Electronic apparatus comprising sound module

Abstract

According to various embodiments, an electronic apparatus comprises: a housing including a first path connected to an outer part of the electronic apparatus; a module housing disposed in a first space of the housing and including a second path connected to the first path; a sound module disposed in the module housing; an opening formed in the module housing, and connecting the first space to at least a portion of the second path; and a plate disposed to close the opening, wherein the sound module may be connected to the outer part through a sound path including the first path and the second path.

Description

Electronic device including an acoustic module

[0001] The embodiments of the present disclosure relate to an electronic device comprising an acoustic module.

[0002] Electronic devices are becoming increasingly slimmer and are being developed to increase rigidity, enhance design aspects, and differentiate their functional elements.

[0003] Electronic components, such as acoustic modules placed within the internal space of an electronic device, must be efficiently positioned to contribute to the device's slimming down. Furthermore, even if multiple electronic components are efficiently arranged within the device, failure to perform their functions properly can lead to a degradation in the device's quality; therefore, they need to be developed to satisfy all these conditions.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] The electronic device may include at least one electronic component positioned to fully perform its function within an internal space. This at least one electronic component may include at least one of a printed circuit board, a display, various components, various sensors, or at least one acoustic module. The acoustic module may include at least one speaker (e.g., a speaker module) for transmitting sound generated from the electronic device to the outside, or at least one microphone (e.g., a microphone module) for collecting external sound.

[0006] Such an acoustic module may include at least one magnet supported by a yoke, and a diaphragm comprising a coil member disposed near the magnet and inducing sound generation through vibration. The above-described components of the acoustic module may be disposed at least partially within a separate module housing, and the module housing may be disposed such that it is connected at least partially to the outside of the electronic device within the internal space of the electronic device.

[0007] The electronic device may include a sealed resonance space for a speaker provided through the combination of at least a portion of the module housing and a portion of the housing. A portion of the module housing may include an acoustic path for transmitting sound generated from the speaker to a hole (e.g., an acoustic emission hole) formed in the housing. If the speaker is replaced or added to a sensor module that detects the external environment, such an acoustic path may be replaced or used in parallel as a detection path for detecting the external environment.

[0008] However, as electronic devices become slimmer, the spatial volume of the acoustic path inevitably decreases. This leads to acoustic bottlenecks, which can increase speaker distortion and cause acoustic defects such as sound wavering. Furthermore, if the spatial volume of the detection path is also reduced, it can lead to false detection of the external environment. To address this, increasing the spatial volume of the acoustic and / or detection paths may run counter to the trend of miniaturizing electronic devices.

[0009] Various embodiments of the present disclosure may provide an electronic device comprising an acoustic module having a placement structure that can help improve sound quality.

[0010] According to various embodiments, an electronic device including an acoustic module having a placement structure that can help slim down the electronic device can be provided.

[0011] According to various embodiments, an electronic device including a sensor module having a structure for improving the detection performance of an external environment can be provided.

[0012] However, the problems intended to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0013] According to various embodiments, the electronic device comprises a housing including a first path connected to the outside of the electronic device, a module housing disposed in a first space of the housing and including a second path connected to the first path, an acoustic module disposed in the module housing, an opening formed in the module housing and connecting at least a portion of the second path to the first space, and a plate disposed to close the opening, wherein the acoustic module may be connected to the outside through an acoustic path including the first path and the second path.

[0014] According to various embodiments, the electronic device comprises a housing including a first path connected to the outside of the electronic device, a module housing disposed in a first space of the housing and including a second path connected to the first path, a sensor module supported by at least a portion of the module housing, an opening formed in the module housing and connecting at least a portion of the second path to the first space, and a plate disposed to close the opening, wherein the sensor module may be configured to detect the external environment of the electronic device through the first path and the second path.

[0015] An electronic device according to exemplary embodiments of the present disclosure may have an expanded spatial volume through a separate plate formed in a part of a module housing in which an acoustic module or a sensor module is disposed and configured to close an opening connected to the internal space of the electronic device, thereby improving the acoustic quality of the acoustic module or improving the detection performance of the sensor module and helping to slim down the electronic device.

[0016] In addition, various effects that can be identified directly or indirectly through this document may be provided.

[0017] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0018] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0019] FIG. 1a is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0020] FIG. 1b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0021] FIG. 2a is a perspective view illustrating an acoustic module assembly according to various embodiments of the present disclosure.

[0022] FIG. 2b is an enlarged view of the area 2b of FIG. 1a according to various embodiments of the present disclosure.

[0023] FIG. 3 is an unfolded perspective view for a plate to be coupled to a module housing according to various embodiments of the present disclosure.

[0024] FIG. 4 is a partial cross-sectional view of an electronic device shown along line 4-4 of FIG. 1a according to various embodiments of the present disclosure.

[0025] FIGS. 5a to 5d are some enlarged views illustrating the fixing structure of a plate and a module housing according to various embodiments of the present disclosure.

[0026] FIG. 6 is a graph comparing the performance of an acoustic module with and without the application of a plate according to various embodiments of the present disclosure.

[0027] FIGS. 7a to 7c are partial cross-sectional views of electronic devices according to various embodiments of the present disclosure.

[0028] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0029] FIG. 1a is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 1b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0030] Referring to FIGS. 1a and 1b, the electronic device (200) may include a front cover (202) (e.g., front plate, front case, first case, first frame, or first case frame) forming the front (200a) of the electronic device (200), and a rear cover (211) (e.g., rear plate, rear case, second case, second frame, or second case frame) forming the rear (200b) of the electronic device, which is at least partially oriented opposite to the front cover (202). In one embodiment, at least a portion of the rear cover (211) may extend to a side (200c) of the electronic device (200). In one embodiment, the electronic device (200) may include a side member (218) extending from the rear cover (211) and forming a side (200c) of the electronic device (200). In one embodiment, the side (200c) may include a first side (2181) formed with a first length, a second side (2182) extending perpendicularly from the first side (2181) and having a second length shorter than the first length, a third side (2183) extending parallel to the first side (2181) from the second side (2182) and having a first length, and a fourth side (2184) extending from the third side (2183) to the first side (2181) and having a second length. In one embodiment, the electronic device (200) may include a housing (210) (e.g., housing structure) formed to form the exterior of the electronic device (200) through a front cover (202) and a rear cover (211).

[0031] According to various embodiments, the front cover (202) may be formed by a glass plate or a polymer plate comprising various coating layers. In one embodiment, the rear cover (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. In one embodiment, the side member (218) extends from the rear cover (211) and may be formed as a side bezel structure comprising metal and / or polymer. In one embodiment, the side member (218) is formed separately from the rear cover and may be formed of the same material as the rear cover (e.g., a metallic material such as aluminum or magnesium) or a different material.

[0032] According to various embodiments, the electronic device (200) may include at least one of a display (201), at least one input device (203), an acoustic output device (e.g., the acoustic module assembly (300) of FIG. 4), a sensor module (204), a camera module (205, 212), a key input device (217), or a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components described above or additionally include other components. In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front cover (202). In one embodiment, the display (201) may be visually exposed through substantially the entire area of ​​the front cover (202). In one embodiment, a recess or opening may be formed in part of the screen display area of ​​the display (201), and at least one of the components described above may be positioned in the internal space of the electronic device (200) so as to be aligned with the recess or opening. In one embodiment, at least one of a sensor module (204) and a camera module (205) may be disposed on the back of a screen display area (e.g., active area) of a display (201) in an internal space of an electronic device (200) (e.g., the first space (2101) of FIG. 4). In one embodiment, the display (201) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or an electromagnetic induction panel (e.g., a digitizer) that detects a magnetic field-type electronic pen (230).

[0033] According to various embodiments, the input device (203) may include at least one microphone module (e.g., a microphone). In some embodiments, the input device (203) may include a plurality of microphone modules positioned at different locations to detect the direction of sound. In one embodiment, the acoustic output device (e.g., the acoustic module assembly (300) of FIG. 4) may include a speaker module. In one embodiment, the speaker module may include an external speaker and / or a receiver for calls. In one embodiment, the acoustic output device (e.g., the acoustic module assembly (300) of FIG. 4) may be symmetrically positioned at one location each on the second side (2182) and the fourth side (2184) of the electronic device (200). In some embodiments, the acoustic output device (e.g., the acoustic module assembly (300) of FIG. 4) may be symmetrically positioned at two locations each on the second side (2182) and the fourth side (2184) of the electronic device (200).

[0034] According to various embodiments, at least one sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The at least one sensor module (204) may further include, for example, at least one of a microphone, a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, an odor sensor, or an illuminance sensor.

[0035] According to various embodiments, the camera module (205, 212) may include a front camera module (205) positioned to be exposed to the outside through a front cover (202) of the electronic device (200) and a rear camera module (212) positioned to be exposed to the outside through a rear cover (211). In one embodiment, the camera module (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, at least two rear camera modules (212) may be positioned adjacently as a single camera module assembly. For example, the rear camera module assembly may perform dual camera functions for normal shooting, wide-angle shooting, or ultra-wide-angle shooting.

[0036] According to various embodiments, the electronic device (200) may include at least one conductive part (231, 232, 233, 234, 235, 236) that is electromagnetically segmented through at least one non-conductive part (241, 242) and used as an antenna of the electronic device (200). In one embodiment, the at least one conductive part (231, 232, 233, 234, 235, 236) may include first, second, and third conductive parts (231, 232, 233) that are electromagnetically segmented with respect to each other through the first non-conductive part (241), and fourth, fifth, and sixth conductive parts (234, 235, 236) that are electromagnetically segmented with respect to each other through the second non-conductive part (242). In one embodiment, the first, second, and third conductive portions (231, 232, 233) may be arranged to be exposed to the outside through the first, second, and third sides (2181, 2182, 2183) and at least a portion of the rear cover (211). In one embodiment, the fourth, fifth, and sixth conductive portions (234, 235, 236) may be arranged to be exposed to the outside through the first, third, and fourth sides (2181, 2183, 2184) and at least a portion of the rear cover (211). In one embodiment, at least one conductive portion (231, 232, 233, 234, 235, 236) may be formed through a conductive member (e.g., conductive member (211a) of FIG. 4) (e.g., metal) formed by the rear cover (211) and / or side member (2180) of the electronic device (200). In one embodiment, at least one non-conductive portion (241, 242) may be formed through a non-conductive member (e.g., non-conductive member (211b) of FIG. 4) (e.g., polymer) that is combined with or injected with the conductive member (211a).

[0037] According to various embodiments, the electronic device (200) may include an electronic pen (250) (e.g., a stylus pen) that is detachably disposed in a pen mounting area provided in at least a portion of the rear cover (211). In one embodiment, the electronic pen (250) may be configured to receive power wirelessly through a charging unit provided in an area corresponding to the pen mounting area. In one embodiment, the electronic pen (250) may be disposed to be detachably disposed in the pen mounting area using the magnetic force of a magnet.

[0038] According to various embodiments, the electronic device (200) may include an acoustic module assembly (300) that is disposed in an internal space (e.g., the first space (2101) of FIG. 4) and connected to the outside through a hole (2182a) (e.g., an acoustic emission hole or an acoustic reception hole) formed in at least a part of the second side (2182) and the fourth side (2184). In one embodiment, the acoustic module assembly (300) may include a module housing (e.g., the module housing (310) of FIG. 4) that is connected to a space (e.g., the second space (312) of FIG. 4) and a space (312) spatially separated from the internal space (2101) by being coupled with a part of the housing (210) (e.g., the rear cover (211)) in the internal space (2101) of the electronic device (200), and includes an acoustic path (e.g., the second path (311) of FIG. 4) connected to the hole (2182a). For example, as the electronic device (200) becomes slimmer, the placement space of the module housing (310) becomes narrower, and there is a limit to the expansion of the spatial volume of the acoustic path (311), which may cause a decrease in the performance of the acoustic module, such as sound vibration or distortion of the sound passing through the acoustic path.

[0039] An electronic device (200) according to an exemplary embodiment of the present disclosure includes an opening (e.g., opening (313) of FIG. 4) formed in the module housing (310) to connect the module housing (310) and the internal space (2101) of the electronic device (200) in an area corresponding to at least a part of the acoustic path (311), and the opening (313) can be closed by a thin plate (e.g., plate (315) of FIG. 4) to help expand the spatial volume of the acoustic path (311). For example, the thin plate (315) can be formed of metal (e.g., SUS) and applied thinner than the thickness of the module housing (310), which is an injection molded material, to help expand the spatial volume of the acoustic path (311) without increasing the volume of the electronic device (200).

[0040] FIG. 2a is a perspective view illustrating an acoustic module assembly according to various embodiments of the present disclosure. FIG. 2b is an enlarged view of area 2b of FIG. 1a according to various embodiments of the present disclosure.

[0041] FIG. 2b is a drawing of the electronic device shown from above with the front cover and display removed.

[0042] Referring to FIG. 2a, the acoustic module assembly (300) may include a module housing (310) formed from an injection molded material and disposed in the internal space (e.g., the first space (2101) of FIG. 4) of the electronic device (200). In one embodiment, the acoustic module assembly (300) may include an acoustic module (320) (e.g., a speaker or microphone) (e.g., a sensor module) disposed to be supported by at least a portion of the module housing (310). In one embodiment, the acoustic module assembly (300) may include a plate (315) disposed to close an opening (e.g., the opening (313) of FIG. 4) formed in at least a portion of the module housing (310). In one embodiment, the plate (315) may be formed from a thin metal material. In one embodiment, the plate (315) may be formed from stainless steel or aluminum. In one embodiment, the plate (315) may be positioned to close an opening (313) formed in an acoustic path (e.g., a second path (311) in FIG. 4) connected to a hole (e.g., a hole (2182a) in FIG. 1a) (e.g., at least one hole) that is in contact with the external environment when the module housing (310) is placed in the internal space (2101) of the electronic device (200).

[0043] According to various embodiments, the acoustic module assembly (300) may include a blocking member (331) disposed between the side member (218) and the module housing (310). In one embodiment, the blocking member (331) may include a filter member for blocking foreign substances entering from the hole (2182a). In some embodiments, the blocking member (331) may include a breathable waterproof member for blocking moisture entering from the hole. In one embodiment, the blocking member (331) may include at least one of a mesh, a non-woven fabric, or a membrane. In one embodiment, the blocking member (331) may be disposed to be supported by a bracket (330) disposed between the hole (2182a) formed in the side member (218) and the acoustic path (311) of the module housing (310). In some embodiments, the blocking member (331) may be disposed directly between the hole (2182a) of the side member (218) and the module housing (310).

[0044] FIG. 3 is an unfolded perspective view for a plate to be coupled to a module housing according to various embodiments of the present disclosure.

[0045] Referring to FIG. 3, the plate (315) can be fixed to the outer surface to close the opening (313) formed in the module housing (310) through at least one adhesive member (T1, T2). In one embodiment, the plate (315) can be fixed by bonding or taping through at least one adhesive member (T1, T2). In one embodiment, the at least one adhesive member (T1, T2) can be applied in such a way that a liquid bonding agent is applied and then cured by natural curing, heat curing, or photocuring. In one embodiment, the at least one adhesive member (T1, T2) may include a double-sided tape member.

[0046] According to various embodiments, the plate (315) may include a plate portion (3154) and a flange (3156) extending along the edge of the plate portion (3154). In one embodiment, the plate (315) may be positioned such that at least a portion of the flange (3156) is attached to the module housing (310) through at least one adhesive member (T1, T2). In one embodiment, the plate (315) may include at least one recess (e.g., the recess (3155) of FIG. 4) formed in at least a portion of the plate portion (3154).

[0047] According to various embodiments, at least one adhesive member (T1, T2) may include a first adhesive member (T1) disposed between the module housing (310) and the flange (3156), and a second adhesive member (T2) attached together to the flange (3156) and the module housing (310) while the plate (315) is fixed to the module housing through the first adhesive member (T1). In some embodiments, the first adhesive member (T1) or the second adhesive member (T2) may be omitted.

[0048] FIG. 4 is a partial cross-sectional view of an electronic device shown along line 4-4 of FIG. 1a according to various embodiments of the present disclosure.

[0049] Referring to FIG. 4, the electronic device (200) may include a front cover (202), a rear cover (211) coupled to the front cover (202), and an acoustic module assembly (300) disposed in a first space (2101) between the front cover (202) and the rear cover (211). In one embodiment, the rear cover (211) may include a side member (218) extending from the rear (210b) of the electronic device (200) to a side (210c) (e.g., a second side (2182)). In one embodiment, the side member (218) may include a conductive member (211a) and a non-conductive member (211b) coupled to the conductive member (211a). In one embodiment, the conductive member (211a) and the non-conductive member (211b) may be joined by injection molding or structurally joined. In one embodiment, the conductive member (211a) may be positioned to be exposed to the outer surface of the electronic device (200) (e.g., side (210c) and / or rear (210b)). In one embodiment, at least a portion of the non-conductive member (211b) may be positioned in the first space (2101) and may be positioned so as not to be seen from the outside at least partially. In one embodiment, the electronic device (200) may include a display (201) positioned in the first space (2101) so as to be seen from the outside through at least a portion of the front cover (202).

[0050] According to various embodiments, the electronic device (200) may include a first path (2185) formed to be connected to the outside through at least a portion of a side member (218). In one embodiment, the first path (2185) may be connected to at least one hole (2182a) formed in a second side (2182) of the electronic device (200). In one embodiment, the first path (2185) may be formed through a conductive member (211a) and a non-conductive member (211b).

[0051] According to various embodiments, the acoustic module assembly (300) may include a module housing (310) positioned near a first path (2185) in a first space (2101) and an acoustic module (320) positioned to be supported by the module housing (310). In one embodiment, the acoustic module (320) may include a speaker or a microphone. In one embodiment, the module housing (310) may be formed at least partially by injection molding. In one embodiment, the electronic device (200) may include a second space (312) (e.g., a resonance space) for the acoustic module (320) provided by the module housing (310) of the acoustic module assembly (300) being coupled with a rear cover (211). The second space (312) may be sealed through a sealing member (e.g., rubber or silicone) positioned between the module housing (310) and the rear cover (211). In one embodiment, an assembly structure (e.g., a semi-module assembly structure) comprising a second space (312) formed by opening a portion of the module housing (310) and sealing the open portion through a rear cover (211) can reduce the placement space of the acoustic module assembly (300) and at the same time induce expansion of the second space (312), thereby helping to slim down the electronic device (200) and improve the performance of the acoustic module (320). In one embodiment, the acoustic module (320) may be positioned to be supported by a support plate (321) fixed to at least a portion of the module housing (310). In one embodiment, the support plate (321) may be formed of a metal material (e.g., SUS) and fixed to the module housing (310) to close at least a partially open portion. For example, since the thickness of the support plate (321) formed from a metal material is relatively thinner than the thickness of the module housing (310) formed from an injection molding material, it can help expand the spatial volume of the second space (312) without expanding the placement space of the module housing (310).

[0052] According to various embodiments, the module housing (310) may include a second path (311) connected to a second space (312). In one embodiment, when the module housing (310) is placed in the first space (2101), the second path (311) may be configured to be connected to the first path (2185). In one embodiment, the second path (311) may be formed through the shape of the module housing (310). In one embodiment, the acoustic module assembly (300) may include a blocking member (331) positioned to selectively block the connection between the first path (2185) and the second path (311). In one embodiment, the blocking member (331) may be positioned to be supported by a bracket (330) placed between the module housing (310) and the side member (218). In one embodiment, the blocking member (331) may include at least one of a mesh, nonwoven fabric, or membrane for selectively blocking external foreign substances and / or moisture.

[0053] According to various embodiments, the acoustic module assembly (300) may include an opening (313) connected to a first space (2101) in an area at least partially corresponding to a second path (311) of the module housing (310). In one embodiment, the opening (313) may be closed through a plate (315) made of thin sheet metal. In one embodiment, the second path (311) is positioned so as to be attached from the outer surface of the module housing (310), and through the plate (315) positioned so as to close the opening (313), the relative spatial volume may be expanded compared to the case where the plate (315) is not positioned, even for a module housing of the same size. This may be attributed to a positioning structure in which the thickness of the plate (315) can be positioned relatively thinner than the thickness of the wall of the module housing (310) formed by injection molding. For example, the height (h) (e.g., diameter) of the second path (311) can be expanded through a plate (315) positioned to close the opening (313) at a position corresponding to the second path (311), which induces an expansion of the spatial volume of the second path (311), thereby helping to improve the acoustic quality passing through it. In one embodiment, the plate (315) may be formed of a metal material.

[0054] According to various embodiments, the plate (315) may include a first surface (3151) facing the second path (311) and a second surface (3152) facing in the opposite direction to the first surface (3151). In one embodiment, the plate (315) may include a plate portion (3154) facing the second path (311) and a flange (3156) extending along the edge of the plate portion (3154). In one embodiment, at least a portion of the flange (3156) may include a fixing portion for the plate (315) to be fixed to the outer surface (310a) of the module housing (310).

[0055] According to various embodiments, the module housing (310) may include a stepped surface (3141) formed lower than the outer surface (310a) of the module housing (310) along the edge of the opening (313). In one embodiment, the plate (315) may be positioned such that at least a portion of the flange (3156) rests on the stepped surface (3141). In one embodiment, the flange (3156) and the outer surface (310a) of the module housing (310) may be positioned side by side to form the same plane. In this case, the edge (3153) of the flange (3156) may be positioned to be in close contact without gap with the side wall (3142) connecting the stepped surface (3141) and the outer surface (310a) of the module housing (310). In some embodiments, the flange (3156) may be positioned to be lower or higher than the outer surface (310a) of the module housing (310). In one embodiment, the plate (315) may include at least one recess (3155) formed lower than the first surface (3151) in the plate portion (3154). In one embodiment, the at least one recess (3155) may be formed lower in a direction opposite to the direction toward the second path (311) (e.g., z-axis direction or display direction) to help extend the height (h) of the second path (311).

[0056] According to various embodiments, the plate (315) may be positioned to be attached to the module housing (310) via at least one adhesive member (T1, T2). In one embodiment, the at least one adhesive member (T1, T2) may include a first adhesive member (T1) positioned between the stepped surface (3141) of the module housing (310) and the flange (3156), and a second adhesive member (T2) positioned to connect the flange (3156) and the outer surface (310a) of the module housing (310). In one embodiment, the first adhesive member (T1) may include a double-sided tape member. In one embodiment, the second adhesive member (T2) may include a single-sided tape member. In some embodiments, the first adhesive member (T1) or the second adhesive member (T2) may be replaced with a liquid bonding agent positioned to cure after application.

[0057] FIGS. 5a to 5d are some enlarged views illustrating the fixing structure of a plate and a module housing according to various embodiments of the present disclosure.

[0058] In describing the combined structure of the plate (315) and the module housing (310) of FIGS. 5a to 5d, the same reference numerals have been used for components that are substantially identical to the combined structure of the plate (315) and the module housing (310) of FIG. 4, and a detailed description thereof may be omitted.

[0059] Referring to FIG. 5a, the plate (315) can be fixed to the module housing (310) through an adhesive member (T), such as a conductive bonding that hardens after application, for example. In one embodiment, the plate (315) can be positioned such that at least a portion of the flange (3156) rests on a stepped surface (3141) formed lower than the outer surface (310a) of the module housing (310). In this case, the plate (315) can be spaced so that the edge (3153) has a specific gap (g) from the side wall (3142) of the module housing (310). In one embodiment, the gap (g) between the edge (3153) of the plate (315) and the side wall (3142) of the module housing (310) can be utilized as a path through which a liquid adhesive member (T) can be introduced, and through the expansion of the adhesive area, it can help to firmly fix the plate (315) to the module housing (310).

[0060] Referring to FIG. 5b, the plate (315) may be fixed to the module housing (310) through an adhesive member (T), such as a conductive bonding that hardens after application, for example. In one embodiment, the module housing (310) may include a stepped surface (3141) formed lower than the outer surface (310a) and an inclined surface (3142') (e.g., inclined side wall) formed inclined from the stepped surface (3141) to the outer surface (310a). In one embodiment, the inclined surface (3142') may be formed in a manner connecting the stepped surface (3141) to the outer surface (310a) in a direction away from the edge (3153) of the mounted plate (315) (e.g., a direction away from the opening (313). In one embodiment, the plate (315) may be positioned such that at least a portion of the flange (3156) rests on a stepped surface (3141) formed lower than the outer surface (310a) of the module housing (310). In this case, the plate (315) may be spaced apart such that the edge (3153) has a specific gap (g) from the inclined surface (3142') of the module housing (310). In one embodiment, the gap (g) between the edge (3153) of the plate (315) and the inclined surface (3142') of the module housing (310) and the inclined surface (3142') may be utilized as a path through which a liquid adhesive member (T) can be introduced. For example, through the inclined surface (3142'), the gap (g) formed between the edge (3153) of the plate (315) and the inclined surface (3142') can facilitate the easy introduction of the adhesive member (T). Additionally, through the gap (g) between the edge (3153) of the plate (315) and the inclined surface (3142'), the adhesive area is expanded, which can help the plate (315) to be firmly fixed to the module housing (310).

[0061] Referring to FIG. 5c, in the configuration of FIG. 5b, the edge (3153) of the plate (315) may be positioned adjacent to the part where the inclined surface (3142') begins. In this case, the size of the opening (313) may be relatively expanded, and the plate (315) applied thereto may help expand the spatial volume of the second path (311).

[0062] Referring to FIG. 5d, in the configuration of FIG. 5b, a first adhesive member (T1) may be further included between the flange (3156) and the stepped surface (3141) of the module housing (310). In this case, the adhesion between the plate (315) and the module housing (310) is strengthened, thereby helping to reinforce the rigidity of the acoustic module assembly (300).

[0063] According to various embodiments of the present disclosure, sound generated from an acoustic module (320) (e.g., a speaker) may be emitted to the outside of an electronic device (200) through an acoustic path comprising a second space (312), a second path (311), a first path (2185), and a hole (2182a). In some embodiments, sound generated from the outside may be collected by an acoustic module (320) (e.g., a microphone) through an acoustic path comprising a hole (2182a), a first path (2185), a second path (311), and a second space (312).

[0064] FIG. 6 is a graph comparing the performance of an acoustic module with and without the application of a plate according to various embodiments of the present disclosure.

[0065] Referring to FIG. 6, compared to the comparative example where the plate (315) is not placed and the sound generated from the acoustic module (320) is transmitted through an acoustic path including a second space (312), a second path (311), a first path (2185), and a hole (2182a) (e.g., graph 601), when the plate (315) is placed and the sound is transmitted through an acoustic path where the spatial volume of the second path (311) is relatively expanded (e.g., graph 602), it can be seen that the acoustic performance is improved by the acoustic module (320) having a relatively high decibel in the audible frequency band (e.g., area 603).

[0066] FIGS. 7a to 7c are partial cross-sectional views of electronic devices according to various embodiments of the present disclosure.

[0067] In describing the electronic device (200) of FIGS. 7a to 7c, the same reference numerals have been assigned to components that are substantially identical to those of the electronic device (200) of FIG. 4, and a detailed description thereof may be omitted.

[0068] Referring to FIG. 7a, the electronic device (200) may include a front cover (202), a rear cover (211) coupled to the front cover (202), and an acoustic module assembly (300) disposed in a first space (2101) between the front cover (202) and the rear cover (211). In one embodiment, the electronic device (200) may include a module housing (310) disposed in the first space (2101) and comprising an acoustic module (320). In one embodiment, the electronic device (200) may include an acoustic path comprising a first path (2185) formed in a side member (218), a second path (311) formed in the module housing (310) and spatially connected to the first path (2185), and a second space (312) formed through the module housing (310) and the rear cover (211) and spatially connected to the second path (311).

[0069] According to various embodiments, the module housing (310) may include an opening (313) formed in an area that corresponds at least partially to the second path (311) and connected to the first space (2101). In one embodiment, the opening (313) may be shielded by a plate (316) made of a metal material. In one embodiment, the plate (316) may be formed in an L shape so as not to interfere with the placement of surrounding electrical components (e.g., display (201)) and correspond to the shape of the opening (313). However, it is not limited thereto, and the plate (316) may be formed in various shapes corresponding to the shape of the opening (313). For example, the plate (316) may include an inverted L shape or a curved shape (e.g., a C shape). In one embodiment, the plate (316) can be fixed to the module housing (310) through any one of the coupling structures of the module housing (310) and the plate (315) of FIGS. 4 to 5d described above.

[0070] Referring to FIG. 7b, the opening (313) of the module housing (310) may be shielded by a flat plate (317). In this case, the plate (317) may be positioned in a manner that aligns with (e.g. forms the same plane as) the outer surface (310a) of the module housing (310). In some embodiments, the plate (317) may be positioned so as to be lower than or protrude above the outer surface (310a) of the module housing (310).

[0071] Referring to FIG. 7c, the opening (313) of the module housing (310) can be shielded by a plate (315). In this case, at least a portion of the plate (315) may be positioned lower than the outer surface (310a) of the module housing (310). For example, the flange (3156) and the plate portion (3154) of the plate (315) may be positioned lower than a virtual line (EL) extending parallel to the outer surface (310a) of the module housing (310). This arrangement structure can help in the efficient design of electrical components placed around the outside of the module housing (310). In some embodiments, the plate portion (3154) may be positioned such that only the flange (3156) is positioned lower than the outer surface (310a) of the module housing (310), and the plate portion (3154) is positioned to be aligned with the outer surface of the module housing (310).

[0072] According to an exemplary embodiment of the present disclosure, the acoustic module (320) may be replaced with a sensor module for detecting the external environment of the electronic device (200). In this case, a path including a second space (312), a second path (311), a first path (2185), and a hole (2182a) may be used as an external environment detection path. For example, through the arrangement of the plate (315), the second path (311) having an expanded spatial volume may help improve detection performance for detecting the external environment. In one embodiment, the sensor module may include at least one of a microphone, a barometric pressure sensor, a biosensor, a temperature sensor, a humidity sensor, or an odor sensor.

[0073] According to various embodiments, the electronic device comprises: a housing (e.g., housing (210) of FIG. 4) having a first path (e.g., first path (2185) of FIG. 4) connected to the outside of the electronic device (e.g., electronic device (200) of FIG. 4); a module housing (e.g., module housing (310) of FIG. 4) disposed in a first space (e.g., first space (2101) of FIG. 4) and having a second path (e.g., second path (311) of FIG. 4) connected to the first path (2185); an acoustic module (e.g., acoustic module (320) of FIG. 4) disposed in the module housing (310); an opening (e.g., opening (313) of FIG. 4) formed in the module housing (310) and connecting at least a portion of the second path (311) and the first space (2101); and a mechanism to close the opening (313). The acoustic module (320) includes a plate (e.g., plate (315) of FIG. 4) and can be connected to the outside through an acoustic path including the first path (2185) and the second path (311).

[0074] According to various embodiments, the plate (315) may be attached to the outer surface of the module housing (310) (e.g., the outer surface (310a) of FIG. 4) through an adhesive member (e.g., the first adhesive member (T1) and / or the second adhesive member (T2) of FIG. 4).

[0075] According to various embodiments, the plate (315) includes a first surface facing the opening (313) (e.g., the first surface (3151) of FIG. 4) and a second surface facing in the opposite direction to the first surface (3151) (e.g., the second surface (3152) of FIG. 4), and the adhesive member (T1, T2) may be applied to connect the first surface (3151) and the outer surface (310a) and / or the second surface (3152) and the outer surface (310a).

[0076] According to various embodiments, the module housing (310) includes a stepped surface (e.g., the stepped surface (3141) of FIG. 4) formed lower than the outer surface (310a) along the edge of the opening (313), and the plate (315) can be positioned so as to be seated on the stepped surface (3141).

[0077] According to various embodiments, the module housing (310) includes a side wall (e.g., side wall (3142) of FIG. 4) connecting the stepped surface (3141) and the outer surface (310a), and the plate (315) is spaced apart so that the edge of the plate (315) (e.g., edge (3153) of FIG. 5a) has a specific gap (e.g., gap (g) of FIG. 5a) with the side wall (3142), and at least a portion of the adhesive member (e.g., adhesive member (T) of FIG. 5a) can be received in the gap (g).

[0078] According to various embodiments, the side wall (e.g., the inclined surface (3142') in FIG. 5b) may be formed to be inclined away from the edge (3153).

[0079] According to various embodiments, the module housing (310) includes a side wall (e.g., the inclined surface (3142') of FIG. 5b) that connects the stepped surface (3141) and the outer surface (310a) and is inclined away from the edge (3153) of the plate (315), and at least a portion of the adhesive member (T) can be received between the edge (3153) and the side wall (3142').

[0080] According to various embodiments, the plate (315) may include a plate portion (e.g., plate portion (3154) of FIG. 4) and a flange (e.g., flange (3156) of FIG. 4) disposed along the edge of the plate portion (3154), and may include at least one recess (e.g., recess (3155) of FIG. 4) formed lower than the first surface (3151) in the plate portion (3154).

[0081] According to various embodiments, the plate (315) may be formed of metal.

[0082] According to various embodiments, a sealed second space (e.g., the second space (312) of FIG. 4) provided through the module housing (310) and a part of the housing (210) may be included, and the second space (312) may be configured to be connected to the second path (311).

[0083] According to various embodiments, a blocking member (e.g., blocking member (331) of FIG. 4) is disposed between the first path (2185) and the second path (311), and the blocking member (331) may be formed of a material for blocking foreign substances introduced from the first path (2185).

[0084] According to various embodiments, the housing (210) may include a front cover (e.g., front cover (202) of FIG. 4) and a rear cover (e.g., rear cover (211) of FIG. 4) which is coupled to the front cover (202) and forms a side (e.g., side (210c) of FIG. 4) and a rear (e.g., rear (210b) of FIG. 4) of the electronic device (200).

[0085] According to various embodiments, the module housing (310) may be placed in the first space (2101) between the front cover (202) and the rear cover (211).

[0086] According to various embodiments, the side (210c) may include at least one hole (e.g., hole (2182a) of FIG. 4) connected to the first path (2185).

[0087] According to various embodiments, the first space (2101) may include a display (e.g., the display (201) of FIG. 4) positioned so as to be visible from the outside through the front cover (202).

[0088] According to various embodiments, the acoustic module (320) may include a speaker or a microphone.

[0089] According to various embodiments, the electronic device comprises a housing (210) having a first path (2185) connected to the outside of the electronic device (200), a module housing (310) disposed in a first space (2101) of the housing (210) and having a second path (311) connected to the first path (2185), a sensor module (320) supported by at least a portion of the module housing (310) (e.g., sensor module (204) of FIG. 1a), an opening (313) formed in the module housing (310) and connecting at least a portion of the second path (311) to the first space (2101), and a plate (315) disposed to close the opening (313), and the sensor module (320) may be configured to detect the external environment of the electronic device (200) through the first path (2185) and the second path (311).

[0090] According to various embodiments, the plate (315) includes a first surface (3151) facing the opening (313) and a second surface (3152) facing in the opposite direction to the first surface (3151), and may be applied to connect the first surface (3151) and the outer surface (310a) of the module housing (310) and / or the second surface (3152) and the outer surface (310a).

[0091] According to various embodiments, the module housing (310) includes a stepped surface (3141) formed lower than the outer surface (310a) along the opening (313), and the plate (315) can be positioned so as to be seated on the stepped surface (3141).

[0092] According to various embodiments, the module housing (310) includes a side wall (3142') inclined away from the edge (3153) of the plate (315) and connecting the stepped surface (3141) and the outer surface (310a), and the plate (315) can be attached to the module housing (310) through an adhesive member (T) that is at least partially received between the edge (3153) and the side wall (3142').

[0093] Furthermore, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device, A housing (210) including a first path (2185) connected to the outside of the electronic device (200); A module housing (310) disposed in a first space (2101) of the housing (210) and including a second path (311) connected to the first path (2185); An acoustic module (320) placed in the above module housing (310); An opening (313) formed in the module housing (310) and connecting at least a portion of the second path (311) and the first space (2101); and It includes a plate (315) positioned to close the opening (313), and The above acoustic module (320) is an electronic device connected to the outside through an acoustic path including the first path (2185) and the second path (311).

2. In Paragraph 1, The above plate (315) is an electronic device attached to the outer surface (310a) of the module housing (310) via adhesive members (T1, T2).

3. In Paragraph 2, The above plate (315) includes a first surface (3151) facing the opening (313) and a second surface (3152) facing in the opposite direction to the first surface (3151). The above adhesive members (T1, T2) are an electronic device applied to connect the first surface (3151) and the outer surface (310a) and / or the second surface (3152) and the outer surface (310a).

4. In Paragraph 2, The above module housing (310) includes a stepped surface (3141) formed lower than the outer surface (310a) along the edge of the opening (313), and The above plate (315) is an electronic device positioned in such a manner that it rests on the stepped surface (3141).

5. In Paragraph 4, The above module housing (310) includes a side wall (3142) connecting the stepped surface (3141) and the outer surface (310a), and The plate (315) is spaced apart such that the edge (3153) of the plate (315) has a specific gap (g) with the side wall (3142), and An electronic device in which at least a portion of the adhesive member (T) is accommodated in the gap (g).

6. In Paragraph 5, The above side wall (3142') is an electronic device formed to be inclined away from the edge (3153).

7. In Paragraph 2, The module housing (310) includes a side wall (3142') that connects the stepped surface (3141) and the outer surface (310a) and is inclined in a direction away from the edge (3153) of the plate (315). An electronic device in which at least a portion of the adhesive member (T) is received between the edge (3153) and the side wall (3142').

8. In Paragraph 1, The above plate (315) includes a plate portion (3154) and a flange (3156) arranged along the edge of the plate portion (3154), and An electronic device comprising at least one recess (3155) formed lower than the first surface (3151) in the plate portion (3154).

9. In Paragraph 1, The above plate (315) is an electronic device formed of metal.

10. In Paragraph 1, It includes a sealed second space (312) provided through the module housing (310) and a part of the housing (210), and The second space (312) is an electronic device configured to be connected to the second path (311).

11. In Paragraph 1, It includes a blocking member (331) disposed between the first path (2185) and the second path (311), and The above blocking member (331) is an electronic device formed of a material for blocking foreign substances introduced from the first path (2185).

12. In Paragraph 1, The above housing (210) is, Front cover (202); and An electronic device comprising a rear cover (211) that is combined with the front cover (202) and forms the side (210c) and rear (210b) of the electronic device (200).

13. In Paragraph 12, The above module housing (310) is an electronic device disposed in the first space (2101) between the front cover (202) and the rear cover (211).

14. In Paragraph 12, The above side (210c) is an electronic device comprising at least one hole (2182a) connected to the first path (2185).

15. In Paragraph 12, An electronic device comprising a display (201) positioned in the first space (2101) so as to be visible from the outside through the front cover (202).

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