Semiconductor substrate handling system

Abstract

A semiconductor substrate handling system is described. The system includes a track comprising paths through a plurality of process stations, and a plurality of substrate holders coupled to the track. Each substrate holder is configured to receive and hold a substrate (e.g., a reticle or a wafer), and move the substrate along the paths through the plurality of process stations to enable the substrate to be processed. A controller is operatively coupled to the track and the plurality of substrate holders. The controller is configured to control relative motion between the plurality of substrate holders to cause each substrate holder to move along the paths through the plurality of process stations independently of other substrate holders, with directions, ranges, and / or speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations.

Description

2025P00001WQ 1SEMICONDUCTOR SUBSTRATE HANDLING SYSTEMCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority of US application 63 / 752,041 which was filed on 31 January 2025 and which is incorporated herein in its entirety by reference.TECHNICAL FIELD

[0002] This description relates to a semiconductor substrate handling system.BACKGROUND

[0003] A lithography (e.g., projection) apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, a patterning device (e.g., a reticle or mask) may contain or provide a pattern corresponding to an individual layer of the IC (“design layout”), and this pattern can be transferred onto a target portion (e.g. comprising one or more dies) on a substrate (e.g., silicon wafer) that has been coated with a layer of radiation-sensitive material (“resist”), by methods such as irradiating the target portion through the pattern on the patterning device. In general, a single substrate contains a plurality of adjacent target portions to which the pattern is transferred successively by the lithographic projection apparatus, one target portion at a time. In one type of lithographic projection apparatus, the pattern on the entire patterning device is transferred onto one target portion in one operation. Such an apparatus is commonly referred to as a stepper. In an alternative apparatus, commonly referred to as a step-and-scan apparatus, a projection beam scans over the patterning device in a given reference direction (the “scanning” direction) while synchronously moving the substrate parallel or anti-parallel to this reference direction. Different portions of the pattern on the patterning device are transferred to one target portion progressively. One or more patterning devices are provided to the lithography apparatus as needed to form the IC.SUMMARY

[0004] Semiconductor substrate handling system(s) and corresponding method(s) are described. A track comprising paths through a plurality of process stations, and a plurality of substrate holders coupled to the track are provided. Each substrate holder is configured to receive and hold a substrate (e.g., a reticle, a reticle pod, a wafer, or other substrates), and move the substrate along the paths through the plurality of process stations to enable the substrate to be processed. A controller is operatively coupled to the track and the plurality of substrate holders. The controller is configured to control relative motion between the plurality of substrate holders to cause each substrate holder to move along the paths through the plurality of process stations independently of other substrate holders, with directions, ranges, and / or speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations. The parallel substrate2025P00001WQ 2processing provided by these new system(s) and method(s) facilitate a reduced substrate handling system footprint, and / or increased substrate throughput, compared to prior substrate handing systems, among other advantages.

[0005] According to an embodiment, a semiconductor substrate handling system is provided. The system comprises a track comprising one or more paths through a plurality of process stations, and a plurality of substrate holders coupled to the track. Each substrate holder is configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations to enable the substrate to be processed. The system comprises a controller operatively coupled to the track and the plurality of substrate holders. The controller is configured to control relative motion between the plurality of substrate holders to cause each substrate holder to move along the one or more paths through the plurality of process stations independently of other substrate holders, with one or more of directions, ranges, and speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations.

[0006] In some embodiments, the track comprises a linear stage, and the plurality of substrate holders comprise shuttles coupled to the linear stage.

[0007] In some embodiments, the track comprises one or more horizontal axes for relatively long stroke movement.

[0008] In some embodiments, each substrate holder is configured to move along the one or more paths, and in horizontal, vertical, and / or rotational directions relative to the one or more paths via a contactless actuator associated with each substrate holder.

[0009] In some embodiments, the track comprises a magnetic levitation stage, the contactless actuator comprises a magnet, and the plurality of substrate holders comprise magnetic levitation pucks configured to magnetically levitate above the stage.

[0010] In some embodiments, the track comprises multiple paths. The plurality of substrate holders are configured to be moveable in different directions on the multiple paths. For example, the track may comprise two or more parallel processing paths for parallel processing of two or more substrates in the plurality of processing stations. Movement of a substrate holder is controlled in concert with a timing of processing at a process station and / or movement of other substrate holders.

[0011] In some embodiments, the controller and the plurality of substrate holders are configured such that one or more operations at the plurality of process stations are performed while a given substrate holder is stopped, and others of the plurality of substrate holders are moving.

[0012] In some embodiments, a number of the plurality of substrate holders corresponds to a number of the process stations. In some embodiments, a number of the plurality of substrate holders is more than a number of the process stations.

[0013] In some embodiments, the semiconductor substrate handling system is a reticle handling system of a lithography apparatus, the substrate is a reticle, and the track is configured to operate in a vacuum environment of the lithography apparatus. The substrate holder may be configured to move the reticle2025P00001WQ 3along the one or more paths from a load lock of the reticle handling system, through the plurality of process stations, to a reticle stage of the lithography apparatus, for example.

[0014] In some embodiments, the system comprises a gripper configured to grip and move the reticle from the load lock onto the substrate holder, and / or a lift configured to lift the reticle from the substrate holder to the reticle stage.

[0015] In some embodiments, the plurality of process stations comprise process stations associated with identification, inspection, storage, alignment, and / or use of the reticle in the lithography apparatus. Use of the reticle comprises patterning a layer of a semiconductor wafer with a pattern from the reticle during a lithography exposure in the lithography apparatus, for example. In some embodiments, the reticle is a 6” x 6”, 6” x 11.4”, or 6” x 12” (these are just representative possible example dimensions) reticle, and / or reticles of other sizes.

[0016] In some embodiments, the semiconductor substrate handling system is a wafer handling system of a lithography apparatus, the substrate is a semiconductor wafer, and the track is configured to operate under atmospheric pressure in the lithography apparatus. In some embodiments, the plurality of process stations comprise process stations associated with inspection, cleaning, alignment, patterning, and / or bonding of the semiconductor wafer.

[0017] In some embodiments, each substrate holder comprises a short stroke actuator configured to cause a substrate holder to move a substrate with relatively short strokes to facilitate one or more operations at the plurality of process stations. Each substrate holder may be configured such that the short strokes are along the one or more paths of the track; and / or in horizontal, vertical, and / or rotational in directions relative to the one or more paths and / or one or more of the plurality of process stations. In some embodiments, the short stroke actuator comprises a contactless actuator, one or more activation coils, one or more air bearings, a mechanical wheel, a magnetic bearing, a motor, electrical components, a wired and / or wireless communication device, a sliding bearing, a rotating bearing, a capacitor, a spring, optical data transfer components, and / or other components.

[0018] In some embodiments, the track comprises one or more additional components configured to cause the plurality of substrate holders to move with relatively long strokes along the one or more paths to facilitate the one or more operations at the plurality of process stations.

[0019] In some embodiments, each of the plurality of substrate holders comprises a chuck configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations.

[0020] According to another embodiment, a semiconductor substrate handling method is provided. The method comprises one or more of the operations performed by a semiconductor substrate handling system described herein.BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification,2025P00001WQ 4illustrate one or more embodiments and, together with the description, explain these embodiments. Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings in which corresponding reference symbols indicate corresponding parts, and in which:

[0022] Fig. 1 schematically depicts a lithography apparatus, according to an embodiment.

[0023] Fig. 2 schematically depicts an embodiment of a lithographic cell or cluster, according to an embodiment.

[0024] Fig. 3 illustrates a portion of an extreme ultra violet (EUV) lithography apparatus, according to an embodiment.

[0025] Fig. 4 illustrates another example lithography apparatus (e.g., similar to an or the same as the lithography apparatus shown in Fig. 1 , with components similar to and / or the same as the components of the lithography apparatus shown in Fig. 3), according to an embodiment.

[0026] Fig. 5 illustrates a semiconductor substrate handling system, according to an embodiment.

[0027] Fig. 6 illustrates another semiconductor substrate handling system, according to an embodiment.

[0028] Fig. 7 illustrates an example lifting mechanism for the semiconductor substrate handling systems shown in Fig. 5 and Fig. 6, according to an embodiment.

[0029] Fig. 8 illustrates a semiconductor substrate handling method, according to an embodiment.

[0030] Fig. 9 is a block diagram of an example computer system, according to an embodiment.DETAIEED DESCRIPTION

[0031] The primary focus of the semiconductor substrate handling discussion below is on substrates such as reticles (also referred to as masks or more generally patterning devices), and the way they are handled in a lithography apparatus. However, the described techniques may be applied for handling other substrates such as reticle pods such as a reticle inner pod, semiconductor wafers, and / or other substrates.

[0032] In general, a mask or reticle may be a transparent block of material that is covered with a pattern defined by a different, opaque material. Or a mask or reticle may be an opaque block of material coated with a patterned mirror, for example. Various masks are loaded into a lithography apparatus and used to form layers of a semiconductor device. The pattern defined on a given mask or reticle corresponds to features produced in one or more layers of the semiconductor device. Often, a plurality of masks or reticles are automatically loaded into a lithography apparatus during manufacturing and used to form corresponding layers of a semiconductor device.

[0033] Current reticle handling systems rely on rotary robots configured to deliver reticles to different process stations, including reticle process stations associated with identification, inspection, storage, alignment, and / or using a reticle for lithography in the lithography apparatus. The robots are also used to deliver reticles to a reticle stage, to and from internal storage, and to and from a load lock to move reticles in and out of the lithography apparatus. The rotary robots occupy large volumes of space and2025P00001WQ 5only handle one reticle at a time (e.g., a single reticle handling path through a lithography apparatus). The large volumes and single reticle handling path create a bottleneck that limits the potential throughput in the lithography apparatus. In addition, the rotary robots are subject to vibration caused by other components of a lithography apparatus, limited in their lateral speed in order to avoid unintended reticle movement and / or particle generation, limited in the sizes of reticles they are configured to handle, and / or have other disadvantages.

[0034] In contrast, as described above, the present substrate handling system(s) include a track comprising paths through a plurality of process stations, and a plurality of substrate holders coupled to the track. Each substrate holder is configured to receive and hold a substrate (e.g., a reticle or a wafer), and move the substrate along the paths through the plurality of process stations to enable the substrate to be processed. A controller is operatively coupled to the track and the plurality of substrate holders. The controller is configured to control relative motion between the plurality of substrate holders to cause each substrate holder to move along the paths through the plurality of process stations independently of other substrate holders, with directions, ranges, and / or speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations. The parallel substrate processing provided by these new system(s) and method(s) facilitate a reduced substrate handling system (and overall lithography apparatus) footprint, and / or increased substrate throughput, compared to prior substrate (e.g., reticle, wafer, or other) handing systems, among other advantages.

[0035] Although specific reference may be made in this text to the manufacture of integrated circuits (ICs), it should be understood that the description herein has many other possible applications. For example, it may be employed in the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memories, liquid-crystal display panels, thin-film magnetic heads, etc. The skilled artisan will appreciate that, in the context of such alternative applications, any use of the terms “reticle”, “wafer” or “die” in this text should be considered as interchangeable with the more general terms “mask”, “substrate” and “target portion”, respectively. In addition, any use of the terms “reticle” or “mask” herein may be considered synonymous with the more general term “patterning device.”

[0036] As an introduction, prior to transferring a pattern from a patterning device such as a mask or reticle to a substrate such as a semiconductor wafer, the substrate may undergo various procedures, such as priming, resist coating and a soft bake. After exposure, the substrate may be subjected to other procedures (“post-exposure procedures”), such as a post-exposure bake (PEB), development, a hard bake and measurement and / or other inspection of the transferred pattern. This array of procedures is used as a basis to make an individual layer of a device, e.g., an IC. The substrate may then undergo various processes such as etching, ion-implantation (doping), metallization, oxidation, chemical mechanical polishing, etc., all intended to finish an individual layer of the device. If several layers are required in the device, then the whole procedure, or a variant thereof, is repeated for each layer.2025P00001WQ 6Eventually, a device will be present in each target portion on the substrate. These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins, etc.

[0037] Manufacturing semiconductor devices typically involves processing a substrate (e.g., a semiconductor wafer) using a number of fabrication processes to form various features and multiple layers of the devices. Such layers and features are typically manufactured and processed using, e.g., deposition, lithography, etch, chemical mechanical polishing, ion implantation, and / or other processes. Multiple devices may be fabricated on a plurality of dies on a substrate and then separated into individual devices. This device manufacturing process may be considered a patterning process. A patterning process involves a patterning step, such as optical and / or nanoimprint lithography using a patterning device in a lithography apparatus, to transfer a pattern on the patterning device to a substrate and typically, but optionally, involves one or more related pattern processing steps, such as resist development by a development apparatus, baking of the substrate using a bake tool, etching using the pattern using an etch apparatus, etc. One or more metrology processes are typically involved in the patterning process.

[0038] Lithography is a step in the manufacturing of devices such as ICs, where patterns formed on substrates define functional elements of the devices, such as microprocessors, memory chips, etc. Similar lithographic techniques are also used in the formation of flat panel displays, micro-electro mechanical systems (MEMS) and other devices.

[0039] Fig. 1 schematically depicts an embodiment of a lithography apparatus LA that may be included in and / or associated with the present systems and / or methods. The apparatus comprises: an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., extreme ultraviolet (EUV) radiation); a holder comprising a support structure (e.g., a mask table) MT configured to support or otherwise hold a patterning device (e.g. a reticle or mask) MA connected to a first positioner PM configured to accurately position the patterning device in accordance with certain parameters; a substrate table (e.g. a wafer table) WT (e.g., WTa, WTb or both) configured to hold a substrate (e.g. a resist-coated wafer) W and coupled to a second positioner PW configured to accurately position the substrate in accordance with certain parameters; and a projection system (e.g. a refractive projection lens system) PS configured to project a pattern imparted to the radiation beam B by patterning device MA onto a target portion C (e.g. comprising one or more dies and often referred to as fields) of the substrate W. The projection system is supported on a reference frame (RF). As depicted, the apparatus is of a transmissive type (e.g. employing a transmissive mask). Alternatively, the apparatus may be of a reflective type (e.g. employing a programmable mirror array of a type as referred to above, or employing a reflective mask).

[0040] The illuminator IL receives a beam of radiation from a radiation source SO. The source and the lithography apparatus may be separate entities, for example when the source is an excimer laser. In such cases, the source is not considered to form part of the lithography apparatus and the radiation beam is2025P00001WQ 7passed from the source SO to the illuminator IL with the aid of a beam delivery system BD comprising for example suitable directing mirrors and / or a beam expander. In other cases, the source may be an integral part of the apparatus, for example when the source is a mercury lamp. The source SO and the illuminator IL, together with the beam delivery system BD if required, may be referred to as a radiation system.

[0041] The illuminator IL may alter the intensity distribution of the beam. The illuminator may be arranged to limit the radial extent of the radiation beam such that the intensity distribution is non-zero within an annular region in a pupil plane of the illuminator IL. Additionally or alternatively, the illuminator IL may be operable to limit the distribution of the beam in the pupil plane such that the intensity distribution is non-zero in a plurality of equally spaced sectors in the pupil plane. The intensity distribution of the radiation beam in a pupil plane of the illuminator IL may be referred to as an illumination mode.

[0042] The illuminator IL may comprise adjuster AD configured to adjust the (angular / spatial) intensity distribution of the beam. Generally, at least the outer and / or inner radial extent (commonly referred to as o-outer and o-inner, respectively) of the intensity distribution in a pupil plane of the illuminator can be adjusted. The illuminator IL may be operable to vary the angular distribution of the beam. For example, the illuminator may be operable to alter the number, and angular extent, of sectors in the pupil plane wherein the intensity distribution is non-zero. By adjusting the intensity distribution of the beam in the pupil plane of the illuminator, different illumination modes may be achieved. For example, by limiting the radial and angular extent of the intensity distribution in the pupil plane of the illuminator IL, the intensity distribution may have a multi-pole distribution such as, for example, a dipole, quadrupole or hexapole distribution. A desired illumination mode may be obtained, e.g., by inserting an optic which provides that illumination mode into the illuminator IL or using a spatial light modulator.

[0043] The illuminator IL may be operable to alter the polarization of the beam and may be operable to adjust the polarization using adjuster AD. The polarization state of the radiation beam across a pupil plane of the illuminator IL may be referred to as a polarization mode. The use of different polarization modes may allow greater contrast to be achieved in the image formed on the substrate W. The radiation beam may be unpolarized. Alternatively, the illuminator may be arranged to linearly polarize the radiation beam. The polarization direction of the radiation beam may vary across a pupil plane of the illuminator IL. The polarization direction of radiation may be different in different regions in the pupil plane of the illuminator IL. The polarization state of the radiation may be chosen in dependence on the illumination mode. For multi-pole illumination modes, the polarization of each pole of the radiation beam may be generally perpendicular to the position vector of that pole in the pupil plane of the illuminator IL. For example, for a dipole illumination mode, the radiation may be linearly polarized in a direction that is substantially perpendicular to a line that bisects the two opposing sectors of the dipole. The radiation beam may be polarized in one of two different orthogonal directions, which may be2025P00001WQ 8referred to as X-polarized and Y-polarized states. For a quadrupole illumination mode, the radiation in the sector of each pole may be linearly polarized in a direction that is substantially perpendicular to a line that bisects that sector. This polarization mode may be referred to as XY polarization. Similarly, for a hexapole illumination mode the radiation in the sector of each pole may be linearly polarized in a direction that is substantially perpendicular to a line that bisects that sector. This polarization mode may be referred to as TE polarization.

[0044] In addition, the illuminator IL generally comprises various other components, such as an integrator IN and a condenser CO. The illumination system may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, or other types of optical components, or any combination thereof, for directing, shaping, or controlling radiation. Thus, the illuminator provides a conditioned beam of radiation B, having a desired uniformity and intensity distribution in its cross section.

[0045] The holder or support structure MT supports the patterning device in a manner that depends on the orientation of the patterning device, the design of the lithography apparatus, and other conditions, such as for example whether or not the patterning device is held in a vacuum environment. The support structure may use mechanical, vacuum, electrostatic or other clamping techniques to hold the patterning device. The support structure may be a frame or a table, for example, which may be fixed or movable as required. The support structure may ensure that the patterning device is at a desired position, for example with respect to the projection system.

[0046] The term “patterning device” should be broadly interpreted as referring to any device that can be used to impart a pattern in a target portion of the substrate (e.g., a semiconductor wafer). A patterning device may be any device that can be used to impart a radiation beam with a pattern in its cross-section to create a pattern in a target portion of the substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, for example if the pattern includes phase-shifting features or so called assist features. Generally, the pattern imparted to the radiation beam will correspond to a particular functional layer in a device being created in a target portion of the device, such as an integrated circuit. A patterning device may be transmissive or reflective. Examples of patterning devices include reticles or masks.

[0047] The projection system PS may comprise a plurality of optical (e.g., lens) elements and may further comprise an adjustment mechanism configured to adjust one or more of the optical elements to correct for aberrations (phase variations across the pupil plane throughout the field). To achieve this, the adjustment mechanism may be operable to manipulate one or more optical (e.g., lens) elements within the projection system PS in one or more different ways. The projection system may have a coordinate system wherein its optical axis extends in the z direction. The adjustment mechanism may be operable to do any combination of the following: displace one or more optical elements; tilt one or more optical elements; and / or deform one or more optical elements. Displacement of an optical element may be in any direction (x, y, z, or a combination thereof). Tilting of an optical element is typically out of a2025P00001WQ 9plane perpendicular to the optical axis, by rotating about an axis in the x and / or y directions although a rotation about the z axis may be used for a non-rotationally symmetric aspherical optical element. Deformation of an optical element may include a low frequency shape (e.g. astigmatic) and / or a high frequency shape (e.g. free form aspheres). Deformation of an optical element may be performed for example by using one or more actuators to exert force on one or more sides of the optical element and / or by using one or more heating elements to heat one or more selected regions of the optical element. In general, it may not be possible to adjust the projection system PS to correct for apodization (transmission variation across the pupil plane). The transmission map of a projection system PS may be used when designing a patterning device (e.g., mask) MA for the lithography apparatus LA. Using a computational lithography technique, the patterning device MA may be designed to at least partially correct for apodization.

[0048] The lithography apparatus may be of a type having two (dual stage) or more tables (e.g., two or more substrate tables WTa, WTb, two or more patterning device tables, a substrate table WTa and a table WTb below the projection system without a substrate that is dedicated to, for example, facilitating measurement, and / or cleaning, etc.). In such “multiple stage” machines, the additional tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposure. For example, alignment measurements using an alignment sensor AS and / or level (height, tilt, etc.) measurements using a level sensor LS may be made.

[0049] In operation of the lithography apparatus, a radiation beam is conditioned and provided by the illumination system IL. The radiation beam B is incident on the patterning device (e.g., reticle or mask) MA, which is held on the support structure (e.g., mask table) MT. Having traversed the patterning device MA, the radiation beam B passes through the projection system PS, which focuses the beam onto a target portion C of the substrate W. With the aid of the second positioner PW and position sensor IF (e.g., an interferometric device, linear encoder, 2-D encoder, or capacitive sensor), the substrate table WT can be moved accurately, e.g. to position different target portions C in the path of the radiation beam B. Similarly, the first positioner PM and another position sensor (which is not explicitly depicted in Fig. 1) can be used to accurately position the patterning device MA with respect to the path of the radiation beam B, e.g. after mechanical retrieval from a mask library, or during a scan. In general, movement of the support structure MT may be realized with the aid of a long-stroke module (coarse positioning) and a short-stroke module (fine positioning), which form part of the first positioner PM. Similarly, movement of the substrate table WT may be realized using a long-stroke module and a shortstroke module, which form part of the second positioner PW. In the case of a stepper (as opposed to a scanner), the support structure MT may be connected to a short-stroke actuator only, or may be fixed. Patterning device MA and substrate W may be aligned using patterning device alignment marks Ml, M2 and substrate alignment marks Pl, P2. Although the substrate alignment marks as illustrated occupy dedicated target portions, they may be located in spaces between target portions (these are known as scribe-lane alignment marks). Similarly, in situations in which more than one die is provided on the2025P00001WQ 10patterning device MA, the patterning device alignment marks may be located between the dies.

[0050] The depicted apparatus may be used in step mode or scan mode. In step mode, the support structure MT and the substrate table WT are kept essentially stationary, while a pattern imparted to the radiation beam is projected onto a target portion C at one time (i.e. a single static exposure). The substrate table WT is then shifted in the X and / or Y direction so that a different target portion C can be exposed. In step mode, the maximum size of the exposure field limits the size of the target portion C imaged in a single static exposure. In scan mode, the support structure MT and the substrate table WT are scanned synchronously while a pattern imparted to the radiation beam is projected onto a target portion C (i.e. a single dynamic exposure). The velocity and direction of the substrate table WT relative to the support structure MT may be determined by the (de-) magnification and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure field limits the width (in the non-scanning direction) of the target portion in a single dynamic exposure, whereas the length of the scanning motion determines the height (in the scanning direction) of the target portion. In another mode, the support structure MT is kept essentially stationary holding a programmable patterning device, and the substrate table WT is moved or scanned while a pattern imparted to the radiation beam is projected onto a target portion C. In this mode, generally a pulsed radiation source is employed, and the programmable patterning device is updated as required after each movement of the substrate table WT or in between successive radiation pulses during a scan. This mode of operation can be readily applied to maskless lithography that utilizes programmable patterning device, such as a programmable mirror array of a type as referred to above. Combinations and / or variations on the abovedescribed modes of use or entirely different modes of use may also be employed.

[0051] A substrate may be processed, before or after exposure, in for example a tool that typically applies a layer of resist to a substrate and develops the exposed resist, or a metrology or inspection tool. Further, the substrate may be processed more than once, for example in order to create a multi-layer IC, so that the term substrate used herein may also refer to a substrate that already includes multiple processed layers.

[0052] The terms “radiation” and “beam” encompass all types of electromagnetic radiation, including ultraviolet (UV) or deep ultraviolet (DUV) radiation (e.g. having a wavelength of 365, 248, 193, 157 or 126 nm) and extreme ultra-violet (EUV) radiation (e.g. having a wavelength in the range of 5-20 nm), as well as particle beams, such as ion beams or electron beams.

[0053] Various patterns on or provided by a patterning device may have different process windows, i.e., a space of processing variables under which a pattern will be produced within specification. Examples of pattern specifications that relate to potential systematic defects include checks for necking, line pull back, line thinning, critical dimension (CD), edge placement, overlapping, resist top loss, resist undercut and / or bridging. The process window of the patterns on a patterning device or an area thereof may be obtained by merging (e.g., overlapping) process windows of each individual pattern. The boundary of the process window of a group of patterns comprises boundaries of process windows of2025P00001WQ 11some of the individual patterns. In other words, these individual patterns limit the process window of the group of patterns.

[0054] As shown in Fig. 2, the lithography apparatus LA may form part of a lithographic cell LC, also sometimes referred to a lithocell or cluster, which also includes apparatuses to perform pre- and postexposure processes on a substrate. Conventionally these include one or more spin coaters SC to deposit one or more resist layers, one or more developers to develop exposed resist, one or more chill plates CH and / or one or more bake plates BK. A substrate handler, or robot, RO picks up one or more substrates from input / output port I / Ol, I / O2, moves them between the different process apparatuses and delivers them to the loading bay LB of the lithography apparatus. These apparatuses are under the control of a track control unit TCU which is itself controlled by the supervisory control system SCS, which also controls the lithography apparatus via lithography control unit LACU. Thus, the different apparatuses can be operated to maximize throughput and processing efficiency.

[0055] In order that a substrate that is exposed by the lithography apparatus is exposed correctly and consistently and / or in order to monitor a part of the patterning process (e.g., a device manufacturing process) that includes at least one pattern transfer step (e.g., an optical lithography step), it is desirable to inspect a substrate or other object to measure or determine one or more properties such as alignment, overlay (which can be, for example, between structures in overlying layers or between structures in a same layer that have been provided separately to the layer by, for example, a double patterning process), line thickness, critical dimension (CD), focus offset, a material property, etc. For example, contamination on reticle clamp membranes may adversely affect overlay because clamping a reticle over such contamination will distort the reticle. Accordingly, a manufacturing facility in which lithocell LC is located also typically includes a metrology system that measures some or all of the substrates W (Fig. 1) that have been processed in the lithocell or other objects in the lithocell. The metrology system may be part of the lithocell LC, for example it may be part of the lithography apparatus LA (such as alignment sensor AS (Fig. 1)).

[0056] The one or more measured parameters may include, for example, alignment, overlay between successive layers formed in or on the patterned substrate, critical dimension (CD) (e.g., critical linewidth) of, for example, features formed in or on the patterned substrate, focus or focus error of an optical lithography step, dose or dose error of an optical lithography step, optical aberrations of an optical lithography step, etc. This measurement may be performed on a target of the product substrate itself and / or on a dedicated metrology target provided on the substrate. The measurement can be performed after-development of a resist but before etching, after-etching, after deposition, and / or at other times.

[0057] There are various techniques for making measurements of the structures formed in the patterning process, including the use of a scanning electron microscope, an image -based measurement tool and / or various specialized tools. As discussed above, a fast and non-invasive form of specialized metrology tool is one in which a beam of radiation is directed onto a target on the surface of the substrate2025P00001WQ 12and properties of the scattered (diffracted / reflected) beam are measured. By evaluating one or more properties of the radiation scattered by the substrate, one or more properties of the substrate can be determined. This may be termed diffraction-based metrology. One such application of this diffractionbased metrology is in the measurement of feature asymmetry within a target. This can be used as a measure of overlay, for example, but other applications are also known. For example, asymmetry can be measured by comparing opposite parts of the diffraction spectrum (for example, comparing the -1st and +lstorders in the diffraction spectrum of a periodic grating). Another application of diffractionbased metrology is in the measurement of feature width (CD) within a target.

[0058] Metrology results may be provided directly or indirectly to the supervisory control system SCS. If an error is detected, an adjustment may be made to exposure of a subsequent substrate (especially if the inspection can be done soon and fast enough that one or more other substrates of the batch are still to be exposed) and / or to subsequent exposure of the exposed substrate. Also, an already exposed substrate may be stripped and reworked to improve yield, or discarded, thereby avoiding performing further processing on a substrate known to be faulty. In a case where only some target portions of a substrate are faulty, further exposures may be performed only on those target portions which meet specifications.

[0059] Within a metrology system, a metrology apparatus is used to determine one or more properties of the substrate, and in particular, how one or more properties of different substrates vary, or different layers of the same substrate vary from layer to layer. As noted above, the metrology apparatus may be integrated into the lithography apparatus LA or the lithocell LC or may be a stand-alone device.

[0060] To enable the metrology, one or more targets can be provided on the substrate. In some embodiments, the target is specially designed and may comprise a periodic structure. In some embodiments, the target is a part of a device pattern, e.g., a periodic structure of the device pattern. In some embodiments, the device pattern is a periodic structure of a memory device (e.g., a Bipolar Transistor (BPT), a Bit Line Contact (BLC), etc. structure).

[0061] In some embodiments, the target on a substrate may comprise one or more 1-D periodic structures (e.g., gratings), which are printed such that after development, the periodic structural features are formed of solid resist lines. In some embodiments, the target may comprise one or more 2-D periodic structures (e.g., gratings), which are printed such that after development, the one or more periodic structures are formed of solid resist pillars or vias in the resist. The bars, pillars, or vias may alternatively be etched into the substrate (e.g., into one or more layers on the substrate).

[0062] As lithography nodes keep shrinking, more and more complicated wafer designs may be implemented. Various tools and / or techniques may be used by designers to ensure complex designs are accurately transferred to physical wafers. These tools and techniques may include mask optimization, source mask optimization (SMO), OPC, design for control, and / or other tools and / or techniques. The present systems, and / or methods may be used as stand-alone tools and / or techniques, and / or or used in conjunction with semiconductor manufacturing processes, to enhance the accurate transfer of complex2025P00001WQ 13designs to physical wafers.

[0063] Fig. 3 illustrates additional example portions of a lithography apparatus 300 (e.g., similar to an or the same as lithography apparatus LA shown in Fig. 1). Fig. 3 illustrates a portion of an extreme ultra violet (EUV) lithography apparatus. Fig. 3 illustrates example lithography apparatus components in proximity to a clamp 312 of lithography apparatus 300, including a tool handler 306, and / or other components.

[0064] In some embodiments, tool handler 306 comprises a reticle handler turret gripper, a reticle handler robot gripper (both having associated components for gripping a reticle during transport), and / or other components. The reticle handler robot gripper may, for example, move a reticle from a pod (e.g., after a user places a reticle in the pod and loads the pod into the lithography apparatus). The reticle handler turret gripper may, for example, move a reticle from the reticle handler robot gripper to reticle clamp(s) 312. Lithography apparatus 300 may include various other mechanical components (translation mechanisms, elevation mechanisms, rotational mechanisms, motors, power generation and transmission components, structural components, etc.) configured to facilitate movement and control of reticle 302 through lithography apparatus 300.

[0065] Fig. 4 illustrates another example lithography apparatus 400 (e.g., similar to an or the same as lithography apparatus LA shown in Fig. 1, with components similar to and / or the same as the components of lithography apparatus LA and / or lithography apparatus 300 shown in Fig. 3). A top view of a footprint 414 of apparatus 400 is shown in Fig. 4. Lithography apparatus 400 comprises a loading station 404, a reticle handling system 406, and / or other components. Various components of lithography apparatus 400 may be similar to an or the same as corresponding components of lithography apparatus LA shown in Fig. 1, and / or lithography apparatus 300 shown in Fig. 3.

[0066] Loading station 404 is configured to receive reticles input into lithography apparatus 400. Loading station 404 is located at a location 410 at or near an end of lithography apparatus 400 (corresponding to a patterning device (e.g., reticle) load port 412 (or load ports 412 - two example load ports 412 are shown in Fig. 4)). In lithography apparatus 400, a reticle in an inner pod and an outer pod may be loaded into loading station 404. Reticle handling system 406 includes a first portion 450 configured to move a reticle from loading station 404 to a load port 412, an arm based rotary robot 411 configured to move the reticle from the load port to a load lock 418, and other rotary robots 480 (e.g., a vacuum module with an in vacuum robot, a reticle exchange device robot, or other components) configured to move (e.g., as indicated by arrow 420) the reticles to a reticle clamp 422 such as in a reticle stage 424. A reticle may be held in an outer pod and an inner pod (again noting that the handling system described below may be configured to handle the reticles themselves, reticles in pods, wafers, or other substrates), which may also be known as an EIP or EUV inner POD. The reticle is removed from the outer pod at the load locks 412. The reticle is removed from the inner pod only during transfer to the reticle stage 424. Lithography apparatus may include a portion 460 that operates under atmospheric pressure conditions, and a portion 470 that operates under vacuum conditions, for example,2025P00001WQ 14on either side of load lock 418. Rotary robots 411 and 480 are configured to move reticles between process stations (not specifically illustrated in Fig. 4, but which may be located in various locations across lithography apparatus 400) associated with identification, inspection, storage, alignment, and / or using a reticle for lithography in lithography apparatus 400. The robots 411 and 480 are also used to deliver reticles to and from internal storage. The rotary robots 411 and 480 occupy large volumes of space and only handle one reticle at a time (e.g., a single reticle handling path through lithography apparatus 400). The large volumes and single reticle handling path create a bottleneck that limits the potential throughput in lithography apparatus 400.

[0067] Fig. 5 illustrates a semiconductor substrate handling system 500. Fig. 5 illustrates a top view of system 500. System 500 comprises a track 502, a plurality of substrate holders 504 coupled to track 502, a controller 506, and / or other components. System 500 may be used as a standalone system, in a lithography apparatus similar to and / or the same as lithography apparatus 400 shown in Fig. 4 to replace rotary robots 480, and / or in other apparatuses that require substrate handling. In this example, system 500 is a reticle handling system of lithography apparatus 400 from Fig. 4, the substrates 512 are reticles, and track 502 is configured to operate in portion 470 of lithography apparatus 400, under vacuum conditions. Features that allow this system to operate in the vacuum are its general non-contact configuration with passive moving substrate holders, which provides a high level of cleanliness and avoids the complication of moving cables and hoses, for example. Active components such as coils and cooling components such as water are isolated and kept either in a dirty vacuum portion of the system, or in a portion of the system that is under atmospheric pressure. Note that many existing systems are not vacuum compatible like this. Fig. 5 shows various components of system 500 in relation to one or more components of apparatus 400 from Fig. 4. As shown in Fig. 5, substrate holders 504 are configured to move the reticles (substrates 512) along one or more paths 508 from a load lock 418, through a plurality of process stations 510, to reticle stage 424 of lithography apparatus 400.

[0068] Track 502 comprises one or more paths 508 through the plurality of process stations 510. The plurality of process stations 510 comprise process stations associated with identification, inspection, storage, alignment, and / or use of reticles (e.g., substrates 512) in lithography apparatus 400 (Fig. 4). Use of a reticle may comprise patterning a layer of a semiconductor wafer with a pattern from the reticle during a lithography exposure in lithography apparatus 400, for example. One or more paths may include one path, two paths, 10 paths, 100 paths, 1000 paths, etc. Paths 508 comprise routes a substrate holder 504 might take through the plurality of process stations 510. In the example shown in Fig. 5, paths 508 may comprise various combinations of left, right, up, and down movements along track 502. Left and right movements in this example might carry a substrate holder 504 back and forth from one process station 510 to another, while up and down movements (according to the planar page orientation of this particular top view) might carry the substrate holder into and out of a particular process station 510. These movements may occur in any combination and in any order (resulting in thousands of different possible paths 508) that facilitates relative motion between the plurality of substrate holders2025P00001WQ 15504 to cause each substrate holder 504 to move along the one or more paths 508 through the plurality of process stations 510 independently of other substrate holders 504, with one or more of directions, ranges, and speeds for each substrate holder 504 that vary according to processing instructions, and track position relative to the other substrate holders 504 and the plurality of process stations 510. In Fig. 5, track 502 comprises two (though track 502 could be configured with more) parallel processing paths 508 for parallel processing of two or more substrates 512 (e.g., reticles) in the plurality of processing stations 510.

[0069] As shown in Fig. 5, track 502 may comprise a linear stage. As part of the linear stage, track 502 may comprise one or more horizontal axes 520 (Fig. 5 shows two example horizontal axes 520) for relatively long stroke movement (e.g., movement between two or more process stations 510). In some embodiments, track 502 comprises one or more additional components 580 (e.g., coils, magnets, motors, wheels, bearings, electrical connectors, wiring, springs, capacitors, etc.) configured to cause the plurality of substrate holders 504 to move with relatively long strokes along the one or more paths 508 to facilitate the one or more operations at the plurality of process stations 510. For example, one or more passive magnets of the Lorentz actuator may be located on a substrate holder 504, with one or more coils of the Lorentz actuator located along track 502.

[0070] In some embodiments, track 502 may be used to move a substrate holder 504 in x, y, z, Rx, Ry, and / or Rz directions (with R indicating rotation) using one or more of the actuators described herein. In some embodiments, track 502 may facilitate coarse motion of a substrate holder 504, and additional mechanisms on a substrate holder 504 function as short stroke stage (see actuators 590 described below). In some embodiments, the plurality of substrate holders 504 comprise shuttles and / or other components coupled to the linear stage. The shuttles may move back and forth along the horizontal axes 520, for example, between entries to an exits from process stations 510.

[0071] Substrate holders 504 are coupled to track 502. Each substrate holder 504 is configured to receive and hold a substrate 512 (e.g., a reticle), and move the substrate 512 along the one or more paths 508 through the plurality of process stations 510 to enable the substrate 512 to be processed. This movement may have up to six degrees of freedom (e.g., x, y, z, Rx, Ry, Rz). In some embodiments, the number of substrate holders 504 corresponds to the number of process stations 510. In some embodiments, the number of substrate holders 504 is more or less than the number of process stations 510. Note that in Fig. 5, every substrate holder is shown as holding a substrate 512. This does not necessarily need to be true (and in fact likely would not be true during normal processing with lithography apparatus 400 (Fig. 4) and semiconductor substrate handling system 500). Instead, one or only some of the substrate holders 504 may receive and hold a substrate 512.

[0072] In some embodiments, each of the plurality of substrate holders may comprise a generally planar surface, configured to receive substrates 512 of different sizes. For example, the size of a substrate 512 reticle may be 6” x 6”, 6” x 11.4”, 6” x 12”, or other sizes (noting that these are just three possibilities of many different sizes). In some embodiments, each of the plurality of substrate holders2025P00001WQ 16504 comprises a releasable clamp, chuck and / or another retention mechanism configured to receive and hold a substrate 512, and move the substrate 512 along the one or more paths 508 through the plurality of process stations 510. These retention mechanisms may be electrically and / or magnetically based, vacuum based, mechanically based, and / or rely on other types of retention mechanisms. For example, a substrate holder 504 may include one or more magnets configured to attract one or more corresponding magnets elements on a reticle (substrate 512). As another example, a substrate holder 504 may include a mechanical clamp configured to grab and hold one or more edges of a reticle.

[0073] The plurality of substrate holders 504 are configured to be moveable in different directions on paths 508. Substrate holders 504 may be configured to move along paths 508, and in horizontal, vertical, and / or rotational directions relative to the one or more paths 508. This movement may be facilitated via an actuator 590 associated with each substrate holder, for example, and / or other components. In some embodiments, each substrate holder 504 comprises a short stroke actuator 590 configured to cause a substrate holder 504 to move a substrate 512 with relatively short strokes to facilitate one or more operations at the plurality of process stations 510. Each substrate holder 504 may be configured such that the short strokes are along the one or more paths 508 of track 502; and / or in horizontal, vertical, and / or rotational in directions relative to the one or more paths 508 and / or one or more of the plurality of process stations 510. In some embodiments, the short stroke actuator 590 comprises a contactless actuator, one or more activation coils, one or more air bearings, a mechanical wheel, a magnetic bearing, a motor, electrical components, a coil and magnet combination, a wired and / or wireless communication device, a sliding bearing, a rotating bearing, a capacitor, a spring, optical data transfer components, and / or other components.

[0074] In some embodiments, system 500 comprises a gripper 550 configured to grip and move a substrate 512 (e.g., a reticle) from a load lock 418 onto a substrate holder 504. Assuming substrate 512 is a reticle or a reticle pod, for example, the reticle is still in the inner pod at this point. Gripper 550 may include a movement arm, various mechanical components for translation, elevation, rotation, power generation and transmission, structural components, etc. Gripper 550 may be configured to move in x, y, z, rotational, and / or other directions. Gripper 550 is configured to transfer a reticle (substrate 512) from a load lock 418 to a substrate holder 504 within the vacuum environment of portion 470 of lithography apparatus 400 (Fig. 4). Gripper 550 may be configured with various designs and materials to ensure precise and secure handling of reticles. For example, gripper 550 may comprise one or more mechanical arms with end-effectors (e.g., the component that interacts directly with the object being handled, makes contact with the reticle, and / or secures the reticle for movement) configured with pads and / or other components configured to prevent damage to a reticle surface. In some embodiments, gripper 550 may include vacuum-based suction mechanisms to achieve contactless handling, reducing the risk of contamination or mechanical stress. Electrostatic clamping techniques may also be employed, using electrodes to generate a holding force that securely grips a reticle while accommodating different substrate sizes and shapes. In some embodiments, gripper 550 may be constructed from low-outgassing2025P00001WQ 17materials, such as stainless steel, titanium alloys, etc., to maintain the cleanliness of the vacuum environment. Gripper 550 may also include sensors, such as optical or force sensors, to monitor the positioning and condition of a reticle during transfer, ensuring alignment precision and operational safety. In some embodiments, gripper 550 may include active or passive vibration isolation and / or damping components.

[0075] In some embodiments, track 502 may be configured to couple directly with a load lock 418, such that a gripper 550 is not necessary for transferring a reticle to a substrate holder. For example, one or more components that accomplish the functionality of gripper 550 may be mounted directly to and / or included in a substrate holder 504.

[0076] In some embodiments, system 500 comprises a lift 560 configured to lift and / or otherwise move a substrate 512 (e.g., a reticle) from a substrate holder 504 to reticle stage 424. Lift 560 may comprise a vertically movable platform 562, arms, and / or other components. Lift 560 may comprise separate x and y movement direction shuttles 564 and 566, a loading station configured to couple to platform 562 and move in a z (e.g., vertical) direction, etc. Some or all of these components may be configured to rotate in one or more directions to facilitate transfer of a substrate 512 to reticle stage 424 and / or clamp 422.

[0077] These components may be driven by one or more actuators, such as a motor, a precision stepper motor, piezoelectric actuator, and / or other actuators, to achieve fine positional control. The platforms, arms, shuttles, and / or other components may include reticle-supporting surfaces, end-effectors, and / or other components configured with burls, pads, low-friction coatings, and / or other features configured to protect the reticle from damage during lifting. Lift 560 may also incorporate vacuum, electrostatic, and / or other gripping components configured to stabilize a reticle (a substrate 512) during movement. To ensure smooth and vibration-free operation, for example, lift 560 may include linear guides, air bearings, and / or other components along its vertical axis. Additionally, sensors such as optical encoders, capacitive proximity sensors, load cells, etc. may be integrated into lift 560 and configured to monitor a reticle’s position and / or orientation during the lifting process, ensuring precise alignment with reticle clamp 422. The mechanism may be constructed from rigid, thermally stable materials, configured to minimize deformation and maintain alignment accuracy under operational conditions, for example.

[0078] Controller 506 is operatively coupled to track 502 and the plurality of substrate holders 504. Controller 506 is configured to control relative motion between the plurality of substrate holders 504 to cause each substrate holder 504 to move along the one or more paths 508 through the plurality of process stations 510 independently of other substrate holders 504, with one or more of directions, ranges, and speeds for each substrate holder 504 that vary according to processing instructions, and track position relative to the other substrate holders 504 and the plurality of process stations 510. For example, movement of a substrate holder 504 may be controlled in concert with a timing of processing at a process station 510, movement of other substrate holders 504, and / or other activities. As another example, controller 506 and the plurality of substrate holders 504 may be configured such that one or2025P00001WQ 18more operations at the plurality of process stations 510 are performed while a given substrate holder 504 is stopped, and others of the plurality of substrate holders 504 are moving.

[0079] Controller 506 may be configured to control substrate holders 504, the process stations 510, and / or other components of system 500 based on output signals from track 502, substrate holders 504, and / or process stations 510, and / or other information. For example, track 502, substrate holders 504, process stations 510, and / or other components may include one or more position and / or motion sensors. Motion sensors may include accelerometers, vibration sensors, gyroscopes, location sensors, encoders, etc. Process sensors may include timers, location sensors, placement sensors, inspection devices, temperature sensors, radiation sensors, level sensors, force sensors, gas sensors, etc. These are representative examples only (i.e., a motion sensor and / or a process sensor may not be shown in a certain location in Fig. 5 for space saving reasons, even though there may many of these sensors associated with substrate holders 504 and / or track 502, and many more sensors may be associated with each process station 510. These and / or other sensors may generate any number and / or type of output signals that may be used by controller 506 to control system 500. Controller 506 is configured to generate one or more control signals for controlling various components of system 500 based on these (feedback) signals, and / or other information. Control by controller 506 may include adjustments made based on positions of various substrate holders 504 on track 502; speeds of substrate holders; timing requirements for individual processing stations 510; acceleration of substrate holders; jerk, snap, crackle, and / or pop of substrate holders; and / or other information, for example. The controlling may be performed with one or more processors and / or other components of controller 506 (see Fig. 9 and computer system 900 described below for further explanation related to the one or more processors). In some embodiments, controller 506, substrate holders 504, track 502, and / or other components of system 500 comprise a transmitter and / or other components configured to transmit and / or receive signals to and / or from controller 506 to cause system 500 to operate as described.

[0080] In some embodiments, controller 506 is configured such that an operating speed of each one the substrate holders 504 can be individually controlled. In some embodiments, controller 506 is configured such that substrate holders 504 move at a constant speed. In some embodiments, substrate holders 504 may be controlled to move at different speeds in different portions of track 502. In some embodiments, controller 506 and the plurality of substrate holders 504 are configured such that one or more operations at the plurality of process stations 510 are performed while a given substrate holder 504 is moving. The moving may be controlled in concert with a timing of processing at a process station, for example. In some embodiments, controller 506 and the plurality of substrate holders 504 are configured such that one or more operations at the plurality of process stations 510 are performed while a given substrate holder 504 is stopped (e.g., does not move with respect to a process station), and others of the plurality of substrate holders 504 are moving (with respect to the process station). For example, controller 506 may be configured to optimize movements of substrate holders 504 throughout the process stations 510 of system 500 to enhance throughput, and / or for other reasons. This2025P00001WQ 19optimization may be based on the process time required at each individual process station 510, and / or other information.

[0081] In some embodiments, controller 506 and / or other components of system 500 communicate unidirectionally and / or bidirectionally with each other and / or other devices such as mobile user devices, a desk-top user device, external resources such as a server, and / or other devices. Each of these devices may communicate wirelessly and / or via wires. For example, each of these devices may communicate via a network, such as the Internet or the Internet in combination with various other networks, like local area networks, cellular networks, Wi-Fi networks, or personal area networks. Mobile user devices may be smart phones, tablets, or other hand-held networked computing devices having a display, a user input device (e.g., buttons, keys, voice recognition, or a single or multi-touch touchscreen), memory (such as a tangible, machine -readable, non-volatile memory), a network interface, a portable energy source (e.g., a battery), and a processor (a term which, as used herein, includes one or more processors) coupled to each of these components. The memory of mobile user devices may store instructions that when executed by the associated processor provide an operating system and various applications, including a web browser or a native mobile application. A desktop user device may also include a web browser, for example. In addition, a desktop user device may include a monitor; a keyboard; a mouse; memory; a processor; and a tangible, non-transitory, machine-readable memory storing instructions that when executed by the processor provide an operating system and the web browser. Native applications and web browsers, in some embodiments, are operative to provide a graphical user interface associated with a user, for example, which communicates with controller 506 and / or other components of system 500 and facilitates user interaction with data from system 500.

[0082] External resources, in some embodiments, include sources of information such as databases, websites, etc.; external entities participating with system 500; one or more servers outside of the system 500; a network (e.g., the internet); electronic storage; equipment related to Wi-Fi ™ technology; equipment related to Bluetooth® technology; data entry devices; or other resources. In some implementations, some or all of the functionality attributed herein to external resources may be provided by resources included in system 500. External resources may be configured to communicate with one or more components of system 500 via wired and / or wireless connections, via a network (e.g., a local area network and / or the internet), via cellular technology, via Wi-Fi technology, and / or via other resources.

[0083] Fig. 6 illustrates another semiconductor substrate handling system 600. Eike system 500 shown in Fig. 5, substrate handling system 600 may be used as a standalone system, in a lithography apparatus similar to and / or the same as lithography apparatus 400 shown in Fig. 4 to replace rotary robots 480, and / or in other apparatuses that require substrate handling. For example, in Fig. 6, various components of system 600 are shown in relation to one or more components of apparatus 400 from Fig. 4 (and similar and / or the same components of system 500). System 600 comprises a track 602, a plurality of substrate holders 604 coupled to track 602, controller 506, and / or other components. In this example,2025P00001WQ 20system 600 is again a reticle handling system of lithography apparatus 400 from Fig. 4, the substrates 512 are reticles, and track 602 is configured to operate in portion 470 of lithography apparatus 400, under vacuum conditions. System 600 may have similar components to system 500 shown in Fig. 5 that allow it to be vacuum environment compatible.

[0084] As shown in Fig. 6, substrate holders 604 are configured to move the reticles (substrates 512) along one or more paths 608 from a load lock 418, through a plurality of process stations 510, to reticle stage 424 of lithography apparatus 400. Note that in this example, for illustration, not every substrate holder 604 holds a substrate 512, and the number of substrate holders 604 does not correspond to the number of process stations 510. Other variations are contemplated.

[0085] Track 602 comprises one or more paths 608 through the plurality of process stations 510. The plurality of process stations 510 may again comprise process stations associated with identification, inspection, storage, alignment, and / or use of reticles (e.g., substrates 512) in lithography apparatus 400 (Fig. 4). One or more paths 608 may include one path, two paths, 10 paths, 100 paths, 1000 paths, etc. Paths 608 comprise routes a substrate holder 504 might take through the plurality of process stations 510. In the example shown in Fig. 6, paths 608 may comprise various combinations of left, right, up, down, curving, and / or other movements 605 across track 602. In some embodiments, track 602 is configured such that movement 605 of a substrate holder 604 may be in x, y, z, Rx, Ry, and / or Rz directions. These movements 605 may occur in any combination and in any order (resulting in thousands of different possible paths 608) that facilitates relative motion between the plurality of substrate holders 604 to cause each substrate holder 604 to move along the one or more paths 608 through the plurality of process stations 510 independently of other substrate holders 604, with one or more of directions, ranges, and speeds for each substrate holder 604 that vary according to processing instructions, and track position relative to the other substrate holders 604 and the plurality of process stations 510.

[0086] In Fig. 6, track 602 comprises a magnetic levitation stage. The magnetic levitation stage has multiple parallel processing paths 608 for parallel processing of two or more substrates 512 (e.g., reticles) in the plurality of processing stations 510. For example, a given substrate holder 604 may be controlled (by controller 506 and the magnetic levitation stage) to take almost any different route across the surface of the magnetic levitation stage. The magnetic levitation stage is a precision positioning platform that utilizes magnetic forces to achieve non-contact movement and support of substrate holders 604. The stage is equipped with magnets and electromagnetic coils that generate controlled magnetic fields, enabling levitation and smooth, frictionless motion along multiple axes. Sensors, such as laser interferometers or encoders, may be configured to provide real-time feedback to controller 506, ensuring nanometer-level accuracy in positioning. The absence of mechanical contact eliminates wear, reduces particle generation, and enhances the cleanliness of the environment, making it ideal for applications like semiconductor lithography. Additionally, the stage's design can be optimized for highspeed operation and vibration isolation, further improving throughput and performance in advanced2025P00001WQ 21manufacturing processes.

[0087] Substrate holders 604 are also configured to receive and hold substrates 512. Each substrate holder 604 is configured to receive and hold a substrate 512 (e.g., a reticle), and move the substrate 512 along the one or more paths 608 through the plurality of process stations 510 to enable the substrate 512 to be processed. In some embodiments, each of the plurality of substrate holders 604 may comprise a generally planar surface, configured to receive substrates 512 of different sizes (e.g., as described above). In some embodiments, each of the plurality of substrate holders 604 comprises a releasable clamp, chuck and / or another retention mechanism configured to receive and hold a substrate 512, and move the substrate 512 along the one or more paths 608 through the plurality of process stations 510. These retention mechanisms may be electrically and / or magnetically based, mechanically based, and / or rely on other types of retention mechanisms. For example, a substrate holder 504 may include one or more magnets configured to attract one or more corresponding magnets elements on a reticle (substrate 512). As another example, a substrate holder 504 may include a mechanical clamp configured to grab and hold one or more edges of a reticle.

[0088] The plurality of substrate holders 604 are configured to be moveable in different directions on paths 608. Substrate holders 604 may be configured to move along the one or more paths 608, and in horizontal, vertical, and / or rotational directions relative to the one or more paths 608. This movement may be facilitated via a contactless actuator 690 associated with each substrate holder 604, and / or other components. For example, in some embodiments, track 602 comprises the magnetic levitation stage described above, and the contactless actuator comprises a magnet. The plurality of substrate holders 604 comprise magnetic levitation pucks with actuators 690 configured to magnetically levitate above the stage. While levitating, each puck may move in any number different directions (along any number of paths 608), one or more at a time, up to and including movement of all pucks at the same time (e.g., in and out of different process stations 510, between process, stations 510, etc.).

[0089] As described above, the plurality of process stations 510 comprise process stations associated with identification, inspection, storage, alignment, use of the reticle in the lithography apparatus, and / or other operations. Fig. 6 illustrates an example process station 510 - 1 associated with storage. (In this application, storage can be broadly considered to be a process associated with semiconductor lithography and / or other operations). Fig. 6 illustrates a side view of a multi-shelf style storage apparatus (e.g., a library) configured to store reticles (substrates 512) in their inner pods (EIP) in this example. The apparatus includes a motor base 625, a carrier 627, a gripper 629 (which may be similar to and share some of the functionality of other grippers described herein), and / or other components configured to transfer a reticle from a substrate holder 604 to a shelf (with the shelf mechanism configured to move up and down to receive different reticles on different shelves).

[0090] As shown in Fig. 6, system 600 may again comprise controller 506, gripper 550, lift 560, and / or other components (which function similar to or the same as described above, but in system 600).

[0091] As noted above, despite the discussion above related to reticles, the semiconductor substrate2025P00001WQ 22handling systems 500 and / or 600 may be wafer handling systems of a lithography apparatus (e.g., lithography apparatus 400 shown in Fig. 4). The substrates 512 may be semiconductor wafers, and the tracks 502 and / or 602 may be configured to operate under atmospheric pressure in the lithography apparatus. In these embodiments, the plurality of process stations may comprise process stations 510 associated with inspection, cleaning, alignment, patterning, and / or bonding of the semiconductor wafers, for example.

[0092] Fig. 7 illustrates example lift 560 for semiconductor substrate handling systems 500 and 600 shown in Fig. 5 and Fig. 6. As described above, lift 560 is configured to lift and / or otherwise move a substrate 512 (e.g., a reticle - see Fig. 5 and Fig. 6) from a substrate holder 504 (Fig. 5) or 604 (Fig. 6) to reticle stage 424 (see Fig. 4, 5, and 6). Lift 560 may comprise a reticle exchange device (RED), for example, in lithography apparatus 400 (Fig. 4). Lift 560 may comprise a vertically movable platform 562, arms, and / or other components. Some or all of these components may be configured to rotate in one or more directions to facilitate transfer of a substrate 512 to reticle stage 424 and / or clamp 422. Lift 560 may comprise separate x and y movement direction shuttles 564 and 566 (e.g., two independent x and y modules - on one side and the other of lift 560 shown in Fig. 7), a loading station 700 configured to couple to platform 562 and move in a z (e.g., vertical) direction, a transfer station 702 configured to receive substrates 512 and return substrates to substrate holders 504 and / or 604, and transfer rails 704 (noting that rails are one possible example component that may be used for an application like this) running therebetween. Fig. 7 illustrates possible patterns of movement 750, shown various movements that may facilitate loading / unloading 752 of a reticle (substrate 512) from a substrate holder, to loading / unloading 754 of a reticle from the reticle stage, and vice versa (e.g., back and forth along transfer rails 704). In some embodiments, a reticle (substrate 512) is transferred from a substrate holder 504 to lift 560, and from lift 560 to the reticle stage / clamp. In some embodiments, the reticle may remain on a substrate holder, and the substrate holder may move or be moved into the clamping position.

[0093] Fig. 8 illustrates a substrate handling method 800. In some embodiments, one or more operations of method 800 may be controlled by one or more processors and / or a computing system, as described below (see Fig. 9). The operations of method 800 presented below are intended to be illustrative. In some embodiments, method 800 may be accomplished with one or more additional operations not described, and / or without one or more of the operations discussed. Additionally, the order in which the operations of method 800 are illustrated in Fig. 8 and described below is not intended to be limiting.

[0094] In some embodiments, one or more operations of method 800 may be implemented in and / or controlled by one or more processing devices (e.g., a digital processor, an analog processor, a digital circuit designed to process information, an analog circuit designed to process information, a state machine, and / or other mechanisms for electronically processing information, as described with respect to Fig. 9 below). The one or more processing devices may include one or more devices executing some or all of the operations of method 800 in response to instructions stored electronically on an electronic2025P00001WQ 23storage medium. The one or more processing devices may include one or more devices configured through hardware, firmware, and / or software to be specifically designed for execution of one or more of the operations of method 800 (e.g., see discussion related to Fig. 9 below). For example, the one or more processing devices may run software configured to control a handling system to move a substrate such as a reticle from a loading station to a holder of a lithography apparatus, control lithography operations, and / or perform other operations.

[0095] Operation 802 comprises providing one or more paths (e.g., paths 508 shown in Fig. 5 and / or paths 608 shown in Fig. 6) through a plurality of process stations with a track (e.g., track 502 shown in Fig. 5 and / or track 602 shown in Fig. 6). Operation 804 comprises coupling a plurality of substrate holders (e.g., substrate holders 504 shown in Fig. 5 and / or substrate holders 604 shown in Fig. 6) to the track. Each substrate holder is configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations to enable the substrate to be processed. Operation 806 comprises controlling, with a controller (e.g., controller 506 shown in Fig. 5 and Fig. 6) operatively coupled to the track and the plurality of substrate holders, relative motion between the plurality of substrate holders. Controlling the relative motion causes each substrate holder to move along the one or more paths through the plurality of process stations independently of other substrate holders, with one or more of directions, ranges, and speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations.

[0096] In some embodiments, the track comprises a linear stage, and the plurality of substrate holders comprise shuttles coupled to the linear stage. In some embodiments, the track comprises one or more horizontal axes for relatively long stroke movement.

[0097] In some embodiments, each substrate holder is configured to move along the one or more paths, and in horizontal, vertical, and / or rotational directions relative to the one or more paths via a contactless actuator associated with each substrate holder.

[0098] In some embodiments, the track comprises a magnetic levitation stage, the contactless actuator comprises a magnet, and the plurality of substrate holders comprise magnetic levitation pucks configured to magnetically levitate above the stage.

[0099] In some embodiments, the track comprises multiple paths. The plurality of substrate holders are configured to be moveable in different directions on the multiple paths. For example, the track may comprise two or more parallel processing paths for parallel processing of two or more substrates in the plurality of processing stations. Movement of a substrate holder is controlled in concert with a timing of processing at a process station and / or movement of other substrate holders.

[0100] In some embodiments, the controller and the plurality of substrate holders are configured such that one or more operations at the plurality of process stations are performed while a given substrate holder is stopped, and others of the plurality of substrate holders are moving.

[0101] In some embodiments, a number of the plurality of substrate holders corresponds to a number2025P00001WQ 24of the process stations. In some embodiments, a number of the plurality of substrate holders is more than a number of the process stations.

[0102] In some embodiments, the semiconductor substrate handling system is a reticle handling system of a lithography apparatus, the substrate is a reticle, and the track is configured to operate in a vacuum environment of the lithography apparatus. The substrate holder may be configured to move the reticle along the one or more paths from a load lock of the reticle handling system, through the plurality of process stations, to a reticle stage of the lithography apparatus, for example.

[0103] In some embodiments, the system comprises a gripper configured to grip and move the reticle from the load lock onto the substrate holder, and / or a lift configured to lift the reticle from the substrate holder to the reticle stage.

[0104] In some embodiments, the plurality of process stations comprise process stations associated with identification, inspection, storage, alignment, and / or use of the reticle in the lithography apparatus. Use of the reticle comprises patterning a layer of a semiconductor wafer with a pattern from the reticle during a lithography exposure in the lithography apparatus, for example. In some embodiments, the reticle is a 6” x 6”, 6” x 11.4”, or 6” x 12” (these are just representative possible example dimensions) reticle, and / or reticles of other sizes.

[0105] In some embodiments, the semiconductor substrate handling system is a wafer handling system of a lithography apparatus, the substrate is a semiconductor wafer, and the track is configured to operate under atmospheric pressure in the lithography apparatus. In some embodiments, the plurality of process stations comprise process stations associated with inspection, cleaning, alignment, patterning, and / or bonding of the semiconductor wafer.

[0106] In some embodiments, each substrate holder comprises a short stroke actuator configured to cause a substrate holder to move a substrate with relatively short strokes to facilitate one or more operations at the plurality of process stations. Each substrate holder may be configured such that the short strokes are along the one or more paths of the track; and / or in horizontal, vertical, and / or rotational in directions relative to the one or more paths and / or one or more of the plurality of process stations. In some embodiments, the short stroke actuator comprises a contactless actuator, one or more activation coils, one or more air bearings, a mechanical wheel, a magnetic bearing, a motor, electrical components, a wired and / or wireless communication device, a sliding bearing, a rotating bearing, a capacitor, a spring, optical data transfer components, and / or other components.

[0107] In some embodiments, the track comprises one or more additional components configured to cause the plurality of substrate holders to move with relatively long strokes along the one or more paths to facilitate the one or more operations at the plurality of process stations.

[0108] In some embodiments, each of the plurality of substrate holders comprises a chuck configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations.

[0109] Fig. 9 is a block diagram that illustrates a computer system 900 that can assist in implementing2025P00001WQ 25the methods, flows, or the systems disclosed herein. Computer system 900 may be included in and / or electronically coupled to a lithography apparatus (e.g., lithography apparatus LA shown in Fig. 1, lithography apparatus 400 shown in Fig. 4), a semiconductor substrate handling system (e.g., systems 500 and / or 600 shown in Fig. 5 and Fig. 6), and / or other components. Computer system 900 includes a bus 902 or other communication mechanism for communicating information, and a processor 904 (or multiple processors 904, 905, etc.) coupled with bus 902 for processing information. Computer system 900 also includes a main memory 906, such as a random access memory (RAM) or other dynamic storage device, coupled to bus 902 for storing information and instructions to be executed by processor 904. Main memory 906 also may be used for storing temporary variables or other intermediate information during execution of instructions to be executed by processor 904. Computer system 900 further includes a read only memory (ROM) 908 or other static storage device coupled to bus 902 for storing static information and instructions for processor 904. A storage device 910, such as a magnetic disk or optical disk, is provided and coupled to bus 902 for storing information and instructions.

[0110] Computer system 900 may be coupled via bus 902 to a display 912, such as a flat panel or touch panel display for displaying information to a computer user. An input device 914, including alphanumeric and other keys, is coupled to bus 902 for communicating information and command selections to processor 904. Another type of user input device is cursor control 916, such as a mouse, a trackball, or cursor direction keys for communicating direction information and command selections to processor 904 and for controlling cursor movement on display 912. This input device typically has two degrees of freedom in two axes, a first axis (e.g., x) and a second axis (e.g., y), that allows the device to specify positions in a plane. A touch panel (screen) display may also be used as an input device.

[0111] In some embodiments, portions of one or more flows and / or methods described herein (e.g., controlling one or more substrate holders) may be performed by computer system 900 in response to processor 904 executing one or more sequences of one or more instructions contained in main memory 906. Such instructions may be read into main memory 906 from another computer-readable medium, such as storage device 910. Execution of the sequences of instructions contained in main memory 906 causes processor 904 to perform the flows and / or process steps described herein. One or more processors in a multi-processing arrangement may also be employed to execute the sequences of instructions contained in main memory 906. In an alternative embodiment, hard-wired circuitry may be used in place of or in combination with software instructions. Thus, the description herein is not limited to any specific combination of hardware circuitry and software.

[0112] The term “computer-readable medium” or “machine readable medium” refers to any medium that participates in providing instructions to processor 904 for execution. Such a medium may take many forms, including but not limited to, non-volatile media, volatile media, and transmission media. Non-volatile media include, for example, optical or magnetic disks, such as storage device 910. Volatile media include dynamic memory, such as main memory 906. Transmission media include coaxial cables, copper wire and fiber optics, including the wires that comprise bus 902. Transmission media can also2025P00001WQ 26take the form of acoustic or light waves, such as those generated during radio frequency (RF) and infrared (IR) data communications. Common forms of computer-readable media include, for example, a floppy disk, a flexible disk, hard disk, magnetic tape, any other magnetic medium, a CD-ROM, DVD, any other optical medium, punch cards, paper tape, any other physical medium with patterns of holes, a RAM, a PROM, and EPROM, a FLASH-EPROM, any other memory chip or cartridge, a carrier wave as described hereinafter, or any other medium from which a computer can read.

[0113] Various forms of computer readable media may be involved in carrying one or more sequences of one or more instructions to processor 904 for execution. For example, the instructions may initially be borne on a magnetic disk of a remote computer. The remote computer can load the instructions into its dynamic memory and send the instructions over a network such as the internet. Bus 902 can receive the data. Bus 902 carries the data to main memory 906, from which processor 904 retrieves and executes the instructions. The instructions received by main memory 906 may optionally be stored on storage device 910 either before or after execution by processor 904.

[0114] Computer system 900 may also include a communication interface 918 coupled to bus 902. Communication interface 918 provides a two-way data communication coupling to a network link 920 that is connected to a local network 922. Wired and / or wireless links may be implemented. In any such implementation, communication interface 918 sends and receives electrical, electromagnetic, or optical signals that carry digital data streams representing various types of information.

[0115] Network link 920 typically provides data communication through one or more networks to other data devices. For example, network link 920 may provide a connection through local network 922 to a host computer 924 or to data equipment operated by an Internet Service Provider (ISP) 926. ISP 926 in turn provides data communication services through the worldwide packet data communication network (the Internet 928). Local network 922 and Internet 928 both use electrical, electromagnetic, or optical signals that carry digital data streams. The signals through the various networks and the signals on network link 920 and through communication interface 918, which carry the digital data to and from computer system 900, are exemplary forms of carrier waves transporting the information.

[0116] Computer system 900 can send messages and receive data, including program code, through the network(s), network link 920, and communication interface 918. In the Internet example, a server 930 might transmit a requested code for an application program through Internet 928, ISP 926, local network 922 and communication interface 918. One such downloaded application may provide all or part of a method described herein, for example. The received code may be executed by processor 904 as it is received, and / or stored in storage device 910, or other non-volatile storage for later execution. In this manner, computer system 900 may obtain application code in the form of a carrier wave.

[0117] Various embodiments of the present systems and methods are disclosed in the subsequent list of numbered clauses:1. A semiconductor substrate handling system, comprising: a track comprising one or more paths through a plurality of process stations; a plurality of substrate holders coupled to the track, each2025P00001WQ 27substrate holder configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations to enable the substrate to be processed; and a controller operatively coupled to the track and the plurality of substrate holders, the controller configured to control relative motion between the plurality of substrate holders to cause each substrate holder to move along the one or more paths through the plurality of process stations independently of other substrate holders, with one or more of directions, ranges, and speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations.2. The system of clause 1 , wherein the track comprises a linear stage, and the plurality of substrate holders comprise shuttles coupled to the linear stage.3. The system of any of the previous clauses, wherein the track comprises one or more horizontal axes for relatively long stroke movement.4. The system of any of the previous clauses, wherein each substrate holder is configured to move along the one or more paths, and in horizontal, vertical, and / or rotational directions relative to the one or more paths via a contactless actuator associated with each substrate holder.5. The system of any of the previous clauses, wherein the track comprises a magnetic levitation stage, the contactless actuator comprises a magnet, and the plurality of substrate holders comprise magnetic levitation pucks configured to magnetically levitate above the stage.6. The system of any of the previous clauses, wherein the track comprises multiple paths.7. The system of any of the previous clauses, wherein the plurality of substrate holders are configured to be moveable in different directions on the multiple paths.8. The system of any of the previous clauses, wherein the track comprises two or more parallel processing paths for parallel processing of two or more substrates in the plurality of processing stations.9. The system of any of the previous clauses, wherein movement of a substrate holder is controlled in concert with a timing of processing at a process station and / or movement of other substrate holders.10. The system of any of the previous clauses, wherein the controller and the plurality of substrate holders are configured such that one or more operations at the plurality of process stations are performed while a given substrate holder is stopped, and others of the plurality of substrate holders are moving.11. The system of any of the previous clauses, wherein a number of the plurality of substrate holders corresponds to a number of the process stations.12. The system of any of the previous clauses, wherein a number of the plurality of substrate holders is more than a number of the process stations.13. The system of any of the previous clauses, wherein the semiconductor substrate handling system is a reticle handling system of a lithography apparatus, the substrate is a reticle, and the track is configured to operate in a vacuum environment of the lithography apparatus.14. The system of any of the previous clauses, wherein the substrate holder is configured to move the reticle along the one or more paths from a load lock of the reticle handling system, through the plurality2025P00001WQ 28of process stations, to a reticle stage of the lithography apparatus.15. The system of any of the previous clauses, further comprising a gripper configured to grip and move the reticle from the load lock onto the substrate holder, and / or a lift configured to lift the reticle from the substrate holder to the reticle stage.16. The system of any of the previous clauses, wherein the plurality of process stations comprise process stations associated with identification, inspection, storage, alignment, and / or use of the reticle in the lithography apparatus.17. The system of any of the previous clauses, wherein use of the reticle comprises patterning a layer of a semiconductor wafer with a pattern from the reticle during a lithography exposure in the lithography apparatus.18. The system of any of the previous clauses, wherein the reticle is a 6” x 6”, 6” x 11.4”, or 6” x 12” reticle.19. The system of any of the previous clauses, wherein the semiconductor substrate handling system is a wafer handling system of a lithography apparatus, the substrate is a semiconductor wafer, and the track is configured to operate under atmospheric pressure in the lithography apparatus.20. The system of any of the previous clauses, wherein the plurality of process stations comprise process stations associated with inspection, cleaning, alignment, patterning, and / or bonding of the semiconductor wafer.21. The system of any of the previous clauses, wherein each substrate holder comprises a short stroke actuator configured to cause a substrate holder to move a substrate with relatively short strokes to facilitate one or more operations at the plurality of process stations.22. The system of any of the previous clauses, wherein each substrate holder is configured such that the short strokes are along the one or more paths of the track; and / or in horizontal, vertical, and / or rotational in directions relative to the one or more paths and / or one or more of the plurality of process stations.23. The system of any of the previous clauses, wherein the short stroke actuator comprises a contactless actuator, one or more activation coils, one or more air bearings, a mechanical wheel, a magnetic bearing, a motor, electrical components, a wired and / or wireless communication device, a sliding bearing, a rotating bearing, a capacitor, a spring, and / or optical data transfer components.24. The system of any of the previous clauses, wherein the track comprises one or more additional components configured to cause the plurality of substrate holders to move with relatively long strokes along the one or more paths to facilitate the one or more operations at the plurality of process stations.25. The system of any of the previous clauses, wherein each of the plurality of substrate holders comprises a chuck configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations.26. A semiconductor substrate handling method, comprising: providing one or more paths through a plurality of process stations with a track; coupling a plurality of substrate holders to the track, each2025P00001WQ 29substrate holder configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations to enable the substrate to be processed; and controlling, with a controller operatively coupled to the track and the plurality of substrate holders, relative motion between the plurality of substrate holders to cause each substrate holder to move along the one or more paths through the plurality of process stations independently of other substrate holders, with one or more of directions, ranges, and speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations.27. The method of clause 26, wherein the track comprises a linear stage, and the plurality of substrate holders comprise shuttles coupled to the linear stage.28. The method of any of the previous clauses, wherein the track comprises one or more horizontal axes for relatively long stroke movement.29. The method of any of the previous clauses, wherein each substrate holder is configured to move along the one or more paths, and in horizontal, vertical, and / or rotational directions relative to the one or more paths via a contactless actuator associated with each substrate holder.30. The method of any of the previous clauses, wherein the track comprises a magnetic levitation stage, the contactless actuator comprises a magnet, and the plurality of substrate holders comprise magnetic levitation pucks configured to magnetically levitate above the stage.31. The method of any of the previous clauses, wherein the track comprises multiple paths.32. The method of any of the previous clauses, wherein the plurality of substrate holders are configured to be moveable in different directions on the multiple paths.33. The method of any of the previous clauses, wherein the track comprises two or more parallel processing paths for parallel processing of two or more substrates in the plurality of processing stations.34. The method of any of the previous clauses, wherein movement of a substrate holder is controlled in concert with a timing of processing at a process station and / or movement of other substrate holders.35. The method of any of the previous clauses, wherein the controller and the plurality of substrate holders are configured such that one or more operations at the plurality of process stations are performed while a given substrate holder is stopped, and others of the plurality of substrate holders are moving.36. The method of any of the previous clauses, wherein a number of the plurality of substrate holders corresponds to a number of the process stations.37. The method of any of the previous clauses, wherein a number of the plurality of substrate holders is more than a number of the process stations.38. The method of any of the previous clauses, wherein the method is performed by a reticle handling system of a lithography apparatus, the substrate is a reticle, and the track is configured to operate in a vacuum environment of the lithography apparatus.39. The method of any of the previous clauses, wherein the substrate holder is configured to move the reticle along the one or more paths from a load lock of the reticle handling system, through the plurality2025P00001WQ 30of process stations, to a reticle stage of the lithography apparatus.40. The method of any of the previous clauses, further comprising griping and move the reticle from the load lock onto the substrate holder with a gripper and / or a lift configured to lift the reticle from the substrate holder to the reticle stage.41. The method of any of the previous clauses, wherein the plurality of process stations comprise process stations associated with identification, inspection, storage, alignment, and / or use of the reticle in the lithography apparatus.42. The method of any of the previous clauses, wherein use of the reticle comprises patterning a layer of a semiconductor wafer with a pattern from the reticle during a lithography exposure in the lithography apparatus.43. The method of any of the previous clauses, wherein the reticle is a 6” x 6”, 6” x 11.4”, or 6” x 12” reticle.44. The method of any of the previous clauses, wherein the method is performed by a wafer handling system of a lithography apparatus, the substrate is a semiconductor wafer, and the track is configured to operate under atmospheric pressure in the lithography apparatus.45. The method of any of the previous clauses, wherein the plurality of process stations comprise process stations associated with inspection, cleaning, alignment, patterning, and / or bonding of the semiconductor wafer.46. The method of any of the previous clauses, wherein each substrate holder comprises a short stroke actuator configured to cause a substrate holder to move a substrate with relatively short strokes to facilitate one or more operations at the plurality of process stations.47. The method of any of the previous clauses, wherein each substrate holder is configured such that the short strokes are along the one or more paths of the track; and / or in horizontal, vertical, and / or rotational in directions relative to the one or more paths and / or one or more of the plurality of process stations.48. The method of any of the previous clauses, wherein the short stroke actuator comprises a contactless actuator, one or more activation coils, one or more air bearings, a mechanical wheel, a magnetic bearing, a motor, electrical components, a wired and / or wireless communication device, a sliding bearing, a rotating bearing, a capacitor, a spring, and / or optical data transfer components.49. The method of any of the previous clauses, wherein the track comprises one or more additional components configured to cause the plurality of substrate holders to move with relatively long strokes along the one or more paths to facilitate the one or more operations at the plurality of process stations.50. The method of any of the previous clauses, wherein each of the plurality of substrate holders comprises a chuck configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations.51. A semiconductor device manufacturing method comprising: receiving and handling substrates with a semiconductor substrate handling system, comprising: a track comprising one or more paths through2025P00001WQ 31a plurality of process stations; a plurality of substrate holders coupled to the track, each substrate holder configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations to enable the substrate to be processed; and a controller operatively coupled to the track and the plurality of substrate holders, the controller configured to control relative motion between the plurality of substrate holders to cause each substrate holder to move along the one or more paths through the plurality of process stations independently of other substrate holders, with one or more of directions, ranges, and speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations; directing patterning radiation from a radiation source of a lithography apparatus to transfer a pattern from a mask onto a photoresist layer on the substrate; andremoving a portion the photoresist layer to form a pattern over the substrate.

[0118] The disclosed concepts may be associated with any generic imaging system for imaging sub wavelength features, and may be especially useful with emerging imaging technologies capable of producing increasingly shorter wavelengths. Emerging technologies already in use include EUV (extreme ultra violet), DUV lithography that is capable of producing a 193nm wavelength with the use of an ArF laser, and even a 157nm wavelength with the use of a Fluorine laser. Moreover, EUV lithography is capable of producing wavelengths within a range of 20-5nm by using a synchrotron or by hitting a material (either solid or a plasma) with high energy electrons in order to produce photons within this range.

[0119] While the disclosed concepts may be used for wafer manufacturing on a substrate such as a silicon wafer, it shall be understood that the disclosed concepts may be used with any type of manufacturing system, e.g., those used for manufacturing on substrates other than silicon wafers. In addition, the combination and sub-combinations of disclosed elements may comprise separate embodiments. For example, a lithography apparatus or other semiconductor manufacturing apparatuses, and the handling system may comprise separate embodiments, and / or these systems may be used together in the same embodiment.

[0120] The descriptions above are intended to be illustrative, not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made as described without departing from the scope of the claims set out below.

Claims

2025P00001WQ 32CLAIMS1. A semiconductor substrate handling system, comprising:a track comprising one or more paths through a plurality of process stations;a plurality of substrate holders coupled to the track, each substrate holder configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations to enable the substrate to be processed; anda controller operatively coupled to the track and the plurality of substrate holders, the controller configured to control relative motion between the plurality of substrate holders to cause each substrate holder to move along the one or more paths through the plurality of process stations independently of other substrate holders, with one or more of directions, ranges, and speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations.

2. The system of claim 1, wherein:the track comprises a linear stage, and the plurality of substrate holders comprise shuttles coupled to the linear stage; andthe track comprises one or more horizontal axes for relatively long stroke movement.

3. The system of claim 1, wherein:each substrate holder is configured to move along the one or more paths, and in horizontal, vertical, and / or rotational directions relative to the one or more paths via a contactless actuator associated with each substrate holder; andthe track comprises a magnetic levitation stage, the contactless actuator comprises a magnet, and the plurality of substrate holders comprise magnetic levitation pucks configured to magnetically levitate above the stage.

4. The system of claim 1, wherein:the track comprises multiple paths;the plurality of substrate holders are configured to be moveable in different directions on the multiple paths;the track comprises two or more parallel processing paths for parallel processing of two or more substrates in the plurality of processing stations; andmovement of a substrate holder is controlled in concert with a timing of processing at a process station and / or movement of other substrate holders.2025P00001WQ 335. The system of claim 1, wherein the controller and the plurality of substrate holders are configured such that one or more operations at the plurality of process stations are performed while a given substrate holder is stopped, and others of the plurality of substrate holders are moving.

6. The system of claim 1 , wherein a number of the plurality of substrate holders corresponds to a number of the process stations or wherein a number of the plurality of substrate holders is more than a number of the process stations.

7. The system of claim 1, wherein:the semiconductor substrate handling system is a reticle handling system of a lithography apparatus, the substrate is a reticle, and the track is configured to operate in a vacuum environment of the lithography apparatus; andthe substrate holder is configured to move the reticle along the one or more paths from a load lock of the reticle handling system, through the plurality of process stations, to a reticle stage of the lithography apparatus.

8. The system of claim 7, further comprising a gripper configured to grip and move the reticle from the load lock onto the substrate holder, and / or a lift configured to lift the reticle from the substrate holder to the reticle stage, wherein:the plurality of process stations comprise process stations associated with identification, inspection, storage, alignment, and / or use of the reticle in the lithography apparatus.use of the reticle comprises patterning a layer of a semiconductor wafer with a pattern from the reticle during a lithography exposure in the lithography apparatus; andthe reticle is a 6” x 6”, 6” x 11.4”, or 6” x 12” reticle.

9. The system of claim 1, wherein:the semiconductor substrate handling system is a wafer handling system of a lithography apparatus, the substrate is a semiconductor wafer, and the track is configured to operate under atmospheric pressure in the lithography apparatus; andthe plurality of process stations comprise process stations associated with inspection, cleaning, alignment, patterning, and / or bonding of the semiconductor wafer.

10. The system of claim 1, wherein:each substrate holder comprises a short stroke actuator configured to cause a substrate holder to move a substrate with relatively short strokes to facilitate one or more operations at the plurality of process stations;2025P00001WQ 34each substrate holder is configured such that the short strokes are along the one or more paths of the track; and / or in horizontal, vertical, and / or rotational in directions relative to the one or more paths and / or one or more of the plurality of process stations; andthe short stroke actuator comprises a contactless actuator, one or more activation coils, one or more air bearings, a mechanical wheel, a magnetic bearing, a motor, electrical components, a wired and / or wireless communication device, a sliding bearing, a rotating bearing, a capacitor, a spring, and / or optical data transfer components.

11. The system of claim 10, wherein the track comprises one or more additional components configured to cause the plurality of substrate holders to move with relatively long strokes along the one or more paths to facilitate the one or more operations at the plurality of process stations.

12. The system of claim 1, wherein each of the plurality of substrate holders comprises a chuck configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations.

13. A semiconductor substrate handling method, comprising:providing one or more paths through a plurality of process stations with a track; coupling a plurality of substrate holders to the track, each substrate holder configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations to enable the substrate to be processed; andcontrolling, with a controller operatively coupled to the track and the plurality of substrate holders, relative motion between the plurality of substrate holders to cause each substrate holder to move along the one or more paths through the plurality of process stations independently of other substrate holders, with one or more of directions, ranges, and speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations.

14. A semiconductor device manufacturing method comprising:receiving and handling substrates with a semiconductor substrate handling system, comprising:a track comprising one or more paths through a plurality of process stations; a plurality of substrate holders coupled to the track, each substrate holder configured to receive and hold a substrate, and move the substrate along the one or more paths through the plurality of process stations to enable the substrate to be processed; anda controller operatively coupled to the track and the plurality of substrate holders, the controller configured to control relative motion between the plurality of substrate holders to cause2025P00001WQ 35each substrate holder to move along the one or more paths through the plurality of process stations independently of other substrate holders, with one or more of directions, ranges, and speeds for each substrate holder that vary according to processing instructions, and track position relative to the other substrate holders and the plurality of process stations;directing patterning radiation from a radiation source of a lithography apparatus to transfer a pattern from a mask onto a photoresist layer on the substrate; andremoving a portion the photoresist layer to form a pattern over the substrate.

Images