Multi-cell powered device
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-01-27
- Publication Date
- 2026-08-13
Smart Images
Figure IB2026050758_13082026_PF_FP_ABST
Abstract
Description
Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1MULTI-CELL POWERED DEVICEBACKGROUNDField of the Invention[oooi] The present invention relates generally to small form factor devices, including medical devices, and powered by multiple circuit board mounted batteries.Related Art
[0002] Medical devices are devices that are intended to be used for medical purposes. They can vary in both their intended use and indications for use. Examples range from simple, low-risk medical supplies to complex, potentially high-risk devices that are implanted and / or sustain life, such as deep brain stimulators and brain-computer interfaces. Other categories of medical device include diagnostic equipment.
[0003] Hearing devices act on an actual or potential auditory perception of an individual, including to improve perception of sound signals, to reduce perception of sound signals, etc. In particular, a hearing device can deliver sound signals to a user in any form, including in the form of acoustical stimulation, mechanical stimulation, electrical stimulation, etc., and / or can operate to suppress all or some sound signals. As such, a hearing device can be a device for use by a hearing-impaired person (e.g., hearing aids, middle ear auditory prostheses, bone conduction devices, direct acoustic stimulators, electro-acoustic hearing prostheses, auditory brainstem stimulators, bimodal hearing prostheses, bilateral hearing prostheses, dedicated tinnitus therapy devices, tinnitus therapy devices, etc.) or a device for use by a person with normal hearing (e.g., a consumer device that provides audio streaming, a consumer headphone, an earphone, etc.), a hearing protection device (e.g., a noise cancellation headset, a loudness reduction apparatus, etc.), etc.SUMMARY
[0004] In one aspect, a medical device is provided. The medical device includes a printed circuit board, and at least two rechargeable batteries mounted on the printed circuit board and electrically connected in parallel. The batteries can be rechargeable surface mount batteries.
[0005] In another aspect, a medical device includes a printed circuit board, and a plurality of rechargeable surface mount batteries attached to the printed circuit board, wherein the pluralityAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1of rechargeable surface mount batteries are electrically connected in parallel, and are spaced from one other in a distributed pattern on the printed circuit board.
[0006] In another aspect, a method is provided. The method comprises: mounting a component on a printed circuit board, mounting a distributed battery system comprising at least two rechargeable surface mount batteries on the printed circuit board in proximity to the component, and electrically connecting the at least two rechargeable surface mount batteries in parallel, wherein respective mounting positions of the at least two rechargeable surface mount batteries are selected based on at least one characteristic of the component.
[0007] In a still other aspect, one or more non-transitory computer readable storage media are provided, and comprise instructions that, when executed by a processor, cause the processor to: determine a characteristic of a component to be attached to a printed circuit board, and determine, based on the characteristic of the component, a distribution pattern for rechargeable surface mount batteries to be attached to a printed circuit board.BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Embodiments of the present invention are described herein in conjunction with the accompanying drawings, in which:
[0009] FIG. 1A is a schematic diagram illustrating a cochlear implant system with which aspects of the techniques presented herein can be implemented;[ooio] FIG. IB is a side view of a recipient wearing a sound processing unit of the cochlear implant system of FIG. 1A;[ooii] FIG. 1C is a schematic view of components of the cochlear implant system of FIG. 1 A;
[0012] FIG. ID is a block diagram of the cochlear implant system of FIG. 1 A;
[0013] FIG. 2 shows a rechargeable surface mount battery and corresponding heat radiation pattern on which placement or positioning of the rechargeable surface mount battery on a printed circuit board can be based, in accordance with techniques presented herein;
[0014] FIG. 3 shows different states of operation of a rechargeable surface mount battery and a corresponding amount of heat that is generated during those states, in accordance with techniques presented herein;Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0015] FIG. 4 shows a printed circuit board with rechargeable surface mount batteries mounted thereon in one configuration, in accordance with techniques presented herein;
[0016] FIG. 5 shows a printed circuit board with rechargeable surface mount batteries mounted thereon in another configuration, in accordance with techniques presented herein;
[0017] FIG. 6 shows a printed circuit board including an electronic component that has a substantially evenly distributed thermal profile, and further shows the positioning of rechargeable surface mount batteries in view of the thermal profile;
[0018] FIG. 7 shows a printed circuit board including an electronic component that has an asymmetrical thermal profile, and further shows the positioning of rechargeable surface mount batteries in view of the asymmetrical thermal profile;
[0019] FIG. 8 shows a printed circuit board with rechargeable surface mount batteries mounted thereon in still another configuration, in accordance with techniques presented herein;
[0020] FIG. 9 shows a printed circuit board with rechargeable surface mount batteries mounted thereon in yet another configuration, in accordance with techniques presented herein;
[0021] FIG. 10 shows a printed circuit board with rechargeable surface mount batteries mounted thereon in yet another configuration, in accordance with techniques presented herein;
[0022] FIG. 11 shows a circuit for individually switching rechargeable surface mount batteries in, or out of, an electric circuit, in accordance with techniques presented herein;
[0023] FIG. 12 is a flowchart illustrating a series of operations for placing or positioning batteries on a printed circuit board, in accordance with techniques presented herein;
[0024] FIG. 13 is a schematic diagram illustrating a vestibular stimulator system with which aspects of the techniques presented herein can be implemented;
[0025] FIG. 14 is a schematic diagram illustrating a retinal prosthesis system with which aspects of the techniques presented herein can be implemented;
[0026] FIG. 15 is a schematic diagram illustrating a tinnitus therapy device with which aspects of the techniques presented herein can be implemented; and
[0027] FIG. 16 is a perspective view of an upper airway stimulation device with which aspects of the techniques presented herein can be implemented.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1DETAILED DESCRIPTION
[0028] Presented herein are techniques for placing, positioning, attaching, mounting, etc. (collectively and generally referred to herein as mounting) a plurality of rechargeable surface mount batteries (e.g., surface mount technology (SMT) batteries or surface mount device (SMD) batteries) on a printed circuit board (PCB) to power an electronic device, such as a medical device. For ease of description, the terms “rechargeable surface mount batteries” or “surface mount batteries” are used to interchangeably to refer to a plurality / collection of rechargeable SMDs, SMTs, or any other type of rechargeable battery that can be mounted to a PCB. The rechargeable surface mount batteries are strategically mounted at a minimally safe thermal distance from one another and / or another heat-generating component on the PCB. The rechargeable surface mount batteries can also be mounted in order to avoid detrimental impact to the operation of the rechargeable surface mount batteries themselves and / or to other components on the PCB or in the electronic device, as well as to achieve a desired form factor.
[0029] There are a number of different types of device in / with which the techniques presented herein can be implemented. Merely for ease of description, the techniques presented herein are primarily described with reference to a specific device. However, it is to be appreciated that the techniques presented herein can also be partially or fully implemented by any of a number of different types of devices or systems, including consumer electronic devices (e.g., consumer hearing devices, consumer computing devices such as mobile phones and tablets, audio equipment such as home theatre and car audio systems, etc.), computing systems (e.g., servers in data centers, Intemet-of-Things (loT) devices), various types of software systems, such as databases, machine learning and artificial intelligence systems, other medical devices, such as diagnostic equipment or life sustaining equipment, etc. For example, the techniques presented herein could be used in or with sensory protheses such as visual implants (e.g., bionic eyes), including hearing aids and cochlear implants, and various medical devices, such as pacemakers, drug delivery systems, implantable defibrillators, functional electrical stimulation devices, sleep disorder devices (e.g., sleep apnea devices), seizure devices (e.g., devices for monitoring and / or treating epileptic events), balance or movement disorder devices (e.g., vestibular stimulation devices), tinnitus management devices, and other neuromodulation devices (e.g., brain-computer interfaces).
[0030] FIGs. 1 A-1D illustrate an example cochlear implant system 102 with which aspects of the techniques presented herein can be implemented. The cochlear implant system 102 comprises an external component 104 that is configured to be directly or indirectly attached toAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1the body of the user, and an internal / implantable component 112 that is configured to be implanted in or worn on the head of the user. In the examples of FIGs. 1 A-1D, the implantable component 112 is sometimes referred to as a “cochlear implant.” FIG. 1A illustrates the cochlear implant 112 implanted in the head 154 of a user, while FIG. IB is a schematic drawing of the external component 104 worn on the head 154 of the user. FIG. 1C is another schematic view of the cochlear implant system 102, while FIG. ID illustrates further details of the cochlear implant system 102. For ease of description, FIGs. 1 A-1D will generally be described together.
[0031] In the examples of FIGs. 1A-1D, the external component 104 comprises a sound processing unit 106, an external coil 108, and generally, a magnet system (e.g., one or more magnets) 150 fixed relative to the external coil 108. The cochlear implant 112 includes an implantable coil 114, an implant body 134, and an elongate stimulating assembly 116 configured to be implanted in the user’s cochlea. In one example, the sound processing unit 106 is an off-the-ear (OTE) sound processing unit, sometimes referred to herein as an OTE component, that is configured to send data and power to the cochlear implant 112. In general, an OTE sound processing unit is a component having a generally cylindrically shaped housing 111 and which is configured to be magnetically coupled to the user’s head 154 (e.g., includes an integrated external magnet 150 configured to be magnetically coupled to an internal / implantable magnet system 152 in the cochlear implant 112). The OTE sound processing unit 106 also includes an integrated external (headpiece) coil 108 (the external coil 108) that is configured to be inductively coupled to the implantable coil 114.
[0032] It is to be appreciated that the OTE sound processing unit 106 is merely illustrative of the external devices that could operate with cochlear implant 112. For example, in alternative examples, the external component 104 can comprise a behind-the-ear (BTE) sound processing unit configured to be attached to, and worn adjacent to, the recipient’s ear. A BTE sound processing unit comprises a housing that is shaped to be worn on the outer ear of the user. In certain examples, the BTE is connected to a separate external coil assembly via a cable, where the external coil assembly is configured to be magnetically and inductively coupled to the implantable coil 114, while in other embodiments the BTE includes a coil disposed in or on the housing worn on the outer ear of the user. It is also to be appreciated that alternative external components could be located in the user’s ear canal, worn on the body, etc.
[0033] Although the cochlear implant system 102 includes the sound processing unit 106 and the cochlear implant 112, as described below, the cochlear implant 112 can operateAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1independently from the sound processing unit 106, for at least a period, to stimulate the user. For example, the cochlear implant 112 can operate in a first general mode, sometimes referred to as an “external hearing mode,” in which the sound processing unit 106 captures sound signals which are then used as the basis for delivering stimulation signals to the user. The cochlear implant 112 can also operate in a second general mode, sometimes referred as an “invisible hearing” mode, in which the sound processing unit 106 is unable to provide sound signals to the cochlear implant 112 (e.g., the sound processing unit 106 is not present, the sound processing unit 106 is powered-off, the sound processing unit 106 is malfunctioning, etc.). As such, in the invisible hearing mode, the cochlear implant 112 captures sound signals itself via implantable sound sensors and then uses those sound signals as the basis for delivering stimulation signals to the user. Further details regarding operation of the cochlear implant 112 in the external hearing mode are provided below, followed by details regarding operation of the cochlear implant 112 in the invisible hearing mode. It is to be appreciated that reference to the external hearing mode and the invisible hearing mode is merely illustrative and that the cochlear implant 112 could also operate in alternative modes.
[0034] In FIGs. 1 A and 1C, the cochlear implant system 102 is shown with an external device 110, configured to implement aspects of the techniques presented. The external device 110 is a computing device, such as a personal computer (e.g., laptop, desktop, tablet), a mobile phone (e g., smartphone), a remote control unit, etc. The external device 110 and the cochlear implant system 102 (e.g., sound processing unit 106 or the cochlear implant 112) wirelessly communicate via a bi-directional communication link 126. The bi-directional communication link 126 can comprise, for example, a short-range communication, such as Bluetooth link, Bluetooth Low Energy (BLE) link, a proprietary link, etc.
[0035] Returning to the example of FIGs. 1 A-1D, the sound processing unit 106 of the external component 104 also comprises one or more input devices configured to capture and / or receive input signals (e.g., sound or data signals) at the sound processing unit 106. The one or more input devices include, for example, one or more sound input devices 118 (e.g., one or more external microphones, audio input ports, telecoils, etc.), one or more auxiliary input devices 128 (e.g., audio ports, such as a Direct Audio Input (DAI), data ports, such as a Universal Serial Bus (USB) port, cable port, etc.), and a short-range wireless transmitter / receiver (wireless transceiver) 120 (e.g., for communication with the external device 110), each located in, on or near the sound processing unit 106. However, it is to be appreciated that one or more input devices can include additional types of input devices and / or less input devices (e.g., the short-Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1range wireless transceiver 120 and / or one or more auxiliary input devices 128 could be omitted).
[0036] The sound processing unit 106 also comprises the external coil 108, a charging coil 130, a closely-coupled radio frequency transmitter / receiver (RF transceiver) 122, at least one power source 132, and an external sound processing module 124. The external sound processing module 124 can be configured to perform a number of operations that are represented in FIG. ID by a sound processor 131. The sound processor 131 can be formed by one or more processors (e.g., one or more Digital Signal Processors (DSPs), one or more uC cores, etc.), firmware, software, etc. arranged to perform operations described herein. That is, the sound processor 131 can each be implemented as firmware elements, partially or fully implemented with digital logic gates in one or more application-specific integrated circuits (ASICs), partially or fully in software, etc. Although FIG. ID illustrates the sound processor 131 as being implemented / performed at the external sound processing module 124, it is to be appreciated that these elements (e.g., functional operations) could also or alternatively be implemented / performed as part of the implantable sound processing module 158, as part of the external device 110, etc.
[0037] Returning to the example of FIGs. 1A-1D, the cochlear implant 112 comprises an implant body (main module) 134, a lead region 136, and the stimulating assembly 116, all configured to be implanted under the skin (tissue) 115 of the user. The implant body 134 generally comprises a hermetically-sealed housing 138 that includes, in certain examples, a power source 125, etc.), in which the RF interface circuitry 140 and a stimulator unit 142 are disposed. The implant body 134 also includes the intemal / implantable coil 114 that is generally external to the housing 138, but which is connected to the RF interface circuitry 140 via a hermetic feedthrough (not shown in FIG. ID).
[0038] As described further below, in accordance with embodiments presented herein, the power source 125 and / or the power source 132 comprises at least two rechargeable surface mount batteries 133 (e.g., SMT batteries or SMD batteries) mounted on a PCB and connected in parallel with another. In certain aspects, the at least two rechargeable batteries 133 are directly soldered to the PCB and / or are around a component that is also mounted on the PCB. This component can comprise, for example, at least one of magnet, a coil, and a heat generating device. In certain aspects, the at least two rechargeable batteries 133 are mounted in respective predetermined positions based on a characteristic (e.g., thermal profile) of a component that is also mounted on the PCB.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0039] As noted, FIG. ID illustrates both the power source 125 and the power source 132 has including two rechargeable surface mount batteries 133. It is to be appreciated that this specific arrangement is merely illustrative and that each of the power source 125 and the power source 132 can be implemented with different numbers of rechargeable surface mount batteries, rechargeable surface mount batteries having different capacities, etc.
[0040] As described further below, at least the implantable coil 114 is disposed in a biocompatible encapsulation layer (encapsulation) 101. The encapsulation layer 101 includes a magnet pocket (not shown in FIG. 1C), which can be any suitable feature in the encapsulation layer 101 configured to receive and retain an implantable magnet system 152. The implantable magnet system 152 comprises one or more magnets / magnetic components, potentially disposed in a hermetic housing. The magnets / magnetic materials disposed of an implantable magnet system can take any of a number of different forms / arrangements and can include, for example, fixed magnets / magnetic materials, uniaxially or biaxially rotatable magnets (e.g., diametric magnets), flexible omnidirectional rotating magnetic arrays (FORMAs) (e.g., miniaturized magnetic balls made sealed insides interconnected cavities where the magnetic balls can rotate freely in the cavities), etc.
[0041] As noted, the stimulating assembly 116 is configured to be at least partially implanted in the user’s cochlea. The stimulating assembly 116 includes a plurality of longitudinally spaced intra-cochlear electrical stimulating contacts (e.g., electrodes) 144 that collectively form a contact array (electrode array) 146 for delivery of electrical stimulation (current) to the recipient’s cochlea. The stimulating assembly 116 extends through an opening in the recipient’s cochlea (e.g., cochleostomy, the round window, etc.) and has a proximal end connected to stimulator unit 142 via lead region 136 and a hermetic feedthrough (not shown in FIG. ID). Lead region 136 includes a plurality of conductors (wires) that electrically couple the electrodes 144 to the stimulator unit 142. The cochlear implant 112 also includes an electrode outside of the cochlea, sometimes referred to as the extra-cochlear electrode (ECE) 139.
[0042] As noted, the cochlear implant system 102 includes the external coil 108 and the implantable coil 114. The external magnet 150 is positioned adjacent to the external coil 108, and the intemal / implantable magnet system 152 is positioned adjacent to the implantable coil 114. The external magnet 150 and the intemal / implantable magnet system 152 adjacent to the external coil 108 and the internal / implantable coil 114, respectively, facilitate the operational alignment of the external coil 108 with the implantable coil 114. This operational alignmentAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1of the coils enables the external component 104 to transmit data and power to the cochlear implant 112 via a closely-coupled wireless link 148 formed between the external coil 108 with the implantable coil 114. In certain examples, the closely-coupled wireless link 148 is an RF link. However, various other types of energy transfer, such as infrared (IR), electromagnetic, capacitive, and inductive transfer, can be used to transfer the power and / or data from an external component to an implantable component and, as such, FIG. ID illustrates only one example arrangement.
[0043] As noted above, the sound processing unit 106 includes the external sound processing module 124. The external sound processing module 124 is configured to process the received input audio signals (received at one or more of the input devices, such as sound input devices 118 and / or auxiliary input devices 128) and convert the received input audio signals into output control signals for use in stimulating a first ear of a recipient or user (i.e., the external sound processing module 124 is configured to perform sound processing on input signals received at the sound processing unit 106). Stated differently, the one or more processors (e.g., processing element(s) implementing firmware, software, etc.) in the external sound processing module 124 are configured to execute sound processing logic in memory to convert the received input audio signals into output control signals (stimulation signals) that represent electrical stimulation for delivery to the recipient.
[0044] As noted, FIG. ID illustrates an embodiment in which the external sound processing module 124 in the sound processing unit 106 generates the output control signals. In an alternative embodiment, the sound processing unit 106 can send less processed information (e.g., audio data) to the cochlear implant 112, and the sound processing operations (e.g., conversion of input sounds to output control signals 156) can be performed by a processor within the cochlear implant 112.
[0045] In FIG. ID, according to an example embodiment, output control signals (stimulation signals) are provided to the RF transceiver 122, which transcutaneously transfers the output control signals (e.g., in an encoded manner) to the cochlear implant 112 via the external coil 108 and the implantable coil 114. That is, the output control signals (stimulation signals) are received at the RF interface circuitry 140 via the implantable coil 114 and provided to the stimulator unit 142. The stimulator unit 142 is configured to utilize the output control signals to generate electrical stimulation signals (e.g., current signals) for delivery to the user’s cochlea via one or more of the stimulating contacts 144. In this way, the cochlear implant system 102 electrically stimulates the user’s auditory nerve cells, bypassing absent or defective hair cellsAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1that normally transduce acoustic vibrations into neural activity, in a manner that causes the recipient to perceive one or more components of the input audio signals (the received sound signals).
[0046] As detailed above, in the external hearing mode, the cochlear implant 112 receives processed sound signals from the sound processing unit 106. However, in the invisible hearing mode, the cochlear implant 112 is configured to capture and process sound signals for use in electrically stimulating the user’s auditory nerve cells. In particular, as shown in FIG. ID, an example embodiment of the cochlear implant 112 can include a plurality of implantable sound sensors 165(1), 165(2) that collectively form a sensor array 160, and an implantable sound processing module 158. Similar to the external sound processing module 124, the implantable sound processing module 158 can comprise, for example, one or more processors and a memory device (memory) that includes sound processing logic. The memory device can comprise any one or more of Non-Volatile Memory (NVM), Ferroelectric Random Access Memory (FRAM), read only memory (ROM), random access memory (RAM), magnetic disk storage media devices, optical storage media devices, flash memory devices, electrical, optical, or other physical / tangible memory storage devices. The one or more processors are, for example, microprocessors or microcontrollers that execute instructions for the sound processing logic stored in memory device.
[0047] In the invisible hearing mode, the implantable sound sensors 165(1), 165(2) of the sensor array 160 are configured to detect / capture input sound signals 166 (e.g., acoustic sound signals, vibrations, etc.), which are provided to the implantable sound processing module 158. The implantable sound processing module 158 is configured to convert received input sound signals 166 (received at one or more of the implantable sound sensors 165(1), 165(2)) into output control signals 156 for use in stimulating the first ear of a recipient or user (i.e., the implantable sound processing module 158 is configured to perform sound processing operations). Stated differently, the one or more processors (e.g., processing element(s) implementing firmware, software, etc.) in the implantable sound processing module 158 are configured to execute sound processing logic in memory to convert the received input sound signals 166 into output control signals 156 that are provided to the stimulator unit 142. The stimulator unit 142 is configured to utilize the output control signals 156 to generate electrical stimulation signals (e.g., current signals) for delivery to the user’s cochlea, thereby bypassing the absent or defective hair cells that normally transduce acoustic vibrations into neural activity.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0048] It is to be appreciated that the above description of the so-called external hearing mode and the so-called invisible hearing mode are merely illustrative and that the cochlear implant system 102 could operate differently in different embodiments. For example, in one alternative implementation of the external hearing mode, the cochlear implant 112 could use signals captured by the sound input devices 118 and the implantable sound sensors 165(1), 165(2) of sensor array 160 in generating stimulation signals for delivery to the user.
[0049] The rechargeable batteries 133 are configured to provide sufficient voltage / current (power) characteristics to operate cochlear implant 112 for some predetermined amount of time without recharging. As noted above, in accordance with embodiments presented herein, the rechargeable batteries 133 are small-scale surface mount devices (SMDs) that are configured to be directly soldered to a printed circuit board (PCB) using surface mount technology (SMT). Batteries employed in accordance with the embodiments described herein can have, for example, dimensions of 4.4 mm x 3.0 mm x 1 mm, which is similar to the sizing of other two-terminal devices such as resistor, capacitor, and diode SMDs. These SMD batteries can have a nominal voltage in the range of 1 ,5V - 4.5 V, making them suitable for powering electronic circuitry associated with smaller electronic devices, such as the medical devices described herein. With their smaller size, and increased energy density, two or more such batteries (referred to hereinafter as “rechargeable surface mount batteries”), electrically connected in parallel with one another, can provide sufficient power and improved form factor configurations.
[0050] FIG. 2 shows a surface mount battery 233 and corresponding heat radiation pattern, depicted by arrows 260, that is taken into account in to determine a mounting position for a plurality of rechargeable surface mount batteries 233 on a PCB in accordance with techniques presented herein. More specifically, FIG. 2 shows surface mount battery 233 with a positive terminal 252 and a negative terminal 254. These terminals are configured to be soldered to a PCB using solder reflow techniques that are similarly used to place other surface mount devices on a PCB. Surface mount battery 233, in both charging and discharging operations, has a predetermined thermal profile. That is, as shown by the several arrows 260, surface mount battery 233 radiates heat during different states of operation. Although shown substantially radiating in a planar direction, those skilled in the art will appreciate that thermal radiation occurs in all directions, and can dissipate radiatively or convectively, e.g., along traces of the PCB, or via packaging material that surrounds / contacts the surface mount battery 233.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0051] For example, FIG. 3 shows different heat-emitting states of a surface mount battery 233 and a corresponding amount of heat that is generated during those states in accordance with techniques presented herein. Specifically, when the surface mount battery 233 is neither charging nor discharging, no heat is dissipated (at least after some period of time after charging or discharging). During a “normal” operation state, i.e., during normal charging and / or discharging operations, surface mount battery 233 generates a first predetermined amount of heat (i.e., a first thermal profile 310). During a short-circuit state, when surface mount battery 233 might have failed in a short-circuit manner and enters a thermal runaway state, surface mount battery 233 generates a second predetermined amount of heat (i.e., second thermal profile 320). The thermal runaway state might be short-lived, but is characterized by an amount of heat that is typically greater than the amount of heat generated during the normal operation state. According to the embodiments described herein, these different heat-emitting states, or thermal profile conditions, are considered in determining how two or more rechargeable surface mount batteries 233 are mounted (placed or positioned) with respect to each other, and to other components, on a PCB.
[0052] In this regard, reference is now made to FIG. 4, which shows a side view of a PCB 410 with rechargeable surface mount batteries 433 mounted thereon. The configuration of surface mount battery placement in FIG. 4 is a top and bottom configuration. That is, rechargeable surface mount batteries 433 are mounted, placed, or positioned (mounted) on both sides of PCB 410. The use of both sides of the PCB 410 allows for increased area on the PCB 410 on which to mount rechargeable surface mount batteries 433. This top and bottom configuration can also help drive an improved overall form factor for the electronic device being powered. Also, in some implementations, it could be desirable to stack the rechargeable surface mount batteries 433 on top of one another, as shown. Notably, rechargeable surface mount batteries 433 are all electrically connected in parallel with one another, such that if any one surface mount battery 433 shorts out or causes an open circuit, due to battery failure, the remaining rechargeable surface mount batteries 433 are still capable of operating and providing power to other components. However, it is noted that, for such operation, switches are required to switch out the offending battery and to maintain function of the remaining batteries.
[0053] That is, given the parallel connection, each surface mount battery 433 can be electrically isolated via appropriate switching techniques (discussed with reference to FIG. 11) to avoid a scenario in which all batteries are shorted out in the event one battery is shorted out.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0054] As shown, a distance DI, which can be referred to as a “minimally safe thermal distance,” separates one surface mount battery 433 from another. In an embodiment, the distance DI is set or determined based on the expected thermal profiles of rechargeable surface mount batteries 433 (per, e.g., FIG. 3) and how those thermal profiles might detrimentally impact the operations of neighboring rechargeable surface mount batteries 433. For example, if one surface mount battery 433 goes into thermal runaway and exhibits the second thermal profile 320, the position of neighboring rechargeable surface mount batteries 433 should be such that the second thermal profile 320 (increased short-lived heat) will not cause the neighboring rechargeable surface mount batteries 433 to likewise fail and enter a thermal runaway condition, or operate at a less than desired efficiency, due, e.g., to increased internal resistance caused by the heat generated by the neighboring surface mount battery 433.
[0055] As a specific example, if a surface mount battery 433 was to heat up to 500°C under fault conditions (e.g., shorted battery cell transitioning into thermal runaway), then the typical objective is to avoid that heat triggering the onset of a thermal runaway in another neighbor battery. The onset temperature is typically 160°C for lithium cobalt-including Li-ion batteries, and a buffer of a few 10°C would be appropriate. As such, the minimally safe thermal distance is calculated to arrive at a spacing that results at, e.g., no more than 100°C in an adjacent battery cell during the heat-emitting event. It is noted that the thermal runaway temperatures described herein are different from the conditions that surface mount battery 433 might undergo during solder reflow, in which temperatures might be as high as 245°C.
[0056] Distance DI illustrated in FIG. 4 can be increased or decreased depending on the particular design configuration of the PCB 410. For example, when rechargeable surface mount batteries 433 are in a stacked configuration and there is the potential for all the batteries in the stack of rechargeable surface mount batteries 433 to fail together, distance DI could be increased to account for the additional heat that two or more batteries might generate together in a thermal runaway state, or even in just the normal operation state.
[0057] As noted, the rechargeable surface mount batteries discussed herein are connected in parallel with one another. FIG. 11 shows the parallel connections of rechargeable surface mount batteries 1133 with the positive terminal of the batteries connected to a power bus 1110 (or trace) and the negative terminal of the batteries connected to a ground plane 1120 (or trace). Because any one of batteries could fail in a short-circuit state, individual switches 1160 can be added to remove a given surface mount battery 1133 from the overall circuit. Switches could also be added to the negative terminal side of the surface mount battery 1133. Switches 1160Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1(and additional switches as desired) can also be used to keep certain batteries in reserve, i.e., initially out-of-service, and at some later time during the life cycle of the electronic device, rechargeable surface mount batteries 1133 could be switched into the circuit for a first time. The switches 1160 can also be used to keep the rechargeable surface mount batteries 1133 operating in a round robin approach such that a sub-set of the rechargeable surface mount batteries 1133 are operating while others are out-of-service, but with the intention to bring those out-of-service batteries back online.
[0058] FIG. 5 shows a plan view of a PCB 510 including several rechargeable surface mount batteries 533 mounted to the PCB 510. In this case, some of the rechargeable surface mount batteries 533 are arranged with their end-facing terminals facing each other, while other rechargeable surface mount batteries 533 are arranged with their long axes perpendicular to one another. Due to the thermal profiles of the rechargeable surface mount batteries 533, and a direction from where heat might tend to emanate more or less, a distance DI between endfacing terminals, and a distance D2 between one end-facing terminal and a body of the where heat might surface mount battery 533 can be different. Once again, the mounting placement or positioning of the rechargeable surface mount batteries 533 is driven by a minimally safe thermal distance, which can be change depending on how the mounting placement or positioning of the rechargeable surface mount batteries 533.
[0059] FIG. 6 shows an electronic component 630, such as an Application Specific Integrated Circuit (ASIC), Metal Oxide Semiconductor Field-Effect transistor (MOSFET), Zener diode, etc., that generates heat during normal operation. The generated heat is depicted as a heat radiation pattern, illustrated by arrows 660. The heat radiation pattern of electronic component 630 can also be used to set the mounting placement or positioning of rechargeable surface mount batteries 633 on a PCB 610 in accordance with techniques presented herein. More specifically, in FIG. 6, electronic component 630 has a substantially evenly distributed thermal profile such that heat radiates substantially equally in all directions. In such a case, rechargeable surface mount batteries 633 are mounted a minimally safe thermal distance away from all sides of electronic component 630 and, as shown on either side of electronic component 630. Of course, those skilled in the art will appreciate that rechargeable surface mount batteries 633 can fully surround electronic component 630 in a configuration like that shown in FIG. 5. Rechargeable surface mount batteries 633 could also be stacked on top of one another as is shown in FIG. 4. In any configuration, rechargeable surface mount batteries 633 are mounted such that in normal operation the heat generated by electronic component 630Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1does not detrimentally impact the functionality of the rechargeable surface mount batteries 633. That is, the rechargeable surface mount batteries 633 are mounted a sufficiently distance away from the electronic component 630 so that the heat from the electronic component 630 does not, for example, cause any one of the rechargeable surface mount batteries 633 to go into thermal runaway, or to perform at a lower efficiency.
[0060] As a specific example, if electronic component 630 was to regularly heat up to 100°C during normal operation (e.g., a Zener diode shunting away excess energy), then a goal can be to set the minimally safe thermal distance to avoid causing a temperature gradient of more than 5-10°C across an adj acent battery. In another example, this approach can include the deliberate use of heat from heat-generating components to minimize the temperature (heat) gradient across batteries in order to operate them more efficiently, but at a somewhat elevated temperature.
[0061] FIG. 7 shows an electronic component 730, such as an Application Specific Integrated Circuit (ASIC), Metal Oxide Semiconductor Field-Effect transistor (MOSFET), etc., that generates heat during normal operation. The generated heat is depicted as a heat radiation pattern, illustrated by arrows 760. The heat radiation pattern of electronic component 730 can also be used in selecting a mounting placement or positioning of rechargeable surface mount batteries 733 on a PCB 710 in accordance with techniques presented herein. More specifically, in FIG. 7, electronic component 730 has a substantially asymmetrically distributed thermal profile such that heat radiates mostly towards the right-hand side of PCB 710. In such a case, rechargeable surface mount batteries 733 are mounted towards the left-hand side of PCB 710 at a minimally safe thermal distance away from the cooler left-hand side of electronic component 730. Those skilled in the art will appreciate that rechargeable surface mount batteries 733 can also be stacked on top of one another as is shown in FIG. 4. In any configuration, rechargeable surface mount batteries 733 are mounted such that in normal operation the heat generated by electronic component 730 does not detrimentally impact the functionality of the rechargeable surface mount batteries 733. That is, the rechargeable surface mount batteries 733 are mounted a sufficiently distance away from the electronic component 730, in an appropriate direction, so that the heat from the electronic component 730 does not, for example, cause any one of the rechargeable surface mount batteries 733 to go into thermal runaway, or to perform at a lower efficiency.
[0062] FIG. 8 shows an electronic component 830, such as an Application Specific Integrated Circuit (ASIC), Metal Oxide Semiconductor Field-Effect transistor (MOSFET), etc., thatAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1generates heat during normal operation. The generated heat is depicted as a heat radiation or conduction pattern, illustrated by arrows 860. The heat radiation or conduction pattern of electronic component 830 can also be used in selecting a mounting placement or positioning of rechargeable surface mount batteries 833 on a PCB 810 in accordance with techniques presented herein. More specifically, in FIG. 8, the rechargeable surface mount batteries 833 are mounted on an opposite side of the PCB 810 from that on which the electronic component 830 is mounted. This configuration provides a minimally safe thermal distance between the electronic component 830 and the rechargeable surface mount batteries 833. Those skilled in the art will appreciate that rechargeable surface mount batteries 833 can also be stacked on top of one another as is shown in FIG. 4. In any configuration, rechargeable surface mount batteries 833 are mounted such that in normal operation the heat generated by electronic component 830 does not detrimentally impact the functionality of the rechargeable surface mount batteries 833. That is, the rechargeable surface mount batteries 833 are mounted a sufficiently distance away from the electronic component 830, so that the heat from the electronic component 830 does not, for example, cause any one of the rechargeable surface mount batteries 833 to go into thermal runaway, or to perform at a lower efficiency.
[0063] FIG. 9 shows an electromagnetic component 930, such as a coil, magnet, or other device. In this case, electromagnetic component 930 might have a substantially circular shape, and could be, e.g., part of cochlear implant 112. Electromagnetic component 930 might not generate as much heat as the electronic components of FIGs. 6-8, but might nevertheless interact with rechargeable surface mount batteries 933. More specifically, rechargeable surface mount batteries 933 could detrimentally impact the operation of electromagnetic component 930, or vice versa. That is, rechargeable surface mount batteries 933 can impact the Q of a coil if placed or mounted too close to the coil. Similarly, the magnetic field of a magnet can be changed in the presence of rechargeable surface mount batteries 933. As such, rechargeable surface mount batteries 933 are, in this case, arranged around a circumference of electromagnetic component 930, in a radial pattern, a minimal distance D3 from electromagnetic component 930 that is sufficient to minimize the impact of the presence of rechargeable surface mount batteries 933 on the operation of electromagnetic component 930. Minimal distance D3 is also sufficient to ensure that the operation or efficiency of rechargeable surface mount batteries 933 are not detrimentally impacted by electromagnetic component 930. FIG. 9 shows terminal faces of rechargeable surface mount batteries 933 facing electromagnetic component 930. However, those skilled in the art will appreciate that theAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1batteries could also be rotated 90 degrees such that the terminal faces are arranged to be perpendicular to the electromagnetic component 930, or the surface mount batteries 933 can be rotated or mounted in any orientation (including radially, tangentially, vertically (e.g., FIG.10), etc.) that is advantageous to a particular application.
[0064] As a specific example, rechargeable surface mount batteries 933 can be placed around componentry of a magnetic-inductive link of a cochlear implant, for example a 5MHz or 6.78MHz link, in order to minimize field line distortion and thus minimize the impact on the link efficiency.
[0065] FIG. 10 shows rechargeable surface mount batteries 1033 that are mounted on a PCB 1010 near an electronic or electromagnetic component 1030. In this case, the rechargeable surface mount batteries 1033 are mounted on a narrow side of their bodies (rather than on a broader side). Such a mounting configuration can limit the amount of heat that is passed between the electromagnetic component 1030 and the rechargeable surface mount batteries 1033 via traces on the PCB 1010. Also, such an on-edge mounting configuration can impact the operation of a coil that could be the electronic or electromagnetic component 1030.
[0066] That is, battery orientation can be selected to be compatible with an overall design intent, by taking advantage of elements of symmetry or deliberate asymmetry (e.g., circular placement around a magnet or with reference to a coil operating a wireless link) where the exact placement could be subject to a corresponding analysis and / or experimentally focused optimization algorithm.
[0067] Also, and as noted, mounting, placement, or configuration of the rechargeable surface mount batteries can be based on their size and footprint / height geometries, where distributed battery cells can contribute to more volume-efficient device design by occupying otherwise unusable void volumes on a PCB due to an overall desired device shape and / or form factor.
[0068] Thus, those skilled in the art will appreciate the multiple rechargeable surface mount batteries can be mounted on a PCB to power an electronic device, such as a medical device. The batteries are strategically placed at a minimally safe thermal distance from one another and / or another heat-generating component on the PCB. The batteries can also be mounted, placed or positioned (mounted) to avoid detrimental impact to the operation of the batteries themselves and / or to other components on the PCB or in the electronic device, as well as to achieve a desired form factor for the device.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0069] FIG. 12 is a flow chart illustrating a method of mounting, placing, or positioning (mounting) rechargeable surface mount batteries on a PCB to provide a distributed battery system. At 1202, an operation includes mounting a component on a printed circuit board. At 1204, an operation includes mounting a distributed battery system comprising at least two rechargeable surface mount batteries on the printed circuit board in proximity to the component. At 1206, an operation includes electrically connecting the at least two rechargeable surface mount batteries in parallel. The respective mounting positions of the at least two rechargeable surface mount batteries can be selected based on at least one characteristic (e.g., thermal characteristics) of the component.
[0070] As previously described, the technology disclosed herein can be applied in any of a variety of circumstances and with a variety of different devices. Example devices that can benefit from technology disclosed herein are described in more detail in FIGs. 13-16 for a vestibular stimulator system, a retinal prosthesis system, a tinnitus therapy device, and an upper airway stimulation device, respectively. However, the techniques of the present disclosure can be applied to other devices, such as neurostimulators, cardiac pacemakers, cardiac defibrillators, seizure therapy stimulators, as well as other medical devices that deliver stimulation to tissue. Further, technology described herein can also be applied to consumer devices. That is, these different systems can benefit from the distributed surface mount battery distribution patterns described herein to achieve thermal safety, reduced electromagnetic interference, and / or improved form factor design.
[0071] FIG. 13 illustrates an example vestibular stimulator system 1302, with which embodiments presented herein can be implemented. As shown, the vestibular stimulator system 1302 comprises an implantable component (vestibular stimulator) 1312 and an external device / component 1304 (e.g., external processing device, battery charger, remote control, etc.). The external device 1304 comprises a transceiver unit 1360. As such, the external device 1304 is configured to transfer data (and potentially power) to the vestibular stimulator 1312.
[0072] The vestibular stimulator 1312 comprises an implant body (main module) 1334, a lead region 1336, and a stimulating assembly 1316, all configured to be implanted under the skin / tissue (tissue) 1315 of the recipient. The implant body 1334 generally comprises a hermetically-sealed housing 1338 in which RF interface circuitry, one or more rechargeable batteries, one or more processors, and a stimulator unit are disposed. The implant body 1334 also includes an intemal / implantable coil 1314 that is generally external to the housing 1338, but which is connected to the transceiver via a hermetic feedthrough (not shown).Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0073] The stimulating assembly 1316 comprises a plurality of electrodes 1344( 1 )-(3) disposed in a carrier member (e.g., a flexible silicone body). In this specific example, the stimulating assembly 1316 comprises three (3) stimulation electrodes, referred to as stimulation electrodes 1344(1), 1344(2), and 1344(3). The stimulation electrodes 1344(1), 1344(2), and 1344(3) function as an electrical interface for delivery of electrical stimulation signals to the recipient’s vestibular system.
[0074] The stimulating assembly 1316 is configured such that a surgeon can implant the stimulating assembly adjacent the recipient’s otolith organs via, for example, the recipient’s oval window. It is to be appreciated that this specific embodiment with three stimulation electrodes 1344 is merely illustrative and that the techniques presented herein can be used with stimulating assemblies having different numbers of stimulation electrodes, stimulating assemblies having different lengths, etc.
[0075] Moreover, the implant body 1334 can be configured in accordance with techniques presented herein, namely to be powered by a distributed surface mount battery distribution arrangement described herein to achieve thermal safety, reduced electromagnetic interference, and / or improved form factor design. For example, the implant body 1334 (e.g., the hermetically-sealed housing 1338) can include at least two rechargeable surface mount batteries 1333 mounted to a PCB (not shown in FIG. 13). The at least two rechargeable surface mount batteries 1333 can be connected in parallel and the respective mounting positions of the at least two rechargeable surface mount batteries 1333 can be selected based on at least one characteristic (e.g., thermal characteristics) of another component. Those skilled in the art will appreciate that the vestibular stimulator system 1302 is merely an exemplary embodiment of such systems and devices.
[0076] FIG. 14 illustrates a retinal prosthesis system 1401 that comprises an external device 1410 configured to communicate with an implantable retinal prosthesis 1400 via signals 1451. The retinal prosthesis 1400 comprises an implanted processing module 1425, and a retinal prosthesis sensor-stimulator 1490 is positioned proximate the retina of a recipient. The external device 1410 and the processing module 1425 can communicate via coils 1408, 1414.
[0077] In an example, sensory inputs (e.g., photons entering the eye) are absorbed by a microelectronic array of the sensor-stimulator 1490 that is hybridized to a glass piece 1492 including, for example, an embedded array of microwires. The glass can have a curved surface that conforms to the inner radius of the retina. The sensor-stimulator 1490 can include aAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1microelectronic imaging device that can be made of thin silicon containing integrated circuitry that convert the incident photons to an electronic charge.
[0078] The processing module 1425 includes an image processor 1423 that is in signal communication with the sensor-stimulator 1490 via, for example, a lead 1488 that extends through surgical incision 1489 formed in the eye wall. In other examples, processing module 1425 is in wireless communication with the sensor-stimulator 1490. The image processor 1423 processes the input into the sensor-stimulator 1490 and provides control signals back to the sensor-stimulator 1490 so the device can provide an output to the optic nerve. That said, in an alternate example, the processing is executed by a component proximate to, or integrated with, the sensor-stimulator 1490. The electric charge resulting from the conversion of the incident photons is converted to a proportional amount of electronic current which is input to a nearby retinal cell layer. The cells fire and a signal is sent to the optic nerve, thus inducing a sight perception.
[0079] The processing module 1425 can be implanted in the recipient and function by communicating with the external device 1410, such as a BTE unit, a pair of eyeglasses, etc. The external device 1410 can include an external light / image capture device (e.g., located in / on a behind-the-ear device or a pair of glasses, etc.), while, as noted above, in some examples, the sensor-stimulator 1490 captures light / images, in which sensor-stimulator 1490 is implanted in the recipient.
[0080] Moreover, the implantable retinal prosthesis 1400 can be configured in accordance with techniques presented herein, namely to be powered by a distributed surface mount battery distribution arrangement described herein to achieve thermal safety, reduced electromagnetic interference, and / or improved form factor design. For example, processing module 1425 can include at least two rechargeable surface mount batteries 1433 mounted to a PCB (not shown in FIG. 14). The at least two rechargeable surface mount batteries 1433 can be connected in parallel and the respective mounting positions of the at least two rechargeable surface mount batteries 1433 can be selected based on at least one characteristic (e.g., thermal characteristics) of another component. Those skilled in the art will appreciate that the implantable retinal prosthesis 1400 is merely an exemplary embodiment of such systems and devices.
[0081] FIG. 15 illustrates a tinnitus therapy device 1500 (e.g., a tinnitus implant, a tinnitus management stimulator) including a sound input unit 1502 (e.g., a microphone) configured to receive acoustic inputs. In some embodiments, the sound input unit 1502 is implanted adjacentAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1to an outer ear 1503 to position a diaphragm 1516 of the sound input unit 1502 such that the diaphragm 1516 is configured to be displaced (vibrate) in response to the acoustic inputs. The tinnitus therapy device 1500 further includes an implant body 1504 in which circuitry, such as a processor and / or a memory, is disposed. The implant body 1504 is also coupled to a coil 1508 to enable transfer of power / data between the tinnitus therapy device 1500 and an external device. The implant body 1504 is electrically coupled to the sound input unit 1502 to receive the acoustic input. The tinnitus therapy device 1500 is then configured to convert the acoustic input to tinnitus therapy control signals (e.g., based on a classification of the acoustic input).
[0082] The tinnitus therapy control signals are provided to an actuator 1506 electrically coupled to the implant body 1504 for delivery to the recipient. By way of example, a coupling member 1540 couples the actuator 1506 to an ossicular chain 1536 (i.e., the malleus, the incus, and the stapes bones) positioned in a middle ear cavity between a tympanic membrane 1513 and a cochlea 1538 of the recipient, and the actuator 1506 is configured to deliver the tinnitus therapy control signals. The actuator 1506 is attached to a temporal bone 1515 of the recipient via a fixation system 1542 and is configured to impart motion to (e.g., vibrate) the ossicular chain 1536, which is typically configured to amplify sound waves received via an ear canal 1511. In operation, the actuator 1506 is configured to impart motion based on the tinnitus therapy control signals, and such vibration creates waves of fluid motion of perilymph within the cochlea 1538 to activate hair cells within the cochlea 1538. Activation of the hair cells causes nerve impulses to be generated and transferred through spiral ganglion cells, an auditory nerve, and a brain, where the vibration is perceived as sounds to provide relief of tinnitus symptoms experienced by the recipient.
[0083] Moreover, the tinnitus therapy device 1500 can be configured in accordance with techniques presented herein, namely to be powered by a distributed surface mount battery distribution arrangement described herein to achieve thermal safety, reduced electromagnetic interference, and / or improved form factor design. For example, implant body 1504 can include at least two rechargeable surface mount batteries 1533 mounted to a PCB (not shown in FIG.15). The at least two rechargeable surface mount batteries 1533 can be connected in parallel and the respective mounting positions of the at least two rechargeable surface mount batteries 1533 can be selected based on at least one characteristic (e.g., thermal characteristics) of another component. Those skilled in the art will appreciate that the tinnitus therapy device 1500 is merely an exemplary embodiment of such systems and devices.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0084] FIG. 16 illustrates an upper airway stimulation device 1600 (e.g., an upper airway implant, a sleep apnea management stimulator, a sleep disorder system) that includes an implant body 1602, a sensor 1604, and a stimulator 1606. The upper airway stimulation device 1600 is implantable in a recipient 1608 to position the sensor 1604 adjacent to lungs 1610 of the recipient 1608. Thus, the sensor 1604 is able to receive input that indicates breathing performed by the recipient 1608. The implant body 1602 includes a housing in which circuitry, such as a processor and / or a memory, is disposed. The sensor 1604 transmits electrical signals in response to receipt of the input, and the upper airway stimulation device 1600 is configured to convert the electrical signals to stimulation signals, which are provided to the stimulator 1606. The stimulator 1606 is positioned adjacent to a hypoglossal nerve 1612 of the recipient 1608 and is configured to deliver the stimulation signals to the hypoglossal nerve 1612, which fires nerve cells of a tongue of the recipient 1608, thereby causing the tongue to contract and move (e.g., in an anterior direction) and increase a size of an opening of an airway of the recipient 1608. Consequently, the upper airway stimulation device 1600 generates stimulation signals based on the input to help the recipient 1608 breathe more easily (e.g., while the recipient 1608 is asleep to mitigate sleep apnea).
[0085] Moreover, the upper airway stimulation device 1600 can be configured in accordance with techniques presented herein, namely to be powered by a distributed surface mount battery distribution arrangement described herein to achieve thermal safety, reduced electromagnetic interference, and / or improved form factor design. For example, implant body 1602can include at least two rechargeable surface mount batteries 1633 mounted to a PCB (not shown in FIG.16). The at least two rechargeable surface mount batteries 1633 can be connected in parallel and the respective mounting positions of the at least two rechargeable surface mount batteries 1633 can be selected based on at least one characteristic (e.g., thermal characteristics) of another component. Those skilled in the art will appreciate that the upper airway stimulation device 1600 is merely an exemplary embodiment of such systems and devices
[0086] The above embodiments have been primarily described with reference to use of the techniques presented herein during implantation of a specific implantable component, namely a cochlear implant stimulating assembly. However, as described above with reference to FIGs.13, 14, 15, and 16, the techniques presented herein can be used to provide flexibility to improve implantation of a variety of implantable components, including sleep disorder devices (e.g., sleep apnea devices), balance or movement disorder devices (e.g., vestibular stimulationAtty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1devices), tinnitus management devices, visual implants (e.g., bionic eyes), and other neuromodulation devices (e.g., brain-computer interfaces).
[0087] As should be appreciated, while particular uses of the technology have been illustrated and discussed above, the disclosed technology can be used with a variety of devices in accordance with many examples of the technology. The above discussion is not meant to suggest that the disclosed technology is only suitable for implementation within systems akin to that illustrated in the figures. In general, additional configurations can be used to practice the processes and systems herein and / or some aspects described can be excluded without departing from the processes and systems disclosed herein.
[0088] This disclosure described some aspects of the present technology with reference to the accompanying drawings, in which only some of the possible aspects were shown. Other aspects can, however, be embodied in many different forms and should not be construed as limited to the aspects set forth herein. Rather, these aspects were provided so that this disclosure was thorough and complete and fully conveyed the scope of the possible aspects to those skilled in the art.
[0089] As should be appreciated, the various aspects (e.g., portions, components, etc.) described with respect to the figures herein are not intended to limit the systems and processes to the particular aspects described. Accordingly, additional configurations can be used to practice the methods and systems herein and / or some aspects described can be excluded without departing from the methods and systems disclosed herein.
[0090] According to certain aspects, systems and non-transitory computer readable storage media are provided. The systems are configured with hardware configured to execute operations analogous to the methods of the present disclosure. The one or more non-transitory computer readable storage media comprise instructions that, when executed by one or more processors, cause the one or more processors to execute operations analogous to the methods of the present disclosure.
[0091] Similarly, where steps of a process are disclosed, those steps are described for purposes of illustrating the present methods and systems and are not intended to limit the disclosure to a particular sequence of steps. For example, the steps can be performed in differing order, two or more steps can be performed concurrently, additional steps can be performed, and disclosed steps can be excluded without departing from the present disclosure. Further, the disclosed processes can be repeated.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1
[0092] Although specific aspects were described herein, the scope of the technology is not limited to those specific aspects. One skilled in the art will recognize other aspects or improvements that are within the scope of the present technology. Therefore, the specific structure, acts, or media are disclosed only as illustrative aspects. The scope of the technology is defined by the following claims and any equivalents therein.
[0093] It is also to be appreciated that the embodiments presented herein are not mutually exclusive and that the various embodiments can be combined with another in any of a number of different manners.
Claims
Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC1CLAIMSWhat is claimed is:
1. A medical device, comprising:a printed circuit board; andat least two rechargeable batteries mounted on the printed circuit board and electrically connected in parallel.
2. The medical device of claim 1, wherein the at least two rechargeable batteries are rechargeable surface mount batteries.
3. The medical device of claim 1, wherein the at least two rechargeable batteries are directly soldered to the printed circuit board.
4. The medical device of claim 1, 2, or 3, wherein the at least two rechargeable batteries are mounted around a component that is also mounted on the printed circuit board.
5. The medical device of claim 4, wherein the component comprises at least one of a magnet, a coil, and a heat generating device.
6. The medical device of claim 1, 2, or 3, wherein the at least two rechargeable batteries are mounted on both sides of the printed circuit board.
7. The medical device of claim 1, 2, or 3, wherein the at least two rechargeable batteries are mounted in respective predetermined positions based on a characteristic of a component that is also mounted on the printed circuit board.
8. The medical device of claim 7, wherein the characteristic of the component comprises a thermal profile of the component.
9. The medical device of claim 7, wherein the characteristic of the component comprises an electromagnetic profile of the component.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC110. The medical device of claim 1, 2, or 3, wherein the at least two rechargeable batteries are mounted end-to-end with terminal faces of respective batteries facing one another or perpendicularly to one another.
11. The medical device of claim 1, 2, or 3, wherein the at least two rechargeable batteries are among a plurality of batteries, and each battery in the plurality of batteries is arranged in a radial pattern around another component mounted on the printed circuit board.
12. The medical device according to anyone of claims 1 to 11 wherein the medical device is a hearing device, a sleep disorder device, a seizure device, a balance or movement disorder device, a tinnitus management device, or a visual device.
13. The use of a device according to anyone of claims 1 to 11 in a hearing device, sleep disorder device, a seizure device, a balance or movement disorder device, a tinnitus management device, or a visual device.
14. A medical device, comprising:a printed circuit board; anda plurality of rechargeable surface mount batteries attached to the printed circuit board,wherein the plurality of rechargeable surface mount batteries are electrically connected in parallel, and are spaced from one another in a distributed pattern on the printed circuit board.
15. The medical device of claim 14, wherein the plurality of rechargeable surface mount batteries are spaced from each other in the distributed pattern around a component that is attached to the printed circuit board.
16. The medical device of claim 15, wherein the component comprises a magnet or a coil.
17. The medical device of claim 15, wherein the distributed pattern is determined based on a thermal profile of the component.
18. The medical device of claim 14, 15, 16, or 17, wherein the plurality of rechargeable surface mount batteries are attached to opposing sides of the printed circuit board.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC119. The medical device of claim 14, 15, 16, or 17, wherein the plurality of rechargeable surface mount batteries are attached to the printed circuit board in an asymmetric pattern.
20. The use of the medical device according to anyone of claims 14 to 19 in a hearing device, a sleep disorder system, a seizure system, a balance or movement disorder system, a tinnitus management system, or a visual system.
21. The use of a device according to anyone of claims 14 to 19 in a hearing device, sleep disorder device, a seizure device, a balance or movement disorder device, a tinnitus management device, or a visual device.
22. A method, comprising:mounting a component on a printed circuit board;mounting a distributed battery system comprising at least two rechargeable surface mount batteries on the printed circuit board in proximity to the component; and electrically connecting the at least two rechargeable surface mount batteries in parallel,wherein respective mounting positions of the at least two rechargeable surface mount batteries are selected based on at least one characteristic of the component.
23. The method of claim 22, wherein the at least one characteristic comprises a thermal profile of the component.
24. The method of claim 22, wherein the at least one characteristic comprises an electromagnetic characteristic of the component.
25. The method of claim 24, wherein the component comprises a magnet or a coil.
26. The method of claim 22, 23, 24, or 25, further comprising mounting the at least two rechargeable surface mount batteries end-to-end with terminal faces of respective rechargeable surface mount batteries facing one another.
27. The method of claim 22, 23, 24, or 25, further comprising mounting the at least two rechargeable surface mount batteries perpendicularly to one another.Atty. Docket No. 3065.085 li Client Ref. No. CID03814WOPC128. The method of claim 22, 23, 24, or 25, wherein the at least two rechargeable surface mount batteries are among a plurality of rechargeable surface mount batteries, and each surface mount battery in the plurality of rechargeable surface mount batteries is part of a radial pattern arranged around the component.
29. One or more non-transitory computer readable storage media comprising instructions that, when executed by a processor, cause the processor to:determine a characteristic of a component to be attached to a printed circuit board; anddetermine, based on the characteristic of the component, a distribution pattern for rechargeable surface mount batteries to be attached to a printed circuit board.
30. The one or more non-transitory computer readable storage media of claim 29, wherein the characteristic of the component is a thermal profile of the component.
31. The one or more non-transitory computer readable storage media of claim 29, wherein the component is a coil or a magnet.
32. The one or more non-transitory computer readable storage media of claim 29, 30, or 31, wherein the distribution pattern for rechargeable surface mount batteries is asymmetric.