Formative system and coating order setting method
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- FUJI CORP
- Filing Date
- 2025-02-03
- Publication Date
- 2026-08-06
Smart Images
Figure JP2025003466_06082026_PF_FP_ABST
Abstract
Description
Modeling System and Coating Order Setting Method
[0001] This specification discloses a modeling system and a coating order setting method.
[0002] Conventionally, there has been proposed a method of discharging and applying a filler from a discharge member to a plurality of locations where components are mounted on a modeled object such as a substrate. For example, Patent Document 1 describes a method of applying a filler such as underfill to the bottom space between the lower surface of a component and the upper surface of a substrate and heating and curing it to fix the component.
[0003] Japanese Patent Application Laid-Open No. 2022-84213
[0004] Here, when the filler is applied, the filler may adhere to the outer peripheral surface of the discharge member or the like. In that case, there may be an influence caused by the filler adhering to the discharge member at a previous location among the plurality of locations being carried over to a subsequent location. If this happens, the application amount and application position of the filler may not be as intended, and there is a risk that the component cannot be securely fixed.
[0005] The main object of the present disclosure is to appropriately apply a filler to a plurality of locations where components are mounted.
[0006] The present disclosure has adopted the following means to achieve the above main object.
[0007] The modeling system of the present disclosure is a modeling system that performs a coating process of discharging and applying a filler from a discharge member to a plurality of locations where components are to be mounted before the components are mounted on the modeled object formed by the modeling process. For each of the plurality of locations, an acquisition unit that acquires a correlation value related to the application amount based on the volume of the space filled with the discharged filler, and a setting unit that sets the coating order of at least a part of the plurality of locations in the coating process such that the smaller the correlation value acquired by the acquisition unit, the earlier the coating. The gist is that it comprises these.
[0008] In the molding system of this disclosure, a correlation value related to the amount of filler applied is obtained based on the volume of the space to which the extruded filler is filled, and the application order of at least some of the multiple locations in the application process is set such that the smaller the correlation value, the earlier the filler is applied. As a result, since the filler is applied in order of increasing application amount at at least some of the multiple locations, the influence of filler adhering to the extruded member at locations with high application amounts being carried over to locations with low application amounts can be suppressed. Therefore, the filler can be appropriately applied to the multiple locations where the part is mounted.
[0009] A diagram showing the general configuration of the production system 1 including the molding device 10. A block diagram showing the general configuration of the molding device 10 and the control device 90. An explanatory diagram showing an example of the overview of the processes performed in the production system 1. A flowchart showing an example of the coating order setting process. An explanatory diagram showing an example of standoff height Hs and bump height Hb. An explanatory diagram showing an example of volume V and coating time T for each part. An explanatory diagram showing an example of the coating order. An explanatory diagram showing an example of small-volume coating. An explanatory diagram showing an example of large-volume coating. An explanatory diagram showing an example of underfill U being applied. A flowchart showing a modified coating order setting process.
[0010] Embodiments of this disclosure will be described with reference to the drawings. Figure 1 is a schematic diagram showing the configuration of a production system 1 including a molding apparatus 10. Figure 2 is a schematic block diagram showing the configuration of the molding apparatus 10 and a control device 90. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figure 1.
[0011] The production system 1 comprises a three-dimensional molding device (hereinafter referred to as the molding device) 10 that molds objects including, for example, a base material layer, wiring, electrodes, etc., on a rectangular plate-shaped pallet 5; a mounting device 80 that mounts components onto the molded objects on the pallet 5; and a management device 90 that manages the production system 1. The production system 1 may have two or more mounting devices 80, or it may have only the molding device 10 without any mounting devices 80. The molding device 10 comprises a control unit 20, a storage unit 22, a communication unit 24, an operation panel 26, a first ejection unit 30, a flattening unit 35, a second ejection unit 40, a UV irradiation unit 47, an upper heating unit 48, a press heating unit 49, a transport unit 50, a stage unit 60, and first and second transfer units 70, 75. All components except the operation panel 26 are housed within the housing 12 of the molding device 10.
[0012] The control unit 20 is configured as a microprocessor centered on a CPU 20a and includes a ROM 20b for storing processing programs, a RAM 20c used as a work area, a timer 20d for performing timing processing, and controls the entire molding apparatus 10. The storage unit 22 is configured, for example, as an HDD or SSD and stores molding job information 22a, which includes molding information such as the shape and size of the molded object (three-dimensional object), and wiring information such as wiring patterns and the position and size of electrodes. The communication unit 24 is an interface used when communicating with each device of the production system 1, such as the mounting device 80 and the management device 90. The control unit 20 exchanges information with each device of the production system 1 via the communication unit 24. The operation panel 26 is a touch panel display located on the upper front of the housing 12 and displays various information to the operator and accepts various operations from the operator.
[0013] The first ejection unit 30 includes a first inkjet head 31 and a second inkjet head 32 that eject liquid materials using an inkjet method, and an X-axis moving unit 33. The first inkjet head 31 ejects resin ink for forming the substrate layer. The resin ink is a liquid material such as a liquid curable resin (e.g., UV curable resin, thermosetting resin, two-component mixed curable resin, etc.), a thermoplastic resin, or a slurry obtained by mixing inorganic solids with a solvent. The second inkjet head 32 ejects conductive metal ink in which fine particles of metal, such as silver, are dispersed in a solvent for forming wiring. The X-axis moving unit 33 includes a guide rail provided in the X-axis direction on the front of a gate-shaped frame, and two sliders on which each inkjet head 31 and 32 are respectively arranged. The X-axis moving unit 33 moves (scans) each inkjet head 31 and 32 in the X-axis direction by moving each slider along the guide rail.
[0014] The flattening unit 35 comprises a roller 36 (flattening member) for flattening liquid on the pallet 5 and a roller lifting unit 37, and is disposed on the rear surface of the frame of the X-axis moving unit 33. The roller lifting unit 37 is configured to raise and lower the roller 36 by means of a cylinder, for example, and raises and lowers the roller 36 in the Z-axis direction between an upper standby position and a lower flattening position (working position). The flattening unit 35 flattens the surface of resin ink discharged onto the pallet 5 by leveling it with the roller 36 while the pallet 5 moves relative to it in the Y-axis direction. The flattening member is a cylindrical roller 36, but a flat blade or the like may also be used.
[0015] The second dispensing unit 40 includes a first dispensing head 41, a second dispensing head 42, and a third dispensing head 43 that dispense and apply liquid substances in a dispenser manner, an X-axis moving unit 44, and a dispensing amount measuring unit 45. The first dispensing head 41 and the second dispensing head 42 dispense and apply conductive paste for electrode molding. The first dispensing head 41 and the second dispensing head 42 include a cylindrical syringe that contains the conductive paste and a needle that extends coaxially from the lower end of the syringe and dispenses the conductive paste from the discharge port by pressure applied to the syringe. The conductive paste is, for example, a liquid resin in which conductive material is dispersed. As the conductive paste, for example, a resin that hardens when heated and in which metal particles such as silver are dispersed is used. The viscosity and conductivity of the conductive paste dispensed by the first dispensing head 41 and the second dispensing head 42 are different. The third dispensing head 43 dispenses and applies a resin paste, such as a thermosetting resin, as an underfill. The third dispensing head 43 comprises a cylindrical syringe for containing the resin paste and a needle that extends coaxially from the lower end of the syringe and dispenses the resin paste from the discharge port due to the pressure applied to the syringe. The thermosetting resin is, for example, a liquid resin with insulating properties. The X-axis moving unit 44 comprises a guide rail provided in the X-axis direction on the front of a gate-shaped frame and a slider on which each of the dispensing heads 41, 42, and 43 is arranged. The X-axis moving unit 44 moves (scans) each of the dispensing heads 41, 42, and 43 in the X-axis direction by moving the slider. The dispensing amount measuring unit 45 detects the weight of the liquid substance dispensed from each of the dispensing heads 41, 42, and 43. The discharge volume measurement unit 45 measures the weight of the liquid being discharged when a certain pressure is applied to the syringes of each dispense head 41, 42, and 43, and outputs the measured value to the control unit 20.
[0016] The UV irradiation unit 47 is equipped with a UV lamp such as a mercury lamp, a metal halide lamp, or a UV-LED, and irradiates the UV-curable resin ejected from the first inkjet head 31 with UV light to cure it. The top heating unit 48 is equipped with an infrared heater such as a halogen heater, a ceramic heater, or a carbon heater, and heats the metal ink ejected from the second inkjet head 32 to cure it. The molding of the resin layer and the molding of the wiring are repeated multiple times, thereby layering the molded object on the pallet 5. The press heating unit 49 is equipped with a metal plate, a heater for heating the plate, and a lifting mechanism that can raise and lower the pallet 5 to press it against the plate from below. The press heating unit 49 cures the conductive paste or underfill by heating the plate while applying pressure to press the pallet 5, which is loaded with the molded object before or after component mounting, against the plate.
[0017] The transport unit 50 includes a belt conveyor 52 that transports the pallets 5 along the X-axis. The transport unit 50 transports the pallets 5 that are brought into the mounting device 80 and the pallets 5 that are discharged from the mounting device 80 in the X-axis direction by driving the belt conveyor 52.
[0018] The stage unit 60 comprises a rectangular stage 61 in a top view, a stage lifting unit 62, and a Y-axis movement unit 64. The stage unit 60 holds the pallet 5 placed on the stage 61 and moves the pallet 5 in the Y-axis direction and raises and lowers it in the Z-axis direction. The stage lifting unit 62 holds the placed pallet 5 and raises and lowers the pallet 5 by moving the stage 61, which can contact the lower surface of the pallet 5, in the Z-axis direction. The Y-axis movement unit 64 is equipped with a slider that can move along a guide rail 11, which is arranged in the center of the lower part of the molding apparatus 10 from front to back in the Y-axis direction. The stage lifting unit 62 is mounted on the slider. The Y-axis movement unit 64 moves the stage lifting unit 62 in the Y-axis direction by moving the slider. The gate-shaped frames of the X-axis movement units 33 and 44 in the first discharge unit 30 and the second discharge unit 40 are arranged to straddle the guide rail 11. The stage lifting unit 62 moves in the Y-axis direction by the slider of the Y-axis moving unit 64 to the processing positions below the first discharge unit 30, the flattening unit 35, the second discharge unit 40, the UV irradiation unit 47, and the top heating unit 48. The stage unit 60 also moves to positions such as the transfer unit 50 and the press heating unit 49 to transfer the pallet 5, and the position where the operator attaches and detaches the pallet 5.
[0019] The first transfer unit 70 transfers the pallet 5, which is to be passed between the transport unit 50 and the stage unit 60, in the X-axis direction, and includes a pusher lifting unit 71 and an X-axis moving unit 72. The pusher lifting unit 71 raises and lowers a pusher (not shown) in the Z-axis direction, for example by a cylinder, between an upper position that does not interfere with the pallet 5 and a lower position that can contact the side surface of the pallet 5. The X-axis moving unit 72 includes a gate-shaped frame that straddles the guide rail 11, a guide rail provided along the X-axis direction, and a slider that is movable along the guide rail and on which the pusher lifting unit 71 is disposed, and moves the pusher lifting unit 71 in the X-axis direction. In this embodiment, the frame and guide rail of the X-axis moving unit 72 are shared with the frame and guide rail of the X-axis moving unit 44 described above, and the slider of the X-axis moving unit 72 is provided separately from the slider of the X-axis moving unit 44. The second transfer unit 75 transfers the pallet 5, which is to be passed between the press heating unit 49 and the stage unit 60, in the X-axis direction. The second transfer unit 75, like the first transfer unit 70, includes a pusher lifting unit 76 that raises and lowers the pusher in the Z-axis direction and an X-axis moving unit 77 that moves the pusher lifting unit 76 in the X-axis direction, so its description is omitted.
[0020] As shown in Figure 1, the mounting device 80 includes a transport unit 81, a parts supply unit 82, a mounting head 83, an XY axis moving unit 85, a parts camera 86, a nozzle stocker 87, and an operation panel 88.
[0021] The transport unit 81 is equipped with a belt conveyor that transports the pallets 5 along the X-axis direction, transporting the pallets 5 to be loaded into the molding device 10 and the pallets 5 that have been unloaded from the molding device 10. The parts supply unit 82 is, for example, a tape feeder equipped with a reel containing parts on tape at predetermined intervals. Multiple tape feeders are detachably attached to the front side of the mounting device 80. The mounting head 83 is equipped with one or more nozzles for picking up parts and a nozzle lifting unit that raises and lowers the nozzles in the Z-axis direction, and mounts the parts picked up by the nozzles to predetermined positions on the pallets 5. The XY axis movement unit 85 is equipped with a Y-axis guide rail and a Y-axis slider that moves along the Y-axis guide rail, and an X-axis guide rail provided on the Y-axis slider and an X-axis slider that moves along the X-axis guide rail and on which the mounting head 83 is arranged. The XY axis movement unit 85 moves the mounting head 83 in the XY direction by moving the Y-axis slider and the X-axis slider. The parts camera 86 has an imaging range above it and captures images of parts attracted to the nozzle of the mounting head 83 from below to generate an image. The nozzle stocker 87 is configured to accommodate multiple types of nozzles of different sizes and shapes. Nozzles stored in the nozzle stocker 87 can be automatically attached to and detached from the mounting head 83. The operation panel 88 is configured as a touch panel display and displays various information to the operator and accepts various operations from the operator.
[0022] The management device 90 comprises a control unit 91, a storage unit 92, a communication unit 94, a display unit 95, and an input unit 96. The control unit 91 is configured as a microprocessor centered on a CPU and controls the entire management device 90. The storage unit 92 is configured, for example, as an HDD or SSD and stores molding job information 92a and mounting job information 92b. The molding job information 92a includes information similar to the molding job information 22a described above. The mounting job information 92b includes information such as the part name, mounting coordinates (mounting position), size, and mounting order of the parts to be mounted. The communication unit 94 is an interface used when communicating with each device of the production system 1, such as the molding device 10 and the mounting device 80. Based on requests from the molding device 10 and the mounting device 80, the control unit 91 sets the molding job information 92a and mounting job information 92b and transmits them via the communication unit 94. The display unit 95 is a display that displays images. The input unit 96 includes a keyboard, mouse, and other devices for receiving input from workers and managers.
[0023] The processing of the production system 1 configured in this way will now be explained. Figure 3 is an explanatory diagram showing an example of the overview of the processing performed in production system 1. In production system 1, the molding device 10 performs molding processing and coating processing, and the mounting device 80 performs mounting processing. In the molding process, for example, the following steps are performed: molding of the base material layer S (Figure 3 (1)), molding of wiring E on the base material layer S (Figure 3 (2)), molding of the cavity C (Figure 3 (3)), and molding of bumps B within the cavity C (Figure 3 (4)). It is possible to mold multiple base material layers S, but for convenience only one layer is shown. In the coating process, for example, the coating of underfill U within the cavity C (Figure 3 (5)) is performed. In the mounting process, for example, the mounting of components P (Figure 3 (6)) is performed. In mounting, for example, the components P are positioned so that the leads L of the components P (see Figure 5) contact (conductively) the bumps B. Furthermore, after the mounting process, additional processes are performed to fill the area around the component P with filler and to fix the component P in place by pressing and heating. Also, although Figure 3 illustrates a case where component P is mounted in two locations, typically component P is mounted in two or more locations, so multiple cavities C are also provided. The application of underfill U into each cavity C is performed sequentially according to the set application order. The process of setting the application order of underfill U is described below. Figure 4 is a flowchart of an example of the application order setting process. This process is performed by the control unit 91 of the management device 90.
[0024] In the coating order setting process shown in Figure 4, the control unit 91 first obtains information such as the part name, size (Px, Py), standoff height Hs, and mounting coordinates (mounting position) for each component P to be mounted from the mounting job information 92b (S100). For example, in the case of a component P having a lead L that protrudes outward from the body of the component P, the standoff height Hs is the height from the lower surface (installation surface) of the lead L to the lower surface of the body of the component P (see Figure 5). Note that in Figure 5, the illustration of the underfill U is omitted for explanatory purposes. Also, in the case of a component P that does not have a lead L and has electrodes provided so that they fit inside the body of the component P, the standoff height Hs is a value of 0.
[0025] Next, the control unit 91 calculates the volume V of the application area where underfill U is applied relative to the mounting coordinates (mounting position) of each component P for each component P using equation (1) (S110). For example, in the case of a component P whose main body has a rectangular bottom surface, Px is the length in the X direction on the bottom surface of the main body of component P, and Py is the length in the Y direction on the bottom surface of the main body of component P. Also, (Hs + Hb) is the height obtained by adding the bump height Hb (see Figure 5), which is the height of the bump B, to the standoff height Hs. Therefore, equation (1) is an equation for calculating the volume V of the space enclosed by the bottom surface of the main body of component P and the top surface of the base material layer S, that is, the space where underfill U is applied (filled) before the mounting of component P. The bump height Hb of each application area can be a value (fixed value) that has been registered in advance in the molding job information 22a, for example, and may be a common value for each application area or a different value for each application area.
[0026] V=Px×Py×(Hs+Hb)...(1)
[0027] Next, the control unit 91 calculates the coating time T (=V / Q0) for each coating location by dividing the volume V of each coating location by the discharge rate Q0 of the third dispensing head 43 per unit time (S120). The coating time T is usually calculated in seconds. The discharge rate Q0 is a value obtained in advance by calibration in the discharge rate measurement unit 45. For example, the discharge rate Q0 is calculated by measuring the discharge rate (weight) of the underfill U discharged from the third dispensing head 43 over a predetermined time using the discharge rate measurement unit 45, and dividing the measured discharge rate by the predetermined time. Once the coating time T is calculated, the control unit 91 sets the coating order so that each coating location (each part P) is coated first as the coating time T decreases (S130), instructs the molding device 10 to perform the coating process based on the set coating order (S140), and ends this process.
[0028] Figure 6 is an explanatory diagram showing an example of the volume V and coating time T for each component. Figure 7 is an explanatory diagram showing an example of the coating order. Figures 6 and 7 illustrate a case where seven components P, from component a to component g, are to be mounted. As explained in S100, the size (Px, Py), standoff height Hs, and mounting coordinates (X, Y) of component P are obtained for each component. In S110, the volume V is calculated for each component, and in the following S120, the coating time T is calculated by dividing the volume V for each coating location (component P) by the discharge rate Q0. In the example in Figure 6, the coating times T (volume V) for components a to g are the same minimum value for components a and d, and the remaining components are in the order of b, c, g, f, and e from smallest to largest. Figure 7 shows the coating order set by rearranging the coating times T at the coating locations of components a to g in Figure 6 in ascending order, for example, the coating order is components a, d, b, c, g, f, and e. Note that since parts a and d have the same coating time T, the order can be reversed. Alternatively, since the coating locations for parts a and d are followed by the coating location for part b, the coating location that is farther from the coating location for part b may be applied first, and the coating location that is closer may be applied later. In other words, if there are coating locations with the same coating time T, the coating order should be determined by considering the distance to the subsequent coating locations. Of course, if there are coating locations that precede the coating locations with the same coating time T, the coating order may be determined by considering the distance from the preceding coating location. The distance between coating locations can be calculated based on the coating coordinates (mounting coordinates) of each coating location.
[0029] Here, Figure 8 is an explanatory diagram illustrating an example of small-volume dispensing, showing the case where a relatively small amount of underfill U is applied to a relatively small cavity C. In this case, because the amount applied is small, the underfill U does not rise above the lower end of the needle 43a during dispensing (see Figure 8A), and normally, no underfill U adheres to the lower end of the outer surface (side) of the needle 43a after dispensing is complete (see Figure 8B). On the other hand, Figure 9 is an explanatory diagram illustrating an example of large-volume dispensing, showing the case where a relatively large amount of underfill U is applied to a relatively large cavity C. In this case, because the amount applied is large, even if the discharge volume (discharge time) is appropriately controlled, the underfill U may rise above the lower end of the needle 43a during dispensing (see Figure 9A). Therefore, underfill U may adhere to the lower end of the outer surface (side) of the needle 43a after dispensing is complete (see Figure 9B).
[0030] Figure 10 is an explanatory diagram showing an example of how underfill U is applied, and shows the applied state from above. When underfill U is applied normally, for example, underfill U is applied without excess or deficiency to the target application position, such as the center position in the cavity C, and fits between the pair of bumps B (see Figure 10A). On the other hand, underfill U adhering to the outer surface of the needle 43a (see Figure 9B) may be carried over to the next application location. In that case, even if the amount of underfill U discharged is appropriately controlled, if underfill U adhering to the needle 43a falls off and is added to the application location, the amount of applied will be more than necessary. Also, underfill U discharged from the needle 43a at the next application location may flow towards the inner wall surface of the cavity C as if pulled by the underfill U adhering to the needle 43a. When the underfill U that has flowed towards the inner wall surface comes into contact with the inner wall surface of the cavity C, it may be applied as if being pulled towards the inner wall surface (see the dotted line in Figure 10B). This results in the underfill U being unevenly applied to a location different from the intended application position. This application situation can be caused by factors other than underfill U adhering to the needle 43a, such as changes in the viscosity of the underfill U, the setting of the discharge pressure, the misalignment of the needle 43a relative to the application position, and the distance from the application position to the inner wall of the cavity C.
[0031] In any case, this coating condition results in insufficient application of underfill U between the bumps B, which are the intended application locations, making it impossible to properly fix the component P, and ultimately causing poor electrical contact between the lead L and the bumps B. Furthermore, this coating condition is more likely to occur when applying underfill U to areas with a small amount of underfill U after areas with a large amount of underfill U. This is thought to be because, at areas with a large amount of underfill U, the underfill U tends to adhere to the outer surface of the needle 43a, while at areas with a small amount of underfill U, the proportion of underfill U carried in becomes larger, resulting in an excessive amount of underfill U, and because the distance from the application location to the inner wall of the cavity C is small, the underfill U tends to be drawn towards the inner wall surface. In this embodiment, as described above, the application order is set so that underfill U is applied in order from the shortest application time T, so that such a coating condition can be prevented. As a result, underfill U can be properly applied to each application location, and the component P can be securely fixed.
[0032] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The control unit 91 of the management device 90 that executes steps S100 to S120 of the coating order setting process in this embodiment corresponds to the acquisition unit of the present disclosure, and the control unit 91 that executes step S130 of the coating order setting process corresponds to the setting unit. In this embodiment, an example of the coating order setting method of the present disclosure is also clarified by explaining the operation of the management device 90.
[0033] In the production system 1 (molding system) of this embodiment described above, the control unit 91 acquires the coating time T as a related value related to the coating amount based on the volume V of the space to which the underfill U (filler) is filled, and sets the coating order of multiple coating locations so that the smaller the coating time T, the earlier the coating. Therefore, it is possible to suppress the effect of underfill U adhering to the needle 43a (dispensing member) at coating locations with a large coating amount being carried over to coating locations with a small coating amount. Thus, underfill U can be appropriately applied to multiple coating locations.
[0034] Furthermore, the control unit 91 obtains a coating time T as a related value for each of the multiple coating locations, based on the volume V calculated from the size of the lower surface of the main body of the component P to be mounted (Px × Py) and the height of the gap between the lower surface of the main body of the component P and the upper surface of the base material layer S when the component P is mounted (Hs + Hb). Therefore, the control unit 91 can obtain the coating time T as a related value appropriately with a simple process and set the coating order more appropriately.
[0035] Furthermore, in the coating process, underfill U is dispensed from the needle 43a for each of the multiple coating locations based on the coating time T, which is calculated from the volume V and the discharge rate Q0 per unit time. Therefore, since the coating order is set using the required coating time T as a related value, it is possible to prevent an increase in processing load in order to obtain the related value.
[0036] Furthermore, during the molding process, concave cavities C are created as multiple coating locations. During the coating process, underfill U is extruded and applied into the cavities C. When underfill U is extruded and applied into the cavities C, if underfill U adhering to the needle 43a at previous coating locations is brought in, it tends to be drawn towards the inner wall surface of the cavity C, resulting in an uneven coating. This type of coating is more likely to occur if the coating order is set so that underfill U is applied to areas with a large coating amount followed by areas with a small coating amount. Therefore, setting the coating order as in this embodiment is highly significant in preventing such coating issues.
[0037] Furthermore, the molding apparatus 10 of the production system 1 (molding system) includes a first inkjet head 31 (first ejection unit) that ejects resin ink (first non-conductive fluid) to form a substrate layer S (insulator), and a second inkjet head 32 (second ejection unit) that ejects metal ink (first conductive fluid) to form wiring E. In addition, the molding apparatus 10 includes a first dispense head 41 (third ejection unit) that ejects conductive paste (second conductive fluid) to form bumps B (conductors), and a third dispense head 43 (fourth ejection unit) that ejects underfill U (second non-conductive fluid) as a filler from a needle 43a (dispensing member) and applies it. Furthermore, in the molding process, wiring E is molded on the substrate layer S molded by the first inkjet head 31 by the second inkjet head 32, and bumps B are molded on the wiring E at the positions where the electrodes of component P are to be placed by the first dispense head 41, thereby forming the object. Then, in the coating process, underfill U is applied by the third dispense head 43 at the positions on the object where the body of component P is to be placed. This system can mold the substrate layer S, mold the wiring E, mold the bumps B, and apply the underfill U. Furthermore, since the underfill U is applied in order of increasing amount to at least some of the multiple locations where the body of component P is to be placed, the influence of underfill U adhering to the needle 43a in areas with high application amounts being carried over to areas with low application amounts can be suppressed. Therefore, underfill U can be appropriately applied to multiple locations where the body of component P is to be placed.
[0038] It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.
[0039] In the embodiment, the application area is exemplified as being within a rectangular recessed cavity C when viewed from above, but it is not limited to such a shape and may be within a cavity C of other shapes, or it may be outside of a cavity C.
[0040] In this embodiment, the control unit 91 acquires the coating time T as a related value related to the coating amount and sets the coating order with a tendency to apply earlier the coating time T is smaller, but it is not limited to this. The control unit 91 may acquire the volume V of the coating location as a related value and set the coating order with a tendency to apply earlier the volume V is smaller. Alternatively, the control unit 91 may acquire the coating amount (discharge amount) of the coating location as a related value and set the coating order with a tendency to apply earlier the coating amount is smaller.
[0041] In this embodiment, the control unit 91 obtained a related value (coating time T) based on the size of the lower surface of the main body of the component P and the volume V calculated from the height (Hs + Hb) of the gap between the lower surface of the main body of the component P and the upper surface of the base material layer S, but is not limited to this. The control unit 91 may obtain any related value as long as it obtains the related value based on the volume V of the space in which the underfill U is coated.
[0042] In this embodiment, the control unit 91 sets the coating order for all of the multiple coating locations in such a way that the smaller the correlation value, the earlier the coating is applied. However, it is not limited to this. The control unit 91 only needs to set the coating order for at least some of the multiple coating locations in such a way that the smaller the correlation value, the earlier the coating is applied. Figure 11 is a flowchart of the coating order setting process in a modified example. In this modified example, the same steps as in the embodiment are given the same step numbers and their explanations are omitted.
[0043] In the modified coating order setting process, the control unit 91 sets the coating order of multiple coating locations such that coating locations with a coating time T of less than or equal to a predetermined time are coated first (S130b). The control unit 91 also sets the coating order of the remaining coating locations, i.e., coating locations with a coating time T exceeding a predetermined time, such that coating locations that are closer to each other are coated first (S135). In S135, the control unit 91 sets the coating location closest to the last coating location set in S130b as the first coating location, and thereafter sets the coating location that is closer to the set coating location as the next coating location. The distance between coating locations can be calculated based on the coating coordinates (implementation coordinates) of each coating location.
[0044] Thus, in the modified example, the control unit 91 sets the application order of the application locations where the application time T (related value) is less than or equal to a predetermined time (predetermined value) among the plurality of application locations in a tendency of increasing order of the application time T. Further, the control unit 91 sets the application order of the application locations where the application time T exceeds the predetermined time in a tendency different from the tendency of increasing order of the application time T, for example, in a tendency of applying earlier as the distance between the application locations is closer. Therefore, in the application location where the application amount is relatively small because the application time T is less than or equal to the predetermined time, it is possible to prevent the influence of the underfill U adhering to the needle 43a at the application location with the earlier application order being brought into the application location with the later application order. On the other hand, as described above, in the application location where the application amount is relatively large, the influence of the underfill U adhering to the needle 43a being brought into the application location with the later application order is small. Therefore, by setting a tendency of applying earlier as the distance between the application locations is closer, the movement amount of the needle 43a (the third dispensing head 43) and the stage unit 60 can be reduced, and the application at the next application location can be started promptly, so that the application process can be performed efficiently.
[0045] In the modified example, the application order of the application locations where the application time T exceeds the predetermined time is set in a tendency of increasing order of the distance between the application locations. However, the present invention is not limited to this, and any tendency may be adopted as long as it is different from the tendency of increasing order of the related value such as the application time T.
[0046] In the embodiment, the second discharge unit 40 includes a plurality of dispensing heads. However, a discharge unit including at least one dispensing head that discharges a filler may be used. Further, the third dispensing head 43 has been exemplified as discharging a resin paste such as a thermosetting resin as the underfill U. However, the present invention is not limited to this, and any filler may be discharged as long as it is filled in the location where the component P is to be mounted. Further, in the embodiment, the application order setting process is executed by the control unit 91 of the management device 90. However, the present invention is not limited to this, and the control unit 20 of the modeling device 10 may execute the process. Further, the present disclosure is in the form of a modeling system, but may also be in the form of an application order setting method.
[0047] The present disclosure may be configured as follows. For example, the method for setting the coating order in the present disclosure is a method for setting the coating order in a coating process in which a filler is discharged from a discharge member and applied to a plurality of locations where mounting is planned before a component is mounted on a formed object formed by a forming process, and includes: (a) for each of the plurality of locations, obtaining a correlation value related to the coating amount based on the volume of the space filled with the discharged filler; and (b) setting the coating order of at least a part of the plurality of locations in the coating process such that the smaller the correlation value obtained in step (a), the earlier the coating is performed.
[0048] In the method for setting the coating order of the present disclosure, similar to the above-described forming system of the present disclosure, coating is performed in ascending order of the coating amount at at least a part of a plurality of locations, so that the influence of the filler adhering to the discharge member at a location with a large coating amount being brought into a location with a small coating amount can be suppressed. Therefore, the filler can be appropriately applied to a plurality of locations where components are mounted. In this method for setting the coating order, various aspects of the forming system of the present disclosure may be adopted, or steps for realizing the functions of the forming system of the present disclosure may be added.
[0049] In this specification, the technical idea of changing "the forming system according to claim 1 or 2" in claim 4 at the time of filing to "the forming system according to any one of claims 1 to 3", the technical idea of changing "the forming system according to claim 1 or 2" in claim 5 at the time of filing to "the forming system according to any one of claims 1 to 4", and the technical idea of changing "the forming system according to claim 1 or 2" in claim 6 at the time of filing to "the forming system according to any one of claims 1 to 5" are also disclosed.
[0050] The present disclosure is applicable to the technical field of discharging and applying a filler to a location where a component is mounted.
[0051] 1 Production system, 5 Pallets, 10 3D printing device, 11 Y-axis rail, 12 Housing, 20 Control unit, 20a CPU, 20b ROM, 20c RAM, 20d Timer, 22 Storage unit, 22a, 92a Printing job information, 24 Communication unit, 26, 88 Operation panel, 30 First ejection unit, 31 First inkjet head, 32 Second inkjet head, 33, 44 X-axis movement unit, 35 Flattening unit, 36 Roller, 37 Roller lifting unit, 40 Second ejection unit, 41 First dispensing head, 42 Second dispensing head, 43 Third dispensing head, 43a Needle, 45 Dispensing amount measurement unit, 47 UV irradiation unit, 48 Top heating unit, 49 Press heating unit, 50 Conveying unit, 52 Belt conveyor, 60 Stage unit, 61 Stage, 62 Stage lifting unit, 64 Y-axis moving unit, 70 First transfer unit, 71, 76 Pusher lifting unit, 72, 77 X-axis moving unit, 75 Second transfer unit, 80 Mounting device, 81 Transport unit, 82 Parts supply unit, 83 Mounting head, 85 XY-axis moving unit, 86 Parts camera, 87 Nozzle stocker, 90 Management device, 92 Storage unit, 92b Mounting job information, 94 Communication unit, 95 Display unit, 96 Input unit, B Bump, C Cavity, E Wiring, P Parts, S Substrate layer, U Underfill.
Claims
1. A molding system that performs a coating process in which a filler is dispensed from an extrusion member and applied to a plurality of locations where parts are to be mounted on a molded object formed by a molding process, wherein the system comprises: an acquisition unit that acquires a related value related to the amount of coating based on the volume of the space to which the dispensed filler is to be filled for each of the plurality of locations; and a setting unit that sets the coating order of at least some of the plurality of locations in the coating process, such that the smaller the related value acquired by the acquisition unit, the earlier the coating is applied.
2. The molding system according to claim 1, wherein the acquisition unit acquires the relevant value for each of the plurality of locations based on the size of the lower surface of the main body of the component to be mounted and the volume calculated from the height of the gap between the lower surface of the main body of the component and the upper surface of the molded object when the component is mounted.
3. The molding system according to claim 1 or 2, wherein, in the coating process, filler is dispensed from the dispensing member and applied to each of the plurality of locations based on a coating time calculated from the coating amount and the dispensing amount per unit time of the dispensing member, and the acquisition unit acquires the coating time as the related value.
4. The molding system according to claim 1 or 2, wherein the setting unit sets the coating order of the locations where the related value is less than or equal to a predetermined value according to the trend, and sets the coating order of the locations where the related value exceeds the predetermined value according to a trend different from the trend.
5. The molding system according to claim 1 or 2, wherein, in the molding process, concave cavities are formed as the plurality of locations, and in the coating process, a filler is dispensed and coated into the cavities.
6. A molding system according to claim 1 or 2, comprising: a first dispensing unit for dispensing a first nonconductive fluid to form an insulator; a second dispensing unit for dispensing a first conductive fluid to form wiring; a third dispensing unit for dispensing a second conductive fluid to form a conductor; and a fourth dispensing unit for dispensing a second nonconductive fluid as a filler from the dispensing member to apply the filler, wherein in the molding process, the second dispensing unit forms the wiring on the insulator formed by the first dispensing unit, and the third dispensing unit forms a conductor on the wiring at the position where the electrodes of the component are to be placed, thereby forming the molded object; and in the coating process, the fourth dispensing unit applies the filler to the molded object at the position where the body of the component is to be placed.
7. A method for setting the coating order in a coating process in which a filler is dispensed from an extrusion member and applied to a plurality of locations where parts are to be mounted on a molded object created by a molding process, the method comprising: (a) obtaining a related value related to the amount of coating based on the volume of the space to be filled with the dispensed filler for each of the plurality of locations; and (b) setting the coating order of at least some of the plurality of locations in the coating process such that the smaller the related value obtained in step (a), the earlier the coating is applied.