Organic photovoltaic module manufacturing

Abstract

A method of producing a photovoltaic module includes obtaining a substrate including a coating and laser ablating a first scribe at least partially through the coating of the substrate. The method includes depositing a first charge carrier layer onto the substrate and annealing the first charge carrier layer at a first temperature for a first time period. The method includes depositing an absorber layer at a second temperature and laser ablating a second scribe at least partially through the absorber layer. The method includes depositing a second charge carrier layer onto the absorber layer and depositing a top contact layer onto the second charge carrier layer to create a subassembly. The method includes washing the subassembly with a second solvent, annealing the subassembly at a third temperature for a second time period, and laser ablating a third scribe at least partially through at least one layer of the subassembly.

Description

Atorney Docket No. 57319-348ORGANIC PHOTOVOLTAIC MODULE MANUFACTURINGCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 750,759, filed January 28, 2025, and U.S. Provisional Application No. 63 / 802,054, filed May 8, 2025. The entire disclosures of the above applications are incorporated by reference.FIELD

[0002] The present disclosure relates to photovoltaic modules and, more particularly, to a method of manufacturing photovoltaic modules.BACKGROUND

[0003] Organic photovoltaic (“OPV”) cells are photovoltaic devices that generate electrical energy from light using organic semiconductor materials. Such devices typically include one or more organic photoactive layers disposed between electrodes, along with additional layers that may facilitate charge transport, charge collection, or environmental protection. OPV cells have attracted interest due to properties of organic materials that may enable lightweight structures, mechanical flexibility, and compatibility with a variety of substrates. A range of materials and device architectures have been developed for OPV cells, along with corresponding manufacturing techniques for forming and assembling the various layers of the device.

[0004] Manufacturing processes for OPV cells can involve depositing organic and other functional materials using techniques such as solution processing, coating, printing, or vacuumbased methods. The characteristics of the resulting devices may depend on factors including material selection, layer morphology, process conditions, and device architecture. As OPV technology continues to develop, there is ongoing interest in manufacturing approaches that support consistent device formation, integration with different production environments, and increased production speed.

[0005] The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.Atorney Docket No. 57319-348SUMMARY

[0006] One aspect of the present disclosure provides a method of producing a photovoltaic module. The method includes obtaining a substrate including a coating and washing the substrate with a first solvent. The method further includes laser ablating a first scribe at least partially through the coating of the substrate and depositing a first charge carrier layer onto the substrate. The method further includes annealing the first charge carrier layer at a first temperature for a first time period and depositing an absorber layer at a second temperature. The method further includes laser ablating a second scribe at least partially through the absorber layer and depositing a second charge carrier layer onto the absorber layer. The method further includes depositing a top contact layer onto the second charge carrier layer to create a subassembly including the substrate, the first charge carrier layer, the absorber layer, the second charge carrier layer, and the top contact layer and washing the subassembly with a second solvent. The method further includes annealing the subassembly at a third temperature for a second time period and laser ablating a third scribe at least partially through at least one layer of the subassembly to create the photovoltaic module.

[0007] Another aspect of the present disclosure provides another method of producing a photovoltaic module. The method includes obtaining a substrate including a coating and washing the substrate with a first solvent. The method further includes laser ablating a first scribe at least partially through the coating of the substrate and depositing a first charge carrier layer onto the substrate. The method further includes depositing an absorber layer at a first temperature and laser ablating a second scribe at least partially through the absorber layer. The method further includes depositing a second charge carrier layer onto the absorber layer and depositing a top contact layer onto the second charge carrier layer to create a subassembly including the substrate, the first charge carrier layer, the absorber layer, the second charge carrier layer, and the top contact layer. The method further includes washing the subassembly with a second solvent and laser ablating a third scribe at least partially through at least one layer of the subassembly to create the photovoltaic module. The method further includes laminating the photovoltaic module to a sheet material.

[0008] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.Atorney Docket No. 57319-348BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present disclosure will become more fully understood from the detailed description and the accompanying drawings.

[0010] FIG. 1 is an example photovoltaic module according to the principles of the present disclosure.

[0011] FIG. 2 is another example photovoltaic module according to the principles of the present disclosure.

[0012] FIG. 3 is a flowchart of a first method of producing a photovoltaic module.

[0013] FIG. 4 is a flowchart of a second method of producing a photovoltaic module.

[0014] In the drawings, reference numbers may be reused to identify similar and / or identical elements.DETAILED DESCRIPTION STRUCTURE

[0015] A photovoltaic module may be used in a variety of photovoltaic applications. In various implementations, the photovoltaic module is a semi-transparent organic photovoltaic module that is disposed on or within a glass window that allows sunlight into the interior of an enclosure, such as a building or vehicle. In various other implementations, the photovoltaic module is an opaque organic photovoltaic module for applications where light transmission through the photovoltaic module is not necessary.

[0016] In FIG. 1, an example photovoltaic module 100 according to the principles of the present disclosure includes a substrate 104 with a coating 110, a first charge carrier layer 200, an absorber layer 300, a second charge carrier layer 400, and atop contact layer 500. The photovoltaic module 100 may produce electricity from light (typically, sunlight) by the photovoltaic effect. In operation, when light contacts the photovoltaic module 100, at least a portion of the light is absorbed by the photovoltaic module 100. The absorber layer 300 generates electron-hole pairs from absorbed photons.

[0017] The electron-hole pairs are separated into electrons and hole charges by the various layers of the photovoltaic module 100. For example, the first charge carrier layer 200 may allow electrons to flow freely through the first charge carrier layer 200 and collect in the coating 110 of the substrate 104 and / or the first charge carrier layer 200, while preventing the flow of hole charges. The second charge carrier layer 400 may allow hole charges to flow freely through theAtorney Docket No. 57319-348second charge carrier layer 400 and collect in the top contact layer 500 and / or the second charge carrier layer 400, while preventing the flow of electrons. This creates an electrical potential across the photovoltaic module 100. The photovoltaic module 100 may be coupled to one or more electronic devices (not shown) in order to provide electrical power to the devices, including for storage of the energy.

[0018] In various implementations, the substrate 104 is glass. In various implementations, the substrate 104 is plastic, such as polycarbonate or polyethylene naphthalate (PEN). In various implementations, the substrate 104 is a continuous pattern of substrates for roll-to-roll processing. In these implementations, the substrate 104 may be an ultra-thin substrate having a thickness of less than 200 microns. For example, the substrate may be 3 mil or 6 mil PEN having a thickness of approximately 76 microns or 152 microns, respectively.

[0019] The coating 110 may be disposed on a first side 120 of the substrate 104. In various implementations, the coating 110 is a transparent conductive oxide. In various implementations, the coating 110 is indium tin oxide (ITO) and is approximately 250 nm thick. In various other implementations, the coating is fluorine-doped tin oxide (FTO) and is approximately 1 micron thick. Increasing the thickness of the coating 110 may increase the conductivity of the photovoltaic module 100 but reduce the transparency of the photovoltaic module 100. In various implementations, the coating 110 includes silver nanowires (AgNW). The AgNW may be dyed or colored to achieve desired optical characteristics of the photovoltaic module 100.

[0020] In various implementations, the first charge carrier layer 200 is an electron transport layer. In this regard, the first charge carrier layer 200 may be referred to herein as the electron transport layer 200. In such implementations, the first charge carrier layer 200 allows electrons to flow freely and collect in the coating 110 of the substrate 104 and / or the electron transport layer 200, while preventing the flow of hole charges.

[0021] The electron transport layer 200 may be zinc oxide or tin oxide. The electron transport layer 200 may be between 50 nm and 150 nm thick. In various implementations, the electron transport layer 200 includes nanoparticles, such as those from Avantama AG, that are converted to zinc oxide during an annealing process described in more detail below. The first charge carrier layer 200 is described as being an electron transport layer and the second charge carrier layer 400 is described as being a hole transport layer (making the photovoltaic module 100 an inverted photovoltaic module); in various implementations, the first charge carrier layer 200 is a hole transport layer and the second charge carrier layer 400 is an electron transport layer (which would make a standard photovoltaic module).Atorney Docket No. 57319-348

[0022] In various implementations, the first charge carrier layer 200 includes a self-assembled monolayer (SAM) material. The SAM material may be chosen based on one or more desired properties of the SAM material. In various implementations, the SAM material is chosen based on its electron-transporting properties. For example, it may be desirable for the SAM material to allow the transport of electrons through the SAM material, while blocking the transport of hole charges. In various implementations, the SAM material is chosen based on its ability to bind to the material that makes up the first charge carrier layer 200 and / or the absorber layer 300. In other words, in various implementations, the SAM material is chosen based on its polarity. For example, a first end (tail end) of the SAM material may readily bind to the first charge carrier layer 200 material and a second end (head end) of the SAM material may readily bind to the absorber layer 300 material.

[0023] The SAM material may improve the stability (sometimes called lifespan) of the photovoltaic module 100. In various implementations, stability may be calculated by measuring the amount of time until the photovoltaic module 100 loses 20% of its initial power.

[0024] In various implementations, the SAM material is applied as a separate layer on top of the first charge carrier layer 200. The SAM material layer may be one molecule thick (in other words, a self-assembled monolayer).

[0025] In various other implementations, the SAM material is mixed throughout the material that makes up the first charge carrier layer 200 (for example, zinc oxide or tin oxide). The SAM material and the material that makes up the first charge carrier layer 200 may be mixed such that each bead (nanoparticle) of the material that makes up the first charge carrier layer 200 is at least partially covered by the SAM material. For example, the mixture may be 0.1%, 1%, or 5% SAM material.

[0026] In various other implementations, a thin layer (approximately 10% of the total thickness of the first charge carrier layer 200) of only first charge carrier layer 200 material is deposited and annealed. Next, the mixture of SAM material and the first charge carrier layer 200 material is deposited to create the remainder of the first charge carrier layer 200.

[0027] In various implementations, the absorber layer 300 is a blend of electron-donating materials and electron-accepting materials. The donor and acceptor materials may be polymers. For example, the absorber layer 300 may be a blend of PBDB-T-2F (PM6) and Y6-BO. In various implementations, up to six different donor and acceptor materials may make up the absorber layer 300. The ratio of donor materials to acceptor materials may be close to 1:1. For example, the ratio of donor materials to acceptor materials may be 1:1.2. The absorber layer 300Atorney Docket No. 57319-348may be approximately 250 nm thick. Making the absorber layer 300 thinner may produce less electrical current but may increase the transparency of the photovoltaic module 100.

[0028] In various implementations, the second charge carrier layer 400 is a hole transport layer. In this regard, the second charge carrier layer 400 may be referred to herein as the hole transport layer 400. In such implementations, the second charge carrier layer 400 allows hole charges to flow freely and collect in the top contact layer 500 and / or the hole transport layer 400, while preventing the flow of electrons.

[0029] In various implementations, the hole transport layer 400 is a conductive polymer blend. For example, the hole transport layer 400 may be Poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOTPSS). In various implementations, the PEDOTPSS is combined with 5% by volume dimethyl sulfoxide and between 0.5% and 1% by volume of a surfactant to increase the conductivity of the PEDOT PSS. In various implementations, 0.5% by volume of the surfactant is used. In various implementations, the surfactant is a non-ionic surfactant, such as Triton X-100. In various implementations, the surfactant is a fluorosurfactant. The hole transport layer 400 may be between 100 nm and 400 nm thick. For example, the hole transport layer may be approximately 200 nm thick.

[0030] The top contact layer 500 may be disposed on top of the second charge carrier layer 400. The top contact layer 500 may be a deposited solution of silver nanowires (AgNW). The AgNW may be diluted in an alcohol solution. For example, the alcohol may be s-butanol or isopropanol. The concentration of AgNW in the solution may depend on the composition of the absorber layer 300. The AgNW may be diluted between 0.1% and 5% by volume in the solution. In various implementations, the AgNW are diluted to 1% by volume concentration. A lower concentration of AgNW may provide better transparency and aesthetics of the photovoltaic module 100 at lower costs. The AgNW may have different lengths and widths (aspect ratios) selected based on desired electrical and / or optical characteristics of the photovoltaic module 100. The top contact layer 500 may include indium zinc oxide (IZO). For example, the top contact layer 500 may include a combination of sputtered IZO and reflective back-contact silver.

[0031] In various implementations, the photovoltaic module 100 includes an interlayer 700 disposed between the first charge carrier layer 200 and the absorber layer 300. The interlayer 700 may increase adhesion between the first charge carrier layer 200 and the absorber layer 300, resulting in improved lamination. In various other implementations, the interlayer 700 is omitted.Atorney Docket No. 57319-348

[0032] The photovoltaic module 100 includes multiple scribes: a first scribe 610, a second scribe 620, and a third scribe 630. The scribes may be cut, at least partially, into one or more layers of the photovoltaic module 100. The scribes may produce gaps where portions of the one or more layers of the photovoltaic module 100 are removed.

[0033] In various implementations, removal of the one or more layers separates the photovoltaic module 100 into one or more individual photovoltaic cells. The one or more photovoltaic cells may be electrically connected to each other, such as in a series arrangement, a parallel arrangement, or a hybrid incorporating both series and parallel connections. Each photovoltaic cell may be capable of producing electricity independently, while the photovoltaic module 100 combines individual cells to produce a desired voltage or current.

[0034] In various implementations, one or more of the scribes are shallow-scribed, such that the scribe extends through less than all of the layers of the photovoltaic module 100. Shallow scribing may improve the optical properties of the photovoltaic module 100. For example, shallow scribing may reduce distortion when looking through a window including the photovoltaic module 100. Shallow scribing may also improve the transmission of communication signals (such as mobile phone signals) through a window including the photovoltaic module 100.

[0035] Referring now to FIG. 2, a second example photovoltaic module 100a according to the principles of the present disclosure is shown. The photovoltaic module 100a includes the substrate 104 with the coating 110, the first charge carrier layer 200, the absorber layer 300, the second charge carrier layer 400, and the top contact layer 500. The photovoltaic module 100a may include multiple scribes: the first scribe 610, the second scribe 620, and a fourth scribe 640. In this regard, the photovoltaic module 100a may differ from the photovoltaic module 100 in that the fourth scribe 640 replaces the third scribe 630 of the photovoltaic module 100. The fourth scribe 640 may extend through the top contact layer 500, the second charge carrier layer 400, the absorber layer 300, and the first charge carrier layer 200. References herein to the photovoltaic module 100 should be understood to apply equally to the photovoltaic module 100a, unless explicitly stated otherwise.

[0036] Referring to FIGS. 1 and 2, in various implementations, the photovoltaic module 100 may be laminated to a sheet material 800. In this regard, the sheet material 800 may be disposed on top of the top contact layer 500. The photovoltaic module 100 may be laminated to the sheet material 800 using any known lamination machine. The photovoltaic module 100 may be placed in the lamination machine and the lamination machine may draw a vacuum on the photovoltaicAtorney Docket No. 57319-348module 100 and the sheet material 800. In various implementations, the lamination machine may draw the vacuum for up to 5 minutes. In various implementations, the lamination machine may draw the vacuum for up to 30 minutes. In various implementations, the lamination machine may draw the vacuum for one or more hours. After some time, the lamination machine may heat the photovoltaic module 100 and the sheet material 800 while continually drawing the vacuum. Finally, the lamination machine applies pressure (for example, by an inflatable air bladder) on the photovoltaic module 100 and the sheet material 800, while continuing to heat the photovoltaic module 100 and the sheet material 800.

[0037] In various implementations, the sheet material 800 may be glass. For example, the sheet material 800 may be architectural glass. In various implementations, the sheet material 800 is polyvinyl butyral (PVB). In various implementations, the sheet material 800 is ethylene vinyl acetate (EVA). In various implementations, the sheet material 800 is epoxy.

[0038] In various implementations, the photovoltaic module 100 may be sandwiched between a first layer 900 and a second layer 904. The first layer 900 and / or the second layer 904 may be glass, such as for a window in a building or automobile.

[0039] In various implementations, the first layer 900 is disposed near the sheet material 800 and the second layer 904 is disposed near the substrate 104. In various implementations, the second layer 904 is connected or bonded to a second side 130 of the substrate 104. In various implementations, the first layer 900 is separated from the sheet material 800. In this regard, the sheet material 800 and / or the first layer 900 may at least partially define a void 50. The void 50 may be a vacuum. In various implementations, the void 50 is filled with an inert gas (such as helium, neon, argon, etc.).PROCESS

[0040] FIG. 3 depicts a first method 1000 of manufacturing a photovoltaic module, such as the photovoltaic module 100 or the photovoltaic module 100a. The method 1000 begins at step 1010, which includes obtaining the substrate 104. As discussed above, the substrate 104 may include the coating 110 disposed on the first side 120 of the substrate 104.

[0041] Step 1020 includes washing the substrate 104 with a solvent. Washing the substrate 104 may remove impurities and / or a protective coating and prepare the substrate 104 for further processing.

[0042] Optional step 1030 includes laser ablating the first scribe 610, at least partially, through the coating 110. In various implementations, the first scribe 610 cuts completely through theAtorney Docket No. 57319-348coating 110. The first scribe 610 may remove enough of the coating 110 to interrupt the electrical conductivity of the coating 110. In various implementations, multiple first scribes 610 are cut into the coating 110. The scribes 610 may be cut lengthwise along the substrate 104. For example, the multiple first scribes 610 may be disposed approximately 4 mm to 8 mm apart across the width of the substrate 104. The laser used to ablate the first scribe 610 may produce a beam with a width of between 40 microns and 240 microns. For example, the beam width may be approximately 50 microns. Although described as optional, steps (such as step 1030) may be required in various implementations; in other implementations, some optional steps may not even be relevant in various implementations.

[0043] Step 1040 includes depositing the first charge carrier layer 200 onto the substrate 104 (e.g., the coating 110). The first charge carrier layer 200 may be dissolved in a solvent prior to deposition. For example, the solvent may be 2-methoxyethanol. In various implementations, when ambient humidity is low, water may be introduced into the deposition of the first charge carrier layer 200 for proper deposition.

[0044] Optional step 1050 includes depositing the interlayer 700 onto the first charge carrier layer 200.

[0045] Optional step 1060 includes laser ablating the first scribe 610 through the first charge carrier layer 200 and the coating 110. For example, if optional step 1030 was not performed, then optional step 1060 is performed. In various implementations, both steps 1030 and 1060 are performed. The description of laser ablating in step 1030 may apply equally to the laser ablating performed in step 1060.

[0046] Step 1070 includes annealing the first charge carrier layer 200 and / or the interlayer 700. The annealing may be performed at a specific temperature for a period of time. The annealing temperature may be greater than 80°C. For example, the annealing temperature may be 120°C. The annealing temperature may be chosen based on the material of the substrate 104. For example, the annealing temperature may be less than 150°C if the substrate 104 is plastic.However, if the substrate 104 is glass, the annealing temperature may exceed 200°C. In implementations where the first charge carrier layer 200 is dissolved in 2-methoxyethanol, the first charge carrier layer 200 may be annealed at 200°C for approximately 20 minutes.

[0047] Step 1080 includes depositing the absorber layer 300 onto the first charge carrier layer 200 and / or the interlayer 700. The material that comprises the absorber layer 300 may be dissolved in a solution prior to and during deposition. In various implementations, the solution is a solution of ortho-xylenes. The concentration of the absorber material in the solution may beAtorney Docket No. 57319-348dependent on the desired thickness of the absorber layer 300. In various implementations, the concentration of absorber material in the solution is 44 mg / mL of total dissolved solids. Lower concentrations of the absorber material will produce a thinner absorber layer 300 after deposition. The absorber layer 300 may be deposited at a specific temperature. The temperature may be between 20°C and 110°C. In various implementations, the temperature may be selected based on the solution. For example, if the solution is a solution of ortho-xylenes, the temperature may not exceed 110°C to prevent the ortho-xylenes from boiling off. The absorber layer 300 may be deposited via one or more of spin coating, blade coating, or slot-die coating.

[0048] Optional step 1090 includes annealing the absorber layer 300. The absorber layer 300 may be annealed at a specific temperature for a specific period of time. For example, the temperature may be between 90°C and 110°C. The absorber layer 300 and / or the second charge carrier layer 400 may be annealed for up to five minutes. Annealing the absorber layer 300 may be performed before or after laser ablating the second scribe 620.

[0049] Step 1100 includes laser ablating the second scribe 620. The second scribe 620 cuts at least partially through the absorber layer 300. In various implementations, the second scribe 620 cuts completely through the absorber layer 300. In various implementations, the second scribe 620 cuts completely through the absorber layer 300 and the first charge carrier layer 200. In cutting the second scribe 620, the laser may make up to three total passes over the absorber layer 300. Each pass of the laser may be offset from the prior pass by half of the width of the laser’s beam. In this regard, the third pass of the laser may completely overlap the first pass of the laser. In various implementations, the laser makes only a single pass over the absorber layer 300. This may improve the power output and aesthetics (e.g., optical characteristics) of the photovoltaic module 100. The width of the second scribe may be approximately 80 microns.

[0050] Step 1110 includes depositing the second charge carrier layer 400 onto the absorber layer 300 or the interlayer 700. If step 1100 was not performed, then the second charge carrier layer 400 is deposited directly onto the absorber layer 300. If step 1100 was performed, then the second charge carrier layer 400 is deposited onto the interlayer 700.

[0051] Optional step 1120 includes annealing the absorber layer 300, the second charge carrier layer 400, and / or the interlayer 700 prior to step 1130. Annealing the absorber layer 300, the second charge carrier layer 400, and / or the interlayer 700 may be performed at a specific temperature for a period of time. For example, the temperature may be between 90°C and 110°C. The absorber layer 300, the second charge carrier layer 400, and / or the interlayer 700 may be annealed for up to five minutes.Atorney Docket No. 57319-348

[0052] Step 1130 includes depositing the top contact layer 500 onto the second charge carrier layer 400. The substrate 104, the first charge carrier layer 200, the absorber layer 300, the second charge carrier layer 400, and the top contact layer 500 may form a subassembly 102 of the photovoltaic module 100. The top contact layer 500 may be deposited via one or more of spin coating, blade coating, slot-die coating, or sputtering.

[0053] Optional step 1140 includes annealing the top contact layer 500 prior to washing the subassembly 102 at step 1150. Annealing the top contact layer 500 may occur between 80°C and 150°C. For example, the top contact layer 500 may be annealed between 100°C and 120°C. Specifically, the top contact layer 500 may be annealed at exactly 120°C. The top contact layer 500 may be annealed for a period of time between one and ten minutes. For example, the top contact layer 500 may be annealed for two minutes or five minutes.

[0054] Step 1150 includes washing the subassembly in a solvent. The solvent may be non-organic. The solvent may be aqueous. The solvent may be a low-boiling-point alcohol. For example, the solvent may be s-butanol or isopropanol. The solvent may be heated prior to washing the subassembly 102. In various implementations, the solvent is heated to 120°C prior to washing the subassembly 102. However, heat may not be applied while the subassembly 102 is being washed. Washing the subassembly 102 may cause the AgNW of the top contact layer 500 to become, at least partially, engulfed by the PEDOT:PSS of the second charge carrier layer 400, thereby increasing the conductivity of the photovoltaic module 100.

[0055] Step 1160 includes annealing the subassembly 102. Annealing the subassembly 102 may occur between 80°C and 150°C. For example, the subassembly 102 may be annealed between 100°C and 120°C. The temperature for annealing the subassembly 102 may be selected based on the composition of the absorber layer 300. Step 1160 may be performed regardless of whether or not steps 1120 and / or step 1140 were performed.

[0056] Step 1170 includes laser ablating the third scribe 630 or the fourth scribe 640. The process of laser ablating the third scribe 630 or the fourth scribe 640 may differ only by the number of layers of the subassembly 102 through which the scribe is cut. For example, the third scribe 630 may cut, at least partially, through at least one layer of the subassembly 102. In various implementations, the third scribe 630 cuts completely through the top contact layer 500. In various implementations, the third scribe 630 cuts completely through the top contact layer 500 and at least partially through the second charge carrier layer 400. In various implementations, the third scribe 630 cuts completely through the top contact layer 500, the second charge carrier layer 400, and less than all of the absorber layer 300. In variousAtorney Docket No. 57319-348implementations, the fourth scribe 640 may cut through all of the top contact layer 500, the second charge carrier layer 400, the absorber layer 300, and the first charge carrier layer 200. The third scribe 630 may be cut with a single pass of the laser. The third scribe 630 may break up the AgNW of the top contact layer 500. The combined width of the first, second, and third scribes, 610, 620, 630, may be less than 700 microns, and specifically, may be approximately 380 microns. Once the final scribe is cut, the subassembly 102 may be considered the photovoltaic module 100.

[0057] Optional step 1180 includes heating the photovoltaic module 100 in an environment above a temperature threshold prior to and / or during lamination to the sheet material 800. In various implementations, the environment and / or the photovoltaic module 100 is heated to over 100°C. For example, the environment and / or the photovoltaic module 100 may be heated to 120°C for up to five minutes.

[0058] Step 1190 includes laminating the photovoltaic module 100 to the sheet material 800. Laminating the sheet material 800 to the photovoltaic module 100 may include disposing the sheet material 800 on top of the top contact layer 500.

[0059] Finally, Step 1200 includes sandwiching the photovoltaic module 100 between the first layer 900 and the second layer 904.

[0060] FIG. 4 depicts a second method 1000a of manufacturing a photovoltaic module, such as the photovoltaic module 100 or the photovoltaic module 100a. The second method 1000a may be similar to the first method 1000, except that the second method 1000a may eliminate some or all of the annealing steps described in the first method 1000. For example, the second method 1000a may skip some or all of steps 1070, 1090, 1120, 1140, 1160, or 1180 and only heat the photovoltaic module during the laminating step 1190. In various implementations, in the second method 1000a, all of steps 1070, 1090, 1120, 1140, 1160, and 1180 are skipped. In this regard, the laminating step 1190 may effectively replace some or all of steps 1070, 1090, 1120, 1140, 1160, or 1180. The specific chemical composition of the first charge carrier layer 200 may make it possible to remove all of the annealing steps.

[0061] The annealing steps may all use the same heating method or may use two or more different heating methods. Heating methods include exposing the photovoltaic module to a heated environment and directly heating the photovoltaic module. In various implementations, heat may be applied by hot forced air, an infrared heater, an induction heating coil, a heating chamber, a hot plate, etc.Atorney Docket No. 57319-348

[0062] Eliminating some or all of the annealing steps may decrease the amount of time necessary to manufacture the photovoltaic module and thus increase production throughput of the photovoltaic module. For example, removing all of the annealing steps may save up to 10 or 15 minutes per photovoltaic module. Removing all of the annealing steps may improve the shelf-life of the photovoltaic module. Further, eliminating some or all of the annealing steps may eliminate concerns about overheating the photovoltaic module. The photovoltaic module may have a thermal budget — in other words, the photovoltaic module is only able to withstand a certain amount of heat before experiencing negative effects (such as reduced power output of the photovoltaic module and / or deformation of one or more layers of the photovoltaic module, etc.). CLAUSES

[0063] Various example embodiments of the invention are described in the following clauses.

[0064] Clause 1: A method of producing a photovoltaic module, the method comprising: obtaining a substrate including a coating; washing the substrate with a first solvent; laser ablating a first scribe at least partially through the coating of the substrate; depositing a first charge carrier layer onto the substrate; annealing the first charge carrier layer at a first temperature for a first time period; depositing an absorber layer at a second temperature; laser ablating a second scribe at least partially through the absorber layer; depositing a second charge carrier layer onto the absorber layer; depositing a top contact layer onto the second charge carrier layer to create a subassembly including the substrate, the first charge carrier layer, the absorber layer, the second charge carrier layer, and the top contact layer; washing the subassembly with a second solvent; annealing the subassembly at a third temperature for a second time period; and laser ablating a third scribe at least partially through at least one layer of the subassembly to create the photovoltaic module.

[0065] Clause 2: The method of clause 1, further comprising laminating the photovoltaic module to a sheet material.

[0066] Clause 3 : The method of clause 2, further comprising, prior to laminating the photovoltaic module to the sheet material, heating the photovoltaic module to a fourth temperature for a third time period:

[0067] Clause 4: The method of clauses 2 or 3, further comprising disposing the photovoltaic module between a first layer disposed adjacent the sheet material and a second layer disposed adjacent the substrate.Atorney Docket No. 57319-348

[0068] Clause 5 : The method of clause 4, wherein: the first layer is separated from the sheet material, and the first layer and the sheet material at least partially define a void.

[0069] Clause 6: The method of clause 5, wherein the void is a vacuum.

[0070] Clause 7: The method of clause 5, wherein the void is filled with an inert gas.

[0071] Clause 8: The method of clause any of clauses 1 to 7, further comprising, prior to washing the subassembly with the second solvent, annealing the top contact layer at a fifth temperature for a fourth time period.

[0072] Clause 9: The method of any of clauses 1 to 8, further comprising, prior to depositing the top contact layer, annealing the absorber layer at a sixth temperature for a fifth time period.

[0073] Clause 10: The method of any of clauses 1 to 9, wherein the substrate is glass.

[0074] Clause 11 : The method of any of clauses 1 to 10, wherein the coating is a transparent conductive oxide.

[0075] Clause 12: The method of any of clauses 1 to 11, wherein the first charge carrier layer is an electron transport layer.

[0076] Clause 13: The method of any of clauses 1 to 12, wherein the absorber layer is dissolved in ortho-xylenes.

[0077] Clause 14: The method of any of clauses 1 to 13, wherein the absorber layer is deposited via at least one of: spin coating, blade coating, or slot-die coating.

[0078] Clause 15: The method of any of clauses 1 to 14, wherein the first scribe cuts completely through the coating.

[0079] Clause 16: The method of any of clauses 1 to 15, wherein the second scribe cuts completely through the absorber layer.

[0080] Clause 17: The method of any of clauses 1 to 16, wherein the third scribe cuts completely through the top contact layer and the second charge carrier layer and at least partially through the absorber layer.

[0081] Clause 18: The method of any of clauses 1 to 17, wherein the third scribe cuts completely through the first charge carrier layer, the absorber layer, the second charge carrier layer, and the top contact layer.

[0082] Clause 19: The method of any of clauses 1 to 18, wherein the top contact layer is sputter-deposited.Atorney Docket No. 57319-348

[0083] Clause 20: The method of any of clauses 1 to 19, further comprising depositing an interlayer onto the first charge carrier layer prior to depositing the absorber layer.

[0084] Clause 21: A method of producing a photovoltaic module, the method comprising: obtaining a substrate including a coating; washing the substrate with a first solvent; laser ablating a first scribe at least partially through the coating of the substrate; depositing a first charge carrier layer onto the substrate; depositing an absorber layer at a first temperature; laser ablating a second scribe at least partially through the absorber layer; depositing a second charge carrier layer onto the absorber layer; depositing a top contact layer onto the second charge carrier layer to create a subassembly including the substrate, the first charge carrier layer, the absorber layer, the second charge carrier layer, and the top contact layer; washing the subassembly with a second solvent; laser ablating a third scribe at least partially through at least one layer of the subassembly to create the photovoltaic module; and laminating the photovoltaic module to a sheet material.

[0085] Clause 22: The method of clause 21, wherein laminating the photovoltaic module includes heating the photovoltaic module above a temperature threshold.

[0086] Clause 23 : The method of clause 22, wherein laminating the photovoltaic module includes heating the photovoltaic module above the temperature threshold for a first period of time.

[0087] Clause 24: The method of clauses 22 or 23, wherein between depositing the absorber layer and laminating the photovoltaic module, the photovoltaic module remains below the temperature threshold.

[0088] Clause 25 : The method of any of clauses 22 to 24, wherein prior to laminating the photovoltaic module, the photovoltaic module remains below the temperature threshold.CONCLUSION

[0089] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. In the written description and claims, one or more steps within a method may be executed in a different order (or concurrently) without altering the principles of the present disclosure. Unless indicatedAtorney Docket No. 57319-348otherwise, numbering or other labeling of instructions or method steps is done for convenient reference, not to indicate a fixed order.

[0090] Numerical terms, such as “first,” “second,” and “third,” may be used in the disclosure and claims as unique labels: they are not used to imply a sequence or order unless the context clearly indicates otherwise. In other words, a “second” element could be relabeled as a “first” element without departing from the principles of the present disclosure. Further, the presence of a “second” element does not imply or require the presence of a “first” element. Similarly, the presence of a “first” element does not imply or require the presence of a “second” element.

[0091] Unless the context clearly indicates otherwise, the singular articles “a,” “an,” and “the” before a noun do not restrict the noun to a single instance. The verbs “comprise,” “include,” and “have” are inclusive and therefore specify the presence of elements without excluding the presence of one or more additional elements.

[0092] Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and / or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.

[0093] Spatial and functional relationships between elements are described using various terms, including “connected,” “coupled,” “engaged,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship encompasses a direct relationship where no other intervening elements are present between the first and second elements, as well as an indirect relationship where one or more intervening elements are present between the first and second elements.

[0094] The term “set” generally means a grouping of one or more elements. The elements of a set do not necessarily need to have any characteristics in common or otherwise belong together. However, in various implementations, a "set" may, in certain circumstances, be the empty set (in other words, the set has zero elements in those circumstances). As an example, a set of search results resulting from a query may, depending on the query, be the empty set. In contexts where it is not otherwise clear, the term “non-empty set” can be used to explicitly denote exclusion of the empty set — that is, a non-empty set will always have one or more elements.Atorney Docket No. 57319-348

[0095] A “subset” of a first set generally includes some of the elements of the first set. In various implementations, a subset of the first set is not necessarily a proper subset: in certain circumstances, the subset may be coextensive with (equal to) the first set (in other words, the subset may include the same elements as the first set). In contexts where it is not otherwise clear, the term “proper subset” can be used to explicitly denote that a subset of the first set must exclude at least one of the elements of the first set. Further, in various implementations, the term “subset” does not necessarily exclude the empty set. As an example, consider a set of candidates that was selected based on first criteria and a subset of the set of candidates that was selected based on second criteria; if no elements of the set of candidates met the second criteria, the subset may be the empty set. In contexts where it is not otherwise clear, the term “non-empty subset” can be used to explicitly denote exclusion of the empty set.

[0096] The phrase “at least one of A, B, and C” should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.” The phrase “at least one of A, B, or C” should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR. The phrase "A, B, and / or C" should be construed in the same way as the phrase “at least one of A, B, and C.”

[0097] In the figures, the direction of an arrow, as indicated by the arrowhead, generally demonstrates the flow of information (such as data or instructions) that is of interest to the illustration. For example, when element A and element B exchange a variety of information but information transmitted from element A to element B is relevant to the illustration, the arrow may point from element A to element B. This unidirectional arrow does not imply that no other information is transmitted from element B to element A. Further, for information sent from element A to element B, element B may send requests for, or receipt acknowledgements of, the information to element A.

Claims

Atorney Docket No. 57319-348CLAIMS1. A method of producing a photovoltaic module, the method comprising:obtaining a substrate including a coating;washing the substrate with a first solvent;laser ablating a first scribe at least partially through the coating of the substrate; depositing a first charge carrier layer onto the substrate;annealing the first charge carrier layer at a first temperature for a first time period; depositing an absorber layer at a second temperature;laser ablating a second scribe at least partially through the absorber layer; depositing a second charge carrier layer onto the absorber layer;depositing a top contact layer onto the second charge carrier layer to create a subassembly including the substrate, the first charge carrier layer, the absorber layer, the second charge carrier layer, and the top contact layer;washing the subassembly with a second solvent;annealing the subassembly at a third temperature for a second time period; and laser ablating a third scribe at least partially through at least one layer of the subassembly to create the photovoltaic module.

2. The method of claim 1 further comprising laminating the photovoltaic module to a sheet material.

3. The method of claim 2 further comprising, prior to laminating the photovoltaic module to the sheet material, heating the photovoltaic module to a fourth temperature for a third time period.

4. The method of claim 2 further comprising disposing the photovoltaic module between a first layer disposed adjacent the sheet material and a second layer disposed adjacent the substrate.

5. The method of claim 4 wherein:the first layer is separated from the sheet material, andthe first layer and the sheet material at least partially define a void.

6. The method of claim 5 wherein the void is a vacuum.Atorney Docket No. 57319-3487. The method of claim 5 wherein the void is fdled with an inert gas.

8. The method of claim 1 further comprising, prior to washing the subassembly with the second solvent, annealing the top contact layer at a fifth temperature for a fourth time period.

9. The method of claim 1 further comprising, prior to depositing the top contact layer, annealing the absorber layer at a sixth temperature for a fifth time period.

10. The method of claim 1 wherein the substrate is glass.

11. The method of claim 1 wherein the coating is a transparent conductive oxide.

12. The method of claim 1 wherein the first charge carrier layer is an electron transport layer.

13. The method of claim 1 wherein the absorber layer is dissolved in ortho-xylenes.

14. The method of claim 1 wherein the absorber layer is deposited via at least one of: spin coating, blade coating, or slot-die coating.

15. The method of claim 1 wherein the first scribe cuts completely through the coating.

16. The method of claim 1 wherein the second scribe cuts completely through the absorber layer.

17. The method of claim 1 wherein the third scribe cuts completely through the top contact layer and the second charge carrier layer and at least partially through the absorber layer.

18. The method of claim 1 wherein the third scribe cuts completely through the first charge carrier layer, the absorber layer, the second charge carrier layer, and the top contact layer.

19. The method of claim 1 wherein the top contact layer is sputter-deposited.

20. The method of claim 1 further comprising depositing an interlayer onto the first charge carrier layer prior to depositing the absorber layer.Atorney Docket No. 57319-34821. A method of producing a photovoltaic module, the method comprising:obtaining a substrate including a coating;washing the substrate with a first solvent;laser ablating a first scribe at least partially through the coating of the substrate; depositing a first charge carrier layer onto the substrate;depositing an absorber layer at a first temperature;laser ablating a second scribe at least partially through the absorber layer; depositing a second charge carrier layer onto the absorber layer;depositing a top contact layer onto the second charge carrier layer to create a subassembly including the substrate, the first charge carrier layer, the absorber layer, the second charge carrier layer, and the top contact layer;washing the subassembly with a second solvent;laser ablating a third scribe at least partially through at least one layer of the subassembly to create the photovoltaic module; andlaminating the photovoltaic module to a sheet material.

22. The method of claim 21 wherein laminating the photovoltaic module includes exposing the photovoltaic module to an environment above a temperature threshold.

23. The method of claim 22 wherein laminating the photovoltaic module includes exposing the photovoltaic module to the environment above the temperature threshold for a first period of time.

24. The method of claim 22 wherein, between depositing the absorber layer and laminating the photovoltaic module, an environment to which the photovoltaic module is exposed remains below the temperature threshold.

25. The method of claim 22 wherein, prior to laminating the photovoltaic module, an environment to which the photovoltaic module is exposed remains below the temperature threshold.

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