Temperature sensor module, method for manufacturing same, and electronic device

Abstract

A semiconductor module has, on a side facing a connection pipe, a semiconductor chip and a heat dissipation layer thermally connected to a heat conduction member. The heat conduction member is disposed in contact with the heat dissipation layer. A temperature sensor module (500) according to the present invention is configured such that, on one surface (540a) side of a sealing member (540) facing the connection pipe, a pressing force of an outer edge portion of the one surface (540a) pressing the connection pipe is greater than a pressing force of an inner edge portion of the one surface (540a) pressing the connection pipe, the inner edge portion being on the inner side of the outer edge portion. The temperature sensor module (500) is disposed in a cooling device with the heat dissipation layer being positioned on the inner side of the outer edge portion in the arrangement direction of the semiconductor module and the temperature sensor module (500).

Description

Temperature Sensor Module, Method for Manufacturing the Same, and Electronic Device Cross - Reference to Related Applications

[0001] This application is based on Japanese Patent Application No. 2025 - 012156 filed on January 28, 2025, the contents of which are incorporated herein by reference.

[0002] The present disclosure relates to a temperature sensor module, a method for manufacturing the same, and an electronic device.

[0003] Conventionally, for example, in Patent Document 1, an electronic device has been proposed in which a semiconductor module and a temperature sensor module are arranged in a cooling device, and the temperature of a cooling medium flowing through the cooling device is detected by a temperature sensor provided in the temperature sensor module. Specifically, the cooling device is configured to have a cooling medium such as cooling water flowing inside, and includes an inlet pipe and an outlet pipe, and a plurality of connecting pipes that communicate the inlet pipe and the outlet pipe. The connecting pipes are arranged in a plurality along the extending direction of the inlet pipe and the outlet pipe. Hereinafter, the extending direction of the inlet pipe and the outlet pipe, in which the plurality of connecting pipes are arranged, is also referred to as the arrangement direction.

[0004] The semiconductor module is arranged between adjacent connecting pipes in the arrangement direction via a heat - conducting member such as grease and is cooled by the cooling device. The temperature sensor module is arranged between adjacent connecting pipes in the arrangement direction. The temperature sensor module is arranged on the opposite side of the semiconductor module across one connecting pipe and is provided so as to face the semiconductor module. Further, the temperature sensor module is configured such that a temperature sensor that outputs a detection signal according to temperature is sealed with a sealing member such as resin.

[0005] Japanese Unexamined Patent Application Publication No. 2024 - 31929

[0006] Because the temperature sensor module has a sealing member made of resin, it may deform due to the effects of heat, etc., such that the inner edge of the side facing the connecting tube becomes more convex toward the connecting tube than the outer edge. In this case, the heat conductive member placed between the connecting tube and the semiconductor module may be pushed out from between the connecting tube and the semiconductor module due to the stress caused by the deformation of the temperature sensor module. Therefore, in the above electronic device, the cooling performance of the semiconductor module may decrease.

[0007] The purpose of this disclosure is to provide a temperature sensor module, a method for manufacturing the same, and an electronic device that can suppress a decrease in the cooling performance of a semiconductor module.

[0008] According to one aspect of this disclosure, the electronic device comprises a cooling device having an inlet pipe, an outlet pipe, and a connecting pipe connecting the inlet pipe and the outlet pipe, through which a cooling medium flows; a semiconductor module having a semiconductor chip and positioned opposite the connecting pipe; a heat conductive member positioned between the semiconductor module and the connecting pipe; a temperature sensor module having a support member positioned on the opposite side of the connecting pipe from the semiconductor module, a temperature sensor positioned on the support member to detect the temperature of the cooling medium, and a sealing member that seals the temperature sensor, wherein the semiconductor module has a heat dissipation layer on the side facing the connecting pipe that is thermally connected to the semiconductor chip and the heat conductive member, the heat conductive member is positioned in contact with the heat dissipation layer, and the temperature sensor module is configured such that, on one side of the sealing member facing the connecting pipe, the pressing force of the outer edge portion of that side pressing the connecting pipe is greater than the pressing force of the inner edge portion of that side pressing the connecting pipe, and the semiconductor module and the temperature sensor module are positioned in the cooling device such that the heat dissipation layer is located inside the outer edge portion in the direction of arrangement between them.

[0009] According to this, the temperature sensor module is arranged such that the heat dissipation layer of the semiconductor module is located inside the outer edge portion where the pressing force is higher in the arrangement direction. Therefore, it is possible to suppress the heat conductive material from coming out from between the heat dissipation layer of the semiconductor module and the connecting tube, and to suppress a decrease in the cooling performance of the semiconductor module.

[0010] According to another aspect of this disclosure, the temperature sensor module comprises a support member, a temperature sensor disposed on the support member for detecting temperature, and a sealing member for sealing the support member and the temperature sensor, wherein one side of the sealing member opposite to the support member is positioned facing the member to be mounted, and the pressing force exerted by the outer edge portion against the member to be mounted is greater than the pressing force exerted by the inner edge portion inside the outer edge portion against the member to be mounted.

[0011] Such a temperature sensor module is used by positioning it on the opposite side of the mounting component from the semiconductor module, which has a heat dissipation layer, on the mounting component. A heat conductive material is placed between the heat dissipation layer of the semiconductor module and the mounting component. More specifically, the temperature sensor module is positioned such that the heat dissipation layer of the semiconductor module is located inside the outer edge portion where the pressing force is highest, in the alignment direction of the semiconductor module and the temperature sensor module. This prevents the heat conductive material from coming out from between the heat dissipation layer of the semiconductor module and the connecting tube, thereby preventing a decrease in the cooling performance of the semiconductor module.

[0012] In another aspect of this disclosure, the method for manufacturing a temperature sensor module comprises a support member, a temperature sensor disposed on the support member for detecting temperature, a terminal portion electrically connected to the temperature sensor, and a sealing member that seals a portion of the temperature sensor and the terminal portion, wherein one side of the sealing member opposite to the support member is positioned facing the member to be mounted, and the pressing force of the outer edge portion pressing against the member to be mounted is greater than the pressing force of the inner edge portion inside the outer edge portion pressing against the member to be mounted, and the support member is provided with a fixing portion having a support portion connected to the support member and a connecting portion floating from the support member and connected to the support portion, wherein the rigidity of the connecting portion of the fixing portion is lower than the rigidity of the support portion, and the temperature sensor module is manufactured by providing a support member to the support member. The process involves arranging the sensor, preparing a lead frame in which the connecting lead portion constituting the terminal portion and the fixing portion is integrated with a tie bar, connecting the connecting lead portion of the lead frame to a support member to form a component, placing the component in a mold to form a sealing member, and removing the tie bar to form a fixing portion with a part of the connecting lead portion. When preparing the lead frame, the rigidity of the connecting portion of the connecting lead is made lower than that of the support portion of the connecting lead. When forming the sealing member, the sealing member is formed such that the pressing force of the outer edge pressing against the mounted component is greater than the pressing force of the inner edge pressing against the mounted component.

[0013] According to this, when forming the sealing member, the pressing force exerted by the outer edge against the mounted component is greater than the pressing force exerted by the inner edge against the mounted component. Therefore, a temperature sensor module can be manufactured that suppresses a decrease in the cooling performance of the semiconductor module when it is assembled into an electronic device. Furthermore, the fixing part has a support part and a connecting part that are connected to the support member, and the connecting part has lower rigidity than the support part. As a result, when connecting the lead frame to the support member and when forming the sealing member, stress from the lead frame and other components is less likely to be transmitted to the support member and mounted components such as electronic components including the temperature sensor, thereby suppressing damage to the temperature sensor.

[0014] According to another aspect of this disclosure, the present invention comprises a support member having a conductive layer, a plurality of electronic components including a temperature sensor that detects temperature and is arranged on the conductive layer via a bonding member, and a sealing member that seals the electronic components and is made of resin, wherein one side of the sealing member opposite to the support member is positioned facing the component to be mounted, and the pressing force of the outer edge portion pressing the component to be mounted is greater than the pressing force of the inner edge portion inside the outer edge portion pressing the component to be mounted, and the plurality of electronic components are positioned such that there is a gap between the portion connected to the conductive layer and the support member, and the gap is in the plane direction of the support member A method for manufacturing a temperature sensor module that communicates along one direction, comprising: arranging electronic components on a conductor layer of a support member via solder as a bonding member; cleaning and removing the flux used when arranging the electronic components; and forming a sealing member by pouring molten resin into a mold and solidifying it, wherein the cleaning is performed so that the cleaning liquid penetrates from a direction along the communication direction of the gap, and the sealing member is formed such that the pressing force of the outer edge pressing against the mounted component is greater than the pressing force of the inner edge pressing against the mounted component.

[0015] According to this, by forming the sealing member so that the pressing force of the outer edge pressing against the mounted component is greater than the pressing force of the inner edge pressing against the mounted component, it is possible to manufacture a temperature sensor module that can suppress a decrease in the cooling performance of the semiconductor module when it is assembled into an electronic device. In addition, since cleaning is performed so that the cleaning solution penetrates from a direction that is not perpendicular to the communication direction of the gap, flux cleaning can be simplified. Furthermore, since flux is less likely to remain in the gap, it becomes easier to fill the gap with the sealing member, and it becomes easier to ensure stable insulation performance.

[0016] This is a circuit diagram of the electronic device in the first embodiment. This is a front view of the electronic device in the first embodiment. This is a plan view of the semiconductor module as seen from the first support member side. This is a cross-sectional view along the line IV-IV in Figure 3. This is a plan view of the temperature sensor module as seen from one side of the sealing member. This is a plan view of the temperature sensor module as seen from the other side of the sealing member. This is a plan view showing the internal state of the temperature sensor module as seen from one side of the sealing member. This is a cross-sectional view along the line VIII-VIII in Figure 7. This is a schematic diagram showing the arrangement relationship of the temperature sensor module, the target semiconductor module, and the target heat conductive member. This is a schematic diagram for explaining the state of the heat conductive member along the line X-X in Figure 9. This is a plan view of the temperature sensor module in a modified example of the first embodiment as seen from one side of the sealing member. This is a plan view of the temperature sensor module in a modified example of the first embodiment as seen from one side of the sealing member. This is a plan view of the temperature sensor module in a modified example of the first embodiment as seen from one side of the sealing member. This is a plan view of the temperature sensor module in a modified example of the first embodiment as seen from one side of the sealing member. This is a cross-sectional view along the line XIE-XIE in Figure 11D. This is a cross-sectional view of the temperature sensor module in the second embodiment. This is a cross-sectional view of the temperature sensor module immediately after the sealing member has been molded. This is a cross-sectional view of the temperature sensor module in the third embodiment. This is a diagram for explaining thermal resistance. This is a cross-sectional view of the temperature sensor module in the fourth embodiment. This is a cross-sectional view of the temperature sensor module in the fifth embodiment. This is a plan view showing the internal state of the temperature sensor module in the sixth embodiment as viewed from one side of the sealing member. This is a plan view showing the internal state of the temperature sensor module in a modified example of the sixth embodiment as viewed from one side of the sealing member. This is a plan view showing the internal state of the temperature sensor module in a modified example of the sixth embodiment as viewed from one side of the sealing member. This is a plan view showing the components before the sealing member is molded in the sixth embodiment. This is a cross-sectional view showing the components in the sixth embodiment arranged in a mold. This is a plan view of the lead frame in the seventh embodiment. This is a plan view of the components in the seventh embodiment.This is a cross-sectional view illustrating the relationship between the wire and the flow direction of the molten resin in the eighth embodiment. This is a diagram illustrating the cleaning process in the ninth embodiment. This is a plan view showing the internal state after molding the sealing member in the ninth embodiment. This is a diagram illustrating the conductive layer of the support member in the tenth embodiment. This is a cross-sectional view showing the semiconductor module in another embodiment placed between two connecting tubes.

[0017] The embodiments of this disclosure will be described below with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other will be denoted by the same reference numerals.

[0018] (First Embodiment) The first embodiment will be described with reference to the drawings. In the following description, a power conversion device as an electronic device will be used as an example. Such an electronic device is preferably used when mounted on a vehicle, for example.

[0019] First, the circuit configuration using the electronic device of this embodiment will be described. As shown in Figure 1, the electronic device of this embodiment is used to configure a circuit that drives a three-phase motor as load 1, and includes a power supply 10, a boost circuit 20, an inverter circuit 40, a temperature sensor 50, a control unit 60, and the like.

[0020] The power supply 10 consists of a battery or the like installed in the vehicle and supplies a DC voltage.

[0021] The boost circuit 20 is configured to include a first capacitor 21, a first discharge resistor 22, a first discharge switching element 23, a first boost switching element 24, a second boost switching element 25, and the like. The boost circuit 20 is also configured to include a coil 26, a first diode element 27, a second diode element 28, a second capacitor 29, a second discharge resistor 30, a second discharge switching element 31, and the like.

[0022] The first capacitor 21 smooths the voltage supplied from the power supply 10 and is positioned between the high-potential side and the low-potential side of the power supply 10.

[0023] In this embodiment, the first discharge resistor 22 is configured by connecting a plurality of first chip resistors 221 in series. The first discharge resistor 22 is connected in parallel with the first capacitor 21 and constitutes a circuit for discharging the charge of the first capacitor 21. The first discharge switching element 23 is made up of a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) or the like and is placed between the first discharge resistor 22 and the low-potential side of the power supply 10 in order to improve the discharge rate of the charge of the first capacitor 21. The first discharge switching element 23 is connected to the control unit 60 and is controlled to be turned on or off by the control unit 60.

[0024] The first boost switching element 24 and the second boost switching element 25 are composed of MOSFETs or the like and are connected in series. The high-potential side of the power supply 10 is connected to the midpoint between the first boost switching element 24 and the second boost switching element 25 via a coil 26, and the low-potential side of the second boost switching element 25 is connected to the low-potential side of the power supply 10. In this embodiment, the first boost switching element 24 and the second boost switching element 25 are connected in parallel to the first boost switching element 24 and the second boost switching element 25, respectively. The voltage supplied from the power supply 10 is boosted by controlling the on / off state of the first boost switching element 24 and the second boost switching element 25 by a control unit 60, which will be described later.

[0025] The second capacitor 29 is connected in parallel with the first boost switching element 24 and the second boost switching element 25, and smooths the boosted voltage.

[0026] The second discharge resistor 30 is constructed by connecting multiple second chip resistors 301 in series, which are then connected in parallel. The second discharge resistor 30 is connected in parallel with the second capacitor 29, forming a circuit for discharging the charge from the second capacitor 29. The second discharge switching element 31 is made up of a MOSFET or the like, and is placed between the second discharge resistor 30 and the low-potential side of the power supply 10 to improve the discharge rate of the charge from the second capacitor 29. The second discharge switching element 31 is connected to the control unit 60, and its on / off state is controlled by the control unit 60.

[0027] In this embodiment, the inverter circuit 40 is a three-phase inverter circuit in which the upper and lower arms 41 to 46, which are connected in series, are connected in parallel for three phases. The inverter circuit 40 then applies the midpoint potentials of the upper arms 41, 43, and 45 and the lower arms 42, 44, and 46 to the U, V, and W phases of the three-phase AC motor which is load 1, in a sequential manner.

[0028] Specifically, the upper and lower arms 41 to 46 are configured to each have switching elements 41a to 46a such as IGBTs (Insulated Gate Bipolar Transistors) or MOSFETs, and recirculating diode elements 41b to 46b. The three-phase inverter circuit 40 is connected to the control unit 60, and the on / off switching of the switching elements 41a to 46a in the upper and lower arms 41 to 46 of each phase is controlled to supply three-phase AC currents with different periods to the load 1. Each switching element 41a to 46a and each diode element 41b to 46b are connected in parallel.

[0029] The temperature sensor 50 is composed of a thermistor or the like and outputs a detection signal to the control unit 60 corresponding to the temperature of the cooling medium flowing through the cooling device 300, which will be described later.

[0030] The control unit 60 is composed of a vehicle ECU (Electronic Control Unit) and other components, and is configured to include a CPU (not shown) and various memory units such as ROM, RAM, and non-volatile RAM. The control unit 60 performs various control operations by having the CPU read and execute programs from the various memory units. Various data used when executing programs (e.g., initial values, lookup tables, maps, etc.) are pre-stored in the ROM and other memory units. CPU stands for Central Processing Unit, ROM stands for Read Only Memory, and RAM stands for Random Access Memory. Furthermore, various memory media such as ROM are non-transitional physical memory media.

[0031] Specifically, the control unit 60 is connected to the boost circuit 20 and the inverter circuit 40, and controls the on / off state of each switching element 23, 24, 25, 31, 41a to 46a. The control unit 60 also receives a detection signal from the temperature sensor 50 corresponding to the cooling medium and performs predetermined processing according to the detection signal.

[0032] Next, the configuration of the electronic device of this embodiment will be described. As shown in Figure 2, the electronic device is composed of a semiconductor module 100 for configuring an inverter circuit 40, a cooling device 300 for cooling the semiconductor module 100, a temperature sensor module 500 including a temperature sensor 50 for detecting the temperature of the cooling medium flowing through the cooling device 300, etc. The first discharge resistor 22, the second discharge resistor 30, and the temperature sensor 50, etc., are arranged inside the temperature sensor module 500, as will be described later. The power supply 10, the first capacitor 21, the first discharge switching element 23, the first boost switching element 24, the second boost switching element 25, the coil 26, the first diode element 27, the second diode element 28, the second capacitor 29, the second discharge switching element 31, etc., are arranged in different positions than in Figure 2. However, for example, the first discharge switching element 23, the second discharge switching element 31, etc., may be arranged inside the temperature sensor module 500. Furthermore, in this embodiment, the temperature sensor 50, the first chip resistor 221 which constitutes the first discharge resistor 22, and the second chip resistor 301 which constitutes the second discharge resistor 30 correspond to electronic components.

[0033] The cooling device 300 is designed to circulate a cooling medium such as cooling water inside, and includes an inlet pipe 300a and an outlet pipe 300b that form a circular flow path, and a connecting pipe 310 that communicates with the inlet pipe 300a and the outlet pipe 300b and forms a substantially rectangular flow path. Specifically, the inlet pipe 300a and the outlet pipe 300b are arranged to extend in the same direction. The connecting pipe 310 has a substantially rectangular shape in plan with one direction as its longitudinal direction. Multiple connecting pipes 310 are arranged along the direction in which the inlet pipe 300a and the outlet pipe 300b extend, with the inlet pipe 300a and the outlet pipe 300b inserted through both ends in the longitudinal direction. In this embodiment, there are five connecting pipes 310 such that four spaces are formed along the arrangement direction of the connecting pipes 310 (hereinafter also simply referred to as the arrangement direction). In Figure 2, the vertical direction of the paper is the arrangement direction AD. In this embodiment, the direction toward the bottom of the paper in Figure 2 will be described as one side of the arrangement direction AD, and the direction toward the top of the paper in Figure 2 will be described as the other side of the arrangement direction AD. The connecting pipe 310 located on the furthest side in the arrangement direction AD has a closed portion on the side opposite to the side where the inlet pipe 300a and outlet pipe 300b are provided.

[0034] Furthermore, in this embodiment, the connecting pipe 310 located on the far side in the arrangement direction is pressed to the other side in the arrangement direction AD by an elastic member 400 such as a spring. The connecting pipe 310 located on the far side in the arrangement direction is fixed by a housing or the like (not shown). Therefore, when the semiconductor module 100 and the temperature sensor module 500 are arranged in the cooling device 300 as described later, it is possible to suppress the formation of a gap between the semiconductor module 100 and the temperature sensor module 500 and the connecting pipe 310.

[0035] In this configuration, the cooling device 300 cools the semiconductor module 100 attached to the cooling device 300 by having a cooling medium such as cooling water flow in from the inlet pipe 300a and flow out from the outlet pipe 300b via the connecting pipe 310. In this embodiment, although details are omitted, the cooling medium discharged from the outlet pipe 300b flows into the inlet pipe 300a via a radiator or the like. In other words, the cooling device 300 is configured to circulate the cooling medium.

[0036] In this embodiment, the semiconductor module 100 is constructed by modularizing one upper arm 41, 43, 45 and one lower arm 42, 44, 46 of each layer in the inverter circuit 40. In this embodiment, three semiconductor modules 100 are provided to constitute the inverter circuit 40 having U-phase, V-phase, and W-phase.

[0037] The configuration of the semiconductor module 100 of this embodiment will be described below with reference to Figures 3 and 4. In the following description, one direction in the planar direction of the semiconductor module 100 will be referred to as the X-axis direction, the direction perpendicular to the X-axis direction and along the planar direction of the semiconductor module 100 will be referred to as the Y-axis direction, and the direction perpendicular to both the X-axis and Y-axis directions will be referred to as the Z-axis direction. Note that the Z-axis direction is also the direction that coincides with the array direction AD.

[0038] As shown in Figures 3 and 4, the semiconductor module 100 has a configuration that includes a first support member 110, a first semiconductor chip 120, a second semiconductor chip 130, a first block 150, a second block 160, a second support member 170, a connecting member 180, first to third main terminal sections 191 to 193, a control terminal section 194, a positioning section 195, a sealing member 200, and the like.

[0039] The first support member 110 has a structure in which a first heat dissipation layer 111, a first insulating layer 112, and a second conductor layer 173 are stacked in that order. In other words, the first support member 110 has the first insulating layer 112 placed between the first heat dissipation layer 111 and the first conductor layer 113, and the first heat dissipation layer 111 and the first conductor layer 113 are insulated by the first insulating layer 112. In this embodiment, the first conductor layer 113 is patterned with a first chip connection portion 1131 and a second chip connection portion 1132. In this embodiment, the first chip connection portion 1131 and the second chip connection portion 1132 are arranged along the X-axis direction. The first heat dissipation layer 111 and the first conductor layer 113 are made of, for example, a copper plate or an aluminum plate, and in this embodiment, the first heat dissipation layer 111 is thicker than the first conductor layer 113. The first insulating layer 112 is composed of, for example, ceramics such as silicon nitride, alumina, or aluminum nitride, or an insulating resin.

[0040] The first semiconductor chip 120 and the second semiconductor chip 130 have the same configuration. The first semiconductor chip 120 and the second semiconductor chip 130 are constructed by forming switching elements 41a to 46a such as MOSFETs and IGBTs, and diode elements 41b to 46b on a semiconductor substrate such as silicon or silicon carbide, so that current flows in the thickness direction between one side 120a, 130a and the other side 120b, 130b. The thickness direction of the first semiconductor chip 120 and the second semiconductor chip 130 is the direction along the Z-axis.

[0041] The first semiconductor chip 120 is connected to the first chip connection portion 1131 via a bonding member 141 such as solder on its other side 120b. The second semiconductor chip 130 is connected to the second chip connection portion 1132 via a bonding member 142 such as solder on its other side 130b. The first semiconductor chip 120 and the second semiconductor chip 130 are thermally connected to the first heat dissipation layer 111.

[0042] The first block 150 is made of a copper block or the like, and is disposed on one surface 120a side of the first semiconductor chip 120 via a bonding member 143 such as solder. The second block 160 is made of a copper block or the like, and is disposed on one surface 130a side of the second semiconductor chip 130 via a bonding member 144 such as solder.

[0043] Similar to the first support member 110, the second support member 170 has a structure in which a second heat dissipation layer 171, a second insulating layer 172, and a second conductor layer 173 are laminated in this order. That is, in the second support member 170, the second insulating layer 172 is disposed between the second heat dissipation layer 171 and the second conductor layer 173, and the second heat dissipation layer 171 and the second conductor layer 173 are insulated by the second insulating layer 172. And the second conductor layer 173 of the present embodiment is patterned into a first chip connection portion 1731 and a second chip connection portion 1732. In the present embodiment, the first chip connection portion 1731 and the second chip connection portion 1732 are arranged along the X-axis direction. Note that the second heat dissipation layer 171 and the second conductor layer 173 are made of, for example, a copper plate, an aluminum plate, or the like, and in the present embodiment, the second heat dissipation layer 171 is made thicker than the second conductor layer 173. The second insulating layer 172 is made of, for example, ceramics such as silicon nitride, alumina, aluminum nitride, or an insulating resin.

[0044] And in the second support member 170, the first chip connection portion 1731 is connected to the first block 150 via a bonding member 145 such as solder, and the second chip connection portion 1732 is connected to the second block 160 via a bonding member 146 such as solder. And the first semiconductor chip 120 and the second semiconductor chip 130 are thermally connected to the second heat dissipation layer 171.

[0045] In the present embodiment, the connecting member 180 is a rod-shaped member, and is connected to the second chip connection portion 1132 of the first support member 110 via a bonding member 147 such as solder, and is also connected to the first chip connection portion 1731 of the second support member 170 via a bonding member 148 such as solder. Thereby, the first semiconductor chip 120 and the second semiconductor chip 130 are connected in series.

[0046] Further, the first to third main terminal portions 191 to 193, the control terminal portion 194, and the positioning portion 195 are arranged around the first semiconductor chip 120 and the second semiconductor chip 130. The first main terminal portion 191 is connected to the first chip connection portion 1131 of the first support member 110 via a bonding member such as solder, and is arranged to be connected to the other surface 120b side of the first semiconductor chip 120 via the first chip connection portion 1131. The second main terminal portion 192 is connected to the second chip connection portion 1732 of the second support member 170 via a bonding member such as solder, and is arranged to be connected to the one surface 130a side of the second semiconductor chip 130 via the second chip connection portion 1732. The third main terminal portion 193 is connected to the second chip connection portion 1132 of the first support member 110 or the first chip connection portion 1731 of the second support member 170 via a bonding member such as solder, and is connected to the one surface 120a side of the first semiconductor chip 120 and the other surface 130b side of the second semiconductor chip 130. That is, the first main terminal portion 191 corresponds to a so-called P terminal portion, the second main terminal portion 192 corresponds to a so-called N terminal portion, and the third main terminal portion 193 corresponds to a so-called O terminal portion.

[0047] A plurality of control terminal portions 194 are provided and are respectively connected to the gate electrodes and other detection elements of the first semiconductor chip 120 and the second semiconductor chip 130. The positioning portion 195 is used when molding the sealing member 200 or when arranging the semiconductor module 100, and is insulated from the first to third main terminal portions 191 to 193 and the control terminal portion 194.

[0048] In this embodiment, the first to third main terminal portions 191 to 193 are collectively arranged on one side in the Y-axis direction with respect to the first support member 110 and the second support member 170. The control terminal portion 194 and the positioning portion 195 are collectively arranged on the other side, which is opposite to the side where the first to third main terminal portions 191 to 193 are provided, in the Y-axis direction with respect to the first support member 110 and the second support member 170. Further, two positioning portions 195 are provided and are provided so as to sandwich the control terminal portion 194.

[0049] The sealing member 200 is constructed by mixing an epoxy resin or the like with a filler having a predetermined coefficient of linear expansion. The sealing member 200 is formed so that the first semiconductor chip 120 and the second semiconductor chip 130 are sealed while one side 111a of the first heat dissipation layer 111 on the first support member 110, opposite to the first insulating layer 112, and one side 171a of the second heat dissipation layer 171 on the second support member 170, opposite to the second insulating layer 172, are exposed. In other words, the semiconductor module 100 of this embodiment has a double-sided heat dissipation structure.

[0050] The above describes the configuration of the semiconductor module 100 in this embodiment. The semiconductor module 100 is arranged between adjacent connecting tubes 310 along the arrangement direction AD, as shown in Figure 2. In this embodiment, the semiconductor modules 100 are arranged sequentially from the other space in the arrangement direction AD among the four spaces. More specifically, each semiconductor module 100 is arranged such that one connecting tube 310 of an adjacent connecting tube 310 faces the first heat dissipation layer 111, and the other connecting tube 310 faces the second heat dissipation layer 171. A heat conductive member 410 is placed between one connecting tube 310 and the first heat dissipation layer 111, and between the other connecting tube 310 and the second heat dissipation layer 171, respectively. As a result, each semiconductor module 100 is cooled by the cooling device 300. The heat conductive member 410 is, for example, a grease with high thermal conductivity.

[0051] Next, the configuration of the temperature sensor module 500 will be described with reference to Figures 5 to 8. In the following, one direction in the planar direction of the temperature sensor module 500 will be referred to as the X-axis direction, the direction perpendicular to the X-axis direction and along the planar direction of the temperature sensor module 500 will be referred to as the Y-axis direction, and the direction perpendicular to both the X-axis and Y-axis directions will be referred to as the Z-axis direction. Note that the Z-axis direction is also the direction that coincides with the array direction AD.

[0052] The temperature sensor module 500 is composed of an integrated support member 510, first to third main terminal sections 521 to 523, a terminal section 524 for the temperature sensor, a terminal section 525 for the chip resistor, a positioning section 526, a fixing section 527, a temperature sensor 50, a first discharge resistor 22, a second discharge resistor 30, a sealing member 540, and the like. Figure 7 is a plan view of the sealing member 540, as described later, from one side 540a, where the sealing member 540 is shown by a dotted line and the part arranged inside the sealing member 540 is shown by a solid line. In the following, the first to third main terminal sections 521 to 523, the terminal section 524 for the temperature sensor, and the terminal section 525 for the chip resistor will be collectively referred to as terminal sections 521 to 525.

[0053] The support member 510 has a structure in which a metal layer 511, an insulating layer 512, and a conductor layer 513 are stacked in that order. In other words, the insulating layer 512 is placed between the metal layer 511 and the conductor layer 513 of the support member 510, and the metal layer 511 and the conductor layer 513 are insulated by the insulating layer 512. In this embodiment, the conductor layer 513 is separated into multiple sections so that the first discharge resistor 22, the second discharge resistor 30, and the temperature sensor 50 can be placed on it. The metal layer 511 and the conductor layer 513 are made of, for example, copper plates or aluminum plates, and in this embodiment, the metal layer 511 is thicker than the conductor layer 513. The insulating layer 512 is made of, for example, ceramics such as silicon nitride, alumina, or aluminum nitride, or insulating resin.

[0054] On the conductive layer 513, a plurality of first chip resistors 221 constituting the first discharge resistor 22 and a plurality of second chip resistors 301 constituting the second discharge resistor 30 are arranged via a bonding member 514 such as solder. In addition, a temperature sensor 50 is arranged on the conductive layer 513 via a bonding member 514 such as solder.

[0055] A solder resist 515 is placed on the insulating layer 512 so as to cover the conductive layer 513. Note that in Figure 7, the solder resist 515 shown in Figure 8 is omitted.

[0056] The first to third main terminal sections 521 to 523, the temperature sensor terminal section 524, the chip resistor terminal section 525, the positioning section 526, and the fixing section 527 are each part of the lead frame and are integrated by tie bars or the like before the sealing member 540 is formed. The first to third main terminal sections 521 to 523, the temperature sensor terminal section 524, the chip resistor terminal section 525, the positioning section 526, and the fixing section 527 are separated by removing the tie bars after the sealing member 540 is formed.

[0057] As shown in Figures 1 and 7, the first main terminal 521 is connected to the conductor layer 513 so as to be connected to one end of the first discharge resistor 22, and connects one end of the first discharge resistor 22 to the high-potential side of the power supply 10. The second main terminal 522 is connected to the conductor layer 513 so as to be connected to the other end of the first discharge resistor 22 and the other end of the second discharge resistor 30, and connects the other end of the first discharge resistor 22 and the other end of the second discharge resistor 30 to the low-potential side of the power supply 10. The third main terminal 523 is connected to the conductor layer 513 so as to be connected to one end of the second discharge resistor 30, and connects one end of the second discharge resistor 30 to the inverter circuit 40.

[0058] The temperature sensor terminal section 524 is connected to the conductor layer 513 connected to the temperature sensor 50, and connects the temperature sensor 50 to the control unit 60. Multiple chip resistor terminal sections 525 are provided to be connected to the conductor layer 513 connected to the first chip resistor 221 and the conductor layer 513 connected to the second chip resistor 301, and connect the first chip resistor 221 and the second chip resistor 301 to the control unit 60.

[0059] The positioning portion 526 is used when molding the sealing member 540, which will be described later, or when positioning the temperature sensor module 500, and has a positioning hole portion 526a. The fixing portion 527 connects the lead frame and the support member 510 before molding the sealing member 540, and is composed of a part of the connecting lead portion before molding the sealing member 540. The connecting lead portion is a part that serves to connect the tie bar, which is removed after molding, to the support member 510.

[0060] The first to third main terminal sections 521 to 523 are arranged on one side of the support member 510 in the Y-axis direction. The temperature sensor terminal section 524, the chip resistor terminal section 525, and the positioning section 526 are provided on the side of the support member 510 opposite to the side where the first to third main terminal sections 521 to 523 are arranged in the Y-axis direction. In addition, there are two positioning sections 526, one on each side of the temperature sensor terminal section 524 and the other of the chip resistor terminal section 525.

[0061] The fixing portion 527 is positioned on the side of the support member 510 opposite to the side where the first to third main terminal portions 521 to 523, the temperature sensor terminal portion 524, the chip resistor terminal portion 525, and the positioning portion 526 are located. In this embodiment, there are two fixing portions 527, one at each end of the support member 510 in the X-axis direction.

[0062] The first to third main terminal sections 521 to 523, the temperature sensor terminal section 524, and the chip resistor terminal section 525 are connected via the conductor layer 513 and wires 530. The fixing section 527 is connected to the conductor layer 513 of the support member 510 via a bonding member such as solder. However, the conductor layer 513 on which the fixing section 527 is located is insulated from the conductor layer 513 on which the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301 are located.

[0063] The sealing member 540 is constructed by mixing an epoxy resin or the like with a filler having a predetermined coefficient of linear expansion, and is in the shape of a roughly rectangular parallelepiped having one surface 540a, another surface 540b, and a side surface 540c connecting the two surfaces 540a and 540b. The sealing member 540 is formed so as to seal the temperature sensor 50, the first chip resistor 221, the second chip resistor 301, etc., with one surface 511a of the metal layer 511 opposite to the insulating layer 512 exposed. Furthermore, the sealing member 540 is formed so as to seal the portion of the first to third main terminals 521 to 523, the temperature sensor terminal 524, the chip resistor terminal 525, and the positioning portion 526 on the support member 510 side, while the portion opposite to the support member 510 is exposed from the side surface 540c. The sealing member 540 is a molded body formed by pouring molten resin into a mold and allowing it to solidify.

[0064] Furthermore, in this embodiment, the sealing member 540 has a recess 541 formed on its side surface between the second main terminal portion 522 and the third main terminal portion 523. This allows for a longer creepage distance along the sealing member 540 between the second main terminal portion 522 and the third main terminal portion 523.

[0065] As will be described later, the temperature sensor module 500 of this embodiment is positioned so that one side 540a of the sealing member 540 faces the connecting pipe 310, which is the component to be mounted. The temperature sensor module 500 is configured such that the pressing force of the outer edge portion against the connecting pipe 310 on one side 540a of the sealing member 540 is greater than the pressing force of the inner edge portion against the connecting pipe 310. In other words, the temperature sensor module 500 is configured such that the surface pressure of the outer edge portion against the connecting pipe 310 on one side 540a of the sealing member 540 is greater than the surface pressure of the inner edge portion against the connecting pipe 310.

[0066] In this embodiment, the temperature sensor module 500 has a projection 542 formed on its outer edge that protrudes along the normal direction (i.e., the Z-axis direction) of one surface 540a. The projection 542 in this embodiment is formed in the shape of a rectangular frame that surrounds the inner edge. Furthermore, as shown in Figure 3, the projection 542 in this embodiment is formed such that the area surrounded by the projection 542 is approximately the same size and shape as the planar size of the first heat dissipation layer 111 in the semiconductor module 100.

[0067] The above describes the configuration of the temperature sensor module 500 in this embodiment. As shown in Figures 2 and 9, the temperature sensor module 500 in this embodiment is positioned in the space located on the far side of the arrangement direction A among the four spaces, facing the semiconductor module 100 across a connecting pipe 310. Specifically, between the two connecting pipes 310 that constitute the space located on the far side of the arrangement direction A, the temperature sensor module 500 is provided such that one side 540a of the sealing member 540 faces the connecting pipe 310 on which the semiconductor module 100 is located. The other side 540b of the sealing member 540 (i.e., one side 511a of the metal layer 511) faces the connecting pipe 310 on which the semiconductor module 100 is not located. A heat conductive member 410 is positioned between one side 511a of the metal layer 511 and the connecting pipe 310 in the temperature sensor module 500. As a result, the temperature of the cooling medium, which is less affected by the heat of the semiconductor module 100, is transmitted from the metal layer 511 to the temperature sensor 50 of the temperature sensor module 500, thereby improving detection accuracy.

[0068] In this embodiment, since the semiconductor module 100 and the temperature sensor module 500 are arranged in the space between the connecting pipes 310 as described above, the arrangement direction AD can also be said to be the arrangement direction of the semiconductor module 100 and the temperature sensor module 500. Also, although Figure 2 is a front view, the protruding portion 542 of the temperature sensor module 500 is shown as a convex portion in order to make it easier to understand its shape.

[0069] Hereinafter, the connecting pipe 310 facing one surface 540a of the temperature sensor module 500 will also be referred to as the target connecting pipe 311, and the semiconductor module 100 that contacts this target connecting pipe 311 via the heat conductive member 410 will also be referred to as the target semiconductor module 101. Furthermore, the heat conductive member 410 positioned between the target semiconductor module 101 and the target connecting pipe 311 will also be referred to as the target heat conductive member 411. The target semiconductor module 101 has a first support member 110 that contacts the target connecting pipe 311 via the target heat conductive member 411.

[0070] More specifically, the temperature sensor module 500 of this embodiment is provided in the cooling device 300 such that the outer edge portion of the first heat dissipation layer 111 on the target semiconductor module 101 and the protruding portion 542 face each other. In other words, the temperature sensor module 500 is provided in the cooling device 300 such that, in the arrangement direction A, most of the first heat dissipation layer 111 is located within the protruding portion 542. That is, the temperature sensor module 500 is provided in the cooling device 300 such that, in the arrangement direction A, most of the portion of the target heat conductive member 411 that contacts the first heat dissipation layer 111 on the target semiconductor module 101 is located within the protruding portion 542. Note that "most of the first heat dissipation layer 111" includes the entirety of the first heat dissipation layer 111, for example, 50% or more. Also, "most of the portion of the target heat conductive member 411 that contacts the first heat dissipation layer 111 on the target semiconductor module 101" includes the entirety of the first heat conductive member 411, for example, 50% or more.

[0071] As described above, the temperature sensor module 500 is installed in the cooling device 300 such that the outer edge portion of the first heat dissipation layer 111 of the target semiconductor module 101 and the protruding portion 542 face each other. For this reason, the outer edge portion of the temperature sensor module 500 can also be said to be the opposing portion that faces the outer edge portion of the first heat dissipation layer 111 of the target semiconductor module 101, and the inner edge portion can also be said to be the inner portion of the opposing portion. In other words, the portion of the temperature sensor module 500 that faces a predetermined area of ​​the first heat dissipation layer 111 can be called the inner edge portion, and the portion surrounding this inner edge portion can also be called the outer edge portion.

[0072] As a result of the arrangement of the temperature sensor module 500 in this manner, the target connecting pipe 311 is pressed by the protrusion 542. Therefore, as shown in Figure 10, the portion of the target heat conductive member 411 facing the protrusion 542 experiences higher stress than the portion inside the portion facing the protrusion 542. Consequently, the target heat conductive member 411 tends to move from the portion facing the protrusion 542 towards the portion inside the portion facing the protrusion 542. In other words, the portion of the target heat conductive member 411 that contacts the outer edge portion of the first heat dissipation layer 111 in the first support member 110 of the semiconductor module 100 experiences higher stress than the portion that contacts the inner edge portion of the first heat dissipation layer 111 in the first support member 110. Consequently, the target heat conductive member 411 tends to move from the portion contacting the outer edge portion of the first support member 110 towards the portion contacting the inner edge portion. Therefore, it is possible to prevent the target heat conductive member 411 from coming out from between the first heat dissipation layer 111 and the target connecting tube 311 of the target semiconductor module 101, and to prevent a decrease in the cooling performance of the target semiconductor module 101.

[0073] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force of the outer edge portion pressing against the target connecting pipe 311 is greater than the pressing force of the inner edge portion pressing against the target connecting pipe 311. Furthermore, in the arrangement direction AD, the temperature sensor module 500 is arranged such that the first heat dissipation layer 111 of the target semiconductor module 101 is located inside the outer edge portion where the pressing force is higher. Therefore, it is possible to prevent the target heat conductive member 411 from coming out from between the first heat dissipation layer 111 of the target semiconductor module 101 and the target connecting pipe 311. Consequently, it is possible to prevent a decrease in the cooling performance of the target semiconductor module 101.

[0074] (1) In this embodiment, the temperature sensor module 500 has a protrusion 542 formed on one surface 540a. By forming the protrusion 542 in this way, a configuration can be easily realized in which the pressing force of the outer edge portion pressing the target connecting pipe 311 on one surface 540a of the sealing member 540 facing the target connecting pipe 311 is greater than the pressing force of the inner edge portion pressing the target connecting pipe 311.

[0075] (2) In this embodiment, the protruding portion 542 of the temperature sensor module 500 is a frame-shaped portion. Therefore, it is possible to further suppress the target heat conductive member 411 from coming out from between the first heat dissipation layer 111 of the target semiconductor module 101 and the target connecting pipe 311.

[0076] (3) In this embodiment, the sealing member 540 has a recess 541 formed on the side surface between the second main terminal portion 522 and the third main terminal portion 523. This makes it possible to increase the creepage distance along the sealing member 540 between the second main terminal portion 522 and the third main terminal portion 523, thereby suppressing dielectric breakdown. In this embodiment, an example in which the recess 541 is formed on the side surface between the second main terminal portion 522 and the third main terminal portion 523 has been described, but the recess 541 may also be formed between the first main terminal portion 521 and the second main terminal portion 522. Furthermore, the recess 543 may be formed between the temperature sensor terminal portion 524 and the chip resistor terminal portion 525.

[0077] (Modification of the First Embodiment) A modification of the first embodiment described above will now be explained. In the first embodiment, the configuration of the protrusion 542 can be appropriately changed as long as it makes it difficult for the target heat conductive member 411 to come out from between the first heat dissipation layer 111 of the target semiconductor module 101 and the target connecting tube 311. For example, as shown in Figure 11A, the width of the protrusion 542 does not have to be uniform. This makes it possible to reduce the amount of resin in the part that makes up the protrusion 542. The width of the protrusion 542 is the length in the direction that intersects with the direction in which the protrusion 542 extends and is along the surface direction of the sealing member 540. In Figure 11A, a protrusion 542 is shown in which the width of the part extending in the X direction is narrower than the width of the part extending in the Y direction. However, the width of the part extending in the X direction of the protrusion 542 may be wider than the width of the part extending in the Y direction.

[0078] Furthermore, as shown in Figure 11B, the protrusion 542 may not be rectangular in shape as shown in Figure 11A, but rather have a rectangular shape with separated corners. This further reduces the amount of resin that makes up the protrusion 542. Although not specifically shown, the protrusion 542 may have a minute gap between the part extending in the X-axis direction and the part extending in the Y-axis direction. In other words, the protrusion 542 may not be a complete frame shape, but rather a substantially frame shape. Also, as shown in Figure 11C, the protrusion 542 may be equipped with a separation wall 542a that separates the space surrounded by the protrusion 542. This improves the strength of the protrusion 542 and suppresses its breakage. The configurations in Figures 11B and 11C can also be adopted in configurations where the width of the protrusion 542 is constant. Furthermore, as shown in Figures 11D and 11E, the protrusion 542 may be provided on one surface 540a of the sealing member 540, at the outer edge of that surface 540a.

[0079] Furthermore, in the first embodiment described above, the protrusion 542 does not have to be positioned to face the outer edge portion of the first heat dissipation layer 111 in the target semiconductor module 101 in the arrangement direction. For example, the protrusion 542 may be positioned to face the portion of the sealing member 200 in the target semiconductor module 101 that surrounds the outer edge portion of the first heat dissipation layer 111.

[0080] Furthermore, in the first embodiment described above, when an electronic device is used to configure the circuit, the number of first chip resistors 221 constituting the first discharge resistor 22 and the number of second chip resistors 301 constituting the second discharge resistor 30 can be changed as appropriate. Also, when an electronic device is used to configure the circuit, only one of the first discharge resistor 22 and the second discharge resistor 30 may be provided. For example, in the first embodiment described above, the first discharge resistor 22 is configured to include three first chip resistors 221, and the second discharge resistor 30 is configured to include ten second chip resistors 301. Therefore, as a modification, for example, the first discharge resistor 22 may not be provided, and the second chip resistors 301 constituting the second discharge resistor 30 may be 13.

[0081] (Summary of the First Embodiment) The temperature sensor module 500 of the first embodiment described above can also be said to have the effect of suppressing dielectric breakdown. Furthermore, in order to suppress dielectric breakdown, the protrusion 542 does not need to be formed on the sealing member 540. For this reason, it can be said that the following contents and viewpoints are disclosed in the first embodiment described above.

[0082] In other words, conventionally, electronic component modules have been proposed in which electronic components are arranged on a support member, along with multiple terminal sections, and the electronic components and parts of each of the multiple terminal sections are integrally sealed with a sealing member (see, for example, Patent Document 1).

[0083] However, such electronic component modules may experience dielectric breakdown when used with high voltages.

[0084] Furthermore, the first embodiment described above can be said to provide an electronic component module that can suppress dielectric breakdown, and can also be said to have the following aspects. Examples of electronic components that can be provided in the electronic component module include temperature sensors, current sensors, acceleration sensors, capacitors, chip resistors, etc.

[0085] [First viewpoint] An electronic component module comprising: a support member (510); electronic components (50, 221, 301) disposed on the support member; a plurality of terminal portions (521 to 525); and a sealing member (540) that seals the electronic components and a part of the terminal portions while exposing the terminal portions from a side surface (540c), wherein the sealing member has a recess (541) formed at a position between adjacent terminal portions on the side surface.

[0086] [Second viewpoint] The electronic component module according to the first viewpoint, wherein the electronic component includes a temperature sensor (50).

[0087] (Second Embodiment) The second embodiment will now be described. This embodiment is a modification of the temperature sensor module 500 compared to the first embodiment. Other aspects are the same as in the first embodiment, so their explanation will be omitted here.

[0088] In this embodiment, as shown in Figure 12, the temperature sensor module 500 does not have a protrusion 542 formed on one surface 540a of the sealing member 540. Furthermore, in this embodiment, the inner edge of one surface 540a of the sealing member 540 is recessed compared to the outer edge. Note that Figure 12 corresponds to a cross-sectional view along the line VIII-VIII in Figure 7.

[0089] Specifically, the sealing member 540 is formed by pouring molten resin into a mold and allowing it to solidify, as described above. When the sealing member 540 is formed, it shrinks due to curing shrinkage. As a result, as shown in Figure 13, immediately after molding, the inner edge of one surface 540a of the sealing member 540 is significantly recessed compared to the outer edge.

[0090] Furthermore, the temperature sensor module 500 is composed of a sealing member 540 and a support member 510. The metal (for example, copper) that constitutes the metal layer 511 and the conductive layer 513 of the support member 510 has a larger coefficient of linear expansion than the resin that constitutes the sealing member 540. Therefore, when the temperature drops after the sealing member 540 has been molded, the amount of shrinkage of the support member 510 becomes greater than the amount of shrinkage of the sealing member 540. Since the support member 510 is positioned on the other side 540b of the sealing member 540, the inner edge portion of the sealing member 540 on one side 540a shrinks so that it becomes more convex than the outer edge portion. Thus, after the sealing member 540 has been molded, the shrinkage of the support member 510 cancels out the shrinkage of the sealing member 540 immediately after molding. However, if the amount of shrinkage of the support member 510 is too large, the outer edge portion of one side 540a of the sealing member 540 will be more concave than the inner edge portion.

[0091] Therefore, in this embodiment, the amount of thermal shrinkage of the sealing member 540 is made greater than the difference in the amount of thermal shrinkage between the support member 510 and the sealing member 540. More specifically, the amount of thermal shrinkage of the sealing member 540 immediately after molding is made greater than the difference in the amount of thermal shrinkage between the support member 510 and the sealing member 540 from molding until it reaches room temperature. In other words, the thermal shrinkage rate of the sealing member 540 is made greater than the product of the difference in the linear expansion coefficients between the support member 510 and the sealing member 540 and the amount of temperature change. As a result, as shown in Figure 12, the temperature sensor module 500 is in a state where the inner edge portion is recessed compared to the outer edge portion on one surface 540a of the sealing member 540.

[0092] The support member 510 has a metal layer 511, an insulating layer 512, and a conductive layer 513. However, since the thickness of the metal layer 511 and the conductive layer 513 is significantly greater than that of the insulating layer 512, they can be approximated by the coefficients of thermal expansion of the metal layer and the conductive layer 513. Similarly, the difference in thermal shrinkage between the support member 510 and the sealing member 540 can be approximated by the difference between the thermal shrinkage of the metal layer 511 and the conductive layer 513 and the thermal shrinkage of the sealing member 540. The temperature change is the value obtained by subtracting the room temperature from the molding temperature when the sealing member 540 is molded. The thermal shrinkage, thermal shrinkage rate, and difference in the coefficient of thermal expansion of the sealing member 540 are adjusted by changing the material and amount of filler mixed into the epoxy resin, the thickness of the sealing member 540, etc. The thermal shrinkage and coefficient of thermal expansion of the support member 510 are also adjusted by changing the material, thickness, etc.

[0093] When such a temperature sensor module 500 is placed in the cooling device 300, it is positioned so that the outer edge portion of one surface 540a of the sealing member 540 is in contact with the target connecting pipe 311. Specifically, the temperature sensor module 500 is provided in the cooling device 300 such that, in the arrangement direction A, the outer edge portion of the first heat dissipation layer 111 of the target semiconductor module 101 and the outer edge portion of the sealing member 540 face each other. In other words, the temperature sensor module 500 is provided in the cooling device 300 such that, in the arrangement direction A, most of the first heat dissipation layer 111 is positioned inside the outer edge portion. That is, the temperature sensor module 500 is provided in the cooling device 300 such that, in the arrangement direction A, most of the portion of the target heat conductive member 411 that contacts the first heat dissipation layer 111 of the target semiconductor module 101 is positioned inside the sealing member 540.

[0094] Therefore, in the electronic device of this embodiment, the heat conductive member 411 experiences higher stress in the portion facing the outer edge of the sealing member 540 than in the portion inside the portion facing the outer edge of the sealing member 540. Consequently, it is possible to prevent the heat conductive member 411 from coming out from between the first heat dissipation layer 111 and the connecting tube 311 of the semiconductor module 101, thereby preventing a decrease in the cooling performance of the semiconductor module 101.

[0095] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0096] (1) In this embodiment, the temperature sensor module 500 has an inner edge that is recessed compared to the outer edge on one surface 540a of the sealing member 540. By forming the sealing member 540 in this way, it is easy to realize a configuration in which the pressing force of the outer edge pressing against the target connecting pipe 311 on one surface 540a of the sealing member 540 that faces the target connecting pipe 311 is greater than the pressing force of the inner edge pressing against the target connecting pipe 311. Furthermore, compared to the first embodiment, the amount of resin constituting the sealing member 540 can be reduced because there is no protrusion 542.

[0097] (Third Embodiment) The third embodiment will now be described. This embodiment is a modification of the temperature sensor module 500 compared to the first embodiment. Other aspects are the same as in the first embodiment, so their explanation will be omitted here.

[0098] In the temperature sensor module 500 of this embodiment, as shown in Figure 14, the chip resistor 221 closest to the temperature sensor 50 is designated as the nearest chip resistor 221a. In this embodiment, one of the first chip resistors 221 becomes the nearest chip resistor 221a. The temperature sensor module 500 is configured such that the distance L between the nearest chip resistor 221a and the temperature sensor 50 is longer than the distance W between the nearest chip resistor 221a and one surface 511a of the metal layer 511. Note that Figure 14 corresponds to a cross-sectional view along the line VIII-VIII in Figure 7. Also, in Figure 14, for explanatory purposes, the chip resistor 221 closest to the temperature sensor 50 in Figure 14 is designated as the nearest chip resistor 221a, but in reality, the first chip resistor 221 closest to the temperature sensor 50 in Figure 7 becomes the nearest chip resistor 221a. In this embodiment, the first chip resistor 221 and the second chip resistor 301 correspond to electronic components.

[0099] Such a temperature sensor module 500 can suppress the influence of heat from the nearest chip resistor 221a on the temperature sensor 50 compared to a case where the distance L between the nearest chip resistor 221a and the temperature sensor 50 is shorter than the distance W between the nearest chip resistor 221a and one surface 511a of the metal layer 511. That is, as shown in Figure 15, a thermal resistance Rth1 is formed between the nearest chip resistor 221a and the temperature sensor 50, and a thermal resistance Rth2 is formed between the nearest chip resistor 221a and one surface 511a of the metal layer 511. The thermal resistance Rth is given by the following formula 1.

[0100] (Equation 1) Thermal resistance Rth = distance / (cross-sectional area × thermal conductivity) ... (Equation 1) Therefore, as described above, by making the distance L longer than the distance W, the thermal resistance Rth1 between the nearest chip resistor 221a and the temperature sensor 50 increases as the length L in Equation 1 increases. Consequently, the heat from the nearest chip resistor 221a is more easily released from the metal layer 511 of the support member 510, and a decrease in the detection accuracy of the temperature sensor 50 can be suppressed.

[0101] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0102] (1) In this embodiment, the distance L between the temperature sensor 50 and the nearest chip resistor 211a is longer than the distance W between the nearest chip resistor 221a and one surface 511a of the metal layer 511. As a result, heat from the nearest chip resistor 221a is more easily released from the metal layer 511 of the support member 510, and a decrease in the detection accuracy of the temperature sensor 50 can be suppressed.

[0103] (Fourth Embodiment) The fourth embodiment will now be described. This embodiment is a modification of the configuration of the temperature sensor module 500 compared to the third embodiment. Other aspects are the same as in the third embodiment, so their explanation will be omitted here.

[0104] In this embodiment, as shown in Figure 16, the temperature sensor module 500 has a low thermal conductivity region 550, which has a lower thermal conductivity than the sealing member 540, positioned between the temperature sensor 50 and the nearest chip resistor 221a. In other words, the portion that forms the heat path between the temperature sensor 50 and the nearest chip resistor 221a has a low thermal conductivity region 550, which has a lower thermal conductivity than the sealing member 540. In this embodiment, the low thermal conductivity region 550 is an air layer formed by creating a recess 543 from one surface 540a of the sealing member 540. Note that Figure 16 corresponds to a cross-sectional view along the line VIII-VIII in Figure 7. Also, in Figure 16, for explanatory purposes, the chip resistor 221 closest to the temperature sensor 50 in Figure 16 is referred to as the nearest chip resistor 221a, but in reality, the first chip resistor 221 closest to the temperature sensor 50 in Figure 7 is the nearest chip resistor 221a.

[0105] Furthermore, the thermal resistance Rth1 between the nearest chip resistor 221a and the temperature sensor 50 increases when the heat from the nearest chip resistor 221a is propagated to the temperature sensor 50 via the low thermal conductivity region 550, as the thermal conductivity in Equation 1 decreases. Also, the thermal resistance Rth1 between the nearest chip resistor 221a and the temperature sensor 50 increases when the heat from the nearest chip resistor 221a is propagated to the temperature sensor 50 by circumventing the low thermal conductivity region 550, as the cross-sectional area in Equation 1 decreases and the length increases. Therefore, the heat from the nearest chip resistor 221a is more easily released from the metal layer 511 of the support member 510, and a decrease in the detection accuracy of the temperature sensor 50 can be suppressed.

[0106] Furthermore, the heat generated in the chip resistor 221a propagates while spreading. Therefore, if a recess 543 is formed, it is possible to suppress the heat from the chip resistor 221a from reaching the temperature sensor 50. The deeper the recess 543, the more effectively it is possible to suppress the propagation of heat generated in the chip resistor 221a to the temperature sensor 50. For this reason, it is preferable that the bottom surface of the recess 543 be deeper than the depth of the conductor layer 513 side of the chip resistor 221a. With such a configuration, it is possible to suppress the linear propagation of heat generated in the chip resistor 221a to the temperature sensor 50, and furthermore, to suppress a decrease in the detection accuracy of the temperature sensor 50.

[0107] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0108] (1) In this embodiment, a low thermal conductivity region 550, which has a lower thermal conductivity than the sealing member 540, is placed between the temperature sensor 50 and the nearest chip resistor 221a. As a result, heat from the nearest chip resistor 221a is more easily released from the metal layer 511 of the support member 510, and a decrease in the detection accuracy of the temperature sensor 50 can be suppressed.

[0109] (2) In this embodiment, the low thermal conductivity region 550 is composed of an air layer. Therefore, the low thermal conductivity region 550 can be easily formed by forming a recess 543 in the sealing member 540.

[0110] (Modification of the fourth embodiment) A modification of the fourth embodiment described above will now be explained. In the fourth embodiment, the low thermal conductivity region 550 may not be a recess 543 formed from one surface 540a of the sealing member 540, but rather a space formed inside the sealing member 540. Also, the low thermal conductivity region 550 may not be an air layer, but rather a structure in which, for example, a resin layer with a lower thermal conductivity than the sealing member 540 is embedded in the recess 543.

[0111] Furthermore, in the fourth embodiment described above, a configuration was described in which a low thermal conductivity region 550 is placed between the nearest chip resistor 221a and the temperature sensor 50. However, heat from the first chip resistor 221 and the second chip resistor 301, which are different from the nearest chip resistor 221a, may also be propagated to the temperature sensor 50. For this reason, the low thermal conductivity region 550 may also be formed between the first chip resistor 221 and the second chip resistor 301, which are different from the nearest chip resistor 221a, and the temperature sensor 50. Alternatively, the low thermal conductivity region 550 may not be formed between the nearest chip resistor 221a and the temperature sensor 50, but only between the first chip resistor 221 and the second chip resistor 301, which are different from the nearest chip resistor 221a, and the temperature sensor 50. However, by including the space between the nearest chip resistor 221a and the temperature sensor 50 in the low thermal conductivity region 550, it is easier to suppress a decrease in the detection accuracy of the temperature sensor 50.

[0112] (Fifth Embodiment) The fifth embodiment will now be described. This embodiment is a modification of the configuration of the temperature sensor module 500 compared to the fourth embodiment. Other aspects are the same as in the fourth embodiment, so a detailed explanation will be omitted here.

[0113] In this embodiment, as shown in Figure 17, the temperature sensor module 500 has a support member 510 with a low thermal conductivity region 551 that has a lower thermal conductivity than the support member 510. Specifically, in this embodiment, a recess 511b is formed in the metal layer 511 of the support member 510 between the portion facing the temperature sensor 50 and the portion facing the nearest chip resistor 221a. In this embodiment, the recess 511b is formed so as to extend from one surface 511a of the metal layer 511 to the insulating layer 512. The low thermal conductivity region 550 is an air layer formed by the formation of the recess 511b. Note that Figure 17 corresponds to a cross-sectional view along the line VIII-VIII in Figure 7. Also, in Figure 17, for explanatory purposes, the chip resistor 221 closest to the temperature sensor 50 in Figure 17 is referred to as the nearest chip resistor 221a, but in reality, the first chip resistor 221 closest to the temperature sensor 50 in Figure 7 is the nearest chip resistor 221a.

[0114] Here, the heat generated in the chip resistor 221a is propagated to the temperature sensor 50 via the metal layer 511, as indicated by arrow A in Figure 17. Furthermore, a thermal resistance Rth3 exists in the path of heat propagated through the metal layer 511. This thermal resistance Rth3 increases when the heat from the chip resistor 221a is propagated to the temperature sensor 50 via the low thermal conductivity region 551, as the thermal conductivity in Equation 1 decreases. Also, the thermal resistance Rth3 increases when the heat from the chip resistor 221a is propagated to the temperature sensor 50 by going around the low thermal conductivity region 550, as the cross-sectional area in Equation 1 decreases and the length increases. Therefore, the heat from the chip resistor 221a is more easily released from the metal layer 511 of the support member 510, and a decrease in the detection accuracy of the temperature sensor 50 can be suppressed.

[0115] Furthermore, the heat generated in the chip resistor 221a propagates while spreading. Therefore, if a recess 511b is formed, it is possible to suppress the heat from the chip resistor 221a from reaching the temperature sensor 50. The deeper the recess 511b, the more effectively it is possible to suppress the propagation of heat generated in the chip resistor 221a to the temperature sensor 50. For this reason, in this embodiment, the recess 511b is formed to reach the insulating layer 512. However, the depth of the recess 511b can be changed as appropriate.

[0116] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0117] (1) In this embodiment, a low thermal conductivity region 551 is arranged in the metal layer 511 of the support member 510 between the portion facing the temperature sensor 50 and the portion facing the nearest chip resistor 221a. As a result, heat from the nearest chip resistor 221a is easily released from the metal layer 511 of the support member 510, and a decrease in the detection accuracy of the temperature sensor 50 can be suppressed.

[0118] (2) In this embodiment, the low thermal conductivity region 551 is composed of an air layer. Therefore, the low thermal conductivity region 551 can be easily formed by creating a recess 511b in the metal layer 511.

[0119] (Modification of the Fifth Embodiment) A modification of the fifth embodiment described above will now be explained. In the fifth embodiment described above, the low thermal conductivity region 551 may not be an air layer, but rather a resin layer or the like having a lower thermal conductivity than the metal layer 511 of the support member 510 embedded in the recess 511b.

[0120] Furthermore, in the fifth embodiment described above, a configuration was described in which a low thermal conductivity region 551 is placed between the portion of the metal layer 511 of the support member 510 that faces the temperature sensor 50 and the portion that faces the nearest chip resistor 221a. However, heat from the first chip resistor 221 and the second chip resistor 301, which are different from the nearest chip resistor 221a, may also be transmitted to the temperature sensor 50 via the metal layer 511 of the support member 510. For this reason, the low thermal conductivity region 551 may also be formed between the portion of the metal layer 511 of the support member 510 that faces the first chip resistor 221 and the second chip resistor 301, which are different from the nearest chip resistor 221a, and the portion that faces the temperature sensor 50. Furthermore, the low thermal conductivity region 551 may not be formed between the portion of the metal layer 511 of the support member 510 that faces the nearest chip resistor 221a and the temperature sensor 50, but rather only between the portion of the metal layer 511 of the support member 510 that faces the first chip resistor 221 and the second chip resistor 301, which are different from the nearest chip resistor 221a, and the portion that faces the temperature sensor 50. However, by arranging the low thermal conductivity region 551 to include the portion of the metal layer 511 that faces the nearest chip resistor 221a and the temperature sensor 50, it is easier to suppress a decrease in the detection accuracy of the temperature sensor 50.

[0121] (Summary of the Third to Fifth Embodiments) The temperature sensor module 500 of the Third to Fifth Embodiments described above can be made to have the effect of suppressing a decrease in the detection accuracy of the temperature sensor 50. Furthermore, in order to suppress a decrease in the detection accuracy of the temperature sensor 50, it is not necessary for the sealing member 540 to have a protrusion 542 formed on it. Moreover, the Third to Fifth Embodiments described above can be combined as appropriate, and the combined configuration can be changed. For this reason, it can be said that the Third to Fifth Embodiments described above disclose the following contents and viewpoints.

[0122] In other words, the above-mentioned Patent Document 1 has proposed a temperature sensor module in which a temperature sensor and electronic components such as a chip resistor are arranged on a support member, and the temperature sensor and electronic components are sealed with a sealing member.

[0123] However, in such temperature sensor modules, heat generated by electronic components can be transferred to the temperature sensor, potentially reducing the sensor's detection accuracy.

[0124] Furthermore, the third to fifth embodiments described above can be said to provide a temperature sensor module that can suppress a decrease in the detection accuracy of the temperature sensor, and can also be said to have the following features.

[0125] [First viewpoint] A temperature sensor module comprising: a support member (510) having a metal layer (511), an insulating layer (512) disposed on the metal layer, and a conductor layer (513) disposed on the insulating layer; a temperature sensor (50) disposed on the conductor layer of the support member; electronic components (221, 301) disposed on the conductor layer of the support member; and a sealing member (540) that seals the temperature sensor and the electronic components while exposing one side (511a) of the metal layer opposite to the insulating layer side, wherein the thermal resistance (Rth1, Rth3) between the temperature sensor and the electronic components is greater than the thermal resistance (Rth2) between the electronic components and one side of the metal layer.

[0126] [Second viewpoint] The temperature sensor module according to the first viewpoint, wherein the distance (L) between the electronic component (221a) closest to the temperature sensor and the temperature sensor is longer than the distance (W) between the electronic component and one surface of the metal layer.

[0127] [Third viewpoint] The temperature sensor module according to the first or second viewpoint, wherein the sealing member has a low thermal conductivity region (550) which has a lower thermal conductivity than the sealing member, in the portion that forms a heat path between the temperature sensor and the electronic component.

[0128] [Fourth viewpoint] The temperature sensor module according to any one of the first to third viewpoints, wherein the metal layer has a low thermal conductivity region (551) which has a lower thermal conductivity than the metal layer, in a portion that serves as a heat path between the temperature sensor and the electronic component.

[0129] [Fifth viewpoint] The temperature sensor module according to the third or fourth viewpoint, wherein the low thermal conductivity region is an air layer.

[0130] [Sixth viewpoint] The temperature sensor module according to any one of the third to fifth viewpoints, wherein the low thermal conductivity region is located in the portion that forms the heat path between the electronic component (221a) closest to the temperature sensor and the temperature sensor.

[0131] (Sixth Embodiment) The sixth embodiment will now be described. This embodiment is a modification of the temperature sensor module 500 compared to the first embodiment. Other aspects are the same as in the first embodiment, so further explanation will be omitted here.

[0132] As shown in Figure 18A, the temperature sensor module 500 of this embodiment has a fixed portion 527 which includes a support portion 527a connected to the support member 510 and a connecting portion 527b which is connected to the support portion 527a and is floating above the support member 510. The connecting portion 527b has lower rigidity than the support portion 527a.

[0133] In this embodiment, the connecting portion 527b has lower rigidity than the support portion 527a because a notch 5271 is formed on the opposite side of the support portion 527a. In this embodiment, the notch 5271 is formed by two recesses extending in the X-axis direction from the opposite side of the support portion 527a, as shown in Figure 18A. However, the notch 5271 may be composed of a single recess. The shape and location of the notch 5271 can also be changed as appropriate. The sealing member 540 is positioned so that the notch 5271 is also covered with resin.

[0134] The fixing portion 527 is composed of a part of the connecting lead portion 5270, which will be described later. The fixing portion 527 is connected to the conductor layer 513 via a bonding member 514, similar to the temperature sensor 50, the first chip resistor 221, the second chip resistor 301, etc. However, the fixing portion 527 is insulated from the temperature sensor 50, the first chip resistor 221, the second chip resistor 301, etc. In this embodiment, the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301 correspond to electronic components.

[0135] Here, the temperature sensor module 500 described above is manufactured as follows. First, a support member 510 is prepared, and the temperature sensor 50, first chip resistor 221, second chip resistor 301, etc. are placed on the conductor layer 513 or insulating layer 512 via a bonding member 514.

[0136] Next, as shown in Figure 19, a lead frame 520 is prepared in which the first to third main terminal sections 521 to 523, the temperature sensor terminal section 524, the chip resistor terminal section 525, the positioning section 526, the connecting lead section 5270, etc. are integrated by a tie bar 520a. Then, by connecting the connecting lead section 5270 to the support member 510, a component 5100 is prepared in which the support member 510 and the lead frame 520 are integrated.

[0137] The connecting lead portion 5270 is positioned on a side of the support member 510 different from the side where the terminal portions 521 to 525 are located. The connecting lead portion 5270 is formed when the tie bar 520a is removed, creating the support portion 527a and the connecting portion 527b, with a notch 5271 formed in the portion that becomes the connecting portion 527b. The connecting lead portion 5270 is positioned to extend from the tie bar 520a by being bent in the Z-axis direction. In other words, the portion of the connecting lead portion 5270 that connects to the tie bar 520a and the portion that becomes the support portion 527a of the fixing portion 527 are at different heights. The terminal portions 521 to 525 are positioned to extend at the same height as the tie bar 520a. Therefore, the support member 510 and the terminal portions 521 to 525 are at different heights (i.e., in different positions). In this way, by setting the support member 510 and each terminal portion 521 to 525 at different heights (i.e., positions), miniaturization can be achieved while increasing the distance between the support member 510 and each terminal portion 521 to 525, making it easier to ensure insulation.

[0138] Subsequently, the wires 530 are used to connect each terminal portion 521 to 525 to the conductor layer 513. By connecting each terminal portion 521 to 525 to the conductor layer 513 with the wires 530 in this way, stress transmitted from the lead frame 520, such as stress and heat, is less likely to be transmitted to the support member 510 compared to the case where each terminal portion 521 is directly connected via a joining member such as solder. Therefore, damage to the support member 510, temperature sensor 50, first chip resistor 221, and second chip resistor 301 can be suppressed.

[0139] Furthermore, when connecting the connecting lead portion 5270 of the lead frame 520 to the support member 510, stress from the lead frame 520 may be transmitted to the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301 via the support member 510, potentially damaging the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301. For this reason, in this embodiment, a notch 5271 is provided in the connecting lead portion 5270 (i.e., the connecting portion 527b). Therefore, when connecting the lead frame 520 to the support member 510, stress from the lead frame 520 is less likely to be transmitted to the support member 510, thereby suppressing damage to the support member 510, the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301.

[0140] Then, after preparing the component members 5100, the sealing member 540 is molded. When molding the sealing member 540, a mold 600 is prepared in which a cavity 603 is formed by the aligning of the upper mold 601 and the lower mold 602, as shown in Figure 20. Then, with a tie bar 520a sandwiched between the upper mold 601 and the lower mold 602, the component members 510 are positioned so that one surface 511a of the metal layer 511 on the support member 510 abuts against the bottom surface 602a of the lower mold 602. Note that in Figure 20, for ease of understanding, the first chip resistor 221 and the second chip resistor 301, which are electronic components placed on the support member 510, are shown connected to the conductor layer 513 at both ends in the X-axis direction.

[0141] In this case, the component 5100 is positioned such that the tie bar 520a is pressed towards the lower mold 602 by the upper mold 601, so that no gap is formed between one surface 511a of the metal layer 511 on the support member 510 and the bottom surface 602a of the lower mold 602. Therefore, when the component 5100 is placed in the mold 600, stress from the lead frame 520 and others is transmitted to the support member 510 and also propagated through the support member 510 to the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301. Consequently, the support member 510, the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301 may be damaged.

[0142] However, in this embodiment, a notch 5271 is formed in the connecting lead portion 5270 (i.e., the connecting portion 527b). Therefore, when the component members 5100 are placed in the mold 600, stress from the lead frame 520 is less likely to be transmitted to the support member 510, thereby preventing damage to the support member 510, the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301. After the sealing member 540 is formed by pouring molten resin into the cavity 603 of the mold 600, the tie bar 520a is removed, thereby forming a fixing portion 527 with a part of the connecting lead portion 5270.

[0143] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0144] (1) In this embodiment, the fixing portion 527 has a support portion 527a and a connecting portion 527b that are connected to the support member 510, and the connecting portion 527b has lower rigidity than the support portion 527a. Therefore, when connecting the lead frame 520 to the support member 510 and when forming the sealing member 540, stress from the lead frame 520 is less likely to be transmitted to the support member 510, thereby preventing damage to the support member 510 and mounted components (i.e., electronic components) such as the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301.

[0145] (2) In this embodiment, the sealing member 540 is positioned to cover the notch 5271 as well. This prevents the fixing portion 527 from coming out of the sealing member 540.

[0146] (3) In this embodiment, the fixing portion 527 is located on a side different from the side on which each terminal portion 521 to 525 is located. This prevents the lead frame 520 used when preparing the component 5100 from becoming too large, and also improves the stability of the component 5100 when the lead frame 520 is connected to the support member 510 to form the component 5100.

[0147] (4) In this embodiment, as in the first embodiment, each terminal portion 521 to 525 is connected to the conductor layer 513 of the support member 510 by a wire 530. Therefore, when connecting each terminal portion 521 to 525 of the temperature sensor module 500 to an external circuit, stress transmitted from the outside, such as stress and heat from each terminal portion 521 to 525, is less likely to be transmitted to the support member 510. Therefore, damage to the support member 510 and mounted components (i.e., electronic components) such as the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301 can be suppressed.

[0148] (Modification of the sixth embodiment) A modification of the sixth embodiment described above will now be explained. In the sixth embodiment, there may be only one fixing portion 527, or there may be three or more. Also, the fixing portion 527 may be provided on the same side as the terminal portions 521 to 525. Furthermore, the connecting portion 527b may be made thinner or narrower than the support portion 527a to reduce its rigidity.

[0149] Furthermore, as described above, the shape and location of the notch 5271 can be changed as appropriate. For example, the notch 5271 may be a circular hole formed inside the connecting portion 527b, as shown in Figure 18B, or it may be a rectangular hole formed inside the connecting portion 527b, as shown in Figure 18C. Moreover, as shown in Figure 18D, the notch 5271 may be a recess extending in the Y-axis direction formed in the connecting portion 527b.

[0150] (Seventh Embodiment) The seventh embodiment will now be described. This embodiment is a modification of the manufacturing method of the temperature sensor module 500 compared to the sixth embodiment. Other aspects are the same as in the sixth embodiment, so a detailed explanation will be omitted here.

[0151] In this embodiment, the component 5100 is constructed using a lead frame 520 as shown in Figure 21A. In this embodiment, the support member 510 to which the lead frame 520 is connected corresponds to the part being constructed. Specifically, the tie bar 520a has a rectangular frame-shaped portion, and the connecting lead portion 5270 is provided on opposing portions of the tie bar 520a. In other words, there are two connecting lead portions 5270 in this embodiment. The lead frame 520 is configured such that, if the region connecting the opposing connecting lead portions 5270 is defined as a virtual connection region KS, the center of gravity LC of the lead frame 520 is located within the virtual connection region KS. This prevents the lead frame 520 from tilting or rotating when it is joined to the support member 510 to construct the component 510.

[0152] The lead frame 520 has a positioning hole 526a formed in the positioning portion 526, and a hole 520b for the X-axis direction and a hole 520c for the Y-axis direction are formed in the portion that will become the tie bar 520a. In this embodiment, the hole 520b for the X-axis direction corresponds to the first positioning hole, and the hole 520c for the Y-axis direction corresponds to the second positioning hole.

[0153] Furthermore, as shown in Figure 21B, the X-axis direction hole 520b and the Y-axis direction hole 520c are formed in a location diagonally opposite to the overall center of gravity C, which is defined by the center of gravity of the support member 510 and the center of gravity of the lead frame 520, as indicated by arrow D, when the component 5100 is assembled. In other words, the X-axis direction hole 520b and the Y-axis direction hole 520c are formed on opposite sides of the center of gravity C. This prevents the component 5100 from tilting due to eccentricity when it is placed in the mold 600, making it easier to place the component 5100 in the mold 600. It is preferable that the X-axis direction hole 520b and the Y-axis direction hole 520c be positioned as far away from the positioning hole 526a as possible in order to improve positioning accuracy.

[0154] Furthermore, the X-axis direction hole 520b is formed in an elongated or elliptical shape with the Y-axis direction as its major axis. The Y-axis direction hole 520c is formed in an elongated or elliptical shape with the X-axis direction as its major axis. In other words, the X-axis direction hole 520b and the Y-axis direction hole 520c are formed so that their longitudinal directions are different. This allows tolerances in two different directions to be absorbed when the component 5100 is placed in the mold 600, and also makes it easier to place the component 5100 in the mold 600. Figures 21A and 21B show examples where the X-axis direction hole 520b and the Y-axis direction hole 520c are elongated.

[0155] Furthermore, the X-axis direction hole 520b and the Y-axis direction hole 520c are formed to be in different positions when the lead frame 520 is rotated 90° or 180°, or when it is turned over. This helps to prevent errors in mounting the component members 5100 when placing them in the mold 600, and also makes it easier to place the component members 5100 in the mold 600.

[0156] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0157] (1) In this embodiment, the lead frame 520 has a positioning hole 526a formed in the positioning portion 526, and a hole 520b for the X-axis direction and a hole 520c for the Y-axis direction are formed in the portion that will become the tie bar 520a. Therefore, the hole 520b for the X-axis direction and the hole 520c for the Y-axis direction can also be used as positioning holes, making it easier to place the component members 5100 in the mold 600.

[0158] (2) In this embodiment, the X-axis direction hole 520b and the Y-axis direction hole 520c are formed in the portion of the support member 510 that is diagonally opposite to the center of gravity C. Therefore, when the component member 5100 is placed in the mold 600, tilting of the component member 5100 can be suppressed, and the component member 5100 can be placed in the mold 600 more easily.

[0159] (3) In this embodiment, the X-axis direction hole 520b and the Y-axis direction hole 520c are formed so that their longitudinal directions are different. Therefore, when placing the component 5100 in the mold 600, tolerances in two different directions can be absorbed, and the component 5100 can be placed in the mold 600 more easily.

[0160] (4) In this embodiment, the X-axis direction hole 520b and the Y-axis direction hole 520c are formed to be in different positions when the lead frame 520 is rotated 90° or 180°, or when it is turned over. This prevents errors in mounting the component members 5100 when placing them in the mold 600, and also makes it easier to place the component members 5100 in the mold 600.

[0161] (5) In this embodiment, when preparing the lead frame, connecting lead portions 5270 are provided on opposing parts of the tie bar 520a, and the center of gravity LC of the lead frame 520 is located in a virtual connection region KS connecting the opposing connecting lead portions 5270. This prevents the lead frame 520 from tilting or rotating when the lead frame 520 is joined to the support member 510 to form the component member 510, thereby preventing damage to the support member and electronic components.

[0162] (Modification of the Seventh Embodiment) A modification of the seventh embodiment described above will now be explained. In the seventh embodiment, the lead frame 520 may have only one of the X-axis direction hole 520b and the Y-axis direction hole 520c formed thereon. Also, in the seventh embodiment, the X-axis direction hole 520b and the Y-axis direction hole 520c do not have to be located on opposite sides of the center of gravity of the support member 510. In the seventh embodiment, the longitudinal direction of the X-axis direction hole 520b and the Y-axis direction hole 520c may be the same. Furthermore, the shape of the X-axis direction hole 520b and the Y-axis direction hole 520c can be changed as appropriate and may be rectangular, etc. In the seventh embodiment, the X-axis direction hole 520b and the Y-axis direction hole 520c may be formed to be in the same position when the lead frame 520 is rotated 90° or 180°, or when the lead frame 520 is turned over.

[0163] (Summary of the 6th and 7th embodiments) The temperature sensor module 500 of the 6th and 7th embodiments described above can be made to have the effect of suppressing damage to the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301. Furthermore, in order to suppress damage to the temperature sensor 50, the first chip resistor 221, and the second chip resistor 301, it is not necessary for the sealing member 540 to have a protrusion 542 formed on it. For this reason, the 6th and 7th embodiments described above can be said to disclose the following contents and viewpoints.

[0164] In other words, conventionally, electronic component modules have been proposed in which electronic components are arranged on a support member, along with multiple terminal sections, and the electronic components and parts of each of the multiple terminal sections are integrally sealed with a sealing member (see, for example, Japanese Patent No. 7452233).

[0165] Such electronic component modules are manufactured, for example, as follows: First, a lead frame is prepared in which multiple terminals and connecting leads fixed to a support member are integrated with tie bars. Then, by connecting the connecting leads to the support member, a component is formed in which the support member and the lead frame are integrated. This component is then placed in a mold, and molten resin is poured into the mold and solidified to form a sealing member. After that, the unnecessary tie bars are removed to manufacture the electronic component module.

[0166] However, when preparing the components by connecting the support member and the connecting lead portion, stress from the lead frame may be transmitted to the electronic component via the support member, potentially damaging the electronic component.

[0167] Furthermore, the sixth and seventh embodiments described above can be said to provide an electronic component module, a lead frame, and a method for manufacturing the same that can suppress damage to electronic components, and can also be said to have the following aspects. Examples of electronic components that can be provided in the electronic component module include temperature sensors, current sensors, acceleration sensors, capacitors, chip resistors, etc.

[0168] [First viewpoint] An electronic component module comprising: a support member (510); electronic components (50, 221, 301) disposed on the support member; terminal portions (521 to 525) electrically connected to the electronic components; and a sealing member (540) that seals a part of the electronic components and the terminal portions, wherein the support member is provided with a fixing portion (527) having a support portion (527a) connected to the support member and a connecting portion (527b) floating from the support member and connected to the support portion, and the fixing portion is an electronic component module in which the rigidity of the connecting portion is lower than the rigidity of the support portion.

[0169] [Second viewpoint] The connecting portion is an electronic component module according to the first viewpoint, wherein a notch (5271) is formed therein.

[0170] [Third viewpoint] The electronic component module according to the second viewpoint, wherein the sealing member is arranged to also cover the notch.

[0171] [Fourth viewpoint] The fixing portion is located on a side of the support member different from the side on which the terminal portion is located, according to any one of the first to third viewpoints of the electronic component module.

[0172] [Fifth viewpoint] The terminal portion is electrically connected to the electronic component via a wire (530) in the electronic component module according to any one of the first to fourth viewpoints.

[0173] [Sixth Perspective] A method for manufacturing an electronic component module comprising: a support member (510); electronic components (50, 221, 301) arranged on the support member; terminal portions (521 to 525) electrically connected to the electronic components; and a sealing member (540) that seals a part of the electronic components and the terminal portions, wherein the support member is provided with a fixing portion (527) having a support portion (527a) connected to the support member and a connecting portion (527b) floating from the support member and connected to the support portion, wherein the rigidity of the connecting portion of the fixing portion is lower than that of the support portion, the method comprising: arranging the electronic components on the support member; preparing a lead frame (520) in which the connecting lead portions (5270) constituting the terminal portions and the fixing portion are integrated by a tie bar (520a); and connecting the connecting lead portions of the lead frame to the support member to constitute a component (5100), A method for manufacturing an electronic component module, comprising: arranging the constituent members in a mold (600) to form the sealing member; removing the tie bar to form the fixing portion with a part of the connecting lead portion; and preparing the lead frame such that the rigidity of the connecting portion of the connecting lead portion is lower than the rigidity of the support portion of the connecting lead portion.

[0174] [Seventh viewpoint] The method for manufacturing an electronic component module according to the sixth viewpoint, wherein the lead frame is prepared such that when the component is assembled, the connecting lead portion is positioned on a side different from the side on which the terminal portion is positioned relative to the support member.

[0175] [Eighth viewpoint] The method for manufacturing an electronic component module according to the sixth or seventh viewpoint, wherein the lead frame is provided having positioning holes (520b, 520c) formed in the tie bar.

[0176] [Ninth Perspective] The method for manufacturing an electronic component module according to the eighth perspective, wherein the lead frame is prepared such that, when the components are assembled, a first positioning hole (520b) and a second positioning hole (520c) are formed as positioning holes at positions on opposite sides of the overall center of gravity (C) of the support member and the lead frame.

[0177] [Tenth viewpoint] The method for manufacturing an electronic component module according to the eighth or ninth viewpoint, wherein the lead frame is prepared such that the first positioning hole (520b) and the second positioning hole (520c) are formed as positioning holes, and the longitudinal direction is different.

[0178] [Aspect 11] A method for manufacturing an electronic component module according to any one of the eighth to tenth aspects, wherein the lead frame is prepared such that when the lead frame is rotated 90° or 180°, or when the lead frame is turned over, the first positioning hole (520b) and the second positioning hole (520c) are in different positions.

[0179] [12th viewpoint] A method for manufacturing an electronic component module according to any one of the 6th to 10th viewpoints, wherein the lead frame is provided such that the connecting lead portion is provided on opposing parts of the tie bar, and the region connecting the opposing connecting lead portions is defined as a virtual connection region (KS), and the center of gravity (LC) of the lead frame is located within the virtual connection region.

[0180] [13th Perspective] A lead frame comprising: terminal portions (521-525) electrically connected to electronic components (50, 221, 301); connecting lead portions (5270) connected to a target portion; and a tie bar (520a) that integrally holds the terminal portions and the connecting lead portions (5270), wherein the connecting lead portions are provided on opposing portions of the tie bar, and the centroid (LC) of the lead frame is located within the virtual connection region (KS) where the region connecting the opposing connecting lead portions is defined.

[0181] (Eighth Embodiment) The eighth embodiment will now be described. This embodiment is a modification of the temperature sensor module 500 compared to the first embodiment. Other aspects are the same as in the first embodiment, so further explanation will be omitted here.

[0182] The temperature sensor module 500 of this embodiment has the same basic configuration as the first embodiment described above. However, in this embodiment, the wire 530 is arranged so as not to be perpendicular to the flow direction of the resin constituting the sealing member 540. The flow direction of the resin constituting the sealing member 540 is determined, for example, by CAE (Computer Aided Engineering) analysis.

[0183] In other words, the temperature sensor module 500 is manufactured by placing the component members 5100 in a mold 600 and pouring molten resin into the mold 600 to form the sealing member 540, as described in the sixth embodiment above. In this case, for example, the molten resin 5400 flows as shown in Figure 22. The wire 530 is positioned not perpendicular to arrow B, which is the flow direction of the molten resin 5400 (i.e., the sealing member 540). Figure 22 shows an example in which the molten resin 5400 flows in from the lower right portion of the page, and the flow direction of the molten resin 5400 is indicated by arrow B. Also, Figure 22 is an enlarged view of section XXII in Figure 7, but even in a different section from Figure 22, the wire 530 is positioned not perpendicular to arrow B, which is the flow direction of the molten resin 5400.

[0184] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0185] (1) In this embodiment, the wire 530 is arranged so as not to be perpendicular to the flow direction of the resin constituting the sealing member 540. This prevents connection failures from occurring between each terminal portion 521 to 525 and the conductor layer 513 of the support member 510. That is, the sealing member 540 is formed when molten resin 5400 flows into the mold 600 and then solidifies. If the flow direction of the molten resin 5400 is perpendicular to the wire, the stress of the molten resin 5400 applied to the wire 530 will increase, and the wire 530 may break. Therefore, by arranging the wire 530 as in this embodiment, the breakage of the wire 530 can be prevented. In this embodiment, an example in which the wire 530 is connected to the support member 510 has been described, but the wire 530 may also be directly connected to electronic components such as the first chip resistor 221 and the second chip resistor 301.

[0186] (Summary of the Eighth Embodiment) The temperature sensor module 500 of the eighth embodiment described above has the effect of suppressing connection failures between each terminal portion 521 to 525 and the support member 510. Furthermore, in order to suppress connection failures between each terminal portion 521 to 525 and the support member 510, the sealing member 540 does not need to have a protrusion 542 formed on it. For this reason, the eighth embodiment discloses the following contents and viewpoints.

[0187] In other words, conventionally, electronic component modules have been proposed in which electronic components are arranged on a support member, terminals are arranged on the support member, and parts of the electronic components and terminals are integrally sealed with a sealing member (see, for example, Patent Document 1).

[0188] In such electronic component modules, each terminal is sometimes connected to a support member or electronic component via a wire. The wire is positioned to connect each terminal to the support member.

[0189] Such electronic component modules are manufactured as follows: the terminals and support members or electronic components are connected via wires. Then, this is placed in a mold, and molten resin is poured into the mold and solidified to form a sealing member.

[0190] However, in such electronic component modules, if the flow direction of the wire and the molten resin are perpendicular, the stress applied to the wire from the molten resin becomes large, which may cause the wire to break. In other words, if the flow direction of the wire and the molten resin are perpendicular, a connection failure may occur between the terminal and the support member or electronic component.

[0191] Furthermore, the eighth embodiment described above can be said to provide an electronic component module that can suppress connection failures between each terminal and the support member or electronic component, and can be said to have the following aspects. Examples of electronic components that can be provided in the electronic component module include temperature sensors, current sensors, acceleration sensors, capacitors, chip resistors, etc.

[0192] [First viewpoint] An electronic component module comprising: a support member (510); electronic components (50, 221, 301) arranged on the support member; terminal portions (521 to 525) electrically connected to the electronic components; a sealing member (540) comprising resin that seals a part of the electronic components and the terminal portions; and a wire (530) connecting the terminal portions to the support member or the electronic components, wherein the flow direction of the wire and the resin constituting the sealing member is not perpendicular.

[0193] (Ninth Embodiment) The ninth embodiment will now be described. This embodiment is a modification of the temperature sensor module 500 compared to the first embodiment. Other aspects are the same as in the first embodiment, so further explanation will be omitted here.

[0194] The temperature sensor module 500 of this embodiment has the same basic configuration as the first embodiment described above. In this embodiment, as shown in Figure 7, the first chip resistors 221 are arranged in the Y-axis direction. The second chip resistors 301 are also arranged in the Y-axis direction. In this embodiment, the second chip resistors 301, which are arranged in the Y-axis direction, are arranged in three rows in the X-axis direction.

[0195] The first chip resistor 221 and the second chip resistor 301 are arranged such that a gap is formed between the inner sides of both ends in the Y-axis direction and the support member 510, with the ends of each chip resistor in the Y-axis direction being connected via a conductor layer 513 and a connecting member 514. A sealing member 540 is placed in this gap. Hereafter, the gap between the inner sides of both ends of the first chip resistor 221 and the second chip resistor 301 in the Y-axis direction and the support member 510 will also be simply referred to as the gap between the first chip resistor 221 and the second chip resistor 301 and the support member 510. The gaps between the first chip resistor 221 and the second chip resistor 301 and the support member 510 are in communication in the same direction, and in this embodiment, they are in communication in the X-axis direction.

[0196] In this embodiment, the temperature sensor 50, like the first chip resistor 221 and the second chip resistor 301, is connected to the support member 510 via a conductor layer 513 and a connecting member 514 so that a gap is formed between the inner sides of both ends in the Y-axis direction and the support member 510. A sealing member 540 is placed in this gap. Hereafter, the gap between the inner sides of both ends of the temperature sensor 50 in the Y-axis direction and the support member 510 will also be simply referred to as the gap between the temperature sensor 50 and the support member 510. The gap between the temperature sensor 50 and the support member 510 is in communication in the X-axis direction, similar to the gap between the first chip resistor 221 and the second chip resistor 301 and the support member 510. In other words, in this embodiment, the temperature sensor 50, the first chip resistor 221 and the second chip resistor 301 are arranged on the support member 510 such that the gap is in communication along the X-axis direction, which is one direction in the planar direction of the support member 510. Furthermore, the statement that the gaps are in communication along the X-axis includes cases where the gaps perfectly align with the X-axis, but also cases where the gaps are slightly tilted from the X-axis due to manufacturing tolerances, etc.

[0197] Here, the joining member 514 is made of solder as described above. In this case, the solder used as the joining member 514 is either one that directly contains flux or one for which flux is supplied separately during soldering, in order to stabilize the solder wettability.

[0198] Furthermore, since the temperature sensor module 500 of this embodiment is used in connection with an inverter circuit 40, etc., a high voltage is applied to the first chip resistor 221 and the second chip resistor 301. If flux remains on the solder used as the bonding member 514, there is a concern that active components such as halogen ions in the flux will promote the dissolution of Sn (i.e., tin) and other elements in the solder, causing migration. Therefore, it is preferable to remove the flux by washing before forming the sealing member 540. For example, an aqueous cleaning solution can be used.

[0199] In this embodiment, before molding the sealing member 540, the gaps between the first chip resistor 221, the second chip resistor 301, and the temperature sensor 50 and the support member 510 (i.e., the conductive layer 513) are all in communication in the X-axis direction. In other words, the gaps between the first chip resistor 221, the second chip resistor 301, and the temperature sensor 50 and the support member 510 are all in communication in the same direction. Therefore, as shown in Figure 23A, the direction in which the cleaning liquid enters can be made common in the X-axis direction as indicated by arrows E1, E2, and E3, thereby simplifying the cleaning process. Note that if the direction in which the gaps between the first chip resistor 221, the second chip resistor 301, and the temperature sensor 50 and the support member 510 are in communication and the direction in which the cleaning liquid enters are not perpendicular, the cleaning liquid can be more easily injected into the gaps, further simplifying the cleaning process. However, it is preferable that the direction of communication of the gap between the first chip resistor 221, the second chip resistor 301, and the temperature sensor 50 and the support member 510 be approximately parallel to the direction in which the cleaning liquid enters, as this makes it easier for the cleaning liquid to enter the gap.

[0200] Furthermore, after the cleaning process is completed, the sealing member 540 is molded. In this embodiment, the communication direction of the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50, and the support member 510 is aligned in the same direction. When molding the sealing member 540, the communication direction of each gap and the flow direction of the sealing member 540 placed in the gap are made non-perpendicular. In other words, when molding the sealing member 540, the configuration of the mold 600 is adjusted so that the flow direction of the molten resin 5400 flowing in the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50, and the support member 510 is non-perpendicular to the communication direction of the gap. For example, in this embodiment, the flow direction of the sealing member 540 placed in the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50, and the support member 510 is aligned with the communication direction of this gap (i.e., the X-axis direction). Therefore, the sealing member 540 is filled between the first chip resistor 221, the second chip resistor 301, and the temperature sensor 50 and the support member 510, thereby suppressing the occurrence of unfilled areas and voids. Furthermore, in this embodiment, when molding the sealing member 540, the communication direction of each gap and the flow direction of the sealing member 540 placed in the gap are not perpendicular. Therefore, as shown in Figure 23B, the gate mark 5401 formed on the sealing member 540 is located in a direction different from the direction perpendicular to the communication direction of the gap. In this embodiment, the gate mark 5401 is located on the side surface 540c of the sealing member 540 that extends in the Y-axis direction. The gate mark 5401 formed on the sealing member 540 is a mark formed on the sealing member 540 when the sealing member 540 is separated from the mold 600 after the molten resin 5400 has been poured into the mold 600 to form the sealing member 540, and it indicates the position of the gate of the mold 600. Furthermore, in Figure 23B, the gate mark 5401 is shown in an exaggerated manner. In this embodiment, the gate mark 5401 formed on the sealing member 540 is located on the side surface 540c of the sealing member 540 that extends in the Y-axis direction. However, the gate mark 5401 formed on the sealing member 540 only needs to be located in a direction different from the direction perpendicular to the communication direction of the gap, and may be located on the side surface 540c that extends in the X-axis direction.In other words, the gate mark 5401 may be located on the terminal portion 521 to 525 side of the sealing member 540. To put it another way, the gate used when pouring the molten resin 5400 into the mold 600 may be located on the terminal portion 521 to 525 side of the mold 600.

[0201] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0202] (1) In this embodiment, the gaps between the first chip resistor 221, the second chip resistor 301, and the temperature sensor 50 and the support member 510 are in communication along the same direction. Therefore, in the cleaning process before molding the sealing member 540, the cleaning can be performed so that the cleaning liquid penetrates from a direction not perpendicular to the direction in which the gaps communicate, thereby simplifying the cleaning process.

[0203] (2) In this embodiment, the flow direction of the sealing member 540, which is placed in the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50 and the support member 510, is not perpendicular to the communication direction of the gap. As a result, the molten resin constituting the sealing member 540 flows easily into the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50 and the support member 510. Consequently, the sealing member 540 is more easily filled between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50 and the support member 510, and the occurrence of voids and unfilled areas can be suppressed.

[0204] (Modification of the Ninth Embodiment) A modification of the ninth embodiment described above will now be explained. In the ninth embodiment, the gaps between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50, and the support member 510 do not all communicate in the same direction; some of the gaps may communicate in different directions.

[0205] (Tenth Embodiment) The tenth embodiment will now be described. This embodiment is a modification of the temperature sensor module 500 compared to the ninth embodiment. Other aspects are the same as in the ninth embodiment, so their explanation will be omitted here.

[0206] The temperature sensor module 500 of this embodiment has the same basic configuration as the first embodiment described above. Furthermore, as shown in Figure 24, the thickness T of the conductive layer 513 of the temperature sensor module 500 of this embodiment is defined.

[0207] Specifically, the sealing member 540 is constructed by mixing a filler into epoxy resin or the like, as described above. The filler has, for example, an average length of about 20 μm and a maximum length of about 70 μm. For this reason, the conductive layer 513 in this embodiment has a thickness T of 70 μm or more. As a result, the filler cannot flow into the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50, and the support member 510, so the sealing member 540 is not placed there, and the generation of voids and the like can be suppressed.

[0208] Furthermore, although the conductive layer 513 is patterned by etching or the like, if the thickness T is too thick, the taper may become larger, potentially reducing processability. For this reason, it is preferable that the conductive layer 513 be 210 μm or less.

[0209] According to the embodiment described above, in the temperature sensor module 500, on one surface 540a of the sealing member 540 facing the target connecting pipe 311, the pressing force exerted by the outer edge portion against the target connecting pipe 311 is greater than the pressing force exerted by the inner edge portion against the target connecting pipe 311. Therefore, the same effects as in the first embodiment can be obtained.

[0210] (1) In this embodiment, the thickness T of the conductive layer 513 is 70 μm or more. Therefore, the filler cannot flow into the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50 and the support member 510, so the sealing member 540 is not placed there, and the generation of voids and the like can be suppressed.

[0211] (2) In this embodiment, the thickness T of the conductive layer 513 is 210 μm or less. Therefore, a decrease in processability can be suppressed.

[0212] (Modification of the 10th Embodiment) A modification of the 10th embodiment described above will now be explained. In the 10th embodiment described above, a configuration was described in which the thickness T of the conductor layer 513 was set to 70 μm or more to suppress the occurrence of voids. However, for example, an underfill material with higher fluidity than the sealing member 540 may be placed in the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50 and the support member 510. In this way as well, the occurrence of voids in the gap between the first chip resistor 221, the second chip resistor 301, the temperature sensor 50 and the support member 510 can be suppressed.

[0213] (Summary of the 9th and 10th embodiments) The temperature sensor module 500 of the 9th and 10th embodiments described above can be made to have the effect of suppressing the occurrence of voids between the electronic component and the support member 510. Furthermore, in order to suppress the occurrence of voids between the electronic component and the support member 510, it is not necessary for the sealing member 540 to have a protrusion 542 formed thereon. For this reason, the 9th and 10th embodiments described above can be said to disclose the following contents and viewpoints.

[0214] In other words, conventionally, electronic component modules have been proposed in which electronic components are arranged on a conductive layer of a support member, and the support member and electronic components are integrally sealed with a sealing member (see, for example, Patent Document 1). The sealing member is also placed in the gap between the electronic component and the support member.

[0215] Such electronic component modules are manufactured by placing a support member containing the electronic components into a mold, pouring molten resin into the mold, and then allowing it to solidify to form a sealing member.

[0216] However, in such electronic component modules, molten resin may not flow into the gap between the electronic component and the support member, potentially creating voids between the electronic component and the support member.

[0217] Furthermore, the ninth and tenth embodiments described above can be said to provide an electronic component module and a method for manufacturing the same that can suppress the occurrence of voids between the sealing member and the support member, and can also be said to have the following aspects. Examples of electronic components that can be provided in the electronic component module include temperature sensors, current sensors, acceleration sensors, capacitors, chip resistors, etc.

[0218] [First viewpoint] An electronic component module comprising: a support member (510) having a conductive layer (513); a plurality of electronic components (50, 221, 301) arranged on the conductive layer via a bonding member (514); and a sealing member (540) that seals the electronic components and is made of resin, wherein the plurality of electronic components are arranged such that a gap is formed between each of the parts that are connected to the conductive layer and the support member, and the gap communicates along one direction in the planar direction of the support member.

[0219] [Second viewpoint] The electronic component module according to the first viewpoint, wherein the sealing member is also placed in the gap between the electronic component and the support member, and the flow direction of the resin is not perpendicular to the direction in which the gap communicates.

[0220] [Third viewpoint] The electronic component module according to the first or second viewpoint, wherein the conductive layer has a thickness (T) of 70 μm or more.

[0221] [Fourth viewpoint] The electronic component module according to any one of the first to third viewpoints, wherein the conductor layer has a thickness (T) of 210 μm or less.

[0222] [Fifth viewpoint] An electronic component module comprising: a support member (510) having a conductive layer (513); electronic components (50, 221, 301) arranged on the conductive layer via a bonding member (514); and a sealing member (540) that seals the electronic components and is made of resin, wherein the conductive layer has a thickness (T) of 70 μm or more and 210 μm or less.

[0223] [Sixth Perspective] A method for manufacturing an electronic component module comprising: a support member (510) having a conductor layer (513); a plurality of electronic components (50, 221, 301) arranged on the conductor layer via a bonding member (514); and a sealing member (540) that seals the electronic components and is made of resin, wherein each of the plurality of electronic components is arranged such that a gap is formed between the portion that is connected to the conductor layer and the portion that is different from the portion that is connected to the conductor layer and the support member, and the gap communicates along one direction in the planar direction of the support member, the method comprising: arranging the electronic components on the conductor layer of the support member via solder as the bonding member; cleaning and removing the flux used when arranging the electronic components; and molding the sealing member by pouring molten resin into a mold (600) and solidifying it, wherein the cleaning of the flux is performed such that the cleaning liquid penetrates from a direction along the communication direction of the gap.

[0224] [Sixth viewpoint] A method for manufacturing an electronic component module, wherein molding the sealing member is such that the flow direction of the molten resin flowing into the gap between the electronic component and the support member is not perpendicular to the communication direction of the gap.

[0225] (Other Embodiments) While this disclosure has been described in accordance with embodiments, it is understood that this disclosure is not limited to such embodiments or structures. This disclosure also includes various modifications and variations within the scope of equivalents. In addition, various combinations and forms, as well as other combinations and forms that include only one, more, or fewer of those elements, fall within the scope and idea of ​​this disclosure.

[0226] For example, in each of the above embodiments, the electronic device may be configured to include two or fewer semiconductor modules 100, or it may be configured to include four or more semiconductor modules 100.

[0227] Furthermore, in each of the above embodiments, the first semiconductor chip 120 and the second semiconductor chip 130 may not have switching elements 41a to 46a forming the three-phase inverter circuit 40, but may have semiconductor elements forming other circuits.

[0228] Furthermore, the configuration of the semiconductor module 100 can be modified as appropriate in each of the above embodiments. For example, in the first embodiment, a configuration was described in which one first heat dissipation layer 111 and one second heat dissipation layer 171 are exposed from the sealing member 200. However, the semiconductor module 100 may be configured such that, for example, two first heat dissipation layers 111 and two second heat dissipation layers 171 are exposed from the sealing member 200. In other words, the first support member 110 and the second support member 170 that are thermally connected to the first semiconductor chip 120 and the first support member 110 and the second support member 170 that are thermally connected to the second semiconductor chip 130 may be separated.

[0229] In this case, for example, in the temperature sensor module 500 of the first embodiment, the plurality of first heat dissipation layers 111 are arranged such that each is located within the protruding portion 542 in the arrangement direction A. In the temperature sensor module 500 of the second embodiment, the plurality of first heat dissipation layers 111 are arranged such that each is located within the outer edge portion of the sealing member 540 in the arrangement direction A.

[0230] Furthermore, the semiconductor module 100 may be configured such that, for example, as shown in Figure 25, the first support member 110 is composed of a first heat dissipation layer 111, and the second support member 170 is composed of a second heat dissipation layer 171. Although shown simply in Figure 25, the first support member 110 and the second support member 170 are appropriately provided with insulating structures and connection structures such as those that connect the first semiconductor chip 120 and the second semiconductor chip 130 in series, similar to the first embodiment described above. When such a semiconductor module 100 is placed in the cooling device 300, an insulating heat dissipation member 430, in which an insulating plate 420 made of ceramic or the like is sandwiched between heat conductive members 410, should be placed between the semiconductor module 100 and the connecting pipe 310.

[0231] Furthermore, the temperature sensor module 500 and its manufacturing method in each of the above embodiments can be combined as appropriate. That is, as in the second embodiment, the inner edge portion of one surface 540a of the sealing member 540 may be recessed compared to the outer edge portion. As in the third to fifth embodiments, the thermal resistance between the temperature sensor 50 and the electronic component may be adjusted. As in the sixth and seventh embodiments, the shape of the fixing portion 527 and the shape of the lead frame 520 may be adjusted. As in the eighth embodiment, the flow direction of the wire 530 and the resin constituting the sealing member 540 may be non-perpendicular. As in the ninth and tenth embodiments, the communication direction of the gap between the electronic component and the support member 510 and the thickness of the conductor layer 513 may be adjusted.

[0232] The control unit and its method described herein may be implemented by a dedicated computer provided by configuring a processor and memory programmed to perform one or more functions embodied by a computer program. Alternatively, the control unit and its method described herein may be implemented by a dedicated computer provided by configuring a processor by one or more dedicated hardware logic circuits. Alternatively, the control unit and its method described herein may be implemented by one or more dedicated computers configured by a combination of a processor and memory programmed to perform one or more functions and a processor configured by one or more hardware logic circuits. Furthermore, the computer program may be stored as instructions executed by the computer on a computer-readable non-transitional tangible recording medium.

[0233] [Disclosure of the Invention] The above disclosure can be understood, for example, from the following viewpoints. [First Perspective] An electronic device comprising: a cooling device (300) having an inlet pipe (300a), an outlet pipe (300b), and connecting pipes (310, 311) connecting the inlet pipe and the outlet pipe, through which a cooling medium flows; semiconductor modules (100, 101) having semiconductor chips (120, 130) arranged opposite to the connecting pipe; heat conductive members (410, 411) arranged between the semiconductor module and the connecting pipe; a temperature sensor module (500) having a support member (510) arranged on the opposite side of the connecting pipe from the semiconductor module, a temperature sensor (50) arranged on the support member for detecting the temperature of the cooling medium, and a sealing member (540) for sealing the temperature sensor, wherein the semiconductor module has a heat dissipation layer (111) on the side facing the connecting pipe that is thermally connected to the semiconductor chip and the heat conductive member, and the heat conductive member is arranged in contact with the heat dissipation layer. [Second viewpoint] The temperature sensor module is configured such that, on one side (540a) of the sealing member facing the connecting tube, the pressing force exerted by the outer edge portion of the one side facing the connecting tube is greater than the pressing force exerted by the inner edge portion of the one side facing the connecting tube, and the electronic device is arranged in the cooling device such that the heat dissipation layer is located inside the outer edge portion in the arrangement direction (AD) of the semiconductor module and the temperature sensor module. [Second viewpoint] The semiconductor module has a sealing member (200) that seals the semiconductor chip while exposing one side (111a) of the heat dissipation layer facing the connecting tube, and the temperature sensor module is configured such that, in the arrangement direction, the outer edge portion includes the outer edge portion of the semiconductor module or the portion of the sealing member that faces the outer edge portion of the heat dissipation layer, and the outer edge portion, which exerts a greater pressing force than the inner edge portion, is provided in a frame shape, as described in the first viewpoint.[Third viewpoint] The electronic device according to the first or second viewpoint, wherein the sealing member has a projection (542) formed on its outer edge portion on one surface facing the connecting pipe, projecting in the direction normal to the surface. [Fourth viewpoint] The electronic device according to the first or second viewpoint, wherein the sealing member has an inner edge portion recessed from the outer edge portion on one surface facing the connecting pipe. [Fifth viewpoint] The electronic device according to the fourth viewpoint, wherein the sealing member is a molded body containing resin, and the sealing member and the support member are configured such that the amount of thermal shrinkage of the sealing member is greater than the difference in the amount of thermal shrinkage of the support member and the sealing member. [Sixth viewpoint] A temperature sensor module comprising: a support member (510); a temperature sensor (50) disposed on the support member for detecting temperature; and a sealing member (540) that seals the support member and the temperature sensor, wherein one side (540a) of the sealing member opposite to the support member side is positioned facing the mounted members (310, 311), and the pressing force of the outer edge portion pressing the mounted members is greater than the pressing force of the inner edge portion inside the outer edge portion pressing the mounted members. [Seventh Aspect] The temperature sensor module according to the sixth aspect, wherein the support member has a metal layer (511), an insulating layer (512) disposed on the metal layer, and a conductor layer (513) disposed on the insulating layer, the temperature sensor is disposed on the conductor layer of the support member and has electronic components (221, 301) different from the temperature sensor disposed on the conductor layer of the support member, the sealing member seals the temperature sensor and the electronic components while exposing one side (511a) of the metal layer opposite to the insulating layer side, and the thermal resistance (Rth1, Rth3) between the temperature sensor and the electronic components is greater than the thermal resistance (Rth2) between the electronic components and one side of the metal layer. [Eighth Aspect] The temperature sensor module according to the seventh aspect, wherein the distance (L) between the electronic component (221a) closest to the temperature sensor and the temperature sensor is longer than the distance (W) between the electronic components and one side of the metal layer.[Ninth Aspect] The temperature sensor module according to the seventh or eighth aspect, wherein the sealing member has a low thermal conductivity region (550) having a lower thermal conductivity than the sealing member in the portion that forms a heat path between the temperature sensor and the electronic component. [Tenth Aspect] The temperature sensor module according to any one of the seventh to ninth aspects, wherein the metal layer has a low thermal conductivity region (551) having a lower thermal conductivity than the metal layer in the portion that forms a heat path between the temperature sensor and the electronic component. [Eleventh Aspect] The temperature sensor module according to the ninth or tenth aspect, wherein the low thermal conductivity region is an air layer. [Twelfth Aspect] The temperature sensor module according to any one of the ninth to eleventh aspects, wherein the low thermal conductivity region is located in the portion that forms a heat path between the electronic component (221a) closest to the temperature sensor and the temperature sensor. [13th Aspect] The temperature sensor module according to any one of the 6th to 12th aspects, wherein the support member is provided with a fixed portion (527) having a support portion (527a) connected to the support member and a connecting portion (527b) floating from the support member and connected to the support portion, and the fixed portion is configured such that the rigidity of the connecting portion is lower than the rigidity of the support portion. [14th Aspect] The temperature sensor module according to the 13th aspect, wherein the connecting portion has a notch (5271) formed therein. [15th Aspect] The temperature sensor module according to the 14th aspect, wherein the sealing member is arranged to cover the notch as well. [16th Aspect] The temperature sensor module according to any one of the 13th to 15th aspects, comprising an electronic component (221, 301) including the temperature sensor and terminal portions (521 to 525) electrically connected to the electronic component, and the fixed portion is arranged on a side of the support member different from the side on which the terminal portions are arranged. [17th aspect] A temperature sensor module according to any one of the 6th to 16th aspects, comprising an electronic component (221, 301) including the temperature sensor, and terminal portions (521 to 525) electrically connected to the electronic component, wherein the terminal portions are electrically connected to the electronic component via a wire (530).[18th Aspect] The temperature sensor module according to any one of the 6th to 17th aspects, wherein the sealing member is made up of resin and comprises electronic components (221, 301) including the temperature sensor, terminal portions (521 to 525) electrically connected to the electronic components, and a wire (530) connecting the terminal portions to the support member or the electronic components, and the flow direction of the wire and the resin constituting the sealing member is not perpendicular. [19th Aspect] The temperature sensor module according to any one of the 6th to 18th aspects, wherein the support member has a conductor layer (513) and a plurality of electronic components (50, 221, 301) including the temperature sensor, the sealing member is made up of resin and seals the electronic components, the plurality of electronic components are arranged such that there is a gap between the portion connected to the conductor layer and the portion different from the portion connected to the support member, and the gap communicates along one direction in the planar direction of the support member. [20th Aspect] The temperature sensor module according to the 19th Aspect, wherein the sealing member is also disposed in the gap between the electronic component and the support member, and the flow direction of the resin is not perpendicular to the direction in which the gap communicates. [21st Aspect] The temperature sensor module according to the 19th or 20th Aspect, wherein the conductor layer has a thickness (T) of 70 μm or more. [22nd Aspect] The temperature sensor module according to any one of the 19th to 21st Aspects, wherein the conductor layer has a thickness (T) of 210 μm or less. [23rd viewpoint] A temperature sensor module according to any one of the 6th to 22nd viewpoints, comprising an electronic component (221, 301) including the temperature sensor, and a plurality of terminal portions (521 to 525) connected to the electronic component, wherein the sealing member seals the electronic component and a part of the terminal portions while exposing the terminal portions from the side surface (540c), and a recess (541) is formed on the side surface at a position between adjacent terminal portions.[24th Perspective] A method for manufacturing a temperature sensor module comprising: a support member (510); a temperature sensor (50) disposed on the support member for detecting temperature; terminal portions (521-525) electrically connected to the temperature sensor; and a sealing member (540) that seals the temperature sensor and a part of the terminal portions, wherein one side (540a) of the sealing member opposite to the support member side is positioned facing the mounted members (310, 311), and the pressing force of the outer edge portion pressing the mounted members is greater than the pressing force of the inner edge portion inside the outer edge portion pressing the mounted members, the support member is provided with a fixing portion (527) having a support portion (527a) connected to the support member and a connecting portion (527b) floating from the support member and connected to the support portion, wherein the rigidity of the connecting portion is lower than that of the support portion. A method for manufacturing a temperature sensor module, comprising: arranging the temperature sensor on the support member; preparing a lead frame (520) in which the connecting lead portion (5270) constituting the terminal portion and the fixing portion are integrated with a tie bar (520a); connecting the connecting lead portion of the lead frame to the support member to constitute a component (5100); arranging the component in a mold (600) to form the sealing member; and removing the tie bar to constitute the fixing portion with a part of the connecting lead portion, wherein the lead frame is prepared such that the rigidity of the connecting portion of the connecting lead portion is lower than the rigidity of the support portion of the connecting lead portion; and forming the sealing member such that the pressing force of the outer edge portion pressing against the mounting member is greater than the pressing force of the inner edge portion pressing against the mounting member. [25th viewpoint] The method for manufacturing a temperature sensor module according to the 24th viewpoint, wherein the lead frame is prepared such that when the constituent members are assembled, the connecting lead portion is positioned on a side different from the side on which the terminal portion is positioned relative to the support member.[26th viewpoint] The method for manufacturing a temperature sensor module according to the 24th or 25th viewpoint, wherein the lead frame is provided having positioning holes (520b, 520c) formed in the tie bar. [27th viewpoint] The method for manufacturing a temperature sensor module according to the 26th viewpoint, wherein the lead frame is provided having a first positioning hole (520b) and a second positioning hole (520c) formed as the positioning holes at positions opposite to the overall center of gravity (C) of the support member and the lead frame when the components are assembled. [28th viewpoint] The method for manufacturing a temperature sensor module according to the 26th or 27th viewpoint, wherein the lead frame is provided having a first positioning hole (520b) and a second positioning hole (520c) formed as the positioning holes in different longitudinal directions. [29th viewpoint] The method for manufacturing a temperature sensor module according to any one of the 26th to 28th viewpoints, wherein the lead frame is provided such that when the lead frame is rotated 90° or 180°, or when the lead frame is turned over, the first positioning hole (520b) and the second positioning hole (520c) as positioning holes are in different positions. [30th viewpoint] The method for manufacturing a temperature sensor module according to any one of the 24th to 29th viewpoints, wherein the lead frame is provided such that the connecting lead portion is provided on opposing parts of the tie bar, and if the region connecting the opposing connecting lead portions is defined as a virtual connection region (KS), then the center of gravity (LC) of the lead frame is located within the virtual connection region.[31st Perspective] A method for manufacturing a temperature sensor module comprising: a support member (510) having a conductor layer (513); a plurality of electronic components (221, 301) including a temperature sensor (50) that detects temperature and is arranged on the conductor layer via a bonding member (514); and a sealing member (540) that seals the electronic components and is made of resin, wherein one side (540a) of the sealing member opposite to the support member side is arranged facing the components to be mounted (310, 311), and the pressing force of the outer edge portion pressing the components to be mounted is greater than the pressing force of the inner edge portion inside the outer edge portion pressing the components to be mounted, the plurality of electronic components are arranged such that there is a gap between the portion that is connected to the conductor layer and the support member, and the gap communicates along one direction in the surface direction of the support member, wherein the electronic components are arranged on the conductor layer of the support member via solder as the bonding member, A method for manufacturing a temperature sensor module, comprising: cleaning and removing the flux used when arranging the electronic components; and forming the sealing member by pouring molten resin into a mold (600) and allowing it to solidify, wherein the cleaning of the flux is performed such that the cleaning liquid penetrates from a direction along the communication direction of the gap; and the sealing member is formed such that the pressing force of the outer edge portion pressing against the mounted member is greater than the pressing force of the inner edge portion pressing against the mounted member. [32nd viewpoint] A method for manufacturing a temperature sensor module according to the 31st viewpoint, wherein the flow direction of the molten resin flowing into the gap between the electronic components and the support member is not perpendicular to the communication direction of the gap.

Claims

1. An electronic device comprising: a cooling device (300) having an inlet pipe (300a), an outlet pipe (300b), and connecting pipes (310, 311) connecting the inlet pipe and the outlet pipe, through which a cooling medium flows; semiconductor modules (100, 101) having semiconductor chips (120, 130) arranged opposite to the connecting pipe; heat conductive members (410, 411) arranged between the semiconductor modules and the connecting pipe; a temperature sensor module (500) having a support member (510) arranged on the opposite side of the connecting pipe from the semiconductor modules, a temperature sensor (50) arranged on the support member for detecting the temperature of the cooling medium, and a sealing member (540) for sealing the temperature sensor, wherein the semiconductor module has a heat dissipation layer (111) on the side facing the connecting pipe that is thermally connected to the semiconductor chip and the heat conductive member, and the heat conductive member is arranged in contact with the heat dissipation layer. The temperature sensor module is configured such that, on one side (540a) of the sealing member facing the connecting tube, the pressing force exerted by the outer edge portion of that side against the connecting tube is greater than the pressing force exerted by the inner edge portion of that side inside the outer edge portion against the connecting tube, and the electronic device is arranged in the cooling device such that the heat dissipation layer is located inside the outer edge portion in the arrangement direction (AD) between the semiconductor module and the temperature sensor module.

2. The electronic device according to claim 1, wherein the semiconductor module has a sealing member (200) that seals the semiconductor chip while exposing one surface (111a) of the heat dissipation layer facing the connecting tube, and the temperature sensor module has an outer edge portion that, in the arrangement direction, includes the outer edge portion of the semiconductor module or the portion of the sealing member that faces the outer edge portion of the heat dissipation layer, and the outer edge portion, which has a greater pressing force than the inner edge portion, is provided in a frame shape.

3. The electronic device according to claim 1 or 2, wherein the sealing member has a projection (542) formed on its outer edge portion on one surface facing the connecting pipe, projecting in the direction normal to the surface.

4. The electronic device according to claim 1 or 2, wherein the sealing member has an inner edge portion recessed from the outer edge portion on one surface facing the connecting pipe.

5. The electronic device according to claim 4, wherein the sealing member is a molded body containing resin, and the sealing member and the support member are such that the amount of thermal shrinkage of the sealing member is greater than the difference in the amount of thermal shrinkage of the support member and the sealing member.

6. A temperature sensor module comprising: a support member (510); a temperature sensor (50) disposed on the support member for detecting temperature; and a sealing member (540) for sealing the support member and the temperature sensor, wherein one side (540a) of the sealing member opposite to the support member side is positioned facing the mounted members (310, 311), and the pressing force of the outer edge portion pressing against the mounted members is greater than the pressing force of the inner edge portion inside the outer edge portion pressing against the mounted members.

7. The temperature sensor module according to claim 6, wherein the support member has a metal layer (511), an insulating layer (512) disposed on the metal layer, and a conductor layer (513) disposed on the insulating layer; the temperature sensor is disposed on the conductor layer of the support member and has electronic components (221, 301) different from the temperature sensor disposed on the conductor layer of the support member; the sealing member seals the temperature sensor and the electronic components while exposing one side (511a) of the metal layer opposite to the insulating layer side; and the thermal resistance (Rth1, Rth3) between the temperature sensor and the electronic components is greater than the thermal resistance (Rth2) between the electronic components and one side of the metal layer.

8. The temperature sensor module according to claim 7, wherein the distance (L) between the electronic component (221a) closest to the temperature sensor and the temperature sensor is longer than the distance (W) between the electronic component and one surface of the metal layer.

9. The temperature sensor module according to claim 7, wherein the sealing member has a low thermal conductivity region (550) which has a lower thermal conductivity than the sealing member, in the portion that serves as a heat path between the temperature sensor and the electronic component.

10. The temperature sensor module according to claim 7, wherein the metal layer has a low thermal conductivity region (551) that is lower in thermal conductivity than the metal layer, in a portion that serves as a heat path between the temperature sensor and the electronic component.

11. The temperature sensor module according to claim 9 or 10, wherein the low thermal conductivity region is an air layer.

12. The temperature sensor module according to claim 9 or 10, wherein the low thermal conductivity region is located in the portion that forms the heat path between the electronic component (221a) closest to the temperature sensor and the temperature sensor.

13. The temperature sensor module according to claim 6, wherein the support member is provided with a fixed portion (527) having a support portion (527a) connected to the support member and a connecting portion (527b) floating from the support member and connected to the support portion, and the rigidity of the connecting portion of the fixed portion is lower than that of the support portion.

14. The temperature sensor module according to claim 13, wherein the connecting portion has a notch (5271) formed therein.

15. The temperature sensor module according to claim 14, wherein the sealing member is arranged to also cover the notch.

16. A temperature sensor module according to any one of claims 13 to 15, comprising an electronic component (221, 301) including the temperature sensor, and terminal portions (521 to 525) electrically connected to the electronic component, wherein the fixing portion is arranged on a side of the support member different from the side on which the terminal portions are arranged.

17. The temperature sensor module according to claim 6, comprising an electronic component (221, 301) including the temperature sensor, and terminal portions (521 to 525) electrically connected to the electronic component, wherein the terminal portions are electrically connected to the electronic component via a wire (530).

18. The temperature sensor module according to claim 6, wherein the sealing member is made up of a resin and comprises an electronic component (221, 301) including the temperature sensor, terminal portions (521 to 525) electrically connected to the electronic component, and a wire (530) connecting the terminal portion to the support member or the electronic component, and the flow direction of the wire and the resin constituting the sealing member is not perpendicular.

19. The temperature sensor module according to claim 6, wherein the support member has a conductive layer (513), and has a plurality of electronic components (50, 221, 301) including the temperature sensor, the sealing member is made of resin and seals the electronic components, the plurality of electronic components are arranged such that a gap is formed between the support member and a portion that is different from the portion that is connected to the conductive layer, and the gap is in communication along one direction in the planar direction of the support member.

20. The temperature sensor module according to claim 19, wherein the sealing member is also placed in the gap between the electronic component and the support member, and the flow direction of the resin is not perpendicular to the direction in which the gap communicates.

21. The temperature sensor module according to claim 19, wherein the conductive layer has a thickness (T) of 70 μm or more.

22. The temperature sensor module according to any one of claims 19 to 21, wherein the conductor layer has a thickness (T) of 210 μm or less.

23. The temperature sensor module according to claim 6, comprising an electronic component (221, 301) including the temperature sensor, and a plurality of terminal portions (521 to 525) connected to the electronic component, wherein the sealing member seals the electronic component and a part of the terminal portions while exposing the terminal portions from the side surface (540c), and a recess (541) is formed on the side surface at a position between adjacent terminal portions.

24. A method for manufacturing a temperature sensor module comprising: a support member (510); a temperature sensor (50) disposed on the support member for detecting temperature; terminal portions (521-525) electrically connected to the temperature sensor; and a sealing member (540) that seals the temperature sensor and a part of the terminal portions, wherein one side (540a) of the sealing member opposite to the support member is positioned facing the mounted members (310, 311), and the pressing force of the outer edge portion pressing the mounted members is greater than the pressing force of the inner edge portion inside the outer edge portion pressing the mounted members, the support member is provided with a fixing portion (527) having a support portion (527a) connected to the support member and a connecting portion (527b) floating from the support member and connected to the support portion, wherein the rigidity of the connecting portion is lower than the rigidity of the support portion, the method for manufacturing a temperature sensor module comprising: arranging the temperature sensor on the support member; A method for manufacturing a temperature sensor module, comprising: preparing a lead frame (520) in which the connecting lead portion (5270) constituting the terminal portion and the fixing portion is integrated with a tie bar (520a); connecting the connecting lead portion of the lead frame to the support member to constitute a component (5100); arranging the component in a mold (600) to form the sealing member; and removing the tie bar to constitute the fixing portion with a part of the connecting lead portion, wherein the lead frame is prepared such that the rigidity of the connecting portion of the connecting lead portion is lower than the rigidity of the support portion of the connecting lead portion; and forming the sealing member such that the pressing force of the outer edge portion pressing against the mounting member is greater than the pressing force of the inner edge portion pressing against the mounting member.

25. The method for manufacturing a temperature sensor module according to claim 24, wherein the lead frame is prepared such that when the constituent members are assembled, the connecting lead portion is positioned on a side different from the side on which the terminal portion is positioned relative to the support member.

26. The method for manufacturing a temperature sensor module according to claim 24 or 25, wherein the lead frame is provided having positioning holes (520b, 520c) formed in the tie bar.

27. The method for manufacturing a temperature sensor module according to claim 26, wherein the lead frame is prepared such that, when the constituent members are assembled, a first positioning hole (520b) and a second positioning hole (520c) are formed as positioning holes at positions on opposite sides of the overall center of gravity (C) of the support member and the lead frame.

28. The method for manufacturing a temperature sensor module according to claim 26, wherein the lead frame is prepared such that the first positioning hole (520b) and the second positioning hole (520c) are formed in a positioning hole that has a different longitudinal direction.

29. The method for manufacturing a temperature sensor module according to claim 26, wherein the lead frame is prepared such that when the lead frame is rotated 90° or 180°, or when the lead frame is turned over, the first positioning hole (520b) and the second positioning hole (520c) serving as positioning holes are in different positions.

30. The method for manufacturing a temperature sensor module according to claim 24, wherein the lead frame is provided such that the connecting lead portion is provided on opposing parts of the tie bar, and the region connecting the opposing connecting lead portions is defined as a virtual connection region (KS), and the center of gravity (LC) of the lead frame is located within the virtual connection region.

31. A method for manufacturing a temperature sensor module comprising: a support member (510) having a conductor layer (513); a plurality of electronic components (221, 301) including a temperature sensor (50) that detects temperature and is arranged on the conductor layer via a bonding member (514); and a sealing member (540) that seals the electronic components and is made of resin, wherein one side (540a) of the sealing member opposite to the support member side is arranged facing the components to be mounted (310, 311), and the pressing force of the outer edge portion pressing the components to be mounted is greater than the pressing force of the inner edge portion inside the outer edge portion pressing the components to be mounted, and each of the plurality of electronic components is arranged such that a gap is formed between the portion that is connected to the conductor layer and the support member, and the gap communicates along one direction in the surface direction of the support member, wherein the electronic components are arranged on the conductor layer of the support member via solder as the bonding member, A method for manufacturing a temperature sensor module, comprising: cleaning and removing the flux used when arranging the electronic components; and forming the sealing member by pouring molten resin into a mold (600) and allowing it to solidify, wherein the cleaning is performed such that the cleaning liquid penetrates from a direction along the communication direction of the gap, and the sealing member is formed such that the pressing force of the outer edge portion pressing the mounted component is greater than the pressing force of the inner edge portion pressing the mounted component.

32. The method for manufacturing a temperature sensor module according to claim 31, wherein the sealing member is molded such that the flow direction of the molten resin flowing into the gap between the electronic component and the support member is not perpendicular to the communication direction of the gap.

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