Multilayer ceramic electronic component

Abstract

The present invention provides a multilayer ceramic capacitor capable of achieving a higher water repellent effect on the surfaces of a laminate between external electrodes.　Provided is a multilayer ceramic capacitor 1 according to the present embodiment in which: a hydrophilic part 70 and a hydrophobic part 80 are formed on surfaces of a laminate 10; the hydrophilic part 70 includes a first main surface-side hydrophilic section 71 containing a hydroxyl group, a second main surface-side hydrophilic section 72 containing a hydroxyl group, a first side surface-side hydrophilic section 73 containing a hydroxyl group, and a second side surface-side hydrophilic section 74 containing a hydroxyl group; and the hydrophobic part 80 includes a first main surface-side netlike hydrophobic section 81 containing fluorine and / or silicone, a second main surface-side netlike hydrophobic section 82 containing fluorine and / or silicone, a first side surface-side netlike hydrophobic section 83 containing fluorine and / or silicone, and a second side surface-side netlike hydrophobic section 84 containing fluorine and / or silicone.

Description

Multilayer ceramic electronic components

[0001] This invention relates to multilayer ceramic electronic components.

[0002] In recent years, electronic devices such as mobile phones and portable music players have become smaller and thinner. Consequently, there is a growing demand for smaller electronic components, for example, within these devices. Furthermore, the environments in which these electronic devices are used are becoming more diverse, and there is a need for improved reliability of electronic components in these diverse environments.

[0003] Against this backdrop, electronic components with a pair of external electrodes faced the problem of electrochemical migration. Specifically, condensation occurs on the surface of an electronic component due to the temperature difference or difference in heat capacity between the electronic component and the surrounding air. The water droplets generated by this condensation form a water film connecting the external electrodes on the surface of the electronic component. When a voltage is applied between the external electrodes of the electronic component in this state, ionized metal species from the external electrodes dissolve and precipitate in this water film, causing electrochemical migration.

[0004] As a technique for suppressing the occurrence of electrochemical migration, Patent Document 1 describes a technique using a perfluoroalkylalkylsilane-based water-repellent agent, that is, a silane coupling agent having F (fluorine) as a functional group.

[0005] International Publication No. 2002 / 082480

[0006] In the technology described in Patent Document 1, a water-repellent film is formed on the surface of ceramic electronic components using a treatment agent, thereby suppressing the continuous formation of condensation and inhibiting the occurrence of electrochemical migration. However, in more severe environments, a sufficient water-repellent effect cannot be obtained, and the occurrence of electrochemical migration cannot be sufficiently suppressed.

[0007] The purpose of this disclosure is to provide a multilayer ceramic electronic component that can achieve a higher water-repellent effect on the surface of the laminate between external electrodes.

[0008] The multilayer ceramic electronic component according to this disclosure comprises a laminate having a plurality of stacked ceramic layers and a plurality of stacked internal conductor layers, a first main surface and a second main surface facing each other in the height direction, a first side surface and a second side surface facing each other in the width direction perpendicular to the height direction, and a first end surface and a second end surface facing each other in the length direction perpendicular to the height direction and the width direction, and a first external electrode having a first base electrode layer disposed on the first end surface and a first plating layer disposed on the outer surface side of the first base electrode layer. A multilayer ceramic capacitor comprising: a second external electrode having a second base electrode layer disposed on the second end face and a second plating layer disposed on the outer surface side of the first base electrode layer, wherein the plurality of internal conductor layers have a first internal conductor layer disposed on the plurality of dielectric layers and exposed on the first end face and a second internal conductor layer disposed on the plurality of dielectric layers and exposed on the second end face, and the surface of the laminate has hydrophilic portions and hydrophobic portions, the hydrophilic portions are disposed on a part of the first main surface and have hydroxyl groups The hydrophobic portion comprises a first main surface hydrophilic portion, a second main surface hydrophilic portion located on a part of the second main surface and having hydroxyl groups, a first side surface hydrophilic portion located on a part of the first side surface and having hydroxyl groups, and a second side surface hydrophilic portion located on a part of the second side surface and having hydroxyl groups, wherein the hydrophobic portion is located on a part of the first main surface and contains at least one of fluorine, silicone, acrylic resin, and hydrocarbons, and is arranged in a mesh-like manner, and is located on a part of the second main surface and contains fluorine, silicone It comprises a second main surface side mesh-like hydrophobic portion containing at least one of corn, acrylic resin, and hydrocarbons and arranged in a mesh-like manner; a first side side mesh-like hydrophobic portion arranged in a mesh-like manner and located on a part of the first side surface containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons; and a second side side mesh-like hydrophobic portion arranged in a mesh-like manner and located on a part of the second side surface containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons.

[0009] According to this disclosure, it is possible to provide a multilayer ceramic electronic component that can obtain a higher water-repellent effect on the surface of the laminate between external electrodes.

[0010] This is an external inclined view of a multilayer ceramic capacitor of the first embodiment. This is a cross-sectional view of the multilayer ceramic capacitor shown in Figure 1 along the line II-II. This is a cross-sectional view of the multilayer ceramic capacitor shown in Figure 2 along the line III-III. This is a cross-sectional view of the multilayer ceramic capacitor shown in Figure 2 along the line IVA-IVA. This is a cross-sectional view of the multilayer ceramic capacitor shown in Figure 2 along the line IVB-IVB. This is an arrow diagram of the multilayer ceramic capacitor shown in Figure 1, viewed from the first main surface side along the direction of arrow V. This is a diagram showing a double-gang multilayer ceramic capacitor. This is a diagram showing a triple-gang multilayer ceramic capacitor. This is a diagram showing a quadruple-gang multilayer ceramic capacitor.

[0011] The following describes a multilayer ceramic capacitor 1 as a multilayer ceramic electronic component according to the first embodiment of this disclosure. Figure 1 is an external perspective view of the multilayer ceramic capacitor 1 of this embodiment. Figure 2 is a cross-sectional view of the multilayer ceramic capacitor 1 of Figure 1 along the line II-II. Figure 3 is a cross-sectional view of the multilayer ceramic capacitor 1 of Figure 2 along the line III-III. Figure 4A is a cross-sectional view of the multilayer ceramic capacitor 1 of Figure 2 along the line IVA-IVA. Figure 4B is a cross-sectional view of the multilayer ceramic capacitor 1 of Figure 2 along the line IVB-IVB. For convenience, the thickness of the hydrophobic portion is exaggerated to be larger than the actual dimension in Figures 2, 4A, and 4B.

[0012] The multilayer ceramic capacitor 1 comprises a laminate 10 and an external electrode 40.

[0013] Figures 1 to 4B show the XYZ Cartesian coordinate system. The length direction L of the multilayer ceramic capacitor 1 and the laminate 10 corresponds to the X direction. The width direction W of the multilayer ceramic capacitor 1 and the laminate 10 corresponds to the Y direction. The height direction T, which is the stacking direction of the multilayer ceramic capacitor 1 and the laminate 10, corresponds to the Z direction. Here, the cross section shown in Figure 2 is also called the LT cross section. The cross section shown in Figure 3 is also called the WT cross section. The cross sections shown in Figures 4A and 4B are also called the LW cross section.

[0014] As shown in Figures 1 to 4B, the laminate 10 includes a first main surface TS1 and a second main surface TS2 that are opposite to the height direction T, a first side surface WS1 and a second side surface WS2 that are opposite to the width direction W which is perpendicular to the height direction T, and a first end surface LS1 and a second end surface LS2 that are opposite to the length direction L which is perpendicular to the height direction T and the width direction W.

[0015] As shown in Figure 1, the laminate 10 has a substantially rectangular parallelepiped shape. The length L dimension of the laminate 10 is not necessarily longer than the width W dimension. It is preferable that the corners and edges of the laminate 10 are rounded. The corners are the parts where three faces of the laminate intersect, and the edges are the parts where two faces of the laminate intersect. Some or all of the surfaces constituting the laminate 10 may have irregularities or other features. Furthermore, hydrophilic portions 70 and hydrophobic portions 80 are formed on the surface of the laminate 10. The hydrophilic portions 70 and hydrophobic portions 80 will be described later. The surface of the laminate 10 is formed by a first main surface TS1, a second main surface TS2, a first side surface WS1, a second side surface WS2, a first end surface LS1, and a second end surface LS2.

[0016] As shown in Figures 2 and 3, the laminate 10 has an inner layer 11 and a first main surface-side outer layer 12 and a second main surface-side outer layer 13 arranged to sandwich the inner layer 11 in the height direction T.

[0017] The inner layer 11 includes a plurality of dielectric layers 20 and a plurality of internal electrode layers 30. In the height direction T, the inner layer 11 includes the internal electrode layer 30 located closest to the first main surface TS1 to the internal electrode layer 30 located closest to the second main surface TS2. In the inner layer 11, the plurality of internal electrode layers 30 are arranged facing each other via the dielectric layers 20. The inner layer 11 is the part that generates capacitance and functions substantially as a capacitor.

[0018] Multiple dielectric layers 20 are composed of a dielectric material. The dielectric material is, for example, BaTiO ３ CaTiO ３ SrTiO ３ , or CaZrO ３ The dielectric ceramic may contain components such as the above. Alternatively, the dielectric material may have minor components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds added to these main components. The dielectric material may have BaTiO as its main component. ３ It is particularly preferable that the material contains [a specific substance].

[0019] The thickness of the dielectric layer 20 is preferably 0.5 μm or more and 10 μm or less. The number of dielectric layers 20 to be stacked is preferably 15 or more and 1200 or less. The number of dielectric layers 20 is the sum of the number of dielectric layers in the inner layer portion 11 and the number of dielectric layers in the first main surface side outer layer portion 12 and the second main surface side outer layer portion 13.

[0020] The plurality of internal electrode layers 30 have a plurality of first internal electrode layers 31 and a plurality of second internal electrode layers 32. The plurality of first internal electrode layers 31 are arranged on a plurality of dielectric layers 20. The plurality of second internal electrode layers 32 are arranged on a plurality of dielectric layers 20. The plurality of first internal electrode layers 31 and the plurality of second internal electrode layers 32 are arranged alternately in the height direction T of the laminate 10 via the dielectric layers 20. The first internal electrode layers 31 and the second internal electrode layers 32 are arranged so as to sandwich the dielectric layers 20.

[0021] In this embodiment, the plurality of internal electrode layers 30 are substantially rectangular in shape and are arranged at equal intervals along the height direction T. Each of the plurality of internal electrode layers 30 is arranged substantially parallel to the first main surface TS1 and the second main surface TS2. The first internal electrode layer 31 and the second internal electrode layer 32 face each other in the height direction T via the dielectric layer 20.

[0022] The first internal electrode layer 31 has a first opposing portion 31A that faces the second internal electrode layer 32, and a first leading portion 31B that is drawn out from the first opposing portion 31A to the first end face LS1. The first leading portion 31B is exposed to the first end face LS1.

[0023] The second internal electrode layer 32 has a second opposing portion 32A that faces the first internal electrode layer 31, and a second leading portion 32B that is drawn out from the second opposing portion 32A to the second end face LS2. The second leading portion 32B is exposed to the second end face LS2.

[0024] In this embodiment, capacitance is formed when the first opposing portion 31A and the second opposing portion 32A face each other via the dielectric layer 20, and the characteristics of a capacitor are exhibited.

[0025] The shapes of the first opposing portion 31A and the second opposing portion 32A are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded, or the corners of the rectangular shape may be formed at an angle. The shapes of the first pull-out portion 31B and the second pull-out portion 32B are not particularly limited, but are preferably rectangular. However, the corners of the rectangular shape may be rounded, or the corners of the rectangular shape may be formed at an angle.

[0026] The widthwise dimension W of the first opposing portion 31A and the widthwise dimension W of the first drawer portion 31B may be the same, or one of them may be smaller. The widthwise dimension W of the second opposing portion 32A and the widthwise dimension W of the second drawer portion 32B may be the same, or one of them may be narrower.

[0027] The first internal electrode layer 31 and the second internal electrode layer 32 are made of a suitable conductive material such as metals like Ni, Cu, Ag, Pd, and Au, or alloys containing at least one of these metals. When using an alloy, the first internal electrode layer 31 and the second internal electrode layer 32 may be made of, for example, an Ag-Pd alloy.

[0028] The thickness of the first internal electrode layer 31 and the second internal electrode layer 32 is preferably, for example, 0.2 μm or more and 2.0 μm or less. The total number of the first internal electrode layer 31 and the second internal electrode layer 32 is preferably 15 or more and 1000 or less.

[0029] The first main surface-side outer layer 12 is located on the side of the first main surface TS1 of the laminate 10. The first main surface-side outer layer 12 is an aggregate of multiple dielectric layers 20 located between the first main surface TS1 and the internal electrode layer 30 closest to the first main surface TS1. The dielectric layers 20 used in the first main surface-side outer layer 12 may be the same as the dielectric layers 20 used in the inner layer 11.

[0030] The second main surface-side outer layer 13 is located on the second main surface TS2 side of the laminate 10. The second main surface-side outer layer 13 is an aggregate of multiple dielectric layers 20 located between the second main surface TS2 and the internal electrode layer 30 closest to the second main surface TS2. The dielectric layers 20 used in the second main surface-side outer layer 13 may be the same as the dielectric layers 20 used in the inner layer 11.

[0031] Thus, the laminate 10 has a plurality of stacked dielectric layers 20 and a plurality of internal electrode layers 30 stacked on the dielectric layers 20. In other words, the multilayer ceramic capacitor 1 has a laminate 10 in which the dielectric layers 20 and internal electrode layers 30 are stacked alternately.

[0032] The laminate 10 has a counter electrode portion 11E. The counter electrode portion 11E is the portion where the first counter portion 31A of the first internal electrode layer 31 and the second counter portion 32A of the second internal electrode layer 32 face each other. The counter electrode portion 11E is configured as part of the inner layer portion 11. Figures 4A and 4B show the width W and length L ranges of the counter electrode portion 11E. The counter electrode portion 11E is also called the capacitor effective portion.

[0033] The laminate 10 has a side outer layer. The side outer layer has a first side outer layer WG1 and a second side outer layer WG2. The first side outer layer WG1 is a portion that includes a dielectric layer 20 located between the opposing electrode portion 11E and the first side WS1. The second side outer layer WG2 is a portion that includes a dielectric layer 20 located between the opposing electrode portion 11E and the second side WS2. Figures 3, 4A, and 4B show the widthwise range W of the first side outer layer WG1 and the second side outer layer WG2. The side outer layer is also called a W gap or side gap.

[0034] The laminate 10 has an end-face outer layer. The end-face outer layer has a first end-face outer layer LG1 and a second end-face outer layer LG2. The first end-face outer layer LG1 is a portion that includes a dielectric layer 20 located between the opposing electrode portion 11E and the first end face LS1. The second end-face outer layer LG2 is a portion that includes a dielectric layer 20 located between the opposing electrode portion 11E and the second end face LS2. Figures 2, 4A, and 4B show the range L in the longitudinal direction of the first end-face outer layer LG1 and the second end-face outer layer LG2. The end-face outer layer is also called an L gap or end gap.

[0035] The external electrode 40 includes a first external electrode 40A positioned on the first end face LS1 side and a second external electrode 40B positioned on the second end face LS2 side. The surfaces of the first external electrode 40A and the second external electrode 40B have hydrophilic portions 75 and hydrophobic portions 85 formed thereon.

[0036] The first external electrode 40A is disposed on the first end face LS1. The first external electrode 40A is connected to the first internal electrode layer 31. The first external electrode 40A may also be disposed on a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2. In the present embodiment, the first external electrode 40A is formed to extend from the first end face LS1 to a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2.

[0037] The second external electrode 40B is disposed on the second end face LS2. The second external electrode 40B is connected to the second internal electrode layer 32. The second external electrode 40B may also be disposed on a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2. In the present embodiment, the second external electrode 40B is formed to extend from the second end face LS2 to a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2.

[0038] As described above, in the laminate 10, a capacitance is formed by the first opposing portion 31A of the first internal electrode layer 31 and the second opposing portion 32A of the second internal electrode layer 32 facing each other through the dielectric layer 20. Therefore, the characteristics of a capacitor are exhibited between the first external electrode 40A connected to the first internal electrode layer 31 and the second external electrode 40B connected to the second internal electrode layer 32.

[0039] The first external electrode 40A includes a first base electrode layer 50A and a first plating layer 60A disposed on the first base electrode layer 50A.

[0040] The second external electrode 40B includes a second base electrode layer 50B and a second plating layer 60B disposed on the second base electrode layer 50B.

[0041] The first base electrode layer 50A is disposed on the first end face LS1. The first base electrode layer 50A is connected to the first internal electrode layer 31. In the present embodiment, the first base electrode layer 50A is formed to extend from the first end face LS1 to a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2.

[0042] The second base electrode layer 50B is disposed on the second end face LS2. The second base electrode layer 50B is connected to the second internal electrode layer 32. In the present embodiment, the second base electrode layer 50B is formed to extend from the second end face LS2 to a part of the first main surface TS1, a part of the second main surface TS2, a part of the first side surface WS1, and a part of the second side surface WS2.

[0043] The first base electrode layer 50A and the second base electrode layer 50B of the present embodiment are baking layers. The baking layer preferably contains either a metal component and a glass component or a ceramic component, or both. The metal component includes, for example, at least one selected from Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc. The glass component includes, for example, at least one selected from B, Si, Ba, Mg, Al, Li, etc. The ceramic component may be the same type of ceramic material as the dielectric layer 20 or a different type of ceramic material. The ceramic component includes, for example, BaTiO ３ , CaTiO ３ , (Ba,Ca)TiO ３ , SrTiO ３ , CaZrO ３ , etc., and includes at least one selected therefrom.

[0044] The baked layer is, for example, formed by applying a conductive paste containing glass and metal to a laminate and baking it. The baked layer may be formed by simultaneously firing a laminated chip having internal electrodes and a dielectric layer and the conductive paste applied to the laminated chip, or by firing a laminated chip having internal electrodes and a dielectric layer to obtain a laminate, and then applying the conductive paste to the laminate and baking it. When simultaneously firing a laminated chip having internal electrodes and a dielectric layer and the conductive paste applied to the laminated chip, it is preferable to form the baked layer by baking a material with a ceramic material added instead of glass. In this case, it is particularly preferable to use the same type of ceramic material as the dielectric layer 20 as the added ceramic material. The baked layer may consist of multiple layers.

[0045] The longitudinal thickness of the first base electrode layer 50A located at the first end face LS1 is preferably, for example, 10 μm to 150 μm at the center of the height T and width W of the first base electrode layer 50A.

[0046] The thickness of the second base electrode layer 50B located at the second end face LS2 in the longitudinal direction is preferably, for example, 10 μm to 150 μm at the center of the height direction T and width direction W of the second base electrode layer 50B.

[0047] When the first base electrode layer 50A is provided on a part of at least one of the first main surface TS1 or the second main surface TS2, it is preferable that the thickness of the first base electrode layer 50A in the height direction T provided in this part is, for example, 10 μm or more and 100 μm or less at the center of the length direction L and width direction W of the first base electrode layer 50A provided in this part.

[0048] When the first base electrode layer 50A is provided on a part of at least one of the first side surface WS1 or the second side surface WS2, it is preferable that the thickness of the first base electrode layer 50A in the width direction provided in this portion is, for example, 10 μm or more and 100 μm or less at the center of the length direction L and height direction T of the first base electrode layer 50A provided in this portion.

[0049] When a second base electrode layer 50B is provided on at least one of the surfaces of the first main surface TS1 or the second main surface TS2, it is preferable that the thickness of the second base electrode layer 50B in the height direction T provided in this portion is, for example, 10 μm or more and 100 μm or less at the center of the length direction L and width direction W of the second base electrode layer 50B provided in this portion.

[0050] When a second base electrode layer 50B is provided on at least one of the surfaces of the first side surface WS1 or the second side surface WS2, it is preferable that the thickness of the second base electrode layer 50B in the width direction provided in this portion is, for example, 10 μm or more and 100 μm or less at the center of the length direction L and height direction T of the second base electrode layer 50B provided in this portion.

[0051] The first base electrode layer 50A and the second base electrode layer 50B are not limited to baked layers. The first base electrode layer 50A and the second base electrode layer 50B include at least one selected from baked layers, conductive resin layers, thin film layers, etc. For example, the first base electrode layer 50A and the second base electrode layer 50B may be thin film layers. The thin film layer is formed by a thin film formation method such as sputtering or vapor deposition. The thin film layer is a layer of 10 μm or less in thickness on which metal particles are deposited.

[0052] The first plating layer 60A is positioned to cover the first underlay electrode layer 50A.

[0053] The second plating layer 60B is positioned to cover the second under electrode layer 50B.

[0054] The first plating layer 60A and the second plating layer 60B may each contain at least one selected from, for example, Cu, Ni, Sn, Ag, Pd, Ag-Pd alloy, Au, etc. The first plating layer 60A and the second plating layer 60B may each be formed by multiple layers. Preferably, the first plating layer 60A and the second plating layer 60B have a two-layer structure in which a Sn plating layer is formed on top of a Ni plating layer.

[0055] The first plating layer 60A is arranged to cover the first underlay electrode layer 50A. In this embodiment, the first plating layer 60A has a first Ni plating layer 61A and a first Sn plating layer 62A located on the first Ni plating layer 61A.

[0056] The second plating layer 60B is arranged to cover the second under electrode layer 50B. In this embodiment, the second plating layer 60B includes a second Ni plating layer 61B and a second Sn plating layer 62B located on the second Ni plating layer 61B.

[0057] The Ni plating layer prevents the first underlay electrode layer 50A and the second underlay electrode layer 50B from being corroded by the solder used when mounting the multilayer ceramic capacitor 1. The Sn plating layer also improves the wettability of the solder used when mounting the multilayer ceramic capacitor 1. This facilitates the mounting of the multilayer ceramic capacitor 1. The thickness of each of the first Ni plating layer 61A, the first Sn plating layer 62A, the second Ni plating layer 61B, and the second Sn plating layer 62B is preferably between 1 μm and 15 μm.

[0058] In this embodiment, the first external electrode 40A and the second external electrode 40B may have, for example, a conductive resin layer containing a conductive filler and a thermosetting resin. When a conductive resin layer is provided as a base electrode layer (first base electrode layer 50A, second base electrode layer 50B), the conductive resin layer may be arranged to cover the baking layer, or it may be placed directly on the laminate 10 without providing a baking layer. When the conductive resin layer is arranged to cover the baking layer, the conductive resin layer is placed between the baking layer and the plating layer (first plating layer 60A, second plating layer 60B). The conductive resin layer may completely cover the baking layer, or it may cover a part of the baking layer.

[0059] A conductive resin layer containing a thermosetting resin is more flexible than a conductive layer made of, for example, a plated film or a fired conductive paste. Therefore, even when the multilayer ceramic capacitor 1 is subjected to physical shock or shock caused by thermal cycling, the conductive resin layer functions as a buffer layer. Thus, the conductive resin layer suppresses the occurrence of cracks in the multilayer ceramic capacitor 1.

[0060] The metal constituting the conductive filler may be Ag, Cu, Ni, Sn, Bi, or an alloy containing these. The conductive filler preferably contains Ag. The conductive filler is, for example, Ag metal powder. Ag has the lowest resistivity among metals, making it suitable as an electrode material. Furthermore, since Ag is a noble metal, it is resistant to oxidation and has high weather resistance. Therefore, Ag metal powder is suitable as a conductive filler.

[0061] Furthermore, the conductive filler may be a metal powder with an Ag coating on its surface. When using a metal powder with an Ag coating on its surface, the metal powder is preferably Cu, Ni, Sn, Bi, or an alloy of these. It is preferable to use an Ag-coated metal powder in order to maintain the properties of Ag while making the base metal inexpensive.

[0062] Furthermore, the conductive filler may be Cu or Ni that has been treated to prevent oxidation. Alternatively, the conductive filler may be metal powder coated with Sn, Ni, or Cu on its surface. When using metal powder coated with Sn, Ni, or Cu, the metal powder is preferably Ag, Cu, Ni, Sn, Bi, or an alloy of these.

[0063] The shape of the conductive filler is not particularly limited. Conductive fillers can be spherical, flattened, or otherwise, but it is preferable to use a mixture of spherical and flattened metal powders.

[0064] The average particle size of the conductive filler is not particularly limited. For example, the average particle size of the conductive filler may be 0.3 μm or more and 10 μm or less.

[0065] The conductive filler contained in the conductive resin layer is preferably present in an amount of 35 vol% to 75 vol% relative to the total volume of the conductive resin layer.

[0066] The conductive fillers contained in the conductive resin layer primarily play a role in ensuring the conductivity of the conductive resin layer. Specifically, the contact between multiple conductive fillers forms an electrical pathway within the conductive resin layer.

[0067] The resin constituting the conductive resin layer may include at least one selected from various known thermosetting resins such as epoxy resin, phenolic resin, urethane resin, silicone resin, and polyimide resin. Among these, epoxy resin, which has excellent heat resistance, moisture resistance, and adhesion, is one of the most suitable resins. Furthermore, it is preferable that the resin in the conductive resin layer includes a curing agent together with the thermosetting resin. When epoxy resin is used as the base resin, the curing agent for the epoxy resin may be various known compounds such as phenolic, amine, acid anhydride, imidazole, active ester, and amide-imide compounds.

[0068] The conductive resin layer may be formed from multiple layers. Preferably, the thickness of the thickest part of the conductive resin layer is 10 μm or more and 200 μm or less.

[0069] It is also possible to omit the first base electrode layer 50A and the second base electrode layer 50B, and instead directly arrange the first plating layer 60A and the second plating layer 60B, as described later, on the laminate 10. In other words, the multilayer ceramic capacitor 1 may include a plating layer that is directly electrically connected to the first internal electrode layer 31 and the second internal electrode layer 32. In such a case, the plating layer may be formed after a catalyst is placed on the surface of the laminate 10 as a pretreatment.

[0070] In this case as well, it is preferable that the plating layer consists of multiple layers. The lower plating layer and the upper plating layer each preferably contain at least one metal selected from, for example, Cu, Ni, Sn, Pb, Au, Ag, Pd, Bi, or Zn, or an alloy containing these metals. The lower plating layer is more preferably formed using Ni, which has solder barrier properties. The upper plating layer is more preferably formed using Sn or Au, which has good solder wettability. For example, if the first internal electrode layer 31 and the second internal electrode layer 32 are formed using Ni, it is preferable that the lower plating layer be formed using Cu, which has good bonding properties with Ni. The upper plating layer may be formed as needed, and the external electrode 40 may consist only of the lower plating layer. Furthermore, the upper plating layer may be the outermost layer, or other plating layers may be formed on the surface of the upper plating layer.

[0071] The thickness of each plating layer, when placed without an undercoat electrode layer, is preferably 1 μm to 15 μm. Furthermore, the plating layer preferably does not contain glass. The metal content per unit volume of the plating layer is preferably 99% by volume or more.

[0072] Furthermore, when the plating layer is formed directly on the laminate 10, the thickness of the base electrode layer can be reduced. Therefore, by reducing the thickness of the base electrode layer, the height T dimension of the multilayer ceramic capacitor 1 can be reduced, thereby making the multilayer ceramic capacitor 1 lower profile. Alternatively, by reducing the thickness of the base electrode layer, the thickness of the dielectric layer 20 sandwiched between the first internal electrode layer 31 and the second internal electrode layer 32 can be increased, thereby improving the overall thickness. In this way, by forming the plating layer directly on the laminate 10, the design flexibility of the multilayer ceramic capacitor can be improved.

[0073] Furthermore, if the lengthwise dimension of the multilayer ceramic capacitor 1, including the laminated body 10 and the external electrode 40, is denoted as dimension L, then it is preferable that dimension L is 0.2 mm or more and 10 mm or less. Also, if the heightwise dimension of the multilayer ceramic capacitor 1, is denoted as dimension T, then it is preferable that dimension T is 0.1 mm or more and 5 mm or less. Also, if the widthwise dimension of the multilayer ceramic capacitor 1, is denoted as dimension W, then it is preferable that dimension W is 0.1 mm or more and 10 mm or less.

[0074] Here, the inventors of the present invention have found, through repeated studies, experiments, and simulations, that by forming a mesh-like hydrophobic portion 80 on the surface of the laminate 10 of the multilayer ceramic capacitor 1, a high water-repellent effect can be obtained, and furthermore, the problem of the multilayer ceramic capacitors 1 sticking together after manufacturing can also be suppressed. This point will be explained below.

[0075] For example, if water droplets formed by condensation continuously wet the surface of the laminate 10 between the external electrodes 40 and a voltage is applied between the external electrodes 40, ionized metal species from the external electrodes 40 will dissolve and precipitate, causing electrochemical migration. In this embodiment, hydrophilic portions 70 and hydrophobic portions 80 are formed on the surface of the laminate 10 to suppress the occurrence of this electrochemical migration.

[0076] Next, the configuration of the hydrophilic portion 70 and the hydrophobic portion 80 will be explained with reference to Figures 1, 2, 4A, 4B, and 5. Figure 5 is an arrow diagram showing the multilayer ceramic capacitor 1 shown in Figure 1, viewed from the first main surface TS1 side along the direction of arrow V.

[0077] The hydrophilic portion 70 is a hydrophilic area formed on the surface of the multilayer ceramic capacitor 1. The hydrophilic portion 70 may be a film formed by coating, for example, a hydroxyl group-containing silane coupling material on the surface of the laminate 10, or it may be the surface of the multilayer ceramic capacitor 1 itself. In other words, the hydrophilic portion 70 may be the surface of the ceramic material. In this embodiment, the hydrophilic portion 70 is the surface of the multilayer ceramic capacitor 1 itself. In other words, the hydrophilic portion 70 in this embodiment is the surface of the ceramic material.

[0078] As shown in Figures 1, 2, 4A, 4B, and 5, the hydrophilic portion 70 includes a first main surface hydrophilic portion 71, a second main surface hydrophilic portion 72, a first side surface hydrophilic portion 73, and a second side surface hydrophilic portion 74.

[0079] The first main surface hydrophilic portion 71 is a hydrophilic surface having hydroxyl groups. The first main surface hydrophilic portion 71 is formed on a part of the first main surface TS1. In this embodiment, as shown in Figures 1, 2, and 5, the first main surface hydrophilic portion 71 is formed in an island-like manner, dispersed over the entire region TE1 located between the first external electrode 40A and the second external electrode 40B on the first main surface TS1. In other words, the first main surface hydrophilic portion 71 has a plurality of first main surface island-like hydrophilic portions 711 scattered in an island-like manner on the first main surface TS1.

[0080] The second main surface hydrophilic portion 72 is a hydrophilic surface having hydroxyl groups. The second main surface hydrophilic portion 72 is formed on a part of the second main surface TS2. In this embodiment, the second main surface hydrophilic portion 72 is formed in an island-like manner, dispersed over the entire region TE2 located between the first external electrode 40A and the second external electrode 40B on the second main surface TS2. In other words, the second main surface hydrophilic portion 72 has a plurality of second main surface island-like hydrophilic portions 721 scattered in an island-like manner on the second main surface TS2.

[0081] The first side hydrophilic portion 73 is a hydrophilic surface having hydroxyl groups. The first side hydrophilic portion 73 is formed on a part of the first side surface WS1. In this embodiment, the first side hydrophilic portion 73 is formed in an island-like manner, dispersed over the entire region WE1 located between the first external electrode 40A and the second external electrode 40B on the first side surface WS1. In other words, the first side hydrophilic portion 73 has a plurality of first side island hydrophilic portions 731 scattered in an island-like manner on the first side surface WS1.

[0082] The second side hydrophilic portion 74 is a hydrophilic surface having hydroxyl groups. The second side hydrophilic portion 74 is formed on a part of the second side surface WS2. In this embodiment, the second side hydrophilic portion 74 is formed in an island-like manner, dispersed across the entire region WE2 located between the first external electrode 40A and the second external electrode 40B on the second side surface WS2. In other words, the second side hydrophilic portion 74 has a plurality of second side island-like hydrophilic portions 741 scattered in an island-like manner on the second side surface WS2.

[0083] The hydrophobic portion 80 is a hydrophobic area formed on the surface of the multilayer ceramic capacitor 1. The hydrophobic portion 80 may be a film formed by applying a water-repellent agent to the surface of the laminate 10, for example. Examples of water-repellent agents include silane coupling agents and non-crosslinked resins. Examples of non-crosslinked resins include fluorine-based non-crosslinked resins, silicone-based non-crosslinked resins, and polyolefin-based non-crosslinked resins.

[0084] As shown in Figures 1, 2, 4A, 4B, and 7, the hydrophobic portion 80 includes a first main surface mesh-like hydrophobic portion 81, a second main surface mesh-like hydrophobic portion 82, a first side surface mesh-like hydrophobic portion 83, and a second side surface mesh-like hydrophobic portion 84.

[0085] The first main surface-side mesh-like hydrophobic portion 81 is a hydrophobic film containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons. The first main surface-side mesh-like hydrophobic portion 81 is formed in a mesh-like manner on a part of the first main surface TS1. Specifically, as shown in Figure 1, the first main surface-side mesh-like hydrophobic portion 81 is formed within region TE1 on the first main surface TS1. In this embodiment, as shown in Figures 1 and 5, the first main surface-side mesh-like hydrophobic portion 81 is formed as a continuum surrounding each of the multiple first main surface-side island-like hydrophilic portions 711. Formed in a mesh-like manner means, for example, that it is formed in a shape where there are multiple intersections of two parts extending in different directions along the surface of the laminate 10.

[0086] As shown in Figure 2, the first main surface-side mesh-like hydrophobic portion 81 in this embodiment is formed to protrude in a direction away from the first main surface TS1 than the first main surface-side hydrophilic portion 71. That is, on the first main surface TS1, the hydrophobic portion 80 is formed to protrude in a direction away from the surface of the laminate 10 than the hydrophilic portion 70. In this embodiment, the first main surface TS1 on which the first main surface-side hydrophilic portion 71 and the first main surface-side mesh-like hydrophobic portion 81 are formed has an overall uneven shape, with the first main surface-side hydrophilic portion 71 formed in the recesses and the first main surface-side mesh-like hydrophobic portion 81 formed in the convex portions.

[0087] The second main surface-side mesh-like hydrophobic portion 82 is a hydrophobic film containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons. The second main surface-side mesh-like hydrophobic portion 82 is formed in a mesh-like manner on a part of the second main surface TS2. Specifically, as shown in Figure 1, the second main surface-side mesh-like hydrophobic portion 82 is formed within region TE2 on the second main surface TS2. In this embodiment, the second main surface-side mesh-like hydrophobic portion 82 is formed as a continuum surrounding each of the multiple second main surface-side island-like hydrophilic portions 721.

[0088] As shown in Figure 2, the second main surface-side mesh-like hydrophobic portion 82 in this embodiment is formed to protrude in a direction away from the second main surface TS2 than the second main surface-side hydrophilic portion 72. That is, on the second main surface TS2, the hydrophobic portion 80 is formed to protrude in a direction away from the surface of the laminate 10 than the hydrophilic portion 70. In this embodiment, the second main surface TS2 on which the second main surface-side hydrophilic portion 72 and the second main surface-side mesh-like hydrophobic portion 82 are formed has an overall uneven shape, with the second main surface-side hydrophilic portion 72 formed in the recesses and the second main surface-side mesh-like hydrophobic portion 82 formed in the convex portions.

[0089] The first side-side mesh-like hydrophobic portion 83 is a hydrophobic film containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons. The first side-side mesh-like hydrophobic portion 83 is formed in a mesh-like manner on a part of the first side surface WS1. Specifically, as shown in Figures 4A and 4B, the first side-side mesh-like hydrophobic portion 83 is formed within region WE1 on the first side surface WS1. In this embodiment, the first side-side mesh-like hydrophobic portion 83 is formed as a continuum surrounding each of the multiple first side-side island-like hydrophilic portions 731.

[0090] As shown in Figures 4A and 4B, the first side-side mesh-like hydrophobic portion 83 in this embodiment is formed to protrude further away from the first side surface WS1 than the first side-side hydrophilic portion 73. That is, on the first side surface WS1, the hydrophobic portion 80 is formed to protrude further away from the surface of the laminate 10 than the hydrophilic portion 70. In this embodiment, the first side surface WS1 on which the first side-side hydrophilic portion 73 and the first side-side mesh-like hydrophobic portion 83 are formed has an overall uneven shape, with the first side-side hydrophilic portion 73 formed in the recesses and the first side-side mesh-like hydrophobic portion 83 formed in the convex parts.

[0091] The second side-side mesh-like hydrophobic portion 84 is a hydrophobic layer containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons. The second side-side mesh-like hydrophobic portion 84 is formed in a mesh-like manner on a part of the second side surface WS2. Specifically, as shown in Figures 4A and 4B, the second side-side mesh-like hydrophobic portion 84 is formed within region WE2 on the second side surface WS2. In this embodiment, the second side-side mesh-like hydrophobic portion 84 is formed as a continuum surrounding each of the multiple second side-side island-like hydrophilic portions 741.

[0092] As shown in Figures 4A and 4B, the second side mesh hydrophobic portion 84 in this embodiment is formed to protrude further away from the second side surface WS2 than the second side hydrophilic portion 74. That is, on the second side surface WS2, the hydrophobic portion 80 is formed to protrude further away from the surface of the laminate 10 than the hydrophilic portion 70. In this embodiment, the second side surface WS2 on which the second side hydrophilic portion 74 and the second side mesh hydrophobic portion 84 are formed has an overall uneven shape, with the second side hydrophilic portion 74 formed in the recesses and the second side mesh hydrophobic portion 84 formed in the protrusions.

[0093] The thickness T1 of the hydrophobic portion 80 is preferably, for example, 80 nm or more and 800 nm or less. Furthermore, from the viewpoint of achieving both water repellency and adhesion, the thickness T1 of the hydrophobic portion 80 is more preferably 200 nm or more and 400 nm or less. By setting the thickness T1 of the hydrophobic portion 80 to 80 nm or more, more preferably 200 nm or more, the water repellency of the surface of the laminate 10 can be further improved. In addition, by setting the thickness T1 of the hydrophobic portion 80 to 800 nm or less, more preferably 400 nm or less, adhesion between different multilayer ceramic capacitors 1 via the hydrophobic portion 80 can be prevented.

[0094] The amount of protrusion of the hydrophobic portion 80 relative to the hydrophilic portion 70 is preferably, for example, 80 nm or more and 800 nm or less. Furthermore, from the viewpoint of achieving both water-repellent performance and adhesion, it is more preferable that the amount of protrusion of the hydrophobic portion 80 is 200 nm or more and 400 nm or less. By setting the amount of protrusion of the hydrophobic portion 80 to 80 nm or more, more preferably 200 nm or more, the water-repellent performance of the surface of the laminate 10 can be further improved. In addition, by setting the thickness T1 of the hydrophobic portion 80 to 800 nm or less, more preferably 400 nm or less, adhesion between different multilayer ceramic capacitors 1 via the hydrophobic portion 80 can be prevented.

[0095] As mentioned above, the hydrophobic portion 80 can be made of a silane coupling agent or a non-crosslinked resin.

[0096] In a method for forming a silane coupling film by silane coupling treatment, it is conceivable to lengthen the linear chain of the silane coupling agent in order to exhibit high water repellency. However, if the linear chain of the silane coupling agent is lengthened, the steric hindrance caused by this linear chain increases, which may lead to a decrease in density as the spacing between the reactive groups of the silane coupling agent bonded to the surface of the electronic component widens. As a result, the condensation suppression effect may become insufficient, and the condensation on the surface of the laminate 10 between the silane coupling agents may become continuous.

[0097] Another possible method for suppressing electrochemical migration is to use a perfluoroalkylalkylsilane-based water-repellent agent, that is, a silane coupling agent having fluorine as a functional group. By using this agent to form a water-repellent film as a hydrophobic portion 80 on the surface of the laminate 10, the continuity of condensation can be suppressed and the occurrence of electrochemical migration can be prevented. However, since the water-repellent film formed by this agent is a very thin monolayer, it has low heat resistance, and there is a risk that the water repellency will decrease due to thermal decomposition of the water-repellent film in high-temperature environments.

[0098] In this embodiment, the water-repellent performance can be enhanced by making the hydrophobic portion 80 mesh-like, which increases the freedom in selecting the material for the hydrophobic portion 80. This makes it possible to improve the water-repellent performance of the surface of the laminate 10 without causing the problems described above.

[0099] The hydrophobic portion 80 is preferably made of a non-crosslinked resin in that it can achieve both heat resistance and surface density of the laminate 10. In other words, it is preferable that the hydrophobic portion 80 contains a non-crosslinked resin. When a non-crosslinked resin is used, the hydrophobic portion 80 is formed by physical deposition, so unlike when a silane coupling agent is used, the thickness of the water-repellent film can be increased without causing a decrease in surface density of the laminate 10 due to an increase in steric hindrance. As a result, the heat resistance of the water-repellent film formed as the hydrophobic portion 80 is improved and a significant decrease in water-repellent performance due to thermal decomposition of the water-repellent film can be prevented.

[0100] Next, the ratio of the area of ​​the hydrophilic portion 70 and the hydrophobic portion 80 formed on the surface of the multilayer ceramic capacitor 1 will be explained.

[0101] In this embodiment, the surface of the laminate 10 is divided into two regions: a region where a hydrophilic portion 70 is formed and a region where a hydrophobic portion 80 is formed. That is, the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2 contain only regions where either a hydrophilic portion 70 or a hydrophobic portion 80 is formed.

[0102] The ratio of the area of ​​the first main surface-side mesh-like hydrophobic portion 81 to the sum of the area of ​​the first main surface-side hydrophilic portion 71 and the area of ​​the first main surface-side mesh-like hydrophobic portion 81 formed within region TE1 on the first main surface TS1 (hereinafter referred to as the area ratio of the first main surface-side mesh-like hydrophobic portion 81) is preferably 28% or more and 74%, and more preferably 43% or more and 60%. In this embodiment, the area ratio of the first main surface-side mesh-like hydrophobic portion 81 is the ratio of the area of ​​the first main surface-side mesh-like hydrophobic portion 81 to the area of ​​region TE1. By setting the area ratio of the first main surface-side mesh-like hydrophobic portion 81 to 28% or more, more preferably 43% or more, the water-repellent performance of the first main surface TS1 can be further improved. Furthermore, by setting the area ratio of the first main surface-side mesh-like hydrophobic portion 81 to 74% or less, more preferably 60% or less, adhesion between the multilayer ceramic capacitors 1 via the first main surface-side mesh-like hydrophobic portion 81 can be suppressed.

[0103] The ratio of the area of ​​the second main surface-side mesh-like hydrophobic portion 82 to the sum of the area of ​​the second main surface-side hydrophilic portion 72 and the area of ​​the second main surface-side mesh-like hydrophobic portion 82 formed within region TE2 on the second main surface TS2 (hereinafter referred to as the area ratio of the second main surface-side mesh-like hydrophobic portion 82) is preferably 28% or more and 74%, and more preferably 43% or more and 60%. In this embodiment, the area ratio of the second main surface-side mesh-like hydrophobic portion 82 is the ratio of the area of ​​the second main surface-side mesh-like hydrophobic portion 82 to the area of ​​region TE2. By setting the area ratio of the second main surface-side mesh-like hydrophobic portion 82 to 28% or more, and more preferably 43% or more, the water-repellent performance of the second main surface TS2 can be further improved. Furthermore, by setting the area ratio of the second main surface-side mesh-like hydrophobic portion 82 to 74% or less, more preferably 60% or less, adhesion between the multilayer ceramic capacitors 1 via the second main surface-side mesh-like hydrophobic portion 82 can be suppressed.

[0104] The ratio of the area of ​​the first side-side mesh-like hydrophobic portion 83 to the sum of the area of ​​the first side-side hydrophilic portion 73 and the area of ​​the first side-side mesh-like hydrophobic portion 83 formed within region WE1 on the first side surface WS1 (hereinafter referred to as the area ratio of the first side-side mesh-like hydrophobic portion 83) is preferably 28% or more and 74%, and more preferably 43% or more and 60%. In this embodiment, the area ratio of the first side-side mesh-like hydrophobic portion 83 is the ratio of the area of ​​the first side-side mesh-like hydrophobic portion 83 to the area of ​​region WE1. By setting the area ratio of the first side-side mesh-like hydrophobic portion 83 to 28% or more, more preferably 43% or more, the water-repellent performance of the first side surface WS1 can be further improved. Furthermore, by setting the area ratio of the first side-side mesh-like hydrophobic portion 83 to 74% or less, more preferably 60% or less, adhesion between the multilayer ceramic capacitors 1 via the first side-side mesh-like hydrophobic portion 83 can be suppressed.

[0105] The ratio of the area of ​​the second side mesh-like hydrophobic portion 84 to the sum of the area of ​​the second side hydrophilic portion 74 and the area of ​​the second side mesh-like hydrophobic portion 84 formed within region WE2 on the second side surface WS2 (hereinafter referred to as the area ratio of the second side mesh-like hydrophobic portion 84) is preferably 28% or more and 74%, and more preferably 43% or more and 60%. In this embodiment, the area ratio of the second side mesh-like hydrophobic portion 84 is the ratio of the area of ​​the second side mesh-like hydrophobic portion 84 to the area of ​​region WE2. By setting the area ratio of the second side mesh-like hydrophobic portion 84 to 28% or more, more preferably 43% or more, the water-repellent performance of the second side surface WS2 can be further improved. Furthermore, by setting the area ratio of the second side mesh-like hydrophobic portion 84 to 74% or less, more preferably 60% or less, adhesion between the multilayer ceramic capacitors 1 via the second side mesh-like hydrophobic portion 84 can be suppressed.

[0106] The area ratio of the first main surface mesh-like hydrophobic portion 81, the area ratio of the second main surface mesh-like hydrophobic portion 82, the area ratio of the first side surface mesh-like hydrophobic portion 83, and the area ratio of the second side surface mesh-like hydrophobic portion 84 can be confirmed, for example, by the following measurement method.

[0107] One measurement method involves photographing the surface of the laminate 10 using a scanning electron microscope (SEM) and processing the obtained SEM image. The SEM image is, for example, captured as a backscattered electron image at a magnification that shows the entire multilayer ceramic capacitor 1, with an acceleration voltage of 5.0 kV.

[0108] Image cropping is performed on the obtained SEM image to extract the region between the first external electrode 40A and the second external electrode 40B on the surface of the laminate 10, that is, region TE1 on the first main surface TS1, region TE2 on the second main surface TS2, region WE1 on the first side surface WS1, and region WE2 on the second side surface WS2.

[0109] The extracted SEM images are then binarized. Specifically, the difference in brightness between the hydrophilic portion 70 and the hydrophobic portion 80 on the surface of the laminate 10 is binarized. In the SEM image, the hydrophilic portion 70, such as the ceramic surface, appears relatively white, while the hydrophobic portion 80, such as the resin, appears black. The threshold for white and black is set to the midpoint between the peak of the hydrophilic portion 70 and the peak of the hydrophobic portion 80. The area ratio of the first main surface mesh-like hydrophobic portion 81, the area ratio of the second main surface mesh-like hydrophobic portion 82, the area ratio of the first side-side mesh-like hydrophobic portion 83, and the area ratio of the second side-side mesh-like hydrophobic portion 84 are determined by calculating the area of ​​the hydrophobic portion 80 relative to the sum of the area of ​​the hydrophilic portion 70 and the area of ​​the hydrophobic portion 80 in the binarized image.

[0110] Furthermore, it is preferable that the hydrophobic portion 80 formed on the surface of the laminate 10 is greater than the hydrophobic portion 85 formed on the surface of the external electrode 40. That is, it is preferable that the area of ​​the hydrophobic portion 85 formed on the surfaces of the first external electrode 40A and the second external electrode 40B is smaller than the area of ​​the hydrophobic portion 80 formed on the first main surface TS1, the second main surface TS2, the first side surface WS1, and the second side surface WS2. It is preferable that the ratio of the area of ​​the hydrophobic portion 85 formed on the surfaces of the first external electrode 40A and the second external electrode 40B to the total surface area of ​​the first external electrode 40A and the second external electrode 40B is smaller than the area of ​​the first main surface-side mesh-like hydrophobic portion 81 to the area of ​​region TE1, the area of ​​the second main surface-side mesh-like hydrophobic portion 82 to the area of ​​region TE2, the area of ​​the first side-side mesh-like hydrophobic portion 83 to the area of ​​region WE1, and the area of ​​the second side-side mesh-like hydrophobic portion 84 to the area of ​​region WE2.

[0111] Next, the contact angles of the hydrophilic portion 70 and the hydrophobic portion 80 with respect to water will be described. When the surface is composed only of the hydrophilic portion 70, the difference between the water contact angle of the hydrophilic portion 70 and the water contact angle of the hydrophobic portion 80 is preferably 35° or more, and more preferably 45° or more.

[0112] Next, the manufacturing method of the multilayer ceramic capacitor 1 of this embodiment will be described.

[0113] A dielectric sheet for the dielectric layer 20 and a conductive paste for the internal electrode layer 30 are prepared. The dielectric sheet and the conductive paste for the internal electrode contain a binder and a solvent. The binder and solvent may be known substances.

[0114] A conductive paste for the internal electrode layer 30 is printed on the dielectric sheet in a predetermined pattern, for example, by screen printing or gravure printing. This prepares a dielectric sheet with the pattern for the first internal electrode layer 31 formed on it, and a dielectric sheet with the pattern for the second internal electrode layer 32 formed on it.

[0115] A predetermined number of dielectric sheets without printed internal electrode layer patterns are stacked to form the first main surface outer layer portion 12 on the first main surface TS1 side. On top of this, dielectric sheets with printed patterns for the first internal electrode layer 31 and dielectric sheets with printed patterns for the second internal electrode layer 32 are sequentially stacked to form the inner layer portion 11. On top of this inner layer portion 11, a predetermined number of dielectric sheets without printed internal electrode layer patterns are stacked to form the second main surface outer layer portion 13 on the second main surface TS2 side. This completes the production of the laminated sheet.

[0116] Laminated sheets are pressed in the height direction by means of hydrostatic pressing or other methods to produce laminated blocks.

[0117] The laminated block is cut to a predetermined size, thereby producing laminated chips. At this time, the corners and edges of the laminated chips may be rounded by barrel polishing or other methods.

[0118] The laminated chips are fired to produce the laminated body 10. The firing temperature depends on the materials of the dielectric layer 20 and the internal electrode layer 30, but is preferably between 900°C and 1400°C.

[0119] A conductive paste, which will form the base electrode layers (first base electrode layer 50A, second base electrode layer 50B), is applied to both end faces of the laminate 10. In this embodiment, the base electrode layers are baked layers. A conductive paste containing glass components and metal is applied to the laminate 10 by a method such as dipping. A baking process is then performed to form the base electrode layers. The temperature of this baking process is preferably 700°C to 900°C.

[0120] Furthermore, when firing the laminated chip before firing and the conductive paste applied to the laminated chip simultaneously, it is preferable to form the baked layer by baking a ceramic material added instead of the glass component. In this case, it is particularly preferable to use the same type of ceramic material as the dielectric layer 20 as the added ceramic material. In this case, the conductive paste is applied to the laminated chip before firing, and the laminated chip and the conductive paste applied to the laminated chip are fired simultaneously to form a laminate 10 with a baked layer.

[0121] Subsequently, a plating layer is formed on the surface of the base electrode layer. As a result, a capacitor element comprising a laminate 10 and an external electrode 40 is manufactured. In this embodiment, a first plating layer 60A is formed on the surface of the first base electrode layer 50A. Also, a second plating layer 60B is formed on the surface of the second base electrode layer 50B. In this embodiment, a Ni plating layer and a Sn plating layer are formed as the plating layers. When performing the plating process, either electrolytic plating or electroless plating may be used. However, electroless plating has the disadvantage of complicating the process because it requires pretreatment with a catalyst or the like to improve the plating deposition rate. Therefore, it is generally preferable to use electrolytic plating. The Ni plating layer and the Sn plating layer are formed sequentially, for example, by barrel plating.

[0122] When forming the base electrode layer as a thin film layer, masking or other methods are used to form the thin film layer as the base electrode layer in the area where the external electrode is to be formed. The thin film layer is formed by a thin film formation method such as sputtering or vapor deposition. The thin film layer is a layer of metal particles deposited on it that is 1.0 μm or less in thickness.

[0123] When a conductive resin layer is provided as the base electrode layer, the conductive resin layer may be arranged to cover the baking layer, or it may be placed directly on the laminate 10 without providing a baking layer. When a conductive resin layer is provided, a conductive resin paste containing a thermosetting resin and metal components is applied to the baking layer or the laminate 10, and then heat-treated at a temperature of 250 to 550°C or higher. This causes the thermosetting resin to heat-cur, forming a conductive resin layer. The atmosphere during this heat treatment is preferably an N2 atmosphere. Furthermore, to prevent resin scattering and oxidation of various metal components, the oxygen concentration is preferably 100 ppm or less.

[0124] Alternatively, the plating layer may be directly placed on the exposed portion of the internal electrode layer 30 of the laminate 10 without providing a base electrode layer. In this case, the first end face LS1 and the second end face LS2 of the laminate 10 are plated, and the plating layer is formed on the exposed portion of the internal electrode layer 30. Either electrolytic plating or electroless plating may be used for the plating process. However, electroless plating has the disadvantage of complicating the process because it requires pretreatment with a catalyst or the like to improve the plating deposition rate. Therefore, electrolytic plating is generally preferred. Barrel plating is preferred as the plating method. Furthermore, if necessary, the upper plating layer formed on the surface of the lower plating layer may be formed using the same method as the lower plating layer.

[0125] Next, a method for manufacturing a multilayer ceramic capacitor 1 having a hydrophilic portion 70 and a mesh-like hydrophobic portion 80 by forming a hydrophobic portion on the surface of a capacitor element manufactured by the method described above will be explained.

[0126] A water-repellent agent for forming hydrophobic areas is dissolved in a diluent solvent to prepare a water-repellent treatment solution. A container, such as a barrel containing multiple capacitor elements, is placed inside a drying oven. The temperature inside the drying oven is set according to the diluent solvent used to dilute the water-repellent agent.

[0127] While the container placed inside the drying oven is rotated, a water-repellent treatment solution is sprayed onto the capacitor elements. The diluent solvent evaporates, and the water-repellent component uniformly coats the surface of the capacitor elements, producing a multilayer ceramic capacitor 1 having a hydrophilic portion 70 and a mesh-like hydrophobic portion 80.

[0128] The spray weight of the water-repellent component per unit area of ​​the capacitor element may be, for example, 0.24 μg / cm² to 0.60 μg / cm², depending on the surface material of the capacitor element and the type of water-repellent agent.

[0129] The solvent retention rate is preferably 0.1% to 20.0% in order to form a mesh-like hydrophobic portion 80 on the surface of the laminate 10. The solvent retention rate refers to the ratio of the weight of the diluting solvent in the water-repellent treatment solution immediately after spraying (within 1 minute) to the weight of the diluting solvent in the water-repellent treatment solution before spraying it onto the capacitor element. The solvent retention rate can be adjusted by adjusting the temperature inside the drying oven, the mist diameter of the sprayed water-repellent treatment solution, and the rate at which the water-repellent treatment solution is delivered to the capacitor element. The higher the temperature inside the drying oven, the lower the solvent retention rate; the smaller the mist diameter, the lower the solvent retention rate; and the slower the delivery rate, the lower the solvent retention rate.

[0130] Alternatively, a multilayer ceramic capacitor 1 having a hydrophilic portion 70 and a mesh-like hydrophobic portion 80 may be manufactured by forming hydrophobic portions on the surface of the capacitor element using a dipping method or the like. Specifically, the capacitor element is immersed in a water-repellent agent to form hydrophobic portions on the entire surface of the capacitor element. The areas where hydrophilic portions are to be formed on the capacitor element, where hydrophobic portions are formed on the entire surface, are trimmed with a laser or the like. As a result of trimming, the surface of the capacitor element covered with hydrophobic portions is exposed, and the exposed areas become the hydrophilic portion 70 of the multilayer ceramic capacitor 1, while the untrimmed areas become the hydrophobic portion 80. Alternatively, the capacitor element may be immersed in a hydrophilic agent after trimming to form hydrophilic portions 70 only in areas where hydrophobic portions have not been formed. As a water-repellent agent, for example, a fluorine-based silane coupling agent can be used. As a hydrophilic agent, for example, a hydroxyl group-containing silane coupling agent can be used.

[0131] Through this manufacturing process, a multilayer ceramic capacitor 1 is produced.

[0132] Note that the configuration of the laminated structure 10 of the multilayer ceramic capacitor 1 is not limited to the configurations shown in Figures 1 to 5. For example, the multilayer ceramic capacitor 1 may be a double-gang, triple-gang, or quadruple-gang multilayer ceramic capacitor as shown in Figures 6A, 6B, and 6C.

[0133] The multilayer ceramic capacitor 1 shown in Figure 6A is a double-gang multilayer ceramic capacitor 1, and as an internal electrode layer 30, it includes a first internal electrode layer 33 and a second internal electrode layer 34, as well as a floating internal electrode layer 35 that is not led out to either the first end face LS1 or the second end face LS2. The multilayer ceramic capacitor 1 shown in Figure 6B is a triple-gang multilayer ceramic capacitor 1, which includes a first floating internal electrode layer 35A and a second floating internal electrode layer 35B as floating internal electrode layers 35. The multilayer ceramic capacitor 1 shown in Figure 6C is a quadruple-gang multilayer ceramic capacitor 1, which includes a first floating internal electrode layer 35A, a second floating internal electrode layer 35B, and a third floating internal electrode layer 35C as floating internal electrode layers 35. In this way, by providing floating internal electrode layers 35 as internal electrode layers 30, the multilayer ceramic capacitor 1 has a structure in which the opposing electrode portion is divided into multiple parts. As a result, multiple capacitor components are formed between the opposing internal electrode layers 30, and these capacitor components are connected in series. Therefore, the voltage applied to each capacitor component becomes lower, and the voltage rating of the multilayer ceramic capacitor 1 can be increased. It goes without saying that the multilayer ceramic capacitor 1 in this embodiment may also have a multi-gang structure of four or more units.

[0134] The multilayer ceramic capacitor 1 of this embodiment provides the following effects.

[0135] (1) The multilayer ceramic capacitor 1 of this embodiment has a plurality of stacked dielectric layers 20 and a plurality of stacked internal electrode layers 30, and a laminate 10 having a first main surface TS1 and a second main surface TS2 facing the height direction T, a first side surface WS1 and a second side surface WS2 facing the width direction W perpendicular to the height direction T, and a first end surface LS1 and a second end surface LS2 facing the length direction L perpendicular to the height direction T and the width direction W, a first base electrode layer 50A disposed on the first end surface LS1, and a first A multilayer ceramic capacitor 1 comprising: a first external electrode 40A having a plating layer 60A; a second external electrode 40B having a second base electrode layer 50B disposed on a second end face LS2; and a second plating layer 60B disposed on the outer surface side of the first base electrode layer 50A, wherein a plurality of internal electrode layers 30 are disposed on a plurality of dielectric layers 20 and have a first internal conductor layer 30A exposed on the first end face LS1; and a second internal conductor layer 30B is disposed on a plurality of dielectric layers 20 and has a second end face LS2; and the surface of the laminate 10 has a hydrophilic portion 70 and a hydrophobic portion 80 A hydrophilic portion 70 is formed on a part of the first main surface TS1 and has a first main surface side hydrophilic portion 71 having hydroxyl groups, a second main surface side hydrophilic portion 72 having hydroxyl groups formed on a part of the second main surface TS2, a first side surface side hydrophilic portion 73 having hydroxyl groups formed on a part of the first side surface WS1, and a second side surface side hydrophilic portion 74 having hydroxyl groups formed on a part of the second side surface WS2, and the hydrophobic portion 80 is formed on a part of the first main surface TS1 and contains at least one of fluorine, silicone, acrylic resin, and hydrocarbons and is formed in a mesh-like manner. The main surface side mesh-like hydrophobic portion 81, the second main surface side mesh-like hydrophobic portion 82 formed on a part of the second main surface TS2 and containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons and formed in a mesh-like manner, the first side mesh-like hydrophobic portion 83 formed on a part of the first side surface WS1 and containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons and formed in a mesh-like manner, the second side surface side mesh-like hydrophobic portion 83 formed on a part of the second side surface WS2 and containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons,Furthermore, it has a second side-side mesh-like hydrophobic portion 84 formed in a mesh-like manner.

[0136] A hydrophobic mesh-like portion 80 is formed together with the hydrophilic portion 70, which further enhances the water-repellent effect on the surface of the laminate 10 and suppresses the occurrence of electrochemical migration.

[0137] (2) In the multilayer ceramic capacitor 1 according to this embodiment, the ratio of the area of ​​the first main surface mesh-like hydrophobic portion 81 to the sum of the area of ​​the first main surface side hydrophilic portion 71 and the area of ​​the first main surface side mesh-like hydrophobic portion 81 formed between the first external electrode 40A and the second external electrode 40B on the first main surface TS1 is 30% or more and 56% or less, and the ratio of the area of ​​the second main surface side mesh-like hydrophobic portion 82 to the sum of the area of ​​the second main surface side hydrophilic portion 72 and the area of ​​the second main surface side mesh-like hydrophobic portion 82 formed between the first external electrode 40A and the second external electrode 40B on the second main surface TS2 is The ratio of the area of ​​the first side mesh-like hydrophobic portion 83 to the sum of the area of ​​the first side hydrophilic portion 73 and the area of ​​the first side mesh-like hydrophobic portion 83 formed between the first external electrode 40A and the second external electrode 40B on the first side surface WS1 is 30% to 56%, and the ratio of the area of ​​the second side mesh-like hydrophobic portion 84 to the sum of the area of ​​the second side hydrophilic portion 74 and the area of ​​the second side mesh-like hydrophobic portion 84 formed between the first external electrode 40A and the second external electrode 40B on the second side surface WS2 is 30% to 56%.

[0138] The water-repellent performance of the entire surface of the laminate 10 between the first external electrode 40A and the second external electrode 40B can be more effectively improved, and the occurrence of electrochemical migration can be further suppressed. In addition, the occurrence of adhesion between different multilayer ceramic capacitors 1 can be suppressed.

[0139] (3) In the multilayer ceramic capacitor 1 according to this embodiment, the hydrophobic portion 80 is formed to protrude in a direction away from the surface of the laminate 10 than the hydrophilic portion 70.

[0140] Since the hydrophobic portion 80 is formed in a mesh-like structure and protrudes from the surface, a microstructure with hydrophobic protrusions and hydrophilic recesses is formed on the surface of the laminate 10. This further enhances water repellency.

[0141] (4) In the multilayer ceramic capacitor 1 according to this embodiment, the amount of protrusion of the hydrophobic portion 80 relative to the hydrophilic portion 70 is 80 nm or more and 800 nm or less.

[0142] This method enhances water repellency while suppressing adhesion between different multilayer ceramic capacitors 1.

[0143] (5) In the multilayer ceramic capacitor 1 according to this embodiment, the hydrophobic portion 80 is made of a non-crosslinked resin.

[0144] This improves the heat resistance of the hydrophobic portion 80, which is a water-repellent film, and prevents a decrease in water repellency due to thermal decomposition.

[0145] (6) In the multilayer ceramic capacitor 1 according to this embodiment, the first main surface hydrophilic portion 71 has a plurality of first main surface island hydrophilic portions 711 scattered in an island-like manner, the first main surface mesh hydrophobic portion 81 is formed by a continuous body surrounding each of the plurality of first main surface island hydrophilic portions 711, the second main surface hydrophilic portion 72 has a plurality of second main surface island hydrophilic portions 721 scattered in an island-like manner, and the second main surface mesh hydrophobic portion 82 is formed by a continuous body surrounding each of the plurality of second main surface island hydrophilic portions 721 The first hydrophilic side portion 73 has a plurality of first hydrophilic island-like side portions 731 that are scattered in an island-like manner, and the first hydrophobic side mesh-like side portion 83 is formed by a continuous body that surrounds each of the plurality of first hydrophilic island-like side portions 731, and the second hydrophilic side portion 74 has a plurality of second hydrophilic island-like side portions 741 that are scattered in an island-like manner, and the second hydrophobic side mesh-like side portion 84 is formed by a continuous body that surrounds each of the plurality of second hydrophilic island-like side portions 741.

[0146] A network of hydrophobic portions 80 is formed on the surface of the laminate 10 along with a hydrophilic portion 70, thereby increasing the water repellency of the surface of the laminate 10.

[0147] <Experimental Examples> Next, we will describe experimental examples performed on the multilayer ceramic capacitor 1 according to this embodiment. In these experimental examples, a water repellency test and an adhesion test were performed.

[0148] According to the manufacturing method for spraying a water-repellent treatment solution onto the ceramic element described in the above embodiment, samples were manufactured in lots as the samples for Examples 1 to 4 and Comparative Examples 1 and 2, with the amount of water-repellent treatment solution sprayed adjusted so that the area ratio of the hydrophobic portion 80 differed. The samples within each lot were manufactured under the same manufacturing conditions. The dimensions of the multilayer ceramic capacitors in Examples 1 to 4 and Comparative Examples 1 and 2 are L dimension 3.41 mm, W dimension 2.58 mm, and T dimension 2.52 mm. The dielectric material is BaTiO ３ The following was used. The capacitance of each sample was 22 μF, and the internal electrode was Ni. Comparative Example 1 is a normal capacitor without a hydrophobic portion 80. Comparative Example 2 is a capacitor with a hydrophobic portion 80 arranged over the entire surface. The ceramic surface of the multilayer ceramic capacitor is the hydrophilic portion 70. The material of the hydrophobic portion 80 in Examples 1 to 4 and Comparative Example 2 is a fluorine-based non-crosslinked resin, and the thickness is 80 nm or more, within the range of 80 nm to 800 nm. The area ratio of the hydrophobic portion 80 is the average value of the area ratio of the first main surface side mesh-like hydrophobic portion 81, the area ratio of the second main surface side mesh-like hydrophobic portion 82, the area ratio of the first side side mesh-like hydrophobic portion 83, and the area ratio of the second side side mesh-like hydrophobic portion 84.

[0149] For each example and comparative example, n=3 samples for measuring the area ratio of the hydrophobic portion 80, n=10 samples for the water repellency test, and n=100 samples for the adhesion test were prepared from the same lot. The area ratio of the hydrophobic portion 80 was calculated using the measurement method described in the above embodiment. The specific test results for each example and comparative example are shown in Table 1 below. In measuring the area ratio of the hydrophobic portion 80 and the contact angle in the water repellency test, the average value of the measured values ​​of n samples was used as the test result.

[0150] <Water Repellency Test> Multilayer ceramic capacitors 1, which are samples from Examples 1 to 4 and Comparative Examples 1 and 2, were lined up on a plate, and pure water was dropped onto the central part of the ceramic capacitor surface using a contact angle meter, and the contact angle was measured. An average contact angle of 120° or more was judged as "◎", less than 120° and 110° or more as "〇", less than 110° and 100° or more as "△", and less than 100° as "×".

[0151] <Adhesion Test> In the adhesion test, the presence or absence of adhesion between different multilayer ceramic capacitors 1 after manufacturing was confirmed. For each example and comparative example, using n=100 samples, as an accelerated evaluation, two capacitors were intentionally dropped from a height of 1 cm while still attached to each other. The number of samples in which adhesion was confirmed to be maintained was judged as "◎", 1 to 4 as "〇", 5 to 20 as "△", and 21 or more as "×".

[0152]

[0153] Table 1 shows the measurement results of the hydrophobic area ratio, the amount of water-repellent treatment solution sprayed, the water-repellency evaluation results, the adhesion evaluation results, and the overall evaluation results for Examples 1 to 4 and Comparative Examples 1 and 2. In the overall evaluation, "◎", "〇", "△", and "×" are in that order of superiority, and the evaluation was based on whichever of the water-repellency evaluation or adhesion evaluation results was inferior. For example, if both the water-repellency evaluation and adhesion evaluation were "◎", the overall evaluation was judged as excellent "◎", and if either the water-repellency evaluation or adhesion evaluation was "×", the overall evaluation was judged as poor "×". Also, for example, if both the water-repellency evaluation and adhesion evaluation were "〇" or "◎", and included "〇", the overall evaluation was judged as good "〇".

[0154] According to Table 1, in the case of samples from Examples 1 to 4, where the area ratio of the hydrophobic portion 80 was 28% to 74%, the water repellency was improved compared to Comparative Examples 1 and 2, and the adhesion judgment results were also good. In particular, in the case of samples from Examples 2 and 3, where the area ratio of the hydrophobic portion 80 was 53% and 56%, respectively, the water repellency was good, and no adhesion was observed. On the other hand, in the case of the sample from Comparative Example 1, where the area ratio of the hydrophobic portion 80 was 0%, no adhesion occurred because there was no hydrophobic portion 80, but the water repellency was poor. Furthermore, in the case of the sample from Comparative Example 2, where the area ratio of the hydrophobic portion 80 was 100%, the water repellency was improved compared to Comparative Example 1, but it was not good, and adhesion was observed in many samples.

[0155] In the embodiments described above, a multilayer ceramic capacitor was given as an example, in which a dielectric layer 20 made of dielectric ceramic is used as the ceramic layer. However, the multilayer ceramic electronic components of this disclosure are not limited to this. For example, the ceramic electronic components of this disclosure can also be applied to various multilayer ceramic electronic components such as piezoelectric components using piezoelectric ceramic as the ceramic layer, thermistors using semiconductor ceramic as the ceramic layer, and inductors using magnetic ceramic as the ceramic layer. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics, examples of semiconductor ceramics include spinel ceramics, and examples of magnetic ceramics include ferrite and other ceramics. The effects of this disclosure can also be obtained with multilayer ceramic electronic components other than multilayer ceramic capacitors.

[0156] The present invention is not limited to the configuration of the above embodiments, and can be modified and applied as appropriate without altering the essence of the invention. Furthermore, a combination of two or more of the individual desirable configurations described in the above embodiments also constitutes the present invention.

[0157] 1 Multilayer ceramic capacitor 10 Laminate 11 Inner layer 12 First main surface side outer layer 13 Second main surface side outer layer 20 Dielectric layer (ceramic layer) 30 Internal electrode layer (internal conductor layer) 31 First internal electrode layer 32 Second internal electrode layer 40A First external electrode 40B Second external electrode 70 Hydrophilic part 71 First main surface side hydrophilic part 72 Second main surface side hydrophilic part 73 First side side hydrophilic part 74 Second side side hydrophilic part 711 First main surface side island-shaped hydrophilic part 721 Second main surface side island-shaped hydrophilic part 731 First side side island-shaped hydrophilic part 741 Second side side island-shaped hydrophilic part 80 Hydrophobic part 81 First main surface side mesh-like hydrophobic part 82 Second main surface mesh-like hydrophobic portion 83 First side surface mesh-like hydrophobic portion 84 Second side surface mesh-like hydrophobic portion L Length direction LS1 First end face LS2 Second end face T Height direction TS1 First main surface TS2 Second main surface W Width direction WS1 First side surface WS2 Second side surface

Claims

1. A multilayer ceramic capacitor comprising: a laminate having a plurality of stacked ceramic layers and a plurality of stacked internal conductor layers, and having a first main surface and a second main surface facing each other in the height direction, a first side surface and a second side surface facing each other in the width direction perpendicular to the height direction, and a first end surface and a second end surface facing each other in the length direction perpendicular to the height direction and the width direction; a first external electrode having a first base electrode layer disposed on the first end surface and a first plating layer disposed on the outer surface side of the first base electrode layer; and a second external electrode having a second base electrode layer disposed on the second end surface and a second plating layer disposed on the outer surface side of the first base electrode layer, wherein the plurality of internal conductor layers have: a first internal conductor layer disposed on the plurality of ceramic layers and exposed on the first end surface; and a second internal conductor layer disposed on the plurality of ceramic layers and exposed on the second end surface; and the surface of the laminate has a hydrophilic portion and a hydrophobic portion, the hydrophilic portion is The first main surface has a hydrophilic portion formed on a part of the first main surface and having hydroxyl groups, a second main surface has a hydrophilic portion formed on a part of the second main surface and having hydroxyl groups, a first side surface has a hydrophilic portion formed on a part of the first side surface and having hydroxyl groups, and a second side surface has a hydrophilic portion formed on a part of the second side surface and having hydroxyl groups, wherein the hydrophobic portion has a first main surface network hydrophobic portion formed on a part of the first main surface and containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons and formed in a network shape, and a second main surface network hydrophobic portion formed on a part of the second main surface and containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons and formed in a network shape, A multilayer ceramic electronic component having: a first side-side mesh-like hydrophobic portion formed on a part of the first side surface, containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons, and formed in a mesh-like manner; and a second side-side mesh-like hydrophobic portion formed on a part of the second side surface, containing at least one of fluorine, silicone, acrylic resin, and hydrocarbons, and formed in a mesh-like manner.

2. The ratio of the area of ​​the first main surface-side mesh-like hydrophobic portion to the sum of the area of ​​the first main surface-side hydrophilic portion and the area of ​​the first main surface-side mesh-like hydrophobic portion formed between the first external electrode and the second external electrode on the first main surface is 30% or more and 56% or less; The ratio of the area of ​​the second main surface-side mesh-like hydrophobic portion to the sum of the area of ​​the second main surface-side hydrophilic portion and the area of ​​the second main surface-side mesh-like hydrophobic portion formed between the first external electrode and the second external electrode on the second main surface is 30% or more and 56% or less; The ratio of the area of ​​the first side surface-side mesh-like hydrophobic portion to the sum of the area of ​​the first side surface-side hydrophilic portion and the area of ​​the first side surface-side mesh-like hydrophobic portion formed between the first external electrode and the second external electrode on the first side surface is 30% or more and 56% or less; The multilayer ceramic electronic component according to claim 1, wherein the ratio of the area of ​​the second side-side mesh-like hydrophobic portion to the sum of the area of ​​the second side-side hydrophilic portion and the area of ​​the second side-side mesh-like hydrophobic portion formed between the first external electrode and the second external electrode on the second side surface is 30% or more and 56% or less.

3. The multilayer ceramic electronic component according to claim 1 or 2, wherein the hydrophobic portion is formed to protrude in a direction away from the surface of the laminate than the hydrophilic portion.

4. The amount of the hydrophobic portion protruding from the hydrophilic portion is 80 nm or more and 800 nm or less, according to any one of claims 1 to 3.

5. The multilayer ceramic electronic component according to any one of claims 1 to 4, wherein the hydrophobic portion is made of a non-crosslinked resin.

6. The first main surface hydrophilic portion has a plurality of first main surface island-shaped hydrophilic portions scattered in an island-like manner, the first main surface mesh-like hydrophobic portion is formed by a continuous body surrounding each of the plurality of first main surface island-shaped hydrophilic portions, the second main surface hydrophilic portion has a plurality of second main surface island-shaped hydrophilic portions scattered in an island-like manner, the second main surface mesh-like hydrophobic portion is formed by a continuous body surrounding each of the plurality of second main surface island-shaped hydrophilic portions, the first side surface hydrophilic portion has a plurality of first side surface island-shaped hydrophilic portions scattered in an island-like manner, the first side surface mesh-like hydrophobic portion is formed by a continuous body surrounding each of the plurality of first side surface island-shaped hydrophilic portions, the second side surface hydrophilic portion has a plurality of second side surface island-shaped hydrophilic portions scattered in an island-like manner, The multilayer ceramic electronic component according to any one of claims 1 to 5, wherein the second side-side mesh-like hydrophobic portion is formed as a continuous body surrounding each of the plurality of second side-side island-like hydrophilic portions.

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