Semiconductor manufacturing system and distortion detection method
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-01-26
- Publication Date
- 2026-08-13
Smart Images
Figure JP2026002423_13082026_PF_FP_ABST
Abstract
Description
Semiconductor manufacturing system and strain detection method
[0001] The present disclosure relates to a semiconductor manufacturing system and a strain detection method.
[0002] When a semiconductor manufacturing system conveys a substrate or a consumable part, etc. which is a conveyed object by a conveying device, the end effector of the conveying device may be distorted (bent, elastically deformed) by receiving the load of the conveyed object. In particular, when there is a displacement of the conveyed object with respect to the end effector, damage to the conveyed object, inclination of the conveyed object, etc., the conveying device cannot stably convey the conveyed object. For this reason, in a semiconductor manufacturing system, a configuration capable of recognizing the distortion of the end effector of the conveying device is required. Although it is not a configuration for detecting the distortion of the end effector, Patent Document 1 discloses a measuring device that installs a measuring jig having an optical fiber on a substrate and detects the amount of distortion of the substrate.
[0003] Japanese Unexamined Patent Application Publication No. 2022 - 116474
[0004] The present disclosure provides a technique capable of favorably recognizing the distortion of an end effector that supports a conveyed object in a conveying device.
[0005] According to one aspect of the present disclosure, there is provided a semiconductor manufacturing system including: a conveying device that conveys at least one of a substrate and a consumable part which is a conveyed object; an end effector provided at a distal end portion of the conveying device that supports the conveyed object; a strain detection unit that detects information related to the strain of the end effector; and an information processing unit that acquires the detection information of the strain detection unit and recognizes the strain state of the end effector based on the detection information.
[0006] According to one aspect, the distortion of an end effector that supports a conveyed object in a conveying device can be favorably recognized.
[0007] This is a plan view showing the overall configuration of the substrate processing system according to the embodiment. Figure 2(A) is a plan view showing the lower side of the end effector of the vacuum transfer device. Figure 2(B) is a cross-sectional view showing the configuration of the detector of the optical fiber sensor. Figure 3(A) is a graph illustrating the reflectance spectrum of each detector of the optical fiber sensor. Figure 3(B) is a graph illustrating the wavelength shift of the reflectance spectrum. This is a diagram showing the configuration of the strain detection unit provided in the vacuum transfer device. Figure 5(A) is a plan view showing the state in which the substrate is held normally by the end effector. Figure 5(B) is a plan view showing the state in which the substrate is held in a misaligned position by the end effector. This is a flowchart showing the processing flow of the strain detection method.
[0008] The following describes embodiments for implementing this disclosure with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.
[0009] As shown in Figure 1, the semiconductor manufacturing system according to the embodiment of this disclosure comprises a multi-chamber type substrate processing system 1 equipped with a plurality (six) processing modules 10 for processing a substrate W. The semiconductor manufacturing system is not limited to such a substrate processing system 1; for example, it could be an apparatus for inspecting the substrate W, an apparatus for measuring the state of the substrate W (film thickness, etc.), an apparatus for transporting only the substrate W, an apparatus for holding the substrate W in standby, etc.
[0010] Each processing module 10 of the substrate processing system 1 performs substrate processing such as film deposition, etching, modification, cleaning, bonding, peeling, and ashing on the substrate W that has been transported inside. In addition to each processing module 10, the substrate processing system 1 also includes a vacuum transport module 20, a plurality of load lock modules 30, an atmospheric transport module 40, a load port 50, and a control unit 90.
[0011] Each processing module 10 receives and delivers substrates W to and from the vacuum transport module 20, and performs substrate processing on the received substrates W. Of course, there are no particular limitations on the number of processing modules 10 provided in the substrate processing system 1. Furthermore, multiple processing modules 10 may perform the same processing on each other, or some or all of them may perform different processing. The substrate processing system 1 may also be configured to perform plasma processing in some or all of the processing modules 10.
[0012] Each processing module 10 includes a processing container 11 for housing a substrate W, and a substrate support section 12 for placing the substrate W inside the processing container 11. The processing container 11 has an opening 11a at the connection point with the vacuum transport module 20. The substrate support section 12 includes a lifter section (not shown) for raising and lowering the substrate W, and cooperates with the vacuum transport device 22 of the vacuum transport module 20 (described later) to receive and transfer the substrate W.
[0013] Furthermore, each processing module 10 is connected to the vacuum transport module 20 via a gate valve 15 provided in the opening 11a. Each processing module 10 can transport the substrate W between itself and the processing container 11 by opening the gate valve 15, and can reduce the pressure inside the processing container 11 to an appropriate vacuum atmosphere by closing the gate valve 15.
[0014] The vacuum transport module 20 of the substrate processing system 1 comprises a transport container 21 connected to each processing module 10 and each load lock module 30, and a vacuum transport device 22 (transport device) provided inside the transport container 21 for transporting substrates W.
[0015] The transport container 21 is formed in a rectangular shape in plan view and has a transport space 21s that is airtightly closed to the outside. The transport space 21s is reduced to a vacuum atmosphere by a vacuum suction device (not shown). In the substrate processing system 1 according to this embodiment, three processing modules 10 are connected to each of the pair of long sides of the transport container 21. In addition, the substrate processing system 1 has two load lock modules 30 connected to one of the short sides of the transport container 21.
[0016] The vacuum transport device 22 moves within the transport space 21s to transport the substrate W. For example, the vacuum transport device 22 transports the substrate W from one load lock module 30 to a target processing module 10. Alternatively, the vacuum transport device 22 transports the substrate W from one processing module 10 to a target load lock module 30. Or, the vacuum transport device 22 may transport the substrate W between two processing modules 10. Note that the transported items of the vacuum transport device 22 are not limited to substrates W. For example, if a consumable part of the processing module 10, such as a ring R (focus ring, edge ring, etc.), is transported via the vacuum transport module 20 and set in the processing module 10, the transported items of the vacuum transport device 22 may include the ring R. The ring R is positioned around the substrate W in the substrate support portion 12 of the processing module 10.
[0017] The vacuum conveying device 22 includes a base 221 that is movable in the longitudinal direction of the conveying container 21, a plurality of arms 23 provided on the upper part of the base 221, and an end effector 24 provided at the end of the vacuum conveying device 22. Although Figure 1 illustrates a vacuum conveying device 22 equipped with two end effectors 24, the vacuum conveying device 22 is not limited to this and may be equipped with one or three or more end effectors 24.
[0018] The base 221 of the vacuum conveying device 22 is configured to be movable along rails provided on the conveying container 21, for example. The base 221 may also include a lifting mechanism (not shown) for raising and lowering a plurality of arms 23 and end effectors 24 in the vertical direction.
[0019] Multiple arms 23 are interconnected via multiple joints (not shown), allowing each arm to pivot freely relative to the others. This enables the multiple arms 23 to move the end effector 24, supported by the end arm, to a target coordinate position (three-dimensional or two-dimensional coordinate position). Alternatively, the multiple arms 23 (for example, the end arms 23) may be configured to be extendable and retractable, thereby allowing the end effector 24 to move forward and backward.
[0020] On the other hand, the two load lock modules 30 of the substrate processing system 1 are installed between the vacuum transport module 20 and the atmospheric transport module 40, and switch the atmosphere inside the room between atmospheric and vacuum. Specifically, each load lock module 30 includes a container 31 for housing substrates W and a substrate support section 32 for placing the substrates W inside the container 31. For example, the substrate support section 32 has a groove (not shown) into which the end effector 24 of the vacuum transport device 22 and the end effector 44 of the atmospheric transport device 42 described later can enter, and the substrates W are received and transferred by the reciprocating and raising and lowering of the end effectors 24 and 44.
[0021] Furthermore, each load lock module 30 is equipped with a gate valve 33 on the vacuum transport module 20 side and a gate valve 35 on the atmospheric transport module 40 side. Each load lock module 30 communicates with the vacuum transport module 20 by opening the gate valve 33 in a vacuum atmosphere. Also, each load lock module 30 communicates with the atmospheric transport module 40 by opening the gate valve 35 in an atmospheric atmosphere.
[0022] The atmospheric transport module 40 of the substrate processing system 1 transports substrates W while maintaining an atmospheric environment inside. The atmospheric transport module 40 comprises a transport container 41 connected to each load lock module 30, and an atmospheric transport device 42 provided inside the transport container 41 for transporting substrates W. The atmospheric transport module 40 also has an aligner 45 on its side for positioning the substrates W. The atmospheric transport module 40 may also be configured to allow clean air to flow down into the transport container 41.
[0023] Furthermore, multiple load ports 50 are provided on one side of the atmospheric transport module 40. Each load port 50 is set with a carrier C containing a substrate W or an empty carrier C. For example, a FOUP (Front Opening Unified Pod) can be used as the carrier C. Alternatively, each load port 50 may be set with a carrier C containing a ring R, which is an example of a transported object.
[0024] The atmospheric conveying device 42, like the vacuum conveying device 22, has a base 421 that is movable in the longitudinal direction of the conveying container 41, a plurality of arms 43 that can rotate and extend relative to the base 421, and an end effector 44 provided at the end. The atmospheric conveying device 42 supports the substrate W on the upper surface of the end effector 44 and conveys the substrate W by appropriately operating the base 421 and each arm 43. Although Figure 1 illustrates an atmospheric conveying device 42 equipped with two end effectors 44, the atmospheric conveying device 42 is not limited to this and may be equipped with one or three or more end effectors 44.
[0025] The atmospheric transport device 42 loads and unloads substrates W between each carrier C attached to each load port 50 and the atmospheric transport module 40. The atmospheric transport device 42 also loads and unloads substrates W between each load lock module 30 and the atmospheric transport module 40 in accordance with the opening and closing of each gate valve 35. Furthermore, when aligning substrates W, the atmospheric transport device 42 loads and unloads substrates W relative to the aligner 45.
[0026] The control unit 90 is a computer having a processor 91, memory 92, an input / output interface (not shown), and a communication interface. The processor 91 is a combination of one or more of the following: CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field-Programmable Gate Array), a circuit consisting of multiple discrete semiconductors, etc. The memory 92 includes a main memory made of semiconductor memory, etc., and an auxiliary memory made of disks and semiconductor memory (flash memory), etc. The memory 92 may be configured by appropriately combining volatile memory and non-volatile memory (for example, compact disks, DVDs (Digital Versatile Discs), hard disks, flash memory, etc.).
[0027] Memory 92 stores a program for operating the board processing system 1 and a recipe for the board processing process conditions. The processor 91 controls each component of the board processing system 1 by reading and executing the program from memory 92. In other words, the control unit 90 is an electronic circuit having a CPU, GPU, ASIC, FPGA, etc., and performs the various control operations described in this specification by executing instruction codes stored in memory 92 or by designing the circuit for special applications. The control unit 90 may be composed of a host computer or multiple client computers that communicate information via a network.
[0028] For example, the control unit 90 controls the atmospheric transport module 40 to transport the unprocessed substrates W from the carrier C set in the load port 50 to the aligner 45 for alignment, and then transports the substrates W from the aligner 45 to each load lock module 30. After depressurizing the load lock module 30, the control unit 90 controls the vacuum transport module 20 to remove the substrates W using the vacuum transport device 22 and load the substrates W into the target processing module 10. Subsequently, the control unit 90 controls the processing module 10 to perform substrate processing on the loaded substrates W. After substrate processing, the control unit 90 controls various components to transport the substrates W processed in the processing module 10 back to the carrier C in the reverse order of the above procedure.
[0029] The vacuum transport module 20 of the substrate processing system 1 described above supports the substrate W on the upper surface of the end effector 24 of the vacuum transport device 22 when transporting the substrate W, and transports the substrate W by operating the base 221 and each arm 23. The configuration of the end effector 24 of the vacuum transport device 22 according to this embodiment will be described below with reference to Figures 2(A) and 2(B). The atmospheric transport device 42 of the atmospheric transport module 40 will not be described here, but the atmospheric transport device 42 may also adopt a configuration similar to that of the vacuum transport device 22.
[0030] The end effector 24 is configured to support the substrate W and the ring R arranged around the substrate W. The end effector 24 comprises a base portion 241 connected to the end arm 23 and a pair of fork portions 242 that branch out into two from the tip of the base portion 241. The base portion 241 and the pair of fork portions 242 are integrally molded with each other and are continuous in the horizontal direction. In plan view, the tip of the base portion 241 and the pair of fork portions 242 have a U-shape with the tip open.
[0031] The base portion 241 is a rectangular plate with a constant width that extends linearly from the end arm 23 toward the tip. The base portion 241 indirectly supports the substrate W or ring R via a pair of fork portions 242 that make contact with the substrate W or ring R. Alternatively, the base portion 241 may directly contact the substrate W or ring R at its upper surface toward the tip.
[0032] The pair of fork sections 242 are elongated plates that curve toward the tip, branching out from the base section 241, and extending parallel to each other and of the same length. The upper and lower surfaces of the base section 241 and the upper and lower surfaces of the pair of fork sections 242 are formed to be flush and continuous. The recessed space formed inside the base section 241 and the pair of fork sections 242 is the part through which the lifter section of the substrate support section 12, which moves up and down from the vertically downward side, passes.
[0033] The end effector 24 may be provided with a plurality of pads on the upper surface of the fork portion 242 (and / or the upper surface of the base portion 241) for supporting the substrate W and the ring R. The plurality of pads may be formed from a material such as elastomer and may contact the substrate W and ring R to be held with appropriate frictional and elastic force. The end effector 24 may also be equipped with holding means such as a suction mechanism, an electrostatic adsorption mechanism, or a mechanical locking mechanism to fix the supported substrate W or ring R with the holding means.
[0034] The end effector 24 may be equipped with a detection sensor (not shown) on the side opposite to the side supporting the substrate W (the bottom surface) to detect objects. For example, the detector probes of the detection sensor are provided near the extended ends of a pair of fork portions 242 (the tips of the end effector 24) to detect objects facing the vertically downward side of the end effector 24. A displacement sensor that optically measures the distance from the end effector 24 to the object can be used as this detection sensor. The substrate processing system 1 can use the detection information from the detection sensor to recognize the position of the substrate W or the ring R, or the positions of the substrate support portions 12 and 32.
[0035] When the vacuum conveying device 22 supports the substrate W with the end effector 24, it moves the end effector 24 so that its reference position coincides with the conveying position instructed by the control unit 90. The conveying position is, for example, the center position of the substrate W, the center position of the ring R, the center position of the substrate support portion 12 of the processing module 10, the center position of the substrate support portion 32 of the load lock module 30, etc. The reference position is the center position of the contact portion of the conveyed object, which is composed of a pair of fork portions 242 (and / or base portion 241), and is set and stored in advance in the robot controller 29 of the vacuum conveying device 22 (see Figure 4).
[0036] As described above, the end effector 24 will experience distortion due to the load it receives from the supported substrate W or ring R. In particular, if the substrate W or ring R is supported in a misaligned position, distortion may occur in the width direction perpendicular to the extension direction of the end effector 24. This distortion of the end effector 24 may cause the substrate W or ring R to fall during transport by the vacuum transport device 22, or reduce the transport accuracy.
[0037] Therefore, the substrate processing system 1 has installed a strain detection unit 25 on the end effector 24 of the vacuum transport device 22 in order to detect information related to the strain occurring in the end effector 24. The strain detection unit 25 according to this embodiment uses an optical measuring device that optically detects the strain of the end effector 24 and transmits the detected information to the control unit 90, which is an information processing unit. Specifically, the strain detection unit 25 includes an optical fiber sensor 26 and a measuring instrument 27 connected to the optical fiber sensor 26.
[0038] The optical fiber sensor 26 is fixed to the lower surface of the base portion 241. An arrangement groove 243 corresponding to the optical fiber sensor 26 is pre-formed on the lower surface of the end effector 24, and the optical fiber sensor 26 is housed along this arrangement groove 243. Alternatively, the optical fiber sensor 26 may be fixed to the upper surface of the base portion 241, and the arrangement groove 243 may be formed on the upper surface of the base portion 241 accordingly. Alternatively, the optical fiber sensor 26 may be embedded inside the end effector 24.
[0039] Furthermore, the end effector 24 includes a plurality of fixing parts 244 for fixing the optical fiber sensor 26 housed inside the placement groove 243. The plurality of fixing parts 244 may be made of adhesive, mechanical hooks, or the like as appropriate. For example, the plurality of fixing parts 244 are arranged so as to fix both ends of each detector 262 of the optical fiber sensor 26 to the end effector 24 in the extending direction. A pair of fixing parts 244 sandwiching each detector 262 can deform (extend, shorten) the detector 262 in conjunction with the distortion of the end effector 24.
[0040] The optical fiber sensor 26 comprises a linearly formed fiber body 261 and a plurality of detectors 262 provided at intermediate positions along the fiber body 261. One end of the fiber body 261 is connected to a fiber connector 263 provided on the outside of the base portion 241 (the arm 23 on the end side).
[0041] The fiber body 261 is routed so as to be folded back on the underside of the base portion 241. Specifically, the fiber body 261 extends linearly from the base end (the fixing point of the arm 23 on the terminal side) toward the tip of the base portion 241, near one end in the width direction of the base portion 241. At the tip side of the base portion 241, the fiber body 261 curves gently by 90°, then extends a short distance in the width direction of the base portion 241, and then curves gently by 90° again. Furthermore, the fiber body 261 extends linearly from the tip side of the base portion 241 toward the base end, near the other end in the width direction of the base portion 241. The end of the fiber body 261 is located at an intermediate position in the longitudinal direction of the base portion 241. In addition, a termination processing unit 264 capable of appropriately reflecting or suppressing the reflection of measurement light is provided at the end of the fiber body 261.
[0042] As shown in Figure 2(B), the fiber body 261 includes a core 2611 extending along its axis, a cladding 2612 surrounding the outer surface of the core 2611, and a covering material 2613 covering the periphery of the cladding 2612. The core 2611 and the cladding 2612 are made of quartz glass or the like, with different refractive indices. The refractive index n1 of the core 2611 is set to a range of approximately 1.463 to 1.467, for example. The refractive index n2 of the cladding 2612 is set to a range of approximately 1.45 to 1.46, for example.
[0043] Multiple detectors 262 of the optical fiber sensor 26 utilize fiber Bragg diffraction gratings (FBGs). The optical fiber sensor 26 according to this embodiment has five detectors 262 on the end effector 24. Therefore, the five detectors 262 of the optical fiber sensor 26 will hereinafter also be referred to as detector FBG1 to detector FBG5. Detectors FBG1 to detector FBG5 are arranged in this order, spaced apart, from the base end (fiber connector 263) of the fiber body 261 toward the extended end. The number and position of the detectors 262 of the optical fiber sensor 26 are not particularly limited and may be designed appropriately based on the shape of the end effector 24, etc.
[0044] The optical fiber sensor 26 can arrange each detector 262 at an appropriate design position on the lower surface of the base portion 241 in a state where the fiber main body 261 is arranged in the arrangement groove 243 of the base portion 241. Specifically, the detector FBG1 and the detector FBG5 are arranged at positions closer to the base end of the base portion 241 so as to be aligned with each other in the width direction. Also, the detector FBG2 and the detector FBG4 are arranged at positions on the tip side of the detectors FBG1 and FBG5 so as to be aligned with each other in the width direction. The detector FBG3 is arranged at a position (the center position in the width direction of the base portion 241) where the fiber main body 261 extends in the width direction on the tip side of the base portion 241. The detector FBG3 is preferably arranged at a position that does not overlap with the substrate W or the ring R in a state where the substrate W or the ring R is supported by the end effector 24 (see also FIG. 5(A)). However, it is not limited to this, and the detector FBG3 may be arranged at a position that overlaps with the substrate W or the ring R.
[0045] As shown in FIG. 2(B), each of the detectors FBG1 to FBG5 arranges a plurality of reflection elements 2621 having a refractive index higher than the refractive index n1 of the core 2611 in the extending direction of the fiber main body 261. The plurality of reflection elements 2621 are, for example, portions where the refractive index is increased by doping Ge or the like into the silica glass constituting the core 2611.
[0046] Each of the detectors FBG1 to FBG5 formed in this way is configured to reflect reflected light having reflectance spectra with different peak wavelengths within the same fiber main body 261. For example, as shown in FIG. 3(A), the reflectance spectra of the peak wavelengths reflected by each of the detectors FBG1 to FBG5 are separated from each other by a preset wavelength interval. Each of the detectors FBG1 to FBG5 reflects the reflected light of the set peak wavelength when no strain is generated in the end effector 24.
[0047] When distortion occurs in the end effector 24, each reflecting element 2621 of the detector 262 at the portion where the distortion has occurred changes (extends or contracts) the distance between each other based on the distortion of the end effector 24. As a result, the detector 262 at the portion where the distortion has occurred reflects the measurement light with a reflectance spectrum in which the peak wavelength has shifted according to the distortion of the end effector 24. For example, when distortion occurs in the end effector 24 in the detectors FBG4 and FBG5, as shown in FIG. 3(B), the peak wavelength of FGB4 and the peak wavelength of FGB5 shift. Therefore, the control unit 90 connected to the distortion detection unit 25 can monitor at which location (each detector FBG1 to FBG5) of the end effector 24 the distortion has occurred. Further, the control unit 90 can recognize the amount of distortion at that location based on the amount of shift of the peak wavelength of each detector FBG1 to FBG5.
[0048] Also, as shown in FIG. 4, the optical fiber sensor 26 is connected to a fiber line 28 disposed inside each arm 23 (including the arm 23 on the end side), inside the joint portion, and inside the base 221 of the vacuum transfer device 22 via a fiber connector 263. The fiber line 28 reaches the outside of the transfer container 21 of the vacuum transfer module 20 via a fiber connector 281 provided in the base 221. The other end of the fiber line 28 is connected to the measuring device 27 outside the transfer container 21. Note that the inside of each arm 23, the inside of the joint portion, and the inside of the base 221 up to the fiber connector 263 of the vacuum transfer device 22 may be an air atmosphere. The fiber connector 263 is sealed so as to be airtightly adhered to the arm 23 on the end side, thereby preventing the destruction of the vacuum atmosphere in the transfer container 21 and allowing the fiber line 28 to be wired to the outside of the transfer container 21 through the vacuum feedthrough.
[0049] The measuring instrument 27 emits measurement light to the optical fiber sensor 26 and acquires reflected light from each detector 262, and analyzes the state of this reflected light. An interrogator can be used as this measuring instrument 27. The measuring instrument 27 is also configured to transmit detection information from the strain detection unit 25 to the control unit 90 via the robot controller 29. For example, the measuring instrument 27 calculates the amount of strain for each detector FBG1 to FBG5 based on its peak wavelength, and transmits detection information to the control unit 90 that links the identification information of each detector FBG1 to FBG5 with the amount of strain.
[0050] The robot controller 29 is a control device (computer) that controls the operation of the vacuum conveying device 22 in response to control commands from the control unit 90. The robot controller 29 may correct the operation of the vacuum conveying device 22 using the detection information from the strain detection unit 25. For example, when the robot controller 29 acquires the location and amount of strain in the end effector 24, it corrects the preset reference position based on this information. Then, by moving each component of the vacuum conveying device 22 based on the corrected reference position, the end effector 24 can be moved to the target conveying position with high precision.
[0051] Furthermore, the control unit 90 can estimate the transport state of the substrate W or ring R based on the strain state of the end effector 24 recognized from the strain detection information of the strain detection unit 25. For example, if the control unit 90 determines that there is an abnormality in the transport state of the substrate W or ring R during transport, it can take early action such as stopping the transport of the vacuum transport device 22, repositioning the substrate W or ring R, or notifying the abnormality.
[0052] As shown in Figure 5(A), when the substrate W is supported such that the reference position 24o of the end effector 24 coincides with the center position Wo of the substrate W, the end effector 24 will deform only in the longitudinal direction (extending direction) under the load of the substrate W. In this case, the amount of distortion of the detector FBG1 and the detector FBG5, which are aligned at the same position in the longitudinal direction of the end effector 24, will be the same. Also, the amount of distortion of the detector FBG2 and the detector FBG4, which are aligned at the same position in the longitudinal direction of the end effector 24, will be the same. Note that when the reference position 24o of the end effector 24 coincides with the center position Wo of the substrate W, the detector FBG3 will not detect any distortion.
[0053] Furthermore, the amount of strain in detector FBG1 and detector FBG2 (or the amount of strain in detector FBG5 and detector FBG4) may be the same, but they may also be different. The longitudinal strain of the end effector 24 depends on the shape of the end effector 24, but for example, it tends to be larger on the base end side where a large load is more likely to be applied.
[0054] Therefore, the control unit 90 can determine that the end effector 24 is properly supporting the substrate W (without misalignment) when the amount of strain of the detector FBG1 and the amount of strain of the detector FBG5 (and / or the amount of strain of the detector FBG2 and the amount of strain of the detector FBG4) are the same.
[0055] On the other hand, as shown in Figure 5(B), when the reference position 24o of the end effector 24 and the center position Wo of the substrate W are offset in the width direction of the end effector 24 and the substrate W is supported in this manner, the end effector 24 will be distorted in the width direction by the load of the substrate W. In this case, the amount of distortion of the detector FBG1 and the detector FBG5, which are aligned at the same position in the longitudinal direction of the end effector 24, will be different. Specifically, the amount of distortion of detector FBG1, which will receive a larger load from the substrate W, will be larger, while the amount of distortion of detector FBG5, which will receive a smaller load from the substrate W, will be smaller (the relationship is FBG1 distortion > FBG5 distortion). Similarly, the amount of distortion of detector FBG2 and the detector FBG4, which are aligned at the same position in the longitudinal direction of the end effector 24, will be different (the relationship is FBG2 distortion > FBG4 distortion). Furthermore, if the reference position 24o of the end effector 24 and the center position Wo of the substrate W are misaligned in the width direction of the end effector 24, the end effector 24 will also be distorted in the width direction, making it possible for the detector FBG3 to detect the distortion.
[0056] Therefore, for example, the control unit 90 compares the difference between the amount of strain of detector FBG1 and the amount of strain of detector FBG5 (and / or the amount of strain of detector FBG2 and the amount of strain of detector FBG4) with a pre-established threshold. If the difference is less than the threshold, the control unit 90 allows the positional displacement of the substrate W relative to the end effector 24 and transports the substrate W. On the other hand, if the difference is greater than or equal to the threshold, the control unit 90 can determine that there is an abnormality in the support state of the substrate W by the end effector 24. If the control unit 90 determines an abnormality, it performs abnormality notification processing such as stopping the transport of the vacuum transport device 22 and repositioning the substrate W, as described above. In addition, if the substrate processing system 1 repositions the substrate W in the abnormality determination, it may perform processing to re-support the substrate W by correcting the position of the end effector 24 using the robot controller 29.
[0057] Alternatively, the control unit 90 may estimate damage to the substrate W or ring R based on the position and strain amount of each detector FBG1 to FBG5. For example, damage to the substrate W may include cracking of the substrate W. Damage to the ring R may include the degree of wear of the ring R used in the processing module 10. As an example, the control unit 90 stores the strain amount at the locations of each detector FBG1 to FBG5 when supporting the substrate W or ring R before processing, and compares it with the strain amount at the locations of each detector FBG1 to FBG5 when supporting the substrate W or worn ring R after processing. Then, based on large fluctuations in the strain amount, fluctuations in the location of the strain, etc., it can estimate damage to the substrate W or ring R.
[0058] Alternatively, for example, the control unit 90 may estimate the tilt of the transported object based on the position and strain amount of each detector FBG1 to FBG5. As an example, the tilt of the transported object can be recognized, similar to positional misalignment, based on the strain amounts of detectors FBG1, FBG5, FBG2, and FBG4 which are arranged relative to each other in the end effector 24.
[0059] The substrate processing system 1 according to this embodiment is basically configured as described above, and its operation (strain detection method) will be explained below with reference to Figure 6.
[0060] The control unit 90 of the substrate processing system 1 controls various configurations of the vacuum transport module 20 when the substrate W (or ring R) is transported by the end effector 24, and performs the processing flow shown in steps S101 to S105 of Figure 6.
[0061] Specifically, the control unit 90 outputs control commands to the robot controller 29, thereby controlling the vacuum transport device 22 via the robot controller 29 to support the substrate W, including the substrate support sections 12 and 32, with the end effectors 24 (step S101).
[0062] For example, at an upper position of the substrate support parts 12, 32, etc., the strain detection unit 25 detects information related to the strain of the end effector 24 supporting the substrate W based on the reflectance spectra of each detector FBG1 to FBG5 of the optical fiber sensor 26 (step S102: step (A)). If the center position Wo of the substrate W is misaligned with respect to the reference position 24o of the end effector 24, the strain detection unit 25 will calculate different amounts of strain for each detector FBG1 to FBG5.
[0063] Therefore, the control unit 90 calculates the difference in the amount of strain of the acquired detectors FBG1 to FBG5 and determines whether this difference is greater than or equal to a threshold (step S103: (B)). If the difference is less than the threshold (step S103: NO), it determines that the support state of the substrate W by the end effector 24 is normal and proceeds to step S104.
[0064] In step S104, the control unit 90 transports the substrate W to the target object (processing module 10, load lock module 30, etc.) using the vacuum transport device 22. At this time, since the end effector 24 is holding the substrate W properly, the substrate W can be transported stably to the target object. The control unit 90 may also use the strain amount data of each detector FBG1 to FBG5 to predict the amount of strain at the tip of the end effector 44 and correct the movement operation based on this amount of strain.
[0065] On the other hand, in step S103, if the difference is greater than or equal to a threshold (step S103: YES), an abnormality in the support state of the substrate W by the end effector 24 is determined, and the process proceeds to step S105.
[0066] In step S105, the control unit 90 stops the transport of the substrate W by the vacuum transport device 22. The control unit 90 also controls the vacuum transport device 22 to place the supported substrate W back onto the substrate support sections 12 and 32. This prevents the substrate processing system 1 from transporting the substrate W which is experiencing abnormalities, thus preventing problems such as the substrate W coming into contact with a structure or being dropped during the transport process. Alternatively, if the control unit 90 recognizes an abnormality in the support state of the substrate W, it may notify the user of the abnormality via the user interface of the control unit 90 (monitor, speaker, etc.).
[0067] As described above, the substrate processing system 1 and strain detection method can accurately detect the strain of the end effector 24 using the strain detection unit 25 installed on the end effector 24. Furthermore, because the strain detection unit 25 uses an optical fiber sensor 26, even when multiple detectors 262 are used to detect strain at multiple locations on the end effector 24, only one wire is required, thus simplifying the layout and reducing wiring. However, multiple optical fiber sensors 26 may be wired. In this way, the optical fiber sensor 26 makes it easier to secure wiring space and suppresses the influence of electrical noise in the transport container 21, enabling accurate detection of strain on the end effector 44. In addition, the optical fiber sensor 26 has advantages such as being able to be used well in a vacuum atmosphere and having a wide operating temperature range (-80°C to 150°C).
[0068] Furthermore, the substrate processing system 1 can detect abnormalities such as misalignment, damage, and tilting of the transported object during transport by the end effector 24, thereby enabling the prevention of transport abnormalities. In addition, the control unit 90 can estimate the strain state of the tip of the end effector 24 using the strain amount data detected by each detector FBG1 to FBG5 during transport, allowing for effective position correction and other adjustments based on the strain amounts of each detector FBG1 to FBG5.
[0069] Furthermore, the substrate processing system 1 and strain detection method according to this disclosure are not limited to the above-described embodiments and can be modified in various ways. For example, in the atmospheric conveying device 42, the strain detection unit 25 may be provided on the end effector 44 to monitor the strain state of the end effector 44. Also, the consumable parts supported by the end effectors 24 and 44 of the conveying devices (vacuum conveying device 22, atmospheric conveying device 42) are not limited to the ring R, but may be parts that constitute the processing module 10 (electrodes, shielding members).
[0070] Furthermore, the substrate processing system 1 may detect the distortion of the end effector 24 using the distortion detection unit 25 even when it is not supporting the transported object. This allows the control unit 90 to recognize the current distortion state of the end effector 24. For example, the control unit 90 can store the detection information for the end effector 24 when it was new, compare the current distortion state of the end effector 24 with the state when it was new, and notify the system of maintenance if the distortion of the end effector 24 is large.
[0071] The strain detection unit 25 is not limited to a configuration in which the optical fiber sensor 26, which is the detection element, is installed only on the base portion 241 of the end effector 24. For example, it may also be configured to install the optical fiber sensor 26 on the fork portion 242 to detect strain in the fork portion 242. Alternatively, the strain detection unit 25 may install the optical fiber sensor 26 on the arm 23 of the vacuum transport device 22 (for example, the end arm 23) to detect strain in the arm 23.
[0072] Furthermore, although the strain detection unit 25 according to this embodiment uses an optical fiber sensor 26 as the detection element installed on the end effector 24, other strain gauges may be used instead of the optical fiber sensor 26. Examples of other strain gauges include foil-shaped or plate-shaped strain gauges having resistors or the like inside, line strain gauges, and semiconductor strain gauges. Alternatively, the strain detection unit 25 may be a non-contact type sensor that detects the strain of the end effector 24 at a position away from the end effector 24 without being installed on the end effector 24. Examples of such non-contact type sensors include shape measuring instruments such as cameras and laser scanners.
[0073] <Note> The embodiments disclosed above include, for example, the following aspects.
[0074] [Note 1] A semiconductor manufacturing system comprising: a transport device for transporting at least one of a substrate and consumable parts which are transported objects; an end effector provided at the end of the transport device for supporting the transported objects; a strain detection unit for detecting information related to the strain of the end effector; and an information processing unit for acquiring the detection information from the strain detection unit and recognizing the strain state of the end effector based on the detection information.
[0075] [Note 2] The semiconductor manufacturing system according to Note 1, wherein the end effector comprises a base portion that supports the portion in contact with the transported object, and the strain detection unit includes a strain gauge provided on the base portion that deforms integrally with the base portion to detect the strain of the base portion.
[0076] [Note 3] The strain gauge is an optical fiber sensor, as described in Note 2 for the semiconductor manufacturing system.
[0077] [Note 4] The semiconductor manufacturing system according to Note 3, wherein the optical fiber sensor is housed inside the arrangement groove formed in the base portion.
[0078] [Note 5] The semiconductor manufacturing system according to Note 3 or 4, wherein the optical fiber sensor extends from the base end towards the tip end of the base portion toward one end in the width direction of the base portion, and then folds back at the tip end and extends toward the base end toward the other end in the width direction of the base portion.
[0079] [Appendix 6] The semiconductor manufacturing system according to any one of Appendix 3 to 5, wherein the optical fiber sensor comprises a plurality of detectors in the base portion.
[0080] [Note 7] The semiconductor manufacturing system according to Note 6, wherein the information processing unit estimates at least one of the distortion state in the extension direction of the end effector and the distortion state in the width direction perpendicular to the extension direction of the end effector, based on the detection information of the plurality of detectors acquired and the positions of the plurality of detectors held.
[0081] [Note 8] The semiconductor manufacturing system according to any one of Notes 1 to 7, wherein the information processing unit estimates the transport state of the transported object based on the distortion state of the end effector when the transported object is supported by the end effector.
[0082] [Note 9] The semiconductor manufacturing system according to Note 8, wherein the information processing unit estimates at least one of the following as the transport state of the transported object: displacement of the transported object, damage to the transported object, and tilt of the transported object.
[0083] [Note 10] The semiconductor manufacturing system according to any one of Notes 1 to 9, wherein the strain detection unit is connected to a measuring instrument installed in an atmospheric environment via wiring that connects to the strain gauge, passing through the inside of the transport device.
[0084] [Note 11] A strain detection method for detecting strain in an end effector in a semiconductor manufacturing system comprising: a transport device for transporting at least one of a substrate and consumable parts which are transported objects; and an end effector provided at the end of the transport device for supporting the transported objects, the strain detection method comprising: (A) a step of detecting information related to the strain of the end effector using a strain detection unit; and (B) a step of acquiring the detection information of the strain detection unit detected in step (A) using an information processing unit, and recognizing the strain state of the end effector based on the detection information.
[0085] The semiconductor manufacturing system and strain detection method according to the embodiments disclosed herein are illustrative and not restrictive in all respects. The embodiments can be modified and improved in various ways without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be otherwise configured and combined in a non-consistent manner.
[0086] This application claims priority to Japanese Patent Application No. 2025-019492, which was filed with the Japan Patent Office on February 7, 2025, and the entire contents of that application are incorporated herein by reference.
[0087] 1 Substrate processing system 22 Vacuum transport device 24 End effector 25 Strain detection unit 90 Control unit R Ring W Substrate
Claims
1. A semiconductor manufacturing system comprising: a transport device for transporting at least one of a substrate and consumable parts, which are transported objects; an end effector provided at the end of the transport device for supporting the transported objects; a strain detection unit for detecting information related to the strain of the end effector; and an information processing unit for acquiring the detection information from the strain detection unit and recognizing the strain state of the end effector based on the detection information.
2. The semiconductor manufacturing system according to claim 1, wherein the end effector comprises a base portion that supports the portion in contact with the transported object, and the strain detection unit comprises a strain gauge provided on the base portion that deforms integrally with the base portion to detect strain on the base portion.
3. The semiconductor manufacturing system according to claim 2, wherein the strain gauge is an optical fiber sensor.
4. The semiconductor manufacturing system according to claim 3, wherein the optical fiber sensor is housed inside an arrangement groove formed in the base portion.
5. The semiconductor manufacturing system according to claim 3, wherein the optical fiber sensor extends from the base end towards the tip end of the base portion toward one end in the width direction of the base portion, and then folds back at the tip end and extends toward the base end toward the other end in the width direction of the base portion.
6. The semiconductor manufacturing system according to claim 5, wherein the optical fiber sensor comprises a plurality of detectors in the base portion.
7. The semiconductor manufacturing system according to claim 6, wherein the information processing unit estimates at least one of the distortion state in the extension direction of the end effector and the distortion state in the width direction perpendicular to the extension direction of the end effector, based on the detection information of the plurality of detectors acquired and the positions of the plurality of detectors held.
8. The semiconductor manufacturing system according to any one of claims 1 to 7, wherein the information processing unit estimates the transport state of the transported object based on the distortion state of the end effector when the transported object is supported by the end effector.
9. The semiconductor manufacturing system according to claim 8, wherein the information processing unit estimates at least one of the following as the transport state of the transported object: displacement of the transported object, damage to the transported object, and tilt of the transported object.
10. The semiconductor manufacturing system according to any one of claims 1 to 7, wherein the strain detection unit has wiring connected to the strain gauge that passes through the inside of the transport device and is connected to a measuring instrument installed in an atmospheric environment.
11. A strain detection method for detecting strain in an end effector in a semiconductor manufacturing system comprising: a transport device for transporting at least one of a substrate and consumable parts which are transported objects; and an end effector provided at the end of the transport device for supporting the transported objects, the strain detection method comprising: (A) a step of detecting information related to the strain of the end effector using a strain detection unit; and (B) a step of acquiring the detection information of the strain detection unit detected in step (A) using an information processing unit, and recognizing the strain state of the end effector based on the detection information.