Electronic device comprising recess portion for reducing damage to printed circuit board

Abstract

This electronic device comprises: a wireless communication circuit; a conductive portion including a flange portion; a printed circuit board electrically connecting the wireless communication circuit to the conductive portion; a bracket spaced apart from the conductive portion; a fastening portion which includes a through hole for fixing an electronic component, and which is disposed between the flange portion of the conductive portion and the bracket; and a non-conductive portion encompassing the fastening portion. The non-conductive portion comprises: a first recess portion exposing a first surface of the flange portion; and a second recess portion formed between the fastening portion and the flange portion. A first width of a first end portion of the first recess portion is greater than a second width of a second end portion of the first recess portion, which is opposite to the first end portion.

Description

Electronic device including a recessed portion to reduce damage to a printed circuit board

[0001] The present disclosure relates to an electronic device comprising a recess portion for reducing damage to a printed circuit board.

[0002] The electronic device may include a printed circuit board. The printed circuit board may include a plurality of conductive layers. The printed circuit board may be configured to provide electrical connections between electronic components of the electronic device. For example, the printed circuit board may be configured to provide electrical connections between a wireless communication circuit and an antenna. The electronic device may include a conductive portion configured to function as an antenna radiator. The wireless communication circuit may be electrically connected to a feed point or ground point of the antenna radiator through the printed circuit board.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a wireless communication circuit. The electronic device may include a flange portion and a conductive portion adjacent to the edge of the electronic device and configured to function as an antenna radiator. A feed point or a ground point of the antenna radiator may be located on a first surface of the flange portion of the conductive portion. The electronic device may include a printed circuit board configured to electrically connect the wireless communication circuit and the feed point of the flange portion, or to electrically connect the ground of the electronic device and the ground point of the flange portion. The electronic device may include a bracket spaced apart from the conductive portion and supporting an electronic component. The electronic device may include a fastening portion that includes a through hole for fixing the electronic component, is disposed between the flange portion of the conductive portion and the bracket, and is spaced apart from the conductive portion and the flange portion. The electronic device may include a non-conductive portion that fills the gap between the bracket and the conductive portion and surrounds the fastening portion. The above non-conductive portion may include a first recess portion that exposes a first surface of the flange portion. The above non-conductive portion may include a second recess portion that is formed between the fastening portion and the flange portion, is connected to the first recess portion, and exposes a second surface of the flange portion that is perpendicular to the first surface of the flange portion. The first width (w1) of the first end of the first recess portion connected to the second recess portion may be wider than the second width (w2) of the second end of the first recess portion opposite to the first end.

[0005] An electronic device is disclosed. The electronic device may include a printed circuit board. The electronic device may include a flange portion and a conductive portion adjacent to the edge of the electronic device and configured to function as an antenna radiator. A feed point or ground point of the antenna radiator may be located on a first surface of the flange portion of the conductive portion facing the printed circuit board. The electronic device may include a printed circuit board electrically connected to the conductive portion through a conductive connection portion contacting the feed point or the ground point. The electronic device may include a bracket spaced apart from the conductive portion, supporting an electronic component, and comprising a conductive material. The electronic device may include a fastening portion that includes a through hole for fixing the electronic component, is disposed between the flange portion of the conductive portion and the bracket, and is spaced apart from the conductive portion and the flange portion. The electronic device may include a non-conductive portion that fills the space between the bracket and the conductive portion and surrounds the fastening portion. The above non-conductive portion may include a first recess portion that exposes a first surface of the flange portion. The above non-conductive portion may include a second recess portion that is formed between the fastening portion and the bracket, is connected to the first recess portion, and exposes a second surface of the flange portion that is perpendicular to the first surface of the flange portion. The width of the first recess portion may narrow from a first end of the first recess portion connected to the second recess portion to a second end of the first recess portion opposite to the first end.

[0006] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] FIG. 2 illustrates an electronic device according to one embodiment.

[0008] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0009] FIG. 4 illustrates an electronic device according to one embodiment.

[0010] FIG. 5 illustrates a bracket and conductive parts of an electronic device according to one embodiment.

[0011] FIG. 6 is part of an exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 7 is part of a perspective view of an electronic device according to one embodiment.

[0013] FIG. 8 illustrates a part of an electronic device with the non-conductive part omitted.

[0014] FIG. 9 illustrates a fastening part fixed through bridges during the manufacturing process of an electronic device.

[0015] FIG. 10 illustrates an electronic device from which bridges have been removed through a drilling process.

[0016] Figure 11 schematically illustrates the assembly process of a printed circuit board.

[0017] FIG. 12 illustrates the interior of an electronic device according to one embodiment.

[0018] Figure 13 shows the state in which a printed circuit board is placed on the electronic device of Figure 12.

[0019] FIGS. 14 and FIGS. 15 illustrate an electronic device according to a comparative example.

[0020] FIG. 16 illustrates the assembly process of a printed circuit board of an electronic device according to a comparative example.

[0021] FIG. 17 illustrates the assembly process of a printed circuit board of an electronic device according to one embodiment.

[0022] FIG. 18 illustrates an electronic device including an elastic member.

[0023] FIG. 19 illustrates an electronic device including rounded edges.

[0024] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0025] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0026] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0027] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence is performed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0028] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0029] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0030] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0031] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0032] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0033] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0034] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0035] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0036] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0037] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0038] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0039] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0040] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0041] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0042] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0043] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0044] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0045] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0046] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0047] FIG. 2 illustrates an electronic device according to one embodiment.

[0048] Referring to FIG. 2, an electronic device (101) according to one embodiment may include a housing (210) that forms the exterior of the electronic device (101). For example, the housing (210) may include a first surface (or front) (200A), a second surface (or rear) (200B), and a third surface (or side) (200C) that surrounds the space between the first surface (200A) and the second surface (200B).

[0049] An electronic device (101) according to one embodiment may include a display (e.g., a display module (160) of FIG. 1). The display (201) may include a substantially transparent window (e.g., a window (302) of FIG. 3). The window (302) may form at least a portion of a first surface (200A). For example, the window (302) may include a glass plate or a polymer plate comprising various coating layers, but is not limited thereto.

[0050] An electronic device (101) according to one embodiment may include a substantially opaque rear plate (211). According to one embodiment, the rear plate (211) may form at least a portion of a second surface (200B). According to one embodiment, the rear plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials.

[0051] An electronic device (101) according to one embodiment may include a side member (218). The side member (218) may be combined with a window (302) and / or a rear plate (211) to form at least a portion of a third surface (200C) of the electronic device (101). For example, the side member (218) may form the entire third surface (200C) of the electronic device (101). For example, the side member (218) may form the third surface (200C) of the electronic device (101) together with the window (302) and / or the rear plate (211).

[0052] An electronic device (101) according to one embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (217) or a light-emitting element (not shown)) or additionally include other components.

[0053] According to one embodiment, at least a portion of the display (201) may be visible through a window (302) forming a first surface (200A). According to one embodiment, the display (201) may include a display panel (e.g., the display panel (301) of FIG. 3) disposed on the back surface of the window (302).

[0054] According to one embodiment, the display (201) may include a display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the display area (201A).

[0055] According to one embodiment, the display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being overlapped with the display area (201A). For example, the sensing area (201B) may refer to an area capable of displaying visual information by the display (201) as well as other areas of the display area (201A), and additionally acquiring the user's biometric information (e.g., fingerprint). According to one embodiment, the sensing area (201B) may be formed in a key input device (217).

[0056] According to one embodiment, the display (201) may include an area where a first camera module (205) (e.g., camera module (180) of FIG. 1) is located. According to one embodiment, an opening is formed in the area of ​​the display (201), and the first camera module (205) (e.g., punch-hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). For example, the display area (201A) may surround at least a portion of the edge of the opening. According to one embodiment, the first camera module (205) (e.g., under-display camera, UDC) may be positioned below the display (201) so as to overlap with the area of ​​the display (201). For example, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to the direction toward the first surface (200A) through the area of ​​the display (201).

[0057] According to one embodiment, the display (201) may be combined with or adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer capable of detecting a magnetic field type stylus pen.

[0058] According to one embodiment, an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0059] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part area of ​​the third surface (200C) and / or a second microphone hole (204) formed in a part area of ​​the second surface (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound.

[0060] According to one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, it is not limited thereto.

[0061] According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed on a part of the third surface (200C) of the electronic device (101). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed on another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the illustration in FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the bottom part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the top part of the electronic device (101). However, it is not limited thereto, and according to one embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by the spaced-apart space between the display (201) and the side member (218).

[0062] According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole (not shown) for communication.

[0063] According to one embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0064] According to one embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) positioned to face a first surface (200A) of the electronic device (101), a second camera module (212) positioned to face a second surface (200B), and a flash (213).

[0065] According to one embodiment, the second camera module (212) may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module (212) is not necessarily limited to including a plurality of cameras and may include a single camera.

[0066] According to one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0067] According to one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. According to one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (101).

[0068] According to one embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be placed on a third side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0069] According to one embodiment, a connector hole (208) may be formed on a third surface (200C) of the electronic device (101) so as to accommodate a connector of an external device. A connection terminal (e.g., a connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0070] According to one embodiment, the side member (218) may include a vent hole (206). For example, air from outside the housing (210) may flow into the housing (210) through the vent hole (206). For example, air from inside the housing (210) may flow out of the housing (210) through the vent hole (206). The location of the vent hole (206) is not limited to the location shown in FIG. 2.

[0071] According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide state information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is coupled with the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0072] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0073] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0074] Referring to FIG. 3, an electronic device (101) according to one embodiment may include a side member (218), a bracket (243), a printed circuit board (250), a rear plate (211), and / or a battery (270). The printed circuit board (250) may include a first printed circuit board (251) which is a main board and a second printed circuit board (252) which is a sub-board.

[0075] An electronic device (101) according to one embodiment may include a side member (218) forming the exterior of the electronic device (101) (e.g., a third side (200C) of FIG. 2) and a bracket (243) coupled to the inside of the side member (218). For example, the side member (218) and the bracket (243) may be formed integrally. According to one embodiment, the side member (218) and the bracket (243) may be positioned between a display (201) and a rear plate (211). For example, the side member (218) may surround the space between the rear plate (211) and the display (201). A window (302) may be attached to the side member (218).

[0076] According to one embodiment, the bracket (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be placed on one side of the bracket (243) facing in one direction (e.g., +z direction), and a portion of the display (201) may be supported by the bracket (243). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera module (212) may be placed on the other side of the bracket (243) facing in the opposite direction (e.g., -z direction). For example, the first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera module (212) may each be seated in a recess defined by the side member (218) and / or the bracket (243). The bracket (243) may alternatively be referred to as a support member or a support plate.

[0077] According to one embodiment, a first printed circuit board (251), a second printed circuit board (252), and a battery (270) may each be coupled to a bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixedly positioned on the bracket (243) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned on the bracket (243) through an adhesive member (e.g., double-sided tape). However, it is not limited to the examples described above. As illustrated in FIG. 3, the first printed circuit board (251) and the second printed circuit board (252) may be positioned on one side (e.g., in the -z direction) of the bracket (243), but the arrangement structure of the present disclosure is not limited thereto. For example, the first printed circuit board (251) and the second printed circuit board (252) may be located on the other side (e.g., in the +z direction) of the bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be located between the display (201) and the bracket (243).

[0078] According to one embodiment, a support plate (260) may be disposed between the first printed circuit board (251) and the rear plate (211). According to one embodiment, a support plate (260) may be disposed on the first printed circuit board (251). For example, the support plate (260) may be disposed on the face of the first printed circuit board (251) facing the -z direction.

[0079] According to one embodiment, the support plate (260) may overlap at least partially with the first printed circuit board (251) with respect to the z-axis. According to one embodiment, the support plate (260) may cover at least a portion of the first printed circuit board (251). By doing so, the support plate (260) can protect the first printed circuit board (251) from physical impact or prevent the connector coupled to the first printed circuit board (251) from becoming detached.

[0080] According to one embodiment, the support plate (260) may be fixedly positioned on the first printed circuit board (251) through a coupling member (e.g., a screw) or may be coupled to the bracket (243) together with the first printed circuit board (251) through said coupling member.

[0081] According to one embodiment, the display (201) may be placed on a bracket (243). For example, a window (302) may be placed on one side (e.g., +z direction) of the display panel (301), and a bracket (243) may be placed on the other side (e.g., -z direction).

[0082] According to one embodiment, the window (302) may be combined with the display panel (301). For example, the window (302) and the display panel (301) may be bonded to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed between them.

[0083] According to one embodiment, the window (302) may be combined with a side member (218). For example, the window (302) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction, and may be bonded to the side member (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the window (302) and the side member (218). However, it is not limited to the examples described above.

[0084] According to one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (251) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other through a connecting member (e.g., a flexible printed circuit board).

[0085] According to one embodiment, a battery (270) (e.g., battery (189) of FIG. 1) can supply power to at least one component of an electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0086] An electronic device (101) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to one embodiment, the antenna module may be positioned between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, communicate near-field with an external device or wirelessly transmit and receive power with an external device.

[0087] According to one embodiment, a first camera module (205) (e.g., front camera) may be placed in at least a part of a bracket (243) so that a lens can receive external light through a part of a window (302) (e.g., front (200A) of FIG. 2) (e.g., camera area (237)).

[0088] According to one embodiment, a second camera module (212) (e.g., rear camera) may be positioned between a bracket (243) and a rear plate (211). According to one embodiment, the second camera module (212) may be electrically connected to a first printed circuit board (251) through a connecting member (e.g., a connector).

[0089] According to one embodiment, the housing (210) of the electronic device (101) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (101). In this regard, at least a part of the window (302), side member (218), bracket (243), and / or rear plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0090] FIG. 4 illustrates an electronic device according to one embodiment. FIG. 5 illustrates a bracket and conductive parts of an electronic device according to one embodiment.

[0091] Referring to FIG. 4, an electronic device (101) according to one embodiment may include a bracket (243) and non-conductive parts (e.g., a first non-conductive part (430) or a second non-conductive part (440)).

[0092] According to one embodiment, the bracket (243) can support electronic components placed inside the electronic device (101). For example, a battery (e.g., battery (270) of FIG. 3) and printed circuit boards (e.g., printed circuit boards (251, 252) of FIG. 3) of the electronic device (101) can be placed on the bracket (243) and supported by the bracket (243). The bracket (243) may include a conductive material (e.g., metal) to have high rigidity.

[0093] According to one embodiment, non-conductive portions may form at least a portion of the edge (e.g., side of the electronic device (101)) of the electronic device (101) and may be coupled to a bracket (243) disposed inside the electronic device (101).

[0094] For example, the electronic device (101) may include a first non-conductive portion (430) that forms at least a portion of the edge of the electronic device (101). The first non-conductive portion (430) forming the edge may be exposed to the outside of the electronic device (101). A bracket (243) disposed inside the electronic device (101) may be spaced apart from the first non-conductive portion (430). The first non-conductive portion (430) exposed to the outside of the electronic device (101) may have a continuous shape, thereby improving the appearance quality of the electronic device (101).

[0095] For example, the electronic device (101) may include a second non-conductive portion (440) that fills the space between the first non-conductive portion (430) and the bracket (243). The bracket (243) may be coupled to the first non-conductive portion (430) forming an edge through the second non-conductive portion (440). The second non-conductive portion (440) may be coupled to the bracket (243) and the first non-conductive portion (430). The first non-conductive portion (430) and the second non-conductive portion (440) may be formed integrally. The non-conductive portions may include a non-conductive material (e.g., a polymer). The non-conductive portions may be manufactured through injection molding. A display (e.g., the display (201) of FIG. 3) may be placed on the front of the electronic device (101) (e.g., the side of the electronic device (101) facing the +z direction), and a rear plate (e.g., the rear plate (211) of FIG. 3) may be placed on the rear of the electronic device (101) (e.g., the side of the electronic device (101) facing the -z direction).

[0096] FIG. 5 shows an electronic device (101) in which non-conductive parts are omitted from the electronic device (101) of FIG. 4. Referring to FIG. 5, an electronic device (101) according to one embodiment may include conductive parts (e.g., a first conductive part (410) or a second conductive part (420)). For example, the conductive parts may be positioned adjacent to the edge of the electronic device (101). A non-conductive material may be formed on the outer surface of the conductive parts to form a first non-conductive part (e.g., the first non-conductive part (430) of FIG. 4). The outer surface of some of the conductive parts may be covered by the non-conductive material forming the first non-conductive part (430). The conductive parts may not be visible from the outside by the first non-conductive part (430).

[0097] According to one embodiment, at least some of the conductive parts may be configured to function as antenna radiators for wireless communication with an external electronic device. For example, the conductive parts may include a first conductive part (410) and / or a second conductive part (420). The conductive parts may be configured to radiate electromagnetic waves corresponding to a radio frequency (RF) signal by being fed from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). The operating frequency of the RF signal may be set based on the length of each conductive part configured to function as an antenna radiator. Each of the conductive parts may be configured to radiate or receive an RF signal on a designated frequency band. The conductive parts may be spaced apart from each other.

[0098] According to one embodiment, the first conductive portion (410) may be configured to function as an antenna radiator of an antenna for transmitting and / or receiving RF signals on a designated frequency band. For example, the first conductive portion (410) may be positioned adjacent to the lower edge (e.g., the edge in the -y direction) of the electronic device (101). The first conductive portion (410) may include a flange portion (e.g., the first flange portion (411) or the second flange portion (421)) that includes a feed point electrically connected to a wireless communication circuit. When a power source is provided to the feed point of the flange portion, current flows along the first conductive portion (410), and electromagnetic waves may be emitted from the flow of said current. The first conductive portion (410) may be spaced apart from the other conductive portions so that the first conductive portion (410) can be electrically isolated from an adjacent other conductive portion (e.g., a second conductive portion (420)). When a non-conductive material is injected to form the aforementioned non-conductive portions, the gaps between the conductive portions may be filled by the non-conductive material. As illustrated in FIG. 4, when the edges of the electronic device (101) are viewed from the outside, the gaps between the conductive portions may not be visible.

[0099] According to one embodiment, the bracket (243) may be spaced apart from the conductive parts. For example, the bracket (243) and the first conductive part (410) may be spaced apart from each other. Since the bracket (243) contains a conductive material, if the bracket (243) and the first conductive part (410) are physically connected, the communication performance of the electronic device (101) may be degraded. A gap (510) may be formed between the spaced-apart bracket (243) and the first conductive part (410). The gap (510) may be filled by the aforementioned second non-conductive part (e.g., the second non-conductive part (440) of FIG. 4).

[0100] According to one embodiment, since the bracket (243) and the conductive parts are placed inside the electronic device (101), the manufacturing of the electronic device (101) may be easy. For example, if the conductive parts are exposed to the outside of the electronic device (101), gaps between the conductive parts may be visible from the outside of the electronic device (101). Since the length of each conductive part is set according to the operating frequency of the RF signals to be transmitted and / or received through each conductive part, the gaps may degrade the aesthetics of the electronic device (101). For example, if the gaps are arranged irregularly relative to each other, the aesthetics of the electronic device (101) may degrade. According to one embodiment, since the conductive parts are not visible from the outside, the design of the lengths of the conductive parts may be free regardless of the aesthetics of the electronic device (101).

[0101] An electronic device (101) according to one embodiment may include fastening portions. The fastening portions are portions to which electronic components (e.g., electronic component (650) of FIG. 6) disposed within the electronic device (101) are fastened, and may be used to maintain the position of the electronic components. For example, the electronic device (101) may include a fastening portion (620) that is at least partially disposed between a bracket (243) and a first flange portion (411). The fastening portion (620) may be spaced apart from the bracket (243) and the first flange portion (411) and may be electrically insulated from the bracket (243) and the first flange portion (411). When the gap (510) is filled by a second non-conductive portion (e.g., the second non-conductive portion (440) of FIG. 4), the fastening portion (620) may be surrounded by the second non-conductive portion (440). The fastening portion (620) can be secured by the second non-conductive portion (440). Since the fastening portion (620) is electrically insulated from the first flange portion (411) of the first conductive portion (410), the electromagnetic influence on the first conductive portion (410), which is configured to function as an antenna radiator, can be reduced. The process of forming the fastening portion (620) is described later with reference to FIG. 9.

[0102] FIG. 6 is part of an exploded perspective view of an electronic device according to one embodiment. FIG. 7 is part of a perspective view of an electronic device according to one embodiment. FIG. 8 shows a part of an electronic device with a non-conductive part omitted.

[0103] Referring to FIG. 6, a second non-conductive portion (440) and conductive portions (e.g., a first conductive portion (410) or a second conductive portion (420)) may be positioned inside a first non-conductive portion (430) that forms at least a portion of the edge of the electronic device (101). A portion of the second non-conductive portion (440) may be formed between the conductive portions and the first non-conductive portion (430), and another portion of the second non-conductive portion (440) may be formed between the bracket (243) and the conductive portions (e.g., a first conductive portion (410) or a second conductive portion (420)).

[0104] According to one embodiment, some of the conductive parts may include flange parts. For example, the first conductive part (410) may include a first flange part (411) protruding toward the interior of the electronic device (101), and the second conductive part (420) may include a second flange part (421) protruding toward the interior of the electronic device (101). For example, the first flange part (411) may include a feed point or a ground point of the first conductive part (410) configured to function as an antenna radiator. For example, the second flange part (421) may include a feed point or a ground point of the second conductive part (420) configured to function as an antenna radiator. In the present disclosure, the feed point may be replaced by a ground point, and the ground point may be replaced by a feed point.

[0105] According to one embodiment, the power supply point of the first conductive portion (410) may be located on one side of the first flange portion (411) facing the printed circuit board (610) (e.g., the first side (601) of the first flange portion (411) or the third side of the first flange portion (411) opposite to the first side (601). The first side (601) may be referred to as the side of the first flange portion (411) facing the rear of the electronic device (101) (e.g., the side of the electronic device (101) facing the -z direction). For example, the first side (601) of the first flange portion (411) may face the rear plate of the electronic device (101) (e.g., the rear plate (211) of FIG. 3) opposite to the display (e.g., the display (201) of FIG. 3). The above third surface (not shown) may be referred to as the surface of the first flange portion (411) facing the front of the electronic device (101) (e.g., the surface of the electronic device (101) facing the +z direction). For example, the third surface of the first flange portion (411) may face the rear plate (211).

[0106] For example, if the feed point of the first conductive portion (410) configured to function as an antenna radiator is located on the first surface (601), the feed point located on the first surface (601) may be electrically connected to the printed circuit board (610). For example, the printed circuit board (610) may include a protruding portion (611) facing the first surface (601) of the first flange portion (411). The electronic device (101) may include a conductive connection portion (e.g., the conductive connection portion (730) of FIG. 7) configured to electrically connect the printed circuit board (610) and the feed point by contacting the protruding portion (611) of the printed circuit board (610) and the feed point, respectively. For example, the conductive connection portion (730) may be referred to as a conductive connection member, a conductive clip, or an antenna contact. A wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) electrically connected to a printed circuit board (610) may be configured to power a power point through the printed circuit board (610) and a conductive connection (730). The printed circuit board (610) may be configured to electrically connect the wireless communication circuit and the power point of the first flange portion (411).

[0107] For example, if the ground point of the first conductive portion (410) is located on the first surface (601), the ground point of the first conductive portion (410) can be electrically connected to the ground of the electronic device (101) through the printed circuit board (610). For example, the bracket (243) can be configured to function as the ground of the electronic device (101). Among the plurality of layers included in the printed circuit board (610), at least one layer (e.g., a ground layer) can be electrically connected to the bracket (243) configured to function as the ground. According to one embodiment, the ground point of the first flange portion (411) can be electrically connected to the bracket (243) by being electrically connected to the printed circuit board (610). For example, the conductive connection (730) can be electrically connected to the ground point of the first flange portion (411) and to the ground layer of the printed circuit board (610) electrically connected to the bracket (243). The ground point of the first flange portion (411) can be grounded by being electrically connected to the bracket (243) through the conductive connection (730) and the ground layer of the printed circuit board (610).

[0108] According to one embodiment, when the printed circuit board (610) is placed under the bracket (243) (e.g., in the -z direction), the feed point or ground point may be located on the first surface (601) of the first flange portion (411) facing the rear of the electronic device (101). Since the first surface (601) of the first flange portion (411) on which the feed point or ground point is located faces the rear of the electronic device (101), the antenna including the first conductive portion (410) may be referred to as a rear feed structure or a rear contact structure. For example, if a power supply point is located on the second surface of the first flange portion (411) that is perpendicular to the first surface (601) and faces the bracket (243) (e.g., the second surface (602) in FIG. 7), the second surface (602) and the conductive connection (e.g., the conductive connection (730) in FIG. 7) placed on the printed circuit board (610) must be positioned to face each other, which may cause an increase in the size of the electronic device (101). In one embodiment, as the power supply point or ground point is located on the first surface (601) of the first flange portion (411), the size (e.g., length or thickness) of the electronic device (101) may be reduced.

[0109] In FIG. 6, the printed circuit board (610) is depicted as being positioned below the bracket (243) (e.g., in the -z direction), but the structure of the electronic device (101) according to the present disclosure is not limited thereto. For example, the printed circuit board (610) may be positioned above the bracket (243) (e.g., in the +z direction). When the printed circuit board (610) is positioned above the bracket (243), the printed circuit board (610) may be positioned between the display (e.g., the display (201) of FIG. 3) and the bracket (243). When the printed circuit board (610) is positioned above the bracket (243), the power supply point or ground point may be located on the third side of the first flange portion (411) facing the front of the electronic device (101) (e.g., the side of the first flange portion (411) opposite to the first side (601). Even if the power supply point or ground point is located on the third surface, the size of the electronic device (101) can be reduced substantially the same as described above.

[0110] An electronic device (101) according to one embodiment may include a printed circuit board (610) and a connector (630) (e.g., a connection terminal (178) in FIG. 1). For example, the printed circuit board (610) may correspond to a sub-printed circuit board (e.g., a second printed circuit board (252) in FIG. 3) placed on the lower part (e.g., -y direction) of the electronic device (101). A portion of the printed circuit board (610) may be placed on a second non-conductive portion (440). For example, the connector (630) may be used for electrical connection between an external electronic device and the electronic device (101). For example, the connector (630) may be referred to as a USB connector, but is not limited thereto. The connector (630) may be connected to the printed circuit board (610). The connector (630) can be electrically connected to a processor of the electronic device (101) (e.g., processor (120) of FIG. 1) through a printed circuit board (610). The connector (630) can be adjacent to the first flange portion (411) of the first conductive portion (410).

[0111] According to one embodiment, an opening (603) may be formed in a first non-conductive portion (430) of an electronic device (101) (e.g., a side member (218) of FIG. 3). A connector (630) may be positioned to face the opening (603). A connector of an external electronic device may be inserted through the opening (603) and connected to a connector (630) of the electronic device (101) positioned inside the electronic device (101). For example, a terminal of a charging device may be inserted through the opening (603) and connected to a connector (630) of the electronic device (101). Since the connector (630) positioned to face the opening (603) is exposed through the opening (603), the electronic device (101) may include a ring structure (640) for sealing the periphery of the connector (630). For example, a ring structure (640) may be positioned to surround the connector (630) to seal the gap between the printed circuit board (610) and the second non-conductive portion (440). The ring structure (640) may be configured to reduce the ingress of moisture or dust through the gap. The printed circuit board (610) connected to the connector (630) may be assembled to the second non-conductive portion (440) so that the connector (630) may be positioned to face the opening (603).

[0112] An electronic device (101) according to one embodiment may include an electronic component (650) and a support plate (660). For example, the support plate (660) may be placed below the printed circuit board (610) (e.g., in the -z direction) to cover the printed circuit board (610). The electronic component (650) may be placed on a bracket (243) and supported by the bracket (243). The electronic component (650) may be electrically connected to the printed circuit board (610). At least a portion of the electronic component (650) may be accommodated within the support plate (660).

[0113] For example, the electronic component (650) may include a speaker or a vibration motor, but the electronic component (650) in this disclosure is not limited thereto. According to one embodiment, the electronic component (650) may have a speaker and a vibration motor integrated into a single module-type electronic component. For example, the module-type electronic component (650) may output audio signals through vibration and may provide haptic notifications. When the electronic component (650) is provided as the module-type electronic component (650), the thickness of the electronic device (101) may be thinner than the thickness of the electronic device (101) when the speaker and the vibration motor are provided separately.

[0114] An electronic device (101) according to one embodiment may include a fastening portion (620) for fixing an electronic component (650). For example, the fastening portion (620) may include a through hole (621) for fixing. For example, the electronic component (650) may be fixed to the fastening portion (620) through a screw that is coupled to the electronic component (650) and the through hole (621).

[0115] Referring to FIG. 7, the electronic device (101) may include speaker holes (740) through which audio signals output from a speaker (e.g., the electronic component (650) of FIG. 6) placed inside the electronic device (101) are emitted to the outside of the electronic device (101). The speaker holes (740) may penetrate non-conductive parts (e.g., a first non-conductive part (430) and a second non-conductive part (440)). The electronic device (101) may include a waterproof member (750) for sealing the periphery of the speaker holes (740). For example, the waterproof member (750) may include, but is not limited to, flexible rubber. The electronic component (650) including the speaker may be fixed through a through hole (760) of the second non-conductive part (440) and a through hole (621) of the fastening part (620). As described above, since the second non-conductive part (440) is coupled to the first non-conductive part (430) and / or the bracket (243), the electronic part (650) can be fixed when a screw is fastened to the through hole (760) of the electronic part (650) and the second non-conductive part (440). The electronic part (650) can be fastened to the bracket (243) and the second non-conductive part (440). For example, the electronic part (650), including a speaker, can be fastened to the second non-conductive part (440) through a screw inserted into the through hole (760) of the second non-conductive part (440), and can be fastened to the bracket (243) through a screw inserted into the through hole (621) of the fastening part (620). As the electronic component (650) is fixed through the through holes (621, 760), the speaker can be tightly fitted to the speaker holes (740), so that the waterproof performance of the electronic device (101) can be ensured.

[0116] According to one embodiment, at least a portion of the fastening portion (620) may be positioned between the first flange portion (411) of the first conductive portion (410) and the bracket (243). The fastening portion (620) may be spaced apart from the bracket (243) and the first flange portion (411). For example, the fastening portion (620) may not be electrically connected to the bracket (243) and the first flange portion (411), and may be electrically insulated from the bracket (243) and the first flange portion (411). The fastening portion (620), which is physically separated from the bracket (243) and the first flange portion (411), may be located in the gap (e.g., the gap (510) of FIG. 5) between the conductive portion (e.g., the first conductive portion (410)) and the bracket (243). When the above gap is filled with the second non-conductive portion (440), the second non-conductive portion (440) can surround the fastening portion (620). The fastening portion (620) can be secured by the second non-conductive portion (440).

[0117] According to one embodiment, as the fastening portion (620) is physically separated from the first flange portion (411), the deterioration of the communication performance of the antenna including the first conductive portion (410) can be reduced.

[0118] For example, if the fastening portion (620) is physically connected to the first flange portion (411), the communication performance of the antenna including the first conductive portion (410) may be degraded. As described above, since the electronic component (650) is fixed through a screw inserted into the through hole (621) of the fastening portion (620), the fastening portion (620) may be thicker than a certain thickness to accommodate the insertion of the screw. Due to the thickness of the fastening portion (620), when the fastening portion (620) and the display (e.g., the display (201) of FIG. 3) come close together, the conductive material included in the display (201) may exert an electromagnetic influence on the first conductive portion (410) which functions as an antenna radiator. The electromagnetic influence may cause the communication performance of the antenna including the first conductive portion (410) to degrade. In order to reduce the deterioration of the communication performance of the antenna, the fastening portion (620) can be physically separated from the first flange portion (411). Since the fastening portion (620) is physically separated from the first flange portion (411), the deterioration of the communication performance of the antenna due to the distance between the fastening portion (620) and the display (201) can be reduced.

[0119] Referring to FIG. 7, the second non-conductive portion (440) may include a first recess portion (710) and a second recess portion (720). The first recess portion (710) may expose a first surface (601) of a first flange portion (411) where a power supply point or a ground point is located. For example, a mold for forming the second non-conductive portion (440) may include a cavity capable of forming the first recess portion (710). After a non-conductive material is injected into the cavity of the mold and the non-conductive material is cured, the second non-conductive portion (440) including the first recess portion (710) may be formed. The first recess portion (710) may be defined by a bottom surface located substantially on the same plane as the first surface (601) and side wall portions (770) perpendicular to the bottom surface so that the first surface (601) of the first flange portion (411) can be exposed. For example, the distance between the side wall portions (770) may be greater than the width of the first flange portion (411). The side wall portion (780) defining the second recess portion (720) may be located between the first recess portion (710) and the fastening portion (620).

[0120] According to one embodiment, a printed circuit board (e.g., the printed circuit board (610) of FIG. 8) may be placed on a bracket (243) and a second non-conductive portion (440). A conductive connection (730) may be in contact with each of the power supply point (or ground point) located on the first surface (601) and the printed circuit board (610).

[0121] Referring to FIG. 8, the printed circuit board (610) may include a protrusion (611) for electrical connection with a first conductive portion (410). The protrusion (611) may protrude to face a first surface (601) of the first flange portion (411). At least a portion of the protrusion (611) may be placed on sidewall portions (e.g., sidewall portions (770) of FIG. 7) defining a first recess portion (e.g., first recess portion (710) of FIG. 7) and supported by said sidewall portions (770). The protrusion (611) of the printed circuit board (610) may face a first surface (601) of the first flange portion (411). The first surface (601) of the first flange portion (411) exposed through the first recess portion (710) may face the printed circuit board (610). A conductive connection portion (730) may be positioned between the first surface (601) and the printed circuit board (610) and may come into contact with each of the power supply point (or ground point) located on the first surface (601) and the printed circuit board (610). Since the power supply point and the printed circuit board (610) can be electrically connected by the protrusion portion (611) and the conductive connection portion (730), the first conductive portion (410) and the wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) electrically connected to the printed circuit board (610) can be electrically connected to each other. For example, since the ground point and the printed circuit board (610) can be electrically connected by the protruding part (611) and the conductive connection part (730), the bracket (e.g., the bracket (243) of FIG. 7) configured to function as the ground of the electronic device (101) and the ground point can be electrically connected to each other.

[0122] According to one embodiment, a fastening portion (620) spaced apart from the first flange portion (411) and the bracket (e.g., the bracket (243) of FIG. 7) may include a different through hole (622) that is different from the through hole (621) for fixing an electronic component (e.g., the electronic component (650) of FIG. 6). The other through hole (622) may be spaced apart from the through hole (621). The other through hole (622) may be used for fixing a printed circuit board (610). For example, the printed circuit board (610) may include a through hole (810) corresponding to the other through hole (622). The printed circuit board (610) may be fixed through a screw coupled to the through hole (810) of the printed circuit board (610) and the other through hole (622) of the fastening portion (620).

[0123] According to one embodiment, a second recess portion (e.g., the second recess portion (720) of FIG. 7) may be formed during the manufacturing process of an electronic device (101). Hereinafter, the process of forming the second recess portion (720) during the manufacturing process of an electronic device (101) is described.

[0124] FIG. 9 illustrates a fastening part secured through bridges during the manufacturing process of an electronic device. FIG. 10 illustrates an electronic device from which the bridges have been removed through a drilling process.

[0125] Referring to FIG. 9, as described above, the fastening portion (620) may be spaced apart from the first flange portion (411) for waterproofing and communication performance. For example, the fastening portion (620) and the first flange portion (411) may not be connected to each other. The fastening portion (620) spaced apart from the first flange portion (411) may be located in the gap (510) between the first conductive portion (410) and the bracket (243). To form a second non-conductive portion (e.g., the second non-conductive portion (440) of FIG. 6), a non-conductive material forming the second non-conductive portion (440) may be injected into the gap (510) between the first conductive portion (410) and the bracket (243). When the gap (510) is filled with the second non-conductive portion (440), the fastening portion (620) can be fixed by the second non-conductive portion (440). For example, when a non-conductive material (e.g., resin) to form the second non-conductive portion (440) is injected into the gap (510), the non-conductive material can surround the fastening portion (620) located in the gap (510), and as the non-conductive material hardens, the fastening portion (620) can be fixed to the second non-conductive portion (440).

[0126] For example, before the non-conductive material is injected, the fastening portion (620) can be fixed through the bridges (910). Since the fastening portion (620) is positioned in the gap (510) while physically separated from the first flange portion (411) and the bracket (243), if the fastening portion (620) is not fixed, the position of the fastening portion (620) may deviate from the designated position during the injection process of the non-conductive material.

[0127] For example, the bridges (910) may include a first bridge (911) coupled to one side of the fastening portion (620) and the first flange portion (411), and a second bridge (912) coupled to the other side of the fastening portion (620) and the bracket (243). The fastening portion (620) may be secured through the bridges (910) coupled to both sides of the fastening portion (620).

[0128] With the fastening portion (620) fixed by the bridges (910), a non-conductive material can be injected to form a second non-conductive portion (440). When the non-conductive material is injected into the mold, the fastening portion (620) fixed by the bridges (910) can maintain a designated position. When the non-conductive material injected into the mold hardens, a second non-conductive portion (440) can be formed to fill the gap between the conductive portion and the bracket (243) and surround the fastening portion (620). The fastening portion (620) can be fixed by the second non-conductive portion (440).

[0129] For example, after forming the second non-conductive portion (440), the bridges (910) can be removed. When the bridges (910) are removed, a fastening portion (620) spaced apart from the first flange portion (411) and the bracket (243) can be formed. The bridges (910) used to secure the fastening portion (620) during the injection process can be removed through a drilling process using a CNC (computer numerical control) machine. During the drilling process to remove the bridges (910), a portion of the second non-conductive portion (440) overlapping the bridges (910) can be removed together with the bridges (910).

[0130] Referring to FIG. 10, a portion of the second non-conductive portion (440) that overlapped with the bridges (e.g., the bridges (910) of FIG. 9) during the drilling process may be removed together with the bridges (910). By removing said portion of the second non-conductive portion (440), a second recess portion (720) may be formed. Since the bridges (910) are joined to the first flange portion (411), the second recess portion (720) formed during the drilling process may be formed between the first flange portion (411) and the fastening portion (620) and may be connected to the first recess portion (710) which exposes the first surface (601) of the first flange portion (411).

[0131] According to one embodiment, the first depth of the first recess portion (710) may differ from the second depth of the second recess portion (720). The first depth of the first recess portion (710), formed to expose the first surface (601) of the first flange portion (411), may be smaller than the second depth of the second recess portion (720), formed during the drilling process. For example, the second depth may be larger than the first depth. The second recess portion (720), having a relatively larger second depth, may expose the second surface (602) of the first flange portion (411). The second surface (602) of the first flange portion (411) may be referenced as the surface of the first flange portion (411) that is substantially perpendicular to the first surface (601) of the first flange portion (411) and faces the bracket (243). For example, the second surface (602) of the first flange portion (411) may face in the +y direction.

[0132] According to one embodiment, the second recess portion (720) formed through a drilling process using a CNC machine may have a substantially circular cross-section. The diameter (d) of the circular cross-section may be larger than the width of the first recess portion (710).

[0133] According to one embodiment, the second non-conductive portion (440) may include sidewall portions (770) defining the first recess portion (710). For example, when the first recess portion (710) having a first depth is formed, the sidewall portions (770) may be formed by a step formed along the edge of the first recess portion (710). For example, the sidewall portions (770) may include a first sidewall portion (771) and a second sidewall portion (772) arranged to face each other along a first flange portion (411) protruding toward the bracket (243). The distance between the first sidewall portion (771) and the second sidewall portion (772) may be defined as the width of the first recess portion (710).

[0134] According to one embodiment, after non-conductive parts (e.g., a first non-conductive part (430) or a second non-conductive part (440)) are formed, a printed circuit board (e.g., the printed circuit board (610) of FIG. 11) can be assembled. The printed circuit board (610) can be placed on the bracket (243) and the second non-conductive part (440). During the assembly process of the printed circuit board (610), damage to the printed circuit board (610) may occur. The assembly process of the printed circuit board (610) is described below.

[0135] Figure 11 schematically illustrates the assembly process of a printed circuit board.

[0136] Referring to FIG. 11, a printed circuit board (610) can be connected to a connector (630). A ring structure (640) for sealing the periphery of the connector (630) can surround at least a portion of the connector (630). The printed circuit board (610) can be assembled so as to be seated on the seating portion (1110) of the second non-conductive portion (440). When the printed circuit board (610) is assembled, the connector (630) can be positioned to face an opening (e.g., the opening (603) in FIG. 6).

[0137] The state (1101) of FIG. 11 can be referenced as a process in which a printed circuit board (610) is inserted into a seating portion (1110) of a second non-conductive portion (440). Referring to the state (1101), the printed circuit board (610) can be assembled at an angle with respect to the second non-conductive portion (440). Since the ring structure (640) must be in close contact with the second non-conductive portion (440) to seal the periphery of the connector (630), the printed circuit board (610) can be inserted at an angle with respect to the second non-conductive portion (440) so that the ring structure (640) is in close contact with the second non-conductive portion (440).

[0138] The state (1102) of FIG. 11 may be referenced as a state in which the printed circuit board (610) is assembled. After the printed circuit board (610) is inserted obliquely with respect to the second non-conductive portion (440), when an external force is applied to the printed circuit board (610), the printed circuit board (610) can be seated on the seating portion (1110). The ring structure (640) can be in close contact with the inner surface of the second non-conductive portion (440) to seal the periphery of the connector (630). Since the gap between the second non-conductive portion (440) and the ring structure (640) must be sealed, the obliquely inserted printed circuit board (610) can be pressed in a direction toward the opening (e.g., -y direction) by the external force. As the printed circuit board (610) is pressed in the above direction, the printed circuit board (610) is seated on the seating portion (1110), and the ring structure (640) can be in close contact with the inner surface of the second non-conductive portion (440).

[0139] In the assembly process described above, since an external force is applied to the printed circuit board (610) inserted at an angle, physical damage to the printed circuit board (610) may occur. The process of causing such damage will be described later with reference to FIG. 13.

[0140] An electronic device according to one embodiment (e.g., the electronic device (101) of FIG. 6) may include a structure for reducing damage to the printed circuit board (610) caused during the assembly process of the printed circuit board (610).

[0141] FIG. 12 illustrates the interior of an electronic device according to one embodiment. FIG. 13 shows a state in which a printed circuit board is placed in the electronic device of FIG. 12.

[0142] Referring to FIG. 12, the first recess portion (710) may include a first end (711) connected to the second recess portion (720) and a second end (712) opposite to the first end (711). For example, the first end (711) may be referred to as an end located in the +y direction of the first recess portion (710), and the second end (712) may be referred to as an end located in the -y direction of the first recess portion (710). The first end (711) may be closer to the fastening portion (620) than the second end (712).

[0143] According to one embodiment, the first recess portion (710) for exposing the first surface (601) of the first flange portion (411) may have an inconsistent width. For example, the width of the first recess portion (710) may become substantially narrower from the first end (711) to the second end (712). For example, the first width (w1) of the first end (711) may be wider than the second width (w2) of the second end (712). For example, the first width (w1) may be about 3.0 mm and the second width (w2) may be about 2.4 mm, but as described above, the diameter (d) of the circular cross-section of the second recess portion (720) may be larger than the width of the first recess portion (710). The diameter (d) may be referenced as the maximum diameter of the sidewall portion (780) defining the second recess portion (720). For example, the diameter (d) of the circular cross-section of the second recess portion (720) may be approximately 3.23 mm. These figures are exemplary and are not limited thereto.

[0144] According to one embodiment, since the first recess portion (710) becomes substantially narrower as it extends from the first end (711) to the second end (712), the first sidewall portion (771) and the second sidewall portion (772) may not extend in a straight line but may extend closer to each other. For example, the distance between the first sidewall portion (771) and the second sidewall portion (772) defining the first recess portion (710) may correspond to the width of the first recess portion (710). The distance between the first sidewall portion (771) and the second sidewall portion (772) at the first end (711) may be greater than the distance between the first sidewall portion (771) and the second sidewall portion (772) at the second end (712).

[0145] Referring to FIG. 13, a protruding portion (611) of a printed circuit board (610) may be supported by a first sidewall portion (771) and a second sidewall portion (772). A protruding portion (611) of a printed circuit board (610) facing a first surface (601) of a first flange portion (411) exposed through a first recess portion (710) may be positioned on the first sidewall portion (771) and the second sidewall portion (772).

[0146] As described above, the printed circuit board (610) can be assembled obliquely with respect to the second non-conductive portion (440). During the process of assembling the printed circuit board (610) obliquely, since the protrusion (611) is tilted, at least a portion of the protrusion (611) may be located within the second recess portion (720). When an external force is applied to the printed circuit board (610) to insert the printed circuit board (610), the protrusion (611) may be moved at least partially into the sidewall portion (780) defining the second recess portion (720). When the protrusion (611) is moved between the sidewall portions (770) within the second recess portion (720), the sidewall portion (780) defining the second recess portion (720) may interfere with the protrusion (611). When an external force is applied to assemble the printed circuit board (610) while the protruding part (611) interferes with the side wall part (780), the protruding part (611) of the printed circuit board (610) may be damaged by physical interference with the side wall part (780).

[0147] According to one embodiment, as the first width (w1) of the first end (711) is formed relatively wide, physical damage to the printed circuit board (610) occurring during the assembly process of the printed circuit board (610) can be reduced. When the printed circuit board (610) is assembled, the protrusion (611) can be placed on the sidewall portions (770) defining the first recess portion (710). To reduce physical interference between the printed circuit board (610) and the sidewall portion (780) caused during the assembly process of the printed circuit board (610), the width of the protrusion (611) (e.g., the third width (w3)) can be narrower than the first width (w1) of the first end (711). For example, the width of the first end (711) may be about 3.0 mm, and the third width (w3) of the protrusion (611) may be about 2.83 mm, but is not limited thereto. For example, the width of the second end (712) (e.g., second width (w2)) may be narrower than the third width (w3) of the protrusion (611). Because the second width (w2) of the second end (712) is narrower than the third width (w3) of the protrusion (611), at least a portion of the protrusion (611) may be placed on the sidewall portions (770) defining the first recess portion (710) and supported by the second end (712). Since the first width (w1) of the first end (711) is wider than the third width (w3) of the protruding part (611), physical interference between the protruding part (611) and the sidewall part (780) can be reduced when the printed circuit board (610) is assembled obliquely with respect to the second non-conductive part (440). As a result of the reduction in physical interference, physical damage to the printed circuit board (610) caused during the assembly process of the printed circuit board (610) can be reduced.

[0148] FIGS. 14 and 15 illustrate an electronic device according to a comparative example. FIG. 16 illustrates the assembly process of a printed circuit board of an electronic device according to a comparative example. FIG. 17 illustrates the assembly process of a printed circuit board of an electronic device according to one embodiment.

[0149] Referring to FIG. 14, an electronic device (1401) according to a comparative example may include a first recess portion (1420) defined by straight-extending sidewall portions (1410). Because the first recess portion (1420) extends straight, the width (1403) of the first recess portion (1420) may be substantially constant. The diameter (1402) of the circular cross-section of the second recess portion (1430) may be larger than the width (1403) of the first recess portion (1420). For example, the diameter (1402) may be about 3.23 mm, and the width (1403) of the first recess portion (1420) may be about 2.4 mm. Through the first recess portion (1420), the first surface (1441) of the first flange portion (1440) where the power supply point or ground point is located may be exposed.

[0150] Referring to FIG. 15, an electronic device (1401) according to a comparative example may include a printed circuit board (1510). The printed circuit board (1510) may be configured to electrically connect a wireless communication circuit and a first conductive portion (1520) including a first flange portion (1440). A protruding portion (1511) of the printed circuit board (1510) may be placed on sidewall portions (1410) defining a first recess portion (1420) of the electronic device (1401) according to the comparative example. In the electronic device (1401) according to the comparative example, the width (1501) of the protruding portion (1511) may be greater than the width (1403) of the first recess portion (1420). For example, the width (1501) of the protrusion (1511) may be about 2.83 mm, and the width (1403) of the first recess (1420) may be about 2.4 mm. The width (1403) of the first recess (1420) may correspond to the distance between the sidewall portions (1410). Since the width (1403) of the first recess (1420) is narrower than the width (1501) of the protrusion (1511), during the assembly process of the printed circuit board (1510), the protrusion (1511) may physically interfere with the sidewalls defining the first recess (1420).

[0151] Referring to FIG. 16, the printed circuit board (1510) of the electronic device (1401) according to the comparative example may be connected to a connector (1610). The printed circuit board (1510) may be assembled obliquely with respect to the second non-conductive portion (1630) so that a ring structure (1620) for sealing around the connector (1610) is tightly attached to the second non-conductive portion (1630). When the printed circuit board (1510) is assembled obliquely, the width (1501) of the protrusion (1511) is greater than the width (1403) of the first recess portion (1420), so the protrusion (1511) may physically interfere with the sidewall portions (1410) defining the first recess portion (1420). For example, a protruding portion (1511) of a printed circuit board (1510) assembled at an angle may come into contact with sidewall portions (1410). When an external force is applied while the protruding portion (1511) is in contact with the sidewall portions (1410), the protruding portion (1511) may be physically damaged by the sidewall portions (1410). For example, portions adjacent to the outer edge of the printed circuit board (1510) may have relatively low rigidity because they include an area (e.g., a peel-cut area) where a portion of the copper foil (e.g., a ground layer) is removed. Damage to the protruding portion (1511) may be relatively easily caused by physical interference between the protruding portion (1511) and the sidewall portions (1410). The function of the printed circuit board (1510) may be degraded due to damage to the printed circuit board (1510).

[0152] Referring to FIG. 17, in an electronic device (101) according to one embodiment, the width of the first recess portion (710) may not be constant. As described above, the width of the first recess portion (710) may become narrower from the first end (711) to the second end (712). For example, the first width (w1) of the first end (711) may be wider than the second width (w2) of the second end (712).

[0153] According to one embodiment, the third width (w3) of the protrusion (611) of the printed circuit board (610) may be narrower than the first width (w1). For example, the first width (w1) may be about 3.0 mm, the second width (w2) may be about 2.4 mm, and the third width (w3) may be about 2.83 mm, but is not limited thereto. Since the first width (w1) of the first end (711) is wider than the third width (w3) of the protrusion (611), the protrusion (611) may not be inserted into the second recess (e.g., the second recess (720) of FIG. 12) during the process of assembling the printed circuit board (610) at an angle. According to one embodiment, physical interference between the protrusion (611) and the sidewall portions (770) and physical interference between the protrusion (611) and the sidewall portion (e.g., the sidewall portion (780) defining the second recess portion (720) of FIG. 12) can be reduced. For example, when a printed circuit board (610) connected to a connector (630) is assembled obliquely with respect to the second non-conductive portion (440), the protrusion (611) can be positioned between the sidewall portions (770) defining the first recess portion (710). Since the third width (w3) is narrower than the first width (w1), at the first end (711) of the first recess portion (710), the protrusion (611) may not come into contact with the sidewall portions (770). When the printed circuit board (610) is fully assembled, the protrusion (611) may be placed on the sidewall portions (770) and supported by the second end (712) formed by the sidewall portions (770). The second width (w2) of the second end (712) may be narrower than the third width (w3) of the protrusion (611). For example, at the second end (712), the distance between the sidewall portions (770) may be smaller than the third width (w3) of the protrusion (611). Because the second width (w2) is narrower than the third width (w3), at least a portion of the protrusion (611) may be supported by the sidewall portions (770).

[0154] According to one embodiment, during the process of assembling the printed circuit board (610), physical interference between the protrusion (611) and the sidewall portions (770) and physical interference between the protrusion (611) and the sidewall portion (e.g., the sidewall portion (770) of FIG. 12) can be reduced, so that physical damage to the protrusion (611) can be reduced. As described above, the electronic device (101) includes a first recess portion (710) to have a relatively thin thickness, and the first surface (601) of the first flange portion (411) can be exposed through the first recess portion (710). A power supply point or a ground point may be located on the first surface (601) of the first flange portion (411), and a fastening portion (620) spaced apart from the first flange portion (411) may be included. In the process of forming a fastening portion (620) spaced apart from the first flange portion (411), a second recess portion (720) may be formed. According to one embodiment, the first width (w1) of the first end portion (711) of the first recess portion (710) is formed wider than the third width (w3) of the protruding portion (611), thereby reducing physical damage to the protruding portion (611) caused by the side walls of the first recess portion (710).

[0155] FIG. 18 illustrates an electronic device including an elastic member.

[0156] Referring to FIG. 18, the electronic device (101) may include an elastic member (1810). The elastic member (1810) may include an elastic material such as rubber and may have flexibility.

[0157] According to one embodiment, an elastic member (1810) may be inserted into a second recess portion (720). As the elastic member (1810) is inserted into the second recess portion (720), the second recess portion (720) may be filled with a flexible elastic member (1810). For example, the thickness of the elastic member (1810) may correspond to the depth of the second recess portion (720). At least a portion of the elastic member (1810) may be in contact with a sidewall portion (780) defining the second recess portion (720) and may be interference fit within the second recess portion (720).

[0158] According to one embodiment, if the second recess portion (720) formed during the formation process of the fastening portion (620) is filled with a flexible elastic member (1810), damage to the printed circuit board (e.g., the printed circuit board (610) of FIG. 6) may be reduced. For example, if the second recess portion (720) is filled with an elastic member (1810), when the printed circuit board (610) is assembled at an angle, the protruding portion (e.g., the protruding portion (611) of FIG. 6) may be supported by the elastic member (1810). Since the protruding portion (611) is supported by the elastic member (1810) inserted into the second recess portion (720), the protruding portion (611) may be moved without interfering with the sidewall portion (780) defining the second recess portion (720). For example, the protrusion (611) supported by the elastic member (1810) may be supported by the sidewall parts (770) by being positioned on the sidewall parts (770) rather than being inserted into the second recess part (720). Since the elastic member (1810) in contact with the printed circuit board (610) is flexible, physical damage to the printed circuit board (610) caused by the elastic member (1810) may be reduced.

[0159] FIG. 19 illustrates an electronic device including rounded edges.

[0160] Referring to FIG. 19, since the first recess portion (710) and the second recess portion (720) are connected to each other, the bottom surface of the first recess portion (710) and the side surface of the second recess portion (720) can be connected to each other. For example, the bottom surface of the first recess portion (710) can form a plane substantially identical to the first surface (601) of the first flange portion (411). The side surface of the second recess portion (720) perpendicular to the bottom surface can form a plane substantially identical to the second surface (602) of the first flange portion (411) perpendicular to the first surface (601).

[0161] According to one embodiment, the edge (1910) where the bottom surface of the first recess portion (710) and the side of the second recess portion (720) perpendicular to the bottom surface of the first recess portion (710) come into contact with each other may be at least partially rounded. For example, the edge (1910) may be formed to be curved or inclined. The edge (1910) may include an edge (1920) where the first surface (601) of the first flange portion (411) and the second surface (602) of the first flange portion (411) come into contact with each other. If the edge (1910) is at least partially rounded, the edge (1920) of the first flange portion (411) included in the edge (1910) may also be at least partially rounded. According to one embodiment, if the edge (1910) is at least partially rounded, physical damage to a protruding part (e.g., a protruding part (611) of FIG. 6) caused during the assembly process of a printed circuit board (e.g., a printed circuit board (610) of FIG. 6) may be reduced. For example, even if the protruding part (611) comes into contact with the edge (1910), because the edge (1910) is rounded, the protruding part (611) is inserted into the interior of the second recess (720) lessened, and thus physical damage to the protruding part (611) may be reduced.

[0162] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs.

[0163] An electronic device (101) is disclosed. The electronic device (101) may include a wireless communication circuit (192). The electronic device (101) may include a flange portion (411) and a conductive portion (410) that is adjacent to the edge of the electronic device (101) and configured to function as an antenna radiator. A feed point or ground point of the antenna radiator may be located on a first surface (601) of the flange portion (411) of the conductive portion (410). The electronic device (101) may include a printed circuit board (610) configured to electrically connect the wireless communication circuit (192) and the feed point of the flange portion (411), or to electrically connect the ground of the electronic device (101) and the ground point of the flange portion (411). The electronic device (101) may include a bracket (243) that supports an electronic component (650) and is spaced apart from the conductive portion (410). The electronic device (101) may include a through hole (621) for fixing the electronic component (650) and a fastening portion (620) that is positioned between the flange portion (411) of the conductive portion (410) and the bracket (243) and is spaced apart from the conductive portion (410) and the flange portion (411). The electronic device (101) may include a non-conductive portion (440) that fills the gap between the bracket (243) and the conductive portion (410) and surrounds the fastening portion (620). The above non-conductive portion (440) may include a first recess portion (710) that exposes the first surface (601) of the flange portion (411).The above non-conductive portion (440) may include a second recess portion (720) formed between the fastening portion (620) and the flange portion (411), connected to the first recess portion (710), and exposing a second surface (602) of the flange portion (411) perpendicular to the first surface (601) of the flange portion (411). The first width (w1) of the first end (711) of the first recess portion (710) connected to the second recess portion (720) may be wider than the second width (w2) of the second end (712) of the first recess portion (710) opposite to the first end (711).

[0164] According to one embodiment, the printed circuit board (610) may include a protrusion (611) disposed on the sidewall portions (770) of the non-conductive portion (440) defining the first recess portion (710).

[0165] According to one embodiment, the electronic device (101) may further include a conductive connection part (730) configured to contact the protruding part (611) of the printed circuit board (610) and the power supply point or the ground point, respectively, to electrically connect the printed circuit board (610) and the power supply point or to electrically connect the printed circuit board (610) and the ground point.

[0166] According to one embodiment, the third width (w3) of the protruding portion (611) of the printed circuit board (610) may be narrower than the first width (w1) of the first end portion (711).

[0167] According to one embodiment, the third width (w3) of the protruding portion (611) of the printed circuit board (610) may be wider than the second width (w2) of the second end (712).

[0168] According to one embodiment, the electronic component (650) can be fixed to the fastening portion (620) through a screw coupled to the electronic component (650) and the through hole (621).

[0169] According to one embodiment, the electronic component (650) may include a speaker or a vibration motor.

[0170] According to one embodiment, the electronic device (101) may further include a connector (630) for electrical connection between an external electronic device and the electronic device (101), which is connected to the printed circuit board (610). The connector (630) may be adjacent to the flange portion (411).

[0171] According to one embodiment, the electronic device (101) may further include a display (201) defining at least a portion of the front surface of the electronic device (101). The first surface (601) of the flange portion (411) may face the rear surface of the electronic device (101), which is opposite to the front surface of the electronic device (101).

[0172] According to one embodiment, the fastening portion (620) may further include another through hole (622) for fixing the printed circuit board (610) and spaced apart from the through hole (621).

[0173] According to one embodiment, the second recess portion (720) may have a circular cross-section. The diameter (d) of the circular cross-section may be larger than the third width (w3) of the protruding portion (611) of the printed circuit board (610).

[0174] According to one embodiment, the electronic device (101) may further include an elastic member (1810) comprising an elastic material that is inserted into the second recess portion (720).

[0175] According to one embodiment, the edge (1910) where the bottom surface of the first recess portion (710) and the side of the second recess portion (720) perpendicular to the bottom surface of the first recess portion (710) come into contact with each other may be at least partially rounded.

[0176] According to one embodiment, the electronic device (101) may further include another non-conductive portion (430) that defines at least a portion of the edge of the electronic device (101) and is coupled to the non-conductive portion (440).

[0177] According to one embodiment, the electronic device (101) may further include another conductive part (420) that is electrically separated from the conductive part (410) and electrically connected to the wireless communication circuit (192).

[0178] An electronic device (101) is disclosed. The electronic device (101) may include a printed circuit board (610). The electronic device (101) may include a conductive portion (410) that is adjacent to the edge of the electronic device (101) and configured to function as an antenna radiator, and includes a flange portion (411). A feed point or ground point of the antenna radiator may be located on a first surface (601) of the flange portion (411) of the conductive portion (410) facing the printed circuit board (610). The electronic device (101) may include a printed circuit board (610) that is electrically connected to the conductive portion (410) through a conductive connection portion (730) that contacts the feed point or the ground point. The electronic device (101) may include a bracket (243) that is spaced apart from the conductive portion (410), supports an electronic component (650), and includes a conductive material. The electronic device (101) may include a fastening portion (620) that includes a through hole (621) for fixing the electronic component (650), is positioned between the flange portion (411) of the conductive portion (410) and the bracket (243), and is spaced apart from the conductive portion (410) and the flange portion (411). The electronic device (101) may include a non-conductive portion (440) that fills the space between the bracket (243) and the conductive portion (410) and surrounds the fastening portion (620). The above non-conductive portion (440) may include a first recess portion (710) that exposes a first surface (601) of the flange portion (411). The above non-conductive portion (440) may include a second recess portion (720) that is formed between the fastening portion (620) and the bracket (243), is connected to the first recess portion (710), and exposes a second surface (602) of the flange portion (411) that is perpendicular to the first surface (601) of the flange portion (411).The width of the first recess portion (710) may narrow from the first end (711) of the first recess portion (710) connected to the second recess portion (720) to the second end (712) of the first recess portion (710) opposite to the first end (711).

[0179] According to one embodiment, the printed circuit board (610) may include a protrusion (611) disposed on the sidewall portions (770) of the non-conductive portion (440) defining the first recess portion (710). The conductive connection portion (730) may be disposed on the protrusion (611) of the printed circuit board (610).

[0180] According to one embodiment, the electronic component (650) can be fixed through a screw that passes through the electronic component (650) and is coupled to the through hole (621).

[0181] According to one embodiment, the electronic device (101) may further include a connector (630) that is fixed to the printed circuit board (610) and electrically connected to an external electronic device. The connector (630) may be adjacent to the flange portion (411).

[0182] According to one embodiment, the electronic device (101) may further include a display (201) defining at least a portion of the front of the electronic device (101). The first surface (601) of the flange portion (411) may face the rear of the electronic device (101), opposite to the front of the electronic device (101). A printed circuit board (610) may be positioned between a rear plate (211) defining at least a portion of the rear and a bracket (243).

[0183] According to one embodiment, the electronic device (101) may further include a display (201) defining at least a portion of the front surface of the electronic device (101). The first surface (601) of the flange portion (411) may face the front surface of the electronic device (101). A printed circuit board (610) may be positioned between the display (201) and the bracket (243).

[0184] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0185] The electronic devices according to the various embodiments disclosed in this document may be of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or consumer electronics. The electronic devices according to the embodiments of this document are not limited to the devices described above.

[0186] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0187] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0188] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (120) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0189] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store's server, or a relay server's memory (130).

[0190] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, Wireless communication circuit; A conductive portion including a flange portion, adjacent to the edge of the electronic device, and configured to function as an antenna radiator, wherein a feed point or ground point of the antenna radiator is located on a first surface of the flange portion of the conductive portion; A printed circuit board configured to electrically connect the power supply point of the wireless communication circuit and the flange portion, or to electrically connect the ground of the electronic device and the grounding point of the flange portion; A bracket spaced apart from the above conductive part and supporting an electronic component; A fastening portion comprising a through hole for fixing the electronic component, disposed between the flange portion of the conductive portion and the bracket, and spaced apart from the conductive portion and the flange portion; and It includes a non-conductive portion that fills the gap between the bracket and the conductive portion and surrounds the fastening portion, The above-mentioned non-conductive part is, A first recess portion exposing a first surface of the above-mentioned flange portion, and It includes a second recess portion formed between the above-mentioned fastening portion and the above-mentioned flange portion, connected to the first recess portion, and exposing a second surface of the flange portion perpendicular to the first surface of the above-mentioned flange portion, The first width of the first end of the first recess portion connected to the second recess portion is, Wider than the second width of the second end of the first recess portion, opposite to the first end portion. Electronic device.

2. In Paragraph 1, The above printed circuit board is, A protrusion portion disposed on the sidewall portions of the non-conductive portion defining the first recess portion, Electronic device.

3. In Paragraph 2, A conductive connection further comprising a protruding portion of the printed circuit board and a feed point or a ground point, respectively contacting the feed point or the ground point to electrically connect the printed circuit board and the feed point, or to electrically connect the printed circuit board and the ground point. Electronic device.

4. In Paragraph 2 or 3, The third width of the protruding portion of the above printed circuit board is, Narrower than the first width of the first end portion, Electronic device.

5. In Paragraph 4, The third width of the protruding portion of the above printed circuit board is, Wider than the second width of the second end above, Electronic device.

6. In any one of paragraphs 1 through 5, The above electronic component is, Fixed to the fastening portion through the above electronic component and the screw coupled to the through hole, Electronic device.

7. In any one of paragraphs 1 through 6, The above electronic component is, including a speaker or vibration motor, Electronic device.

8. In any one of paragraphs 1 through 7, Connected to the above printed circuit board, further including a connector for electrical connection between an external electronic device and the electronic device, and The above connector is, Adjacent to the above flange portion, Electronic device.

9. In any one of paragraphs 1 through 8, The electronic device further includes a display defining at least a portion of the front surface, and The first surface of the above flange portion is, Facing the rear of the electronic device, opposite to the front of the electronic device, Electronic device.

10. In any one of paragraphs 1 through 9, The above fastening part is, A through hole spaced apart from the above through hole and further comprising another through hole for fixing the printed circuit board, Electronic device.

11. In any one of paragraphs 1 through 10, The above second recess portion is, Having a circular cross-section, The diameter of the above circular cross-section is, Larger than the third width of the protruding portion of the printed circuit board, Electronic device.

12. In any one of paragraphs 1 through 11, A further comprising an elastic member including an elastic material inserted into the second recess portion, Electronic device.

13. In any one of paragraphs 1 through 12, The edge where the bottom surface of the first recess portion and the side surface of the second recess portion perpendicular to the bottom surface of the first recess portion come into contact with each other is At least partially rounded, Electronic device.

14. In any one of paragraphs 1 through 13, Defining at least a portion of the edge of the electronic device and further including another non-conductive portion coupled to the non-conductive portion, Electronic device.

15. In any one of paragraphs 1 through 14, A further comprising another conductive part that is electrically separated from the above conductive part and electrically connected to the wireless communication circuit, Electronic device.

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