Cooling plate

Abstract

A cooling plate is disclosed. The cooling plate has a sealing structure by which water leakage is prevented. The cooling plate is a cooling plate for removing the heat of circuit components and comprises an upper plate and a lower plate. The upper plate includes a water inlet through which cooling water is introduced, and a water outlet through which the cooling water is discharged. The lower plate is coupled to the upper plate and has a plurality of cooling fins disposed thereon. In addition, the upper plate further includes an O-ring groove having an O-ring member disposed therein. When the upper plate and the lower plate are coupled, the O-ring member is compressed.

Description

cooling plate

[0001] The present invention relates to a cooling plate for removing heat generated from circuit components.

[0002] Many electric battery devices contain numerous circuit components, such as high-performance processors, various sensors, Graphics Processing Units (GPUs), and Central Processing Units (CPUs), and these circuit components generate a significant amount of heat during operation.

[0003] Therefore, a cooling plate is required to be attached to one side of a circuit component that is a high heat source to cool the circuit component, and it is also necessary to prevent the cooling water from leaking from the inside to the outside of the cooling plate.

[0004] The objective of the present invention is to provide a cooling plate having a sealed structure to minimize the power consumption of the cooling system by minimizing the pressure applied by the cooling water to the cooling fins and to prevent the cooling water from leaking.

[0005] The aforementioned objective of the present invention is achieved by the specific details described below.

[0006] A cooling plate according to an embodiment of the present invention is a cooling plate for removing heat from circuit components and includes an upper plate and a lower plate. The upper plate includes an inlet for the inflow of cooling water and an outlet for the outflow of cooling water. The lower plate is coupled to the upper plate and has a plurality of cooling fins arranged thereon. The upper plate further includes an O-ring groove in which an O-ring member is arranged. When the upper plate and the lower plate are coupled, the O-ring member is compressed.

[0007] Specifically, the top plate further includes a top plate groove that accommodates a plurality of cooling fins. The O-ring groove is formed in a strip shape with a preset width and surrounds the top plate groove.

[0008] Specifically, the top plate further includes a first coupling groove. The first coupling groove is formed in a strip shape having a preset width and surrounds the O-ring groove.

[0009] Specifically, a first adhesive groove is formed in the first coupling groove. The first adhesive groove communicates with the first coupling groove and accommodates an adhesive member. The first adhesive groove is formed on the bottom surface of the first coupling groove and is formed by being recessed to a predetermined depth from the bottom surface of the first coupling groove toward the upper surface of the top plate.

[0010] Specifically, the lower plate further includes a first coupling protrusion that is inserted into a first coupling groove. The first coupling protrusion is formed in a strip shape having a preset width and is formed to protrude from the upper surface of the lower plate toward the upper plate by a preset length.

[0011] A cooling plate according to an embodiment of the present invention further includes an adhesive member. The adhesive member is applied to a first coupling groove of an upper plate, and the adhesive member is positioned between the first coupling groove and a first coupling protrusion of a lower plate.

[0012] Specifically, the top plate further includes a second coupling groove. The second coupling groove is formed in a strip shape with a preset width and surrounds the first coupling groove.

[0013] Specifically, a second adhesive groove is formed in the second coupling groove. The second adhesive groove communicates with the second coupling groove and accommodates an adhesive member. The second adhesive groove is formed on the bottom surface of the second coupling groove and is formed by being recessed to a predetermined depth from the bottom surface of the second coupling groove toward the upper surface of the top plate.

[0014] Specifically, the lower plate further includes a second coupling protrusion that is inserted into a second coupling groove. The second coupling protrusion is formed in a strip shape having a preset width and is formed to protrude from the upper surface of the lower plate toward the upper plate by a preset length.

[0015] Specifically, the adhesive member is applied to the second coupling groove of the upper plate, and the adhesive member is positioned between the second coupling groove and the second coupling protrusion of the lower plate.

[0016] Specifically, the top plate further includes an inlet channel communicating with an inlet, an outlet channel communicating with an outlet, and a top plate groove accommodating a plurality of cooling fins. The height of the cooling fins is equal to the depth of the top plate groove.

[0017] Specifically, the upper plate groove and the lower plate include a fin area where a plurality of cooling fins are arranged and an edge area surrounding the fin area. Cooling water flowing into the interior of the upper plate groove passes between the cooling fins, reaches the edge area, and moves along the edge area.

[0018] Specifically, a pair of internal partitions are formed in the upper plate groove. The pair of internal partitions are formed between the pin area and the edge area corresponding to the horizontal direction of the upper plate groove, thereby partitioning the pin area and the edge area.

[0019] Specifically, a first group and a second group, each consisting of a plurality of cooling fins, are arranged between a pair of internal partitions. The longitudinal direction of the cooling fins is arranged parallel to the longitudinal direction of the internal partitions.

[0020] Specifically, the first group and the second group are spaced apart by a certain distance in the pin area of ​​the lower plate. And the inlet flow path of the upper plate is located above the space where the first group and the second group are spaced apart.

[0021] The cooling plate of the present invention has a superior sealing structure (performance) compared to conventional cooling plates. Accordingly, the cooling water inside the cooling plate does not leak to the outside of the cooling plate.

[0022] In addition, the cooling plate of the present invention minimizes the pressure applied by the cooling water to the cooling fins, thereby minimizing the overall power consumption of the cooling system.

[0023] In addition, the cooling plate of the present invention reduces pressure loss and improves cooling efficiency by distributing the flow rate of cooling water flowing between the cooling plates.

[0024] The more detailed effects of the cooling plate of the present invention are described in the specific details for implementing the invention below.

[0025] FIG. 1 shows a cooling plate according to an embodiment of the present invention.

[0026] Figure 2 is a perspective view showing the interior of the cooling plate illustrated in Figure 1.

[0027] Figure 3 is a cross-sectional view of one side of the cooling plate shown in Figure 1.

[0028] Figure 4 is a perspective view of the top plate in A of Figure 3.

[0029] Figures 5 and 6 are drawings of the top plate of Figure 1 turned upside down.

[0030] Figure 7 shows the bottom plate and cooling fins of Figure 1.

[0031] Figure 8 shows A of Figure 3.

[0032] Figure 9 shows the area in Figure 8 where the adhesive member is applied.

[0033] Figure 10 briefly shows another cooling plate.

[0034] Embodiments of the present invention will be described in more detail below with reference to the attached drawings. Regarding components of the present invention that can be clearly understood and easily reproduced by a person skilled in the art according to the prior art, specific descriptions thereof are omitted in order not to obscure the essence of the present invention.

[0035] The attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings.

[0036] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0037] Additionally, terms including ordinal numbers, such as first, second, etc., used herein may be used to describe various components, but said components should not be limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0038] Hereinafter, a cooling plate according to an embodiment of the present invention will be described.

[0039] The cooling plate of the present invention is a cooling device for removing (dissipating heat) heat generated from circuit components in a printed circuit board, etc., of an electrical and electronic device.

[0040] For example, the cooling plate of the present invention is a cooling device that is attached to the upper surface of a chip, such as a CPU (Central Processing Unit) or GPU (Graphic Processing Unit), which is a high heat source of a server equipped in a data center, and cools the high heat source.

[0041] If cooling water leaks from such a cooling plate to the outside, not only are circuit components damaged, but it also becomes difficult to restore the electrical and electronic device to a normal state, resulting in massive damage.

[0042] The cooling plate of the present invention not only effectively removes heat generated from circuit components but also has an excellent sealed structure (performance) that prevents leakage of cooling water.

[0043] Referring to FIGS. 1 to 9, the cooling plate (10) includes an upper plate (11) and a lower plate (12).

[0044] The cooling plate (10) is formed by combining the upper plate (11) and the lower plate (12).

[0045] The top plate (11) and the bottom plate (12) form the outer shape of the cooling plate (10). That is, the outer shape of the cooling plate (10) is formed by combining the outer shape of the top plate (11) and the outer shape of the bottom plate (12). The top plate (11) and the bottom plate (12) serve as the case of the cooling plate (10).

[0046] The cooling plate (10) has an internal space (10s).

[0047] Specifically, when the top plate (11) and the bottom plate (12) are combined, an internal space (10s) is formed between the top plate (11) and the bottom plate (12). A cooling fin (121), which will be described later, is placed in the internal space (10s).

[0048] The top plate (11) of the present invention may be provided in a plate shape having a preset size and a preset thickness. The preset size refers to a size having a length and width that constitute a two-dimensional plane. The width represents the X direction in FIG. 1, the length represents the Y direction in FIG. 1, and the thickness direction of the top plate (11) represents the Z direction in FIG. 1.

[0049] The top plate (11) includes an upper surface (11a), a lower surface (11b), and a side surface (11c). The side surface (11c) is a surface connecting the upper surface (11a) and the lower surface (11b), and is a surface forming the thickness between the upper surface (11a) and the lower surface (11b).

[0050] The upper surface (11a), lower surface (11b), and side surface (11c) of the top plate (11) may include steps, curves, grooves, or holes as needed.

[0051] The top plate (11) has a top plate groove (111).

[0052] FIGS. 5 and FIGS. 6 are drawings of the top plate (11) of FIG. 1 turned upside down so that the lower surface (11b) of the top plate (11) is visible. The lower surface (11b) of the top plate (11) is facing upward.

[0053] In FIG. 5, the left side of the top plate (11) is the side with the water outlet (113h), and the middle side is the side with the water inlet (112h). Also, in FIG. 6, the right side of the top plate (11) is the side with the water outlet (113h), and the middle side is the side with the water inlet (112h).

[0054] The upper plate groove (111) is formed on the lower surface (11b) of the upper plate (11) and is formed by being sunk to a predetermined depth from the lower surface (11b) of the upper plate (11) toward the upper surface (11a).

[0055] To elaborate, the opening of the top plate groove (111) is formed on the lower surface (11b), and the bottom surface of the top plate groove (111) is formed on the upper surface (11a) side (opposite side of the opening). Since the opening of the top plate groove (111) is located at the bottom, the bottom surface of the top plate groove (111) may correspond to the ceiling surface.

[0056] The upper plate groove (111) faces the lower plate (12). Specifically, the lower plate (12) is joined to the lower surface (11b) of the upper plate (11) and covers the upper plate groove (111). That is, the lower plate (12) covers the opening of the upper plate groove (111).

[0057] When the top plate (11) and the bottom plate (12) are combined, the top plate groove (111) becomes the internal space (10s) of the cooling plate (10).

[0058] The top plate groove (111) has a preset size and a preset depth. The preset size refers to a size having a length and width that constitute a two-dimensional plane. The width represents the X direction in FIG. 1, the height represents the Y direction in FIG. 1, and the depth of the top plate groove (111) represents the Z direction in FIG. 1.

[0059] The top plate groove (111) includes a pin area (111a) and an edge area (111b) surrounding the pin area (111a). In other words, the top plate groove (111) can be divided into a pin area (111a) and an edge area (111b). The pin area (111a) is located within the edge area (111b).

[0060] When the top plate (11) and the bottom plate (12) are combined, a plurality of cooling fins (121) are arranged in the fin area (111a), and the edge area (111b) becomes an empty space. The edge area (111b) becomes a channel through which cooling water flows.

[0061] Cooling water flowing into the interior of the upper plate groove (111) through the inlet (112h) passes between the cooling fins (121) and reaches the edge area (111b), and flows along the edge area (111b) to reach the outlet (113h). The cooling water moves to the outside of the cooling plate (10) through the outlet (113h).

[0062] The cooling plate (10) of the present invention is equipped with an inlet (112h) and an outlet (113h).

[0063] The inlet port (112h) is a hole through which cooling water flows into the interior of the cooling plate (10), and the outlet port (113h) is a hole through which cooling water flows out to the exterior of the cooling plate (10).

[0064] According to the first embodiment of the present invention, the upper surface (11a) of the top plate (11) may have a plurality of protrusions (112, 113) formed thereon (see FIG. 1). The protrusions (112, 113) are formed by protruding upward from the upper surface (11a) of the top plate (11) and have a space inside. The exterior of the protrusions (112, 113) may be made of a polyhedron.

[0065] Multiple protrusions (112, 113) include an inlet protrusion (112) and an outlet protrusion (113).

[0066] The entrance protrusion (112) is formed in the center area of ​​the top plate (11) in the horizontal direction (X direction in FIG. 1). The exit protrusion (113) may be formed on one side (e.g., the left side) of the top plate (11) in the horizontal direction (X direction in FIG. 1).

[0067] The inlet protrusion (112) is formed above the inlet passage (112b) (see FIG. 3) described later, and the internal space (112s) of the inlet protrusion (112) communicates with the inlet passage (112b). Also, the inlet port (112h) is formed on one side of the inlet protrusion (112) and penetrates one side of the inlet protrusion (112) to communicate with the internal space (112s) of the inlet protrusion (112).

[0068] The outlet protrusion (113) is formed above the outlet channel (113b) (see FIG. 3) described later, and the internal space (113s) of the outlet protrusion (113) communicates with the outlet channel (113b). Additionally, the outlet port (113h) is formed on one side of the outlet protrusion (113) and penetrates one side of the outlet protrusion (113) to communicate with the internal space (113s) of the outlet protrusion (113).

[0069] The internal space (112s, 113s) of the inlet protrusion (112) and the outlet protrusion (113) may have a volume that gradually decreases as the inlet protrusion (112) and the outlet protrusion (113) protrude in the direction of protrusion. Also, the inlet port (112h) may be formed on the upper side of one side of the inlet protrusion (112), and the outlet port (113h) may be formed on the upper side of one side of the outlet protrusion (113).

[0070] Cooling water flows into the internal space (112s) of the inlet protrusion (112) through the inlet port (112h) and then moves to the upper plate groove (111) via the inlet flow path (112b). After moving between the cooling fins (121) in the upper plate groove (111), the cooling water passes through the edge region (111b) of the upper plate groove (111) and then moves to the outside of the cooling plate (10) of the present invention via the outlet flow path (113b), the internal space (113s) of the outlet protrusion (113), and the outlet port (113h) in sequence.

[0071] According to the second embodiment of the present invention, the aforementioned inlet protrusion (112) and outlet protrusion (113) are not provided, and an inlet and an outlet may be formed on the top plate.

[0072] In the second embodiment, the inlet and outlet may be formed at the locations of the aforementioned inlet protrusion (112) and outlet protrusion (113).

[0073] The inlet and outlet are formed from the upper surface (11a) of the top plate (11) toward the lower surface (11b).

[0074] The inlet is connected to the inlet passage (112b), and the outlet is connected to the outlet passage (113b). The inlet passage (112b) and the outlet passage (113b) are connected to the upper plate groove (111).

[0075] Meanwhile, the cooling plate (10) of the present invention is provided with an inlet flow path (112b) and an outlet flow path (113b).

[0076] The inlet channel (112b) and outlet channel (113b) are formed in the top plate (11) and are spaces through which cooling water flows.

[0077] The inlet passage (112b) communicates with the internal space (112s) (first embodiment) or the inlet (second embodiment) of the inlet protrusion (112), and the outlet passage (113b) communicates with the internal space (113s) (first embodiment) or the outlet (second embodiment) of the outlet protrusion (113). Accordingly, the inlet passage (112b) is formed on the side of the inlet protrusion (112) or the inlet, and the outlet passage (113b) is formed on the side of the outlet protrusion (113) or the outlet.

[0078] An inlet channel (112b) is formed in the center area of ​​the top plate groove (111) in the horizontal direction of the top plate (11) (X direction in FIG. 1). An outlet channel (113b) may be formed on one side (e.g., the left side) of the top plate groove (111) in the horizontal direction of the top plate (11) (X direction in FIG. 1) (see FIG. 1 to 3).

[0079] The inlet channel (112b) and the outlet channel (113b) may have a width that is preset in one direction and a length that is preset in a direction that is horizontally orthogonal to the one direction. The one direction is represented by the X direction in FIGS. 2 and 3, and the direction that is horizontally orthogonal to the one direction is represented by the Y direction in FIG. 2.

[0080] And, the inlet channel (112b) and the outlet channel (113b) can be formed by being sunk to a predetermined depth from the bottom surface of the top plate groove (111) toward the top surface (11a) (in the Z direction in FIG. 2 and FIG. 3).

[0081] Below the exit channel (113b), the edge area (111b) of the top plate groove (111) is located.

[0082] The top plate (11) is provided with a pair of internal partitions (111c) (see FIG. 5 and FIG. 6).

[0083] A pair of internal partitions (111c) are formed in the upper plate groove (111).

[0084] The inner partition (111c) is formed with a predetermined length (height) from the bottom surface of the top plate groove (111) toward the opening of the top plate groove (111). The height of the inner partition (111c) may be equal to the depth of the top plate groove (111).

[0085] An internal partition (111c) is formed between the pin area (111a) and the edge area (111b) to partition the pin area (111a) and the edge area (111b). However, the internal partition (111c) is not formed in all places between the pin area (111a) and the edge area (111b).

[0086] Specifically, a pair of internal partitions (111c) are formed only in the horizontal direction (X direction in FIG. 5 and FIG. 6) of the upper plate groove (111) and are not formed in the vertical direction (Y direction in FIG. 5 and FIG. 6) of the upper plate groove (111).

[0087] To elaborate, a pair of internal partitions (111c) are formed between the pin area (111a) and the edge area (111b) corresponding to the horizontal direction of the top plate groove (111), and are not formed between the pin area (111a) and the edge area (111b) corresponding to the vertical direction of the top plate groove (111).

[0088] A pair of internal partitions (111c) are spaced apart by the distance of the pin area (111a) corresponding to the vertical direction of the top plate groove (111).

[0089] The inner partition (111c) has a predetermined length in the horizontal direction of the upper plate groove (111). To elaborate, the inner partition (111c) is formed to the length of the pin area (111a) corresponding to the horizontal direction of the upper plate groove (111) within the pin area (111a) of the upper plate groove (111).

[0090] The internal partition (111c) blocks the cooling water flowing into the upper plate groove (111) from flowing directly to the edge area (111b) of the upper plate groove (111) without passing between the cooling fins (121) described later.

[0091] A pair of internal partitions (111c) allow the entire amount of cooling water flowing into the upper plate groove (111) to pass between the cooling fins (121), thereby maximizing the cooling efficiency of the cooling plate (10).

[0092] The part where the top plate (11) and the bottom plate (12) are joined is sealed. Accordingly, cooling water is prevented from leaking between the top plate (11) and the bottom plate (12).

[0093] Referring to FIGS. 3 to 9, in order to seal the space between the upper plate (11) and the lower plate (12), the cooling plate (10) of the present invention is provided with an O-ring groove (114), a coupling groove (115), adhesive grooves (115a1, 115b1), and a coupling protrusion (122).

[0094] The O-ring groove (114), the coupling groove (115), and the adhesive groove (115a1, 115b1) are formed on the top plate (11), and the coupling protrusion (122) is formed on the bottom plate (12).

[0095] In addition, the cooling plate (10) of the present invention is provided with an O-ring member (13) and an adhesive member (14) so ​​that the space between the upper plate (11) and the lower plate (12) is sealed.

[0096] The O-ring member (13) represents a commonly used O-ring.

[0097] The O-ring member (13) (O-ring) represents a rubber ring commonly used in machinery as is known, and serves as a packing that seals the gap between members.

[0098] The O-ring member (13) (O-ring) is well known, so a detailed description thereof is omitted.

[0099] The adhesive member (14) represents a commonly used adhesive.

[0100] The adhesive member (14) (adhesive) may be a polymer material having the property of bonding members together as is known.

[0101] The adhesive member (14) may be made of, for example, silicon. However, the adhesive member (14) is not limited to this and may be made of various materials.

[0102] The adhesive member (14) (adhesive) is well known, so a detailed description thereof is omitted.

[0103] Below, the O-ring groove (114), coupling groove (115), and adhesive groove (115a1, 115b1) provided on the top plate (11) will be described, and the coupling protrusion (122) provided on the bottom plate (12) will be described in the description of the bottom plate (12).

[0104] The O-ring groove (114) is formed on the lower surface (11b) of the top plate (11).

[0105] An O-ring member (13) is inserted and placed in the O-ring groove (114).

[0106] The O-ring groove (114) is formed in a strip shape with a preset width and surrounds the top plate groove (111).

[0107] The O-ring groove (114) is spaced apart from the top plate groove (111) by a preset distance.

[0108] The O-ring groove (114) is formed by being sunk to a predetermined depth from the lower surface (11b) of the top plate (11) toward the upper surface (11a).

[0109] The depth of the O-ring groove (114) is formed to be smaller than the thickness of the O-ring member (13).

[0110] To elaborate, when the O-ring member (13) is inserted into the O-ring groove (114), a portion of the O-ring member (13) protrudes from the O-ring groove (114). Accordingly, when the upper plate (11) and the lower plate (12) are joined, the O-ring member (13) is compressed, thereby improving the sealing performance between the upper plate (11) and the lower plate (12). The thickness of the O-ring member (13) represents the thickness of the cross-section of the O-ring member (13).

[0111] The connecting groove (115) is formed on the lower surface (11b) of the top plate (11).

[0112] Two or more coupling grooves (115) may be formed on the lower surface (11b) of the top plate (11). An embodiment in which two coupling grooves (115) are formed is shown in the drawing.

[0113] The following detailed description of the coupling groove (115) is for an embodiment in which two coupling grooves (115) are formed as shown in the drawing.

[0114] The two coupling grooves (115) represent the first coupling groove (115a) and the second coupling groove (115b).

[0115] The first coupling protrusion (122a) of the lower plate (12) is inserted and positioned in the first coupling groove (115a), and the second coupling protrusion (122b) of the lower plate (12) is inserted and positioned in the second coupling groove (115b).

[0116] The first coupling groove (115a) is formed in a strip shape with a preset width and surrounds the O-ring groove (114). The first coupling groove (115a) is spaced apart from the O-ring groove (114) by a preset distance.

[0117] And, the second coupling groove (115b) is formed in a strip shape with a preset width and surrounds the first coupling groove (115a). The second coupling groove (115b) is spaced apart from the first coupling groove (115a) by a preset distance. In FIG. 4 and others, reference numeral 115c indicates a surface located between the first coupling groove (115a) and the second coupling groove (115b).

[0118] Each of the first coupling groove (115a) and the second coupling groove (115b) is formed by being recessed to a predetermined depth from the lower surface (11b) of the top plate (11) toward the upper surface (11a).

[0119] To elaborate, the opening of the first coupling groove (115a) is formed on the lower surface (11b), and the bottom surface of the first coupling groove (115a) is formed on the upper surface (11a) side (opposite side of the opening). Since the opening of the first coupling groove (115a) is located at the bottom, the bottom surface of the first coupling groove (115a) may correspond to the ceiling surface. This applies equally to the second coupling groove (115b).

[0120] The cross-sectional shape of the first coupling groove (115a) and the cross-sectional shape of the first coupling protrusion (122a) provided on the bottom plate (12) may correspond to each other. For example, the cross-sectional shape of the first coupling groove (115a) and the cross-sectional shape of the first coupling protrusion (122a) may be rectangular. Accordingly, when the first coupling protrusion (122a) is inserted into the first coupling groove (115a), the gap between the first coupling protrusion (122a) and the first coupling groove (115a) can be minimized. This applies equally to the second coupling groove (115b).

[0121] The cross-sectional shape of the first coupling groove (115a) (or first coupling protrusion (122a)) described above represents the shape of the cut cross-section when the first coupling groove (115a) (or first coupling protrusion (122a)) is cut in a direction orthogonal to the longitudinal direction of the first coupling groove (115a) (or first coupling protrusion (122a)).

[0122] According to embodiments of the present invention, the first coupling groove (115a) is formed in a strip shape having a preset length and surrounds the O-ring groove (114). And, the second coupling groove (115b) is formed in a strip shape having a preset length and surrounds the first coupling groove (115b).

[0123] In these embodiments, the first coupling groove (115a) and the second coupling groove (115b) may each be formed as a single continuous band shape as shown in the drawing, or may be formed into two or more sections with one or more breaks in the middle, although not shown in the drawing. The sections are formed with a predetermined length, and a coupling protrusion (122) may be inserted into each section. Having breaks in the middle means that a coupling groove (115) is not formed between the sections.

[0124] Meanwhile, adhesive grooves (115a1, 115b1) are formed in the coupling groove (115). Specifically, a first adhesive groove (115a1) is formed in the first coupling groove (115a), and a second adhesive groove (115b1) is formed in the second coupling groove (115b).

[0125] The first adhesive groove (115a1) and the second adhesive groove (115b1) accommodate an adhesive member (14). When the adhesive member (14) is applied to a certain area of ​​the lower surface (11b) of the top plate (11), the adhesive member (14) flows into the first adhesive groove (115a1) and the second adhesive groove (115b1) and fills each of the adhesive grooves (115a1, 115b1).

[0126] The first adhesive groove (115a1) is in communication with the first coupling groove (115a), and the second adhesive groove (115b1) is in communication with the second coupling groove (115b).

[0127] The first adhesive groove (115a1) is formed on the bottom surface of the first coupling groove (115a) and is formed by being recessed to a predetermined depth from the bottom surface of the first coupling groove (115a) toward the top surface (11a).

[0128] And, the second adhesive groove (115b1) is formed on the bottom surface of the second coupling groove (115b) and is formed by being recessed to a predetermined depth from the bottom surface of the second coupling groove (115b) toward the upper surface (11a).

[0129] To elaborate, the opening of the first adhesive groove (115a1) is formed on the bottom surface of the first bonding groove (115a), and the bottom surface of the first adhesive groove (115a1) is formed on the upper surface (11a) side (opposite side of the opening). The bottom surface of the first adhesive groove (115a1) may correspond to the ceiling surface since the opening of the first adhesive groove (115a1) is located at the bottom. This applies equally to the second bonding groove (115b).

[0130] With the upper surface (11a) of the top plate (11) facing upward and the lower surface (11b) facing downward (see FIG. 3 and FIG. 4), the first adhesive groove (115a1) is placed on top of the first bonding groove (115a), and the second adhesive groove (115b1) is placed on top of the second bonding groove (115b).

[0131] In an embodiment in which three coupling grooves (115) are formed according to an embodiment of the present invention, the arrangement relationship between the first coupling groove (115a) and the second coupling groove (115b) described above is applied identically, and the third coupling groove is formed in a strip shape having a preset width and is arranged to surround the second coupling groove (115b) described above. The third coupling groove is spaced apart from the second coupling groove (115b) by a preset distance. And a third adhesive groove may be formed in the third coupling groove.

[0132] Meanwhile, according to an embodiment of the present invention, only one coupling groove (115) may be formed on the lower surface (11b) of the top plate (11). In this embodiment, the one coupling groove (115) may be any one of the aforementioned plurality of coupling grooves (115) (e.g., the first coupling groove (115a) and the second coupling groove (115b)). Also, one adhesive groove (115a1 or 115b1) may be formed in the one coupling groove (115).

[0133] Referring to FIGS. 1 to 3 and FIGS. 7 to 9, the bottom plate (12) of the present invention may be provided in a plate shape having a preset size and a preset thickness. The preset size refers to a size having a length of the width and length constituting a two-dimensional plane. The width represents the X direction in FIG. 2, the length represents the Y direction in FIG. 2, and the thickness direction of the cooling plate (10) represents the Z direction in FIG. 2.

[0134] The bottom plate (12) includes an upper surface, a lower surface, and a side surface. The side surface is a surface connecting the upper surface and the lower surface, and is a surface forming the thickness between the upper surface and the lower surface.

[0135] The upper, lower, and side surfaces of the bottom plate (12) may include steps, curves, and grooves as needed.

[0136] The upper surface of the lower plate (12) faces the lower surface (11b) of the upper plate (11). The upper surface of the lower plate (12) covers the opening of the upper plate groove (111).

[0137] Cooling fins (121) are arranged or formed on the upper surface of the lower plate (12), and the lower surface of the lower plate (12) contacts the upper surface of a chip such as a CPU or GPU.

[0138] Referring to FIGS. 2 and FIGS. 7, the bottom plate (12) includes a pin area (12a) corresponding to the pin area (111a) of the top plate groove (111), and also includes an edge area (12b) corresponding to the edge area (111b) of the top plate groove (111). The pin area (12a) and the edge area (12b) are formed on the upper surface of the bottom plate (12).

[0139] The pin area (12a) of the bottom plate (12) is located below the pin area (111a) of the top plate groove (111), and the edge area (12b) of the bottom plate (12) is located below the edge area (111b) of the top plate groove (111). Accordingly, the pin area (12a) of the bottom plate (12) is located within the edge area (12b).

[0140] A plurality of cooling fins (121) are arranged or formed in the fin area (12a) of the bottom plate (12).

[0141] The edge area (12b) of the bottom plate (12) is an empty space and becomes a channel through which coolant flows.

[0142] The internal space (10s) of the cooling plate (10) of the present invention may be divided into a fin area and an edge area. The fin area of ​​the cooling plate (10) is formed by combining the fin area (111a) of the upper plate groove (111) and the fin area (12a) of the lower plate (12), and the edge area of ​​the cooling plate (10) is formed by combining the edge area (111b) of the upper plate groove (111) and the edge area (12b) of the lower plate (12).

[0143] The cooling plate (10) of the present invention is equipped with a plurality of cooling fins (121).

[0144] The cooling fin (121) can be connected to the bottom plate (12) or formed on the bottom plate (12).

[0145] The cooling fin (121) is formed by extending upward from one side (e.g., the upper side) of the lower plate (12) for a predetermined length.

[0146] The cooling fins (121) can be formed, for example, by a skiving method.

[0147] Referring to FIGS. 2, FIGS. 3, and FIGS. 7, the cooling fin (121) is formed in a plate shape having a preset size and a preset thickness. The preset size refers to a size having a length and width that constitute a two-dimensional plane. The width represents the X direction in FIG. 2, the height represents the Z direction in FIG. 2, and the thickness direction of the cooling fin (121) represents the Y direction in FIG. 2.

[0148] The horizontal length of the cooling fin (121) can be formed to be longer than the vertical length.

[0149] The vertical length (height of the cooling fin (121)) of the cooling fin (121) may be equal to the depth of the upper plate groove (111). Accordingly, the cooling water flowing into the upper plate groove (111) cannot flow over the cooling fin (121) but moves through the spaces between the cooling fins (121) and the edge area (111b).

[0150] The thickness of the cooling fins (121) may be the same or different.

[0151] Additionally, the spacing between the cooling fin (121) and the adjacent cooling fin (121) may be the same or different.

[0152] Additionally, for example, the distance between the cooling fins (121) in area A may be different from the distance between the cooling fins (121) in area B. In this case, the distance between the cooling fins (121) in area A may be constant, and the distance between the cooling fins (121) in area B may also be constant.

[0153] In this specification, the 'horizontal length direction of the cooling fin (121)' may be briefly referred to as the 'length direction of the cooling fin (121)' and indicates the X direction in the drawings of this specification.

[0154] In the fin area (12a) of the bottom plate (12), a plurality of cooling fins (121) can be arranged in a plurality of groups (121a, 121b).

[0155] That is, the cooling plate (10) of the present invention may be provided with a plurality of groups composed of a plurality of cooling fins (121).

[0156] Multiple groups (121a, 121b) may include a first group (121a) and a second group (121b). The first group (121a) and the second group (121b) are placed between a pair of internal partitions (111c).

[0157] Each of the first group (121a) and the second group (121b) is composed of a plurality of cooling fins (121).

[0158] In the first group (121a) and the second group (121b), each of the plurality of cooling fins (121) is arranged in one direction. The one direction represents the transverse direction (length direction) of the cooling fins (121).

[0159] To elaborate, the cooling fins (121) are arranged so that the horizontal side of the cooling fins (121) is parallel to the X direction in FIGS. 2 to 3 and FIGS. 5 to 7.

[0160] The cooling fin (121) has a preset length in the horizontal direction of the top plate groove (111).

[0161] The longitudinal direction of the cooling fin (121) may be parallel to the longitudinal direction of the internal partition (111c).

[0162] In the first group (121a) and the second group (121b), a plurality of cooling fins (121) are arranged in a line in a different direction. The other direction represents a direction that is horizontally orthogonal to the direction and represents the thickness direction of the cooling fins (121) (e.g., the Y direction in FIGS. 2 to 3 and FIGS. 5 to 7).

[0163] The first group (121a) and the second group (121b) are arranged side by side in one direction (e.g., the X direction in FIGS. 2 to 3, FIGS. 5 to 7) and spaced apart by a certain distance.

[0164] The space (121s) between the first group (121a) and the second group (121b) is located within the pin area (12a) of the bottom plate (12).

[0165] The inlet passage (112b) of the top plate (11) is positioned above the space (121s) where the first group (121a) and the second group (121b) are separated. Accordingly, the cooling water introduced into the inlet passage (112b) through the inlet port (112h) flows to the space (121s) where the first group (121a) and the second group (121b) are separated (W1 in FIG. 7, and the arrow in FIG. 7 indicates the path of the cooling water).

[0166] And the cooling water flows into the first group (121a) and the second group (121b), and flows between the multiple cooling fins (121) in the first group (121a) and the second group (121b).

[0167] Cooling water in the space (121s) separated from the first group (121a) and the second group (121b) cannot move directly to the edge region (111b) by means of a pair of internal partitions (111c), but flows between the multiple cooling fins (121) in the first group (121a) and the second group (121b) and then moves to the edge region (111b) (see FIGS. 5 to 7).

[0168] Accordingly, the cooling water flowing into the space (121s) where the first group (121a) and the second group (121b) are separated passes entirely between the cooling fins (121), so the cooling efficiency of the cooling plate (10) is improved.

[0169] Then, the cooling water passes through the edge region (111b) of the upper plate groove (111), the outlet channel (113b), the internal space (113s) of the outlet protrusion (113), and the outlet port (113h) in sequence, and moves to the outside of the cooling plate (10) of the present invention (W2 in FIG. 7).

[0170] The inlet (112h) may be positioned in the middle of the spaced-apart location (121s) between the first group (121a) and the second group (121b). The middle of the spaced-apart location (121s) represents the middle in the Y direction of the pin area (111a) shown in FIG. 2.

[0171] Below the separated portion (121s) of the first group (121a) and the second group (121b), a high-heat circuit component (e.g., a chip such as a CPU or GPU) may be placed, or a portion of the circuit component that generates high heat may be placed.

[0172] Accordingly, the cooling water coming out of the inlet (112h) strikes the lower plate (12) on the high-heat circuit component or the part where high heat is generated, so the cooling efficiency of the cooling plate (10) can be further increased.

[0173] The horizontal length of the cooling fin (121) in the first group (121a) and the horizontal length of the cooling fin (121) in the second group (121b) may be the same or different. Accordingly, the positions of the separated part (121s), the inlet protrusion (112), and the water inlet (112h) of the first group (121a) and the second group (121b) may be changed.

[0174] Meanwhile, in an embodiment (not shown) in which there are three or more groups composed of cooling fins (121), there may be two or more spaced-apart places (121s) between groups, and an inlet protrusion (112) and / or an inlet (112h) may be disposed at each spaced-apart place (121s).

[0175] In order to seal the space between the top plate (11) and the bottom plate (12), the bottom plate (12) is provided with a connecting protrusion (122) (see FIGS. 2 to 3, FIGS. 7 to 9).

[0176] The connecting protrusion (122) is formed on the upper surface of the lower plate (12).

[0177] When the top plate (11) and the bottom plate (12) are combined, the connecting protrusion (122) is inserted into and positioned in the connecting groove (115) of the top plate (11).

[0178] In the lower plate (12), the connecting protrusion (122) is formed to be located below the connecting groove (115) of the upper plate (11).

[0179] Two or more coupling protrusions (122) may be formed on the upper surface of the bottom plate (12). The drawing shows an embodiment in which two coupling protrusions (122) are formed corresponding to the number of coupling grooves (115).

[0180] The following detailed description of the coupling protrusion (122) is for an embodiment in which two coupling protrusions (122) are formed as shown in the drawing.

[0181] The two connecting protrusions (122) represent the first connecting protrusion (122a) and the second connecting protrusion (122b).

[0182] The first coupling protrusion (122a) is inserted and positioned in the first coupling groove (115a) of the top plate (11), and the second coupling protrusion (122b) is inserted and positioned in the second coupling groove (115b) of the top plate (11).

[0183] The first connecting protrusion (122a) is formed in a strip shape with a preset width and surrounds the edge area (12b) of the bottom plate (12).

[0184] When the upper plate (11) and the lower plate (12) are combined, the first connecting protrusion (122a) is spaced apart from the O-ring member (13) placed in the O-ring groove (114) of the upper plate (11) by a preset distance.

[0185] And, the second connecting protrusion (122b) is formed in a band shape having a preset width and surrounds the first connecting protrusion (122a). The second connecting protrusion (122b) is spaced apart from the first connecting protrusion (122a) by a preset distance. In FIG. 7 and others, reference numeral 122c indicates a surface located between the first connecting protrusion (122a) and the second connecting protrusion (122b).

[0186] Each of the first connecting protrusion (122a) and the second connecting protrusion (122b) is formed to protrude from the upper surface of the lower plate (12) toward the upper plate (11) by a predetermined length (height).

[0187] According to embodiments of the present invention, the first coupling protrusion (122a) is formed in a strip shape having a preset length and surrounds the edge region (12b) of the bottom plate (12). And, the second coupling protrusion (122b) is formed in a strip shape having a preset length and surrounds the first coupling protrusion (122a).

[0188] In these embodiments, each of the first connecting protrusion (122a) and the second connecting protrusion (122b) may be formed as a single continuous band shape as shown in the drawing, or may be formed into two or more sections with one or more breaks in the middle, although not shown in the drawing. The sections are formed with a predetermined length, and each section may be inserted into the connecting groove (115). Having breaks in the middle means that no connecting protrusion (122) is formed between the sections.

[0189] Meanwhile, when the upper plate (11) and the lower plate (12) are combined and the first coupling protrusion (122a) of the lower plate (12) is inserted into the first coupling groove (115a) of the upper plate (11), the first adhesive groove (115a1) is placed on the upper surface of the first coupling protrusion (122a) (see FIG. 8).

[0190] Then, when the second coupling protrusion (122b) of the lower plate (12) is inserted into the second coupling groove (115b) of the upper plate (11), a second adhesive groove (115b1) is placed on the upper surface of the second coupling protrusion (122b) (see FIG. 8).

[0191] When an adhesive member (14) is applied to a certain area of ​​the lower surface (11b) of the upper plate (11) before the upper plate (11) and the lower plate (12) are joined, the adhesive member (14) flows into the O-ring groove (114), the first adhesive groove (115a1), and the second adhesive groove (115b1) and fills the O-ring groove (114), the first adhesive groove (115a1), and the second adhesive groove (115b1) (see FIG. 9).

[0192] The area where the adhesive member (14) is applied to the lower surface (11b) of the top plate (11) refers to the area surrounding the top plate groove (111) of the top plate (11).

[0193] To elaborate, the adhesive member (14) can be applied to the area where the O-ring groove (114), the first coupling groove (115a), and the second coupling groove (115b) are formed, excluding the top plate groove (111), and the surrounding area of ​​the lower surface (11b) of the top plate (11) (see FIG. 9).

[0194] After the adhesive member (14) is applied to the lower surface (11b) of the top plate (11), the O-ring member (13) is inserted into the O-ring groove (114), and the top plate (11) and the bottom plate (12) are joined.

[0195] An adhesive member (14) is placed between the O-ring groove (114) and the O-ring member (13).

[0196] Since the inner surface of the O-ring groove (114) and the outer surface of the O-ring member (13) are joined by the adhesive member (14), the O-ring member (13) can be fixed without easily detaching from the O-ring groove (114).

[0197] And, an adhesive member (14) is disposed between the coupling groove (115) (first coupling groove (115a) and second coupling groove (115b)) and the coupling protrusion (122) (first coupling protrusion (122a) and second coupling protrusion (122b)).

[0198] Since the inner surface of the coupling groove (115) and the outer surface of the coupling protrusion (122) are joined by an adhesive member (14), the coupling protrusion (122) can be fixed without easily detaching from the coupling groove (115).

[0199] Thus, the adhesive member (14) serves to fix the O-ring member (13) and the combined protrusion (122) to the top plate (11).

[0200] Additionally, the adhesive member (14) serves to prevent the cooling water in the internal space (10s) of the cooling plate (10) (the upper plate groove (111) of the upper plate (11)) from leaking into the gap between the upper plate (11) and the lower plate (12), and also serves to bond the upper plate (11) and the lower plate (12).

[0201] Cooling water flowing into the internal space (10s) of the cooling plate (10) is subjected to a preset pressure to ensure smooth movement. To elaborate, a preset pressure is applied to the cooling water to ensure that the cooling water moves smoothly within the cooling plate (10).

[0202] The O-ring member (13), the adhesive member (14), and the connecting protrusion (122) prevent the coolant from leaking between the upper plate (11) and the lower plate (12) at a preset pressure and a pressure greater than that applied to the coolant.

[0203] The first adhesive groove (115a1) and the second adhesive groove (115b1) improve the bonding strength between the top plate (11) and the bottom plate (12) and the ability of the cooling plate (10) to block leakage.

[0204] To elaborate, since the first adhesive groove (115a1) and the second adhesive groove (115b1) accommodate a certain amount of adhesive material (14), the adhesive material (14) accommodated in the first adhesive groove (115a1) and the second adhesive groove (115b1), together with the adhesive material (14) applied to the surface of the lower plate (11b) of the top plate (11), improves the bonding strength between the top plate (11) and the bottom plate (12) and the ability to prevent leakage of the cooling plate (10).

[0205] In addition, the first connecting protrusion (122a) and the second connecting protrusion (122b) improve the bonding strength between the top plate (11) and the bottom plate (12) and the ability of the cooling plate (10) to prevent leakage.

[0206] To elaborate, the first connecting protrusion (122a) and the second connecting protrusion (122b) trap a certain amount of adhesive member (14) between the first connecting protrusion (122a) and the second connecting protrusion (122b), thereby improving the bonding strength of the top plate (11) and the bottom plate (12) and the leakage blocking performance of the cooling plate (10).

[0207] In an embodiment in which three coupling protrusions (122) are formed according to an embodiment of the present invention, the arrangement relationship between the first coupling protrusion (122a) and the second coupling protrusion (122b) described above is applied identically, and the third coupling protrusion is formed in a band shape having a preset width and is arranged to surround the second coupling protrusion (122b) described above. The third coupling protrusion is spaced apart from the second coupling protrusion (122b) by a preset distance.

[0208] Meanwhile, in an embodiment where only one coupling groove (115) is formed on the lower surface (11b) of the top plate (11) as described above, only one coupling protrusion (122) may be formed on the lower surface (11b) of the top plate (11).

[0209] For example, in this embodiment, if one coupling groove (115) is a first coupling groove (115a), a first coupling protrusion (122a) may be formed, and if one coupling groove (115) is a second coupling groove (115b), a second coupling protrusion (122b) may be formed.

[0210] According to another embodiment of the present invention, the O-ring groove (114) may be formed between the first coupling groove (115a) and the second coupling groove (115b), or may be formed on the edge side of the lower surface (11b) of the top plate (11) to surround the second coupling groove (115b).

[0211] As previously explained, in order to seal the space between the upper plate (11) and the lower plate (12), the upper plate (11) of the present invention is provided with an O-ring groove (114), a coupling groove (115), and an adhesive groove (115a1, 115b1), and the lower plate (12) is provided with a coupling protrusion (122). In addition, the cooling plate (10) of the present invention is provided with an O-ring member (13) and an adhesive member (14).

[0212] The above O-ring groove (114), coupling groove (115), adhesive groove (115a1, 115b1), coupling protrusion (122), O-ring member (13) and adhesive member (14) may be named 'sealing components'.

[0213] The above sealing components may also be applied to a cooling plate (another cooling plate) according to another embodiment. FIG. 10 briefly illustrates an embodiment in which the above sealing components are applied to another cooling plate.

[0214] To elaborate, another cooling plate is composed of an upper plate (11) and a lower plate (12), and even if the shape of the upper plate (11) and the shape of the lower plate (12) of the other cooling plate are different from the shape of the upper plate (11) and the shape of the lower plate (12) of the present invention described above, the sealing components may be formed or arranged at the place where one side (e.g., the lower surface) of the upper plate (11) of the other cooling plate and one side (e.g., the upper surface) of the lower plate (12) come into contact.

[0215] In FIG. 1, drawing reference numeral 112a represents an inlet connection part (112a), and drawing reference numeral 113a represents an outlet connection part (113a).

[0216] One end of the inlet connection part (112a) is connected to the water inlet (112h), and the other end is connected to the first pipe (not shown). That is, the inlet connection part (112a) is positioned between the water inlet (112h) and the first pipe and is a member that connects the water inlet (112h) and the first pipe.

[0217] And, one end of the outlet connection part (113a) is connected to the water outlet (113h), and the other end is connected to the second pipe (not shown). That is, the outlet connection part (113a) is a member positioned between the water outlet (113h) and the second pipe to connect the water outlet (113h) and the second pipe.

[0218] The cooling plate (10) of the present invention minimizes the pressure exerted by the cooling water on the cooling fin (121) by arranging the cooling fin (121) so that the cooling water does not press on one side of the cooling fin (121) in a direction orthogonal to one side of the cooling fin (121). Accordingly, the overall power consumption of the cooling system is minimized.

[0219] In addition, the cooling plate (10) of the present invention reduces pressure loss of the cooling water and improves cooling efficiency by branching the cooling water and moving it between the cooling fins (121).

[0220] In addition, the cooling plate (10) of the present invention allows the cooling water to move along the length direction of the cooling fin (121), thereby reducing the flow resistance of the cooling water.

[0221] Thus, the cooling plate (10) of the present invention has the effect of maximizing cooling efficiency by enhancing heat transfer performance and hydrodynamic performance.

[0222] In addition, the cooling plate (10) of the present invention is equipped with sealing components to maximize the leakage blocking performance of the cooling plate (10). Furthermore, the sealing components can be applied to other cooling plates.

Claims

1. As a cooling plate for removing heat from circuit components, A top plate comprising an inlet for cooling water to flow in and an outlet for cooling water to flow out; and It includes a lower plate coupled to the upper plate and having a plurality of cooling fins arranged thereon, The above top plate further includes an O-ring groove in which an O-ring member is placed, and A cooling plate in which the O-ring member is compressed when the upper plate and the lower plate are combined.

2. In Paragraph 1, The upper plate further includes an upper plate groove that accommodates the plurality of cooling fins, and The above O-ring groove is formed in a strip shape having a preset width and is a cooling plate surrounding the above top plate groove.

3. In Paragraph 2, The above top plate further includes a first coupling groove, and The first coupling groove is formed in a strip shape having a preset width, and the cooling plate surrounds the O-ring groove.

4. In Paragraph 3, A first adhesive groove is formed in the first coupling groove, and The first adhesive groove communicates with the first coupling groove and accommodates an adhesive member, and A cooling plate, wherein the first adhesive groove is formed on the bottom surface of the first coupling groove and is formed by being recessed to a predetermined depth from the bottom surface of the first coupling groove toward the upper surface of the top plate.

5. In Paragraph 3, The lower plate further includes a first coupling protrusion inserted into the first coupling groove, and A cooling plate, wherein the first coupling protrusion is formed in a strip shape having a preset width and protrudes from the upper surface of the lower plate toward the upper plate by a preset length.

6. In Paragraph 5, It further includes an adhesive member, A cooling plate in which the adhesive member is applied to the first coupling groove, and the adhesive member is positioned between the first coupling groove and the first coupling protrusion.

7. In Paragraph 3, The above top plate further includes a second coupling groove, and The second coupling groove is formed in a strip shape having a preset width and is a cooling plate surrounding the first coupling groove.

8. In Paragraph 7, A second adhesive groove is formed in the second coupling groove above, and The second adhesive groove communicates with the second coupling groove and accommodates an adhesive member, and A cooling plate in which the second adhesive groove is formed on the bottom surface of the second coupling groove and is formed by being recessed to a predetermined depth from the bottom surface of the second coupling groove toward the upper surface of the top plate.

9. In Paragraph 7, The lower plate further includes a second coupling protrusion inserted into the second coupling groove, and A cooling plate, wherein the second connecting protrusion is formed in a strip shape having a preset width and protrudes from the upper surface of the lower plate toward the upper plate by a preset length.

10. In Paragraph 9, It further includes an adhesive member, A cooling plate in which the adhesive member is applied to the second coupling groove, and the adhesive member is positioned between the second coupling groove and the second coupling protrusion.

11. In Paragraph 1, The upper plate further includes an inlet passage communicating with the inlet, an outlet passage communicating with the outlet, and an upper plate groove accommodating the plurality of cooling fins. A cooling plate, the height of the cooling fins being the same as the depth of the groove in the upper plate.

12. In Paragraph 11, The upper plate groove and the lower plate each include a fin area in which the plurality of cooling fins are arranged and an edge area surrounding the fin area. Cooling water flowing into the interior of the upper plate groove passes between the cooling fins and reaches the edge region, and moves along the edge region, a cooling plate.

13. In Paragraph 12, A pair of internal partitions are formed in the upper plate groove, and A cooling plate in which the above pair of internal partitions are formed between the pin area and the edge area corresponding to the transverse direction of the upper plate groove, thereby partitioning the pin area and the edge area.

14. In Paragraph 13, Between the aforementioned pair of internal partitions, a first group and a second group composed of the aforementioned plurality of cooling fins are disposed, and A cooling plate in which the longitudinal direction of the cooling fins is arranged parallel to the longitudinal direction of the internal partition.

15. In Paragraph 14, In the pin area of ​​the lower plate, the first group and the second group are spaced apart by a certain distance, and A cooling plate in which the inlet flow path of the above-mentioned top plate is located above the area where the above-mentioned first group and the above-mentioned second group are spaced apart.

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