Antenna module and communication device including same

Abstract

This antenna module may comprise: a non-conductive substrate having at least one rack hole for electroplating; at least one conductive pattern formed through the electroplating; and a plurality of radiation structures disposed on the non-conductive substrate. The at least one conductive pattern may comprise: a conductive line portion for providing signals in a frequency band to each of the plurality of radiation structures on one surface of the non-conductive substrate; and a conductive stub portion branching from one point of the conductive line portion on the one surface of the non-conductive substrate and formed from the one point to a rack hole among the at least one rack hole. The rack hole may be connected to the ground. The conductive stub portion connected to the ground through the rack hole may be used to form an open state for the conductive line portion in at least a portion of the frequency band.

Description

Antenna module and communication device including the same

[0001] The present disclosure relates to an antenna module and a communication device including said antenna module.

[0002] Beamforming technology is utilized as one of the techniques to mitigate propagation path loss and increase the transmission distance of radio waves. Generally, beamforming uses multiple antennas to concentrate the reach area of ​​radio waves or to increase the directivity of reception sensitivity in a specific direction. To operate beamforming technology, a communication device may be equipped with multiple antennas.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to embodiments of the present disclosure, an antenna module is provided. The antenna module may include a non-conductive substrate having at least one rack hole for electroplating; at least one conductive pattern formed by the electroplating on one side of the non-conductive substrate; and a plurality of radiating structures disposed on the non-conductive substrate. The at least one conductive pattern may include a conductive line portion for providing signals of a frequency band to each of the plurality of radiating structures on the one side of the non-conductive substrate, and a conductive stub portion formed on the one side of the non-conductive substrate, branching from a point of the conductive line portion and extending from the point to the rack hole among the at least one rack hole. The rack hole may be connected to ground. The conductive stub portion connected to ground through the rack hole may be used to form an open state for the conductive line portion in at least a portion of the frequency band.

[0005] According to embodiments of the present disclosure, a communication device for performing communication with a terminal is provided. The communication device may include a processor; a radio frequency (RF) processing circuit; a filter circuit; and a plurality of antenna modules. Each of the plurality of antenna modules may include a non-conductive substrate having at least one rack hole for electroplating; at least one conductive pattern formed through the electroplating on one side of the non-conductive substrate; and a plurality of radiating structures disposed on the non-conductive substrate. The at least one conductive pattern may include a conductive line portion for providing signals of a frequency band to each of the plurality of radiating structures on the one side of the non-conductive substrate, and a conductive stub portion formed on the one side of the non-conductive substrate, branching from a point of the conductive line portion and extending from the point to one of the at least one rack hole. The rack hole may be connected to ground. The conductive stub portion connected to the ground through the above-mentioned rack hole can be used to form an open state for the conductive line portion in at least a portion of the frequency band.

[0006] Figure 1 shows a wireless communication system.

[0007] Figure 2 shows examples of components of a communication device.

[0008] Figure 3 shows an example of an array antenna of a communication device.

[0009] Figure 4 shows an example of a non-conductive substrate having a rack hole placed within a transmission line.

[0010] Figure 5 is a diagram illustrating the principles of a transmission line and a stub.

[0011] Figure 6 shows an example of an antenna module comprising a non-conductive substrate having a rack hole connected to a stub.

[0012] Figure 7 shows an example of an antenna module comprising a non-conductive substrate having a rack hole connected to a stub.

[0013] Figures 8a, 8b, and 8c show examples of impedance characteristics of conductive patterns.

[0014] FIGS. 9A and FIGS. 9B show examples of antenna modules comprising a non-conductive substrate having a rack hole connected to stubs.

[0015] Figure 10 shows examples of impedance characteristics of a conductive pattern.

[0016] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0017] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0018] Terms referring to device components used in the following description (e.g., insulating plate, substrate, non-conductive substrate, PCB (print circuit board), FPCB (flexible PCB), module, antenna, antenna element, antenna element, conductive pattern, conductive line, conductive part, stub part, circuit, amplifier circuit, processor, chip, component, device), terms referring to the shape of a component (e.g., opening, structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), terms referring to a circuit (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, conductive pattern, conductive part, conductive stub part, transmission line, stub, amplifier circuit, RF path, RF module, RF circuit, splitter, divider, coupler), Terms such as "combiner" are provided as examples for the convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Furthermore, terms such as "...part," "...device," "...body," etc. used below may refer to at least one shape structure or a unit that processes a function.

[0019] Additionally, in this disclosure, expressions of "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions of "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of elements from A (including A) to B (including B). Below, "C" and / or "D" refers to including at least one of "C" or "D," i.e., {'C', 'D', 'C' and 'D'}.

[0020] This disclosure describes various embodiments using terms used in some communication standards (e.g., 3GPP (3rd Generation Partnership Project), ETSI (European Telecommunications Standards Institute), xRAN (extensible radio access network), O-RAN (open-radio access network), but these are merely illustrative examples. Various embodiments of this disclosure can be easily modified and applied to other communication systems.

[0021] FIG. 1 illustrates a wireless communication system. The wireless communication environment of FIG. 1 exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), a third terminal (120-3)) as a part of the nodes using a wireless channel.

[0022] Referring to FIG. 1, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance over which it can transmit signals. In addition to being a base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5G node (5th generation node)', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', MMU (Massive MIMO (multiple input multiple output) Unit)), 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU)', remote radio head (RRH), communication device, or other terms having an equivalent technical meaning. The base station (110) can transmit downlink signals or receive uplink signals.

[0023] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without user involvement. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as 'user equipment (UE)', 'mobile station', 'subscriber station', 'customer premises equipment (CPE)', 'remote terminal', 'wireless terminal', 'electronic device', or 'vehicle terminal', 'user device', or other terms having an equivalent technical meaning.

[0024] Beamforming technology is utilized as one of the techniques to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally uses multiple antennas to concentrate the reach area of ​​radio waves or to increase the directivity of reception sensitivity in a specific direction. Therefore, to form beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, a base station (110) may be equipped with multiple antennas. A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or an antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0025] A key technology for enhancing the data capacity of 5G communication is beamforming technology using an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased, or the power per RF path must be increased. However, increasing the number of RF paths leads to larger product sizes, and due to spatial constraints in installing actual base station equipment, it is currently impossible to increase them further. To increase antenna gain through high output without increasing the number of RF paths, antenna gain can be increased by connecting multiple antenna elements using dividers (or splitters) in the RF paths. Here, the antenna elements corresponding to the RF paths may be referred to as sub-arrays. As a non-limiting example, sub-array technology may be utilized to increase the signal radiation gain. An antenna array may include multiple sub-arrays. The antennas of the antenna array may be divided into the multiple sub-arrays. The signal may be radiated through each of the antennas of the sub-arrays.

[0026] In FIG. 1, the base station (110) of FIG. 1 is described as an example to explain a communication device including an antenna, but the embodiments of the present disclosure are not limited thereto. As a communication device according to the embodiments of the present disclosure, in addition to the base station (110), wireless equipment performing a function equivalent to that of a base station, wireless equipment connected to a base station (e.g., TRP), the terminal (120) of FIG. 1, or any other communication equipment used for 5G communication are all possible. Hereinafter, as a structure of multiple antennas for communication in a MIMO (Multiple Input Multiple Output) environment, the present disclosure describes an antenna array composed of sub-arrays as an example, but is not limited to examples where easy modifications for beamforming are possible.

[0027] FIG. 2 illustrates examples of components of a communication device. The communication device may be a base station (110) of FIG. 1 or a component of the base station (110). Meanwhile, unlike what is illustrated, the present disclosure does not exclude the possibility that the communication device may be implemented in a terminal (120).

[0028] Referring to FIG. 2, an exemplary functional configuration of a communication device (210) is illustrated. The communication device (210) may include an antenna section (211), a filter section (212), an RF (radio frequency) processing section (213), and a processor (214).

[0029] The antenna section (211) may include a plurality of antennas. The antennas may perform functions for transmitting and receiving signals over a wireless channel. The antennas may include a radiator made of a conductor (e.g., metal structure) or a conductive pattern formed on a substrate (e.g., PCB, non-conductive substrate (e.g., plastic substrate)). The antennas may radiate upconverted signals over a wireless channel or acquire signals radiated by another device. Each antenna may be referred to by an antenna element, antenna component, antenna radiator, radiating part, radiator, and / or equivalent technical terms. The antenna section (211) may include an antenna array in which a plurality of antenna elements form an array. The antenna section (211) may be electrically connected to the filter section (212) via RF signal lines. For example, a plurality of antenna elements of the antenna section (211) may be coupled to a board (e.g., PCB). The antenna elements may be disposed on one side of the board, or a module on which the antenna elements are disposed (e.g., a module including a non-conductive substrate and a radiating structure disposed on the non-conductive substrate) may be disposed. The board may include RF signal lines connecting each antenna element and the RF filters of the filter section (212). The RF signal lines may be referred to as a feeding network. The board may be referred to as a wireless unit board, a wireless unit board, an antenna board, an antenna board, a radiating board, a radiating board, an RF board, an RF board, and / or an equivalent technical term.

[0030] The filter unit (212) can perform filtering to transmit a signal of a desired frequency. The filter unit (212) may include a plurality of RF filters. The RF filters can perform the function of selectively passing a frequency by forming resonance. The filter unit (212) may include at least one of a band-pass filter, a low-pass filter, a high-pass filter, or a band-reject filter. The filter unit (212) may include RF circuits for obtaining a signal in a frequency band for transmission or a frequency band for reception. Each RF filter of the filter unit (212) may be electrically connected to the antennas of the antenna unit (211) and the RF processing circuit of the RF processing unit (213).

[0031] The RF processing unit (213) may include a plurality of RF processing circuits. An RF processing circuit may be a unit for processing a signal received through an antenna or a signal radiated through an antenna. An RF processing circuit may include a plurality of paths corresponding to the antennas. At least one RF processing circuit may be referred to as an RF chain. An RF chain may include a plurality of RF elements. The RF elements may include an amplifier, a mixer, an oscillator, a DAC, an ADC, etc. For example, the RF processing unit (213) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal into an analog RF transmission signal. The up converter and the DAC form part of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Additionally, for example, the RF processing unit (213) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts the digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of the reception path. The reception path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (213) may be implemented on a PCB. The communication device (210) may include a stacked structure in the order of an antenna unit (211), a filter unit (212), and an RF processing unit (213). The antennas and the RF components of the RF processing unit (213) may be implemented on a PCB, and filters may be repeatedly connected between the PCBs to form multiple layers.For example, the RF processing unit (213) may include a communication chip (e.g., RFIC).

[0032] The processor (214) can control the overall operations of the communication device (210). The processor (214) may be referred to as a control unit, a controller, or a control unit. The processor (214) may include various modules for performing communication. The processor (214) may include at least one processor, such as a modem. The processor (214) may include modules for digital signal processing. For example, the processor (214) may include a modem. When transmitting data, the processor (214) generates complex symbols by encoding and modulating the transmitted bit sequence. Also, for example, when receiving data, the processor (214) restores the received bit sequence by demodulating and decoding the baseband signal. The processor (214) may perform the functions of a protocol stack required by the communication standard.

[0033] In FIG. 2, functional components of a communication device (210) are described as a communication device comprising a plurality of antennas. However, the example shown in FIG. 2 is merely an exemplary configuration for a conductive pattern for supplying a signal to the antenna elements of an array antenna described later, and the embodiments of the present disclosure are not limited to the descriptions of the components of the communication device shown in FIG. 2. For example, even if some of the components of the communication device are omitted or the connection relationships of the components are different, any device (e.g., communication device, communication module) that includes a conductive pattern through electroplating can be understood as an embodiment of the present disclosure.

[0034] The present disclosure relates to an antenna module (antenna module 0) in a wireless communication system and a communication device including said antenna module. Specifically, an antenna module according to embodiments of the present disclosure may include a non-conductive board and a conductive pattern formed on said non-conductive board through electroplating. Through the principles of transmission lines and stubs, the influence of impedance caused by rack holes required in said electroplating may be reduced. For example, as the impedance of the stub portion containing the rack hole approaches infinity, transmission line characteristics for broadband may be provided.

[0035] FIG. 3 shows an example of an array antenna of a communication device (e.g., communication device (210)).

[0036] Referring to FIG. 3, the communication device (210) may include an array antenna (310). The array antenna (310) may include a plurality of antennas. For the antennas, the description of the antenna section (211) in FIG. 2 may be referenced. Each of the plurality of antennas may be referred to as an antenna element. Each of the plurality of antennas may include a radiating structure. According to one embodiment, the radiating structure may include a non-conductive support portion (e.g., formed of a dielectric or plastic and protruding from a substrate) and a metal pattern coupled to the non-conductive structure. The metal pattern may be configured to radiate signals obtained from a feed line extending along one side (e.g., a side) of the non-conductive support portion. According to another embodiment, the radiating structure may include a metal structure. The metal structure connected to the feed line may be configured to radiate signals. The communication device (210) may include a non-conductive substrate (320) for arranging the plurality of antennas. The non-conductive substrate (320) may be referred to as a wireless unit substrate, wireless unit board, antenna substrate, antenna board, radiation substrate, radiation board, RF board, RF substrate, and / or equivalent technical terms.

[0037] A key technology for improving data capacity is beamforming technology using an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased or the power per RF path must be increased. Increasing the number of RF paths results in a larger product size, and due to spatial constraints in installing actual base station equipment, it is currently impossible to increase them further. To increase antenna gain through high output without increasing the number of RF paths, antenna gain can be increased by connecting multiple antenna elements using a splitter (or divider) in the RF path. The unit of multiple antenna elements connected to the RF path may be referred to as a sub-array. According to one embodiment, the multiple antennas of FIG. 3 may be divided into multiple sub-arrays. A communication device (210) may include multiple sub-arrays. The multiple sub-arrays may include antenna elements. One or more subarrays may be placed on a non-conductive substrate (320) (e.g., may be referred to as a subarray substrate, insulating plate, insulating plate, subarray plate, radiating substrate, radiating plate, and / or an equivalent technical term). For example, an array antenna (310) may include 16 subarrays. Each subarray may include four antenna elements. The array antenna (310) may include a first subarray and a second subarray placed on the non-conductive substrate (320). The first subarray, as a 1x4 array, may include a first antenna element (331), a second antenna element (332), a third antenna element (333), and a fourth antenna element (334). The second sub-array above may include a first antenna element (341), a second antenna element (342), a third antenna element (343), and a fourth antenna element (344) as a 1x4 array.

[0038] A non-conductive substrate (320) may be combined with radiating structures corresponding to antenna elements. The radiating structures may be disposed on one side of the non-conductive substrate (320). At least one conductive pattern may be formed on the non-conductive substrate (320) to transmit RF signals to each of the radiating structures. The at least one conductive pattern may be referred to as an RF path for transmitting RF signals provided from a filter unit (212), an RF processing unit (213), and / or a processor (214).

[0039] According to one embodiment, the communication device (210) may support dual polarization. Each sub-array may be connected to an RF path for a first polarization and an RF path for a second RF polarization. The first polarization and the second polarization may be perpendicular to each other. For example, the first polarization may correspond to vertical polarization and the second polarization may correspond to horizontal polarization. For another example, the first polarization may correspond to (+)45 degree polarization and the second polarization may correspond to (-)45 degree polarization. Signals for the first polarization may be provided to each of the antenna elements of each sub-array through the RF path for the first polarization. Signals for the second polarization may be provided to each of the antenna elements of each sub-array through the RF path for the second polarization. Conductive patterns may be formed on a non-conductive substrate (320) as RF paths for dual polarization (e.g., RF path for first polarization, RF path for second polarization). For example, a first conductive pattern (351) and a second conductive pattern (352) for the first sub-array may be formed on one side of the non-conductive substrate (320). The first conductive pattern (351) may be configured to provide RF signals for the first polarization to each of the antenna elements (e.g., first antenna element (331), second antenna element (332), third antenna element (333), and fourth antenna element (334)) in a first direction. The second conductive pattern (352) may be configured to provide RF signals in a second direction to each of the antenna elements (e.g., first antenna element (331), second antenna element (332), third antenna element (333), and fourth antenna element (334)) for second polarization. For example, a third conductive pattern (353) and a fourth conductive pattern (354) for the second sub-array may be formed on one side of the non-conductive substrate (320).The third conductive pattern (353) may be configured to provide RF signals in a first direction to each of the antenna elements (e.g., first antenna element (341), second antenna element (342), third antenna element (343), and fourth antenna element (344)) for first polarization. As an example, the third conductive pattern (353) may be connected to a filter section (212), an RF processing section (213), and / or a processor (214) through a feed point (393a) of a non-conductive substrate (320). The feed point (393b) may be electrically connected to an RF component (e.g., an RF filter and / or processor (214)) through a conductive via or a plated through hole (PTH). The fourth conductive pattern (354) may be configured to provide RF signals in a second direction to each of the antenna elements (e.g., first antenna element (341), second antenna element (342), third antenna element (343), and fourth antenna element (344)) for second polarization. As an example, the fourth conductive pattern (354) may be connected to a filter unit (212), an RF processing unit (213), and / or a processor (214) through a feed point (393b) of a non-conductive substrate (320). The feed point (393b) may be electrically connected to an RF component (e.g., an RF filter and / or processor (214)) through a conductive via or a plated through-hole.

[0040] According to one embodiment, the non-conductive substrate (320) may be formed of a dielectric (e.g., plastic). As the number of antennas increases, the complexity of RF components for processing RF signals may increase. To achieve the trend of lightweighting and low cost with increasing antenna elements, a substrate formed of a dielectric (e.g., plastic) may be used as a substrate for mounting antenna modules. An electroplating process may be used to form a conductive pattern for transmitting RF signals on one side of the non-conductive substrate (320). In the above process, rack holes may be utilized to stably supply current to a component (e.g., a non-conductive substrate (320)). For example, in an electroplating process, a plating material corresponding to metal ions may be deposited on the surface of the component through the current. The rack holes may serve as electrical contacts, and are used not only to supply current but also to discharge the plating material from inside the component without pooling. For example, for a first sub-array, the non-conductive substrate (320) may have a plurality of rack holes (e.g., rack hole (363a), rack hole (363b), rack hole (364a), and / or rack hole (364b)). For example, for a second sub-array, the non-conductive substrate (320) may have a plurality of rack holes (e.g., rack hole (371a), rack hole (371b), rack hole (372a), rack hole (372b), rack It may have a hole (374a), and / or a rack hole (374b).

[0041] Figure 4 shows an example of a non-conductive substrate having a rack hole placed within a transmission line.

[0042] Referring to FIG. 4, a non-conductive substrate (420) for an array antenna may include a rack hole (444). For example, the non-conductive substrate (420) may be used for the placement of antenna elements of an antenna module of a communication device (210). For the non-conductive substrate (420), the description of the non-conductive substrate (320) of FIG. 3 may be referenced. A plurality of antenna elements may be placed on one side of the non-conductive substrate (420). For example, an antenna element (431) may be placed on the non-conductive substrate (420). A conductive pattern (451) may be formed on one side of the non-conductive substrate (420) to transmit a signal to at least some of the plurality of antenna elements (e.g., antenna element (431)) or to obtain a signal from at least some of the plurality of antenna elements (e.g., antenna element (431)).

[0043] The conductive pattern (451) may include a conductive line portion for transmitting a signal to each antenna element. The conductive line portion may correspond to a transmission line for signals in a frequency band to be radiated through the plurality of antenna elements. The transmission line may include a rack hole (444) for electroplating. As the rack hole (444) is formed within the transmission line of the conductive pattern (451), the width of the transmission line may vary. The width of one portion (499) containing the rack hole (444) may be greater than the width of another portion of the transmission line. Such a variation in width may cause impedance mismatch. More specifically, the frequency characteristics of the signals radiated through the antenna elements may have a resonance frequency of the signals (or may be referred to as a center frequency, carrier frequency, or transmission frequency) and a bandwidth corresponding to a certain range from the resonance frequency. For example, the above bandwidth may be defined as a frequency range that includes a resonant frequency and has a transmission coefficient (S21) greater than or equal to a certain reference value. As a rock hole (444) is located within the transmission line of the conductive pattern (451), the impedance may fluctuate sensitively with respect to frequency. In other words, as a rock hole (444) is located within the transmission line of the conductive pattern (451), impedance mismatch may easily occur. Since impedance mismatch occurs easily as the frequency changes, broadband design may be difficult.

[0044] In this disclosure, a technique is described to reduce the effect of impedance mismatch caused by a rock hole (444) being located within the transmission line of a conductive pattern (451). The rock hole is positioned outside the transmission line of the conductive pattern and can be connected to a stub for said transmission line. Hereinafter, with reference to FIG. 5, the principle of the transmission line and the stub is described in terms of the circuit.

[0045] Figure 5 is a diagram illustrating the principles of a transmission line and a stub.

[0046] Referring to FIG. 5, signals can be transmitted from a first port (501) to a second port (502). The path between the first port (501) and the second port (502) can be understood as a transmission line (551). One point (599) of the transmission line (551) can be connected to a ground point (566) through a stub (555). The ground point (566) can be connected to ground (590). The transmission line (551) can be divided into a first part (551a) and a second part (551b) based on one point (599). The stub (555) can be connected in parallel to the transmission line (551). In transmission line theory, when the stub (555) is connected to a load, the input impedance viewed from the transmission line (551) toward the stub (555) can be expressed by the following mathematical formula.

[0047]

[0048] Z in represents the input impedance. l represents the length of the stub (555). Z L represents the impedance of the load connected to the end of the stub (555). β represents the phase constant (=2π / λ) (λ is the wavelength of the frequency of the transmitted signal).

[0049] If l has a length of approximately λ / 4, It can have an infinite value. If the impedance of the load connected to the end of the stub (555) is 0, the input impedance can have a value of 0. As the input impedance becomes 0, the stub (555) can be seen as an open circuit with respect to the transmission line (551). That is, the stub (555) can operate in an open state.

[0050] To form the above open state, the rack hole according to embodiments of the present disclosure may be connected to ground. The rack hole may be connected through a stub to a portion (hereinafter referred to as the conductive line portion) that functions as a transmission line used to transmit a signal among the conductive patterns. According to one embodiment, the stub may have a length of about λ / 4. Hereinafter, examples of a non-conductive substrate having a rack hole connected to ground and a stub are described with reference to FIGS. 6 and 7.

[0051] FIG. 6 illustrates an example of an antenna module comprising a non-conductive substrate (e.g., non-conductive substrate (320)) having a rack hole connected to a stub (e.g., stub (555)). The antenna module may be referred to by technical terms other than antenna module, such as communication module, antenna unit, antenna filter module, antenna filter unit, access module, wireless module, wireless communication module, radio frequency communication module, wireless unit, wireless unit module, and / or equivalent terms. The antenna module may be included in the base station (110) of FIG. 1 and / or the communication device (210) of FIG. 2. According to one embodiment, the antenna module comprises a non-conductive substrate (320) having a rock hole (e.g., rock hole (363a), rock hole (363b), rock hole (364a), rock hole (364b), rock hole (371a), rock hole (371b), rock hole (372a), rock hole (372b), rock hole (374a), and / or rock hole (374b)), at least one conductive pattern formed on the non-conductive substrate (320) (e.g., a first conductive pattern (351), a second conductive pattern (352), a third conductive pattern (353), and / or a fourth conductive pattern (354)), and a plurality of radiating structures disposed on one surface of the non-conductive substrate (320) and connected to the at least one conductive pattern (e.g., a first antenna element (331), a second antenna element (332), a third antenna of a first sub-array). It may include an element (333), and / or a fourth antenna element (334), a first antenna element (341), a second antenna element (342), a third antenna element (343), and / or a fourth antenna element (344) of the second sub-array.

[0052] Referring to FIG. 6, the non-conductive substrate (320) may include a rock hole (364a). The rock hole (364a) may be used for electroplating the first conductive pattern (351) on the non-conductive substrate (320). In one embodiment, the first conductive pattern (351) may include a conductive line portion (610) for transmitting a signal to antenna elements (e.g., first antenna element (331), second antenna element (332), third antenna element (333), and / or fourth antenna element (334)) of a sub-array (e.g., the first sub-array of FIG. 3) and a conductive stub portion (620) for connecting to a rock hole located outside the conductive line portion.

[0053] The conductive line portion (610) may correspond to a transmission line (e.g., transmission line (551) of FIG. 5) for transmitting a signal to an antenna element (e.g., fourth antenna element (334)). The conductive stub portion (620) may correspond to a stub (e.g., stub (555) of FIG. 5) for the transmission line. According to one embodiment, the conductive stub portion (620) may be connected to a rock hole (364a). When looking at one side of the non-conductive substrate (320), one end of the rock hole (364a) may be connected to the conductive stub portion (620), and the other end of the rock hole (364a) may not be connected to the conductive pattern. In terms of the connection relationship with the conductive pattern, the rock hole (364a) and the rock hole (444) may be distinguished.

[0054] According to one embodiment, the rock hole (364a) may be connected to ground. For example, the rock hole (364a) may be connected to an electrical material that provides ground. For example, the rock hole (364a) may be connected to the ground layer of a filter board on which an RF filter is placed. For example, the rock hole (364a) may be connected to the ground of a board connected to a non-conductive substrate (320). In an example that is not limited to cases where an RF filter and antenna elements are combined on a single board, the rock hole (364a) may be connected to the ground of the RF filter. In terms of the connection relationship with ground, the rock hole (364a) and a hole (hereinafter referred to as a feed hole) located at a feed point (e.g., feed point (393a), feed point (393b)) may be distinguished.

[0055] According to one embodiment, the length of the conductive stub portion (620) may correspond to about 1 / 4 of the wavelength (λ) of the signals to be radiated through the antenna elements. For example, the length of the conductive stub portion (620) may fall within a range of 0.9 A or more and less than 1.1 A, where 1 / 4 of the wavelength (λ) of the signals is denoted as A. For example, the length of the conductive stub portion (620) may fall within a range of 0.95 A or more and less than 1.05 A, where 1 / 4 of the wavelength (λ) of the signals is denoted as A. For example, the length of the conductive stub portion (620) may fall within a range of 0.8 A or more and less than 1.2 A, where 1 / 4 of the wavelength (λ) of the signals is denoted as A. As described in [Equation 1], the end of the conductive stub portion (620) is connected to ground through the rack hole (364a), and as the length of the conductive stub portion (620) corresponds to approximately λ / 4, the impedance viewed from the conductive line portion (610) toward the conductive stub portion (620) can approach infinity. Due to the impedance approaching infinity, the conductive stub portion (620) and the rack hole (364a) can be understood as an open circuit. In other words, the conductive stub portion (620) can function as an open state with respect to the conductive line portion (610) at the frequency of signals having wavelength λ.

[0056] FIG. 7 shows an example of an antenna module comprising a non-conductive substrate (e.g., non-conductive substrate (320)) having a rack hole connected to a stub (e.g., stub (555)). In FIG. 7, the first sub-array of FIG. 3 is described as an example.

[0057] Referring to FIG. 7, the antenna module (700) may include a non-conductive substrate (320), conductive patterns (e.g., a first conductive pattern (351) and a second conductive pattern (352)) disposed on one side of the non-conductive substrate (320), and a plurality of antenna elements (e.g., a first antenna element (331), a second antenna element (332), a third antenna element (333), and a fourth antenna element (334)) disposed on one side of the non-conductive substrate (320). For example, the first conductive pattern (351) may be configured to provide signals from a first feed point (781a) to each of the plurality of antenna elements for first polarization. The first feed point (781a) may indicate a location where signals from an RF filter (e.g., the RF filter of the filter section (212)), an RF processing circuit (e.g., the RF processing section (213)), and / or a processor (214) are fed to the first conductive pattern (351). The first feed point (781a) may be connected to the first conductive pattern (351) through a conductive via or a plating through hole (PTH) (e.g., a hole formed to penetrate the board on which the RF filter is placed and / or the non-conductive substrate (320)). For example, the second conductive pattern (352) may be configured to provide signals from the first feed point (781a) to each of the plurality of antenna elements for second polarization. The second feed point (781b) may indicate an RF filter (e.g., the RF filter of the filter section (212)), an RF processing circuit (e.g., the RF processing section (213)), and / or Signals from the processor (214) may indicate a location where they are fed to the second conductive pattern (352). The second feeding point (781b) may be connected to the second conductive pattern (352) through a conductive via or a plating through hole (PTH) (e.g., a hole formed to penetrate the board and / or non-conductive substrate (320) on which the RF filter is placed).

[0058] A conductive pattern formed on a non-conductive substrate (320) may include a conductive line portion (e.g., conductive line portion (610)) for supplying a signal to an antenna element and a conductive stub portion (e.g., conductive stub portion (620)) for forming a hook hole and a stub. According to one embodiment, the antenna module (700) may include a sub-array. The conductive pattern may function as a divider. For example, the first conductive pattern (351) may include a divider for the antenna elements of a 1x4 sub-array (e.g., first antenna element (331), second antenna element (332), third antenna element (333), and fourth antenna element (334)). The second conductive pattern (352) may include dividers for antenna elements of a 1x4 sub-array (e.g., first antenna element (331), second antenna element (332), third antenna element (333), and fourth antenna element (334)). The conductive line portion may include a main line portion connected to a feed point and branch line portions branched from the main line portion and connected to individual antenna elements. For example, the conductive line portion of the first conductive pattern (351) may include a first main line portion (751), a first branch line portion (711a) for the first antenna element (331), a second branch line portion (712a) for the second antenna element (332), a third branch line portion (713a) for the third antenna element (333), and a fourth branch line portion (714) for the fourth antenna element (334).For example, the conductive line portion of the second conductive pattern (352) may include a second main line portion (752), a first branch line portion (711b) for the first antenna element (331), a second branch line portion (712b) for the second antenna element (332), a third branch line portion (713b) for the third antenna element (333), and a fourth branch line portion (714b) for the fourth antenna element (334).

[0059] A non-conductive substrate (320) according to embodiments of the present disclosure may have rak holes connected to a conductive line portion through conductive stub portions. The conductive stub portions and the conductive line portions may be formed by electroplating. A plurality of rak holes may be used for the electroplating. For example, the non-conductive substrate (320) may include a rak hole (361a), a rak hole (362a), a rak hole (363a), a rak hole (364a), a rak hole (361b), a rak hole (362b), a rak hole (363b), and / or a rak hole (364b). At least some of the plurality of rak holes may be connected to a main line portion and / or a branch line portion of the conductive line portion through a conductive stub portion. The above-mentioned rack hole can be connected to a conductive stub portion connected to a point of the main line portion and / or branch line portion of the conductive line portion and can be connected to ground.

[0060] According to one embodiment, the rock hole may be connected to the branch line portion of the conductive line portion through a conductive stub portion. The first conductive pattern (351) may include a plurality of conductive stub portions. The plurality of conductive stub portions may include a first conductive stub portion (721a), a second conductive stub portion (722a), a third conductive stub portion (723a), and / or a fourth conductive stub portion (724a). For example, the first rock hole (361a) may be connected to the first conductive stub portion (721a) connected to a point (791a) of the first branch line portion (711a) of the first conductive pattern (351). The first rock hole (361a) connected to the first conductive stub portion (721a) may be connected to ground. The length of the first conductive stub portion (721a) may correspond to 1 / 4 of the wavelength (λ) of at least some of the signals transmitted through the first branch line portion (711a). The radiated signals may have a frequency range specified according to the communication method. The first conductive stub portion (721a), connected to ground through the first rack hole (361a), may function as an open state at at least some of the frequencies within the specified frequency range with respect to the first branch line portion (711a) for the first antenna element (331). The impedance viewed from a point (791a) of the first branch line portion (711a) toward the first conductive stub portion (721a) may be close to infinity or infinity. A point (791a) may be referred to as a branch point for the first conductive stub portion (721a). For example, the second rock hole (362a) can be connected to a second conductive stub portion (722a) connected to a point (792a) of the second branch line portion (712a) of the first conductive pattern (351). The second rock hole (362a) connected to the second conductive stub portion (722a) can be connected to ground.The length of the second conductive stub portion (722a) may correspond to 1 / 4 of the wavelength (λ) of at least some of the signals transmitted through the second branch line portion (712a). The second conductive stub portion (722a), connected to ground through the second rock hole (362a), may function as an open state at at least some of the frequencies of the signals with respect to the second branch line portion (712a) for the second antenna element (332). One point (792a) may be referred to as a branch point for the second conductive stub portion (722a). For example, the third rock hole (363a) may be connected to the third conductive stub portion (723a), which is connected to one point (793a) of the third branch line portion (713a) of the first conductive pattern (351). The third rock hole (363a) connected to the third conductive stub portion (723a) can be connected to ground. The length of the third conductive stub portion (723a) can correspond to 1 / 4 of the wavelength (λ) of at least some of the signals transmitted through the third branch line portion (713a). The third conductive stub portion (723a) connected to ground through the third rock hole (361a) can function as an open state at at least some of the frequencies of the signals with respect to the third branch line portion (713a) for the third antenna element (333). One point (793a) can be referred to as a branch point for the third conductive stub portion (723a). For example, the fourth rock hole (364a) can be connected to a fourth conductive stub portion (724a) connected to a point (794a) of the fourth branch line portion (714a) of the first conductive pattern (351). The fourth rock hole (364a) connected to the fourth conductive stub portion (724a) can be connected to ground. The length of the fourth conductive stub portion (724a) can correspond to 1 / 4 of the wavelength (λ) of at least some of the signals transmitted through the fourth branch line portion (714a).The fourth conductive stub portion (724a), connected to ground through the fourth rack hole (364a), can function as an open state at least some of the frequencies of the signals with respect to the fourth branch line portion (714a) for the fourth antenna element (334). One point (794a) may be referred to as a branch point for the fourth conductive stub portion (724a).

[0061] According to one embodiment, the antenna module (700) may support dual polarization. Each of the antenna elements (radiating structures) of the antenna module (700) may be connected to two conductive patterns. The rak holes of the non-conductive substrate (320) may be connected to the conductive line portion of the second conductive pattern (352) via a stub. The second conductive pattern (352) may include a plurality of conductive stub portions. The plurality of conductive stub portions may include a first conductive stub portion (721b), a second conductive stub portion (722b), a third conductive stub portion (723b), and / or a fourth conductive stub portion (724b). For example, the fifth rock hole (361b) may be connected to a first conductive stub portion (721b) connected to a point (791b) of the first branch line portion (711b) of the second conductive pattern (352). The fifth rock hole (361b) connected to the first conductive stub portion (721b) may be connected to ground. The length of the first conductive stub portion (721b) may correspond to 1 / 4 of the wavelength (λ) of at least some of the signals transmitted through the first branch line portion (711b). The radiated signals may have a frequency range specified according to the communication method. The first conductive stub portion (721b) connected to ground through the fifth rock hole (361b) may function as an open state at at least some of the frequencies within the specified frequency range with respect to the first branch line portion (711b) for the first antenna element (331). The impedance viewed from a point (791b) of the first branch line portion (711b) toward the first conductive stub portion (721b) may be close to infinity or infinity. The point (791b) may be referred to as a branch point for the first conductive stub portion (721b). For example, the sixth rack hole (362b) may be connected to the second conductive stub portion (722b) which is connected to a point (792b) of the second branch line portion (712b) of the second conductive pattern (352).The sixth rock hole (362b) connected to the second conductive stub portion (722b) can be connected to ground. The length of the second conductive stub portion (722b) may correspond to 1 / 4 of the wavelength (λ) of at least some of the signals transmitted through the second branch line portion (712b). The second conductive stub portion (722b) connected to ground through the sixth rock hole (362b) may function as an open state at at least some of the frequencies of the signals with respect to the second branch line portion (712b) for the second antenna element (332). One point (792b) may be referred to as a branch point for the second conductive stub portion (722b). For example, the seventh rock hole (363b) may be connected to a third conductive stub portion (723b) connected to a point (793b) of the third branch line portion (713b) of the second conductive pattern (352). The seventh rock hole (363b) connected to the third conductive stub portion (723b) may be connected to ground. The length of the third conductive stub portion (723b) may correspond to 1 / 4 of the wavelength (λ) of at least some of the signals transmitted through the third branch line portion (713b). The third conductive stub portion (723b) connected to ground through the seventh rock hole (361b) may function as an open state at at least some of the frequencies of the signals with respect to the third branch line portion (713b) for the third antenna element (333). One point (793b) may be referred to as a branch point for the third conductive stub portion (723b). For example, the eighth hook hole (364b) may be connected to the fourth conductive stub portion (724b) which is connected to one point (794b) of the fourth branch line portion (714b) of the second conductive pattern (352). The eighth hook hole (364b) connected to the fourth conductive stub portion (724b) may be connected to ground.The length of the fourth conductive stub portion (724b) may correspond to 1 / 4 of the wavelength (λ) of at least some of the signals transmitted through the fourth branch line portion (714b). The fourth conductive stub portion (724b), connected to ground through the fourth rack hole (364b), may function as an open state at at least some of the frequencies of the signals with respect to the fourth branch line portion (714b) for the fourth antenna element (334). One point (794b) may be referred to as a branch point for the fourth conductive stub portion (724b).

[0062] The conductive stub portion connected to the rack hole may have various shapes. It branches off at one point of the conductive line portion functioning as a transmission line, and the length of the conductive stub portion between said point and the rack hole may be approximately λ / 4 (λ is the wavelength of the signal on said transmission line). For the length of said conductive stub portion, the conductive stub portion may have various shapes. For example, the conductive stub portion may have a straight shape. For example, the conductive stub portion may have an 'L' shape. For example, the conductive stub portion may have a 'Z' shape. According to one embodiment, in an antenna module supporting dual polarization, the conductive patterns may be formed symmetrically. For example, the first conductive pattern (351) and the second conductive pattern (352) may be arranged symmetrically with respect to the direction in which the antenna elements are arranged (e.g., the x-axis). The shape of the conductive stub portion of the first conductive pattern (351) may be symmetrical to the shape of the conductive stub portion of the second conductive pattern (352). For example, the shape of the first conductive stub portion (721a) of the first conductive pattern (351) may be symmetrical to the shape of the first conductive stub portion (721b) of the second conductive pattern (352). For example, the shape of the third conductive stub portion (723a) of the first conductive pattern (351) may be symmetrical to the shape of the third conductive stub portion (723b) of the second conductive pattern (352).

[0063] In FIG. 7, an example is described in which a rock hole is connected to a point of a branch line section through a stub, but embodiments of the present disclosure are not limited thereto. An antenna module having a rock hole connected to a stub line branching from a point of a main line section (e.g., first main line section (751), second main line section (752)) connected to a feed point (e.g., first feed point (791a), second feed point (791b)) may also be understood as an embodiment of the present disclosure.

[0064] Although not illustrated in FIG. 7, as a non-limiting example, at least two of the multiple rock holes may be connected to the same ground. For example, rock holes of the conductive pattern of the same sub-array may be connected to the same ground. For example, at least two of rock holes (361a), rock hole (362a), rock hole (363a), and / or rock hole (364a) may be connected to the same ground (e.g., same ground layer, same electrical material). At least two of rock holes (361b), rock hole (362b), rock hole (363b), and / or rock hole (364b) may be connected to the same ground (e.g., same ground layer, same electrical material). For example, rock holes connected to branch line portions for the same antenna element may be connected to the same ground. For example, the rack hole (361a) and the rack hole (361b) may be connected to the same ground (e.g., same ground layer, same electrical material). For example, the rack hole (362a) and the rack hole (362b) may be connected to the same ground (e.g., same ground layer, same electrical material).

[0065] Figures 8a, 8b, and 8c show examples of impedance characteristics of conductive patterns.

[0066] Referring to FIG. 8a, graph (800a) represents the pass factor of a transmission line that is not connected to a stub and does not contain a rock hole inside. Smith chart (805a) represents the impedance of a load for said transmission line. The horizontal axis of graph (800a) represents frequency (unit: GHz), and the vertical axis represents the pass factor (unit: dB(decibel)). Referring to graph (800a), it can be confirmed that the variation in the pass factor is negligible (e.g., within 0.05 dB) due to a change in frequency (e.g., a change of 0.6 GHz). Since the Smith chart (805a) does not have a separate load (or stub) connected to the transmission line, the impedance can represent the characteristic impedance.

[0067] Referring to FIG. 8b, the graph (800b) represents the pass factor of a transmission line containing a rak hole. The Smith chart (805b) represents the impedance of the load for said transmission line. The horizontal axis of the graph (800b) represents frequency (unit: GHz), and the vertical axis represents the pass factor (unit: dB). Referring to the graph (800b), it can be seen that the variation in the pass factor is significant (e.g., 1.1 dB or more) due to a change in frequency (e.g., a change of 1 GHz). Since the transmission line contains a rak hole, the Smith chart (805b) may represent a complex impedance containing an imaginary part. Referring to the Smith chart (805b), it can be seen that said transmission line has an inductive impedance with a variety of ranges.

[0068] Referring to FIG. 8c, graph (800c) represents the pass factor of a transmission line connected through a ground-connected rock hole and a conductive stub portion. Smith chart (805c) represents the impedance of the load for the transmission line. The horizontal axis of graph (800c) represents frequency (unit: GHz), and the vertical axis represents the pass factor (unit: dB). Referring to graph (800c), it can be confirmed that the variation in the pass factor is negligible (e.g., within 0.05 dB) due to a change in frequency (e.g., a change of 0.6 GHz). Since the transmission line is connected to a ground-connected rock hole through a stub having a size of 1 / 4 of the wavelength, the stub can be referred to as an open circuit in terms of the transmission line. Referring to Smith chart (805c), it can be confirmed that the impedance of the transmission line is within a certain range of the characteristic impedance.

[0069] When radiating signals through an antenna, a frequency range having a reflection coefficient below a certain value or a frequency range having a transmission coefficient above a certain value may correspond to a bandwidth. To have a wider bandwidth, it may be required that the impedance does not change sensitively with frequency. In other words, to support broadband communication, it is required that the change in impedance be within an allowable error range even if the frequency changes within the above bandwidth range. Referring to FIG. 8b and FIG. 8c, in at least part of the frequency band of the signals, the pass factor may be increased as the rack hole is connected to the transmission line (e.g., conductive line portion (610)) through the ground and stub (e.g., conductive stub portion (620)). That is, in at least part of the frequency band of the signals, as the rock hole is connected to the transmission line (e.g., conductive line part (610)) through the ground and stub (e.g., conductive stub part (620)), the impedance effect caused by the rock hole can be reduced. As the impedance of the transmission line approaches the characteristic impedance, the communicable frequency range can be widened.

[0070] FIGS. 9a and 9b show examples of antenna modules (e.g., antenna modules (700)) comprising a non-conductive substrate (e.g., non-conductive substrate (320)) having a rack hole connected to stubs.

[0071] Referring to FIG. 9a, in example (901), the first transmission line (951) can be connected through the first rock hole (961) and the first stub (971). The second transmission line (952) can be connected through the second rock hole (962) and the second stub (972). The first rock hole (961) can be connected to ground. The second rock hole (962) can be connected to ground. In example (902), the first transmission line (951) can be connected through the rock hole (969) and the first stub (971). The second transmission line (952) can be connected through the rock hole (969) and the second stub (972). The rack hole (969) may be referred to as a shared rack hole or a redundant rack hole in that it is connected to transmission lines through multiple stubs. For space efficiency within the non-conductive substrate (320) and / or efficiency of the electroplating process, the shared rack hole (969) may be utilized. The shared rack hole (969) may be connected to ground.

[0072] According to one embodiment, the antenna module (700) may include a shared rack hole (969) as illustrated in example (902). For example, the shared rack hole (969) may be connected to stub portions connected to different conductive patterns (e.g., a stub portion connected to the first conductive pattern (351) and a stub portion connected to the second conductive pattern (352). For another example, the shared rack hole (969) may be connected to stub portions connected to different branch line portions (e.g., a stub portion connected to the first branch line portion (711a) of the first conductive pattern (351) and a stub portion connected to the second branch line portion (712a). As another example, the shared rack hole (969) can be connected to a stub portion connected to a main line portion (e.g., the first main line portion (751) of the first conductive pattern (351)) and a stub portion connected to a branch line portion (e.g., the third branch line portion (713a)).

[0073] Referring to FIG. 9b, the antenna module (700) may include a second antenna element (332). The second branch line portion (712a) of the first conductive pattern (351) may correspond to the first transmission line (951) of FIG. 9a. The second conductive stub portion (722a) branching from a point (792a) of the second branch line portion (712a) may correspond to the first stub (971) of FIG. 9a. The second branch line portion (712b) of the second conductive pattern (352) may correspond to the second transmission line (952) of FIG. 9a. The second conductive stub portion (722b) branching from a point (792b) of the second branch line portion (712b) may correspond to the second stub (972) of FIG. 9a. According to one embodiment, the non-conductive substrate (320) may have a shared lark hole (969). The shared lark hole (969) may be connected to the second conductive stub portion (722a) of the first conductive pattern (351) and the second conductive stub portion (722b) of the second conductive pattern (352). Although not shown in FIG. 9b, the shared lark hole (969) may be connected to ground.

[0074] FIG. 10 shows examples of impedance characteristics of a conductive pattern (e.g., including a first conductive pattern (351) and / or a second conductive pattern (352)) including a shared rak hole (e.g., a shared rak hole (969)).

[0075] Referring to FIG. 10, graph (1000a) represents the pass factor of at least one of two transmission lines (e.g., first transmission line (951), second transmission line (951)) connected through a shared rack hole connected to ground and conductive stub portions. Smith chart (1005a) represents the impedance of the load for the transmission line. The horizontal axis of graph (1000a) represents frequency (unit: GHz), and the vertical axis represents the pass factor (unit: dB). Referring to graph (1000a), it can be confirmed that the variation in the pass factor due to a change in frequency (e.g., a change of 0.6 GHz) is negligible (e.g., within 0.05 dB). Since each of the two transmission lines (e.g., first transmission line (951), second transmission line (951)) is connected through a stub (e.g., first stub (971), second stub (972)) having a size of 1 / 4 of the wavelength and a rock hole (e.g., shared rock hole (969)) connected to ground, the stub can be referred to as an open circuit in terms of individual transmission lines. Referring to the Smith chart (1005a), it can be confirmed that the impedance of the transmission lines is within a certain range of characteristic impedance.

[0076] A communication device according to embodiments of the present disclosure may include a stub formed between a feed line and a rock hole to reduce the effect of a rock hole when forming a conductive pattern by electroplating on a non-conductive substrate (e.g., non-conductive substrate (320)) formed by injection molding (e.g., plastic injection). The stub may function as an open circuit for the feed line functioning as a transmission line, as it is designed to have a length of about λ / 4 (λ is the wavelength of the signal). To provide an impedance close to infinity at a frequency in a target frequency range, the rock hole may be connected to ground. As electroplating is performed to form a stub having a length of about λ / 4, a conductive pattern may be formed that provides a robust pass factor in a certain frequency range. Broadband communication may be enabled due to the conductive pattern.

[0077] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0078] According to embodiments of the present disclosure, an antenna module (700) is provided. The antenna module (700) may include a non-conductive substrate (320) having at least one rack hole for electroplating; at least one conductive pattern (351; 352) formed through electroplating on one side of the non-conductive substrate (320); and a plurality of radiating structures disposed on the non-conductive substrate (320). The at least one conductive pattern (351; 352) may include a conductive line portion for providing signals of a frequency band to each of the plurality of radiating structures on one surface of the non-conductive substrate (320), and a conductive stub portion formed on one surface of the non-conductive substrate (320), branching from one point of the conductive line portion and extending from said point to a rak hole among the at least one rak hole (361a; 362a; 363a; 364a; 361b; 362b; 363b; 364b; 371a; 372a; 374a; 371b; 372b; 374b). The rak hole may be connected to ground. The conductive stub portion connected to the ground through the above-mentioned rack hole can be used to form an open state for the conductive line portion in at least a portion of the frequency band.

[0079] For example, the length of the conductive stub portion between the point of the conductive line portion and the rack hole can substantially correspond to one-fourth of the wavelength of the signals in the frequency band.

[0080] For example, the conductive line portion may include a main line portion connected to a feed point for supplying the signals on one surface of the non-conductive substrate (320), and a plurality of branch line portions connected to the main line portion. The plurality of branch lines may be connected to each of the feed portions of the plurality of radiation structures. The one point of the conductive line portion may be located in the main line portion or one of the plurality of branch line portions.

[0081] For example, the plurality of radiation structures may include a first radiation structure, a second radiation structure, a third radiation structure, and a fourth radiation structure. The plurality of branch line portions may include a first branch line portion connected to a feed portion of the first radiation structure, a second branch line portion connected to a feed portion of the second radiation structure, a third branch line portion connected to a feed portion of the third radiation structure, and a fourth branch line portion connected to a feed portion of the fourth radiation structure. The above at least one rock hole (361a; 362a; 363a; 364a; 361b; 362b; 363b; 364b; 371a; 372a; 374a; 371b; 372b; 374b) may include a first rock hole formed at the end of a first conductive stub line branching from a point in the first branch line portion, a second rock hole formed at the end of a second conductive stub line branching from a point in the second branch line portion, a third rock hole formed at the end of a third conductive stub line branching from a point in the third branch line portion, and a fourth rock hole formed at the end of a fourth conductive stub line branching from a point in the fourth branch line portion.

[0082] For example, the at least one conductive pattern (351; 352) may include a first conductive pattern (351; 352) for first signals having a first polarization and a second conductive pattern (351; 352) for second signals having a second polarization on one surface of the non-conductive substrate (320). The first conductive pattern (351; 352) may include a conductive line portion and a conductive stub portion. The second conductive pattern (351; 352) may include a second conductive line portion for providing second signals having the second polarization to each of the plurality of radiating structures and a second conductive stub portion branching from a point of the second conductive line portion.

[0083] For example, the second conductive stub portion may be formed between the point of the second conductive line portion and another second rock hole among the at least one rock hole (361a; 362a; 363a; 364a; 361b; 362b; 363b; 364b; 371a; 372a; 374a; 371b; 372b; 374b). The length of the second conductive stub portion between the point of the second conductive line portion and the second rock hole may correspond to one-fourth of the wavelength of the signals in the frequency band.

[0084] For example, the second conductive stub portion may be formed between the one point of the second conductive line portion and the rock hole. The length of the second conductive stub portion between the one point of the second conductive line portion and the rock hole may correspond to one-fourth of the wavelength of the signals in the frequency band.

[0085] For example, each of the conductive stub portion and the second conductive stub portion may include an 'L' shape. The conductive stub portion and the second conductive stub portion may be arranged symmetrically with respect to the direction in which the plurality of radiating structures are arranged.

[0086] For example, the plurality of radiation structures may be disposed on one surface of the non-conductive substrate (320) on which the at least one conductive pattern (351; 352) is formed.

[0087] For example, the conductive line portion may be connected to a feed point connected via a conductive via or a plating through hole. The conductive stub portion and the rak hole may be formed in an area different from the area where the conductive line portion is formed on the one surface of the non-conductive substrate (320). A first end of the rak hole is connected to the conductive stub portion, and a second end of the rak hole opposite to the first end may not be connected to the conductive stub portion and may be adjacent to an area of ​​the non-conductive substrate (320).

[0088] According to embodiments of the present disclosure, a communication device for performing communication with a terminal is provided. The communication device may include a processor; an RF (radio frequency) processing circuit; a filter circuit; and a plurality of antenna modules (700). Each of the plurality of antenna modules (700) may include a non-conductive substrate (320) having at least one rack hole for electroplating; at least one conductive pattern (351; 352) formed through electroplating on one side of the non-conductive substrate (320); and a plurality of radiating structures disposed on the non-conductive substrate (320). The at least one conductive pattern (351; 352) may include a conductive line portion for providing signals of a frequency band to each of the plurality of radiating structures on one surface of the non-conductive substrate (320), and a conductive stub portion formed on one surface of the non-conductive substrate (320), branching from one point of the conductive line portion and extending from said point to a rak hole among the at least one rak hole (361a; 362a; 363a; 364a; 361b; 362b; 363b; 364b; 371a; 372a; 374a; 371b; 372b; 374b). The rak hole may be connected to ground. The conductive stub portion connected to the ground through the above-mentioned rack hole can be used to form an open state for the conductive line portion in at least a portion of the frequency band.

[0089] For example, the length of the conductive stub portion between the point of the conductive line portion and the rack hole can substantially correspond to one-fourth of the wavelength of the signals in the frequency band.

[0090] For example, the conductive line portion may include a main line portion connected to a feed point for supplying the signals on one surface of the non-conductive substrate (320), and a plurality of branch line portions connected to the main line portion. The plurality of branch lines may be connected to each of the feed portions of the plurality of radiation structures. The one point of the conductive line portion may be located in the main line portion or one of the plurality of branch line portions.

[0091] For example, the plurality of radiation structures may include a first radiation structure, a second radiation structure, a third radiation structure, and a fourth radiation structure. The plurality of branch line portions may include a first branch line portion connected to a feed portion of the first radiation structure, a second branch line portion connected to a feed portion of the second radiation structure, a third branch line portion connected to a feed portion of the third radiation structure, and a fourth branch line portion connected to a feed portion of the fourth radiation structure. The above at least one rock hole (361a; 362a; 363a; 364a; 361b; 362b; 363b; 364b; 371a; 372a; 374a; 371b; 372b; 374b) may include a first rock hole formed at the end of a first conductive stub line branching from a point in the first branch line portion, a second rock hole formed at the end of a second conductive stub line branching from a point in the second branch line portion, a third rock hole formed at the end of a third conductive stub line branching from a point in the third branch line portion, and a fourth rock hole formed at the end of a fourth conductive stub line branching from a point in the fourth branch line portion.

[0092] For example, the at least one conductive pattern (351; 352) may include a first conductive pattern (351; 352) for first signals having a first polarization and a second conductive pattern (351; 352) for second signals having a second polarization on one surface of the non-conductive substrate (320). The first conductive pattern (351; 352) may include a conductive line portion and a conductive stub portion. The second conductive pattern (351; 352) may include a second conductive line portion for providing second signals having the second polarization to each of the plurality of radiating structures and a second conductive stub portion branching from a point of the second conductive line portion.

[0093] For example, the second conductive stub portion may be formed between the point of the second conductive line portion and another second rock hole among the at least one rock hole (361a; 362a; 363a; 364a; 361b; 362b; 363b; 364b; 371a; 372a; 374a; 371b; 372b; 374b). The length of the second conductive stub portion between the point of the second conductive line portion and the second rock hole may correspond to one-fourth of the wavelength of the signals in the frequency band.

[0094] For example, the second conductive stub portion may be formed between the one point of the second conductive line portion and the rock hole. The length of the second conductive stub portion between the one point of the second conductive line portion and the rock hole may correspond to one-fourth of the wavelength of the signals in the frequency band.

[0095] For example, each of the conductive stub portion and the second conductive stub portion may include an 'L' shape. The conductive stub portion and the second conductive stub portion may be arranged symmetrically with respect to the direction in which the plurality of radiating structures are arranged.

[0096] For example, the plurality of radiation structures may be disposed on one surface of the non-conductive substrate (320) on which the at least one conductive pattern (351; 352) is formed.

[0097] For example, the conductive line portion may be connected to a feed point connected via a conductive via or a plating through hole. The conductive stub portion and the rak hole may be formed in an area different from the area where the conductive line portion is formed on the one surface of the non-conductive substrate (320). A first end of the rak hole is connected to the conductive stub portion, and a second end of the rak hole opposite to the first end may not be connected to the conductive stub portion and may be adjacent to an area of ​​the non-conductive substrate (320).

[0098] For one or more embodiments, at least one of the components described in one or more of the prior art drawings may be configured to perform one or more operations, techniques, processes and / or methods as described in the present disclosure. For example, a processor (e.g., a baseband processor) described in the present disclosure in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described in the present disclosure. As another example, circuits associated with user equipment (UE), a base station, a network element, etc., as described above in relation to one or more of the prior art drawings may be configured to operate according to one or more examples described herein.

[0099] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless otherwise explicitly stated. The foregoing description of one or more embodiments is for illustrative and explanatory purposes only, and is not intended to limit or exhaust the scope of the embodiments in the exact form disclosed. Modifications and variations are possible in light of the foregoing teachings or may be obtained from the practice of various embodiments.

[0100] Methods according to the claims or embodiments described in the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0101] When implemented in software, a computer-readable storage medium (e.g., a non-transient computer-readable storage medium) storing one or more programs (software modules) may be provided. One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0102] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0103] Additionally, the program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WAN (wide area network), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0104] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0105] According to the embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Generally or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components in the same or similar manner as those performed by the corresponding component among the plurality of components prior to the integration. According to the embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0106] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure.

Claims

1. Regarding the antenna module, A non-conductive substrate having at least one rack hole for electroplating; At least one conductive pattern formed through the electroplating on one side of the above-mentioned non-conductive substrate; and It includes a plurality of radiation structures disposed on the above-mentioned non-conductive substrate, and The above at least one conductive pattern is: A conductive line portion for providing signals of a frequency band to each of the plurality of radiating structures on the one surface of the above-mentioned non-conductive substrate, and On one surface of the above-mentioned non-conductive substrate, a conductive stub portion is formed branching from one point of the conductive line portion and extending from the one point to one of the at least one lark hole. The above-mentioned Lark Hole is connected to the ground, and The conductive stub portion connected to the ground through the above-mentioned hook hole is used to form an open state for the conductive line portion in at least a portion of the frequency band, Antenna module.

2. In Claim 1, The length of the conductive stub portion between the aforementioned point of the conductive line portion and the aforementioned rack hole substantially corresponds to one-quarter of the wavelength of the signals in the frequency band, Antenna module.

3. In Claim 1, The conductive line portion comprises a main line portion connected to a feed point for supplying the signals on one surface of the non-conductive substrate, and a plurality of branch line portions connected to the main line portion. The above plurality of branch lines are connected to each of the feed portions of the above plurality of radiation structures, and The above-mentioned point of the conductive line portion is located in one of the main line portion or the plurality of branch line portions, Antenna module.

4. In Claim 3, The above plurality of radiation structures include a first radiation structure, a second radiation structure, a third radiation structure, and a fourth radiation structure, and The plurality of branch line portions include a first branch line portion connected to a feed portion of the first radiation structure, a second branch line portion connected to a feed portion of the second radiation structure, a third branch line portion connected to a feed portion of the third radiation structure, and a fourth branch line portion connected to a feed portion of the fourth radiation structure. The at least one rock hole comprises: a first rock hole formed at the end of a first conductive stub line branching from a point of the first branch line portion; a second rock hole formed at the end of a second conductive stub line branching from a point of the second branch line portion; a third rock hole formed at the end of a third conductive stub line branching from a point of the third branch line portion; and a fourth rock hole formed at the end of a fourth conductive stub line branching from a point of the fourth branch line portion. Antenna module.

5. In Claim 1, The above at least one conductive pattern comprises, on one surface of the above non-conductive substrate, a first conductive pattern for first signals having a first polarization and a second conductive pattern for second signals having a second polarization, and The first conductive pattern includes the conductive line portion and the conductive stub portion, and The second conductive pattern comprises a second conductive line portion for providing second signals having the second polarization to each of the plurality of radiation structures, and a second conductive stub portion branching from a point of the second conductive line portion. Antenna module.

6. In Claim 5, The second conductive stub portion is formed between the first point of the second conductive line portion and the other second rock hole among the at least one rock hole, and The length of the second conductive stub portion between the point of the second conductive line portion and the second rack hole corresponds to one-fourth of the wavelength of the signals in the frequency band, and The above-mentioned second rack hole is connected to the ground, Antenna module.

7. In Claim 5, The second conductive stub portion is formed between the one point of the second conductive line portion and the rack hole, and The length of the second conductive stub portion between the point of the second conductive line portion and the rack hole corresponds to one-quarter of the wavelength of the signals in the frequency band, Antenna module.

8. In Claim 5, Each of the above conductive stub portion and the above second conductive stub portion includes an 'L' shape, and The conductive stub portion and the second conductive stub portion are symmetrically arranged with respect to the direction in which the plurality of radiating structures are arranged. Antenna module.

9. In Claim 1, The plurality of radiation structures are disposed on one surface of the non-conductive substrate on which the at least one conductive pattern is formed. Antenna module.

10. In Claim 1, The above conductive line portion is connected to a feed point connected through a conductive via or a plated through-hole, and The conductive stub portion and the rock hole are formed in a region different from the region where the conductive line portion is formed on the one surface of the non-conductive substrate, and The first end of the above-mentioned rack hole is connected to the conductive stub portion, and the second end of the above-mentioned rack hole opposite to the first end is not connected to the conductive stub portion and is adjacent to a region of the above-mentioned non-conductive substrate, Antenna module.

11. In a communication device for performing communication with a terminal, processor; RF (radio frequency) processing circuit; Filter circuit; and It includes multiple antenna modules, Each of the above plurality of antenna modules is: A non-conductive substrate having at least one rack hole for electroplating; At least one conductive pattern formed through the electroplating on one side of the above-mentioned non-conductive substrate; and It includes a plurality of radiation structures disposed on the above-mentioned non-conductive substrate, and The above at least one conductive pattern is: A conductive line portion for providing signals of a frequency band to each of the plurality of radiating structures on the one surface of the above-mentioned non-conductive substrate, and On one surface of the above-mentioned non-conductive substrate, a conductive stub portion is formed branching from one point of the conductive line portion and extending from the one point to one of the at least one lark hole. The above-mentioned Lark Hole is connected to the ground, and The conductive stub portion connected to the ground through the above-mentioned hook hole is used to form an open state for the conductive line portion in at least a portion of the frequency band, Communication device.

12. In Claim 11, The length of the conductive stub portion between the aforementioned point of the conductive line portion and the aforementioned rack hole substantially corresponds to one-quarter of the wavelength of the signals in the frequency band, Communication device.

13. In Claim 11, The conductive line portion comprises a main line portion connected to a feed point for supplying the signals on one surface of the non-conductive substrate, and a plurality of branch line portions connected to the main line portion. The above plurality of branch lines are connected to each of the feed portions of the above plurality of radiation structures, and The above-mentioned point of the conductive line portion is located in one of the main line portion or the plurality of branch line portions, Communication device.

14. In Claim 13, The above plurality of radiation structures include a first radiation structure, a second radiation structure, a third radiation structure, and a fourth radiation structure, and The plurality of branch line portions include a first branch line portion connected to a feed portion of the first radiation structure, a second branch line portion connected to a feed portion of the second radiation structure, a third branch line portion connected to a feed portion of the third radiation structure, and a fourth branch line portion connected to a feed portion of the fourth radiation structure. The at least one rock hole comprises: a first rock hole formed at the end of a first conductive stub line branching from a point of the first branch line portion; a second rock hole formed at the end of a second conductive stub line branching from a point of the second branch line portion; a third rock hole formed at the end of a third conductive stub line branching from a point of the third branch line portion; and a fourth rock hole formed at the end of a fourth conductive stub line branching from a point of the fourth branch line portion. Communication device.

15. In Claim 11, The above at least one conductive pattern comprises, on one surface of the above non-conductive substrate, a first conductive pattern for first signals having a first polarization and a second conductive pattern for second signals having a second polarization, and The first conductive pattern includes the conductive line portion and the conductive stub portion, and The second conductive pattern comprises a second conductive line portion for providing second signals having the second polarization to each of the plurality of radiation structures, and a second conductive stub portion branching from a point of the second conductive line portion. Communication device.

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