Thermosetting resin composition, sealing material, and electronic component device

Abstract

Provided are a thermosetting resin composition having excellent fluidity, a sealing material, and an electronic component device. This thermosetting resin composition contains: a thermosetting resin; a silane coupling agent containing a silane compound in which an organic functional group having a polyoxyethylene skeleton is bonded to silicon via a hydrocarbon group having 1-10 carbon atoms; and an inorganic filler.

Description

Thermosetting resin compositions, encapsulants, and electronic component devices

[0001] The present invention relates to a thermosetting resin composition, a encapsulant, and an electronic component device.

[0002] Traditionally, resin encapsulation has been the mainstream method for encapsulating electronic components such as transistors and ICs, due to its productivity and cost-effectiveness. Epoxy resins, which offer an excellent balance of various properties including electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to insert components, are primarily used for encapsulation.

[0003] In recent years, with the increasing density of electronic components mounted on printed circuit boards, surface-mount packages have become the dominant mounting method for semiconductor devices, replacing the conventional pin-insertion type. Surface-mount packages are becoming thinner and smaller to increase mounting density and reduce mounting height. Furthermore, the increasing multi-functionality and high capacity of devices have led to an increase in chip area and the number of pins, as well as an increase in the number of pads (electrodes), which has resulted in a reduction in pad pitch and pad dimensions, also known as narrow pad pitch.

[0004] With the miniaturization and multi-functionalization of packages, the wires used within them have become thinner, and in conventional transfer molding, issues such as wire flow have become a problem. On the other hand, in compression molding, liquid or granular sealant is directly placed into the cavity, melted, and then the package is immersed in the mixture to form the package, thus eliminating the problem of wire flow. In both transfer molding and compression molding, liquid or solid sealants are used as the sealant. In transfer molding, solid sealants are heated to a melted state and then filled into the cavity. In compression molding, solid sealants are filled into the cavity in granular form, then heated to melt, and compressed within the cavity. For example, Japanese Patent Publication No. 2018-172545 discloses a solid sealant that exhibits excellent stability in warping behavior after molding and heat treatment.

[0005] However, in order to cope with the recent trend towards narrower pad pitches in packages, improvements have been made to enhance the fluidity of solid encapsulants, such as by miniaturizing the inorganic filler used in solid encapsulants. Nevertheless, in both transfer molding and compression molding, the fluidity of the solid encapsulant was sometimes insufficient. Low fluidity can lead to molding defects, which can result in problems such as reduced yield in semiconductor package manufacturing. Therefore, in view of the above circumstances, this disclosure aims to provide a thermosetting resin composition, encapsulant, and electronic component device with excellent fluidity.

[0006] Having achieved the above-mentioned objectives, this disclosure includes: <1> a thermosetting resin composition comprising a thermosetting resin, a silane coupling agent containing a silane compound in which an organic functional group having a polyoxyethylene skeleton is bonded to silicon via a hydrocarbon group having 1 to 10 carbon atoms, and an inorganic filler; and <2> the thermosetting resin composition according to <1>, wherein the silane compound is represented by the following general formula (1). [In general formula (1), R １ , , and each independently represent an alkyl group having 1 to 5 carbon atoms, X represents a hydrocarbon group having 1 to 10 carbon atoms, Y each independently represents a hydrolyzable group, Z is an organic functional group having a polyoxyethylene skeleton, and m represents an integer from 1 to 3. 3. The thermosetting resin composition according to 2, wherein Y in the general formula (1) is each independently an alkoxy group. 4. The thermosetting resin composition according to 2, wherein Y in the general formula (1) is each independently a methoxy group or an ethoxy group. 5. The thermosetting resin composition according to any one of 2 to 4, wherein m in the general formula (1) is 3. 6. The thermosetting resin composition according to any one of 1 to 5, wherein the polyoxyethylene skeleton has a linear oxyethylene group or a branched oxyethylene group. 7. A sealing material comprising the thermosetting resin composition according to any one of 1 to 6. An electronic component device comprising <8> an element and a cured product of the sealing material described in <7> for sealing the element.

[0007] According to this disclosure, it is possible to provide a thermosetting resin composition with excellent fluidity, a encapsulant, and an electronic component device using the same.

[0008] The embodiments are described in detail below. However, this disclosure is not limited to the embodiments described below. In the embodiments described below, the components (including elemental steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit this disclosure.

[0009] In this disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes, provided that the purpose of the process is achieved. In this disclosure, numerical ranges indicated using "~" include the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described in stages in this disclosure, the upper or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described in stages. Also, in a described numerical range, the upper or lower limit of that range may be replaced with the value shown in the example. In this disclosure, each component may contain multiple types of the corresponding substance. If multiple types of the substance corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple types of substances present in the composition, unless otherwise specified. In this disclosure, each component may contain multiple types of particles. If multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0010] <Thermosetting Resin Composition> The thermosetting resin composition of this disclosure comprises a thermosetting resin, a silane coupling agent containing a silane compound in which an organic functional group having a polyoxyethylene skeleton is bonded to silicon via a hydrocarbon group having 1 to 10 carbon atoms, and an inorganic filler. The silane compound is not particularly limited, but examples include compounds represented by the following general formula (1).

[0011]

[0012] [In general formula (1), R １ Each of the following independently represents an alkyl group having 1 to 5 carbon atoms, X represents a hydrocarbon group having 1 to 10 carbon atoms, Y independently represents a hydrolyzable group, Z is an organic functional group having a polyoxyethylene skeleton, and m represents an integer from 1 to 3.

[0013] The thermosetting resin composition of this disclosure exhibits excellent fluidity when melted due to the inclusion of a specific silane coupling agent. Because of its excellent fluidity, the thermosetting resin composition of this disclosure is suitable for sealing materials and other applications. Here, fluidity can be evaluated by measuring spiral flow. In the thermosetting resin composition of this disclosure, the spiral flow (at 175°C) is preferably 140 cm or more, more preferably 145 cm or more, even more preferably 160 cm or more, and still more preferably 165 cm or more. In the thermosetting resin composition of this disclosure, the spiral flow (at 175°C) is preferably 300 cm or less, more preferably 290 cm or less, even more preferably 280 cm or less, and still more preferably 270 cm or less. Spiral flow can be measured using a spiral flow measurement mold conforming to EMMI-1-66 under the conditions described in the examples.

[0014] The thermosetting resin composition disclosed herein is not limited to its action, mechanism, etc., but it is presumed that the inclusion of a specific silane coupling agent improves the dispersibility of the inorganic filler, resulting in excellent fluidity in the molten state.

[0015] (Specific Silane Coupling Agent) The specific silane coupling agent contains a silane compound in which an organic functional group having a polyoxyethylene skeleton is bonded to silicon via a hydrocarbon group having 1 to 10 carbon atoms. Examples of silane compounds include the compound represented by the general formula (1) above. The silane coupling agent may be used alone or in combination of two or more types.

[0016] In the general formula (1) above, Y independently represents a hydrolyzable group. A hydrolyzable group is a group that can produce a hydroxyl group by hydrolysis (in formula (1), a group that can bond with a silicon atom to produce a silanol group). Examples of hydrolyzable groups represented by Y include alkoxy groups. In particular, examples of hydrolyzable groups represented by Y include alkoxy groups having 1 to 5 carbon atoms, alkenyloxy groups having 1 to 5 carbon atoms, acyloxy groups having 1 to 5 carbon atoms, hydroxyl groups, halogen atoms, etc. From the viewpoint of easily exhibiting stable performance, alkoxy groups having 1 to 5 carbon atoms are preferred as hydrolyzable groups represented by Y, alkoxy groups having 1 to 3 carbon atoms are more preferred, and methoxy or ethoxy groups are even more preferred.

[0017] In the general formula (1) above, m represents an integer from 1 to 3, but is particularly preferably 2 or 3, and more preferably 3. That is, in the general formula (1) above, it is more preferable that the structure has three Y atoms bonded to the silicon atom. In this case, the dispersibility of the inorganic filler in the thermosetting resin composition of this disclosure can be further improved, and the fluidity of the thermosetting resin composition can be further enhanced. When m is 3, the specific silane coupling agent according to this disclosure is R １ The structure will not have this feature.

[0018] In the above general formula (1), R １ Each of these independently represents an alkyl group having 1 to 5 carbon atoms, and is included when m is 1 or 2. In general formula (1), R １ It is particularly preferable that the alkyl group has 1 to 3 carbon atoms, and more preferably that it is a methyl group or an ethyl group.

[0019] In the specific silane coupling agent relating to this disclosure, the polyoxyethylene skeleton may have linear oxyethylene groups or branched oxyethylene groups. The branched polyoxyethylene group may have both linear oxyethylene groups and branched oxyethylene groups, or it may have branched oxyethylene groups branched from linear oxyethylene groups, or linear oxyethylene groups may be bonded to the end of the branched oxyethylene groups. The polyoxyethylene skeleton is defined as (-CH ２ CH ２ The skeleton can contain 2 to 20 units of oxyethylene groups represented as O-, with 2 to 15 units being preferred, and 2 to 12 units being more preferred. Here, the organic functional group having a polyoxyethylene skeleton may have a linear structure with oxyethylene groups in the above range, or it may have a linear structure with a linear oxyethylene group and a branched oxyethylene group branched from the linear oxyethylene group. In the case of a structure with a linear oxyethylene group and a branched oxyethylene group, it is preferable that the total number of polyoxyethylene groups satisfies the above range.

[0020] In this disclosure, an organic functional group means a functional group obtained by removing one or more hydrogen atoms from an organic compound. In this disclosure, an organic functional group having a polyoxyethylene skeleton means a monovalent organic functional group obtained by removing one hydrogen atom from an organic compound having a polyoxyethylene skeleton. Examples of organic functional groups having a polyoxyethylene skeleton include, but are not limited to, linear or branched polyoxyethylene groups. Other examples of organic functional groups include alkyl groups, alkenyl groups, alkynyl groups, alkylidene groups, aryl groups, aralkyl groups, alkaryl groups, cycloalkyl groups, alkoxy groups, heterocyclic groups, carboxyl groups, etc. Examples of alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, etc. Examples of alkenyl groups include allyl group, pentenyl group, vinyl group, etc. Examples of alkynyl groups include the ethynyl group. Examples of alkylidene groups include the methylidene group and the ethylidene group. Examples of aryl groups include the tolyl group, xylyl group, phenyl group, naphthyl group, and anthracenyl group. Examples of aralkyl groups include the benzyl group and the phenethyl group. Examples of alkaryl groups include the tolyl group and the xylyl group. Examples of cycloalkyl groups include the adamantyl group, cyclopentyl group, cyclohexyl group, and cyclooctyl group. Examples of alkoxy groups include the methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, s-butoxy group, isobutoxy group, t-butoxy group, n-pentyloxy group, neopentyloxy group, and n-hexyloxy group. Examples of heterocyclic groups include the epoxy group and the oxetanyl group.

[0021] In the general formula (1) above, Z may be a linear oxyethylene group or a branched oxyethylene group.

[0022] In the general formula (1), when Z is a branched oxyethylene group, specifically, Z may be a group represented by the following formula (2) or formula (2').

[0023]

[0024] In the formulas (2) and (2'), the wavy line represents the bonding site, and R ２ represents an alkyl group having 1 to 5 carbon atoms or an organic functional group having a polyoxyethylene skeleton, p is a value of 1 to 3 on average, and q is a value of 2 to 10 on average. In the formula (2) and the formula (2'), the structural unit enclosed by p and the structural unit enclosed by q from the bonding site are arranged in reverse order. By setting the values of p and q within this range, the dispersibility of the inorganic filler can be further improved, and the fluidity of the thermosetting resin composition of the present disclosure becomes even more excellent. The fact that the values of p or q are average values means that a plurality of specific silane coupling agents having different repetition numbers of the units enclosed by parentheses in the formulas (2) and (2') and the same other parts are included, and it is the average value of p or q in these plurality of specific silane coupling agents.

[0025] In the formulas (2) and (2'), R ２ is an alkyl group having 1 to 5 carbon atoms or an organic functional group having a polyoxyethylene skeleton. In particular, when R ２ is an alkyl group having 1 to 5 carbon atoms, R ２ is preferably an alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group or an ethyl group. The organic functional group having a polyoxyethylene skeleton in R ２ can be applied to those listed as the organic functional group having a polyoxyethylene skeleton described above.

[0026] In the formulas (2) and (2'), p is a value of 1 to 3 on average, but particularly preferably 1 to 2, and even more preferably 1.3 to 1.7. In the formulas (2) and (2'), q is a value of 2 to 10 on average, but preferably 4 to 9, and more preferably 6 to 8.

[0027] Further, in the general formula (1), Z may be a group represented by the following formula (3) or formula (3').

[0028]

[0029] In the above formula (3) and formula (3'), p and q are the same as those in the above formula (2) and formula (2'). Also, in the above formula (3) and formula (3'), k is a value of 0 to q on average. In the above formula (3) and formula (3'), k is preferably 0.1 to 10, more preferably 0.2 to 9, and even more preferably 0.3 to 8.

[0030] Further, in formula (3) and formula (3'), the positions of the structural unit enclosed by p and the structural unit enclosed by q - k are reversed. That is, in the general formula (1), Z may be a structure in which the structural unit enclosed by q - k and the structural unit enclosed by p are arranged in order from the bonding site (wavy line). Furthermore, in the above formula (3) and formula (3'), the oxygen atom branched in the structural unit enclosed by p may have a further branched structure.

[0031] In the general formula (1), X represents a hydrocarbon group having 1 to 10 carbon atoms. The hydrocarbon group includes an aliphatic hydrocarbon group and an aromatic hydrocarbon group. Examples of the aliphatic hydrocarbon group include a linear or branched alkylene group, and examples of the aromatic hydrocarbon group include a phenylene group. In particular, X is preferably a hydrocarbon group having 1 to 8 carbon atoms, more preferably a hydrocarbon group having 1 to 6 carbon atoms, and even more preferably a hydrocarbon group having 1 to 4 carbon atoms.

[0032] Specific examples of the compounds represented by the above formula (2) and formula (2') include compounds represented by the following formula (4) and formula (4'), respectively, in which the value of p is 1.5 and the value of q is 7.6.

[0033]

[0034] In the above formula (4) and formula (4'), p and q are the same as those in the above formula (2). Further, in the above formula (4) and formula (4'), the positions of the structural unit enclosed by p and the structural unit enclosed by q are arranged in reverse.

[0035] Further, when Z in the general formula (1) is a linear oxyethylene group, specifically, Z may be a group represented by the following formula (5).

[0036] In the formula (5), the wavy line represents the bonding site, r is an average value of 1 to 20, preferably 2 to 15, and more preferably 2 to 12. By setting the value of r within this range, the dispersibility of the inorganic filler can be further improved, and the fluidity of the thermosetting resin composition of the present disclosure becomes more excellent. The fact that the value of r is an average value means that it is the average value of r in a plurality of specific silane coupling agents in which the number of repetitions of the unit enclosed in parentheses in the formula (5) is different and the other parts of the general formula (1) are the same.

[0037] Specific examples of the compound represented by the formula (5) include the compound represented by the following formula (6).

[0038]

[0039] In the above formula (6), r is the same as in the above formula (5).

[0040] The commercially available Dynasyland 4148 (manufactured by Evonik) is presumed to contain at least one compound selected from the group consisting of a compound in which Z in the general formula (1) is a linear oxyethylene group and a compound in which Z is a branched oxyethylene group. That is, Dynasyland 4148 (manufactured by Evonik) is presumed to contain at least one compound selected from the group consisting of the compound represented by the above formula (2) and the compound represented by the above formula (5). Although not limited to the action, mechanism, etc., it is presumed that when the thermosetting resin composition contains Dynasyland 4148 (manufactured by Evonik) as a specific silane coupling agent, the dispersibility of the inorganic filler is improved and the fluidity in the molten state is excellent.

[0041] In the thermosetting resin composition of this disclosure, the amount of the specific silane coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass, per 100 parts by mass of the inorganic filler. By keeping the amount of the specific silane coupling agent within the above range, adhesion to the frame is further improved, and the moldability of the package tends to improve.

[0042] (Inorganic Filler) The thermosetting resin composition of this disclosure contains an inorganic filler. The type of inorganic filler is not particularly limited. Specifically, examples of inorganic materials include fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, fossterite, steatite, spinel, mullite, titania, talc, clay, and mica. Inorganic fillers having a flame-retardant effect may also be used. Examples of inorganic fillers having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium and zinc hydroxide, and zinc borate. Among these, fused silica is preferred from the viewpoint of reducing the coefficient of thermal expansion, and alumina is preferred from the viewpoint of high thermal conductivity. One type of inorganic filler may be used alone, or two or more types may be used in combination. Examples of inorganic fillers in the form of powder, beads formed from spherical powder, fibers, etc.

[0043] In the thermosetting resin composition of this disclosure, the content of inorganic filler is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 30% to 90% by volume of the total thermosetting resin composition, more preferably 35% to 88% by volume, and even more preferably 40% to 86% by volume. When the content of inorganic filler is 30% or more by volume of the total thermosetting resin composition, the properties of the cured product, such as the coefficient of thermal expansion, thermal conductivity, and elastic modulus, tend to improve further. When the content of inorganic filler is 90% or less by volume of the total thermosetting resin composition, the increase in viscosity of the thermosetting resin composition is suppressed, fluidity improves further, and moldability tends to be better.

[0044] The average particle size of the inorganic filler is not particularly limited. For example, the volume-average particle size is preferably 0.1 μm to 50 μm, more preferably 0.3 μm to 40 μm, and even more preferably 0.5 μm to 30 μm. The volume-average particle size of the inorganic filler can be measured as the volume-average particle size (D50) using a laser diffraction scattering particle size distribution analyzer.

[0045] The volume-average particle size of inorganic fillers in a thermosetting resin composition or its cured product can be measured by known methods. For example, the inorganic filler can be extracted from the thermosetting resin composition or cured product using an organic solvent, nitric acid, aqua regia, etc., and then thoroughly dispersed using an ultrasonic disperser or the like to prepare a dispersion. Using this dispersion, the volume-average particle size of the inorganic filler can be measured from the volume-based particle size distribution measured by a laser diffraction scattering particle size distribution analyzer. Alternatively, the volume-average particle size of the inorganic filler can be measured from the volume-based particle size distribution obtained by embedding the cured product in a transparent epoxy resin or the like, polishing the resulting cross-section, and observing it with a scanning electron microscope. Furthermore, it can also be measured by continuously observing the two-dimensional cross-section of the cured product using a FIB (Focused Ion Beam SEM) and performing three-dimensional structural analysis.

[0046] From the viewpoint of the fluidity of the thermosetting resin composition of this disclosure, the particle shape of the inorganic filler is preferably spherical rather than angular, and the particle size distribution of the inorganic filler is preferably widely distributed.

[0047] (Thermosetting Resin) The thermosetting resin composition of this disclosure includes a thermosetting resin. The thermosetting resin is not particularly limited as long as it forms a three-dimensional crosslinked structure by a reaction caused by heating. The thermosetting resin may cure by self-polymerization or by reaction with a curing agent, crosslinking agent, etc.

[0048] The functional groups that cause the reaction in the thermosetting resin are not particularly limited, and examples include epoxy groups, cyclic ether groups such as oxetanyl groups, hydroxyl groups, carboxyl groups, amino groups, acryloyl groups, isocyanate groups, maleimide groups, alkenyl groups, and the like. When using the thermosetting resin composition of this disclosure as a encapsulant, from the viewpoint of balancing the properties of the encapsulant, a thermosetting resin containing cyclic ether groups is preferred, and a thermosetting resin containing epoxy groups (epoxy resin) is more preferred.

[0049] If the thermosetting resin is an epoxy resin, the type of epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule. Specifically, novolac-type epoxy resins (phenol novolac-type epoxy resins, orthocresol novolac-type epoxy resins, etc.) are obtained by condensing or co-condensing a novolac resin obtained by condensing or co-condensing a novolac resin obtained by phenol compounds selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene under an acidic catalyst with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, or propionaldehyde under an acidic catalyst. Copolymer epoxy resins that have been modified; diphenylmethane-type epoxy resins that are diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl-type epoxy resins that are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins that are diglycidyl ethers of stilbene-based phenol compounds; sulfur atom-containing epoxy resins that are diglycidyl ethers of bisphenol S, etc.; epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; glycidyl ester-type epoxy resins that are glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; glycidylamine-type epoxy resins in which the active hydrogen bonded to the nitrogen atom of aniline, diaminodiphenylmethane, isocyanuric acid, etc. is substituted with a glycidyl group; dicyclopentadiene-type epoxy resins that are epoxidized from a co-condensation resin of dicyclopentadiene and a phenol compound;Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which have epoxidized olefin bonds within the molecule; paraxylylene-modified epoxy resins, which are glycidyl ethers of paraxylylene-modified phenol resins; metaxylylene-modified epoxy resins, which are glycidyl ethers of metaxylylene-modified phenol resins; terpene-modified epoxy resins, which are glycidyl ethers of terpene-modified phenol resins; and dicyclopentadiene-modified phenol resins, which are glycidyl ethers of dicyclopentadiene-modified phenol resins. Examples of epoxy resins include: pentadiene-modified epoxy resins; cyclopentadiene-modified epoxy resins, which are glycidyl ethers of cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified epoxy resins, which are glycidyl ethers of polycyclic aromatic ring-modified phenolic resins; naphthalene-type epoxy resins, which are glycidyl ethers of naphthalene ring-containing phenolic resins; halogenated phenol novolac-type epoxy resins; hydroquinone-type epoxy resins; trimethylolpropane-type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracids such as peracetic acid; and aralkyl-type epoxy resins, which are epoxidized aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins. Furthermore, epoxides of silicone resins and acrylic resins can also be cited as epoxy resins. These epoxy resins may be used individually or in combination of two or more types.

[0050] When using the thermosetting resin composition of this disclosure as a encapsulant, among the epoxy resins mentioned above, epoxy resins selected from the group consisting of biphenyl-type epoxy resins, stilbene-type epoxy resins, diphenylmethane-type epoxy resins, sulfur atom-containing epoxy resins, novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, triphenylmethane-type epoxy resins, copolymer-type epoxy resins, and aralkyl-type epoxy resins are preferred from the viewpoint of balancing reflow resistance and fluidity. These epoxy resins may be used individually or in combination of two or more types.

[0051] Among epoxy resins, biphenyl-type epoxy resins, stilbene-type epoxy resins, diphenylmethane-type epoxy resins, or sulfur atom-containing epoxy resins are more preferred from the viewpoint of fluidity, and dicyclopentadiene-type epoxy resins, triphenylmethane-type epoxy resins, or aralkyl-type epoxy resins are preferred from the viewpoint of heat resistance.

[0052] The functional group equivalent of the thermosetting resin (epoxy equivalent in the case of epoxy resin) is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the functional group equivalent of the thermosetting resin is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.

[0053] The softening point or melting point of the thermosetting resin is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably 40°C to 180°C, and from the viewpoint of ease of handling during the preparation of the thermosetting resin composition, it is more preferably 50°C to 130°C.

[0054] The thermosetting resin content in the thermosetting resin composition of this disclosure is preferably 0.5% to 50% by mass, and more preferably 2% to 30% by mass, from the viewpoint of strength, fluidity, heat resistance, moldability, etc.

[0055] [Various Additives] In addition to the specified silane coupling agent, inorganic filler, and thermosetting resin described above, the thermosetting resin composition of this disclosure may also contain various additives such as curing agents, curing accelerators, coupling agents other than the specified silane coupling agent described above, ion exchangers, mold release agents, flame retardants, colorants, and stress relievers, as exemplified below. The thermosetting resin composition may also contain various additives known in the art, as needed, in addition to the additives exemplified below.

[0056] (Curing agent) The thermosetting resin composition may contain a curing agent. The type of curing agent is not particularly limited and can be selected according to the type of thermosetting resin, the desired properties of the thermosetting resin composition, etc. When the thermosetting resin is an epoxy resin, examples of curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymer captan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, etc. From the viewpoint of balancing curability and pot life, at least one selected from the group consisting of phenol curing agents, amine curing agents, and acid anhydride curing agents is preferred, and from the viewpoint of electrical reliability, phenol curing agents are more preferred.

[0057] Examples of phenol curing agents include phenol resins and polyhydric phenol compounds having two or more phenolic hydroxyl groups in one molecule. Specifically, these include polyhydric phenol compounds such as resorcinol, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; novolac-type phenol resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene with an aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde under an acidic catalyst; and the above phenolic compounds with dimethoxyp-xylene, bis(methoxymethyl)biphenyl, etc. Examples include aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins synthesized from the above; paraxylylene and / or metaxylylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above phenolic compound and dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above phenolic compound and aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerizing two or more of these. These phenolic curing agents may be used individually or in combination of two or more.

[0058] Among phenol curing agents, at least one selected from the group consisting of aralkyl-type phenol resins, dicyclopentadiene-type phenol resins, triphenylmethane-type phenol resins, copolymerized phenol resins of benzaldehyde-type phenol resins and aralkyl-type phenol resins, and novolac-type phenol resins is preferred from the viewpoint of reflow resistance. The phenol curing agent may be used alone or in combination of two or more types.

[0059] Examples of aralkyl-type phenolic resins include phenolic aralkyl resins synthesized from phenolic compounds with dimethoxyp-xylene, bis(methoxymethyl)biphenyl, etc., and naphthol aralkyl resins. Aalkyl-type phenolic resins may be further copolymerized with other phenolic resins. Examples of copolymerized aralkyl-type phenolic resins include copolymerized phenolic resins of benzaldehyde-type phenolic resin and aralkyl-type phenolic resin, copolymerized phenolic resins of salicylaldehyde-type phenolic resin and aralkyl-type phenolic resin, and copolymerized phenolic resins of novolac-type phenolic resin and aralkyl-type phenolic resin.

[0060] The functional group equivalent of the curing agent (hydroxyl group equivalent in the case of a phenol curing agent) is not particularly limited. From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, it is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.

[0061] The softening point or melting point of the curing agent is not particularly limited. From the viewpoint of moldability and reflow resistance, it is preferably 40°C to 180°C, and from the viewpoint of handling during the manufacture of the thermosetting resin composition, it is more preferably 50°C to 130°C.

[0062] The equivalent ratio of the thermosetting resin to the curing agent, i.e., the ratio of the number of functional groups in the curing agent to the number of functional groups in the thermosetting resin (number of functional groups in the curing agent / number of functional groups in the thermosetting resin), is not particularly limited. From the viewpoint of minimizing unreacted components, it is preferably set in the range of 0.5 to 2.0, and more preferably in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is even more preferable to set it in the range of 0.8 to 1.2.

[0063] (Curing accelerator) The thermosetting resin composition may contain a curing accelerator. The type of curing accelerator is not particularly limited and can be selected according to the type of thermosetting resin, the desired properties of the thermosetting resin composition, etc.

[0064] From the viewpoint of curability and fluidity, it is preferable that the curing accelerator contains a phosphonium compound.Specifically, phosphonium compounds include triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkyl-alkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, and trialkyl Compounds having intramolecular polarization obtained by adding a compound having a π bond, such as maleic anhydride, 1,4-benzoquinone, 2,5-tholquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, diazophenylmethane, etc., to a tertiary phosphine such as tholphosphine, dialkylarylphosphine, or alkyldiarylphosphine; or the tertiary phosphine or the phosphate Fin compounds and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodidephenol, 3-iodidephenol, 2-iodidephenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-tert-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol Examples include compounds having intramolecular polarization obtained by reacting halogenated phenol compounds such as 4-bromo-4'-hydroxybiphenyl with other halogenated phenol compounds followed by a dehalogenation step; tetrasubstituted phosphoniums such as tetraphenylphosphonium, tetrasubstituted phosphoniums and tetrasubstituted borates that lack a phenyl group bonded to the boron atom, such as tetra-p-tolylborate; salts of tetrasubstituted phosphonium with anions obtained by removing a proton from a phenol compound, and salts of tetrasubstituted phosphonium with anions obtained by removing a proton from a carboxylic acid compound.

[0065] The thermosetting resin composition may contain curing accelerators other than phosphonium compounds. Other curing accelerators besides phosphonium compounds include, specifically, diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; and quinone compounds such as maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, and phenyl-1,4-benzoquinone. Examples include compounds having intramolecular polarization formed by adding compounds with π bonds, such as diazophenylmethane; cyclic amidinium compounds such as tetraphenylborate salt of DBU, tetraphenylborate salt of DBN, tetraphenylborate salt of 2-ethyl-4-methylimidazole, and tetraphenylborate salt of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the aforementioned tertiary amine compounds; and ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide.

[0066] When a thermosetting resin composition contains a curing accelerator, the amount is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the total of the thermosetting resin and curing agent. When the amount of curing accelerator is 0.1 parts by mass or more per 100 parts by mass of the total of the thermosetting resin and curing agent, the composition tends to cure well in a short time. When the amount of curing accelerator is 30 parts by mass or less per 100 parts by mass of the total of the thermosetting resin and curing agent, the curing speed is not too fast, and a good molded product tends to be obtained.

[0067] (Coupling Agent) The thermosetting resin composition of this disclosure may contain a coupling agent other than the specified silane coupling agent described above. Examples of coupling agents other than the specified silane coupling agent described above include silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, and vinylsilane, as well as known coupling agents such as titanium compounds, aluminum chelate compounds, and aluminum / zirconium compounds.

[0068] (Ion Exchanger) The thermosetting resin composition may contain an ion exchanger. In particular, when the thermosetting resin composition is used as a molding material for sealing, it is preferable to include an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of the electronic component device equipped with the element to be sealed. The ion exchanger is not particularly limited, and conventionally known ones can be used. Specifically, examples include hydrotalcite compounds and hydrated oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. The ion exchanger may be used alone or in combination of two or more. Among these, hydrotalcite represented by the following general formula (A) is preferred.

[0069] Mg （１－Ｘ） Al Ｘ (OH) ２ (CO ３ ) Ｘ／２ mH ２ O ……(A) (0 < X ​​≤ 0.5, m is a positive number)

[0070] If the thermosetting resin composition contains an ion exchanger, there are no particular restrictions on its content as long as it is sufficient to capture ions such as halogen ions. For example, it is preferably 0.1 to 30 parts by mass, and more preferably 1 to 15 parts by mass, per 100 parts by mass of the resin component.

[0071] (Release Agent) The thermosetting resin composition may contain a release agent from the viewpoint of obtaining good release properties from the mold during molding. The release agent is not particularly limited, and conventionally known ones can be used. Specifically, examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. The release agent may be used alone or in combination of two or more types.

[0072] When a thermosetting resin composition contains a release agent, the amount is preferably 0.01 to 15 parts by mass, and more preferably 0.1 to 10 parts by mass, per 100 parts by mass of the resin component. When the amount of release agent is 0.01 parts by mass or more per 100 parts by mass of the resin component, sufficient release properties tend to be obtained. When it is 15 parts by mass or less, better adhesion tends to be obtained.

[0073] (Flame retardant) The thermosetting resin composition may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known ones can be used. Specifically, examples include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms, or phosphorus atoms, metal hydroxides, etc. The flame retardant may be used alone or in combination of two or more types.

[0074] If the thermosetting resin composition contains a flame retardant, the amount is not particularly limited as long as it is sufficient to obtain the desired flame retardant effect. For example, it is preferably 1 to 300 parts by mass, and more preferably 2 to 150 parts by mass, per 100 parts by mass of the resin component.

[0075] (Colorants) The thermosetting resin composition may further contain colorants. Examples of known colorants include carbon black, organic dyes, organic pigments, titanium dioxide, red lead, and red iron oxide. The amount of colorant can be appropriately selected depending on the purpose. One colorant may be used alone, or two or more colorants may be used in combination.

[0076] (Stress Relief Agents) The thermosetting resin composition may contain stress relief agents such as silicone oil and silicone rubber particles. Including stress relief agents can further reduce package warping deformation and package cracking. Examples of stress relief agents include commonly used and known stress relief agents (flexible agents). Specifically, these include thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based; rubber particles such as NR (natural rubber), NBR (acrylonitrile-butadiene rubber), acrylic rubber, urethane rubber, and silicone powder; and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. One type of stress relief agent may be used alone, or two or more types may be used in combination. Among these, silicone-based stress relief agents are preferred. Examples of silicone-based stress relief agents include those having epoxy groups, those having amino groups, and those modified with polyether.

[0077] <Method for preparing thermosetting resin composition> The method for preparing the thermosetting resin composition is not particularly limited. A common method is to thoroughly mix predetermined amounts of components using a mixer or the like, then melt-knead them using a mixing roll, extruder or the like, cool them, and pulverize them. More specifically, for example, a method can be used in which predetermined amounts of the above-mentioned components are uniformly stirred and mixed, then kneaded using a kneader, roll, extruder or the like that has been preheated to 70°C to 140°C, then cooled, and pulverized.

[0078] The thermosetting resin composition is preferably solid at room temperature and atmospheric pressure (for example, 25°C and atmospheric pressure). The shape of the thermosetting resin composition when it is solid is not particularly limited, and examples include powder, granules, and tablets. When the thermosetting resin composition is in tablet form, the dimensions and mass are preferably such that they conform to the molding conditions of the package, from the viewpoint of ease of handling.

[0079] <Sealing Material> The thermosetting resin composition of this disclosure can be used as a sealing material for sealing devices. That is, one embodiment of this disclosure is a sealing material using the thermosetting resin composition described above. The use of the thermosetting resin composition of this disclosure as a sealing material is intended as one application of the thermosetting resin composition of this disclosure, and the use of the thermosetting resin composition of this disclosure is not limited to sealing materials.

[0080] The encapsulant of this disclosure exhibits excellent fluidity, resulting in particularly good adhesion to elements with microstructures. Because of its excellent fluidity, the encapsulant of this disclosure reduces the occurrence of molding defects in both transfer molding and compression molding, thereby improving yield in semiconductor package manufacturing.

[0081] <Electronic Component Device> An electronic component device, which is one embodiment of the present disclosure, comprises an element and a cured product of the encapsulating material of the present disclosure described above. Examples of electronic component devices include those obtained by mounting elements (active elements such as semiconductor chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils) on a support member such as a lead frame, a pre-wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate, and then encapsulating the element portion with a thermosetting resin composition. More specifically, DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outline J-lead package), TSOP (Thin Small Outline Package), TQFP (Thin Quad Flat) have a structure in which elements are fixed on a lead frame, the terminal parts of the elements such as bonding pads and the lead parts are connected by wire bonding, bumps, etc., and then sealed by transfer molding, etc. using a thermosetting resin composition. Examples include general resin-encapsulated ICs such as Packages; TCPs (Tape Carrier Packages) having a structure in which elements connected to a tape carrier with bumps are encapsulated in a thermosetting resin composition; COB (Chip On Board) modules, hybrid ICs, multi-chip modules, etc., having a structure in which elements connected to wiring formed on a support member by wire bonding, flip-chip bonding, solder, etc., are encapsulated in a thermosetting resin composition; and BGAs (Ball Grid Arrays), CSPs (Chip Size Packages), MCPs (Multi Chip Packages), etc., having a structure in which elements are mounted on the surface of a support member having terminals for wiring board connection formed on the back surface, and after connecting the elements to the wiring formed on the support member by bumps or wire bonding, the elements are encapsulated in a thermosetting resin composition. Furthermore, thermosetting resin compositions can also be suitably used in printed circuit boards.

[0082] Methods for encapsulating electronic components using thermosetting resin compositions include low-pressure transfer molding, injection molding, and compression molding. Among these, low-pressure transfer molding is the most common.

[0083] The embodiments of this disclosure will be described in detail below with reference to examples, but the technical scope of this disclosure is not limited to these examples.

[0084] [Preparation of Thermosetting Resin Composition] The materials in the proportions (parts by mass) shown in Table 1 were pre-mixed (dry blended), then kneaded in a twin-screw extruder with the internal temperature adjusted to 70°C to 100°C, cooled, and then pulverized to obtain a thermosetting resin composition.

[0085] (Epoxy resin) Epoxy resin 1: Epoxy equivalent 172, biphenyl type epoxy resin Epoxy resin 2: Epoxy equivalent 192, biphenyl type epoxy resin

[0086] (Hardening agent) Hardening agent 1: Hydroxyl group equivalent 104 g / eq, triphenylmethane type phenolic resin

[0087] (Curing accelerator) Curing accelerator 1: Adduct of tributylphosphine and 1,4-benzoquinone

[0088] (Coupling agents) Coupling agent 1: Specific silane coupling agent (Dynasylan 4148 (manufactured by Evonik, number average molecular weight 687)) Coupling agent 2: N-phenyl-3-aminopropyltrimethoxysilane (molecular weight 255.4) Coupling agent 3: 3-methacryloxypropyltrimethoxysilane (molecular weight 248.4) Coupling agent 4: 3-glycidoxypropyltrimethoxysilane (molecular weight 236.3) Coupling agent 5: Hexadecyltrimethoxysilane (molecular weight 346.6)

[0089] (Wax) Wax 1: Polyethylene Oxide Wax

[0090] (Pigment) Pigment 1: Carbon Black

[0091] (Inorganic fillers) Inorganic filler 1: Spherical alumina (volume average particle size 4.6 μm) Inorganic filler 2: Spherical alumina (volume average particle size 0.3 μm)

[0092]

[0093] In Examples 1 and 2, Comparative Example 1, and Comparative Examples 3 and 4, the number of methoxysilyl groups relative to the specific surface area of ​​the inorganic filler of coupling agent 2 was kept the same. Note that coupling agents 1 to 5 all contain one trimethoxysilyl group per molecule. The number of methoxysilyl groups relative to the specific surface area of ​​the inorganic filler of coupling agent 1 in Example 1, coupling agent 3 in Comparative Example 1, coupling agent 4 in Comparative Example 3, and coupling agent 5 in Comparative Example 4 was kept the same. The number of methoxysilyl groups relative to the specific surface area of ​​the inorganic filler of coupling agent 1 in Example 2 was 47% of the number of methoxysilyl groups relative to the specific surface area of ​​the inorganic filler of coupling agent 1 in Example 1. The number of methoxysilyl groups relative to the specific surface area of ​​the inorganic filler of coupling agent 2 in Comparative Example 2 was the same as the sum of the number of methoxysilyl groups relative to the specific surface area of ​​the inorganic fillers of coupling agent 1 and coupling agent 2 in Example 1.

[0094] The number of methoxysilyl groups of the coupling agent relative to the specific surface area of ​​the inorganic filler was determined based on the minimum coverage area of ​​the coupling agent. The minimum coverage area of ​​the coupling agent was calculated using the following formula: Formula: Minimum coverage area (m²) ２ ( / g) = 6.02 × 10 ２３ ×13×10 －２０ / Molecular weight of coupling agent

[0095] The minimum coating area of ​​coupling agent 1 is 114 m². ２ The amount was ( / g). The molecular weight of coupling agent 1 was measured by gel permeation chromatography and was a number-average molecular weight of 687.

[0096] [Evaluation of Thermosetting Resin Compositions] The gel time and spiral flow of the thermosetting resin compositions prepared in Examples 1 to 2 and Comparative Examples 1 to 4 were evaluated.

[0097] (1) Gel time: The gel time (seconds) was determined by measuring the time it took for the resin to lose its viscosity when 0.5 g of the thermosetting resin composition was placed on a hot plate preheated to 175°C.

[0098] (2) Spiral flow Using a spiral flow measurement mold in accordance with EMMI-1-66, a thermosetting resin composition was molded in a transfer molding machine under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 150 seconds, and the flow distance (cm) was determined.

[0099] [Evaluation Results of Thermosetting Resin Compositions] For Example 1, Example 2, and Comparative Examples 1 to 4, the measurement results for (1) gel time and (2) spiral flow are shown in Table 2.

[0100]

[0101] As shown in Table 2, the thermosetting resin compositions of Examples 1 and 2, which contain coupling agent 1, showed better spiral flow results and superior fluidity compared to the thermosetting resin composition of the comparative example. This indicates that using a silane coupling agent represented by general formula (1) results in a thermosetting resin composition with excellent fluidity.

[0102] The disclosure of Japanese Patent Application No. 2025-013421, filed on 29 January 2025, is incorporated herein by reference in its entirety. Furthermore, all documents, patent applications, and technical standards described herein are incorporated by reference to the same extent as if each individual document, patent application, and technical standard were specifically and individually noted to be incorporated by reference.

Claims

1. A thermosetting resin composition comprising a thermosetting resin, a silane coupling agent containing a silane compound in which an organic functional group having a polyoxyethylene skeleton is bonded to silicon via a hydrocarbon group having 1 to 10 carbon atoms, and an inorganic filler.

2. The thermosetting resin composition according to claim 1, wherein the silane compound is represented by the following general formula (1). [In general formula (1), R １ Each of the following independently represents an alkyl group having 1 to 5 carbon atoms, X represents a hydrocarbon group having 1 to 10 carbon atoms, Y independently represents a hydrolyzable group, Z is an organic functional group having a polyoxyethylene skeleton, and m represents an integer from 1 to 3.

3. The thermosetting resin composition according to claim 2, wherein Y in the general formula (1) is independently an alkoxy group.

4. The thermosetting resin composition according to claim 2, wherein Y in the general formula (1) is independently a methoxy group or an ethoxy group.

5. The thermosetting resin composition according to claim 2, wherein m is 3 in the general formula (1).

6. The thermosetting resin composition according to claim 1, wherein the polyoxyethylene skeleton has linear oxyethylene groups or branched oxyethylene groups.

7. A sealing material comprising the thermosetting resin composition according to any one of claims 1 to 6.

8. An electronic component device comprising an element and a cured product of the sealing material according to claim 7 for sealing the element.

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