Cooling water leakage discharge structure
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- LG ELECTRONICS INC
- Filing Date
- 2026-01-09
- Publication Date
- 2026-07-30
Smart Images
Figure KR2026000544_30072026_PF_FP_ABST
Abstract
Description
Coolant leak drainage structure
[0001] The present invention relates to a drainage structure for discharging leaked cooling water.
[0002] Servers equipped in data centers include chips such as CPUs (Central Processing Units) or GPUs (Graphic Processing Units), which are sources of high heat.
[0003] Since the above-mentioned chip generates high heat, a cooling plate is used to remove the heat. To elaborate, the cooling plate is attached to the upper surface of a chip, such as a CPU or GPU, which is a high-heat source placed on the server's printed circuit board, to cool the high-heat source.
[0004] If cooling water leaks from the cooling plate, not only are circuit components (e.g., the aforementioned chip) damaged, but it also becomes difficult to restore the electrical and electronic device to a normal state, resulting in massive damage.
[0005] Accordingly, in the event that cooling water leaks from the cooling plate, a drainage structure is required to discharge the leaked cooling water to the outside of the cooling plate, server, and / or server rack.
[0006] In addition, a cooling plate is required to effectively remove heat generated from circuit components.
[0007] The objective of the present invention is to provide a cooling water leakage discharge structure that rapidly detects cooling water leaked from a cooling plate and rapidly discharges the leaked cooling water to the outside of the cooling plate, server, and / or server rack.
[0008] The aforementioned objective of the present invention is achieved by the specific details described below.
[0009] A cooling water leakage discharge structure according to an embodiment of the present invention is provided with a server, a printed circuit board provided on the server, and a cooling plate disposed on a chip of the printed circuit board, and is a cooling water leakage discharge structure for discharging cooling water leaked from the cooling plate to the outside of the cooling plate and the server, and includes an upper surface groove and an upper plate flow path provided on the cooling plate. The leaked cooling water flows into the upper surface groove and then moves to the upper plate flow path. The upper surface groove is formed on the upper surface of the upper plate of the cooling plate and is formed between an inlet protrusion and an outlet protrusion provided on the upper plate.
[0010] Specifically, the upper surface groove is formed by being sunk to a predetermined depth from the upper surface of the top plate toward the lower surface, and includes an inclined surface and a bottom surface. The inclined surface represents the inner side of the upper surface groove, and the bottom surface represents the surface forming the bottom of the upper surface groove.
[0011] Specifically, the inclined surface includes a first inclined surface, a second inclined surface, a third inclined surface, and a fourth inclined surface connected in sequence. The first inclined surface is closest to the side of the top plate than the second inclined surface, the third inclined surface, and the fourth inclined surface. Additionally, the second inclined surface is positioned toward the entrance protrusion, the third inclined surface is positioned opposite the first inclined surface, and the fourth inclined surface is positioned toward the exit protrusion. When looking down at the top surface groove from above, the bottom surface of the top surface groove is not located in the center of the top surface groove, but is located toward the first inclined surface.
[0012] Specifically, the top plate flow channel comprises an upper surface flow channel and a side flow channel. The upper surface flow channel is formed on the upper surface of the top plate of the cooling plate and communicates with the upper surface groove. The side flow channel is formed on the side of the top plate and communicates with the upper surface flow channel.
[0013] Specifically, a sensor unit is disposed on the bottom surface of the upper groove. The sensor unit detects leaked coolant.
[0014] A cooling water leakage discharge structure according to an embodiment of the present invention includes a server flow path. The server flow path is provided in a server, and leaked cooling water in the upper flow path of the cooling plate flows into it. The server flow path includes a support flow path, a guide flow path, and a connecting flow path connected in sequence.
[0015] Specifically, the support channel is formed in the shape of a pipe, inserted into the channel hole of the printed circuit board, and positioned below the side channel of the cooling plate.
[0016] Specifically, a guide channel is provided on the upper surface of a server support member provided on the server. A support channel is placed above one side of the guide channel, and a connecting channel is placed below the other side of the guide channel.
[0017] Specifically, one or more support channels are placed between one side and the other side of the guide channel.
[0018] Specifically, a support hole is formed in the server support, which is a hole through which the cooling water that has moved along the guide channel moves. The support hole is formed between two opposing side walls located on the other side of the guide channel.
[0019] Specifically, the connecting channel is formed in the shape of a pipe, and one end of the connecting channel is coupled to the lower surface of the server support. Additionally, the connecting channel is positioned below the support hole of the server support, and the through hole of the connecting channel communicates with the support hole.
[0020] Specifically, the guide channel is equipped with two side walls having a preset height. The two side walls are spaced apart by a preset distance and positioned to face each other. Both ends of the two side walls are connected to each other.
[0021] Specifically, multiple servers are provided. The multiple servers are stacked, and each server is equipped with a server flow path. One end of a rack pipe is connected to the connection flow path of the server positioned at the bottom among the multiple servers, and the other end of the rack pipe is positioned outside the server rack.
[0022] Specifically, the cooling plate includes an upper plate and a lower plate coupled to the upper plate. The upper plate includes an inlet for the inflow of cooling water and an outlet for the outflow of cooling water, and a plurality of cooling fins are arranged on the lower plate. Additionally, the upper plate further includes an inlet flow path communicating with the inlet, an outlet flow path communicating with the outlet, and an upper plate groove accommodating the plurality of cooling fins. The height of the cooling fins is equal to the depth of the upper plate groove.
[0023] Specifically, the upper plate groove and the lower plate include a fin area where a plurality of cooling fins are arranged and an edge area surrounding the fin area. Cooling water flowing into the interior of the upper plate groove passes between the cooling fins, reaches the edge area, and moves along the edge area.
[0024] Specifically, a pair of internal partitions are formed in the upper plate groove. The pair of internal partitions are formed between the pin area and the edge area corresponding to the horizontal direction of the upper plate groove, thereby partitioning the pin area and the edge area.
[0025] Specifically, a first group and a second group, each consisting of a plurality of cooling fins, are arranged between a pair of internal partitions. The longitudinal direction of the cooling fins is arranged parallel to the longitudinal direction of the internal partitions.
[0026] Specifically, in the pin area of the lower plate, the first group and the second group are spaced apart by a certain distance. The inlet flow path of the upper plate is located above the space where the first group and the second group are spaced apart.
[0027] The cooling water leakage discharge structure of the present invention is equipped with a sensor unit to quickly detect when cooling water leaks from the cooling plate and warns the user.
[0028] In addition, the cooling water leakage discharge structure of the present invention is provided with an upper surface groove and an upper plate flow path in the cooling plate so that leaked cooling water moves quickly to the outside of the cooling plate through the upper surface groove and the upper plate flow path.
[0029] In addition, the cooling water leakage discharge structure of the present invention is provided with a server flow path in the server so that leaked cooling water can move quickly to the outside of the server through the server flow path.
[0030] In addition, the cooling plate equipped with the cooling water leakage discharge structure of the present invention minimizes the pressure exerted by the cooling water on the cooling fins, thereby minimizing the overall power consumption of the cooling system.
[0031] In addition, the cooling plates distribute the flow rate of cooling water flowing between the cooling plates to reduce pressure loss and improve cooling efficiency.
[0032] The more detailed effects of the cooling water leakage discharge structure of the present invention are described in the specific details for implementing the invention below.
[0033] Figure 1 briefly illustrates multiple servers housed in a server rack.
[0034] FIGS. 2 and FIGS. 3 show the cooling water leakage discharge structure of the present invention equipped in the server of FIG. 1.
[0035] FIG. 4 is a perspective view showing the cooling plate of the present invention.
[0036] Figure 5 is a cross-sectional view of one side of the cooling plate shown in Figure 4.
[0037] Figure 6 is a plan view of the cooling plate shown in Figure 4.
[0038] Figure 7 shows the cooling water leakage discharge structure of the present invention deployed in a server.
[0039] Figure 8 shows the server Euro.
[0040] Figure 9 represents A in Figure 7.
[0041] Embodiments of the present invention will be described in more detail below with reference to the attached drawings. Regarding components of the present invention that can be clearly understood and easily reproduced by a person skilled in the art according to the prior art, specific descriptions thereof are omitted in order not to obscure the essence of the present invention.
[0042] The attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification, and the technical concept disclosed in this specification is not limited by the attached drawings.
[0043] A singular expression includes a plural expression unless the context clearly indicates otherwise.
[0044] Additionally, terms including ordinal numbers, such as first, second, etc., used herein may be used to describe various components, but said components should not be limited by said terms. Such terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.
[0045] Hereinafter, a structure for draining leakage of cooling water according to an embodiment of the present invention will be described.
[0046] Hereinafter, the ‘cooling water leakage discharge structure according to an embodiment of the present invention’ may be briefly referred to as the ‘leakage discharge structure of the present invention’.
[0047] FIG. 1 briefly illustrates a server rack (20) and a plurality of servers (21) housed in the server rack (20).
[0048] FIGS. 2 and FIGS. 3 illustrate the cooling water leakage discharge structure of the present invention provided in the server (21) of FIGS. 1. Specifically, FIGS. 2 shows two servers (21) housed in the server rack (20) of FIGS. 1, and FIGS. 3 briefly illustrates a plurality of stacked servers (21) and the components of the server (21). In FIGS. 2 and FIGS. 3, the server rack (20) is omitted.
[0049] A server rack (20) represents a frame (rack) designed to accommodate a server (21), network equipment, storage, etc. That is, the server rack (20) is a type of storage container in which a server (21), network equipment, etc. are stored, and is generally manufactured according to international standard specifications.
[0050] A server rack (20) accommodates one or more servers (21). Although multiple servers (21) are shown in FIGS. 1 to 3, only one server (21) may be provided in the server rack (20).
[0051] A server rack (20) is used to improve space utilization and management efficiency in a location where servers (21), etc. are placed. To elaborate, in a data center, etc., one or more servers (21) are mounted on a server rack (20), thereby improving space efficiency and allowing for the systematic management of heat generation issues and cables.
[0052] A server (21) is a computing and network device that provides specific services and performs data transmission and reception, data storage, data processing, etc. A large number of servers (21) may be provided in a data center.
[0053] A server (21) equipped in a data center includes a chip (212) such as a CPU (Central Processing Unit) or GPU (Graphic Processing Unit) which is a high heat source.
[0054] Since high heat is generated in the chip (212), such as the CPU or GPU, a cooling plate (10) is used to remove the heat.
[0055] The cooling plate (10) is a cooling device for removing (dissipating) heat generated from circuit components (e.g., chips (212)) in a printed circuit board (PCB) (211) of an electrical and electronic device.
[0056] For example, a cooling plate (10) is attached to the upper surface of a chip (212), such as a CPU or GPU, which is a high heat source of a server (21) equipped in a data center, to cool the high heat source.
[0057] Cooling water with a low temperature flows into the cooling plate (10), and cooling water with a higher temperature that undergoes heat exchange inside the cooling plate (10) flows out from the cooling plate (10).
[0058] If cooling water leaks from the cooling plate (10), not only are circuit components damaged, but it is also difficult to restore the electrical and electronic device to a normal state, resulting in massive damage.
[0059] The leakage discharge structure of the present invention relates to a drainage structure for discharging leaked cooling water to the outside of the cooling plate (10), server (21) and / or server rack (20) when cooling water moving inside the cooling plate (10) leaks from the cooling plate (10).
[0060] The leakage discharge structure of the present invention is provided in a server (21) disposed in a server rack (20), a printed circuit board (211) provided in the server (21), and a cooling plate (10) disposed on a chip (212) of the printed circuit board (211).
[0061] In other words, the cooling plate (10), the printed circuit board (211), and the server (21) are equipped with the leakage discharge structure of the present invention. The ‘printed circuit board (211)’ may be briefly referred to as ‘board (211)’ below.
[0062] Referring to FIGS. 2 and FIGS. 3, the server (21) includes a substrate (211) and a cooling plate (10), and includes a server support member (213) that supports the substrate (211).
[0063] A chip (212), such as a CPU or GPU, which is a high heat source, is placed on the substrate (211). A cooling plate (10) is placed on the upper surface of the chip (212).
[0064] Since the cooling plate (10) of the present invention has an excellent leakage discharge structure and effectively removes heat generated from circuit components (e.g., chip (212)), the structure of the cooling plate (10) is also described.
[0065] Referring to FIGS. 4 to 6, the cooling plate (10) includes an upper plate (11) and a lower plate (12). FIGS. 4 to 6 illustrate the cooling plate (10) of the present invention. In FIG. 6, the dotted lines indicate the lower plate (12) and cooling fins (121), etc., placed inside or below the upper plate (11).
[0066] The cooling plate (10) is formed by combining the upper plate (11) and the lower plate (12).
[0067] The top plate (11) and the bottom plate (12) form the outer shape of the cooling plate (10). That is, the outer shape of the cooling plate (10) is formed by combining the outer shape of the top plate (11) and the outer shape of the bottom plate (12). The top plate (11) and the bottom plate (12) serve as the case of the cooling plate (10).
[0068] The cooling plate (10) has an internal space (10s).
[0069] Specifically, when the top plate (11) and the bottom plate (12) are combined, an internal space (10s) is formed between the top plate (11) and the bottom plate (12). A cooling fin (121), which will be described later, is placed in the internal space (10s).
[0070] The part where the top plate (11) and the bottom plate (12) are joined is sealed. Accordingly, cooling water is prevented from leaking between the top plate (11) and the bottom plate (12).
[0071] The top plate (11) of the present invention may be provided in a plate shape having a preset size and a preset thickness. The preset size refers to a size having a length and width that constitute a two-dimensional plane. The width represents the X direction in FIG. 4, the length represents the Y direction in FIG. 4, and the thickness direction of the top plate (11) represents the Z direction in FIG. 4.
[0072] The top plate (11) includes an upper surface (11a), a lower surface (11b), and a side surface (11c). The side surface (11c) is a surface connecting the upper surface (11a) and the lower surface (11b), and is a surface forming the thickness between the upper surface (11a) and the lower surface (11b).
[0073] The upper surface (11a), lower surface (11b), and side surface (11c) of the top plate (11) may include steps, curves, grooves, or holes as needed.
[0074] The top plate (11) has a top plate groove (111).
[0075] The upper plate groove (111) is formed on the lower surface (11b) of the upper plate (11) and is formed by being sunk to a predetermined depth from the lower surface (11b) of the upper plate (11) toward the upper surface (11a).
[0076] To elaborate, the opening of the top plate groove (111) is formed on the lower surface (11b), and the bottom surface of the top plate groove (111) is formed on the upper surface (11a) side (opposite side of the opening). Since the opening of the top plate groove (111) is located at the bottom, the bottom surface of the top plate groove (111) may correspond to the ceiling surface.
[0077] The upper plate groove (111) faces the lower plate (12). Specifically, the lower plate (12) is joined to the lower surface (11b) of the upper plate (11) and covers the upper plate groove (111). That is, the lower plate (12) covers the opening of the upper plate groove (111).
[0078] When the top plate (11) and the bottom plate (12) are combined, the top plate groove (111) becomes the internal space (10s) of the cooling plate (10).
[0079] The top plate groove (111) has a preset size and a preset depth. The preset size refers to a size having a length of the width and height that constitute a two-dimensional plane. The width represents the X direction in FIG. 5, the height represents the Y direction in FIG. 6, and the depth of the top plate groove (111) represents the Z direction in FIG. 5.
[0080] The top plate groove (111) includes a pin area (111a) and an edge area (111b) surrounding the pin area (111a). In other words, the top plate groove (111) can be divided into a pin area (111a) and an edge area (111b). The pin area (111a) is located within the edge area (111b).
[0081] When the top plate (11) and the bottom plate (12) are combined, a plurality of cooling fins (121) are arranged in the fin area (111a), and the edge area (111b) becomes an empty space. The edge area (111b) becomes a channel through which cooling water flows.
[0082] Cooling water flowing into the interior of the upper plate groove (111) through the inlet (112h) passes between the cooling fins (121) and reaches the edge area (111b), and flows along the edge area (111b) to reach the outlet (113h). The cooling water moves to the outside of the cooling plate (10) through the outlet (113h).
[0083] The cooling plate (10) of the present invention is equipped with an inlet (112h) and an outlet (113h).
[0084] The inlet port (112h) is a hole through which cooling water flows into the interior of the cooling plate (10), and the outlet port (113h) is a hole through which cooling water flows out to the exterior of the cooling plate (10).
[0085] The upper surface (11a) of the top plate (11) may have a plurality of protrusions (112, 113) formed thereon (see FIG. 1). The protrusions (112, 113) are formed by protruding upward from the upper surface (11a) of the top plate (11) and have a space inside. The exterior of the protrusions (112, 113) may be made of a polyhedron.
[0086] Multiple protrusions (112, 113) include an inlet protrusion (112) and an outlet protrusion (113).
[0087] The entrance protrusion (112) is formed in the middle area of the top plate (11) in the horizontal direction (X direction in FIG. 5) of the top plate (11). And the exit protrusion (113) can be formed on one side (e.g., the right side) of the top plate (11) in the horizontal direction (X direction in FIG. 5) of the top plate (11).
[0088] The inlet protrusion (112) is formed above the inlet passage (112b) (see FIG. 5) described later, and the internal space (112s) of the inlet protrusion (112) communicates with the inlet passage (112b). Also, the inlet port (112h) is formed on one side of the inlet protrusion (112) and penetrates one side of the inlet protrusion (112) to communicate with the internal space (112s) of the inlet protrusion (112).
[0089] The outlet protrusion (113) is formed above the outlet channel (113b) (see FIG. 3) described later, and the internal space (113s) of the outlet protrusion (113) communicates with the outlet channel (113b). Additionally, the outlet port (113h) is formed on one side of the outlet protrusion (113) and penetrates one side of the outlet protrusion (113) to communicate with the internal space (113s) of the outlet protrusion (113).
[0090] One side of the inlet protrusion (112) in which the inlet (112h) is formed and one side of the outlet protrusion (113) in which the outlet (113h) is formed face each other.
[0091] The internal space (112s, 113s) of the inlet protrusion (112) and the outlet protrusion (113) may have a volume that gradually decreases as the inlet protrusion (112) and the outlet protrusion (113) protrude in the direction of protrusion. Also, the inlet port (112h) may be formed on the upper side of one side of the inlet protrusion (112), and the outlet port (113h) may be formed on the upper side of one side of the outlet protrusion (113).
[0092] Cooling water flows into the internal space (112s) of the inlet protrusion (112) through the inlet port (112h) and then moves to the upper plate groove (111) via the inlet flow path (112b). After moving between the cooling fins (121) in the upper plate groove (111), the cooling water passes through the edge region (111b) of the upper plate groove (111) and then moves to the outside of the cooling plate (10) of the present invention via the outlet flow path (113b), the internal space (113s) of the outlet protrusion (113), and the outlet port (113h) in sequence.
[0093] Meanwhile, the cooling plate (10) of the present invention is provided with an inlet flow path (112b) and an outlet flow path (113b).
[0094] The inlet channel (112b) and outlet channel (113b) are formed in the top plate (11) and are spaces through which cooling water flows.
[0095] The inlet passage (112b) communicates with the internal space (112s) of the inlet protrusion (112), and the outlet passage (113b) communicates with the internal space (113s) of the outlet protrusion (113). Accordingly, the inlet passage (112b) is formed on the inlet protrusion (112) or the inlet side, and the outlet passage (113b) is formed on the outlet protrusion (113) or the outlet side.
[0096] An inlet channel (112b) is formed in the center area of the upper plate groove (111) in the horizontal direction of the upper plate (11) (X direction in FIG. 5). An outlet channel (113b) may be formed on one side (e.g., the right side) of the upper plate groove (111) in the horizontal direction of the upper plate (11) (X direction in FIG. 5) (see FIG. 4 to 6).
[0097] The inlet channel (112b) and the outlet channel (113b) may have a width that is preset in one direction and a length that is preset in a direction that is horizontally orthogonal to the one direction. The one direction is indicated by the X direction in FIG. 6, and the direction that is horizontally orthogonal to the one direction is indicated by the Y direction in FIG. 6.
[0098] And, the inlet channel (112b) and the outlet channel (113b) can be formed by being sunk to a predetermined depth from the bottom surface of the top plate groove (111) toward the top surface (11a) (in the Z direction in FIG. 5).
[0099] Below the exit channel (113b), the edge area (111b) of the top plate groove (111) is located.
[0100] The top plate (11) is provided with a pair of internal partitions (111c) (see FIG. 6).
[0101] A pair of internal partitions (111c) are formed in the upper plate groove (111).
[0102] The internal partition (111c) is formed with a predetermined length (height) from the bottom surface of the upper plate groove (111) toward the opening of the upper plate groove (111) (toward the lower plate (12)). The height of the internal partition (111c) may be equal to the depth of the upper plate groove (111).
[0103] An internal partition (111c) is formed between the pin area (111a) and the edge area (111b) to partition the pin area (111a) and the edge area (111b). However, the internal partition (111c) is not formed in all places between the pin area (111a) and the edge area (111b).
[0104] Specifically, a pair of internal partitions (111c) are formed only in the horizontal direction (X direction in FIG. 6) of the upper plate groove (111) and are not formed in the vertical direction (Y direction in FIG. 6) of the upper plate groove (111).
[0105] To elaborate, a pair of internal partitions (111c) are formed between the pin area (111a) and the edge area (111b) corresponding to the horizontal direction of the top plate groove (111), and are not formed between the pin area (111a) and the edge area (111b) corresponding to the vertical direction of the top plate groove (111).
[0106] A pair of internal partitions (111c) are spaced apart by the distance of the pin area (111a) corresponding to the vertical direction of the top plate groove (111).
[0107] The inner partition (111c) has a predetermined length in the horizontal direction of the upper plate groove (111). To elaborate, the inner partition (111c) is formed to the length of the pin area (111a) corresponding to the horizontal direction of the upper plate groove (111) within the pin area (111a) of the upper plate groove (111).
[0108] The internal partition (111c) blocks the cooling water flowing into the upper plate groove (111) from flowing directly to the edge area (111b) of the upper plate groove (111) without passing between the cooling fins (121) described later.
[0109] A pair of internal partitions (111c) allow the entire amount of cooling water flowing into the upper plate groove (111) to pass between the cooling fins (121), thereby maximizing the cooling efficiency of the cooling plate (10).
[0110] In FIG. 4, reference numeral 112a indicates an inlet connection (112a), and reference numeral 113a indicates an outlet connection (113a).
[0111] One end of the inlet connection part (112a) is connected to the water inlet (112h), and the other end is connected to the pipe (first pipe) (30) (see FIG. 2). That is, the inlet connection part (112a) is positioned between the water inlet (112h) and the first pipe (30) and is a component that connects the water inlet (112h) and the first pipe (30). Cooling water with a low temperature flows into the cooling plate (10) through the first pipe (30).
[0112] And, one end of the outlet connection part (113a) is connected to the water outlet (113h), and the other end is connected to the pipe (second pipe) (31) (see FIG. 2). That is, the outlet connection part (113a) is positioned between the water outlet (113h) and the second pipe (31) and is a member that connects the water outlet (113h) and the second pipe (31). Cooling water, whose temperature has been raised by heat exchange inside the cooling plate (10), moves to the outside of the cooling plate (10) through the second pipe (31).
[0113] The inlet connection (112a) and the outlet connection (113a) are positioned at an angle. Accordingly, leaked coolant flows along the inlet connection (112a) and / or the outlet connection (113a) to their lower parts and falls into the upper groove (114).
[0114] The cooling plate (10) of the present invention has an upper surface groove (114) and an upper plate flow path (115).
[0115] The upper surface groove (114) and the upper plate flow path (115) are cooling water leakage discharge structures of the cooling plate (10).
[0116] The upper groove (114) accommodates leaked cooling water.
[0117] The leaked coolant refers to coolant leaking from the inlet protrusion (112) and / or outlet protrusion (113) of the cooling plate (10).
[0118] Specifically, the leaked coolant includes coolant that leaked out between the inlet port (112h) and the inlet connection (112a) and / or between the inlet connection (112a) and the first pipe (30), and also includes coolant that leaked out between the outlet port (113h) and the outlet connection (113a) and / or between the outlet connection (113a) and the second pipe (31).
[0119] The upper groove (114) receives the leaked coolant. The leaked coolant in the upper groove (114) moves to the outside of the cooling plate (10), server (21), and server rack (20) through separate channels (115, 22, 23) described later, so it does not move to the substrate (211) of the server (21).
[0120] The upper surface groove (114) is formed on the upper surface (11a) of the top plate (11). Specifically, the upper surface groove (114) is formed between the inlet protrusion (112) and the outlet protrusion (113).
[0121] An inlet connection part (112a) and an outlet connection part (113a) are arranged on the upper part of the upper groove (114).
[0122] The upper surface groove (114) is formed by being sunk to a predetermined depth from the upper surface (11a) of the top plate (11) toward the lower surface (11b). The inner side of the upper surface groove (114) is formed at an angle.
[0123] The upper groove (114) includes an inclined surface (114a-114d) and a bottom surface (114e).
[0124] The inclined surfaces (114a-114d) represent the inner sides of the upper groove (114), and the bottom surface (114e) represents the surface forming the bottom of the upper groove (114).
[0125] The inclined surfaces (114a-114d) include a first inclined surface (114a), a second inclined surface (114b), a third inclined surface (114c), and a fourth inclined surface (114d) connected in sequence.
[0126] In this specification, 'first inclined surface (114a), second inclined surface (114b), third inclined surface (114c) and fourth inclined surface (114d)' may be briefly referred to as 'first to fourth inclined surfaces (114a-114d)'.
[0127] The upper portion of each of the first to fourth inclined surfaces (114a-114d) is connected to the upper surface (11a) of the top plate (11), and the lower portion of each of the first to fourth inclined surfaces (114a-114d) is connected to the bottom surface (114e) of the upper surface groove (114). The surface between the upper portion and the lower portion is an inclined surface and may include a curved surface. Cooling water that falls onto the first to fourth inclined surfaces (114a-114d) flows to the bottom surface (114e) of the upper surface groove (114).
[0128] The bottom surface (114e) of the upper groove (114) is located close to the first inclined surface (114a). To elaborate, when looking down at the upper groove (114) from above, the bottom surface (114e) of the upper groove (114) is not located in the center of the upper groove (114), but is located towards the first inclined surface (114a).
[0129] The first slope (114a) is the slope closest to the side (11c) of the top plate (11) compared to the other slopes (114b, 114c, 114d).
[0130] The angle of inclination of the first inclined surface (114a) may be 90° or an angle approximate thereto. The angle of inclination of the first inclined surface (114a) is formed to be greater than the angle of inclination of the other inclined surfaces (114b-114d).
[0131] The second inclined surface (114b), the third inclined surface (114c), and the fourth inclined surface (114d) are arranged in a clockwise direction with respect to the first inclined surface (114a) (in order).
[0132] The first slope (114a) and the third slope (114c) face each other, and the second slope (114b) and the fourth slope (114d) face each other. In other words, the first slope (114a) and the third slope (114c) are located opposite each other, and the second slope (114b) and the fourth slope (114d) are located opposite each other.
[0133] The second inclined surface (114b) is positioned toward the entrance protrusion (112), and the fourth inclined surface (114d) is positioned toward the exit protrusion (113).
[0134] The shortest distance between the upper and lower parts of the third slope (114c) is formed to be longer than the shortest distance between the upper and lower parts of the other slopes (114a, 114b, 114d).
[0135] And, the shortest distance between the upper and lower parts of the second slope (114b) may be the same as the shortest distance between the upper and lower parts of the fourth slope (114d).
[0136] And, the shortest distance between the upper and lower parts of the first slope (114a) is formed to be shorter than the shortest distance between the upper and lower parts of the other slopes (114b-114d).
[0137] Due to the structure of the first to fourth inclined surfaces (114a-114d) described above, the leaked cooling water in the first to fourth inclined surfaces (114a-114d) moves rapidly toward the first inclined surface (114a) or the side (11c) of the top plate (11). This is to allow the cooling water in the top surface groove (114) to move rapidly toward the top plate flow path (115).
[0138] According to an embodiment of the present invention, each of the first to fourth inclined surfaces (114a-114d) may be formed of two or more inclined surfaces with the same or different inclination angles.
[0139] Meanwhile, the upper plate Euro (115) is a passage through which cooling water flows.
[0140] The cooling water on the bottom surface (114e) of the upper surface groove (114) moves to the underside of the cooling plate (10) through the upper plate flow path (115).
[0141] To elaborate, the cooling water in the upper groove (114) moves through the upper plate flow path (115) to the server flow path (22) described later.
[0142] The top plate Euro (115) is equipped with a top surface Euro (115a) and a side Euro (115b).
[0143] The upper surface channel (115a) is formed on the upper surface (11a) of the upper plate (11) and communicates with the upper surface groove (114).
[0144] The upper surface channel (115a) has a preset length and width. The upper surface channel (115a) is formed by being sunk to a preset depth from the upper surface (11a) of the top plate (11) toward the lower surface (11b).
[0145] The preset length of the upper surface channel (115a) represents the length from the first inclined surface (114a) of the upper surface groove (114) to the side (11c) of the upper plate (11). At this time, the side (11c) of the upper plate (11) represents the side closest to the first inclined surface (114a).
[0146] One end of the upper surface channel (115a) is formed on the first inclined surface (114a) of the upper surface groove (114). Accordingly, the upper surface channel (115a) and the upper surface groove (114) are connected.
[0147] The first inclined surface (114a) is divided into two by one end of the upper surface channel (115a). The other end of the upper surface channel (115a) is formed on the side (11c) of the upper plate (11).
[0148] The preset width of the upper surface channel (115a) may be equal to or greater than the width of the bottom surface (114e) of the upper surface groove (114). Accordingly, the coolant that has moved to the bottom surface (114e) of the upper surface groove (114) can move quickly to the upper surface channel (115a) without accumulating in the upper surface groove (114).
[0149] The preset depth of the upper surface channel (115a) may be equal to or greater than the depth of the upper surface groove (114). Accordingly, the coolant in the upper surface groove (114) can move quickly to the upper surface channel (115a) without accumulating in the upper surface groove (114).
[0150] The bottom surface of the upper channel (115a) can be formed at an angle. Additionally, the preset depth of the upper channel (115a) can gradually increase from one end of the upper channel (115a) to the other end. Accordingly, the cooling water that reaches one end of the upper channel (115a) can quickly move to the other end of the upper channel (115a).
[0151] The side channel (115b) is formed on the side (11c) of the top plate (11) and communicates with the upper channel (115a). The side (11c) of the top plate (11) refers to the side closest to the first inclined surface (114a) of the upper groove (114).
[0152] The side channel (115b) has a preset length and width. The side channel (115b) is formed by being sunk to a preset depth from the side (11c) of the top plate (11) toward the opposite side (11c).
[0153] The preset length of the side Euro (115b) may be equal to the length (height) of the side (11c) of the top plate (11) or the side of the cooling plate (10) (top plate (11) and bottom plate (12)).
[0154] According to an embodiment of the present invention, when the lower plate (12) is inserted into a groove formed on the lower surface (11b) of the upper plate (11), the length (height) of the side (11c) of the upper plate (11) becomes equal to the length (height) of the side (11c) of the cooling plate (10).
[0155] One end of the side channel (115b) is formed at the other end of the upper channel (115a). Accordingly, the side channel (115b) and the upper channel (115a) are connected. The other end of the side channel (115b) is formed on the lower surface (11b) of the upper plate (11) (cooling plate (10)).
[0156] The preset width of the side channel (115b) may be equal to or greater than the width of the top channel (115a), and the preset depth of the side channel (115b) may be equal to or greater than the depth of the top channel (115a). Accordingly, the coolant in the top channel (115a) can move quickly to the side channel (115b) without accumulating in the top channel (115a).
[0157] The cooling plate (10) of the present invention may include a sensor part (116) for detecting leaked cooling water.
[0158] The sensor unit (116) is positioned on the bottom surface (114e) of the upper groove (114). Accordingly, when leaked coolant reaches the bottom surface (114e) of the upper groove (114), the sensor unit (116) can quickly detect the leak of coolant.
[0159] The sensor unit (116) is a sensor that detects leaked coolant and generates a signal by detecting the coolant.
[0160] The leaked coolant travels along the inclined surfaces (114a-114d) of the upper groove (114) and reaches the bottom surface (114e) of the upper groove (114), coming into contact with the sensor part (116).
[0161] When the sensor unit (116) detects leaked coolant, it can warn the user through the server rack (20) or a separate device. Accordingly, the safety of the data center is improved, and damage to the data center's servers (21), etc., is prevented.
[0162] The sensor unit (116) may be a known moisture detection sensor. A detailed description of the sensor unit (116) is omitted.
[0163] A groove in which a sensor part (116) is disposed can be formed on the bottom surface (114e) of the upper surface groove (114).
[0164] As shown in FIG. 4, the sensor part (116) can be positioned to protrude upward from the bottom surface (114e) of the upper surface groove (114).
[0165] Alternatively, according to an embodiment of the present invention which is not illustrated, the sensor portion (116) may not protrude above the bottom surface (114e) of the upper groove (114), and the upper surface of the sensor portion (116) may be provided lower than the bottom surface (114e) of the upper groove (114). Accordingly, the cooling water reaching the bottom surface (114e) of the upper groove (114) inevitably flows toward the sensor portion (116) and comes into contact with the upper surface and / or side of the sensor portion (116).
[0166] The bottom plate (12) of the present invention may be provided in a plate shape having a preset size and a preset thickness. The preset size refers to a size having a length of width and length constituting a two-dimensional plane. The width represents the X direction in FIGS. 4 to 6, the length represents the Y direction in FIGS. 4 and 6, and the thickness direction of the bottom plate (12) represents the Z direction in FIGS. 4 and 5.
[0167] The bottom plate (12) includes an upper surface, a lower surface, and a side surface. The side surface is a surface connecting the upper surface and the lower surface, and is a surface forming the thickness between the upper surface and the lower surface.
[0168] The upper, lower, and side surfaces of the bottom plate (12) may include steps, curves, and grooves as needed.
[0169] The upper surface of the lower plate (12) faces the lower surface (11b) of the upper plate (11). The upper surface of the lower plate (12) covers the opening of the upper plate groove (111).
[0170] The lower plate (12) is placed in the lower plate insertion groove (not labeled) formed on the lower surface (11b) of the upper plate (11) (see FIG. 5).
[0171] The bottom plate insertion groove is a groove that is recessed to a predetermined depth from the lower surface (11b) of the top plate (11) toward the upper surface (11a). The overall shape of the edge of the bottom plate insertion groove corresponds to the overall shape of the edge of the bottom plate (12). Accordingly, the bottom plate (12) is inserted into the bottom plate insertion groove of the top plate (11).
[0172] Cooling fins (121) are arranged or formed on the upper surface of the lower plate (12), and the lower surface of the lower plate (12) contacts the upper surface of a chip (212), such as a CPU or GPU.
[0173] Referring to FIGS. 5 and 6, the bottom plate (12) includes a pin area (12a) corresponding to the pin area (111a) of the top plate groove (111), and also includes an edge area (12b) corresponding to the edge area (111b) of the top plate groove (111). The pin area (12a) and the edge area (12b) are formed on the upper surface of the bottom plate (12).
[0174] The pin area (12a) of the bottom plate (12) is located below the pin area (111a) of the top plate groove (111), and the edge area (12b) of the bottom plate (12) is located below the edge area (111b) of the top plate groove (111). Accordingly, the pin area (12a) of the bottom plate (12) is located within the edge area (12b).
[0175] A plurality of cooling fins (121) are arranged or formed in the fin area (12a) of the bottom plate (12).
[0176] The edge area (12b) of the bottom plate (12) is an empty space and becomes a channel through which coolant flows.
[0177] The internal space (10s) of the cooling plate (10) of the present invention may be divided into a fin area and an edge area. The fin area of the cooling plate (10) is formed by combining the fin area (111a) of the upper plate groove (111) and the fin area (12a) of the lower plate (12), and the edge area of the cooling plate (10) is formed by combining the edge area (111b) of the upper plate groove (111) and the edge area (12b) of the lower plate (12).
[0178] The cooling plate (10) of the present invention is equipped with a plurality of cooling fins (121).
[0179] The cooling fin (121) can be connected to the bottom plate (12) or formed on the bottom plate (12).
[0180] The cooling fin (121) is formed by extending upward from one side (e.g., the upper side) of the lower plate (12) for a predetermined length.
[0181] The cooling fins (121) can be formed, for example, by a skiving method.
[0182] Referring to FIGS. 5 and 6, the cooling fin (121) is formed in a plate shape having a preset size and a preset thickness. The preset size refers to a size having a length and width that constitute a two-dimensional plane. The width represents the X direction in FIGS. 5 and 6, the height represents the Z direction in FIG. 5, and the thickness direction of the cooling fin (121) represents the Y direction in FIG. 6.
[0183] The horizontal length of the cooling fin (121) can be formed to be longer than the vertical length.
[0184] The vertical length (height of the cooling fin (121)) of the cooling fin (121) may be equal to the depth of the upper plate groove (111). Accordingly, the cooling water flowing into the upper plate groove (111) cannot flow over the cooling fin (121) but moves through the spaces between the cooling fins (121) and the edge area (111b).
[0185] The thickness of the cooling fins (121) may be the same or different.
[0186] Additionally, the spacing between the cooling fin (121) and the adjacent cooling fin (121) may be the same or different.
[0187] Additionally, for example, the distance between the cooling fins (121) in area A may be different from the distance between the cooling fins (121) in area B. In this case, the distance between the cooling fins (121) in area A may be constant, and the distance between the cooling fins (121) in area B may also be constant.
[0188] In the present invention, the ‘horizontal length direction of the cooling fin (121)’ can be briefly named the ‘length direction of the cooling fin (121)’ and represents the X direction in FIG. 5 and FIG. 6.
[0189] In the fin area (12a) of the bottom plate (12), a plurality of cooling fins (121) can be arranged in a plurality of groups (121a, 121b).
[0190] That is, the cooling plate (10) of the present invention may be provided with a plurality of groups composed of a plurality of cooling fins (121).
[0191] Multiple groups (121a, 121b) may include a first group (121a) and a second group (121b). The first group (121a) and the second group (121b) are placed between a pair of internal partitions (111c).
[0192] Each of the first group (121a) and the second group (121b) is composed of a plurality of cooling fins (121).
[0193] In the first group (121a) and the second group (121b), each of the plurality of cooling fins (121) is arranged in one direction. The one direction represents the transverse direction (length direction) of the cooling fins (121).
[0194] To elaborate, the cooling fin (121) is arranged so that the horizontal side of the cooling fin (121) is parallel to the X direction in FIGS. 5 and 6.
[0195] The cooling fin (121) has a preset length in the horizontal direction of the top plate groove (111).
[0196] The longitudinal direction of the cooling fin (121) may be parallel to the longitudinal direction of the internal partition (111c).
[0197] In the first group (121a) and the second group (121b), a plurality of cooling fins (121) are arranged in a line in a different direction. The other direction represents a direction that is horizontally orthogonal to the direction and represents the thickness direction of the cooling fins (121) (e.g., the Y direction in FIG. 6).
[0198] The first group (121a) and the second group (121b) are arranged side by side in one direction (e.g., the X direction in FIGS. 5 and 6) and spaced apart by a certain distance.
[0199] The space (121s) between the first group (121a) and the second group (121b) is located within the pin area (12a) of the bottom plate (12).
[0200] The inlet passage (112b) of the top plate (11) is positioned above the area (121s) separated from the first group (121a) and the second group (121b). Accordingly, the cooling water introduced into the inlet passage (112b) through the inlet port (112h) flows to the area (121s) separated from the first group (121a) and the second group (121b).
[0201] And the cooling water flows into the first group (121a) and the second group (121b), and flows between the multiple cooling fins (121) in the first group (121a) and the second group (121b).
[0202] Cooling water in the space (121s) separated from the first group (121a) and the second group (121b) cannot move directly to the edge region (111b) by means of a pair of internal partitions (111c), but flows between the multiple cooling fins (121) in the first group (121a) and the second group (121b) and then moves to the edge region (111b) (see FIGS. 5 and 6).
[0203] Accordingly, the cooling water flowing into the space (121s) where the first group (121a) and the second group (121b) are separated passes entirely between the cooling fins (121), so the cooling efficiency of the cooling plate (10) is improved.
[0204] Then, the cooling water passes through the edge area (111b) of the upper plate groove (111), the outlet channel (113b), the internal space (113s) of the outlet protrusion (113), and the outlet port (113h) in sequence, and moves to the outside of the cooling plate (10) of the present invention.
[0205] The inlet (112h) may be positioned in the middle of the spaced-apart location (121s) between the first group (121a) and the second group (121b). The middle of the spaced-apart location (121s) represents the middle in the Y direction of the pin area (111a) shown in FIG. 6.
[0206] Below the separated portion (121s) of the first group (121a) and the second group (121b), a high-heat circuit component (e.g., a chip (212) such as a CPU or GPU) may be placed, or a portion of the circuit component that generates high heat may be placed.
[0207] Accordingly, the cooling water coming out of the inlet (112h) strikes the lower plate (12) on the high-heat circuit component or the part where high heat is generated, so the cooling efficiency of the cooling plate (10) can be further increased.
[0208] The horizontal length of the cooling fin (121) in the first group (121a) and the horizontal length of the cooling fin (121) in the second group (121b) may be the same or different. Accordingly, the positions of the separated part (121s), the inlet protrusion (112), and the water inlet (112h) of the first group (121a) and the second group (121b) may be changed.
[0209] Meanwhile, the server (21) and the server rack (20) are equipped with the cooling water leakage discharge structure of the present invention.
[0210] Referring to FIGS. 2, FIGS. 3, FIGS. 7 through 9, the server (21) includes a server support (213).
[0211] A substrate (211) is placed on a server support (213). To elaborate, the server support (213) supports the substrate (211). For reference, the substrate (211) is omitted in FIG. 7.
[0212] The server support (213) is formed in the shape of a plate of a preset size.
[0213] The upper surface of the server support (213) and the substrate (211) are spaced apart by a preset distance. Although not shown in the drawing, a component supporting the substrate (211) may be placed between the upper surface of the server support (213) and the substrate (211).
[0214] The server (21) is equipped with a server Euro (22).
[0215] The server Euro (22) is a passage through which leaked coolant travels.
[0216] After the leaked coolant passes through the upper plate flow path (115) of the cooling plate (10), it moves to the outside of the server (21) and server rack (20) via the server flow path (22).
[0217] The server Euro (22) includes a support Euro (221), a guide Euro (222), and a connection Euro (23).
[0218] The support channel (221), the guide channel (222), and the connecting channel (23) are in communication with each other.
[0219] The support channel (221) is formed in the shape of a pipe.
[0220] The support channel (221) has a preset length and has a through hole in the longitudinal direction. Leaked coolant moves downward through the through hole of the support channel (221).
[0221] The support Euro (221) can be positioned vertically or at an angle close to the vertical.
[0222] To elaborate, the longitudinal direction of the support channel (221) can be positioned parallel to the vertical, or it can be positioned at an angle close to the vertical. Here, "close to" indicates an angle that is not parallel to the vertical but is close to it.
[0223] The support channel (221) includes a first end and a second end. The first end and the second end are ends positioned opposite each other in the longitudinal direction of the support channel (221).
[0224] One end of the support channel (221) faces upward, and the other end of the support channel (221) faces downward.
[0225] The support channel (221) is positioned below the side channel (115b) of the top channel (115). The coolant in the side channel (115b) enters one end of the support channel (221) and moves to the other end of the support channel (221), but does not exit to the outside of the support channel (221) and move to the upper surface of the substrate (211).
[0226] A channel hole (211h) is formed in the substrate (211) (see FIG. 3). The channel hole (211h) is a hole that penetrates the substrate (211) and is located below the side channel (115b) of the top channel (115).
[0227] The support channel (221) is inserted and positioned into the channel hole (211h) formed in the substrate (211). To elaborate, the support channel (221) is fitted into the channel hole (211h).
[0228] When the support channel (221) is placed in the channel hole (211h) of the substrate (211), one end of the support channel (221) is located on the upper surface of the substrate (211), and the other end of the support channel (221) is located below the lower surface of the substrate (211).
[0229] The other end of the support channel (221) is located above or inside the guide channel (222). Accordingly, the coolant passing through the other end of the support channel (221) moves to the guide channel (222).
[0230] One or more flow channel holes (211h) of the substrate (211) may be formed depending on the number of cooling plates (10), and a support flow channel (221) may be arranged for each flow channel hole (211h).
[0231] The guide path (222) guides the movement of leaked coolant (see FIG. 3, FIG. 7 to 9).
[0232] To elaborate, the guide channel (222) guides the movement of the coolant so that the coolant passing through the support channel (221) moves to the connecting channel (23). That is, the coolant in the support channel (221) moves to the connecting channel (23) via the guide channel (222).
[0233] The guide Euro (222) is provided on the upper surface of the server support (213).
[0234] The guide channel (222) has a preset length and is provided with one side and the other side. The one side and the other side are located on opposite sides in the longitudinal direction of the guide channel (222).
[0235] A support channel (221) is positioned above one side of the guide channel (222). Additionally, one or more support channels (221) may be positioned between one side and the other side of the guide channel (222). The support channels (221) are inserted into the channel holes (211h) of the substrate (211). The number of support channels (221) depends on the number of cooling plates (10).
[0236] The other side of the guide Euro (222) can be positioned at the edge of the server support (213).
[0237] A connecting channel (23) is positioned below the other side of the guide channel (222).
[0238] Depending on the number and location of the cooling plates (10), the leaked cooling water can move from one side of the guide channel (222) to the other side, or from any point between one side and the other side of the guide channel (222) to the other side.
[0239] The guide channel (222) has two side walls (222a, 222b) with a preset height. The two side walls (222a, 222b) are spaced apart by a preset distance.
[0240] Two side walls (222a, 222b) are positioned to face each other. And since both ends of the two side walls (222a, 222b) are connected to each other, the guide channel (222) forms a closed loop.
[0241] The distance between the two side walls (222a, 222b) facing each other corresponds to the width of the guide channel (222).
[0242] The structure of the guide channel (222) may include the first, second, and third embodiments below.
[0243] According to the first embodiment, each of the two side walls (222a, 222b) may extend upward from the upper surface of the server support (213) to a preset height. In this embodiment, the two side walls may be formed integrally with the server support (213).
[0244] Alternatively, according to a second embodiment, the two side walls (222a, 222b) may be manufactured separately from the server support (213) and then joined to the upper surface of the server support (213). Each of the two side walls (222a, 222b) is erected on the upper surface of the server support (213).
[0245] In the second embodiment, the lower portion of the side walls (222a, 222b) and the upper surface of the server support (213) are joined without gaps. At this time, an adhesive member made of silicon material may be used. The adhesive member blocks or fills the gaps.
[0246] In the first and second embodiments, the other end of the support channel (221) is located between or on the two side walls (222a, 222b). Accordingly, the coolant passing through the other end of the support channel (221) moves between the two side walls (222a, 222b) and on the upper surface of the server support (213).
[0247] Or, according to a third embodiment (not shown), the guide channel (222) may be composed of a bottom plate and two side walls (222a, 222b).
[0248] The cross-sectional shape of the guide channel (222) may be similar to a 'U' shape.
[0249] The bottom plate is flat and has a preset thickness, width, and length.
[0250] The bottom plate can be formed long like a single long strip, passing under one or more flow holes (211h) formed in the substrate (211) and extending to the connecting flow channel (23).
[0251] Two side walls (222a, 222b) are located at the edges of the bottom plate.
[0252] One end of each of the two side walls (222a, 222b) is connected to the edge of the bottom plate, and one side of the side walls (222a, 222b) may be positioned at an angle orthogonal to or approximately orthogonal to the bottom plate.
[0253] The lower surface of the bottom plate contacts the upper surface of the server support (213). That is, the lower surface of the bottom plate and the upper surface of the server support (213) can be combined.
[0254] In the third embodiment, the other end of the support channel (221) is located between or on the two side walls (222a, 222b). Accordingly, the cooling water passing through the other end of the support channel (221) moves between the two side walls (222a, 222b) and on the upper surface of the bottom plate.
[0255] Meanwhile, on the other side of the guide channel (222), that is, between two opposing side walls (222a, 222b) located on the other side of the guide channel (222), a support hole (213h) is formed (see FIG. 9).
[0256] The support hole (213h) is a hole through which the coolant moves.
[0257] The support hole (213h) is formed in the server support (213) and is a hole that penetrates the server support (213).
[0258] The support hole (213h) can be formed on the edge side of the server support (213).
[0259] Coolant that travels along the guide channel (222) to the other side of the guide channel (222) enters the connecting channel (23) located below through the support hole (213h) (see FIG. 9).
[0260] In the aforementioned third embodiment (not shown), a bottom plate hole is formed in the bottom plate of the guide channel (222).
[0261] The above-mentioned bottom plate hole is a hole that penetrates the bottom plate of the guide channel (222) and is a hole through which coolant moves.
[0262] The above-mentioned bottom plate hole is in communication with the support hole (213h) of the server support (213).
[0263] The coolant that has moved to the other side of the guide channel (222) enters the connecting channel (23) located below through the bottom plate hole of the guide channel (222) and the support hole (213h) of the server support (213).
[0264] The connecting channel (23) is formed in the shape of a pipe.
[0265] The connecting channel (23) has a preset length and has a through hole in the longitudinal direction. Leaked coolant moves downward through the through hole of the connecting channel (23).
[0266] The connecting Euro (23) can be positioned vertically or at an angle close to the vertical.
[0267] To elaborate, the longitudinal direction of the connecting channel (23) may be positioned parallel to the vertical, or may be positioned at an angle approximate to the vertical. Here, approximate refers to an angle that is not parallel to the vertical but is close to it.
[0268] The connecting channel (23) includes a first end and a second end. The first end and the second end are ends positioned opposite each other along the length of the connecting channel (23).
[0269] One end of the connecting channel (23) faces upward, and the other end of the connecting channel (23) faces downward.
[0270] The connecting channel (23) is connected to the server support (213). Specifically, one end of the connecting channel (23) is joined to the lower surface of the server support (213).
[0271] The server (21) of the present invention may include one or more components that combine the connection channel (23) and the server support (213).
[0272] The connecting Euro (23) is positioned below the support hole (213h) of the server support (213).
[0273] The through hole of the connecting channel (23) communicates with the support hole (213h) of the server support (213). Accordingly, the coolant passing through the support hole (213h) of the server support (213) enters one end of the connecting channel (23) and moves to the other end of the connecting channel (23).
[0274] The diameter of one end of the connecting channel (23) and the diameter of the other end may be different. For example, the diameter of one end of the connecting channel (23) may be larger than the diameter of the other end.
[0275] The diameter of one end of the connecting channel (23) is formed to be larger than the support hole (213h) of the server support (213). Accordingly, all of the cooling water passing through the support hole (213h) is drawn into the connecting channel (23).
[0276] And, the diameter of the other end of the connecting channel (23) is formed to be smaller than the width of the guide channel (222). Accordingly, the coolant passing through the connecting channel (23) of the first server (21a) does not move outside the guide channel (222) of the second server (21b) positioned below, but is drawn into the support hole (213h) of the second server (21b) without any leakage (see FIG. 2).
[0277] Referring to FIGS. 1 to 3, a plurality of servers (21) can be stacked in a server rack (20). Each of the stacked plurality of servers (21) is equipped with a server path (22).
[0278] Multiple servers (21) include a first server (21a), a second server (21b), a third server (21c), etc.
[0279] In the server rack (20), a first server (21a) is placed at the very top, a second server (21b) is placed below the first server (21a), and a third server (21c) is placed below the second server (21b).
[0280] Each server (21) is provided with a server support (213), and the server support (213) includes a support hole (213h). The server support (213) is provided with a connecting channel (23) communicating with the support hole (213h).
[0281] The other end of the connection channel (23) (e.g., the first connection channel (23)) of the first server (21a) is positioned above the support hole (213h) of the server support (213) (second server support (213)) of the second server (21b) positioned below. Accordingly, the coolant passing through the other end of the first connection channel (23) passes through the support hole (213h) of the second server support (213) of the second server (21b) and then moves to the connection channel (23) (second connection channel (23)) connected to the second server support (213). Then, the coolant passing through the second connection channel (23) moves to the third connection channel (23) of the third server (21c) positioned below.
[0282] Thus, when cooling water leaks from the cooling plate (10)(s) placed on one or more of the servers (21) among the multiple servers (21), the cooling water moves through the support channel (221), guide channel (222), and connecting channel (23) of the server (21) in sequence to the connecting channel (23)(s) of the server (21) placed below.
[0283] A pipe (which may be named ‘rack pipe (32)’) is connected to the connection path (23) (bottom connection path (23)) of the server (21) placed at the very bottom (see FIG. 3).
[0284] The rack pipe (32) is a pipe through which leaked cooling water travels.
[0285] The rack pipe (32) has a preset length.
[0286] One end of the rack pipe (32) is connected to the lowest connecting channel (23), and the other end of the rack pipe (32) can be connected to a storage (not shown) located outside the server rack (20). A hole through which the rack pipe (32) passes can be formed in the server rack (20).
[0287] Coolant leaked from the cooling plate (10) reaches the lowest connecting channel (23) and then moves to the outside of the server rack (20) through the rack piping (32).
[0288] In FIGS. 2 and FIGS. 7, reference numeral 214 is a pipe connection.
[0289] The pipe connection part (214) is placed on the server support part (213) and serves to connect the pipes.
[0290] The first pipe (31) and the second pipe (32) of the server (21) are connected to one side of the pipe connection (214), and other external pipes, although not shown, are connected to the other side of the pipe connection (214). Cooling water travels through the pipes and the pipe connection (214).
[0291] The upper surface groove (114) and upper plate flow path (115) provided in the aforementioned cooling plate (10) can also be applied to a cooling plate according to another embodiment.
[0292] To elaborate, another cooling plate is provided with an upper plate and a lower plate, and even if the shape of the upper plate and the shape of the lower plate of the other cooling plate are different from the shape of the upper plate (11) and the shape of the lower plate (12) of the aforementioned cooling plate (10), the aforementioned upper surface groove (114) and upper plate flow path (115) may be provided on the upper surface and side of the upper plate of the other cooling plate. Here, the shape includes the configuration.
[0293] Also, the aforementioned server (21) may not be placed in a server rack (20). In this embodiment, the server (21) may be placed on a simple support structure rather than a server rack (20).
[0294] The cooling water leakage discharge structure of the present invention is equipped with a sensor unit (116) to quickly detect when cooling water leaks from the cooling plate (10) and warn the user.
[0295] In addition, the cooling water leakage discharge structure of the present invention is provided with an upper surface groove (114) and an upper plate flow path (115) on the cooling plate (10) so that the leaked cooling water moves quickly to the outside of the cooling plate (10) through the upper surface groove (114) and the upper plate flow path (115).
[0296] In addition, the cooling water leakage discharge structure of the present invention is provided with a server flow path (22) in the server (21) so that the leaked cooling water moves quickly to the outside of the server (21) through the server flow path (22).
[0297] Accordingly, the cooling water leakage drainage structure of the present invention contributes to improving the operational efficiency of a data center and minimizing damage caused by leakage.
[0298] In addition, the cooling plate (10) equipped with the cooling water leakage discharge structure of the present invention minimizes the pressure exerted by the cooling water on the cooling fin (121) by arranging the cooling fin (121) so that the cooling water does not press on one surface of the cooling fin (121) in a direction orthogonal to one surface of the cooling fin (121). Accordingly, the overall power consumption of the cooling system is minimized.
[0299] In addition, the cooling plate (10) reduces the pressure loss of the cooling water and improves cooling efficiency by branching the cooling water and moving it between the cooling fins (121).
[0300] In addition, the cooling plate (10) allows the cooling water to move along the length direction of the cooling fin (121), thereby reducing the flow resistance of the cooling water.
Claims
1. A cooling water leakage discharge structure provided with a server, a printed circuit board provided on the server, and a cooling plate disposed on a chip of the printed circuit board, for discharging cooling water leaked from the cooling plate to the outside of the cooling plate and the server, It includes an upper surface groove and an upper plate flow path provided in the above cooling plate, and The leaked coolant flows into the upper surface groove and then moves to the upper plate flow path, and The above upper surface groove is formed on the upper surface of the upper plate of the cooling plate, and the cooling water leakage discharge structure is formed between the inlet protrusion and the outlet protrusion provided on the upper plate.
2. In Paragraph 1, The above upper surface groove is formed by being sunk to a predetermined depth from the upper surface of the top plate toward the lower surface, and includes an inclined surface and a bottom surface. A cooling water leakage discharge structure, wherein the inclined surface represents the inner side of the upper groove and the bottom surface represents the surface forming the bottom of the upper groove.
3. In Paragraph 2, The above inclined surface includes a first inclined surface, a second inclined surface, a third inclined surface, and a fourth inclined surface connected in sequence, and The first inclined surface is closest to the side of the top plate than the second inclined surface, the third inclined surface, and the fourth inclined surface, and The second inclined surface is positioned toward the entrance protrusion, the third inclined surface is positioned opposite the first inclined surface, and the fourth inclined surface is positioned toward the exit protrusion. A cooling water leakage discharge structure in which, when viewed from above, the bottom surface of the upper groove is not located at the center of the upper groove but is located on the side of the first inclined surface.
4. In Paragraph 1, The above-mentioned top plate flow path is equipped with an upper surface flow path and a side flow path, and The above upper surface channel is formed on the upper surface of the upper plate and communicates with the upper surface groove, The above-mentioned side channel is formed on the side of the top plate and is in communication with the above-mentioned top surface channel, forming a cooling water leakage discharge structure.
5. In Paragraph 1, A sensor part is disposed on the bottom surface of the upper groove above, and The above sensor part is a coolant leakage discharge structure that detects the leaked coolant.
6. In Paragraph 1, The above server is provided with a server flow path into which the leaked coolant in the upper plate flow path flows, and The above server flow path is a cooling water leakage discharge structure having a support flow path, a guide flow path, and a connecting flow path connected in sequence.
7. In Paragraph 6, A cooling water leakage discharge structure in which the support channel is formed in the shape of a pipe, inserted into the channel hole of the printed circuit board, and positioned below the side channel of the top channel.
8. In Paragraph 6, The above guide channel is provided on the upper surface of a server support provided on the server, and A cooling water leakage discharge structure in which a support channel is disposed above one side of the guide channel and a connecting channel is disposed below the other side of the guide channel.
9. In Paragraph 8, The above support channel is a cooling water leakage discharge structure in which one or more are disposed between one side and the other side of the above guide channel.
10. In Paragraph 8, In the server support above, a support hole is formed, which is a hole through which the cooling water that has moved along the guide path moves. The above support hole is a cooling water leakage drainage structure formed between two opposing side walls located on the other side of the guide channel.
11. In Paragraph 10, The above connecting channel is formed in the shape of a pipe, and one end of the connecting channel is coupled to the lower surface of the server support, and A cooling water leakage discharge structure in which the above-mentioned connecting channel is positioned below the above-mentioned support hole, and the through hole of the above-mentioned connecting channel communicates with the above-mentioned support hole.
12. In Paragraph 6, The above guide channel is equipped with two side walls having a preset height, and The two side walls are spaced apart by a preset distance and positioned to face each other, and A cooling water leakage drainage structure in which both ends of the two side walls are connected to each other.
13. In Paragraph 6, The above server is provided in multiple numbers, and A plurality of the above servers are stacked, and each server is equipped with the server Euro, and A cooling water leakage discharge structure in which one end of a rack pipe is connected to the connection path of the server positioned at the bottom among the plurality of servers, and the other end of the rack pipe is positioned outside the server rack.
14. In Paragraph 1, The above cooling plate includes the above upper plate and the lower plate coupled to the above upper plate, and The upper plate includes an inlet for cooling water to flow in and an outlet for cooling water to flow out, and a plurality of cooling fins are arranged on the lower plate. The upper plate further includes an inlet passage communicating with the inlet, an outlet passage communicating with the outlet, and an upper plate groove accommodating the plurality of cooling fins. Coolant leakage drainage structure, wherein the height of the cooling fins is the same as the depth of the upper plate groove.
15. In Paragraph 14, The upper plate groove and the lower plate each include a fin area in which the plurality of cooling fins are arranged and an edge area surrounding the fin area. Coolant flowing into the interior of the upper plate groove passes between the cooling fins to reach the edge region and moves along the edge region, a cooling water leakage discharge structure.
16. In Paragraph 15, A pair of internal partitions are formed in the upper plate groove, and The above pair of internal partitions are formed between the pin area and the edge area corresponding to the transverse direction of the top plate groove, thereby partitioning the pin area and the edge area, forming a cooling water leakage discharge structure.
17. In Paragraph 16, Between the aforementioned pair of internal partitions, a first group and a second group composed of the aforementioned plurality of cooling fins are disposed, and A cooling water leakage discharge structure in which the longitudinal direction of the cooling fins is arranged parallel to the longitudinal direction of the internal bulkhead.
18. In Paragraph 17, In the pin area of the lower plate, the first group and the second group are spaced apart by a certain distance, and A cooling water leakage discharge structure in which the inlet flow path of the upper plate is located above the area where the first group and the second group are spaced apart.