Electronic device supporting 5g and 6g communications

Abstract

According to one embodiment, an electronic device may comprise: at least one modem; an intermediate frequency (IF) conversion circuit configured to convert a 5G communication baseband signal from the at least one modem to an intermediate frequency signal; a 5G antenna module including a circuit and configured to convert the intermediate frequency signal to a 5G communication radio frequency (RF) signal; and a radio frequency integrated circuit (RFIC) configured to convert a 6G communication baseband signal from the at least one modem to a 6G communication RF signal.

Description

Electronic devices supporting 5G and 6G communication

[0001] The present disclosure relates to an electronic device that supports 5G (5th-generation) communication and 6G communication.

[0002] Looking back at the evolution of wireless communication through successive generations, technologies have primarily been developed for human-oriented services, such as voice, multimedia, and data. It is projected that connected devices, which have been increasing explosively since the commercialization of 5G communication systems, will be connected to communication networks. Examples of networked objects include vehicles, robots, drones, home appliances, displays, smart sensors installed in various infrastructures, construction machinery, or factory equipment. Mobile devices are expected to evolve into various form factors, such as augmented reality glasses, virtual reality headsets, or holographic devices. In the 6G (6th-generation) era, efforts are underway to develop 6G communication systems to connect hundreds of billions of devices and objects to provide diverse services. For this reason, 6G communication systems are being referred to as "beyond 5G" systems.

[0003] In a 6G communication system, the maximum transmission speed is tera (e.g., 1,000 giga) bps, and the wireless latency is 100 microseconds (μsec). For example, compared to a 5G communication system, the transmission speed in a 6G communication system can be 50 times faster and the wireless latency can be reduced to one-tenth.

[0004] As a technology to ensure coverage, new waveforms, beamforming, and multi-antenna transmission technologies such as massive multiple-input and multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, or large-scale antennas are being developed, which are superior in terms of coverage compared to RF (radio frequency) devices, antennas, OFDM (orthogonal frequency division multiplexing).

[0005] In addition, to improve frequency efficiency and system network, development is underway in 6G communication systems for full duplex technology, in which uplink and downlink simultaneously utilize the same frequency resources at the same time; network technology that integrates satellites and HAPS (high-altitude platform stations); network structure innovation technology that supports mobile base stations and enables network operation optimization and automation; dynamic spectrum sharing technology through collision avoidance based on spectrum usage prediction; AI-based communication technology that utilizes AI (artificial intelligence) from the design stage and internalizes end-to-end AI support functions to realize system optimization; and next-generation distributed computing technology that realizes services of complexity exceeding the limits of terminal computing capabilities by utilizing ultra-high performance communication and computing resources (mobile edge computing (MEC), cloud, etc.). In addition, attempts are continuing to further strengthen connectivity between devices, further optimize networks, promote the softwareization of network entities, and increase the openness of wireless communication through the design of new protocols to be used in 6G communication systems, the implementation of hardware-based security environments, the development of mechanisms for the safe utilization of data, and the development of technologies regarding privacy maintenance methods.

[0006] Due to the research and development of such 6G communication systems, it is expected that a new dimension of hyper-connected experience will become possible through the hyper-connectivity of 6G communication systems, which encompasses not only connections between objects but also connections between people and objects. For example, it is projected that 6G communication systems will enable the provision of services such as truly immersive extended reality (truly immersive XR), high-fidelity mobile holograms, or digital replicas. Furthermore, services such as remote surgery, industrial automation, and emergency response, which are provided through 6G communication systems with enhanced security and reliability, will be applicable in various fields such as industry, healthcare, automotive, and consumer electronics.

[0007] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0008] The electronic device may include at least one modem.

[0009] The electronic device may include an IF conversion circuit configured to convert a 5G communication baseband signal from at least one modem into an intermediate frequency signal.

[0010] The electronic device may include a 5G antenna module comprising at least one antenna configured to convert the intermediate frequency signal into a 5G communication RF signal.

[0011] The electronic device may include an RFIC configured to convert a 6G communication baseband signal from at least one modem into a 6G communication RF signal.

[0012] The above electronic device may include an FPCB.

[0013] The above FPCB may include an intermediate frequency signal line for providing the intermediate frequency signal to the 5G antenna module, and a 6G communication RF signal line for providing the 6G communication RF signal to at least one of the 6G antennas.

[0014] At least one of the above 6G antennas can be placed on the above FPCB.

[0015] The FPCB may include a first ground layer.

[0016] The above FPCB may include a signal line layer disposed below the first ground layer.

[0017] The above FPCB may include a second ground layer disposed below the signal line layer.

[0018] The above FPCB may include an intermediate frequency signal line for providing an intermediate frequency signal of 5G communication.

[0019] The above FPCB may include a 6G communication RF signal line for a 6G communication RF signal.

[0020] The above FPCB may include an antenna for the 6G communication.

[0021] The above intermediate frequency signal line and the above 6G communication RF signal line can be placed in the signal line layer.

[0022] The above and other aspects, features, and advantages of specific embodiments of the present invention will become more apparent from the detailed description that follows in conjunction with the accompanying drawings.

[0023] FIG. 1 is a block diagram of an example electronic device in a network environment according to various embodiments.

[0024] FIG. 2a is a block diagram illustrating an example electronic device according to various embodiments.

[0025] FIG. 2b is a drawing for illustrating the arrangement of components within an exemplary electronic device according to various embodiments.

[0026] FIG. 3 is a cross-sectional drawing illustrating the side structure of an FPCB according to various embodiments.

[0027] FIG. 4a is a drawing for explaining the layers of an FPCB according to various embodiments.

[0028] FIG. 4b is a drawing for explaining the layers of an FPCB according to various embodiments.

[0029] FIG. 5a is a cross-sectional view illustrating the arrangement between an FPCB and other elements according to various embodiments.

[0030] FIG. 5b is a cross-sectional view illustrating an example patch antenna arrangement according to various embodiments.

[0031] FIG. 5c is a cross-sectional view illustrating the arrangement between an FPCB and other elements according to various embodiments.

[0032] FIGS. 5d and FIGS. 5e are graphs illustrating the performance of a patch antenna according to various embodiments.

[0033] FIG. 5f is a cross-sectional view illustrating an example FPCB according to various embodiments.

[0034] FIG. 6a is a cross-sectional view illustrating the arrangement of a patch antenna according to various embodiments.

[0035] FIG. 6b is a view of the second ground layer of FIG. 6a according to various embodiments, seen from the bottom.

[0036] FIG. 6c is a view of the second ground layer of FIG. 6a according to various embodiments, seen from above.

[0037] FIG. 7a is a cross-sectional view illustrating a patch antenna according to various embodiments.

[0038] FIG. 7b is a cross-sectional view illustrating a patch antenna according to various embodiments.

[0039] FIG. 8 is a diagram illustrating the arrangement of patch antennas according to various embodiments.

[0040] FIG. 9 is a drawing for illustrating an example electronic device according to various embodiments.

[0041] FIG. 10 is a drawing for illustrating an electronic device according to various embodiments.

[0042] FIG. 11 is a drawing for illustrating an electronic device according to various embodiments.

[0043] FIG. 1 is a block diagram of an example electronic device in a network environment according to various embodiments.

[0044] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0045] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof. Thus, the processor (120) may include various processing circuits and / or multiple processors. For example, the term "processor" as used herein (including claims) may include various processing circuits including at least one processor, and one or more of said at least one processor may be configured to perform the various functions described herein individually or in a distributed manner.Where in this specification, "processor," "at least one processor," and "one or more processors" are described as being configured to perform multiple functions, these terms include, for example, cases where one processor performs some of the described functions and other processor(s) perform the remaining functions, as well as cases where a single processor performs all of the described functions. Additionally, at least one processor may include a combination of processors that perform the various described or disclosed functions in a distributed manner. At least one processor may execute program instructions to achieve or perform the various functions.

[0046] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0047] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input data or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0048] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0049] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0050] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0051] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0052] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0053] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0054] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0055] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0056] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0057] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0058] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0059] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0060] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0061] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0062] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0063] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0064] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0065] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0066] FIG. 2a is a block diagram illustrating an exemplary configuration of an electronic device according to various embodiments. The electronic device of FIG. 2a will be described with reference to FIG. 2b. FIG. 2b is a drawing illustrating an exemplary arrangement of components within an electronic device according to various embodiments.

[0067] According to one embodiment, the electronic device (101) may include a printed circuit board (PCB) (210), a flexible printed circuit board (FPCB) (220), and / or a mmWave antenna module (230) (e.g., including various circuits).

[0068] According to one embodiment, a modem (211), an IF (intermediate) / RFIC (radio frequency integrated circuit) module (213), and / or an RFFE (radio frequency front end) (217) may be disposed on the PCB (210). The modem (211) may provide a 5G communication baseband signal and / or a 6G communication baseband signal by performing modulation. The modem (211) may be implemented to support both 5G communication and 6G communication. The modem (211) may be implemented as a plurality of modems, including a modem supporting 5G communication and a modem supporting 6G communication. The modem (211) may be configured to demodulate a received baseband signal. The IF / RFIC module (213) is illustrated in FIG. 2 as including an IF conversion circuit (214) for 5G communication and an RFIC (215) for 6G communication, but this is exemplary and those skilled in the art will understand that the IF conversion circuit (214) and the RFIC (215) for 6G communication may be implemented as separate hardware.

[0069] The IF conversion circuit (214) can convert a 5G communication baseband signal into an intermediate frequency signal and output it. When 5G communication uses FR (frequency range) 2, the frequency of the intermediate frequency signal may be included in the range of, for example, 7 GHz to 13 GHz, but there is no limitation. The IF conversion circuit (214) may convert the received intermediate frequency signal into a baseband signal and provide it to the modem (211). The RFIC (215) for 6G communication can convert a 6G communication baseband signal into a 6G communication RF (radio frequency) signal. For example, the frequency of the 6G communication RF signal may be 7 GHz or 13 GHz, but there is no limitation. Accordingly, the frequency band of the 5G communication intermediate frequency signal and the frequency band of the 6G communication RF signal may overlap at least partially, and / or the difference may be less than a threshold difference.

[0070] The frequency band of the intermediate frequency signal of 5G communication and / or the frequency band of the RF signal of 6G communication may be a relatively high frequency band, and accordingly, the path loss in the intermediate frequency signal line (221) and the 6G communication RF signal line (222, 223) may also be relatively large. To suppress (or reduce) the path loss, the dielectric constant of the FPCB (220) on which the intermediate frequency signal path (221) is placed may be implemented to have a relatively large value.

[0071] To compensate for losses in the high frequency band, materials with relatively high dielectric constant (or low dielectric loss) may be used. For example, at a frequency of 13 GHz, materials with a low dielectric loss of about 0.5 dB to 1 dB may be used, but there is no limit to the range. For example, the dielectric loss (Df) value of the FPBC may be about 0.003 or less, but there is no limit.

[0072] As described above, the RF signal of 6G communication, which overlaps at least partially with the intermediate frequency signal of 5G communication and / or has a difference less than a threshold difference, may also be in a relatively high frequency band, and accordingly, the path loss may be relatively large. Accordingly, it may be advantageous in terms of path loss for the 6G communication RF signal line (222, 223) to be placed on an FPCB (220) having a relatively high dielectric constant. For example, when an RF signal of 7 GHz or 13 GHz is provided through the 6G communication RF signal line (222, 223), the path loss of the RF signal may be relatively small due to the relatively high dielectric constant of the FPCB (220). The RFFE (217) for 6G communication can process the RF signal for 6G communication provided from the RFIC (215) and provide it to each of the patch antennas (224, 225) for 6G communication. For example, the RFFE (217) may include, but is not limited to, a splitter for splitting into 6G communication RF signal lines (222, 223) corresponding to each of the patch antennas (224, 225), a combiner for combining the received RF signals, a power amplifier, a phase shifter, a low-noise amplifier, and / or a switch for switching the transmit / receive path. The mmWave antenna module (230) may convert an intermediate frequency signal provided through the intermediate frequency signal line (221) into an RF signal. The mmWave antenna module (230) may include, for example, a filter, an RF local oscillator (RF LO), a mixer, an internal-branch coupler, a serial interface (serial I / F), a combiner / splitter, a phase shifter, a switch, a PA, an LNA, a coupler, and / or an antenna for 5G communication, but is not limited to.Accordingly, an RF signal for 5G communication can be provided to an antenna for 5G communication. For example, to mitigate interference between an antenna for 5G communication and a patch antenna (224, 225) for 6G communication, the distance between the two antennas may follow Equation 1.

[0073]

[0074] Here, λ can represent wavelength, and for example, at 7 GHz, the minimum distance between the two antennas can be about 2.2 cm, and at 13 GHz, it can be about 1.1 cm, but there is no limit.

[0075] When an electronic device (101) that simultaneously supports 5G communication and 6G communication is made relatively small, the electronic device (101) may additionally support legacy communication below 5G communication (e.g., 2G communication, 3G communication, or 4G communication), and accordingly, it may be difficult to secure space to additionally place an antenna for 6G communication. Patch antennas (224, 225) for 6G communication of the electronic device (101) according to various embodiments may be placed on an FPCB (220). The FPCB (220) may connect the PCB (210) to the mmWave antenna module (230), for example, as in FIG. 2b. For example, the FPCB (220) may be placed on a battery (280), but there is no limitation. The FPCB (220) may be placed on the battery (280). Accordingly, patch antennas (224, 225) for 6G communication placed on the FPCB (220) may be placed relatively inside the electronic device (101) when viewed from above. As the patch antennas (224, 225) are placed relatively inside the electronic device (101), interference suppression, radiation efficiency, and / or beam forming performance may be relatively high. For example, the internal placement of the patch antennas (224, 225) may be advantageous to prevent and / or reduce the degradation of radiation performance due to contact with body parts such as a user's hand or head. For example, the patch antennas (224, 225) may be placed for radiation through a back glass, which will be described later. On the back of the electronic device (101), a non-conductive material (e.g., back glass, but not limited thereto) may be placed so that losses may be relatively low and / or radiation in the omni-direction may be possible.

[0076] According to one embodiment, the FPCB (220) may include a rigid region (220a) and a flexible region (220b). For example, the rigidity of the rigid region (220a) may be greater than that of the flexible region (220b). The rigid region (220a) may be connected to, for example, a PCB (210). One side of the flexible region (220a) may be connected to the rigid region (220a), and the other side of the flexible region (220a) may be connected to a mmWave antenna module (230).

[0077] FIG. 3 is a cross-sectional drawing illustrating the side structure of an FPCB according to various embodiments.

[0078] According to one embodiment, the FPCB (220) may include a first ground layer (310), a signal line layer (320), and a second ground layer (330). For example, the signal line layer (320) may be disposed on the second ground layer (330). For example, the first ground layer (310) may be disposed on the signal line layer (320). For example, the first ground layer (310) and the second ground layer (330) may be upper / lower ground layers for forming a strip line structure, but are not limited thereto. The first ground layer (310) may be used for grounding, for example. For example, ground vias for shielding intermediate frequency signals and / or RF signals of 6G communication may be connected to the first ground layer (310), which will be explained with reference to FIG. 4a. In FIG. 3, each layer (310, 320, 330) is depicted as being in contact with one another, but this is for convenience of explanation and those skilled in the art will understand that an additional layer (e.g., flexible copper clad laminate) or adhesive member may be placed between adjacent layers (310, 320), and / or an additional layer or adhesive member may be placed between adjacent layers (320, 330).

[0079] For example, a first ground layer (310) may be placed on a portion of the signal line layer (320). The first ground layer (310) may be formed of, for example, a material for grounding, and the rigidity of the first ground layer (310) may be relatively greater than the rigidity of the signal line layer (320) and the second ground layer (330). As the rigidity of the first ground layer (310) is relatively high, the area where the first ground layer (310) is placed may be included in the rigid area (220a), but there is no limitation. For example, the remaining area that is not part of the signal line layer (320) and a portion of the second ground layer (330) placed below it may be included in the flexible area (220b) as the rigidity is relatively low, but there is no limitation. A first ground layer (310) may be disposed on a portion of the signal line layer (320), and a patch antenna (224) for 6G communication may be disposed on at least a portion of the remaining portion of the signal line layer (320). A connector (311) may be disposed, for example, on the first ground layer (310). The connector (311) may be electrically connected, for example, to an IF / RFIC module (213) of the PCB (200), so that an IF signal for 5G communication and / or an RF signal for 6G communication may be provided through the connector (311).

[0080] A 6G communication RF signal line (222) can connect between the connector (311) and the feeding portion (313) of the patch antenna (224). Accordingly, a 6G communication RF signal provided from the IF / RFIC module (213) of the PCB (200) can be provided to the patch antenna (224) through the connector (311) and the feeding portion (313). Although a portion of the 6G communication RF signal line (222) is shown in FIG. 3 as penetrating the interior of the signal line layer (320), this is exemplary, and there are no limitations on the arrangement of the 6G communication RF signal line (222). An intermediate frequency signal line (221) can connect between the connector (311) and the feeding portion (315) of the mmWave antenna module (230). Accordingly, an intermediate frequency signal of 5G communication provided from the IF / RFIC module (213) of the PCB (200) can be provided to the mmWave antenna module (230) through the connector (311) and the feeding section (315). Although a portion of the intermediate frequency signal line (221) is shown in FIG. 3 as penetrating the interior of the signal line layer (320), this is exemplary and there are no limitations on the arrangement of the intermediate frequency signal line (221). For example, ground vias for shielding the intermediate frequency signal and / or the RF signal of 6G communication may be formed in the signal line layer (320), which will be explained with reference to FIG. 4a.

[0081] The patch antenna (224) may be formed, for example, by a plurality of layers (321, 322, 323). For example, the third layer (323) may be connected to the feeding section (313) and thereby receive 6G communication RF signals. For example, the dielectric constant of the third layer (323) may be about 2, but this is exemplary and there is no limit to the dielectric constant. To reduce impedance change and / or loss between the feeding section (313) and the first layer (321) for radiation, the dielectric constant of the third layer (323) may be set relatively low, but there is no limit. The second layer (322) may be formed of a high dielectric constant material. For example, the dielectric constant may be about 6, but this is exemplary and there is no limit to the dielectric constant. By using a high dielectric constant material, the size of the patch antenna (224) may be formed relatively small. The first layer (321) may be a layer that generates radiation, and may be formed of a low dielectric material to improve radiation performance, but there are no limitations.

[0082] FIG. 4a is a drawing for explaining layers included in an FPCB according to various embodiments.

[0083] According to one embodiment, as described with reference to FIG. 3, a connector (311) may be disposed on the first ground layer (310). The connector (311) may be electrically connected, for example, to an IF / RFIC module (213) of the PCB (200), so that an IF signal of 5G communication and / or an RF signal of 6G communication may be provided through the connector (311). A first-1 via ground group (411), a first-2 via ground group (412), a first-3 via ground group (413), a first-4 via ground group (414), and / or a first-5 via ground group (415) may be disposed (or formed) on the first ground layer (310). The connector (311) can be connected to, for example, a plurality of connection parts (453, 454, 455) of the signal line layer (320). For example, a first intermediate frequency signal of 5G communication can be provided from the PCB (210) through the connector (311) and provided to the first intermediate frequency signal line (221a) through the connection part (453). A second intermediate frequency signal of 5G communication can be provided from the PCB (210) through the connector (311) and provided to the second intermediate frequency signal line (221b) through the connection part (454). An RF signal of 6G communication can be provided from the PCB (210) through the connector (311) and provided to the 6G communication RF signal line (222) through the connection part (455). The RF signal of 6G communication can be provided to the patch antenna (424) through the RF signal line (222). In FIG. 4a, one patch antenna (424) and the corresponding RF signal line (222) are shown, but for convenience of explanation, those skilled in the art will understand that other patch antennas, RF signal lines corresponding to each of the other patch antennas, and feeding units may be placed in the signal line layer (320).

[0084] A second-1 ground via group (421) may be disposed on one side of the first intermediate frequency signal line (221a). For example, a portion of the second-1 ground via group (421) may be connected to the first-1 via ground group (411). A second-2 ground via group (422) may be disposed on the other side of the first intermediate frequency signal line (221a). For example, a portion of the second-2 ground via group (422) may be connected to the first-2 via ground group (412). Accordingly, the first intermediate frequency signal may be shielded by the second-1 ground via group (421) and the second-2 ground via group (422). A second-3 ground via group (423) may be disposed on one side of the second intermediate frequency signal line (221b). For example, part of the second-third ground via group (423) may be connected to the first-third via ground group (411). A second-fourth ground via group (424) may be placed on the other side of the second intermediate frequency signal line (221b). For example, part of the second-fourth ground via group (424) may be connected to the first-fourth via ground group (414). Accordingly, the second intermediate frequency signal may be shielded by the second-third ground via group (423) and the second-fourth ground via group (424). As an example, a main power line (or, which may be referred to as VPH) (451) may be placed between the second-second ground via group (422) and the second-third ground via group (423).

[0085] A 6G communication RF signal line (222) may be placed between the 2-4 ground via group (424) and the 2-5 ground via group (425). The 2-5 ground via group (425) may be connected to the 1-5 ground via group (415). Accordingly, the 6G communication RF signal may be shielded by the 2-4 ground via group (424) and the 2-5 ground via group (425). The 2-4 ground via group (424) may be used to shield the 6G communication RF signal while being used to shield the 2 intermediate frequency signal, and this may be referred to as a shared ground via group. According to one embodiment, at least some of the plurality of ground vias may be shared for shielding of the plurality of signals (e.g., a second intermediate frequency signal and a 6G communication RF signal), thereby suppressing an increase in the number of ground vias and suppressing an increase in the area of ​​the FPCB (210).

[0086] According to one embodiment, the signal line layer (320) may include a second-1 sub-region (320a) and a second-2 sub-region (320b). A plurality of signal lines (221a, 221b, 222) may be disposed in the second-1 sub-region (320a). A patch antenna (224) for 6G communication may be disposed in the second-2 sub-region (320b). The second-2 sub-region (320b) may be referred to as an extended area in that it is formed for the patch antenna (224), but there is no limitation. The area disposed below the first ground (310) of the signal line layer (320) may be included in the second-1 sub-region (320a) and may not be included in the second-2 sub-region (320b). The 2-2 sub-region (320b) may be, for example, a fill-cut area. The 3-2 sub-region (330b) may include ground, but this is exemplary and not limited to it.

[0087] The second ground layer (330) may include a third-1 sub-region (330a) and a third-2 sub-region (330b). A second-1 sub-region (320a) may be disposed on the third-1 sub-region (330a), and a second-2 sub-region (320b) may be disposed on the third-2 sub-region (330b). A plurality of via ground groups (431, 432, 433, 434, 435) may be disposed (or formed) on the third-1 sub-region (330a). Each of the multiple via ground groups (431, 432, 433, 434) of the second ground layer (330) may be connected to the multiple via ground groups (421, 422, 423, 424, 425) of the signal line layer (320), but there are no limitations.

[0088] FIG. 4b is a drawing for explaining layers included in an FPCB according to one embodiment according to various embodiments.

[0089] The patch antenna (224) may be placed on the third-2 sub-region (330b) of the second ground layer (330) rather than the signal line layer (320). In this case, the second-2 sub-region (320b) of the signal line layer (320) of FIG. 4a may not exist. For example, the 6G communication RF signal line (222) of the signal line layer (320) may be connected to the patch antenna (224) placed on the third-2 sub-region (330b) through a via (e.g.).

[0090] FIG. 5a is a cross-sectional view illustrating the arrangement between an FPCB and other components according to various embodiments. The arrangement of FIG. 5a will be explained with reference to FIG. 5b. FIG. 5b is a cross-sectional view illustrating the arrangement of a patch antenna according to various embodiments.

[0091] According to one embodiment, the FPCB (220) may be supported, for example, by a support structure (520). The FPCB (220) may include, for example, a first region (551) and a second region (552). The back glass (510) of the electronic device (101) may be spaced apart by d1 from the first region (551) of the FPCB (220). The thickness of the first region (551) of the FPCB (220) may be, for example, d2. The thickness of the second region (552) of the FPCB (220) may be, for example, d3. For example, in FIG. 4a, the second region (552) may include two layers (320, 330), or in FIG. 4b, the second region (552) may include one layer (330). The area between the second region (552) and the back glass (510) may be designated as an air region (520). A patch antenna (224) may be placed in the air region (520), as in FIG. 4a or FIG. 4b. For example, the vertical length of the air region (520) may be d1 + d2 - d3, and accordingly, the thickness of the patch antenna (224) may be set to d1 + d2 - d3 or less. For example, as in FIG. 5b, a patch antenna (224) may be placed between the back glass (510) and the upper surface (560) of the second region (552) (e.g., the signal line layer (320) in FIG. 4a, or the second ground layer (330) in FIG. 4b). In FIG. 5b, the patch antenna (224) is depicted as being in contact with the back glass (510), but those skilled in the art will understand that this is exemplary and may be separated. The thickness of the patch antenna (224) may be, for example, d1 + d2 - d3, and it is assumed that this value is 0.8 mm. For example, d1 may be 0.5 mm, d2 may be 0.35 mm, and d3 may be 0.05 mm, in which case d1 + d2 - d3 may be 0.8 mm.In this case, the first layer (321) of the patch antenna (224) may be 0.2 mm, the second layer (322) may be 0.3 mm, and the third layer (323) may be 0.3 mm, which is exemplary. Again, referring to FIG. 5a, a battery (280) may be located on the lower side of the FPCB (220). The distance between the FPCB (220) and the battery (280) may be d4. For example, the patch antenna (224) may be positioned to be in contact with the battery (280), which will be explained with reference to FIG. 6a. The upper surface (560) may be, for example, the second ground layer (330) in FIG. 4b. The second ground layer (330) may be used as a reflector for electromagnetic waves and / or form a radiation pattern. In this way, when a patch antenna (224) is placed on an upper surface (560) such as a second ground layer (330), stable radiation may be possible. In FIG. 4a, the upper surface (560) may be a signal line layer (320), and in this case, stable radiation may also be possible by the second ground layer (330) placed below the second-2 sub-region (320b), which is a fill-cut area.

[0092] FIG. 5c is a cross-sectional view illustrating the arrangement between an FPCB and other elements according to various embodiments.

[0093] According to one embodiment, the FPCB (220) may be supported, for example, by a support structure (520). The FPCB (220) may include, for example, a first region (551) and a second region (552). The back glass (510) of the electronic device (101) may be spaced apart by d1 from the first region (551) of the FPCB (220). The thickness of the first region (551) of the FPCB (220) may be, for example, d2. The thickness of the second region (552) of the FPCB (220) may be, for example, d3. For example, in FIG. 4a, the second region (552) may include two layers (320, 330), or in FIG. 4b, the second region (552) may include one layer (330). In FIG. 5c, a patch antenna (224) may be placed on a first region (551). Accordingly, the thickness of the patch antenna (224) may be set to d1 or less.

[0094] FIGS. 5d and FIGS. 5e are graphs illustrating the performance of a patch antenna according to various embodiments.

[0095] Referring to FIG. 5d, an S-parameter graph (581) is illustrated. For example, FIG. 5d illustrates an S-parameter graph (581) for a patch antenna (224) when the frequency of the RF signal is set to 12 GHz. As shown in FIG. 5d, it can be seen that the S-parameter graph (581) decreases at a frequency of 12 GHz. Additionally, referring to FIG. 5e, radiation patterns (582, 583, 584) at multiple frequencies (e.g., 11.6 GHz, 12 GHz, or 12.4 GHz, but not limited thereto) in each coordinate system according to the patch antennas according to the embodiment are illustrated. It can be seen that the radiation patterns (582, 583, 584) have relatively large values ​​at 0 degrees, and accordingly, the beam-forming performance is also good.

[0096] FIG. 5f is a cross-sectional view illustrating an FPCB according to various embodiments.

[0097] According to one embodiment, the patch antenna may include a stiffner layer (586), which may be, for example, kapton, but is not limited thereto. The stiffner layer (586) may be, for example, a protective layer to prevent / reduce damage to the FPCB during fastening, but is not limited thereto. An insulating layer (587) may be disposed below the stiffner layer (586), which may be, for example, a photo imageable solder resist (PSR), but is not limited thereto. The insulating layer (587) may prevent / reduce exposure of the plating layer (588), but is not limited thereto. A plating layer (588) may be disposed below the insulating layer (587), which may be, for example, a copper plating layer, but is not limited thereto. An FCCL (flexible copper clad laminate) layer (589) may be disposed below the plating layer (588). The plating layer (588) and the FCCL layer (589) may have flexibility, and, for example, a copper plating layer that is relatively thin on a polymide film may be adhered, but there are no limitations. The plating layer (588) and the FCCL layer (589) may be implemented, for example, with a low loss rate material. An adhesive layer (590) may be disposed below the FCCL layer (589). The adhesive layer (590) may be a layer for adhesion between adjacent layers (e.g., the FCCL layer (589) and the coverlay layer (591)), but there are no limitations. A coverlay layer (591) may be disposed below the adhesive layer (590). An FCCL layer (592) may be disposed below the coverlay layer (591), and the coverlay layer (591) is for protection of the FCCL layer (592), but there are no limitations. A plating layer (593) may be disposed on the lower side of the FCCL layer (592). The plating layer (593) and the FCCL layer (592) may have flexibility, and, for example, a copper plating layer that is a relatively thin film may be adhered to a polyimide film, but there are no limitations.The plating layer (593) and the FCCL layer (592) may be implemented, for example, with a low loss rate material. A coverlay layer (594) may be disposed below the plating layer (593). An insulating layer (595) may be disposed below the coverlay layer (594), and may be, for example, a PSR, but is not limited thereto. The coverlay layer (594) is intended to protect the insulating layer (595), but is not limited thereto. A stiffner layer (596) may be disposed below the insulating layer (595). The stiffner layer (596) may be a protective layer to prevent damage to the FPCB during fastening, but is not limited thereto. For example, the FCCL layer (592) may be used and / or function as a ground, but this is exemplary and is not limited thereto. The FCCL layer (592) may include, for example, a PI (polymide) layer and / or a copper plating layer, and the PI layer and / or the copper plating layer may be used and / or function as a ground, but is not limited thereto. The FCCL layer (592) may include a copper plating layer positioned above and below the PI layer. For example, the copper plating layer on the lower side of the FCCL layer (592) may be implemented as a single entity with the plating layer (593), but this is exemplary and is not limited thereto.

[0098] FIG. 6a is a cross-sectional view illustrating the arrangement of a patch antenna according to various embodiments. The embodiment of FIG. 6a will be described with reference to FIG. 6b and FIG. 6c.

[0099] According to one embodiment, layers (541, 542, 543) of the patch antenna (224) may be disposed on the battery (280). For example, in the embodiment of FIG. 6a, layers (541, 542, 543) of the patch antenna (224) are assumed to be disposed on the third-second sub-region (330b) of the second ground layer (330) as in FIG. 4b, but are not limited thereto. For example, the first portion (631) of the second ground layer (330) may be connected to the third layer (543) by penetrating the second layer (542) (not limited thereto). In the first part (631) of the second ground layer (330), as described above, a 6G communication RF signal line may be formed, and accordingly, a 6G communication RF signal line may be connected to the third layer (543). The second part (632) of the second ground layer (330) may, for example, penetrate the second layer (542). The inactive part (651, 652) and the active part (653) of the patch antenna may be distinguished by the connection point of the parts (631, 632) of the second ground layer (330), but there are no limitations. For example, the active part (653) may be determined based on the size of the radiator of the patch antenna (224). For example, the inactive part (651, 652) may be named a clearance area. For example, the second ground layer (330) may be fill-cut, and the third layer (543) and the second layer (542) may be placed (or joined) on both sides based on the fill-cut portion (e.g., at least part of the third-second sub-region (330b)). Accordingly, in the inactive portion (651, 652), the second ground layer (330) may be placed between the third layer (543) and the second layer (542), and thus may be named a clearance area.

[0100] The battery (280) can operate as a ground for radiation from the patch antenna (224). For example, a case for protecting the battery cell of the battery (280) may include a metal such as aluminum, and accordingly, the surface of the battery (280) may be conductive and / or may act as a reflector for the radiation of electromagnetic waves, as the surface material continuity may be ensured due to the relatively large surface area of ​​the surface of the battery (280). As layers (541, 542, 543) of the patch antenna (224) are placed on the battery (280), a space may be secured between the first layer (541) of the patch antenna (224) and the back glass (510), and / or the thickness of the patch antenna may be increased.

[0101] FIG. 6b is a view of the second ground layer (330) of FIG. 6a from below, according to various embodiments. Third layers (543a, 543b) of a plurality of patch antennas may be disposed on the lower surface of the second ground layer (330). 6G communication RF signal lines may be connected to the feed portions (681c, 682c) of the third layers (543a, 543b). Each of the 6G communication RF signal lines may be disposed, for example, between the slits (681a, 681b) and between the slits (682a, 682b), but is not limited thereto, and those skilled in the art will understand that the slits (681a, 681b, 682a, 682b) may be implemented so as not to be formed.

[0102] FIG. 6c is a view of the second ground layer (330) of FIG. 6a from above. On the upper surface of the second ground layer (330), active portions (541ab, 541bb), inactive portions (541aa, 541ba) of the first layers of a plurality of patch antennas and second layers (541b, 542b) may be arranged, but are not limited thereto. As described above, a space between the first layer (541) of the patch antenna and the back glass (510) may be secured, and / or the thickness of the patch antenna may be increased.

[0103] FIG. 7a is a cross-sectional view illustrating a patch antenna according to various embodiments.

[0104] According to one embodiment, a first layer (541) may be disposed on one side of the back glass (510). A second layer (542) may be disposed below the first layer (541). For example, the patch antenna (224) of FIG. 7a may be implemented based on an electromagnetic coupling feeding method. Accordingly, a third layer (543) may be implemented to be spaced apart from the second layer (542). The third layer (543) may be connected to, for example, a 6G communication RF signal line to receive power. The third layer (543) may be fed to at least one of the spaced-apart layers (541, 542) based on an electromagnetic coupling feeding method, and thus electromagnetic waves may be radiated from the first layer (541).

[0105] FIG. 7b is a cross-sectional view illustrating a patch antenna according to various embodiments.

[0106] According to one embodiment, a first layer (541) may be disposed on one side of the back glass (510). A second layer (542) may be disposed below the first layer (541). For example, the patch antenna of FIG. 7a may be implemented based on an electromagnetic coupling feed method. Accordingly, the third layer (543) may be implemented to be spaced apart from the second layer (542). In FIG. 7b, the size of the second layer (542) may be implemented to be relatively smaller than that of the third layer (543). For example, at the edge region of the third layer (543), the electric field may be formed in a curved direction rather than a vertical direction of the third layer (543) due to the fringing effect, and accordingly, the size of the second layer (542) may be implemented to be relatively smaller.

[0107] FIG. 8 is a drawing for illustrating the arrangement of examples of patch antennas according to various embodiments.

[0108] For example, as described with reference to FIG. 5c, the patch antenna (224, 225) may be placed on the first ground layer (310) of the FPCB (220). In this case, the FPCB (220) in FIG. 8 may be implemented in a shape different from the FPCB (220) in FIG. 2b. For example, in the case of FIG. 2b, the patch antenna (224) may be placed on the second-2 sub-region (320b) or the third-2 sub-region (330b) as in FIG. 4a or FIG. 4b, and accordingly, sub-regions (320a, 330a) on which the intermediate frequency signal line and the 6G communication RF signal line are placed are required. However, in FIG. 8, as the patch antenna (224, 225) is placed on the first ground layer (310), the second-second sub-region (320b) or the third-second sub-region (330b) as in FIG. 4a or FIG. 4b may not be required. Accordingly, the width of the FPCB (220) in FIG. 8 may be relatively smaller than the width of the FPCB (220) in FIG. 2b. However, as described with reference to FIG. 5c, as the patch antenna (224) is placed between the first ground layer (310) and the back glass (510), the thickness of the patch antenna (224) may be set to be relatively small. Those skilled in the art will understand that the thickness of the patch antenna (224) and the width of the FPCB (220) may have a trade-off relationship, and depending on the arrangement of the elements within the electronic device (101), the arrangement of FIG. 2b or the arrangement of FIG. 8 may be selectively used.

[0109] FIG. 9 is a drawing for explaining the configuration of an example of an electronic device according to various embodiments.

[0110] According to one embodiment, a switch (281) may be connected to an IF / RFIC module (213) placed on a PCB (210). In a first state, the switch (281) may electrically connect the IF / RFIC module (213) to an intermediate frequency signal line (221). In a second state, the switch (281) may connect the IF / RFIC module (213) to an RFFE (217) for 6G communication. For example, while 5G communication is being performed, a modem (211) (not limited to) may control the switch (281) to a first state, thereby allowing the IF / RFIC module (213) to be connected to the intermediate frequency signal line (221). While the switch (281) is in a first state, an intermediate frequency signal for 5G communication provided, for example, from an IF / RFIC module (213) may be provided to a mmWave antenna module (230) via an intermediate frequency signal line (221). While the switch (281) is in a first state, an intermediate frequency signal for reception provided, for example, from a mmWave antenna module (230) may be provided to an IF / RFIC module (213) via an intermediate frequency signal line (221). For example, while 6G communication is being performed, the modem (211) (not limited to) may control the switch (281) to a second state, so that the IF / RFIC module (213) may be electrically connected to the RFFE (217). While the switch (281) is in the second state, for example, an RF signal for 6G communication provided from the IF / RFIC module (213) can be provided to the REEF (217). While the switch (281) is in the second state, a receiving RF signal provided from the REEF (217) can be provided to the IF / RFIC module (213).

[0111] FIG. 10 is a block diagram illustrating the configuration of an example of an electronic device according to various embodiments.

[0112] According to one embodiment, an intermediate frequency signal line (221) may be connected to the RFFE (217), and the intermediate frequency signal line (221) may be connected to a mmWave antenna module (230) and a patch antenna (224) for 6G communication. For example, while 5G communication is being performed, an intermediate frequency signal provided from the IF / RFIC module (213) may be provided to the RFFE (217). In this case, the RFFE (217) may provide an intermediate frequency signal for 5G communication to the intermediate frequency signal line (221) without performing any processing on the intermediate frequency signal for 5G communication. For example, the RFFE (217) may include a bypass path that prevents processing including amplification and / or phase shifting, and may provide an intermediate frequency signal for 5G communication to the intermediate frequency signal line (221) through the bypass path under the control of, for example, the modem (211). The bypass path of the RFFE (217) is exemplary, and those skilled in the art will understand that there are no limitations to the implementation in which the RFFE (217) provides an intermediate frequency signal for 5G communication without performing any processing. The intermediate frequency signal may be provided to the patch antenna (224) and the mmWave antenna module (230). For example, since the intermediate frequency signal is amplified, for example, by a driving amplifier but not by a PA, the magnitude of the electromagnetic wave radiated by the patch antenna (224) may be relatively smaller than the magnitude of the electromagnetic wave radiated by the antenna for 5G communication after being amplified by the mmWave antenna module (230), and accordingly, the degree of interference may be relatively small. For example, during 6G communication, the RF signal for 6G communication provided from the IF / RFIC module (213) may be provided to the RFFE (217).RFFE (217) can perform phase shifting for amplification and / or beam-forming of the RF signal and provide the processing result to the intermediate frequency signal line (221) and RF signal line (223). The RF signal can be provided to a patch antenna (224) and a mmWave antenna module (230) for 6G communication via the intermediate frequency signal line (221). The patch antenna (224) can radiate electromagnetic waves based on the provided RF signal. The operation of the mmWave antenna module (230) can be controlled, for example, by a modem (211) (without limitation). The modem (211) can control the mmWave antenna module (230) so that it does not process the input signal while the RF signal for 6G communication is provided, thereby controlling it so that only electromagnetic waves for 6G communication are radiated.

[0113] FIG. 11 is a block diagram illustrating an exemplary configuration of an electronic device according to various embodiments.

[0114] According to one embodiment, a plurality of intermediate frequency signal lines (221x, 221y) may be connected between the IF conversion circuit (214) of the IF / RFIC module (213) and the switch (283). Intermediate frequency signals for, for example, polarization diversity may be provided through the plurality of intermediate frequency signal lines (221x, 221y), but are not limited thereto. The switch (283) may connect the intermediate frequency signal lines (221x, 221y) to the mmWave RFIC (285) in a first state. The switch (283) may be controlled to the first state while 5G communication is being performed. Each of the plurality of intermediate frequency signals provided through the intermediate frequency signal lines (221x, 221y) may be converted into each of the plurality of RF signals for 5G communication by the mmWave RFIC (285). Although omitted in FIG. 11 for convenience of explanation, those skilled in the art will understand that amplification and / or phase shifting may be performed on multiple RF signals for 5G communication. In a second state, the switch (283) may connect intermediate frequency signal lines (221x, 221y) to an RFFE (284) for 6G communication. The switch (283) may be controlled to a second state while 6G communication is being performed. Multiple 6G communication RF signals provided through the intermediate frequency signal lines (221x, 221y) may be provided to the RFFE (284). By the RFFE (284), multiple 6G communication RF signals may be amplified and / or phase-shifted and provided to the patch antenna (224). Elements for amplifying and / or phase shifting 6G communication RF signals and elements for amplifying and / or phase shifting 5G communication RF signals may be included in the first mmWave antenna module (231), but this is exemplary.Those skilled in the art will understand that at least some of the elements for amplifying and / or phase-shifting 6G communication RF signals may be implemented to be used for amplifying and / or phase-shifting 5G communication RF signals. In a first state, the switch (282) may provide intermediate frequency signals for 5G communication to the second mmWave antenna module (232). While 5G communication is in use, the switch (282) may be controlled to the first state. Intermediate frequency signals for 5G communication may be converted into RF signals, amplified, and / or phase-shifted by the second mmWave antenna module (232). In a second state, the switch (282) may provide RF signals for 6G communication to the RFFE (217) for 6G communication. While 6G communication is in use, the switch (282) may be controlled to the second state. RF signals for 6G communication can be amplified and / or phase-shifted by RFFE (217) and provided to a patch antenna (225) through a plurality of 6G communication RF signal lines (223x, 223y). As described above, polarization diversity for 5G communication and / or polarization diversity for 6G communication can be implemented.

[0115] The electronic device (101) may include at least one modem (211).

[0116] The electronic device (101) may include an IF conversion circuit (214) configured to convert a 5G communication baseband signal from at least one modem (211) into an intermediate frequency signal.

[0117] The electronic device (101) may include a 5G antenna module (230) configured to convert the intermediate frequency signal into a 5G communication RF signal.

[0118] The electronic device (101) may include an RFIC (215) configured to convert a 6G communication baseband signal from at least one modem (211) into a 6G communication RF signal.

[0119] The above electronic device (101) may include an FPCB (220).

[0120] The above FPCB (220) may include an intermediate frequency signal line (221) for providing the intermediate frequency signal to the 5G antenna module (230), and a 6G communication RF signal line (222, 223) for providing the 6G communication RF signal to at least one of the 6G antennas.

[0121] At least one of the above 6G antennas can be placed on the above FPCB (220).

[0122] The above 5G antenna module (230) can be configured to amplify the converted 5G communication RF signal and provide the amplified 5G communication RF signal as an antenna for 5G communication.

[0123] The electronic device (101) may further include an RFFE (217) configured to amplify the 6G communication RF signal and provide the amplified 6G communication RF signal to 6G communication RF signal lines (222, 223).

[0124] The above FPCB (220) may have a dielectric constant included in the first range.

[0125] The loss rate of the 6G communication RF signal at the permittivity of the first range and the loss rate of the intermediate frequency signal at the permittivity of the first range may be less than or equal to a specified loss rate.

[0126] The above FPCB (220) may include a first ground layer.

[0127] The above FPCB (220) may include a signal line layer disposed below the first ground layer.

[0128] The above FPCB (220) may include a second ground layer disposed below the signal line layer.

[0129] The above intermediate frequency signal line (221) and the above 6G signal line can be placed in the signal line layer.

[0130] The electronic device (101) may further include a plurality of ground vias connecting the first ground layer, the signal line layer, and the second ground layer.

[0131] A first group of the plurality of ground vias may be placed on the first side with respect to the intermediate frequency signal line (221).

[0132] The second group of the plurality of ground vias may be placed on the second side opposite to the first side with respect to the intermediate frequency signal line (221).

[0133] The second group above may be placed on the first side based on the 6G communication RF signal line (222, 223).

[0134] The third group of the plurality of ground vias can be placed on the second side based on the 6G communication RF signal line (222, 223).

[0135] The first ground layer may be placed on a portion of the signal line layer.

[0136] An antenna (224, 225) for 6G communication may be placed on the remaining area excluding the portion of the signal line mentioned above.

[0137] The signal line layer may include a first sub-region in which a portion of the intermediate frequency signal line (221) and the 6G communication RF signal lines (222, 223) are arranged, and a second sub-region in which an antenna (224, 225) for the 6G communication is arranged.

[0138] The above-mentioned partial region is included in the first sub-region, and the above-mentioned partial region may not be included in the second sub-region.

[0139] The above remaining area is not included in the above first sub-area, and the above remaining area may be included in the above second sub-area.

[0140] The first ground layer may be placed on a portion of the signal line layer.

[0141] An antenna (224, 225) for 6G communication may be placed on a portion of the second ground layer that is positioned below the remaining portion excluding the portion of the signal line.

[0142] The second ground layer may include a first sub-region positioned below a portion of the intermediate frequency signal line (221) and the 6G communication RF signal lines (222, 223), and a second sub-region where the antenna (224, 225) for the 6G communication is positioned.

[0143] The above-mentioned portion of the second ground layer may not be included in the first sub-region.

[0144] The above-mentioned portion of the second ground layer may be included in the above-mentioned second sub-region.

[0145] An antenna (224, 225) for 6G communication may be placed on the first ground layer.

[0146] The first ground layer can be placed on the back glass of the electronic device (101).

[0147] The above signal line layer may be spaced apart from the first ground.

[0148] The antenna (224, 225) for the above 6G communication can be placed in the fill-cut area of ​​the FBCB.

[0149] At least two of the plurality of layers included in the antenna (224, 225) for the 6G communication can be joined through the fill-cut area of ​​the FPCB (220).

[0150] The antenna (224, 225) for the above 6G communication can be placed on the battery of the electronic device (101).

[0151] The above intermediate frequency signal line (221) can directly connect the IF conversion circuit (214) and the 5G antenna module (230).

[0152] The above 6G communication RF signal lines (222, 223) can directly connect the RFFE (217) and the antennas (224, 225) for 6G communication.

[0153] The electronic device (101) may further include a switch connected to the IF conversion circuit (214) and the RFIC (215) for 6G communication.

[0154] The switch can be operated to connect the IF conversion circuit (214) to the intermediate frequency signal line (221) in a first state, and can be operated to connect the RFIC (215) to the RFFE (217) in a second state different from the first state.

[0155] An FPCB (220) may be provided.

[0156] The above FPCB (220) may include a first ground layer.

[0157] The above FPCB (220) may include a signal line layer disposed below the first ground layer.

[0158] The above FPCB (220) may include a second ground layer disposed below the signal line layer.

[0159] The above FPCB (220) may include an intermediate frequency signal line (221) for providing an intermediate frequency signal of 5G communication.

[0160] The above FPCB (220) may include 6G communication RF signal lines (222, 223) for 6G communication RF signals.

[0161] The above FPCB (220) may include an antenna (224, 225) for the 6G communication.

[0162] The above intermediate frequency signal line (221) and the above 6G communication RF signal line (222, 223) can be placed in the signal line layer.

[0163] The above FPCB (220) may have a dielectric constant included in the first range.

[0164] The loss rate of the 6G communication RF signal at the permittivity of the first range and the loss rate of the intermediate frequency signal at the permittivity of the first range may be less than or equal to a specified loss rate.

[0165] The above FPCB (220) may further include a plurality of ground vias connecting the first ground layer, the signal line layer, and the second ground layer.

[0166] A first group of the plurality of ground vias may be placed on the first side with respect to the intermediate frequency signal line (221).

[0167] The second group of the plurality of ground vias may be placed on the second side opposite to the first side with respect to the intermediate frequency signal line (221).

[0168] The second group above may be placed on the first side based on the 6G communication RF signal line (222, 223).

[0169] The third group of the plurality of ground vias can be placed on the second side based on the 6G communication RF signal line (222, 223).

[0170] The first ground layer may be placed on a portion of the signal line layer.

[0171] An antenna (224, 225) for 6G communication may be placed on the remaining area excluding the portion of the signal line mentioned above.

[0172] The first ground layer may be placed on a portion of the signal line layer.

[0173] An antenna (224, 225) for 6G communication may be placed on a portion of the second ground layer that is positioned below the remaining portion excluding the portion of the signal line.

[0174] An antenna (224, 225) for 6G communication may be placed on the first ground layer.

[0175] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0176] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0177] As used in the various embodiments of this document, the term “module” may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0178] One embodiment of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0179] According to one embodiment, the method according to the embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0180] According to one embodiment, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to one embodiment, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the components of the multiple components in the same or similar manner as those performed by the corresponding components among the multiple components prior to integration. According to one embodiment, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0181] Although this specification has been described and illustrated with reference to various embodiments, it should be understood that these various embodiments are illustrative and not limiting. Furthermore, those skilled in the art will understand that various modifications, substitutions, and variations are possible with respect to the various embodiments disclosed in this specification, provided that they do not depart from the technical spirit of the invention and the true technical scope of the claims and equivalents. It will also be understood that any one embodiment described in this specification may be used in combination with other embodiments.

Claims

1. In an electronic device (101), At least one modem (211); An IF conversion circuit (214) configured to convert a 5G communication baseband signal from at least one modem (211) into an intermediate frequency signal; A 5G antenna module (230) including a circuit configured to convert the above intermediate frequency signal into a 5G communication RF signal; An RFIC (215) configured to convert a 6G communication baseband signal from at least one modem (211) into a 6G communication RF signal; and FPCB(220); Includes, The above FPCB (220) includes an intermediate frequency signal line (221) for providing the intermediate frequency signal to the 5G antenna module (230), and a 6G communication RF signal line (222, 223) for providing the 6G communication RF signal to at least one of the 6G antennas. At least one of the above 6G antennas is an electronic device (101) placed on the above FPCB (220).

2. In Paragraph 1, The above 5G antenna module (230) is an electronic device (101) configured to amplify the converted 5G communication RF signal and provide the amplified 5G communication RF signal as an antenna for 5G communication.

3. In any one of paragraphs 1 to 2, RFFE (217) including a circuit configured to amplify the above 6G communication RF signal and provide the amplified 6G communication RF signal to 6G communication RF signal lines (222, 223); An electronic device (101) further comprising 4. In any one of paragraphs 1 to 3, The above FPCB (220) has a dielectric constant included in the first range, and The loss rate of the 6G communication RF signal at the permittivity of the first range and the loss rate of the intermediate frequency signal at the permittivity of the first range are less than or equal to the specified loss rate in an electronic device (101).

5. In any one of paragraphs 1 to 4, The above FPCB (220) is: First ground layer; A signal line layer disposed below the first ground layer; and A second ground layer disposed below the above signal line layer Includes, The above intermediate frequency signal line (221) and the above 6G signal line are electronic devices (101) placed in the signal line layer.

6. In any one of paragraphs 1 through 5, A plurality of ground vias connecting the first ground layer, the signal line layer, and the second ground layer; An electronic device (101) further comprising 7. In any one of paragraphs 1 through 6, A first group of the plurality of ground vias is positioned on the first side with respect to the intermediate frequency signal line (221), and The second group of the plurality of ground vias is positioned on the second side opposite to the first side with respect to the intermediate frequency signal line (221), and The second group is positioned on the first side based on the 6G communication RF signal line (222, 223), and The third group of the plurality of ground vias is an electronic device (101) positioned on the second side based on the 6G communication RF signal line (222, 223).

8. In any one of paragraphs 1 through 7, The electronic device (101) wherein the first ground layer is disposed on a portion of the signal line layer, and the antenna (224, 225) for 6G communication is disposed on the remaining portion of the signal line excluding the portion of the signal line.

9. In any one of paragraphs 1 through 8, The above signal line layer is: A first sub-region in which a portion of the intermediate frequency signal line (221) and the 6G communication RF signal lines (222, 223) are arranged; and It includes a second sub-region where the antenna (224, 225) for the above 6G communication is disposed, The above partial region is included in the first sub-region, and the above partial region is not included in the second sub-region, and The above remaining area is not included in the first sub-area, and the above remaining area is an electronic device (101) included in the second sub-area.

10. In any one of paragraphs 1 through 9, An electronic device (101) wherein the first ground layer is positioned over a portion of the signal line layer, and the antenna (224, 225) for 6G communication is positioned over a portion of the second ground layer positioned below the remaining portion excluding the portion of the signal line.

11. In any one of paragraphs 1 through 10, The above second ground layer is: A first sub-region positioned below a portion of the intermediate frequency signal line (221) and the 6G communication RF signal lines (222, 223); and It includes a second sub-region where the antenna (224, 225) for the above 6G communication is disposed, The electronic device (101) wherein the portion of the second ground layer is not included in the first sub-region, and the portion of the second ground layer is included in the second sub-region.

12. In any one of paragraphs 1 to 11, An electronic device (101) having an antenna (224, 225) for 6G communication disposed on the first ground layer.

13. In any one of paragraphs 1 through 12, The first ground layer is disposed on the back glass of the electronic device (101), and The above signal line layer is an electronic device (101) spaced apart from the first ground.

14. In any one of paragraphs 1 through 13, The antenna (224, 225) for the above 6G communication is placed in the fill-cut area of ​​the FBCB, and At least two of the plurality of layers included in the antenna (224, 225) for the 6G communication are joined through the fill-cut region of the FPCB (220), and The antenna (224, 225) for the above 6G communication is an electronic device (101) placed on the battery of the electronic device (101).

15. In any one of paragraphs 1 through 14, The above intermediate frequency signal line (221) directly connects the IF conversion circuit (214) and the 5G antenna module (230), and The above 6G communication RF signal lines (222, 223) are electronic devices (101) that directly connect the RFFE (217) and the antennas (224, 225) for 6G communication.

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