Electronic component, manufacturing method therefor, and electronic component module

Abstract

[Problem] To provide an electronic component that has a small size and minimal dimensional variation, and that is easy to assemble. [Solution] An electronic component 1 comprises: a magnetic element body 10 that has an upper surface 10a, a lower surface 10b, and a plurality of lateral surfaces 10c-10f; a first conductive line 20 that is disposed inside the magnetic element body 10; and second conductive lines 30 that are disposed on the lateral surfaces 10d-10f of the magnetic element body 10 and are partially embedded in the magnetic element body 10. The pair of ends of the first conductive line 20 constitutes a pair of terminal electrodes 21a, 21b that are exposed from the upper surface 10a and the lower surface 10b of the magnetic element body 10.

Description

Electronic component, manufacturing method thereof, and electronic component module

[0001] The present disclosure relates to an electronic component and a manufacturing method thereof, and particularly to an electronic component having a structure in which a conductor is embedded in a magnetic element and a manufacturing method thereof. The present disclosure also relates to an electronic component module using such an electronic component.

[0002] Small-sized inductor components for high-current applications are known. For example, Patent Document 1 discloses an electronic component having a structure in which a bent metal plate is embedded in a magnetic core. Patent Document 2 also discloses an electronic module including a magnetic element in which an inductor is embedded, a first circuit board disposed on the upper surface of the magnetic element, a second circuit board disposed under the bottom surface of the magnetic element, and a plurality of pin conductors disposed on the side surface of the magnetic element for electrically connecting the first circuit board and the second circuit board.

[0003] Japanese Patent Application Laid-Open No. 2022-151206, U.S. Patent Application Publication No. 2024 / 0049391

[0004] In modules for power circuits such as voltage regulators, heat generation associated with an increase in current is a problem. In order to suppress heat generation, it is better that the power path connected to the semiconductor IC via the inductor is as short as possible. In recent years, the development of interposers in which an inductor is disposed directly under the IC has been progressing. However, since it is necessary to dispose power supply pins and signal supply pins directly under the IC, the structure becomes complicated and assembly becomes difficult.

[0005] Since the conventional electronic module described in Patent Document 2 has a structure in which a plurality of pin conductors are attached to the side surface of the magnetic element, there are problems such as large variations in product dimensions, a decrease in manufacturing yield, and mounting defects.

[0006] Therefore, the present disclosure provides an electronic component that is small, has small dimensional variations, and is easy to assemble, and a manufacturing method thereof. The present disclosure also provides an electronic component module using such an electronic component.

[0007] An electronic component according to one aspect of the present disclosure comprises a magnetic element having an upper surface, a lower surface and a plurality of sides, a first conductive line disposed inside the magnetic element, and a second conductive line disposed on the sides of the magnetic element, with a portion of it embedded within the magnetic element, wherein a pair of ends of the first conductive line constitute a pair of terminal electrodes exposed from the upper surface and the lower surface of the magnetic element, respectively.

[0008] This disclosure provides small electronic components with minimal dimensional variation and easy assembly, as well as a method for manufacturing the same. Furthermore, this disclosure provides an electronic component module using such electronic components.

[0009] Figure 1 is an external perspective view of an electronic component 1 according to the first embodiment of this disclosure. Figure 2 is a substantially transparent perspective view of the electronic component 1 of Figure 1. Figure 3 is a six-view drawing of the electronic component 1 of Figure 1. Figure 4 is a substantially external perspective view of the electronic component 1 after plating. Figure 5 is a substantially side view of the electronic component 1 of Figure 4. Figure 6 is a diagram showing the configuration of an electronic component 1 according to the second embodiment of this disclosure, where (a) is a substantially top view and (b) is a substantially cross-sectional view along the Y1-Y1 line in (a). Figure 7 is an explanatory diagram of a method for manufacturing an electronic component 1 according to an embodiment of this disclosure. Figure 8 is a substantially perspective view showing the configuration of an electronic component 1 according to the third embodiment of this disclosure, where (a) shows the configuration before plating film formation and (b) shows the configuration after plating film formation. Figure 9 is a substantially perspective view showing the configuration of an electronic component 1 according to the fourth embodiment of this disclosure, where (a) shows the configuration before plating film formation and (b) shows the configuration after plating film formation. Figure 10 is a schematic perspective view showing the configuration of an electronic component 1 according to a fifth embodiment of the present disclosure, where (a) shows the configuration before plating film formation and (b) shows the configuration after plating film formation. Figure 11 is a schematic perspective view showing the configuration of an electronic component module 100 including the electronic component 1. Figure 12 is an exploded perspective view of the electronic component module 100. Figure 13 is a schematic cross-sectional view showing the mounted state of the electronic component module 100.

[0010] The embodiments of the technology described herein will be described in detail below with reference to the attached drawings.

[0011] Figure 1 is an external perspective view of the electronic component 1 according to the first embodiment of this disclosure. Figure 2 is a substantially transparent perspective view of the electronic component 1 of Figure 1, and Figure 3 is a six-view drawing of the electronic component 1 of Figure 1.

[0012] As shown in Figures 1 to 3, the electronic component 1 comprises a magnetic element 10 made of a resin containing metal magnetic powder, a first conductive line 20 arranged inside the magnetic element 10, and a second conductive line 30 arranged on the surface of the magnetic element 10.

[0013] The magnetic element 10 may be made of a composite magnetic material in which a magnetic filler made of a high-permeability material such as ferrite or permalloy is solidified with a resin binder. The magnetic element 10 may also be a compacted molded body of metallic magnetic powder. The shape of the magnetic element 10 is substantially a rectangular parallelepiped, having an upper surface 10a, a lower surface 10b, and four sides 10c, 10d, 10e, and 10f. The planar size of the magnetic element 10 is not particularly limited, and the vertical and horizontal dimensions may each be 5 to 10 mm. The thickness of the magnetic element 10 may also be 2 to 3 mm.

[0014] The first conductive line 20 is made of a metal plate such as copper (Cu) and functions, for example, as a coil conductor. In this embodiment, two first conductive lines 20 are arranged inside the magnetic element 10, forming an inductor array. When multiple inductors are provided inside the magnetic element 10, they may not be magnetically coupled to each other, or they may be magnetically coupled to each other. Since the entire circumference of the first conductive line 20 is surrounded by the magnetic element 10, its inductance can be increased.

[0015] The shape of the first conductive line 20 is not particularly limited as long as it can perform the desired function. The first conductive line 20 according to this embodiment has a crank shape with two bent portions, and a pair of ends of the first conductive line 20 constitute a pair of terminal electrodes 21a, 21b that are exposed from the upper surface 10a and lower surface 10b of the magnetic element 10, respectively. That is, one end of the first conductive line 20 constitutes a terminal electrode 21a that is exposed from the upper surface 10a of the magnetic element 10, and the other end of the first conductive line 20 constitutes a terminal electrode 21b that is exposed from the lower surface 10b of the magnetic element 10.

[0016] In this embodiment, the terminal electrode 21a is provided at the corner where the upper surface 10a and the side surface 10c of the magnetic element 10 intersect. Therefore, the exposed surface of the terminal electrode 21a is formed on both the upper surface 10a and the side surface 10c of the magnetic element 10. On the other hand, the terminal electrode 21b is provided inside the edge of the lower surface 10b of the magnetic element 10. Therefore, the exposed surface of the terminal electrode 21b is formed only on the lower surface 10b of the magnetic element 10.

[0017] The exposed surfaces of the terminal electrodes 21a and 21b from the magnetic element 10 are coplanar with the corresponding outer surfaces of the magnetic element 10. Specifically, the exposed surface of terminal electrode 21a on the upper surface 10a side is coplanar with the upper surface 10a, and the exposed surface of terminal electrode 21a on the side surface 10c side is coplanar with the side surface 10c. Furthermore, the exposed surface of terminal electrode 21b is coplanar with the lower surface 10b.

[0018] The second conductive line 30 is also made of a metal plate such as copper and functions as wiring for power or signal transmission. The second conductive line 30 is a straight conductor (columnar conductor) extending in the thickness direction of the magnetic element 10, and multiple lines are provided on the sides 10d, 10e, and 10f of the magnetic element 10. The second conductive line 30 includes signal pins 31 used for signal transmission and power supply pins 32 used for power transmission, with the cross-sectional area of ​​the power supply pins 32 being larger than the cross-sectional area of ​​the signal pins 31. Here, the cross-sectional area of ​​the signal pins 31 and power supply pins 32 refers to the area of ​​the cross-section perpendicular to the direction of the current flowing through the signal pins 31 and power supply pins 32 (the z-direction in the figure). In this embodiment, multiple signal pins 31 (eight in this case) are provided on the side 10d of the magnetic element 10 located opposite the side 10c, and multiple power pins 32 (four each in this case) are provided on the sides 10e and 10f of the magnetic element 10 that are perpendicular to the sides 10c and 10d.

[0019] The upper end surface 30a, the lower end surface 30b, and one side surface 30s of the second conductive line 30 are exposed on the surface of the magnetic element 10, but the remaining portion is embedded within the magnetic element 10. The exposed surfaces of the second conductive line 30 from the magnetic element 10 are coplanar with the corresponding surfaces of the magnetic element 10. That is, the upper end surface 30a of the second conductive line 30 is coplanar with the upper surface 10a of the magnetic element 10, and the lower end surface 30b of the second conductive line 30 is coplanar with the lower surface 10b of the magnetic element 10. The exposed surface on the side surface 10d of the signal pin 31 is coplanar with the side surface 10d, the exposed surface on the side surface 10e of the power supply pin 32 is coplanar with the side surface 10e, and the exposed surface on the side surface 10f of the power supply pin 32 is coplanar with the side surface 10f.

[0020] Figure 4 is a schematic perspective view of the electronic component 1 after plating, and Figure 5 is a schematic side view of the electronic component 1 shown in Figure 4.

[0021] As shown in Figures 4 and 5, the exposed surfaces of the terminal electrodes 21a, 21b and the second conductive line 30 may be covered with a plating film 40. This protects the underlying metal and improves the wettability of the solder. The surfaces of the terminal electrodes 21a, 21b and the second conductive line 30 on which the plating film 40 is formed are raised one level higher than the surface of the magnetic element 10. The plating film 40 may be an electroless gold plating film, or it may be a two-layer electrolytic plating film in which tin plating is applied on a nickel-plated underlayer.

[0022] As described above, the electronic component 1 according to this embodiment uses a metal plate material as the material for the first conductive line 20, thus reducing the DC resistance compared to the case in which a coil conductor made of a plated film is used. Furthermore, since the second conductive line 30 also uses a metal plate material and is integrated with the first conductive line 20 via the magnetic element 10, the inductor component can be miniaturized and the assembly of the electronic component becomes easier.

[0023] Figure 6 shows the configuration of an electronic component 1 according to a second embodiment of the present disclosure, where (a) is a substantially top view and (b) is a substantially cross-sectional view along the line Y1-Y1 in (a).

[0024] As shown in Figures 6(a) and (b), a feature of the electronic component 1 according to this embodiment is that the non-exposed surfaces of the first conductive line 20 and the second conductive line 30 embedded in the magnetic element 10 are covered with an insulating film 41. That is, an insulating film 41 is interposed between the conductor and the magnetic element 10, and the conductor does not directly contact the magnetic element 10. The exposed surfaces of the first conductive line 20 and the second conductive line 30 that are not covered by the magnetic element 10 are not covered by the insulating film 41. The other configurations are the same as in the above embodiment. The material of the insulating film 41 is not particularly limited as long as insulating properties can be ensured. The thickness of the insulating film 41 should be as thin as possible as long as insulating properties can be ensured. With this configuration, even if the insulation resistance of the magnetic element 10 is relatively low, the insulating properties between the first conductive line 20 and the second conductive line 30 can be improved.

[0025] Figure 7 is an explanatory diagram of a method for manufacturing an electronic component 1 according to an embodiment of the present disclosure.

[0026] As shown in Figure 7, in the manufacturing of the electronic component 1, first conductive lines 20 and second conductive lines 30 are prepared. The first conductive line 20 and the second conductive line 30 can be constructed using one or more metal plate materials 50. The material of the metal plate material 50 may be pure copper, tough pitch copper, or a copper alloy.

[0027] Next, if necessary, the surfaces of the first conductive line 20 and the second conductive line 30 are coated with an insulating film. This step can be omitted if there is no need to increase the insulation between the first conductive line 20 and the second conductive line 30, such as when the insulation resistance of the magnetic material is high.

[0028] Next, the metal plate material 50 is placed inside the base plate 61 of the molding die 60 (step S1). At this time, the metal plate material 50 may be fixed in an appropriate position using adhesive tape or the like.

[0029] Next, the magnetic resin material 10r is poured into the mold 60 and molded by heating and pressurizing it using the base plate 61 and movable plate 62 of the mold 60 (step S2). In this way, a composite substrate 10s of magnetic elements 10, in which the first conductive line 20 and the second conductive line 30 are integrally embedded, is completed (step S3).

[0030] Next, both sides of the substrate 10s are polished to expose the conductive surface (step S4). As a result, the terminal electrode 21a and the upper end surface of the second conductive line 30 are exposed from the upper surface 10a of the magnetic element 10. Although not shown in the figure, the terminal electrode 21b and the lower end surface of the second conductive line 30 are also exposed from the lower surface 10b of the magnetic element 10. Furthermore, due to the polishing of both sides, the upper end surfaces of the terminal electrode 21a and the second conductive line 30 become coplanar with the upper surface 10a of the magnetic element 10, and the lower end surfaces of the terminal electrode 21b and the second conductive line 30 become coplanar with the lower surface 10b of the magnetic element 10.

[0031] Next, the assembled substrate 10s is diced to separate the electronic components 1 into individual pieces (step S5). This forms the four sides 10c to 10f of the magnetic element 10, and the sides of the terminal electrode 21a and the second conductive line 30 are exposed from the four sides 10c to 10f (step S6). Furthermore, this dicing makes the sides of the terminal electrode 21a and the second conductive line 30 coplanar with the corresponding sides of the magnetic element 10.

[0032] Subsequently, the conductive surface exposed on the surface of the magnetic element 10 is plated to form a plating film 40 on the exposed surfaces of the terminal electrode 21 and the second conductive line 30 (step S7). With this, the electronic component 1 according to this embodiment is completed.

[0033] Conventional electronic components have a structure in which multiple second conductive lines are attached to the outer surface of a magnetic element. As a result, it is difficult to attach multiple second conductive lines to desired positions with high precision, leading to large dimensional variations. Consequently, manufacturing yield is poor and mounting defects are likely to occur. However, the electronic component according to this embodiment has a structure in which multiple second conductive lines 30 are embedded within the magnetic element 10 together with the first conductive line 20. Therefore, it is possible to manufacture small electronic components with small dimensional variations, thereby improving manufacturing yield and reducing mounting defects.

[0034] Figures 8 to 10 are schematic perspective views showing the configuration of an electronic component according to the third to fifth embodiments of this disclosure, where (a) in each figure shows the state before plating film formation and (b) shows the state after plating film formation.

[0035] The electronic component 1 shown in Figures 8(a) and 8(b) is characterized in that the second conductive line 30 consists only of signal pins 31, and no power pins 32 are provided. The other configurations are the same as in the first embodiment. In this embodiment, the second conductive line 30 as signal pins 31 is provided on the side surface 10d of the magnetic element 10, and not on the side surfaces 10e and 10f, but the configuration is not limited to this. Thus, the second conductive line 30 may consist entirely of signal pins 31.

[0036] The electronic component 1 shown in Figures 9(a) and (b) is characterized in that the second conductive line 30 consists only of power supply pins 32, and no signal pins 31 are provided. The other configurations are the same as in the first embodiment. In this embodiment, the second conductive line 30 as power supply pins 32 is provided on the sides 10e and 10f of the magnetic element 10, but not on the side 10d, however, the configuration is not limited to this. Thus, the second conductive line 30 may all be power supply pins 32.

[0037] As shown in Figures 10(a) and (b), a feature of this electronic component 1 is that the terminal electrode 21a constituting one end of the first conductive line 20 is exposed only from the upper surface 10a of the magnetic element 10, and is not exposed from the side surface 10c of the magnetic element 10. The other configurations are the same as in the first embodiment. In this embodiment, the power supply pin 32 of the second conductive line 30 is provided on the side surface 10c of the magnetic element 10, but the configuration is not limited to this. Thus, the terminal electrode 21a constituting one end of the first conductive line 20 only needs to be exposed on at least the upper surface 10a of the magnetic element 10, and the terminal electrode 21b constituting the other end of the first conductive line 20 (see Figures 2 and 3) only needs to be exposed on at least the lower surface 10b of the magnetic element 10.

[0038] The electronic component 1 according to this embodiment can be used, for example, as an interposer including an inductor for a power supply circuit.

[0039] Figure 11 is a schematic perspective view showing the configuration of an electronic component module including electronic component 1. Figure 12 is an exploded perspective view of the electronic component module.

[0040] As shown in Figures 11 and 12, the electronic component module 100 comprises an electronic component 1, a lower wiring board 101 provided on the lower side of the electronic component 1, an upper wiring board 102 provided on the upper side of the electronic component 1, and a semiconductor IC chip 103 and a chip capacitor 104 surface-mounted on the upper surface of the upper wiring board 102. The semiconductor IC chip 103 is, for example, a voltage regulator IC.

[0041] On the upper surface of the lower wiring substrate 101, a plurality of electrode pads corresponding to the terminal electrodes 21b formed on the lower surface 10b of the magnetic element 10 and the lower end surfaces of the plurality of second conductive lines 30 are provided, and the lower surface side of the electronic component 1 is surface-mounted on the upper surface of the lower wiring substrate 101. Also, on the lower surface of the upper wiring substrate 102, a plurality of electrode pads corresponding to the terminal electrodes 21a formed on the upper surface 10a of the magnetic element 10 and the upper end surfaces of the plurality of second conductive lines 30 are provided, and the upper surface side of the electronic component 1 is surface-mounted on the lower surface of the upper wiring substrate 102. With this configuration, the electronic component 1 is in a state sandwiched between the lower wiring substrate 101 and the upper wiring substrate 102.

[0042] The upper wiring substrate 102 is electrically connected to the lower wiring substrate 101 via the first conductive line 20 and the second conductive line 30 of the electronic component 1. Thereby, the semiconductor IC chip 103 on the upper wiring substrate 102 is electrically connected to the first conductive line 20 and the second conductive line 30 via the upper wiring substrate 102.

[0043] FIG. 13 is a schematic cross-sectional view showing the mounted state of the electronic component module 100.

[0044] As shown in FIG. 13, the electronic component module 100 is surface-mounted on the motherboard 200. Thereby, the electronic component 1 is disposed between the electronic circuit (semiconductor circuit) on the upper wiring substrate 102 and the motherboard 200 and functions as an interposer for electrically connecting the two. Not only is the first conductive line 20 as an inductor disposed directly below the upper wiring substrate 102, but also signal pins 31 and power pins 32 are disposed (see FIG. 2). The first conductive line 20 is an inductor for a power supply circuit for noise removal and is disposed directly below the upper wiring substrate 102, so that the path connecting the semiconductor IC chip 103 and the first conductive line 20 can be shortened, and heat generation of the semiconductor IC chip 103 accompanying a large current can be suppressed.

[0045] As described above, embodiments of the technology according to the present disclosure have been explained. However, the technology according to the present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the gist thereof, and it is needless to say that those are also included within the scope of the technology according to the present disclosure.

[0046] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0047] An electronic component according to one aspect of the present disclosure includes a magnetic element having an upper surface, a lower surface, and a plurality of side surfaces, a first conductive line disposed inside the magnetic element, and a second conductive line disposed on the side surface of the magnetic element and partially embedded in the magnetic element, and a pair of end portions of the first conductive line constitute a pair of terminal electrodes exposed from the upper surface and the lower surface of the magnetic element, respectively. According to this, an electronic component that is small, has little dimensional variation, and is easy to assemble can be provided.

[0048] In the above-described electronic component, the exposed surface of the second conductive line from the side surface of the magnetic element may form the same plane as the surface of the magnetic element. According to this, an electronic component with little dimensional variation and less likely to cause mounting defects can be provided.

[0049] In the above-described electronic component, the second conductive line may include a signal pin and a power supply pin having a larger cross-sectional area than the signal pin. Thereby, both the power supply line and the signal line can be integrated with the first conductive line.

[0050] The above-described electronic component may further include a plating film that covers the exposed surfaces of the second conductive line and the terminal electrodes from the magnetic element. Thereby, the exposed surface of the conductor can be protected, and soldering on a wiring board becomes easy.

[0051] In the above-described electronic component, the first conductive line may be an inductor. Thereby, a small electronic component having an inductor built in the magnetic element can be realized.

[0052] In the above-described electronic component, there may be multiple first conductive lines. This makes it possible to realize a small electronic component with an inductor array built into the magnetic element.

[0053] In the above-described electronic component, the first conductive line and the second conductive line are made of copper, and the magnetic element may be made of a composite magnetic material in which magnetic fillers are solidified with a resin binder, or a compacted molded body of metallic magnetic powder. This makes it possible to increase the inductance of the conductive line.

[0054] The above-described electronic component may further include an insulating film that covers the non-exposed surfaces of the first conductive line and the second conductive line covered by the magnetic element. This makes it possible to improve the insulation of the conductive line and the second conductive line from the magnetic element.

[0055] Furthermore, a method for manufacturing an electronic component according to one aspect of this disclosure is characterized by comprising the steps of preparing a conductive line and a second conductive line, respectively, and integrally embedding the first conductive line and the second conductive line within a magnetic element. This makes it possible to easily manufacture small electronic components with minimal dimensional variation.

[0056] The above-described method for manufacturing electronic components may further include a step of processing the magnetic element in which the first conductive line and the second conductive line are embedded to expose a pair of ends of the first conductive line and a portion of the surface of the second conductive line. This makes it possible to manufacture electronic components with small dimensional variations and less prone to mounting defects.

[0057] In the above manufacturing method, the step of processing the magnetic element may include the step of polishing both sides of the magnetic element to form the upper and lower surfaces of the magnetic element, and the step of cutting the magnetic element to form the side surface of the magnetic element, the step of forming the upper surface of the magnetic element may include the step of exposing one end of the first conductive line and the upper end surface of the second conductive line on the upper surface of the magnetic element, the step of forming the lower surface of the magnetic element may include the step of exposing the other end of the first conductive line and the lower end surface of the second conductive line on the lower surface of the magnetic element, and the step of forming the side surface of the magnetic element may include the step of exposing the side surface of the second conductive line on the side surface of the magnetic element. This makes it possible to manufacture small electronic components with small dimensional variations.

[0058] The above-described method for manufacturing electronic components may further include the step of forming an insulating film on the surfaces of the first conductive line and the second conductive line before embedding the first conductive line and the second conductive line in the magnetic element. This can improve the insulation of the first conductive line and the second conductive line from the magnetic element.

[0059] The above method for manufacturing electronic components may further include the step of forming a plating film on the exposed surfaces of the first conductive line and the second conductive line from the magnetic element. This allows for the manufacture of electronic components that can protect the exposed surfaces of the conductors and that are easy to solder onto a wiring board.

[0060] Furthermore, an electronic component module according to one aspect of this disclosure comprises the electronic component described above, a lower wiring board provided on the lower side of the electronic component, and an upper wiring board provided on the upper side of the electronic component, wherein the upper wiring board is electrically connected to the lower wiring board via the first conductive line and the second conductive line. This makes it possible to provide an electronic component module that enables high-density mounting.

[0061] The above-described electronic component module further comprises a semiconductor IC chip mounted on the upper surface of the upper wiring board, and the semiconductor IC chip may be electrically connected to the first conductive line and the second conductive line via the upper wiring board. This allows for the integration of electronic circuits such as semiconductor IC chips and power supply circuit inductors into a module, thereby reducing mounting space through high-density mounting.

[0062] This application claims the interests of Japanese Patent Application No. 2025-020077, filed on 10 February 2025, the full disclosure of which is incorporated herein by reference.

[0063] 1 Electronic component 10 Magnetic element 10a Top surface of magnetic element 10b Bottom surface of magnetic element 10c Side surface of magnetic element 10d Side surface of magnetic element 10e Side surface of magnetic element 10f Side surface of magnetic element 10r Magnetic resin material 10s Assembly substrate 20 First conductive line 21 Terminal electrode 21a Terminal electrode 21b Terminal electrode 30 Second conductive line 30a Top surface 30b Bottom surface 30s Side surface 31 Signal pin 32 Power pin 40 Plating film 41 Insulating film 50 Metal plate material 60 Mold 61 Base plate 62 Movable plate 100 Electronic component module 101 Lower wiring board 102 Upper wiring board 103 Semiconductor IC chip 104 Chip capacitor 200 Motherboard

Claims

1. An electronic component comprising: a magnetic element having an upper surface, a lower surface and a plurality of side surfaces; a first conductive line disposed inside the magnetic element; and a second conductive line disposed on the side surface of the magnetic element, with a portion of it embedded within the magnetic element, wherein a pair of ends of the first conductive line constitute a pair of terminal electrodes exposed from the upper surface and the lower surface of the magnetic element, respectively.

2. The electronic component according to claim 1, wherein the exposed surface of the magnetic element of the second conductive line from the side surface is coplanar with the surface of the magnetic element.

3. The electronic component according to claim 1, wherein the second conductive line includes a signal pin and a power pin having a larger cross-sectional area than the signal pin.

4. The electronic component according to claim 1, further comprising a plating film covering the exposed surfaces of the second conductive line and the terminal electrode from the magnetic element.

5. The electronic component according to claim 1, wherein the first conductive line comprises an inductor.

6. The electronic component according to claim 1, wherein a plurality of the first conductive lines are provided.

7. The electronic component according to claim 1, wherein the first conductive line and the second conductive line are made of copper, and the magnetic element is made of a composite magnetic material obtained by solidifying a magnetic filler with a resin binder or a compacted molded body of metallic magnetic powder.

8. The electronic component according to claim 1, further comprising an insulating film covering the non-exposed surfaces of the first conductive line and the second conductive line covered by the magnetic element.

9. A method for manufacturing an electronic component, comprising the steps of preparing a first conductive line and a second conductive line, respectively, and integrally embedding the first conductive line and the second conductive line within a magnetic element.

10. The method for manufacturing an electronic component according to claim 9, further comprising the step of processing the magnetic element in which the first conductive line and the second conductive line are embedded to expose a pair of ends of the first conductive line and a portion of the surface of the second conductive line.

11. The method for manufacturing an electronic component according to claim 9 or 10, wherein the step of processing the magnetic element includes the steps of polishing both sides of the magnetic element to form an upper surface and a lower surface, respectively, and cutting the magnetic element to form a side surface, the step of forming the upper surface of the magnetic element includes the step of exposing one end of the first conductive line and the upper end surface of the second conductive line on the upper surface of the magnetic element, the step of forming the lower surface of the magnetic element includes the step of exposing the other end of the first conductive line and the lower end surface of the second conductive line on the lower surface of the magnetic element, and the step of forming the side surface of the magnetic element includes the step of exposing the side surface of the second conductive line on the side surface of the magnetic element.

12. The method for manufacturing an electronic component according to claim 9 or 10, further comprising the step of forming an insulating film on the surfaces of the first conductive line and the second conductive line before embedding the first conductive line and the second conductive line in the magnetic element.

13. The method for manufacturing an electronic component according to claim 9 or 10, further comprising the step of forming a plating film on the exposed surfaces of the first conductive line and the second conductive line from the magnetic element.

14. An electronic component module comprising an electronic component according to any one of claims 1 to 7, a lower wiring board provided on the lower side of the electronic component, and an upper wiring board provided on the upper side of the electronic component, wherein the upper wiring board is electrically connected to the lower wiring board via the first conductive line and the second conductive line.

15. The electronic component module according to claim 14, further comprising a semiconductor IC chip mounted on the upper surface of the upper wiring board, wherein the semiconductor IC chip is electrically connected to the first conductive line and the second conductive line via the upper wiring board.

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