Method for producing an electronic component, and electronic component

Abstract

The invention relates to a method for producing an electronic component, comprising the following steps: - providing a transparent film (1) having a first electrically conductive structure (3) on a front main surface (2), - providing at least one transparent film piece (4) having a second electrically conductive structure (6) on a rear main surface (5), - applying a connecting material (18) to the first electrically conductive structure (3) and / or the second electrically conductive structure (6), - mechanically stably and electrically conductively connecting the first electrically conductive structure (3) to the second electrically conductive structure (6) by means of the connecting material (18), wherein - a dielectric (12) is arranged in places between the front main surface (2) of the transparent film (1) and the rear main surface (5) of the transparent film piece (4), and - the transparent film piece (4) has a smaller surface area than the transparent film (1). The invention also relates to an electronic component.

Description

[0001] 2024PF01067 January 21, 2026

[0002] P2024, 1016 WO N - 1 -

[0003] Description

[0004] METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT

[0005] A method for manufacturing an electronic component and an electronic component are described.

[0006] The aim is to present a simplified method for manufacturing an electronic component that is particularly cost-effective and requires few process steps. Furthermore, the aim is to present an electronic component that exhibits a wide range of functionalities.

[0007] These tasks are solved by a method comprising the steps of claim 1 and by an electronic component comprising the features of claim 14.

[0008] Advantageous embodiments and further developments of the method and the electronic component are the subject of the dependent claims.

[0009] According to one embodiment of the method, a transparent film with a first electrically conductive structure on a front surface is provided. The transparent film is particularly flexible and pliable. For example, the transparent film is made of or consists of a plastic, such as a thermoplastic, for instance PET (polyethylene terephthalate), PI (polyimide), or PC (polycarbonate). In addition to the front surface, the transparent film particularly has a 2024PF01067 21 January 2026

[0010] P2024, 1016 WO N - 2 -

[0011] rear main surface, which is opposite the front main surface.

[0012] The first electrically conductive structure, for example, has a metal or is made of a metal, such as copper. In particular, the first electrically conductive structure does not completely cover the main front surface of the transparent film, but leaves areas of the main front surface of the transparent film freely accessible.

[0013] According to another embodiment of the method, at least one transparent film piece with a second electrically conductive structure on a rear main surface is provided. For example, the transparent film piece is made of the same material as the transparent film or is formed from the same material as the transparent film. In particular, the transparent film piece is also flexible and bendable. The transparent film piece can have the same properties and characteristics as the transparent film except for its size. In particular, the transparent film piece is smaller than the transparent film.

[0014] The second electrically conductive structure on the rear main surface of the transparent film piece also preferably comprises a metal or is formed from a metal, such as copper. A front main surface of the transparent film piece, opposite the rear main surface, is preferably free of electrically conductive structures or other elements, such as components or semiconductor chips. In other words, the 2024PF01067 21 January 2026

[0015] P2024, 1016 WO N 3

[0016] The main front surface of the transparent film piece is preferably formed from the plastic.

[0017] For example, the first electrically conductive structure has a multitude of first electrical connection points. These first electrical connection points are specifically designed to accommodate electronic semiconductor chips. For instance, electronic, particularly optoelectronic, semiconductor chips are mechanically and electrically securely mounted onto these first electrical connection points. The electronic semiconductor chips can be connected to the first electrical connection points of the first electrically conductive structure, for example, by soldering, sintering, or gluing.

[0018] For example, the first electrically conductive structure also has a large number of first conductor tracks, which are arranged in a grid-like pattern.

[0019] For example, the second electrically conductive structure also has a multitude of second electrical connection points and a multitude of second conductor tracks. In particular, the second electrically conductive structure can be identical or similar in design to the first electrically conductive structure. In addition to the second electrical connection points, which are designed to accommodate electronic, especially optoelectronic, semiconductor chips and to be electrically conductive and mechanically stable connected to them, the second electrically conductive structure can also have a multitude of second conductor tracks, which are, for example, arranged in a grid pattern.

[0020] According to another implementation form of the method, a bonding material is applied to the first electrically conductive 2024PF01067 21 January 2026

[0021] P2024, 1016 WO N - 4 -

[0022] The bonding material is applied to the first electrically conductive structure and / or the second electrically conductive structure. It is specifically designed to mechanically and electrically connect the first and second electrically conductive structures in a stable and conductive manner. For example, the bonding material is applied by jetting, dispensing, or printing. During application, the bonding material is generally liquid or at least pasty. In particular, after the first and second electrically conductive structures are joined, the bonding material forms at least one connecting element. This connecting element is particularly rigid.

[0023] According to another embodiment of the method, the first electrically conductive structure is mechanically and electrically connected to the second electrically conductive structure by means of the connecting material.

[0024] In particular, the transparent film and the transparent film piece are arranged at least partially parallel to each other after the first electrically conductive structure and the second electrically conductive structure are joined by the connecting material. Specifically, the front main surface of the transparent film with the first electrically conductive structure faces the rear main surface of the transparent film piece with the second electrically conductive structure after joining.

[0025] According to another embodiment of the method, a dielectric is arranged at certain points between the front main surface of the transparent film and the rear main surface of the transparent film piece. The dielectric serves in particular to prevent short circuits between 2024PF01067 21 January 2026

[0026] P2024, 1016 WO N - 5 -

[0027] to prevent the first electrically conductive structure from becoming isolated from the second. The dielectric, in particular, leaves areas free where the connecting material mechanically and electrically connects the first electrically conductive structure to the second. In other words, the dielectric leaves the connecting elements between the transparent film and the transparent film piece free. Specifically, the dielectric is applied to the transparent film piece in a structured manner. This structuring of the dielectric, in particular, generally prevents unwanted insulation at the connection points. For example, the dielectric connects the transparent film and the transparent film piece.

[0028] The materials bond together seamlessly. For example, due to the dielectric, no additional adhesive is needed to connect the transparent foil piece to the transparent foil.

[0029] According to another embodiment of the method, the transparent film piece has a smaller base area than the transparent film. For example, the transparent film piece has a rectangular base shape or a freeform surface as its base shape. For example, the size of the base area of ​​the transparent film piece ranges from 0.1 mm x 0.1 mm to 100 mm x 100 mm.

[0030] The method for manufacturing an electronic component includes, in particular, the following steps: - Providing the transparent film with the first electrically conductive structure on the front main surface, 2024PF01067 21 January 2026

[0031] P2024, 1016 WO N 6

[0032] - Providing at least one transparent piece of film with the second electrically conductive structure on the rear main surface,

[0033] - Applying the bonding material to the first electrically conductive structure and / or the second electrically conductive structure,

[0034] - mechanically stable and electrically conductive connection of the first electrically conductive structure with the second electrically conductive structure by the connecting material, wherein

[0035] - the dielectric is arranged in places between the front main surface of the transparent film and the rear main surface of the transparent film piece, and

[0036] - the transparent piece of foil has a smaller base area than the transparent foil.

[0037] In particular, the steps are carried out in the specified order.

[0038] Preferably, several transparent film pieces are applied to the transparent film using the present method. For this purpose, the process steps described above are repeated several times.

[0039] The transparent film makes it particularly advantageous to implement complex circuits of the electronic component. If the electronic component is an optoelectronic component, such as one with a transparent film containing radiation-emitting semiconductor chips, the present method makes it particularly possible to generate luminescent segments of the electronic component. 2024PF01067 January 21, 2026

[0040] P2024, 1016 WO N - 7 -

[0041] which are nested within each other. A particularly high number of luminous segments of the electronic component can also be achieved using the present method.

[0042] In particular, electronic components with cross-matrix circuits can be realized using the present method. Furthermore, the electronic component obtained with this method exhibits high electromagnetic transmission when using a radiation-emitting semiconductor chip, even with imperfect alignment between the transparent foil piece and the transparent film.

[0043] Furthermore, the transparent film is generally available at a relatively low cost. The surface area of ​​the transparent film and the transparent film section covered with metal for the first and second electrically conductive structures, as well as with dielectric material, is also comparatively small, resulting in low costs. Moreover, the present method advantageously achieves a reliable electrical contact between the two electrically conductive structures.

[0044] According to another embodiment of the method, the first electrically conductive structure is joined to the second electrically conductive structure by soldering, for example with a low-temperature solder as the joining material, by sintering with a sintering paste as the joining material, or by bonding, in particular with a conductive adhesive as the joining material. The joining material, for example the solder, can be applied by printing. Soldering can be carried out with or without pressure. 2024PF01067 January 21, 2026

[0045] P2024, 1016 WO N - 8 -

[0046] When solder is used as a joining material, the solidified solder forms at least one connecting element after soldering. When an electrically conductive adhesive is used as a joining material, it is usually liquid or pasty when applied. Upon curing, the electrically conductive adhesive becomes solid and forms at least one stable connecting element. Similarly, a sintering paste used as a joining material is usually initially applied in liquid or pasty form and transformed into at least one rigid connecting element through sintering.

[0047] Particularly advantageous is the self-centering wetting effect of solder applied as a bonding material on the underlying electrically conductive structure, due to the different wetting properties of the solder on the material of the electrically conductive structure, such as metal, and the material of the transparent film or piece of transparent film, such as plastic. This self-centering wetting effect of the solder on the electrically conductive structures means that precise application of the solder is not necessary.

[0048] According to another embodiment of the process, a positive electrically conductive photoresist is used as the bonding material. The positive electrically conductive photoresist is made soluble, in particular by exposure to electromagnetic radiation, so that exposed areas are removed during development. Specifically, the positive electrically conductive photoresist simplifies the creation of an electrically conductive and mechanically stable bond between the first electrically conductive structure and the second electrically conductive structure. 2024PF01067 January 21, 2026

[0049] P2024, 1016 WO N - 9 -

[0050] For example, the positive electrically conductive photoresist contains metallic flakes. For example, the metallic flakes are needle-shaped. For example, the metallic flakes contain silver or consist of silver.

[0051] According to one embodiment of the method, an electronic semiconductor chip, in particular an optoelectronic semiconductor chip such as a radiation-emitting semiconductor chip, is deposited onto the first electrically conductive structure on the transparent film. For example, the electronic semiconductor chip is mounted on first electrical connection points of the first electrically conductive structure on the main front surface of the transparent film. In particular, the electronic semiconductor chip is deposited using the same method by which the first electrically conductive structure and the second electrically conductive structure are mechanically stable and electrically conductively connected to each other.In other words, if the first electrically conductive structure and the second electrically conductive structure are joined by soldering, the electronic semiconductor chip is also applied to the first electrically conductive structure of the transparent film by soldering. If the first electrically conductive structure and the second electrically conductive structure are joined by sintering, the electronic semiconductor chip is preferably also applied to the first electrically conductive structure of the transparent film by sintering. If the first electrically conductive structure and the second electrically conductive structure are joined by adhesive bonding, the electronic semiconductor chip is also applied to the first electrically conductive structure by adhesive bonding. 2024PF01067 21 January 2026.

[0052] P2024, 1016 WO N 10

[0053] The structure of the transparent film is applied. In particular, the same bonding material is used to connect the first electrically conductive structure and the second electrically conductive structure, and to mount the electronic semiconductor chip. The application of the electronic semiconductor chip to the first electrically conductive structure can take place before or after connecting the first and second electrically conductive structures.

[0054] If the electronic semiconductor chip is applied to the first electrically conductive structure before the transparent film is bonded to the transparent film piece, the topography of the composite of transparent film and transparent film piece can be disregarded during the assembly of the electronic semiconductor chip. If the bond between the transparent film and the transparent film piece occurs before the application of the electronic semiconductor chip, any unevenness caused by the electronic semiconductor chip does not need to be taken into account.

[0055] In particular, the electronic semiconductor chip can be a micro-component, such as a micro-LED or a micro-IC. Furthermore, the electronic semiconductor chip can also be an electrical resistor or a mini-LED.

[0056] A microcomponent is, for example, any electronic component with particularly small dimensions. Typically—and this is a very important criterion in addition to size—a growth substrate has been removed from the microcomponent, so that typical thicknesses of such components are very small. (2024PF01067 21 January 2026)

[0057] P2024, 1016 WO N 11

[0058] Micro-components, for example, range in size from 1.5 micrometers to 10 micrometers.

[0059] In principle, a micro-component does not necessarily have to have a rectangular base when viewed from above. For example, a micro-component may have a base such that, when viewed from above, any lateral extent of the base is less than or equal to 100 micrometers or less than or equal to 70 micrometers, depending on the active semiconductor area that contains semiconductor structures giving the micro-component its electronic function.

[0060] For example, for rectangular micro-components, an edge length of less than or equal to 70 micrometers or less than or equal to 50 micrometers is often cited as a criterion, especially when viewed from above the active semiconductor area.

[0061] Most of these micro-components are provided on wafers with holding structures that can be removed without damaging the micro-components.

[0062] In the literature, various spellings for "micro-component" can be found, e.g. . p-component, p-component, u-component or u-component .

[0063] According to another embodiment, the optoelectronic semiconductor chip is a micro-LED. A micro-LED is, for example, any light-emitting diode (English: ).

[0064] "Light-emitting diode," abbreviated "LED," with particularly small dimensions. Generally, a micro-LED is not a laser that generates electromagnetic laser radiation through stimulated emission. 2024PF01067 21 January 2026

[0065] P2024, 1016 WO N 12

[0066] As a rule - this is also a very important criterion in addition to size - the growth substrate is removed in micro-LEDs, so that typical thicknesses of such micro-LEDs are, for example, in the range of 1.5 micrometers to 10 micrometers.

[0067] In principle, a micro-LED does not necessarily have to have a rectangular radiation emission surface.

[0068] For example, a micro-LED has a radiation emission surface such that, in a top view of the active semiconductor area, each lateral extent of the radiation emission surface is less than or equal to 100 micrometers or less than or equal to 70 micrometers.

[0069] For example, for rectangular micro-LEDs, an edge length of less than or equal to 70 micrometers or less than or equal to 50 micrometers is often cited as a criterion, especially when viewed from above the active semiconductor area.

[0070] Most of these micro-LEDs are provided on wafers with holding structures that can be removed without damaging the micro-LED.

[0071] Currently, the primary applications for micro-LEDs are displays. Micro-LEDs form pixels or subpixels and emit light of a defined color. Due to their small pixel size and high density with close spacing, micro-LEDs are suitable for small monolithic displays for AR applications, particularly smart glasses. Further applications are also being developed, especially in data communication and pixelated lighting applications. 2024PF01067 January 21, 2026

[0072] P2024, 1016 WO N 13

[0073] In the literature you will find various spellings for “micro-LED”, e.g. pLED, p-LED, uLED, u-LED or Micro Light Emitting Diode.

[0074] According to another implementation of the procedure, providing the transparent piece of film comprises the following steps:

[0075] - Providing a further transparent film with a multitude of second electrically conductive structures, particularly on a rear main surface,

[0076] - partial application of the dielectric over the second electrically conductive structures, and

[0077] - Dividing the remaining transparent film into a large number of transparent film pieces.

[0078] Preferably, the steps listed above should be carried out in the order given.

[0079] In other words, during the production of the transparent film piece, a large-area, additional transparent film, designed, for example, like the transparent film already described and equipped with numerous secondary electrically conductive structures, is partially coated with the dielectric and then separated. Specifically, each transparent film piece has a second electrically conductive structure after separation. The separation of the additional transparent film is carried out, for example, using a laser or a blade. This allows the transparent film piece to be manufactured flexibly and adapted to the respective application.

[0080] According to another embodiment of the process, the dielectric is printed onto the further transparent film. 2024PF01067 21 January 2026

[0081] P2024, 1016 WO N 14

[0082] Printing is done, for example, by screen printing or stencil printing.

[0083] According to another embodiment of the method, the bonding material applied to the first electrically conductive structure and / or the second electrically conductive structure comprises a blowing agent. The blowing agent is, in particular, heated out, preferably before the mechanically stable and electrically conductive bonding of the first electrically conductive structure to the second electrically conductive structure and after application. During the heating out of the blowing agent, a gas is generated in the bonding material, causing pores to form and the bonding material to expand, particularly along a vertical direction extending perpendicular to a principal plane of extension of the transparent film.After baking, the bonding material preferably projects beyond the dielectric along a vertical direction, thus creating a reliable, mechanically stable, and electrically conductive connection between the transparent film and the transparent film piece during subsequent joining. During the baking of the blowing agent, the bonding material is preferably in a liquid or paste-like form.

[0084] The propellant is, for example, an inorganic carbonate, such as baking soda, which decomposes during heating to produce gaseous carbon dioxide.

[0085] According to another embodiment of the process, a first photoresist layer covers only those areas of the front main surface of the transparent film that are not covered by the first electrically conductive structure. 2024PF01067 21 January 2026

[0086] P2024, 1016 WO N 15

[0087] For example, the main front surface of the transparent films is completely covered with the first photoresist layer, the first electrically conductive structure, and the dielectric. It is possible that the dielectric is partially covered by the first photoresist layer. If the bonding material contains a blowing agent, the bonding agent extends vertically, particularly beyond the first photoresist layer, after baking. Preferably, the first photoresist layer has or consists of a negative photoresist. The negative photoresist is cross-linked, particularly during exposure, so that unexposed areas of the photoresist are removed during development.

[0088] According to another embodiment of the method, before applying the bonding material to the first electrically conductive structure, the first photoresist layer is applied to or over the front surface of the transparent film, preferably covering the entire surface. The first photoresist layer is then exposed to light, particularly through the transparent film, with the first electrically conductive structure serving as a mask. This allows the areas of the front surface of the transparent film not covered by the first electrically conductive structure to be covered with the first photoresist layer.

[0089] According to another embodiment of the method, structural elements of the first electrically conductive structure are covered with a second photoresist layer. In this embodiment, other structural elements of the first electrically conductive structure are specifically not covered by the 2024PF01067 21 January 2026

[0090] P2024, 1016 WO N - 16 -

[0091] The second photoresist layer covers the transparent film and remains freely accessible. This serves, in particular, to ensure that electrically conductive and mechanically stable connecting elements from the bonding agent between the transparent film and the transparent film piece are only routed to designated structural elements, while other structural elements covered by the second photoresist layer remain unconnected. This allows for predefined electrical contacts and wiring between the transparent film and the transparent film piece. The second photoresist layer also preferably has a negative photoresist or consists of a negative photoresist.

[0092] In another embodiment of the process, the bonding material is in bulk form. For example, the bulk material is a powder. The bulk material comprises, for instance, a large number of identically shaped spheres. The bulk material is shaken, at least partially, through openings in a perforated mask onto the first electrically conductive structure.

[0093] In particular, the perforated mask is arranged on or above the first electrically conductive structure, with the first photoresist layer covering areas of the front main surface of the transparent film that are exposed between the first electrically conductive structure. The compound is applied to the perforated mask in bulk, and the mask is moved laterally, for example, shaken, so that the compound falls through the openings in the perforated mask onto the first electrically conductive structure. The lateral direction runs along a principal extension plane of the transparent film. By Wahl2024PF01067 21 January 2026

[0094] P2024, 1016 WO N - 17 -

[0095] The openings in the perforated mask allow only predefined structural elements of the first electrically conductive structure to be covered with the bonding material, while other structural elements of the first electrically conductive structure remain freely accessible. Bonding elements are created between the transparent film section and the transparent film at the freely accessible structural elements of the first electrically conductive structure. After the bonding material is applied as bulk material to the structural elements of the first electrically conductive structure, the excess bonding material is removed from the perforated mask.

[0096] The electronic component described below can be manufactured using the method described above. All features and embodiments described herein in connection with the method can therefore also be incorporated into the electronic component, and vice versa.

[0097] In particular, the electronic component is an optoelectronic component designed to emit or detect electromagnetic radiation, especially visible light.

[0098] For example, the electronic component is a display or a light source for a display.

[0099] According to one embodiment, the electronic component comprises an electronic semiconductor chip, in particular an optoelectronic semiconductor chip. The optoelectronic semiconductor chip is specifically designed to transmit electromagnetic radiation, for example 2024PF01067 21 January 2026

[0100] P2024, 1016 WO N 18

[0101] visible light, to emit or detect.

[0102] For example, the optoelectronic semiconductor chip could be a micro-LED. Furthermore, the electronic semiconductor chip could also be an active electronic component, a passive electronic component, an electrical resistor, or an IC (short for "integrated circuit"), especially a micro-IC.

[0103] According to another embodiment, the electronic component comprises a transparent film. The transparent film is particularly transparent to electromagnetic radiation emitted or detected by the optoelectronic semiconductor chip, if such a chip is included in the electronic component.

[0104] According to another embodiment, the electronic component comprises a transparent film piece. The transparent film piece is particularly preferably transparent to electromagnetic radiation emitted or detected by the optoelectronic semiconductor chip, if such a chip is included in the electronic component. In particular, the transparent film piece and / or the transparent film can be transparent to visible light. The term "transparent" here means that at least 50%, at least 80%, or at least 90% of the aforementioned electromagnetic radiation is transmitted by the transparent film and / or the transparent film piece.

[0105] According to another embodiment, the electronic component comprises a first electrically conductive structure on a front main surface of the 2024PF01067 21 January 2026

[0106] P2024, 1016 WO N 19

[0107] A transparent film is mechanically and electrically connected, at least partially, to a second electrically conductive structure on a rear main surface of the transparent film piece. The front main surface of the transparent film and the rear main surface of the transparent film piece face each other and are spaced apart. In particular, a gap is arranged between the rear main surface of the transparent film piece and the front main surface of the transparent film. The connection between the first electrically conductive structure and the second electrically conductive structure is made, in particular, via at least one connecting element.

[0108] According to another embodiment of the electronic component, a dielectric is arranged in certain areas between the front main surface of the transparent film and the rear main surface of the transparent film section. In other words, the gap between the front main surface of the transparent film and the rear main surface of the transparent film section is partially filled with a dielectric. For example, the dielectric connects the transparent film and the transparent film section, at least in certain areas.

[0109] The materials are logically connected.

[0110] According to another embodiment of the electronic component, the transparent foil piece has a smaller base area than the transparent foil, particularly in a top view of one of the main surfaces of the transparent foil and the transparent foil piece. 2024PF01067 21 January 2026

[0111] P2024, 1016 WO N 20

[0112] According to one embodiment, the electronic component comprises the electronic semiconductor chip, the transparent film, and at least one transparent film segment, wherein the first electrically conductive structure on the front main surface of the transparent film is mechanically stable and electrically conductively connected at least partially to the second electrically conductive structure on the rear main surface of the transparent film segment, and wherein the dielectric is arranged locally between the front main surface of the transparent film and the rear main surface of the transparent film segment. Furthermore, the transparent film segment has a smaller base area than the transparent film.

[0113] In particular, a front main surface of the transparent film piece, which faces the rear main surface of the transparent film piece, is free of electrically conductive structures or electronic components such as electronic semiconductor chips. Specifically, the front main surface of the transparent film piece is formed solely by a plastic material such as PET, PI, or PC.

[0114] According to another embodiment of the electronic component, the first electrically conductive structure and / or the second electrically conductive structure is at least partially covered by the dielectric. In particular, the dielectric is in direct contact with the first and second electrically conductive structures in certain areas. For example, the dielectric is a polymeric material, such as a plastic. For example, the dielectric comprises a 2024PF01067 21 January 2026

[0115] P2024, 1016 WO N 21

[0116] Photoresist or a silicone. In particular, the dielectric is transparent to electromagnetic radiation emitted or received by one of the electronic semiconductor chips on the transparent film.

[0117] According to another embodiment of the electronic component, the electronic semiconductor chip is electrically mounted on the first electrical connection points of the first electrically conductive structure and protrudes through a cavity in the transparent foil. In other words, the transparent foil has at least one cavity that completely penetrates it and through which the electronic semiconductor chip protrudes. The cavity can be created, for example, using a laser or a blade. Specifically, an electronic semiconductor chip, designed as an optoelectronic semiconductor chip and configured to emit or detect electromagnetic radiation, protrudes through the cavity.

[0118] According to another embodiment of the electronic component, the first and second electrically conductive structures are not aligned when viewed from the front surface of the transparent film. In other words, the first and second electrically conductive structures are offset from each other when viewed from the front surface of the transparent film. This reduces, in particular, the risk of short circuits between the first and second electrically conductive structures. 2024PF01067 January 21, 2026

[0119] P2024, 1016 WO N - 22 -

[0120] According to another embodiment of the electronic component, the first electrically conductive structure and / or the second electrically conductive structure have at least one intersection point of two conductor tracks, and the first electrically conductive structure and the second electrically conductive structure are electrically conductive and mechanically stable connected via one of the intersection points.

[0121] In particular, a connecting element formed from a bonding agent such as solder, sintered paste, or an electrically conductive adhesive is arranged at the intersection point of two conductive traces of the first or the second electrically conductive structure. Preferably, the conductive traces of the first electrically conductive structure are perpendicular to each other at the intersection points. The conductive traces of the second electrically conductive structure are also perpendicular to each other at the intersection points. For example, at intersection points that are connected to each other, the conductive traces of the first and second electrically conductive structures run parallel to each other.

[0122] According to another embodiment of the electronic component, the transparent foil is at least partially provided with optical structures. In this embodiment, a radiation-emitting optoelectronic semiconductor chip is arranged beneath the optical structures on the transparent foil. Thus, the optical structure in the transparent foil can selectively influence the emission characteristics. For example, the transparent foil is designed to be scattering in certain areas or incorporates a lens or micro-optics as its optical structure. 2024PF01067 21 January 2026

[0123] P2024, 1016 WO N 23

[0124] According to another embodiment of the electronic component, the first electrically conductive structure has at least one first terminal element. Alternatively or additionally, the second conductive electrical structure has at least one second terminal element. The first terminal element is, in particular, part of the first electrically conductive structure, while the second terminal element is part of the second electrically conductive structure. The first terminal element and the second terminal element are, in particular, electrically conductive and formed from the material of the electrically conductive structure of which they are a part. The first terminal element and the second terminal element are, in particular, integrated into the first electrically conductive structure or the second electrically conductive structure.For example, the first terminal element is arranged at the intersection points of the first conductor tracks of the first electrically conductive structure, while the second terminal element is arranged at the intersection points of the second conductor tracks of the second electrically conductive structure. The first terminal element and / or the second terminal element may be round, oval, circular, angular, rectangular, or square in plan view. In particular, the first electrically conductive structure may have more than one first terminal element. The second electrically conductive structure may also have more than one second terminal element. The terminal elements of each electrically conductive structure may be of the same type or different types.

[0125] According to another embodiment of the electronic component, the first electrically conductive structure and the second electrically conductive structure are partially 2024PF01067 21 January 2026

[0126] P2024, 1016 WO N - 24 -

[0127] mechanically stable and electrically conductive, connected by a connecting element located on the first and / or second connection element. For example, the first electrically conductive structure and the second electrically conductive structure each have a first and a second connection element that are congruent in plan view or overlapping such that the geometric centroid or center point of the first and second connection elements are congruent in plan view.

[0128] The connecting element joins the first and second terminals together, for example, by creating a material bond. It is also possible that only the first electrically conductive structure has a first terminal, and the connecting element connects the first terminal to another part of the second electrically conductive structure, for example, to a junction of the two conductors. Furthermore, it is also possible that only the second electrically conductive structure has a second terminal, and the connecting element connects the second terminal to another part of the first electrically conductive structure, for example, to a junction of the first conductors.

[0129] The connecting element is formed in particular from the joining material. For example, the connecting element is formed from or incorporates a solidified solder. To connect the first conductive structure and the second conductive structure, the joining material is applied, for example, to the first connecting element and / or the second connecting element. 2024PF01067 21 January 2026

[0130] P2024, 1016 WO N 25

[0131] applied and then electrically connected to the respective other electrically conductive structure.

[0132] According to another embodiment of the electronic component, the first electrically conductive structure comprises at least one first alignment element configured for aligning the transparent film. Additionally or alternatively, the second electrically conductive structure comprises at least one second alignment element configured for aligning the transparent film segment. For example, the alignment element may be circular, round, or angular in plan view. For example, the first alignment element may be located at intersections of first conductor tracks of the first electrically conductive structure, and the second alignment element may be located at intersections of second conductor tracks of the second electrically conductive structure.

[0133] This electronic component can be used, for example, in illuminated symbols, signs, light films for ambient lighting, RGB displays, headlights, or display protection systems. Furthermore, this electronic component can be used in the automotive, industrial, or consumer sectors.

[0134] Further advantageous embodiments and developments of the method for manufacturing an electronic component and the electronic component result from the exemplary embodiments described below in conjunction with the figures.

[0135] Figures 1 and 2 show schematic representations of an electronic component according to an embodiment .2024PF01067 21 January 2026

[0136] P2024, 1016 WO N 26

[0137] Figures 3 to 9 show schematic representations of stages of a method for manufacturing an electronic component according to an exemplary embodiment.

[0138] Figures 10 to 20 show schematic representations of electronic components according to further embodiments.

[0139] Figures 21 to 27 show schematic representations of stages of a method for manufacturing an electronic component according to a further embodiment.

[0140] Figures 28 to 32 show schematic representations of stages of a method for manufacturing an electronic component according to a further embodiment.

[0141] Figures 33 to 39 show schematic representations of stages of a method for manufacturing an electronic component according to a further embodiment.

[0142] Figures 40 to 48 show schematic representations of stages of a method for manufacturing an electronic component according to a further embodiment.

[0143] Figures 49 to 51 show schematic representations of stages of a method for manufacturing an electronic component according to a further embodiment.

[0144] Figure 52 shows a schematic representation of an electronic component according to an embodiment .2024PF01067 21 January 2026

[0145] P2024, 1016 WO N - 27 -

[0146] Figures 53, 54 and 55 show schematic representations of a first electrically conductive structure and / or a second electrically conductive structure of the electronic component according to Figure 52.

[0147] Figures 56 to 59 show schematic representations of a first electrically conductive structure and / or a second electrically conductive structure according to further embodiments.

[0148] Identical, similar, or similarly functioning elements are marked with the same reference symbols in the figures. The figures and the relative sizes of the elements depicted within them are not to be considered to scale. Rather, individual elements, particularly layer thicknesses, may be exaggerated for clarity and / or better understanding.

[0149] The electronic component according to the embodiment shown in Figures 1 and 2 has a transparent film 1 made of a plastic, for example PET. A first electrically conductive structure 3 is applied to a front surface 2 of the transparent film 1. This structure is at least partially lattice-shaped, as can be seen particularly in the top view of the electronic component in Figure 2. The first electrically conductive structure 3 is, for example, made of copper.

[0150] The electronic component further comprises a transparent film piece 4, which is applied to the transparent film 1. The transparent film piece 4 has a second electrically conductive structure 6 on a rear main surface 5, which is also at least partially 2024PF01067 21 January 2026

[0151] P2024, 1016 WO N 28

[0152] is lattice-shaped. In particular, the first electrically conductive structure 3 has a lattice of intersecting first conductors 7 and the second electrically conductive structure 6 has a lattice of intersecting second conductors 8.

[0153] The transparent foil piece 4 is applied to the transparent foil 1 in such a way that the second electrically conductive structure 6 on the rear main surface 5 of the transparent foil piece 4 points to the first electrically conductive structure 3 on the front main surface 2 of the transparent foil 1 .

[0154] The transparent foil piece 4 and the transparent foil 1 are electrically conductive and mechanically stable connected to each other via the first electrically conductive structure 3 and the second electrically conductive structure 6. In particular, the electrically conductive and stable connection between the first electrically conductive structure 3 and the second electrically conductive structure 6 is created by connecting elements 9.

[0155] The connecting elements 9 are solder joints 10 made of solidified solder, which are arranged at intersection points 11 of the first conductor tracks 7 of the first electrically conductive structure 3.

[0156] The grid-like structure of the second electrically conductive structure 6 of the transparent film piece 4 is arranged offset from the first electrically conductive structure 3 of the transparent film 1. In particular, the first electrically conductive structure 3 and the second 2024PF01067 21 January 2026

[0157] P2024, 1016 WO N 29

[0158] Electrically conductive structure 6 in top view not fully shown.

[0159] A dielectric 12 is further arranged between the rear main surface 5 of the transparent foil piece 4 and the front main surface 2 of the transparent foil 1, which forms a gap 13 between the front main surface 2 of the transparent foil 1 and the rear main surface 5 of the transparent foil piece 4 in a vertical direction R vcompletely fills (Figure 1). The dielectric 12 is further arranged between the solder joints 10 that connect the transparent foil piece 4 and the transparent foil 1.

[0160] The dielectric 12 covers the first conductor tracks 7 of the grid-shaped first electrically conductive structure 3 between the solder joints 10. Second conductor tracks 8 of the grid-shaped second electrically conductive structure 6 of the transparent foil piece 4 are also partially covered by the dielectric 12.

[0161] Furthermore, the electronic component comprises an electronic semiconductor chip 14, in this case a light-emitting diode (LED). The LED is electrically conductive and mechanically stable, with two connecting elements 9, and has two electrical contacts on its back. In particular, the electronic semiconductor chip 14 is attached to the first electrically conductive structure 3 using the same connection technology as the transparent film piece 4. Consequently, the connecting elements 9, which connect the electrical contacts of the LED to the first electrical connection points, are... 162024PF01067 January 21, 2026

[0162] P2024, 1016 WO N - 30 -

[0163] connect the first electrically conductive structure 3, also to solder points 10.

[0164] The first electrically conductive structure 3 has, in particular, interruptions 17, which lead to a segmentation of the first electrically conductive structure 3. Four adjacent segments SI, S2, S3, S4 of the first electrically conductive structure 3 are shown here (Figure 2). The transparent foil piece 4 bridges the third segment S3 from the second segment S2 to the fourth segment S4. In particular, the transparent foil piece 4 establishes an electrically conductive connection between the second segment S2 and the fourth segment S4 and spans the third segment S3. The dielectric 12 prevents unwanted electrical connections between the segments SI, S2, S3, S4.

[0165] It is possible that an electronic semiconductor chip 14, for example a micro-IC, is also applied to the second electrically conductive structure 6 of the transparent film piece 4 (not shown). Such an electronic semiconductor chip 14 has a particular orientation towards the transparent film 1.

[0166] The electronic component according to the embodiment shown in Figures 1 and 2 can, for example, be manufactured using the method described below with reference to Figures 3 to 9.

[0167] In a first step of the process according to the embodiment shown in Figures 3 to 9, a further transparent film 15 with a plurality of second electrical structures 6 is provided (Figure 3). In the further 2024PF01067 21 January 2026

[0168] P2024, 1016 WO N - 31 -

[0169] For example, transparent film 15 is a PET film.

[0170] In a next step, a dielectric 12 is applied to the second electrically conductive structures 6, for example by printing (Figure 4). The dielectric 12 is, for example, a plastic such as a photoresist or a silicone.

[0171] In a further process step, which is shown schematically in Figure 5, the further transparent film 15 is separated into a plurality of transparent film pieces 4, each of which has a second electrically conductive structure 6 on a rear main surface 5.

[0172] A transparent film 1 is then provided, which has a first electrically conductive structure 3 on a front main surface 2 (Figure 6). A bonding material 18 is applied to the first electrically conductive structure 3 in certain areas. In this case, the bonding material 18 is a solder 19, such as SnBi. It is also possible that the bonding material 18 is an electrically conductive adhesive or a sintering paste. In particular, the solder 19 wets the first electrically conductive structure 3 of the transparent film 1 and dewetts the exposed surface of the transparent film 1 due to its wetting properties.

[0173] Then a transparent foil piece 4, such as that produced in connection with the method according to Figures 3 to 5, is applied to the first electrically conductive structure 3 of the transparent foil 1 (Figure 7). 2024PF01067 21 January 2026

[0174] P2024, 1016 WO N - 32 -

[0175] Then, an electronic semiconductor chip 14, for example a light-emitting diode, is electrically conductively and mechanically stable connected to the first electrical connection points 16 of the first electrically conductive structure 3 of the transparent film 1 by soldering. These connection points are also provided with the solder 19 (Figure 8). In particular, the transparent film piece 4 is connected to the first electrically conductive structure 3 of the transparent film 1 using the same connecting material 18 and the same connection technology as the electronic semiconductor chip 14. During soldering, solder joints 10 are formed from the solder 19 as mechanically stable connecting elements 9, which are formed from the solidified solder.

[0176] In a further step, the elements on the front main surface 2 of the transparent film 1, in particular the electronic semiconductor chip 14 and the transparent film piece 4, are encapsulated, for example with a silicone layer 20 (Figure 9).

[0177] In the electronic component according to the embodiment shown in Figures 10 and 11, the connecting elements 9 are formed from a sintered sintering paste, unlike in the embodiment shown in Figures 1 and 2. The sintering paste typically contains, in addition to an organic binder, metallic particles, for example, silver particles.

[0178] The sintered paste is applied in certain locations to intersection points 11 of the first conductor tracks 7 of the first electrically conductive structure 3 and to first electrical connection points 16 of the first electrically conductive structure 3. 2024PF01067 21 January 2026

[0179] P2024, 1016 WO N - 33 -

[0180] Then the transparent foil piece 4 is applied to the sintering paste at the intersection points 11 of the first conductor tracks 7 of the first electrically conductive structure 3 and an electronic semiconductor chip 14 is applied to the sintering paste at the first electrical connection points 16 of the first electrically conductive structure 3.

[0181] The sintering paste is then sintered at high temperatures, so that connecting elements 9 are formed from the inorganic components of the sintering paste between the electronic semiconductor chip 14 and the first electrically conductive structure 3, as well as between the transparent foil piece 4 and the first electrically conductive structure 3.

[0182] In particular, the connecting elements 9 are porous.

[0183] The electronic component according to the embodiment shown in Figures 12 and 13 comprises an electronic semiconductor chip 14, for example a light-emitting diode, which is arranged on first electrical connection points 16 of the first electrically conductive structure 3 below the transparent foil piece 4. In particular, the transparent foil piece 4 has a cavity 21 through which the electronic semiconductor chip 14 projects. The cavity 21 extends into the dielectric 12 between the transparent foil 1 and the transparent foil piece 4.

[0184] The electronic component according to the embodiment shown in Figures 14 and 15, unlike the electronic component according to the embodiment shown in Figures 12 and 13, has a micro-LED 22 as its electronic 2024PF01067 21 January 2026

[0185] P2024, 1016 WO N - 34 -

[0186] Semiconductor chip 14 with a comparatively small thickness on .

[0187] Therefore, according to this embodiment, the transparent film piece 4 does not have a cavity 21, but the microLED 22 is arranged completely below the transparent film piece 4 in the gap 13 between the second electrically conductive structure 6 on the rear main surface 5 of the transparent film piece 4 and the first electrically conductive structure 3 on the front main surface 2 of the transparent film 1.

[0188] However, the dielectric 12 has a recess 23 in which the micro-LED 22 is arranged.

[0189] The electronic component according to the embodiment shown in Figures 16 and 17 has a comparatively small segmentation of the first segmentation compared to the electronic components described so far.

[0190] grid-shaped electrically conductive structure 3 through the interruptions 17 of the first conductor tracks 7 on .

[0191] In particular, the third segment S3 of the first electrically conductive structure 3 has only a single column of the lattice of the first electrically conductive structure 3. This column is bridged by a transparent foil piece 4 with a comparatively small dimension, which extends only over one row of the lattice of the first electrically conductive structure 3.

[0192] Figure 18 shows an exemplary section of a 2x2 pixel array of an electronic component according to an embodiment with a cross-matrix circuit. For example, the electronic component according to Figure 18 is a display. 2024PF01067 21 January 2026

[0193] P2024, 1016 WO N

[0194] Each pixel P of the electronic component has a red-emitting diode R, a green-emitting diode G, and a blue-emitting diode B, which are mounted as electronic semiconductor chips 14 onto a first electrically conductive structure 3 of a transparent film 1. The transparent film 1 has, in the area where the LEDs R, G, and B are mounted, a first electrically conductive structure 3 with a grid-like arrangement of first conductive traces 7.

[0195] Furthermore, five transparent foil pieces 4, arranged in a strip shape, are positioned across a column of pixel P. These transparent foil pieces 4 are electrically connected to the first electrically conductive structure 3 of the transparent foil 1 by connecting elements 9 (not shown). It is also possible that, instead of the five transparent foil pieces 4, a single continuous foil piece 4 is used, which has five electrically isolated areas for electrical contact.

[0196] The electronic component according to the embodiment shown in Figures 19 and 20 has a transparent film 1 with a first electrically conductive structure 3, which is at least partially lattice-shaped. An electronic semiconductor chip 14 is mounted on first electrical connection points 16 of the first electrically conductive structure 3. The electronic component also has a transparent film section 4. An area of ​​the transparent film section 4 is smaller than an area of ​​the transparent film 1. The transparent film section 4 has a second electrically conductive structure 6 on a rear main surface 5, which is lattice-shaped and at least partially rotated by 45° relative to the 2024PF01067 21 January 2026

[0197] P2024, 1016 WO N 36

[0198] A grid-shaped first electrically conductive structure 3 is arranged on a front main surface 2 of the transparent film 1. A dielectric 12 is arranged between the transparent film 1 and the transparent film piece 4 and embeds connecting elements 9 between the first electrically conductive structure 3 and the second electrically conductive structure 6. The dielectric 12 is, for example, a transparent photoresist.

[0199] In the process for manufacturing an electronic component according to Figures 21 to 27, a transparent film 1 with a first electrically conductive structure 3 is first provided (Figure 21 ).

[0200] A first photoresist layer 24 is applied over the entire surface of a front main surface 2 of the transparent film 1, for example by spin coating (Figure 22). The photoresist in this case is a negative photoresist, the exposed areas of which remain on the surface after development.

[0201] In a next step, the first photoresist layer 24 is exposed to ultraviolet radiation 25 through the transparent film 1, with the first electrically conductive structure 3 serving as a mask (Figure 23). When the negative photoresist of the first photoresist layer 24 is exposed to the electromagnetic radiation 25, it cross-links.

[0202] In a next step, which is shown schematically in Figure 24, the first photoresist layer 24 is developed, whereby unexposed areas of the first photoresist layer 24 are transferred to the first electrically conductive 2024PF01067 21 . January 2026

[0203] P2024, 1016 WO N 37

[0204] Structure 3 is removed. After the development of the first photoresist layer 24, the first electrically conductive structure 3 is again freely accessible. After development, the first photoresist layer 24 forms cavities 26 in which the structural elements 27 of the first electrically conductive structure 3 are arranged.

[0205] In a next step, a bonding material 18 is applied to predefined structural elements 27 of the first electrically conductive structure 3 within the cavities 26 of the first photoresist layer 24 (Figure 25). Specifically, the bonding material 18 is applied only to those structural elements 27 of the first electrically conductive structure 3 that are to be connected to a transparent film piece 4 at a later time. Other cavities 26, in which structural elements 27 of the first electrically conductive structure 3 are arranged, remain free of the bonding material 18. In this case, the bonding material 18 contains a blowing agent, such as sodium hydroxide.

[0206] In a next step, which is shown schematically in Figure 26, the propellant is heated out, for example at a temperature of approximately 100 °C.

[0207] In this process, according to

[0208] 2NaHCO3-> Na2CO2+ CO2+ H2O

[0209] Gaseous carbon dioxide causes the compound material 18 to foam up due to gas bubbles. This increases the volume of the compound material 18 in the cavities 26, which are bounded by the first photoresist layer 24. The compound material 18 therefore extends according to the 2024PF01067 21 January 2026

[0210] P2024, 1016 WO N - 38 -

[0211] Heating in a vertical direction R v about the first photoresist layer 24.

[0212] In a next step, a transparent foil piece 4 with a second electrically conductive structure 6 on a rear main surface 5 is applied to the connecting material 18 and electrically conductively and mechanically stable connected to the first electrically conductive structure 3 by soldering, curing or sintering, so that connecting elements 9 are formed (Figure 27 ).

[0213] In the process according to Figures 28 to 32, the steps already described with reference to Figures 21 to 24 are carried out first. In other words, the process steps described below with reference to Figures 28 to 32 follow the process steps according to Figures 21 to 24.

[0214] As shown in Figure 28, a second photoresist layer 28 is applied to the first photoresist layer 24, completely filling the cavities 26 in the first photoresist layer 24. The photoresist of the second photoresist layer 28 is also a negative photoresist, which is cross-linked by exposure, and in which the unexposed areas are removed during development.

[0215] The second photoresist layer 28 is covered with a photomask 29 and exposed to electromagnetic radiation 25, the photomask 29 leaving areas uncovered that are to be covered with the cross-linked second photoresist layer 28. In particular, cavities 26 in the first photoresist layer 24 are covered with the second photoresist layer 282024PF01067 21 January 2026

[0216] P2024, 1016 WO N 39

[0217] filled out, which are not to be connected with a bonding material 18 in the following.

[0218] Then the second photoresist layer 28 is developed and the areas that were not cross-linked during exposure are exposed. In particular, structural elements 27 of the first electrically conductive structure 3 are exposed again, while other structural elements 27 of the first electrically conductive structure 3 remain covered with the second photoresist layer 28 (Figure 29).

[0219] Then, a bonding material 18, which contains a blowing agent (Figure 30), is introduced into the freely accessible cavities 26. This can be done in this case by a method that applies the bonding material 18 over a large area, such as with a doctor blade.

[0220] In a next step, the blowing agent is heated out in the bonding material 18, as already described with reference to Figure 26 (Figure 31 ).

[0221] In a further step, a transparent foil piece 4 with its second electrically conductive structure 6 is electrically conductively and mechanically stable connected to the first electrically conductive structure 3 of the transparent foils 1 by the connecting material 18, as already described with reference to Figure 27 (Figure 32 ).

[0222] In the process according to Figures 33 to 39, the steps already described with reference to Figures 21 to 24 are carried out first. The process steps according to Figures 33 to 39 also follow the process steps according to Figures 21 to 24. 2024PF01067 21 January 2026

[0223] P2024, 1016 WO N - 40 -

[0224] In the method according to the embodiment shown in Figures 33 to 39, a shadow mask 30 with openings 31 is arranged over the first photoresist layer 24 (Figure 33). The openings 31 completely penetrate the shadow mask 30.

[0225] Spherules of a bonding material 18 are applied as bulk material 32 to the perforated mask 30 (Figure 34). The spheres have, in particular, a diameter that corresponds to the depth of the cavities 26 in the first photoresist layer 24.

[0226] The perforated mask 30 with the bulk material 32 is then moved in a lateral direction R.L The spheres are moved back and forth so that they arrange themselves through the openings 31 onto exposed structural elements 27 of the first electrically conductive structure 3. Due to the dimensions of the spheres, the spheres completely fill the cavities 26 in the first photoresist layer 24 around the structural elements 27 and preferably form a monolayer here (Figure 35).

[0227] The openings 31 in the hole mask 30 are arranged such that predetermined structural elements 27 of the first electrical structure 3 remain free of spheres (Figure 36).

[0228] Then excess spheres of the bulk material 32 are removed from the perforated mask 30, for example by shaking or suction (Figure 37 ).

[0229] The hole mask 30 is then removed. Predefined structural elements 27 of the first electrically conductive structure 3 are here connected with a monolayer of spheres of the bulk material 2024PF01067. January 21, 2026

[0230] P2024, 1016 WO N 41

[0231] 32 covered, while other predefined structural elements 27 of the first electrically conductive structure 3 are free of spheres (Figure 38 ).

[0232] In a next step, the bonding material 18 is electrically conductive and mechanically stable connected to a second electrically conductive structure 6 on a rear main surface 5 of a transparent film piece 4, for example by soldering, sintering, or curing (Figure 39). If the bonding material 18 is a solder, the mechanically stable and electrically conductive connection is created by soldering. If the bonding material 18 is a sintering paste, the mechanically stable and electrically conductive connection is created by sintering. If the bonding material 18 is an adhesive, the mechanically stable and electrically conductive connection is created by curing.

[0233] In the method according to the embodiment shown in Figures 40 to 48, a transparent film 1 with a first electrically conductive structure 3 is provided on a front main surface 2 (Figure 40).

[0234] Then, an electrically conductive positive photoresist 33 is applied in certain areas to the front main surface 2 of the transparent film 1. Structural elements 27 of the first electrically conductive structure 3, which are designed and configured to be electrically conductive and mechanically stable connected to a second electrically conductive structure 6 of a transparent film piece 4, are thereby covered by the positive electrically conductive photoresist 33. However, the specified structural elements 27 of the first electrically conductive structure 3 remain free of the photoresist. 2024PF01067 21 January 2026

[0235] P2024, 1016 WO N 42

[0236] positive photoresist 33. For example, the positive electrically conductive photoresist 33 is applied by screen printing ( Figure 41 ).

[0237] Then the positive electrically conductive photoresist 33 is exposed through the transparent film 1, with structural elements 27 of the first electrically conductive structure 3 serving as a mask (Figure 42 ).

[0238] Then the positive photoresist 33 is developed so that predetermined structural elements 27 of the first electrically conductive structure 3 are completely covered with the positive photoresist 33, but the transparent film 1 between the structural elements 27 of the electrically conductive structure 3 is freely accessible after development (Figure 43).

[0239] In a next step, a first photoresist layer 24 is applied to the exposed areas of the transparent film 1, which in this case has a negative photoresist. In particular, the thickness of the first photoresist layer 24 is significantly thinner than that of the positive electrically conductive photoresist 33 (Figure 44).

[0240] The first photoresist layer 24 with the negative photoresist is exposed through the transparent film 1 with electromagnetic radiation 25, with the first electrically conductive structure 3 serving as a mask (Figure 45).

[0241] After development, structural elements 27 of the first electrically conductive structure 3 are freely accessible, not covered by the positive electrically conductive photoresist 33 (Figure 46). 2024PF01067 21 January 2026

[0242] P2024, 1016 WO N - 43 -

[0243] The positive electrically conductive photoresist 33 electrically and mechanically connects the first electrically conductive structure 3 of the transparent film 1 to a second electrically conductive structure 6 on a transparent film piece 4 in a conductively conductive and mechanically stable manner. In other words, in the process according to Figures 40 to 48, connecting elements 9 are formed from the positive electrically conductive photoresist 33 (Figure 47).

[0244] For example, the positive photoresist 33 is electrically conductive by incorporating a predetermined proportion of needle-shaped metallic flakes 34, for example, of silver. Furthermore, the electrically conductive positive photoresist 33 exhibits good UV transmission (Figure 48).

[0245] In the method according to the embodiment shown in Figures 49 to 51, the steps already described with reference to Figures 21 to 24 are carried out first. The steps of the method shown in Figures 49 to 51 follow the steps already described with reference to Figures 21 to 24.

[0246] The first photoresist layer 24, applied over the entire surface, is exposed through the transparent film 1, so that the areas 35 between the structural elements 27 of the first electrically conductive structure 3 are cured (Figure 49). The first electrically conductive structure serves as a mask.

[0247] Then a photomask 29 is placed over the first photoresist layer 24, which is already partially cured, and the 2024PF01067 21 . January 2026

[0248] P2024, 1016 WO N 44

[0249] The exposed areas 36 of the first photoresist layer 24 are re-exposed (Figure 50). In this process, areas 36 of the first photoresist layer 24, which are arranged above predefined structural elements 27 of the first electrically conductive structure 3, are also exposed and thus cross-linked.

[0250] Then the first photoresist layer 24 is developed, so that only the cross-linked areas 35, 36 of the photoresist layer 24 remain on the transparent film 1 (Figure 51). In this way, structural elements 27 of the first electrically conductive structure 3, which are not intended to be provided with a bonding material 18, are also covered with the first photoresist layer 24.

[0251] The electronic component according to the embodiment shown in Figures 52 to 55 comprises a transparent film 1 with a first electrically conductive structure 3 and a transparent film section 4 with a second electrically conductive structure 6. Electronic semiconductor chips 14, which in this case are designed as micro-LEDs 22, are applied to first electrical connection points 16 of the first conductive structure 3. In particular, one of the micro-LEDs 22 is arranged in a recess 23 of a dielectric 12. The transparent film section 4 and the transparent film 1 are mechanically and electrically connected at certain points via the first electrically conductive structure 3 and the second electrically conductive structure 6 to connecting elements 9, which are arranged laterally to the dielectric 12.

[0252] Figure 53 schematically shows a top view of a section of the second electrically conductive structure 6 on a rear main surface 5 of the transparent 2024PF01067 21 January 2026

[0253] P2024, 1016 WO N 45

[0254] Foil piece 4. The second electrically conductive structure 6 comprises second connection elements 37, which are circular in shape and arranged at intersection points 11 of second grid-shaped conductor tracks 8.

[0255] Figure 54 shows a schematic top view of a section of a first electrically conductive structure 3, which is arranged, for example, on a front main surface 2 of the transparent film 1. In contrast to the second electrically conductive structure 6 according to Figure 53, the first circular connection elements 38 have a smaller diameter. Furthermore, the first electrically conductive structure 3 has first electrical connection points 16 for mounting electronic semiconductor chips 14.

[0256] Figure 55 shows a schematic top view of another section of the first electrically conductive structure 3, as it may be configured outside the area where it is connected to the transparent foil piece 4. In this area, the first electrically conductive structure 3 does not have first connection elements 38, but only first electrical connection points 16.

[0257] Figures 56 to 58 show schematic representations of exemplary embodiments of a first electrically conductive structure 3 and / or a second electrically conductive structure 6. For the sake of simplicity, only a conductive structure 3, 6 will be referred to in the following. The descriptions apply to the first electrically conductive structure 3 and the second electrically conductive structure 6. The descriptions of the adjustment element apply to a first adjustment element 39 of a first electrically conductive structure 3 and a second 2024PF01067 21 January 2026

[0258] P2024, 1016 WO N 46

[0259] Adjustment element 40 of a second electrically conductive structure 6 equally.

[0260] The electrically conductive structure 3, 6 according to Figure 56, unlike the previously described electrically conductive structures 3, 6, has an adjustment element 39, 40. In plan view, the adjustment element 39, 40 is circular. In particular, the adjustment element 39, 40 has a wide outer ring into which a circular recess is formed. The center point of the circular adjustment element 39, 40 is located at an intersection 11 of grid-shaped conductor tracks 7, 8 of the electrically conductive structure 3, 6.

[0261] The electrically conductive structure 3, 6 according to Figure 57 also has an adjustment element 39, 40. In contrast to the adjustment element 39, 40 of the electrically conductive structure 3, 6 of Figure 56, an inner circle of the adjustment element 39, 40 is surrounded by a circular recess.

[0262] Figure 58 shows a multitude of similarly formed electrically conductive structures 3, 6 in a common assembly. Figure 59 shows an electrically conductive structure 3, 6 such as can be encompassed by the assembly of Figure 58.

[0263] The present application claims priority over German application DE 102025104038.9, the disclosure content of which is hereby incorporated by reference.

[0264] The invention is not limited to the exemplary embodiments described therein. Rather, it comprises 2024PF01067 21 January 2026

[0265] P2024, 1016 WO N - 47 -

[0266] The invention includes every new feature and every combination of features, which in particular includes every combination of features in the claims, even if that feature or combination itself is not explicitly specified in the claims or embodiments. 2024PF01067 21 January 2026

[0267] P2024, 1016 WO N 48

[0268] Reference symbol list

[0269] 1 transparent film

[0270] 2. Front main surface of the transparent film

[0271] 3. First electrically conductive structure

[0272] 4 pieces of transparent foil

[0273] 5. Rear main surface of the transparent film piece 6. Second electrically conductive structure

[0274] 7 first conductor track

[0275] 8 second conductor track

[0276] 9 Connecting element

[0277] 10 plumb lines

[0278] 11 Intersection point

[0279] 12 Dielectric

[0280] 13 gaps

[0281] 14 electronic semiconductor chip

[0282] 15 more transparent sheets

[0283] 16 first electrical connection points

[0284] 17 Interruption

[0285] 18 Connecting material

[0286] 19 Lot

[0287] 20 silicone layers

[0288] 21 Cavity

[0289] 22 micro-LEDs

[0290] 23 Exclusion

[0291] 24 first photoresist layer

[0292] 25 Radiation

[0293] 26 cavity

[0294] 27 Structural element of the first electrically conductive structure 28 Second photoresist layer

[0295] 29 Photo mask

[0296] 30-hole mask

[0297] 31 Breakthrough2024PF01067 January 21, 2026

[0298] P2024, 1016 WO N

[0299] 49

[0300] 32 Bulk goods

[0301] 33 electrically conductive positive photoresist 34 metallic flake

[0302] 35 area

[0303] 36 exposed area

[0304] 37 second connection element

[0305] 38 first connection element

[0306] 39 first adjustment element

[0307] 40 second adjustment element

[0308] R v vertical direction

[0309] SI, S2, S3, S4 Segment

[0310] P pixels

[0311] R red emitting light-emitting diode

[0312] G green emitting light-emitting diode

[0313] B blue emitting light-emitting diode

[0314] R L lateral direction

Claims

2024PF01067 January 21, 2026 P2024, 1016 WO N - 50 - Patent claims 1. Method for manufacturing an electronic component comprising the following steps: - Providing a transparent film ( 1 ) with a first electrically conductive structure (3) on a front main surface (2 ) , - Providing at least one transparent film piece (4 ) with a second electrically conductive structure ( 6) on a rear main surface (5) , - Applying a bonding material ( 18 ) to the first electrically conductive structure (3) and / or the second electrically conductive structure ( 6) , - mechanically stable and electrically conductive connection of the first electrically conductive structure (3) with the second electrically conductive structure ( 6) by the connecting material ( 18 ) , where - a dielectric (12) is arranged locally between the front main surface (2) of the transparent film (1) and the rear main surface (5) of the transparent film piece (4), and - the transparent foil piece (4 ) has a smaller base area than the transparent foil ( 1 ).

2. Method according to the preceding claim, wherein The joining is done by soldering, sintering or gluing.

3. A method according to any of the preceding claims, wherein a positive electrically conductive photoresist (33) is used as the bonding material (18). 2024PF01067 21 January 2026 P2024, 1016 WO N 51 4. Method according to the preceding claim, wherein the positive electrically conductive photoresist (33) has metallic flakes (34).

5. Method according to one of the preceding claims, wherein an electronic semiconductor chip ( 14 ) is applied to the first electrically conductive structure (3) on the transparent film ( 1 ).

6. Method according to the preceding claim, wherein the electronic semiconductor chip ( 14 ) is a micro-LED (22 ).

7. Method according to any of the preceding claims, wherein providing the transparent film piece (4) comprises the following steps: - Providing another transparent film ( 15) with a plurality of second electrically conductive structures ( 6 ), - partially applying the dielectric ( 12 ) over the second electrically conductive structures ( 6 ), and - Separating the further transparent film ( 15) into a large number of transparent film pieces (4 ).

8. Method according to the preceding claim, wherein the dielectric ( 12 ) is printed onto the further transparent film ( 15 ).

9. Method according to any one of the preceding claims, wherein - the bonding material (18) applied to the first electrically conductive structure (3) and / or the second electrically conductive structure (6) contains a blowing agent, and - the blowing agent is baked out. 2024PF01067 21 January 2026 P2024, 1016 WO N - 52 - 10. Method according to one of the preceding claims, wherein a first photoresist layer (24) covers only those areas of the front main surface (2) of the transparent film (1) that are not covered by the first electrically conductive structure (3).

11. Method according to the preceding claim, wherein Before applying the bonding material ( 18 ) to the first conductive structure (3), the following steps are carried out: - Applying the first photoresist layer (24) to or over the front main surface (2) of the transparent film (1), - Exposure of the first photoresist layer (24 ) , wherein the first electrically conductive structure (3) serves as a mask .

12. Method according to one of the preceding claims, wherein structural elements (27 ) of the first electrically conductive structure (3) are covered with a second photoresist layer (28 ).

13. Method according to one of the preceding claims, wherein - the connecting material ( 18 ) is in bulk (32 ), and - the bulk material (32 ) is shaken at least partially onto the first electrically conductive structure (3) through openings (31 ) in a hole mask (30).

14. Electronic component including: - an electronic semiconductor chip ( 14 ) , - a transparent film ( 1 ) , - at least one transparent foil piece (4) , where 2024PF01067 21 January 2026 P2024, 1016 WO N 53 - a first electrically conductive structure (3) on a front main surface (2 ) of the transparent film ( 1 ) is mechanically stable and electrically conductively connected to a second electrically conductive structure ( 6) on a rear main surface (5) of the transparent film piece (4) in certain places, - a dielectric (12) is arranged locally between the front main surface (2) of the transparent film (1) and the rear main surface (5) of the transparent film piece (4), and - the transparent foil piece (4 ) has a smaller base area than the transparent foil ( 1 ).

15. Electronic component according to the previous claim, wherein the first electrically conductive structure (3) and / or the second electrically conductive structure (6) is at least partially covered with the dielectric (12).

16. Electronic component according to one of claims 14 or 15, wherein - the electronic semiconductor chip ( 14 ) is mounted on first electrical connection points ( 16 ) of the first electrically conductive structure (3), and - protrudes through a cavity (21) in the transparent foil piece (4).

17. Electronic component according to one of claims 14 to 16, wherein The first electrically conductive structure (3) and the second electrically conductive structure (6) are not arranged congruently in plan view on the front main surface (2) of the transparent film (1). 2024PF01067 21 January 2026 P2024, 1016 WO N - 54 - 18. Electronic component according to one of claims 14 to 17, wherein - the first electrically conductive structure (3) and / or the second conductive structure (6) has at least one intersection point (11) of two conductor tracks (7, 8), and - the first electrically conductive structure (3) and the second conductive structure (6) are electrically conductive and mechanically stable connected via one of the intersection points (11).

19. Electronic component according to one of claims 14 to 18, wherein - the first electrically conductive structure (3) has at least a first terminal element (38) and / or the second electrically conductive structure (6) has at least a second terminal element (37), and - the first electrically conductive structure (3) and the second electrically conductive structure (6) are mechanically stable and electrically conductive at certain points by a connecting element (9) which is arranged on the first connecting element (38) and / or the second connecting element (37).

20. Electronic component according to one of claims 14 to 19, wherein - the first electrically conductive structure (3) comprises at least a first adjustment element (39) designed to align the transparent film (1), and / or - the second electrically conductive structure ( 6) comprises at least a second adjustment element (40) which is set up to align the transparent foil piece (4 ).

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