Resin composition, coating material or insulating material, and molded body

Abstract

A resin composition according to one embodiment of the present disclosure contains: a base resin that is at least one selected from the group consisting of polyphenylene sulfide resins and liquid crystal resins; and thermally conductive fillers. The thermally conductive fillers include a filler (A) having a scale-like or plate-like anisotropic shape, and a filler (B) having an isotropic shape. The filler (B) is at least one selected from the group consisting of: alumina that has an isotropic shape and that exhibits a stainless-steel wear amount of 2.0 mm3 or less as measured by a prescribed wear test; and magnesium oxide having an isotropic shape.

Description

Resin compositions, coating materials or insulating materials, and molded articles

[0001] The present invention relates to resin compositions, coating materials or insulating materials, and molded articles.

[0002] With the increasing integration and miniaturization / lightweighting of electrical and electronic components, there are concerns about the degradation of component function due to heat generation and exposure to high-temperature environments. Therefore, heat dissipation properties are required for resin materials. To impart thermal conductivity to resin materials, it is generally effective to add thermally conductive fillers to the resin, such as boron nitride, alumina, and graphite.

[0003] Patent Document 1 discloses a heat-dissipating resin molded article, which is molded from a resin composition containing an organic synthetic resin, a thermally conductive filler, and inorganic short fibers, characterized in that the surface roughness of the molded article is less than 6 μm in terms of a ten-point average roughness Rz.

[0004] Patent Document 2 discloses a high heat-dissipating polyarylene sulfide resin composition containing a polyarylene sulfide resin (A), a high heat-dissipating filler (B), a fibrous reinforcing material (C), and a clay mineral (D) with a Mohs hardness of less than 2, characterized in that, per 100 parts by mass of the polyarylene sulfide resin (A), the high heat-dissipating filler (B) is in the proportion of 10 to 200 parts by mass, the fibrous reinforcing material (C) is in the proportion of 25 to 150 parts by mass, and the clay mineral (D) with a Mohs hardness of less than 2 is in the proportion of 5 to 100 parts by mass.

[0005] Japanese Patent Publication No. 2014-234407 Japanese Patent Publication No. 2013-75996

[0006] High thermal conductivity is required for component parts, particularly in the thickness direction, to efficiently transfer heat generated from heat-generating parts to cooling parts. However, the typical shape of boron nitride used as a thermally conductive filler is flaky and anisotropic, so in injection molding, the thermally conductive filler is oriented in the flow direction of the molded product. As a result, heat is conducted along the direction of the thermally conductive filler, resulting in insufficient thermal conductivity in the thickness direction (depth direction) relative to the surface of the molded product.

[0007] Furthermore, when using thermally conductive fillers with an isotropic shape, such as alumina or aluminum nitride, improvement in thermal conductivity in the thickness direction (depth direction) relative to the surface of the molded product is required.

[0008] One aspect of the present invention aims to realize a resin composition with high thermal conductivity in the thickness direction.

[0009] To solve the above problems, a resin composition according to one aspect of the present invention comprises a base resin, which is at least one selected from the group consisting of polyphenylene sulfide resin and liquid crystal resin, and a thermally conductive filler, wherein the thermally conductive filler comprises a filler (A) having a flaky or plate-like anisotropic shape and a filler (B) having an isotropic shape, and the filler (B) having an isotropic shape has an isotropic shape and the stainless steel wear amount measured by the following abrasion test is 2.0 mm ３ The following is a method of measuring the amount of wear on the contact surface of the metal ring with the resin plate when a thrust test is performed for 90 minutes with a thrust pressure of 100 N and a peripheral speed of 0.3 m / s, in accordance with JIS K 7218 (1986) Method A, by placing a resin plate formed by molding the resin composition on the upper surface of a hollow cylindrical metal ring made of SUS304.

[0010] According to one aspect of the present invention, a resin composition with high thermal conductivity in the thickness direction can be realized.

[0011] This diagram illustrates the test method for measuring stainless steel wear amount as described in the example.

[0012] One aspect of the present invention will be described in detail below. Unless otherwise specified in this specification, "A to B" representing a numerical range means "A or greater, and B or less".

[0013] [1. Resin Composition] A resin composition according to one aspect of the present invention comprises a base resin, which is at least one selected from the group consisting of polyphenylene sulfide resin and liquid crystal resin, and a thermally conductive filler, wherein the thermally conductive filler comprises a filler (A) having a flaky or plate-like anisotropic shape and a filler (B) having an isotropic shape, and the isotropic filler (B) has an isotropic shape and the stainless steel wear amount measured by the following abrasion test is 2.0 mm ３ The following is a method of measuring the amount of wear on the contact surface of the metal ring with the resin plate when a thrust test is performed for 90 minutes with a thrust pressure of 100 N and a peripheral speed of 0.3 m / s, in accordance with JIS K 7218 (1986) Method A, by placing a resin plate formed by molding the resin composition on the upper surface of a hollow cylindrical metal ring made of SUS304.

[0014] A resin composition according to one aspect of the present invention is a resin composition in which the base resin is selected from the group consisting of polyphenylene sulfide resin and liquid crystal resin, and by including a thermally conductive filler which includes a filler (A) having a flaky or plate-like anisotropic shape and a filler (B) having an isotropic shape, a resin composition with high thermal conductivity in the thickness direction can be realized.

[0015] Furthermore, in one aspect of the present invention, the resin composition is such that the filler (B) having an isotropic shape has an isotropic shape and the amount of stainless steel wear measured by the abrasion test is 2.0 mm. ３ By being selected from the group consisting of alumina and magnesium oxide having an isotropic shape, the amount of metal wear on the processing machine during melt-kneading of the resin composition according to one aspect of the present invention can be reduced. In this specification, the property of being less likely to wear down the mating metal is referred to as "metal wear resistance".

[0016] <Base Resin> The base resin is at least one selected from the group consisting of polyphenylene sulfide resin and liquid crystal resin.

[0017] (Polyphenylene sulfide resin) Polyphenylene sulfide resin (hereinafter also referred to as "PPS") is a polymer having a structural unit represented by the following formula (I).

[0018] (In formula (I), Ar represents a phenylene-containing group and S represents sulfur.) If the structural unit represented by the above formula (I) is defined as 1 mole (basic mole), the PPS used in the present invention is a polymer that typically contains 50 mol% or more, preferably 70 mol% or more, and more preferably 90 mol% or more of this structural unit.

[0019] In formula (I) above, Ar may have groups other than phenylene, and phenylene may have substituents. The number of carbon atoms in Ar is, for example, 6 to 20. Examples of Ar structures include the following.

[0020] PPS may be a homopolymer consisting of identical structural units, a copolymer having two or more different structural units, or a mixture thereof. The copolymer may be a random copolymer or a block copolymer.

[0021] In PPS, a portion of the polymer chain may be substituted with another polymer, as long as the effects of the present invention are not impaired. Examples of substituted polymers include polyester polymers, polyarylene ether polymers, polystyrene polymers, polyolefin polymers, fluorine-containing polymers, polyolefin elastomers, and silicone elastomers.

[0022] PPS can be produced by known methods described, for example, in Japanese Patent Publication No. 45-3368 and Japanese Patent Publication No. 52-12240. PPS may be heated in air to increase its molecular weight, or it may be chemically modified using compounds such as acid anhydrides.

[0023] In one aspect of the present invention, the PPS used preferably has a melt viscosity of 1 to 100 Pa·sec, more preferably 5 to 50 Pa·sec, and even more preferably 10 to 30 Pa·sec at a resin temperature of 310°C and a shear rate of 1200 (1 / sec). The melt viscosity of PPS is measured with a capillary rheometer.

[0024] PPS may be used alone or in combination of two or more.

[0025] Since PPS is a crystalline resin, it has excellent heat resistance and chemical resistance. Therefore, by including PPS as a base resin in the resin composition according to one aspect of the present invention, the heat resistance and chemical resistance of the resin composition can be improved.

[0026] Examples of commercially available PPS include "LR-100G" (melt viscosity 8 Pa·sec / 310°C, 1200 sec －１ ) manufactured by DIC Corporation, and "MB652-290G" (melt viscosity 15 Pa·sec / 310°C, 1200 sec －１ ) manufactured by DIC Corporation.

[0027] (Liquid crystal resin) A liquid crystal resin (hereinafter also referred to as "LCP") is a polymer that exhibits liquid crystallinity in a molten state. The type of liquid crystal resin is not particularly limited, but a thermotropic liquid crystal resin is preferred. A thermotropic liquid crystal resin is a polymer that becomes a liquid crystal state such as nematic in a certain temperature range.

[0028] The type of thermotropic liquid crystal resin is not particularly limited. Thermotropic liquid crystal resins are classified according to heat resistance. For example, type I liquid crystal resins are liquid crystal resins with a heat deflection temperature under load (DTUL) of 300°C or higher at 1.80 MPa, and type 1.5 and type II liquid crystal resins are liquid crystal resins with a DTUL of 210°C or higher and lower than 300°C at 1.80 MPa. Type III liquid crystal resins mean liquid crystal resins with a DTUL of 60°C or higher and lower than 210°C at 1.80 MPa.

[0029] Examples of thermotropic liquid crystal resins include: Type I liquid crystal resins (such as biphenol / benzoic acid / parahydroxybenzoic acid (POB) copolymers); Type 1.5 liquid crystal resins (such as biphenol / benzoic acid / hydroxynaphthoic acid (HNA) / parahydroxybenzoic acid (POB) copolymers); Type II liquid crystal resins (such as hydroxynaphthoic acid (HNA) / POB copolymers); Type III liquid crystal resins (such as POB / ethylene terephthalate copolymers); and others.

[0030] While not particularly limited, among these, type 1.5 liquid crystal resin, type II liquid crystal resin, or type III liquid crystal resin are preferred from the viewpoint of mixing temperature and liquid crystal transition temperature. One type of liquid crystal resin may be used alone, or two or more types may be used in combination.

[0031] LCP can be manufactured by known methods (see, for example, Japanese Patent Publication No. 62-250029).

[0032] In one embodiment of the present invention, the LCP used has a melt viscosity of 1 to 100 Pa·sec at a resin temperature of 340°C and a shear rate of 1200 (1 / sec), more preferably 5 to 50 Pa·sec, and even more preferably 7 to 30 Pa·sec. The melt viscosity of the LCP is measured using a capillary rheometer.

[0033] Examples of commercially available LCPs include "A6000" manufactured by Ueno Pharmaceutical Co., Ltd.

[0034] In one aspect of the present invention, a resin composition containing LCP as a base resin can be obtained to achieve superior moldability of the resin composition. For example, when LCP is included as the base resin, the melt viscosity decreases more significantly in the shear rate range of 1200 (1 / sec) or higher compared to using PPS alone, resulting in superior fluidity.

[0035] (Base resin content) Furthermore, from the viewpoint of fluidity, the base resin content in the resin composition according to one embodiment of the present invention is preferably 40% by volume or more, and more preferably 50% by volume or more. Furthermore, from the viewpoint of thermal conductivity, it is preferably 80% by volume or less, and more preferably 70% by volume or less. When the base resin is LCP, the molding fluidity of the resin composition can be sufficiently improved by having the base resin content in the resin composition within the above range.

[0036] Furthermore, when the base resin is PPS, the heat resistance and chemical resistance of the resin composition can be sufficiently improved by ensuring that the base resin content in the resin composition is within the above-mentioned range.

[0037] Furthermore, when the base resin is a mixture of PPS and LCP, the ratio of the PPS content to the LCP content in the base resin (PPS / LCP) can be appropriately adjusted depending on the purpose of the resin composition and is not particularly limited.

[0038] <Thermally conductive filler>

[0039] A thermally conductive filler contained in a resin composition according to one aspect of the present invention includes a filler (A) having a flaky or plate-like anisotropic shape (hereinafter also referred to as "thermally conductive filler (A)") and a filler (B) having an isotropic shape (hereinafter also referred to as "thermally conductive filler (B)"). By including two types of thermally conductive fillers with different shapes, the resin composition according to one aspect of the present invention can achieve a resin composition with high thermal conductivity in the thickness direction. The mechanism of action is thought to be as follows. Specifically, by arranging the flaky or plate-like anisotropic filler (A) in the gaps of the isotropic filler (B) dispersed in the resin, or in contact with the isotropic filler (B), it is thought that heat transfer between the two fillers can be efficiently performed, and heat conduction paths can be generated in the thickness direction as well.

[0040] (Filler (A) having a flaky or plate-like anisotropic shape) Filler (A) having a flaky or plate-like anisotropic shape is not particularly limited as long as it is a flaky or plate-like thermal conductive filler having anisotropic shape. In this specification, anisotropic shape means a shape with an aspect ratio (major axis diameter / minor axis diameter) of 3 or more. The method for measuring the aspect ratio (major axis diameter / minor axis diameter) is to take a two-dimensional image of the filler and determine the circumscribed circle by image analysis. This diameter is taken as the major axis diameter. On the other hand, the inscribed circle is determined and this diameter is taken as the minor axis diameter.

[0041] From the viewpoint of thermal conductivity, the anisotropic shape is preferably one with an aspect ratio (major axis diameter / minor axis diameter) of 5 or more, and more preferably one with an aspect ratio of 10 or more. Furthermore, from the viewpoint of compounding, the shape is preferably one with an aspect ratio (major axis diameter / minor axis diameter) of 200 or less, more preferably one with an aspect ratio of 100 or less, and even more preferably one with an aspect ratio of 50 or less.

[0042] The thermally conductive filler (A) may have an anisotropic shape, such as flakes or plates, but it is preferable that the flakes or plates have an aspect ratio (major axis diameter / minor axis diameter) that satisfies the above-mentioned range.

[0043] The thermally conductive filler (A) may be either an inorganic or organic filler. Examples of thermally conductive fillers (A) include plate-shaped talc, flaky talc, plate-shaped boehmite, flaky boehmite, plate-shaped graphite, flaky graphite, plate-shaped alumina, plate-shaped boron nitride, and flaky boron nitride. The plate-shaped alumina that can be used as a thermally conductive filler (A) may be alumina with normal Mohs hardness or low-hardness alumina. Furthermore, the plate-shaped boron nitride and flaky boron nitride that can be used as a thermally conductive filler (A) are preferably hexagonal boron nitride (h-BN) from the viewpoint of metal wear resistance.

[0044] The thermally conductive filler (A) may be used alone or in combination of two or more types. From the viewpoint of insulation, it is preferable that the thermally conductive filler (A) is at least one selected from the group consisting of flake-shaped or plate-shaped boron nitride, flake-shaped or plate-shaped talc, and plate-shaped alumina. Among these, from the viewpoint of obtaining a resin composition with higher thermal conductivity in the thickness direction, it is more preferable that the thermally conductive filler (A) is flake-shaped or plate-shaped boron nitride.

[0045] When plate-shaped alumina is used as the thermally conductive filler (A), from the viewpoint of metal abrasion resistance, the amount of stainless steel abrasion measured by abrasion testing should be 2.0 mm. ３ The following alumina is preferable. The abrasion test will be described later.

[0046] The average particle size of the thermal conductive filler (A) is not particularly limited and can be selected as appropriate. For example, the average particle size of the thermal conductive filler (A) can be 4 μm or more, and may be 10 μm or more. The upper limit of the average particle size of the thermal conductive filler (A) can be 100 μm or less, and may be 50 μm or less. From the viewpoint of combination with thermal conductive filler (B), it is preferable that the average particle size of the thermal conductive filler (A) be 4 μm or more and 40 μm or less. The average particle size of the thermal conductive filler (A) is a value measured by measuring the particle size distribution by laser diffraction scattering method.

[0047] (Isotropic Shaped Filler (B)) The isotropic shaped filler (B) (thermal conductive filler (B)) contained in the resin composition according to one aspect of the present invention has an isotropic shape and the stainless steel wear amount measured by the following abrasion test is 2.0 mm ３The thermal conductive filler (B) is selected from the group consisting of alumina and magnesium oxide having an isotropic shape, and the abrasion test is a method of measuring the amount of abrasion of the contact surface of the metal ring with the resin plate when a thrust test is performed for 90 minutes with a thrust pressure of 100 N and a peripheral speed of 0.3 m / s in accordance with JIS K 7218 (1986) Method A. The thermal conductive filler (B) may be used alone or in combination of two or more types.

[0048] In this specification, an isotropic shape means a shape with an aspect ratio (major axis diameter / minor axis diameter) of 1.0 or greater and less than 3.0. The major axis diameter and minor axis diameter are as described above.

[0049] From the viewpoint of preventing warping of the molded product obtained by injection molding the resin composition, the isotropic shape is preferably such that the aspect ratio (major axis diameter / minor axis diameter) is 1.0 or more and less than 3.0, more preferably 1.0 or more and 2.5 or less, and even more preferably 1.0 or more and 2.0 or less.

[0050] Isotropic shapes include, for example, spheres and regular polyhedra, but the shape is not limited to these as long as the aspect ratio (major axis diameter / minor axis diameter) is within the above range; it may also be an indeterminate shape with an aspect ratio (major axis diameter / minor axis diameter) within the above range. In this specification, "indeterminate shape" is intended to be a shape other than a sphere or regular polyhedron that is not fixed in shape or size and has multiple planes or curved surfaces.

[0051] (The amount of stainless steel wear measured by the wear test is 2.0 mm) ３The following abrasion test is a method of measuring the abrasion amount of the contact surface between the metal ring and the resin plate, in which a resin plate formed by molding a resin composition is placed on the upper surface of a hollow cylindrical metal ring made of SUS304, and a thrust test is conducted for 90 minutes according to the method A of JIS K 7218 (1986) under a pressing force of 100 N in the thrust direction and a peripheral speed of 0.3 m / s. The detailed test conditions of the abrasion test are as described in the examples below. Also, SUS304 used in the abrasion test is an austenitic hot-rolled stainless steel, and its chemical composition, etc. are defined by JIS G 4304 (2015). The abrasion amount of the stainless steel measured by the abrasion test is 2.0 mm ３ The following alumina has the property of being difficult to wear the mating metal, and thus, in this specification, it may be referred to as "metal wear-resistant alumina" for convenience. From the viewpoint of enhancing the metal wear resistance, it is preferable that the stainless steel abrasion amount of the metal wear-resistant alumina is smaller, for example, 2.0 mm ３ Preferably, it is as follows, 1.5 mm ３ More preferably, it is as follows, 1.0 mm ３ Even more preferably, it is as follows, 0.5 mm ３ Even further preferably, it is as follows, 0.4 mm ３ Most preferably, it is as follows.

[0052] The metal wear-resistant alumina is alumina that satisfies at least one of the following requirements (a) and (b): (a) Particles of an alumina-based oxide having a Mohs hardness of less than 9; (b) An average particle size of 0.5 μm or less.

[0053] In this specification, the "Mohs hardness" of a thermally conductive filler refers to the Mohs hardness of the mineral or compound used as the raw material for the thermally conductive filler. "Alumina oxide particles with a Mohs hardness of less than 9" means particles obtained using alumina oxide with a Mohs hardness of less than 9 as the raw material. "Mohs hardness" is determined by rubbing a standard mineral against a sample material and measuring the relative hardness. Ten types of standard minerals and ten corresponding Mohs hardness levels from 1 to 10 have been defined. For example, if a sample material is scratched when a standard mineral with a specific Mohs hardness is rubbed against it, it is determined that the standard mineral has a higher Mohs hardness than the sample material. The maximum Mohs hardness of the standard mineral that did not scratch the sample material is taken as the Mohs hardness of the sample material. "Alumina oxides with a Mohs hardness of less than 9" have a lower Mohs hardness than ordinary alumina, and therefore, in this specification, they may be referred to as "low-hardness alumina" for convenience.

[0054] If the thermally conductive filler (B) is a metal-wear resistant alumina that satisfies the requirements of (a) above, that is, if the thermally conductive filler (B) is a low-hardness alumina, the average particle size of the thermally conductive filler (B) is not particularly limited and can be appropriately selected. The average particle size of the thermally conductive filler (B) can be, for example, 1 μm or more, 2 μm or more, 3 μm or more, or 5 μm or more. Furthermore, the upper limit of the average particle size of the thermally conductive filler (B) can be 50 μm or less, or 30 μm or less. From the viewpoint of combination with thermally conductive filler (A), it is preferable that the average particle size of the thermally conductive filler (B) be 5 μm or more and 30 μm or less. In this specification, the average particle size of the thermally conductive filler (B) is a value measured by measuring the particle size distribution by laser diffraction scattering, similar to the thermally conductive filler (A).

[0055] If the thermally conductive filler (B) is a metal-wear resistant alumina that satisfies the requirements of (b) above, the Mohs hardness of the alumina is not particularly limited. The thermally conductive filler (B) may be alumina having a normal Mohs hardness or low-hardness alumina. In this case, the lower limit of the average particle size of the thermally conductive filler (B) is not particularly limited.

[0056] The thermally conductive filler (B) may be metal-wear resistant alumina that satisfies both requirements (a) and (b).

[0057] While metal wear-resistant alumina exhibits excellent metal wear resistance, among these, from the viewpoint of efficiently transferring heat between fillers, the thermally conductive filler (B) may be metal wear-resistant alumina that satisfies the requirements of (a) above and has an average particle size of 1 μm or more, or 2 μm or more, or 3 μm or more. The thermally conductive filler (B) may also be a combination of two types of metal wear-resistant alumina: metal wear-resistant alumina that satisfies the requirements of (a) above and has an average particle size of 1 μm or more, or 2 μm or more, or 3 μm or more, and metal wear-resistant alumina with a relatively small particle size that satisfies the requirements of (b).

[0058] (Magnesium Oxide) Magnesium oxide has a Mohs hardness of 5 and excellent resistance to metal wear. When the thermal conductive filler (B) is magnesium oxide, the average particle size of the thermal conductive filler (B) is not particularly limited and can be selected as appropriate. The average particle size of the thermal conductive filler (B) can be, for example, 3 μm or more, and may be 5 μm or more. The upper limit of the average particle size of the thermal conductive filler (B) can be 50 μm or less, and may be 30 μm or less. From the viewpoint of combination with thermal conductive filler (A), it is preferable that the average particle size of the thermal conductive filler (B) be 5 μm or more and 30 μm or less.

[0059] It is preferable that the magnesium oxide used is low-hygroscopic magnesium oxide. The low-hygroscopic magnesium oxide of the thermally conductive filler (B) suppresses its conversion to magnesium hydroxide, thereby preventing a decrease in thermal conductivity. Here, "low-hygroscopic" means that the water absorption rate after 48 hours in an 85°C-85%RH environment is 0.5% or less.

[0060] (Preferred combination of thermally conductive filler (A) and thermally conductive filler (B)) From the viewpoint of obtaining a resin composition with high thermal conductivity in the thickness direction, a preferred combination is in which thermally conductive filler (A) is at least one selected from the group consisting of flake-shaped boron nitride and plate-shaped boron nitride, and thermally conductive filler (B) is at least one selected from the group consisting of isotropically shaped metal-wear resistant alumina and isotropically shaped magnesium oxide. Among these, from the viewpoint of efficiently transferring heat between fillers for thermally conductive filler (A), and from the viewpoint of excellent moldability of the resin composition for thermally conductive filler (B), a combination in which thermally conductive filler (A) is plate-shaped hexagonal boron nitride and thermally conductive filler (B) is isotropically shaped metal-wear resistant alumina is more preferred.

[0061] Another preferred combination is one in which, from the viewpoint of balancing improved thermal conductivity in the thickness direction and reduced anisotropy of thermal conductivity (surface direction / thickness direction), and metal wear resistance, thermal conductive filler (A) is at least one selected from the group consisting of flake-shaped talc and plate-shaped talc, and thermal conductive filler (B) is at least one selected from the group consisting of metal wear-resistant alumina with an isotropic shape and magnesium oxide with an isotropic shape.

[0062] Another preferred combination, from the viewpoint of balancing high thermal conductivity in the thickness direction with a reduction in anisotropy of thermal conductivity (surface direction / thickness direction), is a combination in which thermal conductive filler (A) is plate-shaped alumina and thermal conductive filler (B) is at least one selected from the group consisting of metal wear-resistant alumina having an isotropic shape and magnesium oxide having an isotropic shape.

[0063] Another preferred combination, from the viewpoint of further increasing high thermal conductivity in the thickness direction, is one in which the thermal conductive filler (A) is selected from the group consisting of flaky boron nitride and plate-shaped boron nitride, and the thermal conductive filler (B) is magnesium oxide having an isotropic shape.

[0064] (Content of thermally conductive filler) The content of thermally conductive filler in the resin composition according to one aspect of the present invention is not particularly limited, but from the viewpoint of thermal conductivity, it is preferably 25% by mass or more, and more preferably 30% by mass or more, based on 100% by mass of the resin composition according to one aspect of the present invention. Furthermore, from the viewpoint of fluidity, the content of thermally conductive filler in the resin composition according to one aspect of the present invention is preferably 55% by mass or less, and more preferably 50% by mass or less, based on 100% by mass of the resin composition according to one aspect of the present invention.

[0065] Furthermore, the total content of thermal conductive filler (A) and thermal conductive filler (B) relative to the total amount of thermal conductive filler is not particularly limited. From the viewpoint of thermal conductivity, the total content of thermal conductive filler (A) and thermal conductive filler (B) relative to the total amount of thermal conductive filler is preferably 50% by mass or more, and more preferably 60% by mass or more. Also, there is no particular upper limit to the total content of thermal conductive filler (A) and thermal conductive filler (B) relative to the total amount of thermal conductive filler, and may be 100% by mass.

[0066] Furthermore, the ratio of the content of thermal conductive filler (A) to the content of thermal conductive filler (B) can be appropriately adjusted according to the purpose of the resin composition and is not particularly limited, but from the viewpoint of obtaining a resin composition with higher thermal conductivity in the thickness direction, it is preferable to be within the following range. Specifically, the ratio (A / B) of the content of thermal conductive filler (A) to the content of thermal conductive filler (B) is preferably 20 / 80 or more by volume, and more preferably 25 / 75 or more. Also, the ratio (A / B) of the content of thermal conductive filler (A) to the content of thermal conductive filler (B) is preferably 80 / 20 or less by volume, more preferably 75 / 25 or less, and most preferably 50 / 50 or less.

[0067] The thermal conductivity of the thermally conductive filler contained in a resin composition according to one aspect of the present invention is preferably high from the viewpoint of improving the thermal conductivity of the resin composition. Specifically, the thermal conductivity of the thermally conductive filler is preferably 1.0 W / m·K or higher, more preferably 2.0 W / m·K or higher, and even more preferably 3.0 W / m·K or higher. If the material of the thermally conductive filler is a mineral and raw material is available, the thermal conductivity of the thermally conductive filler shall be the value measured by the laser flash method (JIS R 1611) on a thin flat plate cut from the raw material. However, if it is not possible to obtain a thin flat plate for measuring thermal conductivity (for example, an artificial filler obtained as a powder from the beginning), the value shall be obtained by measuring the thermal permeability of each filler under a microscope using the photoheating thermoreflectance method with a thermophysical microscope and calculating the thermal conductivity.

[0068] Furthermore, it is preferable to select a non-conductive filler for the resin composition according to one aspect of the present invention. This makes it possible to apply the resin composition according to one aspect of the present invention to insulating parts. Here, "non-conductive" means having the property of not conducting electricity well, or in other words, having electrical insulating properties. Examples of non-conductive substances include alumina, magnesium oxide, boron nitride, silica, talc, magnesium carbonate, calcium carbonate, zinc oxide, and aluminum nitride.

[0069] <Fibrous Filler> The resin composition according to one aspect of the present invention preferably further contains a fibrous filler. By further containing a fibrous filler in the resin composition according to one aspect of the present invention, the mechanical strength of the resin composition can be improved.

[0070] Examples of fibrous fillers include conventionally known fibrous fillers used to enhance the mechanical strength of resin compositions. Fibrous fillers may be either inorganic or organic fillers. Examples of fibrous fillers include glass fibers, whiskers, and aramid fibers. Fibrous fillers may be used individually or in combination of two or more types. Among these, glass fibers are preferred from the viewpoint of improving strength. The aspect ratio of a fibrous filler can be expressed as fiber length / fiber diameter.

[0071] (Glass Fibers) Glass fibers are not particularly limited, but include conventionally known glass fibers used to enhance the mechanical strength of resin compositions. Such glass fibers include, for example, SiO ２ Al ２ O ３ , B ２ O ３ , CaO, MgO, Li ２ O, Na ２ O, K ２ O and TiO ２ Glass fiber composed of glass containing one or more components selected from the group consisting of, and the composition of each component is SiO ２ 50-70% by mass, Al ２ O ３ 1-20% by mass, B ２ O ３ 5-30 mass% of , CaO 0.1-25 mass% of , MgO 0-7 mass% of , Li ２ O is 0-1% by mass, Na ２ O is 0-2% by mass, K ２ O is 0-1.5 mass%, TiO ２ Preferably, it has a range of 0 to 5% by mass.

[0072] Such glass fibers include commercially available glass fibers composed of conventionally known materials such as E-glass, S-glass, C-glass, D-glass, ECR-glass, and AR-glass. Glass fibers may be used individually or in combination of two or more types. Among these, glass fibers composed of E-glass are commonly used.

[0073] It is preferable that the surface of the glass fibers is pre-treated with a coupling agent such as an isocyanate compound, an organosilane compound, an organotitanate compound, an organoborane compound, or an epoxy compound. This improves the bundling ability of the glass fibers, their dispersibility in the resin composition, and the adhesion between the glass fibers and the resin.

[0074] Furthermore, while the shape of the glass fibers is not particularly limited, from the viewpoint of fluidity, the fiber diameter is preferably 3 μm or more, more preferably 5 μm or more, and even more preferably 7 μm or more. Also, from the viewpoint of improving strength, the fiber diameter is preferably 20 μm or less, more preferably 15 μm or less, and even more preferably 11 μm or less. The fiber diameter of the glass fiber refers to the diameter of the circle obtained by converting the cross-section perpendicular to the fiber axis into a circle having the same area as the cross-section.

[0075] The fiber diameter of glass fibers is a number average and is measured and calculated by performing image analysis using a digital microscope on 50 or more arbitrarily selected glass fibers. While the cross-sectional shape of glass fibers is usually circular, it can also be a flattened circle or an ellipse. A typical example of a flattened circle is a glass fiber with a cross-sectional shape of 28 μm in major axis and 7 μm in minor axis.

[0076] Furthermore, from the viewpoint of compatibility (handling), the glass fibers are preferably short fibers (for example, chopped fibers (chopped strands), milled fibers, etc.), specifically, the fiber length is preferably 10 mm or less, more preferably 6 mm or less, even more preferably 5 mm or less, and even more preferably 3 mm or less. Furthermore, from the viewpoint of improving strength, the fiber length is preferably 100 μm or more, more preferably 200 μm or more, even more preferably 300 μm or more, and even more preferably 600 μm or more. The fiber length of the glass fibers is a number average, and is a value calculated by measuring and analyzing images of optical microscope images of 50 or more arbitrarily selected glass fibers.

[0077] Examples of commercially available glass fibers include "CSG 3PA-830S" (cross-sectional flattening ratio 4, flattened glass fiber) manufactured by Nitto Boseki Co., Ltd.

[0078] (Content of fibrous filler) The content of fibrous filler in the resin composition according to one aspect of the present invention is not particularly limited, but from the viewpoint of improving strength, it is preferably 10% by mass or more, and more preferably 20% by mass or more. Also, from the viewpoint of fluidity, it is preferably 40% by mass or less, and more preferably 30% by mass or less.

[0079] <Other Components> In addition to the components described above, the resin composition according to one aspect of the present invention may contain any additives such as antioxidants, nucleating agents, plasticizers, mold release agents, flame retardants, pigments, and antistatic agents, to the extent that they do not impair the effects of the present invention. These additives may be additives commonly used in the art.

[0080] The content of each additive in the resin composition may be adjusted as appropriate from the viewpoint of the performance of each additive. Furthermore, from the viewpoint of reducing the influence on the physical properties of the resulting molded article, the total content of additives in the resin composition is preferably 5% by mass or less, more preferably 2% by mass or less, and even more preferably 1% by mass or less.

[0081] <Properties and Form of Resin Composition> The level of thermal conductivity in the thickness direction of the resin composition according to one aspect of the present invention is not particularly limited, but for example, the resin composition according to one aspect of the present invention preferably has a thickness thermal conductivity of 0.1 W / m·K or higher, and more preferably 0.2 W / m·K or higher. Since such a resin composition has sufficiently high thermal conductivity in the thickness direction, it has excellent heat dissipation properties. Therefore, it can be suitably used as a material for any article that requires high heat dissipation. The thickness thermal conductivity of the resin composition according to one aspect of the present invention is a value measured by the method described in the examples below.

[0082] Furthermore, the resin composition according to one aspect of the present invention contains a thermally conductive filler comprising an anisotropic filler (A) and an isotropic filler (B), thereby providing sufficiently high thermal conductivity in the planar direction. For example, the resin composition according to one aspect of the present invention preferably has an in-plane thermal conductivity of 1.0 W / m·K or higher, and more preferably 1.2 W / m·K or higher. The in-plane thermal conductivity of the resin composition according to one aspect of the present invention is a value measured by the method described in the examples below.

[0083] Furthermore, it is preferable that the resin composition according to one aspect of the present invention exhibits low anisotropy in thermal conductivity in the molded article. The aforementioned "anisotropy in thermal conductivity" can be expressed as the ratio of thermal conductivity in the surface direction to thermal conductivity in the thickness direction (surface direction / thickness direction), and a larger ratio of thermal conductivity in the surface direction / thickness direction means greater anisotropy in thermal conductivity. From the viewpoint of reducing anisotropy in thermal conductivity, when the resin composition according to one aspect of the present invention is formed into a plate-shaped molded article, it is preferable that the ratio of thermal conductivity in the surface direction to thermal conductivity in the thickness direction (surface direction / thickness direction) is less than 10, more preferably 6.0 or less, even more preferably 5.0 or less, even more preferably 4.0 or less, and most preferably 3.0 or less. By having the ratio of thermal conductivity in the surface direction / thickness direction within the above range, the effect of efficient heat diffusion is achieved regardless of the shape of the molded article. When the anisotropy of thermal conductivity is large, heat preferentially diffuses in the planar direction. However, when the anisotropy of thermal conductivity is small, such that the ratio of thermal conductivity in the planar direction to thermal conductivity in the thickness direction (planar direction / thickness direction) is less than 10, heat can be efficiently diffused, for example, in molded shapes such as coating materials where heat diffusion in the thickness direction is necessary.

[0084] Furthermore, the resin composition according to one aspect of the present invention preferably has high mechanical strength. For example, the resin composition according to one aspect of the present invention preferably has a tensile strength of 45 MPa or more in a molded article, more preferably 50 MPa or more, more preferably 60 MPa or more, more preferably 70 MPa or more, and even more preferably 80 MPa or more. Having a tensile strength within the above range makes it suitable for use in applications where high mechanical strength is required. Furthermore, there is no particular upper limit to the tensile strength of the resin composition according to one aspect of the present invention. The tensile strength of the resin composition according to one aspect of the present invention is a value measured by the method described in the examples below.

[0085] Furthermore, the resin composition according to one aspect of the present invention preferably has high moldability. For example, the resin composition according to one aspect of the present invention preferably has a spiral flow length of 45 mm or more, more preferably 50 mm or more, more preferably 100 mm or more, more preferably 150 mm or more, and more preferably 170 mm or more. Having a spiral flow length within the above range makes it suitable for use in applications where high moldability is required. Furthermore, there is no particular upper limit to the spiral flow length of the resin composition according to one aspect of the present invention. The spiral flow length of the resin composition according to one aspect of the present invention is a value measured by the method described in the examples below.

[0086] Furthermore, the resin composition according to one aspect of the present invention preferably has high flame retardancy. For example, the resin composition according to one aspect of the present invention preferably has a flame retardancy of V-2 or higher according to the UL94V standard when a test piece with a thickness of 0.8 mm is used, preferably has a flame retardancy of V-1 or higher, and more preferably has a flame retardancy of V-0 or higher. Such a resin composition can be suitably used in applications where high flame retardancy is required.

[0087] The form of the resin composition according to one aspect of the present invention is not particularly limited and can be any form such as powder, granules, or pellets. The resin composition according to one aspect of the present invention is preferably in the form of pellets because it is easy to use in injection molding.

[0088] <Uses of the Resin Composition> The resin composition according to one aspect of the present invention has high thermal conductivity in the thickness direction and excellent heat dissipation properties. The uses of the resin composition according to one aspect of the present invention are not particularly limited, but it can be suitably used as a coating material or insulating material for electric wires by taking advantage of the above-mentioned features. In this specification, "coating material" means a material used to mold a coating part, and "insulating material" means a material used to mold an insulating part. For example, electric motors in the industrial and automotive fields require increased power output and miniaturization to improve power density from the viewpoint of improving power performance and fuel efficiency. To improve the efficiency of motors, high thermal conductivity of components is required, in particular, high thermal conductivity in the thickness direction to efficiently transfer heat generated from the heat-generating part to the cooling part. For this reason, the resin composition according to one aspect of the present invention can be suitably used, for example, as a coating material for coil wires for electric motors. Specific examples of coating parts for electric motor coils formed by molding a coating material for coil wires for electric motors will be described later. Thus, the resin composition according to one aspect of the present invention can be used as a resin composition for coating materials.

[0089] <Method for Producing Resin Compositions> A resin composition according to one aspect of the present invention can be produced by blending a base resin, which is at least one selected from the group consisting of polyphenylene sulfide resin and liquid crystal resin, with a thermally conductive filler containing an anisotropic filler (A) and an isotropic filler (B), and then melt-kneading them together. For example, the above components can be blended and kneaded using a Henschel mixer, Banbury mixer, single-screw extruder, twin-screw extruder, multi-screw extruder, conical mixer, etc. The heating temperature during kneading is usually in the range of 20°C to 60°C higher than the melting point of the resin.

[0090] Alternatively, the above ingredients may be blended and pre-mixed using commonly used equipment (e.g., ribbon blender, drum tumbler, etc.) and then kneaded using the above-mentioned apparatus.

[0091] [2. Coating Material or Insulating Material] A coating material or insulating material according to one aspect of the present invention includes the resin composition described above. A coating material or insulating material according to one aspect of the present invention can be manufactured using the resin composition described above.

[0092] There are no particular limitations on the method for producing a coating material or insulating material using a resin composition according to one aspect of the present invention, and known methods can be employed. For example, a coating material or insulating material can be produced by melting and mixing a resin composition according to one aspect of the present invention with various additives as needed, and then putting the resulting composition into an extruder and melt-kneading it to form pellets. As a means for mixing the composition, compounding equipment such as an extruder, Henschel mixer, kneader, shaft kneader, Banbury mixer, or roll mill can be used.

[0093] [3. Molded Article] A molded article according to one aspect of the present invention includes the above-described resin composition. A molded article according to one aspect of the present invention can be manufactured from the above-described resin composition by, for example, injection molding, injection compression molding, extrusion molding, blow molding, press molding, vacuum molding, foam molding, etc. A molded article according to one aspect of the present invention may be, for example, a covering part or an insulating part.

[0094] A covering or insulating component according to one aspect of the present invention can be used, for example, in electric motors in industrial fields or automotive fields.

[0095] <Coating Parts> A coating part according to one aspect of the present invention is formed by molding a coating material containing the resin composition according to the above-described aspect of the present invention. Specifically, a coating part according to one aspect of the present invention is used in wire coating parts formed by coating an electric wire with the coating material, motor insulators, coil terminal blocks, electric wire coatings, etc.

[0096] There are no particular limitations on the method for manufacturing a coated part using the coating material according to one aspect of the present invention, and known methods can be employed. For example, a mixture containing each component of the resin composition according to the above-described aspect of the present invention can be put into an extruder, melt-kneaded to form pellets, and then these pellets can be put into an injection molding machine equipped with a predetermined mold and injected to manufacture the product.

[0097] There are no particular restrictions on the thickness of the covering component; it can be determined appropriately, for example, by considering the diameter of the electric wire.

[0098] <Insulating component> An insulating component according to one aspect of the present invention is formed by molding an insulating material containing the resin composition according to the above-described aspect of the present invention.

[0099] Specific examples of insulating components formed by molding an insulating material according to one aspect of the present invention include insulating components for electric wires, motor insulators, coil terminal blocks, and electric wire coatings.

[0100] There are no particular limitations on the method for manufacturing a coated part using a coating material according to one aspect of the present invention, and known methods can be employed. For example, a coated part can be manufactured by introducing the coating material according to one aspect of the present invention into an injection molding machine equipped with a predetermined mold and performing injection molding. In addition to injection molding, coated parts may also be manufactured from the above-mentioned coating material by known methods such as injection compression molding, extrusion molding, blow molding, press molding, vacuum molding, and foam molding. The same applies to the method for manufacturing an insulating part using an insulating material according to one aspect of the present invention.

[0101] [Summary] The resin composition according to embodiment 1 of the present invention comprises a base resin which is at least one selected from the group consisting of polyphenylene sulfide resin and liquid crystal resin, and a thermally conductive filler, wherein the thermally conductive filler comprises filler (A) having a flaky or plate-like anisotropic shape and filler (B) having an isotropic shape, wherein the filler (B) has an isotropic shape and the stainless steel wear amount measured by the following abrasion test is 2.0 mm ３The material is selected from the group consisting of alumina and magnesium oxide having an isotropic shape, and the abrasion test is a method of measuring the amount of abrasion of the contact surface between the metal ring and the resin plate when a thrust test is performed for 90 minutes with a thrust pressure of 100 N and a peripheral speed of 0.3 m / s in accordance with JIS K 7218 (1986) Method A.

[0102] In the resin composition according to embodiment 2 of the present invention, the filler (A) having a flaky or plate-like anisotropic shape may be configured to be at least one selected from the group consisting of flaky or plate-like boron nitride, flaky or plate-like talc, and plate-like alumina, as described in embodiment 1 above.

[0103] In the resin composition according to embodiment 3 of the present invention, the magnesium oxide may be configured to be low-hygroscopic magnesium oxide in embodiment 1 or 2 described above.

[0104] The resin composition according to embodiment 4 of the present invention is such that, in any one of embodiments 1 to 3 above, the amount of stainless steel wear measured by the abrasion test is 2.0 mm. ３ The following alumina may be configured to satisfy at least one of the following requirements (a) and (b): (a) particles of alumina-based oxide with a Mohs hardness of less than 9; (b) average particle size of 0.5 μm or less.

[0105] The resin composition according to embodiment 5 of the present invention may be configured such that, in any one of embodiments 1 to 4 above, the aspect ratio of the filler (A) having a flaky or plate-like anisotropic shape is 3 or more and 200 or less, and the aspect ratio of the filler (B) having an isotropic shape is 1.0 or more and less than 3.0.

[0106] In any one of the above embodiments 1 to 5, the resin composition may be configured such that the content of the thermally conductive filler in the resin composition is 25% by mass or more and 55% by mass or less.

[0107] In any one of the above embodiments 1 to 6, the resin composition according to embodiment 7 of the present invention may have a composition in which the ratio (A / B) of the content of the flake-shaped or plate-shaped anisotropic filler (A) to the content of the isotropic-shaped filler (B) is 20 / 80 or more and 80 / 20 or less in volume ratio.

[0108] In the resin composition according to embodiment 8 of the present invention, in any one of embodiments 1 to 7 described above, it is preferable that the ratio of thermal conductivity in the surface direction to thermal conductivity in the thickness direction (surface direction / thickness direction) is less than 10 when the molded body is in the shape of a plate.

[0109] The resin composition according to embodiment 9 of the present invention may further include a fibrous filler in any one of embodiments 1 to 8 described above.

[0110] In the resin composition according to embodiment 10 of the present invention, the fibrous filler may be glass fiber in the above embodiment 9.

[0111] The resin composition according to embodiment 11 of the present invention may be configured to be a resin composition for coating materials or a resin composition for insulating materials in any one of embodiments 1 to 10 described above.

[0112] The coating material or insulating material according to embodiment 12 of the present invention may have a configuration that includes the resin composition described in any one of embodiments 1 to 11 above.

[0113] The molded article according to embodiment 13 of the present invention may have a configuration that includes the resin composition described in any one of embodiments 1 to 11 above.

[0114] The covering component or insulating component according to embodiment 14 of the present invention may be configured to consist of the covering material or insulating material described in embodiment 12 above.

[0115] The present invention is not limited to the embodiments described above, and various modifications are possible within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed in each embodiment are also included within the technical scope of the present invention.

[0116] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples.

[0117] [Raw materials for resin compositions] The raw materials for the resin compositions used in the examples and comparative examples are as follows.

[0118] <Base Resin> Polyphenylene sulfide resin (PPS) (manufactured by DIC Corporation, LR-100G, melt viscosity 8 Pa・sec / 310℃, 1200sec) －１ ) ・Polyphenylene sulfide resin (PPS) (DIC Corporation, MB652-290G, melt viscosity 15 Pa・sec / 310℃, 1200sec) －１ )

[0119] <Thermal conductive filler (A) and thermal conductive filler (B)>

[0120] Table 1 summarizes the various thermally conductive fillers (A) and thermally conductive fillers (B). In Table 1, "particle size" represents the "average particle size" measured by the particle size distribution measurement method using laser diffraction scattering. The aspect ratio of all thermally conductive fillers (A) in Table 1 was 3.0 or greater. The aspect ratio of all thermally conductive fillers (B) in Table 1 was between 1.0 and less than 3.0.

[0121] The stainless steel wear amounts of various aluminas shown in Table 1 were measured using the following method. [Stainless Steel Wear Measurement Test] Evaluation was performed using the thrust test method in accordance with JIS K 7218 (1986) Method A. Specifically, the details are as follows: ・Test apparatus: Friction and wear test apparatus EFM-3-M manufactured by A&D Co., Ltd. ・Test form: Thrust test / resin plate vs metal ring ・Resin composition: Polypropylene resin (PP) / 40 vol% thermal conductive filler ・Test conditions: Counter material: SUS304 Test temperature: Room temperature (23℃) Sliding environment: Silicone grease (Shin-Etsu Silicone Co., Ltd. G-40H) Peripheral speed: 0.3 m / sec Pressing force: 100 N Test time: 90 minutes

[0122] (Test Resin Plate) Polypropylene resin (PP) (H-100M, manufactured by Prime Polymer Co., Ltd.) was used as the base resin. A PP resin composition containing 40 vol% of the thermal conductive filler of the test subject in 100 vol% of the resin composition was press-molded at 200°C to produce a test resin plate (30 mm x 30 mm x 3 mm thick) containing the thermal conductive filler of the test subject. The sliding test surface of the test resin plate was polished with a diamond file with a grit of #170.

[0123] (Metal Ring) A hollow cylindrical metal ring made of SUS304 stainless steel was used. The sliding test surface was polished with #800 grit sandpaper.

[0124] (Test Method) As shown in Figure 1, a test resin plate 1 was placed on the upper surface of a hollow cylindrical metal ring 2, and the test was conducted at room temperature (23°C) with a thrust pressure of 100 N and a peripheral speed of 0.3 m / sec for 90 minutes. ΔV in Figure 1 represents the decrease in volume of the metal ring due to wear. The amount of wear was calculated using the following formula: Amount of wear (mm) ３ ) = (Weight of metal ring (V1) before testing - Weight of metal ring (V2) after testing) / Density of SUS304

[0125] In this test, the thermally conductive filler 11 exposed on the surface of the test resin plate 1 wears down the contact surface 21 of the metal ring 2 with the test resin plate 1, thereby reducing the volume of the metal ring 2. Therefore, the less wear measured in this test, the less the thermally conductive filler is likely to wear down metal, while the more wear measured in this test, the more likely the thermally conductive filler is to wear down metal. In this specification, the amount of stainless steel wear measured in this test is 2.0 mm. ３ The following thermally conductive fillers are evaluated as having excellent resistance to metal wear.

[0126] The following thermally conductive fillers were used from those listed in Table 1: <Thermally conductive filler (A)> - Boron nitride (H-BN GRADE HSL, manufactured by Airbrown Co., Ltd., average particle size 30 μm, thermal conductivity 60 W / m·K, aspect ratio 3.0 or higher, 200 or lower, plate-shaped, hexagonal boron nitride). - Talc (MS-K, manufactured by Nippon Talc Co., Ltd., average particle size 13 μm, thermal conductivity 10 W / m·K, aspect ratio 3.0 or higher, 200 or lower, plate-shaped). ≪Thermally conductive filler (B)≫ ・Low-hardness alumina (Dainichi Seika Kogyo Co., Ltd., Dipyroxide #7330, average particle size 10 μm, thermal conductivity 40 W / m·K, aspect ratio 1.0 or higher, less than 3.0, granular (isotropic shape)) ・Magnesium oxide (Ube Materials Co., Ltd., RF-50-SC, average particle size 50 μm, thermal conductivity 40 W / m·K, water absorption rate 0.5% or less (at 85°C-85% RH environment, after 48 hours), aspect ratio 1.0 or higher, less than 3.0, spherical (isotropic shape)).

[0127] <Fibrous filler> - Flat glass fiber (manufactured by Nitto Boseki Co., Ltd., irregular cross-section chopped strand, CSG3PA-830S, cross-sectional flatness ratio 4)

[0128] [Examples 1-8, Comparative Examples 1-4] Each component except the fibrous filler was pre-blended in the mixing ratios shown in Tables 2-4. The pre-blended mixture was supplied from the top of a twin-screw extruder TEM37SS (manufactured by Shibaura Machinery Co., Ltd.) with a screw diameter of 37 mm and the cylinder temperature set to 340°C, and the fibrous filler was supplied from the side near the center of the screw and melt-kneaded. The strands extruded from the die were cooled on a cooling mesh conveyor and cut with a pelletizer to obtain pellets (resin composition). Various test pieces were made from these pellets using an injection molding machine and evaluated as follows.

[0129] <Injection Molding> Injection molding machine manufactured by Toyo Machinery & Metal Co., Ltd. Si-50V-D75C (Clamping force: 490kN) Cylinder temperature: 320℃ Mold temperature: 150℃

[0130] [Evaluation] <In-plane thermal conductivity> For each example and comparative example, test specimens were prepared by injection molding a 60 mm x 60 mm x 2 mm thick flat plate. The in-plane thermal conductivity of each test specimen was measured using the following apparatus. Measuring apparatus: Hot disk method thermophysical property measuring apparatus TPA-501 manufactured by Kyoto Electronics Manufacturing Co., Ltd.

[0131] <Thermal Conductivity by Thickness> For each example and comparative example, test specimens were prepared by injection molding a 35 mm x 35 mm x 0.8 mm thick plate. The thermal conductivity was calculated from the thermal diffusivity, specific heat capacity, and density of each test specimen. ・Thermal diffusivity The thermal diffusivity of each test specimen was measured using the following device. Measuring device: Thermowave analyzer TA33, periodic heating radiation thermometer, manufactured by Bethel Co., Ltd. ・Specific heat capacity The specific heat capacity of each test specimen was measured using the following device. Measuring device: Differential scanning calorimeter DSC1, manufactured by Mettler Toledo Co., Ltd. The value at 25°C was adopted under a nitrogen atmosphere with a heating rate of 10°C / min. ・Density (water displacement method) Measured in accordance with JIS K7112:1999 water displacement method. Measuring device: Electronic hydrometer SD-200L, manufactured by Alpha Mirage Co., Ltd. ・Thermal conductivity Calculated by multiplying the thermal diffusivity by the specific heat capacity and density.

[0132] <Tensile Test> For each example and comparative example, an ISO (1A) dumbbell was injection molded and measured in accordance with JIS K7161-1,2-1994. Measuring device: Strograph APII manufactured by Toyo Seiki Co., Ltd.

[0133] <Spiral Flow Length (SFL)> For each example and comparative example, the spiral flow length was measured under the following conditions: Wall thickness 1 mmt, Primary injection pressure 100 MPa, Injection speed: 100 mm / sec (primary), 130 mm / sec (secondary).

[0134] [Results] The results are shown in Tables 2 to 4. In Tables 2 to 4, "Percentage of thermally conductive filler" represents the percentage calculated using the following formula: Percentage of thermally conductive filler (vol%) = Total volume of thermally conductive filler / (Total volume of thermally conductive filler + Volume of base resin) Also, "Anisotropy of thermal conductivity (surface direction / thickness direction)" represents the ratio of thermal conductivity in the surface direction to thermal conductivity in the thickness direction (surface direction / thickness direction).

[0135] Furthermore, in Tables 2-4, blank spaces in the ingredient amounts indicate that the ingredient was not added, and a "-" in the evaluation results indicates that the measurement was not taken.

[0136]

[0137]

[0138]

[0139] Comparing the examples with the comparative examples, it was observed that blending thermally conductive filler (B) with thermally conductive filler (A) tended to increase the thermal conductivity in the thickness direction of the molded article.

[0140] From the above results, the material comprises a base resin selected from the group consisting of polyphenylene sulfide resin and liquid crystal resin, and a thermally conductive filler, wherein the thermally conductive filler comprises a filler (A) having a flaky or plate-like anisotropic shape and a filler (B) having an isotropic shape, and the isotropic filler (B) has an isotropic shape and the stainless steel wear amount measured by the above-described abrasion test is 2.0 mm. ３ A resin composition comprising at least one selected from the group consisting of alumina and magnesium oxide having an isotropic shape has been shown to exhibit high thermal conductivity in the thickness direction in a molded article containing the resin composition. Furthermore, by incorporating a thermally conductive filler with excellent metal abrasion resistance into the resin composition, it was possible to provide a resin composition with excellent metal abrasion resistance during processing.

[0141] A resin composition according to one aspect of the present invention can be suitably used as a resin composition for coating materials or a resin composition for insulating materials.

[0142] 1. Test resin plate 2. Metal ring 11. Thermal conductive filler 21. Contact surface of the metal ring with the test resin plate

Claims

1. A base resin comprising at least one selected from the group consisting of polyphenylene sulfide resin and liquid crystal resin, and a thermally conductive filler, wherein the thermally conductive filler comprises filler (A) having a flaky or plate-like anisotropic shape and filler (B) having an isotropic shape, and the isotropic filler (B) has an isotropic shape and the stainless steel wear amount measured by the following abrasion test is 2.0 mm ３ The resin composition is at least one selected from the group consisting of alumina and magnesium oxide having an isotropic shape, and the abrasion test is a method of measuring the amount of abrasion of the contact surface between the metal ring and the resin plate when a thrust test is performed for 90 minutes with a thrust pressure of 100 N and a peripheral speed of 0.3 m / s in accordance with JIS K 7218 (1986) Method A.

2. The resin composition according to claim 1, wherein the filler (A) having a flaky or plate-like anisotropic shape is at least one selected from the group consisting of flaky or plate-like boron nitride, flaky or plate-like talc, and plate-like alumina.

3. The resin composition according to claim 1 or 2, wherein the magnesium oxide is low-hygroscopic magnesium oxide.

4. The amount of stainless steel wear measured by the above wear test is 2.0 mm. ３ The resin composition according to any one of claims 1 to 3, wherein the alumina is alumina that satisfies at least one of the following requirements (a) and (b): (a) particles of alumina-based oxide having a Mohs hardness of less than 9; (b) an average particle size of 0.5 μm or less.

5. The resin composition according to any one of claims 1 to 4, wherein the aspect ratio of the filler (A) having a flaky or plate-like anisotropic shape is 3 or more and 200 or less, and the aspect ratio of the filler (B) having an isotropic shape is 1.0 or more and less than 3.

0.

6. The resin composition according to any one of claims 1 to 5, wherein the content of the thermally conductive filler in the resin composition is 25% by mass or more and 55% by mass or less.

7. The resin composition according to any one of claims 1 to 6, wherein the ratio (A / B) of the content of the flake-like or plate-like anisotropic filler (A) to the content of the isotropic filler (B) is 20 / 80 or more and 80 / 20 or less by volume.

8. The resin composition according to any one of claims 1 to 7, wherein, when formed into a plate-shaped molded body, the ratio of thermal conductivity in the surface direction to thermal conductivity in the thickness direction (surface direction / thickness direction) is less than 10.

9. The resin composition according to any one of claims 1 to 8, further comprising a fibrous filler.

10. The resin composition according to claim 9, wherein the fibrous filler is glass fiber.

11. The resin composition according to any one of claims 1 to 10, which is a resin composition for coating materials or a resin composition for insulating materials.

12. A coating material or insulating material comprising the resin composition according to any one of claims 1 to 11.

13. A molded article comprising the resin composition according to any one of claims 1 to 11.

14. A covering component or insulating component made of the covering material or insulating material described in claim 12.

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