Electronic device

Abstract

Provided in the embodiments of the present application is an electronic device. The electronic device comprises a first housing, a heating element group, fans, and a heat dissipation module. The heating element group and the heat dissipation module are both disposed within the first housing. A plurality of heating elements in the heating element group do not include a processor. A fan is disposed on either side of the heating element group within the first housing. The first housing is provided with an air intake area at a position corresponding to an air inlet of each of the two fans, and the air inlet is in communication with the corresponding air intake area. First air outlets of the fans face the heating element group and are in communication with a first outlet. The heat dissipation module comprises a first heat pipe and a first thermally conductive plate connected to the first heat pipe, wherein the first heat pipe and the first thermally conductive plate at least cover a heating element, which is located in a middle region, in the heating element group, and two end portions of the first heat pipe are respectively arranged corresponding to the first air outlets of the two fans. The electronic device of the present application can take into account all heating elements other than the processor, so as to reduce the temperature of the surface of the electronic device.

Description

electronic devices

[0001] This application claims priority to Chinese patent application filed on February 8, 2025, with application number 202510146785.1 and entitled "Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, and in particular to an electronic device. Background Technology

[0003] To improve the heat dissipation performance of electronic devices, some devices incorporate active cooling systems. These systems effectively dissipate heat from the heat-generating components within the device. Electronic devices can include laptops, tablets, and similar devices.

[0004] Taking a laptop as an example, an active cooling structure mainly includes a substrate, heat pipes, a fan, and heat exchange fins. The substrate covers the heat-generating components on the circuit board of the laptop. These heat-generating components include the processor and other heat-generating elements. The heat pipes contact the substrate at the positions corresponding to the processor, and the fan and heat exchange fins are located at the ends of the heat pipes, connected to the ends of the heat pipes. The heat generated by the heat-generating components can be transferred to the substrate, and then through the substrate to the heat pipes and heat exchange fins. The airflow generated by the fan can carry away the heat from the heat exchange fins, and after the airflow flows to the outside of the first casing, it can dissipate heat from all the heat-generating components on the circuit board.

[0005] However, this active cooling structure of laptops is less efficient at cooling non-processor heat-generating components, which can still lead to excessively high surface temperatures on the laptop. Summary of the Invention

[0006] This application provides an electronic device that enables the heating elements in the heating element group, at least in the middle region, to exchange heat with the outside in a timely and effective manner, so as to reduce the temperature of the surface of the electronic device.

[0007] This application provides an electronic device, including:

[0008] The first housing has an air inlet area and a first outlet, and the air inlet area has a vent.

[0009] A heating element assembly is disposed within the first housing; the heating element assembly includes multiple heating elements, but the processor is not included among the multiple heating elements.

[0010] Along the length of the first housing, a fan is provided on each side of the heating element group inside the first housing. The fan is a centrifugal fan. The fan has an air inlet and a first air outlet. The first housing has an air inlet area at the position corresponding to the two air inlets. The air inlet is connected to the ventilation opening in the corresponding air inlet area. The first air outlet faces the heating element group and is connected to the first outlet.

[0011] A heat dissipation module is disposed inside the first housing. The heat dissipation module includes a first heat pipe and a first heat conduction plate. The first heat pipe and the first heat conduction plate at least cover the heating element in the middle area of ​​the heating element group, and the two ends of the first heat pipe are respectively arranged to correspond to the first air outlets of the two fans; the first heat conduction plate is connected to the first heat pipe.

[0012] By configuring the first heat pipe and the first heat-conducting plate, the heat from the heating elements in the heating element group, at least in the middle region, is concentrated at both ends of the first heat pipe. Furthermore, the two ends of the first heat pipe are respectively positioned to correspond to the first air outlets of two fans. This allows the airflow from the two fans at the first air outlets to carry away the heat concentrated at both ends of the first heat pipe, effectively dissipating heat from the heating elements in the heating element group, at least in the middle region. This ensures that the heating elements in the heating element group, at least in the middle region, can exchange heat effectively with the external air of the electronic device, preventing the surface temperature of the electronic device, especially the surface of the second casing, from becoming too high, and also preventing excessive air resistance.

[0013] Furthermore, the heat from the heating element covered by the first heat pipe in the heating element assembly can be transferred to the first heat pipe along the thickness direction of the first housing, which can reduce the thermal resistance of the heating element covered by the first heat pipe in the length and width directions of the first housing, thereby reducing the thermal resistance of the heating element covered by the first heat pipe in the heat dissipation path. Moreover, the heat transferred to the first heat pipe can be evenly collected at both ends of the first heat pipe along its extension direction and dissipated through the first air outlets of the two fans, which can improve the heat dissipation effect of the heating element in the heating element assembly and reduce the temperature of the first housing and the surface of the electronic device.

[0014] In some embodiments, the first heat pipe can cover part of the heating elements in the heating element group, and the first heat-conducting plate can cover the remaining heating elements in the heating element group. This arrangement of the first heat pipe and the first heat-conducting plate allows for coverage of all heating elements in the heating element group, ensuring comprehensive heat dissipation for all elements and further improving the heat dissipation effect, thereby further reducing the temperature of the first housing and the surface of the electronic device.

[0015] In some embodiments, the first heat pipe has a connecting portion that covers part of the heating element in the heating element group. Along the width direction of the first housing, the first air outlets of the two fans are located on one side of the connecting portion, and the two ends of the first heat pipe are located on the side of the connecting portion facing the two first air outlets, so that while the first heat pipe covers the connecting portion, the two ends of the first heat pipe can be respectively located at the corresponding first air outlet.

[0016] In some embodiments, the electronic device further includes a circuit board disposed within a first housing. The first housing has a bottom shell and a housing body disposed opposite each other in the thickness direction, and a heating element assembly is disposed on the side of the circuit board facing the bottom shell.

[0017] The first housing has a first air duct located at a position opposite to the end of the first heat pipe, and at least a portion of the first air duct is located between the bottom housing and the first heat pipe.

[0018] The two fans share a first outlet, and the first air duct connects the first outlet to the adjacent first air outlet.

[0019] By setting up the first air duct, the airflow from the first air outlet of the two fans can flow in their respective first air ducts and then flow to the outside of the first housing through the same first outlet. This allows the airflow from the first air outlet to be guided by the first air duct, while reducing the number of openings on the first housing.

[0020] In some embodiments, the heat dissipation module further includes a first heat exchanger, wherein the end of the first heat pipe is provided with the first heat exchanger on the side facing the bottom shell;

[0021] The first heat exchanger includes multiple heat exchange sections connected to the ends of the first heat pipe. The heat exchange sections are arranged opposite to the first air outlet and located in the first air duct.

[0022] This allows heat from the heating element assembly to be collected at the end of the first heat pipe and then transferred to the heat exchange section. The multiple heat exchange sections increase the heat exchange area of ​​the first heat exchanger within the first air duct. When the airflow from the fan at the first outlet enters the first air duct, it exchanges heat with multiple heat exchange sections, dissipating heat from the heating elements before being discharged to the outside of the first housing through the first outlet. This ensures that all heating elements in the heating element assembly can effectively and promptly exchange heat with the external air of the electronic device.

[0023] Furthermore, by setting the first heat exchanger, without affecting the overall airflow of the fan, the heat exchanger can increase the resistance of the fan when it exits from the first air outlet. This can prevent the airflow from the first air outlet from being too large and affecting the airflow of the fan at the second air outlet, thus ensuring the heat dissipation efficiency of the airflow flowing out of the second air outlet on the processor, and at the same time ensuring the heat dissipation efficiency of the airflow flowing out of the first air outlet on the heat dissipation components in the heat dissipation component group.

[0024] In some embodiments, the first heat exchanger further includes a heat exchange body, which is connected to the side of the end of the first heat pipe facing the bottom shell and is disposed opposite to the first air outlet.

[0025] The heat exchange section is located on the side of the heat exchange body facing the bottom shell, and there is a gap between adjacent heat exchange sections.

[0026] By configuring the heat exchange body, the heat exchange section can be connected to the end of the first heat pipe, allowing the heat collected at the end of the first heat pipe to be transferred to the heat exchange section through the heat exchange body. The gap between adjacent heat exchange sections allows airflow within the first air duct to flow between adjacent heat exchange sections, increasing the heat exchange area between the heat exchange section and the airflow, and improving the heat dissipation efficiency of the heating elements in the heating element group.

[0027] In some embodiments, the gap between the heat exchange section and the bottom shell along the thickness direction of the first shell is greater than 0.2 mm and less than 0.8 mm. This avoids the heat exchange section affecting the temperature of the first shell in the bottom shell, ensuring that the heat dissipation module is installed in the first shell, while also ensuring that the heat exchange section has sufficient heat exchange area to ensure the heat dissipation efficiency of the heat-generating elements in the heat-generating element group.

[0028] In some embodiments, along the length direction of the first housing:

[0029] The fan is located on the side of the heating element group facing the outside of the first housing, and the distance between the first heat exchange element and the fan is less than 0.5 mm;

[0030] Along the width direction of the first housing:

[0031] The dimensions of the first heat exchanger in the width direction of the first housing are matched with the first air outlet.

[0032] In this way, when the distance between the first heat exchanger and the fan is less than or equal to 0.5mm, the distance between the first heat exchanger and the fan can be smaller, so as to ensure that more air flowing out of the first air outlet enters the first air duct and exchanges heat with the first heat exchanger, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat-generating elements in the heat-generating element group.

[0033] In some embodiments, multiple heat exchange units are arranged in an array on the heat exchange body to make the arrangement of the heat exchange units on the heat exchange body more uniform. This not only enhances the resistance of the heat exchange units to the airflow from the fan at the first air outlet, but also facilitates the distribution of the airflow from the fan at the first air outlet and the second air outlet.

[0034] In some embodiments, a second air duct is provided inside the first housing at a position opposite to the end of the first heat pipe, and the second air duct is located between the first heat pipe and the circuit board;

[0035] One end of the second air duct is connected to the adjacent first air outlet, and the other end of the second air duct is connected to the first outlet and the adjacent first air duct.

[0036] By setting up the second air duct, the airflow in the second air duct merges with the airflow in the first air duct and exchanges heat, which can reduce the temperature of the hot air in the first air duct, thereby reducing the temperature of the main body or bottom shell of the first shell on the rotating shaft side.

[0037] In some embodiments, a third air duct is provided inside the first housing at a position opposite to the end of the first heat pipe. The third air duct is located between the circuit board and the housing body, and the third air duct connects the first outlet and the two first air outlets.

[0038] With the third air duct, the airflow from the first air outlet of the two fans can also flow along the corresponding third air duct toward the first outlet to the outside of the first housing, so as to reduce the temperature of the keyboard surface on the main body of the first housing.

[0039] In some embodiments, the electronic device further includes an air guide assembly, which includes a first air guide, a second air guide, and a third air guide. The first air guide is disposed between the end of the first heat pipe and the bottom shell, and together with the bottom shell, forms a first air duct.

[0040] The second air guide is located between the end of the first heat pipe and the circuit board, and the second air guide, the end of the first heat pipe, and the circuit board form a second air duct.

[0041] The third air guide is located between the circuit board and the main body of the housing, and the third air guide, the circuit board, and the main body of the housing form a third air duct.

[0042] In some embodiments, the first heat-conducting plate is connected to the first heat exchanger so that the heat on the first heat-conducting plate is also transferred to the first heat exchanger, so that the heat dissipation module has better heat dissipation efficiency and heat dissipation effect for the heat-generating elements in the heat-generating element group.

[0043] In some embodiments, the air intake area is located opposite the air inlet on the bottom shell;

[0044] The first housing has a user side and a pivot side in the width direction. The pivot side is used to mount the pivot. At least part of the first opening is located on the pivot side of the first housing opposite to the heating element group. In this way, the airflow in the two first air ducts can flow out from the first opening after exchanging heat with the first heat exchanger in their respective air ducts, so that all heating elements in the heating element group can exchange heat with the external air of the electronic device in a timely and effective manner.

[0045] In some embodiments, the electronic device further includes a circuit board disposed within a first housing. The first housing has a bottom shell and a housing body disposed opposite each other in the thickness direction, and a heating element assembly is disposed on the side of the circuit board facing the bottom shell.

[0046] The first housing has a first air duct located at a position opposite to the end of the first heat pipe, and at least a portion of the first air duct is located between the bottom housing and the first heat pipe.

[0047] The first opening is located on the bottom shell near the first air outlet, and the bottom shell has a first opening at the position of the first air outlet corresponding to the two fans. The first air duct connects the adjacent first outlet and the adjacent first air outlet.

[0048] With this configuration, the first opening can be adjusted from the pivot side to a position near the first air outlet on the bottom shell, and the two fans can each exhaust air through a corresponding first opening, shortening the path from the first air outlet to the first outlet. This allows the airflow in the first air duct to dissipate heat from the heat-generating elements in the heat-generating element group and then flow directly from the first opening to the outside of the first shell, which can significantly reduce the surface temperature of the first shell at the pivot position.

[0049] In some embodiments, the air intake area is located at the edge of the first housing in the longitudinal direction, so that the air intake area is far away from the first outlet, so as to avoid the airflow from the first outlet not exchanging heat with the air outside the first housing and directly flowing back into the fan through the air intake area, affecting the heat dissipation efficiency and heat dissipation effect of the fan on the heat dissipation elements in the heat dissipation element group.

[0050] In some embodiments, the heat dissipation module further includes a second heat exchanger, which is disposed opposite to the first air outlet and is connected to the end of the first heat pipe facing the bottom shell.

[0051] The second heat exchanger has multiple sub-air ducts, which are connected to the first air duct and the first air outlet corresponding to the end of the first heat pipe.

[0052] By configuring the second heat exchanger, the heat from the heating element group is collected at the end of the first heat pipe and then transferred to the second heat exchanger. The multiple sub-air ducts within the second heat exchanger increase its heat exchange area and allow the first air duct to connect to the adjacent first air outlet via the sub-air ducts. Thus, when the airflow from the fan at the first air outlet enters the sub-air duct, it exchanges heat with the multiple second heat exchangers, dissipating heat from the heating elements before being discharged outside the first housing through the first air duct and the first outlet.

[0053] In some embodiments, the second heat exchanger includes a heat exchange shell and a plurality of heat dissipation fins, and the side of the heat exchange shell facing the first air outlet has an air inlet.

[0054] Multiple heat dissipation fins are located inside the heat exchange shell, dividing the space inside the heat exchange shell into multiple sub-air ducts. One end of each sub-air duct is connected to the first air outlet. The side of the heat exchange shell facing the bottom shell has a connecting port, which connects the other end of the sub-air duct and the first air duct.

[0055] By configuring the heat dissipation fins and heat exchange shell, a second heat exchanger with multiple sub-channels is formed, resulting in a larger heat exchange area compared to the first heat exchanger, thus improving the heat dissipation efficiency of the heat-generating elements in the heat-generating element group. Furthermore, the connection port allows the sub-channels to connect with the first channel, enabling the airflow within the sub-channels to enter the first channel after heat exchange through the connection port.

[0056] In some embodiments, the heat dissipation fins are inclined inside the heat exchange shell so that the direction of the sub-air duct matches the direction of the airflow from the first air outlet. This reduces the air resistance of the airflow from the first air outlet in the sub-air duct, allowing the airflow from the first air outlet to flow more smoothly in the sub-air duct.

[0057] In some embodiments, the first housing has a third outlet, and the two fans share one third outlet;

[0058] The first housing has a second air duct located at a position opposite to the end of the first heat pipe. The second air duct is located between the first heat pipe and the circuit board, and the second air duct connects the third outlet and the adjacent first air outlet.

[0059] With the second air duct, the airflow from the first air outlet of the two fans can also flow along the corresponding second air duct toward the third outlet to the outside of the first housing (i.e., the environment), so that the airflow (cold air) in the second air duct and the airflow (hot air) after heat exchange in the first air duct do not interfere with each other, so as to avoid affecting the heat dissipation efficiency of the heat-generating elements in the heat-generating element group.

[0060] In some embodiments, the first housing has a user side and a pivot side in the width direction, the pivot side being used to mount a pivot, and at least a portion of the third outlet is located on the first housing on the pivot side opposite to the heating element. This reduces the temperature of the heating element in the heating element group while simultaneously lowering the temperature of the main body or bottom shell of the first housing on the pivot side.

[0061] In some embodiments, a third air duct is provided inside the first housing, the third air duct is located between the circuit board and the housing body, and the third air duct connects the third outlet and the two first air outlets.

[0062] With the third air duct, the airflow from the first exhaust vents of the two fans can also flow along the corresponding third air duct towards the third outlet to the outside of the first housing, thereby reducing the temperature of the keyboard surface on the main body of the first housing. Furthermore, the second active cooling structure also utilizes the first, second, and third air ducts, allowing the airflow from the first exhaust vent of the fans to flow along three different air ducts, with hot and cold air not interfering with each other, thus achieving different purposes.

[0063] In some embodiments, the electronic device further includes an air guide assembly, which includes a fourth air guide, a fifth air guide, a sixth air guide, and a seventh air guide.

[0064] Along the length of the first shell, the fourth air guide and the fifth air guide are spaced apart between the end of the first heat pipe and the bottom shell, and the fourth air guide and the fifth air guide together with the bottom shell form a first air duct.

[0065] The sixth air guide is located between the end of the first heat pipe and the circuit board, and the sixth air guide, the first heat pipe and the circuit board form a second air duct.

[0066] The seventh air guide is located between the circuit board and the main body of the housing, and together with the circuit board and the main body of the housing, they form a third air duct.

[0067] In some embodiments, the first heat-conducting plate includes a copper plate or an aluminum plate. When the first heat-conducting plate is an aluminum plate, it can reduce the weight of the heat dissipation module while meeting the heat dissipation requirements of the electronic device for the heat-generating components in the heat-generating component group, thus contributing to the lightweight design of the electronic device.

[0068] In some embodiments, the heat-generating element includes at least one of the following: a power supply element for the processor, a power supply element for the video memory module, a video memory module, and a charging element. The power supply element for the processor and the power supply element for the video memory module both include a power supply inductor and a power supply field-effect transistor. The charging element includes a charging inductor and a charging field-effect transistor.

[0069] At least one of the power supply field-effect transistor, the charging field-effect transistor, and the memory module is covered by a first heat pipe. The first heat pipe enables heat dissipation for at least one of the power supply field-effect transistor, the charging field-effect transistor, and the memory module.

[0070] At least one of the power supply inductor and the charging inductor is covered by a first heat-conducting plate. The first heat-conducting plate enables heat dissipation for at least one of the power supply inductor and the charging inductor.

[0071] In some embodiments, the electronic device further includes a processor disposed within the first housing and located between the two fans;

[0072] The fan also has a second air outlet, and the housing has a second outlet opposite to the second air outlet;

[0073] The heat dissipation module also includes a second heat conduction plate, a second heat pipe and two heat sinks. A heat sink is provided between the second air outlet of each of the two fans and the corresponding second outlet. The second heat conduction plate covers the processor, and part of the second heat pipe covers the second heat conduction plate. The two ends of the second heat pipe extend to the two second air outlets and are connected to the heat sinks provided at the second air outlets.

[0074] At least one end of the first heat pipe is connected to the second heat pipe.

[0075] By incorporating a first and a second air outlet, the airflow characteristics of the individual fan can be improved by approximately 15%-30%, thereby enhancing fan performance. Furthermore, the arrangement of the first and second heat pipes ensures that the heat-generating elements in the heat-generating component group are not limited by the heat transfer capacity of the second heat pipe during heat dissipation. This improves the heat dissipation effect on the heat-generating components, preventing excessively high temperatures on the surface of the electronic device, especially on the surface of the second casing.

[0076] Since the first air outlet is located on the side of the fan facing the heating element and on the side facing the inside of the first housing, the first air outlet can be called the inner air outlet of the fan. By setting the first air outlet as the inner air outlet of the fan, the thickness of the first housing at the edge will not be affected.

[0077] At least one end of the first heat pipe is connected to the second heat pipe, which also allows the heat on the first and second heat pipes to be conducted to each other, thereby improving the temperature uniformity of the heat dissipation module and making the temperature on the surface of the second shell more uniform. Attached Figure Description

[0078] Figure 1 is a schematic diagram of the structure of an electronic device in the open state provided in an embodiment of this application from a first perspective;

[0079] Figure 2 is a schematic diagram of the structure of an electronic device in the open state provided in an embodiment of this application from a second perspective;

[0080] Figure 3 is a schematic diagram of an active heat dissipation structure in an electronic device provided in the related art;

[0081] Figure 4 is a structural schematic diagram of an electronic device provided in an embodiment of this application, in the portion where the first housing is located;

[0082] Figure 5a is an exploded view of the portion of an electronic device containing a first housing according to an embodiment of this application;

[0083] Figure 5b is a partial exploded view of the portion of an electronic device containing a first housing according to an embodiment of this application;

[0084] Figure 6 is a schematic diagram of the structure of an electronic device within a first housing according to an embodiment of this application;

[0085] Figure 7 is a schematic diagram of the structure of an electronic device within a first housing according to an embodiment of this application;

[0086] Figure 8 is a cross-sectional view of Figure 4 in the AA direction;

[0087] Figure 9 is a schematic diagram of the structure of an electronic device within a first housing according to an embodiment of this application;

[0088] Figure 10 is a schematic diagram of the structure of another electronic device provided in an embodiment of this application, in the portion where the first housing is located;

[0089] Figure 11 is an exploded view of the part of the electronic device in Figure 10 where the first housing is located;

[0090] Figure 12 is a schematic diagram of the structure of the electronic device in Figure 10 within the first housing;

[0091] Figure 13 is a schematic diagram of the heating element and the second type of active heat dissipation structure in Figure 10.

[0092] Figure 14 is a cross-sectional view of the electronic device in Figure 10 in the BB direction;

[0093] Figure 15 is an enlarged view of point C in Figure 12.

[0094] Figure label:

[0095] 10-Electronic devices;

[0096] 20-First housing; 2a-Bottom housing; 2b-Housing body; 2c-User side; 2d-Shaft side; 21-Air inlet area; 22-First outlet; 23-Second outlet; 24-Third outlet; 25-First air duct; 26-Second air duct; 27-Third air duct;

[0097] 30 - Circuit board assembly; 31 - Circuit board; 32 - Processor; 33 - Heat-generating element group; 331 - Power supply inductor; 332 - Power supply field-effect transistor;

[0098] 40 - Second shell;

[0099] 50 - Display screen; 51 - Display surface;

[0100] 60-substrate;

[0101] 70 - Fan; 7a - First fan; 7b - Second fan; 71 - Air inlet; 72 - First air outlet; 73 - Second air outlet;

[0102] 80-Heat exchange fins;

[0103] 90 - Heat pipe; 91 - First heat pipe; 911 - Connecting part; 912 - First end; 913 - Second end; 92 - Second heat pipe;

[0104] 100 - First heat-conducting plate;

[0105] 200 - Second heat-conducting plate;

[0106] 300 - Heat sink;

[0107] 400 - First heat exchanger; 410 - Heat exchange section; 420 - Main heat exchanger body;

[0108] 500 - Second heat exchanger; 510 - Heat exchanger shell; 511 - Opening; 520 - Heat dissipation fins; 530 - Sub-air duct;

[0109] 600 - Air guide assembly; 610 - First air guide component; 620 - Second air guide component; 630 - Third air guide component; 640 - Fourth air guide component; 650 - Fifth air guide component; 651 - Inclined surface; 660 - Sixth air guide component; 670 - Seventh air guide component;

[0110] 700 - Windshield. Detailed Implementation

[0111] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0112] This application provides an electronic device. The electronic device provided in this application can be a portable electronic device. Portable electronic devices can include, but are not limited to, laptops, tablets (i.e., pads), and other electronic devices that use internal fans for active cooling and are easy for users to carry.

[0113] Figures 1 and 2 show schematic diagrams of an electronic device 10 in its open state from different perspectives. The electronic device 10 shown in Figures 1 and 2 is a laptop computer. The following description uses a laptop computer as an example and, in conjunction with Figures 1 and 2, further elaborates on the structure of the electronic device 10.

[0114] Referring to Figures 1 and 2, the electronic device 10 includes a first housing 20 and a circuit board assembly 30, with the circuit board assembly 30 disposed within the first housing 20. The circuit board assembly 30 is one of the core components of the electronic device 10, enabling functions such as data processing and computation, image processing, power management, and storage.

[0115] The circuit board assembly 30 includes a circuit board 31 and multiple electronic components. The electronic components are disposed on the circuit board 31. Among the multiple electronic components are some heat-generating components and some non-heat-generating components. For example, heat-generating components may include a processor 32, a video memory module (VRAM), capacitors, charging components, power supply components for the processor 32, and power supply components for the video memory module, etc. Non-heat-generating components may include capacitors.

[0116] The processor 32 includes a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU). The CPU serves as the core of the electronic device 10 for computation and control, primarily handling data processing and calculations within the device. The GPU serves as the core of the electronic device 10 for image processing, mainly handling data processing and other tasks. Some GPUs may be equipped with a video memory module to store graphics data.

[0117] The power supply components of the processor 32 include a power supply inductor 331 and a power supply field-effect transistor 332. The power supply field-effect transistor 332 of the processor 32 refers to a metal-oxide-semiconductor field-effect transistor (MOS) that supplies power to the processor 32. For example, the power supply inductor 331 includes the power supply inductor 331 for the central processing unit (CPU) and the power supply inductor 331 for the graphics processing unit (GPU). Similarly, the power supply field-effect transistor 332 includes the power supply field-effect transistor 332 for the CPU and the power supply field-effect transistor 332 for the graphics processing unit (GPU).

[0118] The power supply components for the video memory module also include a power supply inductor 331 and a power supply field-effect transistor 332.

[0119] Charging components are mainly used in the battery charging circuit of electronic device 10 and are part of the power management system of electronic device 10. For example, charging components include charging inductors, charging metal-oxide-semiconductor field-effect transistors (referred to as charging MOS), etc.

[0120] Referring to Figure 1, the first housing 20 has a bottom shell 2a and a main body 2b disposed opposite each other in the thickness direction. The electronic device 10 may also include a keyboard and a touchpad. The keyboard and touchpad, as two different input modules in the electronic device 10, such as a laptop computer, can both be embedded in the main body 2b of the first housing 20 and electrically connected to the circuit board 31. When operating the keyboard and touchpad, the user can issue commands or input data to the electronic device 10 through the keyboard and touchpad.

[0121] Referring to Figures 1 and 2, the first housing 20 has a user side 2c and a pivot side 2d in the width direction. The electronic device 10 also includes a pivot mounted on the pivot side 2d of the first housing 20 and connected to a screen component, allowing the screen component to be rotatably connected to the first housing 20. When the screen component rotates relative to the first housing 20 about the pivot, it can change the configuration of the electronic device 10. For example, when the screen component rotates about the pivot relative to the first housing 20 to a certain angle, the electronic device 10 can be in an open state (as shown in Figures 1 and 2). Alternatively, when the screen component rotates about the pivot relative to the first housing 20 to be stacked on top of the first housing 20, the electronic device 10 can be in a closed state.

[0122] Referring to Figure 1, the screen assembly includes a second housing 40 and a display screen 50. The display screen 50 includes a display surface 51 and a non-display surface 51 disposed opposite to each other. The display screen 50 is installed inside the second housing 40, and the display surface 51 is exposed on the side of the second housing 40 facing the first housing 20.

[0123] It should be noted that when the electronic device 10 is a tablet computer, the electronic device 10 does not include the second housing 40, keyboard, touchpad, and hinge. The display screen 50 replaces the keyboard and touchpad and is installed on the main body 2b of the first housing 20. In this case, the display screen 50 can be a touch display screen 50, allowing the user to issue commands or input data to the electronic device 10 through the touch display screen 50 when operating on it.

[0124] The following text continues to use a laptop computer as an example to further explain the structure of electronic device 10.

[0125] Referring to Figures 1 and 2, the side of the screen assembly facing away from the display screen 50 forms side A of the electronic device 10. The side of the screen assembly where the display screen 50 is located forms side B of the electronic device 10. The side of the housing body 2b where the keyboard and touchpad are located constitutes side C of the electronic device 10, and the side of the bottom shell 2a facing away from the housing body 2b constitutes side D of the electronic device 10.

[0126] The processor 32, its power supply components, and the video memory module are the main heat sources in the circuit board assembly 30. When these heat-generating components generate heat, they dissipate a large amount of heat. If this heat is not dissipated in time, the surface of the first housing 20 will have a high temperature, affecting the normal operation of the electronic device 10.

[0127] Therefore, some existing electronic devices 10 are equipped with an active heat dissipation structure, which can dissipate heat from the heat-generating components inside the first housing 20.

[0128] Figure 3 shows a schematic diagram of an active heat dissipation structure within an electronic device 10 provided in the prior art.

[0129] Referring to Figure 3, the active cooling structure mainly includes a substrate 60, a heat pipe 90, a fan 70, and heat exchange fins 80. The fan 70 is a centrifugal fan. The substrate 60 covers the heat-generating element, and the heat pipe 90 contacts the substrate 60 at the position corresponding to the processor 32. The fan 70 and the heat exchange fins 80 are located at the ends of the heat pipe 90, and the heat exchange fins 80 are connected to the ends of the heat pipe 90. The heat generated by the heat-generating element can be transferred to the substrate 60, and then to the heat pipe 90 through the substrate 60. After the heat from the heat-generating element is transferred to the heat pipe 90, it will be transferred sequentially along the extension direction of the heat pipe 90 to the ends of the heat pipe 90 and the heat exchange fins 80. The airflow generated by the fan 70 can carry away the heat on the heat exchange fins 80, and after the airflow flows to the outside of the first housing 20, it dissipates heat from the heat-generating element and reduces the surface temperature of the electronic device 10.

[0130] It should be noted that the unit consisting of heat-generating components on circuit board 31 other than processor 32 is called heat-generating component group 33. That is to say, heat-generating component group 33 does not include processor 32. For example, the heat-generating components in heat-generating component group 33 may include power supply components for processor 32, power supply components for video memory module, video memory module, and charging components, etc.

[0131] The active cooling structure shown in Figure 3 has low heat dissipation efficiency for heat-generating components on the circuit board 31 other than the processor 32, still resulting in excessively high surface temperatures for the laptop. This is because the active cooling structure is affected by multiple factors, including contact thermal resistance, heat pipe 90 thermal resistance, fin heat dissipation area, and fan 70 performance. The heat-generating components in the heat-generating component group 33 have relatively long thermal resistances along their heat dissipation paths, including from the heat-generating component to the substrate 60, from the substrate 60 to the heat pipe 90, and from the heat pipe 90 to the heat exchange fins 80. This not only generates significant contact thermal resistance but also increases the thermal resistance of the heat pipe 90. Furthermore, during the process from the heat-generating component to the heat pipe 90, the heat from the heat-generating component must first be conducted along the thickness direction of the first housing 20 to the substrate 60, and then along the surface of the substrate 60 to the heat pipe 90. This results in a large thermal resistance transferred from the heating elements in the heating element group 33 to the heat pipe 90. Furthermore, due to the limited thermal conductivity of the heat pipe 90, the heat pipe 90 will preferentially conduct heat from the processor 32, i.e., preferentially dissipate heat from the processor 32. This prevents the heat from the heating elements in the heating element group 33 from exchanging heat with the external air of the electronic device 10 in a timely and effective manner, causing the surface temperature of the electronic device 10 to be too high, especially the surface temperature of the second housing 40.

[0132] Therefore, based on the active heat dissipation structure in Figure 3, the related technology modifies the fan 70 into a dual-outlet fan 70. The dual outlets of the fan 70 include a second outlet 73 and a first outlet 72. The second outlet 73 faces the shaft side 2d, and the first outlet 72 faces the interior of the first housing 20 and is arranged opposite to the heat-generating element group 33, i.e., the inner outlet.

[0133] Compared to the existing active cooling structure in related technologies (Figure 3), the design of the first air outlet 72 allows the airflow from the first air outlet 72 to directly pass through the heating elements in the heating element group 33. This significantly reduces the thermal resistance of the heating elements in the heating element group 33 along the heat dissipation path, thereby improving the heat dissipation efficiency of the heating elements. Although the thermal resistance of the heat dissipation path is minimized, the very small gaps between the heating elements in the heating element group 33 result in relatively high air resistance. This means that the airflow from the first air outlet 72 can only pass through the heating elements near the edge of the heating element group 33, making it difficult to cover the heating elements near the center of the heating element group 33. This still leads to excessively high surface temperatures on the electronic device 10, especially on the surface of the second housing 40.

[0134] In view of this, the electronic device 10 provided in this application embodiment is equipped with another novel active heat dissipation structure. This novel active heat dissipation structure includes a heat dissipation module and two fans. The two fans are located on both sides of the heat-generating element group, and the first air outlets of the fans both face the heat-generating element group, which can be regarded as inner air outlets. The heat dissipation module includes a first heat pipe and a first heat-conducting plate. The first heat pipe and the first heat-conducting plate can cover at least part of the heat-generating elements in the heat-generating element group. The heat of the heat-generating elements covered by the first heat pipe and the heat-generating elements covered by the first heat-conducting plate will be concentrated at the two ends of the first heat pipe in different directions. Furthermore, the first air outlets of the two fans can correspond to the two ends of the first heat pipe respectively, so that the airflow flowing out of the first air outlets of the fans can carry away the heat concentrated at the corresponding ends of the first heat pipe. In this way, while dissipating heat from all the heat-generating elements in the heat-generating element group, it can also reduce the thermal resistance of the heat-generating elements in the heat-generating element group on the heat dissipation path, improve the heat dissipation effect of the heat-generating elements in the heat-generating element group, and thus effectively reduce the temperature of the first casing and the surface of the electronic device, improve the service life of the electronic device and the user experience.

[0135] The following description, in conjunction with the accompanying drawings and embodiments, further elaborates on a novel active heat dissipation structure provided in this application.

[0136] Figure 4 shows a partial structural schematic diagram of an electronic device 10, and Figure 5a shows an exploded view of the part where the first housing 20 is located in the electronic device 10.

[0137] Referring to Figures 4 and 5a, the electronic device 10 includes a first housing 20 having an air inlet area 21 and a first outlet 22. The air inlet area 21 has a vent for air intake. For example, the air inlet area 21 may have at least one vent. The vent may be a rectangular opening, a circular opening, etc. The first outlet 22 is for air exhaust.

[0138] Figure 5b shows a partial exploded view of the portion of an electronic device 10 containing the first housing 20.

[0139] Referring to Figures 5a and 5b, the electronic device 10 also includes a heating element group 33, which is disposed within the first housing 20. The heating element group 33 includes a plurality of heating elements, but the processor 32 is not included among the plurality of heating elements.

[0140] Referring to Figures 5a and 5a, the electronic device 10 also includes a fan 70. Along the length of the first housing 20, a fan 70 is respectively provided on both sides of the heat-generating element group 33. The length of the first housing 20 can be seen in the X direction. The fan 70 is a centrifugal fan, having an air inlet 71 and a first air outlet 72. The first housing 20 has an air inlet area 21 corresponding to each of the two air inlets 71. The air inlet 71 communicates with the ventilation opening in the corresponding air inlet area 21, so that airflow from outside the electronic device 10 enters the corresponding fan 70 through the ventilation opening and the air inlet 71, and flows out from the first air outlet 72. The first air outlet 72 faces the heat-generating element group 33 and communicates with the first outlet 22, so that the airflow from the first air outlet 72 can blow towards the heat-generating element group 33 and flow out from the first outlet 22 to the outside of the first housing 20, dissipating heat from the heat-generating elements in the heat-generating element group 33.

[0141] The electronic device 10 also includes a heat dissipation module disposed within the first housing 20. The heat dissipation module includes a first heat pipe 91 and a first heat-conducting plate 100. The first heat pipe 91 and the first heat-conducting plate 100 at least cover the heat-generating elements in the central region of the heat-generating element group 33. That is, the heat-generating elements in at least the central region of the heat-generating element group 33 are covered by the first heat pipe 91 and the first heat-conducting plate 100. For example, the first heat pipe 91 may cover at least a portion of the heat-generating elements in the central region of the heat-generating element group 33, and the first heat-conducting plate 100 may cover another portion of the heat-generating elements in the central region of the heat-generating element group 33. The central region refers to the area located at the center of the heat-generating element group 33 and at a distance from the edge of the heat-generating element group 33 when all the heat-generating elements of the non-processor 32 constitute a unit.

[0142] The two ends of the first heat pipe 91 are respectively positioned corresponding to the first air outlets 72 of the two fans 70. Furthermore, the first heat-conducting plate 100 is connected to the first heat pipe 91.

[0143] By covering the heating elements of the heating element group 33, at least in the middle region, with the first heat pipe 91 and the first heat-conducting plate 100, the heat from the heating elements covered by the first heat pipe 91 is transferred to the first heat pipe 91 and then along its extension direction to both ends of the first heat pipe 91. Similarly, the heat from the heating elements covered by the first heat-conducting plate 100 is transferred to the first heat-conducting plate 100. Furthermore, since the first heat-conducting plate 100 is connected to the first heat pipe 91, the heat from the heating elements covered by the first heat-conducting plate 100 is transferred to the first heat pipe 91 through the first heat-conducting plate 100 and then along its extension direction to both ends of the first heat pipe 91. This ensures that the heat from the heating elements in the heating element group 33, at least in the middle region, is concentrated at both ends of the first heat pipe 91.

[0144] Based on this, the two ends of the first heat pipe 91 are respectively set to correspond to the first air outlets 72 of the two fans 70. In this way, the airflow from the two fans 70 at the first air outlets 72 can respectively carry away the heat concentrated at the two ends of the first heat pipe 91, which can dissipate heat from the heating element group 33 at least in the middle area. This allows the heating element group 33 at least in the middle area to exchange heat with the external air of the electronic device 10 in a timely and effective manner, avoiding excessive temperature on the surface of the electronic device 10, especially the surface temperature of the second housing 40, and also avoiding excessive wind resistance.

[0145] Compared to the active heat dissipation structure of the prior art mentioned above (shown in Figure 3), in this embodiment, the heat from the heating element covered by the first heat pipe 91 in the heating element group 33 can be transferred to the first heat pipe 91 along the thickness direction of the first housing 20. This reduces the thermal resistance of the heating element covered by the first heat pipe 91 in the length and width directions of the first housing 20, thereby reducing the thermal resistance of the heating element covered by the first heat pipe 91 in the heat dissipation path. Furthermore, the heat transferred to the first heat pipe 91 can be evenly collected at both ends of the first heat pipe 91 along its extension direction and dissipated through the first air outlet 72 of the two fans 70, which can improve the heat dissipation effect of the heating element in the heating element group 33 and further reduce the temperature of the first housing 20 and the surface of the electronic device 10.

[0146] In some embodiments, the first heat pipe 91 may cover a portion of the heating elements of the heating element group 33. In this case, a portion of the heating elements of the heating element group 33 may be arranged along the extending direction of the first heat pipe 91 so as to be covered by the first heat pipe 91.

[0147] The first heat-conducting plate 100 can cover the remaining heating elements of the heating element group 33. At this time, the remaining heating elements of the heating element group 33 can be located within the projection area of ​​the first heat-conducting plate 100 so that they can be covered by the first heat-conducting plate 100.

[0148] In this way, the arrangement of the first heat pipe 91 and the first heat-conducting plate 100 can cover all the heat-generating elements in the heat-generating element group 33, take into account all the heat-generating elements in the heat-generating element group 33, dissipate heat from all the heat-generating elements in the heat-generating element group 33, further improve the heat dissipation effect of the heat-generating elements in the heat-generating element group 33, and further reduce the temperature of the first housing 20 and the surface of the electronic device 10.

[0149] The following section uses the example of the first heat pipe 91 and the first heat-conducting plate 100 covering all the heating elements in the heating element group 33 to further illustrate the structure of the electronic device.

[0150] Figure 6 shows a schematic diagram of the structure of an electronic device 10 inside the first housing 20 (Figure 1), and Figure 7 shows a schematic diagram of the structure of an electronic device 10 inside the first housing 20 (Figure 2).

[0151] Referring to Figures 6 and 7, in some embodiments, the first heat pipe 91 has a connecting portion 911 that covers part of the heating element in the heating element assembly 33, and the first heat-conducting plate 100 is connected to the connecting portion 911. Along the width direction of the first housing 20, the first air outlets 72 of both fans 70 are located on one side of the connecting portion 911. Furthermore, both ends of the first heat pipe 91 are located on the side of the connecting portion 911 facing the two first air outlets 72, so that while covering the connecting portion 911, the two ends of the first heat pipe 91 can be respectively positioned at the corresponding first air outlet 72. In this case, the first heat pipe 91 can be U-shaped. The width direction of the first housing 20 is shown in the Y direction.

[0152] In some embodiments, the height of the heating element covered by the first heat pipe 91 is less than the height of the heating element covered by the first heat-conducting plate 100. This arrangement of the first heat pipe 91 and the first heat-conducting plate 100 allows for better coverage of the heating elements in the heating element group 33, thus facilitating heat dissipation from all heating elements in the heating element group 33.

[0153] In some embodiments, the heat-generating elements in the heat-generating element group 33 may include at least one of the following: a power supply element for the processor 32, a power supply element for the memory module, the memory module, and a charging element. Both the power supply element for the processor 32 and the power supply element for the memory module include a power supply inductor 331 and a power supply field-effect transistor 332. The charging element, as described above, includes a charging inductor and a charging field-effect transistor.

[0154] At least one of the power supply field-effect transistor 332, the charging field-effect transistor, and the memory module is covered by the first heat pipe 91. For example, the power supply field-effect transistor 332 and the charging field-effect transistor can be covered by the first heat pipe 91. When the heat-generating element in the heat-generating element group 33 includes the memory module, the power supply field-effect transistor 332, the charging field-effect transistor, and the memory module can all be covered by the first heat pipe 91.

[0155] The first heat pipe 91 can dissipate heat from at least one of the power supply field-effect transistor 332, the charging field-effect transistor, and the memory module.

[0156] At least one of the power supply inductor 331 and the charging inductor is covered by the first heat-conducting plate 100. For example, both the power supply inductor 331 and the charging inductor can be covered by the first heat-conducting plate 100.

[0157] The first heat-conducting plate 100 can dissipate heat from at least one of the power supply inductor 331 and the charging inductor.

[0158] It should be noted that, in some embodiments, in addition to the power supply inductor 331 and the power supply field-effect transistor 332 of the processor 32, the heat-generating elements in the heat-generating element group 33 may also include a video memory module, a charging inductor, etc. For example, the heat-generating element covered by the first heat pipe 91 may also include a charging inductor.

[0159] A thermally conductive element, including a thermal pad or thermal gel, is also sandwiched between the first heat pipe 91 and the heating element. Compared to when the first heat pipe 91 contacts the heating element through the substrate 60, a thermally conductive element is still provided between adjacent structural components (the substrate 60 and the heating element). Therefore, in this embodiment, by providing a thermally conductive element between the first heat pipe 91 and the heating element, the thermally conductive element can transfer the heat from the heating element to the first heat pipe 91 more quickly, while still reducing the thermal resistance of the heating element in the heat dissipation path in the heating element group 33 compared to the method where the first heat pipe 91 contacts the heating element through the substrate 60.

[0160] In some embodiments, the first heat-conducting plate 100 has a bent portion sandwiched between the first heat pipe 91 and the heating element covered by the first heat pipe 91, so as to realize the connection between the first heat-conducting plate 100 and the first heat pipe 91. For example, the bent portion may be sandwiched between the connecting portion 911 and the heat-conducting element, and connected to the connecting portion 911.

[0161] The circuit board 31 also contains some capacitors, which overlap with the first heat pipe 91 in the thickness direction of the first housing 20. Because the electronic device 10 is designed to have a safety gap between the capacitors and the first heat pipe 91 in the thickness direction of the first housing 20, to prevent the capacitors from hitting the first heat pipe 91, and because the surface flatness of the first heat pipe 91 is relatively poor compared to the first heat-conducting plate 100, a larger safety gap needs to be provided between the first heat pipe 91 and the capacitors in the thickness direction of the first housing 20 compared to the first heat-conducting plate 100. If the first heat-conducting plate 100 could also be located on the side of the connecting part 911 away from the heat-conducting component and connected to the connecting part 911, the thickness of the electronic device 10 in the first housing 20 portion would increase.

[0162] Therefore, by setting the above-mentioned bending portion, this application can achieve the connection between the first heat-conducting plate 100 and the connecting portion 911 while ensuring that the reserved safety gap between the capacitor and the first heat pipe 91 remains unchanged. At the same time, the gap between the capacitor and the bending portion in the thickness direction of the first housing 20 can also meet the safety gap requirements of both, without affecting the thickness of the electronic device in the first housing 20 portion.

[0163] Compared to the active heat dissipation structure of the prior art mentioned above (shown in Figure 3), when the bent portion is sandwiched between the first heat pipe 91 and the heating element covered by the first heat pipe 91, most of the heat from the heating element covered by the first heat pipe 91 can be transferred to the first heat pipe 91 along the thickness direction of the first housing 20. Although the heating element covered by the first heat pipe 91 still has a small amount of heat conducted along the plane where the bent portion is located, it can still reduce the thermal resistance of the heating element covered by the first heat pipe 91 in the heat dissipation path, improve the heat dissipation effect of the heating element in the heating element group 33, and reduce the temperature of the first housing 20 and the surface of the electronic device 10.

[0164] It should be noted that in some embodiments, when there is no overlap between the capacitor and the first heat pipe 91 in the thickness direction of the first housing 20, the first heat-conducting plate 100 can also be located on the side of the connecting portion 911 away from the heat-conducting element and connected to the connecting portion 911. In this case, the first heat pipe 91 can directly contact the heating element through the heat-conducting element, without needing to contact the heating element through the first heat-conducting plate 100, which can minimize the thermal resistance of the heating element covered by the first heat pipe 91 in the heat dissipation path.

[0165] Referring to Figures 6 and 7, in some embodiments, the electronic device 10 further includes a processor 32 disposed within a first housing 20 and located between two fans 70. Each fan 70 also has a second air outlet 73, and the first housing 20 has a second outlet 23 opposite to the second air outlet 73. The heat dissipation module also includes a second heat-conducting plate 200, a second heat pipe 92, and two heat sinks 300. For example, the heat sink 300 can be a radiator containing heat dissipation fins. A heat sink 300 is provided between the second air outlet 73 of each of the two fans 70 and the corresponding second outlet 23. The second heat-conducting plate 200 covers the processor 32, a portion of the second heat pipe 92 covers the second heat-conducting plate 200, and both ends of the second heat pipe 92 extend to the second air outlet 73 of the two fans 70, respectively, and connect to the heat sink 300 located at the second air outlet 73. In other words, one end of the second heat pipe 92 extends to the second air outlet 73 of a fan 70 and connects to the heat sink 300 located at the fan 70, while the other end of the second heat pipe 92 extends to the second air outlet 73 of another fan 70 and is also connected to the heat sink 300 located at the fan 70. Thus, the heat generated by the processor 32 will be transferred to the second heat pipe 92 through the second heat-conducting plate 200, and then along the extension direction of the second heat pipe 92 to both ends of the second heat pipe 92, and finally transferred to the two heat sinks 300 through the two ends of the second heat pipe 92.

[0166] Compared to existing technologies (as shown in Figure 3), the arrangement of the first air outlet 72 and the second air outlet 73 improves the airflow characteristics of the individual fan 70 by approximately 15%-30%, thereby enhancing the performance of the fan 70. When the airflow from the two fans 70 at the second air outlet 73 blows towards their respective heat sinks 300, it transfers heat to the heat sinks 300 and discharges it to the outside of the first housing 20 through the second outlet 23, enabling the processor 32 to exchange heat effectively with the external air of the electronic device 10 in a timely manner.

[0167] Therefore, by configuring the first heat pipe 91 and the second heat pipe 92, the second heat pipe 92 can be used for heat dissipation of the processor 32, and the first heat pipe 91 can be used for heat dissipation of the heat-generating elements in the heat-generating element group 33. In this way, when the heat-generating elements in the heat-generating element group 33 dissipate heat, they will not be limited by the heat transfer capacity of the second heat pipe 92, which can improve the heat dissipation effect of the heat-generating elements in the heat-generating element group 33, so as to avoid the surface temperature of the electronic device 10 being too high, especially the surface temperature of the second housing 40 being too high.

[0168] It should be noted that when the end of the second heat pipe 92 is connected to the heat sink 300, the second heat pipe 92 can be located on the side of the heat sink 300 away from the keyboard (as shown in Figure 6), or the second heat pipe 92 can also be located on the side of the heat sink 300 facing the keyboard.

[0169] Compared to the second air outlet 73, the first air outlet 72 is located on the side of the fan 70 facing the heating element and on the side facing the inside of the first housing 20. Therefore, the first air outlet 72 can be referred to as the inner air outlet of the fan 70.

[0170] Since the two fans 70 are located close to the edge of the first housing 20 along the length direction of the first housing 20, if the first air outlet 72 is located on the side of the fan 70 away from the heating element and facing the outside of the first housing 20, that is, the first air outlet 72 is the outer first air outlet 72 of the fan 70, then the first air outlet 72 is close to the edge of the first housing 20. Since the first housing 20 has a rounded chamfer at the edge, the first housing 20 will be thickened at the edge.

[0171] In contrast, in this embodiment, the setting of the first air outlet 72 as the inner air outlet of the fan 70 does not affect the thickness of the first housing 20 at the edge.

[0172] Referring to Figure 6, in some embodiments, at least one end of the first heat pipe 91 is connected to the second heat pipe 92, which also allows heat on the first heat pipe 91 and the second heat pipe 92 to conduct to each other, thereby improving the temperature uniformity of the heat dissipation module and making the temperature on the surface of the second housing 40 more uniform. For example, the end of the first heat pipe 91 can be connected to the second heat pipe 92 by means of heat conduction, such as welding.

[0173] The following section will further elaborate on the heat dissipation of the heat-generating elements in the heat-generating element group 33 by the fan 70 and the heat dissipation module.

[0174] Figure 8 is a cross-sectional view of Figure 4 in the AA direction.

[0175] Referring to Figures 7 and 8, in some embodiments, the electronic device 10 may further include a circuit board 31 disposed within the first housing 20. The first housing 20 has a bottom shell 2a and a housing body 2b disposed opposite each other in the thickness direction, and a heating element assembly 33 is disposed on the side of the circuit board 31 facing the bottom shell 2a. In addition, a processor 32 is also disposed on the side of the circuit board 31 facing the bottom shell 2a. In this case, since a fan 70 is provided on each side of the heating element assembly 33, and the heating element assembly 33 is disposed on the side of the circuit board 31 facing the bottom shell 2a, the circuit board 31 is disposed between the two fans 70.

[0176] The first housing 20 has a first air duct 25 located at a position opposite to the end of the first heat pipe 91. At least a portion of the first air duct 25 is located between the bottom housing 2a and the first heat pipe 91.

[0177] Referring to Figure 7, in some embodiments, two fans 70 share a first outlet 22, and a first air duct 25 connects the first outlet 22 with an adjacent first air outlet 72. For example, for ease of description, the two ends of the first heat pipe 91 are referred to as the first end 912 and the second end 913, the fan 70 opposite to the first end 912 is referred to as the first fan 7a, and the fan 70 opposite to the second end 913 is referred to as the first fan 7b. Since the first heat pipe 91 has two ends, a first air duct 25 is provided inside the first housing 20 at positions opposite to the first end 912 and the second end 913 of the first heat pipe 91. The first air duct 25 at the first end 912 can connect the first outlet 22 with the first air outlet 72 of the first fan 7a, and the first air duct 25 at the second end 913 can connect the first outlet 22 with the first air outlet 72 of the second fan 7b.

[0178] By setting the first air duct 25, the airflow from the first air outlet 72 of the two fans 70 can flow in their respective first air ducts 25 and then flow to the outside of the first housing 20 through the same first outlet 22. This way, the airflow from the first air outlet 72 can be guided by the first air duct 25, while reducing the number of openings on the first housing 20.

[0179] Referring to Figures 7 and 8, in some embodiments, the heat dissipation module may further include a first heat exchanger 400, which is provided on the side of the first heat pipe 91 facing the bottom shell 2a. That is, the heat dissipation module includes two first heat exchangers 400, with one first heat exchanger 400 on the side of the first end 912 of the first heat pipe 91 facing the bottom shell 2a, and another first heat exchanger 400 on the side of the second end 913 of the first heat pipe 91 facing the bottom shell 2a.

[0180] The first heat exchanger 400 includes a plurality of heat exchange sections 410 connected to the ends of the first heat pipe 91. The heat exchange sections 410 are disposed opposite to the first air outlet 72 and are located within the first air duct 25.

[0181] Since the heat exchange section 410 is connected to the end of the first heat pipe 91, the heat in the heating element group 33 is collected at the end of the first heat pipe 91 and then transferred to the heat exchange section 410. By setting multiple heat exchange sections 410, the heat exchange area of ​​the first heat exchange element 400 in the first air duct 25 can be increased. In this way, when the airflow from the fan 70 at the first air outlet 72 enters the first air duct 25, it will exchange heat with multiple heat exchange sections 410, dissipate heat from the heating elements, and then be discharged to the outside of the first housing 20 through the first outlet 22. This allows all the heating elements in the heating element group 33 to exchange heat with the external air of the electronic device 10 in a timely and effective manner.

[0182] Because the processor 32 generates a lot of heat, the airflow from the fan 70 at the second air outlet 73 needs to be greater than that from the first air outlet 72.

[0183] If there is no first heat exchanger 400 in the first air duct 25, and it is necessary to distribute the airflow of the fan 70 between the second air outlet 73 and the first air outlet 72 so that the airflow of the first air outlet 72 is less than that of the second air outlet 73, this can only be achieved by adjusting the size of the fan 70 at the first air outlet 72. However, this method will affect the overall airflow of the fan 70 and the heat dissipation efficiency of the processor 32 and the heat-generating elements in the heat-generating element group 33.

[0184] In contrast, in this embodiment, by setting the first heat exchanger 400, without affecting the overall airflow of the fan 70, the heat exchanger 410 blocks part of the airflow in the first air outlet 72 when the airflow of the fan 70 enters the first air duct 25, increasing the resistance when the fan 70 exits from the first air outlet 72. This avoids the airflow of the first air outlet 72 being too large and affecting the airflow of the fan 70 at the second air outlet 73, thus ensuring the heat dissipation efficiency of the airflow flowing out of the second air outlet 73 for the processor 32, and at the same time ensuring the heat dissipation efficiency of the airflow flowing out of the first air outlet 72 for the heat dissipation elements in the heat dissipation element group 33.

[0185] It should be noted that Figure 8 only shows the relevant structure of the first housing 20 at the first end 912 of the first heat pipe 91. The following text mainly focuses on the scenario of the first heat pipe 91 at the first end 912 to further elaborate on the design of the heat dissipation module and airflow, as well as the heat dissipation of the heat dissipation module and fan 70 on the heat dissipation elements in the heat dissipation element group 33. In the scenario of the second end 913 of the first heat pipe 91, the design of the heat dissipation module and airflow can refer to the relevant description of the first end 912, and will not be repeated here.

[0186] Referring to Figures 7 and 8, in some embodiments, the first heat exchanger 400 further includes a heat exchange body 420. The heat exchange body 420 is connected to the end of the first heat pipe 91 facing the bottom shell 2a and is disposed opposite to the first air outlet 72. Heat exchange sections 410 are located on the side of the heat exchange body 420 facing the bottom shell 2a, and there is a gap between adjacent heat exchange sections 410. The heat exchange body 420 enables the connection between the heat exchange section 410 and the end of the first heat pipe 91, allowing heat collected at the end of the first heat pipe 91 to be transferred to the heat exchange section 410 through the heat exchange body 420. The gap between adjacent heat exchange sections 410 allows airflow within the first air duct 25 to flow between adjacent heat exchange sections 410, increasing the heat exchange area between the heat exchange section 410 and the airflow, and improving the heat dissipation efficiency of the heating elements in the heating element group 33.

[0187] In some embodiments, when the heat exchange body 420 is connected to the end of the first heat pipe 91, the heat exchange body 420 may cover at least a portion of the end of the first heat pipe 91 so that the heat collected at the end of the first heat pipe 91 can be quickly transferred to the heat exchange body 420 and then transferred to the heat exchange section 410 through the heat exchange body 420.

[0188] For example, the heat exchange section 410 may include a cylindrical structure, a frustum structure, or a dome-shaped protrusion with relatively smooth sides. Compared to a prismatic structure, when the heat exchange section 410 has a cylindrical structure, a frustum structure, or a dome-shaped protrusion with relatively smooth sides, it can avoid the presence of the heat exchange section 410 generating greater flow resistance to the airflow within the first air duct 25, so that the airflow can flow more smoothly along the first air duct 25 to the first outlet 22 and be discharged from the first housing 20.

[0189] It should be noted that when the heat exchange section 410 has a cylindrical structure, as an example, the diameter of the heat exchange section 410 can be 1.55 mm, and the gap between adjacent heat exchange sections 410 can be 2.6 mm. However, this does not constitute a limitation on the diameter of the heat exchange section 410 or the gap between adjacent heat exchange sections 410. For example, the diameter of the heat exchange section 410 and the gap between adjacent heat exchange sections 410 will also change with changes in the external environment (such as the size of the first housing 20), and this application does not impose any limitations on these aspects.

[0190] In some embodiments, the gap between the heat exchange section 410 and the bottom shell 2a along the thickness direction of the first housing 20 is greater than 0.2 mm and less than 0.8 mm. For example, the gap between the heat exchange section 410 and the bottom shell 2a can be 0.3 mm, 0.4 mm, 0.5 mm, or 0.6 mm, etc. The gap between the heat exchange section 410 and the bottom shell 2a can be such that the thickness direction of the first housing 20 can be seen in the Z direction.

[0191] If the gap between the heat exchange part 410 and the bottom shell 2a in the thickness direction of the first housing 20 is less than 0.2mm, the gap between the heat exchange part 410 and the bottom shell 2a is too small, which may affect the temperature of the first housing 20 in the bottom shell 2a. Furthermore, due to the existence of tolerances, it may also affect the installation of the heat dissipation module in the first housing 20.

[0192] Figure 8 shows a second structural schematic diagram of an electronic device 10 within a first housing 20. Compared to Figure 7, Figure 8 hides a portion of the air guide components that form the first air duct 25. The formation of the first air duct 25 will be further explained below in conjunction with its specific structure.

[0193] Referring to Figure 8, if the gap between the heat exchange section 410 and the bottom shell 2a is greater than 0.8 mm in the thickness direction of the first shell 20, then the heat exchange section 410 has a limited heat exchange area, which affects the heat dissipation efficiency of the heat-generating elements in the heat-generating element group 33.

[0194] In contrast, in the embodiments of this application, when the gap between the heat exchange section 410 and the bottom shell 2a is limited to greater than 0.2 mm and less than 0.8 mm, the heat exchange section 410 can be made to have sufficient heat exchange area to ensure the heat dissipation efficiency of the heat dissipation element in the heat dissipation element group 33, while avoiding the heat exchange section 410 affecting the temperature of the first shell 20 in the bottom shell 2a and ensuring the installation of the heat dissipation module in the first shell 20.

[0195] In some embodiments, along the width direction of the first housing 20:

[0196] The dimensions of the first heat exchanger 400 in the width direction of the first housing 20 are matched with those of the first air outlet 72, that is, the dimensions of the first heat exchanger 400 in the width direction of the first housing 20 are the same as or similar to those of the first air outlet 72.

[0197] Furthermore, referring to Figure 8, along the length direction of the first housing 20:

[0198] The fan 70 is located on the side of the heating element group 33 facing the outside of the first housing 20, and the distance between the first heat exchanger 400 and the fan 70 can be less than or equal to 0.5 mm. For example, the distance between the first heat exchanger 400 and the fan 70 can be 0.5 mm, 0.4 mm, etc. For example, the distance between the first heat exchanger 400 and the fan 70 can also approach zero.

[0199] In this way, when the distance between the first heat exchanger 400 and the fan 70 is less than or equal to 0.5mm, the distance between the first heat exchanger 400 and the fan 70 can be smaller, so as to ensure that the airflow from the first air outlet 72 can enter the first air duct 25 more and exchange heat with the first heat exchanger 400, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation element in the heat dissipation element group 33.

[0200] Referring to Figure 8, multiple heat exchange units 410 can be arranged in an array or other manner on the heat exchange body 420 to make the arrangement of heat exchange units 410 on the heat exchange body 420 more uniform. While enhancing the resistance of the heat exchange units 410 to the air outlet 72 of the fan 70, it also facilitates the distribution of the air volume of the fan 70 at the first air outlet 72 and the second air outlet 73.

[0201] For example, the array may include a rectangular array, etc. When multiple heat exchange sections 410 are arranged in a rectangular array or the like on the heat exchange body 420, some of the multiple heat exchange sections 410 may be spaced apart along the length direction of the first housing 20 to form a row of heat exchange sections. Some of the multiple heat exchange sections 410 may also be spaced apart along the width direction of the first housing 20 to form a column of heat exchange sections. At least three columns of heat exchange sections may be provided on the heat exchange body 420.

[0202] It should be noted that if there is no first heat exchanger 400 in the first air duct 25, and if the air volume of the fan 70 at the second air outlet 73 and the first air outlet 72 is to be distributed in a 7:3 ratio, it can only be achieved by adjusting the size of the fan 70 at the first air outlet 72. However, this method will affect the overall air volume of the fan 70 and the heat dissipation efficiency of the processor 32 and the heat dissipation components in the heat dissipation component group 33.

[0203] When the dimension of the first heat exchanger 400 in the width direction of the first housing 20 matches that of the first air outlet 72, and the distance between the first heat exchanger 400 and the fan 70 can be less than or equal to 0.5 mm, at least three rows of heat exchange groups are provided on the heat exchange body 420. Through thermal simulation, by setting the first heat exchanger 400, the system impedance of the fan 70 at the first air outlet 72 can be increased, and the airflow of the fan 70 at the second air outlet 73 and the first air outlet 72 can be distributed in a 7:3 ratio to avoid the airflow at the first air outlet 72 being too large and affecting the airflow at the second air outlet 73.

[0204] Referring to Figure 8, in some embodiments, the first heat-conducting plate 100 can be an integral structural component with the first heat exchanger 400, that is, the first heat-conducting plate 100 and the first heat exchanger 400 are integrally formed. In this case, during the formation of the heat exchange portion 410, the heat exchange portion 410 can be formed by stamping or other methods to make a portion of the heat exchange body 420 recessed to one side.

[0205] Alternatively, in some embodiments, the first heat-conducting plate 100 can be connected to the first heat exchanger 400. For example, the first heat-conducting plate 100 can be connected to the first heat exchanger 400 by a heat-conducting method such as welding. When the first heat-conducting plate 100 and the first heat exchanger 400 are integral structural components, or when the first heat-conducting plate 100 and the first heat exchanger 400 are connected, the heat on the first heat-conducting plate 100 will also be transferred to the first heat exchanger 400, so that the heat of the heating element covered by the first heat-conducting plate 100 can also be directly transferred to the heat exchange portion 410 of the first heat exchanger 400. This makes the heat dissipation module have better heat dissipation efficiency and effect for the heating elements in the heating element group 33.

[0206] The first heat-conducting plate 100 may include a copper plate or an aluminum plate to give the first heat-conducting plate 100 good thermal conductivity so that the heat of the heating element covered by the first heat-conducting plate 100 can be directly transferred to the heat exchange section 410 of the first heat exchanger 400.

[0207] It should be noted that when the first heat-conducting plate 100 and the first heat exchanger 400 are integral structural components, or when the first heat-conducting plate 100 and the first heat exchanger 400 are connected, the first heat-conducting plate 100 can be an aluminum plate because the heat dissipation module has good heat dissipation efficiency for the heat-generating elements in the heat-generating element group 33. In this way, while meeting the heat dissipation requirements of the heat-generating elements in the heat-generating element group 33 and reducing the surface temperature of the first housing 20, the weight of the heat dissipation module can also be reduced because aluminum has a lower density than copper, thus helping to reduce the weight of the electronic device 10.

[0208] Referring to Figures 5a, 5b, and 6, in some embodiments, the air intake area 21 is located on the bottom housing 2a opposite to the air inlet 71. The first housing 20 has a user side 2c and a pivot side 2d opposite each other in the width direction. The pivot side 2d is used to mount a pivot. At least part of the first opening is located on the first housing 20 on the pivot side 2d opposite to the heating element assembly 33.

[0209] In this way, the airflow outside the first housing 20 can enter the air inlet 71 of the fan 70 through the air inlet area 21, and flow out from the first air outlet 72 into the first air duct 25. Furthermore, the airflow in the two first air ducts 25 can flow out from the first opening after exchanging heat with the first heat exchanger 400 within their respective ducts, so that all the heat-generating elements in the heating element group 33 can exchange heat with the external air of the electronic device 10 in a timely and effective manner.

[0210] It should be noted that when multiple ventilation openings are also provided in the area between the two fans 70 on the bottom shell 2a, a baffle 700 needs to be provided on the inner side of the bottom shell 2a of the first shell 20. The baffle 700 is located between the two fans 70 and covers the ventilation opening between the two fans 70 on the bottom shell 2a. This is to prevent the airflow from the first air outlet 72 from flowing back to the air inlet 71 of the fan 70 through the ventilation opening between the two fans 70 without exchanging heat with the air outside the first shell 20, thus affecting the heat dissipation efficiency and effect of the fan 70 on the heat-generating elements in the heat-generating element group 33. In this case, the gap between the heat exchange part 410 and the bottom shell 2a mentioned above can be understood as the gap between the heat exchange part 410 and the baffle 700.

[0211] Referring to Figure 8, in some embodiments, a second air duct 26 may be provided inside the first housing 20 at a position opposite to the end of the first heat pipe 91. The second air duct 26 is located between the first heat pipe 91 and the circuit board 31, and one end of the second air duct 26 is connected to the adjacent first air outlet 72, while the other end of the second air duct 26 is connected to the first outlet 22 and the adjacent first air duct 25. Again, taking the first end 912 as an example, that is, one end of the second air duct 26 at the first end 912 can be connected to the first air outlet 72 of the first fan 7a, and the other end of the second air duct 26 at the first end 912 can be connected to the first outlet 22 and the first air duct 25 adjacent to the first fan 7a.

[0212] Through the arrangement of the second air duct 26, the airflow from the first air outlet 72 of the two fans 70 can also flow along the corresponding second air duct 26 towards the first outlet 22 to the outside of the first housing 20 (i.e., the environment). Furthermore, since the other end of the second air duct 26 is connected to the adjacent first air duct 25, the airflow within the second air duct 26 will also merge with the airflow within the first air duct 25, resulting in heat exchange. The heat from the heating element is mainly concentrated on the first heat exchanger 400 of the first air duct 25. When the airflow within the first air duct 25 exchanges heat with the first heat exchanger 400, it becomes hot air. The airflow within the second air duct 26 has a lower temperature, close to the ambient temperature, and can be considered cold air. Therefore, when the airflow flows within the second air duct 26 and merges with the airflow within the first air duct 25, resulting in heat exchange, the temperature of the hot air within the first air duct 25 can be reduced, thereby reducing the temperature of the main body 2b or bottom shell 2a of the first housing 20 on the shaft side 2d.

[0213] Referring to Figure 8, in some embodiments, the first housing 20 is provided with a third air duct 27, which is located between the circuit board 31 and the housing body 2b, and the third air duct 27 connects the first outlet 22 and the first air outlet 72 of the two fans 70.

[0214] With the third air duct 27 in place, the airflow from the first air outlet 72 of the two fans 70 can also flow along the corresponding third air duct 27 towards the first outlet 22 to the outside of the first housing 20, thereby reducing the temperature of the keyboard surface on the housing body 2b of the first housing 20. Furthermore, the arrangement of the first air duct 25, the second air duct 26, and the third air duct 27 allows the airflow from the first air outlet 72 of the fans 70 to flow along three different air ducts without interfering with each other, achieving different purposes.

[0215] In some embodiments, the electronic device 10 further includes an air guide assembly 600, which includes a plurality of air guide elements. For example, the air guide elements can be foam, air guide ribs, etc. The plurality of air guide elements include a first air guide element 610, a second air guide element 620, and a third air guide element 630.

[0216] Referring to Figure 6, the first air guide 610 is disposed between the end of the first heat pipe 91 and the bottom shell 2a, and together with the bottom shell 2a, forms a first air duct 25, so that the airflow from the first air outlet 72 can flow within the first air duct 25 to the first outlet 22.

[0217] It should be noted that Figure 6 shows six first air guides 610, three of which can be located at the first air outlet 72 of the first fan 7a. These three first air guides 610 can be located between the first heat pipe 91 and the bottom shell 2a, and together with the bottom shell 2a, the first fan 7a, and the first heat pipe 91, they form a first air duct 25. The remaining three first air guides 610 can be located at the first air outlet 72 of the second fan 7b. In the same way, the first air guides 610, together with the bottom shell 2a, the second fan 7b, and the first heat pipe 91, can form another first air duct 25.

[0218] The end of a portion of the first air guide 610 may also be located on the side of the second heat pipe 92 facing the bottom shell 2a and extend toward the first outlet 22, so as to guide the airflow in the first air duct 25 to the first outlet 22 and make the formed first air duct 25 communicate with the first outlet 22, so as to ensure that the airflow in the first air duct 25 can flow to the outside of the first shell 20 through the first outlet 22.

[0219] Referring to Figure 9, the second air guide 620 is disposed between the end of the first heat pipe 91 and the circuit board 31. The second air guide 620, the end of the first heat pipe 91, and the circuit board 31 form a second air duct 26, so that the airflow from the first air outlet 72 can flow within the second air duct 26 to the first outlet 22. The second air guide 620 is disposed between the two ends of the first heat pipe 91 and the circuit board 31, so that a second air duct 26 is formed at each of the two ends of the first heat pipe 91.

[0220] The formation of the second air duct 26 will be further explained below, taking the first end 912 of the first heat pipe 91 as an example. The formation of the second air duct 26 at the second end 913 can be referred to the relevant description of the first end 912.

[0221] The second air guide 620 can be disposed between the end of the first heat pipe 91 and the circuit board 31. The end of the second air guide 620 can also be disposed on the side of the end of the second heat pipe 92 away from the bottom shell 2a and extend towards the first outlet 22 to guide the airflow in the second air duct 26 to the first outlet 22 and make the formed second air duct 26 communicate with the first outlet 22, so as to ensure that the airflow in the second air duct 26 can flow to the outside of the first shell 20 through the first outlet 22.

[0222] It should be noted that some of the multiple first air guides 610 can be connected to the second air guides 620 opposite to them in the thickness direction of the first housing 20, and separated by the first heat pipe 91. Alternatively, when some of the multiple first air guides 610 are located on one side of the first heat pipe 91, they can also participate in the formation of the second air duct 26 as second air guides 620, so as to reduce the number of air guides.

[0223] Figure 10 shows a partial exploded view of an electronic device 10.

[0224] Referring to Figure 10, the third air guide 630 is disposed between the circuit board 31 and the housing body 2b, forming a third air duct 27 with the circuit board 31 and the housing body 2b, so that the airflow from the first air outlet 72 can flow within the third air duct 27 to the first outlet 22. The third air guide 630 can be sandwiched between the circuit board 31 and the housing body 2b, and a portion of the end of the third air guide 630 can extend towards the first outlet 22 to guide the airflow within the third air duct 27 to the first outlet 22, thus connecting the formed third air duct 27 with the first outlet 22 and ensuring that the airflow within the third air duct 27 can flow through the first outlet 22 to the outside of the first housing 20.

[0225] In some embodiments, as shown in FIG10, the first air outlets 72 of the two fans 70 can share a third air duct 27. FIG10 shows three third air guides 630, which can form a semi-enclosed structure so that the opening of the semi-enclosed structure faces the first outlet 22 to form the air outlet end of the third air duct 27, thereby realizing the connection between the third air duct 27 and the first outlet 22.

[0226] It should be noted that the heat dissipation module and fan 70 mentioned above are the first type of active heat dissipation structure. Although the first type of heat dissipation module can reduce the temperature of the first housing 20 on the shaft side 2d through the setting of the second air duct 26, the path between the first air outlet 72 and the first outlet 22 is relatively far. Moreover, after the airflow from the first air outlet 72 exchanges heat with the heat exchange part 410 of the first heat exchanger 400 in the first air duct 25, it flows out of the first housing 20 from the first outlet 22 after passing through the shaft set on the shaft side 2d. Therefore, the surface temperature gain of the first housing 20 at the location of the shaft may still be relatively low.

[0227] Therefore, this application provides a second active heat dissipation structure to further reduce the temperature of the first housing 20 at the pivot and increase the surface temperature gain of the first housing 20 at the pivot location.

[0228] The second type of active cooling structure also includes two fans 70, a first heat pipe 91, a second heat pipe 92, a first heat-conducting plate 100, and a second heat-conducting plate 200. The arrangement of the fans 70 relative to the heat-generating element group 33 and the processor 32, as well as the arrangement and connection method of the first heat pipe 91, the second heat pipe 92, the first heat-conducting plate 100, and the second heat-conducting plate 200, are the same as those of the first type of active cooling structure, and will not be described again here. The difference between the second type of active cooling structure and the first type of active cooling structure lies in the airflow design, and the location of the air intake area 21 and the first outlet 22.

[0229] Figure 10 shows a schematic diagram of the structure of another electronic device 10 in the portion where the first housing 20 is located. Figure 11 is an exploded view of the portion where the first housing 20 is located. The first housing 20 in Figure 11 contains a second type of active heat dissipation structure.

[0230] The following section, in conjunction with Figures 10 and 11, further elaborates on the differences between the second type of active heat dissipation structure and the first type of active heat dissipation structure.

[0231] Referring to Figures 10 and 11, in some embodiments of the second active cooling structure, the first opening is located on the bottom shell 2a near the first air outlet 72, and the bottom shell 2a has a first opening at the position corresponding to the first air outlet 72 of the two fans 70. The first air duct 25 connects the adjacent first outlet 22 and the adjacent first air outlet 72. With this configuration, the first opening can be adjusted from the pivot side 2d to the position on the bottom shell 2a near the first air outlet 72, and the two fans 70 each exhaust air through a corresponding first opening, shortening the path from the first air outlet 72 to the first outlet 22. This allows the airflow in the first air duct 25 to dissipate heat from the heat-generating elements in the heat-generating element group 33 and then flow directly from the first opening to the outside of the first housing 20 without passing through the pivot. This significantly reduces the surface temperature of the first housing 20 at the pivot position and increases the surface temperature gain of the first housing 20 at the pivot position.

[0232] Referring to Figure 10 and in conjunction with Figure 11, for the second type of active cooling structure, the air intake area 21 is located at the edge region of the first housing 20 along its length. Specifically, the first housing 20 has two air intake areas 21, so that each air intake area 21 can respectively intake air for the adjacent fan 70. For example, the two air intake areas 21 can be located on the left and right sides of the first housing 20 along its length.

[0233] When the air intake area 21 is located at the edge of the first housing 20 in the length direction, the air intake area 21 can be moved away from the first outlet 22 to avoid the airflow from the first outlet 22 not exchanging heat with the air outside the first housing 20 and directly flowing back into the fan 70 through the air intake area 21, affecting the heat dissipation efficiency and effect of the fan 70 on the heat dissipation elements in the heat dissipation element group 33.

[0234] Figure 12 shows a schematic diagram of the structure of the electronic device 10 in Figure 10 within the first housing 20.

[0235] Referring to Figure 12, for the second type of active heat dissipation structure, in some embodiments, the heat dissipation module further includes a second heat exchanger 500, which is disposed opposite to the first air outlet 72. Furthermore, the second heat exchanger 500 is connected to the end of the first heat pipe 91 facing the bottom shell 2a. For example, the second heat exchanger 500 can be connected to the first heat pipe 91 by welding or other thermally conductive methods.

[0236] Since the first heat pipe 91 has two ends, the heat dissipation module includes two second heat exchangers 500, and each of the two ends of the first heat pipe 91 is provided with a second heat exchanger 500. Each second heat exchanger 500 has multiple sub-air ducts 530, which connect to the first air duct 25 and the first air outlet 72 corresponding to the end of the first heat pipe 91. For example, the second heat exchanger 500 at the first end 912 can connect to the first air duct 25 corresponding to the first end 912 and the first air outlet 72 of the first fan 7a, and the second heat exchanger 500 at the second end 913 can connect to the first air duct 25 corresponding to the second end 913 and the first air outlet 72 of the second fan 7b.

[0237] By configuring the second heat exchanger 500, the heat from the heating element group 33 is collected at the end of the first heat pipe 91 and then transferred to the second heat exchanger 500. The arrangement of multiple sub-air ducts 530 within the second heat exchanger 500 increases its heat exchange area and allows the first air duct 25 to connect to the adjacent first air outlet 72 via the sub-air ducts 530. Thus, when the airflow from the fan 70 exits the first air outlet 72 and enters the sub-air duct 530, it exchanges heat with multiple second heat exchangers 500, dissipating heat from the heating elements. The air then exits the first housing 20 through the first air duct 25 and the first outlet 22, bypassing the shaft side 2d. This ensures that all heating elements in the heating element group 33 can effectively and promptly exchange heat with the external air of the electronic device 10.

[0238] Referring to Figure 12, in some embodiments, the second heat exchanger 500 includes a heat exchange shell 510 and multiple heat dissipation fins 520. The heat exchange shell 510 has an air inlet on the side facing the first air outlet 72. The multiple heat dissipation fins 520 are disposed inside the heat exchange shell 510, dividing the space inside the heat exchange shell 510 into multiple sub-air ducts 530. One end of each sub-air duct 530 is connected to the first air outlet 72; the heat exchange shell 510 has a connecting opening on the side facing the bottom shell 2a, which connects the other end of the sub-air duct 530 to the first air duct 25. Through the arrangement of the heat dissipation fins 520 and the heat exchange shell 510, while forming a second heat exchanger 500 with multiple sub-air ducts 530, the second type of heat exchanger has a larger heat exchange area than the first type of heat exchanger, which can improve the heat dissipation efficiency of the heat-generating elements in the heat-generating element group 33. Furthermore, the connection port enables the sub-duct 530 to connect with the first duct 25, allowing the airflow in the sub-duct 530 to enter the first duct 25 through the connection port after heat exchange.

[0239] In some embodiments, the heat dissipation fins 520 may be inclined within the heat exchange housing 510 so that the airflow direction of the sub-duct 530 matches (is the same as or similar to) the airflow direction exiting the first air outlet 72. The airflow direction exiting the centrifugal fan at the outlet has a certain directionality. By adjusting the inclination angle of the heat dissipation fins within the heat exchange housing 510, the airflow direction of the sub-duct 530 can be matched with the airflow direction exiting the first air outlet 72. For example, the heat dissipation fins 520 may be inclined within the heat exchange housing 510 at a 35° angle to the horizontal direction. The horizontal direction is parallel to the length direction of the first housing 20.

[0240] By matching the airflow direction of the sub-air duct 530 with the airflow direction of the first air outlet 72, the air resistance of the airflow from the first air outlet 72 within the sub-air duct 530 can be reduced, allowing the airflow from the first air outlet 72 to flow more smoothly within the sub-air duct 530.

[0241] The first outlet 22 can have multiple holes formed. For example, the holes constituting the first outlet 22 can be strip holes, circular holes, etc. Taking a strip hole as an example, the width of the sub-air duct 530 can be the same as or similar to the width of the notch. For example, the width of the sub-air duct 530 can be 4.25 mm, but this does not constitute a limitation on the width of the sub-air duct 530. It should be noted that after the size of the electronic device 10 is adjusted, the width of the sub-air duct 530 and the width of the holes can also be adjusted accordingly.

[0242] Similar to the first active heat dissipation structure, for the second active heat dissipation structure, the first heat-conducting plate 100 can be a copper plate or an aluminum plate, etc. Since the second active heat dissipation structure has a higher heat dissipation efficiency for the heat-generating elements in the heat-generating element group 33, the first heat-conducting plate 100, when it is an aluminum plate, can also meet the heat dissipation requirements of the electronic device 10 for the heat-generating elements in the heat-generating element group 33. At the same time, it can reduce the weight of the heat dissipation module, which is conducive to the lightweight design of the electronic device 10.

[0243] In some embodiments, there may be a gap between the first heat-conducting plate 100 and the second heat exchanger 500. Since the second active heat dissipation structure has a high heat dissipation efficiency for the heat-generating elements in the heat-generating element group 33, the heat dissipation requirements of the electronic device 10 for the heat-generating elements in the heat-generating element group 33 can also be met when there is a gap between the first heat-conducting plate 100 and the second heat exchanger 500.

[0244] It should be understood that, alternatively, the first heat-conducting plate 100 and the second heat exchanger 500 are interconnected. When the first heat-conducting plate 100 and the second heat exchanger 500 are interconnected, the heat of the heating element covered by the first heat-conducting plate 100 can be directly transferred to the second heat exchanger 500, which can further improve the heat dissipation efficiency of the heating element in the heating element group 33.

[0245] Figure 13 shows a schematic diagram of the heating element in Figure 10 and the second type of active heat dissipation structure.

[0246] Referring to Figure 13, for the second type of active heat dissipation structure, the first heat-conducting plate 100 can cover the heating element with a larger height, and the first heat pipe 91 can cover the heating element with a smaller height. Furthermore, heat-conducting elements can be provided between the first heat-conducting plate 100 and the heating element, as well as between the first heat pipe 91 and the heating element. For details, please refer to the relevant description in the first type of active heat dissipation structure, which will not be repeated here.

[0247] Figure 14 shows a cross-sectional view of the electronic device 10 in Figure 10 in the BB direction.

[0248] Referring to Figure 14, in some embodiments of the second active cooling structure, the first housing 20 also has a third outlet 24, which is shared by the two fans 70. A second air duct 26 is provided inside the first housing 20 at a position opposite to the end of the first heat pipe 91, and the second air duct 26 is located between the first heat pipe 91 and the circuit board 31. Furthermore, the second air duct 26 connects the third outlet 24 with the adjacent first air outlet 72. Again, taking the first end 912 as an example, that is, the second air duct 26 at the first end 912 connects the third outlet 24 and the first air outlet 72 of the first fan 7a.

[0249] With the setting of the second air duct 26, the airflow from the first air outlet 72 of the two fans 70 can also flow along the corresponding second air duct 26 toward the third outlet 24 to the outside of the first housing 20 (i.e. the environment), so that the airflow (cold air) in the second air duct 26 and the airflow (hot air) after heat exchange in the first air duct 25 do not interfere with each other, so as to avoid affecting the heat dissipation efficiency of the heat-generating elements in the heat-generating element group 33.

[0250] The first housing 20 has a user side 2c and a pivot side 2d in the width direction. The pivot side 2d is used to mount a pivot. At least part of the third outlet 24 is located on the first housing 20 on the pivot side 2d opposite to the heating element. In this way, while reducing the temperature of the heating element in the heating element group 33, the temperature of the housing body 2b or the bottom shell 2a of the first housing 20 on the pivot side 2d can also be reduced.

[0251] Referring to Figure 14, for the second type of active heat dissipation structure, in some embodiments, a third air duct 27 is provided inside the first housing 20. The third air duct 27 is located between the circuit board 31 and the housing body 2b, and the third air duct 27 connects the third outlet 24 and the first air outlet 72 of the two fans 70.

[0252] With the third air duct 27 in place, the airflow from the first air outlet 72 of the two fans 70 can also flow along the corresponding third air duct 27 towards the third outlet 24 to the outside of the first housing 20, thereby reducing the temperature of the keyboard surface on the housing body 2b of the first housing 20. Furthermore, the second active cooling structure, through the arrangement of the first air duct 25, the second air duct 26, and the third air duct 27, allows the airflow from the first air outlet 72 of the fans 70 to flow along three different air ducts, with hot and cold air not interfering with each other, thus achieving different purposes.

[0253] In some embodiments, the electronic device 10 further includes an air guide assembly 600, which includes a plurality of air guides, including a fourth air guide 640, a fifth air guide 650, a sixth air guide 660, and a seventh air guide 670.

[0254] Referring to Figures 12 and 14, along the length of the first housing 20, the fourth air guide 640 and the fifth air guide 650 are spaced apart between the end of the first heat pipe 91 and the bottom housing 2a, and the fourth air guide 640, the fifth air guide 650 and the bottom housing 2a form a first air duct 25, so that the airflow from the first air outlet 72 can exchange heat with the second heat exchanger 500 in the sub-air duct 530 and then flow through the first air duct 25 to the first outlet 22.

[0255] It should be noted that Figure 12 shows two fourth air guides 640 and two fifth air guides 650. A fourth air guide 640 and a fifth air guide 650 are respectively provided at each of the two ends of the first heat pipe 91, so that a first air duct 25 is formed at each of the two ends of the first heat pipe 91. The formation of the first air duct 25 will be further explained below using the first end 912 of the first heat pipe 91 as an example. The formation of the first air duct 25 at the second end 913 can be found in the relevant description of the first end 912.

[0256] Figure 15 is an enlarged view of point C in Figure 12.

[0257] Referring to Figure 15, along the length of the first shell 20, the fourth air guide 640 and the fifth air guide 650 can be spaced apart on both sides of the heat exchange shell 510 at the notch, and both the fourth air guide 640 and the fifth air guide 650 are connected to the inner side of the bottom shell 2a, so that the fourth air guide 640 and the fifth air guide 650 can together with the bottom shell 2a at the first end 912 to form the first air duct 25, and the first air duct 25 is connected to the sub-air duct 530.

[0258] In some embodiments, the fourth air guide 640 and the fifth air guide 650 can both be connected between the heat exchange shell 510 and the bottom shell 2a.

[0259] It should be noted that, referring to Figure 15, when the side of the heat exchange shell 510 away from the air inlet side is an open 511, the fifth air guide 650 can extend toward the side of the circuit board 31 to block the open 511 of the heat exchange shell 510, so as to ensure that the airflow in the sub-air duct 530 flows through the first air duct 25 and the first outlet 22 to the outside of the first housing 20 as much as possible, and avoids the airflow in the sub-air duct 530 flowing toward the third outlet 24 and affecting the temperature of the first housing 20 on the shaft side 2d.

[0260] At this time, the side of the fifth air guide 650 that blocks the opening 511 of the heat exchange shell 510 can be inclined 651, so that by adjusting the inclination angle of the inclined surface 651, the airflow in the sub-air duct 530 can be better guided into the first air duct 25, while reducing the air resistance of the airflow in the sub-air duct 530 when it flows to the fifth air guide 650.

[0261] Referring to Figure 13, a sixth air guide 660 is disposed between the end of the first heat pipe 91 and the circuit board 31. The sixth air guide 660, the end of the first heat pipe 91, and the circuit board 31 form a second air duct 26, allowing the airflow from the first air outlet 72 to flow within the second air duct 26 to the third outlet 24. Second air guides 620 are disposed between the two ends of the first heat pipe 91 and the circuit board 31, so that a second air duct 26 is formed at each of the two ends of the first heat pipe 91. It should be noted that Figure 13 only shows the sixth air guide 660 at one end of the first heat pipe 91.

[0262] The formation of the second air duct 26 will be further explained below, taking one end of the first heat pipe 91 as an example. The formation of the second air duct 26 at the other end of the first heat pipe 91 can be found in the relevant description of the first end 912.

[0263] The sixth air guide 660 can be sandwiched between the end of the first heat pipe 91 and the circuit board 31. The end of the sixth air guide 660 can also be located on the side of the end of the second heat pipe 92 away from the bottom shell 2a and extend towards the third outlet 24 to guide the airflow in the second air duct 26 to the third outlet 24 and make the formed second air duct 26 and the third outlet 24 connected, so as to ensure that the airflow in the second air duct 26 can flow to the outside of the first shell 20 through the third outlet 24.

[0264] Referring to Figure 14, the seventh air guide 670 is disposed between the circuit board 31 and the housing body 2b, and together with the circuit board 31 and the housing body 2b, forms a third air duct 27, so that the airflow from the first air outlet 72 can flow within the third air duct 27 to the third outlet 24. The third air guide 630 can be sandwiched between the circuit board 31 and the housing body 2b, and a portion of the end of the third air guide 630 can extend towards the third outlet 24 to guide the airflow within the third air duct 27 to the third outlet 24, and to connect the formed third air duct 27 with the third outlet 24, ensuring that the airflow within the third air duct 27 can flow through the third outlet 24 to the outside of the first housing 20.

[0265] In the second active cooling structure, the first air outlets 72 of the two fans 70 can also share a third air duct 27. The number and shape of the seventh air guide 670, as well as the relationship between the shape and the third air duct 27, can be found in the relevant description of the first active cooling structure, and will not be repeated here.

[0266] Referring to Figure 15, the second active heat dissipation structure also includes a baffle 700. The baffle 700 is located between the fan 70 and the bottom shell 2a, and is located on the side of the first air outlet 72 facing the bottom shell 2a. This prevents the airflow from the first air outlet 72 from flowing towards the bottom shell 2a, ensuring that as much airflow as possible from the first air outlet 72 flows through the sub-air duct 530 into the first air duct 25 to exchange heat with the second heat exchanger 500. This further improves the heat dissipation efficiency of the heat-generating elements in the heat-generating element group 33.

[0267] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0268] In the description of this application, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, display structure, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are expressly listed, but may include other steps or units that are not expressly listed or that are inherent to such process, method, product, or device.

[0269] The term "and / or" used in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0270] Unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection via an intermediate medium, or the internal connection or interaction between two components. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this application based on the specific circumstances.

[0271] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. An electronic device, characterized in that, include: The first housing has an air inlet area and a first outlet, and the air inlet area has a vent. A heating element assembly is disposed within the first housing; the heating element assembly includes multiple heating elements, wherein the processor is not included among the multiple heating elements. A fan is provided on both sides of the heating element group inside the first housing along the length direction of the first housing. The fan is a centrifugal fan. The fan has an air inlet and a first air outlet. The first housing has an air inlet area at the position corresponding to the two air inlets. The air inlet is connected to the ventilation port in the corresponding air inlet area. The first air outlet faces the heating element group and is connected to the first outlet. A heat dissipation module is disposed within the first housing. The heat dissipation module includes a first heat pipe and a first heat-conducting plate. The first heat pipe and the first heat-conducting plate at least cover the heating element in the middle region of the heating element group. The two ends of the first heat pipe are respectively disposed corresponding to the first air outlets of the two fans. The first heat-conducting plate is connected to the first heat pipe.

2. The electronic device according to claim 1, characterized in that, The first heat pipe covers part of the heating elements of the heating element group, and the first heat-conducting plate covers the remaining heating elements of the heating element group.

3. The electronic device according to claim 1 or 2, characterized in that, The first heat pipe has a connecting portion that covers a portion of the heating elements in the heating element group; Along the width direction of the first housing, the first air outlets of both fans are located on one side of the connection portion, and both ends of the first heat pipe are located on the side of the connection portion facing the two first air outlets.

4. The electronic device according to any one of claims 1-3, characterized in that, It also includes a circuit board, which is disposed inside the first housing. The first housing has a bottom shell and a housing body that are disposed opposite each other in the thickness direction. The heating element group is disposed on the side of the circuit board facing the bottom shell. The first housing has a first air duct located at a position opposite to the end of the first heat pipe, and at least a portion of the first air duct is located between the bottom housing and the first heat pipe. The two fans share a first outlet, and the first air duct connects the first outlet to the adjacent first air outlet.

5. The electronic device according to claim 4, characterized in that, The heat dissipation module further includes a first heat exchanger, wherein the end of the first heat pipe is provided with the first heat exchanger on the side facing the bottom shell; The first heat exchanger includes a plurality of heat exchange sections connected to the ends of the first heat pipe. The heat exchange sections are disposed opposite to the first air outlet and located in the first air duct.

6. The electronic device according to claim 5, characterized in that, The first heat exchanger also includes a heat exchange body, which is connected to the end of the first heat pipe facing the bottom shell and is disposed opposite to the first air outlet. The heat exchange section is located on the side of the heat exchange body facing the bottom shell, and there is a gap between adjacent heat exchange sections.

7. The electronic device according to claim 6, characterized in that, Multiple heat exchange units are arranged in an array on the heat exchange body.

8. The electronic device according to claims 5-7, characterized in that, Along the thickness direction of the first shell, the gap between the heat exchange section and the bottom shell is greater than 0.2 mm and less than 0.8 mm.

9. The electronic device according to any one of claims 5-8, characterized in that, Along the length direction of the first housing: The fan is located on the side of the heating element group facing the outside of the first housing, and the distance between the first heat exchanger and the fan is less than 0.5 mm; Along the width direction of the first housing: The dimensions of the first heat exchanger in the width direction of the first housing are matched with the first air outlet.

10. The electronic device according to any one of claims 5-9, characterized in that, The first housing has a second air duct located at a position opposite to the end of the first heat pipe, and the second air duct is located between the first heat pipe and the circuit board; One end of the second air duct is connected to the adjacent first air outlet, and the other end of the second air duct is connected to the first outlet and the adjacent first air duct.

11. The electronic device according to claim 10, characterized in that, The first housing has a third air duct located at a position opposite to the end of the first heat pipe. The third air duct is located between the circuit board and the housing body and connects the first outlet to the two first air outlets.

12. The electronic device according to claim 11, characterized in that, It also includes an air guide assembly, which includes a first air guide, a second air guide and a third air guide. The first air guide is disposed between the end of the first heat pipe and the bottom shell, and together with the bottom shell, forms the first air duct. The second air guide is disposed between the end of the first heat pipe and the circuit board, and the second air guide, the end of the first heat pipe and the circuit board form the second air duct; The third air guide is disposed between the circuit board and the housing body, and the third air guide, the circuit board and the housing body form the third air duct.

13. The electronic device according to any one of claims 5-12, characterized in that, The first heat-conducting plate is connected to the first heat exchanger.

14. The electronic device according to any one of claims 4-13, characterized in that, The air intake area is located on the bottom shell opposite to the air inlet; The first housing has a user side and a pivot side in the width direction, the pivot side being used to mount a pivot, and at least part of the first opening is located on the pivot side of the first housing opposite to the heating element group.

15. The electronic device according to any one of claims 1-3, characterized in that, It also includes a circuit board, which is disposed inside the first housing. The first housing has a bottom shell and a housing body that are disposed opposite each other in the thickness direction. The heating element group is disposed on the side of the circuit board facing the bottom shell. The first housing has a first air duct located at a position opposite to the end of the first heat pipe, and at least a portion of the first air duct is located between the bottom housing and the first heat pipe. The first opening is located on the bottom shell near the first air outlet, and the bottom shell is provided with a first opening at the position corresponding to the first air outlet of the two fans. The first air duct connects the adjacent first outlet and the adjacent first air outlet.

16. The electronic device according to claim 15, characterized in that, The air intake area is located at the edge region of the first housing in the longitudinal direction.

17. The electronic device according to claim 15 or 16, characterized in that, The heat dissipation module further includes a second heat exchanger, which is disposed opposite to the first air outlet, and the second heat exchanger is connected to the end of the first heat pipe facing the bottom shell. The second heat exchanger has multiple sub-air ducts, which are connected to the first air duct corresponding to the end of the first heat pipe and the first air outlet.

18. The electronic device according to claim 17, characterized in that, The second heat exchanger includes a heat exchange shell and multiple heat dissipation fins, and the heat exchange shell has an air inlet on the side facing the first air outlet; The plurality of heat dissipation fins are disposed inside the heat exchange shell, and divide the space inside the heat exchange shell into a plurality of sub-air ducts. One end of each sub-air duct is connected to the first air outlet. The heat exchange shell has a connecting opening on the side facing the bottom shell, and the connecting opening connects the other end of the sub-air duct and the first air duct.

19. The electronic device according to claim 18, characterized in that, The heat dissipation fins are inclined inside the heat exchange shell so that the sub-air duct matches the airflow direction flowing out of the first air outlet.

20. The electronic device according to any one of claims 15 to 19, characterized in that, The first housing has a third outlet, and the two fans share one third outlet; The first housing has a second air duct located at a position opposite to the end of the first heat pipe. The second air duct is located between the first heat pipe and the circuit board, and the second air duct connects the third outlet to the adjacent first air outlet.

21. The electronic device according to claim 20, characterized in that, The first housing has a user side and a pivot side in the width direction, the pivot side being used to mount a pivot, and at least part of the third outlet is located on the first housing at the position opposite to the heating element on the pivot side.

22. The electronic device according to claim 20 or 21, characterized in that, The first housing is provided with a third air duct, which is located between the circuit board and the housing body, and the third air duct connects the third outlet and the two first air outlets.

23. The electronic device according to claim 22, characterized in that, It also includes an air guiding assembly, which includes a fourth air guiding component, a fifth air guiding component, a sixth air guiding component, and a seventh air guiding component; Along the length of the first housing, the fourth air guide and the fifth air guide are spaced apart between the end of the first heat pipe and the bottom housing, and the fourth air guide and the fifth air guide together with the bottom housing form the first air duct; The sixth air guide is disposed between the end of the first heat pipe and the circuit board, and the sixth air guide, the first heat pipe and the circuit board form the second air duct; The seventh air guide is located between the circuit board and the housing body, and together with the circuit board and the housing body, forms the third air duct.

24. The electronic device according to any one of claims 15-23, characterized in that, There is a gap between the first heat-conducting plate and the first heat exchanger.

25. The electronic device according to any one of claims 1-24, characterized in that, The first heat-conducting plate includes a copper plate or an aluminum plate.

26. The electronic device according to any one of claims 1-25, characterized in that, The heat-generating element includes at least one of a power supply element, a power supply element for the memory module, a memory module, and a charging element. The power supply element for the processor and the power supply element for the memory module both include a power supply inductor and a power supply field-effect transistor. The charging element includes a charging inductor and a charging field-effect transistor. At least one of the power supply field-effect transistor, the charging field-effect transistor, and the memory module is covered by the first heat pipe; At least one of the power supply inductor and the charging inductor is covered by the first heat-conducting plate.

27. The electronic device according to any one of claims 1-26, characterized in that, It also includes a processor, which is disposed within the first housing and located between the two fans; The fan also has a second air outlet, and the housing has a second outlet opposite to the second air outlet; The heat dissipation module further includes a second heat-conducting plate, a second heat pipe, and two heat sinks. A heat sink is provided between the second air outlet of each of the two fans and the corresponding second outlet. The second heat-conducting plate covers the processor, a portion of the second heat pipe covers the second heat-conducting plate, and the two ends of the second heat pipe extend to the two second air outlets respectively and are connected to the heat sinks provided at the second air outlets. At least one end of the first heat pipe is connected to the second heat pipe.

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