Glass-resin laminate and glass processing method

Abstract

The present invention relates to a glass-resin laminate in which a first protective film, a glass layer, and a second protective film are laminated in this order, wherein a pattern formed from grooves is formed on the surface of the first protective film and / or the second protective film, and the distance between one end and the other end of the pattern is 200 µm or less.

Description

Glass resin laminate and glass processing method

[0001] The present invention relates to a glass resin laminate and a glass processing method.

[0002] In image display devices such as liquid crystal displays and organic EL elements, semiconductor elements, and solar cells, extremely thin, flexible glass sheets (hereinafter also referred to as "glass sheets") are used. Conventionally, a technique is known for forming irregularities on the surface of one or both sides of a thin glass sheet by etching.

[0003] For example, a technique has been proposed in which a protective film is formed on one side of glass, and etching is performed on the side opposite to the side on which the protective film is formed (see, for example, Patent Document 1).

[0004] Patent No. 6146746

[0005] In Patent Document 1, a protective film is formed on one side of the glass to secure the desired thickness of the area to be etched, but there was a problem in that etching defects such as residual glass cullet were likely to occur.

[0006] The present invention has been made in view of the above points, and aims to provide a glass resin laminate that can be etched while suppressing the generation of glass cullet.

[0007] This glass resin laminate is a glass resin laminate in which a first protective film, a glass layer, and a second protective film are laminated in this order, and a pattern consisting of grooves is formed on at least one of the surfaces of the first protective film and the second protective film, and the distance between one end and the other end of the pattern is 200 μm or less.

[0008] According to the disclosed technology, it is possible to provide a glass-resin laminate that can be etched while suppressing the generation of glass cullet.

[0009] This is a cross-sectional view illustrating a glass-resin laminate according to the first embodiment. This is a plan view illustrating a glass-resin laminate according to the first embodiment. This is a cross-sectional view illustrating a glass-resin laminate according to a modified example 1 of the first embodiment. This is a cross-sectional view illustrating a glass-resin laminate according to the second embodiment.

[0010] The embodiments for carrying out the invention will be described below with reference to the drawings. In each drawing, the same reference numerals are used for identical components, and redundant explanations may be omitted.

[0011] <First Embodiment> (Glass Resin Laminate) Figure 1 is a cross-sectional view illustrating a glass resin laminate according to the first embodiment, and Figure 2 is a plan view illustrating a glass resin laminate according to the first embodiment. As shown in Figure 1, the glass resin laminate 10 is made by laminating a first protective film 11, a glass layer 12, and a second protective film 13 in this order.

[0012] In the glass resin laminate 10, for example, the first protective film 11, the glass layer 12, and the second protective film 13 may have the same thickness or they may have different thicknesses. Alternatively, multiple types of unit laminate structures with different thicknesses, in which the first protective film 11, the glass layer 12, and the second protective film 13 are laminated at any thickness, may be combined.

[0013] At least one of the first protective film 11 and the second protective film 13 has a groove 17. The groove 17 is formed without penetrating to the glass layer 12. The thickness t4 of the first protective film 11 in the region where the groove 17 is formed is 10 μm or less. In Figure 1, the first protective film 11 has a groove 17, but it is not limited to this; the second protective film 13 may also have a groove 17, or both the first protective film 11 and the second protective film 13 may have a groove 17. In Figure 1, the groove 17 is formed without penetrating to the glass layer 12, but it is not limited to this; the groove 17 may penetrate to the glass layer 12.

[0014] The grooves 17 on at least one surface of the first protective film 11 and the second protective film 13 form a pattern 16 as shown in Figure 2. The pattern 16 has one end 16A and the other end 16B, and the distance D1 between the one end 16A and the other end 16B is 200 μm or less.

[0015] A pattern 16 consisting of grooves 17 is formed on the surface of the first protective film 11, and the distance between one end 16A and the other end 16B is 200 μm or less. As a result, when etching the glass resin laminate 10, only the area where the pattern 16 is formed can be etched. Consequently, the generation of glass cullet can be suppressed.

[0016] [Glass Layer] The glass layer 12 is not particularly limited, and an appropriate one can be used depending on the purpose. Examples of glass layers 12, according to their composition, include soda-lime glass, borate glass, aluminosilicate glass, and quartz glass. Also, according to their alkali content, examples include alkali-free glass and low-alkali glass.

[0017] Alkaline components of glass (e.g., Na ２ O, K ２ O, Li ２ The content of O) is preferably 15% by weight or less, and more preferably 10% by weight or less.

[0018] The thickness t1 of the glass layer 12 is, for example, 10 μm or more and 200 μm or less. Here, a glass layer with a thickness of 10 μm or more and 200 μm or less means a glass layer whose average thickness is 10 μm or more and 200 μm or less.

[0019] The thickness t1 of the glass layer 12 is preferably 10 μm or more, considering the surface hardness, airtightness, and corrosion resistance of the glass. Furthermore, since it is desirable for the single glass layer 12 to have film-like flexibility in order to obtain a curved structure, the thickness t1 of the glass layer 12 is preferably 200 μm or less, and more preferably 50 μm or more and 100 μm or less.

[0020] The light transmittance of the glass layer 12 at a wavelength of 550 nm is preferably 85% or higher. The refractive index of the glass layer 12 at a wavelength of 550 nm is preferably 1.4 to 1.65. The density of the glass layer 12 is preferably 2.3 g / cm³. ３ ~3.0 g / cm ３ And more preferably 2.3 g / cm³ ３ ~2.7 g / cm ３ That is the case.

[0021] The glass layer 12 may be a commercially available product as is, or a commercially available glass layer may be polished to the desired thickness. Examples of commercially available glass layers include Corning's "7059", "1737", or "EAGLE2000", Asahi Glass's "AN100", NH Technoglass's "NA-35", Nippon Electric Glass's "OA-10", and Schott's "D263" or "AF45".

[0022] There are no particular limitations on the method for forming the glass layer 12, and an appropriate method can be adopted depending on the purpose. Typically, the glass layer 12 can be produced by melting a mixture containing main raw materials such as silica and alumina, an antifoaming agent such as Glauber's salt and antimony oxide, and a reducing agent such as carbon at a temperature of about 1400°C to 1600°C, forming it into a thin plate, and then cooling it. Examples of methods for forming the glass layer 12 include the slot-down draw method, the fusion method, and the float method. The glass layer formed into a plate by these methods may be chemically polished with a solvent such as hydrofluoric acid as needed to thin it or improve its smoothness.

[0023] [First protective film and second protective film] The first protective film 11 and the second protective film 13 protect the surface of the glass layer 12 and prevent foreign matter from adhering to and contaminating its surface.

[0024] Examples of materials constituting the first protective film 11 and the second protective film 13 include polyethylene, polyvinyl chloride, polyethylene terephthalate, polyvinylidene chloride, polypropylene, polyvinyl alcohol, polyester, polycarbonate, polystyrene, polyacrylonitrile, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, ethylene-methacrylic acid copolymer, nylon, cellophane, silicone resin, and the like.

[0025] The width w1 of the groove 17 is preferably 10 μm or more, more preferably 10 μm to 200 μm, and particularly preferably 10 μm to 150 μm. Here, the width w1 of the groove 17 refers to the average distance of the width.

[0026] The thickness t2 of the first protective film 11 and the second protective film 13 is not particularly limited, but may be, for example, 100 μm or less. Note that thickness t2 refers to the thickness of the first protective film 11 and the second protective film 13 in the region where the groove 17 is not formed.

[0027] The thickness t4 of the region in which the groove 17 is formed in the first protective film 11 and the second protective film 13 is 10 μm or less.

[0028] In Figure 2, the pattern 16 is shown as a rectangle, but it is not limited to this shape. The pattern 16 formed on the protective film 11 can be appropriately selected according to the shape of the glass to be removed by etching.

[0029] The distance D1 between one end 16A and the other end 16B in pattern 16 is 200 μm or less, preferably between 1 μm and 200 μm, and more preferably between 5 μm and 100 μm. A distance D1 of 200 μm or less suppresses the generation of glass cullet during etching.

[0030] <Modification of the First Embodiment> A modification of the first embodiment shows an example of a glass resin laminate with a different layer structure from that of the first embodiment. In the modification of the first embodiment, the description of components that are the same as those described in the previously described embodiment may be omitted.

[0031] Figure 3 is a cross-sectional view illustrating a glass-resin laminate according to Modification 1 of the First Embodiment. The structure of the glass-resin laminate is such that the glass layer 12 has laser processing marks 14, as shown in the glass-resin laminate 10 in Figure 3.

[0032] Specifically, the laser processing marks 14 are formed inside the grooves in the protective film 11.

[0033] The laser processing marks 14 can be formed by irradiating the surface of the glass layer 12 with a laser.

[0034] A method of forming laser processing marks 14 on the surface of the glass layer 12 by irradiating laser light will be described. When irradiating laser light, a laser light irradiation device that irradiates arbitrary laser light as appropriate can be used.

[0035] The glass layer 12 is installed on the stage of the laser light irradiation device. With respect to the laser light irradiation device, the stage is arranged to be movable, and the laser light source is arranged fixedly. The laser light irradiation device moves the position of the laser light irradiated on the glass layer 12 by moving the stage.

[0036] As the laser light, for example, gas lasers such as CO ２ lasers and excimer lasers; solid lasers such as YAG lasers; semiconductor lasers; ultrashort pulse lasers and the like can be mentioned.

[0037] Laser processing marks 14 may be formed on the glass layer 12 by irradiating laser light along the planned processing line. The laser processing marks 14 may be provided intermittently along the planned processing line or may be provided as a continuous line. The laser processing marks 14 do not penetrate the glass layer 12.

[0038] As the laser light irradiated on the glass layer 12, an ultrashort pulse laser is preferably used. The wavelength of the ultrashort pulse laser oscillated from the ultrashort pulse laser device is preferably 500 nm or more and 2500 nm or less. The pulse width of the ultrashort pulse laser is preferably 100 picoseconds or less, and more preferably 50 picoseconds or less. The oscillation mode of the ultrashort pulse laser may be single pulse oscillation or burst mode multi-pulse oscillation.

[0039] The spot diameter at the irradiation position of the laser light on the glass layer 12 may be set as appropriate, for example, 300 μm or less.

[0040] The stage movement speed when irradiating the glass layer 12 with laser light can be set arbitrarily as appropriate. The stage movement speed corresponds to the relative movement speed of the laser light with respect to the glass layer 12, and by changing the stage movement speed, different energies can be applied to the glass layer 12.

[0041] When the laser processing marks 14 are provided intermittently, the pitch of the laser processing marks 14 is preferably 10 μm or less, and more preferably 5 μm or less.

[0042] Thus, because the glass layer 12 has laser processing marks 14, the laser processing marks 14 function as the starting point for glass etching. Compared to a case where the glass layer 12 does not have laser processing marks 14, this makes it possible to shorten the processing time and process the desired area with high precision.

[0043] <Second Embodiment> The second embodiment shows an example of a glass resin laminate with a different layer structure from the first embodiment. In the first embodiment, descriptions of components that are the same as those described in the previously described embodiment may be omitted.

[0044] Figure 4 is a cross-sectional view illustrating a glass-resin laminate according to the second embodiment. The structure of the glass-resin laminate is as shown in Figure 4, where a first protective film 11, a glass layer 12, a resin layer 15, and a second protective film 13 are laminated in this order.

[0045] In Figure 4, the glass-resin laminate 10 has a resin layer between the second protective film 13 and the glass layer 12, but it is not limited to this, and a resin layer may be present in at least one of the spaces between the first protective film and the glass layer, and between the second protective film and the glass layer.

[0046] In the glass resin laminate 10 according to the second embodiment, the glass layer 12 may have laser processing marks.

[0047] [Resin Layer] The resin layer 15 is a base layer on which the glass layer 12 is laminated. The resin layer 15 can consist of one or more layers. An adhesive layer or bonding layer may be provided between the resin layer 15 and the glass layer 12. The resin layer 15 may contain additives such as inorganic particles.

[0048] The thickness t2 of the resin layer 15 is, for example, 0.1 μm or more and 2 mm or less. Here, a resin layer with a thickness of 0.1 μm or more and 2 mm or less means a resin layer whose average thickness is 0.1 μm or more and 2 mm or less.

[0049] The resin contained in the resin layer 15 can be made of any resin as appropriate, depending on the application of the glass resin laminate 10. Examples of resins that form the resin layer 15 include polyvinyl alcohol (PVA) resins, polyolefin resins, cyclic olefin resins, polycarbonate resins, cellulose resins, polyester resins, polyamide resins, polyimide resins, polyether resins, polystyrene resins, (meth)acrylic resins, (meth)acrylic urethane resins, polysulfone resins, acetate resins, epoxy resins, silicone resins, polyarylate resins, polysulfone resins, polyetherimide resins, epoxy resins, urethane resins, silicone resins, and the like.

[0050] The thickness t3 of the resin layer 15 is preferably 25 μm or more and 1 mm or less, and more preferably 50 μm or more and 500 μm or less.

[0051] [Adhesive layer] An adhesive layer may be provided between the resin layer 15 and the glass layer 12. Any suitable adhesive can be used as the adhesive layer. Examples of materials for the adhesive layer include acrylic adhesives, silicone adhesives, and rubber adhesives. The thickness of the adhesive layer is not particularly limited, but for example, it is about 10 μm to 500 μm.

[0052] Depending on the requirements, an adhesive layer may be used instead of the tack layer. Examples of materials for the adhesive layer used instead of the tack layer include UV-curable acrylic adhesives, UV-curable epoxy adhesives, thermosetting epoxy adhesives, thermosetting melamine adhesives, thermosetting phenolic adhesives, ethylene vinyl acetate (EVA) interlayers, and polyvinyl butyral (PVB) interlayers.

[0053] In this specification, an adhesive layer refers to a layer that is adhesive at room temperature and adheres to an object with light pressure. Therefore, even when an object attached to the adhesive layer is peeled off, the adhesive layer retains practical adhesive strength. On the other hand, an adhesive layer refers to a layer that can bond substances together by being interposed between them. Therefore, when an object attached to an adhesive layer is peeled off, the adhesive layer does not have practical adhesive strength.

[0054] In this way, by having a resin layer 15 between the glass layer 12 and the second protective film 13, the effect of protecting the glass surface by the resin layer can be obtained even when the second protective film having an adhesive layer is peeled off.

[0055] [Method for manufacturing glass-resin laminates] Examples of methods for manufacturing glass-resin laminates include a method of forming a resin layer on a glass layer by solution coating to obtain a glass-resin laminate, a method of heat-pressing an adhesive layer to glass in a semi-cured state, and a method of forming a resin layer by attaching a resin film to a glass layer via an adhesive layer to obtain a glass-resin laminate.

[0056] A method for obtaining a glass-resin laminate by forming a resin layer on a glass layer by solution coating preferably includes a coating step of applying a resin solution to one or both sides of the glass layer to form a coating layer, a drying step of drying the coating layer, and a heat treatment step of heat-treating the dried coating layer to form a resin layer.

[0057] Examples of coating solvents used in the coating process include halogenated solvents such as methylene chloride, ethylene chloride, chloroform, carbon tetrachloride, and trichloroethane; aromatic solvents such as toluene, benzene, and phenol; cellosolve solvents such as methyl cellosolve and ethyl cellosolve; ether solvents such as propylene glycol monomethyl ether and ethylene glycol monoisopropyl ether; and ketone solvents such as methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, and cyclohexanone. Among these, halogenated solvents, aromatic solvents, cellosolve solvents, or ether solvents are preferred. By using such solvents as coating solvents, it is possible to obtain a glass-resin laminate with excellent durability and reliability by maintaining sufficient adhesion between the resin layer and the glass layer even under high temperature and high humidity conditions.

[0058] Coating methods for resin solutions include coating methods such as air doctor coating, blade coating, knife coating, reverse coating, transfer roll coating, gravure roll coating, kiss coating, cast coating, spray coating, slot orifice coating, calender coating, electrodeposition coating, dip coating, and die coating; and printing methods such as relief printing methods like flexographic printing, intaglio printing methods like direct gravure printing and offset gravure printing, lithographic printing methods like offset printing, and stencil printing methods like screen printing.

[0059] Any suitable drying method (e.g., natural drying, forced-air drying, or heat drying) can be used for the drying process. For example, in the case of heat drying, the drying temperature is typically 100°C to 200°C, and the drying time is typically 1 to 10 minutes.

[0060] Any suitable heat treatment method can be used as the heat treatment process. Typically, the heat treatment temperature is 100°C to 300°C, and the heat treatment time is 5 to 45 minutes. If the glass resin laminate has a coupling agent layer, the heat treatment can cause the coupling agent to chemically bond or interact with the resin contained in the resin layer.

[0061] Preferably, the process includes a coupling treatment of the surface of the glass layer before the coating process. By performing the coupling treatment and forming a coupling agent layer, the resin layer can adhere firmly to the glass layer via the coupling agent layer.

[0062] Any suitable method can be used for the coupling treatment. Specifically, for example, a method can be used in which a coupling agent solution is applied to the surface of the glass layer, followed by heat treatment.

[0063] Any suitable solvent can be used when preparing a coupling agent solution, as long as it does not react with the coupling agent. Examples of solvents include aliphatic hydrocarbon solvents such as hexane and hexadecane; aromatic solvents such as benzene, toluene, and xylene; halogenated hydrocarbon solvents such as methylene chloride and 1,1,2-trichloroethane; ether solvents such as tetrahydrofuran and 1,4-dioxane; alcohol solvents such as methanol and propanol; ketone solvents such as acetone and 2-butanone; and water.

[0064] Any suitable heat treatment method can be used during the coupling process. Typically, the heat treatment temperature is 50°C to 150°C, and the heat treatment time is 1 to 10 minutes. Through heat treatment, the coupling agent and the glass layer surface can be chemically bonded together.

[0065] In a method for obtaining a glass-resin laminate by forming a resin layer by attaching a resin film to a glass layer, a resin solution may be applied to any suitable substrate to form a resin film, and then the resin film may be transferred to the surface of the glass layer to bond the glass layer and the resin film together, thereby forming the resin layer. Alternatively, the glass layer may be subjected to a coupling treatment before attaching the resin film. The above-described method may be used as the coupling treatment method.

[0066] The resin film may be annealed before or after being adhered to the glass layer. By performing the annealing treatment, impurities such as residual solvents and unreacted monomer components can be efficiently removed. The temperature of the annealing treatment is preferably 100°C to 200°C. Also, the treatment time of the above annealing treatment is preferably 5 minutes to 20 minutes.

[0067] The resin film is preferably adhered to the surface of the glass layer via an adhesive layer. The adhesive layer may be formed on the resin film and then adhered to the surface of the glass layer, or the adhesive layer may be formed on the glass layer and then the resin film may be adhered.

[0068] As a method for forming the adhesive layer, for example, after applying a thermosetting resin or an active energy ray-curable resin to the surface of the glass layer or the resin film, the glass layer and the resin film are adhered, and then the thermosetting resin or the active energy ray-curable resin is cured by ultraviolet light irradiation or heat treatment. Examples of the irradiation conditions for ultraviolet light irradiation typically include an integrated irradiation light amount of 100 mJ / cm ２ to 2,000 mJ / cm ２ and an irradiation time of 5 minutes to 30 minutes. The conditions for heat treatment typically include a heating temperature of 100°C to 200°C and a heating time of 5 minutes to 30 minutes. In addition, after applying a thermosetting resin or an active energy ray-curable resin to the surface of the glass layer or the resin film, the thermosetting resin or the active energy ray-curable resin may be semi-cured before adhering the glass layer and the resin film. Semi-curing can be performed, for example, by irradiating ultraviolet light of 1 mJ / cm ２ to 10 mJ / cm ２ for 1 second to 60 seconds.

[0069] (Glass Processing Method) The glass processing method according to this embodiment involves immersing the glass resin laminate according to this embodiment in an etching solution to form grooves in the glass layer. Since the glass resin laminate according to this embodiment has a groove pattern formed on at least one of the surfaces of the first protective film and the second protective film, the area where the surface of the glass layer is exposed is etched. This makes it possible to etch a desired area along the groove pattern.

[0070] There are no particular restrictions on the etching solution, and it can be appropriately selected according to the purpose. For example, it may contain 6% hydrogen fluoride, and may also contain other components such as solvents as needed.

[0071] There are no particular restrictions on the immersion time of the glass resin laminate in the etching solution; it can be appropriately selected depending on the purpose.

[0072] [Applications] The glass resin laminate according to this embodiment can be suitably used, for example, in display elements or solar cells. Examples of display elements include semiconductor packages, liquid crystal displays, plasma displays, organic EL displays, and the like.

[0073] (Example 1) A glass resin laminate was obtained by bonding both sides of a glass layer (OA-10G, manufactured by NEG) and the adhesive layers of two protective films (SPV-362X-2K2, manufactured by Nitto Denko Corporation) using a hand roller under a pressure of 2 kg. Next, the glass resin laminate was placed on a stage with the first protective film facing upwards, and CO ２ Using a laser device (250 kHz, 10 W output), CO ２ CO emitted from a laser light source ２ The stage was moved while irradiating only the first protective film with a laser to form grooves in the shape of pattern 16 shown in Figure 2. ２ The laser is focused to a spot diameter of 100 μm using a focusing lens, and the stage movement speed is set to 350 mm / s, and CO2 is applied to the glass resin laminate. ２The relative movement speed (processing speed) of the laser was set. This resulted in obtaining grooves approximately the same size as the spot diameter. At this time, the pattern was formed such that the thickness on the protective film on which the pattern was formed was 10 μm, and the distance D1 between one end 16A and the other end 16B of the pattern was 100 μm.

[0074] (Example 2) A substrate was prepared in the same manner as in Example 1, except that the pattern was formed so that the distance between one end and the other end of the pattern was 50 μm.

[0075] (Example 3) A substrate was prepared in the same manner as in Example 1, except that the pattern was formed so that the distance between one end and the other end of the pattern was 200 μm.

[0076] (Comparative Example 1) A substrate was prepared in the same manner as in Example 1, except that the pattern was formed so that the distance between one end and the other end of the pattern was 300 μm.

[0077] For the glass resin laminates of Examples 1-4 and Comparative Examples 1-2, etching was performed using an etching solution containing 6% hydrogen fluoride to remove the inner portion 18 of the glass resin laminate along the shape of pattern 16 in Figure 2, thereby forming an opening in the glass resin laminate. Next, the presence or absence of residual glass cullet (glass residue) near the area between 16A and 16B of the opening was visually evaluated. The evaluation results are shown in Table 1.

[0078] [evaluation]

[0079]

[0080] As described above, the glass resin laminate according to this embodiment is a glass resin laminate in which a first protective film, a glass layer, and a second protective film are laminated in this order, and a pattern consisting of grooves is formed on at least one of the surfaces of the first protective film and the second protective film, and the distance between one end and the other end of the pattern is 200 μm or less. As a result, when the glass resin laminate according to this embodiment is immersed in an etching solution, the etching solution seeps not only into the grooves of the pattern 16, but also into the space between one end 16A and the other end 16B of the pattern where no grooves are formed. Therefore, when the inner portion 18 of the glass resin laminate is removed along the shape of the pattern 16 after etching to form an opening, the generation of glass cullet near the space between 16A and 16B of the opening can be suppressed.

[0081] Although preferred embodiments have been described in detail above, the invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0082] In addition to the embodiments described above, the following further notes are disclosed. (Note 1) A glass resin laminate comprising a first protective film, a glass layer, and a second protective film laminated in this order, wherein a pattern consisting of grooves is formed on at least one of the surfaces of the first protective film and the second protective film, and the distance between one end and the other end of the pattern is 200 μm or less. (Note 2) The glass resin laminate according to Note 1, wherein the width of the grooves in the pattern is 10 μm or more. (Note 3) The glass resin laminate according to Note 1 or 2, wherein the thickness of the region on the first protective film or the second protective film where the pattern is formed is 10 μm or less. (Note 4) A glass processing method comprising forming grooves in the glass layer by immersing the glass resin laminate according to Note 1 in an etching solution.

[0083] This application claims priority based on Japanese Patent Application No. 2025-019457, filed with the Japan Patent Office on 7 February 2025, and includes the entire contents of that Japanese Patent Application.

[0084] 10 Glass resin laminate 11 First protective film 12 Glass layer 13 Second protective film 14 Laser processing marks 15 Resin layer 16 Pattern 17 Groove 18 Inner part

Claims

1. A glass resin laminate comprising a first protective film, a glass layer, and a second protective film, laminated in this order, wherein a pattern consisting of grooves is formed on at least one of the surfaces of the first protective film and the second protective film, and the distance between one end and the other end of the pattern is 200 μm or less.

2. The glass resin laminate according to claim 1, wherein the width of the grooves in the pattern is 10 μm or more.

3. The glass resin laminate according to claim 1 or 2, wherein the thickness of the region on which the pattern is formed in the first protective film or the second protective film is 10 μm or less.

4. A glass processing method comprising immersing the glass resin laminate described in claim 1 in an etching solution to form grooves in the glass layer.

Images