Detection device
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-02-02
- Publication Date
- 2026-08-13
Smart Images
Figure JP2026003561_13082026_PF_FP_ABST
Abstract
Description
Detection device
[0001] An embodiment of the present invention relates to a detection device.
[0002] As a non-contact detection device, a capacitance sensor or a hover sensor is known. Usually, when a hover sensor is installed inside a wall, it can only be operated from one side. Also, when a hover sensor is attached to an acrylic partition or the like, it cannot be operated from both sides. By removing the shield layer of the hover sensor, it becomes possible to operate from both sides, but in this case, it becomes difficult to determine from which side the operation was performed.
[0003] Japanese Patent Application Laid-Open No. 2024-21759, Japanese Patent Application Laid-Open No. 2023-55127
[0004] An object of an embodiment of this invention is to provide a detection device capable of operating and detecting from both sides.
[0005] The detection device according to the embodiment includes a base layer, a sensor electrode layer provided on the first main surface of the base layer and forming a plurality of sensor electrodes and a plurality of wirings connected to the plurality of sensor electrodes, and a shield electrode layer provided on the second main surface of the base layer and forming a shield electrode facing at least a part of the sensor electrodes. The sensor substrate includes a controller that supplies a drive signal to the plurality of sensor electrodes and processes a detection signal output from the sensor electrodes. The sensor substrate is bent with the second main surface of the base layer on the inside, and includes a first detection unit including a plurality of the sensor electrodes, a second detection unit provided facing at least a part of the first detection unit and including a plurality of the sensor electrodes, and a bent portion located between the first detection unit and the second detection unit.
[0006] Figure 1 is a perspective view showing a hover detection device according to the first embodiment. Figure 2 is a cross-sectional view of the hover detection device along line A-A in Figure 1. Figure 3 is a plan view showing the sensor electrode side of the sensor substrate in the deployed state of the hover detection device. Figure 4 is a plan view showing an enlarged portion of the sensor substrate. Figure 5 is a plan view showing the shield layer side of the sensor substrate. Figure 6 is a block diagram showing an example of the schematic configuration of the hover detection device. Figure 7 is a flowchart showing an example of the hover detection operation in the hover detection device. Figure 8 is a timing chart showing an example of the operation of a frequency-hopping capable hover detection device according to the first embodiment. Figure 9 is a cross-sectional view of a hover detection device according to the second embodiment. Figure 10 is a plan view showing the sensor electrode side of the sensor substrate in the deployed state of the hover detection device according to the second embodiment. Figure 11 is a cross-sectional view of a hover detection device according to the third embodiment. Figure 12 is a plan view showing the shield layer side of the sensor substrate in the deployed state of the hover detection device according to the third embodiment. Figure 13 is a cross-sectional view of a hover detection device according to the fourth embodiment. Figure 14 is a plan view showing the sensor electrode side of the sensor substrate in the deployed state of the hover detection device according to the fourth embodiment. Figure 15 is a plan view showing a magnified portion of the sensor substrate. Figure 16 is a plan view corresponding to Figure 15 showing a modified example of the sensor substrate. Figure 17 is a plan view showing a magnified portion of the shield layer side of the sensor substrate in the fourth embodiment. Figure 18 is a plan view corresponding to Figure 17 showing a modified example of the shield electrode layer.
[0007] Embodiments of this invention will be described in detail below with reference to the drawings. Note that the disclosure is merely an example, and modifications that are easily conceivable by those skilled in the art while maintaining the spirit of the disclosure are naturally included within the scope of this disclosure. Furthermore, in order to clarify the explanation, the drawings may schematically represent the width, thickness, shape, etc., of each part compared to the actual embodiment, but these are merely examples and do not limit the interpretation of this disclosure. In addition, in this specification and in each drawing, elements similar to those described above in previously shown drawings are denoted by the same reference numerals, and detailed explanations may be omitted as appropriate.
[0008] (First Embodiment) As an example of a detection device, a double-sided hover detection device (sometimes referred to as a hover sensor) according to the first embodiment will be described in detail. Figure 1 is a perspective view of the hover detection device according to the first embodiment. Figure 2 is a cross-sectional view of the hover detection device along line A-A in Figure 1.
[0009] As shown in Figures 1 and 2, the hover detection device 10 comprises a sensor substrate 12, a detection circuit board 14 constituting a controller, and an external control device (host computer) 16. In the following description, one direction in the plane parallel to the sensor substrate 12 is referred to as the Y direction (sometimes called the first direction), one direction in the plane parallel to the sensor substrate 12 that is perpendicular to the Y direction is referred to as the X direction (sometimes called the second direction), and the direction perpendicular to the X and Y directions, and the normal direction of the main surface of the sensor substrate 12 is referred to as the Z direction. Note that the Y direction Y may intersect the X direction without being perpendicular. Also, "plan view" refers to the state as seen from a direction perpendicular to the main surface of the sensor substrate 12.
[0010] In one example, the sensor substrate 12 is composed of a two-layer flexible printed circuit board (FPC). Specifically, the sensor substrate 12 includes, for example, a rectangular base substrate (base layer) 20, a conductive layer laminated on the first main surface S1 side of the base substrate 20, for example, a sensor electrode layer SE made of copper foil, a first surface protection layer PL1 laminated on the first main surface S1 on top of the sensor electrode layer SE, a conductive layer laminated on the second main surface S2 side of the base substrate 20 facing the first main surface S1, for example, a shield electrode layer SL made of copper foil, and a second surface protection layer PL2 laminated on the second main surface S2 on top of the shield electrode layer SL. The film thickness T of the sensor substrate 12 in the Z direction is set to, for example, 124 μm. The sensor substrate 12 is a capacitive sensor array that detects the approach or contact of an object to be detected to the side of the sensor electrode layer SE.
[0011] The sensor substrate 12 is folded in half with the second surface protection layer PL2 facing inward. The sensor substrate 12 comprises a first detection section 22A which is substantially rectangular in shape with the sensor electrode layer SE facing in one direction in the Z direction, a second detection section 22B which is substantially rectangular in shape with the sensor electrode layer SE facing in the opposite direction in the Z direction, and a bent section 22C located between the first detection section 22A and the second detection section 22B. The bent section 22C is bent by approximately 180 degrees. As a result, the entire area of the second detection section 22B is facing the first detection section 22A almost parallel to it. The second surface protection layer PL2 of the second detection section 22B is adjacent to or in close contact with the second surface protection layer PL2 of the first detection section 22A. Furthermore, in order to fix the flexible sensor substrate 12, a plate material (not shown) may be inserted between the second surface protective layer PL2 of the second detection unit 22B and the second surface protective layer PL2 of the first detection unit 22A. In this case, it is desirable to set the length of the bent portion 22C taking into consideration the thickness of the plate material.
[0012] The detection circuit board 14 comprises a printed circuit board 15 and a plurality of electronic components or semiconductor elements mounted on the printed circuit board 15. In one example, the detection circuit board 14 includes a semiconductor element SD1 that constitutes an AFE circuit 24 that performs hover detection based on a detection signal from the sensor board 12, and a semiconductor element SD2 that constitutes a control circuit 25 that controls the hover detection operation in the AFE circuit 24. The AFE circuit (sometimes referred to as the detection circuit) 24 is, for example, an analog front end (AFE) circuit. The control circuit 25 includes, for example, an MCU (Micro Control Unit).
[0013] The detection circuit board 14 has a first connector CN1 and a second connector CN2 mounted on a printed circuit board 15. One end of the sensor substrate 12 (the end opposite to the bent portion 22C) is connected to the first connector CN1. As a result, the sensor electrode layer SE and the shield electrode layer SL of the sensor substrate 12 are electrically connected to the detection circuit board 14. The external control device 16 is connected to the second connector CN2 via an FPC 17. The external control device 16 is a device that functions as the host computer (host) of the hover detection device 10 according to this embodiment. The external control device (host) 16 can be any terminal capable of receiving hover operations in the hover detection device 10.
[0014] Figure 3 is a plan view showing the sensor electrode layer SE side of the unfolded sensor substrate 12. In Figure 3, the first surface protection layer PL1 is omitted. Figure 4 is a plan view showing an enlarged portion of the sensor substrate. Figure 5 is a plan view showing the shield electrode layer SL side of the unfolded sensor substrate 12. In Figure 5, the second surface protection layer PL2 is omitted.
[0015] As shown in Figure 3, the sensor substrate 12 has a rectangular base substrate 20 that functions as a core material. The base substrate 20 is not limited to a rectangular shape, but in this embodiment, it is a rectangular base substrate having sides along the X and Y directions. The base substrate 20 has a rectangular first main surface S1 and a rectangular second main surface S2 facing the first main surface S1. In this embodiment, the base substrate 20 integrally has a protrusion 20c that projects in the X direction from the center of one side edge. The protrusion 20c constitutes the connection end of the sensor substrate 12. The base substrate 20 is an insulating substrate, and for example, a flexible substrate made of polyimide or the like can be used. The base substrate 20 may be made of an insulating material that can transmit visible light.
[0016] The sensor electrode layer SE laminated on the first main surface S1 of the base substrate 20 has a plurality of sensor electrodes PX and a plurality of wiring lines WL formed by patterning a conductive layer. The first main surface S1 has, for example, a rectangular detection area SA and a peripheral area (non-detection area) BE located around the detection area SA.
[0017] Multiple sensor electrodes PX are provided in the detection area SA. The multiple sensor electrodes PX are arranged in a matrix along the X and Y directions. For example, if the Y direction is the row and the X direction is the column, the sensor electrodes PX are arranged in an 8x5 matrix. In one example, the sensor electrodes PX are composed of a rectangular planar pattern. The sensor electrode layer SE is not limited to copper, but may be formed from other metals such as titanium and molybdenum, or from an alloy containing one or more of these metals. Furthermore, the sensor electrodes PX may be formed from a translucent conductive material such as indium-tin mixed oxide (ITO) or indium-zinc mixed oxide (IZO).
[0018] Multiple wirings WL are provided in the gaps between the rows of non-detection regions BE and sensor electrodes PX; in this case, eight wirings are provided in each row. One end of each wiring WL is connected to the corresponding sensor electrode PX, and the other end extends through the peripheral region BE to the protrusion 20c. In this embodiment, the sensor electrode layer SE includes a peripheral shield electrode AX formed by patterning a conductive layer. The peripheral shield electrode AX is provided in the peripheral region BE. The peripheral shield electrode AX extends along the four sides of the detection region SA, surrounding the sensor electrodes PX and wirings WL. Both ends of the peripheral shield electrode AX extend through the peripheral region BE to the protrusion 20c.
[0019] As shown in Figure 5, a conductive layer, such as a copper foil shield electrode layer SL, is laminated on the second main surface S2 of the base substrate 20. The shield electrode layer SL constitutes a solid rectangular shield electrode 27 having dimensions approximately equal to the second main surface S2. In one example, the shield electrode 27 faces all the sensor electrodes PX and all the wiring WL with the base substrate 20 in between.
[0020] On the second main surface S2, a plurality of connection terminals CT are provided on the protrusion 20c. These connection terminals CT each extend in the X direction and are spaced apart in the Y direction. The shield electrode 27 is connected to at least one of the connection terminals CT. Furthermore, the plurality of connection terminals CT are electrically connected to a plurality of wirings WL on the first main surface S1 side via a plurality of plated through-holes (see Figure 2, sometimes referred to as vias) MH.
[0021] The first surface protection layer PL1 and the second surface protection layer PL2 shown in Figures 1 and 2 are insulating substrates, and for example, a flexible substrate made of polyimide or the like can be used. These surface protection layers PL1 and PL2 may be made of insulating materials that can transmit visible light.
[0022] As shown in Figures 3 and 5, the sensor substrate 12 is bent around a bending line (bent portion 22C) C extending in the Y direction. In one example, the bending line C is set in the center of the sensor substrate 12 in the X direction and is located in the gap between two adjacent sensor electrodes PX in the X direction. According to this embodiment, the sensor substrate 12 has a plurality of slits provided along the bending line C, in this case, five slits 30. As shown in Figure 4, each slit 30 has a length approximately equal to the Y-direction dimension of the sensor electrode PX and is located in the gap between two adjacent sensor electrodes PX in the X direction. Thus, the five slits 30 are spaced apart in the Y direction and aligned along the bending line C. The width d of each slit 30 in the X direction is preferably set to, for example, 1 mm or more.
[0023] The slits 30 are formed by penetrating the first surface protection layer PL1, the sensor electrode layer SE, the base substrate 20, the shield electrode layer SL, and the second surface protection layer PL2 of the sensor substrate 12. Multiple wirings WL of the sensor electrode layer SE extend through the region between the slits 30. Also, as shown in Figure 5, the shield electrodes 27 are formed on the second main surface S2 in the region excluding each slit 30 and the area around the slits.
[0024] The position of the bending line C, i.e., the position of the bending portion 22C, is not limited to the center of the sensor substrate 12 in the X direction, but may be offset to one or the other in the X direction from the center. The bending line C only needs to be set in the gap between two adjacent sensor electrodes PX in the X direction. Also, the number of slits 30 is not limited to five, and can be increased or decreased depending on the material of the sensor substrate. Providing at least one slit 30 is preferable because it makes it easier to bend the sensor substrate 12, but the slits 30 may be omitted. Even if slits 30 are not provided, it is still possible to bend the sensor substrate 12 around the bending line C.
[0025] The sensor substrate 12 is folded in half along the folding line C, with the second surface protection layer PL2 facing inward. As shown in Figures 1 and 2, in the folded state, the sensor substrate 12 comprises a substantially rectangular first detection section 22A with the sensor electrode layer SE facing in one direction in the Z direction, a substantially rectangular second detection section 22B with the sensor electrode layer SE facing in the opposite direction in the Z direction, and a folded section 22C located between the first detection section 22A and the second detection section 22B. The folded section 22C is folded by approximately 180 degrees. As a result, the entire area of the second detection section 22B is facing the first detection section 22A almost parallel to it. The second surface protection layer PL2 of the second detection section 22B is adjacent to or in close contact with the second surface protection layer PL2 of the first detection section 22A.
[0026] The first detection unit 22A includes 20 sensor electrodes PX arranged in 4 rows and 5 columns. Similarly, the second detection unit 22B includes 20 sensor electrodes PX arranged in 4 rows and 5 columns. According to this embodiment, the 20 sensor electrodes PX of the second detection unit 22B are each facing the 20 sensor electrodes PX of the first detection unit 22A in the Z direction, with the shield electrode layer SL, the base substrate 20, and the second surface protection layer PL2 in between. The sensor substrate 12 integrally has a protrusion 20c extending from one end opposite to the bent portion 22C of the first detection unit 22A, and a plurality of connection terminals CT are provided on the protrusion 20c. The protrusion 20c is directly connected to the first connector CN1 of the detection circuit board 14. As a result, the sensor electrode layer SE and the shield electrode layer SL of the sensor substrate 12 are electrically connected to the detection circuit board 14 via the first connector CN1.
[0027] As shown in Figure 2, in the operating state of the hover detection device 10, a drive signal is supplied from the detection circuit board 14 to a plurality of sensor electrodes PX via wiring WL. The drive signal may be a pulse voltage. At a timing synchronized with the drive signal, a predetermined voltage, for example, the second reference potential GND2 described later, is applied from the detection circuit board 14 to the shield electrode 27 and the surrounding shield electrode AX. The shield electrode 27 and the surrounding shield electrode AX function as active shields whose potential fluctuates periodically in response to changes in the reference potential.
[0028] As a result, a pseudo-capacitance is formed between the sensor electrode PX and the shield electrode 27, and a current equivalent to the self-capacitance CP1 (sometimes referred to as the baseline current) flows through the sensor electrode PX. When an object to be detected, such as a finger, approaches the sensor electrode PX from the side (upper surface) of the first detection unit 22A of the sensor substrate 12, a capacitance CP2 is formed between the sensor electrode PX and the finger. In this case, currents equivalent to capacitances CP1 and CP2 flow through the sensor electrode PX. Therefore, detection signals equivalent to capacitances CP1 and CP2 are output from the sensor electrode PX of the first detection unit 22A.
[0029] Similarly, when an object to be detected, such as a finger, approaches the sensor electrode PX from the side (bottom side) of the second detection unit 22B of the sensor substrate 12, a capacitance CP2 is formed between the sensor electrode PX and the finger. In this case, currents corresponding to capacitances CP1 and CP2 flow through the sensor electrode PX. Therefore, detection signals corresponding to capacitances CP1 and CP2 are output from the sensor electrode PX of the second detection unit 22B. Note that the object to be detected is not limited to a finger; it may also be an object containing a conductor, such as a stylus pen.
[0030] Figure 6 is a block diagram showing an example of the schematic configuration of the hover detection device 10. As shown in Figure 6, the detection circuit board 14, which functions as a controller, includes an AFE circuit 24 that performs hover detection based on a detection signal from the sensor board 12, a control circuit (MCU) 25 that controls the hover detection operation in the AFE circuit 24, a reference potential generation circuit 26, and a power supply PW1 that supplies the drive voltage.
[0031] The MCU (Micro Control Unit) 25 and the reference potential generation circuit 26 operate with a fixed first reference potential GND1 as the ground potential. The AFE circuit 24 and the sensor board 12 operate with a periodically fluctuating second reference potential GND2, which is generated by the reference potential generation circuit 26, as the ground potential.
[0032] The AFE circuit 24 is a signal conditioning circuit and, in one example, includes a readout circuit 51, an Analog Digital Converter (ADI) 52, a Digital Signal Processor (DSP) circuit 53, and a memory 54. The AFE circuit 24 is connected to the wiring WL and sensor electrode PX of the sensor electrode layer SE, and to the shield electrode 27 of the shield electrode layer SL.
[0033] The AFE circuit 24 generates a drive signal (reference signal or baseline current) AS under the control of the MCU 25 and outputs it to multiple sensor electrodes PX via wiring WL. At the same timing as supplying the drive signal to the sensor electrodes PX, the AFE circuit 24 also outputs a second reference potential GND2 to the shield electrode 27 and the surrounding shield electrode AX.
[0034] The AFE circuit 24 reads the detection signal Rx from the sensor electrode PX in response to the drive signal, adjusts the signal (amplification, A / D conversion, filtering), and then outputs it to the MCU 25. Specifically, the readout circuit 51 of the AFE circuit 24 acquires the detection signal Rx from both the sensor electrode PX of the first detection unit 22A and the sensor electrode PX of the second detection unit 22B. The ADC circuit 52 converts the acquired detection signal Rx from an analog signal to a digital signal. The DSP circuit 53 performs digital filtering on the digital data converted by the ADC circuit 52 and generates sensing data based on the detection signal Rx. The AFE circuit 24 outputs the generated sensing data (square wave signal Tx) to the MCU 25.
[0035] In one example, the signal between the AFE circuit 24 and the MCU 25 is transmitted via SPI (Serial Peripheral Interface), which is a clock-synchronous serial interface. However, other methods of data communication are also possible.
[0036] The MCU25 includes a readout circuit 61, a noise detection circuit 62, a coordinate calculation circuit 63, a communication interface I / F, a memory 64, and the like. Each circuit element operates with a fixed potential, the first reference potential GND1, as the ground potential.
[0037] The readout circuit 61 acquires sensing data Tx output from the AFE circuit 24. The noise determination circuit 62 performs noise determination processing based on the sensing data Tx acquired by the readout circuit 61. The coordinate calculation circuit 63 performs coordinate calculation processing based on the sensing data Tx acquired by the readout circuit 61. The coordinate calculation circuit 63 determines whether the object to be detected is approaching or in contact with the sensor electrode layer SE of the first detection unit 22A, and whether the object to be detected is approaching or in contact with the sensor electrode layer SE of the second detection unit 22B. The coordinate calculation circuit 63 may also be a logic circuit that determines the coordinate position of the object to be detected.
[0038] In detail, the coordinate calculation circuit 63 determines whether the object to be detected is approaching the sensor electrode PX based on the digitized detection signal Tx. When the sensor electrode PX outputs a detection signal indicating a change in capacitance, the coordinate calculation circuit 63 determines whether the detected capacitance has changed from the previously detected capacitance. If the result of the determination shows that the detected capacitance has changed by a predetermined amount or more from the previously detected capacitance, the coordinate calculation circuit 63 determines that the object to be detected is approaching the sensor electrode PX whose capacitance is changing, and determines the position of the object to be detected on the x and y coordinates based on the position of the sensor electrode PX that output the detection signal RX. The coordinate calculation circuit 63 generates coordinate information indicating the determined position of the object to be detected on the x and y coordinates. The coordinate information includes x coordinate information (first coordinate information) and y coordinate information (second coordinate information). The coordinate calculation circuit 63 transmits the coordinate information to the host 16 via the I / F.
[0039] Furthermore, if the detected capacitance is the same as the previously detected capacitance, or if the capacitance has changed but the amount of change is less than a predetermined amount, it is determined that there is no approach of the object to be detected to the sensor electrode PX having that capacitance.
[0040] In this disclosure, the MCU 25 has a function to change the driving frequency in the capacitive hover detection, that is, the fundamental frequency of the detection signal (square wave signal) Tx output from the AFE circuit 24. By changing the fundamental frequency, the influence of noise can be suppressed. Hereinafter, the change of the fundamental frequency of the square wave signal Tx may be referred to as "frequency hopping".
[0041] Figure 7 is a flowchart showing an example of the hover detection operation in the hover detection device 10. When power is supplied from the power supply PW1 and the sensing operation by the hover detection device 10 starts (ST1), the hover detection device 10 performs a baseline scan to acquire a detection signal Rx when the object to be detected is not in close proximity to the sensor board 12 (ST2).
[0042] After the baseline scan, the MCU 25 performs a normal hover detection operation (sensing) (ST3). That is, the MCU 25 outputs a drive signal AS from the AFE circuit 24 to the sensor electrode PX, and in synchronization with this, applies a second reference potential GND2 to the shield electrode 27 and the surrounding shield electrode AX. The MCU 25 executes the above-described noise determination processing and coordinate calculation processing based on the difference between the detection signal Rx obtained by the baseline scan (ST2) and the detection signal Rx obtained by the sensing (ST3). More specifically, the noise determination circuit 62 executes a noise determination process (ST4) based on the difference between the detection signal Rx obtained by the baseline scan and the detection signal Rx obtained by the sensing. Also, the coordinate calculation circuit 63 executes a coordinate calculation process (ST5) based on the difference between the detection signal Rx obtained by the baseline scan and the detection signal Rx obtained by the sensing.
[0043] In FIG. 7, an example in which the coordinate calculation process (ST5) is executed after the noise determination process (ST4) is shown. However, a mode in which the noise determination process is executed after the coordinate calculation process may also be used, or a mode in which the noise determination process and the coordinate calculation process are executed in parallel may also be used.
[0044] Subsequently, the MCU 25 determines whether or not the condition for performing the above-described frequency hopping (hereinafter, also simply referred to as "frequency hopping condition") is satisfied (ST6). Specifically, the MCU 25 determines whether or not a signal including a frequency hopping command for instructing the hover detection device 10 to perform frequency hopping is input from an external control device (host) 16 connected via the FPC 17. Note that the frequency hopping condition is not limited to the above. For example, the MCU 25 may be a mode for determining whether or not the frequency hopping condition is satisfied.
[0045] When the frequency hopping condition is satisfied in the process ST6, the MCU 25 sets the drive frequency in the hover detection, that is, the fundamental frequency of the rectangular wave signal Tx output from the AFE circuit 24, to the frequency after the frequency hopping (ST7).
[0046] When the frequency hopping condition is not satisfied in ST6, and after frequency hopping is executed in ST7, the MCU 25 determines whether the sensing operation has ended (ST8). If it has ended, the hover detection operation ends. Examples of when the sensing operation ends include when power supply from the power source PW1 stops, or when a command to end the sensing operation is input from the host 16 to the hover detection device 10. When the sensing operation of the hover detection device 10 has not ended, the MCU 25 repeats the operations after ST3.
[0047] Figure 8 is a timing chart showing an example of the operation of the hover detection device 10 capable of frequency hopping. The detection operation in the hover detection device 10 has a processing flow defined in units of the repetition period Cy. First, a clock signal (V-Sync) indicating the start of the repetition period Cy is output at a predetermined period. In one example, the clock signal is output at timings T1 and T2. Hereinafter, the operation flow within the repetition period Cy starting from timing T1 will be described.
[0048] Starting from timing T1, the sensing operation (Sensing) corresponding to ST3 described above is performed. The sensing operation is performed during the period Pe1 from timing T1 to the start point of the period Pe2 when an interrupt signal (IRQ) indicating the end of the sensing operation occurs.
[0049] From the end point of the period Pe2 to timing T2, periods Pe3, Pe4, Pe5, and Pe6 occur in sequence. The period Pe3 is a period in which the sensing data output from the AFE circuit 24 is read (AFE Read). The period Pe4 is a period in which the noise determination process corresponding to ST4 and the coordinate calculation process corresponding to ST5 are executed in parallel. The period Pe5 is a period in which, when frequency hopping is performed, a command output (writing of information) to the AFE circuit 24 for setting the fundamental frequency of the rectangular wave signal Tx to the frequency after frequency hopping is performed. The period Pe6 is a blank period from the end of the period Pe5 to timing T2.
[0050] Starting from timing T2, the operations of periods Pe1, Pe2, Pe3, Pe4, Pe5, and Pe6 described above are repeated again. Thereafter, each time a clock signal (V-Sync) indicating the start of the repeating period Cy is output at a predetermined interval, periods Pe1 to Pe6 described above are repeated.
[0051] According to the hover detection device 10 configured as described above, the base substrate 20 has a first detection unit 22A facing one direction, a second detection unit 22B facing the opposite direction, and a bent portion 22C connecting these detection units. The detection circuit board 14 connected to the base substrate 20 performs hover detection based on detection signals from multiple sensor electrodes PX of the first detection unit 22A and multiple sensor electrodes PX of the second detection unit 22B. That is, the hover detection device 10 can detect the approach or contact of an object to be detected toward the first detection unit 22A side using the first detection unit 22A of the sensor substrate 12, and can detect the approach or contact of an object to be detected toward the second detection unit 22B side using the second detection unit 22B. As a result, even if the sensor substrate 12 of the hover detection device 10 is embedded in a wall or the like, it is possible to operate and detect hover from both sides of the sensor substrate 12. In other words, according to this embodiment, it is possible to provide a detection device that can be operated and detect hover from both sides.
[0052] Furthermore, according to the first embodiment, a common sensor substrate 12 can be used to configure the first detection unit 22A on the front side and the second detection unit 22B on the back side, making it possible to obtain a double-sided detection type hover detection device with a simple configuration.
[0053] Next, a hover detection device according to other embodiments or modifications will be described. In the other embodiments or modifications described below, parts identical to those in the first embodiment described above will be denoted by the same reference numerals as in the first embodiment, and their detailed descriptions may be simplified or omitted.
[0054] (Second Embodiment) Figure 9 is a cross-sectional view of the hover detection device according to the second embodiment, and Figure 10 is a plan view showing the sensor electrode side of the sensor substrate in the unfolded state of the hover detection device according to the second embodiment. According to the second embodiment, the sensor substrate 12 of the hover detection device 10 is made of a light-transmitting material.
[0055] As shown in Figures 9 and 10, the sensor substrate 12 includes, for example, a transparent adhesive sheet Ad for optical purposes that functions as a rectangular base layer, a sensor electrode layer SE made of a transparent conductive film, a first surface protection layer PL1 made of a transparent protective film laminated on top of the sensor electrode layer SE, a shield electrode layer SL made of a transparent conductive film, and a second surface protection layer PL2 made of a transparent protective film laminated on top of the shield electrode layer SL, with the sensor electrode layer SE and the shield electrode layer SL facing each other with the transparent adhesive sheet Ad in between. That is, the first main surface S1 of the transparent adhesive sheet Ad is attached to the sensor electrode layer SE, and the second main surface S2 of the transparent adhesive sheet Ad is attached to the shield electrode layer SL.
[0056] The sensor electrode layer SE includes a plurality of sensor electrodes PX and a plurality of wirings WL formed by patterning a transparent conductive film. The shield electrode layer SL includes a shield electrode 27 formed from a transparent conductive film.
[0057] The transparent conductive film described above can be formed from a light-transmitting conductive material such as indium-tin mixed oxide (ITO) or indium-zinc mixed oxide (IZO). As a transparent protective film, a light-transmitting insulating material can be used, such as polyimide, vinyl resin, polycarbonate, or other resin materials.
[0058] As shown in Figure 10, the sensor substrate 12 is bent around a bending line (bent portion 22C) C extending in the Y direction. In one example, the bending line C is set in the center in the X direction and is located in the gap between two adjacent sensor electrodes PX in the X direction. According to this embodiment, the sensor substrate 12 has a plurality of slits provided along the bending line C, in this case, five slits 30. Each slit 30 has a length approximately equal to the Y-direction dimension of the sensor electrode PX and is located in the gap between two adjacent sensor electrodes PX in the X direction. As a result, the five slits 30 are spaced apart in the Y direction and arranged along the bending line C. The width of each slit 30 in the X direction is set to, for example, 1 mm or more.
[0059] The slit 30 is formed by penetrating the first surface protection layer PL1, the sensor electrode layer SE, the transparent adhesive sheet Ad, the shield electrode layer SL, and the second surface protection layer PL2 of the sensor substrate 12. Multiple wirings WL of the sensor electrode layer SE extend through the region between the slits 30.
[0060] Note that the position of the bending line C, i.e., the position of the bending portion 22C, is not limited to the center in the X direction, but may be offset to one or the other in the X direction from the center. The bending line C only needs to be set in the gap between two adjacent sensor electrodes PX in the X direction. Providing a slit 30 is preferable because it makes it easier to bend the sensor substrate 12, but the slit 30 may be omitted. Even without providing a slit 30, it is possible to bend the sensor substrate 12 around the bending line C.
[0061] The sensor substrate 12 is folded in half along the folding line C, with the second surface protection layer PL2 facing inward. As shown in Figure 9, in the folded state, the sensor substrate 12 comprises a substantially rectangular first detection section 22A with the sensor electrode layer SE facing in one direction in the Z direction (for example, upward), a substantially rectangular second detection section 22B with the sensor electrode layer SE facing in the opposite direction in the Z direction (for example, downward), and a folded section 22C located between the first detection section 22A and the second detection section 22B. The folded section 22C is folded by approximately 180 degrees. As a result, the entire area of the second detection section 22B is facing the first detection section 22A almost parallel to it. The second surface protection layer PL2 of the second detection section 22B is in close contact with the second surface protection layer PL2 of the first detection section 22A.
[0062] As shown in Figures 9 and 10, the sensor substrate 12 is electrically connected to the first connector CN1 of the detection circuit board 14 by an FPC 32. The FPC 32 is a double-sided FPC with a bifurcated shape, and has a first end 32a connected to the first connector CN1, and a second end 32b and a third end 32c that branch off from the first end 32a in a bifurcated shape. The second end 32b of the FPC 32 is joined to the wiring WL of the sensor electrode layer SE. The third end 32c of the FPC 32 is connected to the shield electrode 27 of the shield electrode layer SL.
[0063] In the hover detection device 10 according to the second embodiment, the other components of the hover detection device are the same as those of the hover detection device according to the first embodiment described above. In the second embodiment with the above configuration, a detection device that can be operated and hover detected from both sides can be provided. Furthermore, by using a light-transmitting material, the sensor substrate 12 can be made almost transparent, which increases the degree of freedom in installing the detection device.
[0064] (Third Embodiment) Figure 11 is a cross-sectional view of the hover detection device according to the third embodiment, and Figure 12 is a plan view showing the shield electrode layer side of the sensor substrate in the unfolded state of the hover detection device according to the third embodiment. According to the third embodiment, the sensor substrate 12 of the hover detection device 10 is provided with the shield electrode layer and the second surface protection layer partially omitted.
[0065] As shown in Figures 11 and 12, the hover detection device 10 includes a sensor substrate 12 and a detection circuit board 14 connected to the sensor substrate 12. The sensor substrate 12 includes, for example, a rectangular base substrate (base layer) 20, a conductive layer laminated on the first main surface S1 side of the base substrate 20, for example, a sensor electrode layer SE made of copper foil, a first surface protection layer PL1 laminated on the first main surface S1 on top of the sensor electrode layer SE, a conductive layer laminated on the second main surface S2 side of the base substrate 20 facing the first main surface S1, for example, a shield electrode layer SL made of copper foil, and a second surface protection layer PL2 laminated on the second main surface S2 on top of the shield electrode layer SL.
[0066] The base substrate 20 is not limited to a rectangular shape, but in this embodiment, it is a rectangular base substrate having sides along the X and Y directions. The base substrate 20 has a rectangular first main surface S1 and a rectangular second main surface S2 facing the first main surface S1. In this embodiment, the base substrate 20 integrally has a protrusion 20c projecting in the X direction from one side edge.
[0067] The sensor electrode layer SE laminated on the first main surface S1 of the base substrate 20 has a plurality of sensor electrodes PX and a plurality of wirings WL formed by patterning a conductive layer. The first main surface S1 has, for example, a rectangular detection area, and the plurality of sensor electrodes PX are provided over almost the entire surface of the detection area. The plurality of sensor electrodes PX are arranged in a matrix along the X and Y directions. For example, if the Y direction is the row and the X direction is the column, the sensor electrodes PX are arranged in an 8x5 matrix. In one example, the sensor electrodes PX are composed of a rectangular planar pattern.
[0068] The sensor electrode layer SE is not limited to copper; it may be formed from other metals such as titanium or molybdenum, or from an alloy containing one or more of these metals. Furthermore, the sensor electrode PX may be formed from a translucent conductive material such as indium-tin mixed oxide (ITO) or indium-zinc mixed oxide (IZO).
[0069] As shown in Figure 12, the sensor substrate 12 is bent around a bending line (bent portion 22C) C extending in the Y direction. In one example, the bending line C is set in the center in the X direction and is located in the gap between two adjacent sensor electrodes PX in the X direction. The sensor substrate 12 has a plurality of slits provided along the bending line C, in this case, five slits 30. Each slit 30 has a length approximately equal to the Y-direction dimension of the sensor electrode PX and is located in the gap between two adjacent sensor electrodes PX in the X direction. As a result, the five slits 30 are spaced apart in the Y direction and aligned along the bending line C. The width of each slit 30 in the X direction is set to, for example, 1 mm or more.
[0070] As shown in Figure 12, the shield electrode layer SL laminated on the second main surface S2 of the base substrate 20 constitutes a substantially rectangular shield electrode 27. According to this embodiment, the shield electrode 27 and the second surface protection layer PL2 have approximately half the size of the second main surface S2 and are provided overlapping the region between the slit 30 (folding line C) and the edge of the sensor substrate 12 on the side of the protrusion 20c on the second main surface S2. That is, the shield electrode layer and the second surface protection layer are not provided in the region between the slit 30 (folding line C) and the edge of the sensor substrate 12 opposite to the protrusion 20c on the second main surface S2.
[0071] The sensor substrate 12 is folded in half along the folding line C, with the second surface protective layer PL2 facing inward. As shown in Figure 11, in the folded state, the sensor substrate 12 comprises a substantially rectangular first detection section 22A with the sensor electrode layer SE facing in one direction (upward) in the Z direction, a substantially rectangular second detection section 22B with the sensor electrode layer SE facing in the opposite direction (downward) in the Z direction, and a folded section 22C located between the first detection section 22A and the second detection section 22B. The folded section 22C is folded by approximately 180 degrees. As a result, the entire area of the second detection section 22B faces the first detection section 22A almost parallel to it.
[0072] As described above, according to this embodiment, the second detection unit 22B does not have a shield electrode layer and a second surface protection layer PL2. The second detection unit 22B is attached to the first detection unit 22A by an adhesive sheet Ad provided between the base substrate 20 of the second detection unit 22B and the second surface protection layer PL2 of the first detection unit 22A.
[0073] The first detection unit 22A includes 20 sensor electrodes PX arranged in 4 rows and 5 columns, and a shield electrode 27 facing these sensor electrodes PX. The second detection unit 22B also includes 20 sensor electrodes PX arranged in 4 rows and 5 columns. According to this embodiment, the 20 sensor electrodes PX of the second detection unit 22B are positioned facing each of the 20 sensor electrodes PX of the first detection unit 22A in the Z direction, with the base substrate 20, adhesive sheet Ad, second surface protective layer PL2, and base substrate 20 in between. As a result, the shield electrode 27 of the first detection unit 22A can also function as a shield electrode of the second detection unit 22B. That is, capacitance can be formed between the sensor electrodes PX of the second detection unit 22B and the shield electrode 27 of the first detection unit 22A. The protrusion 20c of the sensor substrate 12 is directly connected to the first connector CN1 of the detection circuit board 14. As a result, the sensor electrode layer SE and shield electrode layer SL of the sensor substrate 12 are electrically connected to the detection circuit board 14 via the first connector CN1.
[0074] In the hover detection device 10 according to the third embodiment, the other components of the hover detection device are the same as those of the hover detection device according to the first embodiment described above. In the third embodiment with the above configuration, a detection device that can be operated and hover detected from both sides can be provided. Furthermore, according to the third embodiment, by omitting the shield electrode layer and the second surface protection layer on the second detection unit 22B side, the thickness of the sensor substrate 12 can be reduced, and the degree of freedom in installing the detection device can be increased.
[0075] In the third embodiment as well, the position of the bend line C, i.e., the position of the bend portion 22C, is not limited to the center in the X direction, but may be offset from the center to one or the other in the X direction. The bend line C only needs to be set in the gap between two adjacent sensor electrodes PX in the X direction. The slit 30 may also be omitted.
[0076] (Fourth Embodiment) Figure 13 is a cross-sectional view of the hover detection device according to the fourth embodiment, and Figure 14 is a plan view showing the sensor electrode layer side of the sensor substrate in the unfolded state of the hover detection device according to the fourth embodiment. According to the fourth embodiment, the sensor substrate 12 of the hover detection device 10 is configured to be bendable around a plurality of bending lines extending in the Y direction and a plurality of bending lines extending in the X direction.
[0077] As shown in Figure 13, the hover detection device 10 includes a sensor substrate 12 and a detection circuit board 14 connected to the sensor substrate 12. The sensor substrate 12 includes, for example, a rectangular base substrate (base layer) 20, a conductive layer laminated on the first main surface S1 side of the base substrate 20, for example, a sensor electrode layer SE made of copper foil, a first surface protection layer PL1 laminated on the first main surface S1 on top of the sensor electrode layer SE, a conductive layer laminated on the second main surface S2 side of the base substrate 20 facing the first main surface S1, for example, a shield electrode layer SL made of copper foil, and a second surface protection layer PL2 laminated on the second main surface S2 on top of the shield electrode layer SL.
[0078] As shown in Figure 14, the base substrate 20 is a rectangular base substrate having sides along the X and Y directions. The base substrate 20 has a rectangular first main surface S1 and a rectangular second main surface S2 opposite to the first main surface S1. The base substrate 20 integrally has a protrusion 20c that projects in the X direction from one end edge in the X direction. In this embodiment, the protrusion 20c is provided at one end of the end edge in the Y direction. The base substrate 20 is an insulating substrate, and for example, a flexible substrate made of polyimide or the like can be used. The base substrate 20 may be made of an insulating material that can transmit visible light.
[0079] The sensor electrode layer SE laminated on the first main surface S1 of the base substrate 20 has a plurality of sensor electrodes PX and a plurality of wirings WL formed by patterning a conductive layer. The first main surface S1 has, for example, a rectangular detection area and a frame-shaped non-detection area located around the detection area. The plurality of sensor electrodes PX are provided over almost the entire surface of the detection area. The plurality of sensor electrodes PX are arranged in a matrix along the X and Y directions. For example, if the Y direction is the row and the X direction is the column, the sensor electrodes PX are arranged in a 5x5 matrix. In one example, the sensor electrodes PX are composed of a rectangular planar pattern and are formed to the same dimensions.
[0080] The sensor electrode layer SE is not limited to copper; it may be formed from other metals such as titanium or molybdenum, or from an alloy containing one or more of these metals. Furthermore, the sensor electrode PX may be formed from a translucent conductive material such as indium-tin mixed oxide (ITO) or indium-zinc mixed oxide (IZO).
[0081] The sensor substrate 12 is formed to bend around any of the following bending lines: a plurality of bending lines extending in the Y direction, for example, four bending lines C1, C2, C3, C4, or a plurality of bending lines extending in the X direction, for example, four bending lines C5, C6, C7, C8. The four bending lines C1 to C4 are located in the gaps between two adjacent sensor electrodes PX in the X direction and extend in the Y direction. The four bending lines C5 to C8 are located in the gaps between two adjacent sensor electrodes PX in the Y direction and extend in the Y direction.
[0082] Figure 15 is a plan view of the sensor substrate, showing an enlarged portion of the sensor substrate. As shown in Figures 14 and 15, the sensor substrate 12 has multiple first slits 30a, in this case five, along each of the bending lines C1 to C4 extending in the Y direction. Each first slit 30a has a length approximately equal to the Y-direction dimension of the sensor electrode PX and is located in the gap between two adjacent sensor electrodes PX in the X direction. As a result, in each of the bending lines C1 to C4, the five first slits 30a are spaced apart in the Y direction and arranged along the bending line. The width d1 of each first slit 30 in the X direction is set to, for example, 1 mm or more.
[0083] The sensor substrate 12 has multiple second slits 30b along each of the bending lines C5 to C8 extending in the X direction, in this case, five slits in each line. Each second slit 30b has a length approximately equal to the X-direction dimension of the sensor electrode PX and is located in the gap between two adjacent sensor electrodes PX in the Y direction. As a result, in each of the bending lines C5 to C8, the five second slits 30b are spaced apart in the X direction and arranged along the bending line. The Y-direction width d2 of each second slit 30 is set to, for example, 1 mm or more.
[0084] In this embodiment, as shown in Figure 14, with the exception of the first slit 30a located in the rightmost row at one end of the sensor substrate 12, and the second slit 30b located in the lowermost row at one end of the sensor substrate 12, the other first slits 30a and second slits 30b are connected at one end to the other, forming a substantially L-shaped slit.
[0085] The first slit 30a and the second slit 30b are formed by penetrating the first surface protection layer PL1, the sensor electrode layer SE, the base substrate 20, the shield electrode layer SL, and the second surface protection layer PL2 of the sensor substrate 12. As shown in Figure 14, multiple wirings WL are provided in the non-detection areas of the first main surface S1 and in the gaps between the rows of sensor electrodes PX; in this case, five wirings are provided in each area. Here, the wirings WL extend through the area between two adjacent first slits 30a in the Y direction. One end of each wiring WL is connected to the corresponding sensor electrode PX, and the other end extends through the non-detection area to the protrusion 20c. The other end of each wiring WL is electrically connected to the connection terminal CT through the plated hole MH (see Figure 13).
[0086] Figure 16 is a plan view of a sensor substrate 12, showing an enlarged portion of the sensor electrode side of the modified sensor substrate 12. As shown in the figure, the first slit 30a and the second slit 30b of the sensor substrate 12 may be separated from each other and not communicate with each other.
[0087] Figure 17 is a plan view of the second main surface side of the sensor substrate, showing an enlarged portion of the sensor substrate in the fourth embodiment. As shown in Figure 17, the shield electrode 27 is laminated on the second main surface S2 of the base substrate 20, covering almost the entire surface of the second main surface S2. According to this embodiment, the shield electrode 27 is formed in the area of the second main surface S2 excluding the areas around each first slit 30a and the area around the second slit 30b. Furthermore, the connecting portion 72a of the shield electrode 27, which is provided in the area between the second slit 30b and the side edge of the base substrate 20 on the bending lines C5 to C8, is formed in a polygonal mesh shape. By making the connecting portion 72a mesh-shaped, the bending resistance of the shield electrode 27 at the connecting portion 72a can be reduced. That is, when bending the sensor substrate 12 along any of the bending lines C5 to C8 in the X direction, the sensor substrate 12 can be made easier to bend.
[0088] Figure 18 is a plan view showing the connection portion 72a of the shield electrode according to a modified example. The connection portion 72a is not limited to a polygonal mesh shape, but may also be a ladder-shaped or mesh-shaped connection portion having many bridges, as shown in Figure 18.
[0089] The sensor substrate 12 according to this embodiment, configured as described above, can be bent along any of the bending lines C1 to C8. Furthermore, the sensor substrate can be bent along multiple bending lines simultaneously, making it possible to form, for example, a cubic-shaped sensor substrate. While providing the first slit 30a and the second slit 30b is preferable as it facilitates bending the sensor substrate 12, these slits 30a and 30b may be omitted. Even without slits, the sensor substrate 12 can be bent around the bending lines C1 to C8.
[0090] As shown in Figures 13 and 14, according to this embodiment, the sensor substrate 12 is folded in half around the folding line C2, with the second surface protection layer PL2 facing inward. As shown in Figure 13, in the folded state, the sensor substrate 12 comprises a substantially rectangular first detection section 22A with the sensor electrode layer SE facing in one direction (upward) in the Z direction, a substantially rectangular second detection section 22B with the sensor electrode layer SE facing in the opposite direction (downward) in the Z direction, and a folded section 22C located between the first detection section 22A and the second detection section 22B. The folded section 22C is folded by approximately 180 degrees. As a result, the entire area of the second detection section 22B is facing the first detection section 22A almost parallel to its entirety. The second surface protection layer PL2 of the second detection section 22B is adjacent to or in close contact with the second surface protection layer PL2 of the first detection section 22A.
[0091] The first detection unit 22A includes 15 sensor electrodes PX arranged in 3 rows and 5 columns, and a shield electrode 27 facing these sensor electrodes PX. The second detection unit 22B includes 10 sensor electrodes PX arranged in 2 rows and 5 columns, and a shield electrode 27 facing these sensor electrodes PX. According to this embodiment, the 10 sensor electrodes PX of the second detection unit 22B are positioned facing each of the 10 sensor electrodes PX of the first detection unit 22A in the Z direction, with the base substrate 20, the shield electrode 27, the second surface protective layer PL2, and the base substrate 20 in between.
[0092] The protrusion 20c of the sensor substrate 12 is directly connected to the first connector CN1 of the detection circuit board 14. As a result, the sensor electrode layer SE and shield electrode layer SL of the sensor substrate 12 are electrically connected to the detection circuit board 14 via the first connector CN1.
[0093] In the hover detection device 10 according to the fourth embodiment, the other components of the hover detection device are the same as those of the hover detection device according to the first embodiment described above. In the fourth embodiment with the above configuration, a detection device that can be operated and hover detected from both sides can be provided. Furthermore, according to the fourth embodiment, it is possible to freely bend the device along multiple bending lines extending in the X or Y direction, making it possible to form a detection device of any shape or a three-dimensional detection device. This increases the degree of freedom in installing the detection device.
[0094] As described above, in the fourth embodiment, the position of the bent portion 22C of the sensor substrate 12, i.e., the bend line, is not limited to the bend lines C1 to C4 extending in the Y direction, but can be bent around any of the bend lines C5 to C8 extending in the X direction.
[0095] While embodiments and modifications of the present invention have been described, these embodiments and modifications are presented as examples only and are not intended to limit the scope of the invention. Novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. Embodiments and their modifications are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. All configurations that a person skilled in the art can implement by appropriately modifying the design based on the above-described configurations as embodiments of the present invention also fall within the scope of the present invention, insofar as they encompass the spirit of the invention.
[0096] For example, the shape, dimensions, and number of sensor electrodes on the sensor substrate can be changed in various ways, without being limited to the embodiments described above. The constituent materials, dimensions, and shape of the sensor substrate can be changed as appropriate, without being limited to the embodiments or modifications described above. In the first, second, and fourth embodiments described above, the bending angle of the bent portion 22C is not limited to 180 degrees, but can be arbitrarily set in the range of 90 to 180 degrees, for example.
Claims
1. A detection device comprising: a sensor substrate including a base layer; a sensor electrode layer provided on a first main surface of the base layer and forming a plurality of sensor electrodes and a plurality of wirings connected to the plurality of sensor electrodes; and a shield electrode layer provided on a second main surface of the base layer and forming a shield electrode facing at least a portion of the sensor electrodes; and a controller that supplies drive signals to the plurality of sensor electrodes and processes detection signals output from the sensor electrodes, wherein the sensor substrate is bent with the second main surface of the base layer facing inward and constitutes a first detection section including a plurality of the sensor electrodes; a second detection section provided facing at least a portion of the first detection section and including a plurality of the sensor electrodes; and a bent section located between the first detection section and the second detection section.
2. The detection device according to claim 1, wherein the sensor substrate includes a first surface protection layer laminated on the first main surface of the base layer over the sensor electrode layer, a shield electrode layer provided on the second main surface of the base layer and facing the plurality of sensor electrodes and the plurality of wirings, and a second surface protection layer laminated on the second main surface of the base layer over the shield electrode layer, the sensor substrate is bent with the second surface protection layer facing inward, and the second surface protection layer of the second detection unit is adjacent to and facing the second surface protection layer of the first detection unit.
3. The detection device according to claim 1, wherein the sensor substrate includes a first surface protection layer laminated on the first main surface of the base layer over the sensor electrode layer, a shield electrode layer provided on the second main surface of the base layer in the first detection unit and facing the plurality of sensor electrodes and the plurality of wirings, and a second surface protection layer laminated on the second main surface of the base layer in the first detection unit over the shield electrode layer, the sensor substrate is bent with the second surface protection layer facing inward, and the base layer of the second detection unit is attached to the second surface protection layer of the first detection unit by an adhesive layer.
4. The detection device according to claim 1, wherein the number of sensor electrodes in the first detection unit is equal to the number of sensor electrodes in the second detection unit.
5. The detection device according to claim 1, wherein the number of sensor electrodes in the first detection unit is different from the number of sensor electrodes in the second detection unit.
6. The detection device according to claim 3, wherein the base layer of the sensor substrate is formed of a light-transmitting optical adhesive layer, and the sensor electrode layer, the shield electrode layer, the first surface protection layer, and the second surface protection layer are each formed of a light-transmitting material.
7. The detection device according to claim 1, wherein the plurality of sensor electrodes are arranged in a matrix in a first direction and a second direction intersecting the first direction of the sensor substrate, and the bent portion of the sensor substrate is bent around at least one bending line that passes through the region between the sensor electrodes and extends in the first direction or the second direction.
8. The detection device according to claim 7, wherein the sensor substrate has at least one slit extending along the bending line.
9. The detection device according to claim 7, wherein the sensor substrate has a plurality of slits that extend along the bending line and are spaced apart, and the wiring is provided in the region between the plurality of slits.
10. The detection device according to claim 7, wherein the sensor substrate has a plurality of first slits provided along a bending line extending in the first direction and spaced apart in the first direction, and a plurality of second slits provided along a bending line extending in the second direction and spaced apart in the second direction.
11. The detection device according to claim 10, wherein the shield electrode provided on the second main surface of the base layer has a connecting portion located in the region between the second slit and the side edge of the sensor substrate, and the connecting portion has a mesh shape.
12. The detection device according to claim 1, wherein the first detection unit has a connection end including a plurality of connection terminals, and the controller includes a connector to which the connection end is connected.