Method for manufacturing electronic device board connector

Abstract

The present invention relates to a method for manufacturing an electronic device board connector. The objective of the present invention is to quickly and accurately manufacture a board connector, which has a connection pin, a spring part and a solder terminal integrally formed to have a constant contact resistance while not causing a connection resistance and not being affected by usage time. The present invention relates to the method for manufacturing an electronic device board connector, comprising: a spring bending process including a step of bending a spring plate material part, formed through a cutting process, in multiple stages from the center thereof so as to form squares of the same size, thereby bending same to form a spring part; a connection pin compression binding process including a step in which a lower end of a connection pin is inserted and coupled a to a pin-coupling plate cut and formed through the cutting process, so as to penetrate and protrude therethrough, and then a protruding end portion is compressed to bind the connection pin; and a spring-part matching and bending process including a step of bending both spring parts bent through the spring bending process such that the spring parts face each other with the pin-coupling plate therebetween and respective spring wire material parts are crossed and joined together.

Description

Method for manufacturing board connectors for electronic devices

[0001] The present invention relates to a method for manufacturing a board connector for electronic devices, and more specifically, the invention aims to enable the rapid and clear manufacturing of a board connector having a constant contact resistance that does not cause contact resistance and is not affected by usage time, by comprising: a spring bending process in which a spring plate member formed through a cutting process is bent in multiple stages from the center to form a square of the same size to form a spring member; a connection pin compression and binding process in which the lower end of a connection pin is inserted and coupled to a pin coupling plate formed through a cutting process so as to protrude, and then the protruding end is compressed to bind the connection pin; and a spring member matching bending process in which the two spring members formed by bending through the spring bending tube are bent so that each spring wire member crosses and aligns with the center of the pin coupling plate.

[0002] Generally, an electronic device board connector is mounted on an electronic device board and connects to a connected object to transmit and receive electricity or data.

[0003]

[0004] The board connector for electronic devices described above comprises a pin body formed as a tubular body, a spring accommodated inside the pin body, a connecting pin portion elastically protruding from one end of the pin body to connect with a target object, and a solder terminal mounted on a board at the other end of the pin body.

[0005]

[0006] Such board connectors for electronic devices are assembled by separately processing and molding solder terminals, springs, and connection pins, placing them into a spring housing, and connecting them sequentially.

[0007]

[0008] However, conventional board connectors for electronic devices as described above had a problem in that contact resistance occurred because the connection between the object to be connected and the board was made sequentially through connection pins, springs, and solder terminals, and the plating was damaged during use, causing the contact resistance to result in loss of power supply or data transmission and reception.

[0009] Accordingly, the present invention aims to solve the problem in which the conventional board connector for electronic devices described above causes contact resistance when the connection between the object to be connected and the board is made sequentially through a connection pin, a spring, and a solder terminal, and damage to the plating during use results in loss of power supply or data transmission and reception due to the contact resistance.

[0010] That is, the present invention is characterized by a method for manufacturing a board connector for an electronic device comprising: a cutting process comprising the step of forming a pin coupling plate in the center, forming spring plate members protruding laterally in a "V" shape on both sides of the pin coupling plate, and forming solder terminals at both ends; a spring bending process comprising the step of multi-stage bending of the spring plate members formed through the cutting process to form a square of the same size from the center to form a spring member; a connection pin compression and binding process comprising the step of inserting and coupling the lower end of a connection pin through the pin coupling plate formed through the cutting process and protruding, and then compressing the protruding end to bind the connection pin; and a spring member alignment bending process comprising the step of bending the two spring members formed by bending through the spring bending tube so that each spring wire member crosses and aligns with the pin coupling plate at the center.

[0011]

[0012] The present invention is characterized by a pin coupling plate, which is cut through a cutting process, comprising a coupling plate body formed in the shape of a rectangular plate, a pin coupling hole formed through the center of the coupling plate body to secure a connecting pin, and spring connecting parts formed symmetrically on both sides of the coupling plate body to be connected to a spring plate member.

[0013]

[0014] The present invention is characterized by the fact that the spring plate portions on both sides of the pin joint, which are cut through a cutting process, are formed by being cut to protrude in a "V" shape in the opposite lateral directions so that they are joined together in a zigzag pattern during the spring joint bending process after the spring bending process.

[0015]

[0016] The present invention is characterized by comprising a spring plate section cut through a cutting process, a connecting spring section and inclined spring sections and plate spring sections formed in a zigzag pattern on both sides of the connecting spring section through a spring bending process, a "U"-shaped connecting cut plate section formed at a "V"-shaped protruding end during the spring bending process, inclined cut plate sections formed laterally inclined to form inclined spring sections on both sides of the connecting cut plate section during the spring bending process, and a straight cut plate section protruding in a straight line at the end of the inclined cut plate section to form plate spring sections during the spring bending process.

[0017]

[0018] The present invention is characterized by a solder support plate formed in a plate shape between a spring plate part and a solder terminal, which is formed by cutting and processing to form a supporting force for the solder terminal.

[0019]

[0020] The present invention is characterized by a spring portion formed through a spring bending process, wherein a connecting spring portion is formed in the center and inclined spring portions are formed on both sides of the connecting spring portion and plate-shaped spring portions are formed in a zigzag continuous manner.

[0021]

[0022] The present invention is characterized by a housing coupling process in which a board connector for an electronic device, which has been cut and bent and formed through a spring-matching bending process, is coupled to be accommodated in a square housing to ensure stability during operation and prevent damage.

[0023]

[0024] The present invention is characterized by a housing coupling process comprising the step of coupling a square housing to a coupled spring portion formed by a coupled spring coupling process through a spring coupling bending process.

[0025]

[0026] *

[0027] The present invention is characterized by a terminal bending process in which, when a solder terminal is soldered to the upper surface of a board during the soldering process on the board, the solder terminal is made to protrude to the side.

[0028]

[0029] The terminal bending process of the present invention consists of a step of bending the solder terminal protruding from the end of the housing through the housing coupling process so that it protrudes to the side.

[0030]

[0031] Accordingly, the present invention comprises a spring bending process consisting of a step of forming a spring part by multi-stage bending a spring plate part formed through a cutting process from the center to form a square of the same size; a connection pin compression and binding process consisting of a step of inserting and coupling the lower end of a connection pin through the pin coupling plate formed through the cutting process so as to protrude, and then compressing the protruding end to bind the connection pin; and a spring part alignment bending process consisting of a step of bending the two spring parts formed by bending through the spring bending tube so that each spring wire part intersects and aligns with the pin coupling plate facing the center. By doing so, the connection pin, spring part, and solder terminal are formed integrally, thereby having the effect of quickly and clearly manufacturing a board connector having a constant contact resistance that does not cause connection resistance and is not affected by usage time.

[0032]

[0033] FIG. 1 is a process flow diagram according to an embodiment of the present invention.

[0034] FIG. 2 is an example diagram of a cutting process according to an embodiment of the present invention.

[0035] FIG. 3 is an example diagram of a spring bending process according to an embodiment of the present invention.

[0036] FIG. 4 is an exemplary diagram of a connection pin crimping and binding process according to an embodiment of the present invention.

[0037] FIG. 5 is an example diagram of a spring matching tooth bending process according to an embodiment of the present invention.

[0038] FIG. 6 is a process flow diagram according to another embodiment of the present invention.

[0039] FIG. 7 is an exemplary diagram of the housing coupling process according to an embodiment of the present invention.

[0040] FIG. 8 is a process flow diagram according to another embodiment of the present invention.

[0041] The following is a detailed description based on the attached drawings.

[0042] The present invention enables the rapid and clear manufacturing of a board connector having a constant contact resistance, which does not cause contact resistance and is not affected by usage time, by integrally forming a connection pin, a spring part, and a solder terminal. The terms and words used in this specification and claims should not be interpreted as being limited to their ordinary or dictionary meanings, and should be interpreted in a meaning and concept consistent with the technical spirit of the present invention, based on the principle that the inventor can appropriately define the concept of the terms to best describe his invention.

[0043] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings are merely the most preferred embodiments of the present invention and do not represent all of the technical ideas of the present invention; thus, it should be understood that various equivalents and modifications that can replace them may exist at the time of filing this application.

[0044]

[0045] That is, the present invention comprises a method for manufacturing a board connector for an electronic device, the cutting process (100), a spring bending process (200), a connection pin crimping and binding process (300), and a spring matching tooth bending process (400).

[0046]

[0047] Here, the cutting process (100) is composed of a step of forming a pin coupling plate (10) in the center, forming spring plate parts (20) that protrude sideways to form a "V" shape on both sides of the pin coupling plate (10), and cutting to form solder terminals (70) at both ends.

[0048] The pin coupling plate (10) that is cut through the above cutting process (100) is composed of a coupling plate body (11) made of a rectangular plate, a pin coupling hole (12) formed through the center of the coupling plate body (11) to allow a connecting pin (50) to be connected, and a spring connecting part (13) formed symmetrically on both sides of the coupling plate body (11) to be connected to a spring plate part (20).

[0049] The spring plate portions (20) on both sides of the pin joint, which are cut through the above cutting process (100), are formed by cutting so that they protrude in a "V" shape in the opposite directions so that they are joined together in a zigzag pattern during the spring joint bending process (400) after the spring bending process (200).

[0050] The spring plate part (20) cut through the above cutting process (100) is formed such that the connecting spring part (61) and the inclined spring part (62) and the plate spring part (63) can be continuously formed in a zigzag pattern on both sides of the connecting spring part (61) through the spring bending process (200). This is achieved by forming a "U" shaped connecting cut plate part (21) at the "V" shaped protruding end, forming the connecting spring part (61) during the spring bending process (200), forming an inclined cut plate part (22) formed laterally so that the inclined spring part (62) can be formed on both sides of the connecting cut plate part (21) during the spring bending process (200), and forming a straight protrusion at the end of the inclined cut plate part (22) so that the plate spring part (63) can be formed during the spring bending process (200). It is composed of a straight cut plate section (23).

[0051] Between the above spring plate member (20) and the solder terminal (70), a solder support plate (71) formed in a plate shape is cut and formed to form a supporting force for the solder terminal (70).

[0052]

[0053] And, the spring bending process (200) is composed of a step of bending the spring plate part (20) formed through the cutting process (100) in multiple stages from the center to form a square of the same size so as to form a spring part (60).

[0054] The spring part (60) formed through the above spring bending process (200) has a connecting spring part (61) formed in the center, and inclined spring parts (62) formed on both sides of the connecting spring part (61) and plate spring parts (63) formed in a plate shape are formed continuously in a zigzag pattern.

[0055]

[0056] In addition, the above connection pin compression binding process (300) consists of the step of inserting and binding the connection pin (50) so that the lower end of the connection pin (50) penetrates and protrudes through the pin coupling plate (10) formed by cutting through the cutting process (100), and then compressing the protruding end to bind the connection pin (50).

[0057] The above connecting pin (50) has a connecting pin (51) formed protruding from its lower end, which penetrates the pin connection hole (12) of the pin connecting plate (10) and is connected to the pin connecting plate (10) by being compressed at the lower end.

[0058] At this time, the connection pin compression binding process (300) can be performed by placing a lower mold into which a connection pin (50) with a binding pin (51) protruding upward is inserted, protruding the binding pin (51) through the pin binding hole (12) of the pin coupling plate (10), supporting the lower surface of the pin coupling plate (10) with the lower mold, and forming the connection pin (51) to be deformed and bound by compressing it from the top with the upper mold.

[0059]

[0060] In addition, the above spring matching bending process (400) consists of a step of bending the two spring parts (60) formed by bending through the spring bending tube so that each spring wire part crosses and matches with the pin connecting plate (10) facing the center.

[0061]

[0062] Meanwhile, in the implementation of the present invention, the board connector for an electronic device, which has been cut and bent and formed through the spring-matching bending process (400), may be subjected to a housing coupling process (500) in which it is coupled to be received in a square housing (80) to ensure stability during operation and prevent damage.

[0063] The above housing coupling process (500) consists of the step of coupling a square housing (80) to a coupled spring part (60) formed through the spring part coupling bending process (400).

[0064]

[0065] In addition, in the implementation of the present invention, when a solder terminal (70) is soldered to the upper surface of the board during the soldering process on the board, a terminal bending process (600) can be performed so that the solder terminal (70) protrudes to the side.

[0066] The above terminal bending process (600) consists of a step of bending the solder terminal (70), which protrudes from the end of the housing (80) through the housing coupling process (500), so that it protrudes to the side.

[0067]

[0068] The following describes the effects of the application of the present invention.

[0069] As described above, in a method for manufacturing a board connector for an electronic device, the method comprises a cutting process (100) in which a pin coupling plate (10) is formed in the center, and spring plate members (20) that protrude laterally to form a "V" on both sides of the pin coupling plate (10) are formed by cutting, and solder terminals (70) are formed at both ends; a spring bending process (200) in which the spring plate members (20) formed through the cutting process (100) are bent in multiple stages from the center to form a square of the same size so as to form a spring member (60); a connection pin compression and binding process (300) in which the lower end of a connection pin (50) is inserted and coupled through the pin coupling plate (10) formed through the cutting process (100) so as to protrude, and then the protruding end is compressed to bind the connection pin (50); and the two spring members (60) formed by bending through the spring bending tube When the present invention is applied and implemented, the spring matching bending process (400) is formed by the step of bending the pin connecting plate (10) so that each spring wire part crosses and aligns with the center. In this case, the connecting pin (50), the spring part (60), and the solder terminal (70) are formed integrally, so that no connection resistance is caused and the usage time is not affected.

[0070] In addition, the present invention comprises a continuous process of cutting process (100), spring bending process (200), connection pin crimping and binding process (300), and spring matching tooth bending process (400), thereby enabling the rapid and clear manufacturing of a board connector.

[0071]

[0072] <Explanation of Symbols>

[0073] 10 : Pin connection plate

[0074] 11: Connecting plate body 12: Pin connection hole 13: Spring connection part

[0075] 20 : Spring plate section

[0076] 21 : Connecting cut plate section 22 : Inclined cut plate section 23 : Straight cut plate section

[0077] 50 : Connection pin 51 : Binding pin

[0078] 60 : Spring part

[0079] 61: Connecting spring section 62: Inclined spring section 63: Plate spring section

[0080] 70 : Solder terminal 71 : Solder support plate

[0081] 80 : Housing

[0082] 100 : Cutting process and

[0083] 200 : Spring bending process

[0084] 300 : Connection pin crimping process

[0085] 400 : Spring matching tooth bending process

[0086] 500 : Housing assembly process

[0087] 600 : Terminal bending process

Claims

1. A method for manufacturing a board connector for electronic devices, A method for manufacturing a board connector for an electronic device, characterized by comprising: a cutting process comprising the step of forming a pin coupling plate in the center, forming spring plate members protruding laterally to form a "V" on both sides of the pin coupling plate, and forming solder terminals at both ends; a spring bending process comprising the step of multi-stage bending of the spring plate members formed through the cutting process to form a square of the same size from the center to form a spring member; a connection pin compression and binding process comprising the step of inserting and binding the lower end of a connection pin through the pin coupling plate formed through the cutting process and protruding, and then compressing the protruding end to bind the connection pin; and a spring member matching bending process comprising the step of bending the two spring members formed by bending through the spring bending tube so that each spring wire member crosses and aligns with the center of the pin coupling plate.

2. In Paragraph 1; A method for manufacturing a board connector for an electronic device, characterized in that the pin coupling plate, which is cut through the above cutting process, is composed of a coupling plate body formed in the shape of a square plate, a pin coupling hole formed through the center of the coupling plate body to allow a connecting pin to be connected, and spring connecting parts formed symmetrically on both sides of the coupling plate body to be connected to a spring plate member.

3. In Paragraph 1; A method for manufacturing a board connector for an electronic device, characterized in that the spring plate portions on both sides of the pin connection, which are cut through the above cutting process, are formed by cutting so as to protrude in a "V" shape in opposite directions so that they are joined together in a zigzag pattern during the spring part matching bending process after the spring bending process.

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