Electronic device comprising connector

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: a housing including a frame formed of a metal material, an injection member coupled to the frame, and a connector hole formed through a portion of the frame and a portion of the injection member; a display disposed on the front surface of the housing; a cover member disposed on the rear surface of the housing; and a connector which is disposed inside the housing and connectable to an external electronic device through the connector hole. At least a portion of the frame may include a first portion facing a first surface of the connector, which faces the display, and a second portion that faces a second surface of the connector, which faces the cover member, and is separated from the first portion.

Description

Electronic device including a connector

[0001] The various embodiments disclosed in this document relate to electronic devices including connectors.

[0002] In portable electronic devices, particularly ultra-slim mobile devices such as tablets or smartphones, a structure that simultaneously satisfies housing rigidity, water resistance, and antenna performance may be required.

[0003] The electronic device adopts a structure in which the metal on the outer edge of the frame and the metal on the inner edge of the frame are separated and spaced apart to use a portion of the metal on the outer edge of the frame as an antenna, and a strip-shaped injection molding is applied between the metals. In this case, rigidity is secured by a structure in which the entire periphery of the connector is wrapped in metal.

[0004] However, electrical interference occurs between the metal surrounding the connector and the connector in terms of antenna performance, which may result in unsatisfactory antenna performance when using electronic devices.

[0005] If sufficient thickness is secured in the electronic device, antenna performance and waterproofing can be ensured by appropriately separating the metal and injection molding; however, in the case of ultra-slim mobile devices, there are structural constraints regarding this.

[0006] To ensure the waterproof performance of electronic devices, it is necessary to secure a bonding space between the metal and injection molding areas; additionally, to ensure rigidity, it is necessary to expand the surface area of ​​the metal material compared to the injection molding material to secure a structure that prevents the charging part from being damaged by external impact.

[0007] Therefore, there is a growing need for a housing structure that can secure rigidity, water resistance, and antenna performance while maintaining minimum thickness in ultra-slim mobile devices.

[0008] An electronic device according to one embodiment of the present disclosure provides a housing structure in which a frame formed of a metal material and an injection molded member are combined, which enables the implementation of a bonding structure even in an ultra-slim mobile device environment where the thickness of the housing is limited, while simultaneously satisfying rigidity, waterproof performance, and antenna performance around the connector hole.

[0009] An electronic device according to one embodiment of the present disclosure may include a housing comprising a frame formed of a metal material and an injection molded member coupled to the frame, and a connector hole formed through a part of the frame and a part of the injection molded member, a display disposed on the front of the housing, a cover member disposed on the back of the housing, and a connector disposed inside the housing and capable of connecting to an external electronic device through the connector hole. At least a part of the frame may include a first part facing a first surface of the connector facing the display and a second part separated from the first part and facing a second surface of the connector facing the cover member.

[0010] In an electronic device according to one embodiment, a first part and a second part may be joined through an injection molding member. A connector may be positioned to be supported at least partially through an injection molding member. A connector may be positioned spaced apart from the first part and the second part. A connector may be positioned along the longitudinal direction of a frame.

[0011] In an electronic device according to one embodiment, at least one of the first part and the second part has a stepped edge, and the stepped part may be joined to an injection member. The first part may have a length in a direction parallel to the longitudinal direction of the connector hole. At least a portion of the injection member may be joined to at least a portion of the second part between the second part and the cover member. The first part and / or the second part may have a length of at least 2 mm in the longitudinal direction from the portion where the connector hole begins.

[0012] In an electronic device according to one embodiment, the display may include a display panel and a bending portion extending from the display panel and folding toward the back of the display panel, and may further include a cushioning pad disposed between the bending portion and a first portion. A first region of the first portion may have a thickness so as to be spaced apart from the display. When the display is viewed from above, the first portion of the frame may have a length that overlaps at least a portion with the terminal portion of the connector. When the display is viewed from above, the second portion of the frame may have a length that overlaps at least a portion with the terminal portion of the connector. The device includes a bending portion extending from the display panel and folding toward the back of the display panel, and the bending portion may be disposed such that at least a portion faces the first portion of the frame.

[0013] In an electronic device according to one embodiment, the housing includes a side, and a connector hole may be disposed on the side. A frame forms at least a portion of the side, and a first portion and / or a second portion may extend from the side.

[0014] An electronic device according to one embodiment may include at least one antenna disposed inside a housing and, when the rear side is viewed from above, overlaps at least a portion of a first portion. It may include at least one antenna disposed inside a housing and, when the rear side is viewed from above, overlaps at least a portion of a second portion. A connector may be disposed spaced apart from the antenna.

[0015] In an electronic device according to one embodiment, a first part of the frame and an injection member can be joined, each having a thickness of at least 0.25 mm.

[0016] An electronic device according to one embodiment of the present disclosure comprises a housing including a frame formed of a metal material and an injection molded member coupled to the frame, a display disposed on the front of the housing, a cover member disposed on the back of the housing, and a connector disposed inside the housing and capable of connecting to an external electronic device through a connector hole, thereby enabling the simultaneous securing of rigidity, water resistance, and antenna performance while maintaining the minimum thickness required for an ultra-slim mobile device.

[0017] In addition, at least one of the first and / or second parts of the frame has a stepped edge, and by combining the stepped edge with an injection molded member, a waterproof structure of the housing can be reliably implemented.

[0018] In addition, the antenna placed inside the housing is positioned to overlap with at least a part of the first or second part, and the connector is positioned to be spaced apart from the antenna, thereby preventing degradation of the antenna's performance.

[0019] Thus, the electronic device according to the present invention can provide a housing structure that satisfies rigidity, water resistance, and antenna performance in an ultra-slim mobile device by optimizing the structural combination of the frame and the injection molded member and the arrangement of the connector and antenna.

[0020] The effects obtainable from an electronic device according to various embodiments of the present disclosure are not limited to the effects mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in this specification.

[0021] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0022] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0023] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0024] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 2b is a perspective view of the rear side of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0026] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0027] FIG. 4 is an exploded perspective view of a display module according to various embodiments disclosed in this document.

[0028] FIG. 5 is a partial cross-sectional view of an electronic device according to one embodiment of the present disclosure.

[0029] FIG. 6 is a cross-sectional view of the electronic device of FIG. 5 according to one embodiment of the present disclosure, cut along the AA line.

[0030] FIG. 7 is a drawing for explaining the structure of a frame of an electronic device according to one embodiment of the present disclosure.

[0031] FIG. 8 is a cross-sectional view of the electronic device of FIG. 5 according to one embodiment of the present disclosure, cut along the BB line.

[0032] FIG. 9 is a drawing showing a state in which a plug is inserted into the electronic device of FIG. 6 according to one embodiment of the present disclosure.

[0033] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.

[0034] In relation to the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of the noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise.

[0035] In this document, each of the phrases such as “A or B,” “at least one of A and B,” “or at least one of B,” “A, B or C,” “at least one of A, B and C,” and “B, or at least one of C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said component may be connected to said other component directly (e.g., wired), wirelessly, or through a third component.

[0036] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0037] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0038] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0039] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0040] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0041] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0042] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0043] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0044] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0045] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0046] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0047] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0049] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0050] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0051] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0052] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0053] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0054] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0055] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0056] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0057] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0058] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0059] The electronic device (200) described below may include at least one of the components of the electronic device (101) described above in FIG. 1.

[0060] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing (210) may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2a. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0061] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0062] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0063] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0064] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The sound output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (210) excluded.

[0065] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM (heart rate monitor) sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201). The electronic device (200) may further include at least one of the unillustrated sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0066] The camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0067] A key input device (217) may be placed on the side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) that is not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0068] An indicator may be placed, for example, on a first surface (210A) of a housing (210). The indicator may provide status information of an electronic device (200), for example, in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide a light source that corresponds to the operation of a camera module (205), for example. The indicator may include, for example, a light-emitting diode (LED), an infrared (IR) LED, and / or a xenon lamp.

[0069] The connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0070] Some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be visually exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). According to one embodiment, the area facing the display (201) and the camera module (205) may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. These transparent areas may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image with an image sensor to generate an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the area of ​​the display (201) facing the sensor modules may not require a perforated opening.

[0071] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" may mean an electronic device that is capable of bending deformation of a display (e.g., display (330) in FIG. 3), so that at least a portion may be folded, wound or rolled, at least a portion of the area may be expanded, and / or can be housed inside a housing (e.g., housing (210) in FIG. 2a and 2b). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0072] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0073] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIG. 2a and FIG. 2b, or may include other embodiments of the electronic device.

[0074] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 2a or FIG. 2b) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or support structure), a front plate (320) (e.g., a front cover) (e.g., the front plate (202) of FIG. 2a), a display (330) (e.g., the display (201) of FIG. 2a), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover) (e.g., the rear plate (211) of FIG. 2b). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311), or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and redundant descriptions are omitted below.

[0075] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. A display (330) may be attached to one side of the first support member (311), and a substrate (340) may be attached to the other side. The substrate (340) may be equipped with a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0076] Memory may include, for example, volatile memory or non-volatile memory.

[0077] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD (secure digital) card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector.

[0078] The battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the substrate (340). The battery (350) may be integrally disposed inside the electronic device (300). In one embodiment, the battery (350) may be disposed detachably from the electronic device (300).

[0079] An antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external electronic device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or a combination thereof of the side bezel structure (310) and / or the first support member (311).

[0080] FIG. 4 is an exploded perspective view of a display according to various embodiments disclosed in this document.

[0081] In the following description, a display (410) (e.g., the display module (160) of FIG. 1, the display (201) of FIG. 2a) may refer to a device for visually displaying information. A display (410) may be understood as a set of components for visually displaying information. The components of the display (410) shown in FIG. 4 are merely examples of components included in the display (410), and the display (410) may be configured by omitting some of the components shown in FIG. 4, or by adding other components other than those shown in FIG. 4.

[0082] The display (410) may include a flat type display panel (413) of the OCTA (on cell touch AMOLED (active matrix organic light-emitting diode)) method. In addition, the display (410) may include an unbreakable type OLED display (e.g., a curved display) panel (413). Furthermore, the light-emitting element constituting the display panel (413) may be implemented as an inorganic light-emitting element made using inorganic materials, which is different from an OLED (organic light-emitting diode) made using organic materials. According to various embodiments, the light-emitting element may be a micro LED (light-emitting diode) (u-LED). A micro LED may refer to an ultra-small inorganic light-emitting element with a size of 100 micrometers (μm) or less that emits light on its own without a backlight or color filter.

[0083] Referring to FIG. 4, the display (410) may include a window layer (411), a polarizing layer (412) (POL (polarizer)) (e.g., a polarizing film) sequentially disposed on the back surface of the window layer (411), a display panel (413), a polymer layer (414), and a conductive layer (415). In some embodiments, the display panel (413) may include a digitizer panel (416) disposed between the polymer layer (414) and the conductive layer (415), or on the back surface of the conductive layer (415).

[0084] According to various embodiments, the window layer (411) may include a glass layer. According to one embodiment, the window layer (411) may include ultra-thin glass (UTG). In some embodiments, the window layer (411) may include a polymer. In this case, the window layer (411) may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, the window layer (411) may be arranged in a plurality of layers to include a glass layer and a polymer.

[0085] According to one embodiment, the window layer (411), the polarizing layer (412), the display panel (413), the polymer layer (414), and the conductive layer (415) may be attached to each other through an adhesive (P1, P2, P3, P4) (or adhesive). For example, the adhesive (P1, P2, P3, P4) may include at least one of an optical clear adhesive (OCA), a pressure-sensitive adhesive (PSA), a thermoreactive adhesive, a general adhesive, or a double-sided tape.

[0086] According to various embodiments, the display panel (413) may include a plurality of pixels and a wiring structure (e.g., an electrode pattern). According to one embodiment, the polarizing layer (412) may selectively pass light generated from a light source of the display panel (413) and vibrating in a certain direction. According to one embodiment, the display panel (413) and the polarizing layer (412) may be formed integrally. According to one embodiment, the display panel (413) may include a touch panel (not shown). Components included in the display panel (413) may be disposed on a substrate of the display panel (413). The substrate of the display panel may be formed of a rigid material such as glass. In some embodiments, the substrate of the display panel may be formed of a flexible material. For example, it may be formed of a flexible material such as polyimide (PI), polyethylene terephthalate (PET), or ultra-thin-glass (UTG).

[0087] According to various embodiments, the polymer layer (414) may be formed of a cushioning material (e.g., cushion) for cushioning, and may be placed below the display panel (413) to provide a dark background for ensuring visibility of the display panel (413). For example, the polymer layer (414) may include an opaque metal layer (e.g., a black layer containing a rough pattern) to remove air bubbles that may occur between the display panel (413) and its lower attachments and to block light generated from the display panel (413) or light incident from the outside, and / or a cushioning layer (e.g., a sponge layer) placed for shock absorption. In some embodiments, for waterproofing of the display (410), the polymer layer (414) may be removed or placed below the conductive layer (415).

[0088] According to one embodiment, the conductive layer (415) may comprise at least one of SUS (steel use stainless) (e.g., STS (stainless steel)), Cu, Al, or a metal CLAD (e.g., a layer in which SUS and Al are alternately arranged). In some embodiments, the conductive layer (415) may comprise other alloy materials. In some embodiments, the conductive layer (415) may be used to help reinforce the rigidity of an electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2a, and / or the electronic device (300) of FIG. 3), to shield ambient noise, and to dissipate heat emitted from surrounding heat dissipation components. Although FIG. 4 is illustrated as having the conductive layer (415) formed with the same area as the display panel (413), in some embodiments, the conductive layer (415) may be placed on a portion of the display panel (413). In some cases, the conductive layer (415) may be omitted.

[0089] According to one embodiment, the digitizer panel (416) may be disposed between the conductive layer (415) and the polymer layer (414). In some cases, the digitizer panel (416) may be disposed below the conductive layer (415). The digitizer panel (416) may be a detection member that receives input from a pen input device (e.g., a stylus). In one embodiment, the digitizer panel (416) may include a plurality of conductive patterns (not shown). For example, the digitizer panel (416) may include a plurality of conductive loops. Current flowing through the plurality of conductive loops may form a magnetic field. When an external electronic device (e.g., a stylus) including a coil comes into close to the magnetic field formed by the digitizer panel (416), a resonant frequency may be generated. The resonant frequency may be determined according to the inductance and capacitance of the external electronic device. A digitizer circuit controlling the operation of a digitizer panel (416) can recognize a specific frequency and a location where the specific frequency is recognized by utilizing a plurality of conductive loops included in the digitizer panel (416). For example, when a pen input device approaches the digitizer panel (416), the digitizer circuit can identify the occurrence and location of the resonance frequency of the pen input device. Through this, the pen input of the pen input device can be recognized.

[0090] According to one embodiment, the display (410) may include at least one functional member (not shown) disposed between the polymer layer (414) and the conductive layer (415), or below the conductive layer (415). According to one embodiment, the functional member may include a graphite sheet for heat dissipation, a touch sensor supporting the touch function of the display (410), a force touch FPCB, a fingerprint sensor FPCB, a communication antenna radiator, or a conductive / non-conductive tape.

[0091] According to one embodiment, the display (410) may include a first connecting member (420) (e.g., a bending member) that is positioned in a manner that folds (e.g., bending) from the display panel (413) to at least a portion of the back surface of the display (410). According to one embodiment, the first connecting member (420) may be electrically connected to the display panel (413). The first connecting member (420) may include a control circuit (e.g., a DDI (display driver IC)) (501). A second connecting member (not shown) connected to the first connecting member (420) may include a TDDI (touch display driver IC) (not shown). In some embodiments, the first connecting member (420) connected to the display panel (413) may include both the control circuit (421) and the TDDI.

[0092] In one embodiment, the first connecting member (420) may be formed integrally with the substrate of the display panel (413). The first connecting member (420) may be a part of the substrate on which the light-emitting element of the display panel (413) is placed. The first connecting member (420) may include a portion that extends from the substrate of the display panel (413) and at least a portion of which is deformed to extend to the back surface of the display panel (413). In one embodiment, the display (410) may include a COP (chip on panel) structure in which a control circuit (421) is placed on the first connecting member (420) formed integrally with the substrate of the display panel (413).

[0093] In one embodiment, the first connecting member (420) may be formed separately from the substrate of the display panel (413) and electrically connected to the display panel (413). In this case, the first connecting member (420) may be a printed circuit board formed of a flexible material (e.g., a flexible printed circuit board (FPCB)). A portion of the first connecting member (420) connected to the display panel (413) may be deformed and extended to the back surface of the display panel (413). In one embodiment, the display (410) may include a COF (chip on film) structure in which a control circuit (421) is disposed on the first connecting member (420) electrically connected to the display panel (413).

[0094] According to various embodiments, various components related to driving the display (410) may be disposed in the first connecting member (420). For example, passive components such as a flash memory for the display, an ESD (electrostatic discharge) protection diode, a pressure sensor, and / or a decap may be disposed in the first connecting member (420). For example, active components such as a DDI (display driver integrated circuit) may be disposed in the first connecting member (420).

[0095] FIG. 5 is a partial cross-sectional view of an electronic device according to one embodiment of the present disclosure. FIG. 6 is a cross-sectional view of the electronic device of FIG. 5 according to one embodiment of the present disclosure, cut along the AA line, and FIG. 7 is a drawing for explaining the structure of the frame of the electronic device according to one embodiment of the present disclosure. FIG. 8 is a cross-sectional view of the electronic device of FIG. 5 according to one embodiment of the present disclosure, cut along the BB line.

[0096] Hereinafter, with reference to FIGS. 5 to 8, the configuration of an electronic device according to one embodiment of the present invention will be described in detail.

[0097] An electronic device (500) according to one embodiment of the present invention may include a frame (510) formed of a metal material, an injection member (560) coupled to the frame (510), a housing (520) including a connector hole (553) formed through a part of the frame (510) and a part of the injection member (560), a display (530) disposed on the front of the housing (520), a cover member (540) disposed on the back of the housing (520), and a connector (550) disposed inside the housing (520) and capable of connecting to an external electronic device (500) through the connector hole (553).

[0098] The frame (510) may include a first part (511) facing a first surface (551) of the connector (550) facing the display (530) and a second part (512) separated from the first part (511) and facing a second surface (552) of the connector (550) facing the cover member (540). In one embodiment, the frame (510) may be formed of a metal material. The frame (510) may be implemented in various metal materials such as aluminum, stainless steel, magnesium alloy, etc.

[0099] In one embodiment of the present invention, a first part (511) of the frame (510) may extend toward the display (530), and a second part (512) may extend toward the cover member (540). Additionally, the first part (511) and the second part (512) may be positioned on the side (521) of the housing (520) to surround both sides of the connector hole (553). For example, the first part (511) may be designed to protrude in the front direction from the side (521) of the housing (520), and the second part (512) may be designed to protrude in the back direction from the side (521) of the housing (520).

[0100] The first part (511) may have a length in a direction parallel to the longitudinal direction of the connector (550). The first part (511) may be extended along the longitudinal direction of the connector (550) to prevent shaking of the connector (550). The longitudinal extension of the first part (511) of the connector (550) can increase the support force of the connector (550) and improve the precision of the assembly process. The length of the first part (511) can contribute to stable support of the connector (550) and securing internal space. For example, the length of the first part (511) can be set to 2 mm or more to secure wiring routing space. The length of this first part (511) can be adjusted according to the specifications of the connector (550) and the design standards of the housing (520).

[0101] The first part (511) may be positioned parallel to the first surface (551) of the connector (550). In one embodiment of the present disclosure, the positional stability of the connector (550) can be secured by the first part (511) being positioned facing the first surface (551) of the connector (550). The first part (511) can facilitate positional alignment during the assembly process by being positioned facing the first surface (551) of the connector (550). This positioning structure can prevent shaking of the connector (550) and increase durability against external impacts. Therefore, the facing positioning structure can improve the electrical connection reliability of the connector (550).

[0102] The first region (5111) of the first part (511) may have a thickness so as to be spaced apart from the display (530). The first region (5111) of the first part (511) may be designed with a thickness of at least 0.25 mm to prevent interference with the display (530).

[0103] A waterproof member (5112) may be disposed on one side of the first area (5111) in a direction facing the display (530). The waterproof member (5112) may be made of a rubber material (e.g., gasket, sealing packing) or a silicone material to block moisture or foreign substances from entering the frame (510). The waterproof member (5112) may be combined with a molding part (5113) disposed on the bending part (532) to protect the interior of the frame (510) from external foreign substances. In one embodiment, the first area (5111) may form the housing (520) using only a metal frame as the minimum thickness area of ​​the first part (511). Since the first area (5111) is made only of metal without the combination of injection molding members, it can increase the supporting force that firmly supports the molding part (5113) while minimizing the thickness. In addition, by using a metal material for the first region (5111), external moisture or foreign substances can be more strongly blocked from entering the frame (510) even when the thickness is reduced.

[0104] The first region (5111) is spaced apart from the display (530) by a certain distance (d2) to contribute to heat mitigation and prevention of damage to the electronic device (500). Specifically, the thickness and spacing structure of the first region (5111) in the first part (511) can prevent interference with the display (530) and satisfy the criteria for heat mitigation and prevention of damage. The thickness of the first part (511) can be designed to secure a heat dissipation path for the display (530), and the spacing structure can absorb deformation caused by the expansion or contraction of the display (530).

[0105] In one embodiment of the present invention, when the display (530) is viewed from above, the first part (511) of the frame (510) may have a length that overlaps at least a portion with the terminal part (5502) of the connector (550). The first part (511) of the frame (510) may be arranged so that a certain portion overlaps with the terminal part (5502) of the connector (550) when viewed from the direction of the display (530). The overlapping length may be determined by the length of the terminal part (5502) of the connector (550) or the length of the first part (511) of the frame (510). For example, the first part (511) of the frame (510) may be implemented in a structure that covers at least 50% of the terminal part (5502) of the connector (550).

[0106] The second part (512) of the frame (510) may be positioned parallel to the second surface (552) of the connector (550). The second part (512) may have a structure facing the second surface (552) of the connector (550) toward the cover member (540). The second part (512) may be positioned parallel to the second surface (552) of the connector (550) to provide a structural connection with the cover member (540). The second part (512) may fix the position of the connector (550) to minimize alignment errors with the cover member (540).

[0107] The first part (511) and the second part (512) of the frame (510) can be joined through an injection member (560). Referring to FIG. 7, the first part (511) and the second part (512) of the frame (510) are spaced apart by a certain distance with the connector hole (553) in between and can be joined through an injection member (560). The first part (511) and the second part (512) are positioned above, below, or to the left and right of the connector hole (553) to stably support the connector (550).

[0108] The first part (511) and the second part (512) have a length of at least 2 mm in the longitudinal direction from the part where the connector (550) starts and can be combined with the injection member (560). The lengths of the first part (511) and the second part (512) are set to be 2 mm or more to increase assembly stability and provide space for wiring routing and process tolerance absorption around the connector hole (553).

[0109] In one embodiment of the present disclosure, the first part (511) and the second part (512) can optimize the arrangement of the metal surface area and the injection member (560) to ensure the performance of the antenna (5102). The metal surface area of ​​the first part (511) and the second part (512) can be limited so as not to impair the radiation efficiency of the antenna (5102). The injection member (560) can minimize the loss of RF signals by ensuring a separation distance from the antenna (5102).

[0110] At least one of the first part (511) and the second part (512) has a stepped portion (5101) on both sides, and the stepped portion (5101) can be combined with an injection member (560).

[0111] The injection member (560) is inserted and molded into a surface that comes into contact with a part of the frame (510), thereby ensuring airtightness at the joint with the frame (510).

[0112] In at least one embodiment of the present disclosure, the injection member (560) may be made of an insulating resin such as polycarbonate or ABS. The injection member (560) may use an insulating resin to prevent electrical interference between the antenna (5102) and an adjacent metal member.

[0113] An electronic device (500) according to one embodiment of the present invention may form a stepped structure at the joint between the frame (510) and the injection member (560) for waterproofing. The stepped structure forms a step at the joint between the frame (510) and the injection member (560), thereby blocking the penetration path of external moisture. The stepped shape can provide a multi-sealing effect by utilizing the step of the injection member (560). At this time, the shape of the injection member (560) can be precisely machined to match the step portion (5101) of the stepped shape.

[0114] The step portion (5101) can increase the contact force by widening the contact area where the frame (510) and the injection molded member (560) come into contact. The step portion (5101) can enhance waterproof performance without sufficient sealing space at the joint between the frame (510) and the injection molded member (560), thereby ensuring effective waterproof performance without increasing the thickness of the ultra-slim mobile device.

[0115] Referring to FIG. 8, the edges of both the first part (511) and the second part (512) are formed with a stepped structure to expand the bonding surface with the injection member (560). The stepped part (5101) can expand the contact area of ​​the waterproof sealing to block the penetration of external moisture.

[0116] In one embodiment, the joint portion between the first portion (511) and the injection member (560) has a display (530) placed adjacently, so due to thickness constraints, the contact area in the longitudinal direction of the connector (550) may be narrower than the joint portion between the second portion (512) and the injection member (560). Therefore, the electronic device (500) of the present invention may increase the contact area by providing a step portion (5101) in the joint portion between the first portion (511) and the injection member (560).

[0117] The joint between the frame (510) and the injection member (560) can be implemented by ultrasonic welding, mechanical fastening, or double injection. In this case, the stepped portion (5101) can engage with the protrusion or groove of the injection member (560) to increase the mechanical bonding strength. A silicone packing, O-ring, or adhesive sealant may be applied to the joint.

[0118] In addition, in one embodiment of the present disclosure, the frame (510) can increase the bonding strength by micro-machining or surface roughness control at the portion where it is joined to the injection member (560). The joining portion between the frame (510) and the injection member (560) may include structures such as micro-grooves, protrusions, or undercuts to increase the bonding strength with the injection member (560). At this time, by controlling the surface roughness of the joining portion, the adhesion strength between the frame (510) and the injection member (560) can be increased, and airtightness can be maintained even under repeated external impacts.

[0119] The injection member (560) can minimize RF signal loss by securing a separation distance from the antenna (5102), and the ratio of the metal area of ​​the frame (510) to the placement ratio of the injection member (560) can be adjusted considering the radiation efficiency of the antenna (5102).

[0120] At least a portion of the injection molded member (560) can be combined with at least a portion of the first portion (511) between the first portion (511) and the display (530). At this time, the thickness (d4) of the injection molded member (560) and the thickness (d3) of the first portion (511) of the frame (510) each have a thickness of at least 0.25 mm and can be combined to ensure assembly stability. The thickness standard can be set to satisfy the minimum rigidity and waterproof performance of the ultra-slim mobile device. For example, a thickness of 0.25 mm or more can meet the minimum standards required for USB life test and waterproof test.

[0121] The housing (520) includes a side (521), and a connector hole (553) may be formed in the side (521) so that a plug (5501) can be inserted into the connector (550). The frame (510) forms at least a portion of the side (521), and a first portion (511) and / or a second portion (512) of the frame (510) may extend from the side (521).

[0122] The side (521) of the housing (520) may be implemented as a flat or curved surface extending along the length or width direction of the device.

[0123] An electronic device (500) according to one embodiment of the present invention may include at least one antenna (5102) that overlaps with at least a portion of a first part (511) and a second part (512) when the rear side of the electronic device (500) is viewed from above while being disposed inside a housing (520).

[0124] The electronic device (500) may include an antenna (5102) module for transmitting and receiving RF signals. The antenna (5102) module may be placed inside the housing (520) or in a part of the frame (510). The antenna (5102) may be implemented using FPCB (flexible printed circuit) or LDS (laser direct structuring). The pattern of the antenna (5102) may be spaced apart from the metal area of ​​the first part (511) to increase radiation efficiency.

[0125] The antenna (5102) module can support various frequency bands such as LTE, 5G, Wi-Fi, and Bluetooth. The antenna (5102) module is positioned so as to be spaced apart from the metal frame, thereby minimizing signal loss due to the metal material.

[0126] An antenna (5102) placed inside the housing (520) or in a part of the frame (510) requires separation and spacing from the inner metal, and electrical isolation of the antenna (5102) can be achieved by applying an injection member (560) between the metals. The injection member (560) can control the flow of RF signals to increase the radiation efficiency of the antenna (5102) and secure optimal antenna (5102) performance.

[0127] The display (530) includes a display panel (531) and a bending portion (532) that extends from the display panel (531) and folds toward the back of the display panel (531), and may further include a cushioning pad (570) disposed between the bending portion (532) and the first portion (511). The display (530) may be implemented as a flexible panel and may extend into the housing (520) through the bending portion (532).

[0128] In at least one embodiment of the present disclosure, the display (530) may be positioned on the front of the housing (520). The display (530) may be positioned in a flat structure that covers the entire front of the housing (520). The display (530) may be positioned adjacent to the first part (511) of the frame (510) to form a sense of unity with the front of the housing (520). The display (530) may be positioned with a gap of at least 0.5 mm from the corner of the housing (520) to reduce the risk of damage. The display (530) may be implemented in various forms, such as a touch panel, an OLED, or an LCD panel.

[0129] The bending part (532) can be folded to the back of the display panel (531) to efficiently use the internal space.

[0130] The bending portion (532) may be positioned so that at least a portion of it faces the first portion (511) of the frame (510).

[0131] The bending portion (532) extends from the bottom of the display panel (531) and can be folded into the housing (520) and can serve to distribute stress at the connection between the display (530) and the housing (520).

[0132] The bending portion (532) is positioned at a certain distance from the first portion (511) of the frame (510) to minimize structural interference. The radius of curvature of the bending portion (532) can be designed to prevent damage to the display (530). The molding portion (5113) is positioned on the bending portion (532) and, through combination with the waterproof member (5112), can prevent external foreign substances from entering the frame (510). The molding portion (5113) can be composed of a molding material such as rubber resin, TPU (Thermoplastic Polyurethane), or epoxy mold, and can block the path for external foreign substances to penetrate into the frame (510) by combining with the waterproof member (5112). Additionally, the molding part (5113) can prevent damage to the electronic device (500) by fixing the position of the bending part (532) and acting as a structural buffer when the electronic device (500) receives an external shock. Furthermore, it can prevent circuit damage caused by electrostatic discharge (ESD) by insulating the terminals of the electronic device (500) that are electrically connected to the connector (550).

[0133] The cushioning pad (570) can be made of silicone, urethane foam, or rubber material and inserted between the bending part (532) and the first part (511). The cushioning pad (570) can prevent external impact from being directly transmitted to the display (530) and can relieve stress concentration caused by repeated folding of the display (530) and external load.

[0134] In one embodiment, the thickness of the cushioning pad (570) may be set according to the distance between the bending portion (532) and the first portion (511) of the frame (510) and the durability standard of the display panel (531). The thickness of the cushioning pad (570) may be determined by considering the stress distribution that occurs during repeated folding of the bending portion (532). For example, if the thickness of the cushioning pad (570) is increased, the shock absorption performance may be improved.

[0135] In one embodiment, the cushioning pad (570) can be designed to provide sufficient shock absorption performance while minimizing the increase in the overall thickness of the electronic device (500). The cushioning pad (570) is designed with a minimum thickness to maintain the ultra-slim structure of the electronic device (500). The cushioning pad (570) can achieve optimal shock absorption performance by combining the elastic modulus of the material and the thickness.

[0136] A cover member (540) may be placed on the back surface of the housing (520). The cover member (540) may be placed in a plate-like structure that covers the entire back surface of the housing (520) and may be fixed to the housing (520) using screws, clips, or double-sided tape. At this time, the cover member (540) may be designed to be detachable from the housing (520) for maintenance of internal components such as a battery and a circuit board. The cover member (540) may be made of tempered glass, plastic, or a metal material such as aluminum or magnesium for heat dissipation, and may be designed to be in close contact with the frame (510) for protection of internal components and heat dissipation.

[0137] The cover member (540) is positioned adjacent to the second part (512) of the frame (510) to form a sense of unity with the back surface of the housing (520). The cover member (540) can be implemented with a material having heat dissipation and impact resistance properties and can be designed with a thickness of 0.5 mm or more to protect internal components. The cover member (540) can be combined with the second part (512) of the frame (510) to protect internal components.

[0138] The connector (550) is positioned inside the housing (520) and can be connected to an external cable or terminal through the connector hole (553). The connector (550) can be supported by an injection molded member (560) or a frame (510) and fixed so that its position does not change due to vibration or shock. The connector (550) can support various standards such as USB, Type-C HDMI, and audio jacks.

[0139] The connector (550) may be spaced apart from the first part (511) and the second part (512) of the frame (510) along the longitudinal direction of the frame (510). The connector (550) includes a terminal portion (5502), and as one side of the terminal portion (5502), it may include a first surface (551) facing the first part (511) and a second surface (552) facing the second part (512).

[0140] The connector (550) may be positioned to be supported at least partially through the injection member (560). The connector (550) may have increased durability against vibration and shock by the support structure of the injection member (560).

[0141] The connector (550) can be directly connected to an external cable or plug (5501) through the connector hole (553). The connector (550) can be connected to a PCB (printed circuit board) by soldering or FPC (flexible circuit). The terminal portion (5502) of the connector (550) can transmit electrical signals and power when connected externally.

[0142] In one embodiment, the connector (550) may be positioned so as to be spaced apart from the antenna (5102). The connector (550) can reduce RF interference by ensuring a minimum separation distance from the antenna (5102).

[0143] The terminal portion (5502) is the part where the connector (550) contacts the plug (5501) and can be extended and arranged along the length direction of the frame (510) with a length (d5).

[0144] The terminal portion (5502) may have a length that overlaps at least partially with the first portion (511) and the second portion (512) of the frame (510). In one embodiment, the length (d1) of the first portion (511) and the second portion (512) of the frame (510) may be longer than the length (d5) of the terminal portion (5502). Thus, the plug (5501) can be reliably coupled to the connector (550).

[0145] In at least one embodiment of the present disclosure, the connector (550) may be positioned so as to be spaced apart from the antenna (5102). The connector (550) may be positioned inside the housing (520) so as to be spaced apart from the antenna (5102) by a certain distance or more. The spacing distance may be set based on RF interference test results, for example, by leaving a gap of 3 mm or more between the connector (550) and the antenna (5102) to prevent distortion of the radiation pattern.

[0146] In one embodiment of the present disclosure, the connector hole (553) may be formed by combining a part of the frame (510) and a part of the injection member (560). The upper part of the connector hole (553) may be formed by combining a first part (511) of the frame (510) and a part of the injection member (560). The lower part of the connector hole (553) may be formed by combining a second part (512) of the frame (510) and a part of the injection member (560).

[0147] The connector hole (553) can function as a passage for electrical connection with the outside. The connector hole (553) can provide an opening into which the terminal of an external cable can be inserted. The inner wall of the connector hole (553) can provide electrical shielding by the metal frame (510). The connector hole (553) may additionally include a sealing cap or a dustproof cover to prevent the ingress of external foreign matter. The connector hole (553) may include a guide structure for positioning the connector (550) when connecting externally.

[0148] FIG. 9 is a drawing showing a state in which a plug is inserted into the electronic device of FIG. 6 according to one embodiment of the present disclosure.

[0149] Referring to FIG. 9, an electronic device (500) according to one embodiment of the present invention may form an electrical connection by inserting a plug (5501) into a connector (550) through a connector hole (553).

[0150] In one embodiment, the plug (5501) is precisely engaged with the terminal portion (5502) of the connector (550) to prevent shaking during connection. At this time, the length (d1) of the second portion (512) of the frame (510) is longer than the length (d5) of the terminal portion (5502), so that the electrical connection is not interrupted even if the plug (5501) shakes and is stably connected. The connector (550) may be designed in a straight or curved shape to match the insertion direction of the plug (5501). The inner wall of the connector (550) may be finely machined to minimize frictional resistance when in contact with the plug (5501).

[0151] An electronic device (500) according to one embodiment of the present invention may be designed such that the direction in which a plug (5501) is inserted into and removed from a connector (550) coincides with the longitudinal direction of a frame (510). This structure can facilitate assembly and maintenance of the connector (550).

[0152] An electronic device (500) according to one embodiment of the present invention includes a housing comprising a frame formed of a metal material and an injection molded member coupled to the frame, a display disposed on the front of the housing, a cover member disposed on the back of the housing, and a connector disposed inside the housing that can be connected to an external electronic device through a connector hole, thereby enabling the simultaneous securing of rigidity, water resistance, and antenna performance while maintaining the minimum thickness required for an ultra-slim mobile device.

[0153] In addition, at least one of the first and / or second parts of the frame has a stepped edge, and by combining the stepped edge with an injection molded member, a waterproof structure of the housing can be reliably implemented.

[0154] In addition, the antenna placed inside the housing is positioned to overlap with at least a part of the first or second part, and the connector is positioned to be spaced apart from the antenna, thereby preventing degradation of the antenna's performance.

[0155] Thus, the electronic device according to the present invention can provide a housing structure that satisfies rigidity, water resistance, and antenna performance in an ultra-slim mobile device by optimizing the structural combination of the frame and the injection molded member and the arrangement of the connector and antenna.

Claims

1. In an electronic device, A housing comprising a frame formed of a metal material and an injection molded member coupled to the frame, and a connector hole formed through a part of the frame and a part of the injection molded member; A display positioned on the front of the above housing; A cover member disposed on the back surface of the above housing; and It includes a connector disposed inside the above housing and capable of connecting to an external electronic device through the connector hole, The above frame is, An electronic device comprising a first portion facing a first surface of the connector facing the display and a second portion facing a second surface of the connector facing the cover member and separated from the first portion.

2. In Paragraph 1, The electronic device in which the first part and the second part are joined through the injection member.

3. In Paragraph 1, The above connector is, An electronic device positioned to be supported at least partially through the injection member.

4. In Paragraph 1, The above connector is, An electronic device spaced apart from the first and second parts.

5. In Paragraph 1, The above connector is, An electronic device arranged along the longitudinal direction of the above frame.

6. In Paragraph 1, At least one of the first part and the second part includes a stepped portion on both sides, and The above step portion is, An electronic device combined with the above injection member.

7. In Paragraph 1, The first part above is an electronic device having a length in a direction parallel to the length direction of the connector.

8. In Paragraph 1, An electronic device in which at least a portion of the injection member is combined with at least a portion of the second portion between the second portion and the cover member.

9. In Paragraph 1, The above display includes a display panel and a bending portion extending from the display panel and folding toward the back of the display panel. An electronic device further comprising a cushioning pad disposed between the bending portion and the first portion.

10. In Paragraph 9, An electronic device in which at least a portion of the bending portion is positioned to face a first portion of the frame.

11. In Paragraph 1 An electronic device comprising a first portion that is spaced further away from the display than another area of ​​the first portion.

12. In Paragraph 1, When the above display is viewed from above, An electronic device in which the first part of the above frame overlaps at least a portion of the terminal part of the above connector.

13. In Paragraph 1, When the above display is viewed from above, An electronic device in which the second part of the above frame overlaps at least a portion of the terminal part of the above connector.

14. In Paragraph 1, The above housing includes a side, and The above connector hole is an electronic device positioned on the above side.

15. In Paragraph 1, The above frame forms at least a portion of the above side, and The first part and / or the second part is an electronic device extending from the side.

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