Battery module and electric device
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-12-30
- Publication Date
- 2026-08-13
Smart Images

Figure CN2025147579_13082026_PF_FP_ABST
Abstract
Description
Battery modules and electrical equipment Technical Field
[0001] This application relates to the field of energy storage technology, and in particular to a battery module and an electrical device. Background Technology
[0002] Currently, charging speed and temperature rise are two major factors affecting the user experience of electronic products such as mobile phones, laptops, and tablets. With the continuous improvement of mobile phone performance and the widespread application of AI in recent years, the power consumption of the main unit is increasing, and mobile phone manufacturers are constantly raising their requirements for battery capacity. However, the space for the battery is constantly decreasing due to the compression of key components such as cameras and motherboards, making the demand for increasing the energy density of battery modules exceptionally strong. In related technologies, a flexible circuit board is electrically connected to a protection board, and then the protection board is placed at the head of the casing and injection molded, allowing the flexible circuit board to extend for connecting to external circuits. However, because the flexible circuit board is embedded in the injection molding compound, its mobility is affected. Summary of the Invention
[0003] In view of this, this application provides a battery module and an electrical device that can improve the mobility of flexible circuit boards.
[0004] In a first aspect, embodiments of this application provide a battery module, including a battery cell, a first circuit board, a casing, and a second circuit board. The battery cell includes a housing, an electrode assembly, and tabs. The housing includes a main body and a packaging portion. The electrode assembly is housed within the main body. The main body includes a top wall and side walls. The packaging portion includes a top seal, a side seal, and an edge sealing connection portion. The top seal is connected to the top wall and extends along a first direction. The side seal is connected to the side wall and is disposed opposite to the side wall along a second direction. The edge sealing connection portion is connected to the side seal and the top seal. The top seal, the edge sealing connection portion, and the top wall form an accommodating space. The tabs include a connected portion and a protruding portion. The connected portion connects to the electrode assembly, and the protruding portion extends from the top seal. The first circuit board is housed within the accommodating space. The first circuit board includes a substrate. The substrate is connected to the protruding portion. The thickness direction of the main body is a third direction. The thickness direction of the substrate intersects with the third direction. The third direction, the first direction, and the second direction are perpendicular to each other. The cover covers the top wall, top sealing portion, protrusion, edge sealing connection portion, and first circuit board. A release groove is provided on the side of the cover away from the main body in a first direction. The release groove is disposed opposite to the substrate in a second direction and is located between the top sealing portion, edge sealing connection portion, substrate, and top wall. One end of the second circuit board is connected to the substrate, and the other end of the second circuit board protrudes from the cover through the release groove.
[0005] By providing a release groove on the side of the cover member away from the main body in the first direction, and the release groove being disposed opposite to the substrate in the second direction, the second circuit board can extend out from the release groove, thereby reducing the length of the second circuit board covered by the cover member and improving the mobility of the second circuit board.
[0006] In the above embodiments, the second circuit board includes an embedded portion, a lead-out portion, and an external portion connected together. The embedded portion is located within the cover, connected to the substrate, and disposed opposite to the substrate along a first direction. The external portion is located outside the cover and configured to connect to an external circuit. The lead-out portion includes a first lead-out sub-port and a second lead-out sub-port connected together. The first lead-out sub-port is connected to the embedded portion and located within the cover, while the second lead-out sub-port is located outside the cover. The second lead-out sub-port includes a first lead-out section and a second lead-out section connected together. The first lead-out section is located within a release groove and connected to the first lead-out sub-port, while the second lead-out section is located outside the release groove and connected to the external portion.
[0007] The first lead-out part is located inside the cover and connected to the embedded part, so that there is a gap between the embedded part and the release groove, which is beneficial to cover the first lead-out part by the cover, thereby improving the positional stability of the embedded part.
[0008] In one or more of the above embodiments, the release groove includes a first inner wall, a second inner wall, a third inner wall, and a fourth inner wall. The first inner wall, the second inner wall, the third inner wall, and the fourth inner wall enclose a release space with an opening. The second inner wall and the top wall are arranged opposite each other along a first direction, and the second inner wall and the opening are arranged opposite each other along the first direction. The first inner wall and the sealing edge connection portion are arranged opposite each other along a second direction. The third inner wall and the substrate are arranged opposite each other along a second direction. The fourth inner wall and the top sealing portion are arranged opposite each other along a third direction. The first inner wall and the third inner wall are arranged opposite each other along the second direction. The second lead-out portion extends out from the second inner wall.
[0009] The first inner wall, the second inner wall, the third inner wall and the fourth inner wall enclose a release space with an opening. By extending the second lead-out section from the second inner wall, and the second inner wall and the opening being arranged opposite each other in the first direction, the first lead-out section extends directly toward the opening, which is beneficial to improving the mobility of the second lead-out section.
[0010] In one or more of the above embodiments, the release groove includes a first inner wall, a second inner wall, a third inner wall, and a fourth inner wall. The first inner wall, the second inner wall, the third inner wall, and the fourth inner wall enclose a release space with an opening. The second inner wall and the top wall are arranged opposite each other along a first direction, and the second inner wall and the opening are arranged opposite each other along the first direction. The first inner wall and the sealing edge connection portion are arranged opposite each other along a second direction. The third inner wall and the substrate are arranged opposite each other along a second direction. The fourth inner wall and the top sealing portion are arranged opposite each other along a third direction. The first inner wall and the third inner wall are arranged along the second direction, and the second lead-out portion extends out from the third inner wall.
[0011] The third inner wall is disposed opposite to the substrate along the second direction, and the second lead-out portion extends from the third inner wall, so that the extension direction of the first lead-out portion is basically consistent with the extension direction of the embedded portion, which facilitates the injection molding of the cover part. At the same time, compared with the second lead-out portion extending from the second inner wall, the second lead-out portion extending from the third inner wall is closer to the opening of the release space, which is beneficial to the mobility of the second lead-out portion.
[0012] In one or more of the above embodiments, the first lead-out portion extends into the release groove in a direction away from the top wall. The first lead-out portion includes a first connecting end and a second connecting end. The first connecting end is connected to the embedded portion, and the second connecting end is connected to the first lead-out segment. In a third direction, the distance between the second connecting end and the top wall is greater than the distance between the first connecting end and the top wall.
[0013] By setting the distance between the second connecting end and the top wall to be greater than the distance between the first connecting end and the top wall, the second lead-out part extends closer to the opening of the release space from the third inner wall, which is beneficial to the mobility of the second lead-out part.
[0014] In one or more of the above embodiments, the distance between the first inner wall and the third inner wall gradually decreases along the direction away from the top wall.
[0015] The distance between the first inner wall and the third inner wall gradually decreases in the direction away from the top wall, thereby reducing the size of the opening of the release space and improving the positional stability of the second lead-out section.
[0016] In one or more of the above embodiments, along a third direction, the top cover includes a first sub-side facing the first circuit board and a second sub-side facing away from the first circuit board, the second sub-side including an exposed area exposed to the cover.
[0017] The exposed area on the second side is visible to the cover, which helps to reduce the space occupied by the cover in the third direction and improves the energy density of the battery module.
[0018] In one or more of the above embodiments, the battery cell further includes a tab seal located between the tab and the top seal, with the protrusion extending from the tab seal. The second sub-side also includes a covering area located within the covering, with the exposed area overlapping the tab seal along a third direction.
[0019] Along the third direction, the tab seal occupies a certain amount of additional space. By overlapping the exposed area with the tab seal, it is beneficial to reduce the additional space occupied by the cover in the third direction and improve the energy density of the battery module.
[0020] In one or more of the above embodiments, the protrusion includes a first extension section and a second extension section. The second extension section is connected to the first circuit board and is disposed opposite to the first circuit board along a first direction. The first extension section includes a first sub-segment, a second sub-segment, and a bending segment. The first sub-segment is connected to the connecting portion, the second sub-segment is connected to the second extension section, and the bending segment is connected to the first sub-segment and the second sub-segment. The first sub-segment and the second sub-segment are disposed opposite to each other along a third direction.
[0021] The bending section connects the first sub-segment and the second sub-segment, which are arranged opposite each other along a third direction. The second extension section connects to the first circuit board and is arranged opposite to the first circuit board along a first direction, thereby shaping the protrusion and reducing the impact of the protrusion rebounding due to stress on the installation of the first circuit board, which is beneficial to controlling the position of the first circuit board in the receiving space.
[0022] In one or more of the above embodiments, a recess is provided between the second sub-segment and the second extension segment, and the recess extends toward the top wall along the first direction.
[0023] By shaping the protruding part of the electrode tab with the concave part, the impact of the protruding part rebounding due to stress on the mounting of the first circuit board is reduced.
[0024] In one or more of the above embodiments, along the first direction, the distance between the bent section and the top wall is D1, and the distance between the second extension section 1 and the top wall is D2, where 0.1mm≤D1-D2≤2.5mm.
[0025] By controlling the difference between the distance D1 between the bent section and the top wall and the distance D2 between the second extension section and the top wall to between 0.1mm and 2.5mm, it is easier to place the first circuit board. When the difference between the distance D1 between the bent section and the top wall and the distance D2 between the second extension section and the top wall is greater than 2.5mm, there is insufficient space to accommodate the first circuit board, and the first circuit board may be easily damaged by pressure. When the difference between the distance D1 between the bent section and the top wall and the distance D2 between the second extension section and the top wall is less than 0.1mm, due to the thickness and assembly tolerance of the tab itself, there is a risk that the tab may exceed the product size range.
[0026] In one or more of the above embodiments, the battery module includes two battery cells arranged side by side along a second direction; each battery cell has a first side wall as its side wall and a first side seal as its side sealing portion. The first side seal of the same battery cell is connected to the first side wall and is arranged opposite to the first side wall along the second direction. The first side seals of the two battery cells are arranged opposite to each other along the second direction. The encapsulation portion of each battery cell also includes a first edge sealing connection portion, which connects the first side seal and the top seal. The first edge sealing connection portions of the two battery cells are arranged adjacent to each other. The first edge sealing connection portion includes a first sub-part and a second sub-part. The first sub-part is arranged opposite to the top seal along a third direction, and the second sub-part is arranged opposite to the top wall along a first direction.
[0027] By setting the first sub-part opposite to the top seal in a third direction and the second sub-part opposite to the top wall in a first direction, the interference of the first side seals of the two cells opposite to each other in the second direction on the first circuit board is reduced, making it easier for the first circuit board to connect the two cells at the same time.
[0028] In one or more of the above embodiments, the substrate includes a first region, a second region, and a third region distributed along a second direction. The first region is located in the accommodating space of a battery cell and is disposed opposite to the top wall of the battery cell along the first direction. The third region is located in the accommodating space of another battery cell and is disposed opposite to the top wall of the battery cell along the first direction. The second region is disposed opposite to the first sub-parts of the two battery cells along the third direction. The second region is also disposed opposite to the second sub-parts of the two battery cells along the first direction.
[0029] The second region of the substrate is disposed opposite to the first sub-parts of the two cells along a third direction. The second region is also disposed opposite to the second sub-parts of the two cells along a first direction, thereby reducing the risk of interference between the first edge sealing connection and the second region, facilitating the increase of the width of the second region along the third direction, and improving the onboard capacity of the first circuit board.
[0030] In one or more of the above embodiments, the main body of each cell further includes a second sidewall distributed along a second direction, and the encapsulation portion of each cell includes a second side seal portion. The second side seal portion of the same cell is connected to the second sidewall and is disposed opposite to the second sidewall along the second direction. The encapsulation portion of each cell further includes a second sealing edge connection portion. The second sealing edge connection portion is connected to the second side seal portion and the top seal portion at one end away from the first sealing edge connection portion along the second direction. When viewed along the first direction, the second sealing edge connection portion overlaps with the side seal portion.
[0031] Viewed along the first direction, the second edge sealing connection part overlaps with the side sealing part, thereby reducing the space occupied by the second edge sealing connection part.
[0032] In one or more of the above embodiments, the covering includes a connected covering body and a covering protrusion. The covering protrusion is disposed on the side of the covering body away from the first circuit board. Along the first direction, the covering protrusion protrudes from the top sealing portion. The covering body covers the top wall, the top sealing portion, the protrusion, the sealing edge connection portion, and the first circuit board. A release groove is disposed in the covering body. Along the first direction, the projections of the protrusion and the first circuit board are located within the projection of the covering protrusion.
[0033] The covering protrusion is located on the side of the covering body away from the first circuit board, and the projection of the protrusion and the first circuit board is located within the projection of the covering protrusion, thereby improving the protection of the protrusion and enhancing the safety of the protrusion.
[0034] Secondly, embodiments of this application provide an electrical device including the battery module described in one or more of the above embodiments. Attached Figure Description
[0035] Figure 1 is a schematic diagram of the overall structure of a battery module in one embodiment of this application, showing the structure of a single cell.
[0036] Figure 2 is a schematic diagram showing the positional relationship between the main body and the first circuit board and the second circuit board in one embodiment of this application.
[0037] Figure 3 is a cross-sectional view of a battery module in one embodiment of this application.
[0038] Figure 4 is a schematic diagram showing the positional relationship between the cover and the second circuit board in one embodiment of this application.
[0039] Figure 5 is a schematic diagram showing the positional relationship between the cover and the second circuit board in another embodiment of this application.
[0040] Figure 6 is a schematic diagram showing the positional relationship between the cover and the second circuit board in another embodiment of this application.
[0041] Figure 7 is a schematic diagram of the positional relationship between the cover and the second circuit board in another embodiment of this application.
[0042] Figure 8 is a cross-sectional view of the battery module in another embodiment of this application.
[0043] Figure 9 is a cross-sectional view of the battery module in another embodiment of this application.
[0044] Figure 10 is a cross-sectional view of the battery module in another embodiment of this application.
[0045] Figure 11 is a cross-sectional view of the battery module in another embodiment of this application.
[0046] Figure 12 is a cross-sectional view of the battery module in another embodiment of this application.
[0047] Figure 13 is a cross-sectional view of the battery module in another embodiment of this application.
[0048] Figure 14 is a cross-sectional view of the battery module in another embodiment of this application.
[0049] Figure 15 is a partial structural diagram of the battery module in another embodiment of this application.
[0050] Figure 16 is a partial structural diagram of the battery module in another embodiment of this application.
[0051] Figure 17 is a schematic diagram showing the positional relationship between the first circuit board and the top seal in one embodiment of this application.
[0052] Figure 18 is a schematic diagram of the positional relationship between the first circuit board and the top seal from another perspective in one embodiment of this application.
[0053] Figure 19 is a schematic diagram of the overall structure of the battery module in one embodiment of this application, showing the structure of a dual-cell battery.
[0054] Figure 20 is a schematic diagram of the assembly relationship between two battery cells and a first circuit board in one embodiment of this application.
[0055] Figure 21 is a schematic diagram of the positional relationship between the shielding component and the battery module in one embodiment of this application.
[0056] Figure 22 is a schematic diagram of the structure of an electrical device in one embodiment of this application.
[0057] Explanation of main component symbols
[0058] 001, Battery module 113, Accommodation space 420, Second covering section
[0059] 100, battery cell 130, electrode tab 430, main body of the casing
[0060] 110, housing 131, connecting part 431, release groove
[0061] 111. Main body 132. Extension 4311. First inner wall
[0062] 1111, Top wall 1321, First extension section 4312, Second inner wall
[0063] 1112, side wall 1321a, first sub-segment 4313, third inner wall
[0064] 1112a, First sidewall 1321b, Bending section 4314, Fourth inner wall
[0065] 1112b, Second sidewall 1321c, Second sub-segment 4315, Release space
[0066] 112, Encapsulation section 1322, Second extension section 4315a, Opening
[0067] 1121, Top seal 140, Electrode seal 440, Covering protrusion
[0068] 1121a, First sub-side 200, First circuit board 500, Second circuit board
[0069] 1121b, second sub-side surface 210, substrate 510, embedded portion
[0070] S1, Exposed area 211, Mounting surface 520, Lead-out section
[0071] S2, Covering area 220, Electronic component 521, First lead-out sub-section
[0072] 1122, Side sealing part 230, First side surface 5211, First connecting end
[0073] 1122a, First side seal 231, First clearance groove 5212, Second connecting end
[0074] 1122b, Second side seal 240, Second side surface 522, Second lead-out section
[0075] 1123, edge sealing connection part 250, first area 5221, first lead-out section
[0076] 1123a, First edge sealing connection 260, Second region 5222, Second lead-out section
[0077] 1123a1, First Subsection 270, Third Region 530, External Section
[0078] 1123a2, Second Sub-section 300, Adapter 600, Insulating Part
[0079] 1123b, Second edge sealing connection 310, First section 610, Covering component
[0080] 1123b1, Third Subsection 320, Second Section 002, Electrical Equipment
[0081] 1123b2, Fourth Subsection 330, Third Segment X, First Direction
[0082] 1123c1, First connecting part 400, Covering part Y, Second direction
[0083] 1123c2, second connecting part 410, first covering part Z, third direction. Detailed Implementation
[0084] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0085] It should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intervening component present. When a component is considered to be "located" to another component, it can be directly mounted on the other component or there may be an intervening component present.
[0086] Unless otherwise stated, the term "multiple" as used herein refers to two or more.
[0087] The terms “first”, “second”, etc., are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implying the quantity, specific order, or primary and secondary relationship of the indicated technical features.
[0088] The term "perpendicular" is used to describe an ideal state between two components. In actual production or use, two components can exist in a state that is approximately perpendicular. For example, in numerical terms, perpendicularity can refer to the angle between two straight lines within the range of 90° ± 10°, the dihedral angle between two planes within the range of 90° ± 10°, or the angle between a straight line and a plane within the range of 90° ± 10°.
[0089] The term "parallel" is used to describe an ideal state between two components. In actual production or use, two components can exist in a state that is approximately parallel. For example, in numerical terms, parallel can refer to the angle between two straight lines within the range of 180° ± 10°, the dihedral angle between two planes within the range of 180° ± 10°, or the angle between a straight line and a plane within the range of 180° ± 10°.
[0090] It should be noted that when a parameter is greater than, equal to or less than a certain endpoint value, it should be understood that the endpoint value is allowed to have a tolerance of ±5%.
[0091] It should be understood that the dimensions of the structures shown in the accompanying drawings are provided for better understanding and easier description, and this application is not limited to the dimensions shown in the drawings. For the sake of clarity, elements unrelated to the description have been omitted from the details of this specification.
[0092] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0093] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the embodiments and features described below can be combined with each other.
[0094] Please refer to Figures 1 to 3. An embodiment of this application provides a battery module 001, including a battery cell 100 and a first circuit board 200, wherein the first circuit board 200 is disposed at the head of the battery cell 100. Specifically, the battery cell 100 includes a housing 110, an electrode assembly (not shown), and tabs 130. The housing 110 includes a main body portion 111 and an encapsulation portion 112, and the electrode assembly is housed in the main body portion 111.
[0095] The main body 111 includes a top wall 1111, the encapsulation part 112 includes a top sealing part 1121 connected to the top wall 1111, and the electrode tab 130 includes a connecting part 131 and a protrusion 132 connected to each other. The connecting part 131 is connected to the electrode assembly, and the protrusion 132 extends out from the top sealing part 1121.
[0096] A receiving space 113 is formed between the top wall 1111 and the top sealing part 1121, and the first circuit board 200 is housed in the receiving space 113.
[0097] In some embodiments, the first circuit board 200 includes a substrate 210, which is connected to the protrusion 132. The length direction of the main body 111 is defined as the first direction X, the width direction of the main body 111 is defined as the second direction Y, and the thickness direction of the main body 111 is defined as the third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other, and the thickness direction of the substrate 210 intersects with the third direction Z.
[0098] Since the first circuit board 200 is housed in the accommodating space 113 formed between the top wall 1111 and the top sealing portion 1121, the thickness dimension of the substrate 210 is usually smaller than its width dimension, so that the thickness direction of the substrate 210 of the first circuit board 200 intersects with the thickness direction of the main body portion 111, thereby reducing the space occupied by the substrate 210 in the extension direction of the top sealing portion 1121, which is beneficial to improving the energy density of the battery module 001.
[0099] In some embodiments, the first circuit board 200 further includes an electronic component 220, and the substrate 210 has a mounting surface 211, on which the electronic component 220 is disposed. The mounting surface 211 and the top wall 1111 are disposed opposite each other along the first direction X, so that the thickness direction of the substrate 210 is parallel to the length direction of the main body 111, thereby reducing the space occupied by the substrate 210 in the length direction of the battery module 001 and improving the energy density of the battery module 001.
[0100] In some embodiments, the battery cell 100 further includes a tab seal 140, which is located between the tab 130 and the top seal 1121. The protrusion 132 extends out from the tab seal 140, and the tab seal 140 seals the gap between the tab 130 and the top seal 1121, thereby improving the sealing performance of the housing 110.
[0101] Referring to Figure 2, in some embodiments, the main body 111 includes sidewalls 1112 distributed along the second direction Y. The encapsulation part 112 also includes a side sealing part 1122 and an edge sealing connection part 1123. The side sealing part 1122 is connected to the sidewalls 1112 and is disposed opposite to each other along the second direction Y. The top sealing part 1121 and the edge sealing connection part 1123 both extend along the first direction X. The edge sealing connection part 1123 is connected to the side sealing part 1122 and the top sealing part 1121. When viewed along the first direction X, the edge sealing connection part 1123 overlaps with the side sealing part 1122. An accommodating space 113 is formed between the top sealing part 1121, the edge sealing connection part 1123, and the top wall 1111.
[0102] Please refer to Figures 2 and 4. In some embodiments, the battery module 001 further includes a cover 400, which covers the top wall 1111, the top sealing portion 1121, the edge sealing connection portion 1123, the protrusion portion 132, and the first circuit board 200.
[0103] In some embodiments, a portion of the cover 400 is located in the gap between the top seal 1121, the protrusion 132, and the first circuit board 200.
[0104] In some embodiments, the covering 400 is made of resin material. The molten covering 400 fills the gap between the top sealing portion 1121, the protrusion 132, and the first circuit board 200. After cooling and solidification, the covering 400 covers the top wall 1111, the top sealing portion 1121, the edge sealing connection portion 1123, the protrusion 132, and the first circuit board 200, and fixes the relative positions of the top sealing portion 1121, the edge sealing connection portion 1123, the protrusion 132, and the first circuit board 200. At the same time, it protects the electronic component 220 and conducts heat to the electronic component 220, thereby reducing the temperature rise of the battery module 001 head.
[0105] Please refer to Figures 1 to 6. In some embodiments, the cover 400 is provided with a release groove 431 on the side away from the main body 111 along the first direction X. The release groove 431 is disposed opposite to the substrate 210 along the second direction Y. That is, the release groove 431 is located on one side of the substrate 210 along the second direction Y, and the release groove 431 is located between the top sealing part 1121, the edge sealing connection part 1123, the substrate 210 and the top wall 1111.
[0106] Referring to Figures 1, 2, and 4, in some embodiments, the battery module 001 further includes a second circuit board 500. One end of the second circuit board 500 is connected to the substrate 210, and the other end of the second circuit board 500 extends out of the cover member 400 from the release groove 431. By providing the release groove 431 on the side of the cover member 400 away from the main body 111 along the first direction X, and the release groove 431 being disposed opposite to the substrate 210 along the second direction Y, the second circuit board 500 can extend out from the release groove 431 while the cover member covers and protects the top wall 1111, the top sealing portion 1121, the sealing edge connecting portion 1123, the protrusion portion 132, and the first circuit board 200, thereby reducing the length of the second circuit board 500 covered by the cover member 400 and improving the mobility of the second circuit board 500.
[0107] The second circuit board 500 includes an embedded portion 510, a lead-out portion 520, and an external portion 530 connected to each other. The embedded portion 510 is located inside the cover 400 and connected to the substrate 210, and the embedded portion 510 and the substrate 210 are disposed opposite to each other along a first direction X. The external portion 530 is located outside the cover 400 and is configured to connect to an external circuit.
[0108] In some embodiments, the lead-out portion 520 includes a first lead-out sub-portion 521 and a second lead-out sub-portion 522 connected together. The first lead-out sub-portion 521 is connected to the inset portion 510 and located inside the cover 400, while the second lead-out sub-portion 522 is located outside the cover 400.
[0109] The second lead-out portion 522 includes a first lead-out section 5221 and a second lead-out section 5222 connected together. The first lead-out section 5221 is located inside the release groove 431 and connected to the first lead-out portion 521, while the second lead-out section 5222 is located outside the release groove 431 and connected to the external connection portion 530. By placing the first lead-out portion 521 inside the cover member 400 and connecting it to the embedded portion 510, a gap is left between the embedded portion 510 and the release groove 431. This facilitates the covering of the first lead-out portion 521 by the cover member 400, thereby improving the stability of the connection between the embedded portion 510 and the substrate 210.
[0110] In some embodiments, the release groove 431 includes a first inner wall 4311, a second inner wall 4312, a third inner wall 4313 and a fourth inner wall 4314, and the first inner wall 4311, the second inner wall 4312, the third inner wall 4313 and the fourth inner wall 4314 enclose a release space 4315 with an opening 4315a.
[0111] The first inner wall 4311 extends in a direction perpendicular to the second direction Y, the second inner wall 4312 extends in a direction perpendicular to the first direction X, the third inner wall 4313 extends in a direction parallel to the third direction Z and is set at an angle to the first direction X, and the fourth inner wall 4314 extends in a direction perpendicular to the third direction Z.
[0112] Referring to Figure 5, in some embodiments, the second inner wall 4312 and the top wall 1111 are disposed opposite each other along the first direction X, and the second inner wall 4312 and the opening 4315a are disposed opposite each other along the first direction X. The first inner wall 4311 and the edge sealing connection portion 1123 are disposed opposite each other along the second direction Y. The third inner wall 4313 and the substrate 210 are disposed opposite each other along the second direction Y. The fourth inner wall 4314 and the top sealing portion 1121 are disposed opposite each other along the third direction Z. The first inner wall 4311 and the third inner wall 4313 are disposed opposite each other along the second direction Y.
[0113] The second lead-out section 522 extends from the second inner wall 4312. By extending the second lead-out section 522 from the second inner wall 4312, and with the second inner wall 4312 and the opening 4315a positioned opposite each other in the first direction X, the first lead-out section 5221 extends directly toward the opening 4315a, which helps to improve the mobility of the second lead-out section 522.
[0114] Referring to Figure 6, in some embodiments, the third inner wall 4313 is disposed opposite to the substrate 210 along the second direction Y, and the second lead-out portion 522 extends from the third inner wall 4313, so that the extension direction of the first lead-out portion 520 is substantially consistent with the extension direction of the embedded portion 510, which facilitates the injection molding of the cover 400. At the same time, compared with the second lead-out portion 522 extending from the second inner wall 4312, the second lead-out portion 522 extending from the third inner wall 4313 is closer to the opening 4315a of the release space 4315, which is beneficial to improving the mobility of the second lead-out portion 522.
[0115] In some embodiments, the first lead-out portion 521 extends into the release groove 431 in a direction away from the top wall 1111. The first lead-out portion 521 includes a first connecting end 5211 and a second connecting end 5212. The first connecting end 5211 is connected to the embedded portion 510, and the second connecting end 5212 is connected to the first lead-out segment 5221. In the third direction Z, the distance between the second connecting end 5212 and the top wall 1111 is greater than the distance between the first connecting end 5211 and the top wall 1111, so that the second lead-out portion 522 extends from the third inner wall 4313 closer to the opening 4315a of the release space 4315, which is beneficial to improving the mobility of the second lead-out portion 522.
[0116] In some embodiments, the distance between the first inner wall 4311 and the third inner wall 4313 gradually decreases along the direction away from the top wall 1111, thereby reducing the size of the opening 4315a of the release space 4315, which is beneficial to improving the positional stability of the second lead-out section 5222.
[0117] Please refer to Figure 7. In some other embodiments, the edge sealing connection portion 1123 includes a first connection portion 1123c1 and a second connection portion 1123c2. The first connection portion 1123c1 is disposed opposite to the top sealing portion 1121 along a third direction Z, and the second connection portion 1123c2 is disposed opposite to the top wall 1111 along a first direction X. The first connection portion abuts against the top sealing portion, and the second connection portion abuts against the top wall 1111.
[0118] The cover 400 covers the top wall 1111, the top seal 1121, the second connecting portion 1123c2, and the first circuit board 200. The first connecting portion is exposed in the cover 400. The cover 400 has a release groove 431 on the side away from the main body 111 along the first direction X, and the release groove 431 is disposed opposite to the substrate 210 along the second direction Y. The release groove 431 is open along the side away from the substrate 210, and part of the first connecting portion 1123c1 is exposed in the release groove 431 along the third direction Z.
[0119] The release groove 431 includes a second inner wall 4312, a third inner wall 4313, and a fourth inner wall 4314. The second inner wall 4312 extends perpendicularly to the first direction X, the third inner wall 4313 extends parallel to the third direction Z and forms an angle with the first direction X, and the fourth inner wall 4314 extends perpendicularly to the third direction Z. By providing an opening 4315a along the side of the release groove 431 away from the substrate 210, the lead-out space of the second circuit board 500 is increased, thereby improving the lead-out flexibility of the second circuit board 500.
[0120] In some embodiments, the second circuit board 500 is a flexible circuit board.
[0121] In some embodiments, the first circuit board 200 is a rigid circuit board.
[0122] Referring to Figures 1 to 3, in some embodiments, the protrusion 132 includes a first extension 1321 and a second extension 1322. The first extension 1321 is connected to the connecting portion 131, and the second extension 1322 is connected to the first circuit board 200 and is disposed opposite to the first circuit board 200 along a first direction X. In some embodiments, a recess 1321d is provided between the first extension 1321 and the second extension 1322. The recess 1321d extends toward the top wall 1111 along the first direction X. The recess 1321d shapes the protrusion 132 of the tab 130, reducing the impact of the protrusion 132 rebounding due to stress on the installation of the first circuit board 200.
[0123] In some embodiments, the first extension 1321 includes a first sub-segment 1321a, a second sub-segment 1321c, and a bent segment 1321b connected together. The first sub-segment 1321a connects to the connecting portion 131, the second sub-segment 1321c connects to the second extension 1322, and the bent segment 1321b connects the first sub-segment 1321a and the second sub-segment 1321c. The first sub-segment 1321a and the second sub-segment 1321c are disposed opposite each other along a third direction Z. A recessed portion 1321d is disposed between the second sub-segment 1321c and the second extension 1322.
[0124] Firstly, the bent segment 1321b connects the first sub-segment 1321a and the second sub-segment 1321c. The first sub-segment 1321a and the second sub-segment 1321c are positioned opposite each other along a third direction Z. The second extension segment 1322 connects to the first circuit board 200 and is positioned opposite to the first circuit board 200 along a first direction X. The recessed portion 1321d connects the second sub-segment 1321c and the first extension segment 2321, thereby shaping the protruding portion 132 and reducing the impact of the protruding portion 132 rebounding due to stress on the installation of the first circuit board 200, which is beneficial for controlling the position of the first circuit board 200 in the receiving space 113. Secondly, by setting the first sub-segment 1321a, the second sub-segment 1321c, and the bent segment 1321b, the first extension segment 1321 can act as a buffer to accommodate the protruding portion 132 that is too long due to tolerance settings, so as to facilitate the connection between the second extension segment 1322 and the first circuit board 200.
[0125] In some embodiments, along the first direction X, the distance between the bent segment 1321b and the top wall 1111 is D1, and the distance between the second extension segment 1322 and the top wall 1111 is D2, where 0.1mm ≤ D1 - D2 ≤ 2.5mm. By controlling the difference between the distance D1 between the bent segment 1321b and the top wall 1111 and the distance D2 between the second extension segment 1322 and the top wall 1111, which is between 0.1mm and 2.5mm, it is convenient to place the first circuit board 200. When the difference between the distance D1 between the bent segment 1321b and the top wall 1111 and the distance D2 between the second extension segment 1322 and the top wall 1111 is greater than 2.5mm, there is insufficient accommodating space 113, insufficient space to place the first circuit board 200, and the first circuit board 200 is prone to damaging the main body 111. When the difference between the distance D1 between the bent section 1321b and the top wall 1111 and the distance D2 between the second extension section 1322 and the top wall 1111 is less than 0.1mm, the tab 130 itself has thickness and assembly tolerance, which may lead to the risk that the tab 130 exceeds the product size range.
[0126] In some embodiments, the battery module 001 further includes an adapter 300, which includes a first segment 310, a second segment 320, and a third segment 330 connected in sequence. The third segment 330 is connected to the first circuit board 200, and a second extension segment 1322 is located between the first segment 310 and the third segment 330 and connected to the first segment 310. The first segment 310, the second extension segment 1322, the third segment 330, and the first circuit board 200 are stacked along a first direction X. By connecting the first circuit board 200 to the third segment 330 of the adapter 300, and by having the second extension segment 1322 located between the first segment 310 and the third segment 330 and connected to the first segment 310, the protrusion 132 of the tab 130 and the adapter 300 have a more flexible connection position, improving the connection convenience between the tab 130 and the first circuit board 200.
[0127] In some embodiments, the adapter 300 is a nickel sheet.
[0128] In some embodiments, referring to FIG8, the adapter 300 is block-shaped, and the adapter 300 is disposed between the first circuit board 200 and the second extension 1322, and electrically connected to the first circuit board 200 and the second extension 1322.
[0129] In some embodiments, the adapter 300 is a nickel brick and has a single-layer structure.
[0130] Please refer to Figure 9. In some embodiments, the second extension 1322 is directly connected to the first circuit board 200.
[0131] Referring to Figure 10, in some embodiments, the battery module 001 further includes an adapter 300, which includes a first segment 310, a second segment 320, and a third segment 330 connected together. The third segment 330 is connected to the first circuit board 200. The second segment 320 is located on the side of the first segment 310 and the third segment 330 near the top seal 1121.
[0132] The protrusion 132 includes a first extension 1321, a second extension 1322, and a third extension 1323. The third extension 1323 connects to the end of the second extension 1322 away from the first extension 1321. The second extension 1322 and the third extension 1323 are arranged opposite to each other along a first direction X. The third extension 1323 extends from the side of the first segment 310 away from the second segment 320 into the space between the first segment 310 and the third segment 330, and connects to the surface of the first segment 310 facing the third segment 330. The second extension 1322, the first segment 310, the third extension 1323, the third segment 330, and the first circuit board 200 are stacked sequentially along the first direction X. Compared to the second extension 1322 being connected to the first extension 310, by adding a third extension 1323 at the end of the second extension 1322 away from the first extension 1321, the overall length of the protrusion 132 is increased, thereby increasing the welding area available for the protrusion 132 and reducing the risk of increasing the process due to the need to cut the tab seal 140 to increase the welding area.
[0133] Referring to Figure 11, in some embodiments, the substrate 210 also has a transition surface 213, which is disposed opposite to the top wall 1111 along a first direction X.
[0134] The battery module 001 also includes an adapter 300, which is disposed on the adapter surface 213. The adapter 300 includes a first segment 310, a second segment 320, and a third segment 330 connected together. The second segment 320 is located on the side of the first segment 310 and the third segment 330 away from the top seal portion 1121. The third segment 330 is disposed opposite to the first segment 310 along a first direction X, and the third segment 330 is connected to the adapter surface 213. The first segment 310 is connected to the protrusion portion 132.
[0135] The protrusion 132 includes a first extension 1321, a second extension 1322, and a third extension 1323 connected together. The third extension 1323 connects to the end of the second extension 1322 away from the first extension 1321. The third extension 1323 is located between the transition surface 213 and the top wall 1111. The second extension 1322 is disposed opposite to the substrate 210 and the top sealing portion 1121 in the third direction Z. In the third direction Z, the second extension 1322 is located between the substrate 210 and the top sealing portion 1121.
[0136] The third extension segment 1323 extends from the side of the first segment 310 away from the second segment 320 into the space between the first segment 310 and the third segment 330, and connects to the surface of the first segment 310 facing the third segment 330.
[0137] In some embodiments, the transition surface 213 and the mounting surface 211 are located on the same surface of the substrate 200.
[0138] In other embodiments, the transition surface 213 and the mounting surface 211 are located on different surfaces of the substrate 200.
[0139] Referring to Figure 12, in some embodiments, the substrate 210 also has a transition surface 213, which is disposed opposite to the top wall 1111 along a first direction X.
[0140] The battery module 001 also includes an adapter 300, which is disposed on the adapter surface 213. The adapter 300 includes a first segment 310, a second segment 320, and a third segment 330 connected together. The second segment 320 is located on the side of the first segment 310 and the third segment 330 near the top seal 1121. The third segment 330 is disposed opposite to the first segment 310 along a first direction X, and the third segment 330 is connected to the adapter surface 213. The first segment 310 is connected to the protrusion 132.
[0141] The protrusion 132 includes a first extension 1321, a second extension 1322, a third extension 1323, and a fourth extension 1324. The second extension 1322 connects the first extension 1321 and the fourth extension 1324, and the fourth extension 1324 connects the second extension 1322 and the third extension 1323. The third extension 1323, the third segment 330, the first circuit board 200, and the second extension 1322 are stacked sequentially along a first direction X, while the fourth extension 1324, the first circuit board 200, and the top sealing portion 1121 are stacked sequentially along a third direction Z.
[0142] The third extension 1323 connects to the end of the fourth extension 1324 away from the second extension 1322. The third extension 1323 extends from the side of the first segment 310 away from the second segment 320 into the space between the first segment 310 and the third segment 330, and connects to the surface of the first segment 310 facing the third segment 330.
[0143] Referring to Figure 13, in some embodiments, the first circuit board 200 includes a substrate 210 and electronic components 220. The substrate 210 has a mounting surface 211 disposed toward the top wall 1111, and the electronic components 220 are disposed on the mounting surface 211.
[0144] The protrusion 132 includes a first extension 1321, a second extension 1322, and a third extension 1323, with the third extension 1323 connecting to the end of the second extension 1322 away from the first extension 1321. The substrate 210 has a connection surface 212 facing the top seal 1121, and the third extension 1323 is connected to the connection surface 212. The substrate 210, the third extension 1323, and the top seal 1121 are arranged along a third direction Z, thereby reducing the space occupied by the connection structure between the first circuit board 200 and the protrusion 132 in the first direction X, and increasing the energy density of the secondary battery 001.
[0145] In some embodiments, the battery module 001 further includes an adapter (not shown), which is disposed between the connecting surface 212 and the third extension 1323 and connects the third extension 1323 and the connecting surface 212. The substrate 210, the adapter, the third extension 1323, and the top seal 1121 are arranged along the third direction Z, which helps to reduce the space occupied by the adapter in the first direction X and improve the energy density of the secondary battery 001.
[0146] Referring to Figure 14, in some embodiments, the first circuit board 200 includes a substrate 210 and electronic components 220. The substrate 210 has a mounting surface 211 disposed toward the top wall 1111, and the electronic components 220 are disposed on the mounting surface 211.
[0147] The protrusion 132 includes a first extension 1321, a second extension 1322, a fourth extension 1324, and a third extension 1323 connected together. The second extension 1322 connects the first extension 1321 and the fourth extension 1324, and the fourth extension 1324 connects the second extension 1322 and the third extension 1323. The third extension 1323, the substrate 210, and the top sealing portion 1121 are stacked sequentially along the third direction Z, while the top wall 1111, the substrate 210, and the fourth extension 1324 are stacked sequentially along the first direction X.
[0148] The substrate 210 has a connection surface 212 on the side away from the top cover 1121 along the third direction Z. The third extension 1323 is connected to the connection surface 212, thereby reducing the space occupied by the connection structure between the first circuit board 200 and the extension 132 in the first direction X and improving the energy density of the secondary battery 001.
[0149] In some embodiments, the battery module 001 further includes an adapter (not shown), which is disposed between the connecting surface 212 and the third extension 1323 and connects the third extension 1323 and the connecting surface 212. The third extension 1323, the adapter, the substrate 210, and the top seal 1121 are arranged along the third direction Z, which helps to reduce the space occupied by the adapter in the first direction X and improve the energy density of the secondary battery 001.
[0150] Referring to Figure 15, in some embodiments, the first circuit board 200 further includes a protective adhesive 221, which is disposed on the mounting surface 211 and covers the electronic component 220. By providing the protective adhesive 221 on the mounting surface 211 and covering the electronic component 220 with the protective adhesive 221, it is beneficial to improve the safety of the electronic component 220 when assembling the first circuit board 200.
[0151] In some embodiments, the battery module 001 further includes a cover 400, which covers the top seal 1121, the protrusion 132, the substrate 210, and the protective adhesive 221.
[0152] Referring to Figure 16, in some embodiments, the first circuit board 200 further includes a protective bracket 222. The protective bracket 222 has a protective cavity 2221, the opening of which faces the top seal 1121. The first circuit board 200 can at least partially enter the protective cavity 2221 through the opening, and the electronic component 220 is located within the protective cavity 2221. By placing the electronic component 220 within the protective cavity 2221 of the protective bracket 222, and protecting the electronic component 220 by the protective bracket 222, the safety of the electronic component 220 is improved during the assembly of the first circuit board 200.
[0153] In some embodiments, the protective bracket 222 is a one-piece molded plastic part.
[0154] Referring to Figures 2 and 17, in some embodiments, along the third direction Z, the first circuit board 200 has a first side surface 230 facing the top seal portion 1121. The first side surface 230 is provided with a first clearance groove 231. The tab seal 140 is partially located in the first clearance groove 231. Along the third direction Z, the space occupied by the tab seal 140 and the first circuit board 200 is reduced, which is beneficial to improving the energy density of the battery assembly.
[0155] In some embodiments, along the third direction Z, the first circuit board 200 has a second side 240 facing away from the top cover 1121. The second side 240 is at least partially exposed in the cover 400, which helps to reduce the space occupied by the cover 400 in the third direction Z and helps to improve the energy density of the battery module 001.
[0156] Referring to Figures 17 and 18 and in conjunction with Figure 3, in some embodiments, along the third direction Z, the top cover 1121 includes a first sub-side surface 1121a and a second sub-side surface 1121b. The first sub-side surface 1121a faces the first circuit board 200, and the second sub-side surface 1121b faces away from the first circuit board 200. The second sub-side surface 1121b includes an exposed area S1, which is exposed to the cover 400. This helps to reduce the space occupied by the cover 400 in the third direction Z and helps to improve the energy density of the battery module 001.
[0157] In some embodiments, the second sub-side 1121b further includes a covering region S2 located within the covering member 400. Along the third direction Z, the exposed region S1 overlaps with the tab seal 140. Along the third direction Z, the projection of the tab seal 140 lies within the projection of the exposed region S1. The tab seal 140 occupies additional space; by exposing the area of the top seal 1121 with the tab seal 140 within the covering member 400, it is beneficial to reduce the additional space occupied by the covering member 400 along the third direction Z, thereby increasing the energy density of the battery module 001.
[0158] Please refer to Figures 1, 13 and 18. In some embodiments, the battery module 001 also includes an insulating member 600, which covers the exposed area S1, thereby facilitating the protection of the exposed area S1 by the insulating member 600.
[0159] In some embodiments, the insulating member 600 covers the sides of the covering member 400 along the third direction Z and the second direction Y, thereby protecting the components exposed on the covering member 400.
[0160] In some embodiments, the insulating element 600 is insulating tape. When the encapsulation element 400 is formed by low-pressure injection molding, a certain gap needs to be left between the part to be injection molded (such as the top seal 1121) and the mold to allow liquid adhesive to enter the gap and encapsulate the part. Typically, the encapsulation element 400, which is cured between the part to be injection molded and the mold, is thicker than the insulating tape. Using insulating tape to further cover the exposed area S1 is more beneficial for thinning the head of the battery module 001 compared to completely covering the second sub-side 1121b with the encapsulation element 400.
[0161] Please refer to Figures 19 and 20. In some embodiments, the battery module 001 includes two cells 100 arranged side by side along a second direction Y.
[0162] Each battery cell 100 has a main body portion 111 including a first sidewall 1112a distributed along the second direction Y. Each battery cell 100 has a side sealing portion 1122 including a first side sealing portion 1122a. The first side sealing portion 1122a of the same battery cell 100 is connected to the first sidewall 1112a and is disposed opposite to the first sidewall 1112a along the second direction Y. The first side sealing portions 1122a of two battery cells 100 are disposed opposite to each other along the second direction Y.
[0163] Each battery cell 100 has an edge sealing connection portion 1123 including a first edge sealing connection portion 1123a, which connects the first side sealing portion 1122a and the top sealing portion 1121. The first edge sealing connection portions 1123a of two battery cells 100 are arranged adjacent to each other.
[0164] In some embodiments, the first edge sealing connection portion 1123a includes a first sub-portion 1123a1 and a second sub-portion 1123a2. The first sub-portion 1123a1 is disposed opposite to the top sealing portion 1121 along a third direction Z, and the second sub-portion 1123a2 is disposed opposite to the top wall 1111 along a first direction X.
[0165] In some embodiments, the substrate 210 includes a first region 250, a second region 260, and a third region 270 distributed along a second direction Y. The first region 250 is located in the accommodating space 113 of a battery cell 100 and is disposed opposite to the top wall 1111 of the battery cell 100 along the first direction X. The third region 270 is located in the accommodating space 113 of another battery cell 100 and is disposed opposite to the top wall 1111 of the battery cell 100 along the first direction X. The second region 260 is disposed opposite to the first sub-parts 1123a1 of the two battery cells 100 along the third direction Z. The second region 260 is also disposed opposite to the second sub-parts 1123a2 of the two battery cells 100 along the first direction X. Two battery cells 100 are connected simultaneously by the first circuit board 200. The first sub-part 1123a1 is positioned opposite the top sealing part 1121 along the third direction Z, and the second sub-part 1123a2 is positioned opposite the top wall 1111 along the first direction X. The second region 260 of the first circuit board 200 is positioned opposite the first sub-part 1123a1 of the two battery cells 100 along the third direction Z. The second region 260 is also positioned opposite the second sub-part 1123a2 of the two battery cells 100 along the first direction X. This reduces the risk of interference between the first sealing edge connection part 1123a and the second region 260, facilitates increasing the width of the second region 260 along the third direction Z, and improves the onboard capacity of the first circuit board 200.
[0166] Referring to Figures 20 and 21, in some embodiments, the second sub-sections 1123a2 of the two cells 100 are covered by a shielding member 610, which covers a first gap between the second sub-sections 1123a2 of the two cells 100. The shielding member 610 also covers a second gap between the first sub-sections 1123a1 of the two cells 100, in order to improve the problem of molten adhesive entering between the two cells 100 when the overlay 400 is formed by low-pressure injection molding.
[0167] Please refer to Figures 19 and 20. In some embodiments, there is a third gap between the adjacent body portions 111 of the two cells 100. The shielding member 610 also covers the portion of the third gap near the first sealing edge connection portion 1123a to improve the problem of molten adhesive entering between the two cells 100 when the cover 400 is formed by low-pressure injection molding.
[0168] Please refer to Figures 2, 19 and 20. In some embodiments, the main body portion 111 of each cell 100 further includes a second sidewall 1112b distributed along the second direction Y. The encapsulation portion 112 of each cell 100 includes a second side seal portion 1122b. The second side seal portion 1122b of the same cell 100 is connected to the second sidewall 1112b and is disposed opposite to the second sidewall 1112b along the second direction Y.
[0169] Each cell 100 also includes a second sealing connection portion 1123b, which connects the second side sealing portion 1122b and the top sealing portion 1121 at one end away from the first sealing connection portion 1123a along the second direction Y. The second sealing connection portion 1123b includes a third sub-part 1123b1 and a fourth sub-part 1123b2. The third sub-part 1123b1 is disposed opposite to the top sealing portion 1121 along the third direction Z, and the fourth sub-part 1123b2 is disposed opposite to the top wall 1111 along the first direction X.
[0170] Referring to Figures 19 and 20, in some embodiments, the covering 400 further covers a third sub-part 1123b1 and a fourth sub-part 1123b2. The third sub-part 1123b1 is disposed opposite to the top sealing part 1121 along the third direction Z, and the fourth sub-part 1123b2 is disposed opposite to the top wall 1111 along the first direction X. This facilitates the covering 400 covering the second sealing edge connection part 1123b, thereby protecting the second sealing edge connection part 1123b. Simultaneously, the third sub-part 1123b1 being disposed opposite to the top sealing part 1121 along the third direction Z, and the fourth sub-part 1123b2 being disposed opposite to the top wall 1111 along the first direction X, facilitates the flow of the molten covering 400 into the receiving space 113, improving the uniformity of the forming of the covering 400.
[0171] In some embodiments, the cover 400 simultaneously covers the top sealing portion 1121, the protrusion portion 132, the first circuit board 200, the embedded portion 510, and a portion of the lead-out portion 520 of both battery cells 100. The shield 610 covers the sides of the cover 400 along the third direction Z and the second direction Y, thereby protecting components that may be exposed to the cover 400.
[0172] In some embodiments, a second clearance groove 232 is provided on the first side surface 230 along the third direction Z, and the first sub-part 1123a1 is located within the second clearance groove 232. By providing the second clearance groove 232 on the first side surface 230, it is beneficial to improve the problem of interference between the first sub-part 1123a1 and the first circuit board 200.
[0173] Please refer to Figures 2, 3 and 4. In some embodiments, the extension direction of the second edge sealing connection portion 1123b is parallel to the first direction X. The second edge sealing connection portion 1123b connects the second side sealing portion 1122b and the top sealing portion 1121 at one end away from the first edge sealing connection portion 1123a along the second direction Y. When viewed along the first direction X, the second edge sealing connection portion 1123b overlaps with the side sealing portion 1122, thereby reducing the occupancy of the second edge sealing connection portion 1123b on the accommodating space 113.
[0174] In some embodiments, the cover 400 includes a connected cover body 430 and a cover protrusion 440. The cover protrusion 440 is disposed on the side of the cover body 430 away from the first circuit board 200 and protrudes from the top seal portion 1121 along the first direction X. The cover body 430 covers the top wall 1111, the top seal portion 1121, the protrusion 132, the edge sealing connection portion 1123, and the first circuit board 200. A release groove 431 is disposed in the cover body 430.
[0175] Along the first direction X, the projections of the protrusion 132 and the first circuit board 200 are located within the projection of the covering protrusion 440, thereby improving the protection of the protrusion 132 and enhancing the safety of the protrusion 132 through the covering protrusion 440.
[0176] Please refer to Figure 22. An embodiment of this application also provides an electrical device 002, which includes the battery module 001 in one or more of the above embodiments.
[0177] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.
Claims
1. A battery module, characterized in that, include: A battery cell, the battery cell comprising a housing, an electrode assembly, and tabs; The housing includes a main body and a packaging part. The electrode assembly is housed in the main body. The main body includes a top wall and a side wall. The packaging part includes a top sealing part, a side sealing part, and a sealing edge connecting part. The top sealing part is connected to the top wall and extends along a first direction. The side sealing part is connected to the side wall and is disposed opposite to the side wall along a second direction. The sealing edge connecting part is connected to the side sealing part and the top sealing part. The top sealing part, the sealing edge connecting part, and the top wall form an accommodating space. The electrode tab includes a connected part and a protruding part. The connected part is connected to the electrode assembly, and the protruding part extends from the top sealing part. A first circuit board is housed in the accommodating space. The first circuit board includes a substrate, which is connected to the protruding portion. The thickness direction of the main body is a third direction, and the thickness direction of the substrate intersects with the third direction. The first direction, the second direction, and the third direction are perpendicular to each other. A covering member that covers the top wall, the top sealing portion, the protruding portion, the edge sealing connection portion, and the first circuit board. The covering member has a release groove on its side away from the main body along the first direction. The release groove is disposed opposite to the substrate along the second direction and is located between the top sealing portion, the edge sealing connection portion, the substrate, and the top wall. A second circuit board, one end of which is connected to the substrate, and the other end of which extends out of the cover from the release groove.
2. The battery module as described in claim 1, characterized in that, The second circuit board includes an embedded portion, a lead-out portion, and an external portion connected together. The embedded portion is located inside the cover and is connected to the substrate and disposed opposite to the substrate along a first direction. The external portion is located outside the cover and is configured to be connected to an external circuit. The lead-out portion includes a first lead-out sub-port and a second lead-out sub-port connected together. The first lead-out sub-port is connected to the embedded portion and located inside the cover. The second lead-out sub-port is located outside the cover. The second lead-out sub-port includes a first lead-out section and a second lead-out section connected together. The first lead-out section is located inside the release groove and connected to the first lead-out sub-port. The second lead-out section is located outside the release groove and connected to the external part.
3. The battery module as described in claim 2, characterized in that, The release groove includes a first inner wall, a second inner wall, a third inner wall, and a fourth inner wall. The first inner wall, the second inner wall, the third inner wall, and the fourth inner wall enclose a release space with an opening. The second inner wall and the top wall are arranged opposite each other along the first direction, and the second inner wall and the opening are arranged opposite each other along the first direction. The first inner wall and the sealing edge connection portion are arranged opposite each other along the second direction. The third inner wall and the substrate are arranged opposite each other along the second direction. The fourth inner wall and the top sealing portion are arranged opposite each other along the third direction. The first inner wall and the third inner wall are arranged opposite each other along the second direction. The second lead-out portion extends from the second inner wall.
4. The battery module as described in claim 2, characterized in that, The release groove includes a first inner wall, a second inner wall, a third inner wall, and a fourth inner wall. The first inner wall, the second inner wall, the third inner wall, and the fourth inner wall enclose a release space with an opening. The second inner wall and the top wall are arranged opposite each other along the first direction, and the second inner wall and the opening are arranged opposite each other along the first direction. The first inner wall and the sealing edge connection portion are arranged opposite each other along the second direction. The third inner wall and the substrate are arranged opposite each other along the second direction. The fourth inner wall and the top sealing portion are arranged opposite each other along the third direction. The first inner wall and the third inner wall are arranged along the second direction. The second lead-out portion extends from the third inner wall.
5. The battery module as described in claim 4, characterized in that, The first lead-out portion extends into the release groove in a direction away from the top wall. The first lead-out portion includes a first connecting end and a second connecting end. The first connecting end is connected to the embedded portion, and the second connecting end is connected to the first lead-out segment. In the third direction, the distance between the second connecting end and the top wall is greater than the distance between the first connecting end and the top wall.
6. The battery module as described in any one of claims 3 to 5, characterized in that, Along the direction away from the top wall, the distance between the first inner wall and the third inner wall gradually decreases.
7. The battery module as described in claim 3, characterized in that, Along the third direction, the top cover includes a first sub-side facing the first circuit board and a second sub-side facing away from the first circuit board, the second sub-side including an exposed area exposed to the cover.
8. The battery module as described in claim 7, characterized in that, The battery cell also includes a tab seal, which is located between the tab and the top seal. The protruding portion extends from the tab seal. The second sub-side also includes a covering area, which is located inside the covering and extends along the third direction. The exposed area overlaps with the tab seal.
9. The battery module as described in claim 1, characterized in that, The protruding portion includes a first extension section and a second extension section. The second extension section is connected to the first circuit board and is disposed opposite to the first circuit board along a first direction. The first extension section includes a first sub-segment, a second sub-segment, and a bending segment. The first sub-segment is connected to the connecting portion, the second sub-segment is connected to the second extension section, and the bending segment is connected to the first sub-segment and the second sub-segment. The first sub-segment and the second sub-segment are disposed opposite to each other along the third direction.
10. The battery module as described in claim 9, characterized in that, A recess is provided between the second sub-segment and the second extension segment, and the recess extends toward the top wall along the first direction.
11. The battery module as described in claim 9, characterized in that, Along the first direction, the distance between the bent section and the top wall is D1, the distance between the second extension section and the top wall is D2, and 0.1mm≤D1-D2≤2.5mm.
12. The battery module as described in claim 1, characterized in that, The battery module includes two battery cells arranged side-by-side along a second direction; each battery cell has a first sidewall as its sidewall and a first side seal as its side sealing portion. The first side seal of the same battery cell is connected to the first sidewall and is arranged opposite to the first sidewall along the second direction. The first side seals of the two battery cells are arranged opposite to each other along the second direction. The encapsulation portion of each battery cell also includes a first edge sealing connection portion, which connects the first side seal and the top seal. The first edge sealing connection portions of the two battery cells are arranged adjacent to each other. The first edge sealing connection portion includes a first sub-part and a second sub-part. The first sub-part is arranged opposite to the top seal along a third direction, and the second sub-part is arranged opposite to the top wall along a first direction.
13. The battery module as described in claim 12, characterized in that, The substrate includes a first region, a second region, and a third region distributed along the second direction. The first region is located in the accommodating space of one of the battery cells and is disposed opposite to the top wall of the battery cell along the first direction. The third region is located in the accommodating space of another battery cell and is disposed opposite to the top wall of the battery cell along the first direction. The second region is disposed opposite to the first sub-parts of the two battery cells along the third direction. The second region is also disposed opposite to the second sub-parts of the two battery cells along the first direction.
14. The battery module as described in claim 12, characterized in that, The main body of each cell further includes a second sidewall distributed along a second direction, and the encapsulation portion of each cell includes a second side seal portion. The second side seal portion of the same cell is connected to the second sidewall and is disposed opposite to the second sidewall along the second direction. The encapsulation portion of each cell further includes a second edge sealing connection portion. The second edge sealing connection portion connects the second side seal portion and one end of the top seal portion away from the first edge sealing connection portion along the second direction. When viewed along the first direction, the second edge sealing connection portion overlaps with the side seal portion.
15. The battery module as described in claim 1, characterized in that, The covering component includes a connected covering body and a covering protrusion. The covering protrusion is disposed on the side of the covering body away from the first circuit board and protrudes from the top sealing portion along the first direction. The covering body covers the top wall, the top sealing portion, the protrusion, the sealing edge connection portion, and the first circuit board. The release groove is disposed on the covering body. Along the first direction, the projections of the protrusion and the first circuit board are located within the projection of the covering protrusion.
16. An electrical appliance, characterized in that, Includes the battery module as described in any one of claims 1 to 15.