Resin composition for forming optical member

Abstract

[Problem] To provide a resin composition which is suitable for the formation of an optical member that comprises an optical waveguide, and a cured film formed of which has excellent transparency by containing a specific siloxane resin that has good compatibility with a (meth)acrylate compound or the like that is used, as a crosslinking agent, together with this resin composition, while having low propagation loss. [Solution] Disclosed is a resin composition for forming an optical member, which contains: (a) a polycondensate that contains at least partial structures represented by formula (1), formula (2), and formula (3); (b) at least one (meth)acrylate compound; and (c) a photopolymerization initiator. (In the formula (1), R1 is a methyl group or H; and L1 is an alkylene group having 1 to 10 carbon atoms, which may be substituted. In the formula (2), R2 and R3 may be the same or different and are each independently H, an alkyl group having 1 to 5 carbon atoms or an allyl group, which may be substituted; and L2 is an alkylene group having 1 to 10 carbon atoms, which may be substituted. In the formula (3), R4 is an alkyl group having 1 to 5 carbon atoms, which may be substituted.)

Description

Resin composition for forming optical components

[0001] The present invention relates to a resin composition for forming optical components, comprising a polysiloxane compound, a (meth)acrylate compound, and a photopolymerization initiator.

[0002] In recent years, communication traffic has been steadily increasing due to the development of cloud computing and the rise in smartphone users. As a result, problems such as enormous power consumption and approaching processing limits have become apparent at data servers where transmitted information data is concentrated, making technological advancements to improve these issues an urgent necessity. In this context, a technology called optoelectronic mixed-signal substrate (also called optoelectronic composite substrate), which replaces some of the electrical wiring in server boards with optical wiring, is being actively investigated as a technology that can process information at high density and speed, and research and development of optical components that control the refraction, transmission, and scattering of light are attracting increasing attention.

[0003] A photoelectric mixed-signal substrate is a substrate that incorporates an optical waveguide, which is an optical transmission path, a photoelectric conversion element that converts electrical signals into optical signals, and an electrical circuit board. This enables improved data transfer speed and reduced power consumption, dramatically improving the communication efficiency of devices.

[0004] An optical waveguide is a structure for transmitting optical signals along a specific path. An optical waveguide consists of a core through which light primarily propagates and a surrounding cladding. Due to the difference in refractive index between the core and cladding, incident light propagates within the core while undergoing total internal reflection. This technology allows for efficient light guidance, minimizing losses and enabling communication and data processing.

[0005] Core materials and cladding materials used for optical waveguides are required to have optical properties such as refractive index and stability against heat / light / moisture / temperature changes, etc. In the development of optical waveguide materials, siloxane resins using methylsilane are known as materials with low propagation loss. Furthermore, photocurable low propagation loss siloxane resins that co-condense with silanes having polymerizable groups have been studied (Non-Patent Document 1, Non-Patent Document 2, Patent Document 1). However, resins composed of methylsilane and methacrylsilane have low propagation loss, but have poor compatibility with other acrylate compounds used as crosslinking agents, and tend to become turbid when producing a cured film, resulting in a problem of reduced transparency.

[0006] As optical waveguide materials, from the viewpoint of improving the curability of the film, it is generally carried out to use them in combination with a crosslinking agent or a reactive diluent. Therefore, the compatibility with a crosslinking agent or the like used in combination with the resin is important from the viewpoint of the transparency of the cured film. The better the compatibility, the more the decrease in transmittance due to film turbidity or the like can be suppressed when producing a cured film.

[0007] Japanese Patent No. 3952149

[0008] Mol. Cryst. Liq. Cryst., Vol. 520: pp. 215 /

[491] -222 /

[498] , 2010 Thin Solid Films 517 (2008), 857-862

[0009] The present invention provides a resin composition suitable for forming an optical member including an optical waveguide, which contains a specific siloxane resin having low propagation loss and good compatibility with a (meth)acrylate compound or the like used in combination, and thus has excellent transparency of the produced cured film.

[0010] The present invention has been made to solve the above problems, that is, a first aspect of the present invention is a resin composition for forming an optical member, comprising: (a) a polycondensate containing at least partial structures represented by formula (1), formula (2) and formula (3); (b) at least one kind of (meth)acrylate compound; and (c) a photopolymerization initiator. (In formula (1), R １ is a methyl group or H, and L １is an alkylene group having 1 to 10 carbon atoms which may be substituted. In formula (2), R ２ and R ３ may be the same or different, and each independently is H, an alkyl group having 1 to 5 carbon atoms which may be substituted, or an allyl group. L ２ is an alkylene group having 1 to 10 carbon atoms which may be substituted. In formula (3), R ４ is an alkyl group having 1 to 5 carbon atoms which may be substituted.) The second form of the present invention is the resin composition for forming an optical member according to the first form, wherein the above L １ is an unsubstituted alkylene group having 1 to 10 carbon atoms. The third form of the present invention is the resin composition for forming an optical member according to the first or second form, wherein the above R ２ and R ３ may be the same or different, and each independently is H, an unsubstituted alkyl group having 1 to 5 carbon atoms, or an allyl group, and L ２ is an unsubstituted alkylene group having 1 to 10 carbon atoms. The fourth form of the present invention is the resin composition for forming an optical member according to any one of the first to third forms, wherein the above R ４ is an unsubstituted alkyl group having 1 to 5 carbon atoms. The fifth form of the present invention is the resin composition for forming an optical member according to any one of the first to fourth forms, wherein at least one of the above R ２ and R ３ is an allyl group. The sixth form of the present invention is the resin composition for forming an optical member according to any one of the first to fifth forms, wherein the above R ２ and R ３ are allyl groups. The seventh form of the present invention is the above R ４It is the resin composition for optical member formation according to any one of the first to sixth forms in which it is a methyl group. The eighth form of the present invention is the resin composition for optical member formation according to any one of the first to seventh forms in which the HAZE value of the cured product of the resin composition for optical member formation is 0 to 15% at a film thickness of 8 μm. The ninth form of the present invention is the resin composition for optical member formation according to any one of the first to eighth forms in which at least one Hansen solubility parameter of the above (meth)acrylate compound is 15 to 30. The tenth form of the present invention is the resin composition for optical member formation according to any one of the first to ninth forms further containing a solvent. The eleventh form of the present invention is the resin composition for optical member formation according to any one of the first to tenth forms further containing inorganic fine particles. The twelfth form of the present invention is the resin composition for optical member formation according to any one of the first to eleventh forms in which the optical member is an optical waveguide. The thirteenth form of the present invention is the resin composition for optical member formation according to any one of the first to eleventh forms in which the optical member is the core part of the optical waveguide. The fourteenth form of the present invention is an optical waveguide containing a cured product of the resin composition for optical member formation according to any one of the first to eleventh forms. The fifteenth form of the present invention is an optoelectronic hybrid substrate containing the optical waveguide of the fourteenth form. The sixteenth form of the present invention is an apparatus containing the optoelectronic hybrid substrate of the fifteenth form.

[0011] The inventors have found that the polycondensate containing at least the partial structures represented by the above formulas (1), (2) and (3) has low propagation loss and good compatibility with the (meth)acrylate compound. Furthermore, the inventors have found that a cured film with low turbidity (high transparency) can be formed from the resin composition for optical member formation of the present invention containing the above polycondensate, the (meth)acrylate compound, and a photoinitiator.

[0012] Figure 1 is an optical micrograph from the top surface of the line pattern. Figure 2 is an optical micrograph of the cross-section of one line pattern among the line patterns.

[0013] The resin composition for forming optical components of the present invention comprises (a) a polycondensate containing at least a substructure represented by the following formulas (1), (2), and (3), (b) at least one (meth)acrylate compound, and (c) a photopolymerization initiator.

[0014] <Component (a): Polycondensate> Component (a) of the resin composition for forming optical components of the present invention is a polycondensate comprising at least a substructure represented by formula (1), formula (2), and formula (3). In formula (1), R １ is a methyl group or H, L １ R represents an alkylene group having 1 to 10 carbon atoms, which may be substituted, and in formula (2), R ２ and R ３ They may be the same or different, and each independently represents H, an alkyl group or allyl group having 1 to 5 carbon atoms, which may be substituted, and L ２ R represents an alkylene group having 1 to 10 carbon atoms, which may be substituted, and in formula (3), R ４ represents an alkyl group having 1 to 5 carbon atoms, which may be substituted.

[0015] L １ and L ２This is an alkylene group having 1 to 10 carbon atoms, which may be substituted. Examples of alkylene groups having 1 to 10 carbon atoms include methylene group, ethylene group, trimethylene group, n-propylene group, isopropylene group, cyclopropylene group, n-butylene group, isobutylene group, s-butylene group, t-butylene group, cyclobutylene group, 1-methyl-cyclopropylene group, 2-methyl-cyclopropylene group, n-pentylene group, 1-methyl-n-butylene group, 2-methyl-n-butylene group, 3-methyl-n-butylene group, 1,1-dimethyl-n-propylene group, 1,2-dimethyl-n-propylene group, 2,2-dimethyl-n- Propylene, 1-ethyl-n-propylene group, cyclopentylene group, 1-methyl-cyclobutylene group, 2-methyl-cyclobutylene group, 3-methyl-cyclobutylene group, 1,2-dimethyl-cyclopropylene group, 2,3-dimethyl-cyclopropylene group, 1-ethyl-cyclopropylene group, 2-ethyl-cyclopropylene group, n-hexylene group, 1-methyl-n-pentylene group, 2-methyl-n-pentylene group, 3-methyl-n-pentylene group, 4-methyl-n-pentylene group, 1,1-dimethyl-n-butylene group, 1,2-dimethyl -n-butylene group, 1,3-dimethyl-n-butylene group, 2,2-dimethyl-n-butylene group, 2,3-dimethyl-n-butylene group, 3,3-dimethyl-n-butylene group, 1-ethyl-n-butylene group, 2-ethyl-n-butylene group, 1,1,2-trimethyl-n-propylene group, 1,2,2-trimethyl-n-propylene group, 1-ethyl-1-methyl-n-propylene group, 1-ethyl-2-methyl-n-propylene group, cyclohexylene group, 1-methyl-cyclopentylene group, 2-methyl-cyclopentylene group, 3-methyl-cyclo Pentylene group, 1-ethyl-cyclobutylene group, 2-ethyl-cyclobutylene group, 3-ethyl-cyclobutylene group, 1,2-dimethyl-cyclobutylene group, 1,3-dimethyl-cyclobutylene group, 2,2-dimethyl-cyclobutylene group, 2,3-dimethyl-cyclobutylene group, 2,4-dimethyl-cyclobutylene group, 3,3-dimethyl-cyclobutylene group, 1-n-propyl-cyclopropylene group, 2-n-propyl-cyclopropylene group, 1-isopropyl-cyclopropylene group, 2-isopropyl-cyclopropylene group, 1,2,Examples include 2-trimethylcyclopropylene group, 1,2,3-trimethylcyclopropylene group, 2,2,3-trimethylcyclopropylene group, 1-ethyl-2-methylcyclopropylene group, 2-ethyl-1-methylcyclopropylene group, 2-ethyl-2-methylcyclopropylene group, 2-ethyl-3-methylcyclopropylene group, n-heptylene group, n-octylene group, n-nonylene group, or n-decanylene group. The alkylene group having 1 to 10 carbon atoms may be substituted with alkyl groups, alkenyl groups, aryl groups, halogen groups, hydroxyl groups, nitro groups, sulfone groups, amino groups, etc.

[0016] L １ and L ２ Preferably, it is an unsubstituted alkylene group having 1 to 10 carbon atoms. More preferably, it is an unsubstituted alkylene group having 1 to 8 carbon atoms. Particularly preferably, it is an unsubstituted alkylene group having 1 to 4 carbon atoms.

[0017] R ２ and R ３ These may be the same or different, and each may independently be H, an alkyl group or allyl group having 1 to 5 carbon atoms, or a substituted alkyl group. Examples of alkyl groups having 1 to 5 carbon atoms include methyl group, ethyl group, n-propyl group, i-propyl group, cyclopropyl group, n-butyl group, i-butyl group, s-butyl group, t-butyl group, n-pentyl group, and 1-methyl-n-butyl group. These alkyl groups having 1 to 5 carbon atoms may be substituted with alkyl groups, alkenyl groups, aryl groups, halogen groups, hydroxyl groups, nitro groups, sulfone groups, amino groups, etc.

[0018] Preferably, R ２ and R ３ However, they may be the same or different, and each is independently H, an unsubstituted alkyl group or allyl group having 1 to 5 carbon atoms. More preferably, R ２ and R ３ At least one of them is an allyl group. Particularly preferred is R ２ and R ３ This is an allyl group.

[0019] R ４This is an alkyl group having 1 to 5 carbon atoms, which may be substituted. Examples of alkyl groups having 1 to 5 carbon atoms include methyl group, ethyl group, n-propyl group, i-propyl group, cyclopropyl group, n-butyl group, i-butyl group, s-butyl group, t-butyl group, n-pentyl group, and 1-methyl-n-butyl group. This alkyl group having 1 to 5 carbon atoms may be substituted with alkyl groups, alkenyl groups, aryl groups, halogen groups, hydroxyl groups, nitro groups, sulfone groups, amino groups, etc.

[0020] Preferably, R ４ is an unsubstituted alkyl group having 1 to 5 carbon atoms. More preferably, R ４ This is a methyl group.

[0021] As is conventionally known, the substructure represented by formula (1) contributes to the photocurability of the polycondensate, and the substructure represented by formula (3) contributes to the low refractive index of the polycondensate, enabling the formation of an optical waveguide with low propagation loss.

[0022] Furthermore, by having a substructure represented by formula (2), the polycondensate is easily mixed with the (meth)acrylate compound of component (b) below, and the resin composition for forming optical components of the present invention can form a cured product with high transparency. The substructure represented by formula (2) is preferably R ２ and R ３ The allyl group is L ２ The following formula (2-1) is a trimethylene group, or R ２ is an allyl group, R ３ is a hydrogen atom, L ２ The structure is represented by the following formula (2-2), where is a trimethylene group.

[0023] In a polycondensate containing a substructure represented by formula (1), a substructure represented by formula (2), and a substructure represented by formula (3), the substructure represented by formula (1) originates from the compound represented by formula (4) below, the substructure represented by formula (2) originates from the compound represented by formula (5) below, and the substructure represented by formula (3) originates from the compound represented by formula (6) below.

[0024] (In the formula, R５ R is an alkyl group having 1 to 4 carbon atoms, which may be substituted, or H. １ and L １ (The same applies as above.)

[0025] (In the formula, R ６ R is an alkyl group having 1 to 4 carbon atoms, which may be substituted, or H. ２ , R ３ , L ２ (The same applies as above.)

[0026] (In the formula, R ７ R is an alkyl group having 1 to 4 carbon atoms, which may be substituted, or H. ４ (The same applies as above.)

[0027] Examples of alkyl groups having 1 to 4 carbon atoms include methyl, ethyl, n-propyl, i-propyl, cyclopropyl, n-butyl, i-butyl, s-butyl, t-butyl, cyclobutyl, 1-methylcyclopropyl, or 2-methylcyclopropyl groups. These alkyl groups having 1 to 4 carbon atoms may be substituted with alkyl groups, alkenyl groups, aryl groups, halogen groups, hydroxyl groups, nitro groups, sulfone groups, amino groups, etc.

[0028] R ５ , R ６ and R ７ Preferably, it is an unsubstituted alkyl group having 1 to 4 carbon atoms or H.

[0029] In the present invention, the compound represented by formula (4) may be used alone or in combination of two or more. Specific examples include the compounds represented by the following formulas (4-1) to (4-4). (In the formula, R ５ (These are methyl, ethyl, propyl, or isopropyl.)

[0030] In the present invention, the compound represented by formula (5) may be used alone or in combination of two or more. Specific examples include the compounds represented by the following formulas (5-1) to (5-2). (In the formula, R ６ (These are methyl, ethyl, propyl, or isopropyl.)

[0031] In the present invention, the compound represented by formula (6) may be used alone or in combination of two or more. Specific examples include the compounds represented by the following formulas (6-1) to (6-4). (In the formula, R ７ is methyl, ethyl, propyl, or isopropyl, where Me represents a methyl group and Et represents an ethyl group. ｎ Pr represents a propyl group, ｉ Pr represents the isopropyl group.

[0032] <(b) Component: (meth)acrylate compound> The resin composition for forming optical components of the present invention contains a (meth)acrylate compound as a crosslinking agent or reaction diluent. In the present invention, a (meth)acrylate compound includes both an acrylate compound and a methacrylate compound; for example, (meth)acrylic acid includes acrylic acid and methacrylic acid.

[0033] Specifically, the above (meth)acrylate compounds include, for example, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, glycerin tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, Ethoxylated pentaerythritol tetra(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, ethoxylated glycerin tri(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, 1,3-propanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 2-methyl-1,8-octanediol di(meth)acrylate, 1,9-nonanediol di( Meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, bis(2-hydroxyethyl) isocyanurate di(meth)acrylate, tris(2-hydroxyethyl) isocyanurate Anurate tri(meth)acrylate, tricyclo[5.2.1.02,6]decanedimethyl di(meth)acrylate, dioxaneglycol di(meth)acrylate, 2-hydroxy-1-acryloyloxy-3-methacryloyloxypropane, 2-hydroxy-1,3-di(meth)acryloyloxypropane, 9,9-bis[4-(2-(meth)acryloyloxyethoxy)phenyl]fluorene, bis[4-(meth)acryloylthiophenyl]sulfide, bis[2-(meth)acryloylthioethyl]sulfide, 1,Examples of (meth)acrylate compounds include 3-adamantanediol di(meth)acrylate, 1,3-adamantanedimethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and polypropylene glycol di(meth)acrylate. Among these, preferred (meth)acrylate compounds include pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, and tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate.

[0034] <Hansen Solubility Parameter (HSP)> The compatibility between the (meth)acrylate compound (component b) and the polycondensate (component a) contained in the resin composition for forming optical components is evaluated using the Hansen solubility parameter (HSP). The Hansen solubility parameter (HSP) is commonly used to evaluate the compatibility and solubility of substances. The closer the HSP value of the (meth)acrylate compound and the HSP value of the polycondensate are, the more likely they are to be compatible. (In the formula, δ Ｄ δ is the dispersion force term, Ｐ is the polar term, δ Ｈ (This is the hydrogen bond term.)

[0035] In this specification, the HSP of acrylate compounds was calculated using Winmostar (manufactured by CrossAbility Co., Ltd.). In the case of a mixture of acrylate compounds, the HSP of the main component with the highest proportion was used.

[0036] Of the (meth)acrylate compounds contained in the resin composition for forming optical components, the Hansen solubility parameter of at least one is preferably 15 to 30. More preferably, it is 17 to 25.

[0037] Examples of (meth)acrylate compounds having Hansen solubility parameters within this range are listed below.

[0038]

[0039] <Component (c): Photopolymerization Initiator> Component (c) of the resin composition for forming optical components of the present invention is a photopolymerization initiator. Among photopolymerization initiators, photoradical initiators are preferred. Photoradical initiators are compounds that generate radicals in reaction with light such as ultraviolet light, and examples include alkylphenones, benzophenones, Michler ketones, acylphosphine oxides, benzoylbenzoates, oxime esters, tetramethylthiuram monosulfides, and thioxanthones, with photocleavage-type photoradical polymerization initiators being particularly preferred. As the aforementioned photoradical initiators, commercially available products such as IRGACURE® 184, 369, 651, 500, 819, 907, 784, 2959, CGI1700, CGI1750, CGI1850, CG24-61, TPO, 1116, 1173, OXE01, OXE02, OXE03, OXE04, OXE05, OXE03-NP (all manufactured by BASF Japan Ltd.), ESACURE KIP150, KIP65LT, KIP100F, KT37, KT55, KTO46, and KIP75 (all manufactured by Lambertia) and ADEKA Cruise N-1919T, NCI-831E, NCI-930, and NCI-730 (all manufactured by ADEKA Corporation) can be used.

[0040] <Content of Main Components> The content of component (a) in the resin composition for forming optical components of the present invention is 5% to 97% by mass based on 100% by mass of the total solid content in the composition. Preferably, it is 10% to 95% by mass. Furthermore, the content of component (b) in the resin composition for forming optical components of the present invention is preferably added in the range of 3% to 70% by mass based on 100% by mass of the total solid content in the composition. More preferably, it is in the range of 5% to 60% by mass.

[0041] Furthermore, in the resin composition for forming optical components of the present invention, in order to maintain good compatibility with component (b), the proportion of component (a) of the substructure represented by formula (2) is determined according to the content of component (b). For example, when the content of component (a) is 5% to 97% by mass and the content of component (b) is 3% to 60% by mass based on 100% by mass of the total solid content in the composition, the proportion of component (a) of the substructure represented by formula (2) is 5% to 37% by mass.

[0042] The content of component (c) in the resin composition for forming optical components of the present invention is not particularly limited, but is preferably 0.1% to 15% by mass based on 100% by mass of the total solid content in the composition. More preferably, it is 0.5% to 10% by mass.

[0043] <Inorganic Fine Particles> The resin composition for forming optical components of the present invention may further contain inorganic fine particles. Preferably, the inorganic fine particles consist of at least one of aluminum compounds, calcium compounds, potassium compounds, magnesium compounds, silicon compounds, and titanium compounds, or a mixture of two or more of these. Examples include aluminum compounds such as alumina and aluminum hydroxide, calcium compounds such as calcium carbonate and calcium hydroxide, potassium compounds such as potassium carbonate, magnesium compounds such as magnesia, dolomite, and basic magnesium carbonate, silicon compounds such as silicon dioxide (silica) and zeolite, and titanium compounds such as titanium dioxide (titania). In addition, phosphorus and phosphorus compounds can be used as the inorganic fine particles. A preferred inorganic fine particle is silicon dioxide (silica).

[0044] Furthermore, while the shape of the inorganic nanoparticles is not particularly limited, it is desirable that they be approximately spherical, ellipsoidal, or polyhedral, or otherwise approximate spherical.

[0045] Furthermore, the average primary particle diameter of the above inorganic fine particles, as observed by transmission electron microscopy, can be in the range of 3 nm to 150 nm, 5 nm to 130 nm, or 10 nm to 100 nm.

[0046] Furthermore, the content of the inorganic fine particles in the resin composition for forming optical components of the present invention is not particularly limited, but is preferably 1% to 50% by mass based on 100% by mass of the resin component in the composition. More preferably, it is 5% to 30% by mass.

[0047] <Solvent> The resin composition for forming optical components of the present invention may further contain a solvent. The solvent is not particularly limited as long as it dissolves components (a), (b), and (c).

[0048] Examples of the aforementioned solvents include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, propylene glycol monobutyl ether, propylene glycol monobutyl ether acetate, toluene, xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyethyl acetate, ethyl hydroxyethyl acetate, methyl 2-hydroxy-3-methylbutanoate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, methyl pyruvate, ethyl acetate, butyl acetate, ethyl lactate, butyl lactate, 2-heptanone, and γ-butyrolactone. The aforementioned solvents can be used individually or in combination of two or more.

[0049] If a solvent is included, the amount used is preferably 3% to 70% by mass, and particularly preferably 5% to 60% by mass, relative to the total amount of solids in the composition.

[0050] <Other Components> In addition, the resin composition for forming optical components of the present invention may contain additives such as antioxidants, adhesives, other crosslinking agents, chain transfer agents, reactive diluents, curing agents, curing aids, sensitizers, plasticizers, and light stabilizers (HALS) as needed, as long as they do not impair the effects of the present invention.

[0051] Examples of the aforementioned antioxidants include hindered phenol compounds, hindered amine compounds, phosphorus compounds, sulfur compounds, and hydroxylamine compounds. Among these, hindered phenol compounds are preferred. Examples of hindered phenol compounds include Irganox 1010, 1035, 1076, 1098, 1135, and 1330 from BASF.

[0052] Examples of the aforementioned adhesion agent include silane coupling agents. Specific examples include KBM-503, 502, 303, and 403 from Shin-Etsu Chemical Co., Ltd.

[0053] Examples of the chain transfer agent include thiol compounds. Specific examples include BMPA, TMMP, TMMP-S, TMMP-LV, TEMPIC, PEMP, PEMP-HS, PEMP-LV, DPMP, EHMP, MBMP, STMP, EGMP-4, Multiol Y-3, Multiol Y-4 from Sakai Chemical Industry Co., Ltd., and Karenz MTPE1, Karenz MTBD1, Karenz MTNR1, Karenz MTTPMB from Resonac Co., Ltd.

[0054] The use of the resin composition for forming optical components of the present invention will be described below.

[0055] <Optical Waveguides> Optical components, which are optical waveguides, can be formed from the resin composition for forming optical components of the present invention. The resin composition for forming optical components of the present invention is applicable to both cladding materials that form the cladding portion of an optical waveguide and core-forming materials that form the core portion, but is particularly suitable as a core-forming material rather than a cladding material. Furthermore, the resin composition for forming optical components of the present invention can be used in combination with various materials that have been conventionally used to form the cladding portion and core portion of optical waveguides to form optical waveguides. That is, materials that harden by light irradiation or heat treatment, such as materials mainly composed of silicone resin, acrylic resin, vinyl resin, epoxy resin, polyimide resin, polyolefin resin, polynorbornene resin, etc., can be appropriately selected and used as cladding materials and core-forming materials.

[0056] The method for manufacturing an optical waveguide formed using the resin composition for forming optical components of the present invention is not particularly limited. For example, an optical waveguide containing a cured product of the resin composition for forming optical components of the present invention can be formed by applying the resin composition for forming optical components of the present invention or the above-mentioned conventional materials to a desired substrate using a coating device such as a spin coater, removing the solvent by heating if the composition contains a solvent, and curing by exposure (photocuring) or heating (thermocuring). As a typical example, an optical waveguide containing a cured product of the resin composition for forming optical components of the present invention can be formed using lithography technology with a photomask, through etching and developing steps. Examples of light used for lithography include far ultraviolet light (wavelength: e.g., 193 nm, 253 nm), i-line (wavelength: 365 nm), g-line (wavelength: 436 nm), and h-line (wavelength: 405 nm). The cured product of the resin composition for forming optical components of the present invention has a haze value of 0 to 15% at a film thickness of 8 μm. A lower HAZE value indicates better compatibility between the (meth)acrylate compound and the polycondensate.

[0057] <Optoelectric Mixed-Platform Substrate> An optoelectric mixed-platform substrate includes the optical waveguide described above. Typically, an optoelectric mixed-platform substrate comprises an optical waveguide, a photoelectric conversion element, and an electrical circuit board. The electrical circuit board may include electronic components and wiring connected to the electronic components. Examples of electronic components include passive components such as capacitors, inductors, and resistors; active components such as semiconductor chips; and so on. The optical waveguide and the wiring of the electrical circuit board may be connected via a photoelectric conversion element. The photoelectric conversion element may include a combination of a light-emitting element capable of converting electricity into light (e.g., a surface-emitting light-emitting diode) and a light-receiving element capable of converting light into electricity (e.g., a photodiode). Furthermore, the optoelectric mixed-platform substrate may include optical elements such as mirrors for adjusting the optical path.

[0058] A preferred example of an optoelectronic hybrid substrate is one that includes a chip formed by creating an optical integrated circuit on a silicon wafer. This chip is expected to be put into practical use early on using silicon photonics, and is anticipated to be mounted, for example, in semiconductor packages. An optoelectronic hybrid substrate containing this chip includes, for example, an electrical circuit board, a chip mounted on the electrical circuit board, and an optical waveguide. The optical waveguide can be used to connect the wiring of the electrical circuit board to the chip, or to connect multiple chips.

[0059] <Devices including optical-electric mixed-signal substrates> Examples of devices including optical-electric mixed-signal substrates include supercomputers, personal computers, mobile devices such as mobile phones, video equipment, measuring instruments, router devices, WDM devices, automobiles, game consoles, televisions, server devices, etc.

[0060] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples. The apparatus and conditions used for sample preparation and analysis of physical properties in the examples are as follows.

[0061] (1) Gel Permeation Chromatography (GPC) Apparatus: Prominence® GPC system manufactured by Shimadzu Corporation Column: Shodex® GPC KF-804L and GPC KF-803L manufactured by Resonaq Corporation Column temperature: 40°C Solvent: Tetrahydrofuran Detector: RI Calibration curve: Standard polystyrene (2) UV exposure apparatus: Batch-type UV irradiation apparatus manufactured by iGraphics Co., Ltd. (High-pressure mercury lamp 2kW x 1 lamp) (3) Mask aligner apparatus: MA6 manufactured by Suss Microtec Lamp: High-pressure mercury lamp Filter: i-line bandpass filter Illuminance: 10mW / cm ２ (365nm detection) (4) Haze measuring device: Haze meter NDH8000 manufactured by Nippon Denshoku Industries, Ltd. (5) Spin coater device: Cee200X (manufactured by Brewer Science, Inc.) (6) Dry density measuring device: AccuPycII 1340 TEC (manufactured by Micromeritics, Inc.) (7) Spectrophotometer device: UV-3600 (manufactured by Shimadzu Corporation)

[0062] Furthermore, the abbreviations represent the following meanings: DBU: 1,8-diazabicyclo[5.4.0]-7-undecene [manufactured by Tokyo Chemical Industry Co., Ltd.] MATMS: 3-(trimethoxysilyl)propyl methacrylate [manufactured by Shin-Etsu Chemical Co., Ltd.] DAICATMS: 1,3-diallyl-5-(3-trimethoxysilyl)propyl)triazinan-2,4,6-trione [manufactured by Shin-Etsu Chemical Co., Ltd.] MTMS: trimethoxy(methyl)silane [manufactured by Tokyo Chemical Industry Co., Ltd.] PhTMS: trimethoxy(phenyl)silane [KBM-103 manufactured by Shin-Etsu Chemical Co., Ltd.] BHA: 2,6-di-tert-butyl-4-methoxyphenol [manufactured by Tokyo Chemical Industry Co., Ltd.] THF: tetrahydrofuran PGMEA: propylene glycol monomethyl ether acetate IPA: isopropyl alcohol

[0063] [1] Synthesis of Polysiloxane [Synthesis Example 1] Synthesis of Polysiloxane A-1 In a 500 mL reaction flask equipped with a condenser, DBU (2.13 g, 13.98 mmol), deionized water (15.87 g, 880 mmol), and THF (227.1 g) were added, and the air in the flask was replaced with nitrogen using a nitrogen balloon, and the mixture was stirred at 50°C. To this reaction flask, a mixture of MATMS (36.46 g, 146.8 mmol), DAICATMS (18.18 g, 48.94 mmol), and MTMS (40.00 g, 293.6 mmol) was added dropwise over 50 minutes, and the mixture was stirred at 50°C for 3 hours. After stirring was complete, the resulting reaction mixture was cooled to room temperature (approximately 25°C). Then, 14.20 g of cation exchange resin [Amberlist® 15JWET, manufactured by Dow Chemical Company, hereinafter the same] and 1.89 g of powdered cellulose KC Floc® W-100GK (manufactured by Nippon Paper Industries Co., Ltd., hereinafter the same), which had been pre-washed with THF, were added to the reaction mixture, and the mixture was stirred for 2 hours to stop the reaction. After that, the mixture was filtered through a PTFE membrane filter with a pore size of 1.0 μm, and the filtrate was washed with THF. Q-1301 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., hereinafter the same) (9.5 mg) was added to the obtained filtrate as a polymerization inhibitor, and after stirring to dissolve it, the solvent was removed under reduced pressure using an evaporator to obtain the target polysiloxane A-1 (60.48 g). The weight-average molecular weight (Mw) of polysiloxane A-1, measured in polystyrene equivalents by GPC, was 10,300, and the dispersion ratio (Mw: weight-average molecular weight / Mn: number-average molecular weight) was 2.9.

[0064] [Synthesis Example 2] Polysiloxane A-2 synthesis: In a 1000 mL reaction flask equipped with a condenser, DBU (5.90 g, 38.76 mmol), deionized water (43.95 g, 2.44 mol), and THF (344.6 g) were added. The air in the flask was replaced with nitrogen using a nitrogen balloon, and the mixture was stirred at 50°C. To this reaction flask, a mixture of MATMS (101.0 g, 406.6 mmol), DAICATMS (25.17 g, 67.76 mmol), and MTMS (120.0 g, 880.9 mmol) was added dropwise over 60 minutes, and the mixture was stirred at 50°C for 3 hours. After stirring, the resulting reaction mixture was cooled to room temperature (approximately 25°C). Then, cation exchange resin (49.23 g) and powdered cellulose KC floc (4.92 g), which had been previously washed with THF, were added to the reaction mixture, and the mixture was stirred for 2 hours to stop the reaction. Subsequently, the solution was filtered through a PTFE membrane filter with a pore size of 1.0 μm, and the filtrate was washed with THF. Q-1301 (15.2 mg) was added to the obtained filtrate as a polymerization inhibitor and dissolved by stirring. Then, PGMEA (38.12 g) was added, and the solvent, excluding PGMEA, was removed under reduced pressure using an evaporator to obtain the target 80% by mass polysiloxane A-2 PGMEA solution (190.1 g). The weight-average molecular weight Mw of polysiloxane A-2, measured in polystyrene equivalent by GPC, was 16,643, and the dispersion: Mw (weight-average molecular weight) / Mn (number-average molecular weight) was 4.2.

[0065] [Synthesis Example 3] Synthesis of Polysiloxane A-3 In a 300 mL reaction flask equipped with a condenser, DBU (1.6 g, 10.50 mmol), deionized water (11.9 g, 661 mmol), and THF (95.31 g) were added, and the air in the flask was replaced with nitrogen using a nitrogen balloon, and the mixture was stirred at 50°C. To this reaction flask, a mixture of MATMS (27.35 g, 110.1 mmol), DAICATMS (6.87 g, 18.49 mmol), MTMS (30.21 g, 221.8 mmol), and PhTMS (3.65 g, 18.41 mmol) was added dropwise over 60 minutes, and the mixture was stirred at 50°C for 3 hours. After stirring was complete, the resulting reaction mixture was cooled to room temperature (approximately 25°C). Then, cation exchange resin (13.70 g) and powdered cellulose KC floc (1.40 g), which had been previously washed with THF, were added to the reaction mixture, and the mixture was stirred for 2 hours to stop the reaction. Subsequently, the mixture was filtered through a PTFE membrane filter with a pore size of 1.0 μm, and the filtrate was washed with THF. BHA (24.9 mg) was added to the obtained filtrate as a polymerization inhibitor and dissolved by stirring. Then, PGMEA (10.64 g) was added, and the solvent, excluding PGMEA, was removed under reduced pressure using an evaporator to obtain the target 80% by mass polysiloxane A-3 PGMEA solution (53.05 g). The weight-average molecular weight Mw of polysiloxane A-3, measured in polystyrene equivalent by GPC, was 6,999, and the degree of dispersion: Mw (weight-average molecular weight) / Mn (number-average molecular weight) was 2.3.

[0066] [Comparative Synthesis Example 1] Polysiloxane B-1 synthesis: In a 500 mL reaction flask equipped with a condenser, DBU (2.05 g, 13.48 mmol), deionized water (15.30 g, 849 mmol), and THF (192.39 g) were added. The air in the flask was replaced with nitrogen using a nitrogen balloon, and the mixture was stirred at 50°C. A mixture of MATMS (35.16 g, 141.6 mmol) and MTMS (45.00 g, 330.3 mmol) was added dropwise to the reaction flask over 50 minutes, and the mixture was stirred at 50°C for 3 hours. After stirring, the resulting reaction mixture was cooled to room temperature (approximately 25°C). Then, cation exchange resin (12.02 g) pre-washed with THF and powdered cellulose KC Floc® W-100GK (1.60 g) were added to the reaction mixture, and the mixture was stirred for 2 hours to stop the reaction. Subsequently, the mixture was filtered through a PTFE membrane filter with a pore size of 1.0 μm, and the filtrate was washed with THF. Q-1301 (8.0 mg) was added to the obtained filtrate as a polymerization inhibitor, and after dissolving by stirring, the solvent was removed under reduced pressure using an evaporator to obtain the target polysiloxane B-1 (46.8 g). The weight-average molecular weight Mw of polysiloxane B-1, measured in polystyrene equivalent by GPC, was 7,100, and the dispersion: Mw (weight-average molecular weight) / Mn (number-average molecular weight) was 2.5.

[0067] [Comparative Synthesis Example 2] In a 300 mL reaction flask equipped with a polysiloxane B-2 synthesis condenser, DBU (1.5 g, 9.69 mmol), deionized water (11.0 g, 610 mmol), and THF (82.34 g) were added. The air in the flask was replaced with nitrogen using a nitrogen balloon, and the mixture was stirred at 50°C. To this reaction flask, a mixture of MATMS (25.31 g, 101.9 mmol), MTMS (30.08 g, 220.8 mmol), and PhTMS (3.42 g, 17.25 mmol) was added dropwise over 60 minutes, and the mixture was stirred at 50°C for 3 hours. After stirring, the resulting reaction mixture was cooled to room temperature (approximately 25°C). Then, cation exchange resin (11.80 g) and powdered cellulose KC floc (1.20 g), which had been previously washed with THF, were added to the reaction mixture, and the mixture was stirred for 2 hours to stop the reaction. Subsequently, the solution was filtered through a PTFE membrane filter with a pore size of 1.0 μm, and the filtrate was washed with THF. BHA (2.27 mg) was added to the obtained filtrate as a polymerization inhibitor and dissolved by stirring. Then, PGMEA (8.80 g) was added, and the solvent, excluding the PGMEA, was removed under reduced pressure using an evaporator to obtain the target 80% by mass polysiloxane B-2 PGMEA solution (43.99 g). The weight-average molecular weight Mw of polysiloxane B-2, measured in polystyrene equivalent by GPC, was 11,023, and the dispersion: Mw (weight-average molecular weight) / Mn (number-average molecular weight) was 3.4.

[0068] [2] Preparation of resin composition and HAZE measurement of cured film [Example 1-1] Preparation of resin composition 1 Polysiloxane A-1 (2.039 g) synthesized in Synthesis Example 1, acrylate compound A (A-9300s, manufactured by Shin Nakamura Kogyo Co., Ltd., the same applies hereinafter) (1.359 g), photoradical initiator Omnirad 819 (manufactured by BASF, the same applies hereinafter) (0.102 g), and PGMEA (1.500 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thereby obtaining resin composition 1.

[0069] [Examples 1-2] Preparation of resin composition 2 Polysiloxane A-1 (2.039 g) synthesized in Synthesis Example 1, acrylate compound B (A-TMPT, manufactured by Shin Nakamura Kogyo Co., Ltd., the same applies hereinafter) (1.359 g), photoradical initiator Omnirad 819 (0.102 g), and PGMEA (1.500 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thereby obtaining resin composition 2.

[0070] [Examples 1-3] Preparation of resin composition 3 Polysiloxane A-1 (2.039 g) synthesized in Synthesis Example 1, acrylate compound C (ABE-300, manufactured by Shin Nakamura Kogyo Co., Ltd., the same applies hereinafter) (1.359 g), photoradical initiator Omnirad 819 (0.102 g), and PGMEA (1.500 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thereby obtaining resin composition 3.

[0071] [Examples 1-4] Preparation of resin composition 4 Polysiloxane A-1 (2.039 g) synthesized in Synthesis Example 1, acrylate compound D (OGSOL® EA-0200, manufactured by Osaka Gas Chemical Co., Ltd., the same applies hereinafter) (1.359 g), photoradical initiator Omnirad 819 (0.102 g), and PGMEA (1.500 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thereby obtaining resin composition 4.

[0072] [Examples 1-5] Preparation of resin composition 5 Polysiloxane A-1 (2.039 g) synthesized in Synthesis Example 1, acrylate compound E (BAEM-100, manufactured by KSM Co., Ltd., the same applies hereinafter) (1.359 g), photoradical initiator Omnirad 819 (0.102 g), and PGMEA (1.500 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thereby obtaining resin composition 5.

[0073] [Examples 1-6] Preparation of resin composition 6 Polysiloxane A-1 (2.039 g) synthesized in Synthesis Example 1, acrylate compound F (KAYAMER PM-2, manufactured by Nippon Kayaku Co., Ltd., the same applies hereinafter) (1.359 g), photoradical initiator Omnirad 819 (0.102 g), and PGMEA (1.500 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thereby obtaining resin composition 6.

[0074] [Examples 1-7] Preparation of Resin Composition 7 Polysiloxane A-1 (4.779 g), acrylate compound A (3.186 g), photoradical initiator Omnirad 819 (0.239 g), and PGMEA (6.00 g) synthesized in Synthesis Example 1 were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution. Then, a silica nanoparticle dispersion MEK-EC-2130Y (manufactured by Nissan Chemical Corporation), dispersed in MEK solvent, was added so that the weight of silica nanoparticles relative to the resin components was 10% by mass, and the mixture was stirred at room temperature until a homogeneous solution was obtained. Then, the MEK solvent was removed by vacuum distillation using an evaporator to obtain resin composition 7.

[0075] [Examples 1-8] Preparation of resin composition 8 A PGMEA solution of polysiloxane A-2 synthesized in synthesis example 2 (4.078 g), acrylate compound A (2.175 g), photoradical initiator Omnirad 819 (0.163 g), and PGMEA (1.585 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thus obtaining resin composition 8.

[0076] [Examples 1-9 to 1-11] Preparation of resin compositions 9 to 11 Resin compositions 9 to 11 were prepared using the same procedure and composition as in Example 1-8, except that acrylate compound B, acrylate compound C, and acrylate compound F were used instead of acrylate compound A.

[0077] [Examples 1-12 to 1-15] Preparation of resin compositions 12 to 15 Resin compositions 12 to 15 were prepared using the same procedure and composition as in Examples 1-8 to 1-11, except that a PGMEA solution of polysiloxane A-3 synthesized in Synthesis Example 3 was used instead of a PGMEA solution of polysiloxane A-2.

[0078] [Comparative Example 1-1] Preparation of resin composition 16 Polysiloxane A-1 (3.398 g) synthesized in Synthesis Example 1, photoradical initiator Omnirad819 (0.102 g), and PGMEA (1.500 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thereby obtaining resin composition 16.

[0079] [Comparative Example 1-2] Preparation of resin composition 17 Polysiloxane B-1 (3.398 g) synthesized in comparative synthesis example 1, photoradical initiator Omnirad819 (0.102 g), and PGMEA (1.500 g) were mixed and stirred at 50°C for 2 hours to obtain a homogeneous solution, thereby obtaining resin composition 17.

[0080] [Comparative Examples 1-3 to 1-8] Preparation of resin compositions 18 to 23 Resin compositions 18 to 23 were prepared using the same procedure and composition as in Examples 1-1 to 1-6, except that polysiloxane B-1 synthesized in Comparative Synthesis Example 1 was used instead of polysiloxane A-1 synthesized in Synthesis Example 1. Resin composition 23 using acrylate compound F resulted in the varnish gelling, making it impossible to obtain a usable resin composition.

[0081] [Comparative Examples 1-9 to 1-11] Preparation of resin compositions 24 to 26 Resin compositions 24 to 26 were prepared using the same procedure and composition as in Examples 1-1, 1-3, and 1-6, except that a PGMEA solution of polysiloxane B-2 synthesized in Comparative Synthesis Example 2 was used instead of polysiloxane A-1. Resin composition 26 using acrylate compound F resulted in the varnish gelling, making it impossible to obtain a usable resin composition.

[0082] [Preparation of cured film and haze measurement] [Example 2-1] Preparation of cured film of resin composition 1 and haze measurement A 76 mm x 52 mm glass substrate (Matsunami Glass Industry Co., Ltd. S9111) was subjected to UV / O ３ After washing, the resin composition 1 prepared in Example 1-1 was applied by spin coating and heated on a hot plate at 130°C for 1 minute to obtain a coating film. Then, a batch-type UV exposure irradiation device manufactured by I-Graphics Co., Ltd. was used to irradiate at 1 J / cm². ２ (20 mW / cm²) ２ The substrate was exposed to light for 50 seconds. Then, it was heated on a 180°C hot plate for 20 minutes to obtain a cured film with a thickness of 8 μm. Haze measurements were performed on the substrate with the resulting cured film. The haze measurements were performed in accordance with the JIS standard (JIS K7136).

[0083] [Examples 2-2 to 2-15] Preparation of cured films of resin compositions 2 to 15 and haze measurement A cured film with a thickness of 8 μm was prepared in the same procedure as in Example 2-1, except that resin compositions 2 to 15 were used instead of resin composition 1, and haze measurements were performed.

[0084] [Comparative Examples 2-1 to 2-7, 2-9, 2-10] Preparation of cured films of resin compositions 16-22, 24, and 25 and Haze measurement A cured film with a thickness of 8 μm was prepared in the same procedure as in Example 2-1, except that resin compositions 16-22, 24, and 25 were used instead of resin composition 1, and Haze measurement was performed.

[0085] Table 2 shows the compositions of resin compositions 1 to 26, the Hansen solubility parameter (HSP) values ​​of the acrylate compounds used, whether or not the varnish could be prepared, and the results of the haze measurement.

[0086]

[0087] In Comparative Examples 1-8 and 1-11, which used acrylate compound F, varnish gelation occurred, while in Examples 1-6, 1-11, and 1-15, which also used acrylate compound F, a uniform varnish was obtained. This result suggests that the polysiloxane used has a substructure represented by formulas (1) to (3), which expands the HSP range of the acrylate compound that can be compatible when varnished. Furthermore, when comparing the HAZ values ​​of the cured films obtained from the resin compositions of the Examples and Comparative Examples using the same acrylate compound, the HAZ values ​​of the cured films obtained from the resin compositions of the Examples were all lower than those of the cured films obtained from the resin compositions of the Comparative Examples. It is considered that the polysiloxane having a substructure represented by formulas (1) to (3) improved compatibility with the acrylate compound, resulting in a cured film with low HAZ.

[0088] [3] Evaluation of propagation loss of resin composition [Example 3-1] Preparation of resin composition 27 and evaluation of propagation loss Polysiloxane A-1 (3.144 g), acrylate compound A (2.096 g), and photoradical initiator Omnirad819 (0.157 g) synthesized in Synthesis Example 1 were mixed and stirred at 50°C for 15 hours to obtain a homogeneous solution, thereby obtaining resin composition 27. Next, the density of resin composition 27 was measured using a dry density meter and was found to be 1.266 g / cm³. ３ The density was obtained, and a 50 vol% toluene solution of resin composition 15 was prepared. The density of toluene was 0.867 g / cm³. ３ It was prepared as follows.

[0089] The absorbance A of a 50 vol% toluene solution of resin composition 27 was measured using a spectrophotometer with a glass cell having a path length of 1 cm. Next, the absorbance Atol of toluene was measured using a glass cell having a path length of 0.5 cm. The propagation loss of resin composition 27 was calculated according to the following formula. The calculated propagation loss values ​​are shown in Table 4. Propagation loss [dB / cm] = (A - Atol) × 2 × 10 A: Absorbance of resin composition 27 toluene solution at a path length of 1 cm Atol: Absorbance of toluene at a path length of 0.5 cm

[0090]

[0091] The resin composition 27 exhibited good propagation loss values ​​for wavelengths used as communication wavelengths, and the results showed that it can be used as a core material for optical waveguides.

[0092] [4] Evaluation of patternability of resin composition [Example 4-1] Evaluation of patternability of resin composition 1 Silicon substrate UV / O ３ After cleaning, resin composition 1 was applied by spin coating and heated on a hot plate at 130°C for 1 minute to obtain a coating film. Next, using a mask aligner, a photomask having a line and space pattern with a line width of 10 μm and a pitch of 250 μm was subjected to an i-line at 2 J / cm². ２ (10 mW / cm ２Pattern exposure was performed for 200 seconds. Subsequently, the unexposed resin composition was washed away by developing with a PGMEA / IPA mixture (weight ratio 1:1), and the developing solvent was evaporated by heating on a 100°C hot plate for 2 minutes. Next, it was heated on a 180°C hot plate for 20 minutes to obtain a line pattern with a top width of 12 μm and a height of 12 μm. Figures 1 and 2 show images observed from the top surface and cross-section of the obtained pattern using an optical microscope, respectively.

[0093] Optical microscope observations confirmed that the resin composition was patterned in a line-and-space pattern. This result indicates that the resin composition satisfies the patterning requirements for a core material in an optical waveguide.

Claims

1. A resin composition for forming optical components, comprising: (a) a polycondensate containing at least a substructure represented by formula (1), formula (2), and formula (3); (b) at least one (meth)acrylate compound; and (c) a photopolymerization initiator. (In formula (1), R １ is a methyl group or H, L １ R is an alkylene group having 1 to 10 carbon atoms, which may be substituted, in formula (2), ２ and R ３ They may be the same or different, and each is independently H, an alkyl group or allyl group having 1 to 5 carbon atoms which may be substituted, and L ２ R is an alkylene group having 1 to 10 carbon atoms, which may be substituted, and in formula (3), R ４ (This is an alkyl group having 1 to 5 carbon atoms, which may be substituted.) 2. The above L １ The resin composition for forming optical components according to claim 1, wherein is an unsubstituted alkylene group having 1 to 10 carbon atoms.

3. The above R ２ and R ３ may be the same or different and are each independently H, an unsubstituted alkyl group or allyl group having 1 to 5 carbon atoms, and L ２ is an unsubstituted alkylene group having 1 to 10 carbon atoms. The resin composition for forming an optical member according to claim 1.

4. The above R ４ The resin composition for forming optical components according to claim 1, wherein is an unsubstituted alkyl group having 1 to 5 carbon atoms.

5. The above R ２ and R ３ The resin composition for forming optical components according to claim 1, wherein at least one of the members is an allyl group.

6. The above R ２ and R ３ The resin composition for forming optical components according to claim 5, wherein the group is an allyl group.

7. The above R ４ The resin composition for forming optical components according to claim 1, wherein the group is a methyl group.

8. The resin composition for forming optical components according to claim 1, wherein the HAZE value of the cured product of the resin composition for forming optical components is 0 to 15% at a film thickness of 8 μm.

9. The resin composition for forming optical components according to claim 1, wherein at least one of the (meth)acrylate compounds has a Hansen solubility parameter of 15 to 30.

10. The resin composition for forming optical components according to claim 1, further comprising a solvent.

11. The resin composition for forming optical components according to claim 1, further comprising inorganic fine particles.

12. The resin composition for forming an optical component according to any one of claims 1 to 11, wherein the optical component is an optical waveguide.

13. The resin composition for forming an optical component according to any one of claims 1 to 11, wherein the optical component is the core portion of an optical waveguide.

14. An optical waveguide comprising a cured product of the resin composition for forming optical components according to any one of claims 1 to 11.

15. A photoelectric mixed-signal substrate including the optical waveguide of claim 14.

16. Apparatus comprising the photoelectric mixed-signal substrate of claim 15.

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