"a cooling system for a power supply unit panel"
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-02-06
- Publication Date
- 2026-08-13
Smart Images

Figure IN2026050188_13082026_PF_FP_ABST
Abstract
Description
A COOLING SYSTEM FOR A POWER SUPPLY UNIT PANELTECHNICAL FIELD
[0001] The present disclosure relates to the field of power supply systems. More particularly, the present disclosure relates to a cooling system for a power supply unit (PSU) panel to enhance efficiency, reliability, and maintenance of the PSU panel.BACKGROUND
[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced as prior art.
[0003] In conventional PSU designs as shown in FIG. 2A, cooling systems (CU) are often incorporated within the PSU panel. This typically involves complex internal water circulation systems that manage heat generated by electrical components. These systems aim to control temperature and reduce I2R losses, which are critical for maintaining the PSU's operational efficiency and longevity.
[0004] Further, the integration of cooling components within the PSU panel can lead to congestion, limiting the available space for other essential components and potentially complicating the design and assembly. Internal water systems are prone to leaks, which can cause sparking, short circuits, and component failure. This necessitates frequent maintenance and inspection, which can be labor-intensive and costly. Moreover, the internal placement of cooling components may also hinder effective heat dissipation, impacting the overall efficiency of the PSU panel.
[0005] US2012123595A1 discloses Methods and systems for controlling fluid coolant flow in cooling systems of computing devices. According to an aspect, a method may include determining the temperature of a fluid coolant in a cooling system of a computing device. For example, the temperature of water exiting a cooling system of a server may be determined. The method may also include determining an operational condition of the computing device. For example, a temperature of a processor, memory, or input / output (I / O) component may be determined. Further, the method may include controlling a flow of the fluid coolant through the cooling system based on the temperature of the fluid coolant and / or the operational condition.
[0006] CN219802924U discloses the utility model discloses a PLC control cabinet with a heat dissipation function, which is characterized in that a cabinet body is internally divided into an equipment cavity and a water cooling cavity through a partition plate, a heat dissipation coil pipe is arranged in the water cooling cavity, a cooling water tank is arranged on one side of the cabinet body and is circularly communicated with the heat dissipation coil pipe, a water pump is arranged on a water outlet pipe, and a water supplementing port is arranged at the upper end of the cooling water tank; the water replenishing port is externally connected with a water replenishing pipe and provided with an electromagnetic valve, and the cooling water tank is provided with a liquid level monitoring mechanism used for controlling starting and stopping of the electromagnetic valve.
[0007] CN119697947A provides a water-cooled power module is characterized in that, a main board; the functional units are positioned on the main board at intervals and have different working temperatures when in operation; The water cooling system comprises a plurality of branches, wherein the branches comprise water flow adjusting components, and the branches arelocated on one side, away from the main board, of the functional units in one-to-one correspondence.
[0008] US(200)4008490Al discloses a water cooling type cooling system for an electronic device comprising: a coolant circulation unit including heat exchangers contacting heat sources inside the electronic device and internal circulation lines disposed inside the electronic device for circulating a coolant in the heat exchangers; a coolant supply unit including external circulation lines connected to the internal circulation lines of the coolant circulation unit and extending outside the electronic device so as to circulate the coolant outside the electronic device, heat-dissipating devices connected to the external circulation lines for emitting heat of the coolant into the air, circulation pumps connected to the external circulation lines for forming hydraulic pressure of the coolant, a coolant tank in which the coolant is stored, and a casing for protecting the heatdissipating devices, the circulation pumps and the coolant tank; and a controller for controlling the circulation pumps by applying control signals to the circulation pumps.
[0009] CN219824(328)U discloses a multi-path cooling assembly, which comprises a support frame and a plurality of groups of cooling water port management assemblies fixed on the support frame, and the cooling water port management assemblies comprise a water supply port and a water return port; the water supply port comprises a water supply main valve, a water supply calandria, a water supply secondary valve and a flow switch; the backwater port comprises a backwater main valve, a backwater discharge pipe and a backwater secondary valve; the main water supply valve is connected to a port of the water supply calandria, the multiple secondary water supply valves are arranged on the water supply calandria at intervals, and the flow switches are connected to outlets of the secondary water supply valves. The backwater main valve is connected toa port of the backwater discharge pipe, and the plurality of backwater secondary valves are arranged on the backwater discharge pipe at intervals; cooling water passes through the water supply main valve, the water supply calandria, the water supply secondary valve and the flow switch, then flows through a to-be-cooled area through a pipeline and then flows into the water return main valve through the water return secondary valve and the water return calandria.
[0010] Thus, there arises a need for modification in design of the PSU panel to address the above-mentioned issues.
[0011] There is therefore a need in the art to develop a cost effective, effective and reliable cooling system for a power supply unit (PSU) panel to enhance efficiency, reliability, and maintenance of the PSU panel.OBJECTS OF THE PRESENT DISCLOSURE
[0012] Some of the objects of the present disclosure, which at least one embodiment herein satisfies, are as listed herein below.
[0013] It is an object of the present disclosure to provide a simple and reliable cooling system for a power supply unit (PSU) panel to enhance efficiency, reliability, and maintenance of the PSU panel.
[0014] It is an object of the present disclosure is to provide a cooling system that optimizes flow rate, pressure, and temperature of a circulating water, thereby improving heat dissipation and reduces I2R losses.
[0015] It is an object of the present disclosure to provide an improved design of the PSU panel to maximize internal space within the PSU panel for better organization and performance of electrical components.
[0016] It is another object of the present disclosure to provide a cooling system for a PSU panel that reduces risk of water leakage, thereby improving safety and reliability of the PSU panel.
[0017] It is yet another object of the present disclosure to implement cooling system with a PSU panel such that there is direct access and visibility to the cooling system, thereby making it simpler to diagnose and address issues related to a water-cooling mechanism.
[0018] It is yet another object of the present disclosure that is to design the cooling system to facilitate easier and efficient maintenance and hence enabling straightforward access for repairs and replacements without the need of dismantling the PSU panel.SUMMARY
[0019] Aspects of the present disclosure relate generally to the field of power supply systems. More particularly, the present disclosure relates to a cooling system for a power supply unit (PSU) panel to enhance efficiency, reliability, and maintenance of the PSU panel.
[0020] According to an aspect, the present disclosure relates to a cooling system for a power supply unit (PSU) panel. The cooling system is positioned outside the PSU panel, thereby offering advantages in terms of space utilization, safety, maintenance, and overall efficiency. The cooling system comprises an inlet manifold that is configured to receive water from an external water source which is to be circulated or distributed to components of the PSU panel. The cooling system comprises a distribution manifold connected to the inlet manifold. The distribution manifold is configured to distribute or circulate the water evenly to a plurality of cooling channels (206) and / or components within the PSU panel.
[0021] In an embodiment, the outlet manifold can include the plurality of cooling channels (206) configured to direct the water to various components within the PSU panel. It ensures that each cooling channel receives a balanced flow of water. The cooling channels (206) can be placed within the PSU panel to absorb heat from the electrical components.
[0022] In an embodiment, the cooling system can include a flow switch positioned between the inlet manifold and the distribution manifold. The flow switch can be configured to monitor flow rate of the circulating water. The flow switch can ensure that the water flow can be within a desired range to maintain effective cooling. In case the flow rate deviates from preset values, the flow switch can send signals to a central control unit or alarm system to alert for adjustments or maintenance.
[0023] In an embodiment, the cooling system can include an outlet manifold connected to the plurality of cooling channels (206). Water flows through the cooling channels (206) inside the PSU panel, absorbing heat from the components. The outlet manifold can be configured to transfer the heated water to the external water source which can be recirculated or processed further.BRIEF DESCRIPTION OF DRAWINGS
[0024] The accompanying drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. The diagrams are for illustration only, which thus is not a limitation of the present disclosure.
[0025] FIG. 1 illustrates an exemplary architecture representing a Power supply unit (PSU) panel used in an induction melting furnace system, in accordance with embodiments of the present disclosure.
[0026] FIG. 2 A illustrates an exemplary view of a conventional cooling system for a PSU panel of FIG. 1, in accordance with embodiments of the present disclosure.
[0027] FIG. 2B illustrates an exemplary view of a proposed cooling system for a PSU panel of FIG. 1, in accordance with embodiments of the present disclosure.
[0028] FIG. 3A illustrates an exploded view of a flow switch for the cooling system of FIG. 2B, in accordance with embodiments of the present disclosure.
[0029] FIG. 3B illustrates an exemplary perspective view of a flow switch for the cooling system of FIG. 2B, in accordance with embodiments of the present disclosure.DETAILED DESCRIPTION
[0030] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure as defined by the disclosure.
[0031] In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present invention. It will be apparent to one skilled in the art that embodiments of the present invention may be practiced without some of these specific details.
[0032] If the specification states that a component or feature "may”, "can”, "could” or "might” be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
[0033] As used in the description herein and throughout the description that follow, the meaning of "a,” "an,” and "the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of "in” includes "in” and "on” unless the context clearly dictates otherwise.
[0034] The use of "including” "comprising” or "having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. The terms "a” and "an” herein do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced items. Further, the use of terms "first” "second” and "third” and the like, herein does not denote any order, quantity, or importance, but rather are used to distinguish one element from another.
[0035] Groupings of alternative elements or embodiments of the invention disclosed herein are not to be construed as limitations. Each group member can be referred individually or in any combination with other members of the group or other elements found herein. One or more members of a group can be included in, or deleted from, a group for reasons of convenience and / or patentability. When any such inclusion or deletion occurs, the specification is herein deemed to contain the group as modified thus fulfilling the written description of all groups used in the description herein.
[0036] Exemplary embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Theseembodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those of ordinary skilled in the art. Moreover, all statements herein reciting embodiments of the invention, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents as well as equivalents developed in the future (i.e., any elements developed that perform the same function, regardless of structure).
[0037] The present disclosure relates to the field of power supply systems. More particularly, the present disclosure relates to a cooling system for a power supply unit (PSU) panel to enhance efficiency, reliability, and maintenance of the PSU panel.
[0038] Conventional cooling systems integrated within PSU panels often suffer from several significant drawbacks. These systems can lead to space congestion, as internal cooling components compete for limited space with critical electrical parts, complicating the design and assembly process. They are also prone to maintenance challenges, as internal water circulation systems are difficult to access for repairs, increasing downtime and operational costs. Moreover, the risk of water leakage within the panel poses serious safety hazards, including electrical short circuits and sparking. Additionally, internal systems may hinder effective heat dissipation, leading to reduced cooling efficiency and potentially impacting the overall performance and reliability of the PSU unit.
[0039] To address the aforementioned issues inherent in conventional internal cooling systems, the present disclosure introduces an external cooling system designed to optimize space utilization, enhance safety, and simplify maintenance. By relocating the cooling components, such as a manifold assembly, and a flow switch outside the PSU panel, the proposed cooling system helps inminimizing internal congestion and eliminating the risk of water leakage within the panel. This external arrangement not only facilitates easier access for maintenance and troubleshooting but also improves overall cooling efficiency by allowing for better heat dissipation. The result is a more reliable and efficient PSU panel with reduced operational costs and increased safety.
[0040] As illustrated, in an embodiment and referring to FIG. 1, the PSU panel (100) (also referred as PSU unit (100) herein sometimes) includes a plurality of electrical component units. In the electrical component units, electricity of various characteristics flows. Each of the electrical component units have different voltage varied magnitude of current, and different electrical phases. Due to this electrical conduction, I2R losses occur, which generate heat in electrical paths and electrical components associated with the electrical component units. Functioning of the electrical paths and electrical components depend upon temperature stability. Hence, specific quality, pressure, and Liters per Minutes (LPM) water circulation is required. The PSU panel (100) includes various assemblies. The various assemblies are elaborated below:1. Panel Bracket Placement Layout: The panel bracket layout supports various components within the PSU, including electrical parts, and connectors. When designing the panel bracket placement layout for a PSU (Power Supply Unit) panel, it is essential to ensure structural integrity, accessibility, and effective cooling. The panel bracket placement layout can include a top bracket, a bottom bracket, and side brackets. The top and bottom brackets secure top and bottom edges of the PSU panel (100) to an enclosure or chassis. The side brackets provide additional support and help with alignment of the PSU panel (100) within the enclosure. Further, the panel bracket placement layout can include transformer and capacitor brackets, and cable management brackets. Furthermore, the panelbracket placement layout can include mounting holes and slots configured to provide attachment points for components and brackets.2. Input Section: An input section of the PSU panel (100) is a critical area responsible for receiving and conditioning electrical power before it is distributed to the various components within the PSU panel (100). This section typically includes components for power connection, filtering, and initial conditioning. Proper design and layout of the input section ensure stable operation, safety, and efficiency of the PSU. The components of the input section includes but not limited to Power Input Connectors, Fuse or Circuit Breaker , Input Filter , Rectifiers , Input Capacitors, and Transient Voltage Suppression (TVS) Devices.3. Converter Section: A converter section is integral to transforming the input electrical power into the various required output voltages and currents. This section typically includes several key components and stages involved in power conversion, including rectification, filtering, and voltage regulation. Proper design of the converter section ensures efficient, stable, and reliable power delivery to the PSU's load. Components of the Converter section include but not limited to Rectifiers, Input Filter Capacitors, Inductors / Chokes, Voltage Regulators , Switching Components, Feedback Circuitry, and Heat Sinks.4. Cardreck Section: A Cardrack Section is a critical area designed to house and support various circuit boards or cards. This section facilitates the organization, cooling, and maintenance of PSU’s internal electronics, ensuring that the power supply operates efficiently and reliably. The cardrack section is essentially the framework or assembly where all the essential electronic boards, such as power conversion modules and control circuits, are mounted.5. X’Mer Section: An X’Mer Section refers to the part of the panel dedicated to housing and managing transformers (often abbreviated as X’Mer). Transformers are critical components in power supplies, responsible for stepping up orstepping down the voltage to appropriate levels for further processing within the PSU.6. Control Plate Assembly: A Control Plate Assembly in the PSU panel (100) is a crucial component responsible for housing and organizing the control and monitoring systems of the PSU. This assembly typically includes various control interfaces, monitoring devices, and user interaction elements, ensuring the PSU operates within specified parameters and allows for effective management and troubleshooting.7. Inverter Section: An Inverter Section is responsible for converting DC (Direct Current) power into AC (Alternating Current) power. This section is crucial in applications where AC power is required from a DC source, such as in power supplies for AC-powered devices or in situations where an uninterruptible power supply (UPS) is needed.8. Converter to DC Choke Busbar: A Converter to DC Choke Busbar Section is crucial for managing the flow of electrical power between different sections of the PSU, specifically between the converter stage and the DC choke. This section ensures efficient power transfer and stability while minimizing electrical losses and interference.9. Inverter to DC Choke Output Busbar: An Inverter to DC Choke Output Busbar Section is essential for managing the high-current DC power that flows from the inverter to the DC choke. This section ensures efficient power transmission, stability, and safety while minimizing electrical losses and thermal issues.10. Water Circulation Section: A water circulation section (also referred as cooling system herein) is responsible for managing the cooling of various electrical components through water-based heat dissipation. This section iscritical for maintaining optimal operating temperatures, enhancing component longevity, and ensuring the overall efficiency of the PSU.
[0041] Referring to FIG. 2B, and according to an embodiment, the present disclosure relates to a cooling system (200) for the PSU panel (100). The cooling system (200) is positioned outside the PSU panel (100), thereby offering advantages in terms of space utilization, safety, maintenance, and overall efficiency. The cooling system (200) includes an inlet manifold (202) that is configured to receive water from an external water source which is to be circulated or distributed to components of the PSU panel (100). The cooling system (200) includes a distribution manifold (204) connected to the inlet manifold (202). The distribution manifold (204) is configured to distribute or circulate the water evenly to a plurality of cooling channels (206) and / or components within the PSU panel (100).
[0042] In an embodiment, the distribution manifold (204) can include the plurality of cooling channels (206) configured to direct the water to various components within the PSU panel (100). It ensures that each cooling channel receives a balanced flow of water. The cooling channels (206) can be placed within the PSU panel (100) to absorb heat from the electrical components.
[0043] Referring to Figures 3A & 3B, the cooling system (200) can include a flow switch (300) positioned between the inlet manifold (202) and the distribution manifold (204). The flow switch (300) can be configured to monitor flow rate of the circulating water. The flow switch (300) can ensure that the water flow can be within a desired range to maintain effective cooling.
[0044] In an embodiment, the flow switch (300) can include a Hex nipple (302), a rubber 0-ring (306) & (322), a float assembly (308), a housing bracket (310), one or more cheese head screws (312), one or more plain washers (314), a proximity switch (316), a locking bracket (318), a flow switch tube (320), a malecoupling (324), and a ball value (326). The Hex Nipple (302) is a sealing component used on a hex nipple (302) to prevent leaks. The rubber O-ring (306) ensures a tight seal around the proximity switch, protecting it from moisture and dust. The float assembly (308) is a mechanism that rises or falls with the fluid level, activating the proximity switch (316) based on flow conditions. Further, the housing bracket (310) enclosure that houses the internal components, providing protection and stability. The housing bracket (310) can be manufactured of Molded Non-metallic Plastic. The cheese head screws (312) can be screws with a cylindrical head, used to secure various components together, often allowing for easy installation and removal. The plain washers (314) can be flat washers used to distribute the load of the screw, preventing damage to the housing bracket (310) and providing a better seal. The proximity switch (316) can detect the position of the float assembly (308) and sends signals based on the flow conditions.
[0045] The locking bracket (318) can secure the components in place, preventing movement or disassembly during operation. The flow switch tube (320) can be tubes through which fluid flows, connecting to the float assembly (308) and facilitating flow detection.
[0046] The Rubber O-Ring (306) can be a durable sealing component that provides resistance to wear and various chemicals, used in various joints. The male coupling (324) can be a connector that can allow attachment to other components in the system, typically facilitating flow into or out of the assembly. The ball valve (326) can control and monitor the flow of fluid in the system.
[0047] To assembly the flow switch, the proximity switch (316) is fixed within the housing bracket (310) moulded which is a non-metallic plastic moulded housing bracket, ensuring robust protection. A rubber "0” ring is then securely placed on the hex nipple (302) and male coupling (324) to provide a reliable seal.In an embodiment, the hex nipple (302) and the male coupling (324) can be made of non-metallic plastic material. Following this, the male coupling (324) and the hex nipple (302) are attached to the ball valve (326), establishing a secure connection. Next, the flow switch tube (320) made of polycarbonate is inserted into a slot of the male coupling, followed by the float assembly, which is prepped by affixing a stainless steel sensor cap to a top of a float made of brass with a brass screw and attaching a float disc to a bottom of the float. An additional non-metallic plastic "0” ring nipple is then fitted onto the flow switch tube (320) to ensure further integrity. The housing bracket (310) is positioned onto the slot of the male coupling (324) and the "0” ring type nipple, completing the internal structure. Finally, the assembled flow switch tube (320) is inserted into the locking bracket (318), and the housing bracket (310) is secured using a brass screw and a washer for added stability. To complete the assembly, an "LPM" mark is applied to the flow switch, signifying its operational parameters. This systematic assembly process results in a durable and efficient flow switch ready for installation and use.
[0048] In an implementation, in case the flow rate deviates from preset values, the flow switch (300) can send signals to a central control unit or alarm system to alert for adjustments or maintenance. During power supply on condition, to regulate min. required flow (5 to (100) Liters Per Minute (LPM) and beyond), the float assembly (308) lifts upper side of the flow switch (300) and proximity sensor pass on the signal as per the distance travel by the float assembly (308). During Panel running condition, when the flow is not in a proper requirement and float assembly (308) is not lifted upper side then proximity sensor not send the signal and trip the panel to avoid accident and safety purpose. A user can throttle flow with help of the ball valve (326).
[0049] As can be appreciated, the proposed design of the flow switch (300) represents a significant advancement in both functionality and efficiency. By integrating lightweight non-metallic plastic components, it ensures safe operation in higher voltage systems while simplifying installation. The use of plastic molded parts not only reduces manufacturing lead times but also contributes to cost savings — offering a price point that is 40% lower than traditional flow switches.
[0050] In an embodiment, the cooling system (200) can include an outlet manifold 208 connected to the plurality of cooling channels (206). Water flows through the cooling channels (206) inside the PSU panel (100), absorbing heat from the components. The outlet manifold 208 can be configured to transfer the heated water to the external water source which can be recirculated or processed further.
[0051] As can be appreciated, the proposed external cooling system (200) designed to optimize space utilization, enhance safety, and simplify maintenance. By relocating the cooling components, such as a manifold assembly, and the flow switch (300) outside the PSU panel (100), the proposed cooling system (200) helps in minimizing internal congestion and eliminating the risk of water leakage within the panel. This external arrangement not only facilitates easier access for maintenance and troubleshooting but also improves overall cooling efficiency by allowing for better heat dissipation. The result is a more reliable and efficient PSU Panel (100) with reduced operational costs and increased safety.
[0052] While the foregoing describes various embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof. The invention is not limited to the described embodiments, versions or examples, which are included to enable a person having ordinary skill in the art to make and use the invention whencombined with information and knowledge available to the person having ordinary skill in the art.ADVANTAGES OF THE INVENTION
[0053] The present invention provides a simple and reliable cooling system for a power supply unit (PSU) panel to enhance efficiency, reliability, and maintenance of the PSU panel.
[0054] The present invention provides a cooling system that optimizes flow rate, pressure, and temperature of a circulating water, thereby improving heat dissipation and reduces I2R losses.
[0055] The present invention provides an improved design of the PSU panel to maximize internal space within the PSU panel for better organization and performance of electrical components.
[0056] The present invention provides a cooling system for a PSU panel that reduces risk of water leakage, thereby improving safety and reliability of the PSU panel.
[0057] The present invention implements cooling system with a PSU panel such that there is direct access and visibility to the cooling system, thereby making it simpler to diagnose and address issues related to a water cooling mechanism.
[0058] The present invention helps in designing the cooling system to facilitate easier and efficient maintenance and hence enabling straightforward access for repairs and replacements without the need of dismantling the PSU panel.
Claims
CLAIMS:I / We claim:
1. A cooling system (200) for a PSU panel (100), wherein the cooling system (200) is positioned outside the PSU panel (100), such cooling system (200) comprising:an inlet manifold (202) that is configured to receive water from an external water source which is to be circulated or distributed to components of the PSU panel (100);a distribution manifold (204) connected to the inlet manifold (202), wherein the distribution manifold (204) include the plurality of cooling channels (206) configured to direct the water to various components within the PSU panel (100); anda flow switch (300) positioned between the inlet manifold (202) and the distribution manifold (204), wherein the flow switch (300) can be configured to monitor flow rate of the circulating water within the cooling channels (206).
2. The cooling system (200) as claimed in claim 1, wherein the cooling channels (206) emerging from the distribution manifold (204) to be placed within the PSU panel (100) to absorb heat from electrical components.
3. The cooling system (200) as claimed in claim 1, wherein the flow switch (300) include a Hex nipple (302), a rubber O-ring (306) & (322), a float assembly (308), a housing bracket (310), one or more cheese head screws (312), one or more plain washers (314), a proximity switch (316), a locking bracket (318), a flow switch tube (320), a male coupling (324), and a ball valve (326).
4. The cooling system (200) as claimed in claim 3, wherein the Hex Nipple (302) is a sealing component used to prevent leaks.
5. The cooling system (200) as claimed in claim 3, wherein the rubber 0- ring (306) ensures a tight seal around the proximity switch (316), protecting it from moisture and dust.
6. The cooling system (200) as claimed in claim 3, wherein the housing bracket (310) houses the float assembly (308), the flow switch tube (320), and the proximity switch (316) of the flow switch.
7. The cooling system (200) as claimed in claim 3, wherein the locking bracket (318) secures the float assembly (308), the flow switch tube (320), and the proximity switch (316) of the flow switch in place, preventing movement or disassembly during the operation.
8. The cooling system (200) as claimed in claim 3, wherein the float assembly (308) is a mechanism that rises or falls with the fluid level.
9. The cooling system (200) as claimed in claim 3, wherein the proximity switch (316) can detect the position of the float assembly (308) and sends signals based on the flow conditions.
10. The cooling system (200) as claimed in claim 3, wherein the flow switch tube (320) is a tube through which fluid flows, connecting to the float assembly (308) and facilitating flow detection.
11. The cooling system (200) as claimed in claim 3, wherein the male coupling (324) is a connector that allow attachment to the ball valve (326), facilitating flow of water into or out of the cooling channels (206).
12. The cooling system (200) as claimed in claim 3, wherein the ball valve (326) can control and monitor the flow of fluid in the cooling system.