Module

Abstract

A module 1 comprises: a first substrate 10 which is a flat substrate having a first main surface 10a and a second main surface 10b that face each other in the thickness direction; a second substrate 20 which is a flat substrate having a first main surface 20a and a second main surface 20b that face each other in the thickness direction, which is arranged so as to be spaced apart from the first substrate 10 with a gap 30 therebetween in the horizontal direction perpendicular to the thickness direction; a first electronic component 31 which is housed in the gap 30 between the first substrate 10 and the second substrate 20; and a resin layer 41 which is made of a sealing resin 40 that fills at least a space including the gap 30, and that integrates the first substrate 10, the second substrate 20, and the first electronic component 31. The resin layer 41 has: a first surface 41a that is a surface on the first main surface 10a, 20a side of the first substrate 10 and the second substrate 20; and a second surface 41b that is a surface on the second main surface 10b, 20b side. The first main surface 10a of the first substrate 10, the first main surface 20a of the second substrate 20, and the surface including the first surface 41a of the resin layer 41 are flat surfaces.

Description

module

[0001] This invention relates to a module.

[0002] Methods for reducing the height of a module include thinning a portion of the substrate, creating cavities in the substrate, and using a frame substrate.

[0003] For example, Patent Document 1 discloses a partial mounting structure for a module in which a cavity is provided on a substrate and a semiconductor die is housed in the cavity.

[0004] U.S. Patent Application Publication No. 2016 / 0035679

[0005] When creating substrates with thinned sections or frame-shaped substrates to reduce the module's height, the anisotropy of the shape can cause stress differences, leading to distortion in the substrate and a decrease in its flatness. Furthermore, methods that form cavities in the substrate are prone to deformation during processing.

[0006] This invention was made to solve the above problems and aims to provide a module that can achieve both high flatness and a low profile.

[0007] The module of the present invention comprises: a first substrate, which is a flat substrate having a first main surface and a second main surface facing each other in the thickness direction; a second substrate, which is a flat substrate having a first main surface and a second main surface facing each other in the thickness direction, spaced apart from the first substrate and with a gap in the horizontal direction perpendicular to the thickness direction; a first electronic component housed in the gap between the first substrate and the second substrate; and a resin layer made of a sealing resin that fills at least the space including the gap and integrates the first substrate, the second substrate and the first electronic component. The resin layer has a first surface which is the surface on the first main surface side of the first substrate and the second substrate, and a second surface which is the surface on the second main surface side. The first main surface of the first substrate, the first main surface of the second substrate, and the surface including the first surface of the resin layer are flat surfaces.

[0008] According to the present invention, it is possible to provide a module that can achieve both high flatness and a low profile.

[0009] Figure 1 is a schematic perspective view showing an example of the module of the present invention. Figure 2 is a cross-sectional view taken along line II-II of the module shown in Figure 1. Figure 3 is a schematic cross-sectional view showing another example of the module of the present invention. Figure 4 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 5 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 6 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 7 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 8 is a schematic top view transparency showing yet another example of the module of the present invention. Figure 9 is a cross-sectional view taken along line IX-IX of the module shown in Figure 8. Figure 10 is a cross-sectional view taken along line X-X of the module shown in Figure 8. Figure 11 is a cross-sectional view taken along line XI-XI of the module shown in Figure 8. Figure 12 is a cross-sectional view taken along line XII-XII of the module shown in Figure 8. Figure 13 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 14 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 15 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 16 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 17 is a schematic cross-sectional view showing yet another example of the module of the present invention. Figure 18 is a schematic top view transparency showing yet another example of the module of the present invention. Figure 19 is a cross-sectional view of the module shown in Figure 18 along the line XIX-XIX. Figure 20 is a cross-sectional view of the module shown in Figure 18 along the line XX-XX. Figure 21 is a cross-sectional view of the module shown in Figure 18 along the line XXI-XXI. Figure 22 is a schematic top view transparency showing yet another example of the module of the present invention. Figure 23 is a cross-sectional view of the module shown in Figure 22 along the line XIII-XXIII. Figure 24 is a cross-sectional view of the module shown in Figure 22 along the line XXIV-XXIV. Figure 25 is a schematic cross-sectional view showing yet another example of the module of the present invention.

[0010] The modules of the present invention will be described below. However, the present invention is not limited to the following configurations, and may be modified as appropriate without departing from the spirit of the invention. Furthermore, a combination of several of the preferred configurations described below also constitutes the present invention.

[0011] The following diagrams are schematic representations, and their dimensions, aspect ratios, and scales may differ from those of the actual product. The same reference numerals are used for identical or equivalent parts in the diagrams. Furthermore, identical elements are denoted by the same reference numerals in each diagram, and redundant explanations are omitted.

[0012] In this specification, terms describing relationships between elements (e.g., "opposing," "orthogonal," etc.) and terms describing the shape of elements mean not only their literal and precise forms, but also a range that is substantially equivalent, for example, a range that includes differences of a few percent.

[0013] The embodiments described below are illustrative, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. In the description of each embodiment, descriptions of matters common to embodiments already described will be omitted, and only the differences will be described. In particular, similar effects and advantages due to similar configurations will not be mentioned sequentially for each embodiment.

[0014] [Module] The module of the present invention comprises: a first substrate, which is a flat substrate having a first main surface and a second main surface facing each other in the thickness direction; a second substrate, which is a flat substrate having a first main surface and a second main surface facing each other in the thickness direction, spaced apart from the first substrate and with a gap in the horizontal direction perpendicular to the thickness direction; a first electronic component housed in the gap between the first substrate and the second substrate; and a resin layer made of a sealing resin that fills at least the space including the gap and integrates the first substrate, the second substrate and the first electronic component. The resin layer has a first surface which is the surface on the first main surface side of the first substrate and the second substrate, and a second surface which is the surface on the second main surface side. The first main surface of the first substrate, the first main surface of the second substrate, and the surface including the first surface of the resin layer are flat surfaces.

[0015] Figure 1 is a schematic perspective view showing an example of the module of the present invention. The module 1 shown in Figure 1 comprises a first substrate 10, a second substrate 20, a first electronic component 31, and a resin layer 41. Second electronic components 50, 50, and 51 are mounted on the first substrate 10 and the second substrate 20.

[0016] Figure 2 is a cross-sectional view of the module shown in Figure 1, taken along line II-II.

[0017] The first substrate 10 is a flat substrate having a first main surface 10a and a second main surface 10b that face each other in the thickness direction (indicated by arrow Z in Figure 2). The first substrate 10 is a multilayer board made up of multiple insulating layers and has internal wiring (internal wiring). The first substrate 10 has electrodes 13 and 14 on the first main surface 10a and the second main surface 10b, respectively.

[0018] The second substrate 20 is a flat substrate having a first main surface 20a and a second main surface 20b facing each other in the thickness direction Z. The second substrate 20 is a multilayer board made up of multiple insulating layers and has internal wiring (internal wiring). For example, the thickness of the first substrate 10 (in Figure 2, double arrow t) １ The length indicated by the arrow is the thickness of the second substrate 20 (in Figure 2, double arrow t). ２ It is greater than the length shown by . The second substrate 20 has electrodes 23 and 24 on the first main surface 20a and the second main surface 20b, respectively.

[0019] The second substrate 20 is positioned spaced apart from the first substrate 10, with a gap 30 in the horizontal direction perpendicular to the thickness direction Z (indicated by arrow X in Figure 2). In other words, a gap 30 is provided between the first substrate 10 and the second substrate 20 in the horizontal direction X.

[0020] A first electronic component 31 is housed in the gap 30. The planar dimensions of the first electronic component 31 are smaller than the planar dimensions of the gap 30. Terminal electrodes 31a are provided on the surface of the first electronic component 31 on the first main surface (10a, 20a) side of the first substrate 10 and the second substrate 20. The terminal electrodes 31a are exposed on the first surface 41a of the resin layer 41, which will be described later.

[0021] The resin layer 41 consists of a sealing resin 40 that fills the space including at least the gap 30 and integrates the first substrate 10, the second substrate 20, and the first electronic component 31. The sealing resin 40 fills the space including the gap 30, thereby integrating the first substrate 10, the second substrate 20, and the first electronic component 31. The sealing resin 40 may, if necessary, cover the second main surface 10b of the first substrate 10 and / or the second main surface 20b of the second substrate 20.

[0022] The resin layer 41 has a first surface 41a which is the surface on the first main surface (10a, 20a) side of the first substrate 10 and the second substrate 20, and a second surface 41b which is the surface on the second main surface (10b, 20b) side of the first substrate 10 and the second substrate 20.

[0023] The surfaces including the first main surface 10a of the first substrate 10, the first main surface 20a of the second substrate 20, and the first surface 41a of the resin layer 41 are flat surfaces. Here, a flat surface refers to a surface that is flat enough to ensure connectivity of connection parts such as connectors when a module is mounted on a substrate such as a motherboard having a general degree of flatness. Preferably, when the surface displacement of a flat surface is checked using a three-dimensional measuring machine, for example, the maximum amount of displacement is 0.05 mm or less.

[0024] The surface including the first main surface 10a of the first substrate 10, the first main surface 20a of the second substrate 20, and the first surface 41a of the resin layer 41 is also called the first main surface 2 of module 1. In module 1, the first main surface 10a of the first substrate 10, the first main surface 20a of the second substrate 20, and the first surface 41a of the resin layer 41 are all flat surfaces, and the first main surface 2, which includes the first main surface 10a of the first substrate 10, the first main surface 20a of the second substrate 20, and the first surface 41a of the resin layer 41, is also a flat surface.

[0025] Since the first substrate 10 and the second substrate 20 are manufactured as separate substrates, warping and twisting are less likely to occur. Therefore, the first main surface 10a of the first substrate 10 and the first main surface 20a of the second substrate 20 have high flatness. In addition, since the first electronic component 31 is housed in the gap 30 between the first substrate 10 and the second substrate 20, a low profile is possible. Since the first substrate 10 and the second substrate 20 are not processed to form cavities to house the first electronic component, the substrates do not deform, and high flatness is maintained. Therefore, a module that achieves both high flatness and a low profile can be made.

[0026] The gap 30 between the first substrate 10 and the second substrate 20 refers to the space in the horizontal direction X where the side surface 10c of the first substrate 10 facing the second substrate 20 and the side surface 20c of the second substrate 20 facing the first substrate 10 are facing each other. Therefore, for example, if the thicknesses of the first substrate 10 and the second substrate 20 are different, and the thickness of the first substrate 10 is greater than the thickness of the second substrate 20, then a portion of the side surface 10c of the first substrate 10 facing the second substrate 20 will not be facing the second substrate 20. This portion will not be included in the gap 30 between the first substrate 10 and the second substrate 20.

[0027] Note that both the direction indicated by arrow X and the direction indicated by arrow Y are horizontal directions perpendicular to the thickness direction Z. However, Figures 1 and 2 illustrate an example of a module in which the first substrate 10 and the second substrate 20 are arranged with a gap 30 in the horizontal direction X. Therefore, a modified version of module 1 shown in Figures 1 and 2, in which the first substrate 10 and the second substrate 20 are arranged with a gap in the horizontal direction Y, is also included in the module of the present invention.

[0028] The first main surface 10a and the second main surface 10b of the first substrate 10 correspond to the first main surface 20a and the second main surface 20b of the second substrate 20. That is, the side of the first main surface 10a of the first substrate 10 is also the side of the first main surface 20a of the second substrate 20, and the side of the second main surface 10b of the first substrate 10 is also the side of the second main surface 20b of the second substrate 20.

[0029] The planar dimensions of the first substrate 10 and the second substrate 20 may be the same or different. Also, the thicknesses of the first substrate 10 and the second substrate 20 may be the same or different.

[0030] It is preferable that the first substrate 10 and the second substrate 20 are not subjected to external shape processing other than simple cutting. If external shape processing other than simple cutting is performed, warping and twisting are likely to occur in the substrate, and the flatness may decrease. Examples of external shape processing other than simple cutting include, for example, processing for cutting out a part of the substrate to form a cavity for accommodating the first electronic component, countersinking processing, etc. More specifically, examples include processing for cutting out a part of the substrate, processing for a frame-shaped substrate, etc.

[0031] The first substrate 10 and the second substrate 20 preferably have a constant thickness respectively. A substrate with a non-constant thickness is likely to have a reduced flatness.

[0032] When a plurality of terminals and / or electrodes are exposed on the first surface of the module, their surfaces only need to ensure the connectivity of connection parts such as connectors when the module is mounted on a substrate such as a motherboard having a general flatness. The positions of the surfaces of the plurality of terminals and / or electrodes exposed on the first surface of the module in the thickness direction are preferably such that, for example, when the surface displacement is confirmed with a three-dimensional measuring machine or the like, the maximum amount is 0.1 mm or less. For example, in the module 1 shown in FIG. 2, the electrode 13 of the first substrate 10, the electrode 23 of the second substrate 20, and the terminal electrode 31a of the first electronic component 31 are exposed on the first main surface 2 of the module 1, but the maximum value of the displacement amount of these electrodes and terminals in the thickness direction Z is 0 mm. In other words, the surfaces of the electrode 13, the electrode 23, and the terminal electrode 31a are equal in position in the thickness direction Z.

[0033] The first substrate 10 and the second substrate 20 may each be a printed circuit board (also referred to as a p-board) or a low-temperature co-fired ceramic (LTCC) substrate. Further, the first substrate 10 and the second substrate 20 may each be a resin multilayer substrate in which wiring is formed of copper foil on a thermoplastic resin [such as polyether ether ketone (PEEK), polyimide (PI), liquid crystal polymer (LCP), etc.]. A low-temperature co-fired ceramic (LTCC) substrate is a substrate in which insulating layers made of a low-temperature co-fired ceramic (LTCC) material are laminated and which has wiring (internal wiring) inside.

[0034] A low-temperature co-fired ceramic material is a ceramic material that can be fired at a temperature of 1000°C or lower and can be co-fired with metals such as Au, Ag, and Cu having a small specific resistance. Specifically, as the low-temperature co-fired ceramic material, a glass composite low-temperature fired ceramic material obtained by mixing a borosilicate glass with ceramic powders such as alumina, zirconia, magnesia, and forsterite, a crystallized glass-based low-temperature fired ceramic material using a ZnO-MgO-Al ２ O ３ -SiO ２ -based crystallized glass, a BaO-Al ２ O ３ -SiO ２ -based ceramic powder, or a non-glass-based low-temperature fired ceramic material using an Al ２ O ３ -CaO-SiO ２ -MgO-B ２ O ３ -based ceramic powder, etc. can be mentioned.

[0035] Examples of the material for the internal wiring include metals such as Cu, Ag, and Au.

[0036] The first electronic component 31 is housed in the gap 30 between the first substrate 10 and the second substrate 20.

[0037] In this specification, "housed" refers to a state in which at least a part of the first electronic component 31 is disposed within the gap 30. Therefore, not only when all of the first electronic component 31 is disposed within the gap 30, but also when a part of the first electronic component 31 is disposed within the gap 30 is included in "housed".

[0038] The first electronic component 31 may be a semiconductor chip (die) manufactured by a semiconductor process, or it may be an active component such as a diode, or a passive component such as a capacitor, coil, or filter. Examples of dies include ICs (Integrated Circuits) such as PAC (Power Amplifier Controller), PA (Power Amplifier), and LNA (Low Noise Amplifier). Furthermore, the die may also be a high-density silicon capacitor (DTC). The first electronic component 31 may also be an active component such as a diode, or a passive component such as a capacitor, coil, or filter. Examples of filters include SAW (Surface Acoustic Wave) filters and BAW (Bulk Acoustic Wave) filters.

[0039] The height dimension of the first electronic component 31 is not particularly limited, but it is preferable that it be a tall component with a height of 50% or more of the maximum thickness of the resin layer 41. The maximum thickness of the resin layer 41 is the maximum distance from the first surface 41a to the second surface 41b of the resin layer 41 in the thickness direction Z.

[0040] An example of a first electronic component that is a tall component is an inductor.

[0041] The first electronic component 31 may be electrically connected to the second electronic component, which will be described later.

[0042] The resin layer 41 is made of a sealing resin 40 that fills the space including at least the gap 30 between the first substrate 10 and the second substrate 20, and integrates the first substrate 10, the second substrate 20, and the first electronic component 31.

[0043] The resin layer 41 has a first surface 41a which is the surface on the first main surfaces 10a and 20a side of the first substrate 10 and the second substrate 20, and a second surface 41b which is the surface on the second main surfaces 10b and 20b side.

[0044] Since the surface including the first main surface 10a of the first substrate 10, the first main surface 20a of the second substrate 20, and the first surface 41a of the resin layer 41 is a flat surface, the position of the first surface 41a of the resin layer 41 in the thickness direction Z is the same as the position of the first main surface 10a of the first substrate 10 and the first main surface 20a of the second substrate 20. From this, the sealing resin 40 constituting the resin layer 41 does not cover the first main surface 10a of the first substrate 10 and the first main surface 20a of the second substrate 20.

[0045] On the other hand, the sealing resin 40 constituting the resin layer 41 may cover the second main surface 10b of the first substrate 10 and / or the second main surface 20b of the second substrate 20. For example, in the module 1 shown in Figure 2, the sealing resin 40 constituting the resin layer 41 covers the second main surface 10b of the first substrate 10 and the second main surface 20b of the second substrate 20.

[0046] The type of sealing resin 40 is not particularly limited, but epoxy resins are examples. The resin layer 41 may contain additives such as fillers in addition to the sealing resin 40.

[0047] When the thickness of the first substrate and the second substrate are the same, the first main surface and the second main surface of the first substrate and the second substrate are distinguished based on the position of the second surface of the resin layer in the thickness direction and the presence or absence of mounting of the second electronic component, which will be described later.

[0048] Since the first surface of the resin layer is located at the same position in the thickness direction as the first main surface of the first and second substrates, if the position of the resin layer surface in the thickness direction does not coincide with the position of the main surface of the substrate, then the surface of the resin layer can be said to be the second surface. In that case, the main surface of the substrate on which the position in the thickness direction does not coincide with the surface of the resin layer (second surface) can be distinguished as the second main surface. Furthermore, if a second electronic component is mounted on the first or second substrate, the main surface of the substrate on which the second electronic component is mounted can be distinguished as the second main surface, and the main surface on which the second electronic component is not mounted can be distinguished as the first main surface.

[0049] Furthermore, if the positions of the resin layer surfaces in the thickness direction coincide with the positions of the main surfaces of the substrates, and if no second electronic components are mounted on the first and second substrates, then the first and second main surfaces of the first substrate and the first and second main surfaces of the second substrate are equivalent. In this case, one main surface can be distinguished as the first main surface and the other as the second main surface.

[0050] When viewing the module from above, the area of ​​the gaps relative to the module's area is preferably between 10% and 70%.

[0051] The module of the present invention may further include a second electronic component mounted on the second main surface of the first substrate and / or the second substrate.

[0052] Examples of second electronic components include active components such as diodes and ICs, and passive components such as capacitors, coils, and filters. Examples of filters include SAW filters and BAW filters. The second electronic component may also be a semiconductor chip (die) manufactured by a semiconductor process. Examples of dies include ICs such as PACs (Power Amplifier Controllers).

[0053] In module 1 shown in Figure 2, a second electronic component 50 is mounted on the second main surface 10b of the first substrate 10 via an electrode 14, and a second electronic component 51 is mounted on the second main surface 20b of the second substrate via an electrode 24.

[0054] In this specification, "mounting" refers to a state in which an electronic component is fixed to a substrate without the use of other electronic components, thereby enabling the electronic component to perform its function.

[0055] The number of second electronic components mounted on the first substrate 10 and the second substrate 20 is not particularly limited. Furthermore, a single second electronic component may be mounted across both the first substrate 10 and the second substrate 20.

[0056] The second electronic component may partially overlap with the first electronic component when viewed from the thickness direction. If a portion of the second electronic component overlaps with the first electronic component when viewed from the thickness direction Z, the second electronic component and the first electronic component may be electrically connected at the overlapping portion.

[0057] An example of a module having the features described above will be explained with reference to Figure 3. Figure 3 is a schematic cross-sectional view showing another example of the module of the present invention.

[0058] In module 1A shown in Figure 3, a second electronic component 52 is mounted on the second main surface 10b of the first substrate 10 via an electrode 14. When viewed from the thickness direction Z, a portion of the second electronic component 52 overlaps with the first electronic component 32. The first electronic component 32 and the second electronic component 52 are electrically connected in the region where they overlap in the thickness direction Z. The first electronic component 32 is not exposed to the first surface 41a of the resin layer 41, but it may be exposed to the first surface 41a.

[0059] When the first electronic component 32 and the second electronic component 52 are arranged as shown in module 1A in Figure 3, the first electronic component 32 is preferably a die or a passive component such as a capacitor, and the second electronic component 52 is preferably a die.

[0060] In the module of the present invention, a second electronic component may be mounted on a first substrate and a second substrate, and a portion of the second electronic component mounted on the first substrate may overlap with a portion of the first electronic component when viewed from the thickness direction, and a portion of the second electronic component mounted on the second substrate may overlap with a portion of the first electronic component when viewed from the thickness direction, and the second electronic component mounted on the first substrate and the second electronic component mounted on the second substrate may be electrically connected to the first electronic component.

[0061] An example of a module having the features described above will be explained with reference to Figure 4. Figure 4 is a schematic cross-sectional view showing yet another example of the module of the present invention.

[0062] In module 1B shown in Figure 4, a second electronic component 52 is mounted on the second main surface 10b of the first substrate 10 via an electrode 14, and a second electronic component 53 is mounted on the second main surface 21b of the second substrate 21 via an electrode 24. The thickness t of the first substrate 10. １ The thickness t of the second substrate 21 is ２ It is equal to.

[0063] The first electronic component 34 is housed in the gap 30 between the first substrate 10 and the second substrate 21, and when viewed from the thickness direction, a portion of the second electronic component 52 and a portion of the second electronic component 53 overlap with the first electronic component 34. Furthermore, the second electronic component 52 and the second electronic component 53 are electrically connected to the first electronic component 34. The first electronic component 34 is not exposed to the first surface 41a of the resin layer 41, but it may be exposed to the first surface 41a.

[0064] As shown in Figure 4, when the second electronic component 52 and the second electronic component 53 are connected via the first electronic component 34, and the first electronic component 34 and the second electronic components 52 and 53 are all dies, the first electronic component 34 that bridges multiple dies (second electronic components 52 and 53) is also called a bridge die.

[0065] When the second electronic components 52, 53 and the first electronic component 34 are arranged as shown in module 1B in Figure 4, dies are preferred for the second electronic components 52, 53, and a die or a passive component such as a capacitor is preferred for the first electronic component 34.

[0066] In the module of the present invention, the second electronic component is arranged across the first substrate, the first electronic component, and the second substrate, and the second electronic component may be electrically connected to the first electronic component.

[0067] An example of a module having the features described above will be explained with reference to Figure 5. Figure 5 is a schematic cross-sectional view showing yet another example of the module of the present invention.

[0068] In module 1C shown in Figure 5, the second electronic component 55 is positioned across the second main surface 10b of the first substrate 10, the first electronic component 35, and the second main surface 21b of the second substrate 21, when viewed from the thickness direction Z. The second electronic component 55 is electrically connected to the first electronic component 35.

[0069] The first electronic component 35 has terminal electrodes 35a at both ends in the horizontal direction X. Each terminal electrode 35a is connected to the second electronic component 55 and is exposed to the first surface 41a of the resin layer 41.

[0070] The first substrate 10 and the second electronic component 55, and the second substrate 21 and the second electronic component 55 are connected by solder bumps 60, respectively. The second electronic component 55 and the first electronic component 35 are connected by solder bumps 61. The height of the top surface of the first electronic component 35 is lower than the height of the second main surface 10b of the first substrate 10 and the second main surface 21b of the second substrate 21. Therefore, the size of solder bump 61 is larger than the size of solder bump 60.

[0071] As shown in the module 1C in Figure 5, a first electronic component and a second electronic component are arranged, and both terminals of the first electronic component are exposed on the first surface of the resin layer. In this case, a die is preferred as the second electronic component, and a passive component such as a capacitor is preferred as the first electronic component. When a capacitor is used as the first electronic component and a die is used as the second electronic component, the module can be mounted so that the capacitor, which is the first electronic component, is connected to the DC current (power supply line). This allows the capacitor, which is the second electronic component, to be placed between the die, which is the second electronic component, and the DC power supply without the need for a substrate. In this case, the capacitor, which is the first electronic component, can function as a decoupling capacitor or a bypass capacitor. Since the capacitor, as the first electronic component, can connect the second electronic component and the DC power supply over the shortest distance, the increase in impedance due to the longer wiring length from the DC to the second electronic component can be reduced.

[0072] In the module 1C shown in Figure 5, the thicknesses of the first substrate 10 and the second substrate 21 are equal, but the thicknesses of the first and second substrates may be different. If the thicknesses of the first and second substrates are different, and the second electronic component is connected to the first and second substrates via solder bumps, it is preferable that the size of the solder bump connecting the first substrate and the second electronic component is different from the size of the solder bump connecting the second substrate and the second electronic component.

[0073] An example of a module having the features described above will be explained with reference to Figure 6. Figure 6 is a schematic cross-sectional view showing yet another example of the module of the present invention.

[0074] In module 1D shown in Figure 6, the thickness t of the first substrate 10 is the same as in module 1 shown in Figure 2. １ However, the thickness t of the second substrate 20 ２ It is larger than . Therefore, the size of the solder bump 60 connecting the first substrate 10 and the second electronic component 55 is smaller than the solder bump 62 connecting the second substrate 20 and the second electronic component 55. With the above configuration, the difference in thickness (t) between the first substrate 10 and the second substrate 20 is １ -t ２ The solder bumps 60 and 62 absorb the impact, allowing the second electronic component 55 to be mounted substantially parallel to the first substrate 10 and the second substrate 20.

[0075] In the module of the present invention, the first electronic component may be a tall component whose height is 50% or more of the thickness of the resin layer 41.

[0076] An example of a module in which the first electronic component is a tall component will be described with reference to Figure 7. Figure 7 is a schematic cross-sectional view showing yet another example of the module of the present invention.

[0077] The module 1E shown in Figure 7 has a first electronic component 36 housed in the gap 30 between the first substrate 10 and the second substrate 21. The height of the first electronic component 36 (in Figure 7, double arrow t) ３ The length indicated by the arrow (t) is the maximum thickness of the resin layer 41 (in Figure 7, double arrow t) ４It is 50% or more of the length shown. Therefore, the first electronic component 36 is a tall component. The maximum thickness of the resin layer 41 is the length from the first surface 41a to the second surface 41b of the resin layer 41 in the thickness direction Z.

[0078] Furthermore, the first electronic component 36 has terminal electrodes 36a that are exposed on the first surface 41a of the resin layer 41.

[0079] Examples of tall components include inductors.

[0080] Figure 8 is a schematic top view transmission diagram showing yet another example of the module of the present invention. The module 1F shown in Figure 8 comprises a first substrate 10, a second substrate 20, first electronic components 32, 33, 35, and 37 housed in a gap 30 between the first substrate 10 and the second substrate 20, and a resin layer 41 made of a sealing resin 40 that fills the space including the gap 30 and integrates the first substrate 10, the second substrate 20, and the first electronic components 32, 33, 35, and 37. As shown in Figure 8, a plurality of first electronic components may be housed in the gap 30 between the first substrate 10 and the second substrate 20.

[0081] Second electronic components 50 and 52 are mounted on the second main surface 10b of the first substrate 10. Second electronic components 51 and 53 are mounted on the second main surface 20b of the second substrate 20. Furthermore, a second electronic component 55 is mounted across the first substrate 10, the first electronic component 35, and the second substrate 20.

[0082] Figure 9 is a cross-sectional view of the module shown in Figure 8 along the line IX-IX. As shown in Figure 9, the second electronic component 52 mounted on the second main surface 10b of the first substrate 10 is positioned so as to overlap with the first electronic component 32 when viewed from the thickness direction Z, and the second electronic component 52 and the first electronic component 32 are electrically connected.

[0083] Figure 10 is a cross-sectional view of the module shown in Figure 8, taken along the line X-X. As shown in Figure 10, the second electronic component 52 is positioned so as to overlap with the first electronic component 37 when viewed from the thickness direction Z, and the second electronic component 52 and the first electronic component 37 are electrically connected. The first electronic component 37 has terminal electrodes 37a and 37b at both ends in the thickness direction Z, with one terminal electrode 37a exposed on the first surface 41a of the resin layer 41. The other terminal electrode 37b is connected to the second electronic component 52.

[0084] Figure 11 is a cross-sectional view taken along line XI-XI of the module shown in Figure 8. As shown in Figure 11, a pad 15 provided on the second main surface 10b of the first substrate 10 and a pad 25 provided on the second main surface 20b of the second substrate 20 are connected by a bonding wire 66.

[0085] Figure 12 is a cross-sectional view of the module shown in Figure 8 along line XII-XII. As shown in Figure 12, the second electronic component 55 is arranged across the first substrate 10, the first electronic component 35, and the second substrate 20 when viewed from the thickness direction Z. The second electronic component 55 is electrically connected to the first electronic component 35. The first electronic component 35 has terminal electrodes 35a at both ends in the horizontal direction X. Each terminal electrode 35a is connected to the second electronic component 55 and is exposed on the first surface 41a of the resin layer 41.

[0086] Thickness t of the first substrate 10 １ However, the thickness t of the second substrate 20 ２ Because it is larger than the solder bump 60 connecting the first substrate 10 and the second electronic component 55, the size of the solder bump 60 connecting the second substrate 20 and the second electronic component 55 is smaller than the solder bump 62 connecting the second substrate 20 and the second electronic component 55.

[0087] In the module of the present invention, the first electronic component may be exposed from the second surface of the resin layer.

[0088] An example of a module having the features described above will be explained with reference to Figure 13. Figure 13 is a schematic cross-sectional view showing yet another example of the module of the present invention.

[0089] The module 1G shown in Figure 13 comprises a first substrate 11, a second substrate 20, first electronic components 33 and 36 housed in a gap 30 between the first substrate 11 and the second substrate 20, and a resin layer 42 made of sealing resin 40 that fills the space including the gap 30 and integrates the first substrate 11, the second substrate 20, and the first electronic components 33 and 36.

[0090] The sealing resin 40 constituting the resin layer 42 covers the second main surface 20b of the second substrate 20, but does not cover the second main surface 11b of the first substrate 11. Therefore, the second main surface 11b of the first substrate 11 and the electrode 14 are exposed from the second surface 42b of the resin layer 42. The first substrate 11 and the second substrate 20 have different thicknesses, with the thickness t of the first substrate 11 being... １ The thickness t of the second substrate 20 is ２ It is larger than that.

[0091] The second electronic component 53 is positioned so as to overlap the first electronic component 33 when viewed from the thickness direction. The second electronic component 53 is electrically connected to the first electronic component 33. Although the first electronic component 33 shown in Figure 13 is not exposed to the first surface 42a of the resin layer 42, the first electronic component 33 may be exposed to the first surface 42a of the resin layer 42. Although the first electronic component 33 shown in Figure 13 does not have terminal electrodes exposed to the first surface 41a of the resin layer 41, the first electronic component 33 may have terminal electrodes exposed to the first surface 42a of the resin layer 42.

[0092] The first electronic component 36 has terminal electrodes 36a on the first main surface 11a of the first substrate 11 and the first main surface 20a of the second substrate 20, with the terminal electrodes 36a exposed on the first surface 42a of the resin layer 42. The first electronic component 36 is also exposed on the second surface 42b of the resin layer 42.

[0093] If the first electronic component has terminal electrodes, the terminal electrodes of the first electronic component may be exposed on the first and / or second surface of the resin layer.

[0094] The second electronic component 53 is exposed on the second surface 42b of the resin layer 42. If the second electronic component has terminal electrodes, the terminal electrodes of the second electronic component may also be exposed on the second surface of the resin layer.

[0095] Module 1G has a through conductor 70 extending from the second main surface 20b of the second substrate 20 to the second surface 42b of the resin layer 42. The through conductor 70 is exposed on the second surface 42b of the resin layer 42. There may be one or more through conductors. If the second main surface of the first substrate is covered with a resin layer, there may be a through conductor extending from the second main surface of the first substrate to the second surface of the resin layer.

[0096] As shown in Figure 13, when the through-conductor 70 is exposed on the second surface 42b of the resin layer 42, the module 1G can be mounted on a substrate such as a motherboard using the through-conductor 70.

[0097] The module of the present invention may be provided with a first redistribution layer.

[0098] The first redistribution layer is preferably provided on the surface including the first main surface of the first substrate, the first main surface of the second substrate, and the first surface of the resin layer.

[0099] The first redistribution layer is composed of, for example, an insulating layer and redistribution conductors that form the wiring within the redistribution layer.

[0100] The insulating layer of the first redistribution layer preferably contains a resin. The resin contained in the insulating layer of the first redistribution layer may be a thermosetting resin or a thermoplastic resin. Examples of resins contained in the insulating layer may be epoxy resin, polyimide resin, polyamide-imide resin, polyamide resin, phenolic resin, formaldehyde resin, melamine resin, acrylic resin, aromatic polyester resin, polyphenylene sulfide resin, polyether resin, polyetheretherketone resin, etc. Among these, the resin contained in the insulating layer is preferably epoxy resin, polyimide resin, or polyamide-imide resin.

[0101] The insulating layer may further contain fillers in addition to the resin.

[0102] The type of filler included in the insulating layer is not particularly limited and may be, for example, silica, alumina, silicon nitride, aluminum hydroxide, etc.

[0103] The insulating layer may have a single-layer structure or a multi-layer structure.

[0104] An example of a module having a first redistribution layer will be described with reference to Figure 14. Figure 14 is a schematic cross-sectional view showing yet another example of the module of the present invention.

[0105] In module 1H shown in Figure 14, the first redistribution layer 80 is provided on the surface including the first main surface 10a of the first substrate 10, the first main surface 20a of the second substrate 20, and the first surface 41a of the resin layer 41. Module 1H shown in Figure 14 corresponds to module 1A shown in Figure 3 with the first redistribution layer 80 provided.

[0106] In module 1H, in the cross-section shown in Figure 14, the wiring in the first substrate 10 and the second substrate 20 is not connected to the wiring in the first redistribution layer 80. However, in the module of the present invention, if the first redistribution layer is provided, the wiring in the first substrate and / or the second substrate may be connected to the wiring in the first redistribution layer. The first electronic component 32 shown in Figure 14 is not exposed to the first surface 41a of the resin layer 41, but the first electronic component 32 may be exposed to the first surface 41a of the resin layer 41. In other words, the first electronic component 32 may be exposed to the first redistribution layer 80. If the first electronic component 32 has terminal electrodes, the terminal electrodes of the first electronic component 32 may be electrically connected to the wiring in the first redistribution layer.

[0107] Figure 15 is a schematic cross-sectional view showing yet another example of the module of the present invention.

[0108] In the module 1J shown in Figure 15, a first redistribution layer 80 is provided on the surface including the first main surface 10a of the first substrate 10, the first main surface 21a of the second substrate 21, and the first surface 41a of the resin layer 41. The module 1J also has a through conductor 70 extending from the second main surface 10b of the first substrate 10 to the second surface 41b of the resin layer 41 and exposed on the second surface 41b of the resin layer 41, and a through conductor 70 extending from the second main surface 20b of the second substrate 20 to the second surface 41b of the resin layer 41 and exposed on the second surface 41b of the resin layer 41. The through conductor 70 is connected to the electrode 14 of the first substrate 10 or the electrode 24 of the second substrate 20.

[0109] Module 1J shown in Figure 15 corresponds to module 1E shown in Figure 7 with a first redistribution layer 80 and a through conductor 70 provided. The first substrate 10 and the second substrate 21 have electrodes 13 and 23 on their first main surfaces 10a and 21a, respectively. The wiring in the first substrate 10 and the wiring in the second substrate 21 are electrically connected to the wiring 81 in the first redistribution layer 80 via electrodes 13 and 23, respectively. The first electronic component 36 has a terminal electrode 36a exposed on the first surface 41a of the resin layer 41, and the terminal electrode 36a is electrically connected to the wiring 81 in the first redistribution layer 80.

[0110] Furthermore, a module 1E shown in Figure 7 that is provided with a first rewiring layer 80 but without a through conductor 70 is also included in the module of the present invention.

[0111] Figure 16 is a schematic cross-sectional view showing yet another example of the module of the present invention. In the module 1K shown in Figure 16, a second electronic component 56 is mounted on the second main surface 10b of the first substrate 10 and the second main surface 21b of the second substrate 21, respectively. The second electronic component 56 has a terminal electrode 56a used for mounting on the first substrate 10 and the second substrate 21, and a terminal electrode 56b exposed on the second surface 41b of the resin layer 41. It also has a through conductor 70 extending from the second main surface 10b of the first substrate 10 to the second surface 41b of the resin layer 41, and a through conductor 70 extending from the second main surface 21b of the second substrate 21 to the second surface 41b of the resin layer 41.

[0112] In the module 1K shown in Figure 16, it is preferable that the second electronic component 56 is a capacitor. Furthermore, when mounting the module 1K on a circuit board such as a motherboard, it is preferable to mount it via a capacitor as the second electronic component 56 and a through-conductor 70.

[0113] Figure 17 is a schematic cross-sectional view showing yet another example of the module of the present invention. The module 1L shown in Figure 17 comprises a first substrate 11, a second substrate 20, first electronic components 33 and 36 housed in a gap 30 between the first substrate 11 and the second substrate 20, and a resin layer 42 made of sealing resin 40 that fills the space including the gap 30 and integrates the first substrate 11, the second substrate 20, and the first electronic components 33 and 36. A first redistribution layer 80 is provided on the surface including the first main surface 11a of the first substrate 11, the first main surface 20a of the second substrate 20, and the first surface 41a of the resin layer 41. The module 1L shown in Figure 17 corresponds to the module 1G shown in Figure 13, with the first redistribution layer 80 further provided.

[0114] Figure 18 is a schematic top view transparency showing yet another example of the module of the present invention. The module 1M shown in Figure 18 comprises a first substrate 10, a second substrate 21, first electronic components 32, 34, 35, and 36 housed in a gap 30 between the first substrate 10 and the second substrate 21, and a resin layer 41 made of a sealing resin 40 that fills the space including the gap 30 and integrates the first substrate 10, the second substrate 21, and the first electronic components 32, 34, 35, and 36.

[0115] Second electronic components 50, 52, and 52 are mounted on the second main surface 10b of the first substrate 10. Second electronic components 51, 51, 51, and 53 are mounted on the second main surface 21b of the second substrate 21.

[0116] Figure 19 is a cross-sectional view of the module shown in Figure 18, taken along the line XIX-XIX.

[0117] As shown in Figure 19, a second electronic component 52 is mounted on the second main surface 10b of the first substrate 10 via an electrode 14, and a second electronic component 53 is mounted on the second main surface 21b of the second substrate 21 via an electrode 24.

[0118] The first electronic component 34 is housed in the gap 30 between the first substrate 10 and the second substrate 21, and when viewed from the thickness direction, a portion of the second electronic component 52 and a portion of the second electronic component 53 overlap with the first electronic component 34. Furthermore, the second electronic component 52 and the second electronic component 53 are electrically connected to the first electronic component 34.

[0119] The first redistribution layer 80 is provided on the surface including the first main surface 10a of the first substrate 10, the first main surface 21a of the second substrate 21, and the first surface 41a of the resin layer 41.

[0120] The first substrate 10 and the second substrate 21 have electrodes 13 and 23 on their first main surfaces 10a and 21a, respectively. The wiring in the first substrate 10 and the wiring in the second substrate 21 are electrically connected to the wiring 81 in the first redistribution layer 80 via electrodes 13 and 23, respectively.

[0121] Figure 20 is a cross-sectional view taken along the line XX-XX of the module shown in Figure 18. As shown in Figure 20, a second electronic component 50 is mounted on the second main surface 10b of the first substrate 10 via an electrode 14, and a second electronic component 51 is mounted on the second main surface 21b of the second substrate 21 via an electrode 24. Both the second electronic components 50 and 51 are exposed on the second surface 41b of the resin layer 41. Furthermore, a first redistribution layer 80 is provided on the surface including the first main surface 10a of the first substrate 10, the first main surface 21a of the second substrate 21, and the first surface 41a of the resin layer 41.

[0122] The first electronic component 36 has a terminal electrode 36a exposed on the first surface 41a of the resin layer 41, and the terminal electrode 36a is electrically connected to the wiring 81 in the first redistribution layer 80.

[0123] Furthermore, module 1M has a through conductor 70 extending from the second main surface 10b of the first substrate 10 to the second surface 41b of the resin layer 41, and a through conductor 70 extending from the second main surface 21b of the second substrate 21 to the second surface 41b of the resin layer 41.

[0124] The first electronic component 36 has a terminal electrode 36a exposed on the first surface 41a of the resin layer 41, and the terminal electrode 36a is electrically connected to the wiring 81 in the first redistribution layer 80. In addition, the electrode 13 provided on the first main surface 10a of the first substrate 10 and the electrode 23 provided on the first main surface 21a of the second substrate 21 are electrically connected to the wiring 81 in the first redistribution layer 80.

[0125] Figure 21 is a cross-sectional view taken along the line XXI-XXI of the module shown in Figure 18. As shown in Figure 21, a second electronic component 52 is mounted on the second main surface 10b of the first substrate 10 via an electrode 14, and a second electronic component 51 is mounted on the second main surface 21b of the second substrate 21 via an electrode 24. The second electronic component 52 overlaps with the first electronic component 35 when viewed from the thickness direction Z, and the second electronic component 52 and the first electronic component 35 are electrically connected.

[0126] The first electronic component 35 has terminal electrodes 35a at both ends in the horizontal direction X. Each terminal electrode 35a is connected to the second electronic component 52 and is exposed on the first surface 41a of the resin layer 41, and is electrically connected to the wiring 81 in the first redistribution layer 80.

[0127] In the module of the present invention, the number of substrates is not limited to two, but may be three or more. An example of a module having three substrates is a flat substrate having a first main surface and a second main surface facing each other in the thickness direction, a third substrate being spaced apart from the second substrate and with a gap in the horizontal direction, a third electronic component being housed in the gap between the second substrate and the third substrate, and a resin layer made of a sealing resin that fills at least the space including the gap between the second substrate and the third substrate and integrates the second substrate, the third substrate and the third electronic component.

[0128] As the third substrate, one similar to the first and second substrates can preferably be used.

[0129] The third electronic component may be a die, an active component such as a diode, or a passive component such as a capacitor, coil, or filter. Examples of dies include ICs such as PAs and LNAs. Furthermore, the die may be a high-density silicon capacitor (DTC). The third electronic component may also be an active component such as a diode, or a passive component such as a capacitor, coil, or filter. Examples of filters include SAW filters and BAW filters.

[0130] An example of a module equipped with a third substrate will be described with reference to Figures 22 to 24. Figure 22 is a schematic top view transmission diagram showing yet another example of the module of the present invention.

[0131] The module 1N shown in Figure 22 comprises a first substrate 10, a second substrate 21, and a third substrate 100. The gap 30 between the first substrate 10 and the second substrate 21 houses the first electronic components 32, 34, 36, and 36. The space including the gap 30 is filled with sealing resin 40, forming a resin layer 41. The sealing resin 40 constituting the resin layer 41 integrates the first substrate 10, the second substrate 21, and the first electronic components 32, 34, 36, and 36.

[0132] The gap 130 between the second substrate 21 and the third substrate 100 houses the third electronic components 135, 135, 136, 137, and 137. The space including the gap 130 is filled with sealing resin 40, forming a resin layer 41. The sealing resin 40 constituting the resin layer 41 integrates the second substrate 21, the third substrate 100, and the third electronic components 135, 135, 136, 137, and 137.

[0133] If the sealing resin does not cover the second main surface of the second substrate, the sealing resin filling the space including the gap between the first and second substrates will not be continuous with the sealing resin filling the space including the gap between the second and third substrates. In such cases, the types of sealing resins filling the two gaps may be different.

[0134] The second electronic components 50, 50, 52, and 52 are mounted on the second main surface 10b of the first substrate 10. The second electronic components 51, 51, and 53 are mounted on the second main surface 21b of the second substrate 21. The second electronic components 151 and 156 are mounted on the second main surface 100b of the third substrate 100.

[0135] Figure 23 is a cross-sectional view of the module shown in Figure 22, taken along the line XXIII-XXIII.

[0136] As shown in Figure 23, the first electronic component 34 is housed in the gap 30 between the first substrate 10 and the second substrate 21. The second electronic component 52 is mounted on the second main surface 10b of the first substrate 10 such that a portion of it overlaps with the first electronic component 34 in the thickness direction, and is electrically connected to the first electronic component 34. Similarly, the second electronic component 53 is mounted on the second main surface 21b of the second substrate 21 such that a portion of it overlaps with the first electronic component 34 in the thickness direction, and is electrically connected to the first electronic component 34.

[0137] A third electronic component 136 is housed in the gap 130 between the second substrate 21 and the third substrate 100.

[0138] The second electronic component 156 has a terminal electrode 156a used for mounting onto the third substrate 100 and a terminal electrode 156b exposed on the second surface 41b of the resin layer 41. The terminal electrode 156a is connected to an electrode 104 provided on the second main surface 100b of the third substrate 100. It also has a through conductor 70 extending from the second main surface 10b of the first substrate 10 or the second main surface 21b of the second substrate 21 to the second surface 41b of the resin layer 41, and a through conductor 170 extending from the second main surface 100b of the third substrate 100 to the second surface 41b of the resin layer 41.

[0139] As shown in Figure 23, the sealing resin 40 filling the space including gap 30 and the sealing resin 40 filling the space including gap 130 cover the second main surface 10b of the first substrate 10, the second main surface 21b of the second substrate 21, and the second main surface 100b of the third substrate 100. In other words, the sealing resin 40 filling the space including gap 30 and the sealing resin 40 filling the space including gap 130 are the same sealing resin. Therefore, the sealing resin 40 integrates the first substrate 10, the second substrate 21, and the third substrate 100, the first electronic components 32, 34, 36, 36 housed in gap 30, and the third electronic components 135, 135, 136, 137, 137 housed in gap 130.

[0140] The surfaces including the first main surface 10a of the first substrate 10, the first main surface 21a of the second substrate 21, the first main surface 100a of the third substrate 100, and the first surface 41a of the resin layer 41 are flat surfaces. Furthermore, the first redistribution layer 80 is provided on the surfaces including the first main surface 10a of the first substrate 10, the first main surface 21a of the second substrate 21, the first main surface 100a of the third substrate 100, and the first surface 41a of the resin layer 41.

[0141] The third electronic component 136 has a terminal electrode 136a exposed on the first surface 41a of the resin layer 41 and is connected to the wiring 81 in the first redistribution layer 80. The first substrate 10, the second substrate 21, and the third substrate 100 each have electrodes 13, 23, and 103 on their first main surfaces 10a, 21a, and 100a, respectively. The wiring in the first substrate 10, the second substrate 21, and the third substrate 100 is electrically connected to the wiring 81 in the first redistribution layer 80 via electrodes 13, 23, and 103, respectively.

[0142] Figure 24 is a cross-sectional view of the module shown in Figure 22, taken along the line XXIV-XXIV.

[0143] As shown in Figure 24, the first electronic component 32 is housed in the gap 30 between the first substrate 10 and the second substrate 21. The second electronic component 52 is mounted on the second main surface 10b of the first substrate 10 such that a portion of it overlaps with the first electronic component 32 in the thickness direction, and is electrically connected to the first electronic component 32. The second electronic component 51 is mounted on the second main surface 21b of the second substrate 21, but does not overlap with the first electronic component 32 in the thickness direction Z.

[0144] A third electronic component 135 is housed in the gap 130 between the second substrate 20 and the third substrate 100. A second electronic component 151 is mounted on the second main surface 100b of the third substrate 100 such that a portion of it overlaps with the third electronic component 135 in the thickness direction Z, and is electrically connected to the third electronic component 135. The third electronic component 135 has terminal electrodes 135a at both ends in the horizontal direction X. Each terminal electrode 135a is connected to the second electronic component 151 and is exposed on the first surface 41a of the resin layer 41, and is electrically connected to the wiring 81 in the first redistribution layer 80.

[0145] The module of the present invention can be used in communication devices. The module used in communication devices includes, for example, common devices such as antennas (ANT) and switching elements (SW), as well as at least one of a transmitting device such as a PA and a receiving device such as an LNA. Each of these devices consists, for example, a functional unit consisting of one or more electronic components arranged in the module, and a matching circuit for connecting to other devices and electronic components. In the module of the present invention, for example, the functional units and matching circuits of the above-mentioned devices can be mounted by appropriately combining a first electronic component, a second electronic component, and a third electronic component. In this specification, the electronic components constituting the functional unit of each device and the electronic components constituting the matching circuit are collectively referred to as the electronic components constituting the device.

[0146] In the module of the present invention, the first electronic component can be housed in the gap between substrates, so even if a tall component is used as an electronic component constituting the device, for example, the height of the module can be suppressed. Furthermore, since the first electronic component housed in the gap between substrates and the second electronic component mounted on the substrate can be stacked in the thickness direction, it is possible to prevent the electronic components constituting each device from being spread out laterally. This makes it possible to shorten the length of the connecting wires that connect the electronic components constituting the device. Therefore, even if the number of electronic components increases, noise and loss can be suppressed. In addition, since inductors constituting each device are prone to interference with other devices, it is desirable that inductors be placed at a position away from the electronic components constituting other devices. In this regard, with the module of the present invention, the inductor of one device (for example, a receiving device or a transmitting device) can be placed away from the electronic components (especially inductors) constituting other devices (for example, a common device), so that isolation degradation due to inductor interference can be suppressed.

[0147] This is particularly useful in suppressing interference between transmitting and receiving devices. For example, it is preferable to place the inductors constituting the transmitting device and the inductors constituting the matching circuit of the receiving device far apart in order to suppress isolation degradation due to interference.

[0148] In the circuit module of the present invention, for example, by housing the inductor constituting the transmitting device in the gap between the first and second substrates, and the inductor constituting the receiving device in the gap between the second and third substrates, the distance between the inductor constituting the transmitting device and the inductor constituting the receiving device can be increased, thereby suppressing interference between the transmitting device and the receiving device.

[0149] Note that the arrangement of the transmitting and receiving devices may be reversed as described above. For example, the inductors constituting the transmitting device may be housed in the gap between the second and third substrates, and the inductors constituting the receiving device may be housed in the gap between the first and second substrates. In this case, the inductors constituting the common device may be housed in the same gap as the inductors constituting the transmitting device, or in the same gap as the inductors constituting the receiving device, but it is preferable that the inductors constituting the common device be housed in the same gap as the inductors constituting the receiving device.

[0150] For example, module 1N shown in Figures 22 to 24 has a common device arrangement section D1 where a common device consisting of multiple electronic components is arranged, a receiving device arrangement section D2 where a receiving device consisting of multiple electronic components is arranged, and a transmitting device arrangement section D3 where a transmitting device consisting of multiple electronic components is arranged.

[0151] The common device placement section D1 includes a common device function section consisting of a first electronic component 34 housed in the gap 30 between the first substrate 10 and the second substrate 21, a second electronic component 52 mounted on the second main surface 10b of the first substrate 10 and electrically connected to the first electronic component 34, and a second electronic component 53 mounted on the second main surface 21b of the second substrate 21 and electrically connected to the first electronic component 34, and a matching circuit composed of a first electronic component 36 and second electronic components 50 and 51 arranged around it.

[0152] The receiving device placement section D2 includes a receiving device function section comprising a first electronic component 32 housed in the gap 30 between the first substrate 10 and the second substrate 21, and a second electronic component 52 mounted on the second main surface 10b of the first substrate 10 such that a portion of it overlaps with the first electronic component 32 in the thickness direction Z and is electrically connected to the first electronic component 32; and a matching circuit arranged around it, which is composed of a first electronic component 36 and a second electronic component 50.

[0153] The transmitting device is arranged in the transmitting device placement section D3, which consists of a transmitting device function section comprising a transmitting device function section comprising a third electronic component 135, 137, 137 housed in the gap 130 between the second substrate 21 and the third substrate 100, and a second electronic component 151 mounted on the second main surface 100b of the third substrate 100 such that a portion of it overlaps with the third electronic components 135, 135, 137 in the thickness direction Z and is electrically connected to the third electronic components 135, 135, 137, and a matching circuit composed of the third electronic components 135, 136 arranged around it.

[0154] In the example shown in Figure 22, the placement areas for each device are separated, and the tall components, the first electronic component 36 and the third electronic component 136, are arranged to be separated from each other. Specifically, the inductor as the first electronic component 36 constituting the common device is housed together with the inductor as the first electronic component 36 constituting the receiving device in the gap 30 between the first substrate 10 and the second substrate 20, and the inductor as the third electronic component 136 constituting the transmitting device is housed in the gap 130 between the second substrate 20 and the third substrate 100. In other words, the inductor as the third electronic component 136 constituting the transmitting device is housed in a different gap from the gap 30 in which the first electronic component 36 constituting the common device and the first electronic component 36 constituting the receiving device are housed. By configuring the placement areas for each device in this way, isolation degradation can be suppressed.

[0155] In the module 1N shown in Figures 22 to 24, the first substrate 10, the second substrate 21, and the third substrate 100 are arranged in a horizontal direction X. However, the arrangement of the first substrate, the second substrate, and the third substrate is not limited to this shape. For example, the first substrate, the second substrate, and the third substrate may be arranged in an L-shape.

[0156] The module of the present invention may be provided with a second redistribution layer. The second redistribution layer is a redistribution layer provided on the second surface of the resin layer. The same type of redistribution layer as the first redistribution layer can be suitably used as the second redistribution layer.

[0157] If a second electronic component is exposed on the second surface of the resin layer, the second electronic component may be connected to the wiring in the second redistribution layer. In this case, it is preferable that the second electronic component has terminal electrodes exposed on the second surface of the resin layer on the side opposite to the first or second substrate, and that these terminal electrodes are electrically connected to the wiring in the second redistribution layer.

[0158] If a through-conductor is provided in the resin layer, the through-conductor may be connected to the wiring in the second redistribution layer. In this case, it is preferable that the through-conductor electrically connects the wiring in the first or second substrate to the wiring in the second redistribution layer.

[0159] An example of a module having a second redistribution layer will be described with reference to Figure 25. Figure 25 is a schematic cross-sectional view showing yet another example of the module of the present invention. Module 1P shown in Figure 25 corresponds to module 1K shown in Figure 16, in which a second redistribution layer is provided on the second surface 41b of the resin layer 41.

[0160] In module 1P, a second redistribution layer 90 is provided on the second surface 41b of the resin layer 41. The second electronic component 56 has a terminal electrode 56a used for mounting on the first substrate 10 and the second substrate 21, and a terminal electrode 56b exposed on the second surface 41b of the resin layer 41 and connected to the wiring 91 in the second redistribution layer 90. Furthermore, it has a through conductor 70 extending from the second main surface 10b of the first substrate 10 to the second surface 41b of the resin layer 41 and connected to the wiring 91 in the second redistribution layer 90, and a through conductor 70 extending from the second main surface 21b of the second substrate 21 to the second surface 41b of the resin layer 41 and connected to the wiring 91 in the second redistribution layer 90.

[0161] 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1J, 1K, 1L, 1M, 1N, 1P Module 2 First main surface (flat surface) of module 10, 11 First substrate 10a, 11a First main surface of first substrate 10b, 11b Second main surface of first substrate 10c Side surface of first substrate facing second substrate 13, 14 Electrodes of first substrate 15 Pads of first substrate 20, 21 Second substrate 20a, 21a First main surface of second substrate 20b, 21b Second main surface of second substrate 20c Side surface of second substrate facing first substrate 23, 24 Electrodes of second substrate 25 Pads of second substrate 30 Gap between first and second substrate 31, 32, 33, 34, 35, 36, 37 First electronic component 31a, 35a, 36a, 37a, 37b Terminal electrodes 40 Sealing resin 41, 42 Resin layer 41a, 42a First surface of resin layer 41b, 42b Second surface of resin layer 50, 51, 52, 53, 55, 56 Second electronic component 56a, 56b Terminal electrodes 60, 61, 62 Solder bump 66 Bonding wire 70 Through conductor 80 First redistribution layer 81 Wiring within the first redistribution layer 90 Second redistribution layer 91 Wiring within the second redistribution layer 100 Third substrate 100a First main surface of the third substrate 100b Second main surface of the third substrate 103, 104 Electrodes of the third substrate 130 Gap between the second and third substrates 135, 136, 137 Third electronic component 135a, 136a Terminal electrodes 151, 156 Second electronic components 156a, 156b Terminal electrode 170 Through conductor D1 Common device arrangement section D2 Receiving device arrangement section D3 Transmitting device arrangement section

Claims

1. A module comprising: a first substrate, which is a flat substrate having a first main surface and a second main surface facing each other in the thickness direction; a second substrate, which is a flat substrate having a first main surface and a second main surface facing each other in the thickness direction, spaced apart from the first substrate and with a gap in the horizontal direction perpendicular to the thickness direction; a first electronic component housed in the gap between the first substrate and the second substrate; and a resin layer made of sealing resin filling at least the space including the gap and integrating the first substrate, the second substrate and the first electronic component, wherein the resin layer has a first surface which is the surface on the first main surface side of the first substrate and the second substrate, and a second surface which is the surface on the second main surface side, and the surface including the first main surface of the first substrate, the first main surface of the second substrate, and the first surface of the resin layer is a flat surface.

2. The module according to claim 1, further comprising a second electronic component mounted on the second main surface of the first substrate and / or the second main surface of the second substrate.

3. The module according to claim 2, wherein the second electronic component overlaps with the first electronic component in part when viewed from the thickness direction, and the second electronic component is electrically connected to the first electronic component.

4. The module according to claim 2, wherein the second electronic component is mounted on the first substrate and the second substrate, a portion of the second electronic component mounted on the first substrate overlaps with a portion of the first electronic component when viewed from the thickness direction, a portion of the second electronic component mounted on the second substrate overlaps with a portion of the first electronic component when viewed from the thickness direction, and the second electronic component mounted on the first substrate and the second electronic component mounted on the second substrate are electrically connected to the first electronic component, respectively.

5. The module according to claim 2, wherein the second electronic component is arranged to span the first substrate, the first electronic component and the second substrate when viewed from the thickness direction, and the second electronic component is electrically connected to the first electronic component.

6. The module according to claim 5, wherein the height of the first substrate and the height of the second substrate are different, the second electronic component is connected to the first substrate and the second substrate, respectively, via solder bumps, and the size of the solder bump connecting the first substrate and the second electronic component is different from the size of the solder bump connecting the second substrate and the second electronic component.

7. The module according to any one of claims 1 to 6, wherein the first electronic component has terminal electrodes exposed from the first surface of the resin layer.

8. The module according to any one of claims 1 to 6, wherein a first redistribution layer is provided on the surface including the first main surface of the first substrate, the first main surface of the second substrate, and the first surface of the resin layer.

9. The module according to claim 8, wherein the first electronic component has terminal electrodes exposed from the first surface of the resin layer, and the terminal electrodes of the first electronic component are electrically connected to the wiring in the first rewiring layer.

10. The module according to any one of claims 2 to 8, wherein the sealing resin constituting the resin layer covers the second main surface of the first substrate and / or the second substrate.

11. The module according to claim 10, wherein the surface of the second electronic component is exposed from the second surface of the resin layer.

12. The module according to claim 10 or 11, wherein the surface of the first electronic component is exposed from the second surface of the resin layer.

13. The module according to any one of claims 10 to 12, further comprising a through conductor extending from the second main surface of the first substrate or the second main surface of the second substrate to the second surface of the resin layer.

14. The module according to any one of claims 10 to 13, wherein the first substrate and the second substrate have different thicknesses, and the substrate with the greater thickness of the first substrate or the second substrate is exposed on the second surface of the resin layer.

15. The module according to any one of claims 10 to 14, wherein a second redistribution layer is provided on the second surface of the resin layer.

16. The module according to claim 15, wherein the second electronic component has terminal electrodes exposed on the second surface of the resin layer on the side opposite to the first substrate or the second substrate, and the terminal electrodes of the second electronic component are electrically connected to the wiring in the second redistribution layer.

17. The module according to claim 15 or 16, further comprising a through conductor extending from the second main surface of the first substrate or the second main surface of the second substrate to the second surface of the resin layer, wherein the through conductor is electrically connected to the wiring in the second redistribution layer.

18. The module according to any one of claims 1 to 17, wherein the height of the first electronic component is 50% or more of the maximum thickness of the resin layer.

19. The module according to claim 18, wherein the first electronic component is an inductor.

20. The module according to any one of claims 1 to 19, wherein a pad provided on the second main surface of the first substrate and a pad provided on the second main surface of the second substrate are connected by wire bonding that spans the gap between the first substrate and the second substrate.

21. The module according to any one of claims 1 to 20, comprising: a flat substrate having a first main surface and a second main surface facing each other in the thickness direction, a third substrate spaced apart from the second substrate and with a gap in the horizontal direction, and a third electronic component housed in the gap between the second substrate and the third substrate, further comprising a resin layer made of a sealing resin that fills at least the space including the gap between the second substrate and the third substrate and integrates the second substrate, the third substrate and the third electronic component.

22. The module according to claim 21, comprising a common device, a receiving device, and a transmitting device, wherein the common device, the receiving device, and the transmitting device each include an inductor, the inductor constituting the receiving device is housed as the first electronic component in the gap between the first substrate and the second substrate, and the inductor constituting the transmitting device is housed as the third electronic component in the gap between the second substrate and the third substrate.

23. The module according to claim 22, wherein the inductor constituting the common device is housed as the first electronic component in the gap between the first substrate and the second substrate together with the inductor constituting the receiving device.

Images