Radiation structure and electronic device comprising same

Abstract

An electronic device according to one embodiment may comprise a printed circuit board, at least one electronic component, a shield frame, a shield cover, a heat diffusion member, a first heat-transfer member, a second heat-transfer member, and a partition wall member. The shield frame can include a hollow first opening formed in the upper surface thereof. The first heat-transfer member can be disposed in a portion corresponding to the first opening on the upper surface of the at least one electronic component. The partition wall member can extend toward the first opening so as to be in contact with the one surface of the shield cover. The at least one electronic component can be disposed in a first accommodation space formed by the printed circuit board and the shield frame. The first heat-transfer member can be disposed in a second accommodation space formed by the upper surface of the at least one electronic component, the partition member, and the shield cover.

Description

Heat dissipation structure and electronic device including the same

[0001] The present disclosure relates to a heat dissipation structure and an electronic device including the same.

[0002] The term "electronic device" means a device capable of operating using electricity as a primary power source, ranging from home appliances such as refrigerators and washing machines, and desktop computers, to mobile communication terminals that can be carried and used by individuals, tablet personal computers, laptop computers, and vehicle navigation systems.

[0003] With the advancement of technology, electronic devices have become capable of performing not only a single function but also communication, music or video playback, and gaming functions all within a single unit. In particular, for mobile communication terminals such as smartphones, technology is being developed in a direction that diversifies functions and improves performance while simultaneously making the device thinner. Functions in electronic devices are realized through the operation of electronic components such as processors or chips; however, the performance of these components can degrade if excessive heat is generated or if generated heat accumulates.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] An electronic device according to one embodiment of the present disclosure may include a printed circuit board. The electronic device may include at least one electronic component disposed on one surface of the printed circuit board. The electronic device may include a shield frame formed to surround the at least one electronic component. The electronic device may include a first hollow opening formed on the upper surface of the shield frame. The electronic device may include a shielding cover disposed on the upper surface of the shield frame. The electronic device may include a heat diffusion member disposed on the upper side of the shielding cover. The electronic device may include a first heat transfer member disposed to be in contact with the at least one electronic component and one surface of the shielding cover. The first heat transfer member may be disposed on the upper surface of the at least one electronic component at a portion corresponding to the first opening. The electronic device may include a second heat transfer member disposed to be in contact with the heat diffusion member and the other surface of the shielding cover opposite to the one surface. The electronic device may include a partition member attached to at least a portion of the side of the at least one electronic component. The above bulkhead member may be formed to extend toward the first opening so as to contact the one surface of the shielding cover. The at least one electronic component may be disposed within a first receiving space formed by the printed circuit board and the shield frame. The first heat transfer member may be disposed within a second receiving space formed by the upper surface of the at least one electronic component, the bulkhead member, and the shielding cover. At least one of the first heat transfer member and the second heat transfer member may be composed of a liquid material. The bulkhead member may be composed of a solid material having elasticity. One cross-section of the bulkhead member may be formed in a shape corresponding to the shape of the first opening.At least a portion of the outer surface of the above bulkhead member may be positioned to be in contact with a portion of the shield frame forming the first opening. The at least one electronic component may include a first electronic component and a second electronic component stacked on top of the first electronic component. The bulkhead member may be positioned along the side of the second electronic component from the upper surface of the first electronic component. The second heat transfer member may include an adhesive material. The heat diffusion member may be attached to the shield cover by the second heat transfer member. The electronic device may further include a support member positioned on the outside of the shield frame. The support member may include a hollow second opening formed to have a shape corresponding to the heat diffusion member. The second opening may include a first region having a first width and a second region having a second width longer than the first width. The second region may be formed on the upper side of the first region. The heat diffusion member may be positioned in the second region. The above-mentioned heat diffusion member may include a core portion that dissipates heat transferred from the at least one electronic component and an extension portion that surrounds the core portion and extends outwardly from the core portion. The electronic device may further include an adhesive member disposed between the lower surface of the extension portion of the heat diffusion member and the support member. The electronic device may further include a third heat transfer member disposed in a third receiving space formed by the at least one electronic component, the partition member, and the shield frame. The shielding cover may include at least one hole penetrating the shielding cover in the thickness direction. The hole may be formed on the inner side of the area where the partition member contacts the shielding cover. At least one of the first heat transfer member and the second heat transfer member may be disposed inside the hole.The electronic device may further include a fourth heat transfer member disposed between the lower surface of the support member and the shield frame facing the lower surface of the support member. The support member and the shield frame may be formed integrally.

[0006] An electronic device according to one embodiment of the present disclosure may include a printed circuit board, at least one electronic component disposed on one surface of the printed circuit board, a shielding cover disposed above the at least one electronic component and having one surface facing the at least one electronic component, a thermal diffusion member disposed above the shielding cover and facing the other surface opposite to the one surface of the shielding cover, a first thermal interface material (TIM) in contact with at least a portion of the one surface of the shielding cover and at least a portion of the at least one electronic component, and a second thermal interface material in contact with at least a portion of the other surface of the shielding cover and at least a portion of the thermal diffusion member. At least one of the first thermal interface material and the second thermal interface material may be composed of a liquid material. The electronic device may further include a support member fixed to the thermal diffusion member and the printed circuit board. At least a portion of the support member may be formed to surround the at least one electronic component, the shielding cover, the first thermal interface material, and the second thermal interface material. The heat diffusion member may include a core portion, a peripheral portion formed to surround the core portion, and an extended peripheral portion extending outwardly from the peripheral portion. The support member may include an upper support member and a lower support member. The heat diffusion member may be fixed to the support member by an adhesive member disposed between the extended peripheral portion and the upper support member. The second heat transfer member may include an adhesive material. The heat diffusion member may be fixed to the shielding cover and the support member by the second heat transfer member. The electronic device may further include a third heat transfer member disposed between the lower support member and the at least one electronic component.The third heat transfer member may be positioned to be in contact with at least a portion of the at least one electronic component and the inner surface of the lower support member. The electronic device may include a fixing member connecting the upper support member and the lower support member between the upper support member and the lower support member. The electronic device may further include a fourth heat transfer member positioned between the upper support member and the lower support member. The fourth heat transfer member may be positioned to be in contact with the upper support member and the lower support member. The shielding cover may include at least one hole penetrating the shielding cover in the thickness direction. At least one of the first heat transfer member and the second heat transfer member may be positioned inside the hole.

[0007] According to one embodiment of the present disclosure, a method for manufacturing a heat dissipation structure and an electronic device including the same comprises: placing at least one electronic component on one surface of a printed circuit board; forming a shield frame to surround the at least one electronic component; the shield frame includes a first hollow opening formed on an upper surface; placing a shielding cover on the upper surface of the shield frame; placing a heat diffusion member on the upper side of the shielding cover; placing a first heat transfer member to contact the at least one electronic component and one surface of the shielding cover; the first heat transfer member is placed on a portion corresponding to the first opening on the upper surface of the at least one electronic component; a second heat transfer member is placed to contact the other surface opposite to the heat diffusion member and the one surface of the shielding cover; and the structure includes a partition member attached to at least a portion of the side of the at least one electronic component, wherein the partition member is formed to extend toward the first opening to contact the one surface of the shielding cover, and the at least one electronic component is in a first receiving space formed by the printed circuit board and the shield frame. The first heat transfer member may be disposed within the upper surface of the at least one electronic component, the partition member, and the second receiving space formed by the shielding cover.

[0008] A method for manufacturing a heat dissipation structure and an electronic device including the same according to one embodiment of the present disclosure comprises: placing at least one electronic component on one surface of a printed circuit board; placing a shielding cover on the upper side of the at least one electronic component such that one surface faces the at least one electronic component; placing a heat diffusion member on the upper side of the shielding cover such that the other surface opposite to the one surface of the shielding cover faces the other surface of the shielding cover; placing a first heat transfer member to contact at least a part of the one surface of the shielding cover and at least a part of the at least one electronic component; and placing a second heat transfer member to contact at least a part of the other surface of the shielding cover and at least a part of the heat diffusion member. At least one of the first heat transfer member and the second heat transfer member may be composed of a liquid material.

[0009] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0010] FIG. 1 is a perspective view showing the front of an electronic device according to one embodiment.

[0011] FIG. 2 is a perspective view showing the rear side of an electronic device according to one embodiment.

[0012] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0013] FIG. 4 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0014] FIG. 5 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0015] FIG. 6 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0016] FIG. 7 is a drawing showing a heat diffusion member according to one embodiment of the present disclosure.

[0017] FIG. 8 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0018] FIG. 9 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0019] FIG. 10 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0020] FIG. 11 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0021] FIG. 12 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0022] FIG. 13 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure.

[0023] FIG. 14 is a block diagram of an electronic device in a network environment according to various embodiments.

[0024] Hereinafter, embodiments are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the contents of this disclosure. However, the disclosed embodiments may be implemented in various different forms and are not limited to the embodiments described herein.

[0025] FIG. 1 is a perspective view showing the front of an electronic device according to one embodiment. FIG. 2 is a perspective view showing the rear of an electronic device according to one embodiment.

[0026] Referring to FIGS. 1 and 2, an electronic device (100) according to one embodiment may include a housing (110) comprising a first surface (or front) (110A), a second surface (or rear) (110B), and a side (110C) surrounding the space between the first surface (110A) and the second surface (110B). In one embodiment (not shown), the housing may refer to a structure forming some of the first surface (110A) of FIG. 1, the second surface (110B) and the side (110C) of FIG. 2. According to one embodiment, the first surface (110A) may be formed by a front plate (102) in which at least a portion is substantially transparent (e.g., as a front plate, a glass plate or a polymer plate including various coating layers). In one embodiment, the front plate (102) may be coupled to the housing (110) to form an internal space together with the housing (110). In one embodiment, the term 'internal space' may mean an internal space of the housing (110) that accommodates at least a portion of the display (101).

[0027] According to one embodiment, the second surface (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side surface (110C) may be formed by a side bezel structure (or "side member") (118) comprising a metal and / or polymer, which is combined with the front plate (102) and the back plate (111). In one embodiment, the back plate (111) and the side bezel structure (118) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0028] In the illustrated embodiment, the front plate (102) may include two first regions (110D) (e.g., curved regions) that are curved and seamlessly extended from the first surface (110A) toward the rear plate (111) at both ends of the long edge of the front plate (102). In the illustrated embodiment, the rear plate (111) may include two second regions (110E) (e.g., curved regions) that are curved and seamlessly extended from the second surface (110B) toward the front plate (102) at both ends of the long edge. In one embodiment, the front plate (102) (or the rear plate (111)) may include only one of the first regions (110D) (or the second regions (110E)). In one embodiment, some of the first regions (110D) or the second regions (110E) may not be included. In the above embodiments, when viewed from the side of the electronic device (100), the side bezel structure (118) may have a first thickness (or width) on the side that does not include the first region (110D) or the second region (110E) as described above (e.g., the side where the connector hole (108) is formed), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (110D) or the second region (110E) (e.g., the side where the key input device (117) is placed).

[0029] According to one embodiment, the electronic device (100) may include at least one of a display (101), an audio module (103, 107, 114), a sensor module (104), a camera module (105, 155), a key input device (117), a light-emitting element (106), and a connector hole (108, 109). In one embodiment, the electronic device (100) may omit at least one of the components (e.g., a key input device (117), or a light-emitting element (106)) or additionally include other components.

[0030] The display (101) may be exposed, for example, through a significant portion of the front plate (102). In one embodiment, at least a portion of the display (101) may be exposed through the front plate (102) forming the first surface (110A) and the first area (110D) of the side (110C). In one embodiment, the corners of the display (101) may be formed to be generally the same as the adjacent outer shape of the front plate (102). In one embodiment (not shown), in order to expand the area where the display (101) is exposed, the gap between the outer edge of the display (101) and the outer edge of the front plate (102) may be formed to be generally the same.

[0031] In one embodiment (not shown), a recess or opening may be formed in a part of the screen display area (e.g., active area) or an area outside the screen display area (e.g., inactive area) of the display (101), and at least one of an audio module (114), a sensor module (104), a camera module (105, 155), and a light-emitting element (106) may be included that are aligned with the recess or the opening. In one embodiment (not shown), at least one of an audio module (114), a sensor module (104), a camera module (105, 155), and a light-emitting element (106) may be included on the back surface of the screen display area of ​​the display (101). In one embodiment (not shown), the display (101) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field type stylus pen. In some embodiments, at least a portion of the sensor module (104) and / or at least a portion of the key input device (117) may be placed in the first regions (110D) and / or the second regions (110E).

[0032] The audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (107, 114). A microphone for acquiring external sound may be placed inside the microphone hole (103), and in one embodiment, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (107, 114) may include an external speaker hole (107) and a receiver hole (114) for calls. In one embodiment, the speaker hole (107, 214) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included without the speaker hole (107, 114) (e.g., a piezo speaker).

[0033] The sensor module (104) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. The sensor module (104) may include, for example, a first sensor module (104) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or another sensor module (not shown) (e.g., HRM sensor or fingerprint sensor) disposed on a second surface (110B) of the housing (110). The fingerprint sensor may be disposed on the second surface (110B) as well as on the first surface (110A) (e.g., display (101)) of the housing (110). The electronic device (100) may further include at least one of an unillustrated sensor module, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (104).

[0034] The camera module (105, 155) may include a first camera device (105) disposed on a first surface (110A) of the electronic device (100) and a second camera device (155) disposed on a second surface (110B). The camera module (105, 155) may include one or more lenses, an image sensor and / or an image signal processor. A flash, not illustrated, may be disposed on the second surface (110B). The flash may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (100).

[0035] A key input device (117) may be placed on the side (110C) of the housing (110). In one embodiment, the electronic device (100) may not include some or all of the aforementioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (101).

[0036] A light-emitting element (106) may be disposed, for example, on a first surface (110A) of a housing (110). The light-emitting element (106) may, for example, provide state information of an electronic device (100) in the form of light. In one embodiment, the light-emitting element (106) may, for example, provide a light source that is coupled with the operation of a camera module (105). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0037] The connector holes (108, 109) may include a first connector hole (108) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (109) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0038] However, the configuration of the electronic device (100) shown in FIGS. 1 and 2 is provided as an example and is not limited thereto. For example, some of the components of the electronic device (100) shown in FIGS. 1 and 2 may be omitted, the location of the components may be changed, or they may be replaced with other components.

[0039] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0040] According to one embodiment of the present disclosure, for example, the electronic device (200) of FIG. 3 may correspond to the electronic device (100) of FIG. 1 and FIG. 2. For example, the plate (210), front plate (220), and rear plate (280) of FIG. 3 may correspond to the housing (110) of FIG. 1 and FIG. 2. For example, the display (230) of FIG. 3 may correspond to the display (101) of FIG. 1 and FIG. 2.

[0041] Referring to FIG. 3, the electronic device (200) may include a plate (210) (e.g., a side bezel structure), a first support member (211) (e.g., a bracket or support structure), a front plate (220) (e.g., a front cover), a display (230), a substrate (240) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (250), a second support member (260) (e.g., a rear case), an antenna (270), and a rear plate (280) (e.g., a rear cover). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or additionally include other components.

[0042] The first support member (211) may be disposed inside the electronic device (200) and connected to the plate (210), or may be formed integrally with the plate (210). The first support member (211) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (211) may have a display (230) attached to one side and a substrate (240) attached to the other side. The substrate (240) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0043] Memory may include, for example, volatile memory or non-volatile memory.

[0044] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0045] The battery (250) is a device for supplying power to at least one component of the electronic device (200) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially coplanar with, for example, the substrate (240). The battery (250) may be integrally disposed inside the electronic device (200). In one embodiment, the battery (250) may be disposed detachably from the electronic device (200).

[0046] An antenna (270) may be positioned between the rear plate (280) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or a combination thereof of the side bezel structure (110) and / or the first support member (211).

[0047] FIGS. 4 and 5 are drawings for explaining a heat dissipation structure according to one embodiment of the present disclosure. FIGS. 4 and 5 may show a cross-section of a heat dissipation structure according to one embodiment of the present disclosure.

[0048] Referring to FIGS. 4 and 5, according to one embodiment of the present disclosure, an electronic device (100) may include a heat dissipation structure. The heat dissipation structure is configured to dissipate heat generated from electronic components included in the electronic device (100). The heat dissipation structure may be positioned below a display (101). The heat dissipation structure may be positioned between the display (101) and a printed circuit board (PCB) (301). The heat dissipation structure may dissipate heat generated from electronic components (e.g., processor chips) integrated on the printed circuit board (310) to the outside of the electronic device (100).

[0049] According to one embodiment of the present disclosure, a heat dissipation structure for dissipating heat generated from at least one electronic component (320) may include a shield frame (330), a shielding cover (340), a heat transfer member (350), a partition member (360), and a heat diffusion member (370).

[0050] According to one embodiment of the present disclosure, at least one electronic component (320) may be disposed on one side of a printed circuit board (310). Specifically, at least one electronic component (320) may be disposed on the printed circuit board (310) inside a shield frame (330). At least one electronic component (320) may be disposed on the front side facing the +z-axis direction of the printed circuit board (310). For example, at least one electronic component (320) may include at least one processor (e.g., CPU (central processing unit), GPU (graphic processing unit)), at least one passive component (e.g., capacitor, inductor), at least one memory, and / or at least one charging IC (integrated circuit).

[0051] According to one embodiment of the present disclosure, a shield frame (330) may be formed to surround at least one electronic component (320). For example, the shield frame (330) may be placed on the front surface of a printed circuit board (310). For example, the shield frame (330) may be placed to cover at least a portion of the printed circuit board (310). For example, the shield frame (330) may be formed to protrude from the printed circuit board (310) to have a predetermined height in the +z direction. For example, by placing the shield frame (330) on the printed circuit board (310), a first receiving space (S1) may be formed in which other components may be placed inside the shield frame (330). For example, at least one electronic component (320) may be placed in the first receiving space (S1) formed by the printed circuit board (310) and the shield frame (330).

[0052] According to one embodiment of the present disclosure, a shield frame (330) may include a first portion (331) that surrounds a side (320b) of at least one electronic component (320) and a second portion (332) that is bent and extended from the first portion (331) and faces the upper surface (320a) of at least one electronic component (320). For example, it may include a first portion (331) formed to protrude in the +z direction from a printed circuit board (310). For example, the shield frame (330) may include a second portion (332) formed to face the printed circuit board (310). For example, the second portion (332) may be formed in a shape that is bent and extended from one end of the first portion (331). For example, the first portion (331) may be positioned to be substantially orthogonal to the printed circuit board (310). For example, the second part (332) may be positioned substantially parallel to the printed circuit board (310). For example, the height (h1) at which the first part (331) protrudes from the printed circuit board (310) may be formed to have a value greater than the height (h2) of at least one electronic component (320) placed in the inner first receiving space (S1) of the shield frame (330). For example, the height (h1) at which the first part (331) protrudes from the printed circuit board (310) may be the distance between the upper surface (332a) of the second part (332) and the printed circuit board (310). For example, the angle at which the second part (332) is bent from the first part (331) may be about 90 degrees. However, the angle formed by the first part (331) with the printed circuit board (310) and the angle between the first part (331) and the second part (332) are not necessarily limited to the above description, and may be formed at different angles as necessary according to one embodiment of the present disclosure.

[0053] According to one embodiment of the present disclosure, the shield frame (330) can block electromagnetic waves generated inside or outside the shield frame (330). The shield frame (330) may be formed of a material capable of shielding electromagnetic waves. For example, the shield frame (330) can prevent electromagnetic waves generated from at least one electronic component (320) disposed in the first receiving space (S1) inside the shield frame (330) from being emitted outside the shield frame (330). Alternatively, for example, the shield frame (330) can prevent electromagnetic waves generated from another component outside the shield frame (330) from flowing into the first receiving space (S1) inside the shield frame (330).

[0054] According to one embodiment of the present disclosure, the shield frame (330) may include a first opening (333). The first opening (333) may be a hollow shape formed on the upper surface (330a) of the shield frame (330). For example, the first opening (333) may be formed as a hollow shape penetrating the thickness direction of the shield frame (330). For example, the first opening (333) may be a hollow shape penetrating the shield frame (330) in the +z direction. For example, the first opening (333) may be formed in a second part (332) of the shield frame (330). For example, the first opening (333) may be formed to have a width (w1) corresponding to the width (w2) of at least one electronic component (320) disposed in the inner first receiving space (S1) of the shield frame (330). For example, when a plurality of electronic components (320-1, 320-2) are sequentially stacked and arranged in the +z direction in the inner first receiving space (S1) of the shield frame (330), the width (w1) of the first opening (333) may be formed to have a value corresponding to the width of the second electronic component (320-2) that is arranged relatively close to the second part (332). For example, the width (w1) of the first opening (333) may be larger than the width (w2) of at least one electronic component (320).

[0055] According to one embodiment of the present disclosure, a shielding cover (340) may be disposed on the upper surface (330a) of a shield frame (330). For example, the shielding cover (340) may be disposed on the upper side of a second portion (332) of the shield frame (330). For example, the shielding cover (340) may be disposed to cover a first opening (333). For example, the width (w3) of the shielding cover (340) may be formed to be longer than the width (w1) of the first opening (333). For example, the width (w3) of the shielding cover (340) may be formed to be longer than the width (w2) of at least one electronic component (320) disposed in the first receiving space (S1). For example, the shielding cover (340) may be disposed to be in contact with the upper surface of the second portion (332), i.e., the upper surface (330a) of the shield frame (330). For example, the inner first receiving space (S1) of the shield frame (330) can be formed as a closed space by means of the shield cover (340), the shield frame (330), and the printed circuit board (310).

[0056] According to one embodiment of the present disclosure, the shielding cover (340) may be formed of a material capable of shielding electromagnetic waves. For example, the shielding cover (340) may prevent electromagnetic waves generated from at least one electronic component (320) disposed in the inner first receiving space (S1) of the shield frame (330) from being emitted out of the first receiving space (S1) through the first opening (333). Alternatively, for example, the shielding cover (340) may block electromagnetic waves generated outside the first receiving space (S1) from entering the inner first receiving space (S1) of the shield frame (330) through the first opening (333).

[0057] According to one embodiment of the present disclosure, the shielding cover (340) may comprise a material having thermal conductivity. Accordingly, at least a portion of the heat generated from at least one electronic component (320) can be transferred to the outside of the first receiving space (S1) through the shielding cover (340).

[0058] According to one embodiment of the present disclosure, the heat transfer member (350) is configured to effectively dissipate heat generated from at least one electronic component (320) disposed in the first receiving space (S1) to the outside of the electronic device. For example, the heat transfer member (350) may be formed of a material having low specific heat. For example, the heat transfer member (350) may include a thermal interface material (TIM).

[0059] According to one embodiment of the present disclosure, the heat transfer member (350) may include a first heat transfer member (351) and a second heat transfer member (352).

[0060] According to one embodiment of the present disclosure, at least one of the first heat transfer member (351) and the second heat transfer member (352) may be composed of a liquid material. For example, the liquid material may be a material having a certain viscosity. For example, the liquid material having viscosity may be a material that deforms when an external force is applied, and maintains the deformed shape without being restored when the application of the external force is stopped. For example, the heat transfer member (350) composed of a liquid material having viscosity may have physical properties that generate internal frictional force in response to shear deformation. For example, the first heat transfer member (351) and / or the second heat transfer member (352) composed of a liquid material may include heat dissipation grease and / or heat dissipation adhesive. For example, the first heat transfer member (351) may include a polymer resin (e.g., silicone and / or acrylic) and a thermally conductive filler (e.g., aluminum (Al2O3 (aluminum oxide)), boron nitride, carbon, polypropylene, PTFE (poly-tetrafluoroethylene), silver, and / or copper). For example, the first heat transfer member (351) and the second heat transfer member (352) may be appropriately modified so that at least one of them is composed of a liquid material within the desired range to allow heat generated from at least one electronic component (320) to be transferred to the outside of the shield frame (330). Specifically, if the first heat transfer member (351) is composed of a liquid material, the second heat transfer member (352) may be composed of either a liquid or a solid material. For example, the first heat transfer member (351) may be composed of a solid material, and the second heat transfer member (352) may be composed of a liquid material. Accordingly, the manufacturing process of the electronic device (100) can be simplified.For example, when both the first heat transfer member (351) and the second heat transfer member (352) are made of a solid material, components positioned adjacent to the heat transfer member (350), such as the shield frame (330) and / or shielding cover (340), may require a relatively sophisticated process. For example, when the first heat transfer member (351) or the second heat transfer member (352) is made of a solid material, the first heat transfer member (351) or the second heat transfer member (352) may include a thermal pad and / or a thermal tape.

[0061] In contrast, since the first heat transfer member (351) and / or the second heat transfer member (352) may be composed of a liquid material and have the property of being able to flow, even if the volume, thickness, or width of any opening of the components placed adjacent to the heat transfer member (350) in the manufacturing process of the electronic device (100) has a certain error compared to the values ​​planned on the design drawing for the electronic device (100) and an unintended space is formed, the required heat dissipation performance can be achieved by allowing the liquid heat transfer member (350) to flow into the spaced space.

[0062] According to one embodiment of the present disclosure, a heat transfer member (350) may be disposed between at least one electronic component (320) and a heat diffusion member (370) to be described later. For example, the first heat transfer member (351) may be disposed to be in contact with at least one electronic component (320) and one side of the shielding cover (340). For example, the first heat transfer member (351) may be disposed to be in contact with the upper surface of at least one electronic component (320). For example, when a plurality of electronic components (320-1, 320-2) are sequentially stacked in the +z direction in the inner first receiving space (S1) of the shield frame (330), the first heat transfer member (351) may be disposed to be in contact with the upper surface (320-2a) of the second electronic component (320-2) stacked on the uppermost side. For example, the first heat transfer member (351) may be positioned to be in contact with the lower surface (340b) of the shielding cover (340).

[0063] According to one embodiment of the present disclosure, the first heat transfer member (351) may be disposed on the upper surface of at least one electronic component (320) in a portion corresponding to the first opening (333). For example, the first heat transfer member (351) may be formed to have a width (w4) smaller than the width (w1) of the first opening (333). For example, the width (w4) of the first heat transfer member (351) may be formed to correspond to the width (w2) of at least one electronic component (320). For example, the height (h3) of the first heat transfer member (351) may be formed to correspond to the distance between at least one electronic component (320) and the shielding cover (340). Accordingly, at least a portion of the heat generated in at least one electronic component (320) can be transferred to a shielding cover (340) through a first heat transfer member (351) that is in direct and / or indirect contact with at least one electronic component (320).

[0064] According to one embodiment of the present disclosure, the second heat transfer member (352) may include an adhesive material. For example, the heat diffusion member (370) may be attached to the shielding cover (340) by the second heat transfer member (352).

[0065] According to one embodiment of the present disclosure, the second heat transfer member (352) may be positioned on the upper side of the shielding cover (340). For example, the second heat transfer member (352) may be positioned to be in contact with the other side opposite to one side of the heat diffusion member (370) and the shielding cover (340), which will be described later. For example, the second heat transfer member (352) may be positioned to be in contact with the upper surface (340a) of the shielding cover (340) and the lower surface (370a) of the heat diffusion member (370). For example, the width (w5) of the second heat transfer member (352) may be formed to be longer than the width (w4) of the first heat transfer member (351). However, the width (w5) of the second heat transfer member (352) is not necessarily limited thereto, and according to one embodiment, it may be formed to have a value equal to or smaller than the width (w4) of the first heat transfer member (351). For example, the width (w5) of the second heat transfer member (352) may be formed to be longer than the width (w1) of the first opening (333) and the width (w2) of at least one electronic component (320). For example, the width (w5) of the second heat transfer member (352) may be formed to have a value smaller than the width (w3) of the shielding cover (340). For example, the height (h4) of the second heat transfer member (352) may be formed to correspond to the distance between the shielding cover (340) and the heat diffusion member (370) to be described later. For example, heat generated from at least one electronic component (320) may be transferred to the heat diffusion member (370) to be described later through the first heat transfer member (351), the shielding cover (340), and the second heat transfer member (352).

[0066] According to one embodiment of the present disclosure, a first heat transfer member (351), a shielding cover (340), and a second heat transfer member (352) may be attached to each other. For example, a shielding cover (340) may be attached to the upper surface (351a) of the first heat transfer member (351). For example, a second heat transfer member (352) may be attached to the upper surface (340a) of the shielding cover (340).

[0067] Although not shown in the drawing, a shielding film (not shown) may be disposed on the upper surface (340a) and / or lower surface (340b) of the shielding cover (340). For example, the shielding film may include an adhesive material. Accordingly, the first heat transfer member (351) and the second heat transfer member (352) may be more firmly attached to the shielding cover (340). That is, the first heat transfer member (351), the shielding cover (340), the shielding film, and the second heat transfer member (352) may be disposed as a single unit between at least one electronic component (320) and the heat diffusion member (370) to be described later by being bonded by an adhesive material.

[0068] According to one embodiment of the present disclosure, the partition member (360) may be formed of a material having low specific heat. For example, the partition member (360) may include a thermal interface material (TIM). For example, the partition member (360) may include a polymer resin (e.g., silicone and / or acrylic) and a thermally conductive filler (e.g., aluminum (Al2O3 (aluminum oxide)), boron nitride, carbon, PP (polypropylene), PTFE (polytetrafluoroethylene), silver, and / or copper). For example, the partition member (360) may be composed of a solid material having elasticity. For example, it may be composed of an elastic gel material. For example, an elastic solid material may be a material having the property of returning to its original shape even if its shape is slightly deformed by an external force. In other words, the bulkhead member (360), composed of a solid material having elasticity, may have resistance to deformation against external force. For example, the bulkhead member (360) may not deform unless an external force exceeding a certain level is applied. However, the material of the bulkhead member (360) is not limited to the above description, and any material that has thermal conductivity and can maintain a constant shape may be modified as needed in one embodiment.

[0069] According to one embodiment of the present disclosure, a partition member (360) may be attached to the side of at least one electronic component (320). For example, the partition member (360) may be attached to at least a portion of the side of at least one electronic component. For example, the partition member (360) may be positioned to surround the side of at least one electronic component (320). For example, when a plurality of electronic components (320-1, 320-2) are sequentially stacked in the +z direction in the inner first receiving space (S1) of a shield frame (330), the partition member (360) may be positioned to contact the side (320-2b) of the second electronic component (320-2) stacked on the uppermost side. According to one embodiment, at least one electronic component may include a first electronic component (320-1) and a second electronic component (320-2) stacked on top of the first electronic component (320-1), and a partition member (360) may be positioned along the side (320-2b) of the second electronic component (320-2) from the upper surface (320-1a) of the first electronic component (320-1).

[0070] According to one embodiment of the present disclosure, the bulkhead member (360) may be formed to extend toward the first opening (333) so as to be in contact with one side of the shielding cover (340). For example, the bulkhead member (360) may be positioned so that one end (360a) is in contact with the lower surface (340b) of the shielding cover (340). For example, at least a portion of the bulkhead member (360) may be positioned between the first heat transfer member (351) and the shield frame (330). For example, at least a portion of the bulkhead member (360) may be positioned so as to be in contact with the first heat transfer member (351) and the shield frame (330). For example, at least a portion of the bulkhead member (360) may be positioned so as to be in contact with the side surface (351b) of the first heat transfer member (351). For example, at least a portion of the bulkhead member (360) may be positioned to be in contact with the second portion (332) of the shield frame (330). For example, at least a portion of the outer surface (360c) of the bulkhead member (360) may be positioned to be in contact with a portion of the shield frame (330) that forms the first opening (331). For example, the portion of the shield frame (330) may be a portion that is bent in a direction such that the upper surface of the shield frame (330) is indented into the interior of the shield frame (330). In other words, the portion of the shield frame (330) may be a portion that is bent and extended from the upper surface (330a) of the shield frame (330) to form the edge of the first opening (333). In other words, a part of the shield frame (330) may be a part of the shield frame (330) that forms a boundary between the first opening (333) and the shield frame (330).

[0071] According to one embodiment of the present disclosure, a second receiving space (S2) may be formed by at least one electronic component (320), a shielding cover (340), and a partition member (360). For example, a first heat transfer member (351) may be placed in the second receiving space (S2) formed by the upper surface (320a) of at least one electronic component (320), the shielding cover (340), and the partition member (360). For example, the first heat transfer member (351) may be placed such that its side (351b) contacts the partition member (360). Accordingly, the overall thickness of the heat dissipation structure may be reduced compared to the case where the first heat transfer member (351), the shield frame (330), the shielding cover (340), and the second heat transfer member (352) are stacked on the upper side of at least one electronic component (320) without including a first opening (333) in the shield frame (330). Accordingly, the overall thickness of the electronic device (100) can be reduced.

[0072] According to one embodiment of the present disclosure, the partition member (360) may limit the space in which the first heat transfer member (351) can flow. In other words, by forming the partition member (360) to protrude in the +z direction from at least one electronic component (320), the first heat transfer member (351) may be prevented from flowing away from the upper surface (320a) of at least one electronic component (320). This will be explained in more detail in FIG. 7.

[0073] According to one embodiment of the present disclosure, the partition member (360) is shown in the drawings as being positioned to contact only the side (320-2b) of the second electronic component (320-2) among the plurality of electronic components (320-1, 320-2), but is not necessarily limited thereto. For example, the partition member (360) may be positioned to surround all of the plurality of electronic components (320-1, 320-2). For example, the partition member (360) may be positioned to contact all sides of the plurality of electronic components (320-1, 320-2). For example, the other end (360b) of the partition member (360) may be positioned to contact the printed circuit board (310).

[0074] According to one embodiment of the present disclosure, the heat diffusion member (370) is configured to dissipate heat generated inside an electronic device (100). For example, the heat diffusion member (370) is configured to dissipate heat generated from at least one electronic component (320). For example, the heat diffusion member (370) may include a vapor chamber. Alternatively, the heat diffusion member (370) may include a heat pipe. Although not illustrated in the drawings, according to one embodiment, the heat diffusion member (370) may include an upper plate, a lower plate, and a fluid. For example, the upper plate may be combined with the lower plate to form a space capable of accommodating a fluid inside. For example, the fluid may flow between the upper plate and the lower plate depending on the ambient temperature of the heat diffusion member (370). For example, the fluid may vaporize when the ambient temperature is high, and conversely, may liquefy when the ambient temperature is low. For example, the fluid may be vaporized and flow into a region where the ambient temperature is low to be liquefied, and the liquefied fluid may flow into a region where the ambient temperature is high to be vaporized. In this way, the heat diffusion member (370) can cause heat to be transferred and / or diffused from a region where the ambient temperature is high to a region where the ambient temperature is low through a phase change of the fluid contained therein. For example, the region where the ambient temperature is high may be an upper region of at least one electronic component (320).

[0075] According to one embodiment of the present disclosure, a heat diffusion member (370) may be disposed on the upper side of a second heat transfer member (352). For example, the heat diffusion member (370) may be disposed to be in contact with the upper surface (352a) of the second heat transfer member (352). According to one embodiment, the first heat transfer member (351), the shielding cover (340), the second heat transfer member (352), and the heat diffusion member (370) may be sequentially stacked in the +z direction on the upper side of at least one electronic component (320). Accordingly, at least a portion of the heat generated from at least one electronic component (320) may be transferred to the heat diffusion member (370) through the first heat transfer member (351), the shielding cover (340), and the second heat transfer member (352). For example, the area surrounding the second heat transfer member (352) may be a high-temperature region. The fluid contained within the heat diffusion member (370) can be vaporized in an area adjacent to the second heat transfer member (352). The fluid vaporized within the heat diffusion member (370) can flow a predetermined distance from the second heat transfer member (352) and be liquefied. The liquefied fluid can then flow from within the heat diffusion member (370) back to an area adjacent to the second heat transfer member (352). As the fluid circulates within the heat diffusion member (370) in this manner, the heat transferred to the heat diffusion member (370) through the second heat transfer member (352) can be released to the outside of the electronic device (100). In the present drawing, an embodiment in which the heat diffusion member (370) includes a vapor chamber has been described as described above, but even if the heat diffusion member (370) includes other configurations, the heat diffusion member (370) can dissipate heat transferred from the second heat transfer member (352) to the outside of the electronic device (100) using a principle similar to that described above.

[0076] According to one embodiment of the present disclosure, the electronic device (100) may include a support member (380). The support member (380) may refer to a configuration substantially identical to the first support member (211) described in FIG. 3. Unless otherwise specified below, the support member (380) may refer to the description of the first support member (211). According to one embodiment, the support member (380) may be provided as part of a heat dissipation structure of the electronic device (100). For example, the support member (380) may include an upper surface (380a) and a lower surface (380b). For example, the support member (380) may receive a load from another component positioned above the upper surface (380a). For example, the support member (380) may be coupled to a housing (110). In this case, the load of other components transmitted to the support member (380) can be transmitted and / or distributed to the housing (110) through the support member (380). For example, the support member (380) can prevent the load of other components placed on the upper side of the upper surface (380a) from being directly transmitted to other components placed in the -z direction from the lower surface (380b) of the support member (380). Accordingly, it is possible to prevent excessive load from being transmitted to the heat dissipation structure. In other words, the heat dissipation structure can be maintained more stably.

[0077] According to one embodiment, the support member (380) may be positioned on the outside of the shield frame (330). For example, the support member (380) may be positioned on the upper side of the shield frame (330). For example, the support member (380) may be positioned between the shield frame (330) and the display (101). For example, the support member (380) may be positioned to face the second part (332) of the shield frame (330). For example, the support member (380) may be positioned to be spaced apart from the second part (332) by a predetermined distance, and a detailed description thereof will be provided later in FIG. 12.

[0078] According to one embodiment of the present disclosure, the support member (380) may be formed in the shape of a flat plate overall. For example, the support member (380) may have the shape of a flat plate facing the printed circuit board (310). According to one embodiment, the support member (380) may include a second opening (381). For example, the support member (380) may include a hollow second opening (381) formed to have a shape corresponding to the heat diffusion member (370). For example, the second opening (381) may be formed in a hollow shape that penetrates the support member (380) in the z-direction. For example, the second opening (381) may be formed in a shape corresponding to the shape of the heat diffusion member (370) so that the heat diffusion member (370) can be received inside. For example, the heat diffusion member (370) can be placed inside the second opening (381) so that the load of the heat diffusion member (370) can be transferred to the support member (380).

[0079] FIG. 6 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure. Specifically, FIG. 6 is a drawing for explaining a second opening (381) according to one embodiment of the present disclosure.

[0080] According to one embodiment of the present disclosure, the second opening (381) may include a first region (381a) and a second region (381b). For example, the first region (381a) and the second region (381b) may each be a portion of a hollow formed on the inner side of the second opening (381). For example, the first region (381a) may be formed to have a first width (d1). For example, the second region (381b) may be formed to have a second width (d2) that is longer than the first width (d1). For example, the second region (381b) may be formed on the upper side of the first region (381a). For example, the first region (381a) and the second region (381b) may be formed by one side (380c) of the support member (380) forming the second opening (381) having a stepped shape. For example, the first region (381a) may be a region surrounded by the first surface (380c-1). For example, the second region (381b) may be a region surrounded by the second surface (380c-2). For example, the first surface (380c-1) and the second surface (380c-2) may be connected by a third surface (380c-3). For example, the heat diffusion member (370) may be positioned to be in contact with the second surface (380c-2) and the third surface (380c-3).

[0081] According to one embodiment, at least a portion of the second heat transfer member (352), a shielding cover (340), at least a portion of the second part (332) of the shield frame (330), at least a portion of the first heat transfer member (351), and at least a portion of the partition member (360) may be disposed in the first region (381a). For example, at least a portion of the second receiving space (S2) may be disposed in the first region (381a). According to one embodiment, a heat diffusion member (370) may be disposed in the second region (381b). The details regarding the placement of the heat diffusion member (370) in the second region (381b) will be described in detail below.

[0082] According to one embodiment of the present disclosure, the support member (380) may be formed integrally with the shield frame (330). For example, the support member (380) may be formed by extending from the shield frame (330). Accordingly, the manufacturing process for producing a heat dissipation structure according to one embodiment of the present disclosure may be simplified.

[0083] FIG. 7 is a drawing showing a heat diffusion member according to an embodiment of the present disclosure. Referring together to FIGS. 4 through 7, according to an embodiment of the present disclosure, the heat diffusion member (370) may include a core portion (371) and an extension portion (372). For example, the extension portion (372) may be formed only for a peripheral area (A1) of at least one electronic component (320). For example, the peripheral area (A1) of at least one electronic component (320) may be a high-temperature region due to heat emitted from at least one electronic component (320). However, the shape of the extension portion (372) is not necessarily limited to that depicted and may be formed in various shapes as needed. For example, the extension portion (372) may be formed by compressing a member that forms the lower surface (370a) and the upper surface (370b) of the heat diffusion member (370). For example, the extension portion (372) can seal the internal space formed by the member forming the lower surface (370a) and the upper surface (370b). For example, a fluid is placed within the internal space, and heat transferred to the heat diffusion member (370) by the movement of the fluid can be effectively dissipated.

[0084] According to one embodiment of the present disclosure, the core portion (371) can dissipate heat transferred from at least one electronic component (320). For example, the extension portion (372) may be configured to be in contact with the support member (380). For example, the load of the heat diffusion member (370) may be transferred to the support member (380) through the extension portion (372). For example, the heat diffusion member (370) may be positioned so that at least a portion of the extension portion (372) is in contact with the support member (380). For example, the heat diffusion member (370) may be formed so that its upper surface (370b) is positioned substantially on the same plane as the upper surface (380a) of the support member (380). For example, a second heat transfer member (352) may be positioned to be in contact with the lower surface (370a) of the heat diffusion member (370).

[0085] According to one embodiment of the present disclosure, an adhesive member (390) may be further included between the lower surface of the extension portion (372) of the heat diffusion member (370) and one surface of the support member (380). For example, the adhesive member (390) may be double-sided tape, but is not necessarily limited thereto. For example, the adhesive member (390) may be placed on the third surface (380c-3). The heat diffusion member (370) may be attached to the third surface (380c-3) of the support member (380) by the adhesive member (390). Accordingly, the heat diffusion member (370) may be prevented from being detached from the second region (381b). According to one embodiment, as previously described in FIG. 4, if an adhesive material is included in the second heat transfer member (352), the adhesive member (390) may not be included. Conversely, in an embodiment including the adhesive member (390) above, the second heat transfer member (352) above may not include an adhesive material. However, the embodiment in which the second heat transfer member (352) includes an adhesive material and the embodiment in which the adhesive member (390) above are included do not necessarily have to be implemented separately, and may be implemented as an embodiment including both the adhesive material and the adhesive member (390) as needed.

[0086] FIGS. 8 and FIGS. 9 are drawings illustrating a heat dissipation structure according to one embodiment of the present disclosure. Specifically, FIG. 8 is a drawing showing a cross-section along line A-A' of FIG. 6. FIG. 9 is a drawing showing a view of the shield frame (330) from the front.

[0087] Referring to FIGS. 8 and 9, one cross-section of the bulkhead member (360) may be formed in a shape corresponding to the shape of the first opening (333). For example, the bulkhead member (360) may be formed such that at least a portion of its outer surface (360c) contacts a portion of the shield frame (330) in which the first opening (333) is formed. For example, in FIG. 8, the cross-sectional area of ​​the closed region (B) formed by the outer surface (360c) of the bulkhead member (360) may be formed to correspond to the area of ​​the first opening (333).

[0088] According to one embodiment, the first opening (333) and the bulkhead member (360) may share substantially the same virtual center point (CP). For example, the distance (L1) from the virtual center point (CP) to one side (330b) of the shield frame (330) where the first opening (333) is formed may correspond to the distance (L2) from the virtual center point (CP) to the outer surface (360c) of the bulkhead member (360).

[0089] Accordingly, at least a portion of the outer surface (360c) of the bulkhead member (360) may be supported by the shield frame (330). In detail, a portion not attached to at least one electronic component (320) may be supported by one side (330b) of the shield frame (330).

[0090] Accordingly, the first heat transfer member (351) placed in the second receiving space can move to prevent one end of the bulkhead member (360) from being pushed and the overall shape of the bulkhead member (360) from being deformed.

[0091] FIG. 10 is a drawing illustrating a heat dissipation structure according to one embodiment of the present disclosure. Referring to FIG. 10, according to one embodiment of the present disclosure, the heat dissipation structure may further include a third heat transfer member (353). For example, the third heat transfer member (353) may be disposed in at least a portion of a third receiving space (S3) formed by at least one electronic component (320), a partition member (360), and a shield frame (330). For example, the third receiving space (S3) may be formed as a closed space by the above configurations. Or, the third receiving space (S3) may be formed as an open space communicating with the outer space of the shield frame (330). For example, the third heat transfer member (353) may include a thermal pad, thermal grease, thermal adhesive, and / or thermal tape. For example, the third heat transfer member (353) may include a polymer resin (e.g., silicone and / or acrylic) and a thermally conductive filler (e.g., aluminum (Al2O3 (aluminum oxide)), boron nitride, carbon, polypropylene, PTFE (poly-tetrafluoroethylene), silver, and / or copper).

[0092] According to one embodiment of the present disclosure, the third heat transfer member (353) may be positioned to be in contact with at least a portion of the side (320b) of at least one electronic component (320). For example, the third heat transfer member (353) may be positioned to be in contact with at least a portion of the inner surface of the shield frame (330). For example, the third heat transfer member (353) may be positioned in the third receiving space (S3) on the printed circuit board (310). Although not shown in the drawings, the third heat transfer member (353) may be positioned to be in contact with the partition member (360). According to one embodiment, the third heat transfer member (353) may be positioned to be in contact with both at least a portion of the side (320b) of at least one electronic component (320) and at least a portion of the inner surface of the shield frame (330). For example, in an embodiment where at least one electronic component (320) comprises a plurality of electronic components (320-1, 320-2) and a partition member (360) is attached to the side of the second electronic component (320-2), the third heat transfer member (353) may be positioned to be in contact with at least a portion of the side (320-1c) of the first electronic component (320-1). In other words, the third heat transfer member (353) may be positioned to surround the side of the first electronic component (320-1). Accordingly, at least a portion of the heat generated from at least one electronic component (320) may be released to the outside of the heat dissipation structure through the third heat transfer member (353) and the shield frame (330).

[0093] FIG. 11 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure. Referring to FIG. 11, according to one embodiment of the present disclosure, a shielding cover (340) may include at least one hole (341). For example, the shielding cover (340) may include at least one hole (341) penetrating the shielding cover (340) in the thickness direction. Here, the thickness direction of the shielding cover (340) may mean the z-direction.

[0094] According to one embodiment of the present disclosure, at least one hole (341) may be formed in the inner side (IA) of the area where the partition member (360) contacts the shielding cover (340). For example, at least one hole (341) may be formed in an area of ​​the shielding cover (340) facing the first opening (333). According to one embodiment, at least one of a first heat transfer member (351) and a second heat transfer member (352) may be disposed inside the at least one hole (341). For example, if the second heat transfer member (352) is made of a solid material and the first heat transfer member (351) is made of a liquid material, only the first heat transfer member (351) may be disposed in the at least one hole (341). Conversely, if the first heat transfer member (351) is composed of a solid material and the second heat transfer member (352) is composed of a liquid material, only the second heat transfer member (352) may be placed in at least one hole (341). Alternatively, if both the first heat transfer member (351) and the second heat transfer member (352) are composed of a liquid material, the first heat transfer member (351) and / or the second heat transfer member (352) may be placed in at least one hole (341). Although the drawing only illustrates an embodiment in which at least one hole (341) penetrates the shielding cover (340) in the thickness direction (z-direction), the shape of at least one hole (341) is not necessarily limited to this. For example, at least one hole (341) may be formed to have an acute or obtuse angle with respect to the x-axis.

[0095] As a result of the heat transfer member (350) being disposed in at least one hole (341) formed in the shielding cover (340) in this manner, heat generated from at least one electronic component (320) can be transferred more effectively from the first heat transfer member (351) to the second heat transfer member (352). That is, accordingly, the heat dissipation performance of the heat dissipation structure included in the electronic device (100) can be improved.

[0096] FIG. 12 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure. Referring to FIG. 12, according to one embodiment of the present disclosure, the heat dissipation structure may further include a fourth heat transfer member (354). For example, the heat dissipation structure may further include a fourth heat transfer member (354) disposed between a support member (380) and a shield frame (330) facing the lower surface (380b) of the support member (380). For example, the fourth heat transfer member (354) may include a thermal pad, thermal grease, thermal adhesive, and / or thermal tape. For example, the fourth heat transfer member (354) may include a polymer resin (e.g., silicone and / or acrylic) and a thermally conductive filler (e.g., aluminum (Al2O3 (aluminum oxide)), boron nitride, carbon, polypropylene, PTFE (poly-tetrafluoroethylene), silver, and / or copper).

[0097] According to one embodiment of the present disclosure, the fourth heat transfer member (354) may be disposed in a gap space (G) formed between the upper surface (332a) of the second part (332) of the shield frame (330) and the lower surface (380b) of the support member (380). For example, the upper surface (332a) of the second part (332) of the shield frame (330) and the lower surface (380b) of the support member (380) may be disposed with a predetermined gap between them. According to one embodiment, as the fourth heat transfer member (354) is disposed in the gap space (G), which is the spaced-out space, heat generated from at least one electronic component (320) can be transferred to the support member (380) through the shield frame (330). Accordingly, since heat generated from at least one electronic component (320) can also be diffused through the support member (380), the overall heat dissipation performance of the heat dissipation structure can be improved. According to one embodiment, the fourth heat transfer member (354) may be formed to cover at least a portion of the upper surface (330a) of the shield frame (330). For example, the fourth heat transfer member (354) may be formed to cover at least a portion of the upper surface (332a) of the second part (332) of the shield frame (330). For example, the fourth heat transfer member (354) may be formed to be in contact with at least a portion of the upper surface (332a) of the second part (332) of the shield frame (330) and at least a portion of the lower surface (380b) of the support member (380). Although not illustrated in the drawings, according to one embodiment of the present disclosure, the fourth heat transfer member (354) may be formed to surround at least a portion of the upper surface (332a) of the second part (332) of the shield frame (330) and one surface of the first part (331). In other words, the shape of the fourth heat transfer member (354) is not necessarily limited to what is shown and can be implemented in various shapes as needed.

[0098] FIG. 13 is a drawing showing a heat dissipation structure according to one embodiment of the present disclosure. Referring to FIG. 13, according to one embodiment of the present disclosure, an electronic device (100) may include a heat dissipation structure formed on a printed circuit board (410). For example, the heat dissipation structure may include at least one electronic component (420), a shielding cover (430), a heat diffusion member (440), and a heat transfer member (450). According to one embodiment, at least one electronic component (420) may be disposed on one side of the printed circuit board (410). For example, the shielding cover (430) may be disposed on the upper side of at least one electronic component (420). For example, the shielding cover (430) may be disposed such that one side faces the at least one electronic component (420). For example, the heat diffusion member (440) may be disposed on the upper side of the shielding cover (430). For example, the heat diffusion member (440) may be positioned to face the other side opposite to the one side of the shielding cover (430).

[0099] According to one embodiment of the present disclosure, the heat transfer member (450) may include a first heat transfer member (451) and a second heat transfer member (452). For example, the heat transfer member (450) may include a thermal pad, thermal grease, thermal adhesive, and / or thermal tape. For example, the heat transfer member (450) may include a polymer resin (e.g., silicone and / or acrylic) and a thermally conductive filler (e.g., aluminum (Al2O3 (aluminum oxide)), boron nitride, carbon, polypropylene, PTFE (poly-tetrafluoroethylene), silver, and / or copper).

[0100] According to one embodiment of the present disclosure, a first heat transfer member (451) may be positioned to contact at least a portion of one side of the shielding cover (430) and at least a portion of at least one electronic component (420). For example, a second heat transfer member (452) may be positioned to contact at least a portion of the other side of the shielding cover (430) and at least a portion of the heat diffusion member (440). According to one embodiment, at least one of the first heat transfer member (451) and the second heat transfer member (452) may be composed of a liquid material.

[0101] According to one embodiment of the present disclosure, the heat dissipation structure may further include a support member (460). For example, the support member (460) may be fixed to a heat diffusion member (440) and a printed circuit board (410). For example, at least a portion of the support member (460) may be formed to surround at least one electronic component (420), a shielding cover (430), a first heat transfer member (451), and a second heat transfer member (452). For example, the support member (460) may include an upper support member (461) and a lower support member (462).

[0102] According to one embodiment of the present disclosure, the heat diffusion member (440) may include a core portion (441), a peripheral portion (442), and an extended peripheral portion (443). For example, the core portion (441) may have an internal space formed therein through which fluid flows. For example, the peripheral portion (442) may be formed to surround the core portion (441). For example, the extended peripheral portion (443) may be formed extending outward from the peripheral portion (442). In other words, the core portion (441), the peripheral portion (442), and the extended peripheral portion (443) may all be formed integrally.

[0103] According to one embodiment of the present disclosure, the heat diffusion member (440) may be secured by an adhesive member (not shown) disposed between an extended peripheral portion (443) and an upper support member (461). The adhesive member may be double-sided tape, but is not necessarily limited thereto.

[0104] According to one embodiment of the present disclosure, the second heat transfer member (452) may include an adhesive material. For example, the heat diffusion member (440) may be fixed to the shielding cover (430) and the support member (460) by the second heat transfer member (452).

[0105] According to one embodiment of the present disclosure, the heat dissipation structure may further include a third heat transfer member (not shown). For example, it may further include a third heat transfer member (not shown) disposed between a lower support member (462) and at least one electronic component (420). For example, the third heat transfer member (not shown) may be disposed to be in contact with at least a portion of the at least one electronic component (420) and the inner surface of the lower support member (462).

[0106] According to one embodiment of the present disclosure, the heat dissipation structure may further include a fixed member (not shown) and a fourth heat transfer member (not shown). For example, the fixed member may connect the upper support member (461) and the lower support member (462) between the upper support member (461) and the lower support member (462). For example, the fourth heat transfer member (not shown) may be positioned between the upper support member (461) and the lower support member (462). For example, the fourth heat transfer member (not shown) may be positioned to be in contact with the upper support member (461) and the lower support member (462).

[0107] According to one embodiment of the present disclosure, the shielding cover (430) may include at least one hole (not shown). For example, at least one hole may be formed to penetrate the shielding cover (430) in the thickness direction. For example, at least one of a first heat transfer member (451) and a second heat transfer member (452) may be disposed inside the at least one hole.

[0108] FIG. 14 is a block diagram of an electronic device (1401) in a network environment (1400) according to various embodiments. Referring to FIG. 14, in the network environment (1400), the electronic device (1401) may communicate with an electronic device (1402) through a first network (1498) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (1404) or a server (1408) through a second network (1499) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1401) may communicate with the electronic device (1404) through a server (1408). According to one embodiment, the electronic device (1401) may include a processor (1420), memory (1430), input module (1450), sound output module (1455), display module (1460), audio module (1470), sensor module (1476), interface (1477), connection terminal (1478), haptic module (1479), camera module (1480), power management module (1488), battery (1489), communication module (1490), subscriber identification module (1496), or antenna module (1497). In some embodiments, at least one of these components (e.g., connection terminal (1478)) may be omitted from the electronic device (1401), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (1476), camera module (1480), or antenna module (1497)) may be integrated into a single component (e.g., display module (1460)).

[0109] The processor (1420) can, for example, execute software (e.g., program (1440)) to control at least one other component (e.g., hardware or software component) of the electronic device (1401) connected to the processor (1420) and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (1420) can store commands or data received from other components (e.g., sensor module (1476) or communication module (1490)) in volatile memory (1432), process the commands or data stored in volatile memory (1432), and store the resulting data in non-volatile memory (1434). According to one embodiment, the processor (1420) may include a main processor (1421) (e.g., a central processing unit or an application processor) or an auxiliary processor (1423) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (1401) includes a main processor (1421) and an auxiliary processor (1423), the auxiliary processor (1423) may be configured to use less power than the main processor (1421) or to be specialized for a specified function. The auxiliary processor (1423) may be implemented separately from the main processor (1421) or as part thereof.

[0110] The auxiliary processor (1423) may control at least some of the functions or states associated with at least one component of the electronic device (1401) (e.g., display module (1460), sensor module (1476), or communication module (1490)) on behalf of the main processor (1421) while the main processor (1421) is in an inactive (e.g., sleep) state, or together with the main processor (1421) while the main processor (1421) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (1423) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (1480) or communication module (1490)). According to one embodiment, the auxiliary processor (1423) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (1401) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (1408)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0111] The memory (1430) can store various data used by at least one component of the electronic device (1401) (e.g., processor (1420) or sensor module (1476)). The data may include, for example, input data or output data for software (e.g., program (1440)) and related commands. The memory (1430) may include volatile memory (1432) or non-volatile memory (1434).

[0112] The program (1440) may be stored as software in memory (1430) and may include, for example, an operating system (1442), middleware (1444), or an application (1446).

[0113] The input module (1450) can receive commands or data to be used for a component of the electronic device (1401) (e.g., processor (1420)) from outside the electronic device (1401) (e.g., user). The input module (1450) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0114] The sound output module (1455) can output a sound signal to the outside of the electronic device (1401). The sound output module (1455) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0115] The display module (1460) can visually provide information to an external (e.g., user) of the electronic device (1401). The display module (1460) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (1460) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0116] The audio module (1470) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (1470) can acquire sound through the input module (1450) or output sound through the sound output module (1455) or an external electronic device (e.g., electronic device (1402)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (1401).

[0117] The sensor module (1476) can detect the operating state of the electronic device (1401) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (1476) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0118] The interface (1477) may support one or more specified protocols that can be used for the electronic device (1401) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (1402)). According to one embodiment, the interface (1477) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0119] The connection terminal (1478) may include a connector through which the electronic device (1401) can be physically connected to an external electronic device (e.g., electronic device (1402)). According to one embodiment, the connection terminal (1478) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0120] The haptic module (1479) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (1479) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0121] The camera module (1480) can capture still images and video. According to one embodiment, the camera module (1480) may include one or more lenses, image sensors, image signal processors, or flashes.

[0122] The power management module (1488) can manage the power supplied to the electronic device (1401). According to one embodiment, the power management module (1488) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0123] The battery (1489) can supply power to at least one component of the electronic device (1401). According to one embodiment, the battery (1489) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0124] The communication module (1490) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (1401) and an external electronic device (e.g., electronic device (1402), electronic device (1404), or server (1408)), and the performance of communication through the established communication channel. The communication module (1490) may include one or more communication processors that operate independently of the processor (1420) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1490) may include a wireless communication module (1492) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (1494) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (1404) via a first network (1498) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (1499) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1492) can identify or authenticate the electronic device (1401) within a communication network such as the first network (1498) or the second network (1499) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (1496).

[0125] The wireless communication module (1492) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (1492) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (1492) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (1492) can support various requirements specified in the electronic device (1401), external electronic device (e.g., electronic device (1404)), or network system (e.g., second network (1499)). According to one embodiment, the wireless communication module (1492) can support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0126] An antenna module (1497) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (1497) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (1497) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (1498) or a second network (1499), may be selected from the plurality of antennas, for example, by a communication module (1490). A signal or power may be transmitted or received between the communication module (1490) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (1497).

[0127] According to various embodiments, the antenna module (1497) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0128] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0129] According to one embodiment, commands or data may be transmitted or received between the electronic device (1401) and an external electronic device (1404) through a server (1408) connected to a second network (1499). Each of the external electronic devices (1402, or 1304) may be the same or a different type of device as the electronic device (1401). According to one embodiment, all or part of the operations performed on the electronic device (1401) may be performed on one or more of the external electronic devices (1402, 1304, or 1508). For example, if the electronic device (1401) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (1401) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (1401). The electronic device (1401) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (1401) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1404) may include an Internet of Things (IoT) device. The server (1408) may be an intelligent server using machine learning and / or neural networks.According to one embodiment, an external electronic device (1404) or server (1408) may be included within the second network (1499). The electronic device (1401) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0130] The problem to be solved according to one embodiment of the present disclosure may be as follows.

[0131] According to one embodiment of the present disclosure, a heat dissipation structure including a first opening and a bulkhead member may be provided.

[0132] According to one embodiment of the present disclosure, a heat dissipation structure may be provided that includes a second receiving space in which a first heat transfer member is disposed.

[0133] According to one embodiment of the present disclosure, an electronic device may include a printed circuit board. The electronic device may include at least one electronic component disposed on one side of the printed circuit board. The electronic device may include a shield frame formed to surround the at least one electronic component. The electronic device may include a first hollow opening formed on the upper surface of the shield frame. The electronic device may include a shielding cover disposed on the upper surface of the shield frame. The electronic device may include a heat diffusion member disposed on the upper side of the shielding cover. The electronic device may include a first heat transfer member disposed to be in contact with the at least one electronic component and one side of the shielding cover. The first heat transfer member may be disposed on the upper surface of the at least one electronic component at a portion corresponding to the first opening. The electronic device may include a second heat transfer member disposed to be in contact with the heat diffusion member and the other side of the shielding cover opposite to the one side. The electronic device may include a partition member attached to at least a portion of the side of the at least one electronic component. The above bulkhead member may be formed to extend toward the first opening so as to contact the one surface of the shielding cover. The at least one electronic component may be disposed within a first receiving space formed by the printed circuit board and the shield frame. The first heat transfer member may be disposed within a second receiving space formed by the upper surface of the at least one electronic component, the bulkhead member, and the shielding cover. At least one of the first heat transfer member and the second heat transfer member may be composed of a liquid material. The bulkhead member may be composed of a solid material having elasticity. One cross-section of the bulkhead member may be formed in a shape corresponding to the shape of the first opening.At least a portion of the outer surface of the above bulkhead member may be positioned to be in contact with a portion of the shield frame forming the first opening. The at least one electronic component may include a first electronic component and a second electronic component stacked on top of the first electronic component. The bulkhead member may be positioned along the side of the second electronic component from the upper surface of the first electronic component. The second heat transfer member may include an adhesive material. The heat diffusion member may be attached to the shield cover by the second heat transfer member. The electronic device may further include a support member positioned on the outside of the shield frame. The support member may include a hollow second opening formed to have a shape corresponding to the heat diffusion member. The second opening may include a first region having a first width and a second region having a second width longer than the first width. The second region may be formed on the upper side of the first region. The heat diffusion member may be positioned in the second region. The above-mentioned heat diffusion member may include a core portion that dissipates heat transferred from the at least one electronic component and an extension portion that surrounds the core portion and extends outwardly from the core portion. The electronic device may further include an adhesive member disposed between the lower surface of the extension portion of the heat diffusion member and the support member. The electronic device may further include a third heat transfer member disposed in a third receiving space formed by the at least one electronic component, the partition member, and the shield frame. The shielding cover may include at least one hole penetrating the shielding cover in the thickness direction. The hole may be formed on the inner side of the area where the partition member contacts the shielding cover. At least one of the first heat transfer member and the second heat transfer member may be disposed inside the hole.The electronic device may further include a fourth heat transfer member disposed between the lower surface of the support member and the shield frame facing the lower surface of the support member. The support member and the shield frame may be formed integrally.

[0134] An electronic device according to one embodiment of the present disclosure may include a printed circuit board, at least one electronic component disposed on one surface of the printed circuit board, a shielding cover disposed above the at least one electronic component and having one surface facing the at least one electronic component, a thermal diffusion member disposed above the shielding cover and facing the other surface opposite to the one surface of the shielding cover, a first thermal interface material (TIM) in contact with at least a portion of the one surface of the shielding cover and at least a portion of the at least one electronic component, and a second thermal interface material in contact with at least a portion of the other surface of the shielding cover and at least a portion of the thermal diffusion member. At least one of the first thermal interface material and the second thermal interface material may be composed of a liquid material. The electronic device may further include a support member fixed to the thermal diffusion member and the printed circuit board. At least a portion of the support member may be formed to surround the at least one electronic component, the shielding cover, the first thermal interface material, and the second thermal interface material. The heat diffusion member may include a core portion, a peripheral portion formed to surround the core portion, and an extended peripheral portion extending outwardly from the peripheral portion. The support member may include an upper support member and a lower support member. The heat diffusion member may be fixed to the support member by an adhesive member disposed between the extended peripheral portion and the upper support member. The second heat transfer member may include an adhesive material. The heat diffusion member may be fixed to the shielding cover and the support member by the second heat transfer member. The electronic device may further include a third heat transfer member disposed between the lower support member and the at least one electronic component.The third heat transfer member may be positioned to be in contact with at least a portion of the at least one electronic component and the inner surface of the lower support member. The electronic device may include a fixing member connecting the upper support member and the lower support member between the upper support member and the lower support member. The electronic device may further include a fourth heat transfer member positioned between the upper support member and the lower support member. The fourth heat transfer member may be positioned to be in contact with the upper support member and the lower support member. The shielding cover may include at least one hole penetrating the shielding cover in the thickness direction. At least one of the first heat transfer member and the second heat transfer member may be positioned inside the hole.

[0135] The effects of the invention according to one embodiment of the present disclosure are as follows.

[0136] According to one embodiment of the present disclosure, a first opening is formed in the shield frame, thereby simplifying the heat transfer path through which heat generated from at least one electronic component is transferred to a heat diffusion member. In other words, a stacked structure disposed above at least one electronic component to dissipate heat generated from at least one electronic component can be simplified.

[0137] According to one embodiment of the present disclosure, the manufacturing process can be simplified as the first heat transfer member and / or the second heat transfer member are composed of a liquid material. In addition, the required heat dissipation performance can be achieved even when a predetermined error occurs between the dimensions pre-designed in the design drawings and the components adjacent to the heat transfer member when they are formed.

[0138] According to one embodiment of the present disclosure, by including a second receiving space formed by at least one electronic component, a partition member, and a shielding cover, the first heat transfer member may not be ejected from the second receiving space even if it is composed of a fluid material. In other words, it is possible to prevent a phenomenon in which a void is created between the first heat transfer member and the shielding cover, thereby degrading heat dissipation performance, by preventing at least a part of the first heat transfer member from being ejected from the second receiving space.

[0139] In addition, various effects identified directly or indirectly through the present disclosure may be provided.

[0140] Methods according to the claims or embodiments described in the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0141] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure.

[0142] In the present disclosure, the function or operation performed by an electronic device may be performed by one or more processors executing one or more instructions stored in memory. The function or operation of the electronic device mentioned in the present disclosure may be performed by a single processor executing one or more instructions, or by a combination of multiple processors executing one or more instructions. A processor mentioned in the present disclosure is understood to include a circuit for performing operations or controlling other components of the electronic device. For example, the one or more processors may include a central processing unit (CPU), a micro-processor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on chip (SoC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operation of the electronic device described above.

[0143] In the present disclosure, a program (software module, software) may be stored in a random access memory, a non-volatile memory including flash memory, a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic disc storage device, a compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, or a magnetic cassette. Alternatively, it may be stored in a memory composed of some or all of these. The memory may be composed of a single storage medium or a combination of multiple storage media. The one or more instructions may be stored in a single storage medium or distributed across multiple storage media.

[0144] Additionally, the above program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, an intranet, a local area network (LAN), a wide LAN (WLAN), or a storage area network (SAN), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0145] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0146] In the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, comprising only b, comprising only c, or comprising a combination of two or more (comprising a and b, comprising b and c, comprising a and c, or comprising all of a, b, and c).”

[0147] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

[0148] In the present disclosure, the term “if” will be understood, depending on the context, to mean “when, upon,” “in response to a decision,” or “in response to a detection.” Similarly, “when decided to,” or “when [mentioned condition or event] is detected” will be understood, optionally, to mean “when decided,” or “in response to a decision,” “when [mentioned condition or event] is detected,” or “in response to a detection.”

[0149] The device described above may be implemented as a hardware component, a software component, and / or a combination of a hardware component and a software component. For example, the device and components described in the embodiments may be implemented using one or more general-purpose or special-purpose computers, such as a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing unit (or processing circuit) may execute an operating system (OS) and one or more software applications executed on said operating system. Additionally, the processing unit may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing unit may be described as being used as a single unit, but those skilled in the art will understand that the processing unit may include multiple processing elements and / or multiple types of processing elements. For example, the processing unit may include multiple processors or one processor and one controller. Additionally, other processing configurations, such as parallel processors, are also possible.

[0150] Software may include computer programs, code, instructions, or a combination of one or more of these, and may configure a processing unit to operate as desired or instruct the processing unit independently or collectively. Software and / or data may be embodied in any type of machine, component, physical device, computer storage medium, or device so as to be interpreted by the processing unit or to provide instructions or data to the processing unit. Software may be distributed over networked computer systems and may be stored or executed in a distributed manner. Software and data may be stored on one or more computer-readable recording media.

[0151] The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. In this case, the medium may continuously store a program executable by a computer, or temporarily store it for execution or download. Additionally, the medium may be various recording or storage means in the form of a single or several hardware combined, and may not be limited to a medium directly connected to a computer system but may exist distributed over a network. Examples of media may include magnetic media such as hard disks, floppy disks, and magnetic tapes; optical recording media such as CD-ROMs and DVDs; magneto-optical media such as floptical disks; and media configured to store program instructions, including ROM, RAM, and flash memory. Additionally, other examples of media may include recording or storage media managed by an app store that distributes applications or a site or server that supplies or distributes various other software.

[0152] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

[0153] Although the embodiments have been described above with reference to limited examples and drawings, those skilled in the art can make various modifications and variations from the description above. For example, suitable results can be achieved even if the described techniques are performed in a different order than described, and / or the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

Claims

1. In an electronic device, Printed circuit board; At least one electronic component disposed on one side of the above printed circuit board; A shield frame formed to surround at least one electronic component, wherein the shield frame includes a first hollow opening formed on its upper surface; A shielding cover disposed on the upper surface of the shield frame; A heat diffusion member disposed on the upper side of the shielding cover; A first heat transfer member disposed to be in contact with one surface of the at least one electronic component and the shielding cover, wherein the first heat transfer member is disposed on the upper surface of the at least one electronic component at a portion corresponding to the first opening; A second heat transfer member disposed to be in contact with the other surface opposite to the one surface of the heat diffusion member and the shielding cover; and It includes a partition member attached to at least a portion of the side of the above-mentioned at least one electronic component, and The above bulkhead member is formed to extend toward the first opening so as to contact the one surface of the shielding cover, and The above at least one electronic component is disposed within a first receiving space formed by the printed circuit board and the shield frame, and The first heat transfer member is disposed within a second receiving space formed by the upper surface of the at least one electronic component, the partition member, and the shielding cover, in an electronic device.

2. In Paragraph 1, An electronic device in which at least one of the first heat transfer member and the second heat transfer member is composed of a liquid material.

3. In Paragraph 2, The above bulkhead member is composed of a solid material having elasticity, in an electronic device.

4. In Paragraph 1, One cross-section of the above bulkhead member is formed in a shape corresponding to the shape of the first opening, and An electronic device in which at least a portion of the outer surface of the above bulkhead member is positioned to be in contact with a portion of the shield frame forming the first opening.

5. In Paragraph 1, The above at least one electronic component includes a first electronic component and a second electronic component stacked on top of the first electronic component, and The above bulkhead member is an electronic device arranged along the side of the second electronic component from the upper surface of the first electronic component.

6. In Paragraph 1, The second heat transfer member includes an adhesive material, and The above-mentioned heat diffusion member is an electronic device attached to the shielding cover by the above-mentioned second heat transfer member.

7. In Paragraph 1, It further includes a support member disposed on the outer side of the shield frame, and The above support member is, It includes a hollow second opening formed to have a shape corresponding to the heat diffusion member, and The above second opening is, A first region having a first width; and It includes a second region having a second width longer than the first width, and The second region is formed on the upper side of the first region, and The above-mentioned heat diffusion member is an electronic device disposed in the above-mentioned second region.

8. In Paragraph 7, The above-mentioned heat diffusion member is, A core portion for dissipating heat transferred from at least one electronic component; and An electronic device comprising an extension portion that surrounds the core portion and extends outwardly to the core portion.

9. In Paragraph 8, An electronic device further comprising an adhesive member disposed between the lower surface of the extension portion of the heat diffusion member and the support member.

10. In Paragraph 9, An electronic device further comprising at least one electronic component, a third heat transfer member disposed in a third receiving space formed by the partition member and the shield frame.

11. In Paragraph 9, The shielding cover comprises at least one hole penetrating the shielding cover in the thickness direction; and The above hole is formed on the inner side of the area where the bulkhead member contacts the shielding cover, and An electronic device in which at least one of the first heat transfer member and the second heat transfer member is disposed inside the above hole.

12. In Paragraph 9, An electronic device further comprising a fourth heat transfer member disposed between the lower surface of the support member and the shield frame facing the lower surface of the support member.

13. In Paragraph 9, An electronic device in which the support member and the shield frame are integrally formed.

14. In electronic devices, At least one electronic component disposed on one side of a printed circuit board; A shielding cover disposed above the at least one electronic component, with one surface facing the at least one electronic component; A heat diffusion member disposed on the upper side of the shielding cover and facing the other side opposite to the one side of the shielding cover; A first heat transfer member in contact with at least a portion of one surface of the shielding cover and at least a portion of the at least one electronic component; and A second heat transfer member in contact with at least a portion of the other surface of the shielding cover and at least a portion of the heat diffusion member; and It includes the above-mentioned heat diffusion member and a support member fixed to the above-mentioned printed circuit board, and At least one of the first heat transfer member and the second heat transfer member is composed of a liquid material, and An electronic device, wherein at least a portion of the support member is formed to surround at least one electronic component, the shielding cover, the first heat transfer member, and the second heat transfer member.

15. In Claim 14, The above-mentioned heat diffusion member is, Core part; A peripheral portion formed to surround the above-mentioned core portion; and It includes an extended peripheral portion extending outward from the above peripheral portion, and The above support member is, Upper support member; and It includes a lower support member, An electronic device in which the heat diffusion member is fixed to the support member by an adhesive member disposed between the extended peripheral portion and the upper support member.

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