Camera module and electronic device comprising camera module

Abstract

A camera module according to an embodiment of the present disclosure may comprise a lens assembly including at least one lens aligned along an optical axis. The camera module may comprise a camera housing in which the lens assembly is accommodated. The camera module may comprise an image sensor including a pad part and a pixel array for sensing light acquired through the lens. The camera module may comprise a substrate on which the image sensor is disposed. The camera module may comprise a filter holder disposed on the substrate, the filter holder including a first opening corresponding to the pixel array of the image sensor and a second opening corresponding to the pad part of the image sensor and a part of the substrate. The camera module may comprise an adhesive member disposed in the second opening of the filter holder and adhered to the filter holder, the image sensor, and the substrate. The camera module may comprise an IR filter disposed in the filter holder so as to cover the first opening. Various other embodiments are possible.

Description

Camera module and electronic device including the camera module

[0001] The various embodiments disclosed in this document relate to a camera module and an electronic device including a camera module.

[0002] Various electronic devices such as smartphones, tablet PCs, portable multimedia players (PMPs), personal digital assistants (PDAs), laptop personal computers, wristwatches, and wearable devices like head-mounted displays (HMDs) include cameras and can take images using the cameras.

[0003] As the number of users taking photos or videos using electronic devices increases, the performance of cameras included in these devices is also improving. For example, when capturing images using a camera included in an electronic device, it may be necessary to adjust the focus of the subject or correct for shaking (e.g., hand shake) that may occur during shooting in order to obtain a sharp image.

[0004] A camera module used in an electronic device may include an autofocus (AF) function that automatically adjusts the lens focus on a subject and / or an optical image stabilizer (OIS) function that corrects shake occurring in the camera module when shooting a subject. The AF function and the optical image stabilizer function of the camera module may be driven based on electromagnetic force using magnets and coils.

[0005] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0006] The camera module may include an IR (Infrared) filter that selectively absorbs or reflects wavelengths of light entering the image sensor. The IR filter may be an optical filter that blocks or selectively passes infrared wavelengths. By using the IR filter to allow only wavelengths in the visible light band to pass through the image sensor while blocking wavelengths in the infrared band, the camera module can prevent color distortion of the image acquired through the image sensor and improve image clarity.

[0007] The camera module may include a separate filter holder that supports an IR filter. The filter holder may be positioned adjacent to the image sensor and the substrate on which the image sensor is placed. However, impact transmitted to the image sensor and the substrate may be transmitted directly to the filter holder, potentially damaging the filter holder.

[0008] Additionally, the filter holder may be positioned at a certain distance so as not to overlap with wiring (e.g., wires) and / or electrical components connecting the image sensor and the substrate. In this case, the spacing between the filter holder and the wiring and / or between the filter holder and the electrical components may limit the reduction of the size and / or thickness of the camera module.

[0009] Additionally, the substrate on which the image sensor is placed may be formed to be thin to reduce the size and / or thickness of the camera module. In particular, the portion of the substrate where the image sensor is placed may be formed to be thinner than the portion where the image sensor is not placed. In such cases, the image sensor and / or the substrate may be damaged based on external impact transmitted to the image sensor and the substrate. Damage to the image sensor and / or the substrate may cause damage to the filter holder.

[0010] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0011] According to one embodiment of the present disclosure, a camera module may include a lens assembly comprising at least one lens aligned along an optical axis. The camera module may include a camera housing that accommodates the lens assembly. The camera module may include an image sensor comprising a pixel array and a pad portion for detecting light acquired through the lens. The camera module may include a substrate on which the image sensor is placed. The camera module may include a filter holder placed on the substrate, comprising a first opening corresponding to the pixel array of the image sensor and a second opening corresponding to the pad portion of the image sensor and a portion of the substrate. The camera module may include an adhesive member placed in the second opening of the filter holder and bonded to the filter holder, the image sensor, and the substrate. The camera module may include an IR filter placed in the filter holder and covering the first opening.

[0012] According to one embodiment of the present disclosure, a camera module may include a lens assembly comprising at least one lens aligned along an optical axis. The camera module may include a camera housing that accommodates the lens assembly. The camera module may include an image sensor that detects light acquired through the lens. The camera module may include a substrate that includes an opening into which a portion of the image sensor is accommodated. The camera module may include a filter holder disposed on the substrate that accommodates the image sensor and includes an opening corresponding to the image sensor. The camera module may include an IR filter disposed on the filter holder that covers the opening of the filter holder. The camera module may include a first reinforcing member disposed on the substrate and surrounding the filter holder. The camera module may include a second reinforcing member disposed on the lower part of the substrate and supporting the image sensor.

[0013] According to one embodiment disclosed in this document, a filter holder on which an IR filter is placed may be placed on a substrate and an image sensor. The filter holder, the substrate, and the image sensor may be secured through an adhesive member (e.g., epoxy). Thus, the filter holder, the substrate, and the image sensor may be formed as a single rigid body, thereby increasing rigidity against external impact.

[0014] Additionally, the filter holder may include an opening for accommodating wiring and / or electrical components connecting the substrate and the image sensor. The filter holder may not overlap with the wiring and / or electrical components when placed on the substrate and the image sensor. Accordingly, the camera module may have its size and / or thickness reduced as the vertical gap between the wiring and / or electrical components and the filter holder is reduced.

[0015] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0016] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0017] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0018] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 2b is a perspective view of the rear side of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0020] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0021] FIG. 4 is a block diagram illustrating a camera module according to various embodiments.

[0022] FIG. 5 is a perspective view of a camera module according to one embodiment of the present disclosure.

[0023] FIG. 6a is an assembly diagram of a camera module according to one embodiment of the present disclosure.

[0024] FIG. 6b is an assembly diagram of a camera housing, a carrier, a magnet, and a coil according to one embodiment of the present disclosure.

[0025] Figure 7 is a perspective view of the filter holder of Figure 6a.

[0026] FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 5 according to one embodiment.

[0027] FIG. 9 is a plan view in which an image sensor and a filter holder supporting an IR filter are arranged on a substrate according to one embodiment of the present disclosure.

[0028] FIG. 10 is a plan view in which a reinforcing member is disposed on a substrate in an area adjacent to the edge of an image sensor according to one embodiment of the present disclosure.

[0029] FIG. 11a is a perspective view in which a reinforcing member surrounding an image sensor is disposed on a substrate according to one embodiment of the present disclosure.

[0030] Fig. 11b is an assembly diagram of Fig. 11a.

[0031] FIG. 12 is a cross-sectional view taken along line 8-8 of FIG. 5 according to one embodiment.

[0032] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0033] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0034] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0035] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0039] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0040] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0041] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0045] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0047] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0050] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0051] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0052] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] FIG. 2a is a front perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 2b is a rear perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0055] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2a. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (218) (or "side member") comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0056] In the illustrated embodiment, the front plate (202) may include a first region (210D) that curves seamlessly from the first surface (210A) toward the rear plate at both ends of the long edge of the front plate. In the illustrated embodiment (see FIG. 2b), the rear plate (211) may include a second region (210E) that curves seamlessly from the second surface (210B) toward the front plate at both ends of the long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may include only a flat plane positioned parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E) as above, and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0057] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., a key input device (217), or an indicator) or additionally include other components.

[0058] The display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first surface (210A) and the first area (210D) of the side (210C). The display (201) may be combined with or placed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (204, 219) and / or at least a portion of the key input device (217) may be placed in the first area (210D) and / or the second area (210E).

[0059] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The sound output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), speakers (207, 214), and connector (208) may be placed in at least part of the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone (203) and the speakers (207, 214). In some embodiments, the acoustic output device (207, 214) may include a speaker (e.g., a piezo speaker) that is operated with the hole formed in the housing (210) excluded.

[0060] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., home key button), a portion of the second surface (210B), and / or below the display (201). The electronic device (200) may further include at least one of the unillustrated sensor modules, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0061] The camera module (205, 212) may include a first camera module (205) disposed on a first surface (210A) of the electronic device (200), a second camera module (212) disposed on a second surface (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and image sensors may be disposed on one surface of the electronic device (200).

[0062] A key input device (217) may be placed on the side (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input device (217) that is not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0063] An indicator may be disposed, for example, on a first surface (210A) of a housing (210). The indicator may provide status information of an electronic device (200), for example, in the form of light (e.g., a light-emitting element). In one embodiment, the light-emitting element may provide a light source that corresponds to the operation of a camera module (205), for example. The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0064] The connector hole (208) may include a first connector hole (208) capable of receiving a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0065] Some camera modules (205) among the camera modules (205, 212), some sensor modules (204) among the sensor modules (204, 219), or an indicator may be positioned to be visually exposed through the display (201). For example, the camera module (205), sensor module (204), or indicator may be positioned to come into contact with the external environment through an opening or a transparent area perforated to the front plate (202) of the display (201) within the internal space of the electronic device (200). According to one embodiment, the area facing the display (201) and the camera module (205) may be formed as a transparent area having a certain transmittance as part of the area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in the range of about 5% to about 20%. These transparent areas may include an area that overlaps with the effective area (e.g., field of view area) of the camera module (205) through which light passes to form an image with an image sensor to generate an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be positioned to perform their functions without being visually exposed through the front plate (202) within the internal space of the electronic device. For example, in this case, the area of ​​the display (201) facing the sensor modules may not require a perforated opening.

[0066] According to one embodiment, the electronic device (200) has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be part of a foldable electronic device, a slideable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms "foldable electronic device," "slidable electronic device," "stretchable electronic device," and / or "rollable electronic device" may mean an electronic device that is capable of bending deformation of a display (e.g., display (330) in FIG. 3), so that at least a portion may be folded, wound or rolled, at least a portion of the area may be expanded, and / or can be housed inside a housing (e.g., housing (210) in FIG. 2a and 2b). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used by expanding the screen display area by unfolding the display or by exposing a larger area of ​​the display to the outside, depending on the user's needs.

[0067] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment of the present disclosure.

[0068] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIG. 2a and FIG. 2b, or may include other embodiments of the electronic device.

[0069] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 2a or FIG. 2b) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or support structure), a front plate (320) (e.g., a front cover), a display (330) (e.g., the display (201) of FIG. 2a), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or additionally include other components. At least one of the components of the electronic device (300) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and redundant descriptions are omitted below.

[0070] The first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310). The first support member (311) may be formed, for example, from a metal material and / or a non-metal (e.g., polymer) material. The first support member (311) may have a display (330) attached to one side and a substrate (340) attached to the other side. The substrate (340) may be equipped with a processor, memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0071] Memory may include, for example, volatile memory or non-volatile memory.

[0072] The interface may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (300) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0073] The battery (350) is a device for supplying power to at least one component of the electronic device (300) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, the substrate (340). The battery (350) may be integrally disposed inside the electronic device (300). In one embodiment, the battery (350) may be disposed detachably from the electronic device (300).

[0074] An antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. In one embodiment, the antenna structure may be formed by a part or combination thereof of the side bezel structure (310) and / or the first support member (311).

[0075] FIG. 4 is a block diagram illustrating a camera module according to various embodiments.

[0076] Referring to FIG. 4, the camera module (180) may include a lens assembly (410), a flash (420), an image sensor (430), an image stabilizer (440), a memory (450) (e.g., a buffer memory), or an image signal processor (460). The lens assembly (410) may collect light emitted from a subject that is the target of image capture. The lens assembly (410) may include one or more lenses. According to one embodiment, the camera module (180) may include a plurality of lens assemblies (410). In this case, the camera module (180) may form, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the plurality of lens assemblies (410) may have the same lens properties (e.g., angle of view, focal length, autofocus, f-number, or optical zoom), or at least one lens assembly may have one or more lens properties different from the lens properties of other lens assemblies. The lens assemblies (410) may include, for example, wide-angle lenses or telephoto lenses.

[0077] A flash (420) may emit light used to enhance light emitted or reflected from a subject. According to one embodiment, the flash (420) may include one or more light-emitting diodes (e.g., RGB (red-green-blue) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp. An image sensor (430) may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly (410) into an electrical signal. According to one embodiment, the image sensor (430) may include, for example, one image sensor selected from image sensors with different properties such as an RGB sensor, a BW (black and white) sensor, an IR sensor, or a UV sensor, a plurality of image sensors having the same properties, or a plurality of image sensors having different properties. Each image sensor included in the image sensor (430) can be implemented using, for example, a CCD (charged coupled device) sensor or a CMOS (complementary metal oxide semiconductor) sensor.

[0078] The image stabilizer (440) may move at least one lens or image sensor (430) included in the lens assembly (410) in a specific direction or control the operational characteristics of the image sensor (430) (e.g., adjusting read-out timing, etc.) in response to the movement of the camera module (180) or the electronic device (101) including it. This allows for compensating for at least some of the negative effects caused by the movement on the image being captured. According to one embodiment, the image stabilizer (440) may detect such movement of the camera module (180) or the electronic device (101) using a gyroscope sensor (not shown) or an accelerometer sensor (not shown) placed inside or outside the camera module (180). According to one embodiment, the image stabilizer (440) may be implemented, for example, as an optical image stabilizer. The memory (450) may temporarily store at least a portion of the image acquired through the image sensor (430) for the next image processing operation. For example, if image acquisition by the shutter is delayed or multiple images are acquired at high speed, the acquired original image (e.g., a Bayer-patterned image or a high-resolution image) is stored in the memory (450), and the corresponding copy image (e.g., a low-resolution image) can be previewed through the display module (160). Subsequently, when a specified condition is satisfied (e.g., user input or system command), at least a portion of the original image stored in the memory (450) may be acquired and processed by, for example, an image signal processor (460). According to one embodiment, the memory (450) may be configured as at least a portion of the memory (130) or as a separate memory that operates independently thereof.

[0079] The image signal processor (460) can perform one or more image processing operations on an image obtained through the image sensor (430) or an image stored in memory (450). One or more of the above image processing methods may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softing). Additionally or generally, the image signal processor (460) may perform control (e.g., exposure time control, or readout timing control, etc.) over at least one of the components included in the camera module (180) (e.g., image sensor (430)). The image processed by the image signal processor (460) may be stored back in memory (450) for further processing or provided to an external component of the camera module (180) (e.g., memory (130), display module (160), electronic device (102), electronic device (104), or server (108)). According to one embodiment, the image signal processor (460) is at least part of the processor (120). It may be configured as a separate processor that operates independently of the processor (120). If the image signal processor (460) is configured as a separate processor from the processor (120), at least one image processed by the image signal processor (460) may be displayed through the display module (160) as is or after additional image processing by the processor (120).

[0080] According to one embodiment, the electronic device (101) may include a plurality of camera modules (180), each having different attributes or functions. In this case, for example, at least one of the plurality of camera modules (180) may be a wide-angle camera and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules (180) may be a front camera and at least another may be a rear camera.

[0081] FIG. 5 is a perspective view of a camera module according to one embodiment of the present disclosure. FIG. 6a is an assembly view of a camera module according to one embodiment of the present disclosure. FIG. 6b is an assembly view of a camera housing, a carrier, a magnet, and a coil according to one embodiment of the present disclosure.

[0082] According to one embodiment of the present disclosure, as illustrated in FIGS. 5 and 6a, a camera module (500) (e.g., camera module (180) of FIG. 1, camera modules (205, 212) of FIGS. 2a and 2b) may include a lens assembly (510), a shield can (520), a carrier (530), a camera housing (540), a substrate (550), an image sensor (600), an AF ball (b), a flexible substrate (570) connected to a coil (571), and / or a magnet (561) facing the coil (571). At least one of the above configurations may be omitted or at least one configuration may be added.

[0083] According to one embodiment, as illustrated in FIGS. 5 and 6a, a lens assembly (510) may include at least one lens (512) and a lens barrel (511) (e.g., a lens barrel) in which the lens (512) is placed. In one embodiment, the lens barrel (511) may be a housing that accommodates a plurality of lenses (512). In one embodiment, a plurality of lenses (512) may be arranged inside the lens barrel (511) along the optical axis (OA) of the lenses (512) (e.g., the optical axis (OA) of FIG. 5). In one embodiment, the lens assembly (510) may be accommodated in a carrier (530) (e.g., the carrier (530) of FIGS. 6a and 6b) disposed in a camera housing (540). In one embodiment, the carrier (530) may include an opening (531) for accommodating the lens assembly (510).

[0084] According to one embodiment, as illustrated in FIGS. 5, 6a, and 6b, the shield can (520) may be located outside the camera housing (540) and may be coupled to or fitted into the camera housing (540). According to one embodiment, the shield can (520) may be located at the outermost edge of the camera module (500) and may wrap around the camera housing (540). In one embodiment, the shield can (520) may block or reduce electromagnetic waves generated from the outside, thereby reducing the occurrence of malfunctions of the camera module (500).

[0085] According to one embodiment, as illustrated in FIGS. 5 and FIGS. 6a, a carrier (530) can be accommodated inside a camera housing (540). In one embodiment, the camera housing (540) may have an open top surface to allow the carrier (530) to be inserted, thereby providing a space for the carrier (530) to be seated. In one embodiment, the camera housing (540) may prevent and protect the carrier (530) from being dislodged by movement.

[0086] According to one embodiment, as illustrated in FIG. 6b, the camera housing (540) may include a support portion (541) that supports the carrier (530) and a side portion (542) that extends in a direction substantially perpendicular to the support portion (541) (e.g., the +Z direction in FIG. 6b). As described below, in one embodiment, a flexible substrate (570) connected to a coil (571) may be disposed on the side portion (542) of the camera housing (540). In one embodiment, an opening (543) may be formed on the side portion (542) of the camera housing (540) that faces the magnet support portion (532) of the carrier (530) on which a magnet (561) is disposed. The coil (571) can come into contact with the magnet (561) placed on the magnet support (532) of the carrier (530) through the opening (543) formed in the side portion (542) of the camera housing (540).

[0087] In one embodiment, the flexible substrate (570) may be electrically connected to a main substrate (e.g., the substrate (340) of FIG. 3) on which the substrate (550) and / or the processor (120) of the electronic device (200) is placed. Thus, the flexible substrate (570) may supply current to the coil (571) under the control of the processor (120).

[0088] According to one embodiment, the camera module (500) can adjust the focus by moving the carrier (530) under the control of the processor (120). In one embodiment, the carrier (530) can be moved in the direction of the optical axis (OA) of the lenses (512) relative to the camera housing (540) via an AF actuator (e.g., the Z-axis direction in FIG. 6a). In one embodiment, the AF actuator may include a coil (571) and a magnet (561). In one embodiment, the magnet (561) may be placed on the magnet support (532) of the carrier (530) facing the side portion (542) of the camera housing (540). In one embodiment, a flexible substrate (570) may be placed on the side portion (542) of the camera housing (540) from the outside of the camera housing (540). In one embodiment, the coil (571) is placed on a flexible substrate (570) and can face a magnet (561) placed on a magnet support (532) of a carrier (530) through an opening (543) formed in a side portion (542). The carrier (530) can perform an auto focus (AF) function by moving in the direction of the optical axis (OA) relative to the camera housing (540) and / or image sensor (600) through the electromagnetic force acting between the coil (571) and the magnet (561) to automatically adjust the focus of the lens (512) on the subject. For example, the processor (120) can control the current flowing through the coil (571) via a driving circuit (e.g., driver IC) (not shown) electrically connected to the flexible substrate (570) of the camera module (500) to induce an electromagnetic phenomenon between the magnet (561) and the coil (571) and move the carrier (530) in the direction of the optical axis (OA) relative to the camera housing (540) and the image sensor (600). Thus, the focus of the lenses (512) relative to the subject can be adjusted according to the movement of the lens assembly (510). The above description is based on the premise that the magnet (561) is placed on the carrier (530) and the coil (571) is placed on the camera housing (540), but it is not limited thereto.In one embodiment, the magnet (561) is placed on the side portion (542) of the camera housing (540), and the coil (571) is placed on the carrier (530) so as to face the magnet (561). For convenience of explanation, the following description will be based on the premise that the magnet (561) is placed on the carrier (530) and the coil (571) is placed on the camera housing (540).

[0089] Additionally, although the above description describes the carrier (530) as being configured to accommodate the lens assembly (510) and move in the direction of the optical axis (OA), it is not limited thereto. In one embodiment, the carrier (530) can move in a direction perpendicular to the optical axis (OA) (e.g., the X-axis direction and / or the Y-axis direction in FIG. 5) through an electromagnetic force acting between a magnet placed in either the carrier (530) or the camera housing (540) and a coil placed in the other. The lens assembly (510) can be accommodated in the carrier (530) and move in a direction perpendicular to the optical axis (OA). Accordingly, the camera module (500) can correct image shake by moving the carrier (530) under the control of the processor (120).

[0090] According to one embodiment, as illustrated in FIG. 6a, the camera module (500) may include a substrate (550) on which an image sensor (600) is placed. In one embodiment, the substrate (550) may be a printed circuit board electrically connected to the image sensor (600). In one embodiment, the image sensor (600) may acquire an image corresponding to the subject by detecting light emitted or reflected from the subject of the lens assembly (510) and transmitted through the lenses (512), and by converting the light into an electrical signal.

[0091] In one embodiment, the image sensor (600) may include a pixel array (602) that detects light (e.g., an effective imaging surface) and a pad portion (601) that is electrically connected to a substrate (550). In one embodiment, the pad portion (601) may be a substrate that is electrically connected to a substrate (500) (e.g., a printed circuit board). In one embodiment, the pad portion (601) of the image sensor (600) may be electrically connected to the substrate (550) through a plurality of wires (W) (e.g., wiring) formed of a conductive material.

[0092] In one embodiment, the substrate (550) connected to the image sensor (600) can be electrically connected to the main substrate (340) on which the processor (120) is placed through a connector (552).

[0093] In one embodiment, referring to FIG. 6b, at least one AF ball (b) may be disposed between the carrier (530) and the camera housing (540). In one embodiment, the AF ball (b) may guide the movement of the carrier (530) when the carrier (530) is moved relative to the camera housing (540) through the electromagnetic force between the magnet (561) and the coil (571). For example, the AF ball (b) may guide the movement of the carrier (530) relative to the camera housing (540) in the direction of the optical axis (OA). In one embodiment, referring to FIG. 6b, the AF ball (b) may be disposed in a guide groove (not shown) formed by substantially extending in the direction of the optical axis (OA) from at least one of the camera housing (540) and the carrier (530). In one embodiment, the guide grooves formed in the camera housing (540) and the carrier (530), respectively, may be formed on both sides of the magnet support (532) with respect to the magnet (561).

[0094] In one embodiment, as illustrated in FIG. 6a, the camera module (500) may include an IR (infrared) filter (620). In one embodiment, the IR filter (620) may be positioned to face the image sensor (600). For example, the IR filter (620) may be positioned in a filter holder (610) (e.g., bracket, holder, support structure) to face the image sensor (600). In one embodiment, the IR filter (620) may be an optical filter that blocks or selectively passes infrared wavelengths. The camera module (500) can prevent color distortion of the image acquired through the image sensor (600) and improve the clarity of the image by allowing only wavelengths in the visible light band to pass through the image sensor (600) via the IR filter (620) and blocking wavelengths in the infrared band.

[0095] According to one embodiment, the IR filter (620) may be placed in a filter holder (610) and fixed within the camera module (500). In one embodiment, at least a portion of the filter holder (610) may be placed on an image sensor (600) and a substrate (550) and fixed within the camera module (500).

[0096] In one embodiment, referring to FIGS. 6a and FIGS. 7, the filter holder (610) may include a frame (611) forming the exterior, a first opening (OP1), a second opening (OP2), a third opening (OP3), a first partition (612), and / or a second partition (613). At least one of the above-described configurations of the filter holder (610) may be omitted or at least one configuration may be added. In one embodiment, the first opening (OP1) of the filter holder (610) may face the pixel array (602) of the image sensor (600). For example, the first opening (OP1) may correspond to the pixel array (602) of the image sensor (600). In one embodiment, an IR filter (620) may be positioned to cover the first opening (OP1) in the filter holder (610) so as to face the image sensor (600). In one embodiment, the second opening (OP2) and the third opening (OP3) of the filter holder (610) may face the pad portion (601) of the image sensor (600) and a portion of the substrate (550). For example, the second opening (OP2) and the third opening (OP3) may correspond to the pad portion (601) of the image sensor (600). In one embodiment, the second opening (OP2) and the third opening (OP3) may face each other with respect to the first opening (OP1). As described below, wires (W) that electrically connect the substrate (550) and the image sensor (600) and / or electronic components disposed on the substrate (550) may be disposed in the second opening (OP2) and the third opening (OP3). In one embodiment, the first partition portion (612) is formed integrally with the frame (611) and may partition the first opening (OP1) and the second opening (OP2). In one embodiment, the second partition (613) is formed integrally with the frame (611) and faces the first partition (612), and can partition the first opening (OP1) and the third opening (OP3).

[0097] In one embodiment, referring to FIG. 7, the filter holder (610) may include a first rib (614) and a second rib (615) that protrude from the frame (611) toward the lenses (512). In one embodiment, the first rib (614) and the second rib (615) may face each other. In one embodiment, the IR filter (620) may be supported through the frame (611) and partitions (612, 613) of the filter holder (610). The first rib (614) and the second rib (615) of the filter holder (610) may be extended along the edge (e.g., corner) of the IR filter (620). Thus, the IR filter (62) may be supported through the ribs (614, 615) while placed in the filter holder (610) so that it may not be dislodged from the filter holder (610). Additionally, the IR filter (62) can be fixed in position in the filter holder (610) through the ribs (614, 615).

[0098] FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 5 according to one embodiment. FIG. 9 is a plan view according to one embodiment of the present disclosure, showing an image sensor and a filter holder supporting an IR filter on a substrate.

[0099] According to one embodiment, as illustrated in FIGS. 8 and 9, at least a portion of the filter holder (610) may be disposed on the substrate (550) and the pad portion (601) of the image sensor (600). In one embodiment, the frame (611) of the filter holder (610) may be disposed on the substrate (550). In one embodiment, the partition portions (612, 613) of the filter holder (610) may overlap with the pad portion (601) of the image sensor (600) when viewed from the -Z direction of FIG. 8. In one embodiment, a gap in the Z-axis direction of FIG. 8 may be formed between the first partition portion (612) and the pad portion (601) of the image sensor (600) and between the second partition portion (613) and the pad portion (601) of the image sensor (600). In one embodiment, the first partition (612) and the second partition (613) may each come into contact with the pad (601) of the image sensor (600).

[0100] According to one embodiment, the IR filter (620) is supported by the frame (611) and partitions (612, 613) of the filter holder (610) and can cover the first opening (OP1) of the filter holder (610). The pixel array (602) of the image sensor (600) can be shielded from the outside by the frame (611), partitions (612, 613), and IR filter (620) of the filter holder (610). Thus, it is possible to block external foreign substances from entering the pixel array (602) of the image sensor (600).

[0101] According to one embodiment, as illustrated in FIGS. 8 and 9, an adhesive member (P) may be applied to the second opening (OP2) and the third opening (OP3) of the filter holder (610). The filter holder (610) (e.g., frame (611), partitions (612, 613)), the image sensor (600), and the substrate (550) may be fixed through the adhesive member (P). For example, the adhesive member (P) may include an epoxy material. The adhesive member (P) may undergo a curing process after being filled into the second opening (OP2) and the third opening (OP3) located between the frame (611) and the partitions (612, 613). The filter holder (610), the image sensor (600), and the substrate (550) may be formed into a single rigid body through the adhesive member (P), thereby increasing rigidity against external impact. Thus, the structural rigidity of the substrate (550) may be improved.

[0102] In one embodiment, the second opening (OP2) and the third opening (OP3) of the filter holder (610) may accommodate a wire (W) connecting the image sensor (600) and the substrate (550) and / or electronic components placed on the substrate (550). The filter holder (610) may not overlap with the wire (W) and / or electronic components placed on the substrate (550) and the image sensor (600) while placed on the substrate (550) and the image sensor (600). Accordingly, the camera module (500) may have reduced thickness and / or size in the Z-axis direction compared to an embodiment in which the wire (W) and / or electronic components and the filter holder (610) overlap in the Z-axis direction of FIG. 8.

[0103] In one embodiment, the adhesive member (P) applied to the second opening (OP2) and the third opening (OP3) of the filter holder (610) can be applied to the wire (W) and / or electronic components placed on the substrate (550). Thus, the wire (W) and / or electronic components can be fixed in position through the adhesive member (P).

[0104] In one embodiment, the adhesive member (P) may be formed from an epoxy-based, acrylic-based, polyurethane-based, silicon-based, and / or polyimide-based material.

[0105] In one embodiment, the first partition (612) of the filter holder (610) can block the adhesive member (P) from flowing into the first opening (OP1) during the process of applying the adhesive member (P) to the second opening (OP2). The second partition (613) of the filter holder (610) can block the adhesive member (P) from flowing into the first opening (OP1) during the process of applying the adhesive member (P) to the third opening (OP3).

[0106] In one embodiment, the first partition (612) of the filter holder (610) may be located on the pad (601) of the image sensor (600) between the pixel array (602) of the image sensor (600) and the wire (W). In one embodiment, the second partition (613) of the filter holder (610) may be located on the pad (601) of the image sensor (600) between the pixel array (602) of the image sensor (600) and the wire (W). In this case, the first partition (612) and the second partition (613) can block shorts or flares generated from the wire (W) from entering the pixel array (602) of the image sensor (600).

[0107] According to one embodiment, as illustrated in FIG. 8, at least a portion of the camera housing (540) may be disposed on the substrate (550). In one embodiment, the camera housing (540) may include a recess (544) that accommodates a filter holder (610) disposed on the substrate (550). In one embodiment, the recess (544) may be a space formed below the support portion (541) of the camera housing (540).

[0108] According to one embodiment, the substrate (550) may include an opening (e.g., the opening (551) of FIG. 12) into which a portion of the image sensor (600) is received. In one embodiment, the thickness of the camera module (500) in the Z-axis direction may be reduced as the image sensor (600) is received in the opening (551) of the substrate (550). Meanwhile, a reinforcing member (640) supporting the substrate (550) may be disposed below the substrate (550) (e.g., in the -Z direction of FIG. 8). In one embodiment, the image sensor (600) may be disposed on the reinforcing member (740). In one embodiment, the reinforcing member (640) may be disposed on the substrate (550) in which the opening (551) is formed to protect the substrate (550) from external impact.

[0109] FIG. 10 is a plan view in which a reinforcing member is disposed on a substrate in an area adjacent to the edge of an image sensor according to one embodiment of the present disclosure.

[0110] According to one embodiment, as illustrated in FIG. 10, reinforcing members (631, 632) may be disposed on the substrate (550) adjacent to the edge (e.g., corner) of the image sensor (600). In one embodiment, the reinforcing members (631, 632) may be joined to the substrate (550) through welding or bonding. In one embodiment, the reinforcing members (631, 632) may be in a form that extends along the edge of the image sensor (600). In one embodiment, the reinforcing members (631, 632) may be disposed parallel to the edge that is relatively longer among the edges of the image sensor (600). In one embodiment, the reinforcing members (631, 632) may be disposed oppositely on the substrate (550). In one embodiment, the rigidity of the substrate (550) against external impact may be increased as the reinforcing members (631, 632) are disposed.

[0111] In one embodiment, the reinforcing members (631, 632, 640) and the filter holder (610) may be formed from a metal or non-metal material. Metal materials may include alloys such as aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium, and non-metal materials may include synthetic resin, ceramic, and engineering plastic. In one embodiment, the filter holder (610) and the reinforcing members (631, 632) may be formed integrally through insert injection molding.

[0112] FIG. 11a is a perspective view in which a reinforcing member surrounding an image sensor is disposed on a substrate according to one embodiment of the present disclosure. FIG. 11b is an assembly view of FIG. 11a. FIG. 12 is a cross-sectional view taken along line 8-8 of FIG. 5 according to one embodiment.

[0113] The following description may be a description of the briquette (610) of FIGS. 6a to 9 described above and a filter holder (710) of another embodiment (e.g., bracket, holder, support structure).

[0114] According to one embodiment, as illustrated in FIG. 11a and FIG. 11b, the camera module (500) may include a lens assembly (510) (e.g., lens assembly (510) of FIG. 6a), a shield can (520) (e.g., shield can (520) of FIG. 6a), a carrier (530) (e.g., carrier (530) of FIG. 6a), a camera housing (540) (e.g., camera housing (540) of FIG. 6a), a filter holder (710) (e.g., filter holder (610) of FIG. 6a), an IR filter (720) (e.g., IR filter (620) of FIG. 6a), a first reinforcing member (730), a second reinforcing member (740), a substrate (550) (e.g., substrate (550) of FIG. 6a) and / or an image sensor (600) (e.g., image sensor (600) of FIG. 6a). At least one of the above-described configurations may be omitted or at least one configuration may be added.

[0115] In one embodiment, referring to FIG. 11b and FIG. 12, the filter holder (710) may be received in a recess (544) formed in the camera housing (540) at the bottom of the lens assembly (510). In one embodiment, the filter holder (710) may be placed on a substrate (550) to receive an image sensor (600) and may include an opening (712) corresponding to the image sensor (600). In one embodiment, an IR filter (720) may be placed in a recess (711) formed in the filter holder (710) to cover the opening (712). In one embodiment, the recess (711) of the filter holder (710) may be formed in the -Z direction of FIG. 12 with respect to one side of the filter holder (710) facing the lens assembly (510) to form a step with respect to one side of the filter holder (710).

[0116] In one embodiment, referring to FIGS. 11a, 11b and 12, a first reinforcing member (730) may be placed on a substrate (550) to wrap around a filter holder (710). In one embodiment, the first reinforcing member (730) may be joined to the substrate (550) by welding or bonding. In one embodiment, the first reinforcing member (730) may wrap around a wire (W) (e.g., wire (W) of FIG. 10) that electrically connects the substrate (550) and the image sensor (600). In one embodiment, the rigidity of the substrate (550) against external impact may be increased as the first reinforcing member (730) is placed.

[0117] In one embodiment, an adhesive member (e.g., adhesive member (P) of FIG. 8) is applied between the first reinforcing member (730) and the filter holder (710) to bond the first reinforcing member (730), the filter holder (710), and the substrate (550). Thus, the filter holder (710), the first reinforcing member (730), and the substrate (550) can be formed into a single rigid body through the adhesive member, thereby increasing the rigidity against external impact.

[0118] In one embodiment, referring to FIG. 12, the substrate (550) may include an opening (551) into which a portion of the image sensor (600) is received. In one embodiment, the camera module (500) may have a reduced thickness in the Z-axis direction as the image sensor (600) is received in the opening (551) of the substrate (550). Meanwhile, a second reinforcing member (740) supporting the substrate (550) may be disposed below the substrate (550) (e.g., in the -Z direction of FIG. 12). In one embodiment, the image sensor (600) may be disposed on the second reinforcing member (740). In one embodiment, the second reinforcing member (740) may include a protrusion (741) protruding from one side of the second reinforcing member (740). The image sensor (600) can be placed on the protrusion (741) of the second reinforcing member (740) and received in the opening (551) of the substrate (550). In one embodiment, the second reinforcing member (740) can be placed on the substrate (550) in which the opening (551) is formed to protect the substrate (550) from external impact.

[0119] In one embodiment, the reinforcing members (730, 740) and the filter holder (710) may be formed from a metal material or a non-metal material. Metal materials may include alloys such as aluminum, stainless steel (STS, SUS), iron, magnesium, and titanium, and non-metal materials may include synthetic resin, ceramic, and engineering plastic. In one embodiment, the filter holder (710) and the reinforcing members (730, 740) may be formed integrally through insert injection molding.

[0120] The camera module (180, 205, 212, 500) may include an IR (Infrared) filter (620, 720) that selectively absorbs or reflects wavelengths of light entering the image sensor (600). The IR filter (620, 720) may be an optical filter that blocks or selectively passes infrared wavelengths. The camera module (180, 205, 212, 500) can prevent color distortion of the image acquired through the image sensor (600) and improve the clarity of the image by allowing only wavelengths in the visible light band to pass through the image sensor (600) and blocking wavelengths in the infrared band through the IR filter (620, 720).

[0121] The camera module may include a separate filter holder that supports the IR filter. The filter holder may be positioned adjacent to the image sensor and the substrate (550) on which the image sensor is placed. However, impact transmitted to the image sensor and the substrate may be transmitted directly to the filter holder, thereby damaging the filter holder.

[0122] Additionally, the filter holder may be positioned at a certain distance from the wiring (e.g., wire (W)) connecting the image sensor and the substrate and / or the electrical components disposed on the substrate so as not to overlap with the wiring and / or the electrical components. In this case, the distance between the filter holder and the wiring and / or between the filter holder and the electrical components may limit the reduction of the size and / or thickness of the camera module.

[0123] Additionally, the substrate may be formed with a thin thickness to reduce the size and / or thickness of the camera module. In particular, the portion of the substrate where the image sensor is placed may be formed thinner than the portion of the substrate where the image sensor is not placed. In this case, the image sensor and / or the substrate may be damaged based on external impact transmitted to the image sensor and the substrate. Damage to the image sensor and / or the substrate may cause damage to the filter holder.

[0124] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0125] According to one embodiment of the present disclosure, a camera module (180, 205, 212, 500) may include a lens assembly (510) comprising at least one lens (512) aligned along an optical axis (OA). The camera module may include a camera housing (540) in which the lens assembly is received. The camera module may include an image sensor (600) comprising a pixel array (602) and a pad portion (601) for detecting light acquired through the lens. The camera module may include a substrate (550) on which the image sensor is placed. The camera module may include a filter holder (610) placed on the substrate, comprising a first opening (OP1) corresponding to the pixel array of the image sensor and second openings (OP2, OP3) corresponding to the pad portion of the image sensor and a part of the substrate. The camera module is disposed in the second opening of the filter holder and may include an adhesive member (P) that is bonded to the filter holder, the image sensor, and the substrate. The camera module may include an IR filter (620) disposed in the filter holder and covering the first opening.

[0126] In one embodiment, the substrate may be a printed circuit board. The filter holder may include a frame (611) forming the exterior of the filter holder and a partition (612, 613) formed integrally with the frame, partitioning the first opening and the second opening, and disposed on the pad portion of the image sensor. The adhesive member may include an epoxy material and may be filled into the second opening between the frame and the partition to increase the structural rigidity of the printed circuit board.

[0127] In one embodiment, a gap may be formed between the partition portion of the filter holder and the pad portion of the image sensor.

[0128] In one embodiment, the partition portion of the filter holder may be in contact with the pad portion of the image sensor.

[0129] In one embodiment, the camera module may further include a wire (W) that electrically connects the image sensor and the substrate. The wire may be received in a second opening of the filter holder and may come into contact with the adhesive member.

[0130] In one embodiment, the filter holder may include a first rib (614) and a second rib (615) that protrude toward the lens from the frame and face each other. The edges of the IR filter may be supported through the first rib and the second rib of the filter holder.

[0131] In one embodiment, the camera housing may include a recess (544) disposed on the substrate and accommodating the filter holder.

[0132] In one embodiment, the camera module may further include a carrier (530) to which the lens assembly is fixed and which is accommodated in the camera housing.

[0133] In one embodiment, the camera module may further include a plurality of reinforcing members (stiffners) (631, 632) positioned in an area adjacent to the edge of the image sensor and disposed on the substrate.

[0134] In one embodiment, the plurality of reinforcing members may be arranged to face each other on the substrate.

[0135] In one embodiment, the filter holder and the plurality of reinforcing members can be integrally formed through insert injection molding.

[0136] In one embodiment, the plurality of reinforcing members may include a metal material.

[0137] In one embodiment, the substrate may include an opening (551) in which a portion of the image sensor is received.

[0138] In one embodiment, the camera module may further include a protrusion (741) that protrudes from one side and is located at an opening of the substrate and supports the image sensor, and may further include a reinforcing member (740) disposed at the bottom of the substrate.

[0139] According to one embodiment of the present disclosure, a camera module (180, 205, 212, 500) may include a lens assembly (510) comprising at least one lens (512) aligned along an optical axis (OA). The camera module may include a camera housing (540) in which the lens assembly is received. The camera module may include an image sensor (600) that detects light acquired through the lens. The camera module may include a substrate (550) having an opening (551) in which a portion of the image sensor is received. The camera module may include a filter holder (710) disposed on the substrate to receive the image sensor and having an opening (712) corresponding to the image sensor. The camera module may include an IR filter (720) disposed on the filter holder to cover the opening of the filter holder. The camera module may include a first reinforcing member (730) disposed on the substrate and surrounding the filter holder. The camera module may include a second reinforcing member (740) that is positioned at the bottom of the substrate and supports the image sensor.

[0140] In one embodiment, the second reinforcing member may include a protrusion (741) on which the image sensor is disposed and which protrudes from one surface of the second reinforcing member and is located at the opening of the substrate.

[0141] In one embodiment, the camera housing may include a recess (544) disposed on the substrate and accommodating the filter holder.

[0142] In one embodiment, the camera module may further include a carrier (530) to which the lens assembly is fixed and which is accommodated in the camera housing.

[0143] In one embodiment, the camera module may further include an adhesive member (P) that is bonded to the first reinforcing member and the filter holder between the first reinforcing member and the filter holder.

[0144] In one embodiment, the filter holder and the first reinforcing member may be integrally formed through insert injection molding.

[0145] According to one embodiment disclosed in this document, a filter holder (610, 710) on which an IR filter (620, 720) is placed may be placed on a substrate (550) and an image sensor (600). The filter holder (610, 710), the substrate (550), and the image sensor (600) may be fixed through an adhesive member (P). Thus, the filter holder (610, 710), the substrate (550), and the image sensor (600) may be a single rigid body, and their rigidity against external impact may be increased.

[0146] Additionally, the filter holder (610, 710) may include an opening (OP2, OP3) that accommodates wiring (W) connecting the substrate (550) and the image sensor (600) and / or electrical material placed on the substrate (550). The filter holder (610, 710) may not overlap with the wiring (W) and / or electrical material while placed on the substrate (550) and the image sensor (600). Accordingly, the camera module (180, 205, 212, 500) may have its size and / or thickness reduced as the vertical gap between the wiring (W) and / or electrical material and the filter holder (610, 710) is reduced.

[0147] The IR filter (620, 720) can be formed to the required size regardless of surrounding equipment as it is placed in the filter holder (610, 710).

[0148] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

Claims

1. In a camera module (180, 205, 212, 500), A lens assembly (510) comprising at least one lens (512) aligned along the optical axis (OA); A camera housing (540) that accommodates the above lens assembly; An image sensor (600) comprising a pixel array (602) and a pad portion (601) for detecting light obtained through the lens; A substrate (550) on which the above image sensor is placed; A filter holder (610) disposed on a substrate, comprising a first opening (OP1) corresponding to a pixel array of the image sensor and a second opening (OP2, OP3) corresponding to a pad portion of the image sensor and a portion of the substrate; An adhesive member (P) disposed in the second opening of the filter holder and bonded to the filter holder, the image sensor, and the substrate; and A camera module comprising: an IR filter (620) disposed in the filter holder and covering the first opening.

2. In Paragraph 1, The above substrate is a printed circuit board, and The filter holder above is, It includes a frame (611) forming the exterior of the filter holder and a partition (612, 613) formed integrally with the frame, partitioning the first opening and the second opening and positioned on the pad portion of the image sensor, and The above adhesive member is, A camera module comprising an epoxy material and filled in the second opening between the frame and the bulkhead to increase the structural rigidity of the printed circuit board.

3. In Paragraph 2, A camera module in which a gap is formed between the partition portion of the filter holder and the pad portion of the image sensor.

4. In Paragraph 2, The partition of the filter holder above is, A camera module in contact with the pad portion of the image sensor above.

5. In Paragraph 1, It further includes a wire (W) that electrically connects the image sensor and the substrate, and The above wire is, A camera module received in the second opening of the filter holder and in contact with the adhesive member.

6. In Paragraph 2, The filter holder above is, It includes a first rib (614) and a second rib (615) that protrude toward the lens in the frame and face each other, The edges of the above IR filter are, A camera module supported through the first rib and the second rib of the filter holder.

7. In Paragraph 1, The above camera housing is, A camera module comprising a recess (544) disposed on the substrate and accommodating the filter holder.

8. In Paragraph 1, A camera module further comprising a carrier (530) to which the lens assembly is fixed and which is received in the camera housing.

9. In Paragraph 1, A camera module further comprising a plurality of reinforcing members (stiffners) (631, 632) positioned in an area adjacent to the edge of the image sensor and disposed on the substrate.

10. In Paragraph 9, The above plurality of reinforcing members are, A camera module positioned to face each other on the above substrate.

11. In Paragraph 9, The filter holder and the plurality of reinforcing members are, A camera module formed integrally through insert injection molding.

12. In Paragraph 9, The above plurality of reinforcing members are, A camera module containing a metal material.

13. In Paragraph 1, The above substrate is, A camera module including an opening (551) in which a portion of the image sensor is received.

14. In Paragraph 13, A camera module further comprising: a reinforcing member (740) positioned on the lower part of the substrate, and including a protrusion (741) that protrudes from one side and is located at the opening of the substrate and supports the image sensor.

15. In the camera module (180, 205, 212, 500), A lens assembly (510) comprising at least one lens (512) aligned along the optical axis (OA); A camera housing (540) that accommodates the above lens assembly; An image sensor (600) that detects light obtained through the above lens; A substrate (550) including an opening (551) into which a portion of the image sensor is received; A filter holder (710) disposed on the substrate to accommodate the image sensor and including an opening (712) corresponding to the image sensor; IR filter (720) placed in the filter holder and covering the opening of the filter holder; A first reinforcing member (730) disposed on the substrate and surrounding the filter holder; and A camera module comprising: a second reinforcing member (740) disposed on the lower part of the substrate and supporting the image sensor.

Images