Electronic housing safety feature

Abstract

This disclosure pertains to an electronic assembly, which may be an integrated circuit assembly for power electronics, addressing the technical challenge of unpredictable housing failure during excessive heat or pressure events. The assembly includes a housing designed to encase circuitry' and a failure isolation feature incorporating a controlled failure section. The controlled failure section includes one or more portions specifically configured to weaken certain borders of the controlled failure section, thereby managing the failure of the housing during excessive heat or pressure events within the housing. These portions are trenches within the housing that outline the controlled failure section, and the trenches are structured to confine the failure to a designated area, thereby preventing exposure of hazardous components or circuity in a failure of the electronic assembly.

Description

ELECTRONIC HOUSING SAFETY FEATURECROSS REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 750,511 titled: ELECTRONIC HOUSING SAFETY FEATURE, filed on January’ 28, 2025. The entirety of the aforementioned application is incorporated by reference herein.TECHNICAL FIELD

[0002] This disclosure generally relates to systems and methods for managing thermal and pressure-related failures in power electronics.BACKGROUND

[0003] In modem power electronics and particularly in applications utilizing flyback converters, packaging density and thermal loading have progressively increased as devices become more compact and operate at higher power levels. For instance, mobile electronics, industrial power supplies, and charging modules (e.g., portable chargers, rack-mount power systems, and battery-powered inverters) often include tightly integrated power conversion stages designed to deliver regulated output voltage while maintaining electrical isolation between input and output. Frequently, these compact power assemblies are also required to endure rapid voltage surges, short circuits, and other transient events that can generate excessive heat and internal pressure. As a result, the external housing or casing of such power modules plays an important role in protecting both internal circuitry’ and end users.SUMMARY

[0004] The following presents a simplified summary’ of one or more aspects of the technology disclosed herein in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0005] The technology disclosed herein relates to an integrated circuit assembly comprising a housing for encasing circuitry and a failure isolation feature. The failure isolation feature 1Reference No. : PI.0702.WO.P001 / 043734.00021includes a controlled failure section, where the controlled failure section comprises one or more controlled failure portions configured to weaken one or more borders of the controlled failure section for controlling failure of the housing during an excessive heat or pressure event within the housing.

[0006] The technology further relates to a method of improving safety of an integrated circuit assembly. The method includes forming a failure isolation feature with one or more controlled failure portions in a housing that encases circuitry of the integrated circuit assembly by weakening one or more borders of a controlled failure section of the housing, wherein the controlled failure section of the housing is configured to be compromised in an excessive heat or pressure event within the housing while preventing compromise of a first surface area outside of the one or more borders of the controlled failure section.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Various objects, aspects, features, and advantages of the disclosure will become more apparent and better understood by referring to the detailed description taken in conjunction with the accompanying drawings, in which like reference characters identify corresponding elements throughout. In the drawings, like reference numbers indicate identical, functionally similar, and / or structurally similar or relevant elements. The drawing figures are not necessarily drawn to scale and certain figures may be shown in exaggerated or generalized form in the interest of clarify and conciseness. The disclosure itself, however, as well as a preferred mode of use, further objects, and advances thereof, will be more thoroughly understood by reference to the following detailed description of illustrative aspects when read in conjunction with the accompanying drawings.

[0008] FIG. 1 is an illustration of an electronic component casing design showing an uncontrolled failure border and a detached housing portion due to catastrophic failure relevant to aspects of the disclosure.

[0009] FIG. 2A is an illustration of electronic component casing showing a failed housing portion and damage border resulting from uncontrolled failure, according to aspects of the disclosure.2Reference No. : PI.0702.WO.P001 / 043734.00021

[0010] FIG. 2B is a side cross-sectional view of the casing showing a fracture propagating through the structure and terminating at the failed housing portion, according to aspects of the disclosure.

[0011] FIG. 3 is a schematic view of electronic components and features within the casing highlighting a magnified damaged section, according to aspects of the disclosure.

[0012] FIG. 4 is an illustration of a damaged electronic component relevant to aspects of the disclosure.

[0013] FIG. 5A is an illustration of an electronic component with failure isolation features designed to direct failure to a controlled section of the housing, according to aspects of the disclosure.

[0014] FIG. 5B is an illustration of an electronic component with a controlled failure portion, according to aspects of the disclosure.

[0015] FIG. 6A is an illustration of an electronic component with failure isolation features, according to aspects of the disclosure.

[0016] FIG. 6B is a side view of FIG. 6A according to aspects of the disclosure.

[0017] FIG. 6C is a cross-sectional view of FIG. 6A and FIG. 6B according to aspects of the disclosure.

[0018] FIG. 7A is an illustration of an electronic component showing a failed housing portion and the associated damage border resulting from an uncontrolled failure event, according to aspects of the disclosure.

[0019] FIG. 7B is an illustration of an electronic component showing the integration of a controlled failure feature within the housing of an electronic component to direct a housing failure to a controlled section during excessive heat or pressure events, according to aspects of the disclosure.

[0020] FIG. 8 is another illustration of an electronic component showing the integration of a controlled failure feature within the housing of an electronic component to direct a housing failure to a controlled section during excessive heat or pressure events, according to aspects of the disclosure.3Reference No. : PI.0702.WO.P001 / 043734.00021

[0021] FIG. 9A is an illustration of a housing design for an electronic component assembly showing controlled failure features configured to manage failure events, according to aspects of the disclosure.

[0022] FIG. 9B is a cross-sectional view of the housing of FIG. 9A highlighting the interaction of the controlled failure features and the housing during a catastrophic event, according to aspects of the disclosure.

[0023] FIG. 10A is an illustration of an electronic component featuring an example maginot line arrangement as a controlled failure feature according to aspects of the disclosure.

[0024] FIG. 10B is an illustration of an electronic component featuring an example maginot line arrangement as a controlled failure feature according to aspects of the disclosure.

[0025] FIG. 10C is an illustration of an electronic component featuring an example maginot line arrangement as a controlled failure feature according to aspects of the disclosure.

[0026] FIG. 10D is an illustration of an electronic component featuring an example maginot line arrangement as a controlled failure feature according to aspects of the disclosure.

[0027] FIG. 11 is an illustration of an electronic component housing and the addition of maginot lines to form controlled failure housing portions for managing housing failure events, according to aspects of the disclosure.

[0028] FIG. 12 is a schematic diagram of a flyback converter circuit featuring a primary side section, a dielectric portion, and a secondary' side section, according to aspects of the disclosure.

[0029] FIG. 13 is a schematic diagram of a flyback converter circuit featuring a dielectric portion for galvanic isolation between the primary and secondary side sections, according to aspects of the disclosure.DETAILED DESCRIPTION

[0030] The detailed description set forth below in connection with the appended drawings is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein can be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of various concepts. However, it will be apparent to those skilled in the art that these concepts can 4Reference No. : PI.0702.WO.P001 / 043734.00021be practiced without these specific details. In some instances, well known structures and components are shown in block diagram form in order to avoid obscuring such concepts.I. Terminology

[0031] When introducing elements of various aspects of the present disclosure, the articles “a,” "an." and ‘’the” are intended to mean that there are one or more of the elements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements. Additionally, it should be understood that references to “one aspect” or “an aspect” of the present disclosure are not intended to be interpreted as excluding the existence of additional aspects that also incorporate the recited features.

[0032] In the above disclosure, the term “substantially” or “approximately” may be used as a modifier for a geometric relationship between elements or for the shape of an element or component. While the terms substantially or approximately are not limited to a specific metric and may cover any metric that is understood by one of ordinary skill in the art to be an acceptable variation, some examples are provided as follows. In some examples, the terms substantially or approximately may include a variation of less than 10% of the dimension of the object or component, or a variation of less than 5% of the object or component. These examples are not intended to be limiting and may be increased or decreased based on the understanding of acceptable limits to one of ordinary skill in the art.

[0033] In the description, certain terms such as “forward.” “front," “rear,” “back,” “up,” “down.” “upper.” “lower,” “horizontal.” “vertical,” “left,” “right,” “longitudinal.” “lateral,” “inner,” “outer,” “backside,” “frontside,” and the like are used to provide some clarity of description when dealing with relative relationships. However, these terms are not intended to imply absolute relationships, positions, and / or orientations. For example, with respect to an object, an upper surface can become a lower surface by turning the object over.

[0034] Additionally, references to “one aspect” or “an aspect” of the present disclosure are not intended to be interpreted as excluding the existence of additional features or components, either described in this application or that would have been understood by one of ordinary skill in the art after reading this disclosure, that also incorporate the recited features.5Reference No. : PI.0702.WO.P001 / 043734.00021

[0035] Although the Figures or various descriptions throughout may provide a specific order of method steps, the order of the steps may differ from what is depicted. Also, two or more steps can be performed concurrently or with partial concurrence. Such variation will depend on the software and hardware systems chosen and on designer choice. All such variations are within the scope of the disclosure. Likewise, software implementations could be accomplished with standard programming techniques with rule-based logic and other logic to accomplish the various connection steps, processing steps, comparison steps and decision steps.IL Overview

[0036] In the field of power electronics, particularly in power supply applications such as flyback converters, mobile electronics, and industrial power supplies, the increasing demand for compact, high-performance devices has led to challenges in managing thermal and pressure-related failures. Conventional casing designs fail to adequately address the risks associated with catastrophic events, such as voltage surges, short circuits, or excessive heat and pressure build-up. These uncontrolled failures can result in unpredictable fracturing of the housing, exposing potentially dangerous components and features which may create safety hazards for users and / or surrounding equipment.

[0037] The present disclosure addresses these limitations by describing various failure isolation features integrated into the housing of electronic devices and in some aspects power supplies such as flyback converters. The concepts described herein include controlled failure portions, such as strategically placed trenches or grooves, which are strategically engineered to weaken specific sections of the housing. These features ensure that, during excessive heat or pressure events, the housing fails in a predictable and controlled manner along predefined paths. By isolating the failure to a designated low-risk section of the housing, the described approach prevents exposure of high-voltage components, thereby significantly enhancing safety.

[0038] The solution described herein leverages precise structural modifications, such as maginot lines, trenches, and / or other intentional weakening of the housing, which can be formed using techniques like laser cutting, molding, machining, water-jetting and / or etching. These features create a path of least resistance, ensuring that any catastrophic failure is confined to a controlled failure section. This section is strategically positioned to correspond with low- 6Reference No. : PI.0702.WO.P001 / 043734.00021voltage or low-risk areas of the internal circuitry, further minimizing potential hazards. Additionally, the described technology is adaptable to various electronic devices and can be implemented in conjunction with other safety measures. The technology7described herein offers a reliable and scalable solution for improving the safety and reliability of power electronic assemblies.

[0039] This overview, and the detailed description that follows, has been presented for purposes of illustration and description. It is not intended to be exhaustive nor to limit the disclosure to the forms described. Numerous modifications are possible considering the teachings herein, including any combination of the different examples described herein. Some of those modifications have been discussed and others will be understood by those skilled in the art. The various aspects were chosen and described to best illustrate the principles of the present disclosure and various aspects as are suited to the particular use contemplated. The scope of the present disclosure is, of course, not limited to the examples or aspects set forth herein but can be employed in any number of applications and devices and is relevant to any electronic device that may be subject to housing or casing damage due to a build-up of heat and / or pressure therein.III. Detailed Examples

[0040] FIG. 1 and FIG. 2A illustrate top-view7depictions of the integrated circuit assembly 50, showing the structural elements, external contacts, and visible failure regions of one example of an uncontrolled housing failure. While not intended to be limiting, the integrated circuit assembly 50 may be a power supply such as a flyback converter, and in additional examples, may be a mobile device charger, an LED driver, a battery-powered inverter, an industrial power supply, a rack-mount power system, or any other electronic device that includes power conversion circuitry and / or that is subject to thermal or pressure-related housing failure risks.

[0041] The housing 54 senes as the primary enclosure for the assembly, with first end contacts 58 and second end contacts 60 positioned at opposite ends to facilitate electrical connectivity, i.e., to a circuit board or other assembly. The external contacts may be solder balls, pads, lands, pins and / or edge connectors to name a few non-limiting examples.7Reference No. : PI.0702.WO.P001 / 043734.00021

[0042] In FIG. 1, an uncontrolled failure border 51 is illustrated, highlighting the unpredictable nature of housing damage during an over-heating and / or over-pressure event that results in catastrophic failure of the housing 54. Similarly, FIG. 2A illustrates a failed housing portion 56 that has detached from the assembly, with a damage border 66 marking the unpredictable separation line. FIG. 2B illustrates a side cross-sectional view of housing 54, detailing a fracture that propagates through the structure and terminates at the surface of the failed housing portion 56. The damage border 66 is shown as the line / point of separation, where the housing material gives way under excessive pressure and / or heat. This depiction highlights the lack of control in the failure process, resulting in unpredictable damage patterns. In some cases, the catastrophic failure and separation of the failed housing portion 56 may expose high voltage and / or high current circuitry, bond wires, interconnects, or pathways. In one example, a fracture or break-off of the housing 56 may for example expose a gallium nitride (GaN) circuit 67. In another example, bond wires 70 shown in FIG. 3, may be exposed or damaged, representing hazardous damage and / or exposed hazardous regions which may create safety hazards for users and / or surrounding equipment.

[0043] FIG. 3 illustrates an internal schematic view of the integrated circuit assembly 50, with a magnified damaged section 68. This illustration shows uncontrolled damage resulting in discontinuities or other disruptions to bond wires or traces 70 within the assembly, which can occur due to an overheat and / or overpressure scenario within the housing 54 leading to an uncontrolled failure of the housing 54. The uncontrolled failure of the housing 54 may result in damaged bond wires being exposed, which may pose a safety risk if a person w here to touch or encounter the exposed damaged section of the integrated circuit assembly 50.

[0044] FIG. 4 illustrates an integrated circuit assembly 50 lacking the disclosed safety features, for comparison w ith the aspects of the disclosure described below7. The second end contacts 60 are shown in their standard placement and may remain in electrical continuity with a circuit, while the damage border 66 represents another example of an unpredictable failure region exposing a portion of the circuit and / or other components. As noted above, the break-off of the housing may for example expose a GaN circuit 67 or other potentially hazardous circuits, bond wires, interconnects, high voltage and / or high current components or circuitry in the absence of the disclosed controlled failure mechanisms. FIG. 4 further highlights the8Reference No. : PI.0702.WO.P001 / 043734.00021limitations of conventional housing designs, where housing fractures remain unpredictable and uncontrolled.

[0045] The uncontrolled failure border 51 and the damage border 66, as seen in FIG. 1, FIG.2A, FIG 2B, FIG. 3, and FIG. illustrate failure dynamics of an electronic device housing. The uncontrolled failure borders 51, 66, and 68 represent random fracture paths. These illustrations underscore the challenges in managing housing integrity’ during catastrophic events.

[0046] FIG. 5 A illustrates an integrated circuit assembly 100 that includes failure isolation features according to aspects of the disclosure. While not intended to be limiting, the integrated circuit assembly 50 may be a power supply such as a flyback converter, and in additional examples, may be a mobile device charger, an LED driver, a battery-powered inverter, an industrial power supply, a rack-mount power system, or any other electronic device that includes power conversion circuitry and / or that is subject to thermal or pressure-related housing failure risks. As shown in FIG. 5A and FIG. 5B, the integrated circuit assembly 100 includes a housing 157 that encases the internal components of the assembly. A controlled failure section 150 is a strategically positioned portion of housing 157 and is surrounded / bordered by controlled failure features 155 (which may herein be interchangeably referred to as failure portions or features, trenches, or maginot lines), designed to isolate and direct failure to the controlled failure section 150 during excessive heat or pressure events. The controlled failure features 155 include trenches or grooves (e.g., which may be similar in cross section to the maginot line 355 shown in side views 4B and 4C) intentionally formed to weaken the housing 157 along predefined paths. These features ensure that any failure of the housing 157 occurs predictably within the controlled failure section 150, thereby preventing exposure of high-risk areas. The controlled failure features 155 are engineered to create a path of least resistance, directing the failure to the low-risk controlled failure section 150. Additional examples of high voltage or high-risk areas of the IC and low- voltage or low risk areas of the IC are described in further detail below.

[0047] The integrated circuit assembly 100 may further include first end contacts 158 and second end contacts 160 are located at opposite ends of the housing 157, for mounting the integrated circuit and / or for facilitating electrical connectivity to external circuits. The intentional weakening of the housing 157 along the predetermined path 155 may further ensure that the first end contacts 158 and second end contacts 160 remain intact and / or preventing 9Reference No. : PI.0702.WO.P001 / 043734.00021damage to component that the integrated circuit assembly 100 is mounted to (e.g., a circuit board) even during a catastrophic failure of the housing 157 by ensuring that excessive pressure and / or housing failure is directed out of a top surface of the integrated circuit assembly 100.

[0048] FIG. 6A illustrates another example of an electronic component as an integrated circuit assembly with casing 300. It is noted that any one or combination of the features described with respect to FIG. 6A may be combined with or substituted for any of the features described here related to other Figures without departing from the scope of this disclosure. The integrated circuit casing 300, as illustrated in FIG. 6A, incorporates a controlled failure section 350 bordered by a trench or maginot line 355 that divides the casing into a controlled failure section 350 which is designed to fail in an over-temperature and / or over-pressure event, and a housing portion 357 which is intended to remain intact.

[0049] FIG. 6B is a side view of the integrated circuit 300 of FIG. 6A, and FIG. 6C is a crosssection view showing a profile of the trench / maginot line 355 according to one aspect of the disclosure. The trench / maginot line 355 is designed with a specific geometry, such as a V-shaped or U-shaped cross-section, to weaken the housing portion 357 along the designated path. By reducing the wall thickness of the housing portion 357, the trench 355 creates a path of least resistance that directs failure to the controlled failure section 350. This design confines a housing failure to a low-risk area, preventing exposure of high-voltage components and improving the safety of the integrated circuit casing 300. As noted above, a high voltage or other higher risk area of the IC may correspond with the first surface area 357. A low voltage or low risk area of the IC may correspond with the controlled failure section 350. Thus, during a catastrophic event, the IC housing will fail predictably - e.g., the controlled failure section 150 will pop-out or otherwise separate from the housing while leaving the first surface area 357 intact.

[0050] In some examples, the trench or groove that forms the maginot line 355 may have a depth of 350 micrometers (pm). In another example, the depth may be 50 -1000 pm. In yet another example, the depth may be 200 - 500 pm. These maginot line depth examples are applicable to any one or combination of the examples described herein.

[0051] It is noted that any cross-sectional profile may be implemented as a maginot line. For example, the cross-sectional profile may be u-shaped, may have a rectangular or square profile. Further, in some examples, the maginot line may be formed as a series of trenches, grooves, or ioReference No. : PI.0702.WO.P001 / 043734.00021concavities. In another example, the maginot lines may instead be formed of a series of concavities or blind-holes that encompass or otherwise border the controlled failure section.

[0052] Additional details and examples of the maginot lines, controlled failure section, and / or examples of high voltage or high risk areas of the IC and low voltage or low risk areas of the IC are described in further detail below.

[0053] FIG. 7A illustrates one example of a fracture pattern 766 of the outer housing of an electronic device 700 (e.g., an IC as described in any of the examples described herein) if no maginot lines are provided for comparison purposes with FIG. 7B and FIG. 8. As shown in FIG. 7A, if no maginot line is provided, the fracture pattern is unpredictable, and the fracture of the housing may lead to a high voltage or other dangerous or undesirable portions of the circuit within the housing being exposed.

[0054] The integrated circuit (IC) assembly 700, as illustrated in FIGS. 7A and 7B, include a housing 754 designed to encase and protect internal components. In FIG. 7A, a failed housing portion 756 is shown as a result of an uncontrolled failure event (e.g.. excessive heat and / or pressure build-up within the housing), with a damage border 766 illustrating the unpredictable fracture path. This uncontrolled failure can expose a high-risk IC section 768, which may include high-voltage components, posing significant safety risks. Some examples of high-risk IC sections include but are not limited to high-voltage transistors, gallium nitride (GaN) circuits, primary side transformer windings, high-current switching devices, bond wires connected to the primary side, rectifiers rated for high voltage, and energy storage capacitors. For example, high-risk IC sections may include components associated with the primary side of a power converter (e.g., as described below with respect to FIG. 12 and FIG. 13) and that may pose safety risks if exposed during a catastrophic housing failure. FIG. 7B, however, demonstrates the incorporation of a trench or maginot line 755 (as noted above, the terms trench, controlled failure portion(s) and maginot lines may be used interchangeably throughout this disclosure) within the housing 754. This maginot line serves as a controlled failure feature, ensuring that any fracture or damage to the housing 754 is confined to the failed housing portion 756, thereby preventing exposure of the high-risk IC section 768.

[0055] The maginot line 755 in FIG. 7B may be strategically positioned to correspond with (and be to be safely spaced away from) a high-risk IC section 768. This feature weakens the housing along a predefined path, creating a path of least resistance during excessive heat or 11Reference No. : PI.0702.WO.P001 / 043734.00021pressure events. By directing the failure to the designated failed housing portion 756, the maginot line 755 ensures that any housing separation ends at the maginot line 755 thus isolating the high-risk IC section 768 from damage and / or exposure and thus significantly enhancing the safety of the integrated circuit assembly 700. The damage border 766, as depicted in FIGS. 7A and 7B, is provided for comparison of an uncontrolled and unpredictable housing failure (e.g., in an IC without aspects of this disclosure implemented) to a controlled housing failure of an IC implementing features of this disclosure and shows a separation line where the housing material could separate unpredictably and expose a portion of the high-risk IC section 768.

[0056] FIG. 8 illustrates an alternative disclosed example of the integrated circuit assembly 700, featuring dual maginot lines, identified as the first maginot line 755a and the second maginot line 755b, within the housing 754. These maginot lines define a controlled failure section that isolates the failed housing portion 756 from the high-risk IC section 769. The comparison uncontrolled failure border 766a and 766d, along with the first and second uncontrolled failure border sections 766b and 766c, demonstrates the effectiveness of the dual maginot lines in containing IC housing damage and isolating high-risk IC section(s) 769 from damage / exposure. By strategically placing the maginot lines, a controlled failure section can be configured to ensure that any damage is restricted to low-risk areas of the housing 754. This design prevents the progression of fractures beyond the maginot lines, maintaining the integrity and preventing exposure of the high-risk IC section 769.

[0057] The high-risk IC section 769 in FIG. 8 represents an area and / or specific component of the integrated circuit assembly 700 that includes high-voltage or other hazardous components, non-limiting examples of which are described above with respect to FIG. 7A and FIG. 7B and further described below with respect to FIG. 12 and FIG. 13.

[0058] FIG. 9A and FIG. 9B illustrate another example of an electronic component as an integrated circuit assembly. The integrated circuit assembly 700, as illustrated in FIG. 9A and FIG. 9B, includes a housing 754 designed to encase and protect the internal components of the assembly. FIG. 9A shows a housing 754, illustrating the arrangement of structural features intended to manage catastrophic failure events. FIG. 9B complements the illustration of FIG.9A by showing an example of a cross-sectional view, highlighting the internal configuration and interaction of the housing 754 with the failure isolation features.12Reference No. : PI.0702.WO.P001 / 043734.00021

[0059] The first maginot line 755a, the second maginot line 755b, the third maginot line 755c, and the fourth maginot line 755d are strategically positioned weakened boarders of the housing 754, as shown in FIG. 9A. These maginot lines collectively define the boundaries of a controlled failure section, ensuring that any structural failure of the housing 754 is confined to a predetermined area. The arrangement of the maginot lines forms a cross-like pattern, which enhances the predictability and control of the failure path during excessive heat or pressure events.

[0060] The failed housing portion 756, as depicted in FIG. 9A, is the designated area within the housing 754 that is engineered to fail in a controlled manner. This portion is further divided into the first controlled failure portion 756a, the second controlled failure portion 756b, the third controlled failure portion 756c, and the fourth controlled failure portion 756d to ensure that the failure occurs along predefined paths. In this particular example, the crossed configuration of third maginot line 755c and fourth maginot line 755d may further provide control of housing failure by ensuring that any propagating housing failures are contained withing the first maginot line 755a and second maginot line 755b.

[0061] As noted above, an internal housing portion or component 767, as shown in FIG. 9B, may generate heat and / or pressure during a fault condition. The presence of the internal housing portion or component 767 causes the first controlled failure portion 756a, the second controlled failure portion 756b, the third controlled failure portion 756c, and the fourth controlled failure portion 756d to break-off along the maginot lines and separate from the housing 754.

[0062] Various additional examples of alternative maginot line or trench arrangements are shown in FIG. 10A, FIG. 10B, FIG. IOC, and FIG. 10D. The integrated circuit assembly 800 includes a series of alternative maginot line arrangements which may be specifically designed for a particular electronic component or IC component architecture based on a desired controlled failure of the housing. In FIG. 1 OA, a first alternative maginot line arrangement 855a is illustrated, demonstrating a strategically positioned trench pattern that defines a controlled failure section within the housing of the integrated circuit assembly 800. The first alternative maginot line arrangement 855a generally includes series of squares or rectangles and / or a rectangle divided into four quadrants.

[0063] In FIG. 1 OB, a second alternative maginot line arrangement 855b is shown, the second alternative maginot line arrangement 855b generally forms a rectangular or square boundary 13Reference No. : PI.0702.WO.P001 / 043734.00021with diagonal cross lines, creating an "X" shape within an additional dividing line that crosses the rectangle or square.

[0064] FIG. 10C illustrates the third alternative maginot line arrangement 855c and the fourth alternative maginot line arrangement 855d. The third alternative maginot line arrangement 855c generally comprises an elongated oval or elliptical closed loop, while the fourth alternative maginot line arrangement 855d is formed as a circular closed loop, each with a plurality of dividing lines that divide the outer maginot line into quadrants. Further, as shown in the example of IOC, and as may be applied to any of the examples described herein, an integrated circuit assembly 800 according to aspects of the disclosure may have a plurality of controlled failure housing portions depending on the architecture of the electronic component. For example, the third alternative maginot line arrangement 855c may correspond with a first component portion of the integrated circuit assembly 800 that may generate heat and / or pressure in a failure state, and a third alternative maginot line arrangement 855c may correspond with a second component and / or portion of the integrated circuit assembly 800 that may generate heat and / or pressure in a failure state.

[0065] FIG. 10D presents the fifth alternative maginot line arrangement 855e, which provides yet another example of a trench pattern engineered to isolate and direct failure within the housing of the integrated circuit assembly 800. The fifth alternative maginot line arrangement 855e generally follows an L-shaped / rectangular or square path.

[0066] FIG. 11 shows an electronic component housing 1100 incorporating a system of maginot lines 1155a, 1155b, 1155c, and 1155d, which may be engineered during the manufacturing process to provide controlled failure of the housing. It is noted that the manufacturing aspects described below are applicable to any of the examples described in this disclosure. The maginot lines 1155a-d may be formed in the housing 1100 using a variety' of manufacturing techniques. For example, the maginot lines 1155a-d can be formed by a laser, water-jet, machined, molded directly into the housing 1100 during the molding process, and / or machined into the housing 1100. to name a few non-limiting examples.

[0067] In one example manufacturing sequence, the first formed maginot line 1155a and the second formed maginot line 1155b may be created initially, for example by laser cutting or machining. Subsequently, the diagonal third formed maginot line 1155c and fourth formed maginot line 1155d may be formed in a later step of the manufacturing process, such as by 14Reference No. : PI.0702.WO.P001 / 043734.00021additional laser processing, machining, or other suitable methods. This staged approach allows for flexibility in the manufacturing process and can be tailored to the specific requirements of the electronic component housing 1100. Further, the maginot lines described above (and throughout the examples described herein) may have vary ing depths and / or geometries based on a desired failure path of the housing.

[0068] FIG. 12 shows an example of a flyback converter circuit 400 that may be implemented into any one or combination of the 1C housings described above. The circuit 400 may include a primary side section 420, a secondary side section 430, and a dielectric portion 425 that provides galvanic isolation between the two sections. The arrangement in FIG. 12 illustrates how each section interacts while maintaining required separation under standard and fault conditions.

[0069] In one example, the primary side section 420 may comprise a switching element such as a transistor and associated control circuitry for regulating the energy transfer process on the high-voltage side of the circuit. This section operates at elevated voltages, making the primary side section 420 a focal point for safety considerations. Accordingly, the dielectric portion 425 is strategically positioned between the primary side section 420 and the secondary' side section 430 to ensure electrical separation and to prevent high-voltage exposure to the low-voltage side.

[0070] Further, the dielectric portion 425 serves as both a physical and an electrical barrier, providing insulation between the high-voltage and low-voltage sections of the circuit. The dielectric portion 425 may be constructed from materials rated to withstand high electric fields and to prevent breakdown under typical operating and fault conditions. This barrier plays a significant role in maintaining user safety and in protecting the secondary side section 430 from potential high-voltage faults.

[0071] In one example, the secondary side section 430 operates at a lower voltage and may include components for rectification such as a diode and filtering such as a capacitor to provide a regulated output. Secondary' side section 430 is designed to be a low-risk area, even in the event of a catastrophic housing failure. As a result, the output voltage remains stable and suitable for the intended application, such as powering electronic devices or charging batteries. Any one or combination of the examples of maginot lines and / or controlled failure portions described above may be implemented to ensure that in case of a catastrophic housing failure,15Reference No. : PI.0702.WO.P001 / 043734.00021any damage to the housing only exposes the secondary side section 430 and does not expose the primary side section 420. In some examples applicable to any of the controlled housing failure aspects described above, the maginot lines and / or the controlled failure portion or trenches may be formed so that a portion of the dielectric portion 425 remains in-tact in case of a catastrophic failure.

[0072] FIG. 13 illustrates another example of the integrated circuit (IC) usable with any one or combination of the housing configurations described above. FIG. 13 is a diagram of a flyback converter circuit configured to provide galvanic isolation between the primary side section 1340 and the secondary side section 1330, while ensuring safe and reliable operation under both standard and fault conditions. The circuit arrangement is designed so that high-voltage energy transfer and low-voltage regulation are functionally separated, thereby reducing the risk of hazardous interactions between these two sections.

[0073] In one example, as shown in FIG. 13, the primary side section 1340 is responsible for energy transfer and may operate at elevated voltages. The primary side section 1340 may include a switching element 1342 (e.g., a transistor) and associated control circuitry 1344, which regulate the energy transfer process on the high-voltage side of the circuit. Since the primary side section 1340 operates at high voltage, isolation considerations are required to prevent fault propagation and to maintain user safety. As a result, the design of the primary side section 1340 incorporates materials and clearances that withstand high electric fields without breakdown.

[0074] In one example, the secondary side section 1330 operates at a lower voltage and may include rectification components 1332, such as diodes, and filtering components 1334, such as capacitors, to ensure a stable output voltage suitable for powering electronic devices or charging batteries. While the secondary side section 1330 is considered a low-risk area, even in the event of a catastrophic housing failure, the configuration is designed to provide a regulated output and to protect downstream circuitry7through overvoltage and overcurrent protection mechanisms.

[0075] A dielectric portion 1325 is shown in FIG. 13 as the material strategically positioned between the primary side section 1340 and the secondary side section 1330 to provide galvanic isolation as both a physical and electrical barrier. In one example, the dielectric portion 1325 is constructed from materials capable of withstanding high electric fields and preventing 16Reference No. : PI.0702.WO.P001 / 043734.00021breakdown under typical operating and fault conditions. By isolating the high-voltage faults in the primary side section 1340 from the low-voltage section 1330, the dielectric portion 1325 maintains user safety and protects the low-voltage components.

[0076] Any one or combination of the examples of maginot lines and / or controlled failure portions described above may be implemented to ensure that in case of a catastrophic housing failure, any damage to the housing only exposes the secondary side section 1330 and does not expose the primary side section 1340. In one example implementation, any one or combination of the maginot lines or controlled failure portions or trenches may be formed to ensure that any damage to the housing during a catastrophic failure is isolated to the secondary' side section 1330 so that no portion of the primary' side section 1340 is exposed. For example, the secondary side section 1330 may correspond with the controlled failure section as described in any one or combination of the examples described above. In some examples applicable to any of the controlled housing failure aspects described above, the maginot lines and / or the controlled failure portion or trenches may be formed so that a portion of the dielectric portion 1325 remains in-tact in case of a catastrophic failure.

[0077] Additional examples of the disclosure are described in the clauses that follow.

[0078] Clause 1. An integrated circuit assembly, the integrated circuit assembly comprising: a housing for encasing circuitry’ of the integrated circuit assembly; and a failure isolation feature, the failure isolation feature including a controlled failure section, wherein the controlled failure section comprises one or more controlled failure portions configured to weaken one or more borders of the controlled failure section for controlling failure of the housing during an excessive heat or pressure event within the housing.

[0079] Clause 2. The integrated circuit assembly of clause 1, wherein the controlled failure portions are one or more trenches in the housing that border the controlled failure section.

[0080] Clause 3. The integrated circuit assembly of any of the preceding clauses, wherein the housing further comprises a top surface, a bottom surface, and four side surfaces, wherein the top surface has a first surface area and the controlled failure section as a second surface area, wherein the one or more trenches are configured to contain the failure of the housing within the second surface area.17Reference No. : PI.0702.WO.P001 / 043734.00021

[0081] Clause 4. The integrated circuit assembly of any of the preceding clauses, wherein the first surface area is greater than the second surface area.

[0082] Clause 5. The integrated circuit assembly of any of the preceding clauses, wherein the circuitry comprises a high-voltage portion, wherein the high-voltage portion is outside of the one or more borders of the controlled failure section.

[0083] Clause 6. The integrated circuit assembly of any of the preceding clauses, wherein the circuit comprises a primary side section including a high-voltage portion and secondary side section with a low-voltage portion that is galvanically isolated from the high-voltage portion, wherein the controlled failure section corresponds with the low-voltage portion.

[0084] Clause 7. The integrated circuit assembly of any of the preceding clauses, further comprising a dielectric portion isolating the primary side section from the secondary side section, wherein the one or more trenches are adjacent to the dielectric portion.

[0085] Clause 8. The integrated circuit assembly of any of the preceding clauses, wherein the one or more trenches comprise a first trench and a second trench, wherein the first trench and the second trench form boundaries of the controlled failure section.

[0086] Clause 9. The integrated circuit assembly of any of the preceding clauses, wherein the one or more trenches comprise a third trench, wherein the third trench is diagonal with respect to the first trench or the second trench.

[0087] Clause 10. The integrated circuit assembly of any of the preceding clauses, wherein the one or more trenches have a depth of 200 micrometers (urn) to 500um.

[0088] Clause 11. The integrated circuit assembly of any of the preceding clauses, wherein the circuitry of the integrated circuit assembly is a power converter with an energy transfer element.

[0089] Clause 12. A method of improving safety of an integrated circuit assembly, the method comprising: forming a failure isolation feature with one or more controlled failure portions in a housing that encases circuitry of the integrated circuit assembly by weakening one or more borders of a controlled failure section of the housing, wherein the controlled failure section of the housing is configured to be compromised in an excessive heat or pressure event within the housing while preventing compromise of a first surface area outside of the one or more borders of the controlled failure section.18Reference No. : PI.0702.WO.P001 / 043734.00021

[0090] Clause 13. The method of clause 12, wherein forming the controlled failure section comprised forming one or more trenches in the housing.

[0091] Clause 14. The method of any of the preceding clauses, wherein the one or more trenches are cut into the housing via a laser.

[0092] Clause 15. The method of any of the preceding clauses, wherein the one or more trenches comprise a first trench and a second trench.

[0093] Clause 16. The method of any of the preceding clauses, wherein the one or more trenches comprise a third trench, wherein the third trench is diagonal w ith respect to the first trench or the second trench.

[0094] Clause 17. The method of any of the preceding clauses, wherein the one or more trenches separate the controlled failure section from the first surface area.

[0095] Clause 18. The method of any of the preceding clauses, wherein the encased circuitry comprises a high-voltage portion, wherein the high-voltage portion is outside of the one or more borders of the controlled failure section.

[0096] Clause 19. The method of any of the preceding clauses, wherein the encased circuitry comprises a primary side section including a high-voltage portion and secondary side section with a low-voltage portion that is galvanically isolated from the high-voltage portion, wherein the controlled failure section is formed to correspond with the low-voltage portion.

[0097] Clause 20. The method of any of the preceding clauses, wherein the integrated circuit assembly further comprises a dielectric portion isolating the primary side section from the secondary side section, wherein the one or more trenches are formed adjacent to the dielectric portion.

[0098] Clause 21. The method of any of the preceding clauses, wherein the one or more trenches are formed to have a depth of 200 micrometers (um) to 00um.

[0099] Clause 22. The method of any of the preceding clauses, wherein the one or more controlled failure portions are formed via a laser.19Reference No. : PI.0702.WO.P001 / 043734.00021

Claims

CLAIMSWhat is claimed is:

1. An integrated circuit assembly, the integrated circuit assembly comprising:a housing for encasing circuitry of the integrated circuit assembly; anda failure isolation feature, the failure isolation feature including a controlled failure section, wherein the controlled failure section comprises one or more controlled failure portions configured to weaken one or more borders of the controlled failure section for controlling failure of the housing during an excessive heat or pressure event within the housing.

2. The integrated circuit assembly of claim 1, wherein the controlled failure portions are one or more trenches in the housing that border the controlled failure section.

3. The integrated circuit assembly of claim 2, wherein the housing further comprises a top surface, a bottom surface, and four side surfaces, wherein the top surface has a first surface area and the controlled failure section as a second surface area, wherein the one or more trenches are configured to contain the failure of the housing within the second surface area.

4. The integrated circuit assembly of claim 3, wherein the first surface area is greater than the second surface area.

5. The integrated circuit assembly of claim 1, wherein the circuitry comprises a high-voltage portion, wherein the high-voltage portion is outside of the one or more borders of the controlled failure section.20Reference No. : PI.0702.WO.P001 / 043734.000216. The integrated circuit assembly of claim 2, wherein the circuit comprises a primary side section including a high-voltage portion and secondary side section with a low-voltage portion that is galvanically isolated from the high-voltage portion, wherein the controlled failure section corresponds with the low-voltage portion.

7. The integrated circuit assembly of claim 6, further comprising a dielectric portion isolating the primary side section from the secondary’ side section, wherein the one or more trenches are adj acent to the dielectric portion.

8. The integrated circuit assembly of claim 2, wherein the one or more trenches comprise a first trench and a second trench, w herein the first trench and the second trench form boundaries of the controlled failure section.

9. The integrated circuit assembly of claim 8, wherein the one or more trenches comprise a third trench, wherein the third trench is diagonal w ith respect to the first trench or the second trench.

10. The integrated circuit assembly of claim 2, wherein the one or more trenches have a depth of 200 micrometers (um) to 500um.

11. The integrated circuit assembly of claim 1, wherein the circuitry of the integrated circuit assembly is a power converter with an energy transfer element.21Reference No. : PI.0702.WO.P001 / 043734.0002112. A method of improving safety of an integrated circuit assembly, the method comprising:forming a failure isolation feature with one or more controlled failure portions in a housing that encases circuitry of the integrated circuit assembly by weakening one or more borders of a controlled failure section of the housing, wherein the controlled failure section of the housing is configured to be compromised in an excessive heat or pressure event within the housing while preventing compromise of a first surface area outside of the one or more borders of the controlled failure section.

13. The method of claim 12, wherein forming the controlled failure section comprised forming one or more trenches in the housing.

14. The method of claim 13, wherein the one or more trenches are cut into the housing via a laser.

15. The method of claim 13, wherein the one or more trenches comprise a first trench and a second trench.

16. The method of claim 15, wherein the one or more trenches comprise a third trench, wherein the third trench is diagonal with respect to the first trench or the second trench.

17. The method of claim 13, wherein the one or more trenches separate the controlled failure section from the first surface area.22Reference No. : PI.0702.WO.P001 / 043734.0002118. The method of claim 12, wherein the encased circuitry comprises a high-voltage portion, wherein the high-voltage portion is outside of the one or more borders of the controlled failure section.

19. The method of claim 13, wherein the encased circuitry comprises a primary side section including a high-voltage portion and secondary side section with a low-voltage portion that is galvanically isolated from the high-voltage portion, wherein the controlled failure section is formed to correspond with the low-voltage portion.

20. The method of claim 19, wherein the integrated circuit assembly further comprises a dielectric portion isolating the primary side section from the secondary side section, wherein the one or more trenches are formed adjacent to the dielectric portion.

21. The method of claim 13, wherein the one or more trenches are formed to have a depth of 200 micrometers (um) to 500um.

22. The method of claim 12, wherein the one or more controlled failure portions are formed via a laser.23Reference No. : PI.0702.WO.P001 / 043734.00021

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