Semiconductor test pin

Abstract

The present invention relates to a semiconductor test pin, and the purpose of the present invention is to maximize the amount of elastic expansion and contraction of connection portions at both ends by means of a rectangular spiral elastic support portion. That is, the present invention relates to a semiconductor test pin comprising: a rectangular spiral elastic support portion bent to have a rectangular outer shape; a board connection portion integrally formed at one end of the rectangular spiral elastic support portion and formed by bending a plate material for connection with a board; a semiconductor connection portion integrally formed at the other end of the rectangular spiral elastic support portion and formed by bending a plate material for connection with a semiconductor; a spring housing portion integrally formed at the central portion of the rectangular spiral elastic support portion and bent to surround the outside of the rectangular elastic support portion.

Description

semiconductor test pin

[0001] The present invention relates to a semiconductor test pin, and more specifically, to a semiconductor test pin comprising a square spiral elastic support portion formed by bending to form a square shape, a board connection portion and a semiconductor connection portion formed integrally at each end of the square spiral elastic support portion, and a spring housing portion formed integrally at the center of the square spiral elastic support portion and formed by bending to surround the outside of the square elastic support portion, thereby aiming to maximize the elastic expansion amount of the connection portions at both ends by means of the square spiral elastic support portion.

[0002] Generally, semiconductor test pins are used to electrically connect a semiconductor to a test device for testing.

[0003]

[0004] The semiconductor test pin described above is composed of a pin body formed as a tubular body, a spring accommodated inside the pin body, a semiconductor connection part elastically protruding from one end of the pin body to connect with a semiconductor, and a board connection part elastically protruding from the other end of the pin body to connect with a board of a test device.

[0005]

[0006] Such semiconductor test pins are mounted on a semiconductor test device and connected to the semiconductor to test its reliability and durability.

[0007]

[0008] However, conventional semiconductor test pins as described above had a problem in which contact resistance occurred because the semiconductor connection part and the board connection part were connected in contact with a spring, and the reliability of the semiconductor test was reduced as the plating part was damaged during use and the contact resistance increased.

[0009] Accordingly, the present invention aims to solve the problem in which the reliability of semiconductor testing is reduced because the conventional semiconductor test pin described above has contact resistance occurring due to the semiconductor connection part and the board connection part being connected in contact with a spring, and the connection resistance increases as the plating part is damaged during use.

[0010] That is, the present invention is characterized by comprising, in a semiconductor test pin, a square spiral elastic support portion formed by bending to form a square shape, a board connection portion integrally formed at one end of the square spiral elastic support portion and formed by bending a plate material for connection with a board, a semiconductor connection portion integrally formed at the other end of the square spiral elastic support portion and formed by bending a plate material for connection with a semiconductor, and a spring housing portion integrally formed at the center of the square spiral elastic support portion and formed by bending to wrap around the exterior of the square elastic support portion.

[0011]

[0012] The present invention is characterized by comprising: a spiral spring portion formed in a square spiral shape to induce central deflection elasticity; a connecting bend spring formed in a "V" shape to connect the square spiral elastic support portion from the outside and induce bending elasticity; a spring connecting bar formed to connect the center between the square spiral elastic support portion and induce deflection elasticity; and a housing connecting plate body formed in a plate shape to connect two spiral spring portions formed on the central side of the spiral spring portion, so that the spring housing portion is integrally formed.

[0013]

[0014] The present invention is characterized by comprising a board connection pipe body portion formed by bending a board connection portion into a polygonal pipe body, a board connection end portion formed protruding from one side of the board connection pipe body portion to be connected to a board, and a clamping end portion formed protruding from the side opposite to the side where the board connection end portion is formed in the board connection pipe body portion to be able to clamp, bind, support, and bind the board connection end.

[0015]

[0016] The present invention is characterized by comprising a semiconductor connection part formed by bending a semiconductor connection part into a polygonal tube and a semiconductor connection protrusion part protruding at equal intervals on the end side of the semiconductor connection part to accommodate and connect a connection portion of a spherical semiconductor.

[0017] Accordingly, the present invention comprises a square spiral elastic support member formed by folding to form a square shape, a board connection part and a semiconductor connection part formed integrally at each end of the square spiral elastic support member, and a spring housing part formed integrally at the center of the square spiral elastic support member and formed by folding to wrap around the exterior of the square elastic support member, thereby having the effect of maximizing the elastic expansion amount of the connection parts at both ends by the square spiral elastic support member.

[0018] FIG. 1 is a perspective view according to an embodiment of the present invention.

[0019] FIG. 2 is a perspective view with the spring housing removed according to an embodiment of the present invention.

[0020] FIG. 3 is an enlarged perspective view of a square spiral elastic support member according to an embodiment of the present invention.

[0021] FIG. 4 is a perspective view of a square spiral elastic support member connected to a housing connecting plate body according to an embodiment of the present invention.

[0022] FIG. 5 is an enlarged perspective view of a board connection part according to an embodiment of the present invention.

[0023] FIG. 6 is an enlarged perspective view of a board connection terminal and a clamping terminal according to an embodiment of the present invention.

[0024] FIG. 7 is an enlarged perspective view of a semiconductor connection part according to an embodiment of the present invention.

[0025] FIG. 8 is an enlarged perspective view of the bottom surface of a semiconductor connection part according to an embodiment of the present invention.

[0026] FIG. 9 is a cut-and-enlarged perspective view of a spring housing portion according to an embodiment of the present invention.

[0027] The following is a detailed description based on the attached drawings.

[0028] The present invention is designed to maximize the elastic expansion of the two end connecting parts by means of a square spiral elastic support part. The terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings, and should be interpreted in a meaning and concept consistent with the technical spirit of the present invention, based on the principle that the inventor can appropriately define the concept of the terms to best describe his invention.

[0029] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention; thus, it should be understood that various equivalents and modifications that can replace them may exist at the time of filing this application.

[0030]

[0031] That is, the present invention comprises a square spiral elastic support part (100), a board connection part (200), a semiconductor connection part (300), and a spring housing part (400) in a semiconductor test pin.

[0032]

[0033] Here, the square spiral elastic support member (100) is provided by being bent to form an outer shape that is square.

[0034] The square spiral elastic support member (100) is composed of a spiral spring member (110) formed in a square spiral shape to induce central sagging elastic force, a connecting bending spring (120) formed in a "V" shape to connect the square spiral elastic support member (100) and the square spiral elastic support member (100) from the outside and formed in a "V" shape to induce bending elastic force, a spring connecting bar (130) formed to connect the center between the square spiral elastic support member (100) and the square spiral elastic support member (100) and to induce sagging elastic force of the square spiral elastic support member (100), and a housing connecting plate body (140) formed in a plate shape to connect the two spiral spring members (110) formed on the central side of the spiral spring member (110) so that the spring housing member (400) is integrally formed. It is.

[0035]

[0036] And, the board connection part (200) is integrally formed at one end of the square spiral elastic support part (100) and is provided by bending a plate material for connection with the board.

[0037] The above board connection part (200) is composed of a board connection pipe body part (210) formed by bending a plate into a polygonal pipe body, a board connection end (220) formed protruding from one side of the board connection pipe body part (210) to be connected to a board, and a clamping end (230) formed protruding from the side opposite to the side where the board connection end (220) is formed in the board connection pipe body to be able to clamp, bind, support, and bind the board connection end (220).

[0038]

[0039] In addition, the semiconductor connection part (300) is integrally formed at the other end of the square spiral elastic support part (100) and is provided by bending a plate material for connection with the semiconductor.

[0040] The above semiconductor connection part (300) is composed of a semiconductor connection tube part (310) formed by bending a plate into a polygonal tube, and a semiconductor connection protrusion part (320) protruding at equal intervals on the end side of the semiconductor connection tube part (310) to accommodate and connect a connection portion of a spherical semiconductor.

[0041]

[0042] In addition, the spring housing part (400) is integrally formed in the central part of the square spiral elastic support part (100) and is provided by being bent to wrap around the outside of the square elastic support part.

[0043] The above spring housing part (400) is formed integrally with the housing connecting plate body (140) provided on the central side of the square spiral elastic support part (100) and is formed by bending.

[0044] It can be implemented by forming a housing guide projection (410) that protrudes inwardly to guide the elastic movement of the board connection part (200) and the semiconductor connection part (300) that are elastically movable on the inner wall of both ends of the spring housing part (400).

[0045]

[0046] Meanwhile, the joint portion of the tubular part formed in the board connection part (200), the semiconductor connection part (300), and the spring housing part (400) can be implemented by providing interlocking protrusions (500) that protrude in a zigzag pattern at both ends to increase the joint support force.

[0047]

[0048]

[0049] The following describes the effects of the application of the present invention.

[0050] As described above, when the present invention is applied and implemented, the square spiral elastic support part (100) provided by being bent to form a square shape in the semiconductor test pin, the board connection part (200) provided by being integrally formed at one end of the square spiral elastic support part (100) and being provided by being bent from a plate material for connection with a board, the semiconductor connection part (300) provided by being integrally formed at the other end of the square spiral elastic support part (100) and being provided by being bent from a plate material for connection with a semiconductor, and the spring housing part (400) provided by being integrally formed at the center of the square spiral elastic support part (100) and being provided by being bent to wrap around the outside of the square elastic support part, the elastic expansion amount of the connection part at both ends is maximized by the square spiral elastic support part (100).

[0051] <Explanation of Symbols>

[0052] 100 : Square spiral elastic support

[0053] 110 : Spiral spring section 120 : Connecting bend spring

[0054] 130 : Spring connecting bar 140 : Housing connecting plate

[0055] 200 : Board connection part

[0056] 210: Board connection pipe section 220: Board connection terminal

[0057] 230 : Clamping section

[0058] 300 : Semiconductor connection part

[0059] 310 : Semiconductor connection pipe body 320 : Semiconductor connection protrusion

[0060] 400 : Spring housing part

[0061] 410 : Housing guide protrusion

[0062] 500 : Interlocking projection

Claims

1. Regarding semiconductor test pins; A semiconductor test pin characterized by comprising: a square spiral elastic support portion formed by bending to form a square shape; a board connection portion formed integrally at one end of the square spiral elastic support portion and formed by bending a plate material for connection with a board; a semiconductor connection portion formed integrally at the other end of the square spiral elastic support portion and formed by bending a plate material for connection with a semiconductor; and a spring housing portion formed integrally at the center of the square spiral elastic support portion and formed by bending to wrap around the exterior of the square elastic support portion.

2. In Paragraph 1; A semiconductor test pin characterized by comprising: a square spiral elastic support member formed in a square spiral shape to induce central sagging elastic force; a connecting bend spring formed in a "V" shape to connect the square spiral elastic support member from the outside and induce bending elastic force; a spring connecting bar formed to connect the center between the square spiral elastic support member and the square spiral elastic support member and induce sagging elastic force; and a housing connecting plate body formed in a plate shape to connect two spiral spring members formed on the central side of the spiral spring member, so that the spring housing member is integrally formed.

3. In Paragraph 1; The above board connection part is composed of a board connection pipe body part formed by bending a plate into a polygonal pipe body, a board connection end part formed protruding from one side of the board connection pipe body part to be connected to a board, and a clamping end part formed protruding from the side opposite to the side where the board connection end part is formed in the board connection pipe body to be able to clamp, bind, support, and bind the board connection end; A semiconductor test pin characterized by the above-mentioned semiconductor connection portion being composed of a semiconductor connection tube body portion formed by bending a plate into a polygonal tube body and a semiconductor connection projection portion protruding at equal intervals on the end side of the semiconductor connection tube body portion to accommodate and connect a connection portion of a spherical semiconductor.

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