Heat dissipation core and heat exchange device
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-09-23
- Publication Date
- 2026-08-13
Smart Images
Figure CN2025123376_13082026_PF_FP_ABST
Abstract
Description
A heat dissipation core and heat exchange device
[0001] Cross-references to related applications
[0002] This disclosure claims priority to Chinese Patent Application No. 2025101328308, filed on February 6, 2025, entitled “A Heat Dissipation Core and Heat Exchange Device”, the entire contents of which are incorporated herein by reference. Technical Field
[0003] This disclosure relates to the field of heat dissipation and cooling equipment, and more specifically, to a heat dissipation core and a heat exchange device. Background Technology
[0004] Chips operating under high heat flux density are prone to poor heat dissipation, which causes the chip temperature to rise. When the chip temperature exceeds a certain level, it will reduce the performance and lifespan of the power chip.
[0005] Currently, most methods for cooling chips involve using cooling media. Specifically, the chip is connected to a liquid cooling plate, and the cooling media flows through the plate to remove the heat generated by the chip. However, conventional liquid cooling plates cannot provide uniform heat dissipation to all parts of the chip. Typically, the chip near the cooling media inlet has high heat dissipation efficiency, while the chip near the cooling media outlet has low efficiency, resulting in a significant temperature difference between the inlet and outlet of the cooling media and poor heat dissipation uniformity. Summary of the Invention
[0006] This disclosure provides a heat dissipation core and heat exchange device, which can improve the problem of poor heat dissipation uniformity of chips at different locations by existing liquid cooling plates.
[0007] The embodiments of this disclosure can be implemented as follows:
[0008] Embodiments of this disclosure provide a heat dissipation core, comprising:
[0009] First module unit;
[0010] The second module unit is spaced apart from the first module unit, and a liquid inlet channel is formed between the second module unit and the first module unit. The first module unit has a first liquid outlet channel at the end away from the liquid inlet channel, and the second module unit has a second liquid outlet channel at the end away from the liquid inlet channel. Both the first module unit and the second module unit include multiple fins, which are arranged in parallel and spaced apart. The multiple fins have an angle with the liquid inlet channel, and a transverse connecting channel is formed between two adjacent fins. The transverse connecting channel connects the liquid inlet channel and the first liquid outlet channel, or the transverse connecting channel connects the liquid inlet channel and the second liquid outlet channel, or the liquid inlet channel is simultaneously connected to both the first liquid outlet channel and the second liquid outlet channel through the transverse connecting channel.
[0011] Optionally, the width of the liquid inlet channel gradually decreases along the direction of the cooling medium's movement.
[0012] Optionally, the liquid inlet channel is stepped along its length, and the width of the liquid inlet channel gradually decreases along the direction of the cooling medium.
[0013] Optionally, the liquid inlet channel is wedge-shaped along its length, and the width of the liquid inlet channel gradually decreases along the direction of the cooling medium.
[0014] Optionally, the heat dissipation core also includes a front side plate and a rear side plate, which are respectively disposed at both ends of the liquid inlet channel.
[0015] Optionally, the transverse connecting channel is perpendicular to the inlet channel, the first outlet channel, and the second outlet channel.
[0016] Optionally, the lateral connecting channel can be a zigzag channel.
[0017] The embodiments of this disclosure also provide a heat exchange device, including an upper substrate, a lower substrate, and the aforementioned heat dissipation core;
[0018] The upper substrate includes a cooling medium inlet and a cooling medium outlet. The cooling medium inlet is connected to the liquid inlet channel of the heat sink core, and the cooling medium outlet is connected to the first liquid outlet channel and the second liquid outlet channel.
[0019] The lower substrate and the upper substrate are sealed together, forming a heat exchange chamber, and the heat dissipation core is located in the heat exchange chamber.
[0020] Optionally, the upper substrate is provided with a tapered protrusion, and the heat dissipation core is located between the tapered protrusion and the lower substrate. The tapered protrusion is connected to the heat dissipation core and divides the heat exchange chamber into a first space and a second space. The first space is connected to the cooling medium inlet, and the second space is connected to the cooling medium outlet. The liquid inlet channel is located in the first space, and the first liquid outlet channel and the second liquid outlet channel are located in the second space.
[0021] Optionally, the number of heat dissipation cores is multiple, and the multiple heat dissipation cores are arranged at intervals;
[0022] There are also multiple tapered protrusions, and the positions of these multiple tapered protrusions correspond to multiple heat dissipation cores.
[0023] The beneficial effects of the embodiments disclosed herein are as follows:
[0024] The heat dissipation core includes a first module unit and a second module unit, which are spaced apart from each other and form a liquid inlet channel between them. The first module unit has a first liquid outlet channel at the end away from the liquid inlet channel, and the second module unit has a second liquid outlet channel at the end away from the liquid inlet channel. Both the first and second module units include multiple fins, which are arranged in parallel and spaced apart. The multiple fins form an angle with the liquid inlet channel, and a transverse connecting channel is formed between two adjacent fins. The transverse connecting channel connects the liquid inlet channel and the first liquid outlet channel, or connects the liquid inlet channel and the second liquid outlet channel, or the liquid inlet channel is simultaneously connected to both the first and second liquid outlet channels through the transverse connecting channel.
[0025] When the inlet channel is connected to the cooling medium, the cooling medium flows from the transverse connecting channel to either the first outlet channel or the second outlet channel. The distance traveled by the cooling medium from the inlet channel to the outlet is the same regardless of its location. At the same time, since the inlet channel is located between the first and second outlet channels, the temperature difference of the cooling medium flowing from the inlet channel into either transverse channel is low. Therefore, this heat dissipation core improves the problem of inconsistent heat dissipation efficiency in different parts, reduces the temperature difference between parts, and greatly improves the uniformity of heat dissipation.
[0026] The heat exchange device includes an upper substrate, a lower substrate, and a heat dissipation core. The upper substrate includes a cooling medium inlet and a cooling medium outlet. The cooling medium inlet is connected to the liquid inlet channel of the heat dissipation core, and the cooling medium outlet is connected to the first liquid outlet channel and the second liquid outlet channel. The lower substrate is sealed to the upper substrate, and the upper substrate and the lower substrate form a heat exchange chamber, with the heat dissipation core located in the heat exchange chamber. The heat exchange device has all the functions of the heat dissipation core. Attached Figure Description
[0027] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0028] Figure 1 is a schematic diagram of the structure of the heat dissipation core provided in the embodiments of this disclosure;
[0029] Figure 2 is a schematic diagram showing the positional relationship between the liquid inlet channel, the first liquid outlet channel and the second liquid outlet channel provided in the embodiments of this disclosure;
[0030] Figure 3 is a partial enlarged view of the transverse connecting channel in an embodiment of this disclosure;
[0031] Figure 4 is a schematic diagram of the structure of the heat exchange device provided in the embodiments of this disclosure;
[0032] Figure 5 is a schematic diagram of the structure of the heat dissipation core and the lower substrate provided in the embodiments of this disclosure;
[0033] Figure 6 is a schematic diagram of the structure of the upper substrate provided in the embodiments of this disclosure;
[0034] Figure 7 is a schematic diagram of the structure of the lower substrate provided in the embodiments of this disclosure;
[0035] Figure 8 is a schematic diagram of the chip arrangement on the lower substrate provided in an embodiment of this disclosure.
[0036] Icons: 1-Heat dissipation core; 10-First module unit; 11-Second module unit; 12-Fin; 121-Horizontal connecting channel; 13-Liquid inlet channel; 14-First liquid outlet channel; 15-Second liquid outlet channel; 16-Front side plate; 17-Rear side plate; 18-Third module unit; 19-Fourth module unit; 2-Upper substrate; 20-Cooling medium inlet; 21-Cooling medium outlet; 22-Gradual constriction protrusion; 3-Lower substrate; 30-Settling area; 4-Chip. Detailed Implementation
[0037] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. The components of the embodiments of this disclosure described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0038] Therefore, the following detailed description of embodiments of the present disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely to illustrate selected embodiments of the disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without inventive effort are within the scope of protection of the present disclosure.
[0039] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0040] In the description of this disclosure, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed during use, they are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure.
[0041] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0042] The terms “comprising,” “including,” or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase “comprising one…” does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0043] Unless otherwise expressly specified and limited, terms such as "setup" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.
[0044] It should be noted that, for the sake of simplicity, the aforementioned method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because according to this application, some steps can be performed in other orders or simultaneously. The steps in the methods of this application embodiments can be adjusted, combined, or deleted according to actual needs.
[0045] It should be noted that, where there is no conflict, the features in the embodiments of this disclosure can be combined with each other.
[0046] With the development of chip technology, the requirements for chip heat dissipation are becoming increasingly stringent. Poor heat dissipation under high heat flux density will cause temperature rise. If the temperature rise exceeds a certain level, it will reduce the performance and lifespan of the power chip. At the same time, under high heat flux density, uneven temperature distribution inside the chip will further exacerbate the above effects.
[0047] Currently, the most common method for cooling chips is to use liquid cooling plates with a cooling medium. The cooling medium creates forced convection within the channels of the liquid cooling plate, carrying away the heat generated by the chip. However, in conventional liquid cooling plates, the chip near the cooling medium inlet exhibits high heat dissipation efficiency, while the chip near the cooling medium outlet has lower efficiency. This results in a relatively higher temperature for the chip near the outlet, poor overall temperature uniformity of the liquid cooling plate, and is detrimental to the long-term reliable operation of the chip.
[0048] To address this issue, the embodiments of this disclosure provide a heat dissipation core and a heat exchange device that can solve the above problems. The heat exchange device includes a heat dissipation core and has the functions of a heat dissipation core. The heat dissipation core will be described in detail first, followed by a detailed description of the heat exchange device.
[0049] Please refer to Figures 1 to 3. The heat dissipation core includes a first module unit 10 and a second module unit 11. The second module unit 11 is spaced apart from the first module unit 10, and a liquid inlet channel 13 is formed between the second module unit 11 and the first module unit 10. A first liquid outlet channel 14 is provided at the end of the first module unit 10 away from the liquid inlet channel 13, and a second liquid outlet channel 15 is provided at the end of the second module unit 11 away from the liquid inlet channel 13. Both the first module unit 10 and the second module unit 11 include multiple fins 12. The multiple fins 12 are arranged in parallel and spaced apart. The multiple fins 12 have an angle with the liquid inlet channel 13. A transverse connecting channel 121 is formed between two adjacent fins 12. The transverse connecting channel 121 connects the liquid inlet channel 13 and the first liquid outlet channel 14, or the transverse connecting channel 121 connects the liquid inlet channel 13 and the second liquid outlet channel 15, or the liquid inlet channel 13 is simultaneously connected to the first liquid outlet channel 14 and the second liquid outlet channel 15 through the transverse connecting channel 121.
[0050] When the inlet channel 13 is connected to the cooling medium, the cooling medium flows from the transverse connecting channel 121 to the first outlet channel 14 or the second outlet channel 15, or simultaneously to both the first outlet channel 14 and the second outlet channel 15. The cooling medium travels the same distance from the inlet channel 121 to the outlet. Since the inlet channel 13 is located between the first outlet channel 14 and the second outlet channel 15, the temperature difference of the cooling medium flowing from the inlet channel 13 into any transverse channel is low. Therefore, the heat dissipation core 1 improves the problem of inconsistent heat dissipation efficiency in different parts, reduces the temperature difference between parts, and greatly improves the uniformity of heat dissipation.
[0051] The heat dissipation core 1 of this disclosure is provided with a first module unit 10 and a second module unit 11 forming a liquid inlet channel 13. Simultaneously, by arranging multiple fins 12 in parallel and at intervals to form a transverse connecting channel 121, the cooling medium is changed from a straight flow to a vertical impingement flow. This increases the convective heat transfer coefficient without increasing structural complexity, improving heat dissipation efficiency and flow field temperature uniformity. Of course, the multiple fins 12 and the liquid inlet channel 13 have a certain angle, with the angle ranging from greater than 0° to less than or equal to 90°.
[0052] The liquid inlet channel 13 is also provided with a front side plate 16 and a rear side plate 17 at both ends. The front side plate 16 and the rear side plate 17 are respectively connected to the first module unit 10 and the second module unit 11, and the two ends of the front side plate 16 and the rear side plate 17 extend to the first liquid outlet channel 14 and the second liquid outlet channel 15.
[0053] In this embodiment, there are multiple transverse connecting channels 121, which connect the inlet channel 13 and the first outlet channel 14, or the inlet channel 13 and the second outlet channel 15, at different positions. The cooling medium flows along the inlet channel 13, and the transverse connecting channels 121 at each part guide the cooling medium with a lower temperature in the inlet channel 13 to the first outlet channel 14 or the second outlet channel 15. Since the cooling medium guided by each transverse connecting channel 121 comes from the inlet channel 13, the temperature difference of the cooling medium is not large. Therefore, it is ensured that the temperature difference of each part of the heat dissipation core 1 is not large, and the uniformity of heat dissipation and cooling is improved.
[0054] In this embodiment, each independent transverse connecting channel 121 is perpendicular to the liquid inlet channel 13, and the liquid inlet channel 13 is parallel to the first liquid outlet channel 14 and the second liquid outlet channel 15.
[0055] In this embodiment, the fin 12 is plate-shaped. When the fin 12 is a flat plate, the transverse connecting channel 121 is a straight channel; when the fin 12 is a curved plate or a zigzag plate, the transverse connecting channel 121 is a tortuous channel. The tortuous channel has a better heat exchange effect than the straight channel because the cooling medium flowing through the tortuous channel will hit the side wall of the fin 12 when it travels, so that the cooling medium flows in turbulent flow.
[0056] In order to make the flow rate and velocity of the cooling medium more uniform at different locations, the width of the liquid inlet channel 13 gradually decreases along the direction of the cooling medium.
[0057] For example, the liquid inlet channel 13 is stepped along its length. The liquid inlet channel 13 is divided into four steps along its length. The width of the four steps decreases in turn, and the steps are connected one after another. The step with the largest width is close to the liquid inlet end of the liquid inlet channel 13.
[0058] For example, the liquid inlet channel 13 is wedge-shaped along its length, with the larger end of the wedge close to the liquid inlet end of the liquid inlet channel 13, so that the width of the liquid inlet channel 13 gradually decreases along the direction of the cooling medium.
[0059] In other embodiments, the width of the liquid inlet channel 13 along its length can also be in other forms such as arc or semi-arc.
[0060] The width of the liquid inlet channel 13 is 1–5 mm. For example, the liquid inlet channel 13 may be stepped along its length, and may consist of multiple steps, such as four steps. The width of the first step could be 4.5 mm, the width of the second step could be 3.5 mm, the width of the third step could be 2.5 mm, and the width of the fourth step could be 1.5 mm. Here, "multiple steps" refers to two or more steps.
[0061] Optionally, the heat dissipation core 1 is further provided with a third module unit 18 and a fourth module unit 19, both of which are composed of multiple fins 12 arranged in parallel and spaced apart. The third module unit 18 is located outside the first module unit 10, and the third module unit 18 and the first module unit 10 form a first liquid outlet channel 14; the fourth module unit 19 is located outside the second module unit 11, and the fourth module unit 19 and the second module unit 11 form a second liquid outlet channel 15.
[0062] The heat exchange device is described in detail below.
[0063] Currently, although fins are installed in the flow channels of liquid cooling plates to enhance the convective heat transfer coefficient and improve the heat transfer effect, the pressure drop of the cooling medium is large when it flows through the fin area. During the heat dissipation process, the equipment will be subjected to greater pressure, which may cause problems such as material deformation.
[0064] Referring to Figures 4 to 8, embodiments of this disclosure also provide a heat exchange device, including an upper substrate 2, a lower substrate 3, and the aforementioned heat dissipation core 1. The upper substrate 2 includes a cooling medium inlet 20 and a cooling medium outlet 21. The cooling medium inlet 20 is connected to the liquid inlet channel 13 of the heat dissipation core 1, and the cooling medium outlet 21 is connected to the first liquid outlet channel 14 and the second liquid outlet channel 15. The lower substrate 3 is sealed to the upper substrate 2, and the upper substrate 2 and the lower substrate 3 form a heat exchange chamber. The heat dissipation core 1 is located in the heat exchange chamber and is disposed on the lower substrate 3.
[0065] Optionally, the lower substrate 3 is a flat plate, and a placement area 30 is provided on one side of the lower substrate 3. The heat dissipation core 1 is fixed in the placement area 30, and the chip 4 is attached to the other side of the lower substrate 3. When the chip 4 generates heat, the heat is transferred to the heat dissipation core 1 through the lower substrate 3. It should be understood that the lower substrate 3 should have good thermal conductivity so as to quickly transfer the heat generated by the chip 4 to the heat dissipation core 1, thereby efficiently dissipating and cooling the chip 4.
[0066] The upper substrate 2 is stamped from a flat plate into a cover shape. The recessed side of the upper substrate 2 is connected to the lower substrate 3, thereby forming a heat exchange chamber. The heat dissipation core 1 is located in the heat exchange chamber. Cooling medium inlet 20 and cooling medium outlet 21 are provided at both ends of the upper substrate 2. Both the cooling medium inlet 20 and the cooling medium outlet 21 penetrate the upper substrate 2, and the openings of the cooling medium inlet 20 and the cooling medium outlet 21 face the lower substrate 3.
[0067] The upper substrate 2 has a tapered protrusion 22 on the recessed side wall. The heat dissipation core 1 is located between the tapered protrusion 22 and the lower substrate 3. The two ends of the tapered protrusion 22 are respectively connected to the two side walls of the recessed side of the upper substrate 2. The tapered protrusion 22 is a continuous and complete protrusion with a conical shape. The tapered protrusion 22 is connected to the upper surface of the heat dissipation core 1, so that the tapered protrusion 22 divides the heat exchange chamber into a first space and a second space. All of the liquid inlet channels 13 are located in the first space, and the first liquid outlet channel 14 and the second liquid outlet channel 15 are located in the second space. The first space is connected to the cooling medium inlet 20, and the second space is connected to the cooling medium outlet 21. The first space and the second space are connected through the liquid inlet channel 13 and the transverse connecting channel 121.
[0068] When the cooling medium is injected from the cooling medium inlet 20, the cooling medium first impacts the surface of the lower substrate 3, and then the cooling medium accumulates in front of the front side plate 16 of the heat dissipation core 1. After the liquid level of the cooling medium gradually rises until it overflows the upper end of the front side plate 16, the cooling medium impacts the liquid inlet channel 13 from the top of the heat dissipation core 1. The cooling medium impacting the bottom wall of the liquid inlet channel 13 flows to the transverse connecting channel 121.
[0069] It is worth mentioning that the cooling medium can only flow from the first space to the second space through the liquid inlet channel 13 of the heat dissipation core 1 into the transverse connecting channel 121.
[0070] Because the heat dissipation core 1 is provided with a rear side plate 17, the cooling medium in the first liquid outlet channel 14 and the second liquid outlet channel 15 cannot be discharged directly. Instead, it needs to overflow from the top of the first liquid outlet channel 14 and the second liquid outlet channel 15 into the second space. Then, the cooling medium passes over the upper end of the rear side plate 17 and finally gathers behind the rear side plate 17 and is discharged from the cooling medium outlet 21. The process of the cooling medium flowing out from the first liquid outlet channel 14 and the second liquid outlet channel 15 is a process in which the liquid level gradually increases.
[0071] The heat exchange device of the present disclosure changes the flow pattern of the cooling medium without adding additional components by providing a tapered protrusion 22 on the upper substrate 2 and a mutually perpendicular liquid inlet channel 13 and a transverse connecting channel 121 on the heat dissipation core 1, thereby reducing the heat exchange thermal resistance.
[0072] Optionally, there are multiple heat dissipation cores 1, which are spaced apart, and the liquid inlet channel 13 of each heat dissipation core 1 is in the same direction. There are also multiple tapered protrusions 22, and the positions of the multiple tapered protrusions 22 correspond to the multiple heat dissipation cores 1, so that the cooling medium can be reused.
[0073] In this embodiment, the heat dissipation core 1 is connected to the lower substrate 3, and the upper substrate 2 is connected to the lower substrate 3 by brazing. The third module unit 18 and the fourth module unit 19 of the heat dissipation core 1 are respectively connected to the side wall surface of the recessed side of the upper substrate 2.
[0074] In the heat dissipation core 1 of this embodiment, the distance from the liquid inlet channel 13 to the first liquid outlet channel 14 is L, and the distance from the liquid inlet channel 13 to the second liquid outlet channel 15 is l. Since L and l are equal, the flow path of the cooling medium is reduced, thereby achieving the effect of reducing pressure drop.
[0075] In this embodiment, the heat transfer energy of the cooling medium impact reduces the boundary layer thickness of the impacted wall, reduces the thermal resistance of forced convection heat transfer, and thus enhances the heat dissipation capacity.
[0076] The embodiments disclosed herein not only employ impact heat exchange, but also combine impact heat exchange with fin 12 heat exchange, thereby improving the heat exchange effect and addressing the problems of large pressure drop, large temperature difference of cooling medium, and low heat exchange efficiency in existing liquid cooling plates.
[0077] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims. Industrial applicability
[0078] The heat dissipation core includes a first module unit and a second module unit, which are spaced apart from each other and form a liquid inlet channel between them. The first module unit has a first liquid outlet channel at the end away from the liquid inlet channel, and the second module unit has a second liquid outlet channel at the end away from the liquid inlet channel. Both the first and second module units include multiple fins, which are arranged in parallel and spaced apart. The multiple fins form an angle with the liquid inlet channel, and a transverse connecting channel is formed between two adjacent fins. The transverse connecting channel connects the liquid inlet channel and the first liquid outlet channel, or connects the liquid inlet channel and the second liquid outlet channel, or the liquid inlet channel is simultaneously connected to both the first and second liquid outlet channels through the transverse connecting channel.
[0079] When the inlet channel is connected to the cooling medium, the cooling medium flows from the transverse connecting channel to either the first outlet channel or the second outlet channel. The distance traveled by the cooling medium from the inlet channel to the outlet is the same regardless of its location. At the same time, since the inlet channel is located between the first and second outlet channels, the temperature difference of the cooling medium flowing from the inlet channel into either transverse channel is low. Therefore, this heat dissipation core improves the problem of inconsistent heat dissipation efficiency in different parts, reduces the temperature difference between parts, and greatly improves the uniformity of heat dissipation.
Claims
1. A heat dissipation core, characterized in that, include: First module unit (10); The second module unit (11) is spaced apart from the first module unit (10), and a liquid inlet channel (13) is formed between the second module unit (11) and the first module unit (10); a first liquid outlet channel (14) is provided at the end of the first module unit (10) away from the liquid inlet channel (13), and a second liquid outlet channel (15) is provided at the end of the second module unit (11) away from the liquid inlet channel (13); both the first module unit (10) and the second module unit (11) include multiple fins (12), and multiple fins (12) are provided. The fins (12) are arranged in parallel and spaced apart. The plurality of fins (12) have an angle with the liquid inlet channel (13). A transverse connecting channel (121) is formed between two adjacent fins (12). The transverse connecting channel (121) connects the liquid inlet channel (13) with the first liquid outlet channel (14), or the transverse connecting channel (121) connects the liquid inlet channel (13) with the second liquid outlet channel (15), or the liquid inlet channel (13) is connected to both the first liquid outlet channel (14) and the second liquid outlet channel (15) through the transverse connecting channel (121).
2. The heat dissipation core according to claim 1, characterized in that, The width of the liquid inlet channel (13) gradually decreases along the direction of the cooling medium.
3. The heat dissipation core according to claim 2, characterized in that, The liquid inlet channel (13) is stepped along its length, and the width of the liquid inlet channel (13) gradually decreases along the direction of the cooling medium.
4. The heat dissipation core according to claim 2, characterized in that, The liquid inlet channel (13) is wedge-shaped along its length, and the width of the liquid inlet channel (13) gradually decreases along the direction of the cooling medium.
5. The heat dissipation core according to claim 1, characterized in that, The heat dissipation core (1) also includes a front side plate (16) and a rear side plate (17), which are respectively disposed at both ends of the liquid inlet channel (13).
6. The heat dissipation core according to claim 1, characterized in that, The transverse connecting channel (121) is perpendicular to the liquid inlet channel (13), the first liquid outlet channel (14) and the second liquid outlet channel (15).
7. The heat dissipation core according to any one of claims 1 to 6, characterized in that, The transverse connecting channel (121) is a tortuous channel.
8. The heat dissipation core according to any one of claims 1 to 7, characterized in that, The included angle between the plurality of fins (12) and the liquid inlet channel (13) is greater than 0° and less than or equal to 90°.
9. The heat dissipation core according to any one of claims 1 to 8, characterized in that, The number of the horizontal connecting channels (121) is multiple.
10. The heat dissipation core according to any one of claims 1 to 9, characterized in that, When the fin (12) is plate-shaped, the transverse connecting channel (121) is a straight channel.
11. The heat dissipation core according to any one of claims 1 to 10, characterized in that, The width of the liquid inlet channel (13) is 1mm-5mm.
12. The heat dissipation core according to any one of claims 1 to 11, characterized in that, The heat dissipation core (1) is also provided with a third module unit (18) and a fourth module unit (19), both of which are provided with a plurality of fins (12) arranged in parallel at intervals.
13. A heat exchange device, characterized in that, include: Upper substrate (2), lower substrate (3), and heat dissipation core (1) as described in any one of claims 1 to 12; The upper substrate (2) includes a cooling medium inlet (20) and a cooling medium outlet (21). The cooling medium inlet (20) is connected to the liquid inlet channel (13) of the heat dissipation core (1), and the cooling medium outlet (21) is connected to the first liquid outlet channel (14) and the second liquid outlet channel (15). The lower substrate (3) is sealed to the upper substrate (2), the upper substrate (2) and the lower substrate (3) form a heat exchange chamber, and the heat dissipation core (1) is located in the heat exchange chamber.
14. The heat exchange device according to claim 13, characterized in that, The upper substrate (2) is provided with a tapered protrusion (22). The heat dissipation core (1) is located between the tapered protrusion (22) and the lower substrate (3). The tapered protrusion (22) is connected to the heat dissipation core (1). The tapered protrusion (22) divides the heat exchange chamber into a first space and a second space. The first space is connected to the cooling medium inlet (20), and the second space is connected to the cooling medium outlet (21). The liquid inlet channel (13) is located in the first space, and the first liquid outlet channel (14) and the second liquid outlet channel (15) are located in the second space.
15. The heat exchange device according to claim 14, characterized in that, The number of heat dissipation cores (1) is multiple, and the multiple heat dissipation cores (1) are arranged at intervals; The number of tapered protrusions (22) is also multiple, and the positions of the multiple tapered protrusions (22) correspond to the multiple heat dissipation cores (1).