A heating apparatus and a heating control system therefor

Abstract

The present invention discloses a heating apparatus, comprising a first compartment configured to hold liquid to be heated, with channels for directing liquid in and out. The heating apparatus further includes a second compartment housing a computing unit that generates waste heat. The heating apparatus may comprise a heating source within the first compartment and heat transfer facilitation elements between the computing unit and the first compartment. The computing unit can be a bitcoin miner, cryptocurrency miner, server-grade CPU, TPU, or AI-related unit, and is capable of network communication. The heating apparatus further comprises a heating control system that monitors and adjusts the heating process based on liquid temperature, with modes for liquid use and standby. The heating apparatus provides efficient liquid heating while simultaneously offering the added functionality and utility of performing computational tasks.

Description

A HEATING APPARATUS AND A HEATING CONTROL SYSTEM THEREFORREFERENCE TO RELATED APPLICATIONS

[0001] This application claims the priority to SINGAPORE PATENT APPLICATION NO. 10202500255V, filed on 27 January 2025, the contents of which are incorporated herein by reference.TECHNICAL FIELD

[0002] The present disclosure generally relates to the field of liquid heating and, more specifically, to heating apparatuses that utilize computing-generated heat as a heating source.BACKGROUND

[0003] The following discussion of the background to the invention is intended to facilitate an understanding of the present invention only. It should be appreciated that the discussion is not an acknowledgement or admission that any of the material referred to was published, known or part of the common general knowledge of the person skilled in the art in any jurisdiction as at the priority date of the invention.

[0004] In recent years, the demand for more energy-efficient domestic water heaters has grown due to rising energy costs and heightened environmental concerns. However, conventional water heaters remain largely dependent on traditional heating elements, which operate without considering alternative heat sources like computing waste heat. This singular reliance not only results in higher energy consumption but also fails to address the inefficiencies inherent in the current approach.

[0005] Present solutions often overlook the potential to integrate secondary heat sources, such as the waste heat generated by computing units, leaving this energy resource untapped. Instead, computing waste heat is typically dissipated into the environment, contributing to unnecessary energy loss and thermal pollution. The failure to leverage this readily available heat results in water heaters that are less efficient and more costly to operate, while also exacerbating their environmental impact. As energy demands continue to grow, the limitations of these conventional systems highlight the need for more innovative approaches to domestic water heating.

[0006] There exists a need to develop a more efficient liquid heating apparatus that utilizes computing-generated heat as a heating source, addressing at least one of the problems associated with conventional systems.SUMMARY

[0007] Specifically, to address the above-mentioned technical problems, the present invention specifically uses the following technical solutions:

[0008] Accordingly, an aspect of the present invention refers to a heating apparatus comprising a first compartment configured to hold liquid to be heated and a second compartment configured to house a computing unit operable to perform a computing task and generate computing waste heat, wherein the second compartment is configured to transfer the computing waste heat to the first compartment. The first compartment comprises a first liquid channel configured to direct liquid from outside the first compartment into the first compartment and a second liquid channel configured to direct liquid out of the first compartment. The first liquid channel comprises a first inlet configured to receive the liquid from outside the first compartment and a first outlet configured to release the liquid into the first compartment, and the second liquid channel comprises a second inlet configured to receive the liquid from the first compartment and a second outlet configured to direct the liquid out of the first compartment.

[0009] In some embodiments, the second compartment comprises a first heat transfer facilitation element configured to transfer the computing waste heat from the computing unit to the first compartment.

[0010] In some embodiments, the first heat transfer facilitation element is positioned within the first compartment through a compartment opening.

[0011] In some embodiments, the compartment opening is a pre-existing functional opening of the first compartment or a dedicated opening configured to receive the first heat transfer facilitation element.

[0012] In some embodiments, the pre-existing functional opening is the first liquid channel, the second liquid channel, an anti-corrosion rod insertion opening, or a preexisting heating source opening.

[0013] In some embodiments, the first heat transfer facilitation element comprises a heat transfer circuit operable to transfer computing waste heat from the second compartment into the first compartment, the heat transfer circuit comprising a fluid exiting segment and a fluid returning segment, wherein the fluid exiting segment directs a heat transfer fluid out of the second compartment and the fluid returning segment directs the heat transfer fluid back into the second compartment.

[0014] In some embodiments, the fluid exiting segment and the fluid returning segment are integrally connected such that the heat transfer fluid circulates between the heat transfer circuit and the second compartment.

[0015] In some embodiments, the fluid exiting segment is configured in a spiral, curved, or zig-zag shape to increase surface area for heat exchange with liquid inside the first compartment.

[0016] In some embodiments, the fluid returning segment is configured in a linear or linear-like shape to facilitate efficient return of the heat transfer fluid into the second compartment.

[0017] In some embodiments, the fluid returning segment is positioned in a hollow core formed by the fluid exiting segment configured in a spiral shape.

[0018] In some embodiments, the fluid exiting segment comprises a fluid outlet configured to transfer the heat transfer fluid from the second compartment into the first compartment and a fluid inlet configured to transfer the heat transfer fluid from the first compartment back into the second compartment, wherein the heat transfer fluid is the same as the liquid to be heated inside the first compartment.

[0019] In some embodiments, the fluid outlet and the fluid inlet are positioned apart within the first compartment such that the heat transfer fluid exiting from the fluid outlet is diffused across the first compartment before being directed back into the fluid inlet.

[0020] In some embodiments, the second compartment further comprises a fluid pump configured to regulate flow of the heat transfer fluid inside the heat transfer circuit.

[0021] In some embodiments, the first heat transfer facilitation element is configured as an anti-corrosion rod inserted into the first compartment through the anti-corrosion rod insertion opening.

[0022] In some embodiments, the anti-corrosion rod is a sacrificial anode rod.

[0023] In some embodiments, the heating apparatus further comprises a first heating source positioned inside the first compartment.

[0024] In some embodiments, the first heating source is positioned in proximity to the second inlet.

[0025] In some embodiments, the first heating source is an electrical heating element.

[0026] In some embodiments, the electrical heating element is a heating coil, a heating plate, a heating rod, or a heating pad.

[0027] In some embodiments, the first heat transfer facilitation element comprises a heat dissipation unit configured to transfer computing waste heat from the computing unit into the first compartment.

[0028] In some embodiments, the heat dissipation unit is formed of a thermally conductive material configured in a rod, pad, plate, or pipe shape.

[0029] In some embodiments, the first outlet is positioned in proximity to an attachment surface of the first compartment, and the second inlet is positioned distal to the attachment surface.

[0030] In some embodiments, the first heat transfer facilitation element is positioned between the computing unit and the attachment surface of the first compartment to facilitate heat transfer through the attachment surface.

[0031] In some embodiments, the first heat transfer facilitation element is a radiator, a vapour chamber, a graphene sheet, or one or more Peltier elements.

[0032] In some embodiments, the radiator is made of aluminium, copper, graphitebased composite, or ceramic-coated metal.

[0033] In some embodiments, the radiator comprises a liquid-containing layerconfigured to contain a heat-transfer liquid for facilitating heat transfer between the computing unit and the attachment surface.

[0034] In some embodiments, the heat-transfer liquid is water or mineral oil.

[0035] In some embodiments, the heating apparatus further comprises a second heat transfer facilitation element in thermal contact with the first heat transfer facilitation element and extending across the attachment surface into the first compartment.

[0036] In some embodiments, the second heat transfer facilitation element comprises a heat dissipation end positioned in proximity to the first outlet.

[0037] In some embodiments, the second heat transfer facilitation element comprises one or more of a rod, pad, plate, or pipe.

[0038] In some embodiments, the pipe houses a heat transfer fluid circulating between the first compartment and the second compartment.

[0039] In some embodiments, the liquid is water suitable for domestic use.

[0040] In some embodiments, the first compartment comprises a thermal protection coating on an exterior surface of the first compartment.

[0041] In some embodiments, the second compartment comprises a thermal protection coating on an exterior surface of the second compartment.

[0042] In some embodiments, the first compartment is positioned above the second compartment.

[0043] In some embodiments, the attachment surface is a bottom surface of the first compartment, and the first inlet and the second inlet are positioned on a top surface of the first compartment.

[0044] In some embodiments, the second compartment is positioned beside the first compartment.

[0045] In some embodiments, the computing unit comprises one or more of a cryptocurrency miner, a server-grade central processing unit, a simulation processor, or an artificial intelligence-related computing unit, wherein the artificial intelligence-relatedcomputing unit comprises one or more of a graphics processing unit, a tensor processing unit, an Al accelerator, or a neural processing unit.

[0046] In some embodiments, the computing unit is arranged to be in data communication with a network.

[0047] In some embodiments, the heating apparatus further comprises a heating control system configured to control a heating process of the heating apparatus, the heating control system comprising a temperature monitoring module and an operation control module.

[0048] In some embodiments, the temperature monitoring module detects and measures temperature of the liquid inside the first compartment and / or inside the second compartment, and the operation control module adjusts operation of the computing unit and / or the first heating source according to the detected temperature.

[0049] In some embodiments, when the temperature of the liquid at a first temperature zone within the first compartment drops below a first predetermined temperature threshold, the operation control module activates or enhances the heating process of the first heating source.

[0050] In some embodiments, the first temperature zone encompasses the second inlet.

[0051] In some embodiments, when the temperature of the liquid at a second temperature zone within the first compartment exceeds a second predetermined temperature threshold, the operation control module deactivates or reduces operation of the computing unit.

[0052] In some embodiments, the second temperature zone covers the attachment surface.

[0053] In some embodiments, when the temperature inside the second compartment exceeds a predetermined temperature threshold, the operation control module deactivates or reduces operation of the computing unit.

[0054] In some embodiments, the heating apparatus further comprises a mode switch module configured to transmit an instruction signal to the operation control module.

[0055] In some embodiments, when the mode switch module is switched to a liquid use mode, the operation control module activates the first heating source, and when the mode switch module is switched to a standby mode, the operation control module deactivates the first heating source.

[0056] In some embodiments, when the mode switch module is switched to the standby mode, the operation control module also regulates operation of the computing unit.

[0057] In some embodiments, the computing unit is configured to be removable from the second compartment.

[0058] Another aspect of the present invention refers to a detachable heating apparatus comprising a second compartment, a computing unit housed inside the second compartment, and a first heat transfer facilitation element. The computing unit is operable to perform a computing task and generate computing waste heat, and the first heat transfer facilitation element is configured to be detachably positioned inside a first compartment through a compartment opening, such that the computing waste heat generated by the computing unit is transferred from the second compartment into the first compartment.

[0059] In some embodiments, the first heat transfer facilitation element comprises a heat transfer circuit operable to transfer the computing waste heat from the second compartment into the first compartment, the heat transfer circuit comprising a fluid exiting segment and a fluid returning segment, wherein the fluid exiting segment is configured to direct a heat transfer fluid out of the second compartment, and the fluid returning segment is configured to direct the heat transfer fluid back into the second compartment.

[0060] In some embodiments, the fluid exiting segment and the fluid returning segment are integrally connected, such that the heat transfer fluid circulates between the heat transfer circuit and the second compartment.

[0061] In some embodiments, the fluid exiting segment is configured in a spiral, curved, or zig-zag shape to increase surface area for heat exchange between the fluid exiting segment and liquid inside the first compartment.

[0062] In some embodiments, the fluid returning segment is configured in a linear orlinear-like shape to facilitate efficient return of the heat transfer fluid back into the second compartment.

[0063] In some embodiments, the fluid returning segment is positioned within a hollow core formed by the fluid exiting segment configured in a spiral shape.

[0064] In some embodiments, the heat transfer fluid is water or mineral oil.

[0065] In some embodiments, the fluid exiting segment comprises a fluid outlet operable to transfer the heat transfer fluid from the second compartment into the first compartment, and a fluid inlet operable to transfer the heat transfer fluid from the first compartment back into the second compartment, wherein the heat transfer fluid is the same as the liquid to be heated inside the first compartment.

[0066] In some embodiments, the fluid outlet and the fluid inlet are positioned apart.

[0067] In some embodiments, the second compartment further comprises a fluid pump configured to regulate flow of the heat transfer fluid inside the heat transfer circuit.

[0068] In some embodiments, the first heat transfer facilitation element is configured as an anti-corrosion rod operable to be inserted into the first compartment through an anti-corrosion rod insertion opening.

[0069] In some embodiments, the anti-corrosion rod is a sacrificial anode rod.

[0070] In some embodiments, the first heat transfer facilitation element comprises a heat dissipation unit configured to transfer the computing waste heat from the computing unit into the first compartment.

[0071] In some embodiments, the heat dissipation unit is a thermally conductive material configured into a shape of a rod, pad, plate, or pipe.

[0072] In some embodiments, the second compartment comprises a thermal protection coating on an exterior surface of the second compartment.

[0073] In some embodiments, the computing unit comprises one or more of a cryptocurrency miner, a server-grade central processing unit, a simulation processor, or an artificial intelligence-related computing unit, wherein the artificial intelligence-related computing unit comprises one or more of a graphics processing unit, a tensor processingunit, an Al accelerator, or a neural processing unit.

[0074] In some embodiments, the computing unit is arranged to be in data communication with a network.

[0075] Other aspects and features of the present invention will become apparent to those of ordinary skill in the art upon review of the following description of specific embodiments of the invention in conjunction with the accompanying figures.BRIEF DESCRIPTION OF THE DRAWINGS

[0076] In the figures, which illustrate, by way of non-limiting examples only, embodiments of the present invention,

[0077] [Fig. 1]: illustrates a perspective view of a heating apparatus according to various embodiments of the present invention.

[0078] [Fig. 2]: illustrates another perspective view of a heating apparatus according to various embodiments of the present invention.

[0079] [Fig. 3]: illustrates an exploded view showing various components of a heating apparatus according to various embodiments of the present invention.

[0080] [Fig.4]: illustrates a front cross-sectional view of a heating apparatus according to various embodiments of the present invention.

[0081] [Fig. 5]: illustrates a perspective cross-sectional view of a heating apparatus according to various embodiments of the present invention.

[0082] [Fig. 6]: illustrates a bottom cross-sectional view of a heating apparatus according to various embodiments of the present invention.

[0083] [Fig. 7]: illustrates a perspective view of a heating apparatus according to various embodiments of the present invention.

[0084] [Fig. 8]: illustrates a front cross-sectional view of a heating apparatus according to various embodiments of the present invention.

[0085] [Fig. 9]: illustrates a front cross-sectional view of a heating apparatus according to various embodiments of the present invention.

[0086] [Fig. 10]: illustrates a perspective cross-sectional view of a heating apparatus according to various embodiments of the present invention.

[0087] [Fig. 11]: illustrates a bottom cross-sectional view of a heating apparatus according to various embodiments of the present invention.

[0088] [Fig. 12]: illustrates a heating apparatus according to various embodiments of the present invention.

[0089] [Fig. 13a]: illustrates a heating apparatus according to various embodiments of the present invention.

[0090] [Fig. 13b]: illustrates a heating apparatus according to various embodiments of the present invention.

[0091] [Fig. 13c]: illustrates a heating apparatus according to various embodiments of the present invention.

[0092] [Fig. 13d]: illustrates a heating apparatus according to various embodiments of the present invention.

[0093] [Fig. 13e]: illustrates a heating apparatus according to various embodiments of the present invention.

[0094] [Fig. 13f]: illustrates a heating apparatus according to various embodiments of the present invention.

[0095] [Fig. 14]: illustrates, in a block diagram, a heating control system according to various embodiments of the present invention.

[0096] DETAILED DESCRIPTION

[0097] Throughout this document, unless otherwise indicated to the contrary, the terms “comprising”, “consisting of”, “having” and the like, are to be construed as non-exhaustive, or in other words, as meaning “including, but not limited to”.

[0098] Furthermore, throughout the document, unless the context requires otherwise, the word “include” or variations such as “includes” or “including” will be understood to imply the inclusion of a stated integer or group of integers but not the exclusion of any other integer or group of integers.

[0099] Unless defined otherwise, all other technical and scientific terms used herein have the same meaning as is commonly understood by a skilled person to which the subject matter herein belongs.

[0100] EMBODIMENT 1:

[0101] Referring to Figures 1 to 6, the present invention provides a heating apparatus (100B), which includes a first compartment (101) configured to contain liquid to be heated and a second compartment (103) configured to house a computing unit (107). The second compartment (103) is connected to the first compartment (101) at an attachment surface (102). The heat generated by the computing unit (107) during computation tasks (such as bitcoin mining, crypto mining, artificial intelligence computing) can be used to heat the liquid within the first compartment (101 ).

[0102] The first compartment (101) is provided with a first liquid channel (109) for introducing liquid (e.g., ambient-temperature liquid, such as water for domestic use) from outside the first compartment (101) into the first compartment (101) and a second liquid channel (111) for discharging liquid (e.g., heated liquid, such as hot water) from the first compartment (101 ). The first liquid channel (109) comprises a first inlet (117) for receiving liquid from outside the first compartment (101) and a first outlet (119) for releasing liquid into the first compartment (101 ).

[0103] The first outlet (119) is positioned within the first compartment (101), proximate to the attachment surface (102) or the second compartment (103), allowing the low-temperature liquid entering the first compartment (101 ) to absorb heat dissipated from the second compartment (103) and become heated efficiently.

[0104] In some embodiments, the first inlet (117) is located on the upper surface of the first compartment (101) and may extend outward. The second liquid channel (111) comprises a second inlet (123) for receiving liquid from the first compartment (101) and a second outlet (121) for discharging liquid from the second liquid channel (111). Thesecond inlet (123) is positioned adjacent to a first heating source (115) within the first compartment (101), enabling the liquid exiting the first compartment (101) to be heated to the desired temperature as needed (e.g., when large amount of the hot water is being used for extensive dish washing or showering). In some embodiments, the second outlet (121) is located on the upper surface of the first compartment (101) and may extend outward.

[0105] In some embodiments, the first heating source (115) is an electric heating element, such as a heating coil, heating plate, heating rod, or heating pad.

[0106] To enhance heat exchange efficiency, the second compartment (103) is located above the first compartment (101) and comprises a first heat transfer facilitation element (105) positioned between the computing unit (107) and the attachment surface (102). The first heat transfer facilitation element (105) is fixed to the attachment surface (102), which, in some embodiments, is a bottom surface of the first compartment (101). In other embodiments, the attachment surface (102) is formed on a side wall surface of the first compartment (101). The computing unit (107) is fixedly mounted or detachably received within the second compartment (103).

[0107] In some embodiments, the attachment surface (102) features an opening to allow direct contact between the first heat transfer facilitation element (105) and the liquid within the first compartment (101). This enables heat exchange but requires sealing between the attachment surface and the first heat transfer facilitation element (105). Alternatively, the attachment surface (102) may fully separate the first and second compartments, with the first heat transfer facilitation element (105) mounted on the side of the attachment surface facing the second compartment (103). In such embodiments, the attachment surface (102) is made of a thermally conductive material.

[0108] In some embodiments, the first heat transfer facilitation element (105) is a radiator, vapor chamber, graphene sheet, or one or more Peltier elements. The radiator can be made of aluminum, copper, graphite-based composites, or ceramic-coated metal. In further embodiments, the radiator includes a liquid-containing layer configured to hold a heat transfer liquid (e.g., water or mineral oil) for facilitating heat transfer between the computing unit (107) and the attachment surface (102).

[0109] In some embodiments, the second compartment (103) is configured to be positioned beside the first compartment (101), as illustrated in Fig. 12. In this configuration, a second heat transfer facilitation element (125), configured as a spiralshaped heat transfer pipe, extends into the first compartment (101) to transfer heat generated by the computing unit (107) housed in the second compartment (103) into the liquid contained in the first compartment (101). As shown in Fig. 12, the first outlet (119), instead of being positioned in proximity to the attachment surface (102) as illustrated in Figs. 8-11 , is positioned within a region enclosed by the spiral shape of the heat transfer pipe (125), such that liquid entering the first compartment (101) through the first outlet (119) is subjected to heat exchange with the spiral-shaped heat transfer pipe (125). In addition, a first heating source (115) is positioned within the spiral-shaped region formed by the heat transfer pipe (125), such that, when heat dissipated from the heat transfer pipe (125) is insufficient, for example, during high-demand liquid usage such as showering, the first heating source (115) is activatable to further heat the liquid entering the first compartment (101 ) through the first outlet (119).

[0110] In some embodiments, the computing unit (107) includes components such as a bitcoin miner, a cryptocurrency miner, server-grade CPU, simulation processor, or an artificial intelligence-related computing unit. In some embodiments, the artificial intelligence-related computing unit comprises one or more of: a graphics processing unit (GPU), a tensor processing unit (TPU), an Al accelerator and a neural processing unit (NPU).

[0111] The computing unit (107) is configured for data communication with a network. In some embodiments, the computing unit (107) is connected to a network using wired cables. In some embodiments, the computing unit (107) includes a wireless communication module with a wireless communication chip and antenna. This ensures stable connectivity for computational tasks like Bitcoin mining and Al computation.

[0112] In some embodiments, the computing unit (107) is configured to perform bitcoin mining and other computational tasks, both of which rely on consistent data transmission to achieve efficient and uninterrupted operation, at least in some application scenarios. Although the volume of data transmitted may not be substantial, maintaining a stable and reliable connection is crucial to ensure uninterrupted performance. To achieve this, the wireless communication module within the computing unit (107) is equipped with both awireless communication chip and an antenna. These components work together to facilitate communication with external networks. Additionally, to extend the effective communication range, a wireless communication range extension device may be incorporated. Such as wireless communication range extension device can be integrated with the heating apparatus itself, positioned at an existing Internet or Wi-Fi access point (e.g., a router), or placed independently between the access point / router and the heating apparatus. This ensures that the computing unit (107) remains within the extended communication range, allowing for stable connectivity regardless of the placement of the heating apparatus.

[0113] The system may also include additional wireless communication devices, such as EDGE, 2G, 3G, 4G, 5G, or future iterations, to maintain functionality in scenarios without internet access. To address connection interruptions, the system can notify users via mobile apps, push notifications, or other communication means. When a connection issue is detected, the operation control module (502) may reduce heating functionality by instructing the computing unit (107) to halt computation tasks.

[0114] In the event of a data connection disruption, the system is designed to notify the user promptly through various channels. Notifications can be delivered via mobile applications, push alerts, SMS messages, chat applications, device indicators, or standalone notification devices. These alerts inform the user of the connectivity issue, prompting them to take timely action to restore the connection and resume normal operation.

[0115] Moreover, if a data connection issue is detected, the heating control system is programmed to adjust its functionality to mitigate potential inefficiencies. For example, the operation control module (502) may issue a control signal to the computing unit (107), instructing it to suspend its computing tasks temporarily. This ensures that the heating control system prioritizes maintaining efficient operations while reducing the strain on the heating apparatus during periods of network instability.

[0116] To ensure reliable data communication in the heating apparatus that utilizes a computing unit as a heating source, various advanced methods can be implemented to enhance connectivity and maintain efficient operation. These methods are particularly critical in systems where uninterrupted data transfer directly supports both computational tasks and the heat generated by the computing unit.

[0117] One effective approach is adaptive frequency hopping, where the wireless communication module in the computing unit dynamically scans and switches between frequencies to avoid interference. By identifying less congested channels in real time, the system ensures stable data transmission, which is essential for continuous computational operations and efficient heat generation.

[0118] Signal amplification can be employed to adaptively boost signal strength based on the distance between devices and surrounding environmental conditions. This ensures that the computing unit maintains robust connectivity, even when the heating apparatus is located far from the network access point or in challenging environments.

[0119] Using multi-antenna beamforming, the system leverages multiple antennas to focus the wireless signal directly toward the target device, such as a router or range extender. By minimizing signal dispersion and interference, this technique ensures that the computing unit remains reliably connected, enabling uninterrupted computational activity.

[0120] To address potential data errors during transmission, error correction algorithms like forward error correction (FEC) can be integrated into the computing unit’s communication protocol. These algorithms detect and rectify errors in real time, preserving the integrity of data essential for computational tasks.

[0121] In addition, proactive buffering is utilized to mitigate the effects of brief connectivity interruptions. By temporarily storing data, the computing unit ensures continuous operation, preventing computational delays or disruptions in heat generation that could impact the performance of the heating apparatus.

[0122] Dynamic power control is another key feature, allowing the computing unit to adjust its wireless transmission power based on the quality of the connection. Lower power is used for nearby connections to conserve energy, while higher power is employed for distant or weaker connections, ensuring that the computing unit remains operational without compromising energy efficiency.

[0123] Dual-band communication enables the computing unit to transmit data simultaneously over two frequency bands, such as 2.4 GHz and 5 GHz. This redundancyensures that computational tasks continue seamlessly, even if one band experiences interference, thus maintaining consistent heat generation.

[0124] In scenarios where direct communication between the computing unit and the network is obstructed, peer-assisted relaying allows nearby devices to act as relay points, extending the range and reliability of the connection. This ensures that the computing unit remains functional, even in complex or obstructed environments.

[0125] To further enhance bandwidth and redundancy, real-time channel bonding combines multiple communication channels into a single high-capacity data path. This allows for increased data transfer speeds and ensures that computational tasks remain uninterrupted, even if one channel degrades.

[0126] Intelligent packet scheduling prioritizes data packets based on their importance and latency requirements. For example, time-sensitive computations necessary for heating optimization can be prioritized over less critical tasks, ensuring the apparatus operates efficiently.

[0127] Additionally, interference cancellation leverages advanced signal processing to identify and neutralize external interference. This maintains clear and stable communication between the computing unit and the network, supporting uninterrupted computational and heating functions.

[0128] Lastly, self-healing network protocols are implemented to automatically detect and recover from connection failures. These protocols enable the computing unit to reestablish the network connection or reroute data via alternative paths without user intervention, ensuring continuous operation of the heating apparatus.

[0129] EMBODIMENT 2:

[0130] Referring to Figures 7 to 11, the present invention also provides another heating apparatus (100C), which includes the components described in Embodiment 1. The difference is that the heating apparatus (100C) in this embodiment further includes: a second heat transfer facilitation element (125), configured to be in thermal contact with the first heat transfer facilitation element (105) and extend across the attachment surface (102) into the first compartment (101) (e.g., the first heat transfer facilitation element (105) penetrates the bottom of the first compartment (101)). This arrangement enhances thetransfer of heat from the computing unit (107) to the liquid within the first compartment (101), enabling more effective cooling of the computing unit (107) and more efficient heating of the liquid in the first compartment (101) simultaneously.

[0131] Specifically, the second heat transfer facilitation element (125) comprises a heat dissipation end (127), configured to be positioned near the first outlet (119).

[0132] In some embodiments, the second heat transfer facilitation element (125) is configured to comprise one or more of the following forms: rod, pad, plate, pad, and pipe.

[0133] In some embodiments, if the second heat transfer facilitation element (125) is a pipe, the pipe is configured to hold a heat transfer liquid (e.g., water, mineral oil or any other liquid or fluid suitable for efficient heat transfer), which circulates between the first compartment (101) and the second compartment (103) through the pipe.

[0134] In some embodiments, to prevent unnecessary heat loss from the heating apparatus to the ambient environment, the external surface of the first compartment (101) is provided with a thermal protection coating (113).

[0135] In some embodiments, to prevent heat loss, the external surface of the second compartment (103) is also provided with a thermal protection coating (113).

[0136] Referring to Figures 9 to 11 , in other embodiments, if the attachment surface (102) comprises an opening and the first heat transfer facilitation element (105) is installed in the opening such that the first heat transfer facilitation element (105) directly contacts the liquid to be heated inside the first compartment (101), the heat dissipation end (127) can be directly installed on the first heat transfer facilitation element (105) to enhance efficiency.

[0137] EMBODIMENT S:

[0138] Referring to Fig. 14, the heating apparatus in this embodiment, in addition to the components described in the previous embodiments, further comprises a heating control system (500) for controlling the heating process. The heating control system (500) comprises the following components:

[0139] The temperature monitoring module (501) detects and measures the temperature of the liquid within the first compartment (101) and / or the secondcompartment (103). In some embodiments, the temperature monitoring module (501) comprises temperature sensors. Specifically, at least two temperature sensors may be installed within the first compartment (101) to monitor the first temperature zone and the second temperature zone, respectively.

[0140] The operation control module (502) adjusts the operation of the computing unit (107) and / or the first heating source (115) based on the liquid temperature measured by the temperature monitoring module (501). The adjustments may include activating the computing unit (107), executing intensive or periodic computation tasks, stopping the operation of the computing unit (107), or turning the first heating source (115) on or off.

[0141] In some embodiments, when the temperature monitoring module (501 ) detects that the liquid temperature in the first temperature zone within the first compartment (101 ) is below a first predetermined temperature threshold, the operation control module (502) initiates or enhances the heating process of the first heating source (115). Enhancing the heating process refers to increasing the heating power of the first heating source (115). The first temperature zone is defined as the area surrounding the second inlet (123).

[0142] In other embodiments, when the temperature monitoring module (501 ) detects that the liquid temperature in the second temperature zone within the first compartment (101) exceeds a second predetermined temperature threshold, the operation control module (502) stops or reduces the operation of the computing unit (107). For example, this may involve reducing operation time or switching to periodic operation. The second temperature zone may be defined as the area surrounding the first outlet (119), the area around the attachment surface (102), or the area surrounding the heat dissipation end (127).

[0143] In some embodiments, at least one temperature sensor is installed within the second compartment (103). If the operation control module (502) determines from this sensor’s temperature data that the temperature inside the second compartment (103) exceeds a second or third predetermined temperature threshold, it stops or reduces the operation of the computing unit (107).

[0144] The heating control system further comprises a mode switching module (503) that transmits instruction signals to the operation control module (502). When the mode switching module (503) is set to a "use mode," the operation control module (502)activates the first heating source (115) to begin operation (e.g., perform computation tasks). When the mode switching module (503) is set to a "standby mode," the operation control module (502) stops the operation of the first heating source (115). In some embodiments, when the mode switching module (503) is set to standby mode, the operation control module (502) also adjusts the operation of the computing unit (107).

[0145] In this embodiment, the heating apparatus operates in two modes: standby mode and use mode. Standby mode is used when the user does not require heated liquid, whereas use mode is for scenarios where the user needs heated liquid, such as for washing their face or bathing. When user activity is detected (e.g., opening the valve connected to the second liquid channel (111)), the mode switching module (503) automatically changes the mode.

[0146] The heating apparatus in this embodiment supports dual heating modes. The computing unit (107) serves as one heating source, while the first heating source (115) serves as another. These two heating sources are positioned at different heights within the first compartment (101), dividing it into upper and lower heating zones. The computing unit (107) heats the lower zone (liquid with lower temperature, higher density), and the first heating source (115) heats the upper zone (liquid with higher temperature, lower density). In other embodiments, the first compartment (101 ) may be oriented horizontally, with the second compartment (103) positioned adjacent to one side of the first compartment (101). The second compartment (103) can be arranged relative to the first compartment (101 ) in various configurations, provided the waste heat from the computing unit (107) is directed to a low-temperature zone within the first compartment (101) (e.g., the bottom region of the first compartment (101)). In this zone, the first liquid channel (109) directs lower-temperature liquid. Meanwhile, the first heating source (115) can be positioned in the high-temperature zone (e.g., the top region of the first compartment (101)), where the second liquid channel (111) facilitates the discharge of heated liquid from the first compartment (101 ).

[0147] For example, in the case of a horizontally oriented first compartment (101), such as a cylindrical water tank, the first liquid channel (109) can be configured to enter through the bottom surface, where denser cold water naturally accumulates. This ensures that cold water is directed to the bottom region of the first compartment (101), where the second compartment (103), housing the computing unit (107), is located, positionednearby, or equipped with a heat exchange unit to transfer heat to this region. Similarly, the second liquid channel (111) can be configured to exit from the top region, enabling the efficient discharge of less dense hot water, which naturally rises.

[0148] In standby mode or use mode with low liquid demand (e.g., washing hands or face), only the computing unit (107) is used for heating, referred to as the "economic mode." In use mode with high liquid demand, where low-temperature liquid continuously enters through the first liquid channel (109) and heated liquid exits through the second liquid channel (111), the first heating source (115) is activated for rapid heating, referred to as the "enhanced mode". In some cases, only the first heating source (115) is used for heating during high demand. Alternatively, both the first heating source (115) and the computing unit (107) can operate simultaneously. In some embodiments, the heating power of the computing unit (107) is significantly lower than that of the first heating source (115), such as 400W for the computing unit (107) and 2000W for the first heating source (115).

[0149] In standby mode, the operation control module (502) sends instructions to the computing unit (107) to activate and execute computation tasks, using the generated heat to warm the liquid within the first compartment (101 ). The temperature monitoring module (501) continuously or periodically monitors the liquid temperature in the second temperature zone. If the temperature exceeds a second predetermined threshold, the operation control module (502) reduces or stops the operation of the computing unit (107).

[0150] In use mode with low liquid demand, the computing unit (107) maintains the liquid at the desired temperature, eliminating the need to activate the first heating source (115), thereby conserving energy. For high liquid demand such as extensive dish washing and bathing, when the computing unit (107) alone cannot maintain the desired liquid temperature due to the continuous flow of low-temperature liquid into the first compartment (101), the operation control module (502) activates the first heating source (115) for rapid heating.

[0151] In some embodiments, flow sensors installed on the first or second liquid channels allow the operation control module (502) to determine liquid demand and adjust heating accordingly. In other embodiments, the control system includes adaptive learning capabilities, pre-activating the first heating source (115) during peak demand periods.

[0152] Users can manually select the heating mode via a control panel on the heating apparatus or through remote control. In some embodiments, the duty cycle of the computing unit (107) is modulated to improve efficiency, and the 2000W heating element can be activated using short pulses during peak demand.

[0153] The operation control module (502) can also be programmed with a start time for the first heating source (115), enabling scheduled activation.

[0154] EMBODIMENT 4:

[0155] In some embodiments, as illustrated in Figures 13a— 13f, the second compartment (103) is configured as a detachable component relative to the first compartment (101). The second compartment (103) houses a computing unit (107) and comprises a first heat transfer facilitation element (105), which is operable to be inserted into the first compartment (101) through a compartment opening formed on the first compartment (101), such that the first heat transfer facilitation element (105) transfers computing waste heat generated by the computing unit (107) into liquid contained within the first compartment (101 ).

[0156] In some embodiments, the compartment opening through which the first heat transfer facilitation element (105) is inserted is a pre-existing functional opening of the first compartment (101), or a dedicated opening (128) specifically configured to receive the first heat transfer facilitation element (105). By way of example, the pre-existing functional opening may comprise the first liquid channel (109), the second liquid channel (111), an anti-corrosion rod insertion opening, or a pre-existing heating source opening. As illustrated in Figures 13a - f, the first heat transfer facilitation element (105) is inserted into the first compartment (101) through the cold liquid inlet (i.e., the first liquid channel (109)) so that the cold liquid entering the first compartment (101) is heated, and the temperature around the first liquid channel (109) is typically lower so that the heat transfer from the heat dissipating from the first heat transfer facilitation element (105) to the liquid is more efficient. Of course, in some embodiments, other pre-existing functional openings such as the second liquid channel (111) which directs the heated liquid out of the first compartment (101) and the anti-corrosion rod insertion opening can also be utilized for the insertion of the first heat transfer facilitation element (105). In some embodiments, a pre-existing heating source opening formed in a side wall surface of the first compartment (101 ) is utilized as the compartment opening for detachably inserting the first heat transferfacilitation element (105), wherein the detachable second compartment (103) functionally replaces a conventional heating element (for example, a rod-type or U-shaped immersion heating element) that would otherwise be inserted through the pre-existing heating source opening in conventional designs.

[0157] In some embodiments, the first heat transfer facilitation element (105) comprises a heat transfer circuit (130) configured to transfer computing waste heat from the second compartment (103) into the first compartment (101). The heat transfer circuit (130) comprises a fluid exiting segment (131) and a fluid returning segment (132), wherein the fluid exiting segment (131) is configured to direct a heat transfer fluid out of the second compartment (103), and the fluid returning segment (132) is configured to direct the heat transfer fluid back into the second compartment (103). In some embodiments, as illustrated in Figures 13c- 13e, the fluid exiting segment (131) and the fluid returning segment (132) are integrally connected, such that the heat transfer fluid circulates between the heat transfer circuit (130) and the second compartment (103). In some embodiments, the fluid exiting segment (131) is configured in a spiral, curved, or zig-zag shape to increase surface area for heat exchange with the liquid inside the first compartment (101). In some embodiments, as illustrated in Figures 13c - 13e, the fluid returning segment (132) is configured in a linear or linear-like shape to facilitate efficient return of the heat transfer fluid back into the second compartment (103). In certain embodiments, the fluid returning segment (132) is positioned within a hollow core formed by the fluid exiting segment (131) configured in a spiral shape.

[0158] In some embodiments, as illustrated in Fig. 13f , the heat transfer circuit (130) is configured such that the fluid exiting segment (131) comprises a fluid outlet (133) operable to transfer the heat transfer fluid from the second compartment (103) directly into the first compartment (101), and a fluid inlet (135) operable to transfer the heat transfer fluid from the first compartment (101) back into the second compartment (103). In these embodiments, the heat transfer fluid is typically the same as the liquid to be heated inside the first compartment (101). In some embodiments, the fluid outlet (133) and the fluid inlet (135) are positioned apart within the first compartment (101), such that the heat transfer fluid exiting from the fluid outlet (133) is diffused across the first compartment (101) before being directed back into the fluid inlet (135), thereby enhancing heat distribution within the liquid. By way of example, as illustrated in Fig. 13f , the first compartment (101 ) is arranged in an upright orientation, and the attachment surface (102)corresponds to a bottom surface of the first compartment (101). In this configuration, the fluid outlet (133) is positioned at a lower region of the first compartment (101), in proximity to the attachment surface (102), while the fluid inlet (135) is positioned at a higher region of the first compartment (101), distal to the attachment surface (102). This spatial arrangement promotes natural convection within the first compartment (101), whereby heated liquid introduced through the fluid outlet (133) rises toward an upper region of the first compartment (101), and relatively cooler liquid in the upper region is drawn toward the fluid inlet (135) and returned to the second compartment (103) for reheating.

[0159] In some embodiments, the second compartment (103) further comprises a fluid pump configured to regulate flow of the heat transfer fluid inside the heat transfer circuit (130), so as to control heat transfer efficiency between the computing unit (107) and the first compartment (101).

[0160] In some embodiments, the first heat transfer facilitation element (105) is configured as an anti-corrosion rod inserted into the first compartment (101) through an anti-corrosion rod insertion opening. In certain embodiments, the anti-corrosion rod is a sacrificial anode rod, such that the first heat transfer facilitation element (105) provides both corrosion protection and heat transfer functionality.

[0161] In some embodiments, the heating apparatus further comprises a first heating source (115) positioned inside the first compartment (101). The first heating source (115) may be positioned in proximity to the second inlet (123) of the second liquid channel (111), such that liquid entering the second inlet (123) is further heated when additional heating is required (e.g., when the liquid inside the first compartment (101) is used for showering purpose).

[0162] In some embodiments, the first heating source (115) is an electrical heating element. The electrical heating element may comprise one or more of a heating coil, a heating plate, a heating rod, or a heating pad.

[0163] According to another aspect of the present invention, there is provided a detachable heating apparatus configured to be detachably mounted relative to a first compartment (101) via an attachment surface (102) and a compartment opening. The detachable heating apparatus comprises a second compartment (103), a computing unit (107) housed inside the second compartment (103), and a first heat transfer facilitationelement (105). The computing unit (107) is operable to perform a computing task and generate computing waste heat. The first heat transfer facilitation element (105) is configured to be detachably positioned inside the first compartment (101) through the compartment opening (126), such that the computing waste heat generated by the computing unit (107) is transferred from the second compartment (103) into liquid contained within the first compartment (101).

[0164] In some embodiments, the first heat transfer facilitation element (105) comprises a heat transfer circuit (130) configured to transfer computing waste heat from the second compartment (103) into the first compartment (101). The heat transfer circuit (130) comprises a fluid exiting segment (131) and a fluid returning segment (132), wherein the fluid exiting segment (131) is configured to direct a heat transfer fluid out of the second compartment (103), and the fluid returning segment (132) is configured to direct the heat transfer fluid back into the second compartment (103). In some embodiments, the fluid exiting segment (131) and the fluid returning segment (132) are integrally connected, such that the heat transfer fluid is operable to circulate between the heat transfer circuit (130) and the second compartment (103). In certain embodiments, the fluid exiting segment (131) is configured in a spiral, curved, or zig-zag shape to increase surface area for heat exchange between the fluid exiting segment (131 ) and the liquid inside the first compartment (101). In some embodiments, the fluid returning segment (132) is configured in a linear or linear-like shape to facilitate efficient return of the heat transfer fluid into the second compartment (103). In certain embodiments, the fluid returning segment (132) is positioned within a hollow core formed by the fluid exiting segment (131) configured in a spiral shape, thereby reducing flow resistance and improving circulation efficiency.

[0165] In some embodiments, the heat transfer fluid circulating within the heat transfer circuit (130) is water or mineral oil. In certain embodiments, the heat transfer circuit (130) is configured such that the fluid exiting segment (131) comprises a fluid outlet (133) operable to transfer the heat transfer fluid from the second compartment (103) into the first compartment (101), and a fluid inlet (135) operable to transfer the heat transfer fluid from the first compartment (101) back into the second compartment (103). In these embodiments, the heat transfer fluid is the same as the liquid to be heated inside the first compartment (101).

[0166] In some embodiments, the fluid outlet (133) and the fluid inlet (135) are positioned apart within the first compartment (101), such that heat transfer fluid exiting from the fluid outlet (133) is diffused across the first compartment (101) before being directed back into the fluid inlet (135), thereby enhancing heat distribution within the liquid. In certain embodiments, the second compartment (103) further comprises a fluid pump configured to regulate flow of the heat transfer fluid inside the heat transfer circuit (130).

[0167] In some embodiments, the first heat transfer facilitation element (105) is configured as an anti-corrosion rod operable to be inserted into the first compartment (101) through an anti-corrosion rod insertion opening. In certain embodiments, the anticorrosion rod is a sacrificial anode rod, such that the first heat transfer facilitation element (105) provides both corrosion protection and heat transfer functionality.

[0168] In some embodiments, the first heat transfer facilitation element (105) alternatively or additionally comprises a heat dissipation unit configured to transfer computing waste heat from the computing unit (107) into the first compartment (101). In certain embodiments, the heat dissipation unit is formed of a thermally conductive material and configured into a shape of a rod, pad, plate, or pipe.

[0169] In some embodiments, the second compartment (103) comprises a thermal protection coating (113) formed on an exterior surface of the second compartment (103), so as to reduce heat loss to the external environment and to protect internal components housed within the second compartment (103).

[0170] In some embodiments, the computing unit (107) comprises one or more of a cryptocurrency miner, a server-grade central processing unit, a simulation processor, or an artificial intelligence-related computing unit. In certain embodiments, the artificial intelligence-related computing unit comprises one or more of a graphics processing unit, a tensor processing unit, an Al accelerator, or a neural processing unit.

[0171] In some embodiments, the computing unit (107) is arranged to be in data communication with a network, such that the computing unit (107) is operable to receive computing tasks from a remote source while simultaneously providing waste heat for liquid heating.

[0172] In some embodiments, the detachable configuration of the secondcompartment (103), together with the first heat transfer facilitation element (105), enables the second compartment (103) to be detached, replaced, upgraded, or serviced independently of the first compartment (101), thereby facilitating maintenance and adoption of the detachable heating apparatus in existing liquid heating systems. The configurations illustrated in Figures 13a-13f correspond to an embodiment of the present invention in which the second compartment (103), together with the computing unit (107) and the first heat transfer facilitation element (105), is configured to be easily detachable from and replaceable relative to the first compartment (101). In these embodiments, because one or more pre-existing functional openings of the first compartment (101) (e.g., the first liquid channel) are utilized as the compartment opening for insertion of the first heat transfer facilitation element (105), no new openings are required to be formed on walls of the first compartment (101), such as on the attachment surface (102). As a result, the heating apparatus according to these embodiments can be readily retrofitted to existing liquid heating devices, such as water tanks, with minimal structural modification, thereby facilitating maintenance, replacement, or upgrading of the second compartment (103) while preserving the integrity of the first compartment (101).

[0173] In recent years, the demand for energy-efficient solutions has become increasingly important across various industries, including computing and household utilities. As computational tasks become more intensive, the heat generated by computing units has become a significant concern, often requiring additional cooling mechanisms to prevent overheating and ensure optimal performance. This waste heat, if not managed properly, can lead to increased energy consumption and higher operational costs.

[0174] Simultaneously, the need for efficient water heating systems in residential and commercial settings has been a persistent challenge. Traditional water heating methods often rely on significant energy input to maintain or achieve desired temperatures, leading to increased energy usage and costs. The integration of computing systems with household utilities presents an opportunity to address these challenges by repurposing waste heat for practical applications, such as heating water, thereby enhancing energy efficiency and reducing overall energy consumption.

[0175] Accordingly, the present invention provides a technical solution that leverages the waste heat generated by the computing unit (107) in the second compartment (103) during intensive computational tasks to heat the liquid within the first compartment (101),to which the second compartment (103) is attached. This arrangement allows the heat generated by the computing unit (107) to maintain the liquid in the first compartment (101 ) at a stable temperature or gradually bring it closer to a stable temperature over time. Consequently, when only a small amount of liquid is needed (e.g., for handwashing during winter or cleaning a small coffee cup), the liquid at or near the maintained temperature can be used directly, eliminating the need to activate the first heating source (115) for additional heating. Conversely, for larger quantities of liquid (e.g., extensive dishwashing or showering), the first heating source (115) can be activated to heat the liquid, thereby achieving significant energy savings.

[0176] It should be further appreciated by the person skilled in the art that variations and combinations of features described above, not being alternatives or substitutes, may be combined to form yet further embodiments falling within the intended scope of the invention.

[0177] As would be understood by a person skilled in the art, each embodiment, may be used in combination with other embodiment or several embodiments.

Claims

CLAIMSClaim 1. A heating apparatus (100), comprising:a first compartment (101) configured to hold liquid to be heated; wherein the first compartment (101) comprises: a first liquid channel (109) configured to direct the liquid from outside the first compartment (101) into the first compartment (101), and; a second liquid channel (111) configured to direct the liquid out of the first compartment (101);wherein the first liquid channel (109) is configured to comprise a first inlet (117) configured to receive the liquid from outside the first compartment (101 ) and a first outlet (119) configured to release the liquid from the first liquid channel (109) into the first compartment (101 );wherein the second liquid channel (111 ) is configured to comprise a second inlet (123) configured to receive the liquid from the first compartment (101), and a second outlet (121) configured to direct the liquid from the second liquid channel (111) out of the first compartment (101 );a second compartment (103) configured to house a computing unit (107) operable to perform a computing task and generate computing waste heat; wherein the second compartment (103) is configured to transfer the computing waste heat to the first compartment (101).Claim 2. The heating apparatus (100) according to Claim 1, wherein the second compartment (103) is configured to comprise a first heat transfer facilitation element (105) configured to transfer the computing waste heat from the computing unit (107) to the first compartment (101).Claim 3. The heating apparatus (100) according to Claim 2, wherein the first heat transfer facilitation element (105) is configured to be positioned within the first compartment (101 ) through a compartment opening.Claim 4. The heating apparatus (100) according to Claim 3, wherein the compartment opening is a pre-existing functional opening on the first compartment (101 ), or a dedicated opening (128) configured to receive the first heat transfer facilitation element (105).Claim 5. The heating apparatus (100) according to Claim 4, wherein the pre-existing functional opening is the first liquid channel (109), the second liquid channel (111), an anti-corrosion rod insertion opening, or a pre-existing heating source opening.Claim 6. The heating apparatus (100) according to any one of the preceding claims, wherein first heat transfer facilitation element (105) comprises a heat transfer circuit (130) operable to transfer the computing waste heat from the second compartment (103) into the first compartment (101); wherein the heat transfer circuit (130) is configured to comprise a fluid exiting segment (131) and a fluid returning segment (132); wherein, (i) the fluid exiting segment (131) is configured to direct a heat transfer fluid out of the second compartment (103); and,(ii) the fluid returning segment (132) is configured to direct the heat transfer fluid back into the second compartment (103).Claim 7. The heating apparatus (100) according to Claim 6, wherein the fluid exiting segment (131) and the fluid returning segment (132) are integrally connected so that the heat transfer fluid is operable to circulate between the heat transfer circuit (130) and the second compartment (103).Claim 8. The heating apparatus (100) according to Claim 7, wherein the fluid exiting segment (131) is configured in a spiral, curved or zig-zag shape to increase surface area for heat exchange between the fluid exiting segment (131) and the liquid inside the first compartment (101).Claim 9. The heating apparatus (100) according to any one of Claims 6 - 8, wherein the fluid returning segment (132) is configured in a linear or linear-like shape to facilitate efficient return of the heat transfer fluid back into the second compartment (103).Claim 10. The heating apparatus (100) according to Claim 9, wherein the fluid returning segment (132) is configured to be positioned in a hollow core formed by the fluid exiting segment (131) configured to be in the spiral shape.Claim 11. The heating apparatus (100) according to Claim 6, wherein the fluid exiting segment (132) is configured to comprise (i) a fluid outlet (133) operable to transfer the heat transfer fluid from the second compartment (103) into the first compartment (101); and (ii) a fluid inlet (135) operable to transfer the heat transfer fluid from the firstcompartment (101) into the second compartment (103); wherein the heat transfer fluid is the same as the liquid to be heated inside the first compartment (101).Claim 12. The heating apparatus (100) according to Claim 11, wherein the fluid outlet (133) and the fluid inlet (135) are positioned apart inside the first compartment (101) so that the heat transfer fluid exiting from the fluid outlet (133) is operable to be diffused across the first compartment (101) before being directed back into the fluid inlet (135). Claim 13. The heating apparatus (100) according to any one of Claims 6 - 10, wherein the second compartment (103) further comprises a fluid pump configured to regulate flow of the heat transfer fluid inside the heat transfer circuit (130).Claim 14. The heating apparatus (100) according to Claim 5, wherein the the first heat transfer facilitation element (105) is configured as an anti-corrosion rod, inserted into the first compartment (101) through the anti-corrosion rod insertion opening.Claim 15. The heating apparatus (100) according to Claim 10, wherein the anti-corrosion rod is a sacrificial anode rod.Claim 16. The heating apparatus (100) according to any one of the preceding claims, wherein further comprising a first heating source (115) configured to be positioned inside the first compartment (101 ).Claim 17. The heating apparatus (100) according to Claim 16, wherein the first heating source (115) is configured to be positioned in proximity to the second inlet (123).Claim 18. The heating apparatus (100) according to Claim 16 or 17, wherein the first heating source (115) is an electrical heating element.Claim 19. The heating apparatus (100) according to Claim 18, wherein the electrical heating element is a heating coil, a heating plate, a heating rod or a heating pad.Claim 20. The heating apparatus (100) according to Claim 2 - 5, wherein the first heat transfer facilitation element (105) comprises a heat dissipation unit configured to transfer the computing waste heat from the computing unit (107) into the first compartment (101). Claim 21. The heating apparatus (100) according to Claim 20, wherein the heating dissipation unit is a thermal conductive material configured into a shape of rod, pad, plate, pad or pipe.Claim 22. The heating apparatus (100) according to any one of the preceding claims, wherein the first outlet (119) is configured to be positioned in proximity to an attachment surface (102) of the first compartment (101); and the second inlet (123) is configured to be positioned distal to the attachment surface (102).Claim 23. The heating apparatus (100) according to Claim 2, wherein the first heat transfer facilitation element (105) is configured to be positioned between the computing unit (107) and an attachment surface (102) of the first compartment (101 ) to facilitate the heat transfer from the computing unit (107) to the first compartment (101) through the attachment surface (102).Claim 24. The heating apparatus (100) according to Claim 23, wherein the first heat transfer facilitation element (105) is a radiator, a vapour chamber, a graphene sheet, or one or more peltier elements.Claim 25. The heating apparatus (100) according to Claim 24, wherein the radiator is made of aluminium, copper, graphite-based composite or ceramic-coated metal.Claim 26. The heating apparatus (100) according to Claim 25, wherein the radiator is liquid-containing layer configured to contain a heat-transfer liquid for facilitating heat transfer between the computing unit (107) and the attachment surface (102).Claim 27. The heating apparatus (100) according to Claim 26, wherein the heat-transfer liquid is water or mineral oil.Claim 28. The heating apparatus (100) according to any one of Claims 20 - 27, wherein further comprising a second heat transfer facilitation element (125) configured to be in thermal contact with the first heat transfer facilitation element (105), and extends across the attachment surface (102) into the first compartment (101).Claim 29. The heating apparatus (100) according to Claim 28, wherein the second heating transfer facilitation element (125) comprises a heat dissipation end (127) configured to be positioned in proximity to the first outlet (119).Claim 30. The heating apparatus (100) according to Claim 29, wherein the second heating transfer facilitation element (125) is configured to comprise one or more of: rod, pad, plate, pad and pipe.Claim 31. The heating apparatus (100) according to Claim 30, wherein the pipe is configured to house a heat transfer fluid, circulating between the first compartment (101) and the second compartment (103) through the pipe.Claim 32. The heating apparatus (100) according to any one of the preceding claims, wherein the liquid is water suitable for domestic use.Claim 33. The heating apparatus (100) according to any one of the preceding claims, wherein the first compartment (101) comprises a thermal protection coating (113) on exterior surface of the first compartment (101 ).Claim 34. The heating apparatus (100) according to any one of the preceding claims, wherein the second compartment (103) comprises a thermal protection coating (113) on exterior surface of the second compartment (103).Claim 35. The heating apparatus (100) according to any one of the preceding claims, wherein the first compartment (101) is configured to be positioned above the second compartment (103).Claim 36. The heating apparatus (100) according to Claim 35, wherein the attachment surface (102) is bottom surface of the first compartment (101), and the first inlet (117) and the second inlet (121) are configured to be positioned on top surface of the first compartment (101).Claim 37. The heating apparatus (100) according any one of Claims 1 - 34, wherein the second compartment (103) is configured to be positioned beside the first compartment (101).Claim 38. The heating apparatus (100) according to any one of the preceding claims, wherein the computing unit (107) comprises one or more of: a cryptocurrency miner, a server-grade central processing unit (CPU), a simulation processor and an artificial intelligence-related computing unit; wherein the artificial intelligence-related computing unit comprises one or more of: a graphics processing unit (GPU), a tensor processing unit (TPU), an Al accelerator and a neural processing unit (NPU).Claim 39. The heating apparatus (100) according to any one of the preceding claims, wherein the computing unit (107) is arranged to be in data communication with a network.Claim 40. The heating apparatus (100) according to any one of the preceding claims, wherein further comprising a heating control system (500) arranged to control heating process of the heating apparatus (100); wherein the heating control system (500) comprises:a temperature monitoring module (501) operable to detect and measure temperature of the liquid inside the first compartment (101) and / or inside the second compartment (103); and,an operation control module (502) operable to adjust operation of the computing unit (107) and / or the first heating source (115) according to the temperature of the liquid measured by the temperature monitoring module (501).Claim 41. The heating apparatus (100) according to Claim 40, wherein, when the temperature monitoring module (501) detects that the temperature of the liquid at a first temperature zone within the first compartment (101) drops below a first predetermined temperature threshold, the operation control module (502) is operable to activate or enhance the heating process of the first heating source (115).Claim 42. The heating apparatus (100) according to Claim 41, wherein the first temperature zone is defined to encompass the second inlet (123).Claim 43. The heating apparatus (100) according to any one of Claims 40 - 42, wherein, when the temperature monitoring module (501 ) detects that the temperature of the liquid at a second temperature zone within the first compartment (101) exceeds a second predetermined temperature threshold, the operation control module (502) is operable to deactivate or reduce the operation of the computing unit (107).Claim 44. The heating apparatus (100) according to Claim 43, wherein the second temperature zone is defined to cover the attachment surface (102).Claim 45. The heating apparatus (100) according to any one of Claims 40 - 44, wherein, when the temperature monitoring module (501) detects that the temperature inside the second compartment (103) exceeds a second predetermined temperature threshold, the operation control module (502) is operable to deactivate or reduce the operation of the computing unit (107).Claim 46. The heating apparatus (100) according to any one of Claims 40 - 45, wherein further comprising a mode switch module (503) arranged to transmit an instruction signal to the operation control module;when the mode switch module (503) is switched to a liquid use mode, the operation control module is operable to activate the first heating source (115); when the mode switch module (503) is switched to a standby mode, the operation control module is operable to deactivate the first heating source (115).Claim 47. The heating apparatus (100) according to Claim 46, wherein, when the mode switch module (503) is switched to the standby mode, operation control module is operable to also regulate the operation of the computing unit (107).Claim 48. The heating apparatus (100) according to any one of the preceding claims, wherein the computing unit (107) is configured to be removable from the second compartment (103).Claim 49. A detachable heating apparatus, comprising:a second compartment (103), a computing unit (107) housed inside the second compartment (103), and a first heat transfer facilitation element (105);wherein the computing unit (207) is operable to perform a computing task and generate computing waste heat;wherein the first heat transfer facilitation element (105) is operable to be detachably positioned inside a first compartment (101) through a compartment opening (126) to transfer the computing waste heat from the computing unit (107) into the first compartment (101).Claim 50. The detachable heating apparatus according to Claim 49, wherein the first heat transfer facilitation element (105) comprises a heat transfer circuit (130) operable to transfer the computing waste heat from the second compartment (103) into the first compartment (101); wherein the heat transfer circuit (130) is configured to comprise a fluid exiting segment (131) and a fluid returning segment (132); wherein,(i) the fluid exiting segment (131) is configured to direct a heat transfer fluid out of the second compartment (103); and(ii) the fluid returning segment (132) is configured to direct the heat transfer fluid back into the second compartment (103).Claim 51. The detachable heating apparatus according to Claim 49 or 50, wherein the fluid exiting segment (131) and the fluid returning segment (132) are integrally connected so that the heat transfer fluid is operable to circulate between the heat transfer circuit (130) and the second compartment (103).Claim 52. The detachable heating apparatus according to any one of Claims 49-51, wherein the fluid exiting segment (131) is configured in a spiral, curved, or zig-zag shape to increase surface area for heat exchange between the fluid exiting segment (131) and the liquid inside the first compartment (101).Claim 53. The detachable heating apparatus according to Claim 52, wherein the fluid returning segment (132) is configured in a linear or linear-like shape to facilitate efficient return of the heat transfer fluid back into the second compartment (103).Claim 54. The detachable heating apparatus according to Claim 53, wherein the fluid returning segment (132) is configured to be positioned in a hollow core formed by the fluid exiting segment (131) configured to be in the spiral shape.Claim 55. The detachable heating apparatus according to any one of Claims 50-54, wherein the heat transfer fluid is water or mineral oil.Claim 56. The detachable heating apparatus according to Claim 50, wherein the fluid exiting segment (132) is configured to comprise (i) a fluid outlet (133) operable to transfer the heat transfer fluid from the second compartment (103) into the first compartment (101); and (ii) a fluid inlet (135) operable to transfer the heat transfer fluid from the first compartment (101) into the second compartment (103); wherein the heat transfer fluid is the same as the liquid to be heated inside the first compartment (101).Claim 57. The detachable heating apparatus according to Claim 56, wherein the fluid outlet (133) and the fluid inlet (135) are positioned apart.Claim 58. The detachable heating apparatus according to any one of Claims 50-54, wherein the second compartment (103) further comprises a fluid pump configured to regulate flow of the heat transfer fluid inside the heat transfer circuit.Claim 59. The detachable heating apparatus according to any one of Claims 49-58, wherein the first heat transfer facilitation element (105) is configured as an anti-corrosion rod, operable to be inserted into the first compartment (101) through the anti-corrosion rod insertion opening.Claim 60. The detachable heating apparatus according to Claim 59, wherein the anticorrosion rod is a sacrificial anode rod.Claim 61. The detachable heating apparatus according to any one of Claims 49-60, wherein the first heat transfer facilitation element (105) comprises a heat dissipation unit configured to transfer the computing waste heat from the computing unit (107) into the first compartment (101).Claim 62. The detachable heating apparatus according to Claim 61, wherein the heat dissipation unit is a thermally conductive material configured into a shape of a rod, pad, plate, or pipe.Claim 63. The detachable heating apparatus according to any one of Claims 49-62, wherein the second compartment (103) comprises a thermal protection coating (113) on an exterior surface of the second compartment (103).Claim 64. The detachable heating apparatus according to any one of Claims 49-63, wherein the computing unit (107) comprises one or more of: a cryptocurrency miner, a server-grade central processing unit (CPU), a simulation processor, and an artificial intelligence-related computing unit; wherein the artificial intelligence-related computing unit comprises one or more of: a graphics processing unit (GPU), a tensor processing unit (TPU), an Al accelerator, and a neural processing unit (NPU).Claim 65. The detachable heating apparatus according to any one of Claims 49-64, wherein the computing unit (107) is arranged to be in data communication with a network.

Images