Test socket

Abstract

The present invention provides a test socket comprising: an upper plate through which one end of an electrically conductive pin is passed to expose the one end; a lower plate through which the other end of the electrically conductive pin is passed to expose the other end; and a heat dissipation unit which is disposed between the upper plate and the lower plate and discharges, to the outside, heat generated from the electrically conductive pin.

Description

test socket

[0001] The present invention relates to a test socket, and more specifically, to a test socket having a heat dissipation portion that surrounds an electrically conductive pin and releases heat absorbed from the electrically conductive pin.

[0002] In semiconductor manufacturing and inspection processes, various inspection devices are used to measure the electrical characteristics of objects to be inspected, such as wafers and semiconductor packages. These devices include probe cards and test sockets, which are used to establish electrical contact with the external terminals of the objects to transmit and receive signals. Inspection devices require high precision and reliability, and they feature diverse structures and designs, particularly depending on the size and characteristics of the objects being inspected.

[0003] The electrical conduction pins used in inspection devices can generate heat while current flows. This can cause damage to the external terminals of the object being inspected, or in severe cases, lead to the electrical conduction pins themselves overheating and burning. This heat generation problem not only reduces the reliability and efficiency of the inspection process but also acts as a factor that shortens the lifespan of the inspection device or the object being inspected.

[0004] In conventional technology, a structure has been proposed to suppress heat generation in an inspection device at a location spaced apart from the electrical conduction pin. However, this structure has limitations in that it fails to effectively dissipate heat and thus cannot completely solve the heat generation problem.

[0005] Therefore, structural improvements and designs capable of dissipating heat more effectively are required. Such improvements will play a crucial role in enhancing the reliability and stability of the inspection process.

[0006] [Prior Art Literature]

[0007] [Patent Literature]

[0008] (Patent Document 1) Registered Patent Publication No. 10-2351081

[0009] To solve the aforementioned problem, the present invention aims to provide a test socket for efficiently dissipating heat generated from a conductive pin.

[0010] To achieve the above-mentioned purpose, a test socket according to an embodiment of the present invention, for testing the electrical characteristics of an object to be tested, may include: an upper plate through which one end of an electrically conductive pin penetrates and exposes said end; a lower plate through which the other end of the electrically conductive pin penetrates and exposes said end; and a heat dissipation portion that releases heat generated from the electrically conductive pin to the outside between the upper plate and the lower plate.

[0011] In addition, in an embodiment of the present invention, the heat dissipation member may include a heat dissipation through-hole through which the electrically conductive pin passes.

[0012] In addition, in an embodiment of the present invention, the heat dissipation member can surround the electrically conductive pin and absorb the heat of the electrically conductive pin.

[0013] Additionally, in an embodiment of the present invention, the heat dissipation member may include a first heat dissipation member that surrounds the electrically conductive pin and absorbs heat from the electrically conductive pin, and a second heat dissipation member that contacts the first heat dissipation member and releases heat from the first heat dissipation member to the outside.

[0014] In addition, in an embodiment of the present invention, the first heat dissipation part may be an insulating material and the second heat dissipation part may be a metal material.

[0015] In addition, in an embodiment of the present invention, the first heat dissipation part may have a greater thermal conductivity than at least one of the upper plate and the lower plate, and the second heat dissipation part may have a greater thermal conductivity than the first heat dissipation part.

[0016] In addition, in an embodiment of the present invention, the first heat dissipation member is in contact with the upper plate and the lower plate in a vertical direction and can transfer heat generated from the electrical conduction pin in a horizontal direction.

[0017] In addition, in an embodiment of the present invention, the second heat dissipation member may be in contact with the upper plate in a horizontal direction.

[0018] In addition, in an embodiment of the present invention, the heat dissipation member may include a plurality of surface extension members communicating with the outside.

[0019] The present invention has the effect of directly receiving and dissipating heat through a heat dissipation part equipped to be in contact with an electrically conductive pin.

[0020] In addition, the present invention has the effect of efficiently dissipating heat generated from electrical conduction pins through a heat dissipation part with a double structure of electrical insulating material and metal material.

[0021] FIG. 1 is a drawing showing the shape of a test socket according to an embodiment of the present invention.

[0022] FIG. 2 is a cross-sectional view of a test socket according to an embodiment of the present invention.

[0023] FIG. 3 is a drawing showing a heat dissipation unit according to an embodiment of the present invention.

[0024] FIG. 4 is a drawing showing a heat dissipation part according to an embodiment of the present invention.

[0025] Figure 5 is an enlarged view of the dotted line area of ​​Figure 2.

[0026] Figure 6 is a drawing showing a test socket equipped with electrically conductive pins.

[0027] A person skilled in the art can develop various devices that embody the principles of the invention and are included within the concept and scope of the invention, even though they are not explicitly described or illustrated in this specification.

[0028] Furthermore, all conditional terms and embodiments listed in this specification are, in principle, explicitly intended only for the purpose of enabling an understanding of the concept of the invention and should be understood as not being limited to the embodiments and conditions specifically listed as such.

[0029] The aforementioned objectives, features, and advantages will become more apparent through the following detailed description of the invention in conjunction with the attached drawings, and accordingly, a person skilled in the art to which the invention pertains will be able to easily implement the technical concept of the invention.

[0030] The embodiments described herein will be explained with reference to cross-sectional and / or perspective views, which are exemplary illustrations of the present invention. The dimensions, etc., of the components shown in these drawings may be exaggerated for effective explanation of the technical content. The shapes of the exemplary illustrations may be modified due to manufacturing technology and / or tolerances, etc.

[0031] In describing various embodiments, for convenience, the same name and the same reference number will be assigned to components performing the same function, even if the embodiments are different. Additionally, the expression 'at least one of A, B and C' means composed of a combination of one, two, or three of A, B and C.

[0032] Additionally, the width direction may refer to the +x direction and / or the -x direction, and the length direction may refer to the +y direction and / or the -y direction. The vertical direction may refer to the +z direction and / or the -z direction, and the horizontal direction may refer to any direction perpendicular to the vertical direction. The horizontal cross-sectional area may refer to the plane formed when cutting an object in a direction perpendicular to the vertical direction.

[0033] Furthermore, for convenience, the configuration and operation already described in other embodiments will be omitted.

[0034] Below, we will examine a test socket (10) according to an embodiment of the present invention.

[0035] FIG. 1 is a drawing showing the shape of a test socket (10) according to an embodiment of the present invention. FIG. 2 is a drawing showing a cross-section of a test socket (10) according to an embodiment of the present invention.

[0036] Referring to FIGS. 1 and FIGS. 2, a test socket (10) according to an embodiment of the present invention can test the electrical characteristics of an object to be tested (20).

[0037] A test socket (10) according to an embodiment of the present invention may include an upper plate (100), a lower plate (200), a heat dissipation part (300), a guide part (400), and a housing part (500). A test socket (10) according to an embodiment of the present invention may be configured to include more or fewer components.

[0038] A test socket (10) according to an embodiment of the present invention may include an upper plate (100) through which one end of an electrically conductive pin (30) penetrates and exposes one end, a lower plate (200) through which the other end of an electrically conductive pin (30) penetrates and exposes the other end, and a heat dissipation part (300) that releases heat generated from the electrically conductive pin (30) to the outside between the upper plate (100) and the lower plate (200).

[0039] An electrically conductive pin (30) is provided in a test socket (10) and can transmit an electrical signal between an object to be tested (20) and the test socket (10) (or test device). A plurality of electrically conductive pins (30) may be provided and arranged. The electrically conductive pin (30) may be composed of at least one of a straight pin, a pogo pin, and a rubber pin, but the types are not limited to those described above.

[0040] Here, the inspection device (not shown) may refer to a device that includes a test socket (10) and a circuit board (not shown) and inspects the electrical signal of an object to be inspected through an electrical conduction pin (30).

[0041] When the object to be inspected (20) is placed on the guide portion (400) and pressurized, the plurality of electrical conductive pins (30) can be elastically deformed and reach an overdrive state. In the elastically deformed state, the electrical conductive pins (30) can transmit an electrical signal received from the test socket (10) (or inspection device) to the object to be inspected (20), and can transmit an electrical signal received from the object to be inspected (20) to the test socket (10) (or inspection device).

[0042] The guide section (400) can align the object to be inspected (20). The guide section (400) can contact the object to be inspected (20) and position the object to be inspected (20) in the correct position along the inclined section (410). The guide section (400) can position the object to be inspected (20) in the correct position by contacting at least one surface of the object to be inspected (20) through the inclined surface of at least one inclined section (410).

[0043] The guide section (400) may include an inclined section (410) and a seating section (420). The inclined section (410) forms the side of the guide section (400) and may be provided at an angle. When an object to be inspected (20) is placed at any position on the guide section (400), the inclined section (410) can seat the object to be inspected (20) in the correct position through the inclined surface.

[0044] The mounting portion (420) may be provided flatly by forming the lower surface of the guide portion (400). The mounting portion (420) may include guide through holes (401). The mounting portion (420) may expose electrical conductive pins (30) through a plurality of guide through holes (401). The mounting portion (420) may provide a space for the inspection object (20) to be mounted.

[0045] The guide portion (400) may be made of one of plastic, polymer, metal, and a combination thereof. Specifically, the guide portion (400) may be made of one of POM, PEEK, polyimide, stainless steel, aluminum alloy, ceramic, and metal composite, but is not limited thereto.

[0046] If the guide portion (400) is made of a metal material, it may include an insulating coating layer (not shown) on its surface. The insulating coating layer can electrically insulate a plurality of electrically conductive pins (30) from each other to prevent short circuits.

[0047] The upper plate (100) is provided so that one end of the electrical conductive pin (30) passes through it, thereby exposing one end of the electrical conductive pin (30). The upper plate (100) can pass the electrical conductive pin (30) through the upper through hole (101).

[0048] The upper plate (100) is provided with a plurality of upper through holes (101) to allow a plurality of electrically conductive pins (30) to pass through each. The upper plate (100) may be provided to be able to contact the electrically conductive pins (30) in a horizontal direction through the upper through holes (101).

[0049] The upper surface (or upper) of the upper plate (100) may be provided with an upper step (102) formed to narrow the upper through hole (101). The upper step (102) may be provided to be able to contact the electrical conductive pin (30) in a vertical direction. The upper step (102) may contact the electrical conductive pin (30) to prevent the electrical conductive pin (30) from detaching from the test socket (10) in a vertical direction (or upward direction).

[0050] The electrically conductive pin (30) exposed through the upper through hole (101) of the upper plate (100) can come into contact with the external terminal (21) of the object to be inspected (20). One end of the exposed electrically conductive pin (30) can come into contact with the external terminal (21) of the object to be inspected (20) to exchange electrical signals with the object to be inspected (20).

[0051] The upper plate (100) may be made of one of plastic, polymer, metal, and a combination thereof. Specifically, the guide portion (400) may be made of one of POM, PEEK, polyimide, stainless steel, aluminum alloy, ceramic, and metal composite, but is not limited thereto. If the upper plate (100) is made of a metal material, it may include an insulating coating layer on its surface.

[0052] The lower plate (200) is provided so that the other end of the electrical conductive pin (30) passes through it, thereby exposing the other end of the electrical conductive pin (30). The lower plate (200) can pass the electrical conductive pin (30) through the lower through hole (201).

[0053] The lower plate (200) is provided with a plurality of lower through holes (201) to allow a plurality of electrically conductive pins (30) to pass through each. The lower plate (200) may be provided to be able to contact the electrically conductive pins (30) in a horizontal direction through the lower through holes (201).

[0054] The electrically conductive pin (30) exposed through the lower through-hole (201) of the lower plate (200) can come into contact with a contact terminal (not shown) of a circuit board (not shown). The other end of the exposed electrically conductive pin (30) can come into contact with a contact terminal of an object to be inspected (20) to exchange electrical signals with a test socket (10) (or inspection device).

[0055] The lower surface (or lower) of the lower plate (200) may be provided with a lower step (202) formed to narrow the lower through hole (201). The lower step (202) may be provided to be able to contact the electrical conductive pin (30) in a vertical direction. The lower step (202) may contact the electrical conductive pin (30) to prevent the electrical conductive pin (30) from detaching from the test socket (10) in a vertical direction (or downward direction).

[0056] The lower plate (200) may be made of one of plastic, polymer, metal, or a combination thereof. Specifically, the guide portion (400) may be made of one of POM, PEEK, polyimide, stainless steel, aluminum alloy, ceramic, and metal composite, but is not limited thereto. If the lower plate (200) is made of a metal material, it may include an insulating coating layer on its surface.

[0057] The upper plate (100) and the lower plate (200) can be positioned to face each other, and the upper through hole (101) of the upper plate (100) and the lower through hole (201) of the lower plate (200) can be positioned to communicate with each other.

[0058] The upper through hole (101) of the upper plate (100) and the lower through hole (201) of the lower plate (200) can form a space for receiving an electrically conductive pin (30).

[0059] Additionally, the upper plate (100), the lower plate (200), and the seating portion (420) may be positioned to face each other, and the upper through hole (101) of the upper plate (100), the lower through hole (201) of the lower plate (200), and the guide through hole (401) of the seating portion (420) may be positioned to communicate with each other.

[0060] The upper through hole (101) of the upper plate (100), the lower through hole (201) of the lower plate (200), and the guide through hole (401) of the seating portion (420) can form a space in which an electrically conductive pin (30) is received.

[0061] However, the semiconductor socket according to the embodiment of the present invention may include an upper plate (100), a lower plate (200), and a heat dissipation portion (300), and may optionally further include a seating portion (420).

[0062] The heat dissipation part (300) may be located between the upper plate (100) and the lower plate (200). The heat dissipation part (300) may dissipate heat generated from the electrically conductive pin (30) to the outside. The heat dissipation part (300) may be provided to surround the electrically conductive pin (30).

[0063] The heat dissipation part (300) is provided so that an electrically conductive pin (30) can pass through it, thereby allowing the electrically conductive pin (30) to pass through. The heat dissipation part (300) is provided with a plurality of heat dissipation through holes (301) so that each of the plurality of electrically conductive pins (30) can pass through them. The heat dissipation part (300) can be provided so as to be able to contact the electrically conductive pin (30) in a horizontal direction through the plurality of heat dissipation through holes (301).

[0064] The upper plate (100), the heat dissipation part (300), and the lower plate (200) may be positioned to face each other. The upper through-hole (101) of the upper plate (100), the heat dissipation through-hole (301) of the heat dissipation part (300), and the lower through-hole (201) of the lower plate (200) may be positioned to communicate with each other.

[0065] The upper through hole (101) of the upper plate (100), the heat dissipation through hole (301) of the heat dissipation part (300), and the lower through hole (201) of the lower plate (200) can form a space in which an electrically conductive pin (30) is received.

[0066] In contrast, the upper through hole (101) of the upper plate (100), the heat dissipation through hole (301) of the heat dissipation part (300), the lower through hole (201) of the lower plate (200), and the guide through hole (401) of the seating part (420) can form a space in which an electrically conductive pin (30) is received.

[0067] The heat dissipation part (300) may be formed in a structure that surrounds the electrically conductive pin (30) in a horizontal direction. The heat dissipation part (300) may be provided to be able to contact the electrically conductive pin (30) through the inner wall of the heat dissipation through hole (301).

[0068] The heat dissipation part (300) can surround the electrically conductive pin (30) and absorb heat generated in the heat dissipation part (300) and release it to the outside. The heat dissipation part (300) can surround each of the electrically conductive pins (30) through a plurality of heat dissipation through holes (301) and absorb heat generated in the heat dissipation part (300) and release it to the outside.

[0069] The housing part (500) is provided with a penetration area in the center, so that the guide part (400) can be positioned in the penetration area. The housing part (500) allows the object to be inspected (20) to be positioned in the guide part (400) through the penetration area, and the guide part (400) can align the object to be inspected (20) entering through the penetration area of ​​the housing part (500) to the correct position.

[0070] The housing part (500) can protect the upper plate (100), the heat dissipation part (300), and the lower plate (200) from external materials by wrapping them from the top and sides (see FIG. 1).

[0071] The housing portion (500) can expose at least a portion of the heat dissipation portion (300) from the side. Specifically, the housing portion (500) can expose at least a portion of the second heat dissipation portion (320) in the longitudinal direction from the side. The second heat dissipation portion (320), described later, can be located on each of the two wing portions (312) of the first heat dissipation portion (310), and the second heat dissipation portion (320) can be located on the wing portion (312) of the first heat dissipation portion (310) while being exposed to the outside from the side of the housing portion (500).

[0072] The surface extension portion (323) of the second heat dissipation portion (320) can communicate with the outside from the side of the housing portion (500). The second heat dissipation portion (320) itself can be exposed to the outside to release heat generated from the electrical conduction pin (30), and the surface extension portion (323) can be exposed to the outside to release heat generated from the electrical conduction pin (30). In particular, the surface extension portion (323) can increase heat dissipation efficiency by providing a space through which external air passes.

[0073] The test socket (10) according to an embodiment of the present invention can easily dissipate heat generated during the testing process of the electrically conductive pin (30) by allowing the heat dissipation part (300) to surround the electrically conductive pin (30) and directly receive and release heat from the electrically conductive pin (30).

[0074] Next, we will examine the structure of the heat dissipation part (300) in detail.

[0075] FIG. 3 is a drawing showing a heat dissipation unit (300) according to an embodiment of the present invention. FIG. 4 is a drawing showing a heat dissipation unit (300) according to an embodiment of the present invention. FIG. 5 is a drawing showing an enlarged view of the dotted line area of ​​FIG. 2. FIG. 6 is a drawing showing a test socket (10) equipped with an electrical conduction pin (30).

[0076] Referring to FIGS. 3 and 4, in an embodiment of the present invention, the heat dissipation unit (300) may include a first heat dissipation unit (310) that surrounds the electrically conductive pin (30) and absorbs heat from the electrically conductive pin (30), and a second heat dissipation unit (320) that contacts the first heat dissipation unit (310) and releases heat from the first heat dissipation unit (310) to the outside.

[0077] The heat dissipation unit (300) may include a first heat dissipation unit (310) and a second heat dissipation unit (320).

[0078] The first heat dissipation unit (310) can surround the electrical conductive pin (30) and absorb heat generated from the electrical conductive pin (30) and transfer it to the second heat dissipation unit (320). The first heat dissipation unit (320) can absorb heat generated from the electrical conductive pin (30) and release it directly to the outside. The second heat dissipation unit (320) can reabsorb the heat absorbed by the first heat dissipation unit (310) and release it directly to the outside.

[0079] The first heat dissipation part (310) may include a central part (311) and a wing part (312).

[0080] The central part (311) may be provided with a plurality of heat dissipation through holes (301). The central part (311) may refer to an area where a plurality of electrically conductive pins (30) are located. Wing portions (312) may be located on one side and the other side of the central part (311).

[0081] The wing portion (312) may be formed to extend in the direction of one side and the other side of the center (311). The wing portion (312) can transfer heat absorbed from the center (311) to the second heat dissipation portion (320). The wing portion (312) can transfer heat to the second heat dissipation portion (320) by contacting the second heat dissipation portion (320). The wing portion (312) may be located on one side and the other side of the center (311) and connected to two second heat dissipation portions (320) respectively.

[0082] The second heat dissipation section (320) may include a horizontal contact section (321) and a vertical contact section (322), and may further include a surface expansion section (323). At this time, the horizontal contact section (321) and the vertical contact section (322) may be formed in a vertical direction and formed as a single unit. The horizontal contact section (321) and the vertical contact section (322) may form a heat dissipation step, and the heat dissipation step may be formed such that the horizontal cross-sectional area of ​​the horizontal contact section (321) is smaller than the horizontal cross-sectional area of ​​the vertical contact section (322).

[0083] The horizontal contact portion (321) can contact the first heat dissipation portion (310) in a horizontal direction. The vertical contact portion (322) can contact the first heat dissipation portion (310) in a vertical direction. The contact between the horizontal contact portion (321) and the first heat dissipation portion (310), and the contact between the vertical contact portion (322) and the first heat dissipation portion (310), can increase the contact area between the first heat dissipation portion (310) and the second heat dissipation portion (320), thereby creating the effect of efficiently transferring heat from the first heat dissipation portion (310) to the second heat dissipation portion (320).

[0084] The second heat dissipation portion (320) and / or the vertical contact portion (322) may include a surface extension portion (323) formed in a vertical direction. The surface extension portion (323) may include a first surface extension portion (323a), a second surface extension portion (323b), and a third surface extension portion (323c).

[0085] The surface extension portion (323) may refer to an open area formed in a vertical direction from the upper surface of the second heat dissipation portion (320) (or vertical contact portion (322)) to a first predetermined distance. At this time, the first predetermined distance may refer to any distance starting from the upper surface and not reaching the lower surface.

[0086] Additionally, the surface extension portion (323) may refer to an open area formed from the upper surface of the second heat dissipation portion (320) to the lower surface in a vertical direction. At this time, the first predetermined distance may refer to the distance from the upper surface to the lower surface.

[0087] The surface expansion portion (323) can expand the surface area of ​​the second heat dissipation portion (320) to efficiently release heat to the outside. The surface expansion portion (323) may be provided in multiple numbers.

[0088] The first surface extension (323a) may be formed to extend in the length direction or width direction from one side of the second heat dissipation part (320) to the other side. Specifically, the first surface extension (323a) may be formed to extend vertically from the upper surface of the second heat dissipation part (320) to a first predetermined distance, and may be formed to extend horizontally from one side of the second heat dissipation part (320) to the other side.

[0089] The second surface extension (323b) may be formed to extend in the length or width direction from one side of the second heat dissipation part (320) toward the other side for a second predetermined distance. Specifically, the second surface extension (323b) may be formed to extend vertically from the upper surface of the second heat dissipation part (320) to a first predetermined distance, and may be formed to extend horizontally from one side of the second heat dissipation part (320) to a second predetermined distance.

[0090] The third surface extension (323c) is formed to extend vertically from the upper surface of the second heat dissipation part (320) to a first predetermined distance, and its horizontal cross-sectional area may be circular. The third surface extension (323c) may be positioned spaced apart from the second surface extension (323b).

[0091] The third surface extension part (323c) can provide a space where the first heat dissipation part (310) and the second heat dissipation part (320) can be connected through a connecting means such as a bolt. The third surface extension part (323c) can expand the surface of the second heat dissipation part (320) to increase heat dissipation efficiency, and at the same time, provide a space where a connecting means is located so that the second heat dissipation part (320) and the first heat dissipation part (310) can be connected to each other.

[0092] The first surface extension portion (323a) may be formed in plurality, and the plurality of first surface extension portions (323a) may be spaced apart from each other in the width direction. A portion of the plurality of first surface extension portions (323a) may be provided so as to be adjacent to one end surface in the width direction of the second heat dissipation portion (320), and the remainder may be provided so as to be adjacent to the other end surface in the width direction of the second heat dissipation portion (320). Here, the portion and the remainder may mean at least one.

[0093] The second surface extension portions (323b) may be formed in plurality, and the plurality of second surface extension portions (323b) may be spaced apart from each other in the width direction. The plurality of second surface extension portions (323b) may be provided between some and the remainder of the plurality of first surface extension portions (323a).

[0094] The third surface extension portion (323c) may be formed in multiple numbers and may be provided spaced apart in the longitudinal direction from one end of the second surface extension portion (323b).

[0095] On the second heat dissipation section (320), at least one first surface extension section (323a) may be positioned in sequence toward the width direction, at least one second surface extension section (323b) may be positioned, and again at least one first surface extension section (323a) may be positioned.

[0096] On the second heat dissipation part (320), a second surface extension part (323b) is formed extending from one side to a second predetermined distance in the longitudinal direction, and at least one third surface extension part (323c) may be positioned spaced apart in the longitudinal direction from the second surface extension part (323b).

[0097] A test socket (10) according to an embodiment of the present invention is configured such that the second heat dissipation part (320) includes a first surface expansion part (323a), a second surface expansion part (323b), and a third surface expansion part (323c), thereby increasing the surface area of ​​the heat dissipation part (300) to increase heat dissipation efficiency.

[0098] The first heat dissipation part (310) may be made of a ceramic material. The first heat dissipation part (310) may be made of an insulating material. The ceramic material has the advantage of being able to withstand high temperatures due to its high heat resistance and withstand rapid temperature changes due to its thermal shock resistance.

[0099] Furthermore, ceramic materials have the advantage of being very hard due to their high hardness and highly resistant to friction or wear due to their high wear resistance. In addition, ceramic materials have the advantage of being electrically stable due to their high electrical insulation properties.

[0100] The second heat dissipation part (320) may be made of a metal material. In particular, the second heat dissipation part (320) may be made of an aluminum material. The aluminum material can rapidly transfer heat due to its high thermal conductivity and rapidly disperse heat due to its high thermal diffusivity.

[0101] The guide section (400), the upper plate (100), and the lower plate (200) may be made of plastic material. The plastic material may have a thermal conductivity in the range of about 0.3 to 0.35 W / (mk). The first heat dissipation section (310) may be made of ceramic material. The ceramic material may have a thermal conductivity of about 51 W / (mk). The second heat dissipation section (320) may be made of aluminum material. The aluminum material may have a thermal conductivity of 167 W / (mk). However, the materials of the guide section (400), the upper plate (100), the lower plate (200), the first heat dissipation section (310), and the second heat dissipation section (320) are not limited to those described above.

[0102] The first heat dissipation part (310) may have a higher thermal conductivity than the upper plate (100). The first heat dissipation part (310) may have a higher thermal conductivity than the lower plate (200). The first heat dissipation part (310) may have a higher thermal conductivity than the guide part (400). The second heat dissipation part (320) may have a higher thermal conductivity than the first heat dissipation part (310).

[0103] The first heat dissipation part (310) can be in contact with the upper plate (100) and the lower plate (200) in a vertical direction and can transfer heat generated from the electrical conduction pin (30) in a horizontal direction. The upper surface of the first heat dissipation part (310) can be in contact with the lower surface of the upper plate (100), and the lower surface of the first heat dissipation part (310) can be in contact with the upper surface of the lower plate (200).

[0104] The second heat dissipation unit (320) can be in contact with the upper plate (100) in a horizontal direction and can receive heat again from the first heat dissipation unit (310) that received heat generated on the electrical conduction pin (30) and release it to the outside.

[0105] In order to easily dissipate heat from at least one of the guide portion (400), upper plate (100), lower plate (200), and electrical conduction pin (30), the heat dissipation efficiency of the test socket (10) according to an embodiment of the present invention can be improved by configuring the first heat dissipation portion (310) with a ceramic material and the second heat dissipation portion (320) with an aluminum material.

[0106] A test socket (10) according to an embodiment of the present invention may be configured such that a first heat dissipation unit (310) primarily absorbs heat generated from an electrical conduction pin (30) and transfers it in a horizontal direction, and a second heat dissipation unit (320) transfers the received heat to the outside. Since the second heat dissipation unit (320) of the test socket (10) has a high thermal conductivity, it may serve to reinforce the insufficient thermal conductivity of the first heat dissipation unit (310).

[0107] Referring to FIG. 5, the upper through hole (101) of the upper plate (100), the heat dissipation through hole (301) of the heat dissipation part (300), and the lower through hole (201) of the lower plate (200) are connected to each other to form a space in which an electrically conductive pin (30) is received.

[0108] Alternatively, a guide through hole (401) of the guide portion (400) may be added so that the guide through hole (401) of the guide portion (400) or the seating portion (420), the upper through hole (101) of the upper plate (100), the heat dissipation through hole (301) of the heat dissipation portion (300), and the lower through hole (201) of the lower plate (200) are connected to each other to form a space in which an electrically conductive pin (30) is received.

[0109] Referring to FIG. 6, the electrically conductive pin (30) received in the upper through hole (101), the heat dissipation through hole (301), and the lower through hole (201) can be elastically deformed by being pressed by the object to be inspected (20). The elastically deformed electrically conductive pin (30) can exchange electrical signals with the object to be inspected (20) through the external terminal (21) of the object to be inspected (20) in an overdrive state.

[0110] Heat may be generated as the electrical conduction pin (30) exchanges electrical signals with the object to be inspected (20). The test socket (10) according to an embodiment of the present invention may form a thermal path in which the heat generated from the electrical conduction pin (30) spreads horizontally through the heat dissipation part (300).

[0111] The test socket (10) according to an embodiment of the present invention has the effect of dissipating heat by directly receiving heat through a heat dissipation part (300) provided to be in contact with an electrical conduction pin (30).

[0112] The test socket (10) according to the embodiment of the present invention has the effect of efficiently dissipating heat generated from the electrical conduction pin (30) through a heat dissipation part (300) having a double structure of an electrical insulating material and a metal material.

[0113] As described above, although the present invention has been explained with reference to preferred embodiments, a person skilled in the art may implement the present invention with various modifications or variations without departing from the spirit and scope of the invention as described in the following claims.

[0114] [Explanation of the symbol]

[0115] 10: Test Socket

[0116] 20 : Subject of inspection

[0117] 21 : External terminal

[0118] 30: Electrical conduction pin

[0119] 100 : Upper plate

[0120] 101 : Upper through hole

[0121] 102 : Upper step

[0122] 200 : Lower plate

[0123] 201: Lower through hole

[0124] 202 : Lower step

[0125] 300 : Heat dissipation part

[0126] 301: Heat dissipation through-hole

[0127] 310: 1st heat dissipation unit

[0128] 311 : Center

[0129] 312 : Wing part

[0130] 320 : Second heat dissipation unit

[0131] 321 : Horizontal contact part

[0132] 322 : Vertical contact part

[0133] 323 : Surface extension

[0134] 323a : First surface extension

[0135] 323b : Second surface extension

[0136] 323c : Third surface extension

[0137] 400 : Guide section

[0138] 401: Guide through hole

[0139] 410 : Inclined section

[0140] 420 : Seating part

[0141] 500 : Housing part

Claims

1. In a test socket for testing the electrical characteristics of an object to be tested, An upper plate through which one end of an electrically conductive pin penetrates to expose the said end; A lower plate through which the other end of the electrically conductive pin penetrates to expose the other end; and A test socket comprising: a heat dissipation portion that releases heat generated from the electrical conduction pin between the upper plate and the lower plate to the outside.

2. In Paragraph 1, The above heat dissipation unit is, A test socket including a heat dissipation through-hole through which the above-mentioned electrical conductive pin passes.

3. In Paragraph 1, The above heat dissipation unit is, A test socket that surrounds the electrically conductive pin and absorbs the heat of the electrically conductive pin.

4. In Paragraph 1, The above heat dissipation unit is, A first heat dissipation part that surrounds the electrically conductive pin and absorbs heat from the electrically conductive pin, and A test socket comprising a second heat dissipation part that contacts the first heat dissipation part and releases heat from the first heat dissipation part to the outside.

5. In Paragraph 4, The above first heat dissipation part is an insulating material. The above second heat dissipation part is a test socket made of a metal material.

6. In Paragraph 4, The above-mentioned first heat dissipation unit is, The thermal conductivity is greater than that of at least one of the upper plate and the lower plate, and The above second heat dissipation unit is, A test socket having a higher thermal conductivity than the first heat dissipation part.

7. In Paragraph 4, The above-mentioned first heat dissipation unit is, A test socket that contacts the upper plate and the lower plate in a vertical direction and transfers heat generated from the electrical conduction pin in a horizontal direction.

8. In Paragraph 4, The above second heat dissipation unit is, A test socket in horizontal contact with the upper plate above.

9. In Paragraph 1, The above heat dissipation unit is, A test socket comprising a plurality of surface extensions communicating with the outside.

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