Electronic expansion valve connector and coil assembly and electronic expansion valve

Abstract

An electronic expansion valve connector and coil assembly and an electronic expansion valve. The electronic expansion valve connector comprises a terminal pin and a terminal base, wherein the terminal pin passes through the terminal base, one end of the terminal pin extending into the terminal base and connecting to a lead of an electric motor, and the other end being configured to connect to an external power source; one end of the terminal base is provided with a potting groove, within which the terminal pin is soldered to the lead, the potting groove being filled with insulating adhesive.

Description

The connector, coil assembly, and electronic expansion valve of the electronic expansion valve

[0001] Related applications

[0002] This application claims priority to Chinese patent application filed on February 10, 2025, with application number 202520209218.1, entitled "Connector, Coil Assembly and Electronic Expansion Valve for Electronic Expansion Valve", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of fluid control technology, and in particular to a connector, coil assembly, and electronic expansion valve for an electronic expansion valve. Background Technology

[0004] Electronic expansion valves are typically used as throttling elements in refrigeration systems. An electronic expansion valve includes a coil assembly and a piston assembly. The coil assembly drives the piston assembly to move, thereby controlling the flow rate of the medium at the valve orifice. The coil assembly includes a connector for wiring a motor. Leads from the motor connect to pins, which are used to connect to an external power source to supply power to the motor.

[0005] In related technologies, after the connector pins and leads are connected, there is a lack of insulating material to isolate multiple connector pins. If impurities adhere to the connector pins, adjacent connector pins may touch and cause a short circuit. Summary of the Invention

[0006] According to various embodiments of this application, a connector, coil assembly, and electronic expansion valve for an electronic expansion valve are provided, which can prevent short circuits in the wiring pins.

[0007] This application provides a connector for an electronic expansion valve, including a pin and a socket. The pin passes through the socket, with one end extending into the socket and connected to a motor lead, and the other end connected to an external power source. One end of the socket has a potting groove, and the pin is soldered to the lead in the potting groove, which is filled with insulating adhesive.

[0008] In one embodiment, the insulating adhesive is epoxy adhesive.

[0009] In one embodiment, the depth of the glue-filling groove is H, and the length of the connector pin within the glue-filling groove is L1. The groove depth H and the length L1 satisfy the following relationship: H ≥ 2L1.

[0010] In one embodiment, the width of the glue-filling groove opening is B, and the range of the width B is: 15≤B≤20mm.

[0011] This application also provides a coil assembly for an electronic expansion valve, including a housing, a motor, and a socket for the electronic expansion valve. The motor is located inside the housing and has a lead wire, one end of which extends into the potting groove.

[0012] In one embodiment, the lead and the connector are fixedly connected by soldering.

[0013] In one embodiment, the length of the lead wire extending into the potting groove is L2, and the range of the length L2 is: L2≥2mm.

[0014] In one embodiment, there are multiple connector pins, each corresponding to a lead wire. The distance between the central axes of adjacent connector pins is D1, and the distance between the solder joints of adjacent leads and adjacent connector pins is D2. The distances D1 and D2 satisfy the following relationship: D2 ≥ D1.

[0015] In one embodiment, there are multiple connector pins, each corresponding to a lead wire. The distance between the solder joints of adjacent leads and adjacent connector pins is D2, and the range of distance D2 is: D2 > 2.5 mm.

[0016] This application also provides an electronic expansion valve, including the coil assembly of the electronic expansion valve described above.

[0017] Details of one or more embodiments of this application are set forth in the following drawings and description. Other features, objects, and advantages of this application will become apparent from the specification, drawings, and claims. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or conventional technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 is a schematic diagram of the structure of the connector provided in this application after potting.

[0020] Figure 2 is a structural schematic diagram of the connection method of the connector pin and the lead wire in one embodiment.

[0021] Figure 3 is a structural schematic diagram of the connection method of the connector pin and the lead wire in another embodiment.

[0022] Figure 4 is a schematic diagram of the electronic expansion valve provided in this application.

[0023] Reference numerals: 1000, Electronic expansion valve; 100, Coil assembly of electronic expansion valve; 10, Socket of electronic expansion valve; 11, Terminal block; 111, Potting tank; 112, Insulating adhesive; 113, Positioning step; 114, Receiving groove; 12, Connecting pin; 13, Sheath; 131, Opening; 20, Housing cover; 30, Motor; 31, Lead wire; 40, Connecting plate; 200, Valve seat; 201, First port; 202, Second port; 203, Valve port; 300, Piston assembly; 400, Guide sleeve. Detailed Implementation

[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0025] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0029] This application provides a connector 10 (hereinafter referred to as connector 10) for an electronic expansion valve, which is installed on the electronic expansion valve 1000 and is used to supply power to the coil assembly 100 of the electronic expansion valve.

[0030] Specifically, the socket 10 includes a terminal block 11 and a pin 12. The pin 12 passes through the terminal block 11, with one end of the pin 12 extending into the terminal block 11 and connecting to the lead wire 31 of the motor 30, and the other end used to connect to an external power source.

[0031] Please refer to Figures 1 to 3. Figure 1 is a structural schematic diagram of the connector 10 after glue filling according to this application. Figure 2 is a structural schematic diagram of the connection method of the pin 12 and the lead wire 31 in one embodiment. Figure 3 is a structural schematic diagram of the connection method of the pin 12 and the lead wire 31 in another embodiment. One end of the connector 11 has a glue filling groove 111. The pin 12 is soldered to the lead wire 31 in the glue filling groove 111. The glue filling groove 111 is filled with insulating glue 112. This arrangement can enhance the insulation strength of the connector 10. Since the circuit will be conductive when the lead wire 31 and the pin 12 are connected, and there are multiple leads 31 and pins 12, filling the glue filling groove 111 can isolate each group of leads 31 and pins 12, preventing each group of leads 31 and pins 12 from contacting each other due to impurities, which could lead to a short circuit. The insulation effect is good, and the cost of glue filling is low.

[0032] In one embodiment, the insulating adhesive 112 is epoxy resin. Epoxy resin has strong chemical stability and corrosion resistance, as well as high bonding strength. This configuration enhances the corrosion resistance and insulation reliability of the connector 10. The epoxy resin material is liquid and cures after being poured into the potting tank 111. It is suitable for temperatures between -50℃ and +150℃, and its water absorption rate is <0.1%, making it widely applicable. The low water absorption rate ensures that the connection between the lead 31 and the connector 12 will not short-circuit due to contact with water, thus guaranteeing the reliability of the insulation.

[0033] Further, please refer to Figure 2, which is a structural schematic diagram of the connection method between the connector pin 12 and the lead wire 31 in one embodiment. The width of the groove opening of the glue potting groove 111 is B, and the range of width B is 15≤B≤20mm. A suitable width can not only limit the overall width of the socket 10, but also facilitate the soldering of the lead wire 31 and the connector pin 12. It can be understood that if the width is too small, it will be inconvenient for the installer to operate when connecting the lead wire 31 and the connector pin 12; if the width is too large, it will increase the volume of the socket 10. The width B of the groove opening of the glue potting groove 111 can be 15mm, 16mm, 17mm, 18mm, 19mm, 20mm or any other value between 15mm and 20mm.

[0034] The depth of the potting groove 111 is H, and the length of the connector 12 within the potting groove 111 is L1. The groove depth H and the length L1 satisfy the following relationship: H ≥ 2L1. This design reduces the thermal impact on the connection between the lead 31 and the connector 12 during potting. It is understood that potting occurs at the opening of the potting groove 111, and the adhesive generates heat during potting. By setting the welding points of the lead 31 and the connector 12 at a certain distance from the groove opening, the adhesive temperature has already decreased by the time it flows to the welding points, thus reducing the thermal impact and preventing excessively high temperatures from melting and causing the weld between the lead 31 and the connector 12 to detach. Furthermore, the sufficiently deep welding points of the lead 31 and the connector 12, along with the sufficient thickness of the insulating adhesive 112 to isolate the leads 31 and the connector 12, enhance insulation. The groove depth H can be any value greater than twice, three times, or four times L1.

[0035] The connector 10 has a positioning step 113 on the end face of the glue potting groove 111. The positioning step 113 is used for positioning other parts and facilitates the fixing of the connector 10 and other parts.

[0036] Furthermore, the socket 10 also includes a sheath 13. The end of the terminal block 11 away from the potting groove 111 has a receiving groove 114. The sheath 13 is disposed within the receiving groove 114. One end of the connector pin 12 is disposed within the sheath 13. The end of the sheath 13 away from the potting groove 111 has an opening 131. The sheath 13 protects the connector pin 12 and forms a connection end for wiring, allowing it to mate with external terminals.

[0037] This application also provides a coil assembly 100 for an electronic expansion valve (hereinafter referred to as coil assembly 100), including a housing 20, a motor 30 and the aforementioned connector 10. The connector 10 is located at one end of the housing 20, and the motor 30 is located inside the housing 20. The motor 30 has a lead wire 31, one end of which extends into the potting groove 111.

[0038] One end of the cover 20 is located on the positioning step 113 and is fixedly connected to the socket 10 by laser welding.

[0039] The lead wire 31 and the connector pin 12 are fixedly connected by soldering, which can enhance the conductivity between the lead wire 31 and the connector pin 12.

[0040] The length of lead wire 31 extending into the glue-filling groove 111 is L2, and the range of length L2 is: L2 ≥ 2mm. Similarly, allowing lead wire 31 to extend sufficiently into the glue-filling groove 111 not only enhances insulation but also reduces the thermal impact of glue filling on the connection between lead wire 31 and connector 12. If L2 is too short, the connection between lead wire and connector is too close to the groove opening, and the heat generated during glue filling will affect the solder joint between lead wire and connector, and the thickness of the insulating glue after filling cannot guarantee the insulation effect at the solder joint between lead wire and connector. The length L2 of lead wire 31 extending into the glue-filling groove 111 can be any value of 2mm, 3mm, 3mm, 4mm, or more than 2mm.

[0041] Please refer to Figures 2 and 3. In one embodiment, there are multiple pins 12 and multiple leads 31. Each pin 12 and lead 31 corresponds to one other. The distance between the central axes of adjacent pins 12 is D1, and the distance between the solder joints of adjacent leads 31 and adjacent pins 12 (i.e., adjacent solder joints of multiple leads 31 and multiple pins 12) is D2. Distances D1 and D2 satisfy the following relationship: D2 ≥ D1. This ensures that the distance between the solder joints of adjacent leads 31 and pins 12 is sufficiently large, thereby preventing short circuits caused by contact at the solder joints. It should be noted that "multiple leads" here includes two or more leads.

[0042] Furthermore, the distance D2 is in the range of: D2 > 2.5mm. It can be seen that the distance between adjacent connections of lead 31 and connector 12 is large enough to avoid short circuits caused by contact between the connections. D2 can be 2.6mm, 3mm, 4mm or any other value greater than 2.5mm.

[0043] The lead wire 31 can contact the side of the connector pin 12 and be soldered at the contact point, or the end face of the lead wire 31 can contact the end face of the connector pin 12 and be soldered at the contact point.

[0044] The diameter of the connector pin 12 is larger than the diameter of the lead wire 31 core, so that the lead wire 31 core can fully contact the connector pin 12, increasing the welding strength.

[0045] The coil assembly 100 also includes a connecting plate 40, which is located at one end of the housing cover 20 and is used for mounting the motor 30.

[0046] Please refer to Figure 4, which is a structural schematic diagram of the electronic expansion valve 1000 provided in this application. This application also provides an electronic expansion valve 1000, including the aforementioned coil assembly 100, applied in a refrigeration system, which achieves throttling and pressure reduction by controlling the flow rate of the medium. The electronic expansion valve 1000 can be an electric electronic expansion valve or a stepping electronic expansion valve.

[0047] The electronic expansion valve 1000 also includes a valve seat 200, a piston assembly 300, and a guide sleeve 400. The valve seat 200 has a first port 201, a second port 202, and a valve port 203. The first port 201 and the second port 202 penetrate the side wall of the valve seat 200 and are used to connect the medium. The first port 201 and the second port 202 are connected within the valve seat 200 through the valve port 203. One end of the guide sleeve 400 extends into the valve seat 200 and is sealed to the valve seat 200, while the other end is connected to the housing cover 20. A portion of the piston assembly 300 is disposed within the valve seat 200, and another portion is disposed within the guide sleeve 400. One end of the piston assembly 300 is connected to the coil assembly 100, which drives the piston assembly 300 to move so that the piston assembly 300 can adjust the opening degree of the valve port 203.

[0048] In one embodiment, the axes of the first port 201 and the second port 202 are arranged parallel to each other, and the axis of the piston assembly 300 is inclined relative to the axes of the first port 201 and the second port 202, which can reduce the overall height of the electronic expansion valve 1000 and save installation space. In other embodiments, the valve seat 200 may also be configured such that: the axis of the valve port 203 is perpendicular to the axes of the first port 201 and the second port 202, and the axes of the first port 201 and the second port 202 are parallel; or, the axis of the first port 201 is parallel to the axis of the valve port 203, and the axis of the valve port 203 is perpendicular to the axis of the second port 202. The configuration of the valve seat 200 can be adjusted according to different application scenarios.

[0049] During installation, lead wire 31 is inserted into glue potting tank 111, lead wire 31 and connector pin 12 are soldered together, and then glue is poured into the opening of glue potting tank 111. After the insulating glue 112 is cured, each set of lead wire 31 and connector pin 12 is insulated and isolated, which can prevent short circuits, and is low in cost, simple in process, and has strong insulation reliability.

[0050] The technical features of the above-described embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the spirit and essence of this application fall within the scope of protection claimed in this application.

Claims

1. A connector for an electronic expansion valve, comprising a pin and a socket, wherein the pin passes through the socket, one end of the pin extends into the socket and is connected to a motor lead, and the other end is used to connect to an external power source; Its features are, One end of the terminal block is provided with a potting groove, and the terminal pin is soldered to the lead wire in the potting groove. The potting groove is filled with insulating glue.

2. The connector for the electronic expansion valve according to claim 1, wherein, The insulating adhesive is epoxy adhesive.

3. The connector for the electronic expansion valve according to claim 1, wherein, The depth of the glue-filling groove is H, and the length of the connector pin within the glue-filling groove is L1. The groove depth H and the length L1 satisfy the following relationship: H ≥ 2L1.

4. The connector for the electronic expansion valve according to claim 1, wherein, The width of the opening of the glue-filling tank is B, and the range of the width B is: 15≤B≤20mm.

5. A coil assembly for an electronic expansion valve, characterized in that, The device includes a housing, a motor, and a connector for the electronic expansion valve as described in any one of claims 1-4. The motor is located inside the housing and has a lead wire, one end of which extends into the potting groove.

6. The coil assembly of the electronic expansion valve according to claim 5, wherein, The lead wire and the connector pin are fixedly connected by soldering.

7. The coil assembly of the electronic expansion valve according to claim 5, wherein, The length of the lead wire extending into the glue potting groove is L2, and the range of the length L2 is: L2≥2mm.

8. The coil assembly of the electronic expansion valve according to claim 5, wherein, The connector pins are multiple and correspond one-to-one with the leads. The distance between the central axes of adjacent connector pins is D1, and the distance between the solder joints of adjacent leads and adjacent connector pins is D2. The distances D1 and D2 satisfy the following relationship: D2≥D1.

9. The coil assembly of the electronic expansion valve according to claim 5, wherein, The connector pins are multiple and correspond one-to-one with the leads. The distance between the solder joints of adjacent leads and adjacent connector pins is D2, and the range of distance D2 is: D2 > 2.5 mm.

10. An electronic expansion valve, characterized in that, The coil assembly includes the electronic expansion valve as described in any one of claims 5 to 9.

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