Acoustic module and electronic device comprising same

Abstract

An electronic device according to various embodiments may comprise: a housing including a first path; a module housing disposed in a first space of the housing and including a second path connected to the first path; an acoustic module supported by at least a portion of the module housing; an opening formed in the module housing and corresponding to the acoustic module and at least a portion of the housing; a first waterproof member disposed between the module housing and the housing so as to surround the opening and defining a second space connected to the second path; and a blocking member at least partially disposed in the second space between the module housing and the housing. Various other embodiments of the electronic device are possible.

Description

Acoustic module and electronic device including it

[0001] The various embodiments disclosed in this document relate to an acoustic module and an electronic device including the same.

[0002] Electronic devices are becoming increasingly slimmer and are being developed to increase rigidity, enhance design aspects, and differentiate their functional elements.

[0003] The electronic device may include at least one acoustic module disposed in an internal space. The at least one acoustic module may be required to have a placement design that contributes to the slimming of the electronic device without hindering performance.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0005] An electronic device may include a module housing in which an acoustic module (e.g., a speaker module) is placed. The electronic device may include a module housing that is placed within the internal space of the electronic device and includes a sealed acoustic path for the acoustic module (e.g., an integrated acoustic path structure). Additionally, the electronic device may include an acoustic path provided through the combination of the electronic device housing and the module housing, and applied as a transmission path for sound generated from the acoustic module (e.g., a semi-modular acoustic path structure). For instance, a semi-modular acoustic path structure provided through the combination of at least a part of the electronic device housing and at least a part of the module housing can help to slim down the electronic device and secure greater freedom in the design of the placement of peripheral components compared to an integrated acoustic path structure. The acoustic path applied to the semi-modular acoustic path structure may include a sealed space through a sealing member placed between the module housing and the electronic device housing.

[0006] However, in the case of a semi-modular acoustic path structure, the distance from the center of the acoustic module to the outermost point where the sound is reflected (e.g., a sealing member) is longer compared to an integral acoustic path structure, so performance degradation such as reduced volume in the high-frequency range or vibration may occur.

[0007] The electronic device may include a first acoustic path formed in at least a portion of the housing and a second acoustic path formed at least partially by the module housing and spatially connected to the first acoustic path. In this case, the electronic device may include a filter structure disposed between the first acoustic path and the second acoustic path to selectively block external foreign matter and / or moisture. The filter structure may include a filter member disposed between the first acoustic path and the second acoustic path and selectively spatially connecting the two acoustic paths, and a filter bracket supporting the filter member. The electronic device may include a sealing member disposed between the filter bracket and the housing of the electronic device. The filter member and the sealing member may be disposed side by side on one side of the filter bracket.

[0008] When a filter member and a sealing member are placed side by side between a filter bracket and the housing of an electronic device, the sound generated from the acoustic module may be distorted due to acoustic bottlenecking as the width (e.g., space volume) of the through hole of the filter bracket connecting the first acoustic path and the second acoustic path becomes narrow.

[0009] Various embodiments of the present disclosure may provide an electronic device comprising a blocking member that can help improve sound quality.

[0010] According to various embodiments, an electronic device including a semi-modular acoustic path structure that can help slim down the electronic device can be provided.

[0011] According to various embodiments, an electronic device including a filter structure that can help improve sound quality can be provided.

[0012] The technical tasks intended to be accomplished in this document are not limited to those mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art to which this document belongs from the description below.

[0013] According to various embodiments, the electronic device may include a housing having a first path, a module housing disposed in a first space of the housing and having a second path connected to the first path, an acoustic module supported by at least a portion of the module housing, an opening formed in the module housing and corresponding to at least a portion of the acoustic module and the housing, a first waterproof member disposed between the module housing and the housing to surround the opening and forming a second space connected to the second path, and a blocking member disposed at least partially between the module housing and the housing in the second space.

[0014] According to various embodiments, the electronic device comprises a housing including a first path, a module housing disposed in a first space of the housing and including a second path connected to the first path, an acoustic module supported by at least a portion of the module housing, and a filter structure disposed between the first path and the second path, wherein the filter structure may include a filter bracket comprising a first bracket facing the first path, a second bracket surface facing the second path, and a through hole connecting the first path and the second path, a second waterproof member disposed to surround the first path and the through hole between the filter bracket and the housing, and a filter member disposed to selectively block the second path and the through hole between the filter bracket and the module housing.

[0015] An electronic device according to various embodiments of the present disclosure can have relatively high decibels in the high frequency range by inducing a shortened distance from the center of the acoustic module to the outermost end where sound is reflected through a blocking member disposed between the housing and the module housing. This shortened acoustic reflection structure can reduce the volume drop of the acoustic module in the high frequency range and improve the acoustic quality of the acoustic module.

[0016] An electronic device according to various embodiments of the present disclosure may include an opposing surface arrangement structure in which a sealing member is disposed between a filter bracket and a housing of the electronic device, and a filter member is disposed between a filter bracket and a module housing. Such an opposing surface arrangement structure can widen the width (e.g., spatial volume) of the through hole of the filter bracket, thereby reducing acoustic distortion occurring in the acoustic module due to acoustic bottlenecking and improving the acoustic quality of the acoustic module.

[0017] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0018] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0019] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0020] FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0021] FIG. 2b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0022] FIG. 3 is a drawing of the internal structure of an electronic device according to various embodiments of the present disclosure, viewed from the rear direction.

[0023] FIG. 4 is a partial cross-sectional view of an electronic device shown along line 4-4 of FIG. 2a according to various embodiments of the present disclosure.

[0024] FIG. 5a is an enlarged view of an acoustic output device according to various embodiments of the present disclosure, viewed from the rear.

[0025] FIG. 5b is a view of the first waterproof member and the blocking member according to various embodiments of the present disclosure, viewed from the rear direction.

[0026] FIG. 6 is a partial cross-sectional view of an electronic device including an acoustic output device shown along line 6-6 of FIG. 5a according to various embodiments of the present disclosure.

[0027] FIG. 7a is an enlarged view of area 7 of FIG. 6 according to various embodiments of the present disclosure.

[0028] FIGS. 7b, FIGS. 7c, and FIGS. 7d ​​are enlarged cross-sectional views of an electronic device including an acoustic output device according to various embodiments of the present disclosure.

[0029] FIG. 8 is a graph comparing the performance of an acoustic output device with and without the application of a blocking member according to various embodiments of the present disclosure.

[0030] FIG. 9 is an enlarged view of area 9 of FIG. 6 according to various embodiments of the present disclosure.

[0031] FIG. 10 is a graph comparing the performance of an acoustic output device with and without the application of a filter member according to various embodiments of the present disclosure.

[0032] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0033] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0034] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0035] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0036] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0037] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0041] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0042] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0043] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0047] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0049] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0052] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0054] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] FIG. 2a is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 2b is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0057] The electronic device (200) of FIGS. 2a and 2b may be at least partially similar to the electronic device (101) of FIG. 1, or may include other embodiments of the electronic device.

[0058] Referring to FIGS. 2a and 2b, the electronic device (200) may include a housing (210) (e.g., housing structure) comprising a front cover (202) facing a first direction (e.g., z-axis direction), a rear cover (211) facing in a direction opposite to the first direction (e.g., -z-axis direction), and a side member (218) surrounding the space between the front cover (202) and the rear cover (211) (e.g., internal space (2001) of FIG. 3). In one embodiment, the front cover (202) may be formed by a glass plate or a polymer plate comprising various coating layers. In one embodiment, the rear cover (211) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. In one embodiment, the side member (218) is combined with the front cover (202) and the rear cover (211) and may be formed into a side bezel structure comprising metal and / or polymer. In one embodiment, the rear cover (211) and the side member (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum or magnesium).

[0059] According to various embodiments, the electronic device (200) may include at least one of a display (201), at least one input device (203), an audio output device (220), a sensor module (204), a camera module (205, 212), a key input device (217), and a connector (208). In one embodiment, the electronic device (200) may omit at least one of the above-described components (e.g., a key input device (217)) or additionally include other components. In one embodiment, the display (201) may be exposed, for example, through a substantial portion of the front cover (202). In one embodiment, the display (201) may be exposed through substantially the entire area of ​​the front cover (202). In one embodiment, a recess or opening may be formed in a portion of the screen display area of ​​the display (201), and at least one of the above-described components may be positioned in the internal space of the electronic device (200) to be aligned with the recess or opening. In one embodiment, at least one of a sensor module (204) and a camera module (205) may be disposed on the back of a screen display area (e.g., active area) of a display (201) in the internal space (e.g., internal space (2001) of FIG. 3) of an electronic device (200). In one embodiment, the display (201) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or an electromagnetic induction panel (e.g., a digitizer) that detects a magnetic field-type electronic pen (230).

[0060] According to various embodiments, the input device (203) may include at least one microphone module. In some embodiments, the input device (203) may include a plurality of microphone modules placed at different locations to detect the direction of sound. The acoustic output device (220) (and / or the acoustic output device (220, 220-1) of FIG. 3) may include an acoustic module (e.g., a speaker module). The acoustic module may include an external speaker and / or a receiver for calls.

[0061] According to various embodiments, at least one sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The at least one sensor module (204) may further include, for example, at least one of a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0062] According to various embodiments, the camera module (205, 212) may include a front camera module (205) positioned to be exposed to the outside through a front cover (202) of the electronic device (200) and a rear camera module (212) positioned to be exposed to the outside through a rear cover (211). In one embodiment, the camera module (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, at least two rear camera modules (212) may be positioned adjacently as a single camera module assembly. For example, the rear camera module assembly may perform dual camera functions for normal shooting, wide-angle shooting, or ultra-wide-angle shooting.

[0063] According to various embodiments, the electronic device (200) may include an electronic pen (230) (e.g., a stylus pen) that is detachably disposed from at least a portion of the rear cover (211). In one embodiment, the electronic pen (230) may be disposed on at least a portion of the rear cover (211) and configured to be powered wirelessly.

[0064] According to various embodiments, the acoustic output device (220) may include an acoustic module (e.g., the acoustic module (320) of FIG. 4) (e.g., a speaker module) and a module housing (e.g., the module housing (310) of FIG. 4) on which the acoustic module is placed. The electronic device (200) may include an acoustic path provided through the combination of the housing (210) of the electronic device (200) and the module housing, and applied as a transmission path for the acoustic generated from the acoustic module. A semi-modular acoustic path structure provided through the combination of at least a part of the housing (210) of the electronic device (200) and at least a part of the module housing may help to slim down the electronic device (200) and secure a degree of freedom for the placement design of peripheral components.

[0065] According to various embodiments, the acoustic path applied to the semi-modular acoustic path structure may include a resonant space (e.g., the second space (2102) of FIG. 4) sealed through a sealing member (e.g., the first waterproof member (340) of FIG. 4) disposed between the module housing and the housing (210) of the electronic device (200). In one embodiment, the semi-modular acoustic path structure, which includes a resonant space formed by opening a part of the module housing and sealing the open part through the housing (210), may have a longer distance (L1) from the center of the acoustic module (e.g., the center of the acoustic module (320c) of FIG. 4) to the outermost end (e.g., the sealing member) where the sound generated from the acoustic module is reflected compared to the integral acoustic path structure, thereby causing the volume of the acoustic module to decrease in the high frequency range or performance degradation such as vibration.

[0066] An electronic device (200) according to an exemplary embodiment of the present disclosure can have a relatively high decibel in the high frequency range by inducing a shorter distance (L2) from the center of the acoustic module to the outermost end (e.g., the blocking member) where the sound generated from the acoustic module is reflected, through a blocking member (e.g., the blocking member (350) of FIG. 4) disposed between the housing (210) of the electronic device (200) and the module housing of the acoustic output device (220). This shortened acoustic reflection structure can reduce the volume reduction of the acoustic module in the high frequency range and improve the acoustic quality of the acoustic module.

[0067] According to various embodiments, the electronic device (200) may include a first acoustic path (e.g., the first path (301) of FIG. 4) formed in at least a part of the housing (210) and a second acoustic path (e.g., the second path (302) of FIG. 4) formed at least partially by the module housing and spatially connected to the first acoustic path. The electronic device (200) may include a filter structure (e.g., the filter structure (400) of FIG. 4) that selectively blocks external foreign matter and / or moisture by being disposed between the first acoustic path and the second acoustic path. The filter structure may include a filter member (e.g., the filter member (430) of FIG. 4) disposed between the first acoustic path and the second acoustic path and selectively spatially connecting the two acoustic paths, and a filter bracket (e.g., the filter bracket (410) of FIG. 4) supporting the filter member. The filter bracket may include a through hole (e.g., through hole (413) in FIG. 4) that spatially connects the first acoustic path and the second acoustic path. The electronic device (200) may include a sealing member (e.g., second waterproof member (420) in FIG. 4) disposed between the filter bracket and the housing of the electronic device to surround the through hole. For example, an arrangement structure in which the filter member and the sealing member are placed side by side between the filter bracket and the housing (210) may cause acoustic defects, such as acoustic distortion occurring in the acoustic module due to acoustic bottlenecking, by narrowing the width (e.g., spatial volume) of the through hole.

[0068] An electronic device (200) according to an exemplary embodiment of the present disclosure may include an opposing surface arrangement structure in which a sealing member is disposed between a filter bracket and a housing (210) of the electronic device (200), and a filter member is disposed between the filter bracket and a module housing. The opposing surface arrangement structure can widen the width (e.g., spatial volume) of the through hole, thereby reducing the distortion of sound generated in the acoustic module due to acoustic bottlenecking and improving the acoustic quality of the acoustic module. For example, the filter member and the sealing member may be disposed on different opposing surfaces of the filter bracket, respectively, to help expand the spatial volume of the through hole connecting the first acoustic path and the second acoustic conduit.

[0069] FIG. 3 is a drawing of the internal structure of an electronic device according to various embodiments of the present disclosure, viewed from the rear direction.

[0070] Referring to FIG. 3, the electronic device (200) may include a plurality of electrical components disposed in an internal space (2001). In one embodiment, the plurality of electrical components may include a battery (B), at least one substrate (240, 250), a camera module (205), or at least one sound output device (220, 220-1) (e.g., a speaker). In one embodiment, the at least one substrate (240, 250) may include a first substrate (240) (e.g., a main printed circuit board) and a second substrate (250) (e.g., a sub printed circuit board) spaced apart from the first substrate (240). In one embodiment, the electronic device (200) may include an electrical connection member (260) disposed to electrically connect the first substrate (240) and the second substrate (250). In one embodiment, the electrical connection member (260) may include a flexible printed circuit board (FPCB). In one embodiment, the electrical connection member (260) may include connectors (e.g., plugs) disposed at both ends. In one embodiment, the connectors may be disposed on a flexible substrate and secured to a stiffener providing rigidity. In one embodiment, the electrical connection member (260) may electrically connect the two substrates (240, 250) in such a way that the connectors disposed to be supported by the stiffeners are connected to a receptacle (e.g., socket) disposed on the first substrate (240) and / or the second substrate (250).

[0071] According to various embodiments, the acoustic output device may include a first acoustic output device (220) and a second acoustic output device (220-1) disposed inside the electronic device (200) such that the main radiation direction of the sound generated from the acoustic module (e.g., the acoustic module (320) of FIG. 4) is the y-axis direction. In one embodiment, the first acoustic output device (220) and the second acoustic output device (220-1) may have substantially the same arrangement structure. In the following description, the description of the second acoustic output device (220-1) will be replaced with the description of the first acoustic output device (220). In some embodiments, the acoustic output device may include a first acoustic output device (220), a second acoustic output device (220-1), a third acoustic output device (not shown), and a fourth acoustic output device (not shown) disposed inside the electronic device (200) such that the main radiation direction of the sound generated from the acoustic module is the y-axis direction. In some embodiments, at least one of the first sound output device (220), the second sound output device (220-1), the third sound output device, and the fourth sound output device may be omitted.

[0072] FIG. 4 is a partial cross-sectional view of an electronic device shown along line 4-4 of FIG. 2a according to various embodiments of the present disclosure.

[0073] Referring to FIG. 4, the electronic device (200) may include a front cover (202), a rear cover (211) coupled to the front cover (202), and an acoustic output device (220) disposed in a first space (2101) between the front cover (202) and the rear cover (211). In one embodiment, the electronic device (200) may include a display (201) disposed in the first space (2101) so as to be visible from the outside through at least a portion of the front cover (202).

[0074] According to various embodiments, the electronic device (200) may include a first path (301) formed to be connected to the outside of the electronic device (200). The acoustic output device (220) may include a module housing (310) that is disposed in a first space (2101) and includes a second path (302) connected to the first path (301), and an acoustic module (320) disposed to be supported by the module housing (310). In one embodiment, the acoustic output device (220) may include a second space (2102) (e.g., a resonance space) that is spatially separated from the first space (2101) and formed by the module housing (310) being coupled to at least a portion of the rear cover (211). At least a portion of the second space (2102) may be provided as a resonance space for the acoustic module (320). The second space (2102) can be sealed through a first waterproof member (340) (e.g., a first sealing member) disposed between the module housing (310) and the rear cover (211). The first waterproof member (340) can be attached to at least a portion of the module housing (310) via a waterproof tape (T). A semi-modular acoustic path structure that provides a second space (2102) formed by opening a portion of the module housing (310) and sealing the open portion through the rear cover (211) can help to slim down the electronic device (200) and secure freedom in the design of the placement of peripheral components.

[0075] According to various embodiments, the acoustic output device (220) may include a blocking member (350) disposed at least partially between the module housing (310) and the rear cover (211) in the second space (2102). By disposing of the blocking member (350), the outermost end where the sound generated from the acoustic module (320) is reflected is changed from the first waterproof member (340) to the blocking member (350), so that the distance between the center (320c) of the acoustic module and the outermost end where the sound generated from the acoustic module (320) is reflected can be shortened from L1 to L2. As a result, the acoustic module (320) can have a relatively high decibel in the high frequency range. This shortened acoustic reflection structure can reduce the volume drop of the acoustic module (320) in the high frequency range and improve the acoustic quality of the acoustic module (320).

[0076] According to various embodiments, the module housing (310) may include a second path (302) connected to a second space (2102). In one embodiment, when the module housing (310) is placed in a first space (2101), the second path (302) may be connected to the first path (301). In one embodiment, the acoustic output device (220) may include a filter structure (400) (e.g., a filter) arranged to selectively block the first path (301) and the second path (302). In one embodiment, the filter structure (400) may include a filter bracket (410) including a through hole (413) spatially connecting the first path (301) and the second path (302), and a filter member (430) supported by the filter bracket (410) and selectively blocking the through hole (413). In one embodiment, the filter structure (400) may be positioned to be supported by a filter bracket (410) positioned between the front cover (202) and the rear cover (211). In one embodiment, the filter structure (400) may include a filter member (430) for selectively blocking external foreign matter and / or moisture. The filter member (430) may be positioned between the filter bracket (410) and the module housing (310). The filter member (430) may be formed of a breathable member. For example, the filter member (430) may include at least one of a mesh, a non-woven fabric, or a membrane. In one embodiment, the filter structure (400) may include a second waterproof member (420) (e.g., a second sealing member) that seals around the filter structure (400) so that the first path (301) and the second path (302) are connected to each other only through the filter structure (400). The second waterproof member (420) can be placed between the filter bracket (410) and the rear cover (211). In one embodiment, the width of the through hole (413) can be widened by placing the filter member (430) and the second waterproof member (420) on different sides of the filter bracket (410), respectively.By widening the width (e.g., spatial volume) of the through hole (413) of the filter bracket (410), the distortion of sound generated in the acoustic module (320) due to acoustic bottlenecking can be reduced and the sound quality of the acoustic module (320) can be improved.

[0077] FIG. 5a is an enlarged view of an acoustic output device according to various embodiments of the present disclosure, viewed from the rear. FIG. 5b is a view of a first waterproof member and a blocking member according to various embodiments of the present disclosure, viewed from the rear.

[0078] Referring to FIGS. 5a and 5b, the first waterproof member (340) may be positioned to surround the acoustic module (320) and the blocking member (350) within the second space (2102). In one embodiment, when the module housing (310) is viewed from above (e.g., in the z-axis direction), the first waterproof member (340) may be positioned so as not to overlap with the acoustic module (320). When the module housing (310) is viewed from above, the blocking member (350) may be positioned to overlap with at least a portion of the acoustic module (320).

[0079] According to various embodiments, the acoustic output device (220) may include an opening (e.g., the opening (330) of FIG. 6) that corresponds to at least a portion of the acoustic module (320) and the rear cover (211) formed in the module housing (310). In one embodiment, the module housing (310) may include a support member (311) formed along the edge of the opening and positioned to support the acoustic module (320). In one embodiment, a blocking member (350) may be positioned between at least a portion of the support member (311) of the module housing (310) and the rear cover (211). The blocking member (350) may be positioned within the second space (2102), excluding the portion where the second path (302) is connected to the first path (301) through the through hole (413). The blocking member (350) may have an open loop shape within the second space (2102). The blocking member (350) may be formed in a 'U' shape or in a 'square' shape with at least a part open. In one embodiment, the sound generated from the acoustic module (320) is reflected from the blocking member (350) through the blocking member (350) disposed inside the first waterproof member (340), thereby shortening the length of the center (320c) of the acoustic module and the outermost end where the sound generated from the acoustic module (320) is reflected from L1 to L2. As a result, the acoustic module (320) may have a relatively high decibel in the high frequency range. This shortened acoustic reflection structure can reduce the volume drop of the acoustic module (320) in the high frequency range and improve the acoustic quality of the acoustic module (320).

[0080] According to various embodiments, sound generated from the acoustic module (320) may be emitted to the outside of the electronic device (200) through an acoustic path including a second space (2102), a second path (302), a through hole (413), and a first path (301). In one embodiment, when the module housing (310) is viewed from above (e.g., in the z-axis direction), the filter structure (400) may be positioned to correspond to at least a portion of one of the corners of the acoustic module (320) to form a path through which sound generated from the acoustic module (320) is emitted. In some embodiments, the filter structure (400) may be positioned to correspond to one of the corners of the acoustic module (320) so that the through hole (413) of the filter structure (400) corresponds to an open portion of the blocking member (350). In one embodiment, the through hole (413) of the filter structure (400) may be formed in multiple numbers.

[0081] FIG. 6 is a partial cross-sectional view of an electronic device including an acoustic output device shown along line 6-6 of FIG. 5a according to various embodiments of the present disclosure.

[0082] Referring to FIG. 6, the acoustic output device (220) may be formed in the module housing (310) and may include an opening (330) corresponding to at least a part of the acoustic module (320) and the rear cover (211). In one embodiment, the opening (330) of the module housing (310) is opened, and the opening (330) is sealed through the rear cover (211) to form a second space (2102), which may help to slim down the electronic device (200). In one embodiment, a first waterproof member (340) may be positioned to surround the opening (330) to seal the space between the module housing (310) and the rear cover (211).

[0083] FIG. 7a is an enlarged view of region 7 of FIG. 6 according to various embodiments of the present disclosure. FIG. 7b, FIG. 7c, and FIG. 7d are enlarged cross-sectional views of a portion of an electronic device including an acoustic output device according to various embodiments of the present disclosure.

[0084] Referring to FIG. 7a, the blocking member (350) may be formed of an elastic member. For example, the blocking member (350) may include silicone, rubber, or cured liquid silicone rubber (LSR). In one embodiment, the blocking member (350) may be positioned between the support member (311) of the module housing (310) and the rear cover (211). When the module housing (310) and the rear cover (211) are sealed by the first waterproof member (340), one end of the blocking member (350) may be fixed to the support member (311) of the module housing (310), and the other end of the blocking member (350) may be compressed by contacting the rear cover (211). In some embodiments, when the module housing (310) and the rear cover (211) are sealed by the first waterproof member (340), one end of the blocking member (350) is fixed to the rear cover (211), and the other end of the blocking member (350) can be compressed by contacting the support portion (311) of the module housing (310). In one embodiment, the blocking member (350) may be formed of a material that blocks moisture and is compressible.

[0085] Referring to FIG. 7b, the blocking member (350-1) may be formed of a metal member (351) and an elastic member (352). For example, the elastic member (352) of the blocking member (350-1) may include silicone, rubber, or cured liquid silicone rubber (LSR). In one embodiment, the blocking member (350-1) may be positioned between the support member (311) of the module housing (310) and the rear cover (211). In one embodiment, when the module housing (310) and the rear cover (211) are sealed by the first waterproof member (340), the metal member (351) of the blocking member (350-1) may be fixed to the support member (311) of the module housing (310), and the elastic member (352) of the blocking member (350-1) may be compressed by contacting the rear cover (211). In one embodiment, the metal member (351) of the blocking member (350-1) may be attached to the support member (311) of the module housing (310) via an adhesive (e.g., bond). In one embodiment, the blocking member (350-1) may be formed of a compressible material that blocks moisture.

[0086] Referring to FIG. 7c, the blocking member (350-2) may be formed of an elastic member. For example, the blocking member (350-2) may include silicone, rubber, or cured liquid silicone rubber (LSR). In one embodiment, the blocking member (350-2) may be positioned between the support member (311) of the module housing (310) and the rear cover (211). In one embodiment, when the module housing (310) and the rear cover (211) are sealed by the first waterproof member (340), one end of the blocking member (350-2) may be fixed to the support member (311) of the module housing (310), and the other end of the blocking member (350-2) may be compressed by contacting the rear cover (211). In some embodiments, when the module housing (310) and the rear cover (211) are sealed by the first waterproof member (340), one end of the blocking member (350-2) is fixed to the rear cover (211), and the other end of the blocking member (350-2) can be compressed by contacting the support member (311) of the module housing (310). In one embodiment, the blocking member (350-1) may be formed of a material that blocks moisture and is compressible.

[0087] Referring to FIG. 7d, the blocking member (350-3) may be formed of a metal member (351) and an elastic member (352). For example, the elastic member (352) of the blocking member (350-3) may include silicone, rubber, or cured liquid silicone rubber (LSR). In one embodiment, the blocking member (350-3) may be positioned between the support member (311) of the module housing (310) and the rear cover (211). In one embodiment, when the module housing (310) and the rear cover (211) are sealed by the first waterproof member (340), the metal member (351) of the blocking member (350-3) may be fixed to the support member (311) of the module housing (310), and the elastic member (352) of the blocking member (350-3) may be compressed by contacting the rear cover (211). In one embodiment, at least a portion of the support portion (311) of the module housing (310) may have a groove formed in a shape corresponding to the metal member (351) of the blocking member (350-3). The metal member (351) of the blocking member (350-3) may be fitted into the groove of the support portion (311) of the module housing (310). In one embodiment, the blocking member (350-3) may be formed of a material that blocks moisture and is compressible.

[0088] According to various embodiments, the first waterproof member (340) may be formed of an elastic member. For example, at least a portion of the first waterproof member (340) may comprise silicone, rubber, or cured liquid silicone rubber (LSR). In one embodiment, the first waterproof member (340) may be positioned between the module housing (310) and the rear cover (211). In one embodiment, one end of the first waterproof member (340) may be secured to the module housing (310) via a waterproof tape (T), and the other end of the first waterproof member (340) may be compressed by contacting the rear cover (211). In some embodiments, the first waterproof member (340) may be formed of a material that blocks moisture and is compressible.

[0089] FIG. 8 is a graph comparing the performance of an acoustic output device with and without the application of a blocking member according to various embodiments of the present disclosure.

[0090] Referring to FIG. 8, compared to the comparative example where the sound generated from the acoustic module (320) is transmitted through an acoustic path including a second space (2102), a second path (302), a through hole (413), and a first path (301) without the blocking member (350) being placed (e.g., graph 501), when the sound is transmitted through an acoustic path where the distance between the center (320c) of the acoustic module and the outermost end where the sound generated from the acoustic module (320) is reflected is shortened by the placement of the blocking member (350) (e.g., graph 502), it can be seen that the acoustic performance is improved by the acoustic module (320) having a relatively high decibel in the audible frequency band (e.g., area 503).

[0091]

[0092] For example, by placing a blocking member (350), the distance (L, [mm]) between the center (320c) of the acoustic module and the outermost end where the sound generated from the acoustic module (320) is reflected is shortened from L1 to L2, so that the acoustic module (320) can have a relatively high decibel (f, [dB]) in the audible frequency band (e.g., 503 range, [Hz]). This shortened acoustic reflection structure can reduce the volume drop of the acoustic module (320) in the high frequency range and improve the acoustic quality of the acoustic module (320).

[0093] FIG. 9 is an enlarged view of area 9 of FIG. 6 according to various embodiments of the present disclosure.

[0094] Referring to FIG. 9, the filter bracket (410) may include a first bracket surface (411) facing a first path (301), a second bracket surface (412) facing a second path (302), and a through hole (413) connecting the first path (301) and the second path (302). In one embodiment, a filter member (430) may be disposed between the filter bracket (410) and the module housing (310) at the second bracket surface (412) of the filter bracket (410). In one embodiment, the filter structure (400) may include a second waterproof member (420) that seals around the through hole (413) so that the first path (301) and the second path (302) are connected to each other only through the through hole (413). The second waterproof member (420) can be positioned between the filter bracket (410) and the rear cover (211) on the first bracket surface (411) of the filter bracket (410). In one embodiment, the width of the through hole (413) can be widened by positioning the second waterproof member (420) and the filter member (430) on the first bracket surface (411) and the second bracket surface (412) of the filter bracket (410), respectively. A facing arrangement structure in which a second waterproof member (420) is disposed between the filter bracket (410) and the rear cover (211), and a filter member (430) is disposed between the filter bracket (410) and the module housing (310), can widen the width (e.g., spatial volume) of the through hole (413) of the filter bracket (410), thereby reducing the distortion of sound generated in the acoustic module (320) due to acoustic bottlenecking and improving the acoustic quality of the acoustic module (320).

[0095] According to various embodiments, the second waterproof member (420) may be formed of an elastic member. For example, at least a portion of the second waterproof member (420) may comprise silicone, rubber, or cured liquid silicone rubber (LSR). In one embodiment, the second waterproof member (420) may be positioned between the first bracket surface (411) of the filter bracket (410) and the rear cover (211). In one embodiment, one end of the second waterproof member (420) may be fixed to the first bracket surface (411) of the filter bracket (410), and the other end of the second waterproof member (420) may be compressed in contact with the rear cover (211). In some embodiments, one end of the second waterproof member (420) may be fixed to the rear cover (211), and the other end of the second waterproof member (420) may be compressed in contact with the first bracket surface (411) of the filter bracket (410). In some embodiments, the second waterproof member (420) may be formed of a compressible material that blocks moisture.

[0096] FIG. 10 is a graph comparing the performance of an acoustic output device with and without the application of a filter member according to various embodiments of the present invention.

[0097] Referring to FIG. 10, compared to the comparative example where the second waterproof member (420) and the filter member (430) of the filter structure (400) are placed on the same surface of the filter bracket (410) (e.g., the first bracket surface (411) or the second bracket surface (412)) (e.g., graph 601), when the second waterproof member (420) and the filter member (430) of the filter structure (400) are placed on the first bracket surface (411) and the second bracket surface (412) of the filter bracket (410) respectively (e.g., graph 602), the width of the through hole (413) of the filter structure (400) is widened, and the acoustic module (320) can improve the acoustic quality of the acoustic module (320) by reducing the total harmonic distortion (THD, [%]) of the acoustic module (320) due to acoustic bottlenecking across the entire frequency band ([Hz]).

[0098] According to various embodiments, an electronic device (e.g., the electronic device (200) of FIG. 4) comprises a housing (e.g., the housing (210) of FIG. 4) having a first path (e.g., the first path (301) of FIG. 4), a module housing (e.g., the module housing (310) of FIG. 4) having a second path (e.g., the second path (302) of FIG. 4) that is disposed in a first space (e.g., the first space (2101) of FIG. 4) and connected to the first path, an acoustic module (e.g., the acoustic module (320) of FIG. 4) supported by at least a portion of the module housing, an opening (e.g., the opening (330) of FIG. 6) formed in the module housing and corresponding to at least a portion of the acoustic module and the housing, and a first waterproofing member that is disposed between the module housing and the housing to surround the opening and forms a second space (e.g., the second space (2102) of FIG. 4) connected to the second path. It may include a member (e.g., the first waterproof member (340) of FIG. 4), and a blocking member (e.g., the blocking member (350) of FIG. 4) disposed at least partially between the module housing and the housing in the second space.

[0099] According to various embodiments, the blocking member may have an open loop shape in the second space.

[0100] According to various embodiments, the blocking member may be positioned excluding the second path.

[0101] According to various embodiments, at least a portion of the second space may be provided as a resonance space of the acoustic module.

[0102] According to various embodiments, when the module housing is viewed from above, the first waterproof member may be positioned so as not to overlap with the acoustic module.

[0103] According to various embodiments, when the module housing is viewed from above, the blocking member may be positioned to overlap with at least a portion of the acoustic module.

[0104] According to various embodiments, the module housing includes a support member (e.g., a support member (311) of FIG. 6) for supporting the acoustic module along the edge of the opening, and the blocking member may be disposed between at least a portion of the support member and the housing.

[0105] According to various embodiments, the blocking member may be positioned excluding the second path.

[0106] According to various embodiments, the blocking member may be formed of a metal member and / or an elastic member.

[0107] According to various embodiments, the electronic device further comprises a filter structure (e.g., filter structure (400) of FIG. 4) disposed between the first path and the second path, and the filter structure may include a filter bracket (e.g., filter bracket (410) of FIG. 9) comprising a first bracket surface facing the first path (e.g., first bracket surface (411) of FIG. 9), a second bracket surface facing the second path (e.g., second bracket surface (412) of FIG. 9), and a through hole (e.g., through hole (413) of FIG. 9) connecting the first path and the second path, a second waterproof member (e.g., second waterproof member (420) of FIG. 9) disposed to surround the first path and the through hole between the filter bracket and the housing, and a filter member (e.g., filter member (430) of FIG. 9) disposed to selectively block the second path and the through hole between the filter bracket and the module housing.

[0108] According to various embodiments, the second waterproof member may be disposed on the second bracket surface, and the filter member may be disposed on the first bracket surface.

[0109] According to various embodiments, the second waterproof member can be fixed to the filter bracket.

[0110] According to various embodiments, the second waterproof member is an electronic device fixed to the housing.

[0111] According to various embodiments, the second waterproof member may be formed of an elastic member.

[0112] According to various embodiments, the filter member may be formed as a breathable member.

[0113] According to various embodiments, an electronic device (e.g., the electronic device (200) of FIG. 4) comprises a housing (e.g., the housing (210) of FIG. 4) having a first path (e.g., the first path (301) of FIG. 4), a module housing (e.g., the module housing (310) of FIG. 4) disposed in a first space (e.g., the first space (2101) of FIG. 4)) of the housing and having a second path (e.g., the second path (302) of FIG. 4) connected to the first path, an acoustic module (e.g., the acoustic module (320) of FIG. 4) supported by at least a portion of the module housing, and a filter structure (400) disposed between the first path and the second path, wherein the filter structure comprises a first bracket surface (e.g., the first bracket surface (411) of FIG. 9) facing the first path, a second bracket surface (e.g., the second bracket surface (412) of FIG. 9) facing the second path, and the It may include a filter bracket (e.g., filter bracket (410) of FIG. 9) having a through hole (e.g., through hole (413) of FIG. 9) connecting a first path and the second path, a second waterproof member (e.g., second waterproof member (420) of FIG. 9) disposed to surround the first path and the through hole between the filter bracket and the housing, and a filter member (e.g., filter member (430) of FIG. 9) disposed to selectively block the second path and the through hole between the filter bracket and the module housing.

[0114] According to various embodiments, the second waterproof member may be disposed on the first bracket surface, and the filter member may be disposed on the second bracket surface.

[0115] According to various embodiments, the second waterproof member can be fixed to the filter bracket.

[0116] According to various embodiments, the second waterproof member can be fixed to the housing.

[0117] According to various embodiments, the second waterproof member may be formed of an elastic member.

[0118] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device (e.g., a laptop), a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0119] The embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present disclosure and to aid in understanding the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Accordingly, the scope of the various embodiments of the present disclosure should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In an electronic device, Housing (210) including a first path (301); A module housing (310) disposed in a first space (2101) of the above housing and including a second path (302) connected to the first path; An acoustic module (320) supported by at least a portion of the above module housing; An opening (330) formed in the above module housing and corresponding to at least a part of the acoustic module and the housing; A first waterproof member (340) disposed between the module housing and the housing to surround the opening and forming a second space (2102) connected to the second path; and An electronic device comprising a blocking member (350) disposed at least partially between the module housing and the housing in the second space.

2. In Paragraph 1, The above blocking member is an electronic device having an open loop shape in the second space.

3. In Paragraph 1, The above blocking member is an electronic device positioned excluding the above second path.

4. In Paragraph 1, An electronic device in which at least a portion of the second space is provided as a resonance space of the acoustic module.

5. In Paragraph 1, When the above module housing is viewed from above, the first waterproof member is an electronic device that does not overlap with the acoustic module.

6. In Paragraph 1, When the above module housing is viewed from above, the blocking member is an electronic device that overlaps with at least a part of the acoustic module.

7. In Paragraph 1, The above module housing includes a support member (311) for supporting the acoustic module along the edge of the opening, and The above blocking member is an electronic device disposed between at least a portion of the support and the housing.

8. In Paragraph 7, The above blocking member is an electronic device positioned excluding the above second path.

9. In Paragraph 1, The above-mentioned blocking member is an electronic device formed of a metal member and / or an elastic member.

10. In Paragraph 1, The above electronic device is, It further includes a filter structure (400) positioned between the first path and the second path, and The above filter structure is, A filter bracket (410) comprising a first bracket surface (411) facing the first path, a second bracket surface (412) facing the second path, and a through hole (413) connecting the first path and the second path, A second waterproof member (420) positioned to surround the first path and the through hole between the filter bracket and the housing, and An electronic device comprising a filter member (430) positioned to selectively block the second path and the through hole between the filter bracket and the module housing.

11. In Paragraph 10, The second waterproof member is disposed on the first bracket surface, and The above filter member is an electronic device disposed on the surface of the second bracket.

12. In Paragraph 10, The above second waterproof member is an electronic device fixed to the filter bracket.

13. In Paragraph 10, The above second waterproof member is an electronic device fixed to the housing.

14. In Paragraph 10, The above second waterproof member is an electronic device that is an elastic member.

15. In Paragraph 10, The above filter member is an electronic device that is a breathable member.

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