Systems and methods for sintering thick diamond on substrate

Abstract

A cutting element may include a polycrystalline diamond (PCD) table including an apexed working surface. A cutting element may include a body including a non-diamond body material bonded to the PCD table, wherein a PCD height of the PCD table is no less than 40% of a cutting element height including the PCD table and body.

Description

Patent ApplicationAttorney Docket No. IS24.1276-WOSYSTEMS AND METHODS FOR SINTERING THICK DIAMOND ON SUBSTRATECROSS REFERENCE TO RELATED APPLICATIONS

[0001] The present application claims priority to and the benefit of United States Provisional Patent Application No. 63 / 749,286 filed January 24, 2025 and titled “SYSTEMS AND METHODS FOR SINTERING THICK DIAMOND ON SUBSTRATE”, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND

[0002] This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present disclosure, which are described and / or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present disclosure. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.

[0003] Drill bits are used during drilling to produce wellbores for the discovery and extraction of hydrocarbons such as crude oil and natural gas from the earth’s crust. Generally, the cutting element of a drill bit is made of polycrystalline diamond (PCD) supported by a non-diamond substrate. Mismatches in material properties between the substrate and PCD table can induce failures during usage. Large PCD tables have advantageous mechanical properties, but can exacerbate challenges in sintering and material mismatches.SUMMARY

[0004] In some aspects, the techniques described herein relate to a cutting element, including: a polycrystalline diamond (PCD) table including an apexed working surface; and a body including a non-diamond body material bonded to the PCD table, wherein a PCD height of the PCD table is no less than 40% of a cutting element height including the PCD table and body.Patent ApplicationAttorney Docket No. IS24.1276-WO

[0005] In some aspects, the techniques described herein relate to a method of manufacturing a cutting element, the method including: positioning a diamond precursor on a body precursor; positioning an infi Itrant source and / or catalyst source on the diamond precursor longitudinally opposite to the body precursor; migrating an infiltrant and / or catalyst into the diamond precursor; and sintering the diamond precursor into a polycrystalline diamond (PCD) table bonded to a body sintered from the body precursor.

[0006] In some aspects, the techniques described herein relate to a cutting element, including: a polycrystalline diamond (PCD) table including a working surface; a body including a non-diamond body material bonded to the PCD table, wherein a PCD height of the PCD table is no less than 40% of a cutting element height including the PCD table and body; and a transition zone between the PCD table and the body, wherein the transition zone includes diamond material of the PCD table and body material where the body material is no more than 10% of the transition zone by volume.

[0007] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0008] Additional features and advantages will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the teachings herein. Features and advantages of the disclosure may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. Features of the present disclosure will become more fully apparent from the following description and appended claims or may be learned by the practice of the disclosure as set forth hereinafter.Patent ApplicationAttorney Docket No. IS24.1276-WOBRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present disclosure is best understood from the following detailed description when read with the accompanying Figures. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

[0010] FIG. 1 is a perspective view of a cutting element, according to one or more embodiments of the present disclosure.

[0011] FIG. 2 is a side cross-sectional view of another embodiment of a cutting element, according to one or more embodiments of the present disclosure.

[0012] FIG. 3 is a side cross-sectional view of an embodiment of a cutting element with a transition zone, according to one or more embodiments of the present disclosure.

[0013] FIG. 4 is a flowchart illustrating a method of manufacture of a cutting element, according to one or more embodiments of the present disclosure.

[0014] FIG. 5 is a side cross-sectional view of an arrangement of precursors for a sintering can, according to one or more embodiments of the present disclosure.

[0015] FIG. 6 is a side cross-sectional view of another arrangement of precursors for a sintering can, according to one or more embodiments of the present disclosure.

[0016] FIG. 7 is a side cross-sectional view of an apexed cutting element, according to one or more embodiments of the present disclosure.

[0017] FIG. 8 is a side view of a drill bit including cutting elements, according to one or more embodiments of the present disclosure.DETAILED DESCRIPTION

[0018] Illustrative examples of the subject matter claimed below will now be disclosed. In the interest of clarity, not all features of an actual implementation are described in this specification. It will be appreciated that in the development of anyPatent ApplicationAttorney Docket No. IS24.1276-WOsuch actual implementation, numerous implementation-specific decisions may be made to achieve the developers’ specific goals, such as compliance with system-related and business-related constraints, which will vary from one implementation to another. Moreover, it will be appreciated that such a development effort, even if complex and time-consuming, would be a routine undertaking for those of ordinary skill in the art having the benefit of this disclosure.

[0019] Further, as used herein, the article “a” is intended to have its ordinary meaning in the patent arts, namely “one or more.” Moreover, examples herein are intended to be illustrative only and are presented for discussion purposes and not by way of limitation.

[0020] The present disclosure is generally related to methods of manufacture and systems and devices produced by such methods for improved performance of cutting elements. In some embodiments, the present disclosure is directed towards methods for producing a cutting element with improved thermal performance. In some embodiments, a cutting element is exposed to and / or generates heat at a working surface of the cutting element. For example, the working surface of the cutting element may be exposed to high temperatures a downhole environment. In some examples, the working surface may generate heat while contacting rock and other material during drilling operations in a downhole environment. In some examples, the working surface may generate heat while contacting concrete, cement, metal, or other materials during reaming and other borehole operations in a downhole environment.

[0021] Referring now to FIG. 1, in some embodiments, a cutting element 100 includes a body 102 with an ultrahard material at the working surface 104. For example, the working surface of the cutting element 100 may be a polycrystalline diamond (PCD) table 106. PCD tables include a plurality of diamond grains that provide a high hardness to the PCD, as well as a high thermal conductivity (e.g., greater than 250 Watts per Meter per degree Kelvin (W / m*K)). The heat received and / or generated at the working surface, therefore, may be conducted to a body of the cutting element at a high rate. In some embodiments, the body of the cutting element may be a non-diamond substrate material with a lower thermal conductivityPatent ApplicationAttorney Docket No. IS24.1276-WOthan the PCD table. For example, tungsten carbide has a thermal conductivity of 110 W / m*K. The body of the cutting element, in such embodiments, limits the overall thermal conductivity of the cutting element. A thinned body relative to the height of the cutting element may better take advantage of the advantageous thermal conductivity properties of the PCD table and more effectively conduct heat from the working surface, leading to a lower temperature at the working surface.

[0022] As used herein, the term "ultrahard" is understood to refer to those materials known in the art to have a grain hardness of about 1,500 HV (Vickers hardness in kg / mm2) or greater. Such ultrahard materials can include but are not limited to diamond, sapphire, moissantite, hexagonal diamond (Lonsdaleite), cubic boron nitride (cBN), polycrystalline cBN (PcBN), Q-carbon, binderless PcBN, diamond-like carbon, boron suboxide, aluminum manganese boride, metal borides, boron carbon nitride, PCD (including, e.g., leached metal catalyst PCD, non-metal catalyst PCD, and binderless PCD or nanopolycrystalline diamond (NPD)) and other materials in the boron-nitrogen-carbon-oxygen system which have shown hardness values above 1 ,500 HV, as well as combinations of the above materials. In some embodiments, the ultrahard material may have a hardness values above 3,000 HV. In other embodiments, the ultrahard material may have a hardness value above 4,000 HV. In yet other embodiments, the ultrahard material may have a hardness value greater than 80 HRa (Rockwell hardness A).

[0023] In some embodiments, a cutting element 100 according to the present disclosure includes a PCD table 106 bonded to a body 102. In some embodiments, the PCD table 106 is a thick PCD table 106 with a PCD height 108 no less than 40% of a cutting element height 110. In some embodiments, the PCD height 108 is no less than 50% of the cutting element height 110. In some embodiments, the PCD height 108 is no less than 60% of the cutting element height 110. In some embodiments, the PCD height 108 is no less than 70% of the cutting element height 110. A large PCD table 106, however, can create a mismatch in thermal expansion between the PCD material and the non-diamond substrate material of the body 102. In some embodiments, at least one transition layer at the interface between the PCD table and the body 102 limits and / or prevents cracking in the cutting element 100.Patent ApplicationAttorney Docket No. IS24.1276-WO

[0024] FIG. 2 is a side cross-sectional view of another embodiment of a cutting element 200. In some embodiments, the cutting element 200 has a planar interface 212 between the body 202 and the PCD table 206. For example, the interface 212 may be substantially flat and uniform across a diameter of the body 202, while being substantially perpendicular to a longitudinal direction of the body 202. In some embodiments, the interface 212 is non-planar. In some examples, the interface 212 may be at least partially convex toward the working surface 204 and / or PCD table 206. In some examples, the interface 212 may be at least partially concave toward the working surface 204 and / or PCD table 206. In some examples, the interface 212 may be at least partially wavy in the longitudinal direction toward the working surface 204 and / or PCD table 206. In some examples, the interface 212 may be at least partially ridged or have a plurality of ridges in the longitudinal direction toward the working surface 204 and / or PCD table 206.

[0025] In some embodiments, the PCD table 206 or other polycrystalline ultrahard material that forms at least a portion of the working surface 204 is formed using a catalyst or infiltrant material that is provided from the substrate material of the body 202. For example, during sintering of the PCD table 206 on the body 202, a catalyst or infiltrant provided in a precursor (e.g., powder) of the body 202 migrates into the PCD powder or another ultrahard precursor. In some embodiments, polycrystalline ultra-hard materials may be formed using a catalyst or infiltrant material that is provided from a source other than the substrate of the body 202. For example, polycrystalline ultra-hard materials may be formed from diamond powder infiltrated with the catalyst originating from a source other than the substrate, or a preformed sintered diamond body may be infiltrated with an infiltrant material originating from a source other than the substrate to which the preformed diamond body is being attached. In both examples, the infiltration (of catalyst or infiltrant) may occur in an HPHT sintering cycle that first infiltrates the catalyst / infiltrant into the diamond material (powder or preformed sintered body) and subsequently attaches the diamond material to a substrate.

[0026] The term “catalyst” is used to indicate when a material catalyzes diamond powder to form a PCD body (having interconnected diamond grains) while “infiltrant”Patent ApplicationAttorney Docket No. IS24.1276-WOis used to indicate when a material infiltrates into a PCD body but does not catalyze it, i.e. , the material infiltrates into a previously formed PCD body. In the latter case, where an infiltrant is used, the catalyst material used to form the PCD body may be removed from the body (resulting in substantially empty voids or interstitial regions between the diamond grains) prior to allowing the infiltrant material to infiltrate into the PCD body. By using a catalyst or infiltrant provided from a source other than a substrate, a top surface / region of the resulting PCD body opposite the substrate may have a lower tungsten content than a conventional PCD structure. In addition, the term “attachment material” is used to indicate when a material infiltrates into a PCD body from the substrate to attach the substrate to the PCD body. Each of the catalyst, infiltrant, and attachment material may include the same or different materials. For example, cobalt could be included in each of the catalyst, infiltrant, and attachment materials. As will be discussed in detail below, in some embodiments, the attachment material differs from the catalyst or infiltrant in that it generally carries a relatively larger amount of tungsten or other metal from the substrate into the PCD table.

[0027] A thick PCD table, as described herein, may be challenging to infiltrate or catalyze fully (e.g., through to the working surface 204) with an infiltrant or catalyst originating from the body. In some embodiments, an infiltrant or catalyst is provided during the sintering process proximate to the working surface 204 and / or a lateral surface of the PCD table 206 to ensure infiltration and / or catalyzation of the PCD formation during sintering. In some examples, infiltration and / or catalyzation proximate to the working surface 204 is of increased importance in three-dimensional (3D) or apexed cutting elements. In some examples, an apexed cutting element is any cutting element with an apex in the working surface 204 in the longitudinal direction of the cutting element 200. For example, an apexed cutting element may be a bullet cutting element, an axe cutting element, a ridge cutting element, a conical cutting element, a frustoconical cutting element, a hemispherical cutting element, or similar cutting elements. In some embodiments, an apexed cutting element has a non-planar working surface 204 with an apex in the longitudinal direction of the cutting element 200. In some embodiments, an apexed cutting element has a planar working surfacePatent ApplicationAttorney Docket No. IS24.1276-WOoriented at an angle to a longitudinal direction of the cutting element 200 with an apex at a lateral edge of the working surface 204.

[0028] In some embodiments, an infiltrant and / or catalyst source is provided during sintering from a longitudinal end of the PCD precursor opposite the body precursor to provide the infiltrant and / or catalyst to form the PCD table during sintering, and at least a portion of the PCD table is subsequently removed (e.g., by grinding, lapping, laser cutting) to form the apexed working surface. In some embodiments, a majority of the as-sintered end surface is removed after sintering to form the apexed working surface.

[0029] As described herein, a bond between the PCD table 206 and the body 202 may be affected by a mismatch in the coefficient of thermal expansion between the PCD and the body material. In some examples, the body material is tungsten carbide. Referring now to FIG. 3, in some embodiments, a cutting element 300 has a transition zone 314 between the carbide body 302 and the PCD table 306.

[0030] In some embodiments, the transition zone 314 includes at least a portion of the diamond material of the PCD table 306 and a portion of the body material (such as tungsten carbide in the above example). In some embodiments, the transition zone 314 is a majority diamond material. In some embodiments, the transition zone 314 is no more than 10% body material (relative to diamond material) by volume. In some embodiments, the transition zone 314 is no more than 8% body material (relative to diamond material) by volume. In some embodiments, the transition zone 314 is no more than 6% body material (relative to diamond material) by volume. In some embodiments, the transition zone 314 is a discrete layer between the PCD table 306 and the body 302 with a substantially homogeneous mixture of the diamond material and the body material. For example, the transition zone 314 may be a layer with a substantially homogeneous 10% body material composition. In some embodiments, the transition zone 314 is a gradient zone that transitions from 0% body material adjacent to the PCD table 306 and up to 10% body material adjacent to the body 302.

[0031] FIG. 4 is a flowchart illustrating a method 416 of manufacture of a cutting element according to any embodiment described herein. In some embodiments, the method 416 includes positioning a diamond precursor on a body precursor at 418 andPatent ApplicationAttorney Docket No. IS24.1276-WOpositioning an infiltrant or catalyst source on the diamond precursor opposite the body precursor at 420. The method 416 further includes migrating the infiltrant or catalyst into the diamond precursor at 422. In some embodiments, the method 416 further includes sintering the diamond precursor on the body precursor at 424. In some embodiments, the method 416 optionally includes removing at least a portion of a longitudinal end of the as-sintered cutting element to form an apexed cutting element at 426. In some embodiments, the method 416 further includes leaching or removing at least a portion of the infiltrant and / or catalyst. In some embodiments, the leaching includes leaching the infiltrant and / or catalyst at least one millimeter (1 mm) deep from the working surface of the cutting element. For example, the leaching may include removing infiltrant and / or catalyst at least 1 mm deep from the as-sintered surface before removing at least a portion of the longitudinal end of the as-sintered cutting element. In some examples, the leaching may include removing infiltrant and / or catalyst at least 1 mm deep from the as-sintered surface after removing at least a portion of the longitudinal end of the as-sintered cutting element.

[0032] In some embodiments, removing at least a portion of the longitudinal end of the as-sintered cutting element includes laser cutting or ablating the as-sintered cutting element. In some embodiments, removing at least a portion of the longitudinal end of the as-sintered cutting element includes grinding the as-sintered cutting element. In some embodiments, removing at least a portion of the longitudinal end of the as-sintered cutting element includes lapping the as-sintered cutting element.

[0033] Removing at least a portion of the longitudinal end of the as-sintered cutting element may form an apex in the working surface. In some embodiments, the migration of infiltrant and / or catalyst into the diamond of the PCD table creates a gradient in infiltrant and / or catalyst in the PCD table. In some embodiments, removing at least a portion of the longitudinal end of the as-sintered cutting element may form an apex with a greater concentration of infiltrant and / or catalyst than the other portions of the working surface. In a 3D cutting element, the greater concentration of infiltrant and / or catalyst at the apex may provide an increase in operational lifetime of the cutting element, as the apex is leading point of contact of the cutting element with the material being cut.Patent ApplicationAttorney Docket No. IS24.1276-WO

[0034] In some embodiments, migrating the infiltrant and / or catalyst into the diamond precursor and sintering the diamond precursor on the body precursor to form an as-sintered cutting element includes sintering in a high-pressure, high-temperature (HPHT) press. In some embodiments, the method 416 includes migrating the infiltrant and / or catalyst into the diamond precursor and sintering the diamond precursor on the body precursor in a HPHT press in a single (e.g., simultaneous) sintering. In some embodiments, the method 416 includes migrating the infiltrant and / or catalyst into the diamond precursor in a HPHT press at a first temperature and pressure and sintering the diamond precursor on the body precursor in the HPHT press at a second temperature and pressure.

[0035] In some embodiments, positioning a diamond precursor on a body precursor includes positioning a transition layer in contact with the diamond precursor and the body precursor, where the transition layer includes both diamond precursor and body precursor as described herein in relation to FIG. 3.

[0036] FIG. 5 is a side cross-sectional view of an embodiment of a powder (or other precursors) positioned in a sintering can prior to sintering in an HPHT press. For clarity of illustration, the sintering can is not included. The arrangement of precursors prior to sintering includes, in some embodiments, a diamond precursor 528 between a body precursor 530 and an infiltrant and / or catalyst source 532. In some embodiments, such as illustrated in FIG. 6, the arrangement of precursors includes a diamond precursor 628 between a body precursor 630 and an infiltrant and / or catalyst source 632. In some embodiments, the infiltrant and / or catalyst source 632 is positioned opposite the body precursor 630 and circumferentially around at least a portion of the diamond precursor 638 to migrate into the diamond precursor 628 from the lateral surfaces of the diamond precursor 628. In some embodiments, the arrangement of precursors further includes a support powder 634 circumferentially around the body precursor 630 to support the body precursor 630 in the can.

[0037] FIG. 7 is a side cross-sectional view of an embodiment of an apexed cutting element 700 according to the present disclosure. In some embodiments, the apexed cutting element 700 includes a PCD table 706 bonded to a body 702 at an interfacePatent ApplicationAttorney Docket No. IS24.1276-WO712. In some embodiments, the interface 712 includes a transition zone (such as the transition zone 314 described in relation to FIG. 3). In some embodiments, the interface 712 does not include a transition zone. In some embodiments, the PCD table 706 is a thick PCD table 706 with a PCD height 708 no less than 40% of a cutting element height 710. In some embodiments, the PCD table 706 is a thick PCD table 706 with a PCD height 708 no less than 50% of a cutting element height 710. In some embodiments, the PCD height 708 is no less than 60% of the cutting element height 710. In some embodiments, the PCD height 708 is no less than 70% of the cutting element height 710.

[0038] In some embodiments, the PCD table 706 has an apex 736 of the working surface 704 that has a greater concentration of infiltrant and / or catalyst than other portions of the working surface 704. In some embodiments, the apex 736 has the greatest concentration of infiltrant and / or catalyst of the working surface 704.

[0039] FIG. 8 is a side view of an embodiment of a drill bit 838 including one or more cutting elements 800 according to the present disclosure. The drill bit 838 includes a bit body 840 with a plurality of blades 842 protruding therefrom. At least one blade 842 includes a one or more cutting elements 800 affixed thereto. It should be understood that while the illustrated embodiment of a drill bit 838 of FIG. 8 includes shear cutting elements with a planar working surface, any cutting element described herein may be affixed to a blade of a drill bit of the present disclosure. For example, one or more cutting elements 800 of the drill bit 838 may be an apexed cutting element as described herein. In some examples, one or more cutting elements 800 may have a concentration gradient of an infiltrant and / or catalyst in a PCD table thereof, as described herein. Further, while the illustrated embodiment of a drill bit 838 of FIG. 8 includes a plurality of blades 842, it should be understood that some embodiments of a drill bit 838 may include one or more roller cones in addition to a blade 842 protruding from the bit body 840. Any embodiment of a cutting element described herein may be used in other downhole tools other than a drill bit, such as a reamer, a rotary steering system, or components of a bottomhole assembly and / or drilling system.Patent ApplicationAttorney Docket No. IS24.1276-WO

[0040] The present disclosure generally relates to devices and methods of manufacturing said devices for improved cutting element performance in a drill bit and other downhole tools according to any of the clauses below:

[0041] Clause 1. A cutting element, comprising: a polycrystalline diamond (PCD) table including an apexed working surface; and a body including a non-diamond body material bonded to the PCD table, wherein a PCD height of the PCD table is no less than 40% of a cutting element height including the PCD table and body.

[0042] Clause 2. The cutting element of clause 1, wherein the body includes tungsten carbide.

[0043] Clause 3. The cutting element of clause 1, wherein the PCD table includes a gradient in infiltrant and / or catalyst concentration within the PCD table.

[0044] Clause 4. The cutting element of clause 3, wherein an apex of the apexed working surface has a greater concentration of an infiltrant and / or a catalyst than at least another portion of the apexed working surface.

[0045] Clause 5. The cutting element of clause 1, further comprising a transition zone bonding the body material to a diamond of the PCD table, wherein the transition zone includes no more than 10% body material by volume.

[0046] Clause 6. The cutting element of clause 5, wherein the transition zone consists of diamond material of the PCD table and body material where the body material is no more than 10% of the transition zone by volume.

[0047] Clause 7. The cutting element of clause 1 , wherein the PCD table is leached to at least one millimeter (mm) deep from the working surface.

[0048] Clause 8. A method of manufacturing a cutting element, the method comprising: positioning a diamond precursor on a body precursor; positioning an infiltrant source and / or catalyst source on the diamond precursor longitudinally opposite to the body precursor; migrating an infiltrant and / or catalyst into the diamond precursor; and sintering the diamond precursor into a polycrystalline diamond (PCD) table bonded to a body sintered from the body precursor.Patent ApplicationAttorney Docket No. IS24.1276-WO

[0049] Clause 9. The method of clause 8, wherein migrating the infiltrant and / or catalyst into the diamond precursor occurs at a first temperature and pressure and sintering the diamond precursor into a PCD table bonded to a body sintered from the body precursor occurs at a second temperature and pressure.

[0050] Clause 10. The method of clause 8, further comprising removing a portion of the PCD table to produce a gradient in infiltrant and / or catalyst concentration within the PCD table.

[0051] Clause 11. The method of clause 8, further comprising positioning a transition zone between the diamond precursor and the body precursor that includes both the diamond precursor and the body precursor, wherein the transition zone includes no more than 10% body precursor by volume.

[0052] Clause 12. The method of clause 11 , wherein the transition zone includes a homogeneous mixture of diamond precursor and body precursor.

[0053] Clause 13. The method of clause 8, further comprising leaching at least a portion of the PCD table to remove at least a portion of the infiltrant and / or catalyst.

[0054] Clause 14. The method of clause 13, wherein the leaching includes leaching infiltrant and / or catalyst at least 1 mm from a working surface.

[0055] Clause 15. A drill bit comprising: a bit body having a blade thereon; and a cutting element of any of clauses 1 through 7 affixed to the blade.

[0056] The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be understood that references to “one embodiment” or “an embodiment” of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. For example, any element described in relation to an embodiment herein may be combinable with any element of any other embodiment described herein. Numbers, percentages, ratios, or other values stated herein are intended to include that value, and also other values that are “about” or “approximately” the stated value, as would be appreciated by one of ordinary skill in the art encompassed byPatent ApplicationAttorney Docket No. IS24.1276-WOembodiments of the present disclosure. A stated value should therefore be interpreted broadly enough to encompass values that are at least close enough to the stated value to perform a desired function or achieve a desired result. The stated values include at least the variation to be expected in a suitable manufacturing or production process, and may include values that are within 5%, within 1%, within 0.1%, or within 0.01% of a stated value.

[0057] A person having ordinary skill in the art should realize in view of the present disclosure that equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made to embodiments disclosed herein without departing from the spirit and scope of the present disclosure. Equivalent constructions, including functional “means-plus-function” clauses are intended to cover the structures described herein as performing the recited function, including both structural equivalents that operate in the same manner, and equivalent structures that provide the same function. It is the express intention of the applicant not to invoke means-plus-function or other functional claiming for any claim except for those in which the words ‘means for’ appear together with an associated function. Each addition, deletion, and modification to the embodiments that falls within the meaning and scope of the claims is to be embraced by the claims.

[0058] It should be understood that any directions or reference frames in the preceding description are merely relative directions or movements. For example, any references to “front” and “back” or “top” and “bottom” or “left” and “right” are merely descriptive of the relative position or movement of the related elements.

[0059] The present disclosure may be embodied in other specific forms without departing from its spirit or characteristics. The described embodiments are to be considered as illustrative and not restrictive. The scope of the disclosure is, therefore, indicated by the appended claims rather than by the foregoing description. Changes that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

Patent ApplicationAttorney Docket No. IS24.1276-WOCLAIMSWhat is claimed is:

1. A cutting element, comprising:a polycrystalline diamond (PCD) table (706) including an apexed working surface (736); anda body (702) including a non-diamond body material bonded to the PCD table, wherein a PCD height (708) of the PCD table is no less than 40% of a cutting element height (710) including the PCD table and body.

2. The cutting element of claim 1 , wherein the body includes tungsten carbide.

3. The cutting element of claim 1, wherein the PCD table includes a gradient in infiltrant and / or catalyst concentration within the PCD table.

4. The cutting element of claim 3, wherein an apex of the apexed working surface has a greater concentration of an infiltrant and / or a catalyst than at least another portion of the apexed working surface.

5. The cutting elementof any preceding claim, further comprising a transition zone bonding the body material to a diamond of the PCD table, wherein the transition zone includes no more than 10% body material by volume.

6. The cutting element of claim 5, wherein the transition zone consists of diamond material of the PCD table and body material where the body material is no more than 10% of the transition zone by volume.

7. The cutting element of any preceding claim, wherein the PCD table is leached to at least one millimeter (mm) deep from the working surface.

8. A method of manufacturing a cutting element, the method comprising:Patent ApplicationAttorney Docket No. IS24.1276-WOpositioning (418) a diamond precursor on a body precursor;positioning (420) an infiltrant source and / or catalyst source on the diamond precursor longitudinally opposite to the body precursor;migrating (422) an infiltrant and / or catalyst into the diamond precursor; and sintering (424) the diamond precursor into a polycrystalline diamond (PCD) table bonded to a body sintered from the body precursor.

9. The method of claim 8, wherein migrating the infiltrant and / or catalyst into the diamond precursor occurs at a first temperature and pressure and sintering the diamond precursor into a PCD table bonded to a body sintered from the body precursor occurs at a second temperature and pressure.

10. The method of claim 8 or 9, further comprising removing a portion of the PCD table to produce a gradient in infiltrant and / or catalyst concentration within the PCD table.

11. The method of any of claims 8 through 10, further comprising positioning a transition zone between the diamond precursor and the body precursor that includes both the diamond precursor and the body precursor, wherein the transition zone includes no more than 10% body precursor by volume.

12. The method of claim 11 , wherein the transition zone includes a homogeneous mixture of diamond precursor and body precursor.

13. The method of any of claims 8-12, further comprising leaching at least a portion of the PCD table to remove at least a portion of the infiltrant and / or catalyst.

14. The method of claim 13, wherein the leaching includes leaching infiltrant and / or catalyst at least 1 mm from a working surface.Patent ApplicationAttorney Docket No. IS24.1276-WO15. A drill bit comprising:a bit body (838) having a blade (840) thereon; anda cutting element (800) of any of claims 1 through 7 affixed to the blade.

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