Machining system

Abstract

A main body (10) of this machining system is provided with: a carry-in port (18) and / or a carry-out port (19) for a substrate (P); one or more rollers (60) for conveying the substrate (P); a processing device (50) for processing the substrate (P); and an imparting tool (81) for imparting, to the main body (10), a force for generating a moment in a direction opposite to the direction of a moment generated by a force imparted to the one or more rollers (60) when conveying the substrate (P).

Description

Processing system

[0001] The present disclosure relates to a processing system.

[0002] Conventionally, a processing system realized including a main body provided with a processing apparatus that performs processing on a film conveyed using one or more rollers is known. For example, Patent Document 1 describes performing a film forming process on a film conveyed using a roll-to-roll method.

[0003] When conveying a film using one or more rollers, tension is applied to the film. Also, in order to improve the processing accuracy with respect to the film, it is effective to suppress the slack of the film by positively applying tension to the film. However, since a force corresponding to the tension of the film is applied to one or more rollers, there is a risk that the main body provided with the processing apparatus will tilt.

[0004] Japanese Unexamined Patent Application Publication No. 2014-125308

[0005] A processing system according to an aspect of the present disclosure includes: a main body having at least one of a film inlet and a film outlet, one or more rollers that convey the film, a processing apparatus that processes the film, and an applicator that applies a force to the main body that generates a moment in a direction opposite to the direction of the moment generated by the force applied to the one or more rollers when the film is conveyed.

[0006] Figure 1 is a perspective view showing the schematic overall configuration of the processing system. Figure 2 is a schematic diagram showing the schematic configuration of the processing machine body. Figure 3 is a schematic diagram showing an example of the relationship between the positions of multiple transport rollers and the force applied to each transport roller. Figure 4 is a diagram showing an example of the computer hardware configuration. Figure 5 is an explanatory diagram showing a specific example of the relationship between the time elapsed since the start of substrate transport and the tilt angle of the processing machine body. Figure 6 is a schematic diagram showing an example of the relationship between the positions of multiple transport rollers and the force applied to each transport roller in the second embodiment. Figure 7 is a schematic diagram showing the positions of multiple transport rollers and the transport path of the substrate P in the third embodiment. Figure 8 is a schematic diagram showing the positions of multiple transport rollers and the transport path of the substrate P in the third embodiment. Figure 9 is a schematic diagram showing the positions of multiple transport rollers and the transport path of the substrate P in the fourth embodiment. Figure 10 is a schematic diagram showing the positions of multiple transport rollers and the transport path of the substrate P in the fourth embodiment. Figure 11 is a schematic diagram showing the positions of multiple transport rollers and the transport path of the substrate P in the fourth embodiment. Figure 12 is a schematic diagram showing the positions of multiple transport rollers and the transport path of the substrate P in the fourth embodiment.

[0007] (First Embodiment) An embodiment of the processing system will be described. <Outline of Processing System S> As shown in Figure 1, the processing system S is a processing system for processing a substrate P, which is an example of a film. The processing system S employs a so-called roll-to-roll method. In the processing system S, a flexible substrate P is fed out from the supply roll 21, the substrate P is subjected to processing, and the processed substrate P is wound onto the recovery roll 22. The substrate P is in the shape of a long strip.

[0008] Each figure shows the XYZ coordinate system. The X direction is the arrangement direction of the devices constituting the processing system S, and the Y direction is the width direction of the substrate P. For example, the XY plane coincides with the horizontal plane, and the Z direction coincides with the vertical direction. In the following explanation, for each of the X, Y, and Z directions, one direction is indicated with a "+" sign, and the opposite direction is indicated with a "-" sign. The direction of rotation (tilting) around the Y axis is denoted as the θ direction. The direction that is clockwise when viewed in the +Y direction is the +θ direction, and the direction that is counterclockwise is the -θ direction.

[0009] The substrate P may be, for example, a resin film or a metal foil. The substrate P may, for example, have a workpiece layer on one side. The workpiece layer may, for example, be a photosensitive layer that changes in quality upon exposure to light. In the following description, the side of the substrate P with the workpiece layer will be referred to as the front surface (workpiece surface), and the opposite side will be referred to as the back surface.

[0010] The processing system S comprises a processing machine body 10, which is the main body for performing processing on the substrate P; a transport device 20 for transporting the substrate P; and a system control device 200. In the following description, the direction in which the substrate P is transported will be referred to as the transport direction D.

[0011] The conveying device 20 includes, as an example, a first conveying device 30, a second conveying device 40, and a conveying control device 300. The conveying control device 300 controls the first conveying device 30 and the second conveying device 40.

[0012] The first conveying device 30 is configured to supply substrates P from a supply roll 21. The supply roll 21 is formed, for example, by winding substrates P around a cylindrical core material (not shown).

[0013] The first conveying device 30 includes, for example, a supply roll support 31 that supports the supply roll 21. The supply roll support 31 may, for example, be a roller that can rotate about a rotation axis extending along the Y direction. The supply roll 21 is supported so as to be rotatable, for example, with the supply roll support 31 inserted through a core material.

[0014] The first conveying device 30 is configured to convey the substrate P supplied from the supply roll 21 toward the processing machine body 10. The first conveying device 30 includes, as an example, a plurality of first rollers 32 that are rotatable about a rotation axis extending along the Y direction. The first conveying device 30 conveys the substrate P using the plurality of first rollers 32.

[0015] The second transport device 40 is configured to wind the substrate P processed by the processing machine body 10 onto a core material (not shown) and recover it as a recovery roll 22. The recovery roll 22 is formed, for example, by winding the substrate P around a cylindrical core material (not shown).

[0016] The second conveying device 40 includes, for example, a recovery roll support 41 that supports the core material of the recovery roll 22. The recovery roll support 41 may, for example, be a roller that can rotate about a rotation axis extending along the Y direction. The recovery roll 22 is supported so as to be rotatable with the recovery roll support 41 inserted through its core material.

[0017] The second conveying device 40 is configured to convey the substrate P processed by the processing machine body 10 toward the recovery roll support 41. The second conveying device 40 includes, as an example, a plurality of second rollers 42 that can rotate about a rotation axis extending along the Y direction. The second conveying device 40 conveys the substrate P using the plurality of second rollers 42.

[0018] The multiple first rollers 32 include, for example, one nip roller 32n and one or more tension rollers 32t. Each tension roller 32t is configured to adjust the tension applied to the substrate P. Each tension roller 32t is equipped with a tension measuring sensor 32s. Each tension measuring sensor 32s is an example of a detection device that detects the tension applied to the substrate P. Each tension roller 32t is configured to move in the Z direction so that the amount of tension measured by each tension measuring sensor 32s becomes a predetermined value.

[0019] The nip roller 32n is configured to divide the tension applied to the substrate P on its upstream and downstream sides. The nip roller 32n divides the tension by having two parallel rollers face each other with a constant pressing force, clamping the substrate P between them, and rotating one of the rollers. Furthermore, the nip roller 32n can actively control the transport speed of the substrate P by rotating one of the two parallel rollers. For example, by stopping the rotation of the nip roller 32n (speed zero), the substrate P can be locked (anchored) at the position of the nip roller 32n. The number of nip rollers 32n and tension rollers 32t can be changed as appropriate.

[0020] Similarly, the multiple second rollers 42 include, for example, one nip roller 42n and one or more tension rollers 42t. Each tension roller 42t is equipped with a tension measuring sensor 42s. Each tension measuring sensor 42s is an example of a detection device that detects the tension applied to the substrate P. The configurations of the nip roller 42n, each tension roller 42t, and each tension measuring sensor 42s are the same as those of the nip roller 32n, each tension roller 32t, and each tension measuring sensor 32s, respectively, so a detailed explanation is omitted. The number of nip rollers 42n and tension rollers 42t can be changed as appropriate.

[0021] In the processing system S, one or more tension rollers 32t are positioned between the supply roll support 31 and the nip roller 32n, and between the nip roller 32n and the processing machine body 10. In the processing system S, tension rollers 42t are positioned between the processing machine body 10 and the nip roller 42n, and between the nip roller 42n and the recovery roll support 41.

[0022] In the processing system S, a motor (not shown) that rotates the supply roll 21 and a motor (not shown) that rotates the nip roller 32n are synchronously controlled according to the amount of tension measured by the tension measurement sensor 32s. As a result, tension is applied to the substrate P along the transport path from the supply roll 21 to the nip roller 32n, thereby suppressing sagging of the substrate P.

[0023] In the processing system S, a motor (not shown) that rotates the recovery roll 22 and a motor (not shown) that rotates the nip roller 42n are synchronously controlled according to the amount of tension measured by the tension measurement sensor 42s. As a result, tension is applied to the substrate P in the transport path from the nip roller 42n to the recovery roll 22, thereby suppressing sagging of the substrate P.

[0024] In the processing system S, tension is applied to the substrate P using the tension rollers 32t and 42t in the transport path from the nip roller 32n through the processing machine body 10 to the nip roller 42n, thereby suppressing sagging of the substrate P.

[0025] <Configuration of the Processing Machine Body 10> As shown in Figure 2, the processing machine body 10 is, for example, installed on a support base 100 fixed to the ground surface GS. The support base 100 is, for example, a vibration-damping base that supports the processing machine body 10 and controls the posture of the processing machine body 10 by suppressing the transmission of vibrations from the ground surface GS (so-called floor vibrations) to the processing machine body 10. The support base 100 has, for example, a plate 101 that is aligned with the XY plane and one or more vibration-damping units 102 that support the plate 101. The vibration-damping unit 102 is, for example, an air spring. The vibration-damping unit 102 may be an elastic member. As an elastic member, for example, a metal spring or rubber can be used.

[0026] The processing machine body 10 is supported by a support base 100, for example, while resting on the support surface 101a of the plate 101 in the +Z direction. The processing machine body 10 is preferably fixed to the support base 100. The plate 101 is movable in the X, Y, and Z directions by the action of each vibration isolation unit 102. The plate 101 is movable around the X, Y, and Z axes by the action of each vibration isolation unit 102. This suppresses the transmission of vibrations from the ground surface GS to the processing machine body 10.

[0027] The processing machine body 10 comprises a base 12, a frame 13, a housing 14, a processing device 50, a plurality of transport rollers 60, a load adjustment device 80, and a processing control device 400. The base 12 is a plate-shaped member that aligns with the XY plane. The base 12 is supported by a support base 100 with its bottom surface 12a in contact with the support surface 101a of the plate 101. The base 12 and the support base 100 may be fastened to each other using bolts, for example. For example, the frame 13 is a rectangular parallelepiped-shaped framework. The frame 13 is configured to support various members. For example, the frame 13 may include one or more support portions 13a that support various members. The support portion 13a may be, for example, a beam extending in a direction perpendicular to the Z direction, but is not limited to this; it may also be a column extending in the Z direction, or a wall with a predetermined thickness. The frame 13 is fixed to the base 12.

[0028] The base 12 and frame 13 are made of highly rigid metal materials, such as stainless steel and aluminum alloy. The base 12 and frame 13 may have reinforcing structures and reinforcing materials, such as rib structures and bead structures. The base 12 and frame 13 as a whole have high rigidity and are configured to be resistant to distortion caused by tilting of the entire processing machine body 10.

[0029] The housing 14 is, for example, a rectangular box shape. The housing 14 forms a housing space A1 that accommodates the processing device 50, a plurality of transport rollers 60, a load adjustment device 80, and a processing control device 400. The housing 14 has, for example, a plurality (four in this example) of side walls 15 located in a rectangular tube shape along the Z direction, and a top wall 16 that covers the +Z end of each side wall 15. The housing space A1 is the space enclosed by each side wall 15 and the top wall 16. In the figure, for the sake of explanation, the housing space A1 is shown at a position spaced apart from the inner surfaces of each side wall 15 and the top wall 16, but in reality the edges of the housing space A1 coincide with the inner surfaces of each side wall 15 and the top wall 16.

[0030] The housing 14 is fixed to the frame 13 so as to cover the frame 13 from the outside. That is, the housing 14 is supported from the inside by the frame 13. The plurality of side walls 15 include a first side wall 15a facing the transport device 20 and a second side wall 15b facing the first side wall 15a across the storage space A1. The outer surface of the first side wall 15a is the first side surface 17a, and the outer surface of the second side wall 15b is the second side surface 17b. The first side surface 17a and the second side surface 17b are each aligned with the YZ plane. The first side surface 17a and the second side surface 17b are opposite to each other.

[0031] The enclosure 14 has an entrance 18 for the substrate P and an exit 19 for the substrate P. The entrance 18 is through which the substrate P before processing by the processing device 50 is fed into the enclosure 14. The exit 19 is through which the substrate P after processing by the processing device 50 is discharged to the outside of the enclosure 14.

[0032] The loading entrance 18 and loading exit 19 are formed, for example, in the first side wall 15a of the housing 14. That is, the loading entrance 18 and loading exit 19 are provided on the first side surface 17a when viewed from the -X direction. The loading entrance 18 is located above the loading exit 19 (in the +Z direction) on the first side wall 15a. The loading entrance 18 and loading exit 19 are, for example, slit-shaped openings extending along the Y direction.

[0033] The processing apparatus 50 is an exposure apparatus that, as an example of a processing operation, irradiates light onto the substrate P to expose a predetermined pattern. The processing apparatus 50 is, as an example, a direct-drawing type irradiation apparatus that does not use a mask, a so-called spot-scanning type irradiation apparatus (drawing apparatus). The processing apparatus 50 is, as an example, fixed to the support portion 13a of the frame 13. That is, the processing apparatus 50 is supported by the frame 13 inside the housing 14.

[0034] The processing apparatus 50 includes, for example, a plurality of drawing units (not shown) for exposing the substrate P. Each drawing unit irradiates the substrate P with exposure light emitted from a light source device (not shown). Each drawing unit scans the spot light irradiated onto the substrate P along the main scanning direction (for example, the Y direction) under the control of the processing control device 400. The sub-scanning direction of the spot light is the transport direction of the substrate P along the circumferential direction of the main roller 60m, as will be described in more detail later.

[0035] Furthermore, each drawing unit rapidly modulates (turns on / off) the intensity of the spot light according to the pattern data (drawing data, pattern information) under the control of the processing control device 400. As a result, a light pattern corresponding to a predetermined pattern such as an electronic device, circuit, or wiring is drawn and exposed on the surface of the substrate P (workpiece surface). In other words, the spot light is scanned relatively in two dimensions on the surface of the substrate P by the main scan and sub-scan of the spot light, and a predetermined pattern is drawn and exposed on the surface of the substrate P.

[0036] As shown in Figures 2 and 3, within the housing 14, the multiple transport rollers 60 are supported by the support portion 13a of the frame 13. Each transport roller 60 is rotatable, for example, around a rotation axis extending along the Y direction. The processing machine body 10 transports the substrate P using the multiple transport rollers 60. That is, the multiple transport rollers 60 are an example of rollers that transport the substrate P.

[0037] For example, the center of gravity of each conveyor roller 60 is located below the center of the entire processing machine body 10 in the Z direction (in the -Z direction). For example, the end of the outer surface of each conveyor roller 60 in the +Z direction is located below the end of the processing device 50 in the -Z direction. In the Y direction, for example, the center of the processing machine body 10, the center of each conveyor roller 60, and the center of the substrate P when conveyed by each conveyor roller 60 are located on the same plane parallel to the XZ plane.

[0038] The transport roller 60 includes, for example, one or more main rollers 60m and one or more sub-rollers 60s. The main roller 60m transports the substrate P in the transport direction D with its outer surface in contact with the back surface of the substrate P. In other words, the main roller 60m transports the substrate P while supporting it such that the surface of the substrate P is located outside the main roller 60m in the diametrical direction. As a result, the main roller 60m moves the substrate P in the transport direction D.

[0039] The outer surface of the main roller 60m faces the drawing unit of the processing device 50. This allows the main roller 60m to support the substrate P at the position where it is illuminated by the drawing unit of the processing device 50. In other words, the main roller 60m is a specific roller that the processing device 50 uses to process the substrate P in the portion it supports. For example, the rotation (center) axis R1 of the main roller 60m is located in the center of the processing machine body 10 in the X direction. For example, the rotation axis R1 of the main roller 60m may be located on a plane parallel to the YZ plane and containing the center of gravity of the processing machine body 10.

[0040] In the following description, the plane parallel to the YZ plane and containing the rotation axis R1 of the main roller 60m is referred to as plane S1. In the following description, the space between plane S1 and the first side wall 15a within the housing space A1 is referred to as the first space A2, and the space between plane S1 and the second side wall 15b is referred to as the second space A3. In the figure, for the sake of explanation, the first space A2 and the second space A3 are shown as being spaced apart from the inner surfaces of each side wall 15 and the top wall 16, but in reality, the edges of the first space A2 and the second space A3 coincide with the inner surfaces of each side wall 15 and the top wall 16.

[0041] Each sub-roller 60s, for example, transports the substrate P in the transport direction D with its outer surface in contact with the substrate P. In the following description, the multiple sub-rollers 60s are referred to as sub-rollers 61s, 62s, ..., 66s in the order in which the substrate P brought in from the entrance 18 makes contact. The main roller 60m is positioned, for example, after sub-roller 63s and before sub-roller 64s, so that the substrate P makes contact with it.

[0042] Each sub-roller 60s includes, for example, a roller that transports the substrate P with its outer surface in contact with the surface of the substrate P, and a roller that transports the substrate P with its outer surface in contact with the back surface of the substrate P. Sub-rollers 62s, 63s, and 66s transport the substrate P with their outer surfaces in contact with the surface of the substrate P, for example. Sub-rollers 61s, 64s, and 65s transport the substrate P with their outer surfaces in contact with the back surface of the substrate P, for example.

[0043] The diameter of the main roller 60m is, for example, larger than the diameter of each sub-roller 60s. However, it is not limited to this, and the diameter of the main roller 60m may be smaller than or the same as the diameter of each sub-roller 60s. The weight of the main roller 60m is, for example, larger than the weight of each sub-roller 60s. However, it is not limited to this, and the weight of the main roller 60m may be smaller than or the same as the weight of each sub-roller 60s.

[0044] As an example, the load adjustment device 80 includes a weight 81. The weight 81 is an applicator that applies a vertically downward force Fa (-Z direction) to the machine body 10 (see FIG. 3). For the material of the weight 81, for example, metals such as stainless steel, tungsten, and lead are used. As an example, the weight 81 may be in the shape of a rectangular parallelepiped that is long in the Y direction. As an example, the weight 81 has a through hole (not shown) that penetrates in the Z direction. As an example, a plurality of through holes may be formed at intervals along the Y direction.

[0045] As shown in FIG. 3, as an example, the load adjustment device 80 has a support plate 82 that supports the weight 81. As an example, the support plate 82 is fixed to the support portion 13a of the frame 13 so as to span two side walls 15 facing each other in the Y direction. That is, the weight 81 is supported by the frame 13 via the support plate 82. As an example, the support plate 82 may be a plate-shaped member that is long in the Y direction and has a thickness in the Z direction. As an example, the support plate 82 has a plurality of screw holes (not shown) on the +Z direction surface. When a plurality of screw holes formed at the same interval as the through holes of the weight 81 along the Y direction among the plurality of screw holes are taken as a screw hole group, the screw hole group is arranged at a predetermined interval while being separated along the X direction.

[0046] The weight 81 is fixed to the support plate 82 by inserting bolts (not shown) into each of the plurality of through holes and screwing the tips of the bolts into any of the screw hole groups of the plurality of screw hole groups on the support plate 82. That is, the position of the screw hole group formed on the support plate 82 is a position where the weight 81 can be attached. The fixture used for attaching the weight 81 is not limited to a bolt and may be a clip or a screw. The weight 81 is configured to move along the X direction within the accommodation space A1 by being attached to any of the plurality of screw hole groups arranged along the X direction. That is, the center of gravity of the weight 81 is configured to move between the first side surface 17a and the second side surface 17b in the X direction. As an example, the center of gravity of the weight 81 is located on a plane parallel to the XZ plane and including the center in the Y direction of the machine body 10 when the weight 81 is fixed to the support plate 82.

[0047] At positions where the weight 81 can be attached, as an example, a first position 81a and a second position 81b are included. When the weight 81 is attached to the first position 81a or the second position 81b, its center of gravity is located within the first space A2. That is, when the weight 81 is attached to the first position 81a or the second position 81b, it is arranged within the first space A2 on the side of the first side surface 17a with respect to the plane S1. The region within the first space A2 corresponds to the first region.

[0048] When the weight 81 is attached to the first position 81a, when a plane parallel to the YZ plane and having an equal distance between the first side surface 17a and the plane S1 is defined as the plane S2, the center of gravity of the weight 81 may be located between the plane S1 and the plane S2 within the first space A2. That is, when the weight 81 is attached to the first position 81a, it is arranged on the side of the main roller 60m with respect to the plane S2 within the first space A2. When the weight 81 is attached to the second position 81b, the center of gravity of the weight 81 may be located between the plane S2 and the first side surface 17a within the first space A2. That is, when the weight 81 is attached to the second position 81b, it is arranged on the side of the first side surface 17a with respect to the plane S2 within the first space A2.

[0049] The center of gravity of the machine tool body 10 is configured, as an example, to be located at the center of the machine tool body 10 in the Y direction regardless of which screw hole group among the plurality of screw hole groups the weight 81 is attached to. Note that the position of the center of gravity of the machine tool body 10 changes in the X direction depending on which screw hole group among the plurality of screw hole groups the weight 81 is attached to.

[0050] <System control device 200> The system control device 200 is configured to comprehensively control the entire processing system S. The system control device 200 is configured to communicate bidirectionally with each of the conveyance control device 300 and the processing control device 400. By communicating with the conveyance control device 300, the system control device 200 controls the conveyance operation of the substrate P in the first conveyance device 30 and the second conveyance device 40. By communicating with the processing control device 400, the system control device 200 controls the processing operation of the substrate P in the machine tool body 10.

[0051] <Example Hardware Configuration of Computer 800> A computer 800 used as a system control device 200, a transport control device 300, and a processing control device 400 will be described below. Note that the hardware configuration of computer 800 described below is merely an example, and other hardware may be included. Furthermore, the computers 800 used in each of the control devices 200, 300, and 400 are not limited to having the same configuration, and may have different configurations from each other.

[0052] As shown in Figure 4, the computer 800 may include a processor 801, a memory 802, and a communication device 803. The computer 800 may further include an input device 804 and a display device 805. The processor 801 performs various processes to control the operation of the controlled device by executing a series of instructions contained in a program stored in the memory 802. The processor 801 may be a CPU (Central Processing Unit), an MPU (Micro Processor Unit), or other arithmetic unit.

[0053] The processor 801 may include hardware circuits that perform at least a portion of the processing performed by the processor 801, such as an ASIC (Application Specific Integrated Circuit), a PLD (Programmable Logic Device), an FPGA (Field-Programmable Gate Array), or an MCU (Micro Control Unit).

[0054] Memory 802 is a device for storing various programs and various data. Memory 802 may be composed of either volatile memory or non-volatile memory, or both. Volatile memory may be, for example, RAM (Random Access Memory) or other storage devices. Non-volatile memory may be ROM (Read-Only Memory), a hard disk drive, flash memory, or other storage devices.

[0055] The communication device 803 is a device that establishes communication with other computers and transmits and receives various types of data. For example, the communication device 803 may be a wired communication interface or a wireless communication interface. The input device 804 is a device that receives input operations from the operator. The input device 804 may be, for example, a keyboard, mouse, or touch panel. The display device 805 is a device that displays various types of information as predetermined images.

[0056] <Placement of the transport rollers 60> Next, a specific example of the placement of the multiple transport rollers 60 inside the processing machine body 10 will be described. In the following description, the first roller 32 that the substrate P last contacts before being brought into the loading port 18 will be referred to as the "last first roller 32z", and the second roller 42 that the substrate P first contacts after being discharged from the loading port 19 will be referred to as the "first second roller 42a". In the following description, positioning a roller at an offset location relative to a certain roller means using the rotation axis of a certain roller as a reference, placing the rotation axis at a position moved from that rotation axis, and arranging the roller to be offset.

[0057] As shown in Figure 3, for example, the sub-roller 61s is located on a plane parallel to the XY plane, where the +Z end of its outer surface is parallel to the XY plane and includes the +Z end of the outer surface of the last first roller 32z. For example, the sub-roller 62s is located at a location offset in the +X and -Z directions relative to the sub-roller 61s. For example, the sub-roller 63s is located at a location offset in the +X and -Z directions relative to the sub-roller 62s. For example, the main roller 60m is located at a location offset in the +X and +Z directions relative to the sub-roller 63s.

[0058] As an example, the sub-roller 64s is located at a position offset in the -Z direction relative to the main roller 60m. As an example, the sub-roller 65s is located at a position offset in the -X direction relative to the sub-roller 64s. As an example, the sub-roller 66s is located at a position offset in both the -X and +Z directions relative to the sub-roller 65s. As an example, the +Z end of the outer surface of the sub-roller 66s is located on a plane parallel to the XY plane and includes the -Z end of the outer surface of the first second roller 42a.

[0059] <Transportation direction D of substrate P inside the processing machine body 10> As shown in Figure 3, the substrate P is transported in the X and Z directions inside the processing machine body 10 with a width in the Y direction.

[0060] The substrate P moves from the last first roller 32z through the input 18 toward the sub-roller 61s in the +X direction, and is also bent in the +θ direction along the outer surface of the sub-roller 61s, moving toward the sub-roller 62s in the +X and -Z directions. The substrate P is bent in the -θ direction along the outer surface of the sub-roller 62s, moving toward the sub-roller 63s in the +X and -Z directions. The substrate P is bent in the -θ direction along the outer surface of the sub-roller 63s, moving toward the main roller 60m in the -X and +Z directions.

[0061] The substrate P is bent in the +θ direction along the outer surface of the main roller 60m and moves toward the sub-roller 64s in the -X and -Z directions. The substrate P is bent in the +θ direction along the outer surface of the sub-roller 64s and moves toward the sub-roller 65s in the -X direction. The substrate P is bent in the +θ direction along the outer surface of the sub-roller 65s and moves toward the sub-roller 66s in the -X and +Z directions. The substrate P is bent in the -θ direction along the outer surface of the sub-roller 66s and moves toward the first second roller 42a in the -X direction through the discharge port 19.

[0062] <Forces applied to the transport rollers 60> Next, we will explain the forces applied to each transport roller 60 by the substrate P. As shown in Figure 3, in the processing system S, the transport direction D of the substrate P changes before and after each transport roller 60. That is, in the processing system S, the substrate P bends (flexes) around each transport roller 60. In the following explanation, the angle between the part of the substrate P that is facing the roller and the part from which the substrate P is fed out of the roller will be referred to as the "bending angle".

[0063] The bending angles of the substrate P around each of the sub-rollers 61s, 62s, 64s, 65s, and 66s are all obtuse. The bending angles of the substrate P around sub-roller 63s and around main roller 60m are both acute.

[0064] In the processing system S, tension is applied to the substrate P that is brought into the processing machine body 10 from the loading port 18 and discharged from the loading port 19. Therefore, each transport roller 60 is subjected to a force opposite to the transport direction D when the substrate P moves toward the transport roller 60, and a force in the same direction as the transport direction D when the substrate P is unloaded from the transport roller 60. In the following description, the force opposite to the transport direction D when the substrate P moves toward the transport roller 60 will be referred to as the first tensile force, and the force in the same direction as the transport direction D when the substrate P is unloaded from the transport roller 60 will be referred to as the second tensile force.

[0065] Under ideal conditions where friction between each transport roller 60 and the substrate P is not considered, if the tension applied to the substrate P is equal before and after the transport roller 60, the magnitudes of the first tensile force and the second tensile force applied to the transport roller 60 will also be equal. Furthermore, if the tension applied to the substrate P inside the processing machine body 10 is constant, the magnitudes of the first tensile force and the second tensile force applied to each transport roller 60 will also be equal.

[0066] When the magnitudes of the first tensile force and the second tensile force applied to the conveyor roller 60 are equal, a force acts on each conveyor roller 60 in the direction from the contact point between the conveyor roller 60 and the substrate P toward the axis of rotation of each conveyor roller 60, along the bisector of the bending angle of each conveyor roller 60. As a result, a force is applied to the processing machine body 10 from the substrate P via each conveyor roller 60. In the following explanation, the force acting on the conveyor roller 60 in the direction from the contact point between the conveyor roller 60 and the substrate P toward the axis of rotation of the conveyor roller 60, along the bisector of the bending angle of the conveyor roller 60, will simply be referred to as the force acting on the conveyor roller 60.

[0067] The magnitude of the force acting on each conveyor roller 60 varies depending on the angle of bending around that roller 60. In this case, the magnitude of the force acting on each conveyor roller 60 decreases as the bending angle approaches 180°, because the first tensile force and the second tensile force cancel each other out, and increases as the bending angle approaches 0°.

[0068] For example, the force F1 acting on the sub-roller 61s includes components in the -X direction and the -Z direction. The force F2 acting on the sub-roller 62s includes components in the +X direction and the +Z direction. The force F3 acting on the sub-roller 63s includes components in the -X direction and the +Z direction. The force F4 acting on the main roller 60m includes a component in the -Z direction. The force F5 acting on the sub-roller 64s includes components in the -X direction and the +Z direction. The force F6 acting on the sub-roller 65s includes components in the +X direction and the +Z direction. The force F7 acting on the sub-roller 66s includes components in the -X direction and the -Z direction. These forces F1 to F7 acting on each of the transport rollers 60 impart a composite force Fb to the processing machine body 10, for example, which includes components in the -X direction and the +Z direction.

[0069] <Operation of Machining System S> The operation of machining system S will be explained below. In the following explanation, the rotation (tilting) of the machining machine body 10 around the Y axis will not be considered, and the explanation will focus on the rotation (tilting) of the machining machine body 10 around the Y axis.

[0070] In the processing system S, when the substrate P is transported while tension is applied to the substrate P, a combined force Fb of the forces F1 to F7 acting on each transport roller 60 is applied to the processing machine body 10. Due to this influence, a moment may act on the processing machine body 10 that causes it to rotate around an axis extending along the Y direction. As a result, the entire processing machine body 10 may tilt.

[0071] As described above, if the entire processing machine body 10 is tilted, it is possible that distortion will occur in the base 12 and frame 13. When distortion occurs in the base 12 and frame 13, the relative positional relationship between the processing device 50, the multiple transport rollers 60, and the substrate P changes inside the processing machine body 10. This may reduce the processing accuracy of the substrate P. For this reason, it is desirable to reduce the tilt of the processing machine body 10 in the processing system S.

[0072] Referring to Figure 5, the relationship between the time elapsed since the start of transporting the substrate P (hereinafter simply referred to as elapsed time) and the inclination angle of the processing machine body 10 will be explained. In the figure, the solid line shows the behavior of a conventional processing machine body 10 without a load adjustment device 80, and the dashed line shows the behavior of the processing machine body 10 of this embodiment configured as described above.

[0073] As shown by the solid and dashed lines, in this embodiment and the conventional example, when the transport of the substrate P begins, the processing machine body 10 first rotates in the -θ direction around the rotation axis AR1 extending along the Y direction (see Figures 1 to 3). The rotation axis AR1 coincides with the contact position SP1 between the -X end of the base 12 and the plate 101 of the support base 100. In other words, the rotation (tilting) of the processing machine body 10 around the rotation axis AR1 corresponds to rotation with the contact position SP1 as the pivot point.

[0074] Next, the machine body 10 of this embodiment and the conventional example rotates in the +θ direction around a rotation axis AR2 that extends along the Y direction. The rotation axis AR2 coincides with the contact position SP2 between the +X end of the base 12 and the plate 101 of the support base 100. In other words, the rotation (tilting) of the machine body 10 around the rotation axis AR2 corresponds to rotation with the contact position SP2 as the pivot point.

[0075] Subsequently, the processing machine body 10 of this embodiment and the conventional example stabilizes in a state where it has rotated (tilted) in the +θ direction around the rotation axis AR2. "Stable" in terms of posture means that the tilt angle of the processing machine body 10 does not change from a specified value, or is within a specified range. "Stable" in terms of posture may also include a state where the variation range of the tilt angle of the processing machine body 10 per unit time is within a specified range. The specified range is, for example, often within ±100 μrad, and more preferably within ±50 μrad.

[0076] In the following description, the period from the start of transporting the substrate P until the orientation of the processing machine body 10 stabilizes is referred to as the initial period T1, and the period after the orientation of the processing machine body 10 stabilizes is referred to as the stable period T2. The stable period T2 is a period in which the fluctuation range of the tilt angle of the processing machine body 10 per unit time is smaller compared to the initial period T1. For example, the processing machine body 10 transitions from the initial period T1 to the stable period T2 around 1250 seconds into operation. The timing of the transition from the initial period T1 to the stable period T2 may vary depending on, for example, the placement position of each transport roller 60, the amount of tension applied to the substrate P, the weight of the processing machine body 10, and the center of gravity of the processing machine body 10.

[0077] One reason why the processing machine body 10 rotates (tilts) around the rotation axis AR2 is the generation of a moment due to the combined force Fb of the forces F1 to F7 acting on each of the transport rollers 60. For example, if the processing machine body 10 is tilted in the +θ direction during the stable period T2, a moment is generated by the combined force Fb that tries to rotate the processing machine body 10 in the +θ direction, and it is thought that the processing machine body 10 is tilted due to the action of this moment.

[0078] In such cases, in order to reduce the tilt of the machine tool body 10, it is conceivable to generate a moment in the opposite direction to the moment generated by the resultant force Fb. In other words, in order to reduce the tilt of the machine tool body 10, it is conceivable to reduce the moment acting on the machine tool body 10.

[0079] Therefore, in this embodiment, the processing machine body 10 is configured to adjust the moment acting on the processing machine body 10 using a load adjustment device 80. In the processing system S, a vertically downward force Fa is applied to the processing machine body 10 by the weight 81 of the load adjustment device 80. In this case, a moment is generated in the processing machine body 10 due to the force Fa applied by the weight 81.

[0080] For example, if the machine tool body 10 is tilted in the +θ direction around the rotation axis AR2, the tilt of the machine tool body 10 can be reduced by attaching the weight 81 to a position where a moment is generated that rotates the machine tool body 10 in the -θ direction around the rotation axis AR2. As an example, if the center of gravity of the weight 81 is inside the housing space A1, a moment is generated in the machine tool body 10 that rotates it in the -θ direction around the rotation axis AR2. The moment that rotates the machine tool body 10 around the rotation axis AR2 increases as the center of gravity of the weight 81 moves away from the rotation axis AR2 (contact position SP2) in the X direction.

[0081] Furthermore, in the machining system S, attaching the weight 81 causes the center of gravity of the machining center body 10 to become eccentric. In other words, the weight 81 corresponds to an eccentricity device that causes the center of gravity of the machining center body 10 to become eccentric. Therefore, when the machining center body 10 tilts due to the moment generated by the combined force Fb, attaching the weight 81 makes it possible to eccentricize the center of gravity in a direction away from the pivot point (axis of rotation) when the machining center body 10 tilts, or to increase the amount of eccentricity. That is, it is possible to generate a moment in the opposite direction to the moment generated by the combined force Fb, thereby eccentricating the center of gravity of the machining center body 10, or increasing the amount of eccentricity, so that the moment acting on the machining center body 10 becomes smaller. In addition, by attaching the weight 81, it is possible to increase the weight of the machining center body 10 so that a moment in the opposite direction to the moment generated by the combined force Fb becomes smaller. This makes it possible to reduce the tilt of the machining center body 10.

[0082] For example, if the center of gravity of the weight 81 is located in the -X direction more than the center of gravity of the entire machine body 10 excluding the weight 81, the center of gravity of the entire machine body 10 including the weight 81 will be eccentric in the direction away from the contact position SP2 in the -X direction. For example, in a conventional machining system S, the position of the center of gravity of the machine body 10 is position G1, and in the machining system S, when the weight 81 is attached to the first position 81a, the position of the center of gravity of the machine body 10 is position G2. In this case, the weight 81 is positioned such that its center of gravity is eccentric in the direction away from the pivot point (axis of rotation) when the machine body 10 is about to tilt due to the combined force Fb.

[0083] Next, the method for positioning the weight 81 will be described. The position of the weight 81 is determined, for example, based on the result of measuring the inclination angle of the machine body 10 during the stabilization period T2. The position of the weight 81 may be determined, for example, by repeatedly changing the position of the weight 81 and measuring the inclination angle during the stabilization period T2, and comparing the results of multiple measurements. In this case, the position of the weight 81 may be changed, for example, so that the center of gravity of the weight 81 moves from a position close to the center of gravity of the machine body 10 along the X direction to a position farther away from it during multiple measurements, but is not limited to this. It is preferable that the position of the weight 81 be determined to a position where the inclination angle during the stabilization period T2 is 0 or approximately 0. However, it is not limited to this, and the position of the weight 81 may be determined to a position where the inclination angle during the stabilization period T2 approaches 0 compared to before the position of the weight 81 was changed.

[0084] The position of the weight 81 may, for example, be determined based on simulation results. The position of the weight 81 may, for example, be determined by simulating the relationship between elapsed time and the inclination angle by calculating the forces F1 to F7 acting on each conveyor roller 60 and the force applied by the weight 81. In this case, the position of the weight 81 is best determined by repeating such simulations while changing the mounting position of the weight 81. Alternatively, the position of the weight 81 may be determined by combining the measurement results of the inclination angle and the simulation results. The position of the weight 81 may, for example, be determined based on the results of measuring the inclination angle after narrowing down the range of the weight 81's position through simulation.

[0085] The behavior of the processing machine body 10 in this embodiment (dashed line) is compared with the behavior of the processing machine body in the conventional example (solid line). As an example, the position of the weight 81 is set to the first position 81a. In the processing machine body 10 of this embodiment, the average inclination angle during the stabilization period T2 is smaller compared to the processing machine body in the conventional example. That is, in the processing system S of this embodiment, by attaching the weight 81, the inclination of the processing machine body 10 during the stabilization period T2 is reduced compared to the conventional processing system S.

[0086] Furthermore, in the processing machine body 10 of this embodiment, the peak of the inclination angle in the initial period T1 is smaller compared to the processing machine body of the conventional example. That is, in the processing system S of this embodiment, by attaching the weight 81, the range of fluctuation in the inclination angle of the processing machine body 10 in the initial period T1 is reduced compared to the processing system S of the conventional example.

[0087] <Effects> The effects of this embodiment will now be described. (1-1) In the processing system S, the load adjustment device 80 can suppress the tilting of the processing machine body 10 by the combined force Fb of the forces F1 to F7 acting on the multiple transport rollers 60 when the substrate P is transported. Therefore, it is possible to suppress the reduction in processing accuracy of the substrate P by the processing device 50 due to the tilting of the processing machine body 10.

[0088] (1-2) In the processing system S, a downward vertical force Fa is applied to the processing machine body 10 by the weight of the weight 81 itself, so a moment is generated in the opposite direction to the moment generated by the combined force Fb of the forces F1 to F7 acting on the multiple transport rollers 60. As a result, the tilting of the processing machine body 10 in the processing system S can be suppressed with a simpler configuration compared to, for example, a case in which a mechanism that operates mechanically to reduce the tilting of the processing machine body 10 is provided.

[0089] (1-3) The loading entrance 18 and loading exit 19 of the processing machine body 10 are located on the same side of the housing 14. Therefore, in the processing system S, the supply roll 21 and the recovery roll 22 can be arranged in the same direction when viewed from the processing machine body 10, thus enabling space saving for the entire processing system S.

[0090] (1-4) The loading entrance 18 and loading exit 19 of the processing machine body 10 open to the same surface of the housing 14. In this case, when loading and unloading the substrate P, a force is applied to the processing machine body 10 that includes a component in the opposite direction (-X direction) to the direction from the transport device 20 toward the processing machine body 10 (+X direction), so the moment acting on the processing machine body 10 tends to be large. In contrast, the processing system S can suppress the tilting of the processing machine body 10 by the weight 81, thereby suppressing a decrease in the processing accuracy by the processing device 50.

[0091] (1-5) The moment generated by the weight 81 increases as the distance from the pivot point when the machine body 10 rotates (tilts) to the center of gravity of the weight 81 increases. Here, the weight 81 can be attached in a position where its center of gravity is within the first space A2. In this case, compared to when the center of gravity of the weight 81 is located in the second space A3, the distance from the contact position SP2, which is the pivot point when the machine body 10 tilts in the +θ direction, to the center of gravity of the weight 81 becomes longer. For this reason, the weight of the weight 81 required to suppress the tilt of the machine body 10 can be reduced in the machining system S.

[0092] (1-6) When the weight 81 is attached to the first position 81a, its center of gravity is located between plane S1 and plane S2 within the first space A2. In this case, in the processing system S, it is possible to suppress the eccentricity of the center of gravity of the processing machine body 10 to a position away from the main roller 60m. As a result, in the processing system S, the main roller 60m that supports the area in which the substrate P is processed by the processing device 50 can be stabilized.

[0093] (1-7) When the weight 81 is attached to the second position 81b, its center of gravity is located between the plane S2 and the first side surface 17a within the first space A2. In this case, compared to when the center of gravity of the weight 81 is located between the plane S1 and the plane S2 within the first space A2, the distance from the contact position SP2, which is the pivot point when the machine body 10 tilts in the +θ direction, to the center of gravity of the weight 81 becomes longer. Therefore, in the machining system S, the weight of the weight 81 required to suppress the tilt of the machine body 10 can be further reduced while keeping the downward vertical force Fa the same.

[0094] (1-8) The combined force Fb of the forces F1 to F7 acting on each transport roller 60 when transporting the substrate P changes according to the tension applied to the substrate P. In the processing system S, there are multiple positions along the X direction within the storage space A1 where the weight 81 can be attached. Therefore, in the processing system S, even when the tension applied to the substrate P is changed, the weight 81 can be placed in an appropriate position according to the tension applied to the substrate P. Thus, the tilt of the processing machine body 10 can be suppressed more effectively in the processing system S.

[0095] (Second Embodiment) A second embodiment of the processing system S will be described. In the following description, the same components and controls as those described in the previously described embodiment will be denoted by the same reference numerals, and redundant explanations will be omitted or simplified.

[0096] The processing system S of the second embodiment is configured as follows, in place of or in addition to the load adjustment device 80. <Configuration of the inlet 18 and outlet 19> As shown in Figure 6, the inlet 18 is formed in the first side wall 15a of the housing 14. The outlet 19 is formed in the second side wall 15b of the housing 14. That is, the inlet 18 and the outlet 19 are formed in the opposite side walls 15 in the X direction. As an example, the inlet 18 and the outlet 19 are located on a plane in which the center in the Y direction is parallel to the XZ plane and includes the center of the processing machine body 10 in the Y direction. The center of the inlet 18 in the Z direction coincides with the center of the outlet 19 in the Z direction.

[0097] <Configuration and Arrangement Position of the Conveyor Rollers 60> The multiple conveyor rollers 60 are arranged, for example, so as to be symmetrical with respect to the plane S1. The multiple conveyor rollers 60 include, for example, one main roller 60m and multiple sub-rollers 60s. The rotation axis R1 of the main roller 60m is included in the plane S1, for example. The main roller 60m is, for example, a cylindrical member that is elongated in the Y direction, with a rotation axis R1 that extends along the Y direction on the plane S1 as its center. If we assume that the main roller 60m is cut in half along the plane S1, it is desirable that the weight of the portion of the main roller 60m located between the plane S1 and the first side wall 15a is equal to the weight of the portion located between the plane S1 and the second side wall 15b.

[0098] The multiple sub-rollers 60s include, for example, four sub-rollers. In the following description, the four sub-rollers 60s will be referred to as sub-rollers 61s, 62s, ..., 64s in the order in which the substrate P fed in from the entrance 18 makes contact.

[0099] Sub-rollers 61s and 64s are positioned symmetrically with respect to plane S1, for example. Sub-rollers 62s and 63s are positioned symmetrically with respect to plane S1, for example. Each of the sub-rollers 61s to 64s is, for example, identical in shape and size. Each of the sub-rollers 61s to 64s is, for example, identical in weight.

[0100] As an example, the sub-roller 61s has its outer peripheral surface's +Z end located on a plane parallel to the XY plane and which also includes the +Z end of the outer peripheral surface of the last first roller 32z. The sub-roller 62s is located at a position offset in the +X and -Z directions relative to the sub-roller 61s. As an example, the main roller 60m is located at a position offset in the +X and +Z directions relative to the sub-roller 62s.

[0101] For example, the sub-roller 63s is located at a position offset in the +X and -Z directions relative to the main roller 60m. For example, the sub-roller 64s is located at a position offset in the +X and +Z directions relative to the sub-roller 63s. The sub-roller 64s is located at a position offset in the -X direction relative to the first second roller 42a. The +Z direction end of the outer surface of the sub-roller 64s is located on the same XY plane as the +Z direction end of the outer surface of the first second roller 42a.

[0102] <Transportation direction D of the substrate P inside the processing machine body 10> The substrate P is transported, for example, inside the processing machine body 10 in a transport path that is symmetrical with respect to the plane S1.

[0103] As an example, the substrate P moves from the last first roller 32z through the entrance 18 toward the sub-roller 61s in the +X direction, and is also bent in the +θ direction along the outer surface of the sub-roller 61s, moving toward the sub-roller 62s in the +X and -Z directions. The substrate P is bent in the -θ direction along the outer surface of the sub-roller 62s and moves toward the main roller 60m in the +Z direction. The substrate P is bent in the +θ direction along the outer surface of the main roller 60m and moves toward the sub-roller 63s in the -Z direction. The substrate P is bent in the -θ direction along the outer surface of the sub-roller 63s and moves toward the sub-roller 64s in the +X and +Z directions. The substrate P is bent in the +θ direction along the outer surface of the sub-roller 64s and moves toward the first second roller 42a through the exit 19 in the +X direction.

[0104] <Forces applied to the conveyor roller 60> The force Fc1 acting on the sub-roller 61s includes a component in the -X direction and a component in the -Z direction. The force Fc2 acting on the sub-roller 62s includes a component in the -X direction and a component in the +Z direction. The force Fc3 acting on the main roller 60m includes a component in the -Z direction. The force Fc4 acting on the sub-roller 63s includes a component in the +X direction and a component in the +Z direction. The force Fc4 acting on the sub-roller 64s includes a component in the +X direction and a component in the -Z direction.

[0105] <Operation of Machining System S> The operation of machining system S will be explained below. In the following explanation, the rotation (tilting) of the machining machine body 10 around the Y axis will not be considered, and the explanation will focus on the rotation (tilting) of the machining machine body 10 around the Y axis.

[0106] Sub-roller 61s and sub-roller 64s are symmetrical with respect to plane S1. Similarly, sub-roller 62s and sub-roller 64s are symmetrical with respect to plane S1. Therefore, when the center of gravity of the processing machine body 10 is located on plane S1, the moment of rotation in the -θ direction caused by force Fc1 and the moment of rotation in the +θ direction caused by force Fc5 cancel each other out. Likewise, when the center of gravity of the processing machine body 10 is located on plane S1, the moment of rotation in the +θ direction caused by force Fc2 and the moment of rotation in the -θ direction caused by force Fc4 cancel each other out.

[0107] Furthermore, force Fc3 is a force that does not contain a component in the X direction but contains a component in the Z direction, and the point of application of force is located on the plane S1. For this reason, force Fc3 does not generate a moment that rotates in the ±θ direction.

[0108] <Effects> The effects of this embodiment will be explained. (2-1) In the processing system S, the moments generated by the forces Fc1 to Fc5 acting on each transport roller 60 by the substrate P cancel each other out. As a result, the tilt of the processing machine body 10 is suppressed, and the reduction in processing accuracy of the substrate P by the processing device 50 due to the tilt of the processing machine body 10 can be suppressed.

[0109] (Third Embodiment) A third embodiment of the processing system S will now be described. The processing system S of the third embodiment is configured as follows, in place of or in addition to the load adjustment device 80.

[0110] <Configuration of Sub-Roller 64s> As shown in Figures 7 and 8, among the multiple transport rollers 60, the sub-roller 64s is configured to be displaced along the X direction. For example, the sub-roller 64s may be supported at both ends in the Y direction by the frame 13 so that it can be displaced along the X direction while its axis of rotation remains aligned with the Y direction. For example, the frame 13 has rails (not shown) extending along the X direction in the +Y direction and -Y direction portions, respectively. The sub-roller 64s is configured so that both ends in the Y direction move along the respective rails of the frame 13. For example, the sub-roller 64s is displaced along the X direction by the processing control device 400 controlling a moving motor (not shown). However, the sub-roller 64s may also be configured to be moved along the respective rails of the frame 13 by an operator. The sub-roller 64s may also be fixed to the frame 13.

[0111] <Transport path of substrate P inside the processing machine body 10> The transport path of substrate P inside the processing machine body 10 changes according to the position of the sub-roller 64s.

[0112] Referring to Figure 7, the case where the sub-roller 64s is positioned at the first position 64a will be described. The first position 64a is a location offset in the -Z direction with respect to the main roller 60m. In this case, the substrate P is bent in the +θ direction along the outer surface of the main roller 60m, and then moves toward the sub-roller 64s in the -X and -Z directions. The substrate P is bent in the +θ direction along the outer surface of the sub-roller 64s and moves toward the sub-roller 65s in the -X direction. In this case, the bending angle of the substrate P around the sub-roller 64s is obtuse.

[0113] Referring to Figure 8, the case where the sub-roller 64s is located at a second position 64b which is in the +X direction from the first position 64a will be described. The second position 64b is a location offset in the +X and -Z directions with respect to the main roller 60m. In this case, the substrate P is bent in the +θ direction along the outer surface of the main roller 60m and then moves toward the sub-roller 64s in the +X and -Z directions. The substrate P is bent in the +θ direction along the outer surface of the sub-roller 64s and moves toward the sub-roller 65s in the -X direction. In this case, the bending angle around the sub-roller 64s is acute.

[0114] <Operation of Machining System S> The operation of machining system S will be explained below. In the following explanation, the rotation (tilting) of the machining machine body 10 around the Y axis will not be considered, and the explanation will focus on the rotation (tilting) of the machining machine body 10 around the Y axis.

[0115] When the sub-roller 64s is displaced along the X direction, the transport direction D of the substrate P before and after the sub-roller 64s changes, and therefore the bending angle of the substrate P around the sub-roller 64s also changes. As a result, the direction and magnitude of the force Fd2 acting on the sub-roller 64s change as the sub-roller 64s is displaced along the X direction.

[0116] Furthermore, when the sub-roller 64s is displaced along the X direction, the bending angle of the substrate P around the main roller 60m and sub-roller 65s located before and after the sub-roller 64s in the transport direction D also changes. As a result, the direction and magnitude of the force Fd1 acting on the main roller 60m and the force Fd3 acting on the sub-roller 65s also change as the sub-roller 64s is displaced along the X direction.

[0117] Thus, in the processing system S, the magnitude and direction of the combined force acting on each conveyor roller 60 can be changed by displacing the sub-roller 64s. Therefore, if the processing machine body 10 tilts due to the moment generated by the combined force, the moment generated by the combined force can be reduced by displacing the sub-roller 64s.

[0118] The position of the transport roller 64s is determined, for example, based on the results of measuring the inclination angle of the processing machine body 10 during the stabilization period T2. The position of the transport roller 64s may also be determined, for example, based on simulation results. The position of the transport roller 64s may also be determined by combining the measurement results of the inclination angle and the simulation results.

[0119] <Effects> The effects of this embodiment will be explained. (3-1) In the processing system S, the moment that rotates the processing machine body 10 can be reduced by displacing the sub-roller 64s. As a result, the tilt of the processing machine body 10 can be suppressed, and thus the reduction in processing accuracy of the substrate P by the processing device 50 due to the tilt of the processing machine body 10 can be suppressed.

[0120] (Fourth Embodiment) A fourth embodiment of the processing system S will now be described. The processing system S of the fourth embodiment is configured as follows, in place of or in addition to the load adjustment device 80.

[0121] <Transportation path of substrate P inside the processing machine body 10> As shown in Figures 9 to 12, the processing system S is configured to change the transport path of the substrate P by changing the sub-rollers 60s used when transporting the substrate P inside the processing machine body 10. The multiple transport rollers 60 include a plurality of specific sub-rollers 64s1 to 64s4 as an example of sub-rollers 60s. The specific sub-rollers 64s1 to 64s4 are used selectively when changing the transport path of the substrate P.

[0122] As an example, the processing system S is configured such that the processing machine body 10 can select one of the following transport paths for the substrate P: a first path C1, a second path C2, a third path C3, and a fourth path C4. The first path C1 is a transport path in which the substrate P contacts a specific sub-roller 64s1 after the main roller 60m. The second path C2 is a transport path in which the substrate P contacts a specific sub-roller 64s2 after the main roller 60m. The third path C3 is a transport path in which the substrate P contacts a specific sub-roller 64s3 after the main roller 60m. The fourth path C4 is a transport path in which the substrate P contacts a specific sub-roller 64s4 after the main roller 60m.

[0123] <Operation of Machining System S> The operation of machining system S will be explained below. In the following explanation, the rotation (tilting) of the machining machine body 10 around the Y axis will not be considered, and the explanation will focus on the rotation (tilting) of the machining machine body 10 around the Y axis.

[0124] In each of the paths C1 to C4, the bending angle of the substrate P around each specific sub-roller 64s1 to 64s4 is different. Therefore, the direction and magnitude of the force Fe2 acting on the specific sub-rollers 64s1 to 64s4 by the substrate P change depending on which of the transport paths C1 to C4 is used to transport the substrate P.

[0125] Furthermore, in each of the paths C1 to C4, the transport direction D of the substrate P changes before and after the specific sub-rollers 64s1 to 64s4. Consequently, in each of the paths C1 to C4, the bending angle of the substrate P around the main roller 60m and sub-roller 65s before and after the specific sub-rollers 64s1 to 64s4 in the transport direction D also changes. Therefore, the direction and magnitude of the force Fe1 acting on the main roller 60m and the force Fe3 acting on the sub-roller 65s also change depending on which of the transport paths C1 to C4 the substrate P is transported by.

[0126] Thus, in the processing system S, the direction and magnitude of the combined force acting on each transport roller 60 can be changed by altering the transport path of the substrate P. Therefore, if the processing machine body 10 tilts due to the moment generated by the combined force, the moment generated by the combined force can be reduced by altering the transport path of the substrate P inside the processing machine body 10.

[0127] The transport path for the substrate P is determined, for example, based on the measurement of the tilt angle of the processing machine body 10 during the stabilization period T2. The transport path for the substrate P may also be determined, for example, based on simulation results. The transport path for the substrate P may also be determined by combining the measurement results of the tilt angle and the simulation results.

[0128] <Effects> The effects of this embodiment will now be explained. (4-1) In the processing system S, the moment of rotation of the processing machine body 10 can be reduced by changing the transport path of the substrate P by using one of the multiple specific sub-rollers 64s1 to 64s4. As a result, the tilt of the processing machine body 10 can be suppressed, and thus the reduction in processing accuracy of the substrate P by the processing device 50 due to the tilt of the processing machine body 10 can be suppressed.

[0129] (4-2) In the processing system S, the transport path of the substrate P can be changed by using any of the multiple specific sub-rollers 64s1 to 64s4. This prevents the processing machine body 10 from tilting due to eccentricity of the center of gravity or an increase in eccentricity when changing the transport path of the substrate P.

[0130] <Examples of Modifications> The above embodiment can be implemented with the following modifications. The above embodiment and the following examples of modifications can be combined with each other to the extent that they do not contradict each other technically.

[0131] (Modification Example 1) The load adjustment device 80 of the first embodiment may be configured so that the weight 81 can move along the X direction. The support plate 82 may, for example, have a rail on a plane in the +Z direction that extends along the X direction and supports the weight 81. The weight 81 may be movable along the rail using a moving motor. This moving motor may be controlled by the processing control device 400.

[0132] In this modified example, the processing control device 400 may be capable of controlling the displacement of the weight 81 based on the measurement result of at least one of the tension measurement sensors 32s and 42s. That is, the processing control device 400 may control the force that the weight 81 applies to the processing machine body 10 by displacing the weight 81. In this example, the processing control device 400 may calculate the forces F1 to F7 acting on each transport roller 60 based on the measurement results of each tension measurement sensor 32s and 42s. In this example, the processing control device 400 corresponds to the first control device. Furthermore, this modified example may be applied to the control of moving the sub-roller 64s along the X direction using a moving motor in the third embodiment.

[0133] In this modified example, the various controls may be performed by the system control device 200 instead of, or in addition to, the processing control device 400. Furthermore, a dedicated control device capable of controlling the displacement of the weight 81 may be provided separately from the system control device 200 and the processing control device 400.

[0134] (Example of modification 2) The processing control device 400 may also be capable of controlling the tilt of the plate 101 of the support base 100. In this example, the vibration isolation unit 102 of the support base 100 may be equipped with an electric actuator, for example.

[0135] In this case, the processing control device 400 may tilt the plate 101 of the support base 100 by controlling the electric actuator of the vibration isolation unit 102 based on the measurement result of at least one of the tension measurement sensors 32s and 42s. At this time, the processing control device 400 predicts the direction in which the processing machine body 10 will tilt by calculating the forces F1 to F7 acting on each conveyor roller 60 based on the measurement results of each tension measurement sensor 32s and 42s. Then, based on the prediction result, the processing control device 400 may reduce the tilt of the processing machine body 10 with respect to the horizontal plane by controlling the plate 101 to tilt in the opposite direction to the direction in which the processing machine body 10 will tilt. That is, the processing control device 400 may control the support base 100 based on the measurement results of each tension measurement sensor 32s and 42s to control the posture of the processing machine body 10. In this example, the processing control device 400 corresponds to the second control device, and the measurement results of each tension measurement sensor 32s, 42s correspond to tension data relating to the tension applied to the substrate P.

[0136] Furthermore, in this modified example, the machine body 10 may be equipped with one or more tilt angle measuring sensors (not shown) for measuring the tilt angle of the machine body 10. In this case, the machining control device 400 may tilt the plate 101 of the support base 100 by controlling the electric actuator of the vibration isolation unit 102 based on the measurement result of the tilt angle measuring sensor. At this time, the machining control device 400 identifies the direction in which the machine body 10 is tilted based on the measurement result of the tilt angle measuring sensor. Then, based on the identified result, the machining control device 400 may reduce the tilt of the machine body 10 with respect to the horizontal plane by controlling the plate 101 to tilt in the opposite direction to the direction in which the machine body 10 is tilted. That is, the machining control device 400 may control the support base 100 based on the measurement result of the tilt angle measuring sensor to control the posture of the machine body 10.

[0137] In this modified example, the various controls may be performed by the system control device 200 instead of, or in addition to, the processing control device 400. Furthermore, a dedicated control device capable of controlling the tilt of the plate 101 of the support base 100 may be provided separately from the system control device 200 and the processing control device 400.

[0138] (Example of modification 3) The specific configuration of the load adjustment device 80 may be changed as appropriate. For example, the weight 81 of the load adjustment device 80 is not limited to being solid, but may be liquid. In this case, the processing system S may be configured such that the shape of the liquid weight 81 changes as the processing machine body 10 tilts. In this case, the processing system S will change the moment generated by the weight 81 in accordance with the change in the position of the center of gravity of the weight 81 before and after the processing machine body 10 tilts. That is, in this example of modification, the tilt of the processing machine body 10 can be reduced by changing the moment generated by the weight 81 in accordance with the tilt of the processing machine body 10.

[0139] (Example of modification 4) The weight 81 may be fixed inside the processing machine body 10 and configured to be immovable. In this case, the weight 81 should be fixed in a position that generates a moment that rotates the processing machine body 10 in the opposite direction to the direction in which it rotates when tension is applied to the substrate P without the weight 81 attached. The direction in which the processing machine body 10 rotates when tension is applied to the substrate P without the weight 81 attached may be determined by measuring the inclination angle of the processing machine body 10 during the stabilization period T2, or it may be determined based on the simulation results.

[0140] (Example of modification 5) The load adjustment device 80 may be shared with other parts of the processing machine body 10. For example, the load adjustment device 80 may be substituted by making a part of the frame 13 of the processing machine body 10 thicker than other parts of the frame. In other words, the load adjustment device 80 may be shared with the frame 13 of the processing machine body 10.

[0141] (Example of modification 6) In the first embodiment, the number and position of the multiple transport rollers 60 may be changed as appropriate. Also, in the first embodiment, the transport path of the substrate P may be changed as appropriate.

[0142] (Modification Example 7) In the second embodiment, the multiple transport rollers 60 are arranged so as to be symmetrical with respect to a plane parallel to the YZ plane and containing the center of gravity of the processing machine body 10, and the number and position of the transport rollers 60 may be changed as appropriate.

[0143] (Modification Example 8) In the third embodiment, the sub-roller 64s may be displaceable in the Z direction in addition to or instead of the X direction. Also, in the third embodiment, the plurality of transport rollers 60 may include a plurality of displaceable sub-rollers 60s.

[0144] (Example of modification 9) In the fourth embodiment, the number and position of the specific sub-rollers 64s1 to 64s4 may be changed as appropriate. Also, in the fourth embodiment, the transport path of the substrate P may be changed as appropriate. As an example, the transport path of the substrate P may include a path in which the substrate P is transported using some or all of the multiple specific sub-rollers 64s1 to 64s4.

[0145] (Modification Example 10) In each embodiment, multiple main rollers 60m may be provided. For example, the multiple main rollers 60m may be arranged so that their axis of rotation is along the Y direction, and their respective axes of rotation are parallel in the X direction. In this case, in the second embodiment, for example, the multiple main rollers 60m may be arranged so as to be symmetrical with respect to a plane parallel to the YZ plane and containing the center of gravity of the processing machine body 10.

[0146] (Example of modification 11) The positional relationship between the supply roll 21, the multiple first rollers 32, and the loading port 18 of the processing machine body 10 may be changed as appropriate. Also, the number and type of the multiple first rollers 32 may be changed as appropriate. Similarly, the positional relationship between the recovery roll 22, the multiple second rollers 42, and the loading port 19 of the processing machine body 10 may be changed as appropriate. Also, the number and type of the multiple second rollers 42 may be changed as appropriate.

[0147] (Example of modification 12) The processing treatment performed on the film in the processing system S may be modified as appropriate. For example, the processing treatment may be laser etching, in which a laser is used to engrave the film. In this case, the film may be made of metal or plastic, for example. Alternatively, the processing treatment may be a coating treatment, in which a resist or other coating is applied to the film using a roll coater. Alternatively, the processing treatment may be a cleaning treatment, in which the surface of the film is cleaned.

[0148] (Example of modification 13) The weight 81 may be configured so that its center of gravity is movable in the Y direction inside the machine tool body 10. For example, the support plate 82 that supports the weight 81 may have a group of screw holes that are spaced apart along the Y direction and arranged at predetermined intervals. In this case, the weight 81 may be configured to be movable in the Y direction by being screwed into one of the screw holes in the group of screw holes arranged along the Y direction. With this configuration, when a moment is generated by the combined force Fb that rotates the machine tool body 10 with the direction along the X axis as the axis of rotation, the tilt of the machine tool body 10 can be reduced by attaching the weight 81 to a position that generates a moment that rotates in the opposite direction to the moment.

[0149] <Note> The technical concepts that can be understood from this disclosure and the examples of modifications are described below. [1] A processing system comprising: a main body comprising at least one of a film inlet and an outlet; one or more rollers for transporting the film; a processing device for processing the film; and a device for applying a force to the main body that generates a moment in the opposite direction to the direction of the moment generated by the force applied to the one or more rollers when transporting the film.

[0150] [2] The processing system according to [1], wherein the weighting device is a solid or liquid weight. [3] The processing system according to [1] or [2], comprising a detection device for detecting tension on the film and a first control device for controlling the force applied by the weighting device to the main body based on the detection result of the detection device.

[0151] [4] A processing system according to any one of [1] to [3], comprising: a support base that supports the main body and controls the posture of the main body; and a second control device that controls the support base and controls the posture of the main body based on tension data relating to the tension on the film.

[0152] [5] The processing system according to any one of [1] to [4], wherein the main body comprises a housing having a first side on which the entrance and exit are provided and a second side opposite to the first side, one or more rollers, the processing device, and the attachment tool, and a frame that supports the rollers, the processing device, and the attachment tool.

[0153] [6] The processing system according to any one of [1] to [5], wherein the one or more rollers include a specific roller on which the processing apparatus processes the film, and the applicator is located in a first region on the first side side of a vertical plane including the central axis of the specific roller.

[0154] [7] The processing system according to any one of [1] to [6], wherein the applicator is positioned on the side of the specific roller that is in the first region, and is located on the side of the first side that is in the center of the plane between the first side and the first surface.

[0155] [8] The processing system according to any one of [1] to [7], wherein the applicator is positioned on the side of the first side of the first region, more than the center between the first side and the plane.

[0156] [9] The processing system according to any one of [1] to [8], wherein the applicator is configured to move between the first side and the second side.

[10] The processing system according to any one of [1] to [9], wherein the processing apparatus is an exposure apparatus for exposing a predetermined pattern onto the film.

[0157]

[11] A processing system comprising: a main body comprising at least one of a film inlet and an outlet; one or more rollers for transporting the film; a processing device for processing the film; and an eccentricity device, which is a member separate from the one or more rollers, for applying force to the main body such that the center of gravity of the main body is eccentric, wherein the eccentricity device is positioned such that the center of gravity is eccentric in a direction away from the pivot point when the main body is about to tilt due to the force applied to the one or more rollers when transporting the film.

[0158] It will be apparent to those skilled in the art that the present invention may be embodied in other specific forms without departing from its technical spirit. For example, some of the components described in the embodiments (or one or more of the embodiments thereof) may be omitted, or some components may be combined. The same applies to the procedures. The scope of the present invention should be determined by referring to the appended claims, along with the entire scope of equivalents to which the claims are granted.

[0159] A1...Accommodation space A2...First space (first area) A3...Second space AR1, AR2...Rotation axis C1...First path C2...Second path C3...Third path C4...Fourth path D...Transport direction F1-F7...Force Fa...Force Fb...Composite force Fc1-Fc5...Force Fd1-Fd3...Force Fe1-Fe3...Force G1...Position G2...Position GS...Contact surface P...Substrate (film) R1...Rotation axis S...Processing system S1...Plane S2...Plane SP1...Contact position SP2...Contact position T1...Initial phase T2...Stabilization phase 10...Processing machine body (main body) 12...Base 12a...Bottom surface 13...Frame 13a...Support part 14...Housing 15...Side wall 15a...First side wall 15b...Second side wall 16...Top wall 17a...First side 17b...Second side 18...Inlet 19...Outlet 20...Conveying device 21...Supply roll 22...Recovery roll 30...First conveying device 31...Supply roll support 32...First roller 32n...Nip roller 32s...Tension measurement sensor 32t...Tension roller 32z...Last first roller 40...Second conveying device 41...Recovery roll support 42...Second roller 42a...First second roller 42n...Nip roller 42s...Tension measurement sensor 42t...Tension roller 50...Processing device 60...Conveying roller (roller) 60m...Main roller (specific roller) 60s-66s...Sub-roller 64a...First position 64b...Second position 64s1-64s4...Specific sub-roller 80...Load adjustment device 81...Weight (applying device, eccentric device) 81a...First position 81b...Second position 82...Support plate 100...Support base 101...Plate 101a...Support surface 102...Vibration isolation unit 200...System control device 300...Conveying control device 400...Processing control device (First control device, Second control device) 800...Computer 801...Processor 802...Memory 803...Communication device 804...Input device 805...Display device

Claims

1. A processing system comprising: a main body comprising at least one of a film inlet and an outlet; one or more rollers for transporting the film; a processing device for processing the film; and a force-applying device for applying a force to the main body that generates a moment in the opposite direction to the moment generated by the force applied to the one or more rollers when transporting the film.

2. The processing system according to claim 1, wherein the weighting tool is a solid or liquid weight.

3. The processing system according to claim 1 or claim 2, comprising: a detection device for detecting tension applied to the film; and a first control device for controlling the force applied by the force-applying tool to the main body based on the detection result of the detection device.

4. A processing system according to any one of claims 1 to 3, comprising: a support base for supporting the main body and controlling the posture of the main body; and a second control device for controlling the support base and controlling the posture of the main body based on tension data relating to the tension applied to the film.

5. The processing system according to any one of claims 1 to 4, wherein the main body comprises a housing having a first side surface on which the entrance and exit are provided and a second side surface opposite to the first side surface, and a frame that supports the one or more rollers, the processing device, and the applicator.

6. The processing system according to claim 5, wherein the one or more rollers include a specific roller used by the processing apparatus to process the film, and the applicator is positioned in a first region on the first side of a vertical plane including the central axis of the specific roller.

7. The processing system according to claim 6, wherein the applicator is positioned on the side of the specific roller that is closer to the center between the first side surface and the plane within the first region.

8. The processing system according to claim 6, wherein the applicator is positioned on the side of the first surface within the first region, more than the center between the first surface and the plane.

9. The processing system according to any one of claims 5 to 8, wherein the applicator is configured to move between the first side surface and the second side surface.

10. The processing apparatus is an exposure apparatus for exposing a predetermined pattern onto the film, the processing system according to any one of claims 1 to 9.

11. A processing system comprising: a main body comprising at least one of a film inlet and an outlet; one or more rollers for transporting the film; a processing device for processing the film; and an eccentricity device, which is a component separate from the one or more rollers, for eccentricating the center of gravity of the main body, wherein the eccentricity device is positioned such that the center of gravity is eccentric in a direction away from the pivot point when the main body is about to tilt due to the force applied to the one or more rollers when transporting the film.

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