Light-emitting module

Abstract

The present invention discloses a light-emitting module comprising a substrate, a plurality of light-emitting devices disposed on one surface of the substrate, and a low-light-transmittance layer disposed on a light-emitting surface side of the substrate, wherein the low-light-transmittance layer comprises a low-light-transmittance region having a light transmittance of less than 50% and light-transmitting regions having a higher light transmittance than the low-light-transmittance region.

Description

light-emitting module

[0001] The present invention relates to a light-emitting module comprising a light-emitting element.

[0002] A light-emitting diode (LED) is a light-emitting device that emits light when current is applied. Recently, light-emitting diodes are being used in various fields such as display devices, automotive lamps, and general lighting. Furthermore, light-emitting diodes have the advantages of a long lifespan, low power consumption, and fast response speed. By fully utilizing these advantages, they are rapidly replacing existing light sources. For example, a display device using light-emitting diodes can be obtained by forming structures of red (Red, R), green (Green, G), and blue (Blue, B) light-emitting diodes (LEDs) that are individually grown on a final substrate.

[0003] With the recent integration of the real world and AI technology, there is a growing need for mirror displays capable of reflecting real objects while simultaneously displaying digital information, as well as exterior displays installed on building facades or transparent glass to display digital information. Consequently, there is an increasing need for the development of light-emitting modules that can be effectively applied to such display devices.

[0004] The purpose of the present invention is to provide a light-emitting module capable of implementing shapes or characters on mirrors, exteriors, glass, etc.

[0005] The purpose of the present invention is to provide a light-emitting module capable of realizing a clear image with improved contrast ratio.

[0006] The purpose of the present invention is to provide a light-emitting module capable of improving visibility by improving reflectivity.

[0007] The purpose of the present invention is to provide a light-emitting module capable of providing clear image quality without image distortion.

[0008] The purpose of the present invention is to provide a light-emitting module capable of displaying accurate colors with improved color reproduction rate.

[0009] The purpose of the present invention is to provide a light-emitting module capable of improving surface quality such as surface flatness, bonding, curvature, and reflection.

[0010] The purpose of the present invention is to provide a light-emitting module with high light extraction efficiency.

[0011] A light-emitting module according to one embodiment of the present invention comprises a substrate, a plurality of light-emitting elements disposed on one surface of the substrate, and a low-transparency layer disposed on the light-emitting surface side of the substrate.

[0012] In one embodiment, the light-transmitting area may be an area in which a perforation is formed penetrating the low-transmittance layer.

[0013] In one embodiment, the cross-sectional diameter of the perforation may be 50% or more and 90% or less of the cross-sectional length of the light-emitting element.

[0014] In one embodiment, the low-transparency region and the light-transparency region may have different reflectances.

[0015] In one embodiment, the light-emitting region may be located at a position that overlaps with the light-emitting element.

[0016] In one embodiment, the low-transparency layer may be disposed on the other side of the substrate.

[0017] In one embodiment, the light-emitting module may further include a reflective layer disposed on the plurality of light-emitting elements on one side of the substrate.

[0018] In one embodiment, the light-emitting module may further include an optical layer covering the plurality of light-emitting elements.

[0019] In one embodiment, the reflective layer may be disposed on the optical layer.

[0020] In one embodiment, the light-emitting module may further include an optical layer disposed on the plurality of light-emitting elements.

[0021] In one embodiment, the optical layer may include a first optical layer covering the light-emitting element and a second optical layer surrounding the first optical layer.

[0022] In one embodiment, the interface where the first optical layer and the second optical layer meet may be a reflective surface that reflects the emitted light from the light-emitting element.

[0023] In one embodiment, the first optical layer and the second optical layer may have different optical properties.

[0024] In one embodiment, the reflectance of the second optical layer may be greater than the reflectance of the first optical layer.

[0025] In one embodiment, the cross-sectional width of the first optical layer may vary depending on the distance from one surface of the substrate.

[0026] A light-emitting module according to one embodiment of the present invention may include a substrate, a plurality of light-emitting elements disposed on one surface of the substrate, and a low-transparency layer disposed on one surface of the substrate and including a plurality of perforations that expose the plurality of light-emitting elements.

[0027] In one embodiment, an optical layer may be disposed within the perforation.

[0028] In one embodiment, the light-emitting surface of the optical layer may be a curved surface.

[0029] In one embodiment, the cross-sectional width of the perforation may vary depending on the distance from one surface of the substrate.

[0030] A light-emitting module according to one embodiment of the present invention may include a substrate, a plurality of light-emitting elements disposed on one surface of the substrate, and a low-transparency layer disposed on one surface of the substrate and including a plurality of perforations that expose the plurality of light-emitting elements.

[0031] In one embodiment, the substrate may include a sidewall portion forming a cavity on which the plurality of light-emitting elements are seated.

[0032] In one embodiment, the low-transparency layer may be disposed on the sidewall portion.

[0033] In one embodiment, the light-emitting module may further include a side reflection layer disposed on the inner surface of the cavity.

[0034] In one embodiment, the side reflection layer may be a DBR layer.

[0035] The present invention can provide a light-emitting module capable of implementing shapes or characters on mirrors, exteriors, glass, etc.

[0036] The present invention can provide a light-emitting module capable of realizing a clear image with improved contrast ratio.

[0037] The present invention can provide a light-emitting module that can improve visibility by improving reflectivity.

[0038] The present invention can provide a light-emitting module capable of providing clear image quality without image distortion.

[0039] The present invention can provide a light-emitting module capable of displaying accurate colors with improved color reproduction rate.

[0040] The present invention can provide a light-emitting module capable of improving surface quality such as surface flatness, bonding, curvature, and reflection.

[0041] The present invention can provide a light-emitting module with high light extraction efficiency.

[0042] FIG. 1 is a schematic diagram illustrating a light-emitting system according to one embodiment of the present invention.

[0043] FIG. 2 is a schematic diagram illustrating a light-emitting system according to another embodiment of the present invention.

[0044] FIG. 3 is a cross-sectional view illustrating a light-emitting module according to a first embodiment of the present invention.

[0045] FIG. 4 is a cross-sectional view illustrating a light-emitting module according to a second embodiment of the present invention.

[0046] FIG. 5 is a cross-sectional view illustrating a light-emitting module according to a third embodiment of the present invention.

[0047] FIG. 6 is a cross-sectional view illustrating a light-emitting module according to a fourth embodiment of the present invention.

[0048] FIG. 7 is a cross-sectional view illustrating a light-emitting module according to the fifth embodiment of the present invention.

[0049] FIG. 8 is a cross-sectional view illustrating a light-emitting module according to the sixth embodiment of the present invention.

[0050] FIG. 9 is a cross-sectional view illustrating a light-emitting module according to the seventh embodiment of the present invention.

[0051] FIG. 10 is a cross-sectional view illustrating a light-emitting module according to the eighth embodiment of the present invention.

[0052] FIG. 11a is a plan view showing a low-transparency layer according to one embodiment of the present invention.

[0053] FIG. 11b is a plan view showing a low-transparency layer according to another embodiment of the present invention.

[0054] FIG. 12 is a diagram illustrating the distance relationship between a light-emitting system including a light-emitting module of the present invention and a user.

[0055] FIG. 13 is a drawing for explaining the dimensional design of a low-transparency layer according to the distance relationship of FIG. 12.

[0056] In the following description, numerous specific details are described for the purpose of explanation and to provide a complete understanding of the various embodiments or implementations of the present disclosure. As used herein, “Embodiments” and “Implementations” are interchangeable terms indicating non-limiting examples of devices or methods utilizing one or more of the concepts of the invention disclosed herein. However, it will be apparent that various embodiments may be implemented without utilizing these specific details or by utilizing one or more equivalent arrangements. In other examples, known structures and devices are illustrated in block diagram form to avoid unnecessarily obscuring the various embodiments. Furthermore, while various embodiments may differ from one another, they do not need to be exclusive. For example, specific shapes, configurations, and characteristics of an embodiment may be used or implemented in other embodiments without departing from the scope of the concept of the invention.

[0057] Unless otherwise specified, the illustrated embodiments should be understood as providing exemplary features of varying details in some ways in which the concept of the present invention can actually be realized. Therefore, unless otherwise specified, features, components, modules, layers, membranes, panels, regions and / or modes of various embodiments (hereinafter referred to individually or collectively as “elements”) may be combined, separated, interchanged, and / or rearranged differently without departing from the scope of the concept of the present invention.

[0058] The use of cross-hatching and / or shading in the attached drawings is generally provided to clarify the boundaries between adjacent elements. As such, the presence or absence of cross-hatching or shading, unless otherwise specified, does not imply or indicate any preference or requirement regarding the specific material, material properties, dimensions, proportions, commonalities between the exemplified elements, or any other features, attributes, and characteristics of the elements. Additionally, in the attached drawings, the size and relative size of the elements may be exaggerated for clarity and / or illustrative purposes. When embodiments are implemented differently, specific process sequences may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order. Also, the same reference numerals indicate the same elements.

[0059] When an element such as a layer is referred to as being "on", "connected to," or "coupled to" another element or layer, said element may be directly on, connected to, or coupled to the other element or layer, or an interposed element or layer may exist. However, when an element or layer is referred to as being "directly on", "directly connected to," or "directly coupled to" another element or layer, no interposed element or layer exists. To this end, the term "connected" may refer to a physical, electrical, and / or fluid connection with or without an interposed element. Furthermore, the DR1-axis, DR2-axis, and DR3-axis are not limited to the three axes of an orthogonal coordinate system, such as the x, y, and z axes, and may be interpreted in a broader sense. For example, the DR1-axis, DR2-axis, and DR3-axis may be perpendicular to each other, or they may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “one or more of X, Y, and Z” and “one or more selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed articles.

[0060] Although terms such as “first,” “second,” etc., may be used herein to describe various forms of elements, these elements shall not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be named the second element without departing from the teachings of the present disclosure.

[0061] Spatially relative terms such as “below,” “under,” “immediately below,” “lower,” “above,” “upper,” “upper,” “higher,” and “side” (e.g., as in “side wall”) may be used for descriptive purposes and thereby to describe the relationship between one element and another element(s) as illustrated in the drawings. Spatially relative terms are intended to include different orientations of the device in use, operation, and / or manufacture in addition to the orientations illustrated in the drawings. For example, if the device in the drawings is inverted, the element described as “below” or “under” another element or feature will be oriented “above” the other element or feature. Therefore, the exemplary term “below” may include both upper and lower orientations. Additionally, the device may be oriented differently (e.g., rotated 90° or oriented in a different orientation), and thus, spatially relative descriptors used herein may also be interpreted accordingly.

[0062] The technical terms used in this specification are intended to describe specific embodiments and are not limiting. The singular form used in this specification also includes the plural form unless the context clearly indicates otherwise. Additionally, the terms “comprising,” “comprising,” “comprising,” and / or “comprising” used in this specification specify the presence of the mentioned features, integers, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Furthermore, the terms “substantially,” “about,” and other similar terms used in this specification are used to indicate approximation rather than degree, and are used to describe inherent deviations of measured, calculated, and / or provided values ​​that may be recognized by a person of ordinary knowledge in the art.

[0063] Various embodiments are described below with reference to cross-sectional and / or exploded drawings, which are schematic examples of idealized embodiments and / or intermediate structures. As such, variations from the shapes in the drawings may be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein should not be interpreted as being limited to the shapes of specific illustrated regions, but should be interpreted to include, for example, deviations in shape resulting from manufacturing. In this way, the regions illustrated in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and thus are not intended to have a limiting meaning.

[0064] As is customary in the art, some embodiments may be illustrated and described in the accompanying drawings in terms of functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically implemented by electronic (or optical) circuits, such as logic circuits, discrete components, microprocessors, wiring circuits, memory elements, and wiring connections, formed using semiconductor-based manufacturing technology or other manufacturing technology. Where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they may be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and may optionally be driven by firmware and / or software. Additionally, each block, unit, and / or module may be implemented by dedicated hardware, or as a combination of dedicated hardware for performing some functions and a processor for performing other functions (e.g., one or more programmed processors and associated circuits). Additionally, each of the blocks, units, and / or modules of some embodiments may be physically separated into two or more interacting and individual blocks, units, and / or modules without departing from the scope of the concept of the present invention. Additionally, the blocks, units, and / or modules of some embodiments may be physically combined into more complex blocks, units, and / or modules without departing from the scope of the concept of the present invention.

[0065] Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with that meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this specification.

[0066] Hereinafter, a preferred embodiment of the light-emitting module of the present invention will be described in detail with reference to the attached drawings.

[0067] The light-emitting module according to the present invention can be applied to various light-emitting systems. FIGS. 1 and 2 schematically illustrate a light-emitting system including a light-emitting module according to the present invention.

[0068] Referring to FIG. 1, a light-emitting system (1) according to one embodiment is a light-emitting system for a vehicle, and a light-emitting module (100) may be placed on one side of a light-emitting part (11) placed in one area of ​​a vehicle frame (10). For example, the light-emitting module (100) may be a high-mounted stop lamp (HMSL) installed in a vehicle. In this case, the light-emitting system (1) may have different transmittances between the area where the light-emitting module (100) is placed and the light-emitting part (11). Alternatively, the light-emitting module (100) may be configured as a display, headlamp, brake light, interior light, etc. installed in a vehicle.

[0069] Referring to FIG. 2, the light-emitting system (2) according to another embodiment may be a display device. Alternatively, the light-emitting system (2) may be a lighting device, translucent glass, smart glass, smart mirror, electronic picture frame, etc. In this case, the light-emitting system (2) may additionally include a frame (20) that protects the light-emitting module (100). Power may be supplied to the light-emitting module (100) by a wire placed in one area of ​​the frame (20) to increase the transparency of the light-emitting system (2).

[0070] The light-emitting system (2) may include one or more optical sheets. The light-emitting system (2) may include a plurality of optical sheets, and the optical sheets may include at least one of a diffusion sheet, a light-concentrating sheet, or a protective sheet. Each of the optical sheets may include one or a plurality of diffusion sheets, light-concentrating sheets, and protective sheets. Alternatively, each of the optical sheets may include at least one diffusion sheet, light-concentrating sheet, or protective sheet. For example, the optical sheets may be composed of one diffusion sheet and two light-concentrating sheets, or two diffusion sheets and one light-concentrating sheet. The optical sheets may be arranged parallel to the light-emitting module (100). Alternatively, the optical sheets may be arranged parallel to the side of the light-emitting module (100).

[0071] The above frame (20) may have an open top surface and may house a light-emitting module (100) and optical sheets inside. FIG. 3 is a cross-sectional view illustrating a light-emitting module (100) according to a first embodiment of the present invention, and the light-emitting module (100) according to the first embodiment will be described in detail below.

[0072] The light-emitting module (100) may include a substrate (110), a plurality of light-emitting elements (120) disposed on one surface of the substrate (110), and a low-transparency layer (140) disposed on the substrate (120).

[0073] The above substrate (110) is a substrate on which a light-emitting element (120) is mounted on one surface, and may be a light-transmitting substrate. That is, the above substrate (110) may be a light-transmitting substrate and is not limited to specific types such as sapphire, PMMA (Polymethyl Methacrylate), PC (Polycarbonate) resin, COP (Cyclo Olefin Polymer), acrylic resin, PE (Polyethylene), epoxy resin, and glass. Through the light-transmitting substrate (110), the transparency of the light-emitting module (100) can be improved.

[0074] One area of ​​the substrate (110) may be a low-transparency area. This allows the light path of light emitted from the light-emitting element (120) to be adjusted and minimizes the amount of direct / indirect reflected light reflected to the user. Additionally, a coating layer for reflecting or absorbing light may be disposed on one side of the substrate (110). The coating layer may include particles such as TiO2, BaSO4, or SiO2, which are light-reflecting materials. Alternatively, the coating layer may include an absorbing material for absorbing light directed toward the lower surface of the light-emitting module (100). The absorbing material may include pigments such as carbon black or Cr. This allows the light path of light emitted from the light-emitting element (120) to be adjusted and minimizes the amount of direct / indirect reflected light reflected to the user.

[0075] The substrate (110) supports a plurality of light-emitting elements (120) and can be electrically connected to the plurality of light-emitting elements (120) through a conductive region (E). In particular, the light-emitting element (120) can be electrically connected to a conductive region (E) disposed on one side of the substrate (110). The conductive region (E) may be composed of a conductive material for supplying electricity or an electrical signal for driving the light-emitting element (120). The conductive material may be a metal such as copper, aluminum, silver, or tungsten, or a compound thereof. Additionally, the conductive region (E) may further include a reflective material for reflecting light to one side of the light-emitting element (120). The reflective material may include Ag, Al, Au, Ni, etc., and the reflectivity may be 60% or more.

[0076] Additionally, the substrate (110) may include an insulating material to prevent short circuits. Insulating materials may include FR-4, CEM-1 or CEM-3 (Composite Epoxy Material), glass paper epoxy, polyamide, glass epoxy, Teflon, ceramic substrate, organic and inorganic composite materials, etc. The substrate (110) may include a metallic material such as aluminum or copper to enhance the heat dissipation characteristics of the light-emitting device (100).

[0077] Additionally, the substrate (110) may have a planar shape, but is not limited thereto. In some embodiments, the substrate (110) may be in the form of a strap that can be bent according to the shape of the frame (20).

[0078] The light-emitting element (120) may be provided in one or more quantities in the light-emitting module (100). The light-emitting element (120) may be a light-emitting diode, an OLED, etc. that emits light. For example, the light-emitting element (120) may include a device substrate, a semiconductor layer, and a device electrode. This is merely an example, and the light-emitting element (120) is not limited to a specific structure or form.

[0079] For example, the light-emitting element (120) may include subpixels that emit blue, green, and red light, respectively. The subpixels may be stacked on top of each other. Alternatively, the subpixels may be arranged at regular intervals and are not limited to a specific structure. Alternatively, the light-emitting element (120) may emit white light. In this case, the light-emitting element (120) may include a light-emitting diode element that emits short wavelengths and a phosphor that emits long wavelengths. Additionally, the light-emitting element (120) may be a structure that includes a color filter capable of implementing subpixels that emit blue, green, and red light in a region of the light-emitting part that emits white light.

[0080] Specifically, the light-emitting element (120) can be configured in various ways as a light-emitting diode element that emits light and is disposed on one surface of a substrate (110). For example, the light-emitting element (120) may include a semiconductor layer formed on the element substrate.

[0081] The above device substrate may be a growth substrate for growing a gallium nitride-based semiconductor layer, such as a sapphire substrate, a silicon substrate, a SiC substrate, a spinel substrate, a Ga2O3 substrate, etc. The above device substrate is not limited to a specific type as long as it is a substrate capable of growing a nitride-based semiconductor layer. The above device substrate may be removed after the semiconductor layer is grown.

[0082] Additionally, the device substrate may have roughness on one surface to increase light extraction efficiency. Alternatively, the device substrate may have a pattern on one surface to increase light extraction efficiency. The pattern is not limited to specific shapes, such as triangular pyramids, square pyramids, polygonal pyramids, semicircles, or pyramidal shapes with curved surfaces. A portion of the pattern may contain a material of a different composition from the device substrate. This allows for increased light extraction efficiency through light refraction effects at the boundary with the other material. Furthermore, a portion of the side surface of the device substrate may be an inclined surface having an acute angle of inclination.

[0083] The semiconductor layer may include a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer.

[0084] The first conductivity type semiconductor layer may be a semiconductor layer grown on one surface of a device substrate and may include a phosphide or nitride-based semiconductor such as (Al, Ga, In)P or (Al, Ga, In)N. Additionally, the first conductivity type semiconductor layer may be doped as n-type by including one or more impurities such as Si, C, Ge, Sn, Te, Pb, etc. The present invention is not limited thereto, and as another example, the first conductivity type semiconductor layer may be doped as an opposite conductivity type by including a p-type dopant. Furthermore, the first conductivity type semiconductor layer may be composed of a single layer or multiple layers.

[0085] The active layer is a light-emitting layer disposed on one side of the first conductivity semiconductor layer and may include a phosphide or nitride semiconductor such as (Al, Ga, In)P or (Al, Ga, In)N, and may be grown on the first conductivity semiconductor layer using techniques such as MOCVD, MBE, or HVPE. Additionally, the active layer may include a quantum well structure (QW) comprising at least two barrier layers and at least one well layer, and furthermore, may include a multiple quantum well structure (MQW) comprising a plurality of barrier layers and a plurality of well layers. The wavelength of light emitted from the active layer can be controlled by controlling the composition ratio of the materials constituting the well layer. In this case, the well layer may commonly include the same element, and may include, for example, In.

[0086] The second conductivity semiconductor layer may be a semiconductor layer disposed on one side of the active layer. The second conductivity semiconductor layer may include a phosphide-based or nitride-based semiconductor such as (Al, Ga, In)P or (Al, Ga, In)N. The second conductivity semiconductor layer may be doped with a conductivity type opposite to that of the first conductivity semiconductor layer. For example, the second conductivity semiconductor layer may be doped with a p-type by including an impurity such as Mg.

[0087] The light-emitting element (120) may have a light-emitting surface formed on the side of the first conductive semiconductor layer or the second conductive semiconductor layer through which light is emitted. For example, light generated in the active layer may be emitted to the outside by passing through the first conductive semiconductor layer or emitted to the outside by passing through the second conductive semiconductor layer. An uneven structure may be formed on one side of the first conductive semiconductor layer or one side of the second conductive semiconductor layer to increase light extraction efficiency.

[0088] Additionally, the light-emitting element (120) may include an element electrode. The light-emitting element (120) may be driven by being electrically connected to an external power source through the element electrode. The element electrode is configured to mount the light-emitting element (120) on a conductive region (E) of a substrate (110) and may be formed of a material suitable for this purpose. Additionally, the element electrode may make ohmic contact with a semiconductor layer. The element electrode may be formed, for example, of Cr / Pt / Au, etc. One region of the element electrode may include a layer containing a material such as Ag or Al with a reflectivity of 70% or more for reflecting light onto the upper surface of the semiconductor layer.

[0089] As another example, the device electrode may be made of metal materials such as copper, gold, silver, tin, iron, or aluminum. Alternatively, the device electrode may be made of a transparent electrode composed of a compound of the metal or an oxide such as indium tin oxide (ITO) or manganese oxide, a conductive polymer (PEDOT:PSS, Poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate)), a silver nanowire, or a carbon nanotube.

[0090] Meanwhile, the light-emitting element (120) according to the embodiments of the present invention is not limited to a specific form, and as another example, the light-emitting element (120) may include stacked light-emitting stacks in which a plurality of light-emitting diodes are stacked and arranged.

[0091] The stacked light-emitting stacks described above may include a first light-emitting stack, a second light-emitting stack, and a third light-emitting stack that are sequentially stacked. A second light-emitting stack may be disposed on top of the first light-emitting stack, and a third light-emitting stack may be sequentially stacked on top of the second light-emitting stack.

[0092] Each of the first to third light-emitting stacks may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. Each of the first to third light-emitting stacks may be a light-emitting stack that emits red light, a light-emitting stack that emits green light, and a light-emitting stack that emits blue light. Accordingly, a stacked light-emitting device (120) including the first to third light-emitting stacks can display the RGB primary colors as pixels.

[0093] In addition, the light-emitting element (120) can be implemented by modifying it into various structures, and can be modified into various structures such as flip-chip type, vertical type, and horizontal type.

[0094] For example, one of the light-emitting elements (120) is a diode that emits blue light (Blue), and may be a blue light-emitting diode having a peak wavelength within the blue wavelength region, and the difference between the peak wavelength and the dominant wavelength of the blue light-emitting diode may be between 2 nm and 15 nm. Specifically, the blue light-emitting diode may have a peak wavelength between 430 nm and 475 nm and a dominant wavelength between 460 nm and 480 nm. Maintaining the difference in wavelengths reduces color deviation, making it possible to achieve a clearer color expression. The peak wavelength of the blue light-emitting diode may be shorter than the dominant wavelength. This allows for increased light energy while correcting visual sensitivity, thereby reducing the difficulty of design.

[0095] As another example, one of the light-emitting elements (120) is a diode that emits green light (Green), and may be a green light-emitting diode having a peak wavelength within the green wavelength range, and the difference between the peak wavelength and the frequency of the green light-emitting diode may be between 5 and 20 nm. Specifically, the green light-emitting diode may have a peak wavelength between 510 nm and 540 nm and a main wavelength between 525 nm and 545 nm. Maintaining the difference in frequency reduces color deviation, making it possible to achieve a clearer color expression. The peak wavelength of the green light-emitting diode may be shorter than the main wavelength. This allows for increased light energy while correcting visual sensitivity, thereby reducing the difficulty of design.

[0096] As another example, one of the light-emitting elements (120) is a diode that emits red light (Red), and may be a red light-emitting diode having a peak wavelength within the red wavelength region, and the difference between the peak wavelength and the main wavelength of the red light-emitting diode may be between 5 and 30 nm. Specifically, the red light-emitting diode may have a peak wavelength between 620 nm and 640 nm and a main wavelength between 600 nm and 630 nm. Maintaining the difference in wavelengths reduces color deviation, making it possible to achieve a clearer color expression. The peak wavelength of the red light-emitting diode may be longer than the main wavelength. This allows for increased light energy while correcting visual sensitivity, thereby reducing the difficulty of design.

[0097] According to other embodiments, the light-emitting element (120) may be configured to emit orange light, yellow light, purple light, or ultraviolet light in addition to blue light, green light, and red light.

[0098] Meanwhile, the light-emitting module (100) may further include an optical layer (130) disposed on the plurality of light-emitting elements (120). The optical layer (130) may be located between the substrate (110) and the low-transparency layer (140) described later.

[0099] The optical layer (130) is formed of a light-transmitting material and may include one or more of PMMA (Polymethyl Methacrylate), PC (Polycarbonate) resin, COP (Cyclo Olefin Polymer), acrylic resin, silicone resin, PE (Polyethylene), PVB (Polyvinylbutyral), PDMS (Polydimethylsiloxane), epoxy resin, and glass and quartz.

[0100] The optical layer (130) may cover the light-emitting element (120), and the light-emitting element (120) may be placed above, below, or between the optical layer (130).

[0101] The optical layer (130) may include a transparent region containing light-scattering particles for scattering light. The light-scattering particles may include inorganic particles such as silica (SiO2), titanium dioxide (TiO2), alumina (Al2O3), calcium carbonate (CaCO3), magnesium fluoride (MgF2), etc. In addition, the optical layer (130) may include particles made of organic materials such as polymethyl methacrylate (PMMA) and polystyrene (PS).

[0102] The low-transparency layer (140) is configured to be positioned on the light-emitting side of the substrate (110), and various configurations are possible. For example, the low-transparency layer (140) may be positioned on one side of the optical layer (130). Light emitted from the light-emitting element (120) may pass through the optical layer (130) and be emitted to the outside through the low-transparency layer (140). The thickness of the low-transparency layer (140) may be thicker than the thickness of the stacked light-emitting stacks. This allows for sufficient light blocking effects to be secured. Additionally, a pattern may be printed on one area of ​​the low-transparency layer (140) for aesthetic purposes.

[0103] The low-transparency layer (140) may include regions with different light transmittances. For example, the low-transparency layer (140) may include a low-transparency region with a light transmittance of less than 50% and a light-transparency region having a light transmittance higher than that of the low-transparency region. The light-transparency region may be provided in multiple numbers. The light transmittance of the light-transparency region may be 50% or more.

[0104] The light-transmitting area may be an area in which a perforation (P) penetrating the low-transmittance layer (140) is formed. The area in which the perforation (P) is formed may be defined as the light-transmitting area, and the remaining area excluding the perforation (P) may be defined as the low-transmittance area.

[0105] The low-transparency layer (140) may be a layer containing an optical material that absorbs or reflects light. For example, the low-transparency layer (140) may be a layer containing a reflective material. The reflective material may include a metallic material such as aluminum, silver (Ag), copper (Cu), etc. Alternatively, the low-transparency layer (140) may include a material that absorbs or blocks light. The light-absorbing material may include a dye, a pigment, a light-absorbing nanostructure, etc.

[0106] For example, the low-transparency layer (140) may have the form of a metallic mirror film. Alternatively, the low-transparency layer (140) may be a reflective layer in which aluminum is deposited on polyester or polycarbonate. Alternatively, the low-transparency layer (140) may include silica (SiO2, yttrium oxide (Y2O3)) as an inorganic nano-coating film that controls the reflection and transmission of light with a specific nanomaterial.

[0107] In addition, the low-transparency layer (140) may include an optical multilayer thin film layer. The multilayer thin film layer may be an anti-reflective layer in which several layers with different refractive indices (e.g., SiO2, TiO₂) are stacked, a high-reflective layer in which high-refractive-index (HfO2, TiO₂) and low-refractive-index (SiO2) materials are repeatedly stacked, a spectral filter layer, an optical multilayer layer that controls optical interference effects with a multilayer thin film, etc.

[0108] The low-transparency area and the light-transparency area may have different densities. The low-transparency area may have an optical material placed at a higher density than the light-transparency area. This can increase the contrast of the light-emitting module (100). Furthermore, the light-transparency area may be an area without optical material. A transparent material may be additionally placed in the light-transparency area. That is, a transparent material may be placed within the perforation (P). This can minimize light loss and increase light emission efficiency.

[0109] Meanwhile, the low-transparency region and the light-transparency region may have different optical characteristics. For example, the low-transparency region and the light-transparency region may have different reflectances.

[0110] Referring again to FIG. 3, the light-transmitting area, i.e., the perforation (P), may have a regular arrangement. This can reduce the difficulty of the design. The light-transmitting area may have an arrangement corresponding to the arrangement of the light-emitting element (120). For example, one light-emitting element (120) may be placed corresponding to each light-transmitting area. The light-transmitting area may be located at a position that overlaps with the light-emitting element (120). This minimizes the loss of light emitted from the light-emitting element (120), thereby increasing the efficiency of the light-emitting module (100).

[0111] FIG. 11a is a plan view showing the low-transparency layer (140) according to one embodiment, showing a form in which light-transmitting areas are arranged in a regular pattern. The perforations (P) forming the light-transmitting areas may have various shapes, for example, they may be rectangular. However, the present invention is not limited thereto and may be formed in various shapes, such as a circular shape as shown in FIG. 11b. The shape of the perforations (P) is not limited to a specific shape.

[0112] Additionally, FIG. 11a illustrates an example in which the perforations (P) are regularly arranged in a matrix form, but they can be modified into various other patterns. That is, the light-emitting areas are not limited to being regularly arranged in a mesh form, and it is also possible for the light-emitting areas to be arranged in irregular areas. Furthermore, the spacing between adjacent perforations (P) may be smaller than the spacing between adjacent light-emitting elements (120). This allows the perforations (P) to be effectively concealed from view by the user, thereby improving the aesthetic appearance of the entire light-emitting module (100).

[0113] Additionally, the spacing between adjacent holes (P) may be longer than the peak wavelength of the emitted light of the light-emitting element (120). Additionally, the spacing between adjacent holes (P) may be an integer multiple of at least one peak wavelength among the peak wavelengths of the emitted light of the light-emitting element (120). This reduces destructive interference of the emitted light and increases the light extraction efficiency.

[0114] Additionally, the area of ​​the low-transparency region excluding the above-mentioned light-transparency region may have a larger area than the area occupied by the light-emitting elements (120). Also, the low-transparency region may have a larger area than the light-transparency region. This allows for increased reflectivity. Furthermore, this prevents the user from perceiving the light-transparency region, i.e., the perforation (P), thereby increasing contrast.

[0115] Meanwhile, the cross-sectional diameter of the perforation (P) forming the light-transmitting area can be set in various ways, but, for example, it may be wider than the width of the correspondingly arranged light-emitting element (120). This allows for increased light-emitting efficiency by minimizing the loss of light emitted from the light-emitting element (120). The cross-sectional diameter of the perforation (P) may be 50% or more and less than 90% of the cross-sectional length of the light-emitting element (120) on the same plane. This allows the light-emitting element (120) to be effectively concealed so that it is not visible from the outside, thereby improving the aesthetic appearance of the entire light-emitting module (100). For example, when the cross-sectional length of the light-emitting element (120) is 400 μm, the cross-sectional diameter of the perforation (P) may be 300 μm or less. The cross-sectional diameter of the perforation (P) may be set differently depending on other factors such as the type of display and the width of the light-emitting element (120).

[0116] Referring again to FIG. 3, the brightness of the light (L1) passing through the light-transmitting region among the light emitted from the light-emitting element (120) may have a higher brightness than the light (L2) passing through the low-light-transmitting region. For example, the brightness of L1 may be 1.5 times or more the brightness of L2. Through this, the contrast of the light-emitting module (100) can be increased.

[0117] In addition, some of the light emitted from the light-emitting element (120) can pass through the low-transparency layer (140) and cause compensating and destructive interference. Through this, the light from the light-transparency area and the light from the low-transparency area are mutually canceled out and reinforced at a certain distance or more, so that the difference in light brightness between the two areas can be more than double. Through this, higher clarity can be achieved.

[0118] Referring again to FIG. 3, the low-transparency layer (140) can be placed on the light-emitting surface side of the light-emitting element (120). As the low-transparency layer (140) is placed on the upper part of the optical layer (130), the low-transparency layer (140) can be placed spaced apart from the light-emitting element (120).

[0119] The distance between the low-transparency layer (140) and the light-emitting element (120) may be greater than the height of the light-emitting element (120). The distance between the low-transparency layer (140) and the light-emitting element (120) may be 3 times or more and less than 7 times the height of the light-emitting element (120). By doing so, a light path can be secured to increase light extraction efficiency, and the light-emitting element (120) can be effectively concealed so that it is not visible from the outside, thereby improving the aesthetic appearance of the entire light-emitting module (100).

[0120] The distance from one side of the light-emitting element (120) to the bottom surface of the low-transparency layer (140) may be substantially the same as the distance from one side of the light-emitting element (120) to the top surface of the optical layer (130). That is, the bottom surface of the low-transparency layer (140) and the top surface of the optical layer (130) may be located at the same height. When the bottom surface of the low-transparency layer (140) and the top surface of the optical layer (130) are placed in close contact, total reflection at the interface is reduced, thereby increasing the light extraction efficiency.

[0121] Additionally, the refractive index in the light-transmitting region may be lower than that of the optical layer (130). This allows for increased light extraction efficiency in the light-transmitting region, i.e., the region where the perforation (P) is formed. Additionally, the refractive index in the light-transmitting region may be lower than that of the upper surface of the light-emitting element (120). This allows for increased light extraction efficiency.

[0122] The above low-transparency region may have a higher refractive index than the optical layer (130). This allows the path of light toward the low-transparency region to be adjusted. Additionally, the refractive index in the low-transparency region may be lower than the refractive index on the upper surface of the light-emitting element (120). By utilizing the total reflection effect through the change in refractive index, the light-emitting element (120) can be effectively concealed so that it is not visible from the outside, thereby improving the aesthetic appearance of the entire light-emitting module (100).

[0123] Next, FIG. 4 is a cross-sectional view illustrating a light-emitting module (200) according to a second embodiment of the present invention, and the light-emitting module (200) according to the second embodiment will be described in detail below, focusing on the differences from the first embodiment.

[0124] The light-emitting module (200) may be configured to be identical or similar to the light-emitting module (100) of the first embodiment, except that it includes a first optical layer (250) and a second optical layer (230) instead of a single optical layer (130).

[0125] Specifically, the light-emitting module (200) may include a first optical layer (250) covering the light-emitting element (220) between a substrate (210) and a low-transparency layer (240), and a second optical layer (230) surrounding the first optical layer (250). The second optical layer (230) may be placed between the light-emitting elements (220). This reduces optical interference between the light-emitting elements (220), thereby increasing color clarity.

[0126] The first optical layer (250) and the second optical layer (230) may have different optical properties. For example, the refractive indices of the first optical layer (250) and the second optical layer (230) may be different. The first optical layer (250) may have a higher refractive index than the second optical layer (230). Through this, the optical path can be adjusted through the total internal reflection effect at the interface between the first optical layer (250) and the second optical layer (230) to enhance the light extraction effect.

[0127] To further increase the light extraction efficiency, the interface where the first optical layer (250) and the second optical layer (230) meet can form a reflective surface that reflects the light emitted from the light-emitting element (220). The light emitted from the light-emitting element (220) can be totally reflected from the reflective surface, and accordingly, the light extraction efficiency can be increased.

[0128] By arranging a light-transmitting area, i.e., a perforation (P), to correspond to the upper part of the first optical layer (250), the light extraction efficiency through the first optical layer (250) can be increased. In order to increase the refractive index of the first optical layer (250), particles such as silica (SiO2) may be further included within the first optical layer (250).

[0129] As another example, the second optical layer (230) may have a higher reflectance than the first optical layer (250). The second optical layer (230) may further include particles that increase reflectivity to increase light reflectance. For example, the second optical layer (230) may include particles such as TiO2, BaSO4, and SiO2 as particles to increase reflectivity. Additionally, the second optical layer (230) may further include refractive index improving particles, such as cavity fillers with an air layer inside the filler. This allows reflection to be induced at the interface between the two optical layers (230, 250), thereby allowing the light path to be adjusted. At this time, to increase light extraction efficiency, the perforations (P) of the low-transparency layer (240) may be positioned to correspond to the first optical layer (250) with a high refractive index.

[0130] For example, the cross-sectional width of the first optical layer (250) may be constant. As another example, the cross-sectional width of the first optical layer (250) may vary as it moves toward the perforation (P). That is, the cross-sectional width of the first optical layer (250) may vary depending on the distance from one side of the substrate (210). As yet another example, the first optical layer (250) having a constant cross-sectional width may be arranged together with the first optical layer (250) having a variable cross-sectional width.

[0131] For example, the cross-sectional width of the first optical layer (250) may decrease or increase as it moves toward the hole (P). When the cross-sectional width of the first optical layer (250) is varied, the boundary surface between the first optical layer (250) and the second optical layer (230) may form an inclined surface.

[0132] Additionally, the maximum width of the first optical layer (250) may be wider than the cross-sectional diameter of the hole (P). This allows the light-emitting element (220) to be effectively concealed so that it is not visible from the outside, thereby improving the aesthetic appearance of the entire light-emitting module (200). Alternatively, the upper width adjacent to the low-transparency layer (240) of the first optical layer (250) may be wider than the cross-sectional diameter of the hole (P). This allows the light emitted from the light-emitting element (220) to be guided to the hole (P) area, thereby increasing the light extraction efficiency.

[0133] In this way, the brightness in the light-transmitting area can be increased by adjusting the light path through the cross-sectional width design of the first optical layer (250).

[0134] In FIG. 4, among the light emitted from the light-emitting element (220), the brightness of the light (L1, L3) passing through the light-transmitting area may be higher than that of the light (L2) passing through the low-light-transmitting area. A portion of the light (L3) directed toward the low-light-transmitting area is reflected at the boundary surface between the first optical layer (250) and the second optical layer (230) and emitted outward through the light-transmitting area, thereby increasing the brightness in the light-transmitting area.

[0135] Next, FIG. 5 is a cross-sectional view illustrating a light-emitting module (300) according to a third embodiment of the present invention, and the light-emitting module (300) according to the third embodiment will be described in detail below, focusing on the differences from the first and second embodiments.

[0136] The light-emitting module (300) above may be configured similarly to the light-emitting modules (100, 200) of the first and second embodiments, except that the low-transparency layer (340) is placed on the opposite side of one side of the substrate (310) on which the element (320) is placed. At this time, the opposite side of the substrate (310) may be a light-emitting surface on which light from the light-emitting element (320) is emitted.

[0137] In FIG. 5, the low-transparency layer (340) may be placed on the lower side of the light-emitting element (320), that is, on the opposite side of the substrate (310) on which the light-emitting element (320) is placed. As the substrate (310) is placed between the low-transparency layer (340) and the light-emitting element (320), the vertical distance from one side of the light-emitting element (320) to the low-transparency layer (340) may be substantially the same as the height of the substrate (310). At this time, the vertical distance of the substrate (310) may be greater than the height of the light-emitting element (320). This allows the light-emitting element (320) to be protected from the outside. Additionally, the vertical distance (height) of the substrate (310) may be greater than the distance between the light-emitting elements (320). By using this, the light-emitting element (320) can be effectively concealed so that it is not visible from the outside, thereby improving the aesthetic appearance of the entire light-emitting module (300). In addition, the thickness of the low-transparency layer (340) may be thinner than the vertical distance of the substrate (310). This allows for securing an optical path and increasing the light extraction efficiency.

[0138] In FIG. 5, light can pass through the substrate (310) and be emitted to the outside through the other side of the substrate (310). At this time, the substrate (310) may have a higher transparency than the optical layer (330). The optical layer (330) may include a filler, such as a reflective material like TiO or BaSO4, to increase reflectivity. The density of the filler included in the optical layer (330) may be higher than the density of the filler included in the substrate (310). The density can be compared as the content or wt% of the included filler based on an area equal to the area of ​​the light-emitting element (320). The optical layer (330) may have a thicker thickness than the substrate (310). Through this, the light path can be adjusted.

[0139] The conductive region (E) of the substrate (310) may be placed on the upper surface and side of the light-emitting element (320). This allows the light emitted from the side of the light-emitting element (320) to be reflected, thereby increasing the light extraction efficiency. At this time, the substrate (310) may be made of glass with high transparency, such as soda-lime glass, alkali-free glass, borosilicate glass, or quartz, or plastic film such as PET (Polyethylene Terephthalate), PEN (Polyethylene Naphthalate), or PI (Polyimide). Additionally, a sapphire substrate may be used to ensure both transparency and hardness.

[0140] Next, FIG. 6 is a cross-sectional view illustrating a light-emitting module (400) according to the fourth embodiment of the present invention, and the light-emitting module (400) according to the fourth embodiment will be described in detail below, focusing on the differences from the first to third embodiments.

[0141] The light-emitting module (400) may be configured to be identical or similar to the third embodiment, except that it further includes a reflective layer (450).

[0142] The above-mentioned reflective layer (450) is a layer disposed on the plurality of light-emitting elements (420) of the substrate (410), and various configurations are possible. The above-mentioned reflective layer (450) may be disposed on one side of the optical layer (430).

[0143] The above-mentioned reflective layer (450) can reflect light that has passed through the optical layer (430) in a direction toward the low-transparency layer (440). Through this, the brightness measured at the low-transparency layer (440) side may be higher than the brightness measured at the reflective layer (450).

[0144] At this time, a controller IC may be further disposed between the reflective layer (450) and the light-emitting element (420). The controller IC is electrically connected to the light-emitting element (420) to control the operation of the light-emitting element (420). The controller IC may be disposed so as to overlap with the light-emitting element (420) on one side. Through this, the non-light-emitting area can be reduced and the light-emitting area expanded, thereby increasing the brightness of the light-emitting module (400).

[0145] Next, FIG. 7 is a cross-sectional view illustrating a light-emitting module (500) according to the fifth embodiment of the present invention, and the light-emitting module (500) according to the fifth embodiment will be described in detail below, focusing on the differences from the first to fourth embodiments.

[0146] The light-emitting module (500) may be configured to be identical or similar to the first to fourth embodiments, except that an optical layer (530) is disposed within a hole (P) of a low-transparency layer (540).

[0147] In FIG. 7, a low-transparency layer (540) is placed on one side of the substrate (510) and can form a mounting space through which a light-emitting element (520) is mounted. An optical layer (530) can be placed within the perforation (P) to cover the light-emitting element (520). That is, the area where the perforation (P) of the low-transparency layer (540) is formed can be substantially the same as the area where the optical layer (530) is formed.

[0148] The height of the low-transparency layer (540) may be substantially the same as the height of the optical layer (530). Additionally, the lower region of the low-transparency layer (540) may be positioned at the same height as the lower region of the optical layer (530) on one side of the substrate (510).

[0149] Meanwhile, a portion of the optical layer (530) may have curvature. For example, the optical layer (530) corresponds to a light-transmitting area, and one surface may form a light-emitting surface. At this time, the light-emitting surface of the optical layer (530) may correspond to the upper surface of the optical layer (530), and at this time, the light-emitting surface of the optical layer (530) may be a curved surface.

[0150] For example, the light-emitting surface may have a concave shape toward the light-emitting element (520). That is, in some areas of the optical layer (530), the height of the optical layer (530) may be lower than that of the low-transparency layer (540). The light extraction efficiency can be increased through the curved shape of the optical layer (530). In addition, as the light-emitting surface of the optical layer (530) has a shape that is concave downward, some areas of the optical layer (530) are located below the low-transparency layer (540), so the light extraction efficiency can be improved without the optical layer (530) being perceived by the user's eye.

[0151] Referring again to FIG. 7, the cross-sectional width of the optical layer (530) corresponds to the cross-sectional width of the hole (P) and may have a constant value depending on the position. However, the present invention is not limited thereto, and the cross-sectional width of the optical layer (530) or the cross-sectional width of the hole (P) may vary depending on the distance from one side of the substrate (510).

[0152] As shown in Fig. 7, when the cross-sectional width of the perforation (P) has a constant shape, the shape of the low-transparency layer (540) and the optical layer (530) can be simplified to reduce the difficulty of the design.

[0153] Next, FIG. 8 is a cross-sectional view illustrating a light-emitting module (600) according to the sixth embodiment of the present invention, and the light-emitting module (600) according to the sixth embodiment will be described in detail below, focusing on the differences from the first to fifth embodiments.

[0154] The light-emitting module (600) may be configured to be identical or similar to the fifth embodiment, except that the cross-sectional width of the optical layer (630) or the cross-sectional width of the perforation (P) varies according to the distance from one side of the substrate (610).

[0155] Referring to FIG. 8, the cross-sectional width of the perforation (P) of the low-transparency layer (640) can be varied depending on the position. The cross-sectional width of the perforation (P) can decrease as it moves away from the light-emitting element (620). Accordingly, the cross-sectional width of the optical layer (630) can decrease as it moves away from the light-emitting element (620).

[0156] Accordingly, the cross-sectional width at the top of the optical layer (630) may be narrower than the cross-sectional width at the bottom of the optical layer (630). The optical layer (630) may have a wider width in the region adjacent to the light-emitting element (620) than in the region far from the light-emitting element (620). By doing so, the light reception efficiency can be increased in the lower region adjacent to the light-emitting element (620), and the cross-sectional width of the optical layer (630) can be narrowed on the light-emitting surface side where light is emitted, thereby improving light extraction efficiency without the optical layer (630) being perceived by the user's eye.

[0157] Next, FIG. 9 is a cross-sectional view illustrating a light-emitting module (700) according to the seventh embodiment of the present invention, and the light-emitting module (700) according to the seventh embodiment will be described in detail below, focusing on the differences from the first to sixth embodiments.

[0158] The light-emitting module (700) may include a substrate (710), a plurality of light-emitting elements (720) disposed on one side of the substrate (710), and a low-transparency layer (740) disposed on one side of the substrate (710) and including a plurality of holes (P) that expose the plurality of light-emitting elements (720).

[0159] At this time, the substrate (710) may include a side wall portion that forms a cavity in which the plurality of light-emitting elements (720) are seated, such as a transparent substrate like sapphire. The side wall portion is formed integrally with the substrate (710), and, for example, may be formed by etching one surface of the substrate (710).

[0160] The above sidewall portion is a sidewall structure protruding upward from one side of the substrate (710), and the cavity may correspond to the space enclosed by the sidewall portion. The cavity may be formed corresponding to each light-emitting element (720).

[0161] The side of the above-mentioned side wall portion can form a reflective surface that reflects light emitted from the light-emitting element (720). To this end, the light-emitting module (700) may further include a side reflective portion (750) disposed on the inner side of the cavity.

[0162] For example, the side reflector (750) may include a metal layer such as Al, Ag, Cr, Ni, Ti, Pt, etc. As another example, the side reflector (750) may be a multilayer DBR layer composed of different materials.

[0163] The above-mentioned side reflector (750) can be configured with various thicknesses, for example, a thickness of 3 μm to 50 μm.

[0164] The above low-transparency layer (740) may be disposed on the side wall portion. By disposing of the low-transparency layer (740) on the upper surface of the side wall portion and having a perforation (P) correspondingly disposed on the open upper surface of the cavity, a light-transmitting area may be formed at the perforation (P), and a low-transparency area may be formed in the area excluding the perforation (P).

[0165] Next, FIG. 10 is a cross-sectional view illustrating a light-emitting module (800) according to the eighth embodiment of the present invention, and the light-emitting module (800) according to the eighth embodiment will be described in detail below, focusing on the differences from the first to seventh embodiments.

[0166] The above-described light-emitting module (800) may be configured identically or similarly to the first to seventh embodiments, except for including a spacer (830) for physically connecting the light-emitting element (820) on the substrate (810). The spacer (830) may have optical properties identically or similar to the optical layer described above.

[0167] The spacer (830) may include a plurality of particles (832) and a polymer layer surrounding the plurality of particles. The particles (832) may be dispersed within the spacer (830). The plurality of particles (832) may include a conductive material and may electrically connect the light-emitting element (820) and the substrate (810). The light-emitting element (820) is connected to a conductive region (E) of the substrate (810) through the conductive particles (832), and the conductive region (E) may be connected to a metal (M) within the substrate (810).

[0168] Next, FIG. 12 is a diagram illustrating the distance relationship between a light-emitting system (1, 2) including a light-emitting module of the present invention and a user.

[0169] Depending on the type of the light-emitting system (1, 2), the user may use the light-emitting system (1, 2) at a specific distance apart. Here, the specific distance apart may be defined as a usage distance (H) that is preset for the specific light-emitting system (1, 2). The usage distance (H) may vary depending on the application of the light-emitting system (1, 2).

[0170] Depending on the usage distance (H), the shape and specifications of the light-transmitting area (or perforation (P)) and the low-transmitting area of ​​the low-transmitting layer (140, 240, 340, 440, 540, 640, 740, 840) can be determined.

[0171] Referring to FIG. 13, the light-transmitting area (or perforation (P)) of the low-transmittance layer (140, 240, 340, 440, 540, 640, 740, 840) may have a cross-sectional length (A1) for the cross section. The cross-sectional length (A1) may be set according to the viewing angle (α) and the usage distance (H). Here, the viewing angle (α) may be the normal viewing angle of the human eye and may be 1 arcminute (=0.000291 radians).

[0172] At this time, the cross-sectional length (A1) can be defined as shown in Formula 1 below.

[0173]

[0174] As the above viewing angle (α) has a very small value, the above cross-sectional length (A1) can be designed to have a value less than or equal to the value obtained by multiplying the viewing angle (α) by the usage distance (H).

[0175] For example, in the case of a display device for home appliances such as a monitor or smart mirror, the typical usage distance (H) is 1m or less, so the cross-sectional length (A1) may be 291um or less.

[0176] Additionally, two adjacent light-emitting areas (or holes (P)) may be spaced apart by a center-to-center distance (A3). The center-to-center distance (A3) may also be changed according to the usage distance (H).

[0177] In addition, the low-transparency region may have a cross-sectional length (A2) in one cross section, and the cross-sectional length (A2) may have a value greater than A1 and smaller than A3. The cross-sectional length (A2) may also be changed according to the usage distance (H).

[0178] Referring to Table 1 below, depending on the type of light-emitting system (1, 2), the usage distance (H), the low-transparency area cross-sectional length (A2), and the light-transparency area (or perforation (P)) cross-sectional length (A1) can be designed within the following ranges.

[0179] Light Emitting System Usage Distance (H, cm) Subpixel Size (μm) PPI (Pixel Per Inch) A1 (mm) A2 (mm)VR2~43-5600-12000.0058~0.0120.0212~0.0423Smartphone30~5030-50300-6000.07~0.1160.0423~0.0847Smartwatch25~4020-40250-3500.087~0.1460.0726~0.1016Monitor, Home Appliance Display50~8050-100100-3000.146~0.2330.0847~0.2540TV200~300100-20050-2000.582~0.8730.127~0.508LED Display10000 Above 10-502.910~0.508~2.54

[0180] Here, the cross-sectional length (A2) of the low-transparency area can be calculated by dividing 25.4 by PPI. Also, the distance (A3) between the centers of two adjacent transparency areas (or holes (P)) can be calculated by adding A1 and A2.

[0181] Although various application examples using the light-emitting module (100, 200, 300, 400, 500, 600, 700, 800) according to the embodiments of the present invention have been described above, the application examples of the present invention are not limited to those described above. The light-emitting module (100, 200, 300, 400, 500, 600, 700, 800) according to the present invention can also be used in displays and can be applied to various devices such as the rear of an automobile or a lighting device.

[0182] Additionally, a polymer dispersed liquid crystal (PDLC) may be disposed in a region of the low-transparency layer (140, 240, 340, 440, 540, 640, 740, 840). The transparency of the polymer dispersed liquid crystal (PDLC) can be controlled according to an electrical signal. Through this, the light-emitting element (120, 220, 320, 420, 520, 620, 720, 820) can be effectively concealed from external visibility according to the electrical signal, thereby improving the aesthetic appearance of the entire light-emitting module (100, 200, 300, 400, 500, 600, 700, 800). At this time, a channel portion in which a dye or pigment is disposed may be formed in the polymer dispersed liquid crystal (PDLC). The size of the channel portion may be smaller than the size of the light-emitting element (120, 220, 320, 420, 520, 620, 720, 820). This allows for increased light extraction efficiency by not obstructing the light path in transparent mode. The thickness of the polymer dispersed liquid crystal (PDLC) may be thinner than the thickness of the optical layer (130, 230, 430, 530, 630, 730). This allows for sufficient light path in the optical layer (130, 230, 430, 530, 630, 730) to be secured, thereby increasing light extraction efficiency.

[0183] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art or those with ordinary knowledge in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and technical scope of the invention as described in the claims set forth below.

[0184] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims.

Claims

1. A substrate, a plurality of light-emitting elements disposed on one surface of the substrate, and a low-transparency layer disposed on the light-emitting surface side of the substrate, The above low-transparency layer is a light-emitting module comprising a low-transparency region having a light transmittance of less than 50% and a light-transparency region having a light transmittance higher than that of the low-transparency region.

2. In Claim 1, The above-mentioned light-transmitting area is a light-emitting module in which a perforation is formed penetrating the above-mentioned low-transmittance layer.

3. In Claim 2, A light-emitting module in which the cross-sectional diameter of the above-mentioned perforation is 50% or more and 90% or less of the cross-sectional length of the above-mentioned light-emitting element.

4. In Claim 1, The above low-transparency region and the above-transparency region are light-emitting modules having different reflectances.

5. In Claim 1, The light-emitting area is a light-emitting module located at a position overlapping with the light-emitting element.

6. In Claim 1, The above low-transparency layer is a light-emitting module disposed on the other side of the substrate.

7. In Claim 6, A light-emitting module further comprising a reflective layer disposed on the plurality of light-emitting elements on one side of the substrate.

8. In Claim 7, It further includes an optical layer covering the plurality of light-emitting elements, The above reflection layer is a light-emitting module disposed on the above optical layer.

9. In Claim 1, The above-described light-emitting module further comprises an optical layer disposed on the plurality of light-emitting elements.

10. In Claim 9, The above optical layer is a light-emitting module comprising a first optical layer covering the light-emitting element and a second optical layer surrounding the first optical layer.

11. In Claim 10, A light-emitting module in which the interface where the first optical layer and the second optical layer meet is a reflective surface that reflects the light emitted from the light-emitting element.

12. In Claim 10, A light-emitting module having different optical properties, wherein the first optical layer and the second optical layer are different.

13. In Claim 12, A light-emitting module in which the reflectance of the second optical layer is greater than the reflectance of the first optical layer.

14. In Claim 10, A light-emitting module in which the cross-sectional width of the first optical layer varies according to the distance from one surface of the substrate.

15. A substrate, a plurality of light-emitting elements disposed on one surface of the substrate, and a low-transparency layer disposed on one surface of the substrate and including a plurality of perforations that expose the plurality of light-emitting elements, A light-emitting module in which an optical layer is disposed within the above-mentioned perforation.

16. In Claim 15, A light-emitting module in which the light-emitting surface of the optical layer is a curved surface.

17. In Claim 15, A light-emitting module in which the cross-sectional width of the above-mentioned perforation varies according to the distance from one side of the substrate.

18. A substrate, a plurality of light-emitting elements disposed on one surface of the substrate, and a low-transparency layer disposed on one surface of the substrate and including a plurality of perforations that expose the plurality of light-emitting elements, The above substrate includes a sidewall portion forming a cavity on which the light-emitting element is seated, and The above low-transparency layer is a light-emitting module disposed on the above side wall.

19. In Claim 18, A light-emitting module further comprising a side reflection layer disposed on the inner surface of the above cavity.

20. In Claim 19, The above-mentioned side reflection layer is a DBR layer, which is a light-emitting module.

Images