device (200) changes from an unfolded state to a folded state. Since the heat dissipation sheet (300) may not be stretched by tensile stress, damage to the heat dissipation sheet (300) caused by tensile stress can be reduced. Since excessive stretching of the heat dissipation sheet (300) is not required, the requirements for the material of the heat dissipation sheet (300) can be relaxed, and the manufacturing cost of the heat dissipation sheet (300) can be reduced.

[0116] For example, when the foldable electronic device (200) changes from a folded state to an unfolded state, the second bar (412) may be moved (or slid) away from the first bar (411). While the foldable electronic device (200) changes from a folded state to an unfolded state, the tensile stress applied to the heat dissipation sheet (300) may be reduced. In response to the reduction of the tensile stress, the second bar (412) may be moved away from the first bar (411). While the second bar (412) moves away from the first bar (411), a portion of the second part (320) (e.g., a first sub-part (322)) and a portion of the third part (330) (e.g., a fourth sub-part (332)) may be provided as a first part (310) of a heat dissipation sheet (300) that is at least partially wrapped around the first bar (411) and the second bar (412). For example, a portion of the second part (320) (e.g., a first sub-part (322)) may be provided as a first part (310) along the outer surface of the first bar (411) by the movement of the second bar (412). A portion of the third portion (330) (e.g., a third sub-part (331)) may be provided to the first portion (310) along the outer surface of the second bar (412) by the movement of the second bar (412). As the second bar (412) moves away from the first bar (411), a portion of the second portion (320) and a portion of the third portion (330) are provided to the first portion (310), the first length of the first portion (310) may be increased, and the second length of the second portion (320) and the third length of the third portion (330) may be decreased.

[0117] According to one embodiment, when the state of the foldable electronic device (200) changes, the behavior of the first part (310) of the heat dissipation sheet (300) can be controlled. Since the first part (310) of the heat dissipation sheet (300) is at least partially wound around a plurality of bars (410), tension can be maintained. Even if the first length of the first part (310) changes, the tension of the first part (310) is maintained, so the behavior of the first part (310) can be maintained between the first bar (411) and the second bar (412). Since the behavior of the first part (310) can be controlled, the first part (310), which corresponds to a spare part for compensating for tensile stress, can not interfere with the components of the hinge assembly (250) (e.g., hinge plates (252, 253)). As the above interference is reduced, damage to the hinge assembly (250) by the first part (310) can be reduced.

[0118] FIG. 6 illustrates a sliding mechanism in the unfolded state of a foldable electronic device. FIG. 7 illustrates a sliding mechanism in the folded state of a foldable electronic device.

[0119] As described above, in response to the application or reduction of tensile stress, at least one of the plurality of bars (410) (e.g., second bar (412)) is moved (or slid), and the first length of the first part (310) may be changed by the movement of said at least one bar. According to one embodiment, the sliding mechanism (400) may be configured to cause the movement of said at least one bar (e.g., second bar (412)) in response to tensile stress applied to the heat dissipation sheet (300) based on the state of the foldable electronic device (e.g., foldable electronic device (200) of FIG. 4).

[0120] Referring to FIG. 6, the sliding mechanism (400) may include a first bar (411) and a second bar (412). The heat dissipation sheet (300) may be wrapped around the first bar (411) and the second bar (412) in an approximately S-shape form. For example, the first bar (411) within the hinge cover (251) may be closer to the second housing part (220) among the first housing part (e.g., the first housing part (210) in FIG. 4) and the second housing part (e.g., the second housing part (220) in FIG. 4). The second bar (412) within the hinge cover (251) may be closer to the first housing part (210) among the first housing part (210) and the second housing part (220). A second portion (320) of the heat dissipation sheet (300) partially attached to the first housing part (210) can be connected to a first portion (310) of the heat dissipation sheet (300) wound around a first bar (411) positioned close to the second housing part (220). A third portion (330) of the heat dissipation sheet (300) partially attached to the second housing part (220) can be connected to a first portion (310) of the heat dissipation sheet (300) wound around a second bar (412) positioned close to the first housing part (210). As the first portion (310) of the heat dissipation sheet (300) is wound approximately in an S shape, the tension of the first portion (310) of the heat dissipation sheet (300) can be maintained.

[0121] According to one embodiment, the first bar (411) can maintain its position. The first bar (411) can be fixed at a designated position independently of the state of the foldable electronic device (200).

[0122] According to one embodiment, the second bar (412) may be configured to move toward the first bar (411) or to move away from the first bar (411) in response to tensile stress. In FIGS. 6 and 7, the second bar (412) configured to move is shown as a single bar, but the present disclosure is not limited thereto. For example, the second bar (412) configured to move in response to tensile stress may be provided in multiple numbers. The second bar (412) may be configured to move in a first direction toward the first bar (411) (e.g., -x direction) or a second direction opposite to the first direction (e.g., +x direction) in response to tensile stress applied to the heat dissipation sheet (300).

[0123] According to one embodiment, the sliding mechanism (400) may include a first plate (601) and a second plate (602). The first plate (601) and the second plate (602) may be referred to as the housing of the sliding mechanism (400) which defines the exterior of the sliding mechanism (400).

[0124] According to one embodiment, the first plate (601) may include a first groove (610) into which a portion of the first bar (411) is inserted and a second groove (620) into which a portion of the second bar (412) is inserted. For example, a portion of the first bar (411) that maintains position may be inserted into the first groove (610) and fixed. The first groove (610) may be referred to as a fixed groove in that the portion of the fixed first bar (411) is inserted. For example, a portion of the second bar (412) configured to move may be inserted into the second groove (620) and configured to move along the second groove (620). At least a portion of the second groove (620) may be configured to guide the movement of the second bar (412). The second groove (620) may be referred to as a guide groove in that it guides the movement of the second bar (412). The first plate (601) may be referred to as a support plate in that it supports the first bar (411) and the second bar (412).

[0125] According to one embodiment, a second plate (602) may be disposed on a first plate (601) to cover components of a sliding mechanism (400) disposed on the first plate (601). For example, a first bar (411), a second bar (412), and an elastic member (603) described later may be disposed on the first plate (601). The second plate (602) may cover a portion of the first bar (411), the second bar (412), the elastic member (603), and the heat dissipation sheet (300) by covering the top surface of the first plate (601). The second plate (602) may be referred to as a cover plate in terms of covering components of the sliding mechanism (400).

[0126] According to one embodiment, the first groove (610) may be perpendicular to the direction of movement (e.g., x-axis direction) of the second bar (412). The first groove (610) may be connected to the upper surface of the first plate (601) and spaced apart from the bottom portion (630) of the first plate (601). The first bar (411) may be inserted into the first groove (610) perpendicular to the direction of movement of the second bar (412) and fixed. The second groove (620) may include a first groove portion (621) perpendicular to the direction of movement of the second bar (412) and a second groove portion (622) parallel to the direction of movement of the second bar (412). For example, the first groove portion (621) may be in contact with the upper surface of the first plate (601) and spaced apart from the bottom portion (630) of the first plate (601). The second groove portion (622) may extend in a second direction parallel to the direction of movement from the end of the first groove portion (621) adjacent to the bottom portion (630). The second groove (620) may have an approximately L-shaped form.

[0127] According to one embodiment, the second bar (412) may be configured to be inserted into the first groove portion (621) and to move along the second groove portion (622). The second bar (412) may be configured to move within the second groove portion (622). The length of the second groove portion (622) may correspond to the range of movement of the second bar (412). For example, the second groove portion (622) may include a first end (622a) closer to the first bar (411) and a second end (622b) opposite to the first end (622a) among the first bar (411) and the second bar (412). For example, when the foldable electronic device (200) is in an unfolded state, the second bar (412) may be positioned at the first end (622a) of the second groove portion (622) connected to the first groove portion (621). While the foldable electronic device (200) is changing from an unfolded state to a folded state, the second bar (412) may move from the first end (622a) of the second groove portion (622) toward the second end (622b) of the second groove portion (622) opposite to the first end (622a).

[0128] For example, while the angle between the first housing part (210) and the second housing part (220) is reduced, the second bar (412) can move from the first end (622a) of the second groove portion (622) along the second groove portion (622) toward the second end (622b) of the second groove portion (622). When the foldable electronic device (200) is in a folded state, the second bar (412) can be positioned at the second end (622b) of the second groove portion (622). After the first bar (411) is inserted into the first groove (610) and the second bar (412) is inserted into the second groove (620), the second plate (602) can be coupled to the first plate (601) so as to cover the upper surface of the first plate (601). When the second plate (602) is coupled to the first plate (601), the second plate (602) can close (or cover) the first groove (610) and the second groove (620).

[0129] According to one embodiment, the sliding mechanism (400) may include an elastic member (603). The elastic member (603) may be placed on the bottom portion (630) of the first plate (601) and may be placed adjacent to a second groove (620) into which a portion of the second bar (412) is inserted. The elastic member (603) may have elasticity by including an elastic material. For example, when an external force is applied to the elastic member (603), the shape of the elastic member (603) may be deformed in response to the external force. When the external force applied to the elastic member (603) is reduced or released, the elastic member (603) may be restored to its original shape in response to the reduction or release of the external force.

[0130] According to one embodiment, the elastic member (603) may be positioned to contact a second bar (412) configured to move in response to tensile stress applied to the heat dissipation sheet (300). The elastic member (603) may be pressed by the second bar (412). For example, when the second bar (412) is positioned at the first end (622a) of a second groove portion (622) corresponding to the unfolded state of the foldable electronic device (200), the elastic member (603) may have an original shape. When the second bar (412) moves in a second direction in response to tensile stress applied to the heat dissipation sheet (300), the second bar (412) may move while pressing the elastic member (603). While the second bar (412) moves in the second direction, the shape of the elastic member (603) pressed by the second bar (412) may be deformed. The second bar (412) may move from the first end (622a) of the second groove portion (622) to the second end (622b) of the second groove portion (622) while pressing the elastic member (603).

[0131] Referring to FIG. 7, when the second bar (412) is positioned at the second end (622b) of the second groove portion (622) corresponding to the folded state of the foldable electronic device (200), the position of the second bar (412) can be maintained at the second end (622b) by the tensile stress applied to the heat dissipation sheet (300). As the second bar (412) moves to the second end (622b), a portion of the first portion (310) of the heat dissipation sheet (300) can be provided as the second portion (320) of the heat dissipation sheet (300) and the third portion (330) of the heat dissipation sheet (300). As described above, as the first length of the first part (310) of the heat dissipation sheet (300) decreases and the second length of the second part (320) of the heat dissipation sheet (300) and the third length of the heat dissipation sheet (300) increase, the tensile stress applied to the heat dissipation sheet (300) can be compensated.

[0132] According to one embodiment, while the state of the foldable electronic device (200) is maintained in a folded state, the position on the second bar (412) may be maintained at the second end (622b). Due to the tensile stress applied to the heat dissipation sheet (300) within the folded state, the second bar (412) may continuously press the elastic member (603). The elastic member (603) pressed by the second bar (412) may maintain a deformed shape. When the state of the foldable electronic device (200) changes from a folded state to an unfolded state, the angle between the first housing part (e.g., the first housing part (210) of FIG. 4) and the second housing part (e.g., the second housing part (220) of FIG. 4) may be reduced. As the angle is reduced, the tensile stress applied to the heat dissipation sheet (300) is reduced, and due to the reduction in tensile stress, the force exerted by the second bar (412) on the elastic member (603) may be reduced. Since the force exerted by the second bar (412) on the elastic member (603) corresponds to an external force that causes deformation of the elastic member (603), the elastic member (603) may be restored to its original shape as the force is reduced. When the elastic member (603) is deformed to its original shape, the elastic member (603) may push out the second bar (413). The second bar (412) in contact with the elastic member (603) may be moved in a first direction by the elastic member (603). When the foldable electronic device (200) is in an unfolded state, the elastic member (603) may have an original shape, and the second bar (412) in contact with the elastic member (603) may be positioned at the first end (622a) of the second groove portion (622). According to one embodiment, movement of the second bar (412) may be caused by the elastic member (603) due to a reduction or release of tensile stress.

[0133] As illustrated in FIGS. 6 and 7, the elastic member (603) may include a plate spring or leaf spring. For example, the elastic member (603) may include a first part (603a) disposed on the bottom portion (630) of the first plate (601) and a second part (603b) in contact with the second bar (412) and pressed by the second bar (412). The second part (603b) may be bent from the end of the first part (603a) to face the first part (603a). When the second bar (412) is positioned at the first end (622a) of the second groove portion (622), the elastic member (603) may have an original shape. When the elastic member (603) has the original shape, the second part (603b) may be tilted relative to the first part (603a). The second part (603b) may interfere with the second bar (412) moving along the second groove part (622).

[0134] According to one embodiment, when the second bar (412) moves in the first direction due to tensile stress, the second portion (603b) of the elastic member (603) may be pressed by the second bar (412). When the second portion (320) is pressed by the second bar (412), the second portion (603b) may be deformed to be closer to the first portion (603a). As the second portion (603b) is deformed, the angle between the first portion (603a) and the second portion (603b) may be reduced. When the elastic member (603) is positioned at the second end (622b) of the second groove portion (622), the second portion (603b) may be substantially parallel to the first portion (603a). When the state of the foldable electronic device (200) is maintained in a folded state, the tensile stress applied to the heat dissipation sheet (300) is maintained, and according to the maintenance of the tensile stress, the elastic member (603) can maintain a deformed state.

[0135] For example, while the foldable electronic device (200) changes from a folded state to an unfolded state, the tensile stress applied to the heat dissipation sheet (300) may be reduced. Due to the reduction in the tensile stress, the external force maintaining the deformed state of the elastic member (603) may be reduced. Due to the reduction in the external force, the elastic member (603) may be restored to its original shape. When the shape of the elastic member (603) is restored to its original shape, the second bar (412) may be moved from the second end (622b) of the second groove portion (622) to the first end (622a) of the second groove portion (622) by the second part (603b) of the elastic member (603). For example, the angle between the first part (603a) of the elastic member (603) and the second part (603b) of the elastic member (603) is increased, and the second part (603b) of the elastic member (603) can push the second bar (412) in a second direction. When the foldable electronic device (200) is in an unfolded state, the tensile stress applied to the heat dissipation sheet (300) is released, and the shape of the elastic member (603) can be restored to its original shape. While the second bar (412) moves from the second end (622b) of the second groove part (622) to the first end (622a) of the second groove part (622), the first length of the first part (310) of the heat dissipation sheet (300), which is at least partially wrapped around the first bar (411) and the second bar (412), can be increased. As the first length increases, the second length of the second part (320) and the third length of the third part (330) may be reduced.

[0136] For example, when the foldable electronic device (200) changes from an unfolded state to a folded state, tensile stress may be applied to the heat dissipation sheet (300). The second bar (412) may be configured to move in a first direction (e.g., -x direction) toward the first bar (411) in response to the tensile stress. When the second bar (412) moves in the first direction, the distance between the first bar (411) and the second bar (412) may be reduced. As the distance increases, the first length of the first part (310) may be reduced, and the second length of the second part (320) and the third length of the third part (330) may be increased. For example, the second bar (412) may be configured to move in a second direction opposite to the first direction (e.g., +x direction) in response to the tensile stress applied to the heat dissipation sheet (300) when the tensile stress is reduced. When the second bar (412) moves in the second direction, the distance between the first bar (411) and the second bar (412) may be reduced. As the distance increases, the first length of the first part (310) may be increased, and the second length of the second part (320) and the third length of the third part (330) may be reduced.

[0137] According to one embodiment, the edges of the first plate (601) and the edges of the second plate (602) that are in contact with the heat dissipation sheet (300) may be at least partially rounded. For example, the first plate (601) may include a first side (641) and a second side (642) extending from the bottom portion (630) toward the second plate (602). The second portion (320) of the heat dissipation sheet (300) may extend from the first housing part (210) through the first side (641) of the first plate (601) and the second plate (602) into the hinge cover (251). A third portion (330) of the heat dissipation sheet (300) may extend from the second housing part (220) through the second side (642) of the first plate (601) and the second plate (602) into the hinge cover (251). The first edge (651) of the first side (641) through which the second portion (320) of the heat dissipation sheet (300) passes, and the third edge (661) of the second plate (602) facing the first edge (651) may be at least partially rounded. The second edge (652) of the second side (642) through which the third portion (330) of the heat dissipation sheet (300) passes, and the fourth edge (662) of the second plate (602) facing the second edge (652) may be at least partially rounded.

[0138] According to one embodiment, as the second bar (412) moves, the heat dissipation sheet (300) can pass through the gap between the first edge (651) and the third edge (661), and the gap between the second edge (652) and the fourth edge (662). When the heat dissipation sheet (300) passes through the gaps, it may come into contact with the first plate (601) and the second plate (602). If the edges are angled, the heat dissipation sheet (300) may be damaged by the angled edges. According to one embodiment, since the edges of the first plate (601) and the second plate (602) are at least partially rounded, damage to the heat dissipation sheet (300) may be reduced. The heat dissipation sheet (300) can smoothly pass through the gap between the first edge and the third edge (661), and the gap between the second edge (652) and the fourth edge (662).

[0139] The structure and assembly process of the sliding mechanism (400) are described below.

[0140] FIG. 8 is a perspective view of the first plate of the sliding mechanism. FIG. 9 is a plan view of the first plate of the sliding mechanism.

[0141] Referring to FIGS. 8 and 9, the sliding mechanism (400) may include a first plate (601). The first plate (601) may include a bottom portion (630) and sides connected to the edges of the bottom portion (630). For example, the bottom portion (630) of the first plate (601) may have a roughly rectangular shape. The sides of the first plate (601) may be connected to each of the four edges of the bottom portion (630) having a rectangular shape. For example, the sides of the first plate (601) may include a first side (641) and a second side (642) connected to the long sides of the bottom portion (630), and a third side (643) and a fourth side (644) connected to the short sides of the bottom portion (630). The first side (641) may be opposite to the second side (642), and the third side (643) may be opposite to the fourth side (644).

[0142] According to one embodiment, grooves into which a plurality of bars (e.g., a plurality of bars (410) of FIG. 12) are partially inserted may be formed within a third side (643) and a fourth side (644). For example, a first groove (610) into which a portion of a first bar (e.g., a first bar (411) of FIG. 12) is inserted and a second groove (620) into which a portion of a second bar (e.g., a second bar (412) of FIG. 12) is inserted may be formed in each of the third side (643) and the fourth side (644).

[0143] According to one embodiment, an opening (710) may be formed in the bottom portion (630) of the first plate (601). For example, the bottom portion (630) of the first plate (601) may correspond to a rectangular ring containing the opening (710). The opening (710) may facilitate the assembly of a portion of a heat dissipation sheet (e.g., the heat dissipation sheet (300) of FIG. 4) contained within the first plate (601). For example, a heat dissipation sheet (300) that is at least partially wound around a plurality of bars (410) may be assembled through the opening (710). The first plate (601) may be formed of a metal material (e.g., stainless steel), but is not limited thereto.

[0144] FIG. 10 is a perspective view of a first plate on which an elastic member is disposed. FIG. 11 is a plan view of a first plate on which an elastic member is disposed.

[0145] Referring to FIGS. 10 and 11, an elastic member (603) may be disposed on the bottom portion (630) of the first plate (601). The elastic member (603) may be adjacent to the second groove (620) so as to interfere with a second bar (e.g., the second bar (412) in FIG. 12) moving along the second groove (620). The sliding mechanism (400) may include a first elastic member (1011) and a second elastic member (1012) adjacent to the second groove (620) formed on each of the third side (643) and the fourth side (644). The elastic member (603) may include a plate spring, but is not limited thereto.

[0146] FIG. 12 is a perspective view of a first plate in which a plurality of bars are joined. FIG. 13 is a plan view of a first plate in which a plurality of bars are joined.

[0147] Referring to FIGS. 12 and 13, a plurality of bars (410) may be partially inserted into the grooves of the first plate (601). For example, a portion of the first bar (411) may be inserted into the first groove (610), and a portion of the second bar (412) may be inserted into the second groove (620). A portion of the first bar (411) may be inserted into the first groove (610) formed on the third side (643) and the first groove (610) formed on the fourth side (644). A portion of the second bar (412) may be inserted into the second groove (620) formed on the third side (643) and the second groove (620) formed on the fourth side (644). The second bar (412) may be in contact with an elastic member (603) adjacent to the second groove (620). For example, the second bar (412) may be in contact with the first elastic member (1011) and the second elastic member (1012).

[0148] According to one embodiment, each of the plurality of bars (410) may include a flange portion wider than the diameter of the groove so as not to deviate from the groove. For example, the first bar (411) may include a first body portion (1211) and first flange portions (1212, 1213) formed at both ends of the first body portion (1211). The diameter of the first body portion (1211) may substantially correspond to the diameter of the first groove (610), and the diameter of each of the first flange portions (1212, 1213) may be larger than the diameter of the first groove (610). For example, the second bar (412) may include a second body portion (1221) and second flange portions (1222, 1213) formed at both ends of the second body portion (1221). The diameter of the second body part (1221) can substantially correspond to the diameter of the second groove (620), and the diameter of each of the second flange parts (1222, 1213) can be larger than the diameter of the second groove (620).

[0149] FIG. 14 is a perspective view of a sliding mechanism in which a heat dissipation sheet is wound around a plurality of bars. FIG. 15 is a plan view of a sliding mechanism in which a heat dissipation sheet is wound around a plurality of bars.

[0150] Referring to FIGS. 14 and 15, the heat dissipation sheet (300) may be at least partially wound around a plurality of bars (410). For example, a first portion (310) of the heat dissipation sheet (300) may be at least partially wound around a first bar (411) and a second bar (412). The first portion (310) of the heat dissipation sheet (300) that is at least partially wound around the first bar (411) and the second bar (412) can maintain tension by being wound in an S shape. Since the tension of the first portion (310) of the heat dissipation sheet (300) can be maintained even if the second bar (412) moves, the behavior of the first portion (310) corresponding to the spare portion can be controlled.

[0151] According to one embodiment, a first sub-part (321) of a second part (320) of a heat dissipation sheet (300) may be attached to a first housing part (e.g., the first housing part (210) of FIG. 4). A first sub-part (322) of the second part (320) may extend from the first sub-part (321) to a first part (310) of the heat dissipation sheet (300) wound on a first bar (112).

[0152] According to one embodiment, a third sub-part (331) of a third part (330) of a heat dissipation sheet (300) may be attached to a second housing part (e.g., the second housing part (220) of FIG. 4). A fourth sub-part (332) of the third part (330) may extend from the third sub-part (331) to a first part (310) of the heat dissipation sheet (300) wound on a second bar (412).

[0153] As described above, the edges of the first plate (601) in contact with the heat dissipation sheet (300) may be at least partially rounded. For example, the first edge (651) of the first side (641) in contact with the first sub-part (322) of the second part (320) and the second edge (652) of the second side (642) in contact with the fourth sub-part (332) of the third part (330) may be at least partially rounded. Because the first edge (651) and the second edge (652) are at least partially rounded, damage to the heat dissipation sheet (300) may be reduced.

[0154] FIG. 16 is a perspective view of a sliding mechanism in which a second plate is coupled to a first plate. FIG. 17 is a plan view of a sliding mechanism in which a second plate is coupled to a first plate.

[0155] Referring to FIGS. 16 and 17, a second plate (602) may be coupled to the first plate (601) to cover the first plate (601). For example, the second plate (602) may be coupled to the upper surface of the first plate (601) (e.g., the surface facing the +z direction) to cover the interior of the first plate (601). The second plate (602) may protect a portion of the heat dissipation sheet (300) and components of the sliding mechanism (400) contained within the first plate (601).

[0156] As described above, the third edge (661) of the second plate (602) facing the first edge (651) of the first plate (601), and the fourth edge (662) of the second plate (602) facing the second edge (652) of the first plate (601) may be at least partially rounded. Since the edges (e.g., the first edge (651), the second edge (652), the third edge (661), and the fourth edge (662)) are at least partially rounded, damage to the heat dissipation sheet (300) passing through the gap between the edges may be reduced.

[0157] FIG. 18 illustrates the process of assembling a sliding mechanism into a foldable housing.

[0158] Referring to FIG. 18, the hinge assembly (250) may include hinge modules (1800). For example, each of the hinge modules (1800) may include components for rotation of the first housing part (210) and the second housing part (220), such as a set of gears, a rotator, and an arm. For example, the hinge assembly (250) may include, but is not limited to, a first hinge module (1801), a second hinge module (1802), and / or a third hinge module (1803) spaced apart from each other. For example, the first hinge module (1801) may be positioned on the upper part of the foldable housing (e.g., in the +y direction), and the second hinge module (1802) may be positioned on the lower part of the foldable housing (e.g., in the -y direction). The third hinge module (1803) can be placed between the first hinge module (1801) and the second hinge module (1802).

[0159] According to one embodiment, the assembled sliding mechanism (400) may be positioned between the hinge modules (1800). For example, the sliding mechanism (400) may be positioned between the first hinge module (1801) and the third hinge module (1803). The sliding mechanism (400) may be coupled to the hinge cover (251) between the first hinge module (1801) and the third hinge module (1803) to dissipate heat from the foldable electronic device (200).

[0160] According to one embodiment, a flexible printed circuit board (1810) may be disposed between a second hinge module (1802) and a third hinge module (1803). The flexible printed circuit board (1810) may be disposed across a hinge cover (251) to electrically connect a printed circuit board disposed within a first housing part (210) and a printed circuit board disposed within a second housing part (220). However, it is not limited thereto. For example, a heat dissipation sheet (300) may be laminated with the flexible printed circuit board (1810). When the heat dissipation sheet (300) and the flexible printed circuit board (1810) are laminated together, the heat dissipation sheet (300) and the flexible printed circuit board (1810) may be formed at least partially integrally.

[0161] FIG. 19 is a perspective view of a sliding mechanism including a ring spring. FIG. 20 is a side view of a sliding mechanism including a ring spring.

[0162] In the examples described above, the elastic member (603) was described as a leaf spring, but the elastic member (603) according to the present disclosure is not limited thereto.

[0163] Referring to FIGS. 19 and 20, the elastic member (603) may include a ring spring (1910). The ring spring (1910) may have a ring shape approximately.

[0164] For example, the ring spring (1910) may come into contact with at least a portion of the outer surface of the second bar (412) and a protruding portion (1920) protruding from the outer surface of the first plate (601). The shape of the ring spring (1910) shown in FIG. 19 may be referred to as the original shape. Since the protruding portion (1920) is fixed, the ring spring (1910) can be pressed by the movement of the second bar (412).

[0165] For example, when the second bar (412) moves in a first direction (e.g., -x direction) toward the first bar (411), the ring spring (1910) may be stretched. When the foldable electronic device (200) is in a folded state, the ring spring (1910) may be configured to maintain a deformed state due to tensile stress. When the foldable electronic device (200) changes from a folded state to an unfolded state, the tensile stress is reduced or released, and according to the reduction or release of said tensile stress, the ring spring (1910) may be restored to its original shape. When the ring spring (1910) is restored to its original shape, the second bar (412) may be moved by the ring spring (1910) in a second direction opposite to the first direction (e.g., +x direction). The elastic member (603) can be implemented in various shapes that cause movement of the second bar (412) in the second direction based on a restoring force, in addition to a leaf spring or ring spring (1910).

[0166] FIG. 21 is a perspective view of a sliding mechanism including a plurality of movable bars. FIG. 22 is a side view of a sliding mechanism including a plurality of movable bars.

[0167] In the examples described above, at least one bar configured to move in response to tensile stress applied to the heat dissipation sheet (300) was described as a second bar (412), but the present disclosure is not limited thereto. For example, the sliding mechanism (400) may include one or more bars configured to move in response to said tensile stress.

[0168] Referring to FIGS. 21 and 22, a plurality of bars (410) of a sliding mechanism (400) may include a first bar (411), a second bar (412), and one or more third bars (2110). The first bar (411) may maintain its position independently of the state of the foldable electronic device (200). For example, the first bar (411) may be fixed without moving. The second bar (412) and one or more third bars (2110) may be configured to move in response to tensile stress applied to the heat dissipation sheet (300). For example, one or more third bars (2110) may include a fourth bar (2111) and a fifth bar (2112). The fifth bar (2112) may be positioned between the second bar (412) and the fourth bar (2111), but is not limited thereto.

[0169] For example, when the foldable electronic device (200) changes from an unfolded state to a folded state, the second bar (412) and one or more third bars (2110) may be configured to move in a first direction (e.g., -x direction) toward the first bar (411) in response to the tensile stress. When the second bar (412) and one or more third bars (2110) move in the first direction, a portion of the first part (e.g., the first part (310) of FIG. 22) of the heat dissipation sheet (300) that is at least partially wrapped around the plurality of bars (410) may be provided as a second part (e.g., the second part (320) of FIG. 22) and a third part (e.g., the third part (330) of FIG. 22). As a portion of the first part (310) is provided as the second part (320) and the third part (330) by the movement of the second bar (412) and one or more third bars (2110), the first length of the first part (310) may be reduced, and the second length of the second part (320) and the third length of the third part (330) may be increased.

[0170] For example, when the foldable electronic device (200) changes from a folded state to an unfolded state, the second bar (412) and one or more third bars (2110) may move in a second direction opposite to the first direction (e.g., +x direction). When the second bar (412) and one or more third bars (2110) move in the second direction, a portion of the second part (320) and a portion of the third part (330) may be provided as a first part (310) of a heat dissipation sheet (300) that is at least partially wound around a plurality of bars (410). As a result of moving the second bar (412) and moving one or more third bars (2110), a portion of the second part (320) and a portion of the third part (330) are provided as the first part (310), the first length of the first part (310) may be increased, and the second length of the second part (320) and the third length of the third part (330) may be decreased.

[0171] Referring to FIG. 24, a foldable electronic device (2300) according to one embodiment may include the aforementioned heat dissipation sheet (300) and sliding mechanism (400). In the case of a foldable electronic device (2300), since it includes three housing parts (e.g., a first housing part (2310), a second housing part (2320), and a third housing part (2330), the heat dissipation sheet (300) may extend from the first housing part (2310) across the first hinge assembly (2350), the second housing part (2320), and the second hinge assembly (2360) to the third housing part (2330) to diffuse heat to the three housing parts. For example, heat generated from an electronic component (e.g., the main processor (121) of FIG. 1) placed within the third housing part (2330) may be diffused to the second housing part (2320) and the third housing part (2330) through the heat dissipation sheet (300). For example, the heat dissipation sheet (300) is the second hinge It can cross between the hinge modules (2361, 2362) of the assembly (2360).

[0172] According to one embodiment, the foldable electronic device (2300) may include two sliding mechanisms. For example, the foldable electronic device (2300) may include a sliding mechanism (400) disposed between a second housing part (2320) and a third housing part (2330), and another sliding mechanism disposed between a first housing part (2310) and a second housing part (2320). The sliding mechanisms may be configured to compensate for a tensile force applied to a heat dissipation sheet (300) depending on the state of the foldable electronic device (2300). The sliding mechanisms may substantially correspond to the aforementioned sliding mechanism (400).

[0173] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0174] A foldable electronic device (200) is disclosed. The foldable electronic device (200) may include a first housing part (210) and a second housing part (220). The foldable electronic device (200) may include a hinge assembly (250) configured to rotatably connect the first housing part (210) and the second housing part (220). The foldable electronic device (200) may include a hinge cover (251) covering the hinge assembly (250). The foldable electronic device (200) may include a sliding mechanism (400) that is received within the hinge cover (251) and includes a plurality of bars (410). At least one of the plurality of bars (410) (e.g., a second bar and / or one or more third bars (2110)) may be configured to move based on the rotation of the first housing part (210) and the rotation of the second housing part (220). The foldable electronic device (200) may include a heat dissipation sheet (300). The heat dissipation sheet (300) may include a first part (310) configured to be at least partially wound around the plurality of bars (410) and maintained tension by the plurality of bars (410), a second part (320) extending from one end of the first part (310) of the heat dissipation sheet (300) within the hinge cover (251) to the first housing part (210) and partially attached to the first housing part (210), and a third part (330) extending from the other end of the first part (310) of the heat dissipation sheet (300) within the hinge cover (251) to the second housing part (220) and partially attached to the second housing part (220).The sliding mechanism (400) may be configured to adjust the first length of the first part (310), the second length of the second part (320), and the third length of the third part (330) through the at least one bar configured to move in response to tensile stress applied to the heat dissipation sheet (300) based on the rotation of the first housing part (210) and the rotation of the second housing part (220).

[0175] According to one embodiment, a portion of the first portion (310) of the heat dissipation sheet (300) may be provided as a second portion (320) of the heat dissipation sheet (300) and a third portion (330) of the heat dissipation sheet (300) based on the movement of at least one bar among the plurality of bars (410) of the sliding mechanism (400). A portion of the second portion (320) of the heat dissipation sheet (300) and a portion of the third portion (330) of the heat dissipation sheet (300) may be provided as the first portion (310) of the heat dissipation sheet (300) based on the movement of at least one bar among the plurality of bars (410) of the sliding mechanism (400). For example, as a portion of the first part (310) is provided as the second part (320) and the third part (330), the first length may be reduced, and the second length and the third length may be increased. For example, as a portion of the second part (320) and a portion of the third part (330) are provided as the first part (310), the first length may be increased, and the second length and the third length may be reduced.

[0176] According to one embodiment, the plurality of bars (410) of the sliding mechanism (400) may include a first bar (411) that maintains a position. The plurality of bars (410) may include a second bar (412) configured to move closer to the first bar (411) or move away from the first bar (411) in response to the tensile stress. The first length of the first portion (310) of the heat dissipation sheet (300) may be configured to change based on the distance between the first bar (411) and the second bar (412).

[0177] According to one embodiment, the distance between the first bar (411) and the second bar (412) may correspond to a first distance in the unfolded state of the foldable electronic device (200). The distance between the first bar (411) and the second bar (412) may correspond to a second distance shorter than the first distance in the folded state of the foldable electronic device (200).

[0178] According to one embodiment, the first length of the first portion (310) of the heat dissipation sheet (300) may correspond to the maximum length in the unfolded state of the foldable electronic device (200) where the distance between the first bar (411) and the second bar (412) corresponds to the first distance. The first length of the first portion (310) of the heat dissipation sheet (300) may correspond to the minimum length in the unfolded state of the foldable electronic device (200) where the distance between the first bar (411) and the second bar (412) corresponds to the second distance.

[0179] According to one embodiment, the sliding mechanism (400) may be configured to cause the movement of the at least one bar to decrease the first length of the first part (310) in response to the tensile stress applied to the heat dissipation sheet (300) when the foldable electronic device (200) changes from the unfolded state to the folded state. The sliding mechanism (400) may be configured to cause the movement of the at least one bar to increase the first length of the first part (310) in response to the decrease in the tensile stress applied to the heat dissipation sheet (300) when the foldable electronic device (200) changes from the folded state to the unfolded state.

[0180] According to one embodiment, the plurality of bars (410) of the sliding mechanism (400) may include a first bar (411) that maintains a position. The plurality of bars (410) may include a second bar (412) configured to move closer to the first bar (411) or move away from the first bar (411) in response to the tensile stress. The sliding mechanism (400) may include a first plate (601) comprising a first groove (610) into which a portion of the first bar (411) is inserted, and a second groove (620) into which a portion of the second bar (412) is inserted and which guides the movement of the second bar (412). The sliding mechanism (400) may include an elastic member (603) comprising an elastic material that contacts the second bar (412).

[0181] According to one embodiment, the second bar (412) may be configured to move closer to the first bar (411) while pressing the elastic member (603) in response to the tensile stress applied to the heat dissipation sheet (300) when the foldable electronic device (200) changes from the unfolded state to the folded state. The second bar (412) may be configured to move away from the first bar (411) by the elastic member (603) which is restored in response to the reduction of the tensile stress when the foldable electronic device (200) changes from the folded state to the unfolded state.

[0182] According to one embodiment, the first groove (610) may be perpendicular to the direction of movement of the second bar (412). The second groove (620) may include a first groove portion (621) perpendicular to the direction of movement of the second bar (412). The second groove (620) may include a second groove portion (622) extending parallel to the direction of movement of the second bar (412) from the end of the first groove portion (621). The portion of the second bar (412) may be configured to move within the second groove portion (622) of the second groove portion (622).

[0183] According to one embodiment, the sliding mechanism (400) may include a second plate (602) that is coupled to the first plate (601), covers the plurality of bars (410), and closes the first groove (610) and the second groove (620).

[0184] According to one embodiment, the edges of the first plate (601) and the second plate (602) may be at least partially rounded.

[0185] According to one embodiment, the second groove portion (622) of the second groove (620) may include a first end (622a) that is closer to the first bar (411) among the first bar (411) and the second bar (412). The second groove portion (622) of the second groove (620) may include a second end (622b) opposite to the first end (622a). The second bar (412) may be located at the first end (622a) of the second groove portion (622) when the foldable electronic device (200) is in a folded state. The second bar (412) may be located at the second end (622b) of the second groove portion (622) when the foldable electronic device (200) is in an unfolded state.

[0186] According to one embodiment, the elastic member (603) may include a leaf spring.

[0187] According to one embodiment, the elastic member (603) may include a protruding portion (1920) protruding from the outer surface of the first plate (601) and a ring spring (1910) in contact with the outer surface of the second bar (412).

[0188] According to one embodiment, the plurality of bars (410) of the sliding mechanism (400) may include a first bar (411) that maintains a position. The plurality of bars (410) may include a second bar (412) configured to move closer to the first bar (411) or move away from the first bar (411) in response to the tensile stress, and one or more third bars (2110) between the first bar (411) and the second bar (412).

[0189] According to one embodiment, the total length of the heat dissipation sheet (300) can be substantially constant.

[0190] A foldable electronic device (200) is disclosed. The foldable electronic device (200) may include a first housing part (210) and a second housing part (220). The foldable electronic device (200) may include a hinge assembly (250) configured to rotatably connect the first housing part (210) and the second housing part (220). The foldable electronic device (200) may include a hinge cover (251) covering the hinge assembly (250). The foldable electronic device (200) may include a sliding mechanism (400) accommodated within the hinge cover (251). The sliding mechanism (400) may include a first bar (411) that maintains a position and a second bar (412) configured to move based on the state of the foldable electronic device (200). The above-described foldable electronic device (200) may include a heat dissipation sheet (300). The heat dissipation sheet (300) may include a first portion (310) configured to be at least partially wound in an S shape around the first bar (411) and the second bar (412) and to maintain tension by the plurality of bars (410). The heat dissipation sheet (300) may include a second portion (320) that extends from one end of the first portion (310) of the heat dissipation sheet (300) within the hinge cover (251) to the first housing part (210) and is partially attached to the first housing part (210). The heat dissipation sheet (300) may include a third part (330) that extends from the other end of the first part (310) of the heat dissipation sheet (300) within the hinge cover (251) to the second housing part (220) and is partially attached to the second housing part (220).The sliding mechanism (400) may be configured to adjust the first length of the first part (310), the second length of the second part (320), and the third length of the third part (330) through the second bar (422), which is configured to move in response to tensile stress applied to the heat dissipation sheet (300) based on the rotation of the first housing part (210) and the rotation of the second housing part (220). The total length of the heat dissipation sheet (300) may be substantially constant, independently of the movement of the second bar (412).

[0191] According to one embodiment, the first length, the second length, and the third length may be configured to be adjusted based on the distance between the first bar (411) and the second bar (412).

[0192] According to one embodiment, the first length of the first portion (310) of the heat dissipation sheet (300) may correspond to the maximum length in the unfolded state of the foldable electronic device (200) where the distance between the first bar (411) and the second bar (412) corresponds to the first distance. The first length of the first portion (310) of the heat dissipation sheet (300) may correspond to the minimum length in the unfolded state of the foldable electronic device (200) where the distance between the first bar (411) and the second bar (412) corresponds to the second distance.

[0193] According to one embodiment, the sliding mechanism (400) may be configured to cause the movement of the second bar (422) to decrease the first length of the first part (310) in response to the tensile stress applied to the heat dissipation sheet (300) when the foldable electronic device (200) changes from the unfolded state to the folded state. The sliding mechanism (400) may be configured to cause the movement of the second bar (422) to increase the first length of the first part (310) in response to the decrease in the tensile stress applied to the heat dissipation sheet (300) when the foldable electronic device (200) changes from the folded state to the unfolded state. As the first length of the first part (310) decreases, the second length of the second part (320) and the second length of the third part (330) may increase. As the first length of the first part (310) increases, the second length of the second part (320) and the second length of the third part (330) may decrease.

[0194] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0195] The electronic devices according to the various embodiments disclosed in this document may be of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0196] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0197] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0198] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (120) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0199] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store's server, or a relay server's memory (130).

[0200] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In a foldable electronic device, 1st housing part; 2nd housing part; A hinge assembly configured to rotatably connect the first housing part and the second housing part; A hinge cover covering the above hinge assembly; A sliding mechanism received within the hinge cover and comprising a plurality of bars, wherein at least one of the plurality of bars is configured to move based on the rotation of the first housing part and the rotation of the second housing part; and A heat dissipation sheet, the heat dissipation sheet is: A first part configured to be at least partially wound around the plurality of bars and to maintain tension by the plurality of bars, A second portion extending from one end of the first portion of the heat dissipation sheet located within the hinge cover to the first housing part and partially attached to the first housing part, and It includes a third part extending from the other end of the first part of the heat dissipation sheet within the hinge cover to the second housing part and partially attached to the second housing part, The above sliding mechanism is, A first length of the first part, a second length of the second part, and a third length of the third part are configured to be adjusted through the at least one bar configured to move in response to tensile stress applied to the heat dissipation sheet by the rotation of the first housing part and the rotation of the second housing part. Foldable electronic device.

2. In Paragraph 1, A portion of the first part of the above heat dissipation sheet is, Based on the movement of at least one bar among the plurality of bars of the sliding mechanism, provided as a second portion of the heat dissipation sheet and a third portion of the heat dissipation sheet, Foldable electronic device.

3. In Paragraph 1 or 2, The plurality of bars of the above sliding mechanism are, The first bar maintaining the position, and It includes a second bar configured to move closer to the first bar or move away from the first bar in response to the above tensile stress, and The first length of the first portion of the heat dissipation sheet is, Configured to be changed based on the distance between the first bar and the second bar, Foldable electronic device.

4. In Paragraph 3, The distance between the first bar and the second bar is: In the unfolded state of the above-mentioned foldable electronic device, corresponding to a first distance, and In the folded state of the above-mentioned foldable electronic device, a second distance shorter than the first distance, Foldable electronic device.

5. In Paragraph 4, The first length of the first portion of the heat dissipation sheet is: The distance between the first bar and the second bar corresponds to the maximum length within the unfolded state of the foldable electronic device corresponding to the first distance, and In the unfolded state of the foldable electronic device corresponding to the second distance between the first bar and the second bar, the minimum length, Foldable electronic device.

6. In any one of paragraphs 1 through 5, The above sliding mechanism is, When the foldable electronic device changes from an unfolded state to a folded state, in response to the tensile stress applied to the heat dissipation sheet, the movement of the at least one bar is caused to reduce the first length of the first portion, and When the foldable electronic device changes from the folded state to the unfolded state, the device is configured to cause movement of the at least one bar to increase the first length of the first portion in response to a reduction in the tensile stress applied to the heat dissipation sheet. Foldable electronic device.

7. In any one of paragraphs 1 through 6, The plurality of bars of the above sliding mechanism are, The first bar maintaining the position, and It includes a second bar configured to move closer to the first bar or move away from the first bar in response to the above tensile stress, and The above sliding mechanism is, A first plate comprising a first groove into which a portion of the first bar is inserted, and a second groove into which a portion of the second bar is inserted and for guiding the movement of the second bar, and A resilient member comprising an elastic material that is in contact with the second bar, Foldable electronic device.

8. In Paragraph 7, The above second bar is, When the above-described foldable electronic device changes from an unfolded state to a folded state, it is configured to move toward the first bar while pressing the elastic member in response to the tensile stress applied to the heat dissipation sheet, and When the foldable electronic device changes from the folded state to the unfolded state, it is configured to move away from the first bar by means of the elastic member which is restored in response to the reduction of the tensile stress. Foldable electronic device.

9. In Paragraph 7, The first groove above is, Perpendicular to the direction of movement of the second bar mentioned above, and The second groove mentioned above is, A first groove portion perpendicular to the direction of movement of the second bar, and It includes a second groove portion extending parallel to the direction of movement of the second bar from the end of the first groove portion, The above portion of the second bar is configured to move within the second groove portion of the second groove portion, Foldable electronic device.

10. In Paragraph 9, The above sliding mechanism is, A second plate coupled to the first plate, covering the plurality of bars, and closing the first groove and the second groove, Foldable electronic device.

11. In Paragraph 10, The edges of the first plate and the second plate are, at least partially rounded, Foldable electronic device.

12. In Paragraph 10, The second groove portion of the second groove above is, Among the first bar and the second bar, a first end closer to the first bar, and It includes a second end opposite to the first end, and The above second bar is: When the above foldable electronic device is in a folded state, it is located at the first end of the second groove portion, and When the above-mentioned foldable electronic device is in an unfolded state, located at the second end of the second groove portion, Foldable electronic device.

13. In Paragraph 7, The above elastic member is, including leaf springs, Foldable electronic device.

14. In Paragraph 7, The above elastic member is, A ring spring comprising a protruding portion protruding from the outer surface of the first plate and contacting the outer surface of the second bar, Foldable electronic device.

15. In any one of paragraphs 1 through 14, The plurality of bars of the above sliding mechanism are, First bar maintaining position, A second bar configured to move toward or away from the first bar in response to the above tensile stress, and one or more third bars between the first bar and the second bar, Foldable electronic device.

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