Recovery plate fixing device
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-07
- Publication Date
- 2026-08-13
Smart Images

Figure JP2025004233_13082026_PF_FP_ABST
Abstract
Description
Recovery Plate Fixing Device
[0001] This specification discloses a technology related to a recovery plate fixing device.
[0002] The connection part described in Patent Document 1 includes a second fixing part and a second fixed part. Thereby, when the second fixing part is fixed to the second fixed part, the connection part can restrict the movement of the recovery plate in the first direction (the moving direction of the squeegee) with respect to the lifting device.
[0003] International Publication No. 2021 / [215017]]
[0004] The recovery plate for recovering solder needs to be removed, for example, for cleaning, and is detachably attached to a lifting device that raises and lowers the recovery plate. In this mechanism, if the fixing part is not properly fixed to the fixed part, the recovery plate may fall off when the printing machine is driven and interfere with other members.
[0005] In view of such circumstances, this specification discloses a recovery plate fixing device capable of confirming the fixation between a recovery plate for recovering solder and a lifting device that raises and lowers the recovery plate.
[0006] This specification discloses a recovery plate fixing device including a fixing part, a fixed part, and a detection part. The fixing part is a part provided on a recovery plate for recovering solder and detachably attaches the recovery plate to a lifting device that raises and lowers the recovery plate. The fixed part is a part provided on the lifting device to which the fixing part is fixed. The detection part detects a fixed state in which the fixing part is fixed to the fixed part.
[0007] In addition, in this specification, in claim 9 described in the claims initially attached to the application (hereinafter referred to as the initial claims), the technical idea of changing "the recovery plate fixing device according to claim 1" to "the recovery plate fixing device according to any one of claims 1 to 8" is disclosed. Further, in this specification, in claim 11 described in the initial claims, the technical idea of changing "the recovery plate fixing device according to claim 1" to "the recovery plate fixing device according to any one of claims 1 to 10" is disclosed.
[0008] According to the above-described recovery plate fixing device, it is possible to detect the state in which the fixing part is fixed to the part to be fixed, and to confirm the fixing between the recovery plate and the lifting device.
[0009] This is a partial cross-sectional view showing an example of the configuration of a printing press. This is a plan view showing an example of the arrangement of the solder recovery device of the printing press in Figure 1. This is a perspective view showing an example of the configuration of the solder recovery device. This is a perspective view showing an example of the fixing part before the second fixing part is fixed. This is a perspective view showing an example of the fixing part when the second fixing part is fixed. This is a perspective view showing an example of the part to be fixed. This is a perspective view showing an example of the connection when the groove of the first fixing part is fitted with the first shaft of the first part to be fixed. This is a perspective view showing an example of the connection when the fitting part of the second fixing part is fitted with the second shaft of the second part to be fixed. This is a schematic diagram showing an example of the configuration of the recovery plate fixing device. This is a flowchart showing an example of control by the recovery plate fixing device. This is a view from the detection direction of the sensor in Figure 9, showing an example of the positional relationship between the fixing part and the part to be fixed when the detection unit does not detect the fixed state. This is a perspective view showing an example of the positional relationship between the fixing part and the part to be fixed when the detection unit detects the fixed state. This is a view from the detection direction of the sensor in Figure 12.
[0010] 1. Embodiment 1-1. Example of the configuration of the printing press WM1 The printing press WM1 prints solder SP0 onto the mounting positions of multiple components on the substrate CB0. In this embodiment, the printing press WM1 performs a printing process in which a squeegee 34 slides over the mask MK0 and prints solder SP0 onto the substrate CB0 through the opening H0 of the mask MK0.
[0011] As shown in Figure 1, the printing press WM1 of this embodiment includes two substrate transport devices 10, 10, two mask support devices 20, 20, a squeegee moving device 30, a control device 40, and two solder recovery devices 50, 50. In this specification, the transport direction of the substrate CB0 (the direction perpendicular to the plane of the paper in Figure 1) is defined as the X direction, the front-to-back direction of the printing press WM1 that is perpendicular to the X direction (the left-to-right direction on the plane of the paper in Figure 1) and is the printing direction is defined as the Y direction, and the vertical direction that is perpendicular to the X and Y directions (the up-and-down direction on the plane of the paper in Figure 1) is defined as the Z direction.
[0012] Each of the two substrate transport devices 10, 10 transports the substrate CB0 to be printed. The substrate CB0 is a circuit board on which various circuits such as electronic circuits, electrical circuits, and magnetic circuits are formed. The two substrate transport devices 10, 10 are installed on the base BS0 of the printing press WM1. Each of the two substrate transport devices 10, 10 transports the substrate CB0, for example, by a belt conveyor extending in the transport direction (X direction) of the substrate CB0.
[0013] Each of the two substrate transport devices 10, 10 is equipped with a substrate holding unit 11 for holding the substrate CB0 that has been loaded into the printing press WM1. The substrate holding unit 11 is located below the mask MK0 and is configured to be able to move up and down vertically (Z direction) by a linear motion mechanism such as a lead screw mechanism. Specifically, the substrate holding unit 11 is lowered when the substrate CB0 is being transported, and when the substrate CB0 is transported to a predetermined position, it rises together with the substrate CB0 and holds the substrate CB0 in close contact with the lower surface of the mask MK0.
[0014] Each of the two mask support devices 20, 20 is located above the substrate transport device 10. The mask support device 20 supports the mask MK0 with a pair of support bases. The pair of support bases are located on the left side (the back side of the paper in Figure 1, which is shown) and the right side (the front side of the paper in Figure 1, which is not shown) of the printing press WM1 when viewed from the front, and are formed to extend along the printing direction (Y direction).
[0015] Figure 1 is a partial cross-sectional view of the printing press WM1 cut along the printing direction (Y direction), schematically showing the interior of the printing press WM1 in a side view, and the cross-sections of the mask MK0 and substrate CB0. The mask MK0 has openings H0 that penetrate it at predetermined positions on the wiring pattern of the substrate CB0. The mask MK0 is supported by a mask support device 20, for example, via a frame member provided on its outer edge.
[0016] The squeegee moving device 30 raises and lowers the squeegee 34 in a vertical direction (Z direction) perpendicular to the mask MK0, and also moves the squeegee 34 on the upper surface of the mask MK0 in the printing direction (Y direction). The squeegee moving device 30 comprises a head drive device 31, a squeegee head 32, a pair of squeegee lifting devices 33, 33, and a pair of squeegees 34, 34. The head drive device 31 is located on the upper side of the printing press WM1. The head drive device 31 can move the squeegee head 32 in the printing direction (Y direction) by a linear motion mechanism such as a feed screw mechanism.
[0017] The squeegee head 32 is clamped and fixed to the moving body that constitutes the linear motion mechanism of the head drive unit 31. The squeegee head 32 holds a pair of squeegee lifting devices 33, 33. Each of the pair of squeegee lifting devices 33, 33 holds a squeegee 34 and can be driven independently of each other. Each of the pair of squeegee lifting devices 33, 33 drives an actuator, such as an air cylinder, to raise or lower the squeegee 34 it holds.
[0018] The squeegee 34 slides along the upper surface of the mask MK0, moving the solder SP0 supplied to the upper surface of the mask MK0 along the mask MK0. Solder SP0 can be solder paste. The solder SP0 is pressed into the substrate CB0 through the opening H0 of the mask MK0, printing the solder SP0 onto the substrate CB0 located on the lower side of the mask MK0. In this embodiment, each of the pair of squeegees 34, 34 is a plate-shaped member formed to extend along the transport direction (X direction) of the substrate CB0, which is perpendicular to the printing direction (Y direction).
[0019] The front squeegee 34 of the pair of squeegees 34, 34 (left side of the paper in Figure 1) is used in a printing process that moves solder SP0 from front to back, with the direction of travel being from front to back of the printing press WM1. The rear squeegee 34 of the pair of squeegees 34, 34 (right side of the paper in Figure 1) is used in a printing process that moves solder SP0 from back to front, with the direction of travel being from back to front of the printing press WM1. In addition, for both squeegees 34, the direction opposite to the direction of travel is the direction of reversal.
[0020] Each of the pair of squeegees 34, 34 is held in the squeegee lifting device 33 at an angle such that the front portion on the forward side faces downward. In other words, each of the pair of squeegees 34, 34 is held in the squeegee lifting device 33 at an angle such that the rear portion on the backward side faces upward. The inclination angle of each of the pair of squeegees 34, 34 can also be adjusted by an adjustment mechanism provided at the bottom of the squeegee lifting device 33.
[0021] The control device 40 is equipped with a known arithmetic unit and memory device, and a control circuit is configured. The control device 40 is communicatively connected to the management device and can send and receive various data with the management device. Based on the production program, detection results from various sensors, etc., the control device 40 can drive and control two substrate transport devices 10, 10, two mask support devices 20, 20, a squeegee moving device 30, and two solder recovery devices 50, 50.
[0022] The control device 40 is also equipped with a display device 41. The display device 41 can display the operating status of the printing press WM1. In this embodiment, the display device 41 is configured as a touch panel and also functions as an input device that accepts various operations from the operator. The control device 40 acquires various information stored in the storage device and detection results from various sensors provided on the printing press WM1. The storage device stores production programs for driving the printing press WM1, etc. For example, the control device 40 drives and controls the squeegee moving device 30.
[0023] The control device 40 sends a control signal to the squeegee moving device 30 based on the various information and detection results described above. This controls the position of the pair of squeegees 34, 34 held by the squeegee head 32 in the printing direction (Y direction) and the vertical direction (Z direction) (height), as well as the moving speed and tilt angle. As previously described, the pair of squeegees 34, 34 are driven and controlled to print solder SP0 onto the substrate CB0 located on the lower side of the mask MK0.
[0024] 1-2. Solder Recovery Device 50 1-2-1. Schematic of the Solder Recovery Device 50 As shown in Figures 1 and 2, the two solder recovery devices 50, 50 are provided at both ends of the mask MK0 in the printing direction (Y direction). Also, as shown in Figure 3, each of the two solder recovery devices 50, 50 is equipped with a recovery plate 60, at least one (two in this figure) lifting device 70, 70, and a plurality (two in this figure) of connection parts 100, 100 for each lifting device 70. Each of the plurality (two) of connection parts 100 (a total of four connection parts 100) is equipped with a fixing part 80 and a fixed part 90.
[0025] In Figures 1 and 2, the two solder recovery devices 50, 50, shown by solid lines, are located at both ends of the mask MK0 in the printing direction (Y direction) on the rear side of the printing press WM1 (right side of the paper in Figures 1 and 2). As shown in Figure 1, the squeegee 34 on the rear side of the printing press WM1 (right side of the paper in Figure 1) moves the solder SP0 from the rear to the front. Therefore, before the squeegee 34 starts moving, the solder SP0 is placed on the recovery plate 60 of the solder recovery device 50, shown by solid lines on the rear side of the printing press WM1 (right side of the paper in Figures 1 and 2).
[0026] From this state, as the squeegee 34 moves in the direction of travel (from the rear to the front of the printing press WM1), the solder SP0 moves onto the mask MK0 and the printing process is executed. When the printing process is completed, the solder SP0 is moved by the squeegee 34 to the collection plate 60 of the solder recovery device 50, which is shown by the solid line on the front side of the printing press WM1 (left side of the paper in Figures 1 and 2).
[0027] As shown in Figure 2, the printing press WM1 is equipped with a pair of drive units 51, 51. The pair of drive units 51, 51 can move (slide) the two solder recovery devices 50, 50 in the printing direction (Y direction) while maintaining the relative position of the two solder recovery devices 50, 50, using a linear motion mechanism such as a lead screw mechanism. In Figures 1 and 2, the two solder recovery devices 50, 50 shown by dashed lines are shown by the pair of drive units 51, 51, indicating that the two solder recovery devices 50, 50 shown by solid lines have been moved to both ends of the mask MK0 in the printing direction (Y direction) on the front side (left side of the paper in Figures 1 and 2) of the printing press WM1.
[0028] As shown in Figure 3, each of the two solder recovery devices 50, 50 is equipped with two lifting devices 70, 70. Before the pair of drive devices 51, 51 move (slide) the two solder recovery devices 50, 50 in the printing direction (Y direction), the two lifting devices 70, 70 raise the recovery plate 60 to the state shown in Figure 3. When the two solder recovery devices 50, 50 are moved (slid) in the printing direction (Y direction), the two lifting devices 70, 70 lower the recovery plate 60 to position it at the same height as the mask MK0.
[0029] As shown in Figure 1, the squeegee 34 at the front of the printing press WM1 (left side of the page in Figure 1) moves the solder SP0 from the front to the rear. As the squeegee 34 moves in the direction of travel (from the front to the rear of the printing press WM1), the solder SP0 moves onto the mask MK0 and the printing process is executed. When the printing process is completed, the solder SP0 is moved by the squeegee 34 to the recovery plate 60 of the solder recovery device 50, which is shown by the dashed line at the rear of the printing press WM1 (right side of the page in Figures 1 and 2).
[0030] In Figures 1 and 2, the two solder recovery devices 50, 50 shown by dashed lines are moved in the printing direction (Y direction) by a pair of drive devices 51, 51 to the positions of the two solder recovery devices 50, 50 shown by solid lines. By repeating the above process, the printing press WM1 can perform printing on the two substrates CB0 being transported by the two substrate transport devices 10.
[0031] 1-2-2. Example of the configuration of the solder recovery device 50 As shown in Figure 3, the solder recovery device 50 comprises a recovery plate 60, at least one (two in the figure) lifting devices 70, 70, and a plurality (two in the figure) of connection parts 100, 100 for each lifting device 70.
[0032] The recovery plate 60 recovers the solder SP0. The recovery plate 60 is formed in a plate shape so as to extend along the transport direction (X direction) of the substrate CB0 which is perpendicular to the printing direction (Y direction). The recovery plate 60 has an inclined portion 60a on the side onto which the solder SP0 is transferred by the squeegee 34 (the side facing the mask MK0). The inclined portion 60a is inclined at a predetermined angle with respect to the horizontal plane formed by the transport direction (X direction) and the printing direction (Y direction) of the substrate CB0, making it easier for the solder SP0 to be transferred to the recovery plate 60 compared to a case without the inclined portion 60a.
[0033] The lifting device 70 raises and lowers the recovery plate 60. The lifting device 70 only needs to be able to raise and lower the recovery plate 60 and can take various forms. For example, the lifting device 70 can move the recovery plate 60 vertically (in the Z direction) by a linear motion mechanism such as a cylinder. Specifically, as shown in Figure 3, the lifting device 70 comprises a main body 71 and a lifting unit 72 that moves up and down relative to the main body 71. The recovery plate 60 is detachably attached to the lifting unit 72 via a plurality (two) of connecting parts 100, 100.
[0034] Each of the multiple (two) connecting parts 100, 100 is provided with a fixing part 80 and a fixed part 90, and when the fixing part 80 is fixed to the fixed part 90, it restricts the movement of the recovery plate 60 in a predetermined direction relative to the lifting device 70. The fixing part 80 is a part provided on the recovery plate 60 for recovering solder SP0, and the recovery plate 60 is detachably attached to the lifting device 70 that raises and lowers the recovery plate 60. The fixed part 90 is a part provided on the lifting device 70, to which the fixing part 80 is fixed.
[0035] Here, as shown in Figure 3, the direction of movement of the squeegee 34 that moves the solder SP0 is defined as the first direction (Y direction). The direction of up and down movement of the recovery plate 60 is defined as the second direction (Z direction). Furthermore, the direction perpendicular to the first direction (Y direction) and the second direction (Z direction) is defined as the third direction (X direction). In addition, the fixing part 80 provided on one of the multiple (two) connecting parts 100, 100 is defined as the first fixing part 81, and the part 90 to which the first fixing part 81 is fixed is defined as the first fixed part 91. Furthermore, the fixing part 80 provided on the other connecting part 100 of the multiple (two) connecting parts 100, 100 is defined as the second fixing part 82, and the part 90 to which the second fixing part 82 is fixed is defined as the second fixed part 92.
[0036] In this embodiment, the connecting portion 100, which includes a first fixing portion 81 and a first fixed portion 91, restricts the movement of the retrieval plate 60 in a second direction (Z direction) and a third direction (X direction) relative to the lifting device 70 when the first fixing portion 81 is fixed to the first fixed portion 91. Furthermore, the connecting portion 100, which includes a second fixing portion 82 and a second fixed portion 92, restricts the movement of the retrieval plate 60 in a first direction (Y direction) relative to the lifting device 70 when the second fixing portion 82 is fixed to the second fixed portion 92. Thus, the multiple (two) connecting portions 100, 100 restrict the movement of the retrieval plate 60 relative to the lifting device 70 in different directions.
[0037] As shown in Figures 4 and 5, the first fixing portion 81 comprises a rising portion 81a, a groove portion 81b, a protruding portion 81c, and a support portion 81d. The rising portion 81a extends upward from the recovery plate 60 in the second direction (Z direction). The groove portion 81b is formed in a U shape and extends along the first direction (Y direction) in the rising portion 81a. The protruding portion 81c protrudes outward from the tip portion 81a1 of the rising portion 81a toward the recovery plate 60. The support portion 81d supports the second fixing portion 82.
[0038] The second fixing portion 82 is formed in an L-shape. The second fixing portion 82 comprises an extension portion 82a and a gripping portion 82b. The extension portion 82a extends along the second direction (Z direction). The gripping portion 82b protrudes outward from the upper end portion 82a1 of the extension portion 82a toward the recovery plate 60, making it possible for an operator to grip it. The second fixing portion 82 is provided to be movable in the second direction (Z direction) by passing through the protruding portion 81c and the support portion 81d.
[0039] For example, an operator can grasp the gripping portion 82b and move the second fixing portion 82 in the second direction (Z direction). Figure 4 shows the state of the second fixing portion 82 before it is fixed to the second fixed portion 92. Figure 5 shows the state of the second fixing portion 82 when it is fixed to the second fixed portion 92.
[0040] As shown in Figure 6, the first fixed portion 91 and the second fixed portion 92 are provided on the lifting portion 72. The first fixed portion 91 comprises a first shaft portion 91a and a first flange portion 91b. The first shaft portion 91a extends from the lifting portion 72 along the third direction (X direction). The first flange portion 91b is provided at the end of the first shaft portion 91a opposite to the lifting portion 72. The groove portion 81b of the first fixed portion 81 fits with the first shaft portion 91a.
[0041] For example, an operator can grasp the gripping portions 82b, which are provided at both ends 60e, 60e of the recovery plate 60, as shown in Figure 4, and engage the groove portion 81b of the first fixing portion 81 with the first shaft portion 91a of the first fixed portion 91. Figure 7 shows an example of the connection portion 100 when the groove portion 81b of the first fixing portion 81 is engaged with the first shaft portion 91a of the first fixed portion 91. Since the first fixed portion 91 of this embodiment is equipped with a first flange portion 91b, the groove portion 81b is guided to the first shaft portion 91a by the first flange portion 91b, making the operator's work easier.
[0042] Further, the groove portion 81b is formed in a U shape, and restricts the movement of the recovery plate 60 in the second direction (Z direction) while allowing the movement of the recovery plate 60 in the first direction (Y direction). Specifically, as shown in FIG. 4, the groove portion 81b is formed to extend along the first direction (Y direction), and the movement of the recovery plate 60 in the first direction (Y direction) is allowed. Further, the groove width (length in the Z direction) of the groove portion 81b is formed to be capable of fitting with the first shaft portion 91a, and when the groove portion 81b fits with the first shaft portion 91a, the movement of the recovery plate 60 in the second direction (Z direction) is restricted.
[0043] Further, when the groove portion 81b fits with the first shaft portion 91a, the movement of the recovery plate 60 in the third direction (X direction) is restricted by the elevating portion 72 and the first flange portion 91b. Thus, in the solder recovery device 50 of the embodiment, when the groove portion 81b of the first fixing portion 81 fits with the first fixed portion 91 (in the embodiment, the first shaft portion 91a), the movement of the recovery plate 60 in the second direction (Z direction) and the third direction (X direction) is restricted.
[0044] As shown in FIG. 6, the second fixed portion 92 includes a second shaft portion 92a and a second flange portion 92b. The second shaft portion 92a extends coaxially with the first shaft portion 91a from the first flange portion 91b of the first fixed portion 91 along the third direction (X direction). The second flange portion 92b is provided at the end of the second shaft portion 92a on the side opposite to the first flange portion 91b. As shown in FIGS. 4 and 5, the second fixing portion 82 includes a fitting portion 82c that fits with the second shaft portion 92a.
[0045] For example, after the operator fits the groove portion 81b of the first fixing portion 81 with the first shaft portion 91a of the first fixed portion 91, the operator moves the gripping portion 82b downward in the second direction (Z direction) to move the second fixing portion 82 downward in the second direction (Z direction). Thereby, the second fixing portion 82 changes from the state shown in FIG. 4 to the state shown in FIG. 5. Thus, the operator can use the gripping portion 82b to fit the fitting portion 82c of the second fixing portion 82 with the second shaft portion 92a of the second fixed portion 92.
[0046] FIG. 8 shows an example of the connection portion 100 when the fitting portion 82c of the second fixing portion 82 is fitted to the second shaft portion 92a of the second fixed portion 92. In the embodiment, since the first fixed portion 91 includes the first flange portion 91b and the second fixed portion 92 includes the second flange portion 92b, the fitting portion 82c of the second fixing portion 82 is guided by the first flange portion 91b and the second flange portion 92b, facilitating the work of the operator. Further, since the second fixing portion 82 includes the gripping portion 82b, the operator can perform the work by gripping the gripping portion 82b, facilitating the work of the operator.
[0047] Thus, the second fixing portion 82 is fitted to the second fixed portion 92 (the second shaft portion 92a in the embodiment) via the first fixing portion 81, and the movement of the recovery plate 60 in the first direction (Y direction) is further restricted. That is, when the first fixing portion 81 of the embodiment is fixed to the first fixed portion 91, the movement of the recovery plate 60 with respect to the lifting device 70 is restricted in the second direction (Z direction) and the third direction (X direction) among the first direction (Y direction), the second direction (Z direction), and the third direction (X direction). Further, when the second fixing portion 82 is fixed to the second fixed portion 92, the movement of the recovery plate 60 with respect to the lifting device 70 is restricted in the remaining direction (the first direction (Y direction)) among the first direction (Y direction), the second direction (Z direction), and the third direction (X direction).
[0048] 1-3. Recovery Plate Fixing Device 200 The recovery plate 60 for recovering the solder SP0 needs to be removed, for example, for cleaning, and is detachably attached to the lifting device 70 that raises and lowers the recovery plate 60. As described above, in this specification, the above-described detaching mechanism is referred to as the solder recovery device 50. However, in the solder recovery device 50, if the fixing portion 80 is not properly fixed to the fixed portion 90, the recovery plate 60 may fall off when the printing machine WM1 is driven, possibly interfering with other members.
[0049] Therefore, a recovery plate fixing device 200 is provided. The recovery plate fixing device 200 can detect the state in which the fixing part 80 is fixed to the fixed part 90, and can confirm the fixing between the recovery plate 60 and the lifting device 70. Specifically, the recovery plate fixing device 200 comprises a fixing part 80, a fixed part 90, and a detection part SR0. The recovery plate fixing device 200 may also include a control unit CP0. As shown in Figure 9, the recovery plate fixing device 200 of the embodiment comprises a fixing part 80, a fixed part 90, a detection unit SR0, and a control unit CP0.
[0050] The detection unit SR0 and the control unit CP0 can be installed in various control devices such as the control device 40 of the printing press WM1, and various management devices such as management devices for managing substrate work machines such as the printing press WM1. For example, at least one of the detection unit SR0 and the control unit CP0 can be installed in the control device 40 of the printing press WM1. At least one of the detection unit SR0 and the control unit CP0 can also be formed on the cloud. At least one of the detection unit SR0 and the control unit CP0 can also be distributed across various control devices, various management devices, the cloud, etc. In this embodiment, as shown in Figure 9, the detection unit SR0 and the control unit CP0 are installed in the control device 40 of the printing press WM1.
[0051] Furthermore, the recovery plate fixing device 200 can be controlled according to the flowchart shown in Figure 10. The detection unit SR0 performs the judgment and processing shown in steps S11 to S13. The control unit CP0 performs the processing shown in steps S14 and S15. The matters described herein can be selected and applied as appropriate. Furthermore, the matters described herein can be combined as appropriate. Moreover, the matters described herein can be modified as appropriate.
[0052] 1-3-1. Fixing part 80, fixed part 90, and detection unit SR0 As previously described, the fixing part 80 is a part provided on the recovery plate 60 for recovering solder SP0, and the recovery plate 60 is detachably attached to a lifting device 70 that raises and lowers the recovery plate 60. The fixed part 90 is a part provided on the lifting device 70, and the fixing part 80 is fixed to it. The detection unit SR0 detects the fixed state in which the fixing part 80 is fixed to the fixed part 90.
[0053] The fixing part 80 and the fixed part 90 can be any of the above-mentioned parts and can take various forms. Similarly, the detection unit SR0 only needs to be able to detect the fixed state and can take various forms. For example, when the fixing part 80 is fixed to the fixed part 90 by an operator, the fixing part 80 may not be properly fixed to the fixed part 90. Therefore, it is desirable for the detection unit SR0 to detect the fixed state in which the fixing part 80 is fixed to the fixed part 90 by an operator. Specifically, as shown in Figures 11 and 13, the fixing part 80 may include an extension part 82a and a gripping part 82b.
[0054] As previously described, the extension portion 82a refers to the portion that extends along the vertical direction (second direction (Z direction)) of the recovery plate 60. The gripping portion 82b refers to the portion that protrudes outward from the upper end portion 82a1 of the extension portion 82a toward the recovery plate 60 and is a portion that can be gripped by an operator. In other words, the fixing portion 80 in this configuration corresponds to the second fixing portion 82 described above. Also, the fixed portion 90 corresponds to the second fixed portion 92 described above. As shown in Figures 11 and 13, in this configuration, the extension portion 82a may include a detected portion SD0 that is detected by the detection portion SR0 when the plate is fixed.
[0055] The extended portion 82a shown in Figures 11 and 13 has a portion on the upper end 82a1 side that protrudes toward the sensor (for example, proximity sensor SR1 or laser sensor SR2) compared to the extended portion 82a shown in Figures 4 and 5. The portion to be detected SD0 is formed on the protruding part of the extended portion 82a. The detection unit SR0 can detect the fixed state using various known sensors. For example, the detection unit SR0 can detect the fixed state using the proximity sensor SR1.
[0056] The proximity sensor SR1 detects a fixed state when the detected part SD0 is included in its detection range, and does not detect a fixed state when the detected part SD0 is not included in its detection range. For example, Figures 9 and 11 show an unfixed state where the fixed part 80 is not fixed to the fixed part 90. In this case, as shown in Figure 11, the detected part SD0 is located above the detection range of the proximity sensor SR1 and is not included in the detection range (case No in step S11 shown in Figure 10). Therefore, in this case, the detection unit SR0 does not detect a fixed state (step S13).
[0057] In contrast, Figures 12 and 13 show a fixed state in which the fixing part 80 is fixed to the part to be fixed 90. In this case, as shown in Figure 13, the part to be detected SD0 is located within the detection range of the proximity sensor SR1 and is included in the detection range (if the answer is Yes in step S11). This figure is viewed from the direction of sensor detection, and the detection range of the proximity sensor SR1 is opposite to the part to be detected SD0. Therefore, in this case, the detection unit SR0 detects the fixed state (step S12).
[0058] The detection unit SR0 can also detect the fixed state using the laser sensor SR2. The laser sensor SR2 detects the fixed state when the laser light is blocked by the detected part SD0, and does not detect the fixed state when the laser light is not blocked by the detected part SD0. In the unfixed state, as shown in Figure 11, the detected part SD0 is located above the detection range (laser light irradiation range) of the laser sensor SR2, and the laser light is not blocked by the detected part SD0. Therefore, in this case, the detection unit SR0 does not detect the fixed state.
[0059] In contrast, in the fixed state, as shown in Figure 13, the detected part SD0 is located within the detection range (laser beam irradiation range) of the laser sensor SR2, and the laser beam is blocked by the detected part SD0. Therefore, in this case, the detection unit SR0 detects the fixed state. Thus, the detection unit SR0 can detect the fixed state using the laser sensor SR2 in the same way as when using the proximity sensor SR1. In other words, when using the laser sensor SR2, the determination of whether the detected part SD0 is included in the detection range in step S11 of Figure 10 can be reinterpreted as the determination of whether the laser beam is blocked by the detected part SD0.
[0060] The detection unit SR0 can also detect the fixed state using a mechanical sensor such as a limit switch. In this case, for example, the limit switch can be configured to be OFF in the unfixed state and ON by the detected part SD0 in the fixed state. Alternatively, the detection unit SR0 can also detect the fixed state using an image sensor. In this case, for example, the detection unit SR0 can capture an image of the detected part SD0 from the direction shown in Figures 11 and 13, process the image, and recognize the position of the detected part SD0.
[0061] Furthermore, the detection unit SR0 can detect a fixed state when the recognized object to be detected SD0 is in a fixed position (the position shown in Figure 13), and can not detect a fixed state when the recognized object to be detected SD0 is in an unfixed position (the position shown in Figure 11). In this way, the detection unit SR0 can detect a fixed state using various known sensors.
[0062] Furthermore, in any of the embodiments described above, the fixing portion 80 can be fixed to the fixed portion 90 by moving a predetermined amount L0 relative to the fixed portion 90. In this case, the detection unit SR0 detects the fixed state when the amount of movement of the fixing portion 80 relative to the fixed portion 90 reaches the predetermined amount L0. For example, as described above, the fixing portion 80 may include an extension portion 82a and a gripping portion 82b. The extension portion 82a and the gripping portion 82b are formed in an L-shape.
[0063] In this configuration, for example, the operator can grasp the gripping part 82b and move the fixing part 80 along the vertical direction (second direction (Z direction)) of the recovery plate 60, as shown in Figures 11 and 13. Then, as shown in Figures 11 and 13, the operator can move the fixing part 80 by a predetermined amount L0 relative to the part to be fixed 90 and fix it to the part to be fixed 90. The amount of movement of the fixing part 80 relative to the part to be fixed 90 in the unfixed state shown in Figure 11 is set to zero. The amount of movement of the fixing part 80 relative to the part to be fixed 90 in the fixed state shown in Figure 13 is set to a predetermined amount L0.
[0064] However, in this configuration, the fixing portion 80 may not be properly fixed to the fixed portion 90. For example, the extension portion 82a shown in Figures 11 and 13 is equipped with a fitting portion 82c, similar to the extension portion 82a shown in Figures 4 and 5. The fitting portion 82c is a part provided on the lower end 82a2 side of the extension portion 82a, and is formed in a U-shape so as to be movable by a predetermined amount L0 along the vertical direction (second direction (Z direction)) of the recovery plate 60. In other words, as shown in Figures 5, 11, and 13, the length dimension of the fitting portion 82c in the vertical direction (second direction (Z direction)) of the recovery plate 60 is set to a predetermined amount L0. The fixed portion 90 is equipped with a fitting portion 92c. The fitting portion 82c fits into the fitting portion 92c when it is fixed. The previously described second shaft portion 92a corresponds to the fitting portion 92c.
[0065] In Figures 9 and 11-13, the solder recovery device 50 shown on the left side of the page represents one of the pair of solder recovery devices 50, 50 described above. Similarly, the solder recovery device 50 shown on the right side of the page in Figures 9 and 11-13 represents the other solder recovery device 50 of the pair of solder recovery devices 50, 50 described above. For example, to prevent an operator from mistakenly using the fixing part 80 intended for one solder recovery device 50 on the other solder recovery device 50, the width dimensions of the fitting part 82c and the fitted part 92c may differ between the pair of solder recovery devices 50, 50.
[0066] In this case, even if a worker mistakenly attempts to fix the fixing part 80, which should not be used, to the part to be fixed 90, the fixing part 80 will not be fixed to the part to be fixed 90, but will merely rest on the part to be fixed 90. In this case, it is difficult for the worker to visually recognize that the fixing part 80 is not fixed to the part to be fixed 90, and there is a possibility that the fixing part 80 will not be properly fixed to the part to be fixed 90. Therefore, it is preferable for the detection unit SR0 to detect the fixed state when the amount of movement of the fixing part 80 relative to the part to be fixed 90 reaches a predetermined amount L0. The detection unit SR0 can detect the fixed state when the amount of movement of the fixing part 80 relative to the part to be fixed 90 reaches a predetermined amount L0, regardless of which sensor is used.
[0067] As shown in Figures 9 and 12, in all the embodiments described above, the fixing portion 80 and the fixed portion 90 are provided at both ends 60e, 60e in the longitudinal direction of the recovery plate 60, respectively. The lifting device 70 is also provided at both ends 60e, 60e in the longitudinal direction of the recovery plate 60, respectively. Therefore, the recovery plate fixing device 200 can detect the fixed state at both ends 60e, 60e in the longitudinal direction of the recovery plate 60. The solder recovery device 50 can also fix the recovery plate 60 to the lifting device 70 at only one end in the longitudinal direction of the recovery plate 60. In this case, the recovery plate fixing device 200 can detect the fixed state at one end in the longitudinal direction of the recovery plate 60.
[0068] 1-3-2. Control Unit CP0 In any of the embodiments described above, the recovery plate fixing device 200 may include a control unit CP0. The control unit CP0 can perform various controls on the printing press WM1 based on the detection result of the detection unit SR0. For example, when the detection unit SR0 detects that the plate is fixed, the control unit CP0 allows the start of the printing process to print solder SP0 onto the substrate CB0 (step S14 shown in Figure 10). Specifically, as described above, the control unit CP0 can drive and control the squeegee moving device 30 to start the printing process.
[0069] In response to this, the control unit CP0 restricts the start of the printing process if the detection unit SR0 does not detect a fixed state (step S15). Specifically, the control unit CP0 can stop the driving of the squeegee moving device 30. In this way, the control unit CP0 can suppress the detachment of the recovery plate 60 when the printing press WM1 is driven if the fixing part 80 is not properly fixed to the fixed part 90, and can suppress interference with other members caused by the detachment of the recovery plate 60.
[0070] The control unit CP0 can also guide the operator to fix the fixing part 80 to the part to be fixed 90 if the detection unit SR0 does not detect a fixed state (step S15). The control unit CP0 only needs to be able to provide the above guidance to the operator and can take various forms. For example, the printing press WM1 is equipped with a display device 41. The control unit CP0 can provide the above guidance to the display device 41. Alternatively, the control unit CP0 can provide the above guidance to a portable terminal carried by the operator. In either case, the operator can check the fixed state of the fixing part 80 and the part to be fixed 90 and properly fix the fixing part 80 to the part to be fixed 90.
[0071] 2. An example of the effects of the embodiment: With the recovery plate fixing device 200, it is possible to detect the fixed state in which the fixing part 80 is fixed to the fixed part 90, and to confirm the fixing between the recovery plate 60 and the lifting device 70.
[0072] 60: Recovery plate, 60e, 60e: Both ends, 70: Lifting device, 80: Fixing part, 82a: Extending part, 82a1: Upper end, 82a2: Lower end, 82b: Gripping part, 82c: Fitting part, 90: Fixed part, 92c: Fitted part, 200: Recovery plate fixing device, SR0: Detection part, SR1: Proximity sensor, SR2: Laser sensor, SD0: Detected part, CP0: Control unit, SP0: Solder, CB0: Substrate, L0: Determined amount.
Claims
1. A solder collection plate fixing device comprising: a fixing part provided on a solder collection plate for detachably attaching the collection plate to a lifting device for raising and lowering the collection plate; a fixed part provided on the lifting device for fixing the fixing part; and a detection part for detecting a fixed state in which the fixing part is fixed to the fixed part.
2. The recovery plate fixing device according to claim 1, wherein the detection unit detects the fixing state in which the fixing unit is fixed to the fixed unit by an operator.
3. The recovery plate fixing device according to claim 2, wherein the fixing portion comprises an extending portion that extends along the vertical direction of the recovery plate, and a gripping portion that protrudes outward from the upper end of the extending portion toward the recovery plate and can be grasped by the operator, and the extending portion comprises a detectable portion that is detected by the detection unit in the fixed state.
4. The recovery plate fixing device according to claim 3, wherein the detection unit detects the fixing state when the part to be detected is included in the detection range, and detects the fixing state using a proximity sensor that does not detect the fixing state when the part to be detected is not included in the detection range.
5. The recovery plate fixing device according to claim 3, wherein the detection unit detects the fixing state when the laser light is blocked by the part to be detected, and detects the fixing state using a laser sensor that does not detect the fixing state when the laser light is not blocked by the part to be detected.
6. The recovery plate fixing device according to any one of claims 1 to 5, wherein the fixing part is fixed to the part to be fixed by moving it by a predetermined amount relative to the part to be fixed, and the detection part detects the fixed state when the amount of movement of the fixing part relative to the part to be fixed reaches the predetermined amount.
7. The recovery plate fixing device according to claim 6, wherein the fixing portion comprises an extending portion that extends along the vertical direction of the recovery plate, and a gripping portion that protrudes outward from the upper end of the extending portion toward the recovery plate and can be grasped by an operator, and the extending portion and the gripping portion are formed in an L shape.
8. The recovery plate fixing device according to claim 7, wherein the extension portion is a portion provided on the lower end side of the extension portion and is formed in a U-shape so as to be movable by a predetermined amount along the vertical direction of the recovery plate, and the fixed portion is a fixed portion into which the fitting portion fits when the fixed state is reached.
9. The recovery plate fixing device according to claim 1, further comprising a control unit that allows the start of a printing process for printing the solder onto the substrate when the fixing state is detected by the detection unit, and restricts the start of the printing process when the fixing state is not detected by the detection unit.
10. The recovery plate fixing device according to claim 9, wherein the control unit guides the operator to fix the fixing unit to the fixed part when the detection unit does not detect the fixed state.
11. The recovery plate fixing device according to claim 1, wherein the fixing part and the fixed part are provided at both ends in the longitudinal direction of the recovery plate, and the lifting device is provided at both ends in the longitudinal direction of the recovery plate.