Test connector and test socket
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ISC CO LTD
- Filing Date
- 2026-01-20
- Publication Date
- 2026-07-30
Smart Images
Figure KR2026001169_30072026_PF_FP_ABST
Abstract
Description
Inspection connectors and inspection sockets
[0001] The present invention relates to a test connector and a test socket, and more specifically, to a test connector and a test socket that facilitate testing of a semiconductor device having a fine pitch terminal.
[0002] In an inspection process for determining whether a device under test, such as a manufactured semiconductor device, is defective, an inspection socket is placed between the device under test and the inspection device. An inspection method is known in which the inspection socket electrically connects the device under test and the inspection device, and the defect of the device under test is determined based on whether power is supplied between the device under test and the inspection device.
[0003] Recently, due to the advancement and integration of semiconductor technology, the pitch (spacing) between terminals of devices under test is decreasing. To test semiconductor devices with fine pitches, testing equipment must be modified accordingly; however, due to the increased costs associated with replacement, testing is sometimes performed without design changes by utilizing pitch converter boards.
[0004] Conventional test sockets achieve soft contact with semiconductor devices by utilizing the elasticity of conductive probes after installing multiple conductive probes, which are thin sheets in the form of cantilevered beams, on a pitch changer substrate.
[0005] However, cantilever-type conductive probes designed for fine pitches have the disadvantage of low assembly process efficiency. Not only is the precise manufacturing of fine metal foils expensive, but the process of installing these foils onto the converter substrate is also difficult and costly.
[0006] Furthermore, pitch changer substrates are composed of multilayer boards, which makes them relatively expensive and poses a problem that causes increased costs. Pitch changer substrates also have the disadvantage of high costs due to their complex manufacturing process.
[0007] In addition, when a conductive probe made of a thin sheet metal in the form of a cantilever is pressed excessively, it can damage the surface of an expensive pitch changer board, so it is necessary to install a separate cushioning member on the upper surface of the pitch changer board, which complicates the structure of the overall inspection socket and is a factor that increases manufacturing costs.
[0008] The present invention was created to solve the aforementioned problems, and its technical objective is to provide a test connector and a test socket capable of stably and reliably performing inspection on a fine-pitch semiconductor device.
[0009] The technical objective of the present invention is to provide a test connector and a test socket with a relatively simple structure that do not incur excessive costs when testing fine-pitch semiconductors.
[0010] The present invention was created to solve the aforementioned technical problem, and relates to a test connector connected to a terminal of a device to be tested and for performing an electrical test on said device to be tested, wherein
[0011] An upper substrate having a plurality of first upper patterns formed thereon, and a first lower pattern formed on the lower surface that is electrically connected to the first upper patterns;
[0012] A lower substrate spaced downward from the upper substrate, the lower substrate having a second upper pattern formed on its upper surface to face the first lower pattern, and a second lower pattern formed on its lower surface that is electrically connected to the second upper pattern;
[0013] A connecting portion disposed between the upper substrate and the lower substrate and electrically connecting the first lower pattern and the second upper pattern to each other; and
[0014] It includes an elastic support member disposed between the upper substrate and the lower substrate and elastically supporting the upper substrate while its lower surface is in contact with the lower substrate,
[0015] In the first upper pattern above, a conductive probe is formed that protrudes upward and contacts a terminal of the device under test, and
[0016] When the first lower pattern and the conductive probe are projected onto a virtual plane parallel to the upper surface of the lower substrate, the first lower pattern and the conductive probe are in a misaligned positional relationship with each other, and
[0017] The above elastic support member is positioned at least partially directly below the conductive probe so that it can absorb the pressure by elastically deforming when the terminal of the device under test presses the conductive probe.
[0018] In the above inspection connector,
[0019] The above elastic support may be made of any one of silicone, rubber, or urethane.
[0020] In the above inspection connector,
[0021] The upper substrate may be made of a material that is softer than the lower substrate.
[0022] In the above inspection connector,
[0023] The upper substrate may be made of a polyimide material, and the lower substrate may be made of an epoxy-based material.
[0024] In the above inspection connector,
[0025] The spacing of the first upper pattern and the spacing of the first lower pattern may be different from each other.
[0026] In the above inspection connector,
[0027] The above connection part is a solder ball formed on the second upper pattern and can be connected to the first lower pattern.
[0028] In the above inspection connector,
[0029] The above-mentioned connecting part may be made of a conductive rubber sheet mixed with an elastic insulating material and conductive particles.
[0030] In the above inspection connector,
[0031] The above conductive rubber sheet is,
[0032] It may consist of a conductive part composed of an elastic insulating material and conductive particles, and an insulating part that supports the conductive part.
[0033] In the above inspection connector,
[0034] The above conductive rubber sheet is,
[0035] It can be supported by a frame.
[0036] In the above inspection connector,
[0037] The above connecting part is,
[0038] It may be an intermediate substrate having vias formed therein that electrically connect the first lower pattern and the second upper pattern.
[0039] In the above inspection connector,
[0040] The above intermediate substrate may be made of polyimide or epoxy material.
[0041] The inspection connector of the present invention for achieving the above-described technical purpose is an inspection connector that is connected to a terminal of a device to be inspected and performs an electrical inspection of said device to be inspected, wherein
[0042] An upper substrate having a plurality of first upper patterns having a first pitch formed on an upper surface, and a plurality of first lower patterns formed on a lower surface that are electrically connected to the first upper patterns and have a second pitch different from the first pitch;
[0043] A lower substrate spaced downward from the upper substrate, the lower substrate having a plurality of second upper patterns formed on an upper surface facing a first lower pattern, and a plurality of second lower patterns formed on a lower surface electrically connected to the second upper pattern;
[0044] A plurality of connecting portions disposed between the upper substrate and the lower substrate and electrically connecting the first lower pattern and the second upper pattern to each other; and
[0045] It includes an elastic support member disposed between the upper substrate and the lower substrate, elastically supporting the upper substrate while its lower surface is in contact with the lower substrate, and disposed between a plurality of connecting parts.
[0046] In a plurality of first upper patterns, a conductive probe is formed that protrudes upward and contacts a terminal of the device under test, and
[0047] When the first lower pattern and the conductive probe are projected onto a virtual plane parallel to the upper surface of the lower substrate, the first lower pattern and the conductive probe are in a misaligned positional relationship with each other, and
[0048] The above elastic support member is positioned at least partially directly below the conductive probe so that it can absorb the pressure by elastically deforming when the terminal of the device under test presses the conductive probe.
[0049] In the above inspection connector,
[0050] The above elastic support can support each conductive probe individually.
[0051] In the above inspection connector,
[0052] The above elastic support can support two or more conductive probes.
[0053] In the above inspection connector,
[0054] A void space may be formed between the above connecting part and the elastic support part.
[0055] In the above inspection connector,
[0056] The side of the elastic support part may come into contact with the side of the connection part.
[0057] The inspection socket of the present invention for achieving the above-described technical purpose is an inspection socket connected to a terminal of a device to be inspected and for performing an electrical inspection of said device to be inspected, wherein
[0058] An upper substrate having a first upper pattern formed on the upper surface with a conductive probe protruding upward, and a first lower pattern formed on the lower surface that is electrically connected to the first upper pattern and positioned offset upward from the conductive probe, and
[0059] A lower substrate spaced downward from the upper substrate, comprising: a second upper pattern formed on an upper surface facing the first lower pattern; and a lower substrate having a second lower pattern formed on a lower surface electrically connected to the second upper pattern.
[0060] A connecting portion disposed between the upper substrate and the lower substrate and electrically connecting the first lower pattern and the second upper pattern to each other,
[0061] An inspection connector comprising an elastic support member disposed between the upper substrate and the lower substrate, and elastically supporting the upper substrate while the lower surface is in contact with the lower substrate;
[0062] A guide member installed on the upper part of the above-mentioned inspection connector and having a receiving hole for accommodating a device to be inspected;
[0063] A cover member detachably coupled to the upper surface of the guide member by means of a latch means;
[0064] A pusher that is elastically supported by the cover member and has at least a portion inserted into the guide member to press the device under test toward the upper substrate;
[0065] When the above-mentioned conductive probe and the elastic support are projected onto a virtual plane parallel to the upper surface of the lower substrate, the first lower pattern and the conductive probe are in a misaligned positional relationship.
[0066] The inspection socket according to the present invention has the advantage of reducing inspection costs and simplifying the structure by enabling inspection to be performed using a conductive probe of a simple shape that does not require elastic deformation.
[0067] The inspection socket according to the present invention is provided with an elastic support member directly below the conductive probe so as to absorb the pressure exerted by the device under inspection, thereby preventing damage to the conductive probe.
[0068] The inspection socket according to the present invention aims to provide an inspection socket that can effectively respond to pressure while having a simple structure by using a material that is softer for the upper substrate than for the lower substrate and providing an elastic support member below the upper substrate.
[0069] FIG. 1 is a perspective view of an inspection socket according to a first embodiment of the present invention, viewed from above.
[0070] FIG. 2 is a perspective view of the inspection socket of FIG. 1 viewed from below.
[0071] FIG. 3 is a plan view of the inspection socket of FIG. 1.
[0072] FIG. 4 is a front view of the inspection socket of FIG. 1.
[0073] FIG. 5 is an exploded view of the inspection socket of FIG. 1.
[0074] FIG. 6 is a perspective view of one configuration of the inspection socket of FIG. 1 viewed from below.
[0075] FIG. 7 is a top-view perspective of the separated configuration of FIG. 6.
[0076] FIG. 8 is a perspective view of the separated configuration of FIG. 6 as seen from below.
[0077] FIG. 9 is a top-view perspective of a disassembled test connector, which is a component of the test socket of FIG. 1.
[0078] FIG. 10 is a perspective view taken from below of a disassembled test connector, which is a component of the test socket of FIG. 1.
[0079] FIG. 11 is a plan view of a test connector, which is a component of the test socket of FIG. 1.
[0080] FIG. 12 is a cross-sectional view of FIG. 11.
[0081] FIG. 13 is a projected view of the inspection connector of FIG. 11.
[0082] FIG. 14 is a drawing showing the operation of the inspection connector of FIG. 12.
[0083] FIG. 15 is a cross-sectional view of an inspection connector according to a second embodiment of the present invention.
[0084] FIG. 16 is a cross-sectional view of an inspection connector according to a third embodiment of the present invention.
[0085] FIG. 17 is an enlarged view of a connection portion which is a component of the inspection connector of FIG. 16.
[0086] FIG. 18 is a cross-sectional view of an inspection connector according to a fourth embodiment of the present invention.
[0087] FIG. 19 is a cross-sectional view of an inspection connector according to a fifth embodiment of the present invention.
[0088] FIG. 20 is a drawing showing various cross-sectional views of a conductive probe, which is a component of the inspection connector of the present invention.
[0089] The embodiments of the present disclosure are illustrative for the purpose of explaining the technical concept of the present disclosure. The scope of rights according to the present disclosure is not limited to the embodiments presented below or the specific description thereof.
[0090] All technical and scientific terms used in this disclosure, unless otherwise defined, have the meaning generally understood by those skilled in the art to which this disclosure pertains. All terms used in this disclosure are selected for the purpose of further clarifying this disclosure and are not selected to limit the scope of the rights under this disclosure.
[0091] Expressions such as “comprising,” “comprising,” “having,” etc. used in this disclosure should be understood as open-ended terms implying the possibility of including other embodiments, unless otherwise stated in the phrase or sentence containing such expressions.
[0092] Unless otherwise stated, singular expressions described in this disclosure may include a plural meaning, and this applies likewise to singular expressions described in the claims.
[0093] Expressions such as "first," "second," etc. used in this disclosure are used to distinguish multiple components from one another and do not limit the order or importance of said components.
[0094] In the present disclosure, where it is stated that a component is "connected" or "connected" to another component, it should be understood that the component may be directly connected or connected to the other component, or connected or connected through a new component.
[0095] As used in this disclosure, the direction indicator "upward" is based on the direction in which the guide member is positioned relative to the inspection connector, and the direction indicator "downward" means the opposite direction of upward. As used in this disclosure, the direction indicator "upward and downward direction" includes both upward and downward directions, but should be understood not to mean any specific direction between the upward and downward directions.
[0096] The direction indicator "horizontal" used in this disclosure is a direction orthogonal to the up-and-down direction and includes both left-right and front-back directions. When the left-and-right direction is referred to as the first horizontal direction, the front-back direction may be defined as the second horizontal direction.
[0097] Embodiments are described with reference to the examples illustrated in the attached drawings. In the attached drawings, identical or corresponding components are given the same reference numerals. Additionally, in the description of the following embodiments, the description of identical or corresponding components may be omitted. However, even if a description of a component is omitted, it is not intended that such component is not included in any embodiment.
[0098] The embodiments described below and the examples illustrated in the attached drawings relate to a test socket for electrical connection between a test device and a device under test. The test socket of the embodiments can be used for electrical connection between the test device and the device under test during the inspection of the device under test. For example, the test socket of the embodiments can be used for a burn-in test of the device under test in a post-process during the manufacturing process of the device under test. In a burn-in test, thermal stress is applied to the device under test at a high temperature of about 80°C to 125°C. During the burn-in test, since the device under test operates under conditions where high temperature and a high electric field are applied, a device under test that cannot withstand the inspection conditions of the burn-in test will cause a defect. Accordingly, through the burn-in test, a device under test that may cause an initial defect can be inspected. Examples of inspections to which the test socket of the embodiments is applied are not limited to the burn-in test described above.
[0099] FIGS. 1 to 5 illustrate an example in which an inspection socket (100) according to one embodiment is applied. An inspection socket (100) and a device to be inspected (600) accommodated in the inspection socket (100) are schematically illustrated, and the shapes shown in FIG. 1 are merely exemplary.
[0100] An inspection socket (100) according to one embodiment is configured to insert a device to be inspected (600) inside. The inspection socket (100) may be mounted on an inspection device (not shown). The inspection socket (100) accommodates the device to be inspected (600) inside and positions it on the inspection device. Inspection of the device to be inspected (600) is performed by the inspection device through the inspection socket (100).
[0101] The device under test (600) may be a memory device, but is not limited thereto. The memory device may be a non-volatile NAND-type Flash memory. For example, the memory device may include PRAM, MRAM, ReRAM, FRAM, NOR Flash memory, etc. Additionally, the memory device may be a volatile memory device in which data is lost when the power is cut off, such as DRAM and SRAM. The memory device may be a High Bandwidth Memory (HBM), which is a high-performance RAM interface composed of a stack of multiple DRAM devices. The HBM may include a base die optionally equipped with a memory controller, and the base die is connected to dies formed with DRAM devices by through-silicon vias (TSVs) and microbumps. The device under test may be a logic chip, a measurement device, a communication device, a Digital Signal Processor (DSP), or a System-On-Chip (SOC), etc. Such a test device (600) may have multiple terminals for connection.
[0102] An unillustrated inspection device may be configured to perform a burn-in inspection of a device under inspection (600). The inspection device has an inspection board on which an inspection socket (100) is mounted. The inspection board may have a plurality of pads capable of outputting an electrical inspection signal and receiving a response signal. A terminal (610) of the device under inspection (600) is electrically connected to a pad of the corresponding inspection board through the inspection socket (100). That is, the inspection socket (100) electrically connects the terminal (610) of the device under inspection (600) and the pad of the inspection board corresponding thereto in the vertical direction (VD), thereby transmitting an electrical inspection signal and a response signal between the terminal and the inspection board.
[0103] An inspection socket (100) according to the first embodiment of the present invention comprises a cover member (200), a guide member (300), a pusher (400), and an inspection connector (500).
[0104] The above cover member (200) is detachably coupled to the upper surface of the guide member (300) by means of a latch means (240). This cover member (200) is formed in the shape of a square frame with a central hole (210) formed in the center. A pusher (400) is configured to be inserted into the central hole (210).
[0105] A latch receiving portion (220) facing in the second horizontal direction (HD2) is formed in the cover member (200). The latch receiving portion (220) is configured to be concave inward. Pin holes (221) extending in the first horizontal direction (HD1) are formed on both side walls of the latch receiving portion (220). A hinge pin (241) is inserted into the pin holes (221). A seating groove (222) is formed on the bottom portion of the latch receiving portion (220). A first spring (250) that elastically biases the latch means (240) to the locking position is seated in the seating groove (222).
[0106] In the above cover member (200), a plurality of fastening holes (230) are formed along the second horizontal direction (HD2) on the edge sides facing each other in the first horizontal direction (HD1). A retaining bolt (430) is inserted into the fastening hole (230).
[0107] The above latch means (240) is coupled to the latch receiving portion (220) of the cover member (200) to detachably connect the cover member (200) to the guide member (300). The latch means (240) has a hook formed at its lower end and is coupled to the cover member (200) by a hinge pin (241). The latch means (240) is pressed to a locked position by a first spring (250) seated in the seating groove (222).
[0108] The guide member (300) is installed on the upper part of the inspection connector (500) in the center and has a receiving hole (310) provided to accommodate the device to be inspected (600). The guide member (300) is formed in the shape of a square frame. A step (320) is formed on the guide member (300) at the end facing in the first horizontal direction (HD1) to be engaged with the end of the latch means (240). When the end of the latch means (240) moves to a locked position, the step (320) engages, preventing the cover member (200) from being separated from the guide member (300).
[0109] The above pusher (400) is elastically supported by the cover member (200) and at least a portion is inserted into the guide member (300) to press the device to be tested (600) toward the upper substrate (510).
[0110] The above pusher (400) is composed of a pressure plate (410) formed in the shape of a square plate, a heating block (420) protruding upward from the upper surface of the pressure plate (410), a retaining bolt (430) and a second spring (440) that are connected to the pressure plate (410) so as to be able to move up and down.
[0111] The pressure plate (410) has its bottom surface inserted into the receiving hole (310) and contacts the upper surface of the device to be inspected (600). The pressure plate (410) is coupled to the cover member (200) so as to be movable in the vertical direction (VD). When the pressure plate (410) is lowered, it presses the device to be inspected (600) toward the inspection device side, thereby pressing the terminal of the device to be inspected (600) against the inspection connector (500) side.
[0112] The heating blocks (420) are protruding from the upper surface of the pressure plate (410) and are arranged in a spaced-apart manner extending in the first horizontal direction (HD1). The heating blocks (420) function to absorb heat from the pressure plate (410) and release it to the outside.
[0113] The above-mentioned retaining bolts (430) are each positioned on opposite end sides in the first horizontal direction (HD1) of the pressure plate (410). With the head portion of the retaining bolt (430) caught on the bottom surface of the pressure plate (410), the threaded portion (431) passes through the pressure plate (410) and protrudes upward. The threaded portion (431) is configured to be screw-coupled to the fastening hole (230) of the cover member (200).
[0114] The second spring (440) elastically biases the pressure plate (410) downward. The second spring (440) is positioned between the cover member (200) and the pressure plate (410). The second spring (440) is fitted into the retaining bolt (430). The upper end of the second spring (440) contacts the lower end of the cover member (200), and the lower end of the second spring (440) contacts the upper end of the pressure plate (410). The second spring (440) presses the pressure plate (410) downward so that the device under inspection (600) is securely coupled to the inspection connector (500).
[0115] The above inspection connector (500) electrically connects the device to be inspected (600) housed within the guide member (300) to the inspection device. The inspection connector (500) electrically connects the terminals of the device to be inspected (600) to the pads of the inspection device.
[0116] The above inspection connector (500) includes an upper substrate (510), a lower substrate (520), a connecting part (530), and an elastic support part (540).
[0117] The upper substrate (510) has a plurality of first upper patterns (511) formed on its upper surface and a first lower pattern (512) formed on its lower surface that is electrically connected to the first upper patterns (511). The upper substrate (510) is made of a flexible material, such as polyimide.
[0118] A conductive probe (513) is formed on one side of the first upper pattern (511). The first upper pattern (511) is configured to extend in one direction from the conductive probe (513). The other end of the first upper pattern (511) is connected to a via. The other end of the first upper pattern (511) is positioned opposite the first lower pattern (512) in the vertical direction.
[0119] The conductive probe (513) is formed in a columnar shape. The conductive probe (513) may be cylindrical in shape, but is not limited thereto and may also be polygonal.
[0120] The conductive probe (513) can come into contact with the terminal of the device under test (600). When the device under test (600) is pressurized, it comes into secure contact with the terminal of the device under test (600). The conductive probe (513) electrically connects the terminal of the device under test (600) to the first upper pattern (511).
[0121] The conductive probe (513) may be made of gold, nickel, copper, silver, palladium, iron, etc., which have excellent conductivity, and the conductive probe (513) may be made entirely of a single metal, may be made of an alloy of two or more metals, or may be made of two or more metals stacked together. In addition, it is preferable that the surface of the conductive probe (513) be formed of a metal that is chemically stable and has high conductivity, such as gold, silver, or palladium.
[0122] The conductive probe (513) preferably has an aspect ratio of 1:2.5 to 1:10. For example, in a columnar shape, the diameter of the top or bottom of the conductive probe (513) is preferably 20 to 60 μm, and the height is preferably 50 to 200 μm.
[0123] The first lower pattern (512) is positioned on the lower surface of the upper substrate. It is positioned opposite to the other end of the first upper pattern (511). The first lower pattern (512) is electrically connected to the first upper pattern (511) by vias. When the first lower pattern (512) and the conductive probe (513) are projected onto a virtual plane parallel to the upper surface of the lower substrate (520), the first lower pattern (512) and the conductive probe (513) are in a misaligned positional relationship. That is, the first lower pattern (512) and the conductive probe (513) are positioned so that they are not projected onto the virtual plane in an overlapping state. The first upper pattern (511) and the first lower pattern (512) may have different pitches.
[0124] As a result, it is possible to test semiconductor devices (600) with different pitches using existing mass-produced test equipment.
[0125] The lower substrate (520) is spaced downward from the upper substrate (510). The lower substrate (520) may be made of a material that is harder than the upper substrate (510). The lower substrate (520) may be made of an epoxy-based material (such as FR4), but is not limited thereto.
[0126] A second upper pattern (521) is formed on the upper surface of the lower substrate (520) so as to face the first lower pattern (512). A second lower pattern (522) is formed on the lower surface of the lower substrate (520) and is electrically connected to the second upper pattern (521) by a via.
[0127] The second upper pattern (521) is connected to the lower end of the connection part (530) and is electrically connected to the first lower pattern (512). The second lower pattern (522) is connected to the pad of the inspection device. The second lower pattern (522) is positioned opposite the second upper pattern (521) in the vertical direction (VD).
[0128] The above connecting portion (530) is disposed between the upper substrate (510) and the lower substrate (520) and electrically connects the first lower pattern (512) and the second upper pattern (521) to each other. The connecting portion (530) can be anything that is conductive. The connecting portion (530) may be formed in the shape of a ball, but is not limited thereto.
[0129] The upper end of the connecting part (530) is configured to contact the first lower pattern (512), and the lower end of the connecting part (530) is configured to contact the second upper pattern (521). A plurality of connecting parts (530) are spaced apart from each other in the horizontal direction (HD) so that a plurality of first lower patterns (512) and second upper patterns (521) can be connected to each other.
[0130] The elastic support member (540) is positioned between the upper substrate (510) and the lower substrate (520) and elastically supports the upper substrate (510) while its lower surface is in contact with the lower substrate (520). The elastic support member (540) is positioned such that at least a portion thereof is positioned directly below the conductive probe (513), so that when the terminal of the device under test (600) presses the conductive probe (513), it can absorb the pressure by elastically deforming.
[0131] The elastic support member (540) can be made of a material that is easy to absorb pressure, and any one of silicone, rubber, or urethane can be used. However, it is not limited to these, and any material with excellent elasticity is possible.
[0132] The elastic support member (540) is positioned at a different location from the connecting member (530). Specifically, the elastic support member (540) may be positioned between a plurality of connecting members (530). When pressure is applied from the device under test (600), the conductive probe (513) moves downward and the upper substrate (510) bends, and the elastic support member (540) can be compressed in the vertical direction and expanded in the horizontal direction. Since the lower substrate (520) is made of a hard material, it bends less than the upper substrate, so most of the pressure is absorbed by the elastic support member (540).
[0133] The elastic support member (540) is configured to support each conductive probe (513) individually. At this time, an empty space (V) is formed around the elastic support member (540). As a result, there is no interference with the surroundings when the elastic support member (540) undergoes elastic deformation, which has the advantage of allowing it to absorb more pressure.
[0134] The elastic support member (540) preferably contacts the lower surface of the upper substrate (510), but it is also possible to be spaced apart. As the elastic support member (540) is provided in this manner, the conductive probe (513) does not need to have elasticity, so the conductive probe (513) can be manufactured at a low cost. The elastic support member (540) absorbs the pressure applied to the conductive probe (513), thereby preventing damage to the conductive probe (513) or the terminal of the device under test (600).
[0135] The inspection socket (100) according to the present invention operates as follows.
[0136] With the device to be inspected (600) inserted into the receiving hole (310) of the guide member (300), the cover member (200) is attached to the guide member (300). When the operator releases their hand while the latch means (240) is moved to the release position, the latch means (240) moves to the lock position due to the spring reaction force. As a result, the lower end of the latch means (240) is engaged with the step (320) of the guide member (300). At this time, the pusher (400) presses the device to be inspected (600) downward.
[0137] When pressure is applied to the device under test (600), the terminal (610) of the device under test (600) comes into contact with the conductive probe (513) and moves the conductive probe (513) downward. As the conductive probe (513) descends, the upper substrate (510) bends, and the elastic support (540) located directly below the conductive probe (513) absorbs the pressure by undergoing elastic deformation due to the downward pressure. Accordingly, the terminal and the conductive probe (513) can maintain a state of soft contact with each other without excessive impact being applied to the terminal of the device under test (600).
[0138] Afterwards, when a test signal is applied from the test device, the test signal is transmitted to the device to be tested (600) through the test connector (500), and the response signal moves in the opposite direction to conduct a test on the device to be tested (600).
[0139] The inspection socket (100) according to the present invention can be manufactured to enable mass production at a low cost. In addition, it has excellent characteristics and can secure price competitiveness.
[0140] The inspection socket (100) according to the present invention has the advantage that the conductive probe (513) can be manufactured in a simple pillar shape without needing to have a complex structure with elasticity required for inspection, thereby reducing manufacturing costs and eliminating the need to consider damage to the substrate caused by dents.
[0141] The inspection socket (100) according to the present invention can be modified as follows.
[0142] FIG. 15 discloses a test connector (500) of a test socket (100) according to a second embodiment of the present invention.
[0143] In the second embodiment, the remaining configuration, excluding the connection portion (530), is the same as in the first embodiment. In the inspection connector (500) according to the second embodiment, the connection portion (530) is formed by a solder ball (531) formed on the second upper pattern (521). The connection portion (530) is configured to be connected to the first lower pattern (512). Specifically, the connection portion (530) can be formed on the lower substrate (520) through a solder ball formation process, and the excellent electrical characteristics of the solder ball (531) can be utilized as is.
[0144] In addition, the solder ball (531) and the upper substrate (510) can be fixedly coupled through the reflow process, so there is an advantage that a more stable test is possible when the upper and lower parts are fixed through the solder ball (531).
[0145] In addition, even after being fixed to the upper substrate (510), if separation of the upper substrate (510) is required, it can be separated through heat treatment, which has the advantage of being easy to replace.
[0146] FIGS. 16 and 17 disclose an inspection connector (500) of an inspection socket (100) according to a third embodiment of the present invention.
[0147] In the third embodiment, there is a difference from the first embodiment in the upper substrate (510), the connecting part (530), and the elastic support part (540).
[0148] In the inspection connector (500) according to the third embodiment, the upper substrate (510) is a pitch converter substrate, and the connection portion (530) may be made of a conductive rubber sheet mixed with an elastic insulating material and conductive particles (5321). In addition, in the first embodiment, the elastic support portion (540) was formed to correspond one-to-one to support each conductive probe (513) individually, but it is not limited thereto, and it is also possible for one elastic support portion (540) to support two or more probes simultaneously.
[0149] The upper substrate (510) may be a pitch converter substrate in which the pitch is changed. The upper substrate (510) is composed of a plurality of substrate layers. The upper substrate (510) is configured such that vias internally connect patterns having different pitches on the upper and lower surfaces of the upper substrate (510).
[0150] When the connecting part (530) is made of a conductive rubber sheet, it can absorb the pressure together with the elastic support part (540) when pressure is applied by the device under inspection (600). The conductive rubber sheet is composed of a conductive part (532) and an insulating part (533).
[0151] The conductive portion (532) is formed in a columnar shape and is composed of an elastic insulating material and conductive particles (5321). As the elastic insulating material, a polymer material having a cross-linked structure is preferred. Various materials can be used as curable polymer material forming materials to obtain such an elastic polymer material, and specific examples include conjugated diene rubbers such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber, and their hydrogenated derivatives; block copolymer rubbers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer rubber, and their hydrogenated derivatives; chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber, etc. Among these, silicone rubber is preferred.
[0152] The conductive particles (5321) are conductive particles (5321) that exhibit magnetism. Specific examples of such conductive particles (5321) include particles of a magnetic metal such as iron, cobalt, or nickel, particles of an alloy thereof, or particles containing these metals, or particles of these particles used as core particles and having a good conductive metal such as gold, silver, palladium, or rhodium plated on the surface of the core particles, or particles of a non-magnetic metal, inorganic material such as glass beads, or polymer particles used as core particles and having a conductive magnetic metal such as nickel or cobalt plated on the surface of the core particles.
[0153] The insulating part (533) is positioned around the conductive part (532) and is configured to surround the conductive part (532). The insulating part (533) supports the conductive part (532). The material constituting the insulating part (533) may be the same material as the elastic insulating material constituting the conductive part (532), but is not limited thereto; any other material that has excellent insulating properties and good elastic properties may also be used.
[0154] The conductive rubber sheet is configured to be supported by a frame (534). The frame (534) may have a through hole formed in the center, and the conductive rubber sheet may be attached to and supported in the through hole.
[0155] The frame (534) may be made of a material with excellent rigidity. The frame (534) may be made of a resin material such as a liquid crystal polymer, polyimide resin, polyester resin, polyaramid resin, or polyamide resin; a fiber-reinforced resin material such as a glass fiber-reinforced epoxy resin, a glass fiber-reinforced polyester resin, or a glass fiber-reinforced polyimide resin; or a composite resin material containing inorganic materials such as alumina or boron nitride as fillers in the epoxy resin. However, it is not limited thereto, and glass or metal materials may also be used.
[0156] At this time, the connecting portion (530) serves as an intermediate layer of the conventional pitch converter substrate. As the connecting portion (530) is made of an elastic rubber sheet, the tension increases, and consequently, the load can be reduced. Additionally, the conductive portion (532) serves as a via, allowing for the realization of low load and low resistance, and has the advantage of minimizing signal loss.
[0157] FIG. 18 discloses a test connector (500) of a test socket (100) according to a fourth embodiment of the present invention.
[0158] The inspection connector (500) according to the fourth embodiment differs from the first embodiment in the connection portion (530).
[0159] Specifically, in the inspection connector (500) according to the fourth embodiment, the connection portion (530) may be an intermediate substrate (535) having a via (536) formed therein that electrically connects the first lower pattern (512) and the second upper pattern (521).
[0160] The intermediate substrate (535) is formed by forming via holes in a material such as polyimide or epoxy, and shares the first lower pattern (512) and the second upper pattern (521). It can be manufactured using an existing multilayer PCB manufacturing process and can also be formed integrally with the elastic support member (540).
[0161] As a result, it can be manufactured at a low unit cost, and has the advantages of improved productivity and mass production. In terms of effectiveness, the height of the elastic support part (540) can be easily adjusted, allowing for an increase in stroke, and has the advantage of being able to be implemented with low load and low resistance.
[0162] FIG. 19 discloses a test connector (500) of a test socket (100) according to a fifth embodiment of the present invention.
[0163] The inspection connector (500) according to the fourth embodiment differs from the first embodiment in the elastic support portion (540).
[0164] In the first embodiment, the elastic support member (540) is illustrated as supporting each conductive probe (513) individually, but is not limited thereto, and it is possible for the elastic support member (540) to support a plurality of conductive probes (513) simultaneously. In this case, the elastic support member (540) is formed as a single unit. The side of the elastic support member (540) contacts the side of the connecting member (530). It is also possible for the elastic support member (540) to be integrated and connected to the connecting member (530).
[0165] In this way, when the elastic support part (540) comes into contact with or is integrated with the connecting part (530), there is an advantage of easy manufacturing.
[0166] FIG. 20 illustrates various shapes of a conductive probe (513) in an inspection socket (100) of the present invention.
[0167] In the previous embodiment, the conductive probe (513) was exemplified as having a columnar shape, but alternatively, it is possible for the lower part to be a truncated cone shape and the upper part to be a columnar shape with a small diameter (Fig. 20(a)), a truncated cone shape (Fig. 20(b)), or a columnar shape with a pointed probe formed at the top (Fig. 20(c)). By changing the shape of the conductive probe (513) in this way, it is possible to reduce contact resistance and minimize damage to the terminals of the device (600).
[0168] Although the technical concept of the present disclosure has been described by some embodiments and examples illustrated in the accompanying drawings, it should be understood that various substitutions, modifications, and changes may be made without departing from the technical concept and scope of the present disclosure as understood by those skilled in the art to which the present disclosure pertains. Furthermore, such substitutions, modifications, and changes should be considered to fall within the scope of the appended claims.
Claims
1. A test connector connected to a terminal of a device to be tested and for performing an electrical test on said device to be tested, An upper substrate having a plurality of first upper patterns formed thereon, and a first lower pattern formed on the lower surface that is electrically connected to the first upper patterns; A lower substrate spaced downward from the upper substrate, the lower substrate having a second upper pattern formed on its upper surface to face the first lower pattern, and a second lower pattern formed on its lower surface that is electrically connected to the second upper pattern; A connecting portion disposed between the upper substrate and the lower substrate and electrically connecting the first lower pattern and the second upper pattern to each other; and It includes an elastic support member disposed between the upper substrate and the lower substrate and elastically supporting the upper substrate while its lower surface is in contact with the lower substrate, In the first upper pattern above, a conductive probe is formed that protrudes upward and contacts a terminal of the device under test, and When the first lower pattern and the conductive probe are projected onto a virtual plane parallel to the upper surface of the lower substrate, the first lower pattern and the conductive probe are in a misaligned positional relationship with each other, and The above elastic support member is characterized by being positioned at least partially below the conductive probe and absorbing the pressure while elastically deforming when the terminal of the device to be tested presses the conductive probe.
2. In Paragraph 1, An inspection connector characterized in that the above elastic support is made of one of silicone, rubber, or urethane.
3. In Paragraph 1, An inspection connector characterized in that the upper substrate is made of a softer material than the lower substrate.
4. In Paragraph 3, An inspection connector characterized in that the upper substrate is made of a polyimide material and the lower substrate is made of an epoxy-based material.
5. In Paragraph 1, An inspection connector characterized in that the spacing of the first upper pattern and the spacing of the first lower pattern are different from each other.
6. In Paragraph 1, The above-mentioned connecting portion is a solder ball formed on a second upper pattern and is connected to the first lower pattern, characterized by being an inspection connector.
7. In Paragraph 1, The above-mentioned connecting portion is characterized by being made of a conductive rubber sheet mixed with an elastic insulating material and conductive particles.
8. In Paragraph 7, The above conductive rubber sheet is, An inspection connector characterized by comprising a conductive part composed of an elastic insulating material and conductive particles, and an insulating part that supports the conductive part.
9. In Paragraph 8, The above conductive rubber sheet is, An inspection connector characterized by being supported by a frame.
10. In Paragraph 1, The above connecting part is, A test connector characterized by being an intermediate substrate having vias formed therein that electrically connect the first lower pattern and the second upper pattern.
11. In Paragraph 10, The above intermediate substrate is characterized by being made of polyimide or epoxy material.
12. A test connector connected to a terminal of a device under test and performing an electrical test on said device under test, An upper substrate having a plurality of first upper patterns having a first pitch formed on an upper surface, and a plurality of first lower patterns formed on a lower surface that are electrically connected to the first upper patterns and have a second pitch different from the first pitch; A lower substrate spaced downward from the upper substrate, the lower substrate having a plurality of second upper patterns formed on an upper surface facing a first lower pattern, and a plurality of second lower patterns formed on a lower surface electrically connected to the second upper pattern; A plurality of connecting portions disposed between the upper substrate and the lower substrate and electrically connecting the first lower pattern and the second upper pattern to each other; and It includes an elastic support member disposed between the upper substrate and the lower substrate, elastically supporting the upper substrate while its lower surface is in contact with the lower substrate, and disposed between a plurality of connecting parts. In a plurality of first upper patterns, a conductive probe is formed that protrudes upward and contacts a terminal of the device under test, and When the first lower pattern and the conductive probe are projected onto a virtual plane parallel to the upper surface of the lower substrate, the first lower pattern and the conductive probe are in a misaligned positional relationship with each other, and The above elastic support member is characterized by being positioned at least partially below the conductive probe and absorbing the pressure while elastically deforming when the terminal of the device to be tested presses the conductive probe.
13. In Paragraph 12, An inspection connector characterized by the above-mentioned elastic support member individually supporting each conductive probe.
14. In Paragraph 12, An inspection connector characterized by the above-mentioned elastic support supporting two or more conductive probes.
15. In Paragraph 14, An inspection connector characterized by having a void space formed between the above-mentioned connecting part and the elastic support part.
16. In Paragraph 14, An inspection connector characterized in that the side of the elastic support member is in contact with the side of the connection member.
17. A test socket connected to a terminal of a device under test for performing an electrical test on said device under test, An upper substrate having a first upper pattern formed on the upper surface with a conductive probe protruding upward, and a first lower pattern formed on the lower surface that is electrically connected to the first upper pattern and positioned offset upward from the conductive probe, and A lower substrate spaced downward from the upper substrate, comprising: a second upper pattern formed on an upper surface facing the first lower pattern; and a lower substrate having a second lower pattern formed on a lower surface electrically connected to the second upper pattern. A connecting portion disposed between the upper substrate and the lower substrate and electrically connecting the first lower pattern and the second upper pattern to each other, An inspection connector comprising an elastic support member disposed between the upper substrate and the lower substrate, and elastically supporting the upper substrate while the lower surface is in contact with the lower substrate; A guide member installed on the upper part of the above-mentioned inspection connector and having a receiving hole for accommodating a device to be inspected; A cover member detachably coupled to the upper surface of the guide member by means of a latch means; A pusher that is elastically supported by the cover member and has at least a portion inserted into the guide member to press the device under test toward the upper substrate; An inspection socket characterized in that when the conductive probe and the elastic support are projected onto a virtual plane parallel to the upper surface of the lower substrate, the first lower pattern and the conductive probe are in a misaligned positional relationship.