Electronic device including camera cover for forming electrostatic discharge path

Abstract

Provided is an electronic device comprising: a non-conductive rear cover including a first surface defining at least a portion of the outer rear surface thereof and a second surface opposite to the first surface, and defining an opening; a non-conductive camera cover covering the opening of the non-conductive rear cover and including a light-transmitting portion; a camera disposed under the light-transmitting portion of the non-conductive camera cover and aligned with the light-transmitting portion of the non-conductive camera cover; a conductive ring attached to the first surface of the non-conductive rear cover and surrounding the non-conductive camera cover; and a conductive frame configured to secure the non-conductive camera cover to the non-conductive rear cover, at least partially overlapping the conductive ring, and spaced apart from the conductive ring, wherein the conductive frame connects the conductive ring to the ground of the electronic device through electrical coupling between the conductive ring and the conductive frame spaced apart from the conductive ring.

Description

Electronic device including a camera cover for forming an electrostatic discharge path

[0001] The present disclosure relates to an electronic device comprising a camera cover for forming an electrostatic discharge path.

[0002] An electronic device, such as a smartphone, may include a camera and a camera cover (e.g., a camera decorative member) for protecting the camera. Meanwhile, due to electrostatic discharge (ESD), a component (e.g., the camera) or circuit inside the electronic device may malfunction or be damaged.

[0003] The above information may be provided as background technical information for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in connection with the present disclosure.

[0004] The aspects of the present disclosure are to solve at least the problems and / or disadvantages mentioned above and to provide at least the advantages described below. Accordingly, the aspects of the present disclosure provide an electronic device comprising a camera cover for forming an ESD discharge path.

[0005] Additional aspects will be partially explained in the following description, partially apparent from the description, or can be learned by practicing the presented embodiments.

[0006] According to one aspect of the present disclosure, an electronic device is provided. The electronic device comprises: a non-conductive rear cover that defines an opening, comprising a first surface defining at least a portion of the outer rear surface of the electronic device and a second surface opposite to the first surface; a non-conductive camera cover that covers the opening of the non-conductive rear cover and includes a light-transmitting portion; a camera disposed below the light-transmitting portion of the non-conductive camera cover and aligned with the light-transmitting portion of the non-conductive camera cover; a conductive ring attached to the first surface of the non-conductive rear cover and surrounding the non-conductive camera cover; and a conductive frame configured to secure the non-conductive camera cover to the non-conductive rear cover, at least partially overlapping the conductive ring, and spaced apart from the conductive ring, wherein the conductive frame is electrically connected to the ground of the electronic device such that the conductive ring is connected to the ground of the electronic device through electrical coupling with the conductive frame spaced apart from the conductive ring.

[0007] According to another aspect of the present disclosure, an electronic device is disclosed. The electronic device comprises: a non-conductive rear cover defining an opening, comprising a first surface defining at least a portion of the rear outer surface of the electronic device and a second surface opposite to the first surface; a non-conductive camera cover attached to the first surface of the non-conductive rear cover to cover the opening of the non-conductive rear cover and comprising a light-transmitting portion; a camera disposed below the light-transmitting portion of the non-conductive camera cover and configured to receive light through the light-transmitting portion of the non-conductive camera cover; a conductive protective member disposed on the first surface of the non-conductive rear cover and surrounding the periphery of the non-conductive camera cover; a conductive frame attached to the second surface of the non-conductive rear cover to overlap at least partially with the conductive protective member; and a non-conductive plate disposed below the conductive frame. and includes a conductive pattern formed on the non-conductive plate, spaced apart from the conductive frame, and at least partially overlapping the conductive frame, wherein the conductive protective member comprises: a conductive frame spaced apart from the conductive protective member and electrically coupled to the conductive protective member; and electrically connected to the ground of the electronic device through the conductive pattern spaced apart from the conductive frame and electrically coupled to the conductive frame.

[0008] Other aspects, advantages, and important features of this disclosure will become apparent to those skilled in the art from the following detailed description disclosing various embodiments of this disclosure together with the accompanying drawings.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0010] FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment.

[0011] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0012] FIGS. 3 and FIGS. 4 are drawings showing the rear side of an electronic device according to one embodiment.

[0013] FIGS. 5 and 6 are exploded perspective views of an electronic device according to one embodiment.

[0014] FIG. 7 is a transparency showing a camera area of ​​an electronic device according to one embodiment.

[0015] FIG. 8 shows a coupling structure between a camera cover and a conductive frame according to one embodiment.

[0016] FIG. 9 is a cross-sectional view of an electronic device according to one embodiment.

[0017] FIG. 10 is a plan view of an electronic device according to one embodiment.

[0018] FIG. 11 is a block diagram showing an ESD discharge path of an electronic device according to one embodiment.

[0019] Figure 12 is a block diagram showing the ESD discharge path of an electronic device according to a comparative example.

[0020] Figure 13 is a cross-sectional view of an electronic device according to a comparative example.

[0021] FIG. 14 is a block diagram of an electronic device according to one embodiment.

[0022] FIG. 15 is a block diagram of an electronic device according to one embodiment.

[0023] It should be noted that the same reference numbers are used throughout the drawing to depict identical or similar elements, features, and structures.

[0024] With reference to the accompanying drawings, the following description is provided to facilitate a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents. While this description includes various specific details to aid such understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0025] The terms and words used in the following description and claims are not limited to their bibliographic meanings and are intended merely to enable the inventor to understand the present disclosure clearly and consistently. Accordingly, it will be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0026] The singular forms "a," "an," and "the" should be understood to include the plural form unless the context clearly indicates otherwise. Thus, for example, a reference to "component surfaces" includes a reference to one or more such surfaces.

[0027] It must be understood that the blocks of each flowchart and combinations of flowcharts can be executed by one or more computer programs containing instructions. One or more computer programs as a whole may be stored in a single memory device, or one or more computer programs may be divided into multiple parts and stored in multiple memory devices.

[0028] The functions or operations described in this disclosure may be processed by a single processor or a combination of processors. A single processor or a combination of processors is a circuit that performs processing and includes circuits such as an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a wireless fidelity (Wi-Fi) chip, a Bluetooth® chip, a global positioning system (GPS) chip, a nearfield communication (NFC) chip, a connectivity chip, a sensor controller, a touch controller, a fingerprint sensor controller, a display driver integrated circuit (IC), an audio codec chip, a universal serial bus (USB) controller, a camera controller, an image processing IC, a microprocessor unit (MPU), a system on chip (SoC), an IC, etc.

[0029] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0030] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0031] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0032] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0033] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0034] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0035] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0036] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0037] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0038] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0039] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0041] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0043] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0045] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0046] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5th generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0047] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4th generation (4G) network, for example, new radio access technology. The NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave (millimeter wave) band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0048] The antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). The signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0049] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0050] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0051] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more external electronic devices, such as the external electronic devices (102 or 104) or the server (108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0052] FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment.

[0053] Referring to FIG. 2a, an electronic device (200) according to one embodiment may include a housing (210) that forms at least partially the exterior of the electronic device (200). For example, the housing (210) may include a first surface (or front) (200A), a second surface (or rear) (200B), and a third surface (or side) (200C) that surrounds the space between the first surface (200A) and the second surface (200B). In one embodiment, the housing (210) may refer to a structure that forms at least some of the first surface (200A), the second surface (200B), and / or the third surface (200C).

[0054] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, for example, a glass plate or a polymer plate including various coating layers, but is not limited thereto.

[0055] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of a second surface (200B). In one embodiment, the back plate (211) may be formed of a non-conductive material. For example, the back plate (211) may be formed by coated or colored glass, ceramic, polymer, or a combination of at least two of the materials.

[0056] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0057] In one embodiment, the side bezel structure (218) may comprise a metal and / or a polymer. In one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the rear plate (211) and the side bezel structure (218) may be formed as separate components and / or may comprise different materials.

[0058] In one embodiment, the electronic device (200) may include a display (201) (e.g., display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., key input device (217) or light-emitting element (not shown)) or additionally include other components.

[0059] In one embodiment, the display (201) may be visually exposed through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first surface (200A). The display (201) may be positioned on the back surface of the front plate (202).

[0060] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is shown to be located on the inner side of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of the edge of the screen display area (201A) may substantially coincide with the edge of the first surface (200A) (or the front plate (202)).

[0061] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being overlapped with the screen display area (201A). For example, the sensing area (201B) may refer to an area that can display visual information by the display (201) just like other areas of the screen display area (201A), and additionally acquire the user's biometric information (e.g., fingerprint). Although the sensing area (201B) is depicted as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may be formed in the key input device (217).

[0062] In one embodiment, the display (201) may include an area where a first camera module (205) is located. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch-hole camera) may be placed at least partially within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of the edge of the opening. In one embodiment, the first camera module (205) (e.g., an under-display camera (UDC)) may be placed below the display (201) so as to overlap with the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to the direction toward the first surface (200A) through the area of ​​the display (201).

[0063] In one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0064] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0065] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part of the third surface (200C) and a second microphone hole (204) formed in a part of the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0066] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, it is not limited thereto.

[0067] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) is integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the illustration in FIG. 2a, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by the spaced-apart space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0068] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., the acoustic output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole for calls (not shown).

[0069] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0070] In one embodiment, the camera module (205, 212, 213) may include a first camera module (205) positioned to face a first surface (200A) of the electronic device (200), a second camera module (212) positioned to face a second surface (200B), and a flash (213).

[0071] In one embodiment, the second camera module (212) may include one or more camera modules. The one or more camera modules may each include one or more cameras.

[0072] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0073] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (200).

[0074] In one embodiment, the key input device (217) may be placed on a third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0075] In one embodiment, a connector hole (208) may be formed on a third surface (200C) of the electronic device (200) so as to accommodate a connector of an external device. A connection terminal (e.g., connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0076] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide state information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0077] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0078] Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240) (e.g., side bezel structure (218) of FIG. 2a), a first printed circuit board (280), a second printed circuit board (282), a non-conductive plate (250), and a battery (270) (e.g., battery (189) of FIG. 1).

[0079] In one embodiment, the frame structure (or frame) (240) may be positioned between the display (201) and the rear plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be placed on one side of the frame structure (240) facing in one direction (e.g., +Z direction). For example, the frame structure (240) may support the front plate (202) to which the display (201) is attached. On the other side of the frame structure (240) facing in the opposite direction (e.g., -Z direction) to the one direction, the first printed circuit board (280), the second printed circuit board (282), the battery (270), and the second camera module (212) may be placed. The first printed circuit board (280), the second printed circuit board (282), the battery (270), and the second camera module (212) can be placed within a recess formed in the frame structure (240).

[0080] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround the space between the rear plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side of the electronic device (200) (e.g., the third side (200C) in FIG. 2a), and the second part (243) located within the space may extend inward from the first part (241). The second part (243) may be located below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and / or the second part (243) may be formed of metal and / or polymer. For example, the first part (241) and the second part (243) may be formed integrally, though not limited thereto. For example, the metal portion of the first part (241) may be formed integrally with the metal portion of the second part (243). For example, the polymer portion of the first part (241) may be formed integrally with the polymer portion of the second part (243).

[0081] The frame structure (240) (or the first part (241) of the frame structure (240)) may be referred to as a lateral member or lateral structure in that it forms the side of the electronic device (200). The frame structure (240) (or the second part (243) of the frame structure (240)) may be referred to as a support member, support structure, or bracket in that it supports various parts of the electronic device (200).

[0082] In one embodiment, the first printed circuit board (280), the second printed circuit board (282), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (280) and the second printed circuit board (282) may be fixedly positioned to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, it is not limited to the examples described above.

[0083] In one embodiment, the display (201) may be positioned between the frame structure (240) and the front plate (202). For example, the front plate (202) may be positioned on one side (e.g., +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., -Z direction).

[0084] In one embodiment, the front plate (202) may be coupled to the display (201). For example, the display (201) may be attached to the back surface of the front plate (202) via an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR). In that the front plate (202) is coupled to the display (201), the front plate (202) may be described as being included in the display (201).

[0085] In one embodiment, the front plate (202) may be combined with a frame structure (240). For example, the front plate (202) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be attached to the frame structure (240) (e.g., the first part (241)).

[0086] In one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (280) and / or the second printed circuit board (282). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector. In one embodiment, the first printed circuit board (280) and the second printed circuit board (282) may be operatively or electrically connected to each other through a connecting member (e.g., a flexible printed circuit board).

[0087] In one embodiment, the battery (270) can supply power to at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0088] In one embodiment, the first camera module (205) (e.g., front camera) may be placed in at least a part (e.g., second part (243)) of the frame structure (240) so that the lens can receive external light through a part area (e.g., camera area (237)) of the front plate (202) (e.g., first surface (200A) of FIG. 2a).

[0089] In one embodiment, a second camera module (212) (e.g., rear camera) may be positioned between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (280) through a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be positioned so that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0090] In one embodiment, the camera area (284) may be formed on the surface of the rear plate (211) (e.g., the second surface (200B) of FIG. 2a). In one embodiment, the camera area (284) may be formed at least partially transparent so that external light can be incident on the lens of the second camera module (212). The camera area (284) may be defined (or formed) by a camera decorative member (hereinafter referred to as camera deco) (e.g., camera deco (301) of FIG. 3a) to be described later.

[0091] In one embodiment, the housing (210) of the electronic device (200) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (200). In other words, the housing (210) may include at least a part of a front plate (202), a frame structure (240), and / or a rear plate (211) that form the exterior of the electronic device (200).

[0092] In one embodiment, a non-conductive plate (250) (hereinafter, plate (250)) may be positioned below the rear plate (211) (e.g., in the +Z direction). For example, the plate (250) may be positioned between the rear plate (211) and the first printed circuit board (280). In one embodiment, the plate (250) may cover at least a portion of the first printed circuit board (280). The plate (250) may protect the first printed circuit board (280) and the components mounted thereon. In one embodiment, the plate (250) may be formed of a non-conductive material (e.g., plastic). A conductive pattern (e.g., the conductive pattern (360) of FIG. 5) may be formed on the plate (250).

[0093] In FIG. 2a and FIG. 2b, a bar-type electronic device (200) is illustrated, but the shape or form factor of the electronic device (200) is not limited by the illustrated example.

[0094] For example, the housing of the electronic device (200) may be formed to be deformable. For example, the electronic device (200) may further include a second housing that is movably coupled to a first housing (e.g., the first housing (210)) (e.g., linear movement and / or rotation). For example, the second housing may be configured to be rotatable relative to the first housing via a hinge mechanism (or hinge structure). By the rotational movement of the second housing relative to the first housing, the first housing and the second housing may be folded or unfolded. In this case, the display (201) of the electronic device (200) may be positioned across the first housing (210) and the second housing. Additionally, the display (201) of the electronic device (200) may include a flexible display configured to be deformable according to the folding movement of the first housing and the second housing.

[0095] Additionally, the electronic device (200) may further include a third housing movably coupled to a first housing or the second housing. For example, the third housing may be rotatably coupled to the first housing (e.g., on the opposite side of the second housing) via a hinge mechanism (or hinge structure). As another example, the third housing may be rotatably coupled to the second housing via a hinge mechanism (or hinge structure). As described above, the electronic device (200) comprising a plurality of mutually movably coupled housings may be referred to as a foldable electronic device or a multi-foldable electronic device.

[0096] FIGS. 3 and FIGS. 4 are drawings showing the rear side of an electronic device according to one embodiment.

[0097] Referring to FIGS. 3 and 4, according to one embodiment, an electronic device (300) (e.g., electronic device (200)) may include a non-conductive rear cover (310) (e.g., rear plate (211)), and a camera deco (301) disposed on the non-conductive rear cover (310).

[0098] In one embodiment, the non-conductive rear cover (310) (hereinafter, rear cover (310)) may be formed of a non-conductive material. For example, the rear cover (310) may be formed of plastic, glass, ceramic, or a combination thereof.

[0099] In one embodiment, the rear cover (310) may form at least a part of the housing (e.g., the housing (210) of FIG. 2a) or exterior of the electronic device (300). For example, the rear cover (310) may form (or define) at least a part of the outer rear surface (e.g., the second surface (200B)) of the electronic device (300).

[0100] In one embodiment, the rear cover (310) may include a first surface (310A) and a second surface (310B) opposite to the first surface (310A). The first surface (310A) may face the outside of the electronic device (300), and the second surface (310B) may face the inside of the electronic device (300). For example, the first surface (310A) of the rear cover (310) may form (or define) at least a portion of the outer rear surface of the electronic device (300).

[0101] In one embodiment, the rear cover (310) may include an opening (315). The opening (315) may penetrate the rear cover (310). For example, the opening (315) may extend from a first surface (310A) of the rear cover (310) to a second surface (310B).

[0102] In one embodiment, the camera deco (301) may include a non-conductive camera cover (320) and a conductive ring (330). The camera deco (301) may be described as a camera cover, a camera protective member, or a camera cover assembly. The non-conductive camera cover (320) may be described as a deco cover, a camera deco cover, a decoration cover, a decoration member, or a molded cover. The conductive ring (330) may be described as a protective member, a deco ring, a camera deco ring, a decoration ring, or a decoration member.

[0103] In one embodiment, the non-conductive camera cover (320) (hereinafter, camera cover (320)) may be formed of a non-conductive material. For example, the non-conductive camera cover (320) may be formed of glass, sapphire glass, plastic, or a combination thereof.

[0104] In one embodiment, the camera cover (320) may be placed on the rear cover (310). For example, the camera cover (320) may be placed on the first surface (310A) of the rear cover (310). For example, the camera cover (320) may be placed on the first surface (310A) of the rear cover (310) to cover the opening (315) of the rear cover (310). For example, the camera cover (320) may be attached to the first surface (310A) of the rear cover (310) (e.g., via an adhesive material such as double-sided tape).

[0105] For example, without limitation, the camera cover (320) may comprise a first part formed of a first non-conductive material (e.g., plastic) and a second part formed of a second non-conductive material (e.g., glass). For example, the first part of the camera cover (320) may be placed on the rear cover (310) to cover an opening (315) of the rear cover (310). For example, the second part of the camera cover (320) may define one or more window portions (e.g., window portions (322)) for cameras. The first part of the camera cover (320) may include one or more openings aligned with the one or more window portions of the second part of the camera cover (320). The second part of the camera cover (320) may be supported by the first part of the camera cover (320). For example, the second part of the camera cover (320) may be positioned on the first part of the camera cover (320) to cover the one or more openings of the first part of the camera cover (320), or may be positioned within the one or more openings of the first part of the camera cover (320).

[0106] In one embodiment, the conductive ring (330) may be placed on the first surface (310A) of the rear cover (310). For example, the conductive ring (330) may be placed on the first surface (310A) of the rear cover (310) to wrap around the edge of the camera cover (320). For example, the conductive ring (330) may wrap around all or part of the edge of the camera cover (320) (e.g., the first part and / or the second part of the camera cover (320)). In FIG. 3, a conductive ring (330) that wraps around the entire edge of the camera cover (320) is illustrated. The conductive ring (330) may be attached to the edge of the camera cover (320), for example (e.g., via an adhesive material such as double-sided tape). Additionally, the conductive ring (330) can be attached to the first surface (310A) of the rear cover (310) (e.g., via an adhesive material such as double-sided tape). Through the opening (335) of the conductive ring (330), a portion of the camera cover (320) can be seen (or exposed) from the outside of the electronic device (300).

[0107] In one embodiment, the conductive ring (330) may be formed from a conductive material. For example, the conductive ring (330) may be formed from metal. Accordingly, the rigidity of the camera deco (301) may be improved. The conductive ring (330) may form the exterior (e.g., the outer rear surface) of the electronic device (300) together with the first surface (310A) of the rear cover (310) and the camera cover (320). The conductive ring (330) formed from metal may provide the exterior of the electronic device (300) with visual characteristics unique to metal (e.g., texture, color, and reflective properties). Additionally, because the visual characteristics of the conductive ring (330) and the visual characteristics of the rear cover (310) and the camera cover (320) are different, a visual contrast effect may be provided to the exterior of the electronic device (300).

[0108] However, an electrostatic discharge (ESD) may occur due to the conductive ring (330) exposed on the exterior of the electronic device (300). Due to the ESD, components inside the electronic device (300) may malfunction or be damaged. For example, due to the ESD, cameras located under the camera deco (301) (e.g., one or more cameras (370) of FIG. 5) may be reset or damaged, and the shooting function of the electronic device (300) may be degraded.

[0109] Below, an ESD discharge structure of an electronic device (300) is described to solve the ESD problem that can be induced by a conductive ring (330).

[0110] FIGS. 5 and 6 are exploded perspective views of an electronic device according to one embodiment.

[0111] Referring to FIG. 5, according to one embodiment, an electronic device (300) may include one or more cameras (370) (e.g., camera module (180)), a printed circuit board (380) (e.g., a first printed circuit board (280)), and a conductive pattern (360).

[0112] Referring to FIGS. 5 and 6, according to one embodiment, an electronic device (300) may include a conductive frame (340) and a non-conductive plate (350) (e.g., plate (250)).

[0113] Referring to FIG. 5, in one embodiment, a printed circuit board (380) and one or more cameras (370) may be placed on a frame structure (240) (e.g., a second part (243)). For example, the printed circuit board (380) may be placed under a non-conductive plate (350) (e.g., in the +Z direction). For example, one or more cameras (370) may be placed under a camera cover (320) (e.g., in the +Z direction). One or more cameras (370) may be adjacent to the edge of the printed circuit board (380).

[0114] In one embodiment, one or more cameras (370) may be oriented toward the rear direction (e.g., -Z direction) of the electronic device (300). For example, one or more cameras (370) may be configured to acquire an image corresponding to the rear direction of the electronic device (300) through a camera deco (301) (e.g., camera cover (320)).

[0115] In one embodiment, one or more cameras (370) may include a first camera (370-1). One or more cameras (370) may further include, for example, a second camera (370-2) and / or a third camera (370-3). For example, but not limited, the first camera (370-1), the second camera (370-2), and the third camera (370-3) may be arranged along one direction (e.g., the Y-axis direction). For example, but not limited, the first camera (370-1) may be positioned between the second camera (370-2) and the third camera (370-3). The first camera (370-1) may be the main camera (and / or primary camera) among the one or more cameras (370). For example, without limitation, the first camera (370-1) may include a wide-angle camera, the second camera (370-2) may include an ultra-wide-angle camera, and the third camera (370-3) may include a telephoto camera. In one embodiment, the first camera (370-1), the second camera (370-2), and the third camera (370-3) may each be included in distinct camera modules. Alternatively, the first camera (370-1), the second camera (370-2), and the third camera (370-3) may be included in a single camera module (e.g., the second camera module (212)).

[0116] In one embodiment, the camera cover (320) may include one or more window portions (322) (or one or more camera window portions (322)) for one or more cameras (370) and a region (324) (or portion (324)) surrounding one or more window portions (322). One or more window portions (322) may be formed to be substantially transparent, and the region (324) may be formed to be substantially opaque. One or more cameras (370) may be configured to receive light through one or more window portions (322) of the camera cover (320).

[0117] In one embodiment, one or more window portions (322) of the camera cover (320) may include a first window portion (322-1) corresponding to the first camera (370-1). For example, the first window portion (322-1) may be aligned with respect to the first camera (370-1). For example, the first window portion (322-1) may be positioned over the first camera (370-1) (e.g., in the -Z direction). For example, the first window portion (322-1) may be substantially centered on the optical axis of the first camera (370-1).

[0118] In one embodiment, one or more window portions (322) may further include a second window portion (322-2) corresponding to the second camera (370-2) and / or a third window portion (322-3) corresponding to the third camera (370-3). For example, the second window portion (322-2) may be aligned with respect to the second camera (370-2). For example, the second window portion (322-2) may be positioned over the second camera (370-2) (e.g., in the -Z direction). For example, the second window portion (322-2) may be substantially centered aligned with the optical axis of the second camera (370-2). For example, the third window portion (322-3) may be aligned with respect to the third camera (370-3). For example, the third window portion (322-3) may be positioned over the third camera (370-3) (e.g., in the -Z direction). For example, the third window portion (322-3) may be substantially centered on the optical axis of the third camera (370-3).

[0119] Referring to FIGS. 5 and 6, in one embodiment, the conductive frame (340) may be formed of a conductive material. For example, the conductive frame (340) may be formed of metal. For example, without limitation, the conductive frame (340) may be formed of stainless steel.

[0120] In one embodiment, the conductive frame (340) may be positioned between the rear cover (310) and the non-conductive plate (350). For example, the conductive frame (340) may be positioned below the rear cover (310) (e.g., in the +Z direction). For example, the conductive frame (340) may be positioned on the second surface (310B) of the rear cover (310). For example, the conductive frame (340) may be detached from the second surface (310B) of the rear cover (310). For example, the conductive frame (340) may not be attached to the second surface (310B) of the rear cover (310). Alternatively, the conductive frame (340) may be attached to the second surface (310B) of the rear cover (310) (e.g., via an adhesive material such as double-sided tape).

[0121] In one embodiment, the conductive frame (340) may be configured to secure the camera cover (320) to the rear cover (310). In one embodiment, the conductive frame (340) may be placed on a second surface (310B) of the rear cover (310) so as to overlap at least a portion of the conductive ring (330). For example, the conductive frame (340) may face the at least portion of the conductive ring (330) through the rear cover (310). For example, the conductive frame (340) and the at least portion of the conductive ring (330) may face each other with the rear cover (310) in between. Additionally, the conductive frame (340) may be coupled to the camera cover (320). For example, the conductive frame (340) may include one or more first parts (e.g., the first part (341) and / or the third part (343) of FIG. 7) disposed on the second surface (310B) of the rear cover (310), and one or more second parts (e.g., the second part (342) and / or the fourth part (344) of FIG. 7) extending from the one or more first parts across the opening (315) of the rear cover (310). The one or more first parts of the conductive frame (340) may overlap with the at least part of the conductive ring (330), and the one or more second parts of the conductive frame (340) may be coupled to the camera cover (320). The coupling structure of the conductive frame (340) and the camera cover (320) is described in detail with reference to FIG. 8.

[0122] In one embodiment, the conductive frame (340) and the conductive ring (330) can be electrically coupled by overlapping the conductive frame (340) with at least a portion of the conductive ring (330).

[0123] In the present disclosure, the first component and the second component being “electrically coupled” may mean being indirectly electrically connected. For example, the first component and the second component being “electrically coupled” may mean a state in which electrical signals or power can be mutually transmitted even if the first component and the second component are not directly connected through a conductor. For example, the first component and the second component being “electrically coupled” may mean a state in which electrical signals or power can be transmitted through an electric field with a dielectric material in between, that is, the first component and the second component may be capacitively coupled.

[0124] In one embodiment, the non-conductive plate (350) (hereinafter, plate (350)) may be formed of a non-conductive material (e.g., plastic). In one embodiment, the plate (350) may be placed below the conductive frame (340) (e.g., in the +Z direction). For example, referring to FIG. 5, the plate (350) may be placed between the conductive frame (340) and the printed circuit board (380). In one embodiment, the plate (350) may cover at least a portion of the printed circuit board (380) and may also include one or more openings (355) for one or more cameras (370). For example, the plate (350) may include a first portion covering (e.g., overlapping with the printed circuit board (380)) the printed circuit board (380) and a second portion extending outward from the first portion of the plate (350) toward the printed circuit board (380) (e.g., in the +X direction) and including one or more openings (355).

[0125] In one embodiment, one or more openings (355) of the plate (350) may include a first opening (355-1) that accommodates a first camera (370-1). For example, a portion of the first camera (370-1) may be placed within the first opening (355-1). The one or more openings (355) may further include a second opening (355-2) that accommodates a second camera (370-2) and / or a third opening (355-3) that accommodates a third camera (370-3). For example, a portion of the second camera (370-2) may be placed within the second opening (355-2). For example, a portion of the third camera (370-3) may be placed within the third opening (355-3).

[0126] In one embodiment, the plate (350) may include a first surface (350A) facing the conductive frame (340) (or rear cover (310)) (e.g., in the -Z direction). Additionally, the plate (350) may include a recessed area (350R) formed on the first surface (350A). For example, the recessed area (350R) may be formed along the periphery of the first opening (355-1) of the plate (350). For example, but not limited to, a portion of the recessed area (350R) may be formed between the first opening (355-1) and the second opening (355-2). For example, but not limited to, another portion of the recessed area (350R) may be formed between the first opening (355-1) and the third opening (355-3).

[0127] In one embodiment, a conductive pattern (360) may be formed on a plate (350). For example, the conductive pattern (360) may be formed on a first surface (350A) of the plate (350). For example, the conductive pattern (360) may be formed on a recessed area (350R) formed on the first surface (350A) of the plate (350). For example, the conductive pattern (360) may be formed on the plate (350) using laser direct structuring (LDS). In this respect, the conductive pattern (360) may be described as an LDS pattern.

[0128] In one embodiment, the conductive pattern (360) may overlap at least a portion of the conductive frame (340) and may be spaced apart from the conductive frame (340). A dielectric (e.g., air) may be placed between the conductive pattern (360) and the conductive frame (340). For example, the conductive pattern (360) may face the at least portion of the conductive frame (340) through the dielectric. By the conductive pattern (360) and the conductive frame (340) facing each other with the dielectric in between, the conductive pattern (360) may be electrically coupled to the conductive frame (340). Alternatively, the conductive pattern (360) may be electrically connected directly to the conductive frame (340) or electrically connected to the conductive frame (340) through another conductor.

[0129] In one embodiment, the conductive pattern (360) may be electrically connected to the ground of the electronic device (300). For example, the conductive pattern (360) may be electrically connected to a conductive region (e.g., conductive region (982) of FIG. 9) of a printed circuit board (380) that functions as at least part of the ground. An electrical connection structure associated with the conductive pattern (360) is described in detail with reference to FIG. 8.

[0130] In one embodiment, the conductive ring (330) may be electrically connected to the ground of the electronic device (300). For example, the conductive ring (330) may be electrically connected to the ground of the electronic device (300) through a conductive frame (340) electrically coupled to the conductive ring (330) and a conductive pattern (360) electrically coupled to the conductive frame (340). The electrical path through which the conductive ring (330) is connected to the ground of the electronic device (300) described above may form an ESD discharge path. For example, ESD generated or / or induced by the conductive ring (330) may be discharged to the ground of the electronic device (300) through a conductive frame (340) electrically coupled to the conductive ring (330) and a conductive pattern (360) electrically coupled to the conductive frame (340). Accordingly, damage and / or malfunction of components of the electronic device (300) (e.g., one or more cameras (370)) caused by the above ESD can be reduced and / or prevented.

[0131] FIG. 7 is a transparency showing a camera area of ​​an electronic device according to one embodiment. FIG. 7 is shown in a projected form on the same plane so that overlapping areas between components are shown.

[0132] Referring to FIG. 7, according to one embodiment, a conductive frame (340) may include a first part (341), a second part (342), a third part (343), and a fourth part (344).

[0133] In one embodiment, the third portion (343) of the conductive frame (340) may be opposite to the first portion (341) of the conductive frame (340). For example, when viewed from above (e.g., in the Z-axis direction) of the rear cover (310), the third portion (343) of the conductive frame (340) may be opposite to the first portion (341) of the conductive frame (340) with the opening (315) of the rear cover (310) in between. Each of the first portion (341) and the third portion (343) of the conductive frame (340) may extend along the periphery of the opening (315) of the rear cover (310).

[0134] In one embodiment, the second portion (342) and the fourth portion (344) of the conductive frame (340) may each extend from the first portion (341) to the third portion (343) so as to cross the opening (315) of the rear cover (310). The second portion (342) and the fourth portion (344) of the conductive frame (340) may be spaced apart from each other. The second portion (342) and the fourth portion (344) of the conductive frame (340) may face the camera cover (320) through the opening (315) of the rear cover (310). When viewed from above (e.g., in the Z-axis direction), the first window portion (322-1) of the camera cover (320) may be located between the second portion (342) and the fourth portion (344) of the conductive frame (340).

[0135] In one embodiment, the first portion (341), second portion (342), third portion (343), and fourth portion (344) of the conductive frame (340) may define an opening (345) of the conductive frame (340). The opening (345) of the conductive frame (340) may be aligned with the first window portion (322-1) of the camera cover (320). For example, the opening (345) of the conductive frame (340) may be aligned vertically (e.g., along the Z-axis) with the first window portion (322-1) of the camera cover (320). For example, the opening (345) of the conductive frame (340) may be substantially centered aligned with the first window portion (322-1) of the camera cover (320) in the vertical direction.

[0136] In one embodiment, the first portion (341) and the third portion (343) of the conductive frame (340) may overlap the conductive ring (330). For example, the conductive ring (330) may include an upper portion, a lower portion, and a central portion between them, with respect to one direction (e.g., the Y-axis). The upper portion, the lower portion, and the central portion of the conductive ring (330) may each wrap around the edge of the upper portion, the edge of the lower portion, and the edge of the central portion between them of the camera cover (320). In one embodiment, the first portion (341) and the third portion (343) of the conductive frame (340) may overlap the central portion of the conductive ring (330).

[0137] In one embodiment, one or more holes (746) may be formed in the conductive frame (340), which overlap the opening (315) of the rear cover (310) and the camera cover (320). For example, the one or more holes (746) may include at least one of a first hole (746-1), a second hole (746-2), a third hole (746-3), and a fourth hole (746-4).

[0138] For example, the first hole (746-1) and the second hole (746-2) may be formed in the second part (342) of the conductive frame (340). For example, the first hole (746-1) may be adjacent to the first part (341) of the conductive frame (340), and the second hole (746-2) may be adjacent to the third part (343) of the conductive frame (340).

[0139] For example, the third hole (746-3) and the fourth hole (746-4) may be formed in the fourth part (344) of the conductive frame (340). For example, the third hole (746-3) may be adjacent to the first part (341) of the conductive frame (340), and the fourth hole (746-4) may be adjacent to the third part (343) of the conductive frame (340).

[0140] FIG. 8 shows a coupling structure between a camera cover and a conductive frame according to one embodiment.

[0141] Referring to FIG. 8, according to one embodiment, the camera cover (320) may include one or more protrusions (826) corresponding to one or more holes (746) of the conductive frame (340). The one or more protrusions (826) may be coupled to the conductive frame (340).

[0142] One or more protrusions (826) may include, for example, at least one of a first protrusion (826-1), a second protrusion (826-2), a third protrusion (826-3), and a fourth protrusion (826-4).

[0143] For example, the first projection (826-1) of the camera cover (320) may correspond to the first hole (746-1) of the conductive frame (340). For example, the first projection (826-1) of the camera cover (320) may penetrate the first hole (746-1) of the conductive frame (340). For example, at least a portion of the first projection (826-1) of the camera cover (320) may be positioned within the first hole (746-1) of the conductive frame (340).

[0144] For example, the second projection (826-2) of the camera cover (320) may correspond to the second hole (746-2) of the conductive frame (340). For example, the second projection (826-2) of the camera cover (320) may penetrate the second hole (746-2) of the conductive frame (340). For example, at least a portion of the second projection (826-2) of the camera cover (320) may be positioned within the second hole (746-2) of the conductive frame (340).

[0145] For example, the third projection (826-3) of the camera cover (320) may correspond to the third hole (746-3) of the conductive frame (340). For example, the third projection (826-3) of the camera cover (320) may penetrate the third hole (746-3) of the conductive frame (340). For example, at least a portion of the third projection (826-3) of the camera cover (320) may be positioned within the third hole (746-3) of the conductive frame (340).

[0146] For example, the fourth projection (826-4) of the camera cover (320) may correspond to the fourth hole (746-4) of the conductive frame (340). For example, the fourth projection (826-4) of the camera cover (320) may penetrate the fourth hole (746-4) of the conductive frame (340). For example, at least a portion of the fourth projection (826-4) of the camera cover (320) may be positioned within the fourth hole (746-4) of the conductive frame (340).

[0147] According to one embodiment, the conductive frame (340) can be coupled to the camera cover (320). For example, the conductive frame (340) can be coupled to the camera cover (320) by the second part (342) and the fourth part (344) of the conductive frame (340) being coupled to one or more protrusions (826) of the camera cover (320). For example, the conductive frame (340) and the camera cover (320) can be coupled by fusing the conductive frame (340) with one or more protrusions (826) of the camera cover (320) while fastening them to one or more holes (746) of the conductive frame (340). Additionally, the first part (341) and the third part (343) of the conductive frame (340) may be positioned on the second surface (310B) of the rear cover (310) outside the opening (315) of the rear cover (310). By including a part of the conductive frame (340) that is coupled to the camera cover (320) through the opening (315) of the rear cover (310) (e.g., the second part (342) and the fourth part (344)), and another part configured to be caught on the second surface (310B) of the rear cover (310) on both sides of the opening (315) of the rear cover (310) (e.g., the first part (341) and the third part (343)), the camera deco (301) may not be detached from the rear cover (310) (e.g., in the -Z direction).

[0148] Additionally, the second part (342) and the fourth part (344) of the conductive frame (340) can be attached to the camera cover (320) via an adhesive material such as double-sided tape (e.g., prior to the fusion).

[0149] FIG. 9 is a cross-sectional view of an electronic device according to one embodiment. FIG. 10 is a plan view of an electronic device according to one embodiment.

[0150] FIG. 10 is shown in a projected form on the same plane so that the overlapping areas between the components are visible.

[0151] Referring to FIG. 9, in one embodiment, the printed circuit board (380) may include a conductive region (982) that functions as at least part of the ground of the electronic device (300). The conductive region (982) may be referred to as the ground, ground region, or ground plane of the printed circuit board (380).

[0152] According to one embodiment, the electronic device (300) may include a connector (992) disposed on a printed circuit board (380). The connector (992) may include, for example, an elastic connector (or spring connector), such as a C-clip, or a conductive gasket, but is not limited to.

[0153] An electronic device (300) according to one embodiment may include a conductive pattern (960) (e.g., the conductive pattern (360) of FIG. 5). At least a portion of the conductive pattern (960) may include a first portion (961) (e.g., the conductive pattern (360)) formed on a plate (350) (e.g., a first surface (350A)) so as to overlap with a conductive frame (340), and a second portion (962) that electrically connects (and / or is to electrically connect) the first portion (961) to the ground of the electronic device (300).

[0154] For example, a second portion (962) of the conductive pattern (960) may extend from a first portion (961) to a connector (992) placed on a printed circuit board (380). For example, the second portion (962) of the conductive pattern (960) may include a first section extending from the first portion (962) through (e.g., through) the plate (350), and a second section formed on a second surface (350B) of the plate (350) (e.g. opposite to the first surface (350A)) to connect the first section to the connector (992). Additionally, the second portion (962) of the conductive pattern (960) may further include a third section extending from the first portion (961) so as not to overlap with the conductive frame (340). In this case, the first section of the conductive pattern (960) penetrating the plate (350) may extend from the third section of the conductive pattern (960), rather than the first part (961) of the conductive pattern (960).

[0155] In one embodiment, the conductive pattern (960) may be electrically connected to a connector (992). The connector (992) may be electrically connected to a conductive region (982) through an electrical path (984) formed in the printed circuit board (380). Accordingly, the conductive pattern (960) may be electrically connected to a conductive region (982) of the printed circuit board (380). The conductive region (982) may be electrically connected to a conductive portion included in the second part (243) of the frame structure (240). The conductive portion of the second part (243) of the frame structure (240) may function as the ground of the electronic device (300), for example, together with the conductive region (982) of the printed circuit board (380).

[0156] According to one embodiment, the electronic device (300) may further include at least one element (994) disposed on a printed circuit board (380). The at least one element (994) may include at least one passive element. For example, the at least one element (994) may include at least one of R (resistor), L (inductor), and / or C (capacitor).

[0157] In one embodiment, the conductive pattern (960) may be electrically connected to a conductive region (982) of a printed circuit board (380) through at least one element (994). For example, the electrical path (984) of the printed circuit board (380) may electrically connect a connector (992) electrically connected to the conductive pattern (960) to at least one element (994), and may also electrically connect at least one element (994) to the conductive region (982).

[0158] At least one element (994) can be configured to improve isolation between another antenna and a conductive ring (330), a conductive frame (340), and a conductive pattern (960) that form an electrical path for ESD discharge.

[0159] For example, referring to FIG. 10, according to one embodiment, an electronic device (300) may include a plurality of different conductive patterns (1068) formed on a plate (350). The plurality of different conductive patterns (1068) may function as at least part of an antenna (e.g., an antenna radiator) of the electronic device (300). As another example, a conductive portion included in a first part (241) of a frame structure (240) of the electronic device (300) may function as at least part of an antenna (e.g., an antenna radiator) of the electronic device (300).

[0160] Referring again to FIG. 9, a conductive ring (330), a conductive frame (340), and a conductive pattern (960) forming an ESD discharge path are electrically connected to a conductive region (982) of a printed circuit board (380) through at least one element (994), thereby improving the isolation from antennas of an electronic device (300) adjacent to the ESD discharge path (e.g., a plurality of other conductive patterns (1068) and the conductive portion of the first part (241). Accordingly, when the antennas of the electronic device (300) are in operation, the correlation caused by the conductive ring (330), the conductive frame (340), and the conductive pattern (960) can be reduced.

[0161] The camera cover (320) may cover the opening (315) of the rear cover (310). For example, the camera cover (320) may be placed on the first surface (310A) of the rear cover (310) to cover the opening (315) of the rear cover (310). For another example, the camera cover (320) may be placed (or inserted) at least partially within the opening (315) of the rear cover (310) to cover the opening (315) of the rear cover (310). In this case, the camera cover (320) may include the portion placed on the first surface (310A) of the rear cover (310), or it may be placed within the opening of the rear cover (310) without the said portion placed on the first surface (310A) of the rear cover (310).

[0162] If the camera cover (320) includes a portion disposed within the opening (315) of the rear cover (310), the camera cover (320) may further include a portion disposed on a second surface (310B) of the rear cover (310) that extends from said portion disposed within the opening (315) of the rear cover (310). said portion of the camera cover (320) disposed within the opening (315) of the rear cover (310) may be attached to the opening (315) of the rear cover (310) (e.g., the inner surface of the opening (315)). Additionally, said portion of the camera cover (320) disposed on the second surface (310B) of the rear cover (310) may be attached to the second surface (310B) of the rear cover (310).

[0163] FIG. 11 is a block diagram showing an ESD discharge path of an electronic device according to one embodiment.

[0164] Figure 12 is a block diagram showing the ESD discharge path of an electronic device according to a comparative example.

[0165] Figure 13 is a cross-sectional view of an electronic device according to a comparative example.

[0166] Referring to FIG. 11, the ESD discharge path of an electronic device (300) may include a conductive ring (330), a conductive frame (340) electrically coupled to the conductive ring (330), a conductive pattern (960) electrically coupled to the conductive frame (340) (e.g., the conductive pattern (360) of FIG. 5), a connector (992) electrically connected to the conductive pattern (960), a printed circuit board (380) electrically connecting the connector (992) to at least one element (994) (e.g., an electrical path (984)), and at least one element (994) electrically connected to ground (e.g., a conductive region (982) of the printed circuit board (380) and / or a second part (243) of the frame structure (240)).

[0167] Referring to FIG. 12, the ESD discharge path of an electronic device (1202) according to a comparative example may include a conductive camera deco (1201), a connector (1292) electrically connected to the conductive camera deco (1201), and a printed circuit board (1280) electrically connecting the connector (1292) to ground.

[0168] Referring to FIG. 13, an electronic device (1202) according to a comparative example may include a conductive camera deco (1201) installed on a rear cover (1210) so as to be positioned over one or more cameras (370). A connector (1292) disposed on a printed circuit board (1280) may be directly electrically connected to the conductive camera deco (1201). An electrical path (1284) of the printed circuit board (1280) may electrically connect the connector (1292) to a conductive region (1282) of the printed circuit board (1280). Accordingly, an ESD discharge path of the comparative example as shown in FIG. 12 may be formed.

[0169] In one embodiment, the volume ratio of the conductive part (e.g., conductive ring (330)) in the camera deco (301) may be smaller than the volume ratio of the non-conductive part (e.g., camera cover (320)). In contrast, the conductive camera deco (1201) according to the comparative example may be formed mostly of the conductive part.

[0170] Accordingly, in the case of the electronic device (300) according to one embodiment, the material cost can be reduced compared to the electronic device (1202) according to the comparative example. In addition, in the case of the electronic device (300) according to one embodiment, the performance degradation of the antennas of the electronic device (300) due to the conductive part of the camera deco (301) can be reduced compared to the electronic device (1202) according to the comparative example.

[0171] That is, according to one embodiment, the electronic device (300) can form an ESD discharge path that may be caused by the camera deco (301) using an electrical coupling structure, even if only a portion of the camera deco (301) is made of a conductive material (e.g., a conductive ring (330)) for appearance characteristics, with relatively lower material costs and relatively smaller antenna performance degradation. Accordingly, damage and / or malfunction of the components of the electronic device (300) (e.g., one or more cameras (370)) due to ESD can be reduced and / or prevented.

[0172] FIG. 14 is a block diagram of an electronic device according to one embodiment.

[0173] Referring to FIG. 14, according to one embodiment, an electronic device (300) may include a wireless communication circuit (1492) (e.g., a wireless communication circuit (192)) and a filter circuit (1494) (or a filter element (1494)).

[0174] In one embodiment, the wireless communication circuit (1492) may be electrically connected to the conductive pattern (960) through the connector (992). For example, the wireless communication circuit (1492) may be placed on the printed circuit board (380) and may be electrically connected to the connector (992) through an electrical path (e.g., electrical path (984)) formed on the printed circuit board (380).

[0175] In one embodiment, the conductive pattern (960) may function as at least part of the antenna (e.g., antenna radiator) of the electronic device (300). For example, a wireless communication circuit (1492) may transmit and / or receive an RF signal using the conductive pattern (960). The RF signal may be transmitted through the electrical path of the connector (992) and the printed circuit board (380) that electrically connects the conductive pattern (960) and the wireless communication circuit (1492). Additionally, a conductive frame (340) electrically coupled to the conductive pattern (960) and a conductive ring (330) electrically coupled to the conductive frame (340) may also function as at least part of the antenna (e.g., antenna radiator) of the electronic device (300) together with the conductive pattern (960).

[0176] The filter circuit (1494) may include at least one element configured to reduce and / or prevent the RF signal from being lost to ground. Additionally, the filter circuit (1494) may include a diode-based filter or a SAW filter configured to reduce and / or prevent the RF signal from being lost to ground.

[0177] FIG. 15 is a block diagram of an electronic device according to one embodiment.

[0178] Referring to FIG. 15, an electronic device (300) according to one embodiment may further include a connector (1596). The connector (1596) may be disposed on a printed circuit board (380).

[0179] Unlike the wireless communication circuit (1492) of FIG. 14, which is electrically connected to the conductive pattern (960) through the connector (992), the wireless communication circuit (1492) of FIG. 15 may be electrically connected to the conductive pattern (960) through the connector (1596). Through the connector (1596), the wireless communication circuit (1492) may transmit the RF signal to the conductive pattern (960) and / or receive the RF signal from the conductive pattern (960).

[0180] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0181] According to one embodiment, the electronic device (300) comprises: a non-conductive rear cover (310) that defines at least a portion of the outer rear surface (i.e., a second surface (200B)) of the electronic device (300) and a second surface (310B) opposite to the first surface (310A), and defines an opening (315); a non-conductive camera cover (320) that covers the opening (315) of the non-conductive rear cover (310) and includes a light-transmitting portion (322); and a camera (370) that is positioned below the light-transmitting portion (322) of the non-conductive camera cover (320) and aligned with the light-transmitting portion (322) of the non-conductive camera cover (320). It may include a conductive ring (330) attached to the first surface (310A) of the non-conductive rear cover (310) and surrounding the non-conductive camera cover (320); and a conductive frame (340) configured to fix the non-conductive camera cover (320) to the non-conductive rear cover (310), at least partially overlapping the conductive ring (330), and spaced apart from the conductive ring (330). The conductive frame (340) may be electrically connected to the ground of the electronic device (300) such that the conductive ring (330) is connected to the ground of the electronic device (300) through electrical coupling with the conductive frame (340) spaced apart from the conductive ring (330).

[0182] In one embodiment, the conductive ring (330) may be electrically connected to the ground of the electronic device (300) to form an electrical path for electrostatic discharge (ESD).

[0183] In one embodiment, the conductive frame (340) can be structurally coupled to the non-conductive camera cover (320).

[0184] In one embodiment, the conductive frame (340) may include a first portion (341) overlapping a portion of the conductive ring (330); a second portion overlapping a different portion of the conductive ring (330); and a third portion (342; 344) extending from the first portion (341) of the conductive frame (340) to the second portion of the conductive frame (340) across the opening (315) of the non-conductive camera cover (320). The third portion (342; 344) of the conductive frame (340) may be structurally coupled to the non-conductive camera cover (320).

[0185] In one embodiment, the non-conductive camera cover (320) may include at least one projection (826) coupled to the third part (342; 344) of the conductive frame (340).

[0186] In one embodiment, the at least one projection (826) of the non-conductive camera cover (320) extends through the third part (342; 344) of the conductive frame (340) and can be fused to the third part (342; 344) of the conductive frame (340).

[0187] In one embodiment, the electronic device (300) may further include an adhesive material for attaching the third portion (342; 344) of the conductive frame (340) to the non-conductive camera cover (320).

[0188] In one embodiment, the electronic device (300) may include a non-conductive plate (350) disposed below the conductive frame (340); and a conductive pattern (360; 960) formed on the non-conductive plate (350), spaced apart from the conductive frame (340), and at least partially overlapping the conductive frame (340). The conductive ring (330) may be electrically connected to the ground of the electronic device (300) through the electrical coupling with the conductive frame (340) spaced apart from the conductive ring (330); and the electrical coupling between the conductive frame (340) and the conductive pattern (360; 960) spaced apart from the conductive frame (340).

[0189] In one embodiment, the non-conductive plate (350) may include a surface (350A) facing the conductive frame (340). A recessed area (350R) may be formed on the surface (350A) of the non-conductive plate (350). At least a portion of the conductive pattern (360; 960) may be formed on the recessed area (350R) of the non-conductive plate (350).

[0190] In one embodiment, the electronic device (300) may include a printed circuit board (380) comprising a ground region (982) configured to function as at least part of the ground of the electronic device (300). The conductive pattern (360; 960) may be electrically connected to the ground region (982) of the printed circuit board (380).

[0191] In one embodiment, the electronic device (300) may include a conductive connector disposed on the printed circuit board (380) and connecting the conductive pattern (360; 960) to the ground area of ​​the printed circuit board (380).

[0192] In one embodiment, the non-conductive plate (350) may include another surface (350B) opposite to the surface (350A) of the non-conductive plate (350) and facing the printed circuit board (380). The conductive pattern (360; 960) may include a first portion (961) formed on the surface (350A) of the non-conductive plate (350); a second portion (962) formed on the other surface (350B) of the non-conductive plate (350) and in contact with the conductive connector; and a third portion extending through the non-conductive plate (350) from the first portion (961) of the conductive pattern (360; 960) to the second portion (962) of the conductive pattern (360; 960).

[0193] In one embodiment, the non-conductive plate (350) may include an opening portion defining an opening (355) into which a part of the camera (370) is disposed. At least a part of the conductive pattern (360; 960) may be formed on the opening portion of the non-conductive plate (350).

[0194] In one embodiment, the conductive pattern (360; 960) may be used as at least part of the antenna of the electronic device (300).

[0195] In one embodiment, the electronic device (300) may further include another conductive pattern (1068) formed on the non-conductive plate (350) and used as at least part of another antenna of the electronic device (300).

[0196] In one embodiment, the conductive frame (340) may define an opening (345) aligned with the light-transmitting portion (322) of the non-conductive camera cover (320). A portion of the camera (370) may be placed within the opening (345) of the conductive frame (340).

[0197] In one embodiment, the conductive ring (330) may be attached to the edge portion of the non-conductive camera cover (320).

[0198] According to one embodiment, the electronic device (300) comprises: a non-conductive rear cover (310) that defines an opening (315) and includes a first surface (310A) that defines at least a portion of the rear outer surface (i.e., a second surface (200B)) of the electronic device (300) and a second surface (310B) opposite to the first surface (310A); a non-conductive camera cover (320) that is attached to the first surface (310A) of the non-conductive rear cover (310) to cover the opening (315) of the non-conductive rear cover (310) and includes a light-transmitting portion (322); and a camera (370) that is positioned below the light-transmitting portion (322) of the non-conductive camera cover (320) and configured to receive light through the light-transmitting portion (322) of the non-conductive camera cover (320). A conductive protective member disposed on the first surface (310A) of the non-conductive rear cover (310) and surrounding the periphery of the non-conductive camera cover (320); a conductive frame (340) attached to the second surface (310B) of the non-conductive rear cover (310) so as to overlap at least partially with the conductive protective member; a non-conductive plate (350) disposed below the conductive frame (340); and a conductive pattern (360; 960) formed on the non-conductive plate (350), spaced apart from the conductive frame (340), and at least partially overlapping with the conductive frame (340). The conductive protective member may include a conductive frame (340) spaced apart from the conductive protective member and electrically coupled to the conductive protective member. And through a conductive pattern (360; 960) that is spaced apart from the conductive frame (340) and electrically coupled to the conductive frame (340), it can be electrically connected to the ground of the electronic device (300).

[0199] In one embodiment, the conductive frame (340) can be structurally coupled to the non-conductive camera cover (320).

[0200] In one embodiment, the conductive frame (340) may include: a first conductive portion (341) overlapping a portion of the conductive protective member; a second portion overlapping a different portion of the conductive protective member; and a third portion (342; 344) extending across the opening (315) from the first portion (341) of the conductive frame (340) to the second portion of the conductive frame (340). The third portion (342; 344) of the conductive frame (340) may be structurally coupled to the non-conductive camera cover (320).

[0201] According to one embodiment, the electronic device (300) comprises: a non-conductive rear cover (310) that defines at least a portion of the outer rear surface (200B) of the electronic device (300) and includes a first surface (310A) and a second surface (310B) opposite to the first surface (310A); a non-conductive camera cover (320) disposed on the first surface (310A) of the non-conductive rear cover (310) to cover an opening (315) of the non-conductive rear cover (310); and a conductive ring (330) disposed on the first surface (310A) of the non-conductive rear cover (310) to wrap around the edge of the non-conductive camera cover (320). It may include a conductive frame (340) comprising a first portion (341; 343) disposed on the second surface (310B) of the non-conductive rear cover (310) so as to overlap at least a portion of the conductive ring (330), and a second portion (342; 344) extending from the first portion (341; 343) across the opening (315) of the non-conductive rear cover (310) and coupled to the non-conductive camera cover (320); and a non-conductive plate (350) disposed below the non-conductive rear cover (310) and having a conductive pattern (360; 960) formed thereon. The conductive pattern (360; 960) may include a first portion (961) that overlaps the conductive frame (340) and a second portion (962) that electrically connects the first portion (961) of the conductive pattern (360; 960) to the ground of the electronic device (300). The conductive ring (330) may be electrically connected to the ground through the conductive frame (340) which is spaced apart from the conductive ring (330) and electrically coupled to the conductive ring (330); and the conductive pattern (360; 960) which is spaced apart from the conductive frame (340) and electrically coupled to the conductive frame (340).

[0202] In one embodiment, the conductive ring (330) may be electrically connected to the ground to form an electrostatic discharge (ESD) path.

[0203] In one embodiment, the non-conductive camera cover (320) may include a projection (826) coupled to the second portion (342; 344) of the conductive frame (340).

[0204] In one embodiment, the projection (826) of the non-conductive camera cover (320) can be fused to the second part (342; 344) of the conductive frame (340).

[0205] In one embodiment, the non-conductive plate (350) may include a surface (350A) facing the non-conductive rear cover (310) and having a recessed area (350R). The first portion (961) of the conductive pattern (360; 960) may be formed on the recessed area (350R) of the non-conductive plate (350).

[0206] In one embodiment, the electronic device (300) may include a camera (370) under the non-conductive camera cover (320). The non-conductive camera cover (320) may include a window portion (322) aligned with the camera (370). The conductive frame (340) may include an opening (345) aligned with the window portion (322) of the non-conductive camera cover (320).

[0207] In one embodiment, the non-conductive plate (350) may include an opening (355) that is aligned with the opening (345) of the conductive frame (340). A portion of the camera (370) may be positioned within the opening (355) of the non-conductive plate (350).

[0208] In one embodiment, the first portion (961) of the conductive pattern (360; 960) may be formed around the opening (355) of the non-conductive plate (350).

[0209] In one embodiment, the electronic device (300) may include a printed circuit board (380) disposed below the non-conductive plate (350), which includes a conductive region (982) that functions as at least part of the ground. The second portion (962) of the conductive pattern (360; 960) may be electrically connected to the conductive region (982) of the printed circuit board (380) through at least one element (994; 1494).

[0210] In one embodiment, the conductive pattern (360; 960) can be used as an antenna of the electronic device (300).

[0211] In one embodiment, another conductive pattern (1068) used as an antenna of the electronic device (300) may be formed on the non-conductive plate (350).

[0212] In one embodiment, the non-conductive camera cover (320) may include an upper portion, a lower portion opposite to the upper portion, and a central portion between the upper portion and the lower portion. The conductive ring (330) may include a first portion covering the upper portion of the non-conductive camera cover (320), a second portion covering the lower portion of the non-conductive camera cover (320), and a third portion extending from the first portion of the conductive ring (330) to the second portion of the conductive ring (330) to cover the central portion of the non-conductive camera cover (320). The conductive frame (340) may overlap the third portion among the first, second, and third portions of the conductive ring (330).

[0213] In one embodiment, the non-conductive camera cover (320) may be attached to the first surface (310A) of the non-conductive rear cover (310).

[0214] In one embodiment, the first portion (341; 343) of the conductive frame (340) may be attached to the second surface (310B) of the non-conductive rear cover (310).

[0215] In one embodiment, the conductive frame (340) may include a third portion (343) disposed on the second surface (310B) of the non-conductive rear cover (310) opposite to the first portion (341) of the conductive frame (340). The second portion (342; 344) of the conductive frame (340) may extend from the first portion (341) of the conductive frame (340) across the opening (315) of the non-conductive rear cover (310) to the third portion (343) of the conductive frame (340).

[0216] According to one embodiment, the electronic device (300) comprises: a non-conductive rear cover (310) that defines at least a portion of the outer rear surface (200B) of the electronic device (300) and includes a first surface (310A) and a second surface (310B) opposite to the first surface (310A); a non-conductive camera cover (320) disposed on the first surface (310A) of the non-conductive rear cover (310) to cover an opening (315) of the non-conductive rear cover (310); and a conductive ring (330) disposed on the first surface (310A) of the non-conductive rear cover (310) to wrap around the edge of the non-conductive camera cover (320). It may include a conductive frame (340) comprising a first portion (341; 343) disposed on the second surface (310B) of the non-conductive rear cover (310) so as to overlap at least a portion of the conductive ring (330), and a second portion (342; 344) extending from the first portion (341; 343) across the opening (315) of the non-conductive rear cover (310) and coupled to the non-conductive camera cover (320); and a non-conductive plate (350) disposed below the non-conductive rear cover (310) and having a conductive pattern (360; 960) formed thereon. The conductive ring (330) can be electrically connected to the ground of the electronic device (300) through the conductive frame (340) which is spaced apart from the conductive ring (330) and electrically coupled to the conductive ring (330).

[0217] In one embodiment, the conductive ring (330) may be electrically connected to the ground to form an electrostatic discharge (ESD) path.

[0218] In one embodiment, the non-conductive camera cover (320) may include a projection (826) fused to the second portion (342; 344) of the conductive frame (340).

[0219] In one embodiment, the electronic device (300) may include: a non-conductive plate (350) disposed below the non-conductive rear cover (310) and having a conductive pattern (360; 960) formed thereon that overlaps the conductive frame (340); a printed circuit board (380) disposed below the non-conductive plate (350) and including a conductive region (982) that functions as at least part of the ground; and at least one element (994; 1494) disposed on the printed circuit board (380). The conductive ring (330) may include: the conductive frame (340) spaced apart from the conductive ring (330) and electrically coupled to the conductive ring (330); and the conductive pattern (360; 960) spaced apart from the conductive frame (340) and electrically coupled to the conductive frame (340). And through the at least one element (994; 1494) electrically connected to the conductive pattern (360; 960), it can be electrically connected to the conductive region (982) of the printed circuit board (380).

[0220] In one embodiment, the non-conductive plate (350) may include a surface (350A) facing the non-conductive rear cover (310) and having a recessed area (350R). The first portion (961) of the conductive pattern (360; 960) may be formed on the recessed area (350R) of the non-conductive plate (350).

[0221] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0222] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0223] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0224] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0225] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0226] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0227] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, A non-conductive rear cover comprising a first surface defining at least a portion of the outer rear surface of the electronic device and a second surface opposite to the first surface, defining an opening; A non-conductive camera cover that covers the opening of the above-mentioned non-conductive rear cover and includes a light-transmitting portion; A camera positioned below the light-transmitting portion of the non-conductive camera cover and aligned with the light-transmitting portion of the non-conductive camera cover; A conductive ring attached to the first surface of the non-conductive rear cover and surrounding the non-conductive camera cover; and The above-mentioned non-conductive camera cover is configured to be fixed to the above-mentioned non-conductive rear cover and includes a conductive frame that overlaps at least partially with the above-mentioned conductive ring and is spaced apart from the above-mentioned conductive ring, and The conductive frame is electrically connected to the ground of the electronic device such that the conductive ring is connected to the ground of the electronic device through electrical coupling with the conductive frame spaced apart from the conductive ring. Electronic device.

2. In Claim 1, The conductive ring is electrically connected to the ground of the electronic device to form an electrical path for electrostatic discharge (ESD). Electronic device.

3. In Claim 1, The conductive frame is structurally coupled to the non-conductive camera cover. Electronic device.

4. In Claim 3, The above conductive frame is: A first part overlapping a portion of the above conductive ring; A second part overlapping another part of the above conductive ring; and It includes a third portion extending from the first portion of the conductive frame to the second portion of the conductive frame across the opening of the non-conductive camera cover, The third portion of the conductive frame is structurally coupled to the non-conductive camera cover. Electronic device.

5. In Claim 4, The above-mentioned non-conductive camera cover comprises at least one projection coupled to the third portion of the above-mentioned conductive frame, Electronic device.

6. In Claim 5, The at least one projection of the above-mentioned non-conductive camera cover extends through the third portion of the above-mentioned conductive frame and is fused to the third portion of the above-mentioned conductive frame, Electronic device.

7. In any one of claims 4 to 6, A further comprising an adhesive material for attaching the third portion of the conductive frame to the non-conductive camera cover. Electronic device.

8. In Claim 1, A non-conductive plate disposed below the conductive frame; and A conductive pattern formed on the above-mentioned non-conductive plate, spaced apart from the above-mentioned conductive frame, and at least partially overlapping with the above-mentioned conductive frame, comprising The above conductive ring is: The electrical coupling with the conductive frame spaced apart from the conductive ring; and Electrically connected to the ground of the electronic device through electrical coupling between the conductive frame and the conductive pattern spaced apart from the conductive frame, Electronic device.

9. In Claim 8, The above non-conductive plate includes a surface facing the above conductive frame, and A recessed area is formed on the surface of the above-mentioned non-conductive plate, and At least a portion of the conductive pattern is formed on the recessed area of ​​the non-conductive plate, Electronic device.

10. In Claim 9, A printed circuit board comprising a ground region configured to function as at least a part of the ground of the electronic device, and The conductive pattern is electrically connected to the ground area of ​​the printed circuit board. Electronic device.

11. In Claim 10, A conductive connector disposed on the printed circuit board and connecting the conductive pattern to the ground area of ​​the printed circuit board, Electronic device.

12. In Claim 11, The above non-conductive plate includes another surface opposite to the surface of the above non-conductive plate and facing the printed circuit board, The above conductive pattern is: A first section formed on the surface of the non-conductive plate, superimposed on the conductive frame; A second section formed on the other surface of the non-conductive plate and in contact with the conductive connector; and A third section including a section extending from the first section of the conductive pattern to the second section of the conductive pattern through the non-conductive plate. Electronic device.

13. In any one of claims 8 to 12, The above non-conductive plate includes an opening portion that defines an opening in which a part of the camera is disposed, and At least a portion of the conductive pattern is formed on the opening portion of the non-conductive plate, Electronic device.

14. In any one of claims 8 to 13, The above conductive pattern is used as at least part of the antenna of the electronic device, Electronic device.

15. In any one of claims 8 to 14, A further comprising another conductive pattern formed on the above non-conductive plate and used as at least part of another antenna of the electronic device, Electronic device.

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