Waveguide filter and communication device including same

Abstract

According to one embodiment, a waveguide filter including a dielectric may comprise a plurality of guide portions for forming a transmission path between a radio frequency (RF) port and an antenna port. A first guide portion and a second guide portion among the plurality of guide portions may be coupled in a first direction. The second guide portion and a third guide portion among the plurality of guide portions may be coupled in a second direction perpendicular to the first direction. The first guide portion may have a first resonance hole on a first side facing a direction opposite to the first direction. The second guide portion may have a second resonance hole on a second side facing the first direction. The third guide portion may have a third resonance hole on the second side.

Description

Waveguide filter and communication device including the same

[0001] The present disclosure relates to a waveguide filter and a communication device including the same.

[0002] Products equipped with multiple antennas are being developed to enhance communication performance. It is expected that equipment featuring an even greater number of antennas will be used. As the number of antennas in communication devices increases, the number of RF components (e.g., filters) inevitably increases as well.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] According to one embodiment, a waveguide filter comprising a dielectric may include a plurality of guide portions for forming a transmission path between an RF (radio frequency) port and an antenna port. Among the plurality of guide portions, a first guide portion and a second guide portion may be coupled in a first direction. The second guide portion and a third guide portion among the plurality of guide portions may be coupled in a second direction perpendicular to the first direction. The first guide portion may have a first resonant hole on a first side facing a direction opposite to the first direction. The second guide portion may have a second resonant hole on a second side facing the first direction. The third guide portion may have a third resonant hole on the second side.

[0005] According to one embodiment, a communication device may include a printed circuit board, an antenna disposed on a first surface of the printed circuit board, an RF processing circuit disposed on a second surface opposite to the first surface of the printed circuit board, and a waveguide filter disposed on the second surface of the printed circuit board. The waveguide filter may include a plurality of guide portions for forming a transmission path between an RF (radio frequency) port and an antenna port. Among the plurality of guide portions, a first guide portion and a second guide portion may be coupled in a first direction. The second guide portion and a third guide portion among the plurality of guide portions may be coupled in a second direction perpendicular to the first direction. The first guide portion may have a first resonant hole on a first side facing a direction opposite to the first direction. The second guide portion may have a second resonant hole on a second side facing the first direction. The third guide portion may have a third resonant hole on the second side.

[0006] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0007] Figure 1 shows a wireless communication system.

[0008] Figure 2 shows examples of components of a communication device.

[0009] Figure 3a shows an example of a communication device.

[0010] Figure 3b shows an example of the components of a communication device.

[0011] Figure 4a shows an example of a communication device.

[0012] Figure 4b shows an example of components of a communication device.

[0013] FIGS. 5A and FIGS. 5B illustrate an example of a waveguide filter.

[0014] Figure 6 shows the coupling between resonant holes.

[0015] Figure 7a shows a part of a waveguide filter.

[0016] Figure 7b shows the bandwidth of the passband according to the distance between the resonant holes.

[0017] Figure 8a shows a part of a waveguide filter.

[0018] Figure 8b shows the bandwidth of the passband according to the depth of the auxiliary hole.

[0019] Figure 9a shows a part of a waveguide filter.

[0020] Figure 9b shows the bandwidth of the passband according to the depth of the groove connecting the resonant holes.

[0021] Figure 10a shows a part of a waveguide filter.

[0022] Figure 10b shows the bandwidth of the passband according to the groove depth.

[0023] FIG. 11a illustrates examples of a planar waveguide filter and a three-dimensional waveguide filter.

[0024] Figure 11b illustrates a schematic view of a three-dimensional waveguide filter.

[0025] FIG. 11c illustrates the signal transmission path of a three-dimensional waveguide filter.

[0026] Figure 12a illustrates an example of a waveguide filter.

[0027] Figure 12b illustrates an example of a waveguide filter.

[0028] FIG. 12c illustrates an example of a waveguide filter.

[0029] FIG. 13a illustrates examples of a planar waveguide filter and a three-dimensional waveguide filter.

[0030] Figure 13b illustrates the signal transmission path of a three-dimensional waveguide filter.

[0031] Figure 14a illustrates an example of a waveguide filter.

[0032] Figure 14b illustrates the signal transmission path of a waveguide filter.

[0033] Figure 15 illustrates a schematic view of a waveguide filter.

[0034] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0035] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0036] Terms used in the following description to refer to components of an electronic device (e.g., insulating plate, substrate, PCB (print circuit board), FPCB (flexible PCB), module, antenna, antenna element, antenna element, circuit, amplifier circuit, processor, chip, component, device), terms referring to the shape of a component (e.g., opening, structure, structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), and terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, amplifier circuit, RF path, RF module, RF circuit, splitter, divider, coupler, combiner) are examples provided for the convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Additionally, terms such as '...part', '...device', '...piece', '...body' used below may refer to at least one shape structure or a unit that processes a function.

[0037] Additionally, in this disclosure, expressions of "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions of "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of elements from A (including A) to B (including B). Below, "C" and / or "D" refers to including at least one of "C" or "D," i.e., {"C", "D", "C" and "D"}.

[0038] FIG. 1 illustrates a wireless communication system. The wireless communication environment of FIG. 1 exemplifies a base station (110) and a terminal (120) (e.g., a first terminal (120-1), a second terminal (120-2), a third terminal (120-3)) as a part of the nodes using a wireless channel.

[0039] Referring to FIG. 1, a base station (110) is a network infrastructure that provides wireless access to a terminal (120). The base station (110) has coverage based on the distance over which it can transmit signals. In addition to being a base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5G node (5th generation node)', '5G NodeB (NB)', 'wireless point', 'transmission / reception point (TRP)', MMU (Massive MIMO (multiple input multiple output) Unit)', 'access unit', 'distributed unit (DU)', 'transmission / reception point (TRP)', 'radio unit (RU)', 'remote radio head (RRH)', or other terms having an equivalent technical meaning. The base station (110) can transmit downlink signals or receive uplink signals.

[0040] The terminal (120) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, the terminal (120) may be operated without user involvement. That is, the terminal (120) is a device that performs machine type communication (MTC) and may not be carried by the user. The terminal (120) may be referred to as 'user equipment (UE)', 'mobile station', 'subscriber station', 'customer premises equipment (CPE)', 'remote terminal', 'wireless terminal', 'electronic device', or 'vehicle terminal', 'user device', or other terms having an equivalent technical meaning.

[0041] Beamforming technology is utilized as one of the techniques to mitigate propagation path loss and increase the transmission distance of radio waves. Beamforming generally uses multiple antennas to concentrate the reach area of ​​radio waves or to increase the directivity of reception sensitivity in a specific direction. Therefore, to form beamforming coverage instead of forming a signal in an isotropic pattern using a single antenna, a base station (110) may be equipped with multiple antennas. A form in which multiple antennas are gathered may be referred to as an antenna array (130), and each antenna included in the array may be referred to as an array element or an antenna element. The antenna array (130) may be configured in various forms, such as a linear array or a planar array. The antenna array (130) may be referred to as a massive antenna array.

[0042] A key technology for enhancing the data capacity of 5G communication is beamforming technology using an antenna array connected to multiple RF paths. To achieve higher data capacity, the number of RF paths must be increased, or the power per RF path must be increased. However, increasing the number of RF paths leads to larger product sizes, and due to spatial constraints in installing actual base station equipment, it is currently impossible to increase them further. To increase antenna gain through high output without increasing the number of RF paths, antenna gain can be increased by connecting multiple antenna elements using dividers (or splitters) in the RF paths. Here, the antenna elements corresponding to the RF paths may be referred to as sub-arrays. As a non-limiting example, sub-array technology may be utilized to increase the signal radiation gain. An antenna array may include multiple sub-arrays. The antennas of the antenna array may be divided into the multiple sub-arrays. The signal may be radiated through each of the antennas of the sub-arrays.

[0043] In FIG. 1, the base station (110) of FIG. 1 is described as an example to explain an electronic device including an antenna, but the embodiments of the present disclosure are not limited thereto. As an electronic device according to the embodiments of the present disclosure, in addition to the base station (110), any wireless equipment performing a function equivalent to that of the base station, wireless equipment connected to the base station (e.g., TRP), the terminal (120) of FIG. 1, or other communication equipment used for 5G communication is possible. Hereinafter, as a structure of multiple antennas for communication in a MIMO (Multiple Input Multiple Output) environment, the present disclosure describes an antenna array composed of sub-arrays as an example, but is not limited to examples where easy modifications for beamforming are possible.

[0044] FIG. 2 illustrates examples of components of a communication device. The communication device may be a base station (110) of FIG. 1 or a component of the base station (110). Meanwhile, unlike what is illustrated, the present disclosure does not exclude the possibility that the communication device may be implemented in a terminal (120).

[0045] Referring to FIG. 2, an exemplary functional configuration of a communication device (210) is illustrated. The communication device (210) may include an antenna section (211), a filter section (212), an RF (radio frequency) processing section (213), and a processor (214).

[0046] The antenna section (211) may include a plurality of antennas. The antennas may perform functions for transmitting and receiving signals through a wireless channel. The antennas may include a radiator made of a conductor (e.g., a metal structure) or a conductive pattern formed on a substrate (e.g., a PCB). The antennas may radiate upconverted signals over a wireless channel or acquire signals radiated by another device. Each antenna may be referred to by an antenna element, antenna component, antenna radiator, radiating part, radiator, and / or equivalent technical terms. The antenna section (211) may include an antenna array in which a plurality of antenna elements form an array. The antenna section (211) may be electrically connected to the filter section (212) via RF signal lines. For example, a plurality of antenna elements of the antenna section (211) may be coupled to a board (e.g., a PCB). The antenna elements may be placed on one side of the board, or a module on which the antenna elements are placed may be placed. The above board may include RF signal lines connecting each antenna element and the RF filters of the filter section (212). The RF signal lines may be referred to as a feeding network. The board may be referred to as a wireless unit board, a wireless unit board, an antenna board, an antenna board, a radiation board, a radiation board, an RF board, an RF board, and / or an equivalent technical term.

[0047] The filter unit (212) can perform signal filtering to transmit a signal of a desired frequency. The filter unit (212) can perform signal filtering to reduce a signal of an unwanted frequency. The filter unit (212) may include a plurality of RF filters. The RF filters can perform the function of selectively passing frequencies by forming resonance. The filter unit (212) may include at least one of a band-pass filter, a low-pass filter, a high-pass filter, or a band-reject filter. The filter unit (212) may include RF circuits for obtaining a signal in a frequency band for transmission or a frequency band for reception. Each RF filter of the filter unit (212) may be electrically connected to the antennas of the antenna unit (211) and the RF processing circuit of the RF processing unit (213).

[0048] The RF processing unit (213) may include a plurality of RF processing circuits. An RF processing circuit may be a unit for processing a signal received through an antenna or a signal radiated through an antenna. An RF processing circuit may include a plurality of paths corresponding to the antennas. At least one RF processing circuit may be referred to as an RF chain. An RF chain may include a plurality of RF elements. The RF elements may include an amplifier, a mixer, an oscillator, a DAC, an ADC, etc. For example, the RF processing unit (213) may include an up converter that up-converts a baseband digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal into an analog RF transmission signal. The up converter and the DAC form part of a transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Additionally, for example, the RF processing unit (213) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts the digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of the reception path. The reception path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit (213) may be implemented on a PCB. The communication device (210) may include a stacked structure in the order of an antenna unit (211), a filter unit (212), and an RF processing unit (213). The antennas and the RF components of the RF processing unit (213) may be implemented on a PCB, and filters may be repeatedly connected between the PCBs to form multiple layers.For example, the RF processing unit (213) may include a communication chip (e.g., RFIC).

[0049] The processor (214) can control the overall operations of the communication device (210). The processor (214) may be referred to as a control unit, a controller, or a control unit. The processor (214) may include various modules for performing communication. The processor (214) may include at least one processor, such as a modem. The processor (214) may include modules for digital signal processing. For example, the processor (214) may include a modem. When transmitting data, the processor (214) generates complex symbols by encoding and modulating the transmitted bit sequence. Also, for example, when receiving data, the processor (214) restores the received bit sequence by demodulating and decoding the baseband signal. The processor (214) may perform the functions of a protocol stack required by the communication standard.

[0050] In FIG. 2, functional components of a communication device (210) are described as a communication device including a plurality of antennas. However, the example shown in FIG. 2 is merely an exemplary configuration for RF calibration described later, and the embodiments of the present disclosure are not limited to the components of the communication device shown in FIG. 2. For example, even if some of the components of the communication device are omitted or the connection relationships of the components are different, any device (e.g., communication device, communication module) including a plurality of antennas (or RF filters) can be understood as an embodiment of the present disclosure.

[0051] Figure 3a shows an example of a communication device.

[0052] Referring to FIG. 3a, the communication device (300) may include a front cover (301), an antenna plate (302), a shield can (303), a main PCB (304), and a rear housing (305). For example, the communication device (300) may be referred to as a massive MIMO unit (MMU) or a radio unit (RU).

[0053] According to one embodiment, the front cover (301) may be configured to surround the antenna plate (302). The front cover (301) may protect a plurality of antennas placed on the antenna plate (302). For example, the front cover (301) may be referred to as a radome. For example, the front cover (301) may be configured to reduce transmission loss of the frequency band used in the communication device (300). For example, the front cover (301) may be composed of a material having excellent radio wave transmittance and excellent environmental resistance.

[0054] According to one embodiment, the antenna plate (302) may include a plurality of antennas. For example, the antenna plate (302) may include a plurality of antennas and an antenna substrate for arranging the plurality of antennas (e.g., antenna element, antenna array, antenna sub-array). For example, each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. For the plurality of antennas, the description of the antenna portion (211) of FIG. 2 may be referenced. For example, the plurality of antennas may be arranged on the antenna substrate. The antenna substrate on which the plurality of antennas are arranged may be referred to as an insulating plate, an insulating plate, a radiating substrate, a radiating plate, and / or an equivalent technical term.

[0055] According to one embodiment, an antenna plate (302) may be placed on a shield can (303). The antenna plate (302) may be placed on the shield can (303) so as not to affect the signal emitted through the plurality of antennas included in the antenna plate (302). The shield can (303) can reduce the effect on the signal emitted through the plurality of antennas generated by the components placed on the main PCB (304). According to one embodiment, a plurality of filters may be placed between the shield can (303) and the antenna plate (302). For the plurality of filters, the description of the filter section (212) of FIG. 2 may be referenced.

[0056] According to one embodiment, the main PCB (304) may provide connections between components for transmitting signals through a plurality of antennas. For example, an RF processing circuit may be placed on a first surface of the main PCB (304). A processor may be placed on a second surface opposite to the first surface of the main PCB (304).

[0057] According to one embodiment, the rear housing (305) may include a heat sink to provide protection and heat dissipation for the communication device (300). The heat sink may be configured to dissipate heat generated by the components of the main PCB (304) to the outside.

[0058] Figure 3b shows an example of the components of a communication device.

[0059] Referring to FIG. 3b, Example (380) represents a part of the communication device (300) of FIG. 3a as viewed from one direction (e.g., the x-axis or y-axis of FIG. 3a). In Example (380), the communication device (300) (or part of the communication device (300)) may include a PCB (310), a shield can (320), an antenna substrate (330), a filter (340), and a heat sink (350).

[0060] The PCB (310) may include a coin (362). The coin (362) may be placed within the PCB (310) to dissipate heat generated from components of the communication device (300) (e.g., RF processing circuit (363)). The coin (362) may be inserted inside the PCB (310). The coin (362) may be formed to penetrate a first side (e.g., front) and a second side (e.g., rear) of the PCB (310). The coin (362) may be positioned to contact a heat sink (350). Heat generated from components of the communication device (300) (e.g., RF processing circuit (363)) may be transferred to the heat sink (350) through the coin (362). The heat transferred to the heat sink (350) may be discharged to the outside through the rear housing (305) of FIG. 3A.

[0061] An RF processing circuit (363) may be placed on the first side (e.g., front) of the PCB (310). The RF processing circuit (363) may be placed on the coin (362) of the PCB (310). For the RF processing circuit (363), the description of the RF processing unit (213) of FIG. 2 may be referenced.

[0062] A processor (361) may be placed on a second side (e.g., the rear side) of the PCB (310). For the processor (361), the description of the processor (214) in FIG. 2 may be referenced. For example, the processor (361) may include modules for digital signal processing. The processor (361) may include a module for processing a digital signal received from an external device (e.g., a digital unit (DU)).

[0063] The RF processing circuit (363) can be connected to the filter (340) through the connector (368). A transmission signal can be provided to the filter (340) through the connector (368). A reception signal can be provided from the filter (340) through the connector (368). The connector (368) can be connected to the filter (340) by passing through the shield can (320).

[0064] The filter (340) may correspond to at least one of the plurality of filters described in FIG. 3a. The filter (340) may be configured to filter a signal received through the connector (368). For the filter (340), the description of the filter section (212) in FIG. 2 may be referenced.

[0065] An antenna substrate (330) may be placed on a filter (340). The antenna substrate (330) may be part of the antenna plate (302) of FIG. 3a. A plurality of antennas (e.g., antenna element (331), antenna element (332)) may be placed (or implemented) on the antenna substrate (330). The antenna substrate (330) may be connected to the filter (340) through connectors (369) (e.g., RF signal lines, feed networks). The antenna substrate (330) may receive a transmission signal from the filter (340) through the connectors (369). The antenna substrate (330) may provide a reception signal to the filter (340) through the connectors (369).

[0066] Figure 4a shows an example of a communication device.

[0067] Referring to FIG. 4a, the communication device (400) may include a front cover (401), a PCB (402), and a rear housing (403). For example, the communication device (400) may be referred to as a massive MIMO unit (MMU) or a radio unit (RU).

[0068] According to one embodiment, the front cover (401) may be configured to enclose the PCB (402). The front cover (401) may protect the PCB (402) and / or components placed on the PCB (402). For example, the front cover (401) may be referred to as a radome. For example, the front cover (401) may be configured to reduce transmission loss of the frequency band used in the communication device (400). For example, the front cover (401) may be composed of a material with excellent radio wave transmittance and excellent environmental resistance. For example, the front cover (401) may correspond to the front cover (301) of FIG. 3A.

[0069] According to one embodiment, components including a plurality of antennas, a plurality of filters, a processor, and a power amplifier may be disposed on the PCB (402). Components included in the antenna plate (302) and the main PCB (304) of FIG. 3a may be disposed on the PCB (402).

[0070] For example, a plurality of antennas may be disposed on a first outer surface (e.g., front) of the PCB (402). For example, the plurality of antennas may include antenna elements and support portions. For example, each of the plurality of antennas may include a radiating structure. The radiating structure may be formed of a conductive material. For the plurality of antennas, the description of the antenna portion (211) of FIG. 2 may be referenced. According to an embodiment, an antenna substrate for the plurality of antennas may be disposed on the first outer surface (e.g., front) of the PCB (402). The plurality of antennas may be disposed on the antenna substrate. For example, the plurality of antennas and the substrate on which the plurality of antennas are disposed may correspond to the antenna plate (302) of FIG. 3a.

[0071] For example, the PCB (402) may provide connections between components for transmitting signals through a plurality of antennas. A plurality of antennas may be placed on a first outer surface (e.g., front) of the PCB (402). A power amplifier circuit, an RF processing circuit, a circulator, and a plurality of filters may be placed on a second outer surface (e.g., rear) of the PCB (402). However, it is not limited thereto. In addition to the components described above, the PCB (402) may further include various components for transmitting signals from the communication device (400).

[0072] According to one embodiment, the rear housing (403) may include a heat sink to provide protection and heat dissipation for the communication device (400). The heat sink may be configured to dissipate heat generated by the components of the PCB (402) to the outside. According to an embodiment, the heat sink may provide the function of a shield can. According to an embodiment, the rear housing (403) may include a heat sink and a shield can.

[0073] In FIG. 4b below, specific examples of the components of the communication device (400) will be described later.

[0074] Figure 4b shows an example of components of a communication device.

[0075] Referring to FIG. 4b, example (480) represents a part of the communication device (400) of FIG. 4a as viewed from one direction (e.g., the x-axis or y-axis of FIG. 4a). In example (480), the communication device (400) (or part of the communication device (400)) may include a PCB (410), a plurality of antennas (420), and a heat sink (430).

[0076] The PCB (410) shown in example (480) may be part of the PCB (402) of FIG. 4a. The plurality of antennas (420) shown in example (480) may be part of the plurality of antennas described in FIG. 4a. The heat sink (430) shown in example (480) may be part of the heat sink described in FIG. 4a.

[0077] According to one embodiment, a plurality of antennas (420) may be placed on a PCB (410). For example, the PCB (410) may include RF signal lines connecting the plurality of antennas (420) and a filter (413). The RF signal lines may be referred to as a feeding network.

[0078] According to one embodiment, the PCB (410) may include a processor (411), an RF processing circuit (412), and a filter (413). This is exemplary, and the PCB (410) may further include various components for transmitting and / or receiving signals.

[0079] For example, the processor (411), RF processing circuit (412), and filter (413) may be placed on a second outer surface (e.g., rear) of the PCB (410). For example, the processor (411) may include modules for digital signal processing. For the processor (411), the description of the processor (214) in FIG. 2 may be referenced. For the RF processing circuit (412), the description of the RF processing unit (213) in FIG. 2 may be referenced. For the filter (413), the description of the filter unit (212) in FIG. 2 may be referenced. For example, the filter (413) may include at least one filter.

[0080] According to one embodiment, at least some of the components disposed on the second outer surface (e.g., rear) of the PCB (410) (e.g., processor (411), RF processing circuit (412)) may be disposed to be in contact with the heat sink (430). Heat generated from at least some of the components disposed on the second outer surface (e.g., rear) of the PCB (410) (e.g., processor (411) or RF processing circuit (412))) may be transferred to the heat sink (430). The heat transferred to the heat sink (430) may be discharged to the outside through the rear housing (403) of FIG. 4a.

[0081] According to one embodiment, the PCB (410) and various components disposed on the PCB (410) may be referred to as an antenna module. For example, the antenna module may include at least one of the PCB (410), a processor (411), an RF processing circuit (412), a filter (413), and a plurality of antennas (420). Unlike the communication device (300) described in FIGS. 3a and 3b, a plurality of antennas may be disposed on a first outer surface (e.g., front) of the PCB (410) of the communication device (400), and components for transmitting and / or receiving signals may be disposed on a second outer surface (e.g., rear) of the PCB (410).

[0082] Unlike the communication device (300) described in FIGS. 3a to 3c, a plurality of antennas may be disposed on a first surface (e.g., front) of the PCB (410) (or the PCB (402) in FIG. 4a) of the communication device (400), and components for transmitting and / or receiving signals may be disposed on a second surface (e.g., rear) of the PCB (410) (or the PCB (402) in FIG. 4a). Due to the large area occupied by the filter (413) (or a plurality of filters) on the second surface of the PCB (410), an unnecessary area (481) may be formed on the first surface. For example, if the size of the area occupied by the filter (413) (or a plurality of filters) is reduced, the unnecessary area (481) may be reduced. For example, if the size of the area occupied by the filter (413) (or a plurality of filters) is reduced, the size of the communication device (400) may be reduced.

[0083] As data transmission capacity increases, massive MIMO may be used. Massive MIMO is a technology that transmits signals using multiple communication paths. Accordingly, a communication device may include components to provide multiple communication paths. To provide multiple communication paths, the size of the communication device may increase. Therefore, as described above, if the area occupied by the filter (or multiple filters) is reduced, the communication device can be miniaturized.

[0084] In the specification below, specific examples of filter structures for reducing the area occupied by a filter (e.g., a waveguide filter) will be described. As an example of the filter described above, a waveguide filter will be described below. When the waveguide filter described below is used, the assembly area for the filter can be reduced. Accordingly, communication equipment can be miniaturized.

[0085] FIGS. 5A and 5B illustrate an example of a waveguide filter. A waveguide filter (e.g., a ceramic waveguide filter) may be configured to guide electromagnetic waves along a specified path. While guiding electromagnetic waves along a specified path, the waveguide filter may be configured to pass signals in a specified frequency band and attenuate or reflect signals in the remaining frequency bands. The size of the waveguide filter may be smaller than that of a metal cavity filter. The weight of the waveguide filter may be smaller than that of a metal cavity filter. Accordingly, the size of a communication device including a waveguide filter (or a plurality of waveguide filters) may be smaller than the size of a communication device including a metal cavity filter (or a plurality of metal cavity filters).

[0086] Referring to FIG. 5a, the waveguide filter (500) may include a plurality of resonant holes. For example, the first surface (501) of the waveguide filter (500) may have a plurality of resonant holes. For example, the first surface (501) of the waveguide filter (500) may include a plurality of resonant holes. For example, the plurality of resonant holes may include a resonant hole (511), a resonant hole (512), a resonant hole (513), a resonant hole (514), a resonant hole (515), a resonant hole (516), a resonant hole (517), and a resonant hole (518). For example, each of the plurality of resonant holes may not penetrate the first surface (501) and the second surface (502) of the waveguide filter (500). For example, each of the plurality of resonant holes may be a blind hole.

[0087] According to one embodiment, each of the plurality of resonant holes can function as a node for transmitting a signal. Each of the plurality of resonant holes can be referred to as a resonator. As coupling is formed between the plurality of resonant holes, a signal can be transmitted.

[0088] According to one embodiment, the waveguide filter (500) may include a plurality of holes for a path through which a signal travels. The plurality of holes may include a hole (521), a hole (522), a hole (523), a hole (531), and a hole (532). The plurality of holes may be formed to penetrate the first surface (501) and the second surface (502). Unlike the plurality of resonant holes, as the plurality of holes are formed to penetrate the first surface (501) and the second surface (502), each of the plurality of holes may not function as a resonator.

[0089] For example, a hole (521) may be placed to reduce the coupling strength between the resonant hole (512) and the resonant hole (514). A hole (521) may be placed to reduce the coupling strength between the resonant hole (511) and the resonant hole (513). A hole (531) may be placed to reduce the coupling strength between the hole (511) and the hole (514).

[0090] For example, a hole (522) may be placed to reduce the coupling strength between the resonant hole (514) and the resonant hole (516). A hole (522) may be placed to reduce the coupling strength between the resonant hole (513) and the resonant hole (515). A hole (522) may be placed to reduce the coupling strength between the resonant hole (513) and the resonant hole (516).

[0091] For example, a hole (523) may be placed to reduce the coupling strength between the resonant hole (516) and the resonant hole (518). A hole (523) may be placed to reduce the coupling strength between the resonant hole (515) and the resonant hole (517). A hole (532) may be placed to reduce the coupling strength between the hole (515) and the hole (518).

[0092] According to one embodiment, each of the holes (521), (522), and (523) may have a cross shape when viewed from the first surface (501). According to one embodiment, each of the holes (531) and (532) may be a counterbored hole (or countersink hole). Each of the holes (531) and (532) may include holes having different diameters. For example, the diameter of the hole (531) formed on the first surface (501) may be smaller than the diameter of the hole (531) formed on the second surface (502).

[0093] According to one embodiment, an input port (e.g., an RF port) may be placed on the opposite side of the resonant hole (511). An output port (e.g., an antenna port) may be placed on the opposite side of the resonant hole (518). For example, a signal provided to the resonant hole (511) from an input port placed on the opposite side of the resonant hole (511) may be transmitted to a resonant hole (512) that forms a coupling with the resonant hole (511). The signal transmitted to the resonant hole (512) may be transmitted to a resonant hole (513) that forms a coupling with the resonant hole (512). The signal transmitted to the resonant hole (513) may be transmitted to a resonant hole (514) that forms a coupling with the resonant hole (513). The signal transmitted to the resonant hole (514) may be transmitted to a resonant hole (515) that forms a coupling with the resonant hole (514). The signal transmitted to the resonant hole (515) can be transmitted to the resonant hole (516) that forms a coupling with the resonant hole (515). The signal transmitted to the resonant hole (516) can be transmitted to the resonant hole (517) that forms a coupling with the resonant hole (516). The signal transmitted to the resonant hole (517) can be transmitted to the resonant hole (518) that forms a coupling with the resonant hole (517). The signal transmitted to the resonant hole (518) can be transmitted to an output port located opposite the resonant hole (518).

[0094] For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (511) and the resonant hole (512). The coupling formed between the resonant hole (511) and the resonant hole (512) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (512) and the resonant hole (513). The coupling formed between the resonant hole (512) and the resonant hole (513) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (513) and the resonant hole (514). The coupling formed between the resonant hole (513) and the resonant hole (514) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (514) and the resonant hole (515). A coupling formed between the resonant hole (514) and the resonant hole (515) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (515) and the resonant hole (516). A coupling formed between the resonant hole (515) and the resonant hole (516) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (516) and the resonant hole (517). A coupling formed between the resonant hole (516) and the resonant hole (517) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (517) and the resonant hole (518). A coupling formed between the resonant hole (517) and the resonant hole (518) may be referred to as the main coupling. As described above, in order to form the main coupling, the size of each of the holes (521), (522), (523), (531), and (532) can be changed.

[0095] For example, a coupling having a size smaller than a reference size may be formed between the resonant hole (511) and the resonant hole (514). The coupling formed between the resonant hole (511) and the resonant hole (514) may be referred to as a cross coupling. A coupling having a size smaller than a reference size may be formed between the resonant hole (515) and the resonant hole (518). The coupling formed between the resonant hole (515) and the resonant hole (518) may be referred to as a cross coupling. As described above, to form a cross coupling, the size of each of the holes (521), (522), (523), (531), and (532) may be changed.

[0096] Referring to FIG. 5b, the waveguide filter (550) may include a plurality of resonant holes. For example, the first surface (551) of the waveguide filter (550) may have a plurality of resonant holes. For example, the first surface (551) of the waveguide filter (550) may include a plurality of resonant holes. For example, the plurality of resonant holes may include a resonant hole (561), a resonant hole (562), a resonant hole (563), a resonant hole (564), a resonant hole (565), and a resonant hole (566). For example, each of the plurality of resonant holes may not penetrate the first surface (501) and the second surface (502) of the waveguide filter (550). For example, each of the plurality of resonant holes may be a blind hole.

[0097] According to one embodiment, each of the plurality of resonant holes can function as a node for transmitting a signal. Each of the plurality of resonant holes can be referred to as a resonator. As coupling is formed between the plurality of resonant holes, a signal can be transmitted.

[0098] According to one embodiment, the waveguide filter (550) may include a plurality of holes for a path through which a signal travels. The plurality of holes may include hole (571), hole (572), hole (573), hole (574), hole (581), and hole (582). The plurality of holes may be formed to penetrate the first surface (501) and the second surface (502). Unlike the plurality of resonant holes, as the plurality of holes are formed to penetrate the first surface (501) and the second surface (502), each of the plurality of holes may not function as a resonator.

[0099] According to one embodiment, a hole (571) may be positioned to adjust the strength of the coupling between the resonant hole (561) and the resonant hole (562) and / or the strength of the coupling between the resonant hole (562) and the resonant hole (563). For example, a hole (571) may be positioned to reduce the coupling strength between the resonant hole (561) and the resonant hole (563).

[0100] According to one embodiment, the hole (581) may be positioned to adjust the coupling strength between the hole (561) and the hole (563). For example, the hole (581) may be positioned to reduce the coupling strength between the hole (561) and the hole (563).

[0101] According to one embodiment, a hole (572) may be placed to adjust the coupling strength between the resonant hole (562) and the resonant hole (564). A hole (574) may be placed to adjust the coupling strength between the resonant hole (564) and the resonant hole (566). A hole (582) may be placed to adjust the coupling strength between the hole (564) and the hole (566). For example, a hole (572) may be placed to reduce the coupling strength between the resonant hole (562) and the resonant hole (564). A hole (574) may be placed to reduce the coupling strength between the resonant hole (564) and the resonant hole (566). A hole (582) may be placed to reduce the coupling strength between the hole (564) and the hole (566).

[0102] According to one embodiment, each of the hole (581) and the hole (582) may be a counterbored hole (or countersink hole). Each of the hole (581) and the hole (582) may include holes having different diameters. For example, the diameter of the hole (581) formed on the first surface (551) may be smaller than the diameter of the hole (581) formed on the second surface (552).

[0103] According to one embodiment, an input port (e.g., an RF port) may be placed on the opposite side of the resonant hole (561). An output port (e.g., an antenna port) may be placed on the opposite side of the resonant hole (566). For example, a signal provided to the resonant hole (561) from an input port placed on the opposite side of the resonant hole (511) may be transmitted to a resonant hole (562) that forms a coupling with the resonant hole (561). The signal transmitted to the resonant hole (562) may be transmitted to a resonant hole (563) that forms a coupling with the resonant hole (562). The signal transmitted to the resonant hole (563) may be transmitted to a resonant hole (564) that forms a coupling with the resonant hole (563). The signal transmitted to the resonant hole (564) may be transmitted to a resonant hole (565) that forms a coupling with the resonant hole (564). The signal transmitted to the resonant hole (565) can be transmitted to the resonant hole (566) that forms a coupling with the resonant hole (565). The signal transmitted to the resonant hole (566) can be transmitted to the resonant hole (567) that forms a coupling with the resonant hole (566). The signal transmitted to the resonant hole (567) can be transmitted to the resonant hole (568) that forms a coupling with the resonant hole (567). The signal transmitted to the resonant hole (566) can be transmitted to an output port located opposite the resonant hole (566).

[0104] For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (561) and the resonant hole (562). The coupling formed between the resonant hole (561) and the resonant hole (562) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (562) and the resonant hole (563). The coupling formed between the resonant hole (562) and the resonant hole (563) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (563) and the resonant hole (564). The coupling formed between the resonant hole (563) and the resonant hole (564) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonant hole (564) and the resonant hole (565). A coupling formed between the resonance hole (564) and the resonance hole (565) may be referred to as the main coupling. For example, a coupling having a size stronger than the reference size may be formed between the resonance hole (565) and the resonance hole (566). A coupling formed between the resonance hole (565) and the resonance hole (566) may be referred to as the main coupling.

[0105] For example, a coupling having a size smaller than a reference size may be formed between the resonance hole (561) and the resonance hole (563). The coupling formed between the resonance hole (561) and the resonance hole (563) may be referred to as a cross coupling. A coupling having a size smaller than a reference size may be formed between the resonance hole (564) and the resonance hole (566). The coupling formed between the resonance hole (564) and the resonance hole (566) may be referred to as a cross coupling.

[0106] Referring to FIGS. 5a and 5b, a plurality of holes distinct from a plurality of resonant holes may be arranged to adjust (e.g., reduce) the coupling size formed between the plurality of resonant holes. Depending on the plurality of resonant holes and the arrangement of the plurality of holes, the signal transmission path may be changed. Depending on the plurality of resonant holes and the arrangement of the plurality of holes, a passing frequency band and / or a blocked frequency band may be defined (or determined).

[0107] According to one embodiment, the waveguide filter (500) and the waveguide filter (550) may each be referred to as planar waveguide filters in that the path through which the signal is transmitted is formed on a plane. For example, the waveguide filter (500) may include a dielectric. For example, the waveguide filter (500) may be composed of a dielectric. If the dielectric is ceramic, the waveguide filter (500) may be referred to as a ceramic waveguide filter.

[0108] Figure 6 shows the coupling between resonant holes.

[0109] Referring to FIG. 6, example (600) may represent a part of the waveguide filter described above (e.g., the waveguide filter (500) or waveguide filter (550) of FIG. 5a). The waveguide filter may include resonant holes (610) and resonant holes (620). of the waveguide filter

[0110] For example, each of the resonant hole (610) and the resonant hole (620) can function as a resonator when a signal is transmitted. For example, the resonant hole (610) can function as a first resonator. The resonant hole (620) can function as a second resonator. A coupling can be formed between the resonant hole (610) functioning as the first resonator and the resonant hole (620) functioning as the second resonator. Based on the formed coupling, a signal can be transmitted between the resonant hole (610) and the resonant hole (620). For example, the resonant hole (610) and the resonant hole (620) can be formed on the first surface (601). The resonant hole (610) and the resonant hole (620) may not penetrate the first surface (601) and the second surface (602). The resonant holes (610) and (620) may be blind holes. The second surface (602) may be a surface attached to the PCB.

[0111] In the planar waveguide filter described above, the resonant frequency can be determined based on the size of the waveguide filter cavity and the characteristics of the internal material. If a material with a high dielectric constant is used as the waveguide filter, the resonant frequency is achieved within a small cavity, which can reduce the size of the waveguide filter. However, high-order harmonics also occur at low frequencies, and performance degradation due to the low-pass filter (LPF) may occur.

[0112] The aforementioned planar waveguide filter can have a large assembly area. Depending on the difference in the coefficient of thermal expansion between the planar waveguide filter and the PCB (printed circuit board), cracks may occur due to soldering between the waveguide filter and the PCB. Therefore, if the assembly area is reduced, the probability of cracks occurring due to soldering can be decreased.

[0113] In the following specification, a three-dimensional waveguide filter will be described. Compared to a planar waveguide filter, the three-dimensional waveguide filter may have a smaller area (or mounting area) on the PCB. Accordingly, the probability of cracks occurring due to soldering between the waveguide filter and the PCB may be reduced.

[0114] Figure 7a shows a part of a waveguide filter.

[0115] Figure 7b shows the bandwidth of the passband according to the distance between the resonant holes.

[0116] Referring to FIG. 7a, example (791) shows a perspective view of a part (750) of a waveguide filter (or three-dimensional waveguide filter). Example (792) shows a perspective view of a part (750) of a waveguide filter (or three-dimensional waveguide filter).

[0117] According to one embodiment, a portion (750) of a waveguide filter may include a guide portion (751) and a guide portion (752). The guide portion (751) and the guide portion (752) refer to logical portions, and the guide portion (751) and the guide portion (752) may not be physically separated. For example, each of the guide portion (751) and the guide portion (752) may be formed as a square block. The guide portion (751) and the guide portion (752) may be joined in a first direction (760). However, they are not limited thereto. According to an embodiment, the guide portion (751) and the guide portion (752) may be physically separated and joined to each other through a contact member.

[0118] For example, the guide portion (751) may have a resonance hole (710) on the first side (701) facing the direction opposite to the first direction (760). The guide portion (751) may include a resonance hole (710) on the first side (701) facing the direction opposite to the first direction (760). The guide portion (752) may have a resonance hole (720) on the second side (702) facing the first direction (760). The guide portion (752) may include a resonance hole (720) on the second side (702) facing the first direction (760).

[0119] For example, the resonant hole (710) and the resonant hole (720) may face each other. The resonant hole (710) and the resonant hole (720) may be spaced apart from each other. A coupling may be formed between the resonant hole (710) and the resonant hole (720). The guide portion (751) and the guide portion (752) may form a coupling between the resonant hole (710) and the resonant hole (720). For example, a capacitive coupling may be formed between the resonant hole (710) and the resonant hole (720).

[0120] Referring to FIGS. 7a and 7b, the resonant hole (710) and the resonant hole (720) may be separated by a distance (712). The distance (712) may be related to the strength of the coupling between the resonant hole (710) and the resonant hole (720). If the distance (712) is changed, the strength of the coupling between the resonant hole (710) and the resonant hole (720) may be changed.

[0121] According to one embodiment, the graph (793) shows the bandwidth of the passband according to the distance (712). In the graph (793), the horizontal axis represents the distance (712), and the unit is [mm] (millimeter). In the graph (793), the vertical axis represents the bandwidth of the passband according to the resonance hole (710) and the resonance hole (720), and the unit is [MHz] (megahertz).

[0122] In graph (793), as the distance (712) increases, the bandwidth of the passband may decrease. As the distance (712) decreases, the bandwidth of the passband may increase. Therefore, as the distance (712) decreases, the strength of the coupling between the resonant hole (710) and the resonant hole (720) may increase.

[0123] Figure 8a shows a part of a waveguide filter.

[0124] Figure 8b shows the bandwidth of the passband according to the depth of the auxiliary hole.

[0125] Referring to FIG. 8a, example (891) shows a perspective view of a part (850) of a waveguide filter (or three-dimensional waveguide filter). Example (892) shows a perspective view of a part (850) of a waveguide filter (or three-dimensional waveguide filter).

[0126] According to one embodiment, a portion (850) of a waveguide filter may include a guide portion (851) and a guide portion (852). The guide portion (851) and the guide portion (852) refer to logical portions, and the guide portion (851) and the guide portion (852) may not be physically separated. For example, each of the guide portion (851) and the guide portion (852) may be formed as a square block. The guide portion (851) and the guide portion (852) may be joined in a first direction (860). However, they are not limited thereto. According to an embodiment, the guide portion (851) and the guide portion (852) may be physically separated and joined to each other through a contact member.

[0127] For example, the guide portion (851) may have a resonance hole (810) on the first side (801) facing the direction opposite to the first direction (860). The guide portion (851) may include a resonance hole (810) on the first side (801) facing the direction opposite to the first direction (860). The guide portion (852) may have a resonance hole (820) on the second side (802) facing the first direction (860). The guide portion (852) may include a resonance hole (820) on the second side (802) facing the first direction (860).

[0128] For example, the resonant hole (810) and the resonant hole (820) may face each other. The resonant hole (810) and the resonant hole (820) may be spaced apart from each other. A coupling may be formed between the resonant hole (810) and the resonant hole (820). The guide portion (851) and the guide portion (852) may form a coupling between the resonant hole (810) and the resonant hole (820). For example, a capacitive coupling may be formed between the resonant hole (810) and the resonant hole (820).

[0129] According to one embodiment, a portion (850) of the waveguide filter may include a supporting hole (830). The portion (850) of the waveguide filter may further include a supporting hole (830) positioned between the resonant hole (810) and the resonant hole (820) on a third side (803) perpendicular to the first side (801) and the second side (802). The supporting hole (830) may be a counterbored hole. The supporting hole (830) may be positioned (or formed) on the third side (803) perpendicular to the first side (801) and the second side (802). The supporting hole (830) may be positioned for coupling (e.g., capacitive coupling) between the resonant hole (810) and the resonant hole (820). An auxiliary hole (830) may be placed to assist coupling (e.g., capacitive coupling) between the resonant hole (810) and the resonant hole (820).

[0130] For example, the auxiliary hole (830) may have a depth (831) from the third side. The auxiliary hole (830) may include a first part having a depth (832) and a second part having a depth (833). The area of ​​the first part viewed from the third side may be larger than the area of ​​the second part viewed from the third side.

[0131] Referring to FIG. 8a and FIG. 8b, the depth (831) of the auxiliary hole (830) may be related to the strength of the coupling (e.g., capacitive coupling) between the resonant hole (810) and the resonant hole (820). If the depth (831) of the auxiliary hole (830) is changed, the strength of the coupling between the resonant hole (810) and the resonant hole (820) may be changed.

[0132] According to one embodiment, the graph (893) represents the bandwidth of the passband according to the depth (831) of the auxiliary hole (830). In the graph (893), the horizontal axis represents the depth (831) of the auxiliary hole (830), and the unit is [mm] (millimeter). In the graph (893), the vertical axis represents the bandwidth of the passband according to the resonant hole (810) and the resonant hole (820), and the unit is [MHz] (megahertz).

[0133] In graph (893), as the depth (831) of the auxiliary hole (830) increases, the bandwidth of the passband may increase. As the depth (831) of the auxiliary hole (830) decreases, the bandwidth of the passband may decrease. Therefore, as the depth (831) of the auxiliary hole (830) increases, the strength of the coupling between the resonant hole (810) and the resonant hole (820) may increase.

[0134] Figure 9a shows a part of a waveguide filter.

[0135] Figure 9b shows the bandwidth of the passband according to the depth of the groove connecting the resonant holes.

[0136] Referring to FIG. 9a, example (991) shows a perspective view of a part (950) of a waveguide filter (or three-dimensional waveguide filter). Example (992) shows a perspective view of a part (950) of a waveguide filter (or three-dimensional waveguide filter).

[0137] According to one embodiment, a portion (950) of a waveguide filter may include a guide portion (951) and a guide portion (952). The guide portion (951) and the guide portion (952) refer to logical portions, and the guide portion (951) and the guide portion (952) may not be physically separated. For example, each of the guide portion (951) and the guide portion (952) may be formed as a square block. The guide portion (951) and the guide portion (952) may be joined in a second direction (970). However, they are not limited thereto. According to an embodiment, the guide portion (951) and the guide portion (952) may be physically separated and joined to each other through a contact member.

[0138] For example, the guide portion (951) may have a resonance hole (910) on the first side (901) facing the direction opposite to the first direction (960). The guide portion (951) may include a resonance hole (910) on the first side (901) facing the direction opposite to the first direction (960). The guide portion (952) may have a resonance hole (920) on the second side (902) facing the direction opposite to the second direction (960). The guide portion (952) may include a resonance hole (920) on the second side (902) facing the direction opposite to the second direction (960). The first direction and the second direction may be perpendicular to each other. The first side (901) and the second side (902) may be perpendicular to each other.

[0139] According to one embodiment, a portion (950) of the waveguide filter may include a groove (912) connecting the resonance hole (910) and the resonance hole (920). For example, the groove (912) may be formed along a first side (901) and a second side (902) from the resonance hole (910) to the resonance hole (920). The groove (912) may extend from the resonance hole (910). The groove (912) may extend from the resonance hole (920). For example, the groove (912) may be referred to as a trench. For example, the groove (912) may be referred to as a coupling boss.

[0140] For example, a groove (912) may be positioned for coupling between the resonant hole (910) and the resonant hole (920). Coupling may be formed between the resonant hole (910) and the resonant hole (920) through the groove (912). Guide portions (951) and (952) may form coupling between the resonant hole (910) and the resonant hole (920). For example, inductive coupling may be formed between the resonant hole (910) and the resonant hole (920).

[0141] Referring to FIGS. 9a and 9b, the groove (912) may have a depth (931). For example, the depth (931) of the groove (912) may be smaller than or equal to the depth (932) of the resonance hole (910). The depth (931) of the groove (912) may be smaller than or equal to the depth (933) of the resonance hole (920). However, it is not limited thereto. According to an embodiment, the depth (931) of the groove (912) may be larger than the depth (932) of the resonance hole (910) and the depth (933) of the resonance hole (920).

[0142] According to one embodiment, the graph (993) represents the bandwidth of the passband according to the depth (931) of the groove (912). In the graph (993), the horizontal axis represents the depth (931) of the groove (912), and the unit is [mm] (millimeter). In the graph (993), the vertical axis represents the bandwidth of the passband according to the resonance hole (910) and the resonance hole (920), and the unit is [MHz] (megahertz).

[0143] In the graph (993), as the depth (931) of the groove (912) increases, the bandwidth of the passband may increase. As the depth (931) of the groove (912) decreases, the bandwidth of the passband may decrease. Therefore, as the depth (931) of the groove (912) increases, the strength of the coupling (e.g., inductive coupling) between the resonant hole (910) and the resonant hole (920) may increase.

[0144] Figure 10a shows a part of a waveguide filter.

[0145] Figure 10b shows the bandwidth of the passband according to the groove depth.

[0146] Referring to FIG. 10a, example (1091) shows a perspective view of a part (1050) of a waveguide filter (or three-dimensional waveguide filter). Example (1092) shows a perspective view of a part (1050) of a waveguide filter (or three-dimensional waveguide filter).

[0147] According to one embodiment, a portion (1050) of a waveguide filter may include a guide portion (1051) and a guide portion (1052). The guide portion (1051) and the guide portion (1052) refer to logical portions, and the guide portion (1051) and the guide portion (1052) may not be physically separated. For example, the guide portion (1051) and the guide portion (1052) may be joined in a first direction (1060). However, this is not limited thereto. According to an embodiment, the guide portion (1051) and the guide portion (1052) may be physically separated and joined to each other through a contact member.

[0148] For example, the guide portion (1051) may have a resonance hole (1010) on the first side (1001) facing the direction opposite to the first direction (1060). The guide portion (1051) may include a resonance hole (1010) on the first side (1001) facing the direction opposite to the first direction (1060). The guide portion (1052) may have a resonance hole (1020) on the second side (1002) facing the first direction (1060). The guide portion (1052) may include a resonance hole (1020) on the second side (1002) facing the first direction (1060).

[0149] For example, the resonance hole (1010) and the resonance hole (1020) may face each other. The resonance hole (1010) and the resonance hole (1020) may be spaced apart from each other. A portion (1050) of the waveguide filter may include a recess (1053) formed to space apart at least a portion of the guide portion (1051) and at least a portion of the guide portion (1052). By the recess (1053), at least a portion of the guide portion (1051) and at least a portion of the guide portion (1052) may be spaced apart from each other.

[0150] According to one embodiment, a portion (1050) of the waveguide filter may include a groove (1012) connecting a resonance hole (1010) and a resonance hole (1020). For example, the groove (1012) may be formed along a first side (1001), a second side (1002), and a third side (1003) perpendicular to the first side (1001) and the second side (1002) from the resonance hole (1010) to the resonance hole (1020). The groove (1012) may extend from the resonance hole (1010). The groove (1012) may extend from the resonance hole (1020). For example, the groove (1012) may be referred to as a trench. For example, the groove (1012) can be referred to as a coupling boss.

[0151] For example, a groove (1012) may be positioned for coupling between a resonant hole (1010) and a resonant hole (1020). Coupling may be formed between the resonant hole (1010) and the resonant hole (1020) through the groove (1012). A guide portion (1051) and a guide portion (1052) may form coupling between the resonant hole (1010) and the resonant hole (1020). For example, inductive coupling may be formed between the resonant hole (1010) and the resonant hole (1020).

[0152] Referring to FIG. 10a and FIG. 10b, the groove (1012) may have a depth (1031). For example, the depth (1031) of the groove (1012) may be smaller than or equal to the depth (1032) of the resonance hole (1010). The depth (1031) of the groove (1012) may be smaller than or equal to the depth (1033) of the resonance hole (1020). However, it is not limited thereto. According to an embodiment, the depth (1031) of the groove (1012) may be larger than the depth (1032) of the resonance hole (1010) and the depth (1033) of the resonance hole (1020).

[0153] According to one embodiment, the graph (1093) represents the bandwidth of the passband according to the depth (1031) of the groove (1012). In the graph (1093), the horizontal axis represents the depth (1031) of the groove (1012), and the unit is [mm] (millimeter). In the graph (1093), the vertical axis represents the bandwidth of the passband according to the resonance hole (1010) and the resonance hole (1020), and the unit is [MHz] (megahertz).

[0154] In graph (1093), as the depth (1031) of the groove (1012) increases, the bandwidth of the passband may increase. As the depth (1031) of the groove (1012) decreases, the bandwidth of the passband may decrease. Therefore, as the depth (1031) of the groove (1012) increases, the strength of the coupling (e.g., inductive coupling) between the resonant hole (1010) and the resonant hole (1020) may increase.

[0155] FIG. 11a illustrates examples of a planar waveguide filter and a three-dimensional waveguide filter.

[0156] Figure 11b illustrates a schematic view of a three-dimensional waveguide filter.

[0157] FIG. 11c illustrates the signal transmission path of a three-dimensional waveguide filter.

[0158] Referring to FIG. 11a, the waveguide filter (500) may be an example of a planar waveguide filter. The waveguide filter (500) may correspond to the waveguide filter (500) of FIG. 5a.

[0159] For example, the waveguide filter (500) may include eight resonant holes. The plurality of resonant holes may include resonant hole (511), resonant hole (512), resonant hole (513), resonant hole (514), resonant hole (515), resonant hole (516), resonant hole (517), and resonant hole (518). For example, each of the plurality of resonant holes may function as a node. As described in FIG. 5a, a main coupling may be formed along a path in which resonant holes (511), resonant hole (512), resonant hole (513), resonant hole (514), resonant hole (515), resonant hole (516), resonant hole (517), and resonant hole (518) are sequentially connected. A cross-coupling may be formed in the path between resonant hole (511) and resonant hole (514). Cross-coupling can be formed in the path between the resonance hole (515) and the resonance hole (518).

[0160] The signal transmission path described above can be similarly formed in a waveguide filter (1190), which is an example of a three-dimensional waveguide filter. Example (1191) illustrates a front perspective view of the waveguide filter (1190). Example (1192) illustrates a rear perspective view of the waveguide filter (1190). Example (1193) illustrates a front transparent view of the waveguide filter (1190). For convenience of explanation, the waveguide filter (1190) will be described through Examples (1191) and (1192).

[0161] According to one embodiment, the waveguide filter (1190) may include a plurality of resonant holes. The waveguide filter (1190) may include a resonant hole (1111), a resonant hole (1112), a resonant hole (1113), a resonant hole (1114), a resonant hole (1115), a resonant hole (1116), a resonant hole (1117), and a resonant hole (1118). For example, the resonant hole (1111) and the resonant hole (1114) may face each other and be spaced apart from each other. The resonant hole (1112) and the resonant hole (1113) may face each other and be spaced apart from each other. The resonant hole (1115) and the resonant hole (1118) may face each other and be spaced apart from each other. The resonant hole (1116) and the resonant hole (1117) may face each other and be spaced apart from each other.

[0162] For example, resonance holes (1111), resonance holes (1112), resonance holes (1117), and resonance holes (1118) may be placed on a first side (1151) facing the x-axis. Resonance holes (1113), resonance holes (1114), resonance holes (1115), and resonance holes (1116) may be placed on a second side (1152) facing in a direction opposite to the x-axis (e.g., -x-axis).

[0163] For example, the waveguide filter (1190) may include a groove (1121) connecting the resonance hole (1112) to the resonance hole (1113). The waveguide filter (1190) may include a groove (1122) connecting the resonance hole (1116) and the resonance hole (1117). The groove (1121) may be formed along a first side (1151), a third side (1153), and a second side (1152). The groove (1122) may be formed along a first side (1151), a third side (1153), and a second side (1152). For example, the third side (1153) may be oriented in the z-axis direction.

[0164] According to one embodiment, the waveguide filter (1190) may include a recess (1133) on a fourth side facing the y-axis. The waveguide filter (1190) may include a recess (1132) on a fifth side facing the -y-axis. For example, the recess (1132) may be positioned to reduce the coupling strength between the resonant hole (1115) and the resonant hole (1118). The recess (1133) may be positioned to reduce the coupling strength between the resonant hole (1111) and the resonant hole (1114).

[0165] For example, the recess (1132) may include a first portion (1132-1) between the resonance hole (1115) and the resonance hole (1118) and a second portion (1132-2) between the resonance hole (1116) and the resonance hole (1117). For example, the length of the first portion (1132-1) extending toward the side opposite to the third side (1153) may be shorter than the length of the second portion (1132-2) extending toward the third side (1153).

[0166] For example, the recess (1133) may include a first portion (1133-1) between the resonance hole (1111) and the resonance hole (1114) and a second portion (1133-2) between the resonance hole (1112) and the resonance hole (1113). For example, the length of the first portion (1133-1) extending toward the side opposite to the third side (1153) may be shorter than the length of the second portion (1133-2) extending toward the third side (1153).

[0167] According to one embodiment, the waveguide filter (1190) may include a plurality of guide portions. The plurality of guide portions included in the waveguide filter (1190) will be described in FIG. 11b.

[0168] Referring to FIG. 11b, examples (1194) and (1195) are conceptual diagrams showing a plurality of resonant holes, grooves (1121), and grooves (1122) of a waveguide filter (1190). Example (1194) may correspond to a front perspective view of the waveguide filter (1190) (e.g., example (1191) of FIG. 11a). Example (1195) may correspond to a rear perspective view of the waveguide filter (1190) (e.g., example (1192) of FIG. 11a).

[0169] Referring to examples (1194) and (1195), the waveguide filter (1190) may include a plurality of guide portions. The waveguide filter (1190) may include a guide portion (1101), a guide portion (1102), a guide portion (1103), a guide portion (1104), a guide portion (1105), a guide portion (1106), a guide portion (1107), and a guide portion (1108).

[0170] For example, the guide part (1101) can be coupled with the guide part (1102) in the z-axis direction. The guide part (1102) can be coupled with the guide part (1103) in the -x-axis direction. The guide part (1103) can be coupled with the guide part (1104) in the -z-axis direction. The guide part (1104) can be coupled with the guide part (1105) in the -y-axis direction. The guide part (1105) can be coupled with the guide part (1106) in the z-axis direction. The guide part (1106) can be coupled with the guide part (1107) in the x-axis direction. The guide part (1107) can be coupled with the guide part (1108) in the -z-axis direction. For example, the guide part (1103) and the guide part (1106) may not be coupled to each other by a slot between the guide part (1103) and the guide part (1106). Guide portion (1102) and guide portion (1107) may not be joined to each other by a slot between guide portion (1102) and guide portion (1107). Guide portion (1101) and guide portion (1108) may not be joined to each other by a slot between guide portion (1101) and guide portion (1108).

[0171] For example, the guide portion (1101) may have a resonance hole (1101) on the first side (1151) facing the x-axis direction. The guide portion (1102) may have a resonance hole (1102) on the first side (1151) facing the x-axis direction. The guide portion (1103) may have a resonance hole (1103) on the second side (1152) facing the -x-axis direction. The guide portion (1104) may have a resonance hole (1104) on the second side (1152) facing the -x-axis direction. The guide portion (1105) may have a resonance hole (1105) on the second side (1152) facing the -x-axis direction. The guide portion (1106) may have a resonance hole (1106) on the second side (1152) facing the -x-axis direction. The guide portion (1107) may have a resonance hole (1107) on the first side (1151) facing the x-axis direction. The guide portion (1108) may have a resonance hole (1108) on the first side (1151) facing the x-axis direction.

[0172] The aforementioned plurality of guide parts may not be physically separated. However, this is not limited thereto. According to an embodiment, each of the plurality of guide parts may be physically separated and joined to one another through a contact member.

[0173] Referring again to FIG. 11a, the resonant hole (1111) can be connected to an input port (e.g., RF port) of the waveguide filter (1190). The resonant hole (1118) can be connected to an output port (e.g., antenna port) of the waveguide filter (1190). A signal can be provided to the resonant hole (1111) of the waveguide filter (1190).

[0174] Based on the signal provided to the resonant hole (1111), a coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1111) and the resonant hole (1112). A coupling (e.g., an inductive coupling, the coupling of FIG. 10a) may be formed between the resonant hole (1112) and the resonant hole (1113). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1113) and the resonant hole (1114). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1114) and the resonant hole (1115). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1115) and the resonant hole (1116). A coupling (e.g., inductive coupling, coupling of FIG. 10a) may be formed between the resonant hole (1116) and the resonant hole (1117). A coupling (e.g., coupling of FIG. 6) may be formed between the resonant hole (1117) and the resonant hole (1118). For example, a cross-coupling may be formed between the resonant hole (1111) and the resonant hole (1114). A cross-coupling may be formed between the resonant hole (1115) and the resonant hole (1118).

[0175] A signal transmission path according to the coupling between the aforementioned resonant holes can be formed as shown in FIG. 11c.

[0176] Referring to FIG. 11c, example (1196) represents the signal transmission path of the waveguide filter (1190) of FIG. 11a. As described in FIG. 11b, a main coupling may be formed along a path in which resonant holes (1111), resonant holes (1112), resonant holes (1113), resonant holes (1114), resonant holes (1115), resonant holes (1116), resonant holes (1117), and resonant holes (1118) are sequentially connected. A cross-coupling may be formed in the path between resonant holes (1111) and resonant holes (1114). A cross-coupling may be formed in the path between resonant holes (1115) and resonant holes (1118).

[0177] When comparing the signal transmission path of the waveguide filter (500) of FIG. 11a with the signal transmission path of the waveguide filter (1190), eight nodes can be sequentially coupled in the waveguide filter (500) and the waveguide filter (1190). In the waveguide filter (500) and the waveguide filter (1190), cross-coupling can be formed between a resonant hole functioning as the first node (e.g., resonant hole (511) and resonant hole (1111)) and a resonant hole functioning as the fourth node (e.g., resonant hole (514) and resonant hole (1114)). In the waveguide filter (500) and waveguide filter (1190), cross-coupling can be formed between a resonant hole functioning as a fifth node (e.g., resonant hole (515) and resonant hole (1115)) and a resonant hole functioning as an eighth node (e.g., resonant hole (518) and resonant hole (1118)).

[0178] As described above, a signal transmission path similar to the signal transmission path of the waveguide filter (500) can be provided through the waveguide filter (1190). Thus, a planar waveguide filter can be replaced with a three-dimensional waveguide filter. As the planar waveguide filter is replaced with a three-dimensional waveguide filter, the mounting area for the waveguide filter can be reduced. For example, the area for placing the planar waveguide filter can be larger than the area for placing the three-dimensional waveguide filter. As the above-described three-dimensional waveguide filter is used, the probability of cracks occurring due to soldering between the three-dimensional waveguide filter and the PCB can be reduced.

[0179] Figure 12a illustrates an example of a waveguide filter.

[0180] Figure 12b illustrates an example of a waveguide filter.

[0181] FIG. 12c illustrates an example of a waveguide filter.

[0182] The waveguide filter (1190) illustrated in FIGS. 12a, 12b, and 12c may be related to the waveguide filter (1190) described in FIGS. 11a to 11b. The waveguide filter (1190) illustrated in FIGS. 12a, 12b, and 12c may have some structures formed differently from the waveguide filter (1190) described in FIGS. 11a to 11b. In the waveguide filter (1190) illustrated in FIGS. 12a, 12b, and 12c, descriptions of components that overlap with the waveguide filter (1190) described in FIGS. 11a to 11b will be omitted.

[0183] In FIGS. 12a to 12c, a main coupling may be formed along a path in which resonant holes (1111), resonant holes (1112), resonant holes (1113), resonant holes (1114), resonant holes (1115), resonant holes (1116), resonant holes (1117), and resonant holes (1118) are sequentially connected. A cross-coupling may be formed in the path between resonant holes (1111) and resonant holes (1114). A cross-coupling may be formed in the path between resonant holes (1115) and resonant holes (1118).

[0184] Referring to FIG. 12a, example (1291) shows a front perspective view of a waveguide filter (1190). Example (1292) shows a rear perspective view of a waveguide filter (1190).

[0185] Unlike the waveguide filter (1190) according to example (1291) and example (1292) of FIG. 11a, the waveguide filter (1190) may not include grooves (1121) and grooves (1122). For example, capacitive coupling may be formed between the resonant hole (1112) and the resonant hole (1113) of the waveguide filter (1190). Capacitive coupling may be formed between the resonant hole (1116) and the resonant hole (1117) of the waveguide filter (1190). Unlike FIG. 12a, in the waveguide filter (1190) of FIG. 11a, inductive coupling may be formed between the resonant hole (1112) and the resonant hole (1113) by the grooves (1122) and the recess (1133). In the waveguide filter (1190) of FIG. 11a, inductive coupling can be formed between the resonant hole (1116) and the resonant hole (1117) by the groove (1121) and the recess (1132).

[0186] Referring to FIG. 12b, example (1293) shows a front perspective view of a waveguide filter (1190). Example (1294) shows a rear perspective view of a waveguide filter (1190).

[0187] Unlike the waveguide filter (1190) of FIG. 11a, the waveguide filter (1190) according to example (1293) and example (1294) may not include grooves (1121), grooves (1122), recesses (1132), and recesses (1133). The waveguide filter (1190) may include auxiliary holes (1211) and auxiliary holes (1212). The waveguide filter (1190) may include holes (1221) and holes (1222).

[0188] For example, the waveguide filter (1190) may include an auxiliary hole (1211) positioned between the resonant hole (1112) and the resonant hole (1113) on the side facing the z-axis. The waveguide filter (1190) may include an auxiliary hole (1211) positioned between the resonant hole (1116) and the resonant hole (1117) on the side facing the z-axis.

[0189] For example, the structure between the resonant hole (1112) and the resonant hole (1113) may correspond to part (850) of the waveguide filter of FIG. 8a. The structure between the resonant hole (1116) and the resonant hole (1117) may correspond to part (850) of the waveguide filter of FIG. 8a. Similar to FIG. 8a, capacitive coupling may be formed between the resonant hole (1112) and the resonant hole (1113) of the waveguide filter (1190). Capacitive coupling may be formed between the resonant hole (1116) and the resonant hole (1117) of the waveguide filter (1190).

[0190] For example, a hole (1221) may be placed to adjust (e.g., reduce) the coupling strength (e.g., capacitive coupling) between resonant hole (1115) and resonant hole (1118). A hole (1222) may be placed to adjust (e.g., reduce) the coupling strength (e.g., capacitive coupling) between resonant hole (1111) and resonant hole (1114). For example, holes (1221) and (1222) may be connected to a slot (1131). However, this is not limited thereto. Holes (1221) and (1222) may not be connected to a slot (1131).

[0191] Referring to FIG. 12c, example (1295) shows a front perspective view of a waveguide filter (1190). Example (1296) shows a rear perspective view of a waveguide filter (1190).

[0192] Unlike the waveguide filter (1190) of FIG. 11a, the waveguide filter (1190) according to example (1295) and example (1296) may not include a recess (1132) and a recess (1133). The waveguide filter (1190) may include a hole (1231) and a hole (1232).

[0193] For example, the structure between the resonant hole (1112) and the resonant hole (1113) may correspond to part (1050) of the waveguide filter of FIG. 10a. The structure between the resonant hole (1116) and the resonant hole (1117) may correspond to part (1050) of the waveguide filter of FIG. 10a. For example, each of the hole (1231) and the hole (1232) may correspond to the recess (1053) of FIG. 10a. Similar to FIG. 10a, inductive coupling may be formed between the resonant hole (1112) and the resonant hole (1113) of the waveguide filter (1190). Inductive coupling may be formed between the resonant hole (1116) and the resonant hole (1117) of the waveguide filter (1190).

[0194] For example, holes (1231) and (1232) may be connected to the slot (1131). However, this is not limited thereto. Holes (1231) and (1232) may not be connected to the slot (1131).

[0195] FIG. 13a illustrates examples of a planar waveguide filter and a three-dimensional waveguide filter.

[0196] Figure 13b illustrates the signal transmission path of a three-dimensional waveguide filter.

[0197] Referring to FIG. 13a, the waveguide filter (550) may be an example of a planar waveguide filter. The waveguide filter (550) may correspond to the waveguide filter (550) of FIG. 5b. For example, the waveguide filter (550) may include six resonant holes. The plurality of resonant holes may include resonant hole (561), resonant hole (562), resonant hole (563), resonant hole (564), resonant hole (565), and resonant hole (566). For example, each of the plurality of resonant holes may function as a node. As described in FIG. 5b, a main coupling may be formed along a path in which the resonant holes (561), resonant hole (562), resonant hole (563), resonant hole (564), resonant hole (565), and resonant hole (566) are sequentially connected. Cross-coupling can be formed in the path between the resonance hole (561) and the resonance hole (563). Cross-coupling can be formed in the path between the resonance hole (564) and the resonance hole (566).

[0198] The signal transmission path described above can be similarly formed in a waveguide filter (1390), which is a three-dimensional waveguide filter. Example (1391) illustrates a front perspective view of the waveguide filter (1390). Example (1392) illustrates a rear perspective view of the waveguide filter (1390). Example (1393) illustrates a front transparent view of the waveguide filter (1190). For convenience of explanation, the waveguide filter (1390) will be described through Examples (1391) and (1392).

[0199] According to one embodiment, the waveguide filter (1390) may include a plurality of resonant holes. The waveguide filter (1390) may include a resonant hole (1301), a resonant hole (1302), a resonant hole (1303), a resonant hole (1304), a resonant hole (1305), and a resonant hole (1306).

[0200] For example, resonance holes (1301) and (1306) may be placed on a first side (1351) facing the x-axis. Resonance holes (1303) and (1304) may be placed on a second side (1352) facing the -x-axis. Resonance holes (1302) and (1305) may be placed on a third side (1353) facing the z-axis.

[0201] For example, the waveguide filter (1390) may include a groove (1312) formed along a first side (1351) and a third side (1353) from the resonance hole (1301) to the resonance hole (1302). The waveguide filter (1390) may include a groove (1323) formed along a third side (1353) and a second side (1352) from the resonance hole (1302) to the resonance hole (1303). The waveguide filter (1390) may include a groove (1345) formed along a second side (1352) and a third side (1353) from the resonance hole (1304) to the resonance hole (1305). The waveguide filter (1390) may include a groove (1356) formed along the third side (1353) and the first side (1351) from the resonance hole (1305) to the resonance hole (1306).

[0202] According to one embodiment, the waveguide filter (1390) may include a recess (1331) disposed between the resonance hole (1302) and the resonance hole (1305) on the third side (1353). For example, the recess (1331) may be disposed to adjust (e.g., reduce) the coupling strength between the resonance hole (1302) and the resonance hole (1305).

[0203] For example, the structure between the resonant hole (1301) and the resonant hole (1302) may correspond to part (950) of the waveguide filter in FIG. 9a. The groove (1312) may correspond to the groove (912) in FIG. 9a. For example, the structure between the resonant hole (1302) and the resonant hole (1303) may correspond to part (950) of the waveguide filter in FIG. 9a. The groove (1323) may correspond to the groove (912) in FIG. 9a. For example, the structure between the resonant hole (1304) and the resonant hole (1305) may correspond to part (950) of the waveguide filter in FIG. 9a. The groove (1345) may correspond to the groove (912) in FIG. 9a. For example, the structure between the resonance hole (1305) and the resonance hole (1306) may correspond to part (950) of the waveguide filter in FIG. 9a. The groove (1356) may correspond to the groove (912) in FIG. 9a.

[0204] The resonant hole (1301) can be connected to an input port (e.g., RF port) of the waveguide filter (1390). The resonant hole (1306) can be connected to an output port (e.g., antenna port) of the waveguide filter (1390). A signal can be provided to the resonant hole (1301) of the waveguide filter (1390). Based on the signal provided to the resonant hole (1301), a coupling (e.g., inductive coupling, coupling of FIG. 9a) can be formed between the resonant hole (1301) and the resonant hole (1302). A coupling (e.g., coupling of FIG. 9a) can be formed between the resonant hole (1302) and the resonant hole (1303). A coupling (e.g., coupling of FIG. 6) can be formed between the resonant hole (1303) and the resonant hole (1304). A coupling (e.g., inductive coupling, coupling of FIG. 9a) may be formed between the resonant hole (1304) and the resonant hole (1305). A coupling (e.g., inductive coupling, coupling of FIG. 9a) may be formed between the resonant hole (1305) and the resonant hole (1306).

[0205] A signal transmission path according to the coupling between the aforementioned resonant holes can be formed as shown in FIG. 13b.

[0206] Referring to FIG. 13b, example (1394) represents the signal transmission path of the waveguide filter (1390) of FIG. 13a. As described in FIG. 13a, a main coupling may be formed along a path in which resonant holes (1301), resonant holes (1302), resonant holes (1303), resonant holes (1304), resonant holes (1305), and resonant holes (1306) are sequentially connected. A cross-coupling may be formed in the path between resonant holes (1301) and resonant holes (1303). A cross-coupling may be formed in the path between resonant holes (1304) and resonant holes (1306).

[0207] When comparing the signal transmission path of the waveguide filter (550) of FIG. 13a with the signal transmission path of the waveguide filter (1390), six nodes can be sequentially coupled in the waveguide filter (550) and the waveguide filter (1390). In the waveguide filter (550) and the waveguide filter (1390), cross-coupling can be formed between a resonant hole functioning as the first node (e.g., resonant hole (511) and resonant hole (1301)) and a resonant hole functioning as the third node (e.g., resonant hole (513) and resonant hole (1303)). In the waveguide filter (550) and waveguide filter (1390), cross-coupling can be formed between a resonant hole functioning as a fourth node (e.g., resonant hole (514) and resonant hole (1304)) and a resonant hole functioning as a sixth node (e.g., resonant hole (516) and resonant hole (1306)).

[0208] As described above, a signal transmission path similar to the signal transmission path of the waveguide filter (550) can be provided through the waveguide filter (1390). Thus, a planar waveguide filter can be replaced with a three-dimensional waveguide filter. As the planar waveguide filter is replaced with a three-dimensional waveguide filter, the mounting area for the waveguide filter can be reduced. For example, the area for placing the planar waveguide filter can be larger than the area for placing the three-dimensional waveguide filter. As the above-described three-dimensional waveguide filter is used, the probability of cracks occurring due to soldering between the three-dimensional waveguide filter and the PCB can be reduced.

[0209] Figure 14a illustrates an example of a waveguide filter.

[0210] Figure 14b illustrates the signal transmission path of a waveguide filter.

[0211] Referring to FIG. 14a, Example (1491) illustrates a front perspective view of a waveguide filter (1490). Example (1492) illustrates a rear perspective view of a waveguide filter (1490). Example (1493) illustrates a front transparent view of a waveguide filter (1490). For convenience of explanation, the waveguide filter (1490) will be described through Examples (1491) and (1492).

[0212] According to one embodiment, the waveguide filter (1490) may include a plurality of resonant holes. The waveguide filter (1190) may include 16 resonant holes. The waveguide filter (1490) may include a resonant hole (1400), a resonant hole (1401), a resonant hole (1402), a resonant hole (1403), a resonant hole (1404), a resonant hole (1405), a resonant hole (1406), a resonant hole (1407), and a resonant hole (1408), a resonant hole (1411), a resonant hole (1412), a resonant hole (1413), a resonant hole (1414), a resonant hole (1415), a resonant hole (1416), and a resonant hole (1417).

[0213] For example, resonance holes (1406) and (1407) may face each other and be spaced apart from each other. Resonance holes (1402) and (1408) may face each other and be spaced apart from each other. Resonance holes (1402) and (1403) may face each other and be spaced apart from each other. Resonance holes (1401) and (1404) may face each other and be spaced apart from each other. Resonance holes (1400) and (1413) may face each other and be spaced apart from each other. Resonance holes (1411) and (1412) may face each other and be spaced apart from each other. Resonance holes (1416) and (1415) may face each other and be spaced apart from each other. The resonance hole (1417) and the resonance hole (1414) may face each other and be spaced apart from each other.

[0214] For example, resonance holes (1403), resonance holes (1404), resonance holes (1405), resonance holes (1406), resonance holes (1412), resonance holes (1413), resonance holes (1414), and resonance holes (1415) may be placed on a first side (1451) facing the x-axis. Resonance holes (1400), resonance holes (1401), resonance holes (1402), resonance holes (1407), resonance holes (1408), resonance holes (1411), resonance holes (1416), and resonance holes (1417) may be placed on a second side (1452) facing the -x-axis.

[0215] According to one embodiment, the waveguide filter (1490) may include a plurality of guide portions. Although not illustrated, each of the plurality of guide portions may be formed to include a single resonant hole, as illustrated in FIG. 11b. For example, a guide portion including a resonant hole (1400) may be coupled with a guide portion including a resonant hole (1401). A guide portion including a resonant hole (1414) may be coupled with a guide portion including a resonant hole (1413). A guide portion including a resonant hole (1404) may be coupled with a guide portion including a resonant hole (1405).

[0216] For example, the waveguide filter (1490) may include a slot (1431), a slot (1432), and a slot (1433). For example, by the slot (1431), a guide portion including a resonant hole (1401) and a guide portion including a resonant hole (1408) may be separated from each other. By the slot (1431), a guide portion including a resonant hole (1407) and a guide portion including a resonant hole (1402) may be separated from each other. By the slot (1431), a guide portion including a resonant hole (1406) and a guide portion including a resonant hole (1403) may be separated from each other.

[0217] For example, by means of a slot (1432), a guide portion including a resonant hole (1401) and a guide portion including a resonant hole (1402) may be spaced apart from each other. By means of a slot (1432), a guide portion including a resonant hole (1403) and a guide portion including a resonant hole (1412) may be spaced apart from each other. By means of a slot (1432), a guide portion including a resonant hole (1404) and a guide portion including a resonant hole (1413) may be spaced apart from each other.

[0218] For example, by means of a slot (1433), a guide portion including a resonance hole (1400) and a guide portion including a resonance hole (1417) may be spaced apart from each other. By means of a slot (1433), a guide portion including a resonance hole (1411) and a guide portion including a resonance hole (1416) may be spaced apart from each other. By means of a slot (1433), a guide portion including a resonance hole (1412) and a guide portion including a resonance hole (1415) may be spaced apart from each other.

[0219] According to one embodiment, the waveguide filter (1490) may include a recess (1435) on a fourth side (1454) facing the y-axis. The waveguide filter (1490) may include a recess (1434) on a fifth side (1455) facing the -y-axis. The recess (1435) may be positioned to reduce the coupling strength between the resonant hole (1405) and the resonant hole (1408). The recess (1434) may be positioned to reduce the coupling strength between the resonant hole (1414) and the resonant hole (1417).

[0220] According to one embodiment, the waveguide filter (1490) can function as a duplexer for transmission and reception. For example, the resonant hole (1400) can function as a common port of the waveguide filter (1490). The resonant hole (1400) can be connected to an antenna. The resonant hole (1417) can be connected to a port for a reception path. The resonant hole (1417) can be connected to an RF processing circuit for processing a reception signal through the port for a reception path. The resonant hole (1408) can be connected to a port for a transmission path through the port for a transmission path. The resonant hole (1408) can be connected to an RF processing circuit for processing a transmission signal.

[0221] According to one embodiment, a signal may be provided to a resonant hole (1408) to output (or radiate) a signal to an antenna. Based on the signal provided to the resonant hole (1408), a coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1408) and the resonant hole (1407). A coupling (e.g., a capacitive coupling, the coupling of FIG. 7a) may be formed between the resonant hole (1407) and the resonant hole (1406). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1406) and the resonant hole (1405). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1405) and the resonant hole (1404). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1404) and the resonant hole (1403). A coupling (e.g., a capacitive coupling, the coupling of FIG. 7a) may be formed between the resonant hole (1403) and the resonant hole (1402). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1402) and the resonant hole (1401). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1401) and the resonant hole (1400).

[0222] According to one embodiment, a signal may be provided to a resonant hole (1400) to process a signal received from an antenna. Based on the signal provided to the resonant hole (1400), a coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1400) and the resonant hole (1411). A coupling (e.g., a capacitive coupling, the coupling of FIG. 7a) may be formed between the resonant hole (1411) and the resonant hole (1412). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1412) and the resonant hole (1413). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1413) and the resonant hole (1414). A coupling (e.g., the coupling of FIG. 6) may be formed between the resonant hole (1414) and the resonant hole (1415). A coupling (e.g., capacitive coupling, coupling of FIG. 7a) may be formed between the resonant hole (1415) and the resonant hole (1416). A coupling (e.g., coupling of FIG. 6) may be formed between the resonant hole (1416) and the resonant hole (1417).

[0223] Referring to FIG. 14b, example (1494) represents the signal transmission path of the waveguide filter (1490) of FIG. 14a. As described in FIG. 14a, a main coupling for a receiving path can be formed along a path in which resonant holes (1400), resonant holes (1411), resonant holes (1412), resonant holes (1413), resonant holes (1414), resonant holes (1415), resonant holes (1416), and resonant holes (1417) are sequentially connected. As described in FIG. 14a, a main coupling for a transmission path can be formed along a path in which resonant holes (1408), resonant holes (1407), resonant holes (1406), resonant holes (1405), resonant holes (1404), resonant holes (1403), resonant holes (1402), resonant holes (1401), and resonant holes (1400) are sequentially connected.

[0224] Figure 15 illustrates a schematic view of a waveguide filter.

[0225] Referring to FIG. 15, example (1591) illustrates a front conceptual view of a waveguide filter (1500). Example (1592) illustrates a rear conceptual view of a waveguide filter (1390).

[0226] According to one embodiment, the waveguide filter (1500) may include a dielectric. For example, the waveguide filter (1500) may be composed of a dielectric. If the dielectric is ceramic, the waveguide filter (1500) may be referred to as a ceramic waveguide filter.

[0227] According to one embodiment, the waveguide filter (1500) may include a plurality of guide portions. For example, the plurality of guide portions may include a first guide portion (1501), a second guide portion (1502), a third guide portion (1503), a fourth guide portion (1504), a fifth guide portion (1505), a sixth guide portion (1505), a seventh guide portion (1507), and an eighth guide portion (1508).

[0228] For example, the first guide part (1501) and the second guide part (1502) may be joined in a first direction (e.g., x-axis direction). The second guide part (1502) and the third guide part (1503) may be joined in a second direction (e.g., z-axis direction) perpendicular to the first direction (e.g., x-axis direction). The first guide part (1501) may have a first resonance hole (1511) on a first side (1561) facing a direction opposite to the first direction (e.g., -x-axis). The second guide part (1502) may have a second resonance hole (1512) on a second side (1562) facing the first direction. The third guide part (1503) may have a third resonance hole (1513) on a second side (1562). The third guide portion (1503) can be coupled to the fourth guide portion (1504) in a third direction (e.g., y-axis direction) perpendicular to the first direction (e.g., x-axis direction) and the second direction (e.g., z-axis direction). The fourth guide portion (1504) may have a fourth resonant hole (1514) on the second side (1562).

[0229] According to one embodiment, the first resonant hole (1511) may face the second resonant hole (1512). The first resonant hole (1511) may be spaced apart from the second resonant hole (1512). For example, a first guide portion (1501) having the first resonant hole (1511) and a second guide portion (1502) having the second resonant hole (1512) may form a capacitive coupling between the first resonant hole (1511) and the second resonant hole (1512).

[0230] Although not illustrated, according to one embodiment, the waveguide filter (1500) may include an auxiliary hole positioned between the first resonant hole (1511) and the second resonant hole (1512) on a third side (1563) facing a direction opposite to the second direction (e.g., z-axis direction). The auxiliary hole may be positioned for capacitive coupling between the first resonant hole (1511) and the second resonant hole (1512). For example, the auxiliary hole may correspond to the auxiliary hole (830) of FIG. 8a.

[0231] Although not illustrated, according to one embodiment, the waveguide filter (1500) may include a groove formed along the first side (1561), the third side (1563), and the second side (1562) from the first resonant hole (1511) to the second resonant hole (1512). The first guide portion (1501) having the first resonant hole (1511) and the second guide portion (1502) having the second resonant hole (1512) may form an inductive coupling between the first resonant hole (1511) and the second resonant hole (1512). According to an embodiment, the waveguide filter (1500) may include a recess formed to space at least a portion of the first guide portion (1501) and at least a portion of the second guide portion (1502) between the first resonant hole (1511) and the second resonant hole (1512). The recess may be positioned for inductive coupling between the first resonant hole (1511) and the second resonant hole (1512). For example, the recess may correspond to the recess (1053) of FIG. 10a.

[0232] According to one embodiment, the first guide portion (1501) may be coupled to the fifth guide portion (1505) in a third direction (e.g., y-axis direction). The fifth guide portion (1505) may include a fifth resonant hole (1515) on a fourth side (1564) facing the third direction. Although not illustrated, according to one embodiment, the waveguide filter (1500) may include a groove formed along the first side (1561) and the fourth side (1564) from the first resonant hole (1511) to the fifth resonant hole (1515). A first guide portion (1501) having a first resonant hole (1511) and a fifth guide portion (1505) having a fifth resonant hole (1515) can form an inductive coupling between the first resonant hole (1511) and the fifth resonant hole (1515) by means of the groove. The groove can be positioned for inductive coupling. For example, the groove may correspond to the groove (912) of FIG. 9a.

[0233] According to one embodiment, the waveguide filter (1500) may include an RF port and an antenna port. For example, one of the plurality of resonant holes included in the waveguide filter (1500) may be used for the RF port. Another of the plurality of resonant holes included in the waveguide filter (1500) may be used for the antenna port.

[0234] According to one embodiment, a waveguide filter comprising a dielectric may include a plurality of guide portions for forming a transmission path between an RF (radio frequency) port and an antenna port. Among the plurality of guide portions, a first guide portion and a second guide portion may be coupled in a first direction. The second guide portion and a third guide portion among the plurality of guide portions may be coupled in a second direction perpendicular to the first direction. The first guide portion may have a first resonant hole on a first side facing a direction opposite to the first direction. The second guide portion may have a second resonant hole on a second side facing the first direction. The third guide portion may have a third resonant hole on the second side.

[0235] For example, the third guide portion may be coupled to the fourth guide portion among the plurality of guide portions in a third direction perpendicular to the first direction and the second direction. The fourth guide portion may have a fourth resonant hole on the second side.

[0236] For example, the first resonant hole may face the second resonant hole. The first resonant hole may be spaced apart from the second resonant hole. The first guide portion having the first resonant hole and the second guide portion having the second resonant hole may form a capacitive coupling between the first resonant hole and the second resonant hole.

[0237] For example, the waveguide filter may include an auxiliary hole disposed between the first resonant hole and the second resonant hole on a third side facing a direction opposite to the second direction. The auxiliary hole may be disposed for the capacitive coupling between the first resonant hole and the second resonant hole.

[0238] For example, the waveguide filter may include a groove formed along the first side, a third side facing the opposite direction to the second side, and a first side from the first resonant hole to the second resonant hole. The first guide portion having the first resonant hole and the second guide portion having the second resonant hole may form an inductive coupling between the first resonant hole and the second resonant hole.

[0239] For example, the waveguide filter may include a recess formed to space at least a portion of the first guide portion and at least a portion of the second guide portion apart between the first resonant hole and the second resonant hole.

[0240] For example, the first guide portion may be coupled to the fifth guide portion among the plurality of guide portions in the third direction. The fifth guide portion may include a fifth resonant hole on the fourth side facing the third direction. The waveguide filter may include a groove formed along the first side and the fourth side from the first resonant hole to the fifth resonant hole.

[0241] For example, the first guide portion having the first resonant hole and the fifth guide portion having the fifth resonant hole can form an inductive coupling between the first resonant hole and the fifth resonant hole.

[0242] For example, the groove formed along the first side and the fourth side from the first resonant hole to the fifth resonant hole can be arranged for the inductive coupling.

[0243] For example, one of the plurality of resonant holes having the plurality of guide parts may be connected to the RF port. Another of the plurality of resonant holes having the plurality of guide parts may be connected to the antenna port.

[0244] According to one embodiment, a communication device may include a printed circuit board, an antenna disposed on a first surface of the printed circuit board, an RF processing circuit disposed on a second surface opposite to the first surface of the printed circuit board, and a waveguide filter disposed on the second surface of the printed circuit board. The waveguide filter may include a plurality of guide portions for forming a transmission path between an RF (radio frequency) port and an antenna port. Among the plurality of guide portions, a first guide portion and a second guide portion may be coupled in a first direction. The second guide portion and a third guide portion among the plurality of guide portions may be coupled in a second direction perpendicular to the first direction. The first guide portion may have a first resonant hole on a first side facing a direction opposite to the first direction. The second guide portion may have a second resonant hole on a second side facing the first direction. The third guide portion may have a third resonant hole on the second side.

[0245] For example, the third guide portion may be coupled to the fourth guide portion among the plurality of guide portions in a third direction perpendicular to the first direction and the second direction. The fourth guide portion may have a fourth resonance hole on the second side.

[0246] For example, the first resonant hole may face the second resonant hole. The first resonant hole may be spaced apart from the second resonant hole. The first guide portion having the first resonant hole and the second guide portion having the second resonant hole may form a capacitive coupling between the first resonant hole and the second resonant hole.

[0247] For example, the waveguide filter may include an auxiliary hole disposed between the first resonant hole and the second resonant hole on a third side facing a direction opposite to the second direction. The auxiliary hole may be disposed for the capacitive coupling between the first resonant hole and the second resonant hole.

[0248] For example, the waveguide filter may include a groove formed along the first side, a third side facing the opposite direction to the second side, and a first side from the first resonant hole to the second resonant hole. The first guide portion having the first resonant hole and the second guide portion having the second resonant hole may form an inductive coupling between the first resonant hole and the second resonant hole.

[0249] For example, the waveguide filter may include a recess formed to space at least a portion of the first guide portion and at least a portion of the second guide portion apart between the first resonant hole and the second resonant hole.

[0250] For example, the first guide portion may be coupled to the fifth guide portion among the plurality of guide portions in the third direction. The fifth guide portion may include a fifth resonant hole on the fourth side facing the third direction. The waveguide filter may include a groove formed along the first side and the fourth side from the first resonant hole to the fifth resonant hole.

[0251] For example, the first guide portion having the first resonant hole and the fifth guide portion having the fifth resonant hole can form an inductive coupling between the first resonant hole and the fifth resonant hole.

[0252] For example, the groove formed along the first side and the fourth side from the first resonant hole to the fifth resonant hole can be arranged for the inductive coupling.

[0253] For example, one of the plurality of resonant holes having the plurality of guide parts may be connected to the RF port connected to the RF processing circuit. Another of the plurality of resonant holes having the plurality of guide parts may be connected to the antenna port connected to the antenna.

[0254] Methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0255] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the embodiments described in the claims or specification of this disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0256] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0257] Additionally, the program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WAN (wide area network), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0258] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0259] According to embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Generally or additionally, a plurality of components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components in the same or similar manner as those performed by the corresponding component among the plurality of components prior to integration. According to embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0260] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure.

Claims

1. In a waveguide filter including a dielectric, It includes a plurality of guide parts for forming a transmission path between an RF (radio frequency) port and an antenna port, and Among the plurality of guide parts above, the first guide part and the second guide part are coupled in a first direction, and The second guide portion and the third guide portion among the plurality of guide portions are coupled in a second direction perpendicular to the first direction, and The first guide portion has a first resonant hole on a first side facing the direction opposite to the first direction, The second guide portion has a second resonant hole on the second side facing the first direction, The third guide portion above has a third resonant hole on the second side, Waveguide filter.

2. In claim 1, the third guide portion is, Among the plurality of guide parts above, the fourth guide part is coupled to the third direction perpendicular to the first direction and the second direction, and The above fourth guide part is, having a fourth resonant hole on the second side above, Waveguide filter.

3. In claim 2, the first resonant hole is, Facing the above-mentioned second resonant hole, The above-mentioned first resonant hole is, Spaced apart from the above second resonance hole, The first guide portion having the first resonant hole and the second guide portion having the second resonant hole are Forming a capacitive coupling between the first resonant hole and the second resonant hole, Waveguide filter.

4. In claim 3, the waveguide filter is, On a third side facing a direction opposite to the second direction, it further includes an auxiliary hole disposed between the first resonant hole and the second resonant hole, The above auxiliary hole is, Arranged for the capacitive coupling between the first resonant hole and the second resonant hole, Waveguide filter.

5. In claim 3, the waveguide filter is, Further comprising a groove formed along the first side, a third side facing the opposite direction to the second side, and from the first resonant hole to the second resonant hole, and a groove formed along the second side. The first guide portion having the first resonant hole and the second guide portion having the second resonant hole are Forming an inductive coupling between the first resonant hole and the second resonant hole, Waveguide filter.

6. In claim 5, the waveguide filter is, A recess further comprising, between the first resonant hole and the second resonant hole, formed to space apart at least a portion of the first guide portion and at least a portion of the second guide portion. Waveguide filter.

7. In claim 2, the first guide portion is, The fifth guide part among the plurality of guide parts above is coupled to the third direction, and The above fifth guide part is, On the fourth side facing the third direction above, it includes a fifth resonance hole, The above waveguide filter is, Further including grooves formed along the first side and the fourth side from the first resonant hole to the fifth resonant hole, Waveguide filter.

8. In claim 7, the first guide portion having the first resonant hole and the fifth guide portion having the fifth resonant hole are Forming an inductive coupling between the first resonant hole and the fifth resonant hole, Waveguide filter.

9. In claim 8, the groove formed along the first side and the fourth side from the first resonant hole to the fifth resonant hole is, Arranged for the above inductive coupling, Wave guide filter.

10. In claim 1, one of the plurality of resonant holes having the plurality of guide parts is, Connected to the above RF port, Another one of the plurality of resonant holes having the plurality of guide parts is, Connected to the above antenna port, Wave guide filter.

11. In a communication device, Printed circuit board; An antenna disposed on the first surface of the above printed circuit board; An RF processing circuit disposed on a second surface opposite to the first surface of the printed circuit board; and It includes a waveguide filter disposed on the second surface of the printed circuit board, and The above wave guide filter is, It includes a plurality of guide parts for forming a transmission path between an RF (radio frequency) port and an antenna port, and Among the plurality of guide parts above, the first guide part and the second guide part are coupled in a first direction, and The second guide portion and the third guide portion among the plurality of guide portions are coupled in a second direction perpendicular to the first direction, and The first guide portion has a first resonant hole on a first side facing the direction opposite to the first direction, The second guide portion has a second resonant hole on the second side facing the first direction, The third guide portion above has a third resonant hole on the second side, Communication device.

12. In claim 11, the third guide portion is, and a fourth guide part among the plurality of guide parts is coupled to a third direction perpendicular to the first direction and the second direction, and The above fourth guide part is, having a fourth resonant hole on the second side above, Communication device.

13. In claim 12, the first resonant hole is, Facing the above-mentioned second resonant hole, The above-mentioned first resonant hole is, Spaced apart from the above second resonance hole, The first guide portion having the first resonant hole and the second guide portion having the second resonant hole are Forming a capacitive coupling between the first resonant hole and the second resonant hole, Communication device.

14. In claim 13, the waveguide filter is, On a third side facing a direction opposite to the second direction, it further includes an auxiliary hole disposed between the first resonant hole and the second resonant hole, The above auxiliary hole is, Arranged for the capacitive coupling between the first resonant hole and the second resonant hole, Communication device.

15. In claim 13, the waveguide filter is, Further comprising a groove formed along the first side, a third side facing the opposite direction to the second side, and from the first resonant hole to the second resonant hole, and a groove formed along the second side. The first guide portion having the first resonant hole and the second guide portion having the second resonant hole are Forming an inductive coupling between the first resonant hole and the second resonant hole, Communication device.

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