Printed circuit board and electronic device comprising same

Abstract

A printed circuit board (PCB) unit is disclosed. The PCB unit may comprise at least one electronic component and a PCB on which the at least one electronic component is disposed. When disposed in an electronic device, the PCB may include a first side surface adjacent to a designated electronic component of the electronic device and formed by a laser, and a second side surface spaced apart from the designated electronic component and formed by a milling machine.

Description

Printed circuit board, and electronic device including the same

[0001] The following descriptions relate to printed circuit boards and electronic devices including the same.

[0002] A printed circuit board (PCB) can have one or more electronic components placed on it and electrically connect the placed electronic components. As thin mobile devices are preferred, improvements are being made to make PCBs thinner as well.

[0003] In a manufacturing process of a PCB unit having one or more electronic components, multiple PCB units may be arranged in a single PCB array. While the multiple PCB units are being manufactured, multiple bridges may connect the PCB array and the multiple PCB units. The multiple bridges may be removed when separating the multiple PCB units from the PCB array.

[0004] An electronic device is disclosed. The electronic device may include a housing; and a printed circuit board (PCB) accommodated in the housing. The PCB may include a first side having a first cross-sectional characteristic formed by laser cutting, and a second side having a second cross-sectional characteristic formed by mechanical cutting.

[0005] A printed circuit board (PCB) unit is disclosed. The PCB unit may include a first electronic component and a first PCB on which the first electronic component is placed. When the first PCB is placed in an electronic device, it may include a first side formed by a laser adjacent to a second electronic component included in the electronic device, and a second side formed by a milling machine separated from the second electronic component.

[0006] A method for manufacturing a PCB unit is disclosed. The method for manufacturing the PCB unit may include the operation of forming at least a portion of the side of the PCB unit on a PCB array through a milling machine, the operation of placing at least one electronic component on the PCB unit on the PCB array, and the operation of separating the PCB unit from the PCB array by forming at least another portion of the side of the PCB unit on the PCB array through a laser.

[0007] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0008] FIG. 2a is a drawing illustrating a printed circuit board (PCB) unit according to one embodiment.

[0009] FIGS. 2B and FIGS. 2C are drawings illustrating a PCB comprising one or more layers stacked in a vertical direction.

[0010] FIG. 3 is a drawing illustrating an electronic device equipped with a PCB unit according to one embodiment.

[0011] Figure 4a is a drawing illustrating a PCB array.

[0012] FIG. 4b is a drawing illustrating PCB units in which parts of the sides are formed on a PCB array.

[0013] FIG. 4c is a drawing illustrating an example in which components are arranged on PCB units in which parts of the sides are formed on a PCB array.

[0014] FIG. 4d is a drawing illustrating PCB units separated from a PCB array.

[0015] FIG. 5 is a drawing illustrating another example in which components are arranged on PCB units in which parts of the sides are formed on a PCB array.

[0016] FIG. 6 is a drawing illustrating a PCB unit including two or more PCBs.

[0017] FIG. 7 is a drawing illustrating a PCB unit according to one embodiment.

[0018] FIG. 8 is a drawing illustrating an electronic device equipped with a PCB unit according to one embodiment.

[0019] FIG. 9 is a drawing illustrating PCB units in which parts of the sides are formed on a PCB array.

[0020] FIG. 10 is a drawing illustrating PCB units in which parts of the sides are formed on a PCB array.

[0021] FIG. 11 is a drawing illustrating PCB units in which parts of the sides are formed on a PCB array.

[0022] FIG. 12a is a drawing illustrating the side of a PCB unit.

[0023] FIG. 12b is a drawing illustrating a crystalline structure formed on the side of a PCB unit.

[0024] Figure 13 is a drawing illustrating the side of a PCB unit.

[0025] Figure 14 is a drawing illustrating the side of a PCB unit.

[0026] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0027] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0028] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0029] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0030] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0031] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0032] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0033] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0034] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0035] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0036] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0037] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0038] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0039] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0040] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0041] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0042] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0043] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0044] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 664 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 6 ms or less) for realizing URLLC.

[0045] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0046] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0047] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0048] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0049] FIG. 2a is a drawing illustrating a printed circuit board (PCB) unit according to one embodiment. FIG. 2b and FIG. 2c are drawings illustrating a PCB comprising one or more layers stacked in a vertical direction. FIG. 3 is a drawing illustrating an electronic device equipped with a PCB unit according to one embodiment.

[0050] In one embodiment, referring to FIG. 2a, the PCB unit (201) may include a PCB (210) and at least one electronic component (221, 225) disposed on the PCB (210). In one embodiment, the at least one electronic component (221, 225) may be a processor (120 in FIG. 1) and / or a communication module (190 in FIG. 1), but is not limited thereto.

[0051] In one embodiment, the PCB (210) may include a plurality of sides (211, 213, 215, 217). For example, the PCB (210) may include a plurality of sides (211, 213, 215, 217) forming the perimeter of the PCB (210). In one embodiment, the thickness of the PCB (210) may be 0.4 millimeters or less.

[0052] For example, a plurality of sides (211, 213, 215, 217) may correspond to different parts of the perimeter of the PCB (210). In one embodiment, a first side (211) among the plurality of sides (211, 213, 215, 217) may extend along the left perimeter of the PCB (210). In one embodiment, a second side (213) among the plurality of sides (211, 213, 215, 217) may extend along the upper perimeter of the PCB (210). In one embodiment, a third side (215) among the plurality of sides (211, 213, 215, 217) may extend along the lower perimeter of the PCB (210). In one embodiment, among the plurality of sides (211, 213, 215, 217), the fourth side (217) may extend along the right perimeter of the PCB (210).

[0053] In one embodiment, a plurality of sides (211, 213, 215, 217) of the PCB (210) may be formed by different cutting methods. For example, different cutting methods may include cutting methods based on an optical cutter (e.g., a laser router). For example, an optical cutter (e.g., a laser router) may form at least some of the plurality of sides (211, 213, 215, 217) of the PCB (210) by irradiating light (or a laser) onto a PCB array. For example, different cutting methods may include cutting methods based on a mechanical cutter (e.g., a milling machine, or a CNC (computerized numerical control) machine). For example, a mechanical cutting machine (e.g., a milling machine, or a CNC machine) can form at least some of the multiple sides (211, 213, 215, 217) of the PCB (210) by cutting the PCB array through a bit cutter.

[0054] In one embodiment, referring to FIG. 3, at least a portion of the sides (211, 215) of a plurality of sides (211, 213, 215, 217) of the PCB (210) that are adjacent to (or in contact with) a designated electronic component (310, 320) may be formed through an optical cutter (e.g., a laser router). In one embodiment, at least a portion of the sides (211, 215) of the plurality of sides (211, 213, 215, 217) of the PCB (210) formed through an optical cutter (e.g., a laser router) may have a first cross-sectional characteristic. In one embodiment, at least a portion of the sides (211, 215) having the first cross-sectional characteristic may include a carbonized portion. In one embodiment, at least a portion of the sides (211, 215) having the first cross-sectional characteristic may include a crystalline material.

[0055] For example, referring to FIG. 2b and FIG. 2c, the PCB (210) may include one or more layers (261, 263, 265, 281, 283, 285) stacked in a vertical direction. For example, referring to FIG. 2b, the PCB (210) may define at least some of the sides (211, 215) having a first cross-sectional characteristic between a first surface (251) of a first layer (261) among one or more layers (261, 263, 265) stacked in a vertical direction and a second surface (255) of a second layer (265) opposite to the first surface (251).

[0056] For example, on the sides (211, 215) having the first cross-sectional characteristics, a smooth surface can be formed by an optical cutter (e.g., a laser router) when viewed in a direction perpendicular to the first surface (251) of the PCB (210) (e.g., a direction from A to A').

[0057] In one embodiment, a damaged portion formed by an optical cutter (e.g., a laser router) may be formed on the first surface (251). In one embodiment, the edge portion adjacent to the sides (211, 215) of the first surface (251) may include the damaged portion. For example, the length of the damaged portion inward from the sides (211, 215) (e.g., the direction from A to A') may be 10 micrometers to 30 micrometers. According to an embodiment, a processor may be placed on the edge portion adjacent to the sides (211, 215) of the first surface (251). However, the embodiment is not limited thereto. According to an embodiment, a relatively tall electronic component (e.g., a sensor) may be placed on the edge portion adjacent to the sides (211, 215) of the first surface (251).

[0058] For example, one or more stacked layers (261, 263, 265) may include a conductive layer (263). For example, the distance from the first surface (251) to the conductive layer (263) may be 50 micrometers to 150 micrometers.

[0059] In one embodiment, a damaged portion formed by an optical cutter (e.g., a laser router) may not be formed on the second surface (255). In one embodiment, the edge portion of the second surface (255) adjacent to the sides (211, 215) may not include a damaged portion facing inward. According to an embodiment, a relatively high component (e.g., an interposer) may be placed on the edge portion of the second surface (255) adjacent to the sides (211, 215). However, the embodiment is not limited thereto. According to an embodiment, a relatively sensitive electronic component (e.g., a connector) may be placed on the edge portion of the second surface (255) adjacent to the sides (211, 215).

[0060] In one embodiment, the first side (211) may include a portion (231) adjacent to (or in contact with) a designated electronic component (310, 320). In one embodiment, the portion (231) may extend for more than a designated length (e.g., 3 millimeters) along the perimeter of the PCB unit (201) perpendicular to one direction (or normal). In one embodiment, the third side (215) may include portions (233, 235) adjacent to (or in contact with) the designated electronic component (310, 320). In one embodiment, the portions (233, 235) may extend for more than a designated length (e.g., 3 millimeters) along the perimeter of the PCB unit (201) perpendicular to one direction (or normal). The designated electronic component (310) may be a camera module (e.g., 180 in FIG. 1). The designated electronic component (320) may be a battery (e.g., 189 in FIG. 1).

[0061] In one embodiment, the length of the portions (233, 235) adjacent to the battery (189) extending along the perimeter of the PCB unit (201) may be longer than the length of the portion (231) adjacent to the camera module (180) extending along the perimeter of the PCB unit (201).

[0062] In one embodiment, among the plurality of sides (211, 213, 215, 217) of the PCB (210), the sides (213, 217) that are separated from (or do not come into contact with) a designated electronic component (310, 320) may be formed through a mechanical cutting machine (e.g., a milling machine, a CNC machine). In one embodiment, at least some of the sides (213, 217) formed through the mechanical cutting machine (e.g., a milling machine, a CNC machine) among the plurality of sides (211, 213, 215, 217) of the PCB (210) may have a second cross-sectional characteristic. In one embodiment, at least some of the sides (213, 217) having the second cross-sectional characteristic may not contain a crystalline material.

[0063] For example, referring to FIG. 2c, the PCB (210) may define at least some of the sides (213, 217) having a second cross-sectional characteristic between the first side (271) of the first layer (281) and the second side (275) of the second layer (285) opposite to the first side (271) of the first layer (285) among one or more layers (281, 283, 285) stacked in a vertical direction.

[0064] For example, on the sides (213, 217) having the second cross-sectional characteristics, a rough surface may be formed by a mechanical cutting machine (e.g., milling machine, CNC machine) when viewed in a direction perpendicular to the first side (271) of the PCB (210) (e.g., direction from B to B').

[0065] For example, the length from the sides (213, 217) of the rough surface in the inner direction (e.g., from B to B') may be 10 micrometers to 30 micrometers.

[0066] In one embodiment, a damaged portion may be formed on the first surface (271) by a mechanical cutting machine (e.g., a milling machine, a CNC machine). In one embodiment, the edge portion adjacent to the sides (213, 217) of the first surface (271) may include the damaged portion. For example, the length of the damaged portion inward from the sides (213, 217) (e.g., the direction from B to B') may be 6 micrometers to 7 micrometers.

[0067] In one embodiment, the second surface (275) may not have a damaged portion formed by a mechanical cutting machine (e.g., milling machine, CNC machine). In one embodiment, the edge portion of the second surface (275) adjacent to the sides (213, 217) may not have a damaged portion facing inward.

[0068] In one embodiment, the second side (213) may include portions (241, 243, 245, 247, 249) that are separated (or not in contact) from the designated electronic component (310, 320). In one embodiment, the portions (241, 243, 245, 247, 249) may extend perpendicular to different directions (or normals) along the perimeter of the PCB unit (201).

[0069] In one embodiment, the cutting tolerance of an optical cutter (e.g., laser router) (e.g., ± 0.1 millimeters) may be smaller than the cutting tolerance of a mechanical cutter (e.g., milling machine, CNC machine) (e.g., ± 0.3 millimeters). Accordingly, sides (211, 215) formed by the optical cutter (e.g., laser router) (or parts (231, 233, 235) of the sides (211, 215)) may be formed into the interior of the PCB (210) by a cutting tolerance difference (e.g., 0.2 millimeters) compared to sides (213, 217) (or parts (241, 243, 245, 247, 249)) formed by the mechanical cutter (e.g., milling machine, CNC machine). As sides (211, 215) (or parts (231, 233, 235)) formed by an optical cutter (e.g., a laser router) are formed inwardly on the PCB (210) by a cutting tolerance difference (e.g., 0.2 millimeters), the size of some electronic components (e.g., a battery (189)) may be increased. For example, as parts (233, 235)) of sides (215) are formed inwardly on the PCB (210) by a cutting tolerance difference (e.g., 0.2 millimeters), the size of the electronic component (320) (or battery (189)) may be increased inwardly on the PCB (210) by a cutting tolerance difference (e.g., 0.2 millimeters). As the size of the electronic component (320) (or battery (189)) increases in the direction of the PCB (210) by a cutting tolerance difference (e.g., 0.2 millimeters), the battery capacity of the electronic component (320) (or battery (189)) can be increased.

[0070] Additionally, the electronic component (310, 320) may be positioned adjacent to the sides (211, 215) (or parts (231, 233, 235)) of the sides (211, 215) by a cutting tolerance difference (e.g., 0.2 millimeters) than to parts (241, 243, 245, 247, 249) of the sides (213, 217). Accordingly, due to a cutting tolerance difference (e.g., 0.2 millimeters), the distance between the sides (211, 215) (or parts (231, 233, 235) of the sides (211, 215)) and the designated electronic component (310, 320) may be shorter than the distance between the sides (213, 217) (or parts (241, 243, 245, 247, 249)) and the other electronic component closest to the sides (213, 217) (or parts (241, 243, 245, 247, 249) of the sides (213, 217).

[0071] As described above, the PCB (210) may include a plurality of sides (211, 215) that are curved by an optical cutter (e.g., a laser router). Accordingly, by the plurality of curved sides (211, 215), the shape of a shield can on an edge portion adjacent to the plurality of sides (211, 215) among the faces (251, 255) of the layers (261, 263, 265) may be simplified, and / or a placement space for placing at least one electronic component (221, 225) on the PCB (210) may be secured.

[0072] Additionally, by means of multiple sides (211, 215) processed by an optical cutter (e.g., a laser router), the degree of design freedom can be increased so that an electronic component (e.g., a sensor) having a relatively high height can be placed on an edge portion adjacent to multiple sides (211, 215) among the faces (251, 255) of the layers (261, 263, 265). Additionally, by means of multiple sides (211, 215) processed by an optical cutter (e.g., a laser router), relatively little dust is generated, so that an electronic component (e.g., a connector, a sensor) having a relatively high sensitivity can be placed on an edge portion adjacent to multiple sides (211, 215) among the faces (251, 255) of the layers (261, 263, 265).

[0073] In addition, as it is processed by an optical cutting machine (e.g., a laser router), the generation of burrs is reduced compared to when it is processed only by a mechanical cutting machine (e.g., a milling machine, a CNC machine), and accordingly, damage to the PCB (210) can be reduced.

[0074] FIG. 4a is a drawing illustrating a PCB array. FIG. 4b is a drawing illustrating PCB units in which parts of the sides are formed in the PCB array. FIG. 4c is a drawing illustrating an example in which components are arranged on PCB units in which parts of the sides are formed in the PCB array. FIG. 4d is a drawing illustrating PCB units separated from the PCB array.

[0075] A method for manufacturing a PCB unit (201) on a PCB array (401) can be described through FIGS. 4a to 4d. The method for manufacturing a PCB unit (201) may include the operation of forming at least a portion of the side of the PCB unit (201) on the PCB array (401) through a milling machine exemplified through FIG. 4b. The method for manufacturing a PCB unit (201) may include the operation of placing at least one electronic component (221, 225) on the PCB unit (201) on the PCB array (401) exemplified through FIG. 4c. The method for manufacturing a PCB unit (201) may include the operation of separating the PCB unit (201) from the PCB array (401) by forming at least another portion of the side of the PCB unit (201) on the PCB array (401) through a laser exemplified through FIG. 4d.

[0076] Referring to FIG. 4a, the PCB array (401) may have the shape of a specified figure. For example, the PCB array (401) may be rectangular. For example, the PCB array (401) may have a size of about 90 millimeters in the vertical direction and about 115 millimeters in the horizontal direction.

[0077] Referring to FIG. 4b, parts (411, 412, 413, 414, 415, 416, 417) of the sides of a plurality of PCB units (201, 403, 405, 407) can be formed on a PCB array (401). For example, parts (411, 412, 413, 414, 415, 416, 417) of the sides of a plurality of PCB units (201, 403, 405, 407) can be formed on the PCB array (401) through a mechanical cutting machine (e.g., a milling machine, or a CNC machine).

[0078] In one embodiment, parts (411, 412, 413, 414, 415, 416, 417) of the sides of a plurality of PCB units (201, 403, 405, 407) may be spaced apart from each other via bridges (420). In one embodiment, the bridges (420) may be an area of ​​a specified length (e.g., about 2 millimeters) or less connecting each of the plurality of PCB units (201, 403, 405, 407) and the PCB array (401) during the manufacturing process of the plurality of PCB units (201, 403, 405, 407).

[0079] In one embodiment, some of the sides (431, 433, 435, 437) of the plurality of PCB units (201, 403, 405, 407) may be cut through an optical cutter (e.g., a laser router) after one or more electronic components (441, 445) are placed.

[0080] In one embodiment, some of the sides (431, 433, 435, 437) of the plurality of PCB units (201, 403, 405, 407) may be extended for a specified length (e.g., 3 millimeters) or more in a manner perpendicular to one direction (or normal) along the perimeter of the plurality of PCB units (201, 403, 405, 407). In one embodiment, some of the sides (431, 433, 435, 437) of the plurality of PCB units (201, 403, 405, 407) may be arranged parallel to the outer line of electronic components (e.g., battery (189), and / or camera module (180)) within the electronic device (101) when the plurality of PCB units (201, 403, 405, 407) are placed in the electronic device (101).

[0081] Referring to FIG. 4c, electronic components (441, 445) can be placed on a plurality of PCB units (201, 403, 405, 407) in which parts of the sides are formed.

[0082] Referring to FIG. 4d, a plurality of PCB units (201, 403, 405, 407) on which electronic components (441, 445) are placed can be separated from the PCB array (401). For example, some sides (431, 433, 435, 437) of the PCB units (201, 403, 405, 407) are formed and bridges (420) are removed, thereby separating the plurality of PCB units (201, 403, 405, 407) on which electronic components (441, 445) are placed from the PCB array (401). Some sides (431, 433, 435, 437) of a plurality of PCB units (201, 403, 405, 407) can be formed on a PCB array (401) through an optical cutter (e.g., a laser router), and the plurality of PCB units (201, 403, 405, 407) can be separated from the PCB array (401) by removing bridges through a mechanical cutter (e.g., a milling machine, or a CNC machine). For example, some sides (431, 433, 435, 437) of a plurality of PCB units (201, 403, 405, 407) can be formed on a PCB array (401) through an optical cutter (e.g., a laser router). For example, bridges (420) that separate parts of the sides of multiple PCB units (201, 403, 405, 407) can be removed using a mechanical cutting machine (e.g., a milling machine, or a CNC machine).

[0083] Other parts (431, 433, 435, 437) that are not cut before the placement of the electronic components (441, 445) as described above can connect the plurality of PCB units (201, 403, 405, 407) to the PCB array (401) with a stronger strength than the bridges (420) while the plurality of PCB units (201, 403, 405, 407) are manufactured on the PCB array (401) (or before the plurality of PCB units (201, 403, 405, 407) are separated from the PCB array (401).

[0084] As described above, warpage can be reduced even if the thickness of each of the plurality of PCB units (201, 403, 405, 407) is reduced by other parts (431, 433, 435, 437) that are not cut before the placement of the electronic components (441, 445). As described above, even if the number of bridges (420) connecting the plurality of PCB units (201, 403, 405, 407) and the PCB array (401) is reduced, the connection strength between the plurality of PCB units (201, 403, 405, 407) and the PCB array (401) can be maintained or increased by other parts (431, 433, 435, 437) that are not cut before the placement of the electronic components (441, 445).

[0085] As described above, the connection strength between the plurality of PCB units (201, 403, 405, 407) and the PCB array (401) is maintained or increased by other parts (431, 433, 435, 437) that are not cut before the placement of electronic components (441, 445), thereby reducing the spacing between the plurality of PCB units (201, 403, 405, 407) placed within the PCB array (401). In one embodiment, as the spacing between the plurality of PCB units (201, 403, 405, 407) is reduced, more plurality of PCB units (201, 403, 405, 407) can be placed within the PCB array (401). Additionally, as the spacing between multiple PCB units (201, 403, 405, 407) is reduced, a smaller size PCB array (401) may be used when the same number of PCB units (201, 403, 405, 407) are placed in the PCB array (401). As a larger number of PCB units (201, 403, 405, 407) are manufactured in a single PCB array (401), or as the same number of PCB units (201, 403, 405, 407) are manufactured in a smaller size PCB array (401), the manufacturing cost of the PCB units (201, 403, 405, 407) may be reduced.

[0086] FIG. 5 is a drawing illustrating another example in which components are arranged on PCB units in which parts of the sides are formed on a PCB array.

[0087] The PCB array of FIG. 5 may have longer sides formed by an optical cutter (e.g., a laser router) compared to the PCB array (401) of FIG. 4c.

[0088] To strengthen the connection strength between the PCB array of FIG. 5 and the plurality of PCB units (201, 403, 405, 407), the remaining parts (511, 513, 515, 517) of the sides of the plurality of PCB units (201, 403, 405, 407) connecting the PCB array and the plurality of PCB units (201, 403, 405, 407) may be included, which are longer than the bridges (420). In one embodiment, the remaining parts (511, 513, 515, 517) may be located at different positions for each of the plurality of PCB units (201, 403, 405, 407). For example, the remaining parts (511, 513, 515, 517) may be located in a direction facing the PCB array (401) rather than in a direction facing an adjacent PCB unit among the plurality of PCB units (201, 403, 405, 407). For example, the remaining parts (511, 513, 515, 517) may be located in a direction facing the side rather than the center direction of the PCB array (401).

[0089] In one embodiment, the remaining portions (511, 513, 515, 517) of the sides of the plurality of PCB units (201, 403, 405, 407) may be extended for a specified length (e.g., 3 millimeters) or more in a manner perpendicular to one direction (or normal) along the perimeter of the plurality of PCB units (201, 403, 405, 407).

[0090] In one embodiment, some sides (431, 433, 435, 437) of the sides of a plurality of PCB units (201, 403, 405, 407) and the remaining parts (511, 513, 515, 517) of the sides of the plurality of PCB units (201, 403, 405, 407) can be formed on a PCB array (401) through an optical cutter (e.g., a laser router).

[0091] FIG. 6 is a drawing illustrating a PCB unit including two or more PCBs.

[0092] In one embodiment, the PCBs (601, 603) of FIG. 6 may be arranged vertically (or stacked) through connecting parts (e.g., interposers (611, 613) and soldering (621, 623, 625, 627)). One or more electronic components (631, 633, 635, 641, 643, 645) may be arranged on each of the PCBs (601, 603) of FIG. 6.

[0093] In one embodiment, any one of the PCB units (601, 603) may correspond to the PCB (210) illustrated in FIGS. 2a through 5. For example, the sides of any one of the PCBs (601, 603) may be formed using both an optical cutter (e.g., a laser router) and a mechanical cutter (e.g., a milling machine, or a CNC machine). Hereinafter, a PCB in which the sides are formed using both an optical cutter (e.g., a laser router) and a mechanical cutter (e.g., a milling machine, or a CNC machine) may be referred to as a hybrid PCB.

[0094] In one embodiment, sides of one of the PCBs (601, 603) may be formed using a cutting machine of either an optical cutting machine (e.g., a laser router) or a mechanical cutting machine (e.g., a milling machine, or a CNC machine). For example, sides of one of the PCBs (601, 603) may be formed using an optical cutting machine (e.g., a laser router). For example, sides of one of the PCBs (601, 603) may be formed using a mechanical cutting machine (e.g., a milling machine, or a CNC machine). Hereinafter, a PCB in which sides are formed using a cutting machine of either an optical cutting machine (e.g., a laser router) or a mechanical cutting machine (e.g., a milling machine, or a CNC machine) may be referred to as a single-type PCB.

[0095] For example, a hybrid PCB may be placed below a single PCB via interposers (611, 613). However, it is not limited thereto. For example, a hybrid PCB may be placed above a single PCB via interposers (611, 613). Hereinafter, the PCB placed above may be referred to as the primary PCB, and the PCB placed below may be referred to as the secondary PCB.

[0096] For example, the thickness of the hybrid PCB may be thinner than the thickness of the single PCB. For example, if the hybrid PCB is a secondary PCB placed underneath, the thickness of the hybrid PCB is 0.392 or 0.376 millimeters (or less), and the thickness of the single PCB may be thicker than the thickness of the hybrid PCB.

[0097] FIG. 7 is a drawing illustrating a printed circuit board (PCB) unit according to one embodiment. FIG. 8 is a drawing illustrating an electronic device equipped with a PCB unit according to one embodiment.

[0098] In one embodiment, referring to FIG. 7, the PCB unit (701) may include a plurality of sides (711, 713, 715, 717). For example, the PCB unit (701) may include a plurality of sides (711, 713, 715, 717) forming the perimeter of the PCB unit (701).

[0099] For example, a plurality of sides (711, 713, 715, 717) may correspond to different parts of the perimeter of the PCB unit (701). In one embodiment, the first side (711) among the plurality of sides (711, 713, 715, 717) may extend along the left perimeter of the PCB unit (701). In one embodiment, the second side (713) among the plurality of sides (711, 713, 715, 717) may extend along the right perimeter of the PCB unit (701). In one embodiment, the third side (715) among the plurality of sides (711, 713, 715, 717) may extend along the lower perimeter of the PCB unit (701). In one embodiment, among the plurality of sides (711, 713, 715, 717), the fourth side (717) may extend along the upper perimeter of the PCB unit (701).

[0100] In one embodiment, a plurality of sides (711, 713, 715, 717) of a PCB unit (701) may be formed by different cutting methods. For example, different cutting methods may include cutting methods based on an optical cutter (e.g., a laser router). For example, an optical cutter (e.g., a laser router) may form at least some of the plurality of sides (711, 713, 715, 717) of the PCB unit (701) by irradiating light (or a laser) onto a PCB array. For example, different cutting methods may include cutting methods based on a mechanical cutter (e.g., a milling machine, or a CNC machine). For example, a mechanical cutter (e.g., a milling machine, or a CNC machine) may form at least some of the plurality of sides (711, 713, 715, 717) of the PCB unit (701) by cutting the PCB array through a bit cutter.

[0101] In one embodiment, the PCB unit (701) may be a secondary PCB. For example, referring to FIG. 8, the PCB unit (701) may be a PCB located below a primary PCB on which electronic components (810) are placed.

[0102] In one embodiment, referring to FIG. 8, among the plurality of sides (711, 713, 715, 717) of the PCB unit (701), the side (711) adjacent to (or in contact with) the side of the electronic device (101) can be formed through an optical cutter (e.g., a laser router). In one embodiment, referring to FIG. 8, among the plurality of sides (711, 713, 715, 717) of the PCB unit (701), the side (715) adjacent to (or in contact with) a designated electronic component (830) can be formed through an optical cutter (e.g., a laser router).

[0103] In one embodiment, the first side (711) and the third side (715) may extend for a specified length (e.g., 3 millimeters) or more along the perimeter of the PCB unit (701) in a manner perpendicular to one direction (or normal). In one embodiment, the specified electronic component (830) may be a battery (e.g., 189 in FIG. 1).

[0104] In one embodiment, among the plurality of sides (711, 713, 715, 717) of the PCB unit (701), the sides (713, 717) that are separated from (or do not come into contact with) the designated electronic component (830) may be formed through a mechanical cutting machine (e.g., a milling machine, or a CNC machine). In one embodiment, among the plurality of sides (711, 713, 715, 717) of the PCB unit (701), the sides (713, 717) that are separated from (or do not come into contact with) the sides of the electronic device (101) may be formed through a mechanical cutting machine (e.g., a milling machine, or a CNC machine).

[0105] In one embodiment, the cutting tolerance of an optical cutter (e.g., laser router) (e.g., ± 0.1 millimeters) may be smaller than the cutting tolerance of a mechanical cutter (e.g., milling machine, CNC machine) (e.g., ± 0.3 millimeters). Accordingly, sides (711, 715) formed by the optical cutter (e.g., laser router) may be formed inwardly to the PCB unit (701) by a cutting tolerance difference (e.g., 0.2 millimeters) compared to sides (713, 717) formed by the mechanical cutter (e.g., milling machine, or CNC machine). As the sides (711, 715) formed by the optical cutter (e.g., laser router) are formed inwardly to the PCB unit (701) by a cutting tolerance difference (e.g., 0.2 millimeters), the size of some electronic components (e.g., battery (189)) may be increased. For example, as the side (715) is formed inwardly to the PCB unit (701) by a cutting tolerance difference (e.g., 0.2 millimeters), the size of the electronic component (830) (or battery (189)) can be increased in the direction of the PCB unit (701) by a cutting tolerance difference (e.g., 0.2 millimeters). As the size of the electronic component (830) (or battery (189)) is increased in the direction of the PCB unit (701) by a cutting tolerance difference (e.g., 0.2 millimeters), the battery capacity of the electronic component (830) (or battery (189)) can be increased.

[0106] Additionally, the electronic component (830) may be positioned adjacent to the side (715) by a cutting tolerance difference (e.g., 0.2 millimeters) than the distance between the sides (713, 717) and other electronic components. Accordingly, by the cutting tolerance difference (e.g., 0.2 millimeters), the distance between the side (715) and the designated electronic component (830) may be shorter than the distance between the sides (713, 717) and the other electronic component closest to the sides (713, 717).

[0107] FIG. 9 is a drawing illustrating PCB units in which parts of the sides are formed on a PCB array.

[0108] A plurality of PCB units (701, 902, 903, 904, 905, 906) of FIG. 9 can be arranged on a PCB array (901) such that at least one side is connected to each other through bridges (951, 952, 953) compared with a plurality of PCB units (201, 403, 405, 407) of FIG. 4b.

[0109] Referring to FIG. 9, the PCB array (901) may have the shape of a specified figure. For example, the PCB array (901) may be rectangular. For example, the PCB array (901) may have a size of about 90 millimeters in the vertical direction and about 115 millimeters in the horizontal direction.

[0110] In one embodiment, parts (911, 912, 913, 914, 915, 916) of the sides of a plurality of PCB units (701, 902, 903, 904, 905, 906) may be formed on a PCB array (901). For example, the sides of the plurality of PCB units (701, 902, 903, 904, 905, 906) may be formed on the PCB array (901) through a mechanical cutting machine (e.g., a milling machine, or a CNC machine).

[0111] In one embodiment, the sides of a plurality of PCB units (701, 902, 903, 904, 905, 906) may be separated by bridges (941, 942, 951, 952, 953, 954). In one embodiment, the bridges (941, 942) may be an area of ​​a specified length (e.g., 2 millimeters) or less connecting each of the plurality of PCB units (701, 902, 903, 904, 905, 906) and the PCB array (901) during the manufacturing process of the plurality of PCB units (701, 902, 903, 904, 905, 906). In one embodiment, the bridges (951, 952, 953, 954) may be an area of ​​a specified length (e.g., 2 millimeters) or less connecting the plurality of PCB units (701, 902, 903, 904, 905, 906) during the manufacturing process of the plurality of PCB units (701, 902, 903, 904, 905, 906).

[0112] In one embodiment, some of the sides (911, 912, 913, 914, 915, 916, 921, 926, 932, 935) of a plurality of PCB units (701, 902, 903, 904, 905, 906) may be cut through an optical cutter (e.g., a laser router) after one or more electronic components have been placed.

[0113] In one embodiment, some of the sides (911, 912, 913, 914, 915, 916, 921, 926) of the plurality of PCB units (701, 902, 903, 904, 905, 906) may be extended for a specified length (e.g., 3 millimeters) or more in a manner perpendicular to one direction (or normal) along the perimeter of the plurality of PCB units (701, 902, 903, 904, 905, 906). In one embodiment, some of the sides (911, 912, 913, 914, 915, 916, 921, 926) of the plurality of PCB units (701, 902, 903, 904, 905, 906) may be arranged parallel to the outer line of electronic components (e.g., battery (189), and / or camera module (180)) within the electronic device (101) when the plurality of PCB units (701, 902, 903, 904, 905, 906) are placed in the electronic device (101).

[0114] In one embodiment, other sides (932, 935) of the sides of the plurality of PCB units (701, 902, 903, 904, 905, 906) may be cut through an optical cutter (e.g., a laser router) after one or more electronic components are placed to strengthen the connection between the plurality of PCB units (701, 902, 903, 904, 905, 906) and the PCB array (901) during the manufacturing process.

[0115] In one embodiment, electronic components may be placed on a plurality of PCB units (701, 902, 903, 904, 905, 906) formed by a portion of the sides through a mechanical cutting machine (e.g., a milling machine, or a CNC machine).

[0116] In one embodiment, a plurality of PCB units (701, 902, 903, 904, 905, 906) on which electronic components are placed can be separated from a PCB array (901). For example, some sides (911, 912, 913, 914, 915, 916, 921, 926, 932, 935) of the sides of the PCB units (701, 902, 903, 904, 905, 906) are formed and bridges (941, 942, 951, 952, 953, 954) are removed, thereby separating a plurality of PCB units (701, 902, 903, 904, 905, 906) on which electronic components are placed from a PCB array (901). Some sides (911, 912, 913, 914, 915, 916, 921, 926, 932, 935) of a plurality of PCB units (701, 902, 903, 904, 905, 906) are formed on a PCB array (901) through an optical cutter (e.g., a laser router), and the bridges are removed through a mechanical cutter (e.g., a milling machine, or a CNC machine), thereby separating the plurality of PCB units (701, 902, 903, 904, 905, 906) from the PCB array (901). For example, some sides (911, 912, 913, 914, 915, 916, 921, 926, 932, 935) of a plurality of PCB units (701, 902, 903, 904, 905, 906) can be formed on a PCB array (901) through an optical cutter (e.g., a laser router). For example, bridges (941, 942, 951, 952, 953, 954) separating some sides of the plurality of PCB units (701, 902, 903, 904, 905, 906) can be removed through a mechanical cutter (e.g., a milling machine, or a CNC machine).

[0117] FIG. 10 is a drawing illustrating PCB units in which parts of the sides are formed on a PCB array.

[0118] In comparison to the plurality of PCB units (701, 1002, 1003, 1004, 1005, 1006) in the PCB array (1001) of FIG. 10, the length of the sides (1011, 1016) formed through an optical cutter (e.g., a laser router) may be longer than the length of the sides (911, 916, 921, 926) of FIG. 9. For example, the sides (1011, 1016) formed through an optical cutter (e.g., a laser router) may be formed through an optical cutter (e.g., a laser router) up to the portions (1061, 1065) formed through a mechanical cutter (e.g., a milling machine, or a CNC machine) in FIG. 9.

[0119] Some sides (1032, 1035) of the plurality of PCB units (701, 1002, 1003, 1004, 1005, 1006) of FIG. 10 may be formed using a mechanical cutting machine (e.g., a milling machine, or a CNC machine) instead of an optical cutting machine (e.g., a laser router) compared to the sides (932, 935) of FIG. 9.

[0120] In one embodiment, the sides of a plurality of PCB units (701, 1002, 1003, 1004, 1005, 1006) can be separated through bridges (1041, 1042, 1051, 1052, 1053, 1054).

[0121] In one embodiment, some of the sides (1011, 1012, 1013, 1014, 1015, 1016) of a plurality of PCB units (701, 1002, 1003, 1004, 1005, 1006) may be cut through an optical cutter (e.g., a laser router) after one or more electronic components have been placed.

[0122] FIG. 11 is a drawing illustrating PCB units in which parts of the sides are formed on a PCB array.

[0123] Compared to the plurality of PCB units (701, 1102, 1103, 1104, 1105, 1106) of FIG. 11, the length of the sides (1111, 1112, 1113, 1114, 1115, 1116) formed through an optical cutter (e.g., a laser router) may be longer than the length of the sides (911, 912, 913, 914, 915, 916, 921, 926, 932, 935) of FIG. 9.

[0124] Some sides of the multiple PCB units (701, 1102, 1103, 1104, 1105, 1106) of FIG. 11 that are adjacent to each other can be formed using a mechanical cutting machine (e.g., a milling machine, or a CNC machine) instead of an optical cutting machine (e.g., a laser router).

[0125] The sides of the plurality of PCB units (701, 1102, 1103, 1104, 1105, 1106) of FIG. 11 facing the PCB array (1101), excluding some sides adjacent to each other, can be formed through an optical cutter (e.g., a laser router) instead of a mechanical cutter (e.g., a milling machine, or a CNC machine).

[0126] In one embodiment, the sides of a plurality of PCB units (701, 1102, 1103, 1104, 1105, 1106) can be separated through bridges (1141, 1142, 1151, 1152, 1153, 1154).

[0127] In one embodiment, some of the sides (1111, 1112, 1113, 1114, 1115, 1116) of a plurality of PCB units (701, 1102, 1103, 1104, 1105, 1106) may be cut through an optical cutter (e.g., a laser router) after one or more electronic components have been placed.

[0128] FIG. 12a is a drawing illustrating a side view of a PCB unit. FIG. 12b is a drawing illustrating a crystalline structure formed on the side view of a PCB unit. FIG. 13 is a drawing illustrating a side view of a PCB unit. FIG. 14 is a drawing illustrating a side view of a PCB unit.

[0129] FIG. 12a may illustrate at least some of the sides (211, 215) formed by an optical cutter (e.g., a laser router) among the plurality of sides (211, 213, 215, 217) of the PCB (210) of FIG. 2a. Referring to FIG. 12a, at least some of the sides having a first cross-sectional characteristic may include a carbonized portion (1210, 1215). In one embodiment, referring to an enlarged view (1220, 1225) of the carbonized portion (1210, 1215), the carbonized portion (1210, 1215) may include a crystalline material (1231, 1232, 1233, 1234, 1241). For example, the carbonized portion (1210, 1215) can be formed within the glass fiber in the PCB (210). For example, referring to FIG. 12b, the crystalline material (1250) can be formed when the organic material within the glass fiber is heated to a high temperature by a laser or the like.

[0130] FIG. 13 may illustrate at least some of the sides (213, 217) of the PCB (210) of FIG. 2a that are formed by a mechanical cutting machine (e.g., a milling machine, a CNC machine). Referring to FIG. 13, at least some of the sides having a second cross-sectional characteristic may not include a carbonized portion. In one embodiment, at least some of the sides having a second cross-sectional characteristic may not include a crystalline material.

[0131] FIG. 14 may illustrate at least some of the sides (211, 215) formed by an optical cutter (e.g., a laser router) among the plurality of sides (211, 213, 215, 217) of the PCB (210) of FIG. 2a. Referring to FIG. 14, the PCB may include one or more layers (1401, 1403, 1405) stacked in a vertical direction. The cut surface (1400) formed by the optical cutter (e.g., a laser router) may be relatively smooth.

[0132] Referring to FIG. 14, the portion (1410) relatively adjacent to the cut surface (1400) may be carbonized (or discolored). The portion (1420) relatively far from the cut surface (1400) may not be carbonized (or discolored).

[0133] As described above, the electronic device (101) may include a housing; and a printed circuit board (PCB) (210) housed in the housing. The PCB (210) may include a first side (211) having a first cross-sectional characteristic formed by laser cutting, and a second side (213) having a second cross-sectional characteristic formed by mechanical cutting.

[0134] The first side having the first cross-sectional characteristic may include a carbonized portion.

[0135] The first side having the first cross-sectional characteristic may include a crystalline material. The second side having the second cross-sectional characteristic may not include the crystalline material.

[0136] In the first section adjacent to the first surface of the PCB among the first sides having the first cross-sectional characteristics, a damaged portion may be formed by the laser cutting.

[0137] The length of the portion damaged by the laser cutting in the direction toward the inside of the PCB from the first side may be 10 to 30 μm.

[0138] A conductive layer may be disposed on the first surface of the PCB. The length from the first surface through the portion damaged by the laser cutting to the conductive layer may be 0.05 to 0.15 mm.

[0139] In the second section adjacent to the second side opposite to the first side of the PCB having the first cross-sectional characteristics, a portion damaged by the laser cutting may not be substantially formed.

[0140] A processor may be disposed in a portion adjacent to the first side of the first surface of the PCB. An interposer may be disposed in a portion adjacent to the first side of the second surface of the PCB.

[0141] The first side having the first cross-sectional characteristic may include a smooth surface formed by the laser cutting when viewed in a direction perpendicular to the first surface of the PCB.

[0142] The second side having the second cross-sectional characteristics may include a rough surface formed by the mechanical cutting when viewed in a direction perpendicular to the first surface of the PCB.

[0143] The depth of the rough surface in the direction toward the inside of the PCB from the second side may be 0.1 to 0.3 mm.

[0144] In the first section adjacent to the first surface of the PCB among the second side having the above second cross-sectional characteristics, a damaged portion may be formed by mechanical cutting.

[0145] The length of the portion damaged by the mechanical cutting in the direction toward the inside of the PCB from the second side may be 6 to 7 μm.

[0146] In the second section adjacent to the second side opposite to the first side of the PCB having the above second cross-sectional characteristics, a portion damaged by the mechanical cutting may not be substantially formed.

[0147] A processor may be disposed in the portion of the first surface of the PCB adjacent to the second side. An interposer may be disposed in the portion of the second surface of the PCB adjacent to the second side.

[0148] The electronic device (101) may include a camera module; and a battery. At least one of the camera module or the battery may be located adjacent to the first side having the first cross-sectional characteristic.

[0149] The electronic device (101) may include another PCB; and an interposer connected between the PCB and the other PCB. At least one of the other PCB or the interposer may include a third side having a third cross-sectional characteristic formed by another laser cutting, and a fourth side having a fourth cross-sectional characteristic formed by another mechanical cutting.

[0150] The other PCB may include a third surface facing the first surface of the PCB and a fourth surface opposite to the third surface. Among the third sides having the third cross-sectional characteristics, a portion damaged by the other laser cutting may be formed on the third end adjacent to the third surface of the other PCB.

[0151] The other PCB may include a third surface facing the first surface of the PCB and a fourth surface opposite to the third surface. In the fourth section adjacent to the fourth surface of the other PCB among the third sides having the third cross-sectional characteristics, a portion damaged by the other laser cutting may be formed.

[0152] The thickness of the PCB (210) may be 0.4 mm or less.

[0153] As described above, a printed circuit board (PCB) unit (201) may include a first electronic component (221, 225) and a first PCB (210) on which the first electronic component (221, 225) is placed. When the first PCB (210) is placed in an electronic device (101), it may include a first side (211) formed by a laser that is adjacent to a second electronic component (310, 320) included in the electronic device (101), and a second side (213) formed by a milling machine that is separated from the second electronic component (310, 320).

[0154] The above printed circuit board unit may include a second PCB on which a third electronic component is placed, the sides of the second PCB being formed by the milling machine, and an interposer vertically connected between the first PCB and the second PCB (210).

[0155] The thickness of the first PCB (210) may be thinner than the thickness of the second PCB.

[0156] The printed circuit board unit may include a second PCB on which the third electronic component is placed, the sides of the second PCB formed by the laser, and an interposer (611, 613) vertically connected between the first PCB and the second PCB (210).

[0157] The printed circuit board unit may include a first side (211) that includes a planar portion (231) extending for a specified length along the perimeter of the PCB unit (201). The second side (213) includes different portions (241, 243, 245, 247, 249) extending along the perimeter of the PCB unit (201), and the portions (241, 243, 245, 247, 249) of the second side (213) may face different directions.

[0158] The first distance between the first side (211) of the first PCB (210) and the second electronic component (310, 320) may be shorter than the second distance between the second side (213) and the fourth electronic component included in the electronic device (101) and adjacent to the second side (213) of the first PCB (210).

[0159] The second electronic component (310, 320) above may be a camera module.

[0160] The second electronic component (310, 320) above may be a battery.

[0161] The first PCB (210), when placed in the electronic device (101), may include a third side (215) formed by the laser, adjacent to a fourth electronic component included in the electronic device (101). The first side (211) may be substantially perpendicular to the third side (215).

[0162] The length extending along the perimeter of the first PCB (210) on the third side (215) may be longer than the length extending along the perimeter of the first PCB (210) on the first side (211). The second electronic component adjacent to the first side (211) may be a camera module, and the fourth electronic component adjacent to the third side (215) may be a battery.

[0163] The thickness of the first PCB (210) may be 0.4 millimeters or less.

[0164] The above printed circuit board unit may include a first PCB (210) on which a camera module (180), a battery (189), and a first electronic component (221, 225) are placed. The first PCB (210) may include a first side (211) formed by a laser adjacent to the camera module (180) or the battery (189), and a second side (213) formed by a milling machine apart from the camera module (180) and the battery (189).

[0165] The above printed circuit board unit may include a second PCB on which a third electronic component is placed, the sides of the second PCB formed by the milling machine, and an interposer vertically connected between the first PCB and the second PCB (210).

[0166] The thickness of the first PCB (210) may be thinner than the thickness of the second PCB.

[0167] The printed circuit board unit may include a second PCB on which the third electronic component is placed, the sides of the second PCB formed by the laser, and an interposer vertically connected between the first PCB and the second PCB (210).

[0168] The first side (211) may include a planar portion extending for a specified length along the perimeter of the first PCB (210). The second side (213) may include different portions extending along the perimeter of the first PCB (210), and said portions of the second side (213) may face in different directions.

[0169] The first distance between the first side (211) of the first PCB (210) and the second electronic component (310, 320) may be shorter than the second distance between the second side (213) and the fourth electronic component included in the electronic device and adjacent to the second side (213) of the first PCB (210).

[0170] The first PCB (210) may include a third side (215) formed by the laser, adjacent to a fourth electronic component included in the electronic device (101). The first side (211) may be substantially perpendicular to the third side (215).

[0171] The length extending along the perimeter of the first PCB on the third side (215) may be longer than the length extending along the perimeter of the first PCB on the first side (211). The camera module may be adjacent to the first side (211), and the battery may be adjacent to the third side (215).

[0172] A method for manufacturing a printed circuit board (PCB) unit as described above may include the operation of forming at least a portion of the side of the PCB unit (201) on the PCB array (401) through a milling machine, the operation of placing at least one electronic component (221, 225) on the PCB unit (201) on the PCB array (401), and the operation of separating the PCB unit (201) from the PCB array (401) by forming at least another portion of the side of the PCB unit (201) on the PCB array (401) through a laser.

[0173] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0174] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0175] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0176] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0177] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0178] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read-only memory)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0179] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, Housing; and It includes a printed circuit board (PCB) housed in the above housing, and The above PCB is, A first side having a first cross-sectional characteristic formed by laser cutting, and including a second side having a second cross-sectional characteristic formed by mechanical cutting, Electronic device.

2. In Claim 1, The first side having the above-mentioned first cross-sectional characteristics includes a carbonized portion, Electronic device.

3. In claim 1 or claim 2, The first side having the above-mentioned first cross-sectional characteristics comprises a crystalline material, and The second side having the above second cross-sectional characteristics does not include the crystalline material, Electronic device.

4. In any one of claims 1 to 3, In the first end adjacent to the first surface of the PCB among the first sides having the first cross-sectional characteristics, a portion damaged by the laser cutting is formed. Electronic device.

5. In Claim 4, The length of the portion damaged by the laser cutting in the direction from the first side toward the inside of the PCB is 10 to 30 μm, Electronic device.

6. In Claim 4, A conductive layer is disposed on the first surface of the above PCB, and The length from the first side through the portion damaged by the laser cutting to the conductive layer is 0.05 to 0.15 mm, Electronic device.

7. In Claim 4, In the second section adjacent to the second surface opposite to the first surface of the PCB among the first sides having the first cross-sectional characteristics, the portion damaged by the laser cutting is substantially not formed, Electronic device.

8. In Claim 7, A processor is disposed in a portion adjacent to the first side of the first surface of the PCB, and An interposer is disposed on the portion adjacent to the first side among the second sides of the PCB. Electronic device.

9. In any one of claims 1 to 8, The first side having the first cross-sectional characteristic comprises a smooth surface formed by the laser cutting when viewed in a direction perpendicular to the first surface of the PCB. Electronic device.

10. In any one of claims 1 to 9, The second side having the second cross-sectional characteristic includes a rough surface formed by the mechanical cutting when viewed in a direction perpendicular to the first surface of the PCB. Electronic device.

11. In Claim 10, The depth of the uneven surface in the direction from the second side toward the inside of the PCB is 0.1 to 0.3 mm, Electronic device.

12. In any one of claims 1 to 11, In the first section adjacent to the first surface of the PCB among the second side having the above second cross-sectional characteristics, a portion damaged by mechanical cutting is formed. Electronic device.

13. In Claim 12, The length of the portion damaged by the mechanical cutting in the direction toward the inside of the PCB from the second side is 6 to 7 μm, Electronic device.

14. In Claim 12, In the second section adjacent to the second side opposite to the first side of the PCB among the second sides having the above second cross-sectional characteristics, a portion damaged by the mechanical cutting is substantially not formed, Electronic device.

15. In Claim 14, A processor is disposed in a portion adjacent to the second side among the first surfaces of the PCB, and An interposer is disposed on the portion adjacent to the second side of the second side of the PCB. Electronic device.

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