Resin material supply mechanism, resin molding device, and manufacturing method

Abstract

A resin material supply mechanism supplies a resin material to a cavity by using a planar member, and comprises: an inner frame part (61) that has a vertically penetrating through-hole (63) and that, by coming into contact with the planar member and by the through-hole (63) and the planar member, forms a space into which the resin material is charged; an outer frame part (62) that supports the inner frame part on the inner surface so as to be able to move up and down; and a dust suppression part (70) that suppresses entry of dust into a gap between the inner frame part (61) and the outer frame part (62). (Representative drawing) FIG. 6

Description

Resin Material Supply Mechanism, Resin Molding Apparatus, and Manufacturing Method ,

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[0001] The present disclosure relates to a resin material supply mechanism, a resin molding apparatus, and a manufacturing method.

[0002] Conventionally, there has been a resin molding apparatus that uses a resin molding technique by a compression molding method (compression mold method). As a conventional resin molding apparatus, for example, as described in Patent Document 1, there is one that supplies a resin material to a cavity formed in a lower mold and coated with a release film, heats and melts it to generate molten resin.

[0003] In such a resin molding apparatus, a release film is coated on an X - Y table, a resin supply mechanism having a resin material storage frame is placed on the release film, and a resin material is supplied to a space formed by a through - hole provided in the resin material storage frame and the release film. Here, the resin material storage frame has an outer frame portion (referred to as "peripheral portion" in Patent Document 1) and an inner frame portion (referred to as "elevating member" in Patent Document 1) that is supported by the outer frame portion so as to be able to move up and down. The inner frame portion is configured to contact the release film when it freely falls. With this configuration, the lower surface of the inner frame portion and the release film are in close contact, and it is prevented that the resin material enters between the lower surface of the resin material storage frame and the upper surface of the release film. In this state, the resin supply mechanism is transported onto the cavity together with the release film and the resin material, and the resin material is supplied to the cavity.

[0004] Japanese Patent Application Laid - Open No. 2015 - 222760

[0005] In such a resin supply mechanism, a gap is formed so as to penetrate from the upper surface to the lower surface of the outer frame portion and the inner frame portion. In the conventional resin supply mechanism, there is a possibility that dust enters the gap between the outer frame portion and the inner frame portion, and the entered dust passes through the gap between the outer frame portion and the inner frame portion and falls below the conveyance path of the resin material storage frame.

[0006] Therefore, an object of the present invention is to provide a resin material supply mechanism, a resin molding apparatus, and a manufacturing method that can reduce dust falling below the conveyance path of the resin material storage frame.

[0007] One embodiment of the cutting apparatus according to the present disclosure is a resin material supply mechanism for supplying resin material to a cavity using a planar member, comprising: an inner frame portion having a through hole that penetrates vertically and contacting the planar member to form a space into which the resin material is fed by the through hole and the planar member; an outer frame portion that supports the inner frame portion on its inner surface so as to be able to move up and down; and a dust suppression portion that suppresses the intrusion of dust into the gap between the inner frame portion and the outer frame portion.

[0008] One embodiment of the resin molding apparatus according to the present disclosure comprises the above-described resin material supply mechanism, an upper mold, a lower mold provided opposite to the upper mold, the cavity provided in the lower mold, and a mold clamping mechanism for clamping a mold having at least the upper mold and the lower mold, wherein the resin material supply mechanism supplies the resin material to the cavity using the planar member.

[0009] One embodiment of the manufacturing method according to this disclosure is a method for manufacturing a resin molded product using the resin molding apparatus described above, comprising the steps of supplying the resin material to the planar member and supplying the resin material to the cavity using the planar member.

[0010] This is a schematic diagram representing a resin molding apparatus. This is a diagram illustrating the coating process and contact process in the resin supply module. This is a diagram illustrating the loading process and transport process in the resin supply module. This is a diagram illustrating the operation of supplying resin material to the lower mold cavity in the resin molding module. This is a diagram illustrating the resin sealing operation in the resin molding module. This is a plan view showing the configuration of the dust suppression unit. This is a diagram showing the configuration of a resin material supply mechanism in another embodiment. This is a diagram showing the configuration of a resin material supply mechanism in another embodiment.

[0011] The embodiments of the resin material supply mechanism, resin molding apparatus, and method for manufacturing resin molded products according to this disclosure will be described in detail below with reference to the drawings. The embodiments described below are illustrative examples for explaining the resin material supply mechanism, resin molding apparatus, and method for manufacturing resin molded products, and do not limit the resin material supply mechanism, resin molding apparatus, and method for manufacturing resin molded products to these embodiments only. Therefore, the resin material supply mechanism, resin molding apparatus, and method for manufacturing resin molded products according to this disclosure can be implemented in various forms without departing from the gist of the disclosure.

[0012] A substrate (molded object) on which a semiconductor chip (hereinafter sometimes referred to as "chip") is fixed is used as an electronic component (resin molded product) by resin encapsulation. Technologies for resin encapsulating substrates include the compression method (compression molding) and the transfer method. One example of the compression method is a resin encapsulation method in which liquid resin or granular resin is supplied to a release film, the release film is placed on the lower mold of the molding die, and the object to be molded is immersed in the molten liquid resin or granular resin on the release film to perform resin molding. Examples of electronic elements other than semiconductor chips include resistors and capacitors.

[0013] [Configuration of the Resin Molding Apparatus] Figure 1 shows a schematic diagram of the resin molding apparatus 1. The resin molding apparatus 1 in this embodiment employs a compression method and comprises a resin supply module 2, a plurality of (three in this embodiment) resin molding modules 3, a substrate supply module 4, and a control unit 5. The resin supply module 2, the plurality of resin molding modules 3, and the substrate supply module 4 can each be attached or detached independently. In this embodiment, the resin molding module 3 is composed of three modules, but it may be composed of two or fewer modules or four or more modules, and the optimal number can be appropriately selected according to the production quantity. In Figure 1, the Z direction is the vertical direction of the resin molding apparatus 1, the arrangement direction of the resin supply module 2, resin molding modules 3, and substrate supply module 4 is the X direction, and the direction perpendicular to the X and Z directions (the depth direction of each module) is the Y direction. In the X, Y, and Z directions shown in Figure 1, the directions indicated by the arrows are the +X, +Y, and +Z directions, respectively, while the directions opposite to those indicated by the arrows are the -X, -Y, and -Z directions.

[0014] The control unit 5 includes a processor such as a CPU (Central Processing Unit) and a memory device such as RAM (Random Access Memory). The control unit 5 controls the operation of the resin molding apparatus 1 by executing a control program stored in the memory device using the processor. Unless otherwise specified, the operation of the resin molding apparatus 1 described below is performed based on operation commands from the control unit 5. In the following description, the operation commands of the control unit 5 will generally not be explained, and will be described as necessary.

[0015] The substrate supply module 4 is provided with a pre-molded substrate supply unit 41 for supplying pre-molded substrates Sa, a molded substrate storage unit 42 for storing molded substrates Sb (an example of the "resin molded product" of the present invention), a substrate placement unit 43 for transferring pre-molded substrates Sa and molded substrates Sb, and a substrate transport mechanism 44 for transporting pre-molded substrates Sa and molded substrates Sb. The substrate placement unit 43 moves in the Y direction within the substrate supply module 4. The substrate transport mechanism 44 moves in the X and Y directions within the substrate supply module 4 and the resin molding module 3, respectively.

[0016] Each of the three resin molding modules 3 is provided with a vertically movable lower mold LM and an upper mold UM positioned opposite the lower mold LM. The upper mold UM and lower mold LM are included in the molding die M. Each of the resin molding modules 3 has a mold clamping mechanism 35 (circular portion shown by the dashed line) for clamping and unclapping the upper mold UM and the lower mold LM. The lower mold LM and the upper mold UM are moved relative to each other by the mold clamping mechanism 35 to clamp and unclap. The lower mold LM has a lower mold cavity MC (corresponding to the "cavity" of the present invention) into which a release film F (an example of the "planar member" of the present invention) and resin material R (see Figure 3) are supplied. The unmolded substrate Sa becomes a molded substrate Sb by being resin-sealed with the resin material R.

[0017] The resin supply module 2 includes an X-Y table 21, a release film supply mechanism 22 for supplying release film F onto the X-Y table 21, a cleaning mechanism 23 for cleaning the lower and inner surfaces of the resin material storage frame 60 (which will be described later), a resin storage section 24 containing the resin material storage frame 60 and the release film F, a storage frame transport mechanism 25 for transporting the resin material storage frame 60, a loading mechanism 26 for loading resin material R into the resin storage section 24, and a resin transport mechanism 27 for transporting the resin storage section 24 or the resin material storage frame 60. The X-Y table 21 moves in the X and Y directions within the resin supply module 2.

[0018] [Configuration of the Resin Material Supply Mechanism] Next, the configuration of the resin material supply mechanism 6, which supplies resin material R to the release film F used in resin molding, will be explained. As shown in the upper and lower figures of Figure 2, the resin material supply mechanism 6 has a resin material storage frame 60. The resin material storage frame 60 has an inner frame portion 61 and an outer frame portion 62. The inner frame portion 61 is made of a metal material and has a through hole 63 that penetrates vertically. The outer frame portion 62 is made of a metal material and has a holding portion 64 on its lower surface for holding the release film F.

[0019] A lower edge portion 61a is formed on the edge portion of the lower end of the inner frame portion 61 that is on the side of the through hole 63. The lower edge portion 61a extends downward from the portion of the lower end of the inner frame portion 61 other than the portion where the lower edge portion 61a is formed. With this configuration, the lower end of the lower edge portion 61a becomes the lower end of the inner frame portion 61. The inner surface of the through hole 63 is preferably processed to create fine irregularities on the surface, for example by blasting, or coated, in order to make it difficult for dust to adhere, but is not limited to this.

[0020] In this embodiment, the outer circumferential surface of the inner frame portion 61 is provided with a recess 65 that is recessed inward along its entire circumference. The inner circumferential surface of the outer frame portion 62 is provided with a protrusion 66 that extends along its entire circumference toward the recess 65 of the inner frame portion 61. The recess 65 is configured to allow the protrusion 66 to fit into it. The inner frame portion 61 is supported by the outer frame portion 62 when the protrusion 66 fits into the recess 65. Here, the vertical length of the protrusion 66 is shorter than the distance from the top surface to the bottom surface of the recess 65. In other words, the protrusion 66 is configured to be movable vertically within the space from the top surface to the bottom surface of the recess 65. With this configuration, the outer frame portion 62 supports the inner frame portion 61 so that it can move up and down on its inner surface. In addition, in this embodiment, a groove 67 is formed in the protrusion 66 that extends along the outer circumferential surface of the inner frame portion 61. A cylindrical roller 68 extending in the direction of extension of the groove 67 is provided in the groove 67, with the roller 68 fitting into the groove 67. The groove 67 and roller 68 are configured such that a portion of the roller 68 protrudes from the groove 67, and the portion of the roller 68 protruding from the groove 67 contacts the outer frame 62. With this configuration, as the convex portion 66 moves vertically relative to the concave portion 65, the roller 68 rotates around an axis extending in the direction of extension, allowing the inner frame 61 to move smoothly up and down relative to the outer frame 62. Furthermore, because a portion of the roller 68 protrudes from the groove 67, it is possible to maintain a state where the vertically extending surface of the convex portion 66 and the vertically extending surface of the concave portion 65 are separated, thereby avoiding damage caused by friction between them, and allowing the inner frame 61 to move more smoothly up and down relative to the outer frame 62.

[0021] As shown in the upper part of Figure 2, when the inner frame portion 61 moves downward relative to the outer frame portion 62, the height position of the lower surface of the inner frame portion 61 is configured to be lower than the height position of the lower surface of the outer frame portion 62 where the holding portion 64 is provided. With this configuration, as shown in the lower part of Figure 2 and Figure 3, when the release film F is adhering to the lower surface of the outer frame portion 62, the inner frame portion 61 moves downward relative to the outer frame portion 62 due to its own weight, and the lower surface of the inner frame portion 61 comes into contact with the upper surface of the release film F. Because the inner frame portion 61 is configured to be able to come into contact with the release film F in this way, the lower surface of the inner frame portion 61 and the release film F come into close contact. When the inner frame portion 61 is in contact with the release film F, the space surrounded by the through hole 63 of the inner frame portion 61 and the release film F is configured as a resin material storage portion S into which the resin material R is introduced. Here, the release film F is made of a deformable film material. When the release film F is held on the lower surface of the outer frame portion 62, the upper surface of the portion of the release film F surrounded by the through holes 63 of the inner frame portion 61 is flat.

[0022] As shown in the upper part of Figure 3, the resin material storage section S is provided with an input mechanism 26 for introducing the resin material R. In this embodiment, granular resin material R is used, but other types of resins such as powder, granular, paste, or liquid resins at room temperature can also be used.

[0023] [Configuration of the Dust Suppression Unit] As shown in Figures 2 and 3, the resin material supply mechanism 6 further has a dust suppression unit 70 that suppresses the intrusion of dust into the gap G between the inner frame 61 and the outer frame 62. In this embodiment, the dust suppression unit 70 has a cover 71 that covers the gap G between the inner frame 61 and the outer frame 62 from above. Because the upper end of the gap G is covered by the cover 71, it becomes difficult for dust to enter the gap G. This makes it possible to prevent dust that enters the gap G and passes through the gap G downwards from falling from the lower end of the gap G. As a result, it is possible to reduce the amount of dust that falls below the transport path of the resin material storage frame 60. As shown in Figure 6, in this embodiment, the cover 71 is composed of two members. The two members are each composed of a U-shape in plan view, and the two members are combined to form a rectangular frame. In this embodiment, the two components are made of plate-shaped metal members, but they are not limited to this, and may be made of, for example, resin members or glass members.

[0024] The two lids 71 ​​are fastened and fixed to the upper surface of the outer frame 62 with a plurality of bolts Bo. As shown in Figures 2 and 3, the upper end portion of the inner frame 61 has an upper edge 61b which is the edge on the through hole 63 side, and a stepped portion 61c which has a surface located below the upper surface of the upper edge 61b. The lid 71 is configured to cover the area above the gap G between the inner frame 61 and the outer frame 62, and above the stepped portion 61c of the inner frame 61.

[0025] Furthermore, a dust collection section 72 is provided in the portion of the inner frame 61 above the recess 65, and is configured to accommodate dust that has entered the gap G between the inner frame 61 and the outer frame 62. As shown in Figure 6, in this embodiment, the dust collection section 72 is made up of a groove surrounding the outer circumference of the through hole 63 in the inner frame 61. With this configuration, dust that enters from between the inner frame 61 and the lid 71 is contained in the dust collection section 72. In this embodiment, as shown in Figure 2, the dust collection section 72 is formed on the upper surface of the stepped portion 61c of the inner frame 61. In other words, the dust collection section 72 is formed in a portion of the inner frame 61 that is located on the upper edge 61b side of the gap G between the inner frame 61 and the outer frame 62. That is, the dust collection section 72 is located in the middle of the path that dust that enters from between the upper edge 61b and the lid 71 will take towards the gap G. As a result, dust that enters between the lid 71 and the inner frame 61 is contained (falls) into the dust collection section 72, making it difficult for dust to reach the gap G. This configuration reduces the amount of dust that enters the gap G that falls below the transport path of the resin material storage frame 60. In addition, since it is difficult for dust to reach the gap G, dust is less likely to adhere to the roller 68.

[0026] [Operation of the Resin Material Supply Mechanism] Referring to Figures 2 to 4, the operation of supplying resin material R to the lower mold cavity MC using the resin material supply mechanism 6 will be described. Figures 2 and 3 describe the operation of supplying resin onto the release film F in the resin supply module 2. The upper part of Figure 2 shows the coating process. In the coating process, the long release film F supplied from the release film supply mechanism 22 (see Figure 1) is coated onto the X-Y table 21. After coating with the release film F, the release film F is adsorbed onto the X-Y table 21 by an adsorption mechanism (not shown). The release film F is cut, leaving only the necessary portion of the release film F.

[0027] Furthermore, the resin material storage frame 60 is moved above the X-Y table 21 and stopped using the storage frame transport mechanism 25. This movement of the resin material storage frame 60 may be performed simultaneously with the coating process, or before and after the coating process. At this time, the upper surface of the recess 65 of the inner frame portion 61 is in contact with the upper surface of the convex portion 66 of the outer frame portion 62, and the inner frame portion 61 is in its lowest position relative to the outer frame portion 62. Furthermore, the lower surface (lower end) of the lid 71 is located at a lower height than the upper surface (upper end) of the upper edge portion 61b of the inner frame portion 61. In this embodiment, the edge of the lid 71 facing the upper edge portion 61b is configured to be able to contact the upper edge portion 61b. Such a configuration is preferable in that it can reduce the intrusion of dust between the lid 71 and the upper edge portion 61b, but it is not limited to this. For example, the edge facing the upper edge portion 61b may be configured to be separated from the upper edge portion 61b. After the coating process, a contact process is carried out.

[0028] The lower diagram in Figure 2 shows the contact process. In the contact process, the storage frame transport mechanism 25 lowers the resin material storage frame 60 toward the X-Y table 21. As the resin material storage frame 60 descends, the lower surface of the inner frame portion 61 first comes into contact with the release film F. As the resin material storage frame 60 descends further, the outer frame portion 62 descends. At this time, since the descent of the inner frame portion 61, which is in contact with the release film F, has stopped, the upper surface of the convex portion 66 of the outer frame portion 62 separates from the upper surface of the concave portion 65 of the inner frame portion 61 and descends relative to the inner frame portion 61. As the resin material storage frame 60 descends further, the lower surface of the outer frame portion 62 comes into contact with the release film F, and the descent of the resin material storage frame 60 ends here. At this time, in this embodiment, the surface of the lid 71 facing the upper surface of the stepped portion 61c is configured to come into contact with the upper surface of the stepped portion 61c. Such a configuration is preferable in that it can reduce the intrusion of dust between the lid 71 and the stepped portion 61c, but it is not limited to this. For example, a configuration in which there is a gap between the surface facing the upper surface of the stepped portion 61c and the upper surface of the stepped portion 61c may be used. After the contact process, the resin injection process is carried out.

[0029] The upper diagram of Figure 3 shows the resin input process. Here, the resin material containment frame 60 is placed on the release film F, so that the lower opening of the through hole 63 of the inner frame portion 61 is covered from below by the release film F. As a result, the space surrounded by the through hole 63 of the inner frame portion 61 and the release film F becomes the resin material containment section S into which the resin material R is input. In the resin input process, a predetermined amount of resin material R is input into the resin material containment section S from the input mechanism 26. In this embodiment, granular resin is used as the resin material R. After the resin input process, a conveying process is carried out. Dust contains, for example, resin with a particle size that is sufficiently smaller than that of granular resin. In this case, a lot of dust floats around while the resin material R is being input from the input mechanism 26.

[0030] The lower diagram in Figure 3 shows the transport process. In the transport process, first, the suction of the release film F by the X-Y table 21 is released. Furthermore, the release film F is sucked up using the holding part 64 provided on the outer frame part 62 of the resin material containment frame 60, causing the release film F to adhere to the lower surface of the outer frame part 62. In this state, the resin transport mechanism 27 lifts and raises the resin containment part 24. As the resin containment part 24 rises, the inner frame part 61 moves relative to the outer frame part 62 along the inner surface of the outer frame part 62 by its own weight. The inner frame part 61 moves relative to the outer frame part 62 until the lower end of the lower edge part 61a contacts the release film F, and then stops. The resin material R is transported on top of the release film F while remaining contained in the area surrounded by the through hole 63 of the inner frame part 61, i.e., in the resin material containment part S. In this configuration, the inner frame portion 61 prevents the resin material R from moving outward (towards the outer frame portion 62) from the resin material storage portion S. In other words, while the lower surface of the inner frame portion 61 and the release film F are in close contact, it is possible to prevent the resin material R from entering between the lower surface of the inner frame portion 61 and the upper surface of the release film F. Therefore, the resin material R stored in the resin material storage portion S can be transported stably by the resin transport mechanism 27 without the resin material R adhering to the lower surface of the inner frame portion 61. During the transport process, the resin material R is transported toward the lower mold cavity MC.

[0031] Figure 4 illustrates the operation of supplying resin material R to the lower mold cavity MC of the resin molding module 3. The upper part of Figure 4 shows the resin lowering process. First, as shown in the upper part of Figure 4, the resin transport mechanism 27 is used to move the resin containment section 24 to a predetermined position on the lower mold LM and stop it. In this state, the weight of the inner frame 61 pushes the release film F and the resin material R downward by a predetermined distance. The lower mold LM is provided with a lower mold cavity MC to which the resin material R and the release film F are supplied. Here, the lower mold LM has a base block LM1, a frame-shaped side block LM2 provided on the base block LM1, and a cavity block LM3 arranged inside the side block LM2. The lower mold cavity MC is composed of the side block LM2 and the cavity block LM3. The lower edge 61a of the inner frame 61 of the lower mold cavity MC is formed to a size that can be inserted into the lower mold cavity MC.

[0032] The middle diagram in Figure 4 shows the resin supply process. In the resin supply process, the resin material R is supplied into the lower mold cavity MC. The resin transport mechanism 27 lowers the resin storage section 24, supplying the release film F and the resin material R together into the lower mold cavity MC. When the lower surface of the inner frame section 61, excluding the lower edge 61a, and the lower surface of the outer frame section 62 come into contact with the upper surface of the side block LM2, the descent of the resin storage section 24 stops. Here, the depth d1 of the lower mold cavity MC is configured to be deeper (longer) than the difference d2 between the contact position where the lower end of the lower edge 61a of the inner frame section 61 and the release film F come into contact, and the height position of the holding section 64. Therefore, the part of the release film F on which the resin material R is placed is separated from the bottom surface of the lower mold cavity MC (the upper surface of the cavity block LM3). This configuration makes it possible to prevent the resin material R from melting due to the high heat of the cavity block LM3 while it is in contact with the resin material housing frame 60 (inner frame portion 61), and to prevent the molten resin material R from adhering to the resin material housing frame 60 (inner frame portion 61).

[0033] The lower diagram of Figure 4 shows the resin heating process. The suction by the holding part 64 provided on the outer frame portion 62 of the resin material containment frame 60 is stopped, releasing the suction of the release film F from the outer frame portion 62, and the release film F is sucked up by the suction part 31 provided on the lower mold LM. At this time, the release film F, which had been separated from the bottom surface of the lower mold cavity MC (the upper surface of the cavity block LM3), is held in the lower mold LM so that it comes into contact with the bottom surface of the lower mold cavity MC. As a result, the resin material R is heated by the cavity block LM3 heated by a heater (not shown). In addition, the suction of the release film F from the outer frame portion 62 is released, and the resin material containment frame 60 is raised by the resin transport mechanism 27. The release film F and resin material R remain in the lower mold LM and the lower mold cavity MC. In other words, the resin material R on top of the release film F is supplied to the lower mold cavity MC. The resin transport mechanism 27 places the raised resin material storage frame 60 on a table (not shown) of the resin supply module 2. The resin material storage frame 60 placed on the table is used for the subsequent supply process of the resin material R.

[0034] Figure 5 illustrates the configuration of the mold M in the resin molding module 3 and the operation of resin sealing. The upper part of Figure 5 shows the pre-molding substrate lowering process. A pre-molding substrate Sa, on which chips and the like are fixed, is attached to the lower surface of the upper mold UM, which is positioned opposite the lower mold LM. A sealing member or the like may be provided between the lower surface of the upper mold UM and the upper surface of the lower mold LM to isolate the lower mold cavity MC from the outside air when the mold is clamped.

[0035] The lower diagram of Figure 5 shows the mold clamping process. The upper mold UM and lower mold LM are heated by a heater (not shown), and the temperatures of the upper mold UM and lower mold LM are maintained at a constant temperature, for example, 185 degrees. The thermosetting resin material R supplied to the lower mold cavity MC is heated by the lower mold LM, and the resin material R becomes molten. The mold clamping mechanism 35 (see Figure 1) clamps the upper mold UM and lower mold LM, which are the molding molds M. In this embodiment, the mold is clamped by the lower mold LM rising. Specifically, as the lower mold LM rises, the unmolded substrate Sa comes into contact with the side block LM2. As the lower mold LM rises further, resisting the biasing force of the spring member Sp, the chips etc. fixed to the unmolded substrate Sa are immersed in the molten resin material R in the lower mold cavity MC. With the molds clamped in this manner, the upper mold UM and lower mold LM continuously heat the molten resin material R, causing the molten resin material R in the lower mold cavity MC to harden. In other words, with the pre-molding substrate Sa and the release film F containing the resin material R placed between the upper mold UM and lower mold LM, the mold M is clamped and resin-sealed. As a result, the chips and the like fixed to the pre-molding substrate Sa are resin-sealed by the resin material R in the lower mold cavity MC, becoming the molded substrate Sb (see Figure 1). Resin molding is achieved by resin sealing.

[0036] [Alternative Embodiments] The following are examples of alternative embodiments that modify the above embodiments.

[0037] (1) In the above embodiment, the outer circumferential surface of the inner frame portion 61 is provided with a recess 65 that is recessed inward, and the inner circumferential surface of the outer frame portion 62 is provided with a protrusion 66 that protrudes toward the recess 65 of the inner frame portion 61. However, the present invention is not limited to the above embodiment. For example, as shown in Figure 7, the inner frame portion 61 may be provided with a protrusion 81 that protrudes toward the outer frame portion 62, and the outer frame portion 62 may be provided with a recess 82 into which the protrusion 81 can be inserted.

[0038] (2) In the above embodiment, the dust containment portion 72 was described as being formed on the upper surface of the stepped portion 61c of the inner frame portion 61, but the present invention is not limited to the above embodiment. For example, as shown in Figure 8, it may be formed on the upper surface of the protrusion 66 of the outer frame portion 62. Alternatively, the dust containment portion 72 may be formed on the surface of the outer frame portion 62 that is in contact with the lower surface of the lid 71. Furthermore, the dust containment portion 72 may be formed on both the inner frame portion 61 and the outer frame portion 62.

[0039] (3) In the above embodiment, the lid 71 was described as being fastened and fixed to the upper surface of the outer frame 62 with bolts Bo, but the present invention is not limited to the above embodiment. For example, the lid 71 may be fastened and fixed to the upper surface of the inner frame 61 with bolts Bo.

[0040] (4) The present invention has been described using as an example a configuration in which the lid 71 is composed of two members and two lids 71 ​​are combined to form a rectangular frame, but the present invention is not limited to the above embodiment. For example, the lid 71 may be composed of one rectangular frame, or it may be composed of three or more members.

[0041] (5) In the above embodiment, the lid 71 was described as being provided so as to surround the outer circumference of the through hole 63 as shown in Figure 6, but the present invention is not limited to the above embodiment. For example, the lid 71 may be provided only on the portion of the inner frame portion 61 that extends along the long side shown in Figure 6, or it may be provided only on the portion of the inner frame portion 61 that extends along the short side.

[0042] (6) In the above embodiment, the outer peripheral surface of the inner frame portion 61 is provided with a recess 65 that recesses inward over the entire circumference, and the inner peripheral surface of the outer frame portion 62 is provided with a convex portion 66 that protrudes toward the recess 65 of the inner frame portion 61 over the entire circumference. However, the present invention is not limited to the above embodiment. The recess 65 may be provided only on a part of the outer peripheral surface of the inner frame portion 61, and the convex portion 66 may be provided only on a part of the inner peripheral surface of the outer frame portion 62. For example, the recess 65 and the convex portion 66 may be provided only on the portion extending along the long side of the inner frame portion 61 and the outer frame portion 62 shown in FIG. 6, or may be provided only on the portion extending along the short side of the inner frame portion 61 and the outer frame portion 62.

[0043] (7) In the above embodiment, the dust storage portion 72 is described by taking as an example the configuration formed by a groove surrounding the outer periphery of the through hole 63 in the inner frame portion 61. However, the present invention is not limited to the above embodiment. For example, the dust storage portion 72 may be provided only on the portion extending along the long side of the inner frame portion 61 shown in FIG. 6, or may be provided only on the portion extending along the short side of the inner frame portion 61. Further, the dust storage portion 72 may be formed by a bowl-shaped depression that recesses downward, or may be formed by a cylindrical hole.

[0044] (8) In the above embodiment, in the covering step and the contact step, the resin material storage frame 60 is conveyed using the storage frame conveying mechanism 25, and in the conveying step, the resin dropping step, the resin supply step, and the resin heating step, the resin storage portion 24 or the resin material storage frame 60 is conveyed using the resin conveying mechanism 27. However, the present invention is not limited to the above embodiment, and in any step, the resin storage portion 24 or the resin material storage frame 60 may be conveyed using the same conveying device.

[0045] (9) In the above-described embodiment, the resin housing portion 24 has been described by taking as an example the configuration including the resin material housing frame 60 and the release film F. However, in addition to the resin material housing frame 60 and the release film F, a configuration including a flat heat radiating plate (an example of the "plane member" of the present invention) may be adopted. In this case, the resin material housing frame 60 holds the heat radiating plate on the lower surface. The resin material housing frame 60 holding the heat radiating plate is placed on the release film F. As a result, the heat radiating plate is disposed on the release film F, and the resin material housing frame 60 is disposed on the heat radiating plate. Thus, the resin housing portion 24 is realized using the resin material housing frame 60, the release film F, and the heat radiating plate. In this case, the resin material R is supplied onto the heat radiating plate. The lower mold LM of the molding die M is clamped in a state where the release film F, the heat radiating plate, and the resin material R are placed thereon. The heat radiating plate is made of, for example, a metal having a high thermal conductivity. In the molded substrate Sb, the heat radiating plate is exposed, and the heat generated in the molded substrate Sb is radiated through the heat radiating plate. In the configuration in which the resin housing portion 24 is realized using the resin material housing frame 60, the release film F, and the heat radiating plate, the heat radiating plate functions as a plane member.

[0046] (10) In the above-described embodiment, the configuration in which the inner frame portion 61 is provided with the groove portion 67 and the roller 68 has been described by taking as an example. However, the present invention is not limited to the above-described embodiment. For example, as shown in FIG. 8, a configuration in which the outer frame portion 62 is provided with the groove portion 67 and the roller 68 may be adopted, or a configuration not provided with the groove portion 67 and the roller 68 may be adopted.

[0047] Incidentally, the configurations disclosed in the above-described embodiments (including other embodiments, the same applies hereinafter) can be applied in combination with the configurations disclosed in other embodiments as long as no contradiction occurs. Further, the embodiments disclosed in this specification are examples, and the embodiments of the present invention are not limited thereto, and can be appropriately modified within the scope not departing from the object of the present invention.

[0048] [Outline of the Above Embodiment] Hereinafter, an outline of the resin material supply mechanism (6), the resin molding apparatus (1), and the manufacturing method described in the above-described embodiment will be described.

[0049] <1> One embodiment of the resin material supply mechanism (6) is a resin material supply mechanism (6) that supplies resin material (R) to a cavity (MC) using a planar member (F), and comprises: an inner frame portion (61) having a through hole (63) that penetrates vertically and contacting the planar member (F) to form a space into which the resin material (R) is fed by the through hole (63) and the planar member (F); an outer frame portion (62) that supports the inner frame portion (61) on its inner surface so as to be able to move up and down; and a dust suppression portion (70) that suppresses the intrusion of dust into the gap (G) between the inner frame portion (61) and the outer frame portion (62).

[0050] In the resin material supply mechanism (6) of this embodiment, a dust suppression unit (70) is provided to suppress the intrusion of dust into the gap (G) between the inner frame (61) and the outer frame (62). The gap (G) between the inner frame (61) and the outer frame (62) of such a resin material supply mechanism (6) is formed to penetrate from the upper surface to the lower surface of the inner frame (61) and the outer frame (62). Therefore, by providing the dust suppression unit (70), it is possible to reduce the amount of dust that enters the gap (G) between the inner frame (61) and the outer frame (62). As a result, it is possible to reduce the amount of dust passing through the gap (G) and the amount of dust that falls below the transport path of the resin material storage frame (60), making it possible to prevent the area below the transport path from becoming dirty.

[0051] <2> In the resin material supply mechanism (6) described in <1> above, the dust suppression section (70) preferably has a cover (71) that covers the gap (G) between the inner frame section (61) and the outer frame section (62) from above.

[0052] According to this, the dust suppression section (70) is composed of a cover (71) that covers the gap (G) between the inner frame (61) and the outer frame (62) from above. This simple structure of a cover (71) makes it possible to reduce the amount of dust that enters the gap (G) between the inner frame (61) and the outer frame (62), and is useful in reducing the number of man-hours and costs of installing the cover (71).

[0053] <3> In the resin material supply mechanism (6) described in <1> or <2> above, it is preferable that a dust collection section (72) is provided in either the inner frame section (61) or the outer frame section (62) or both, and is configured to contain dust.

[0054] According to this, for example, dust that enters the gap (G) between the inner frame (61) and the outer frame (62) can be contained in the dust containment section (72). This configuration makes it possible to reduce dust that heads towards the gap (G) and dust that passes through the gap (G). As a result, it is possible to reduce the amount of dust that passes through the gap (G) and reduce the amount of dust that falls below the transport path of the resin material containment frame (60).

[0055] <4> In the resin material supply mechanism (6) described in <3> above, the outer frame portion (62) has a protrusion (66) that protrudes toward the inner frame portion (61), the inner frame portion (61) has a recess (65) into which the protrusion (66) can fit, and the dust collection portion (72) is provided in the portion of the inner frame portion (61) above the recess (65), and when the upper surface of the protrusion (66) is in contact with the upper surface of the recess (65), it is preferable that the lower end of the dust suppression portion (70) is located at a height lower than the upper end of the inner frame portion (61).

[0056] According to this, a simple configuration in which the protrusion (66) of the outer frame (62) fits into the recess (65) of the inner frame (61) makes it possible to realize a configuration in which the outer frame (62) supports the inner frame (61) so that it can move up and down. Here, when the upper surface of the protrusion (66) is in contact with the upper surface of the recess (65), the inner frame (61) is in the lowest position relative to the outer frame (62). At this time, since the lower end of the dust suppression part (70) is located at a lower height than the upper end of the inner frame (61), even when the inner frame (61) is in the lowest position relative to the outer frame (62), the dust suppression part (70) can prevent dust from entering the gap (G) between the inner frame (61) and the outer frame (62).

[0057] <5> In the resin material supply mechanism (6) described in any one of the above items <1> to <4>, the outer frame portion (62) has a holding portion (64) for holding the planar member (F), and when the inner frame portion (61) is lowered relative to the outer frame portion (62), it is preferable that the lower end of the inner frame portion (61) is located below the height position of the holding portion (64) of the outer frame portion (62).

[0058] According to this configuration, the lower end of the inner frame portion (61) is positioned below the height of the holding portion (64) of the outer frame portion (62). With this configuration, when the holding portion (64) holds the planar member (F), the lower end of the inner frame portion (61) comes into contact with the upper surface of the planar member (F). As a result, the lower end of the inner frame portion (61) and the upper surface of the planar member (F) are in close contact, which prevents the resin material (R) introduced into the space formed by the through hole (63) and the planar member (F) from moving out of that space.

[0059] <6> One embodiment of the resin molding apparatus (1) includes a resin material supply mechanism (6) described in any one of <1> to <5> above, an upper mold (UM), a lower mold (LM) provided opposite to the upper mold (UM), a cavity (MC) provided in the lower mold (LM), and a mold clamping mechanism (35) for clamping a mold (M) having at least the upper mold (UM) and the lower mold (LM), wherein the resin material supply mechanism (6) supplies the resin material (R) to the cavity (MC) using the planar member (F).

[0060] In the resin molding apparatus (1) of this embodiment, it is possible to supply resin material (R) to the cavity (MC) using a resin material supply mechanism (6) having the effects described above.

[0061] <7> In the resin molding apparatus (1) described in <6> above, the outer frame portion (62) has a holding portion (64) for holding the planar member (F), and when the inner frame portion (61) is in contact with the planar member (F) while the holding portion (64) is holding the planar member (F), the lower end of the inner frame portion (61) is configured to be in contact with the outer frame portion (62) at a height lower than the height of the holding portion (64), and the depth (d1) of the cavity (MC) is configured to be deeper than the difference in height between the holding portion (64) and the contact position.

[0062] According to this, when the resin material (R) is supplied to the cavity (MC) using the resin material supply mechanism (6) while the flat member (F) is held in the holding part (64), the lower end of the inner frame part (61) and the cavity (MC) are separated. As a result, it becomes possible to avoid the resin material (R) melting due to heating by the cavity (MC) while the resin material (R) is present in the space formed by the through hole (63) of the inner frame part (61) and the flat member (F).

[0063] <8> One embodiment of the manufacturing method is a method for manufacturing a resin molded product using the resin molding apparatus (1) described in <6> or <7> above, comprising the steps of supplying the resin material (R) to the planar member (F) and supplying the resin material (R) to the cavity (MC) using the planar member (F).

[0064] In the manufacturing method of this embodiment, it is possible to manufacture a resin molded product using a resin molding apparatus (1) having the effects described above.

[0065] This disclosure is applicable to resin material supply mechanisms, resin molding apparatus, and manufacturing methods.

[0066] 1: Resin molding apparatus 6: Resin material supply mechanism 35: Mold clamping mechanism 61: Inner frame 62: Outer frame 63: Through hole 64: Holding part 65: Recess 66: Protrusion 70: Dust suppression part 71: Cover 72: Dust containment part 81: Protrusion 82: Recess G: Gap M: Molding mold MC: Lower mold cavity (cavity) LM: Lower mold UM: Upper mold R: Resin material F: Release film (flat member) Sb: Molded substrate (resin molded product)

Claims

1. A resin material supply mechanism for supplying resin material to a cavity using a flat member, comprising: an inner frame having a through hole that penetrates vertically and contacting the flat member to form a space into which the resin material is fed by the through hole and the flat member; an outer frame supporting the inner frame on its inner surface so as to be able to move up and down; and a dust suppression part that suppresses the entry of dust into the gap between the inner frame and the outer frame.

2. The resin material supply mechanism according to claim 1, wherein the dust suppression section has a cover that covers the gap between the inner frame and the outer frame from above.

3. The resin material supply mechanism according to claim 1 or 2, further comprising a dust collection section provided in either the inner frame or the outer frame, or both thereof, and configured to contain dust.

4. The resin material supply mechanism according to claim 3, wherein the outer frame portion has a protrusion that projects toward the inner frame portion, the inner frame portion has a recess configured to allow the protrusion to fit into, the dust collection portion is provided in the portion of the inner frame portion above the recess, and when the upper surface of the protrusion is in contact with the upper surface of the recess, the lower end of the dust suppression portion is located at a height lower than the upper end of the inner frame portion.

5. The resin material supply mechanism according to any one of claims 1 to 4, wherein the outer frame portion has a holding portion for holding the planar member, and when the inner frame portion is lowered relative to the outer frame portion, the lower end of the inner frame portion is located below the height position of the holding portion of the outer frame portion.

6. A resin molding apparatus comprising: a resin material supply mechanism according to any one of claims 1 to 5; an upper mold; a lower mold provided opposite to the upper mold; a cavity provided in the lower mold; and a mold clamping mechanism for clamping a mold having at least the upper mold and the lower mold, wherein the resin material supply mechanism supplies the resin material to the cavity using the planar member.

7. The resin molding apparatus according to claim 6, wherein the outer frame portion has a holding portion for holding the planar member, and when the inner frame portion is in contact with the planar member while the holding portion is holding the planar member, the lower end of the inner frame portion is configured to be at a contact position lower than the height position of the holding portion within the outer frame portion, and the depth of the cavity is configured to be greater than the difference in height between the holding portion and the contact position.

8. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 6 or 7, comprising the steps of: supplying the resin material to the planar member; and supplying the resin material to the cavity using the planar member.

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